WO2020209586A1

WO2020209586A1 - Electronic apparatus and method of controlling power output to communication device on basis of temperature

Info

Publication number: WO2020209586A1
Application number: PCT/KR2020/004723
Authority: WO
Inventors: 리데니스; 박정민; 서종화; 유성철; 이종원
Original assignee: 삼성전자 주식회사
Priority date: 2019-04-11
Filing date: 2020-04-08
Publication date: 2020-10-15
Also published as: KR20200120151A

Abstract

Various embodiments relating to an electronic apparatus are described. According to an embodiment, the electronic apparatus may comprise: an antenna module; a communication circuit for transmitting signals through the antenna module; at least one temperature sensor; a power control circuit for providing power to the communication circuit; and a processor electrically or operatively connected to the communication circuit, the at least one temperature sensor, and the power control circuit, wherein the processor is configured to: determine a degree of change in temperature related to the antenna module or the communication circuit by means of the at least one temperature sensor during signal transmission through the antenna module; determine a compensation period on the basis of the determined degree of change in temperature and a threshold for the degree of change in temperature; if the determined compensation period is a first compensation period, determine a power compensation value at first periodic intervals; if the determined compensation period is a second compensation period, determine the power compensation value at second periodic intervals, which are longer than the first periodic intervals respectively, and regulate power being provided to the communication circuit by using the power control circuit on the basis of the determined power compensation value.

Description

Method of controlling output power of communication device based on electronic device and temperature

Various embodiments relate to electronic devices and communication devices.

In order to meet the increasing demand for wireless data traffic after commercialization of the 4G communication system, efforts are being made to develop a next-generation communication system, for example, a 5G communication system or a pre-5G communication system.

The 5G communication system is being considered to be able to use not only the existing communication band but also a new band, for example, an ultra-high frequency (mmWave) band (for example, a 60 GHz band). In addition, 5G communication systems include beamforming, massive multi-input multi-output (massive MIMO), and full dimensional MIMO to mitigate the path loss of radio waves and increase the transmission distance of radio waves. : FD-MIMO), array antenna, analog beam-forming, and application of large scale antenna technologies are being discussed.

5G communication technology can transmit large amounts of data and consume more power, potentially increasing the temperature of electronic devices. For example, an electronic device may consume more power to transmit a larger amount of data at a higher rate, and the communication device inside the electronic device (e.g., a communication module or antenna) is proportional to the power consumption. The temperature of the can rise.

When the electronic device transmits a signal, as the temperature of the communication module or the antenna increases, effective isotropic radiated power (EIRP) may decrease. For example, in the electronic device, when the EIRP decreases as the temperature of the communication module or the antenna rises, transmission power lower than the transmission power output for actual signal transmission may be transmitted, resulting in very low transmission efficiency.

According to various embodiments, it is possible to provide an electronic device capable of compensating for EIRP that decreases as the temperature increases when transmitting a signal based on a temperature associated with a communication module or an antenna, and a method for controlling output power of a communication device based on temperature. have.

According to various embodiments, at least one temperature sensor is disposed around the 5G communication module or antenna to check the temperature associated with the communication module or antenna, and decreases as the temperature increases when transmitting a signal based on the determined temperature. It is possible to provide an electronic device capable of compensating for EIRP and a method for controlling output power of a communication device based on temperature.

An electronic device according to various embodiments includes an antenna module, a communication circuit for transmitting a signal through the antenna module, at least one temperature sensor, a power control circuit providing power to the communication circuit, and the communication circuit, the at least one A temperature sensor and a processor electrically or operatively connected to the power control circuit, wherein the processor includes a temperature associated with the antenna module or the communication circuit through the at least one temperature sensor when a signal is transmitted through the antenna module Check the amount of change, check the compensation period based on the confirmed temperature change amount and the temperature change amount threshold value, and if the confirmed compensation period is the first compensation period, the power compensation value is checked every first time interval, and the confirmed If the compensation period is a second compensation period, the power compensation value is checked every second time interval having a time interval longer than the first time interval, and the communication circuit through the power control circuit based on the confirmed power compensation value. It can be set to adjust the power provided to.

The method for controlling output power of a transmitter based on temperature in an electronic device includes an operation of checking a temperature change amount associated with the antenna module or the communication circuit through at least one temperature sensor when a signal is transmitted from a communication circuit through an antenna module, and the identified Checking the compensation period based on the temperature change amount and the temperature change amount threshold value, checking the power compensation value associated with the communication circuit every first time interval if the confirmed compensation period is a first compensation period, the confirmed compensation If the period is a second compensation period, checking the power compensation value associated with the communication circuit every second time interval having a time interval longer than the first time interval, and power control based on the determined power compensation value It may include an operation of adjusting the power provided to the communication circuit through the circuit.

In a storage medium storing instructions, the instructions are set to cause the at least one circuit to perform at least one operation when executed by at least one circuit, and the at least one operation is performed by communication through an antenna module. Checking a temperature change amount associated with the antenna module or the communication circuit through at least one temperature sensor when a signal is transmitted from a circuit, checking a compensation period based on the identified temperature change amount and temperature change threshold value, and the confirmation If the determined compensation period is a first compensation period, the operation of checking a power compensation value associated with the communication circuit every first time interval. When the determined compensation period is a second compensation period, a second compensation period having a longer time interval than the first time interval An operation of checking the power compensation value associated with the communication circuit every two time intervals, and an operation of adjusting power provided to the communication circuit through a power control circuit based on the determined power compensation value. .

According to various embodiments, the electronic device may compensate for EIRP that decreases as the temperature increases during signal transmission based on a temperature associated with a communication module (communication circuit) or an antenna.

According to various embodiments, the electronic device checks the temperature associated with the 5G communication module (5G communication circuit) or the antenna by disposing at least one temperature sensor around the 5G communication module (5G communication circuit) or the antenna, and When transmitting a signal based on temperature, it is possible to compensate for the EIRP that decreases as the temperature increases.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

3A, 3B, 3C, and 3D illustrate an embodiment of a structure of an electronic device including an antenna module according to various embodiments.

4A, 4B, and 4C illustrate an embodiment of the structure of an antenna module according to various embodiments.

5 is a perspective view illustrating an antenna module according to various embodiments.

6 is a block diagram of an electronic device according to various embodiments of the present disclosure.

7 is an example circuit diagram of an electronic device according to various embodiments of the present disclosure.

8 is a diagram illustrating a relationship between temperature and effective isotropic radiated power (EIRP) according to various embodiments.

9 is a diagram illustrating a decrease in effective isotropic radiated power (EIRP) over time in a transmission circuit according to various embodiments.

10A is a graph of temperature change over time of an RFIC internal temperature sensor and an RFIC external temperature sensor associated with one transmission circuit according to various embodiments.

10B is a graph showing a temperature difference over time between an RFIC internal temperature sensor and an RFIC external temperature sensor associated with one transmission circuit according to various embodiments.

11A is a graph of a temperature change amount of an RFIC internal temperature sensor and an RFIC external temperature sensor associated with a plurality of transmission circuits according to various embodiments of the present disclosure.

11B is a graph showing a temperature difference over time between an RFIC internal temperature sensor and an RFIC external temperature sensor associated with a plurality of transmission circuits according to various embodiments.

12 is a flowchart illustrating an operation of controlling output power of a transmission circuit based on temperature in an electronic device according to various embodiments of the present disclosure.

13 is a flowchart illustrating an operation of controlling power provided to a transmission circuit by using an RFIC internal temperature sensor in an electronic device according to various embodiments of the present disclosure.

14 is a flowchart illustrating an operation of controlling power provided to a transmission circuit using an RFIC external temperature sensor in an electronic device according to various embodiments of the present disclosure.

15A, 15B, and 15C are diagrams illustrating a relationship between temperature and transmission power over time in an electronic device according to various embodiments.

16 is a flowchart illustrating an operation of controlling power provided to a transmission circuit using a temperature sensor associated with an RFIC in an electronic device according to various embodiments of the present disclosure.

According to various embodiments of FIG. 1, a block diagram of an electronic device 101 in a network environment 100 is illustrated.

Referring to FIG. 1, in a network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199 It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 may store commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132. The command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphic processing unit, an image signal processor) that can be operated independently or together , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 123 may be set to use less power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.

The coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, an application is executed). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component of the electronic device 101 (for example, the processor 120 or the sensor module 176 ). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.

The input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from an outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 170 may convert sound into an electric signal or, conversely, convert an electric signal into sound. According to an embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102) (for example, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to connect directly or wirelessly with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor), and may include one or more communication processors that support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : A LAN (local area network) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 in a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.

The antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module 197 may include one or more antennas, from which at least one suitable for a communication method used in a communication network such as the first network 198 or the second network 199 An antenna of, for example, may be selected by the communication module 190. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the

electronic devices

102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more of the external

electronic devices

102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service by itself. In addition or in addition, it is possible to request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

Electronic devices according to various embodiments of the present disclosure may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or a plurality of the items unless clearly indicated otherwise in a related context. In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A Each of the phrases such as "at least one of B, or C" may include all possible combinations of items listed together in the corresponding phrase among the phrases. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the component from other corresponding components, and the components may be referred to in other aspects (eg, importance or Order) is not limited. Some (eg, a first) component is referred to as “coupled” or “connected” with or without the terms “functionally” or “communicatively” to another (eg, second) component. When mentioned, it means that any of the above components can be connected to the other components directly (eg by wire), wirelessly, or via a third component.

The term "module" used in this document may include a unit implemented by hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (for example, the program 140) including them. For example, the processor (eg, the processor 120) of the device (eg, the electronic device 101) may call and execute at least one command among one or more commands stored from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here,'non-transient' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves). It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments of the present disclosure may be provided by being included in a computer program product. Computer program products can be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or two user devices ( It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are sequentially, parallel, repeatedly, or heuristically executed, or one or more of the above operations are executed in a different order or omitted. Or one or more other actions may be added.

2 is an exploded perspective view of an electronic device 101 according to various embodiments.

Referring to FIG. 2, the electronic device 101 (eg, the electronic device 101 of FIG. 1) has a side bezel structure 331 (or may also be referred to as a side structure), and a first support member 332 ( Example: bracket), front plate 320, display 330, printed circuit board 340, battery 350, second support member 360 (eg, rear case), antenna 370, and rear plate It may include 380. In some embodiments, the electronic device 101 may omit at least one of the components (eg, the first support member 332 or the second support member 360) or may additionally include other components. .

According to an embodiment, the first support member 332 may be disposed inside the electronic device 101 to be connected to the side bezel structure 331 or may be integrally formed with the side bezel structure 331. The first support member 332 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. In the first support member 332, the display 330 may be coupled to one surface and the printed circuit board 340 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

According to an embodiment, the memory may include, for example, a volatile memory or a nonvolatile memory.

According to an embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 101 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to an embodiment, the battery 350 is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary cell, or a rechargeable secondary cell, or a fuel It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340, for example. The battery 350 may be integrally disposed within the electronic device 101 or may be disposed detachably from the electronic device 101.

According to an embodiment, the antenna 370 may be disposed between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a side bezel structure 331 and/or a part of the first support member 332 or a combination thereof.

According to various embodiments, the electronic device may include an antenna module 390. For example, some of the antenna modules 390 may be implemented to transmit and receive radio waves (tentatively referred to as radio waves in frequency bands A and B) having different characteristics for MIMO implementation. As another example, some of the antenna modules 390 are configured to simultaneously transmit and receive radio waves (tentatively referred to as radio waves of frequencies A1 and A2 in the A frequency band) having the same characteristics to implement diversity. Can be. As another example, another part of the antenna module 390 may be set to transmit and receive simultaneously, for example, radio waves having the same characteristics (tentatively referred to as radio waves of frequencies B1 and B2 in the B frequency band) for implementing diversity. I can. In one embodiment, two antenna modules may be included, but in another embodiment, the electronic device 101 may include four antenna modules to simultaneously implement MIMO and diversity. In another embodiment, the electronic device 101 may include only one antenna module 390.

According to an embodiment, when one antenna module is disposed at a first position of the printed circuit board 340 in consideration of transmission/reception characteristics of radio waves, the other antenna module is the first antenna module of the printed circuit board 340. It can be arranged in a second position separated from the position. As another example, one antenna module and another antenna module may be disposed in consideration of a distance between each other according to diversity characteristics.

According to an embodiment, the antenna module 390 may include a wireless communication circuit that processes radio waves transmitted and received in an ultra-high frequency band (eg, 6 GHz or more and 300 GHz or less). The conductive plate of the antenna module 390 may be formed of, for example, a patch-type radiation conductor or a conductive plate having a dipole structure extending in one direction, and a plurality of the conductive plates may be arrayed to form an antenna array. . A chip (eg, an integrated circuit chip) on which a part of the wireless communication circuit is implemented may be disposed on one side of the area where the conductive plate is disposed or on a side facing the opposite direction to the side where the conductive plate is disposed, and a printed circuit It may be electrically connected to the conductive plate through a patterned wiring.

3A to 3D are diagrams illustrating a structure of an electronic device including an antenna module according to various embodiments of the present disclosure.

3A to 3D, the electronic device 101 is spaced apart from the first plate 420 (for example, the front plate 320 of FIG. 2) and the first plate 420 in the opposite direction. A second plate 430 facing toward (for example, the rear plate 380 or the rear glass of FIG. 2), and a side member surrounding the space between the first plate 420 and the second plate 430 A housing 410 including 440 may be included.

According to various embodiments, the first plate 420 may include a transparent material including a glass plate. The second plate 430 may include a non-conductive and/or conductive material. The side member 440 may include a conductive material and/or a non-conductive material. In some embodiments, at least a portion of the side member 440 may be integrally formed with the second plate 430. In the illustrated embodiment, the side member 440 includes first to third insulating

portions

441, 443, and 445 and first to third conductive portions (eg, first to third legacy antennas) 451 , 453, and 455).

According to various embodiments, the electronic device 101 may include a display arranged to be visible through the first plate 420 in the space, a main printed circuit board (PCB) 470, and/or an intermediate plate ( Mid-plate) (not shown) may be included, and optionally, various other parts may be further included.

According to various embodiments, the electronic device 101 may include a first legacy antenna 451, a second legacy antenna 453, and a third legacy antenna 455 in the space and/or of the housing 410. It may be included in a part (for example, the side member 440). The first to third legacy antennas 451 to 455 are, for example, cellular communication (eg, second generation (2G), 3G, 4G, or LTE), short-range communication (eg, WiFi, Bluetooth, or NFC). ), and/or a global navigation satellite system (GNSS).

According to various embodiments, the electronic device 101 includes a first antenna module 461, a second antenna module 463, and a third antenna module 465 for forming a directional beam. can do. The

antenna modules

461, 463, and 465 communicate via a network (eg, the first network 198 or the second network 199 of FIG. 1) (eg, 5G network communication, mmWave communication, 60 GHz communication, or WiGig communication, etc.). The

antenna modules

461, 463, and 465 are metal members of the electronic device 101 (eg, a housing 410, an internal component 473), and/or first to third legacy antennas 451 To 455)) and spaced apart from each other by a predetermined distance or more.

According to various embodiments, the first antenna module 461 is located on the upper left (-Y axis), the second antenna module 463 is located in the middle of the upper (X side), and the third antenna module 465 is located on the right. It can be located in the middle (Y-axis). In another embodiment, the electronic device 101 includes additional antenna modules at an additional position (eg, a lower (-X axis) middle), or some of the first to third antenna modules 461 to 465 Can be omitted. According to an embodiment, the first to

third antenna modules

461, 463, and 465 are at least on the main printed circuit board 470 by using a conductive line 471 (eg, a coaxial cable or FPCB). It may be electrically connected to one communication processor (eg, the processor 120 of FIG. 1 ).

Referring to FIG. 3B showing a cross section based on the A-A' axis of FIG. 3A, a part of the antenna array of the first antenna module 461 (for example, a patch antenna array) radiates toward the second plate 430 And, another part (for example, a dipole antenna array) may be disposed to radiate through the first insulating part 441. Referring to FIG. 3C showing a cross section based on the B-B' axis of FIG. 3A, a part of the radiator of the second antenna module 463 (eg, a patch antenna array) radiates toward the second plate 430 And, another part (for example, a dipole antenna array) may be disposed to radiate through the second insulating part 443.

According to various embodiments, the second antenna module 463 may include a plurality of printed circuit boards. For example, a portion of the antenna array (eg, a patch antenna array) and another portion (eg, a dipole antenna array) may be located on different printed circuit boards. According to an embodiment, the printed circuit boards may be connected through a flexible printed circuit board. The flexible printed circuit board may be disposed around the electric material 473 (eg, receiver, speaker, sensors, camera, ear jack, or button).

Referring to FIG. 3D showing a cross section based on the C-C′ axis of FIG. 3A, the third antenna module 465 may be disposed toward the side member 440 of the housing 410. Part of the antenna array of the third antenna module 465 (for example, a dipole antenna array) radiates in the direction of the second plate 430, and another part (for example, a patch antenna array) uses the third insulating part 445. It can be arranged to radiate through.

4A, 4B, and 4C illustrate an embodiment of the structure of an antenna module according to various embodiments. 4A is a perspective view of the antenna module as viewed from one side, and FIG. 4B is a perspective view of the antenna module as viewed from the other side. 4C is a cross-sectional view of the antenna module along a vertical axis of D-D'.

4A to 4C, in one embodiment, the antenna module 460 may include a printed circuit board 470 and an antenna array 480. The antenna module 460 may be disposed on the printed circuit board 470 together with the communication module 490 (hereinafter also referred to as a'communication circuit', for example, the communication module 190 of FIG. 1 ). For example, the communication module 490 may include a mmWave module. According to an embodiment, the communication module 490 may include a radio frequency integrate circuit (RFIC) 492 and a power manage integrate circuit (PMIC) 494. Optionally, the communication module 490 may further include a shielding member 496. In other embodiments, at least one of the aforementioned parts may be omitted, or at least two of the parts may be integrally formed.

According to various embodiments, the printed circuit board 470 may include a plurality of conductive layers, and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 470 may provide electrical connection between the printed circuit board 470 and/or various electronic components disposed outside by using wires and conductive vias formed on the conductive layer.

According to various embodiments, the antenna array 480 may include a plurality of

antenna elements

482, 484, 486, or 488 arranged to form a directional beam. The antenna elements may be formed on the first surface of the printed circuit board 470 as shown. According to another embodiment, the antenna array 480 may be formed inside the printed circuit board 470. According to embodiments, the antenna array 480 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shape or type.

According to various embodiments, the RFIC 492 may be disposed in another area of the printed circuit board 470 (eg, a second surface opposite to the first surface), spaced apart from the antenna array 480. have. The RFIC is configured to process a signal of a selected frequency band transmitted/received through the antenna array 480. According to an embodiment, the RFIC 492 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band during transmission. Upon reception, the RFIC 492 may convert an RF signal received through the antenna array 480 into a baseband signal and transmit it to a communication processor.

According to another embodiment, the RFIC 492 may up-convert an IF signal (eg, about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) into an RF signal of a selected band during transmission. Upon reception, the RFIC 492 down-converts the RF signal obtained through the antenna array 480, converts it into an IF signal, and transmits it to the IFIC.

According to various embodiments, the PMIC 494 may be disposed in another partial area (eg, the second surface) of the printed circuit board 470 spaced apart from the antenna array 480. The PMIC may receive a voltage from a main PCB (not shown) and provide power required for various components (eg, RFIC 492) on an antenna module.

According to various embodiments, the shielding member 496 is a part of the printed circuit board 470 (for example, the second surface) to electromagnetically shield at least one of the RFIC 492 and the PMIC 494 Can be placed on According to an embodiment, the shielding member 496 may include a shield can.

Although not shown, in various embodiments, the antenna module 460 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface. The module interface may include a connecting member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connection member, the RFIC 492 and/or the PMIC 494 of the antenna module may be electrically connected to the printed circuit board.

4A to 4C, an arrangement relationship, a relative ratio, or size between the printed circuit board 470, the antenna array 480, and/or the communication module 490 is an exemplary embodiment. Various design changes can be made according to the structure and layout space.

5 is a perspective view illustrating an antenna module 460 and a communication module 490 according to various embodiments.

Referring to FIG. 5, an antenna module 460 may be located in an internal space of an electronic device (eg, the electronic device 101 of FIGS. 1 and 2 ). The antenna module 460 of FIG. 5 is partially or entirely the same as the configuration of the antenna module 390 of FIG. 2, the antenna modules 461,463, 465 of FIGS. 3A to 3D, and the antenna module 460 of FIGS. 4A to 4C. can do.

According to various embodiments, the antenna module 460 may include an antenna radiator (not shown) (for example, a patch type radiator), and may be provided on one surface or inside of the printed circuit board 470 formed of a plurality of conductive layers. Can be placed. A radio frequency integrate circuit (RFIC) 492 and a power manage integrate circuit (PMIC) 494 may be disposed on the other surface of the printed circuit board 470.

According to various embodiments, at least one

thermistor

498 and 499 may be disposed inside and/or outside the radio frequency integrate circuit (RFIC) 492. For example, at least one thermistor 499 may be disposed on the radio frequency integrate circuit (RFIC) 492, and at least one thermistor 498 may be disposed outside the radio frequency integrate circuit (RFIC) 492 Can be. According to various embodiments, the printed circuit board 470 may further include a connector 497. In FIG. 5, in order to describe the internal structure of the RFIC 492, the RFIC 492 is projected.

According to various embodiments, the printed circuit board 470 may include a first surface 470a and a second surface 470b facing in a direction opposite to the first surface 470a. For example, based on a plurality of conductive layers constituting the printed circuit board 470, the RFIC 492, PMIC 494, connector 497,

thermistors

498 and 499, and various electronic devices are provided on the first surface 470a. Parts can be placed. An antenna module 460 may be disposed on or inside the second surface 470b.

According to various embodiments, the antenna module 460 may include an antenna array formed of a plurality of conductive plate(s) or radiation conductors (for example, the antenna array 480 of FIG. 4A), and antennas of various structures Can contain types. For example, it may be at least one of a patch type antenna or a dipole type antenna.

According to various embodiments, the RFIC 492 is electrically connected to the antenna module 460 and is provided with a communication signal having a specified frequency through a radio transceiver or transmits a received communication signal to the radio transceiver. Can be transmitted. For example, the RFIC 492 may perform wireless communication using the plurality of conductive plate(s) or radiation conductors while being controlled by a processor (eg, the processor 120 of FIG. 1 ). In another embodiment, the RFIC 492 receives a control signal and power from the processor 120 and the power management module (for example, the power management module 188 of FIG. 1), and receives a communication signal or Communication signals to be transmitted to the outside can be processed. For example, the RFIC 492 may include a switch circuit for separating transmission/reception signals, various amplifiers or filter circuits for enhancing transmission/reception signal quality.

According to an embodiment, if a plurality of the conductive plate(s) or radiation conductors form an antenna array, the RFIC 492 includes a communication circuit (eg, a plurality of transmission/reception circuits) connected to each conductive plate or radiation conductor. Each of the transmission circuits may be turned on or may be a heat source that generates heat during signal transmission. For example, each of the transmission circuits may include at least one power amplifier (PA), and each of the transmission circuits is turned on or a heat source is generated by heat generated by at least one PA when transmitting a signal. Can be. For example, if the RFIC 492 includes a plurality of 16 transmission circuits, each transmission circuit may become a heat source due to heat generated by at least one PA included in each transmission circuit, and thus, 16 transmission circuits. The plurality of transmission circuits may be sources S0-S15 (sources) (eg, heat sources). According to an embodiment, a plurality of PAs included in each of a plurality of transmission circuits may be sources S0-S15 (sources) (eg, heat sources). For example, the plurality of transmission circuits (hereinafter, also referred to as'sources S0-S15') each include a phase shifter and TX, RX VGA, so that the communication device, for example, , It is possible to control the orientation direction of the electronic device 101. As another example, the RFIC 492 provides an optimal communication environment or a good communication environment in a communication method with strong linearity, such as millimeter wave communication through phase difference feeding (e.g., wireless communication using a frequency band of 6 GHz or more and 300 GHz or less). It can be useful for securing. According to an embodiment, a shielding member (not shown) for shielding the RFIC 492 may be disposed at the periphery of the RFIC 492.

According to an embodiment, a plurality of sources S0-S15 of the RFIC 492 may be arranged in an array of an N*M matrix. For example, a plurality of sources arranged in a 2*8 arrangement may include a total of 16 sources from source 0 (S0) to source 15 (S15). 5, source 0 (S0), source 1 (S1), source 4 (S4), source 5 (S5), source 8 (S8), source 9 (S9), and source 12 (S12) in the first column. , Source 13 (S13) is arranged side by side, and source 2 (S2), source 3 (S3), source 6 (S6), source 7 (S7), source 10 (S10), source 11 (S11) in the second column , Source 14 (S14), source 15 (S15) may be arranged side by side. The direction of the antenna direction may be controlled by the electric flow of the conductive plate(s) or radiation conductors connected to each source.

According to various embodiments, at least one temperature sensor (at least one thermistor) for sensing a temperature corresponding to each of the sources S0-S15 may be disposed on the printed circuit board 470. For example, at least one first thermistor (for example, 499 in FIG. 5) may be included inside the RFIC 492, and at least one second thermistor (for example, 498 in FIG. 5) may be included outside the RFIC 492. Can be included.

According to an embodiment, the RFIC 492 includes a plurality of first thermistors 499-0 to 499-15 at positions 1 to 16 corresponding to each of a plurality of sources S0-S15 inside. Can include. Each of the first thermistors 499-0 to 499-15 disposed at the first to sixteenth positions corresponding to the sources S0-S15 processes the sensed information when a temperature higher than a threshold is sensed. (For example, it can be provided to the processor 120 of FIG. 1). The process 120 may control on/off of the plurality of sources S0-S15 in response to whether there is an overcurrent.

According to an embodiment, a plurality of the at least one second thermistor 498 disposed outside the RFIC 492 may be provided and may be positioned on the printed circuit board 470. For example, the second thermistor 498 includes a 2-1 thermistor 498a and a 2-2 thermistor 498b, and the 2-1 thermistor 498a and the 2-2 thermistor 498b ) May be spaced apart from the sources S0-S15 of the RFIC 492 by a specified distance. The first distance between the 2-1 thermistor 498a and the sources S0-S15 of the RFIC 492 and the 2-2 thermistor 498b correspond to the sources S0 of the RFIC 492 -S15) and the spaced second distance may be different from each other. As another example, the 2-1 th thermistor 498a and the 2-2 th thermistor 498b may be disposed between the RFIC 492 and the PMIC 494. The 2-1 th thermistor 498a and the 2-2 th thermistor 498b may monitor the temperature of each positioned region in real time and transmit the temperature to the processor 120. The processor 120 checks the temperature relationship between the internal thermistor of the plurality of previously input sources S0-S15 and the second thermistor 498, and controls whether each of the sources S0-S15 is operated. can do. A detailed description of this will be described later.

According to various embodiments, the connector 497 may electrically connect the printed circuit board 470 and an external board (eg, a main circuit board) through a bridge circuit board. For example, a connector (e.g., a coaxial cable connector or a B-to-B (board to board)) is included at one end or the other end of the bridge circuit board, and the signal of the RFIC 492 is transmitted to the main circuit board ( Example: It can be connected to the printed circuit board 340 of FIG. 2. According to an embodiment, the bridge circuit board may include a flexible circuit board. As another example, the bridge circuit board may include a coaxial cable using a coaxial cable connector, and the coaxial cable may be used for transmission of transmission and reception IF signals or RF signals. As another example, power or other control signals may be transmitted through a B-to-B connector.

Referring to FIG. 6, an electronic device 601 (eg, the electronic device 101 of FIG. 1) is a processor 610 (eg, the processor 120 of FIG. 1 ), an intermediate frequency integrated chip (IFIC). 620 (e.g., the communication module 190 of FIG. 1), a radio frequency integrated chip (RFIC) 630 (e.g., the communication module 190 of FIG. 1), a power management integrated chip (PMIC) 640) ( Example: power management module 188 of FIG. 1), memory 650 (eg, memory 130 of FIG. 1), antenna module (or antennas) 660 (eg, antenna module 460 of FIG. 4A) ), at least one first temperature sensor 670 (for example, the sensor module 176 in FIG. 1, or at least one first thermistor 499 in FIG. 5 ), at least one second temperature sensor 680 ( Example: A sensor module 176 of FIG. 1 or at least one second thermistor 498 of FIG. 5 may be included.

According to various embodiments, the RFIC 630, the PMIC 640, the antennas 660, the at least one first temperature sensor 670, or/and the at least one second temperature sensor 680 is a communication module ( It may be contained within 605 or packaged into a communication module 605. For example, the communication module 605 may be a mmWave module. The mmWave module may further include components other than the RFIC 630, the PMIC 640, the antennas 660, the at least one first temperature sensor 670, and the at least one second temperature sensor 680. .

According to various embodiments, the processor 610 may be an application processor (AP) or a communication processor (CP), or a processor in which an AP and a CP are integrated. According to various embodiments, the processor 610 may generate a baseband signal for wireless communication and provide it to the IFIC 620, and the RFIC 630 (or provided to the RFIC 630) for transmission of the baseband signal. The PMIC 640 that supplies power to a power amplifier (not shown) that amplifies power may be controlled.

The IFIC 620 may be at least a part of a communication circuit (for example, the communication module 190 of FIG. 1), and converts the transmission baseband signal provided from the processor 610 into a transmission IF signal, and converts the converted transmission IF signal into an RFIC. It may be provided to 630, and may be provided to the processor 610 by converting the received IF signal received from the RFIC 630 into a received baseband signal.

The RFIC 630 may be at least a part of a communication circuit (eg, the communication module 190 of FIG. 1 ), and may include at least one transmission circuit and at least one reception circuit. At least one receiving circuit may process a received RF signal received through the antenna module 660 and provide it to the IFIC 620. At least one transmission circuit may convert the transmission IF signal provided from the IFIC 620 into a transmission RF signal, and transmit the transmission RF signal through the antenna module 660 using power provided through the PMIC 640 .

The PMIC 640 may provide power to the RFIC 630 according to the control of the processor 610 or may adjust the power provided to the RFIC 630. For example, the PMIC 640 may control power supplied to the RFIC 630 (or a power amplifier (not shown) that amplifies the power provided to the RFIC 630).

At least one first temperature sensor 670 may be disposed at at least one location corresponding to at least one transmission circuit (or at least one source) inside the RFIC 630 and may provide sensed temperature information. have. For example, the at least one first temperature sensor 670 may include first temperature sensors TH0 to TH15 disposed at positions 1 to 16 corresponding to sources 0 to 15 (S0 to S15) of the RFIC 630. ) Can be included. For example, the temperature sensor TH0 may provide temperature information sensed at a first position corresponding to the source 0, and the temperature sensor TH1 may provide temperature information sensed at a second position corresponding to the source 1. According to an embodiment, the processor 610 may check a sensing value by each of the first temperature sensors TH0 to TH15 disposed at the first to sixteenth positions.

At least one second temperature sensor 680 may be disposed outside the RFIC 630 and may be disposed at a location spaced apart from the RFIC 492 by a specified distance. For example, at least one second temperature sensor 680 is a 2-1 temperature sensor (eg, the first temperature sensor of FIG. 5) disposed at a position (eg, a 17th position) spaced apart from the RFIC 492 by a first distance. 2-1 thermistor 498a) or/and the 2-2 temperature sensor (eg, 2-2 thermistor in FIG. 5) disposed at a location (eg, the 18th location) separated by a second distance from the RFIC 492 (498b)). For example, the 2-1 temperature sensor and the 2-2 temperature sensor may each provide sensed temperature information. According to an embodiment, the processor 610 may check values sensed by the 2-1 temperature sensor and the 2-2 temperature sensor, respectively.

According to various embodiments, the processor 610 may sense information sensed by at least one first temperature sensor 670 or/and at least one second temperature sensor 680 when a signal is transmitted through the antenna module 660. The temperature associated with the antenna module or the communication circuit can be checked using. According to an embodiment, the processor 610 includes at least one first temperature sensor 670 corresponding to at least one transmission circuit (or source) inside the RFIC 630 or/and at least one outside the RFIC 630 The temperature of at least one transmission circuit (eg, at least one source S0 to S15) in the RFIC 630 may be checked using the information sensed by the second temperature sensor 680 of.

According to an embodiment, the processor 610 uses the first temperature sensing information sensed by the first temperature sensor 670, the second temperature sensing information sensed by the second temperature sensor 680, or , The temperature of at least one transmission circuit (eg, at least one source S0 to S15) in the RFIC 630 may be checked by using the first temperature sensing information and the second temperature sensing information.

According to an embodiment, the processor 610 senses first temperature sensing information sensed by each of the at least one first temperature sensor 670 and second temperature sensing information sensed by the at least one second temperature sensor 680. At least one transmission circuit in the RFIC 630 (e.g., at least one source (S0 to S15)) by acquiring a relationship between information and using the relationship with at least one of first temperature sensing information or second temperature sensing information You can check the temperature of. For example, the relationship between the first temperature sensing information sensed by each of the at least one first temperature sensor 670 and the second temperature sensing information sensed by the at least one second temperature sensor 680 is the memory 650 ) Can be stored in advance. For example, when one transmission circuit (e.g., source 0 (S0)) is turned on or starts signal transmission, the processor 610 may perform first temperature sensing information and second temperature sensing information corresponding to source 0 (S0). A relationship between temperature sensing information (for example, a temperature difference) can be obtained, and first temperature sensing information can be obtained using the second temperature sensing information and the relationship to check the temperature corresponding to the source 0 (S0). have. In addition, when a plurality of sources (e.g., source 2 (S2), source 3 (S3), source 10 (S10), source 11 (S11)) are turned on or start signal transmission, the processor 610 Relationships (temperature differences) between each of the first temperature sensing information and the second temperature sensing information corresponding to each of (S2), source 3 (S3), source 10 (S10), and source 11 (S11) can be obtained. In addition, a temperature corresponding to each of the source 2 (S2), the source 3 (S3), the source 10 (S10), and the source 11 (S11) may be checked using the second temperature sensing and the relationships.

According to an embodiment, the processor 610 has a temperature change amount (Δt) (or a temperature change slope) of at least one transmission circuit (eg, source 0 to source 15 (S0 to S15)) in the RFIC 630 is less than a threshold value. You can check whether it is large or not. According to an embodiment, the processor 610 has a temperature change amount (Δt) (or a temperature change slope) of at least one transmission circuit (eg, source 0 to source 15 (S0 to S15)) in the RFIC 630 is less than a threshold value. In a large case, the temperature of at least one transmission circuit (eg, S0 ~ S15) in the RFIC 630 is checked every first time interval in the first time period (eg, transient state) to check the power compensation value according to the temperature, Power provided to at least one transmission circuit (eg, S0 to S15) may be adjusted in response to the determined power compensation value. According to an embodiment, the processor 610 has a temperature change amount (Δt) (or a temperature change slope) of at least one transmission circuit (eg, source 0 to source 15 (S0 to S15)) in the RFIC 630 is less than a threshold value. If it is not large, check the temperature of at least one transmission circuit (eg, S0 ~ S15) in the RFIC 630 every second time interval in the second time period (eg, static period), and check the power compensation value according to the temperature. , It is possible to adjust the power provided to at least one transmission circuit (for example, S0 ~ S15) in response to the determined power compensation value. For example, the first time interval may be a shorter time interval than the second time interval.

According to various embodiments, the threshold value may be designated as one of various values according to various conditions such as the number of at least one transmission circuit in the RFIC 630, the type or size of the antenna module 660, or the heating state of the RFIC 630. I can.

According to various embodiments, the processor 610 checks other heating elements around at least one transmission circuit before turning on at least one transmission circuit in the RFIC 630 or transmitting a signal, and recovers heat generated by the other heating elements. In consideration of, the temperature of at least one transmission circuit can be checked.

According to various embodiments, the processor 610 may check the power compensation value based on the determined temperature. According to an embodiment, the processor 610 may check a power compensation value to be compensated for each transmission circuit based on the temperature of at least one source (eg, S0 to S15) in the RFIC 630. For example, the memory 650 may store compensation value information (eg, a compensation value table) according to each temperature of at least one source (eg, S0 ~ S15), and the processor 610 may store the memory 650 The power compensation value to be compensated for each transmission circuit can be checked using the compensation value information stored in. For example, the compensation power value may be a power value for compensating for reduced power according to the EIRP of the antenna module 660 at a specific time period (eg, a first time period or a second time period) and a specific temperature. According to various embodiments, the processor 610 may adjust power provided to the communication circuit through the power control circuit based on the determined power compensation value. According to an embodiment, the processor 610 may adjust power provided to at least one transmission circuit (or source) in the RFIC 630 through the PMIC 640 (eg, S0 to S15). For example, the processor 610 provides power to at least one transmission circuit (or source) in the RFIC 630 through the PMIC 640 (eg, S0 to S15), but the EIRP is reduced based on the temperature. Accordingly, it is possible to provide more power equal to the power compensation value. In addition, the processor 610 performs compensation at each first time interval having a small time interval in the first time interval in which the EIRP decrease based on temperature is abrupt, and the second time interval in which the EIRP decrease based on temperature is relatively less rapid. Compensation may be performed at every second time interval in which the time interval is greater than the first time interval.

An electronic device (eg, the electronic device 101 of FIG. 1, or the electronic device 601 of FIG. 6) according to various embodiments includes an antenna module (eg, the antenna module 197 of FIG. 1, and the antenna module of FIG. 4A ). 460), the antenna module 460 of FIG. 5, or the antenna module 660 of FIG. 6), a communication circuit for transmitting a signal through the antenna module (eg, the communication module 190 of FIG. 1, or Communication module 605), at least one temperature sensor (e.g., the sensor module 176 of FIG. 1, at least one first thermistor 499 of FIG. 5, at least one second thermistor 498 of FIG. 5), At least one first temperature sensor 670 of FIG. 6, or at least one second temperature sensor 680 of FIG. 6), a power control circuit that provides power to the communication circuit (for example, a power management module of FIG. 1 188, or the PMIC 640 of FIG. 6), and a processor electrically or operatively connected to the communication circuit, the at least one temperature sensor, and the power control circuit (for example, the processor 120 of FIG. 1, Or the processor 610 of FIG. 6), wherein the processor checks the amount of temperature change associated with the antenna module or the communication circuit through the at least one temperature sensor when transmitting a signal through the antenna module, and checks the The compensation period is checked based on the determined temperature change amount and the temperature change amount threshold value, and if the confirmed compensation period is the first compensation period, the power compensation value is checked every first time interval, and the confirmed compensation period is the second compensation period. If the back side is set to check the power compensation value at every second time interval having a time interval longer than the first time interval, and adjust the power provided to the communication circuit through the power control circuit based on the confirmed power compensation value Can be.

According to various embodiments, the processor (for example, the processor 120 of FIG. 1 or the processor 610 of FIG. 6) determines the compensation period when the determined temperature change amount is greater than or equal to the temperature change amount threshold value. It is confirmed as a compensation period, and when the confirmed temperature change amount is less than the temperature change amount threshold value, the compensation period may be confirmed as the second compensation period.

According to various embodiments, the at least one temperature sensor and the power control circuit may be disposed on the same substrate (eg, the printed circuit board 470 of FIG. 5 ).

According to various embodiments, the communication circuit includes a plurality of transmission circuits (eg, sources 0 to source 15 (S0 to S15) in FIG. 6), and the processor includes the plurality of transmission circuits based on the determined amount of temperature change. It may be set to check a plurality of power compensation values for the transmission circuits of and to provide different powers to the plurality of transmission circuits based on the plurality of power compensation values.

According to various embodiments, the communication circuit includes a radio frequency integrated chip (RFIC) (eg, RFIC 630 of FIG. 6), and the at least one temperature sensor is a first temperature sensor (eg, a first temperature sensor) inside the RFIC. : It may include at least one first temperature sensor 670 of FIG. 6.

According to various embodiments, a second temperature sensor (eg, at least one second temperature sensor 680 of FIG. 6) may be further included outside the RFIC.

According to various embodiments, the processor uses the information sensed by at least one of the first temperature sensor and the second temperature sensor and the relationship between the first temperature sensor and the second temperature sensor to provide the antenna module or the communication circuit. It is possible to check the amount of temperature change associated with.

According to various embodiments, the electronic device may further include a memory (eg, the memory 130 of FIG. 1 or the memory 650 of FIG. 6) for storing a power compensation value based on the amount of temperature change.

According to various embodiments, the plurality of transmission circuits may include a circuit for transmitting at least one signal among signals of a frequency band belonging to frequency range 2 (fr2) of 5G.

According to various embodiments, the processor (eg, the processor 120 of FIG. 1, or the processor 610 of FIG. 6) is the communication circuit (eg, the communication module 190 of FIG. 1, or the communication module of FIG. 6). When (605)) is turned on, a temperature associated with the communication circuit is checked, a temperature check cycle is checked based on the checked temperature, and a temperature change amount associated with the antenna module or the communication circuit is determined based on the temperature check cycle. I can confirm.

Referring to FIG. 7, a processor 710 (eg, the processor 120 of FIG. 1) of the electronic device 701 (eg, the electronic device 101 of FIG. 1, or the electronic device 601 of FIG. 6 ), or The processor 610 of FIG. 6 may include a Tx I/Q DAC 712, a modem 713, or an Rx I/Q ADC 714. The processor 710 converts the digital signal modulated by the modem 713 through the Tx I/Q DAC 712 into a balanced Tx I/Q signal, which is a transmission signal, and transmits it to the IFIC 720, and Rx I/Q A Balanced Rx I/Q signal, which is a transmission signal, is received from the IFIC 720 through the ADC 714 and converted into a digital signal, and the converted digital signal may be transmitted to the modem 713. According to various embodiments, the processor 710 is a communication processor including a Tx I/Q DAC 712, a modem 713, or an Rx I/Q ADC 714, or another processor capable of processing functions other than communication. It may be a processor integrated with a processor (eg, an application processor (AP)). According to various embodiments, the processor 710 may control the PMIC 740 that controls power supply to the first to nth power amplifiers 755-1 to 755-n for transmission of a transmission signal. I can.

According to various embodiments, the IFIC 720 (for example, the IFIC 620 in FIG. 6) is at least a part of a communication circuit (for example, the communication module 190 in FIG. 1), and the reception IF processing circuit 720-1 and It may include a transmit IF processing circuit 720-2. The receive IF processing circuit 720-1 may include a mixer 722-1, at least one Rx VGA 724-1, an LPF 726-1, and a buffer 728-1. The mixer 722-1 may down-convert the down-converted IF signal to a received IF signal to generate a balanced Rx I/Q signal. The LPF 726-1 may serve as a channel filter by setting the bandwidth of the Balanced Rx I/Q signal to a cutoff frequency. At least one Rx VGA 724-1 may perform automatic gain control (AGC) on the balanced Rx I/Q signal. The buffer 728-1 may temporarily store the Balanced Rx I/Q signal so that the Balanced Rx I/Q signal is stably transmitted to the Rx I/O DAC 714 of the processor 710. The balanced Rx I/Q signal delivered to the Rx I/O DAC 714 may be demodulated by a modem to process the received signal. According to various embodiments, the transmission IF processing circuit 720-2 may include a buffer 728-2, a TX variable gain amplifier (VGA) 724-2, a low pass filter (LPF) 726-2, or a mixer ( mixer) 722-2. The buffer 728-2 may temporarily store the received Balanced Tx I/Q signal to enable stable signal processing. The TX VGA 724-2 may include one or more VGAs and may perform automatic gain control (AGC) on a transmission signal. The LPF 726-2 may perform an operation of a channel filter operating the bandwidth of the Balanced Tx I/Q signal as a cutoff frequency, and the cutoff frequency may be variable. The mixer 722-2 may receive a signal from the oscillator 729 and up-convert the Balanced Tx I/Q signal to a transmission IF signal. The up-converted transmission IF signal may be transmitted to the transmission RF processing unit 730-2 through the switch 725 and processed.

According to various embodiments, the RFIC 730 (eg, the RFIC 730 of FIG. 6) is at least a part of a communication circuit (eg, the communication module 190 of FIG. 1), and the reception RF processing circuit 730-1 and It may include a transmit RF processing circuit (730-2). The reception RF processing circuit 730-1 may include n reception circuits (n reception chains or n sources). According to various embodiments, the reception RF processing circuit 730-1 includes a plurality of received RF signals through the first to n-th low noise amplifiers 735-1 to 735-n and the antenna module 760. Can receive. According to an embodiment, the reception RF processing circuit 730-1 may convert a plurality of received RF signals into a plurality of IF signals. According to various embodiments, the plurality of RF signals may be phase-shifted beamforming signals. According to an embodiment, the reception RF processing circuit 730-1 includes first to n-th phase shifters 732-1 to 732-n, and the first to nth RX VGAs 734-1 to 734-n), or a combination (n way Rx combination) 736. The first to nth phase shifters 732-1 to 732-n shift the phase of a plurality of received RF signals, for example, the first to nth received RF signals according to the beamforming angle, The plurality of received RF signals can be output. The first to nth RX VGAs 734-1 to 734-n may include one or more VGAs and may perform automatic gain control (AGC) for each of a plurality of received RF signals. The combination (n way Rx combination) 736 may combine a plurality of received RF signals that are in phase. The combined received RF signal may be transmitted to a mixer 738. The combined received RF signal may be subjected to automatic gain control (AGC) by the VGA 739 before being transmitted to the mixer 738. The mixer 738 may down-convert the combined received RF signal using a signal from the internal or external oscillator 731 from the RF band to the IF band. The down-converted IF signal may be transmitted to and processed through the switch 725 to the reception IF processing circuit 720-1. According to various embodiments, the reception IF processing circuit 720-1 may convert the down-converted IF signal into a digital signal and transmit it to the processor 710.

According to various embodiments, the transmit RF processing circuit 730-2 may receive an IF signal and convert it into a plurality of RF signals. The transmission RF processing circuit 730-2 may include n transmission circuits (n transmission chains or n sources) 771-1 to 771-n.

According to various embodiments, the plurality of RF signals may be phase-shifted beamforming signals. According to an embodiment, the transmission RF processing circuit unit 730-2 includes a mixer 742, an n way tx spliter 744, and first to nth TX VGAs 746-1 to 746-n. ), or the first to nth phase shifters 748-1 to 748-n. The mixer 742 may up-convert the transmitted IF signal to an RF band signal using a signal from the oscillator 731. The splitter (n way tx spliter) 744 may separate and generate the transmitted RF signal upconverted by the mixer 742 into n transmitted RF signals. The first to nth TX VGAs 746-1 to 746-n may perform an Auto Gain Control (AGC) operation for n transmitted RF signals according to a control signal of the processor 710. According to an embodiment, the number of VGAs may increase or decrease depending on the case. The first to n-th phase shifters 748-1 to 748-n can shift the phases of n transmitted RF signals according to the beamforming angle according to the control signal of the processor 710. have. Based on the phase shift, n transmit RF signals may be output as beamforming signals having different phases.

According to various embodiments, the first to nth power amplifiers 755-1 to 755-n may amplify the first to nth transmission signals and transmit them to the antenna module 760.

The PMIC 740 (for example, the PMIC 640 of FIG. 6) can control the power supplied to the first to n-th power amplifiers 755-1 to 755-n to amplify n transmission signals. have. According to various embodiments, the PMIC 740 may control power supplied to the first to nth power amplifiers 755-1 to 755-n according to a control signal from the processor 710.

The antenna module 760 (for example, the antenna module 460 of FIG. 4A or 5, or the antenna module 660 of FIG. 6) includes first to nth power amplifiers 755-1 to 755-n. ) Can be transmitted by selecting an appropriate path based on a communication method, and selecting an appropriate path for the received RF signal based on the communication method, and selecting the first to nth low noise amplifiers 735- 1~735-n). According to various embodiments, the antenna module 760 selects at least one antenna (or antenna path) from among a plurality of antennas or antenna arrays through the first to n-th path selection units 760-1 to 760-n. I can. According to various embodiments, the antenna module 760 itself may be a plurality of antennas (or antenna arrays) without the first to nth path selection units 760-1 to 760-n.

According to various embodiments, the first to nth low noise amplifiers 735-1 to 735-n may include a duplexer or a switch. For example, the first to nth low noise amplifiers 735-1 to 735-n may use a duplexer in the case of a frequency division duplex (FDD) communication method, and a time division duplex (TDD) type If so, you can use a switch. The antenna module 460 may include various antennas such as a phase array antenna and a patch antenna.

At least one first temperature sensor 770-1 to 770-n (eg, at least one temperature sensor 670 in FIG. 6) includes n (eg, 16) included in the transmission RF processing circuit 730-2. Dog) transmission circuits (n transmission chains or n sources) 771-1 to 771-n, respectively, and sensed temperature information may be provided. For example, the temperature sensor 770-1 is a temperature sensor corresponding to the first transmission circuit 771-1, and the first transmission circuit 771-1 is turned on or the first transmission circuit 771-1 is When a signal is transmitted by, sensed information may be provided. Similarly, the temperature sensor 770-n is a temperature sensor corresponding to the n-th transmission circuit 771-n, and the n-th transmission circuit 771-n is turned on or by the n-th transmission circuit 771-n. When a signal is transmitted, sensed information may be provided. According to various embodiments, one or a plurality of transmission circuits among n transmission circuits (n transmission chains or n sources) 771-1 to 771-n included in the transmission RF processing circuit 730-2 during signal transmission May be selectively turned on or transmit a signal, and the processor 710 may be turned on or transmit a signal at a specified time interval (eg, a first time interval or a second time interval) using a sensing value by a temperature sensor corresponding to each transmission circuit to which the signal is transmitted. Every 2 hour interval), you can check the temperature of each transmission circuit.

According to various embodiments, at least one second temperature sensor 780 (for example, at least one second temperature sensor 680 in FIG. 6) may be disposed outside the RFIC 730 and designated with the RFIC 730. They can be placed apart by distance. According to an embodiment, the processor 710 senses when at least one of n transmission circuits (n transmission chains or n sources) 771-1 to 771-n included in the RFIC 730 is turned on or a signal is transmitted. Information can be provided. According to various embodiments, one or a plurality of n transmission circuits (n transmission chains or n sources) 771-1 to 771-n may be selectively turned on or transmit signals, and the processor 710 is When one or more of the transmission circuits 771-1 to 771-n is selectively turned on or transmits a signal, a time interval specified by using the sensing value by the second temperature sensor 780 (e.g., the first time The temperature of the transmission circuit that is turned on at every interval or second time interval) or transmitting a signal can be checked.

According to various embodiments, the electronic device 701 may include only at least one first temperature sensor 770-1 to 770-n or only at least one second temperature sensor 780.

According to an embodiment, the processor 710 includes the first temperature sensing information sensed by each of the at least one first temperature sensor 770-1 to 770-n and the first temperature sensing information sensed by the second temperature sensor 780. 2 A relationship between temperature sensing information (e.g., a temperature difference value) is obtained, and the temperature of at least one transmission circuit that is turned on or is transmitting a signal using at least one of the first temperature sensing information or the second temperature sensing information and the relationship You can check. For example, when the first transmission circuit 771-1 is turned on or signal transmission is started, the processor 710 may determine the relationship between the first temperature sensing information and the second temperature sensing information corresponding to the first transmission circuit 771-1. (For example, a temperature difference) may be obtained, and a temperature corresponding to the first transmission circuit 771-1 may be checked using the second temperature sensing information and the relationship. Further, the processor 710 includes a plurality of transmission circuits (eg, a second transmission circuit 771-2, a third transmission circuit 771-3, a tenth transmission circuit 771-10, and an eleventh transmission circuit. (771-11)) is turned on or starts transmission, the second transmission circuit 771-2, the third transmission circuit 771-3, the tenth transmission circuit 771-10, the eleventh transmission circuit 771 -11) Relationships between the sensing values of the respective first temperature sensors 770-2, 770-3, 770-10, and 770-11 and the sensing values of the second temperature sensor 780 (temperature difference S), and using the relationships (temperature differences), the second transmission circuit 771-2, the third transmission circuit 771-3, the tenth transmission circuit 771-10, 11 The temperature corresponding to each of the transmission circuits 771-11) can be checked.

According to an embodiment, the processor 710 may check whether the temperature change amount Δt (or the temperature change slope) of each of the n transmission circuits 771-1 to 771-n is greater than a threshold value. According to an embodiment, when the temperature change Δt of each of the n transmission circuits 771-1 to 771-n is greater than the threshold value, the processor 710 transmits n transmissions at each first time interval in the first time interval. Check the temperature of each of the circuits 771-1 to 771-n to check the power compensation value according to the temperature, and each of the n transmission circuits 771-1 to 771-n in response to the determined power compensation value You can adjust the power provided to it. According to an embodiment, when the temperature change amount (Δt) (or temperature change slope) of each of the n transmission circuits 771-1 to 771-n is not greater than the threshold value, the processor 610 Every two time intervals, the temperature of each of the n transmission circuits 771-1 to 771-n is checked to check the power compensation value according to the temperature, and n transmission circuits 771- 1~771-n) You can adjust the power provided to each. For example, the first time interval may be a shorter time interval than the second time interval.

According to various embodiments, the processor 610 is another heating element around the n transmission circuits 771-1 to 771-n before each of the n transmission circuits 771-1 to 771-n is turned on or signal transmission. And the temperature of each of the n transmission circuits 771-1 to 771-n in consideration of heat generated by the other heating element.

According to various embodiments, the processor 710 may check the power compensation value based on the determined temperature. According to an embodiment, the processor 710 may check a power compensation value to be compensated for each transmission circuit based on the temperature of each of the n transmission circuits 771-1 to 771-n in the RFIC 730. For example, the memory 650 may store compensation value information (eg, a compensation value table) according to the temperature of each of the n transmission circuits 771-1 to 771-n in the RFIC 730, and the processor ( The 710 may check a power compensation value to be compensated for each of the n transmission circuits 771-1 to 771-n in the RFIC 730 using the compensation value information. For example, the compensation power value may be a power value for compensating for reduced power according to the EIRP of the antenna module 660 at a specific time period (eg, a first time period or a second time period) and a specific temperature. According to various embodiments, the processor 710 may adjust power provided to the communication circuit through the power control circuit based on the determined power compensation value. According to an embodiment, the processor 710 may adjust the power provided to each of the n transmission circuits 771-1 to 771-n in the RFIC 730 in the RFIC 730 through the PMIC 740. . For example, the processor 710 provides power to each of the n transmission circuits 771-1 to 771-n in the RFIC 730 in the RFIC 730 through the PMIC 740, but decreases based on the temperature. According to the EIRP to be used, more power equal to the power compensation value may be provided. In addition, the processor 710 performs compensation at each first time interval with a small time interval in the first time interval in which the EIRP decrease based on temperature is abrupt, and the second time interval in which the EIRP decrease based on temperature is relatively less rapid. Compensation may be performed at every second time interval in which the time interval is greater than the first time interval.

Referring to FIG. 8, a first graph 801 shows a temperature change of the transmission circuit when the transmission circuit (eg, at least one of the plurality of transmission circuits 771-1 to 771-n of FIG. 7) is turned on or the signal transmission starts. It may be a graph showing the curve 81 and the EIRP change curve 82. The second graph 802 may be a graph showing the EIRP curve 83 that changes according to temperature.

Referring to the first graph 801 and the second graph 802, the temperature of the transmission circuit (or the temperature of the antenna module associated with the transmission circuit (for example,) as time passes after the transmission circuit is turned on or the signal transmission starts. The temperature of the patch antenna surface)) 81 may increase, and the EIRP 82 value may decrease as the temperature 81 of the transmission circuit increases. For example, the temperature of the transmission circuit may increase rapidly (e.g., 80 degrees or more) within a few seconds to tens of seconds (about 180 seconds) after the transmission circuit is turned on or signal transmission starts, and the EIRP is proportional to this. It can be reduced from dBm to several tens of dBm (eg, about 13 dBm). EIRP may be a value obtained by multiplying a gain of a transmitting antenna by a power transmitted to the antenna from a connected transmitting circuit for a given direction as effective isotropic radiation power. When the EIRP value is decreased, a signal having a power smaller than the power transmitted from the transmission circuit to the antenna may be transmitted, resulting in lower transmission efficiency.

9 is a diagram illustrating a decrease in effective isotropic radiated power (EIRP) over time according to various embodiments.

Referring to FIG. 9, a first curve 910 indicates EIRP according to time when one transmission circuit (eg, one of the plurality of transmission circuits 771-1 to 771-n of FIG. 7) is turned on or transmission starts. It can be the curve shown. The second curve 920 is determined according to time when a plurality of transmission circuits (e.g., a plurality of the plurality of transmission circuits 771-1 to 771-n in FIG. 7) (e.g., four transmission circuits) are turned on or It may be a curve representing EIRP.

Referring to the first curve 910, one transmission circuit (e.g., one of the plurality of transmission circuits 771-1 to 771-n in FIG. 7) is turned on or several tens of seconds (e.g., 180 seconds) when transmission starts. Within the range, the temperature of the transmission circuit may increase (eg, several tens of degrees (for example, 80 degrees or more)), and in proportion to this, the EIRP may decrease by several dBm to several tens of dBm (eg, about 7.4 dBm).

Referring to the second curve 920, when a plurality of transmission circuits (e.g., a plurality of the plurality of transmission circuits 771-1 to 771-n in FIG. 7) (e.g., four transmission circuits) is turned on or when transmission starts The temperature of the transmitting circuit may rise within minutes or seconds (e.g. 3 minutes or 180 seconds) (e.g., tens of degrees (e.g., 116 degrees or more)), and in proportion to this, EIRP is several dBm to tens of dBm (e.g.: About 14.6dBm) can be reduced.

According to an embodiment, the processor 710 (e.g., the processor 120 of FIG. 1 or the processor 610 of FIG. 6) is the time when one transmission circuit is turned on or the temperature change amount is the threshold TH1 ( tTH1) (e.g., about 23 seconds), the first time interval t11 in which the temperature change amount is greater than the threshold value TH1 and the second time period t11 in which the temperature change amount is less than or equal to the threshold value TH1 The time section t12 can be checked. According to an embodiment, the processor 710 (for example, the processor 120 of FIG. 1 or the processor 610 of FIG. 6) is a time when a plurality of transmission circuits are turned on or when transmission starts, the temperature change amount is a threshold value TH2 ( tTH2) (e.g., about 38 seconds), the first time period t21 in which the temperature change amount is greater than the threshold value TH2 and the second time period t21 in which the temperature change amount is less than or equal to the threshold value TH2. The time section t22 can be checked. The processor 710 (for example, the processor 120 of FIG. 1 or the processor 610 of FIG. 6) checks the temperature of one or more transmission circuits at each first time interval in a first time interval to compensate for power according to the temperature. Based on the value, the power provided to each of one or more transmission circuits can be adjusted, and the temperature of one or more transmission circuits can be checked every second time interval in the second time period, and the power compensation value according to the temperature is used. Power provided to each of one or a plurality of transmission circuits can be adjusted.

10A is a graph of temperature change over time of an RFIC internal temperature sensor and an RFIC external temperature sensor associated with one transmission circuit according to various embodiments, and FIG. 10B is an RFIC internal temperature sensor associated with one transmission circuit according to various embodiments. It is a graph showing the temperature difference over time between the and RFIC external temperature sensor.

Referring to FIG. 10A, when one transmission circuit (eg, source 0) is turned on or a signal transmission starts, an RFIC internal temperature sensor (thermistor 0 (internal)) (eg, 499-0 in FIG. 5, TH0 in FIG. 6, or 770-1 in FIG. 7), RFIC external temperature sensor 1 (thermistor 1 (external)) (eg, 498a in FIG. 5), and RFIC external temperature sensor 2 (thermistor 2 (external)) (eg 498b in FIG. 5) The

temperature change graphs

1010, 1020, and 1030 show the temperature change amount based on the time (tTH1) (for example, about 23 seconds) at which the temperature change amount is the threshold value (TH1). A first time period 1001 having a value greater than (TH1) (the temperature change is rapid) and a second time period 1002 having a value less than or equal to the threshold value TH1 (temperature change is gentle) Can have

Referring to FIG. 10B, an RFIC internal temperature sensor (thermistor 0 (internal)) corresponding to one transmission circuit (eg, source 0) (eg, 499-0 in FIG. 5, TH0 in FIG. 6, or 770 in FIG. 7 ). -1), RFIC external temperature sensor 1 (thermistor 1 (external)) (e.g., 498a in FIG. 5), and RFIC external temperature sensor 2 (thermistor 2 (external)) (e.g., 498b in FIG. 5) over time As a result of the temperature measurement, there may be a relationship in which the temperature difference obtained using each of the RFIC internal temperature sensor and the RFIC external temperature sensor has a constant value (eg, 23.3deg).

According to various embodiments, the processor 710 (for example, the processor 120 of FIG. 1 or the processor 610 of FIG. 6) uses the relationship (temperature difference) between the RFIC internal temperature sensor and the RFIC external temperature sensor. Even without the internal temperature sensor, the RFIC internal temperature sensor value can be obtained based on the temperature obtained by the RFIC external temperature sensor when the transmission circuit (eg, source 0) is turned on or signal transmission starts.

11A is a graph of temperature change over time of an RFIC internal temperature sensor and an RFIC external temperature sensor associated with a plurality of transmission circuits according to various embodiments, and FIG. 11B is an RFIC internal temperature sensor associated with a plurality of transmission circuits according to various embodiments. It is a graph showing the temperature difference over time between the and RFIC external temperature sensor.

Referring to FIG. 11A, when a plurality of transmission circuits (eg, source: 2/3/10/11) is turned on or signal transmission starts, the average of internal temperature sensors (thermistors: 2/3/10/11 (internal)) ), RFIC external temperature sensor 1 (thermistor 1 (external)) (e.g., 498a in Fig. 5), and RFIC external temperature sensor 2 (thermistor 2 (external)) (e.g., 498b in Fig. 5) temperature change over time As a result of the measurement, the

temperature change graphs

1110, 1120, and 1130 each have a temperature change amount greater than the threshold value TH2 based on the time (tTH2) (about 23 seconds) at which the temperature change amount is the threshold value TH2 ( A first time period 1111 in which temperature change is abrupt) and a second time period 1112 in which the temperature change amount is less than or equal to the threshold value TH2 (the temperature change is gentle) may be provided.

Referring to FIG. 11B, RFIC internal temperature sensors corresponding to a plurality of transmission circuits (eg, source: 2/3/10/11) (thermistors: average of 2/3/10/11 (internal)), outside the RFIC Temperature measurement result of temperature sensor 1 (thermistor 1 (external)) (e.g. 498a in FIG. 5), and RFIC external temperature sensor 2 (thermistor 2 (external)) (e.g. 498b in FIG. 5) over time RFIC internal temperature There may be a relationship between the sensor and the temperature difference obtained using each of the RFIC external temperature sensor having a constant value (eg, 35.4deg).

According to various embodiments, the processor 710 (for example, the processor 120 of FIG. 1 or the processor 610 of FIG. 6) uses the relationship (temperature difference) between the RFIC internal temperature sensors and the RFIC external temperature sensor. Even without internal temperature sensors, when multiple transmission circuits (e.g., source: 2/3/10/11) are turned on or signal transmission starts, the values of the RFIC internal temperature sensors can be obtained based on the temperature obtained by the RFIC external temperature sensor. I can.

According to various embodiments, a method for controlling output power of a communication device based on temperature in an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7) An antenna module (eg, the antenna module 197 of FIG. 1, the antenna module 460 of FIG. 4A, the antenna module 460 of FIG. 5, the antenna module 660 of FIG. 6, or the antenna module 760 of FIG. 7) ) Through at least one temperature sensor (eg, the sensor module 176 of FIG. 1, FIG. 5) when a signal is transmitted from the communication circuit (eg, the communication module 190 of FIG. 1 or the communication module 605 of FIG. 6). At least one first thermistor 499 of FIG. 5, at least one second thermistor 498 of FIG. 5, at least one first temperature sensor 670 of FIG. 6, at least one second temperature sensor 680 of FIG. 6. ), checking an amount of temperature change associated with the antenna module or the communication circuit through at least one first temperature sensor 770 of FIG. 7 or at least one second temperature sensor 780 of FIG. 7, the Checking a compensation period based on the determined temperature change amount and the temperature change amount threshold value, if the compensation period is a first compensation period, checking a power compensation value associated with the communication circuit every first time interval, the compensation period In the second compensation period, an operation of checking the power compensation value associated with the communication circuit every second time interval having a time interval longer than the first time interval, and a power control circuit (eg: Provided to the communication circuit through the power management module 188 of FIG. 1, the PMIC 640 of FIG. 6, the IFIC 620 of FIG. 6, the PMIC 740 of FIG. 7, or the IFIC 620 of FIG. 6 It may include an operation of adjusting the power to be generated.

According to various embodiments, the method includes checking the compensation period as the first compensation period when the determined temperature change amount is greater than the temperature change amount threshold value, and the compensation period when the confirmed temperature change amount is less than the temperature change amount threshold value. It may further include an operation of checking as the second compensation period.

According to various embodiments, the communication circuit includes a plurality of transmission circuits (eg, source 0 to source 15 (S0 to S15) of FIG. 5, or n transmission circuits 771-1 to 771-n of FIG. 7). ), wherein the method includes checking a plurality of power compensation values for the plurality of transmission circuits based on the determined amount of temperature change, and to the plurality of transmission circuits based on the plurality of power compensation values. It may further include an operation of providing different powers.

According to various embodiments, the communication circuit includes a radio frequency integrated chip (RFIC) (eg, RFIC 630 of FIG. 6 or RFIC 730 of FIG. 7), and the at least one temperature sensor is A first temperature sensor (eg, at least one first temperature sensor 670 of FIG. 6 or at least one first temperature sensor 770 of FIG. 7) may be included therein.

According to various embodiments, the at least one temperature sensor is a second temperature sensor outside the RFIC (eg, at least one second temperature sensor 680 of FIG. 6 or at least one second temperature sensor of FIG. 7 ). (780)) may be further included.

According to various embodiments, the method includes the antenna module or the communication using information sensed by at least one of the first temperature sensor and the second temperature sensor and the relationship between the first temperature sensor and the second temperature sensor. It may further include an operation of checking the amount of temperature change associated with the circuit.

According to various embodiments, the method includes an operation of checking a temperature associated with the communication circuit when the communication circuit is turned on, an operation of checking a temperature check cycle based on the checked temperature, and the temperature check cycle based on the temperature check cycle. It may further include an operation of checking an amount of temperature change associated with the antenna module or the communication circuit.

Referring to FIG. 12, operations 1210 to 1230 according to various embodiments of the present disclosure are performed on an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7 ). It is understood as an operation performed by a processor (e.g., the processor 120 of FIG. 1, the processor 610 of FIG. 6, or the processor 710 of FIG. 7, hereinafter the processor 610 of FIG. 6 is described as an example) Can be. According to an embodiment, at least one of operations 1210 to 1230 may be omitted, an order of some operations may be changed, or another operation may be added.

In operation 1210, the processor 610 according to an embodiment senses by at least one first temperature sensor 670 or/and at least one second temperature sensor 680 when a signal is transmitted through the antenna module 660. The temperature (or temperature change amount) associated with the antenna module or communication circuit can be checked using the information. According to an embodiment, the processor 610 includes at least one first temperature sensor 670 corresponding to at least one transmission circuit (or source) inside the RFIC 630 or/and at least one outside the RFIC 630 The temperature (or temperature change amount) of at least one transmission circuit (eg, at least one source (S0 to S15)) in the RFIC 630 can be checked using the information sensed by the second temperature sensor 680 of . According to an embodiment, the processor 610 uses the first temperature sensing information sensed by the first temperature sensor 670, the second temperature sensing information sensed by the second temperature sensor 680, or , The temperature (or temperature change amount) of at least one transmission circuit (for example, at least one source S0 to S15) in the RFIC 630 may be checked using the first temperature sensing information and the second temperature sensing information. According to an embodiment, the processor 610 senses first temperature sensing information sensed by each of the at least one first temperature sensor 670 and second temperature sensing information sensed by the at least one second temperature sensor 680. At least one transmission circuit in the RFIC 630 (e.g., at least one source (S0 to S15)) by acquiring a relationship between information and using the relationship with at least one of first temperature sensing information or second temperature sensing information You can check the temperature (or temperature change) of. For example, the relationship between the first temperature sensing information sensed by each of the at least one first temperature sensor 670 and the second temperature sensing information sensed by the at least one second temperature sensor 680 is the memory 650 ) Can be stored in advance. For example, when one transmission circuit (e.g., source 0 (S0)) is turned on or starts signal transmission, the processor 610 may perform first temperature sensing information and second temperature sensing information corresponding to source 0 (S0). A relationship (eg, temperature difference) between temperature sensing information may be obtained, and first temperature sensing information may be obtained using the second temperature sensing information and the relationship, and the temperature (or temperature) corresponding to the source 0 (S0) may be obtained. Change). In addition, when a plurality of sources (e.g., source 2 (S2), source 3 (S3), source 10 (S10), source 11 (S11)) are turned on or start signal transmission, the processor 610 Relationships (temperature differences) between each of the first temperature sensing information and the second temperature sensing information corresponding to each of (S2), source 3 (S3), source 10 (S10), and source 11 (S11) can be obtained. In addition, a temperature (or temperature change amount) corresponding to each of the source 2 (S2), the source 3 (S3), the source 10 (S10), and the source 11 (S11) can be checked using the second temperature sensing and the relationships.

According to an embodiment, the processor 610 has a temperature change amount Δt (or temperature change slope) of at least one transmission circuit (eg, source 0 to source 15 (S0 to S15)) in the RFIC 630 is a threshold value ( Example: You can check whether it is greater than the temperature change threshold). According to an embodiment, the processor 610 has a temperature change amount (Δt) (or temperature change slope) of at least one transmission circuit (eg, source 0 to source 15 (S0 to S15)) in the RFIC 630 is a temperature change amount threshold. If it is greater than the value, the temperature (or temperature change amount) of at least one transmission circuit (eg, S0 to S15) in the RFIC 630 can be checked at each first time interval in the first time period (eg, transient state). According to an embodiment, the processor 610 has a temperature change amount (Δt) (or temperature change slope) of at least one transmission circuit (eg, source 0 to source 15 (S0 to S15)) in the RFIC 630 is a temperature change amount threshold. If it is not greater than the value, the temperature (or temperature change amount) of at least one transmission circuit (eg, S0 to S15) in the RFIC 630 can be checked every second time interval in the second time period (eg, static period). For example, the first time interval may be a shorter time interval than the second time interval. According to various embodiments, the threshold value may be designated as one of various values according to various conditions such as the number of at least one transmission circuit in the RFIC 630, the type or size of the antenna module 660, or the heating state of the RFIC 630. I can.

In operation 1220, the processor 610 according to an embodiment may check a power compensation value based on the identified temperature (or temperature change amount). According to an embodiment, the processor 610 may check a power compensation value to be compensated for each transmission circuit based on the temperature (or temperature change amount) of at least one source (eg, S0 to S15) in the RFIC 630. . According to an embodiment, the processor 610 checks the compensation period based on the temperature (or temperature change amount) and the temperature change amount threshold value of at least one source (eg, S0 to S15) in the RFIC 630, and confirms the If the determined compensation period is a first compensation period, the power compensation value is checked at every first time interval, and if the confirmed compensation period is a second compensation period, the power is performed every second time interval having a longer time interval than the first time interval. You can check the compensation value. For example, the memory 650 may store a compensation period and compensation value information (eg, a compensation value table) according to each temperature (or temperature change amount) of at least one source (eg, S0 ~ S15), and the processor 610 may check a power compensation value to be compensated for each transmission circuit by using the compensation period and compensation value information stored in the memory 650. For example, the compensation power value is the power to compensate for the reduced power according to the EIRP of the antenna module 660 at a specific period (or a specific time period) (eg, a first time period or a second time period) and a specific temperature. Can be a value.

In operation 1230, the processor 610 according to an embodiment may adjust power provided to the communication circuit through the power control circuit based on the determined power compensation value. According to an embodiment, the processor 610 may adjust power provided to at least one transmission circuit (or source) in the RFIC 630 through the PMIC 640 (eg, S0 to S15). For example, the processor 610 provides power to at least one transmission circuit (or source) in the RFIC 630 through the PMIC 640 and IFIC 620 (for example, S0 to S15), but based on temperature. Thus, it is possible to provide more power equal to the power compensation value according to the reduced EIRP. For example, the processor 610 performs compensation at every first time interval having a small time interval in a first time interval in which the EIRP decrease based on temperature is abrupt, and the EIRP decreased based on temperature is relatively less rapid. In the second time interval, compensation may be performed at every second time interval in which the time interval is greater than the first time interval.

Referring to FIG. 13, operations 1310 to 1350 according to various embodiments are performed by an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7 ). It is understood as an operation performed by a processor (e.g., the processor 120 of FIG. 1, the processor 610 of FIG. 6, or the processor 710 of FIG. 7, hereinafter the processor 610 of FIG. 6 is described as an example) Can be. According to an embodiment, at least one of operations 1310 to 1350 may be omitted, an order of some operations may be changed, or another operation may be added.

In operation 1310, the processor 610 according to an embodiment includes at least one first temperature sensor (eg, at least one of the RFIC 630 of FIG. 6 or the RFIC 730 of FIG. At least one transmission circuit (or source) (for example, by using the information sensed by the first temperature sensor 670 of FIG. 7 or at least one of the at least one first temperature sensor 770-1 to 770-n) of FIG. : A temperature (or temperature change amount) associated with at least one of S0 to S15 of FIG. 5 or at least one of 771-1 to 771-n of FIG. 7 may be checked.

In operation 1320, the processor 610 according to an embodiment may check the temperature change amount Δt (or temperature change slope) over time. For example, the processor 610 may check the temperature change amount (Δt) over time based on information sensed by at least one first temperature sensor inside the RFIC from when the electronic device 601 is turned on.

In operation 1330, the processor 610 according to an embodiment may check a time interval (or an operation state, or a compensation period) corresponding to the temperature change amount Δt. According to an embodiment, the processor 610 may check whether the temperature change amount Δt (or temperature change slope) of at least one transmission circuit in the RFIC is greater than a threshold value (eg, a temperature change amount threshold). According to an embodiment, the processor 610 is a first time interval (eg, transient state) when the temperature change amount (Δt) (or temperature change slope) of at least one transmission circuit in the RFIC 630 is greater than the temperature change amount threshold value. (Or the first compensation cycle). According to an embodiment, when the temperature change amount (Δt) (or temperature change slope) of at least one transmission circuit in the RFIC is not greater than the temperature change amount threshold value, the processor 610 may perform a second time period (eg, static state) (or The second compensation cycle).

In operation 1340, the processor 610 according to an embodiment uses the power compensation value corresponding to the first time interval at each first time interval (eg, every first compensation period) to provide power to at least one transmission circuit. Can compensate. According to various embodiments, the processor 610 may compensate for power provided to at least one transmission circuit by using power compensation information stored in the memory 650.

According to an embodiment, the power compensation information may include Table 1 below.

Static state start time(ms)Static state start time(ms)
start time for n257start time for n257	3000030000
start time for n258start time for n258	10001000
start time for n260start time for n260	20002000
start time for n261start time for n261	30003000
Compensation speed at transient state(ms)Compensation speed at transient state(ms)
Compensation speed at transient state_ n257Compensation speed at transient state_ n257	1One
Compensation speed at transient state_ n258Compensation speed at transient state_ n258	22
Compensation speed at transient state_ n260Compensation speed at transient state_ n260	33
Compensation speed at transient state_ n261Compensation speed at transient state_ n261	44
Target TxP Compensation at transient state(dBm)Target TxP Compensation at transient state(dBm)
Target TxP Compensation at transient state_ n257Target TxP Compensation at transient state_ n257	2323
Target TxP Compensation at transient state_ n258Target TxP Compensation at transient state_ n258	2323
Target TxP Compensation at transient state_ n260Target TxP Compensation at transient state_ n260	2323
Target TxP Compensation at transient state_ n261Target TxP Compensation at transient state_ n261	2323
Compensation speed at static state(ms)Compensation speed at static state(ms)
Compensation speed at static state_ n257Compensation speed at static state_ n257	10001000
Compensation speed at static state_ n258Compensation speed at static state_ n258	20002000
Compensation speed at static state_ n260Compensation speed at static state_ n260	30003000
Compensation speed at static state_ n261Compensation speed at static state_ n261	40004000
Target TxP Compensation at static state(dBm)Target TxP Compensation at static state(dBm)
Target TxP Compensation at static state_ n257Target TxP Compensation at static state_ n257	2323
Target TxP Compensation at static state_ n258Target TxP Compensation at static state_ n258	2323
Target TxP Compensation at static state_ n260Target TxP Compensation at static state_ n260	2323
Target TxP Compensation at static state_ n261Target TxP Compensation at static state_ n261	2323
When doing EIRP Compensation, Target temperature delta(deg)When doing EIRP Compensation, Target temperature delta(deg)
Target temperature delta_ n257Target temperature delta_ n257	0.50.5
Target temperature delta_ n258Target temperature delta_ n258	0.50.5
Target temperature delta_ n260Target temperature delta_ n260	0.50.5
Target temperature delta_ n261Target temperature delta_ n261	0.50.5

Referring to Table 1, the static state start time (ms) may be a second time interval start time. Compensation speed at transient state (ms) may be a power compensation speed in the first time period. Target TxP Compensation at transient state (dBm) may be the target transmission power in the first time interval. Compensation speed at static state (ms) may be a power compensation speed in the second time period. Target TxP Compensation at static state (dBm) may be the target transmission power in the second time interval. When doing EIRP Compensation, Target temperature delta(deg) may be a temperature error range when performing compensation. n257, n258, n260, and n261 may be frequency band numbers belonging to 5G frequency range 2 (fr2). For example, n257 is a 28GHz band and may range from 26.5GHz to 29.5GHz. The n258 is a 26 GHz band and may range from 24.25 GHz to 27.5 GHz. The n260 is a 39GHz band and may range from 37GHz to 40GHz. n261 is a 28 GHz band and may range from 27.5 GHz to 28.35 GHz. According to an embodiment, the threshold between the first time period and the second time period corresponding to n257 may be a time of 30000 ms, and the processor 610 Based on Table 1, power may be compensated so that the target transmission power is maintained at 23 dBm every 1 ms before 30000 ms after the signal transmission corresponding to n257 starts.

In operation 1350, the processor 610 according to an embodiment uses the power compensation value corresponding to the second time interval at every second time interval (eg, every second compensation cycle) to provide power to at least one transmission circuit. Can compensate. According to an embodiment, based on Table 1, the processor 610 may compensate for power so that the target transmission power is maintained at 23 dBm every 1000 ms after 30000 ms after the signal transmission corresponding to n257 starts based on Table 1 above.

Referring to FIG. 14, operations 1410 to 1460 according to various embodiments of the present disclosure are performed on an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7 ). It is understood as an operation performed by a processor (e.g., the processor 120 of FIG. 1, the processor 610 of FIG. 6, or the processor 710 of FIG. 7, hereinafter the processor 610 of FIG. 6 is described as an example) Can be. According to an embodiment, at least one of operations 1410 to 1460 may be omitted, an order of some operations may be changed, or another operation may be added.

In operation 1410, the processor 610 according to an embodiment includes at least one second temperature sensor outside the RFIC (eg, the RFIC 630 of FIG. 6 or the RFIC 730 of FIG. 7) (eg, 2 of FIG. 5). Second temperature sensing information sensed by the thermistor 498, at least one second temperature sensor 680 of FIG. 6, or the second temperature sensor 780 of FIG. 7 may be obtained.

In operation 1420, the processor 610 according to an embodiment uses at least one transmission circuit (or source) (eg, at least one of S0 to S15 in FIG. 5, or 771- in FIG. 7) by using the second temperature sensing information. At least one of 1 to 771-n) and associated temperature (or temperature change amount) can be checked. For example, the processor 610 is based on the relationship (temperature difference) between the second temperature sensing information and the first temperature sensing information inside the RFIC (eg, the RFIC 630 of FIG. 6 or the RFIC 730 of FIG. 7 ). The temperature (or temperature change amount) associated with at least one transmission circuit (or source) (eg, at least one of S0 to S15 of FIG. 5 or at least one of 771-1 to 771-n of FIG. 7) can be checked. .

In operation 1430, the processor 610 according to an embodiment may check the temperature change amount Δt (or temperature change slope) over time. For example, the processor 610 may check the temperature change Δt over time based on information sensed by at least one second temperature sensor outside the RFIC from when the electronic device 601 is turned on.

In operation 1440, the processor 610 according to an embodiment may check a time interval (or an operation state or a compensation period) corresponding to the temperature change amount Δt. According to an embodiment, the processor 610 may check whether the temperature change amount Δt (or temperature change slope) of at least one transmission circuit in the RFIC is greater than a threshold value (eg, a temperature change amount threshold). According to an embodiment, the processor 610 is a first time interval (eg, transient state) when the temperature change amount (Δt) (or temperature change slope) of at least one transmission circuit in the RFIC 630 is greater than the temperature change amount threshold value. (Or the first compensation cycle). According to an embodiment, when the temperature change amount (Δt) (or temperature change slope) of at least one transmission circuit in the RFIC is not greater than a threshold value, the processor 610 may perform a second time period (eg, static state) (or a second Compensation cycle).

In operation 1450, the processor 610 according to an embodiment uses the power compensation value corresponding to the first time interval for each first time interval (eg, every first compensation period) to provide power to at least one transmission circuit. Can compensate. According to various embodiments, the processor 610 may compensate for power provided to at least one transmission circuit by using power compensation information stored in the memory 650. According to an embodiment, as shown in Table 1, the threshold value between the first time interval and the second time interval corresponding to n257 may be a time of 30000 ms, and the processor 610 corresponds to n257 based on Table 1 above. Power can be compensated so that the target transmission power is maintained at 23dbm every 1ms before 30000ms after the signal transmission starts.

In operation 1460, the processor 610 according to an embodiment uses the power compensation value corresponding to the second time interval every second time interval (eg, every second compensation period) to provide power to at least one transmission circuit. Can compensate. According to an embodiment, the processor 610 may compensate for power so that the target transmission power is maintained at 23 dBm every 1000 ms after 30000 ms after the signal transmission corresponding to n257 starts based on Table 1 above.

15A to 15C are diagrams illustrating a relationship between temperature and transmission power over time in an electronic device.

15A shows a transmission circuit (or source) of an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7) (eg, S0 to When one of S15 or one of 771-1 to 771-n of FIG. 7 is turned on, a relationship between temperature and transmission power over time may be shown when the power compensation operation is not performed. Referring to FIG. 15A, The horizontal axis represents time (t) and the vertical axis represents temperature and power (TxP) (eg, transmission power output through an antenna) When the transmission circuit is turned on, the temperature is room temperature before the transmission circuit is turned off. Value -> Tem2-> Tem1 can be raised (1510), and as the temperature rises, the transmit power decreases (1520) as the target transmit power (TxP1) -> TxP2 to satisfy the actual target transmit power. You may not be able to.

15B illustrates a transmission circuit (or source) of an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7) (eg, S0 to It may represent the power 1530 that is compensated when one of S15 or one of 771-1 to 771-n in Fig. 7 is turned on. According to various embodiments, a processor (eg, the processor 120 of Fig. 1, Fig. The processor 610 of FIG. 6 or the processor 710 of FIG. 7 is the IFIC at every first time interval having a small time interval in the first transient state 1501 in which the amount of transmission power change decreased based on temperature is abrupt. (For example, the output power of the IFIC 620 of FIG. 6 or the IFIC 720 of FIG. 7) is output with a higher power than the second time period (static state) 1503 to compensate for the transmission power. The processor (for example, the processor 120 of FIG. 1, the processor 610 of FIG. 6, or the processor 710 of FIG. 7) is a second time period (static In state) 1503, the output power of the IFIC is output at a power lower than that of the first time period 1501 at every second time interval longer than the first time interval, thereby compensating the transmission power.

15C illustrates a transmission circuit (or source) of an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7) (eg, S0 to When one of S15 or one of 771-1 to 771-n in Fig. 7 is turned on, it may indicate that the target transmission power TxP1 is satisfied according to the compensated power. For example, the temperature of the transmission circuit is turned on. Even if the normal temperature value -> Tem2-> Tem1 rises (1510), the target transmission is performed by compensating the transmission power according to whether the first time period (transient state) 1501 or the second time period (static state) 1503. Power TxP1 may be maintained (1522).

Referring to FIG. 16, operations 1610 to 1670 according to various embodiments of the present disclosure are performed on an electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 601 of FIG. 6, or the electronic device 701 of FIG. 7 ). It is understood as an operation performed by a processor (e.g., the processor 120 of FIG. 1, the processor 610 of FIG. 6, or the processor 710 of FIG. 7, hereinafter the processor 610 of FIG. 6 is described as an example) Can be. According to an embodiment, at least one of operations 1610 to 1670 may be omitted, an order of some operations may be changed, or another operation may be added.

In operation 1610, the processor 610 according to an embodiment of the RFIC (for example, the RFIC 630 of FIG. 6 or the RFIC 730 of FIG. 7, hereinafter, the RFIC 630 of FIG. 6 will be described as an example). You can check whether it is on or not. For example, the processor 610 may check whether the RFIC 630 is turned on based on whether the communication circuit (eg, the communication module 190 of FIG. 1) is turned on.

In operation 1620, the processor 610 according to an embodiment may check the temperature associated with the RFIC 630. For example, the processor 610 may check the temperature at the point when the RFIC 630 is turned on (eg, present). According to an embodiment, the processor 610 includes at least one first temperature sensor (eg, at least one first temperature sensor 670 of FIG. 6 or at least one first temperature of FIG. 7) inside the RFIC 630. At least one transmission circuit (or source) when the RFIC 630 is turned on by using information sensed by the sensors 770-1 to 770-n (e.g., at least one of S0 to S15 in FIG. 5) , Or at least one of 771-1 to 771-n in Fig. 7. According to an embodiment, the processor 610 may include at least one second temperature sensor outside the RFIC 630 (eg: When the RFIC 630 is turned on using sensing information sensed by the 2 thermistors 498 of FIG. 5, at least one second temperature sensor 680 of FIG. 6, or the second temperature sensor 780 of FIG. 7 A temperature associated with at least one transmission circuit (or source) (for example, at least one of S0 to S15 of Fig. 5, or at least one of 771-1 to 771-n of Fig. 7) can be checked. According to the processor 610, the time when the RFIC 630 is turned on using sensing information sensed by each of at least one first temperature sensor inside the RFIC 630 and at least one second temperature sensor outside the RFIC 630 It is also possible to check the temperature associated with at least one transmission circuit at.

In operation 1630, the processor 610 according to an embodiment may check (or determine) a temperature check period based on the temperature associated with the identified RFIC 630. For example, the processor 610 may check the temperature check cycle as a first cycle if the temperature value sensed at the time when the RFIC 630 is turned on (eg, present) is not more than a specified temperature threshold value, and the RFIC 630 If the temperature value sensed at the turned-on time point (eg, present) is greater than or equal to the specified temperature threshold, the temperature check cycle may be checked as a second cycle having a longer time interval than the first cycle. For example, the first period may be a fast period, and the second period may be a slow period.

In operation 1640, the processor 610 according to an embodiment may check the amount of temperature change according to the temperature check period. For example, the processor 610 checks the temperature change amount Δt over time based on information sensed by at least one first temperature sensor inside the RFIC 630 from when the electronic device 601 is turned on. Or, based on information sensed by at least one second temperature sensor outside the RFIC 630 from when the electronic device 601 is turned on, the temperature change amount Δt over time is checked, or the electronic device 601 The temperature change amount Δt over time may be checked based on information sensed by at least one of the first and second temperature sensors inside and outside the RFIC 630 from when turned on.

In operation 1650, the processor 610 according to an embodiment may check a compensation period corresponding to the identified temperature change amount Δt. According to an embodiment, the processor 610 may check whether the temperature change amount Δt (or the temperature change slope) of at least one transmission circuit in the RFIC 630 is greater than the temperature change amount threshold. According to an embodiment, the processor 610 is a first time interval (eg, transient state) when the temperature change amount (Δt) (or temperature change slope) of at least one transmission circuit in the RFIC 630 is greater than the temperature change amount threshold value. Can be confirmed. According to an embodiment, when the temperature change amount Δt (or temperature change slope) of at least one transmission circuit in the RFIC 630 is not greater than the temperature change amount threshold value, the processor 610 ). For example, a first time period may correspond to a first compensation period, and a second time period may correspond to a second compensation period. For example, the first compensation period may be a fast compensation period, and the second compensation period may be a slow compensation period.

In operation 1660, the processor 610 according to an embodiment may compensate for power provided to at least one transmission circuit by using a power compensation value corresponding to the first compensation period at every first time interval. According to various embodiments, the processor 610 may compensate for power provided to at least one transmission circuit by using power compensation information stored in the memory 650.

In operation 1670, the processor 610 according to an embodiment may compensate for power provided to at least one transmission circuit by using a power compensation value corresponding to the second compensation period at every second time interval. According to various embodiments, the processor 610 may compensate for power provided to at least one transmission circuit by using power compensation information stored in the memory 650.

Each of the components described in this document may be composed of one or more components, and the name of the component may vary according to the type of electronic device. In various embodiments, the electronic device may be configured to include at least one of the components described in this document, and some components may be omitted or additional other components may be further included. In addition, some of the components of the electronic device according to various embodiments of the present disclosure are combined to form a single entity, so that functions of the corresponding components prior to the combination may be performed in the same manner.

The term "module" used in this document may mean, for example, a unit including one or a combination of two or more of hardware, software, or firmware. "Module" may be used interchangeably with terms such as unit, logic, logical block, component, or circuit, for example. The "module" may be the smallest unit of integrally configured parts or a part thereof. The "module" may be a minimum unit or a part of one or more functions. The "module" can be implemented mechanically or electronically. For example, a "module" is one of known or future developed application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), or programmable-logic devices that perform certain operations. It may include at least one.

At least a part of a device (eg, modules or their functions) or a method (eg, operations) according to various embodiments is, for example, a computer-readable storage media in the form of a program module. It can be implemented as a command stored in ). When the command is executed by a processor (for example, the processor 120), the one or more processors may perform a function corresponding to the command. The computer-readable storage medium may be, for example, a memory (for example, the memory 130).

According to various embodiments of the present disclosure, in a storage medium storing instructions, the instructions are configured to cause the at least one circuit to perform at least one operation when executed by at least one circuit, and the at least one operation is , When transmitting a signal from the communication circuit through the antenna module, an operation of checking a temperature change amount associated with the antenna module or the communication circuit through at least one temperature sensor, and a compensation period based on the identified temperature change amount and a temperature change amount threshold value. Checking operation, if the confirmed compensation period is a first compensation period, checking a power compensation value associated with the communication circuit every first time interval, and if the confirmed compensation period is a second compensation period, than the first time interval Checking the power compensation value associated with the communication circuit every second time interval having a long time interval, and adjusting the power provided to the communication circuit through a power control circuit based on the checked power compensation value May include actions.

Computer-readable recording media include hard disks, floppy disks, magnetic media (e.g. magnetic tape), optical media (e.g. compact disc read only memory (CD-ROM)), DVD ( digital versatile disc), magnetic-optical media (e.g. floptical disk), hardware device (e.g. read only memory (ROM), random access memory (RAM)), or flash memory ), etc. In addition, the program instruction may include not only machine language code generated by a compiler, but also high-level language code that can be executed by a computer using an interpreter, etc. The hardware devices described above may include various types of hardware devices. It may be configured to operate as one or more software modules to perform the operation of the embodiment, and vice versa.

A module or a program module according to various embodiments may include at least one or more of the above-described components, some of the above-described components may be omitted, or additional other components may be further included. Operations performed by a module, a program module, or other components according to various embodiments may be executed sequentially, in parallel, repeatedly, or in a heuristic manner. Also, some operations may be executed in a different order, omitted, or other operations may be added.

The electronic device of the various embodiments of the present invention described above is not limited by the above-described embodiments and drawings, and various substitutions, modifications and changes are possible within the technical scope of the present invention. It will be obvious to those who have the knowledge of.

Claims

In the electronic device,

Antenna module;

A communication circuit for transmitting a signal through the antenna module;

At least one temperature sensor;

A power control circuit for providing power to the communication circuit; And

A processor electrically or operatively connected to the communication circuit, the at least one temperature sensor, and the power control circuit,

The processor,

When transmitting a signal through the antenna module, check the amount of temperature change associated with the antenna module or the communication circuit through the at least one temperature sensor,

Check the compensation period based on the identified temperature change amount and the temperature change amount threshold,

If the confirmed compensation period is the first compensation period, the power compensation value is checked every first time interval,

If the confirmed compensation period is a second compensation period, the power compensation value is checked every second time interval having a time interval longer than the first time interval,

An electronic device configured to adjust power provided to the communication circuit through the power control circuit based on the determined power compensation value.
The method of claim 1,

The processor,

It is set to check the compensation period as the first compensation period when the confirmed temperature change amount is greater than the temperature change amount threshold value, and check the compensation period as the second compensation period when the confirmed temperature change amount is less than the temperature change amount threshold value. Electronic device.
The method of claim 1,

The electronic device in which the at least one temperature sensor and the power control circuit are disposed on the same substrate.
The method of claim 1,

The communication circuit includes a plurality of transmission circuits,

The processor,

Checking a plurality of power compensation values for the plurality of transmission circuits based on the determined amount of temperature change,

An electronic device configured to provide different powers to the plurality of transmission circuits based on the plurality of power compensation values.
The method of claim 4,

The communication circuit includes a radio frequency integrated chip (RFIC),

The electronic device of the at least one temperature sensor including a first temperature sensor in the RFIC.
The method of claim 5,

The at least one temperature sensor further includes a second temperature sensor outside the RFIC.
The method of claim 6,

The processor uses the information sensed by at least one of the first temperature sensor and the second temperature sensor and the relationship between the first temperature sensor and the second temperature sensor to determine the amount of temperature change associated with the antenna module or the communication circuit. Electronic device set up to check.
The method of claim 1,

The electronic device further comprises a memory for storing a power compensation value based on a temperature change amount.
The method of claim 3,

The plurality of transmission circuits includes a circuit for transmitting at least one of signals in a frequency band belonging to a frequency range 2 (fr2) of 5G.
The method of claim 1,

The processor,

When the communication circuit is turned on, a temperature associated with the communication circuit is checked, a temperature check cycle is checked based on the checked temperature, and a temperature change amount associated with the antenna module or the communication circuit is checked based on the temperature check cycle. Electronic device.
In the temperature-based output power control method of a communication device,

Checking an amount of temperature change associated with the antenna module or the communication circuit through at least one temperature sensor when a signal is transmitted from the communication circuit through the antenna module;

Checking a compensation period based on the determined temperature change amount and the temperature change amount threshold value;

Checking a power compensation value associated with the communication circuit every first time interval if the confirmed compensation period is a first compensation period;

If the confirmed compensation period is a second compensation period, checking the power compensation value associated with the communication circuit every second time interval having a time interval longer than the first time interval; And

And adjusting power provided to the communication circuit through a power control circuit based on the determined power compensation value.
The method of claim 11,

A method of checking the compensation period as the first compensation period when the confirmed temperature change amount is greater than the temperature change amount threshold value, and checking the compensation period as the second compensation period when the determined temperature change amount is less than the temperature change amount threshold value .
The method of claim 11,

The method wherein the at least one temperature sensor and the power control circuit are disposed on the same substrate.
The method of claim 11,

The communication circuit includes a plurality of transmission circuits,

Checking a plurality of power compensation values for the plurality of transmission circuits based on the determined amount of temperature change; And

The method further comprising providing different powers to the plurality of transmission circuits based on the plurality of power compensation values.
A storage medium storing instructions, wherein the instructions are set to cause the at least one circuit to perform at least one operation when executed by at least one circuit,

The at least one operation includes an operation of checking a temperature change amount associated with the antenna module or the communication circuit through at least one temperature sensor when a signal is transmitted from the communication circuit through the antenna module, the confirmed temperature change amount and the temperature change amount threshold Checking a compensation period based on, if the confirmed compensation period is a first compensation period, checking a power compensation value associated with the communication circuit every first time interval, and if the confirmed compensation period is a second compensation period Checking the power compensation value associated with the communication circuit every second time interval having a time interval longer than the first time interval, and to the communication circuit through a power control circuit based on the confirmed power compensation value. A storage medium comprising the operation of adjusting the provided power.