WO2020187034A1 - 光学收发模组及光纤缆线模组 - Google Patents

光学收发模组及光纤缆线模组 Download PDF

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Publication number
WO2020187034A1
WO2020187034A1 PCT/CN2020/077878 CN2020077878W WO2020187034A1 WO 2020187034 A1 WO2020187034 A1 WO 2020187034A1 CN 2020077878 W CN2020077878 W CN 2020077878W WO 2020187034 A1 WO2020187034 A1 WO 2020187034A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
substrate
transceiver module
optical transceiver
optical
Prior art date
Application number
PCT/CN2020/077878
Other languages
English (en)
French (fr)
Inventor
张骏扬
黄云晟
李文贤
吕政鸿
陈珉儒
吴昌成
Original Assignee
佑胜光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201911053739.8A external-priority patent/CN112748502A/zh
Priority claimed from CN202010106520.6A external-priority patent/CN113296198A/zh
Application filed by 佑胜光电股份有限公司 filed Critical 佑胜光电股份有限公司
Publication of WO2020187034A1 publication Critical patent/WO2020187034A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors

Definitions

  • This application relates to the field of optical fiber communication technology, and in particular to an optical transceiver module and an optical fiber cable module used in the same.
  • optical fiber communication technology it is necessary to convert electrical signals into optical signals through optical transmitting components (such as lasers), and then couple the optical signals into optical fibers that conduct the optical signals.
  • optical transmitting components such as lasers
  • I/O input/output
  • I/O signals are electrically transmitted back and forth from the processor through the circuit board and sent out to peripheral devices. Electrical signals must pass through solder joints, cables and other electrical conductors. Therefore, the electrical I/O signal rate is limited by the electrical characteristics of the electrical connector.
  • optical fiber transmission system has the advantages of high-speed transmission, long transmission distance, and immunity to electromagnetic wave interference because it does not have bandwidth limitations. Therefore, the current electronics industry is mostly researching and developing in the direction of optical fiber transmission.
  • This application proposes an optical transceiver module to realize the miniaturization of the optical transceiver module.
  • optical transceiver module including:
  • the substrate is arranged in the housing;
  • the light receiving component is arranged on the substrate;
  • a plurality of light emitting components are connected to the substrate, wherein there is an oblique angle between the light emitting components and the substrate.
  • optical fiber cable module including:
  • Optical transceiver module including:
  • the substrate is arranged in the housing;
  • the light receiving component is arranged on the substrate;
  • a plurality of light emitting components are connected to the substrate, wherein there is an oblique angle between the light emitting components and the substrate.
  • This application proposes a light emitting component, an optical transceiver module and an application thereof.
  • the optical transceiver module has a simple structure and can realize the miniaturization of the optical transceiver module.
  • Figure 1 is a block diagram of a system using the optical cable module of the present application
  • FIGS. 2 to 4 are schematic diagrams of an embodiment of the optical transceiver module of this application.
  • 5A to 9 are schematic diagrams of different embodiments of the substrate of this application.
  • FIG. 12 is a schematic diagram of an embodiment of the light emitting component of this application.
  • FIG. 13 is a schematic diagram of an embodiment of the light emitting component of this application.
  • optical transceiver module 14 is a schematic diagram of an embodiment of the optical transceiver module of this application.
  • FIGS. 14A and 14B are schematic diagrams of the light emitting fixture of this application.
  • 15 to 17 are schematic diagrams of different embodiments of the substrate of this application.
  • FIG. 18 is a schematic diagram of an embodiment of the light receiving component and the substrate of this application.
  • 19A and 19B are schematic diagrams of an embodiment of the light receiving fixture of this application.
  • FIG. 20 is a schematic diagram of an embodiment of a light receiving component and a substrate according to the present application.
  • 21-27 are schematic diagrams of different embodiments of the optical transceiver module of this application.
  • FIG. 28 is a schematic diagram of an embodiment of the light emitting component of this application.
  • FIG. 29 is a schematic diagram of an embodiment of the light emitting component of this application.
  • FIGS. 30A and 30B are schematic diagrams of an embodiment of the light receiving chip of this application.
  • FIG. 31A is a schematic diagram of an embodiment of the light receiving component and the light receiving fixing member of the present application.
  • FIG. 31B is a schematic diagram of an embodiment of the light receiving fixture of the present application.
  • FIG. 36 are schematic diagrams of different embodiments of the light emitting component of this application.
  • FIG. 1 is a flowchart of using the optical cable module 100.
  • the optical cable module 100 includes an optical transceiver module 110, an optical fiber Cable 130 and electronic device 101.
  • the electronic device 101 may be any of many computing or display devices, including but not limited to data centers, desktop or laptop computers, notebook computers, ultra-thin notebooks, tablet computers, notebooks, or Other computing devices.
  • many other types of the electronic device 101 may include one or more of the optical transceiver module 110 and/or the matching port 102 described in this application, and are described in The embodiments in this application can be equivalently applied to these electronic devices.
  • Examples of these other electronic devices 101 may include electric vehicles, handheld devices, smart phones, media devices, personal digital assistants (PDAs), ultra-mobile personal computers, mobile phones, multimedia devices, memory devices, cameras, voice recorders, I/ O devices, servers, set-top boxes, printers, scanners, monitors, TVs, electronic billboards, projectors, entertainment control units, portable music players, digital cameras, Internet devices, game equipment, game consoles, or any Other electronic devices 101 that may include the optical transceiver module 110 and/or the matching port 102.
  • the electronic device 101 may be any other electronic device that processes data or images.
  • the optical fiber cable 130 is connected to the optical transceiver module 110 for transmitting optical signals.
  • the optical fiber cable 130 may include at least one or more optical fiber cores for allowing optical signals to be transmitted in the optical fiber cores.
  • the electronic device 101 may include a processor 103, which may represent any type of processing component for processing electrical and/or optical I/O signals. It is understandable that the processor 103 may be a single processing device or multiple separate devices.
  • the processor 103 may include or may be a microprocessor, a programmable logic device or array, a microcontroller, a signal processor, or some combination.
  • the matching port 102 of the electronic device 101 can be used as an interface to connect to the optical transceiver module 110.
  • the optical transceiver module 110 can allow another peripheral device 105 and the electronic device 101 to be connected to each other.
  • the optical transceiver module 110 of this embodiment can support communication via an optical interface. In various embodiments, the optical transceiver module 110 may also support communication through an electrical interface.
  • the peripheral device 105 may be a peripheral I/O device.
  • the peripheral device 105 may be any of a variety of computing devices, including but not limited to desktop or laptop computers, notebook computers, ultra-thin notebooks, tablet computers, notebook, or other computing devices.
  • peripheral devices 105 may include electric vehicles, handheld devices, smart phones, media devices, personal digital assistants (PDAs), ultra-mobile personal computers, mobile phones, multimedia devices, memory Devices, cameras, tape recorders, I/O devices, servers, set-top boxes, printers, scanners, monitors, televisions, electronic billboards, projectors, entertainment control units, portable music players, digital cameras, Internet devices, Game equipment, game console, or other electronic devices.
  • PDAs personal digital assistants
  • I/O devices servers, set-top boxes, printers, scanners, monitors, televisions, electronic billboards, projectors, entertainment control units, portable music players, digital cameras, Internet devices, Game equipment, game console, or other electronic devices.
  • the electronic device 101 may also include an internal optical path.
  • the optical path may represent one or more components, which may include processing and/or termination components that transmit an optical signal between the processor 103 and the matching port 102. Transmitting a signal can include generating and converting to optical, or receiving and converting to electrical.
  • the device may also include electrical paths.
  • the electrical path represents one or more components that transmit an electrical signal between the processor 103 and the matching port 102.
  • the optical transceiver module 110 can be used to correspond to the matching port 102 of the electronic device 101.
  • mating a connector plug with another can be used to provide a mechanical connection.
  • Mating a connector plug with another usually also provides a communication connection.
  • the mating port 102 may include a housing 104, which may provide the mechanical connection mechanism.
  • the mating port 102 may include one or more optical interface components.
  • the path 106 may represent one or more components, and it may include processing and/or termination components for transmitting optical signals (or optical signals and electrical signals) between the processor 103 and the matching port 102. Transmitting signals can include generating and converting into optical signals, or receiving and converting into electrical signals.
  • the optical transceiver module 110 of the present application may be called an optical connector or an optical connector.
  • this optical connector can be used to provide a physical connection interface with a mating connector and an optical component.
  • the optical transceiver module 110 may be an optical engine for generating optical signals and/or receiving and processing optical signals.
  • the optical transceiver module 110 can provide conversion from electrical to optical signal or from light to electrical signal.
  • the optical transceiver module 110 can be used to process the optical signals in compliance with or in accordance with one or more communication protocols.
  • the optical interface and the electrical interface can follow the same protocol, but this is not absolutely necessary.
  • the optical transceiver module 110 can be an intended protocol It is constructed or programmed in a specific module, and different transceiver modules or light engines can be constructed for different protocols.
  • the optical transceiver module 110 proposed in this embodiment may include a substrate 111, a processor 112, a light emitting component 113, a light receiving component 114, a connector 115, a housing 116, a connecting board 117, and a light emitting fixture 118.
  • the substrate 111 may have a first surface 111a and a second surface 111b opposite to each other.
  • the substrate 111 is, for example, a printed circuit board (PCB) or a ceramic substrate, and may include, for example, pins or connecting balls for connecting to an external device.
  • PCB printed circuit board
  • the processor 112 is connected to the substrate 111, and the processor 112 can be any type of processor die or optical IC, and is not limited to any specific processor type.
  • the light emitting component 113 and the light receiving component 114 are the processor 112 connected to the substrate 111, and are used for transmitting and receiving optical signals, respectively.
  • the light emitting component 113 and the light receiving component 114 may include a transmitting circuit and a receiving circuit for transmitting electronic signals, and more specifically, processing the timing or other protocol aspects of the electronic signal corresponding to the optical signal.
  • the housing 116 may have an internal space for accommodating the substrate 111, the processor 112, the light emitting component 113, the light receiving component 114, the connector 115, the connecting board 117 and the light emitting holder 118.
  • the connecting plate 117 is connected between the base plate 111 and the light emitting component 113.
  • the light emitting fixture 118 can be used to position and fix the setting of the light emitting component 113 to maintain the characteristic loss and reliability of the optical fiber channel and the joint between the optical transceiver components. .
  • the substrate 111 is arranged in the housing 116, the substrate 111 may include at least one convex portion 111c and at least one concave portion 111d, the convex portion 111c is protruding from the substrate 111, the concave portion 111d It is formed on at least one side of the convex portion 111c.
  • the light emitting component 113 can be accommodated in the recess 111d. That is, the light emitting component 113 may be disposed on at least one side of the convex portion 111c.
  • the circuit or IC chip can also be formed on the surface of the convex portion 111c of the substrate 111 to increase the area of the circuit.
  • the substrate 111 may have one or more convex shapes.
  • a plurality of concave portions 111d may be located on opposite sides of the convex portion 111c, respectively.
  • the plurality of recesses 111d may also have different lengths or depths. In this way, light emitting components 113 of different sizes can be accommodated according to requirements.
  • the embossed shape of the substrate 111 can isolate different circuits (for example, a flexible circuit board connected to the light emitting component 113) to avoid mutual interference due to spatial overlap.
  • the substrate 111 may have at least one L-shape.
  • at least one concave portion 111d may be located on at least one side of the convex portion 111c.
  • the substrate 111 may have at least one step shape.
  • a plurality of concave portions 111d may be located on at least one side of the convex portion 111c.
  • the first surface 111a and the second surface 111b of the substrate 111 opposite to each other can be provided with different circuits for setting circuits, chips or components with different functions.
  • the light receiving component 114 may be disposed on the first surface 111a of the substrate 111, and the processor 112 and IC chips (such as but not limited to LDD, PA, CDR, DSP chips, etc.) may be disposed on the second surface of the substrate 111 On 111b. In this way, the installation space of circuits or chips can be increased, and the size of the substrate 111 can be correspondingly reduced.
  • the light receiving component 114 may also be fixed on the first surface 111a of the substrate 111 by a chip on board method.
  • the optical transceiver module 110 can be applied to, for example, a four-fiber channel parallel transmission (Parallel Single Mode 4 lane, PSM4) technology, which uses multiple light emitting components 113 to separate four laser sources with different wavelengths.
  • PSM4 Parallel Single Mode 4 lane
  • the optical receiving component 114 can receive optical signals, and can respectively guide the processed optical signals to different channels.
  • PSM4 Parallel Single Mode 4 lane
  • the optical transceiver module 110 can also be applied to various multi-channel wavelength division multiple tasks (multi-channel, Binary Phase Shift Keying, BPSK) , Quadrature Phase Shift Keying (QPSK), Coarse Wavelength Division Multiplexing (CWDM), Dense Wavelength Division Multiplexing (DWDM), Optical Optical Add/Drop Multiplexer (OADM), Reconfigurable Optical Add/Drop Multiplexer (ROADM), LR4 or similar related optical communication technology.
  • BPSK Binary Phase Shift Keying
  • QPSK Quadrature Phase Shift Keying
  • CWDM Coarse Wavelength Division Multiplexing
  • DWDM Dense Wavelength Division Multiplexing
  • OADM Optical Optical Add/Drop Multiplexer
  • ROADM Reconfigurable Optical Add/Drop Multiplexer
  • one or more light emitting components 113 can be connected to the substrate 111 through a connecting board 117, and a plurality of light emitting components 113 can be staggered.
  • the light emitting directions of the light emitting components 113 (that is, the emitting directions of the light signals) have an included angle, and the included angle is, for example, between 90 degrees and 180 degrees, that is, between the light emitting components 113 They can be arranged alternately.
  • the light emitting directions of the light emitting components 113 may be approximately opposite to each other or different from each other, that is, the light emitting directions of the light emitting components 113 are sandwiched between The angle is approximately 180 degrees.
  • each light emitting component 113 includes a light emitter 113a, a sealed housing 113b, and a cylindrical member 113c, and the light emitter 113a is completely sealed in one or more sealed housings 113b. That is, the light emitter 113a in the light emitting component 113 will not contact the external environment or the air outside the light emitting component 113, so as to avoid the aging of the components of the light emitter 113a, ensure the component performance of the light emitter 113a, and greatly extend The service life of the component.
  • the degree of sealing of the light emitting assembly 113 meets the airtight requirement of TO (Transmitter Optical Sub-Assembly) type packaging for industrial use.
  • the sealing degree of each of the plurality of light emitting components 113 may be 1 ⁇ 10 -12 to 5 ⁇ 10 -7 (atm*cc/sec).
  • the wavelength of the light signal emitted by the light emitter 113a of the light emitting component 113 may be in the range of near infrared light to infrared light, which is about 830 nanometers (nm) to 1660 nanometers.
  • the optical transmitter 113a may be any type of laser chip suitable for generating optical signals (for example, edge-emitting laser device, FP/DFB/EML laser, or vertical cavity surface emitting laser, VCSEL).
  • the light emitter 113a can be directly sealed in the sealed housing 113b without an exposed gap, so as to ensure the tightness of the light emitting component 113.
  • the sealed housing 113b is, for example, a cylindrical housing.
  • the cylindrical member 113c is provided on one side of the sealed casing 113b.
  • a light coupling lens (not shown), such as a convex lens or a spherical lens, may be provided inside the cylindrical member 113c for coupling the optical signal emitted by the light transmitter 113a to an external optical fiber via the cylindrical member 113c. Therefore, the light emitting direction of each light receiving component is from the light emitter 113a in the sealed housing 113b toward the cylindrical member 113c.
  • the diameter or width of the sealed housing 113b may be greater than the diameter or width of the cylindrical member 113c. In this way, through the staggered arrangement of the plurality of light emitting components 113, the plurality of light emitting components 113 can be arranged more closely, so as to reduce the configuration space of the plurality of light emitting components 113, so that more light emitting components 113 can be arranged.
  • the component 113 is configured and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.
  • a plurality of light emitting components 113 may be respectively located on the upper and lower sides of the substrate 111 and arranged in a staggered manner, so that the staggered arrangement of the plurality of light emitting components 113 on the upper and lower sides of the substrate 111 arrangement.
  • a plurality of light emitting components 113 may be respectively located on the same side of the substrate 111 and arranged in a staggered manner, thereby realizing a staggered arrangement of the plurality of light emitting components 113 on the same side of the substrate 111.
  • two or more (for example, three or more) light emitting components 113 may be arranged in a staggered arrangement with each other, so as to achieve more light emitting components 113 in a staggered arrangement.
  • the light emitting element 113 there may be an oblique angle between the light emitting element 113 and the substrate 111, that is, there may be an oblique angle between the light emitting direction of the light emitting element 113 and the substrate 111
  • the inclination angle between the light emitting component 113 and the substrate 111 may be less than 90 degrees, such as 5 degrees to 85 degrees, such as 30 degrees, 60 degrees, or 45 degrees. Therefore, the light emitting components 113 can be arranged obliquely to reduce the configuration space of the light emitting components 113.
  • the light emitting fixture 118 can be used to realize and fix the tilt angle of the light emitting component 113.
  • the inclination angle of the light emitting component 113 can also be implemented and fixed by different structures or methods.
  • the inclination angle of the light emitting component 113 can also be fixed by fixing glue.
  • a plurality of light emitting components 113 can also be arranged in a staggered manner up and down, and arranged at an angle at the same time. At this time, since the front and rear ends of the light emitting components 113 are different in size, they can be arranged more closely in the optical transceiver module 110 to better achieve the miniaturization of the optical transceiver module.
  • each light emitting assembly 113 may further include a temperature control unit 119, and the temperature control unit 119 may be disposed in the sealed housing 113b.
  • the temperature control unit 119 may include a thermistor 119a and a refrigerator 119b.
  • the thermistor 119a is fixed on the base of the light emitter 113a, and the refrigerator 119b may, for example, It is a thermoelectric refrigerator (TEC) or a semiconductor refrigerator (TEC), and can be fixed in the sealed housing 113b and close to the light emitter 113a, for example, the thermistor 119a and the refrigerator 119b Electrical connection.
  • TEC thermoelectric refrigerator
  • TEC semiconductor refrigerator
  • the resistance value of the thermistor 119a is changed by the temperature of the light emitter 113a, so the temperature of the light emitter 113a can be detected through the thermistor 119a. Then, by controlling the current flow direction of the refrigerator 119b, the temperature of the light emitter 113a can be cooled, so as to control the light emitter 113a to work within a reasonable temperature range (for example, 40-50 degrees), and reduce the temperature The change causes the wavelength shift of the light emitter 113a. Furthermore, since the overall thermal load of the light emitting component 113 can be greatly reduced, the power consumption of the light emitting component 113 can be reduced.
  • the power consumption range of a single light emitting component 113 can be reduced to 0.1-0.2W, for example, the power consumption range of four light emitting components 113 can be reduced to 0.4-0.8W.
  • the thermistor 119a and the refrigerator 119b can be fixed on the base of the light emitter 113a, for example, by thermally conductive glue.
  • the multiple light emitting components 113 can also be controlled by a single temperature control unit 119.
  • the connector 115 may provide a resetting mechanism to change the light between the optical transceiver module 110 and some external object (for example, another device) across the optical fiber (not shown).
  • the connector 115 may provide a reset direction of the optical signal through a reflective surface.
  • the angle, general size and shape of the connector 115 depend on the wavelength of the light, the material used to make the coupler and the requirements of the overall system.
  • the connector 115 may be designed to provide a reset direction of the vertical light from the substrate 111 and the horizontal light transmitted to the substrate 111.
  • the size, shape, and configuration of the connector 115 are related to the standard, which includes tolerances for mating corresponding connectors. Therefore, the layout of the connector used to integrate the optical I/O components may be different due to various standards.
  • the optical interface requires a line-of-sight connection to have an optical signal transmitter interfaced with the receiver (both can be called a lens). Therefore, the configuration of the connector will prevent the lens from being blocked by the corresponding electrical contact components.
  • the optical interface lens can be arranged on the side, or above or below the contact components, depending on the available space in the connector.
  • the connector 115 may be, for example, MPO (Multi-Fibre Push On) specification, and the optical fibers may be connected in a one-to-one manner in a multi-channel manner.
  • MPO Multi-Fibre Push On
  • the CWDM/WDM system can be used to achieve the LR4 specification through the steps of light splitting and de-splitting.
  • the outer shell 116 is used to protect and assemble the substrate 111, the processor 112, a plurality of light emitting components 113, the light receiving components 114 and the connecting board 117.
  • the optical transceiver module 110 may further include a planar light-wave chip (PLC) and a modulator.
  • the planar light-wave chip can provide a planar integrated component for the transmission of light and its conversion into electronic signals, and vice versa. It can be understood that the functions of a planar light-wave chip (PLC) can also be integrated in the connector 115.
  • the housing 116 may include an upper housing 116a and a lower housing 116b.
  • the upper housing 116a and the lower housing 116b can be combined into one body, and an internal space can be formed to accommodate the substrate 111 and process The device 112, a plurality of light emitting components 113, a light receiving component 114 and a connecting board 117.
  • the housing 116 may be made of metal, for example, so as to not only electrically shield the circuit enclosed therein, but also effectively dissipate the heat generated by the electronic circuit to the outside of the housing 116.
  • the connecting plate 117 is connected between the substrate 111 and the light emitting component 113 to fix the light emitting component 113 and allow the light emitting component 113 to be electrically connected to the substrate 111. That is, through the connection board 117, the substrate 111 and the light emitting component 113 can transmit signals to each other.
  • the connecting board 117 may be, for example, a flexible circuit board or a flexible printed circuit board (FPC) to transmit signals between the substrate 111 and the light emitting component 113.
  • the connecting plate 117 allows the light emitting component 113 to be disposed in the recess 111 d of the substrate 111.
  • the connecting plate 117 may be disposed in the recess 111 d of the substrate 111 and connected to the substrate 111.
  • the light emitting component 113 can be disposed on the connecting board 117 and connected to the connecting board 117. Therefore, through the connecting plate 117, the light emitting component 113 is disposed in the recess 111d of the substrate 111 and is electrically connected to the substrate 111.
  • the connecting plate 117 may include a first connecting plate 117a and a second connecting plate 117b.
  • one end of the first connection plate 117a can be connected to the first surface 111a of the substrate 111
  • one end of the second connection plate 117b can be connected to the second surface 111b of the substrate 111. Therefore, through the first connecting plate 117a and the second connecting plate 117b, the plurality of light emitting components 113 can be electrically connected to the circuits on the opposite sides of the substrate 111, and can form a staggered arrangement of upper and lower positions.
  • Each light emitting component 113 is configured and packaged in a smaller optical transceiver module 110 to realize the miniaturization of the optical transceiver module.
  • first connecting plate 117a and the second connecting plate 117b can also be connected to the same side surface (the first surface 111a or the second surface 111b) of the substrate 111.
  • the first connecting plate 117a and the second connecting plate 117b may have different lengths. Specifically, in some embodiments, the length of the second connecting plate 117b may be greater than the length of the first connecting plate 117a. Therefore, through the different lengths of the first connecting plate 117a and the second connecting plate 117b, the plurality of light emitting components 113 can be arranged in a staggered arrangement of front and rear positions, so that the plurality of light emitting components 113 can be simultaneously arranged and packaged in a smaller size. In the optical transceiver module 110, miniaturization of the optical transceiver module is realized.
  • one end of the connecting plate 117 may have a bent structure and is connected to the light emitting component 113, and this bent structure (not labeled) may correspond to the tilt angle, position or other arrangement of the light emitting component 113 To form a bend to correspond to the arrangement of the light emitting components 113.
  • the substrate 111 and the light emitting assembly 113 can be appropriately separated to avoid direct heat transfer to the light emitting assembly 113, thus effectively reducing the power consumption of the temperature control unit 119 and the overall consumption of the optical transceiver module 110. Power.
  • the light emitting fixture 118 can be used to fix the position and arrangement of the light emitting component 113 in the optical transceiver module 110.
  • the light emitting fixture 118 may be disposed on the housing 116 or the substrate 111 of the optical transceiver module 110 to fix the light emitting component 113.
  • the light emitting holder 118 may be integrally formed on the housing 116, for example.
  • the light emitting holder 118 may include a first light emitting holder 118a and a second light emitting holder 118b for fixing a plurality of light emitting components 113 and allowing the light emitting components 113 to form a staggered arrangement. As shown in FIG.
  • the first light emission holder 118a may be disposed on the upper housing 116a, for example, and the second light emission holder 118b may be disposed on the lower housing 116b, for example.
  • the light emitting holder 118 may include at least one fixing groove 118c, and the groove shape of the fixing groove 118c corresponds to the shape of the light emitting component 113 (for example, the shape of the sealed housing 113 or the cylindrical member 113c), It is used for accommodating and engaging the light emitting component 113 to fix the light emitting component 113.
  • the groove shape of the fixing groove 118c can also be formed corresponding to the inclination angle of the light emitting element 113, so that the light emitting element 113 is obliquely fixed.
  • the fixing groove 118c of the light emission holder 118 may have an inclined angle
  • the fixing groove 118c The inclination angle of may be the same as the inclination angle of the light emitting element 113 to fix the inclination angle of the light emitting element 113.
  • the recess 111d of the substrate 111 may be a hollowed-out cavity formed on the substrate 111.
  • a plurality of recesses 111d are formed on the substrate 111, and the substrate 111 may have an I-shaped or F-shaped structure. Therefore, through the plurality of recesses 111d on the substrate 111, a plurality of light emitting components 113 can be accommodated on the substrate 111.
  • the size of the substrate 111 can be designed to meet the requirements of QSFP28, QSFP+ or Micro QSFP+.
  • the width of the substrate 111 may be about 11-18 mm, and in some embodiments, the length of the substrate 111 may be about 58-73 mm to meet the requirements of QSFP+ or QSFP28. Therefore, through the arrangement and arrangement of the light emitting components 113 and/or the design of the substrate 111, multiple light emitting components 113 can be arranged and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.
  • the plurality of light receiving components 114 may also be arranged in a staggered arrangement, and the light receiving directions of the plurality of light receiving components 114 may have an angle between 90 degrees and 180 degrees.
  • the tilt angle between the light receiving component 114 and the substrate may be less than 90 degrees, for example, between 0 degrees and 90 degrees, such as 1 degree. , 5 degrees, 30 degrees, 60 degrees or 45 degrees.
  • the light receiving component may be, for example, a cylindrical light receiving component 114a, or, for example, a plug-in cylindrical (TO-CAN) light receiving component.
  • the degree of sealing of the cylindrical light receiving assembly 114a meets the airtight requirement of the TO (Transmitter Optical Sub-Assembly) type package for industrial use.
  • the sealing degree of each of the plurality of cylindrical light receiving components 114a may be 1 ⁇ 10-12 to 5*10-7 (atm*cc/sec). In an embodiment, more specifically, the sealing degree of each of the plurality of cylindrical light receiving components 114a may be 1 ⁇ 10-9 to 5 ⁇ 10-8 (atm*cc/sec).
  • a plurality of cylindrical light receiving components 114 a can be assembled by the light receiving holder 120.
  • the light receiving holder 120 is used for assembling the plurality of cylindrical light receiving components 114 a into one body, wherein the plurality of cylindrical light receiving components 114 a are fixed in the light receiving holder 120.
  • the plurality of cylindrical light receiving components 114 a can be connected to the circuit on the substrate 111 through the connection board 121.
  • the connecting board 121 may be, for example, a flexible circuit board or a flexible printed circuit board (FPC) for transmitting signals between the substrate 111 and the cylindrical light receiving component 114a.
  • FPC flexible printed circuit board
  • a plurality of cylindrical light receiving components 114a can be respectively connected to the first connection pad (Pad) 122a and the second connection pad 122b on the substrate 111 through the connection plate 121
  • the first connection pad 122a and the second connection pad 122b can be bonded and fixed on the substrate 111 by surface bonding, and are electrically connected to a circuit (not shown) on the substrate 111.
  • the light receiving holder 120 may be provided with a plurality of fixing through holes 120a, and the number of the fixing through holes 120a may correspond to the number of the plurality of cylindrical light receiving components 114a to provide
  • the cylindrical light receiving component 114a is inserted through the fixing through hole 120a, so that a plurality of cylindrical light receiving components 114a can be fixed in the light receiving holder 120.
  • the inner aperture or size of each fixing through hole 120a corresponds to the external size of the cylindrical light receiving component 114a, so as to tightly sleeve and fix the cylindrical light receiving component 114a in the light receiving holder 120.
  • the cylindrical light receiving component 114a may have a first width and a second width of different sizes (as shown in FIG. 19A), and the fixing through hole 120a may also have a first inner aperture and a second inner aperture of different sizes.
  • the aperture corresponds to the first width and the second width of the cylindrical light receiving component 114a.
  • the light receiving holder 120 can be fixed on the substrate 111 to fix a plurality of cylindrical light receiving components 114 a on the substrate 111.
  • the light receiving holder 120 may not be fixed on the substrate 111 (as shown in FIG. 18).
  • the light emitting component 113 and the light receiving component 114 may have different arrangements, combinations, and/or configurations.
  • the light emitting component 113 and the light receiving component 114 may be disposed on the same side of the substrate 111. However, it is not limited to this. In some embodiments, the light emitting component 113 and the light receiving component 114 may also be respectively disposed on different sides of the substrate 111.
  • one or more light receiving components 114 can be disposed on the substrate 111, and one or more light emitting components 113 can be disposed on one side of the substrate 111 (as shown in FIG. 21) or the substrate 111 obliquely. Up (as shown in Figure 22).
  • one or more light receiving components 113 may be disposed on the substrate 111, and one or more light receiving components 114 may be disposed obliquely on one side of the substrate 111 (as shown in FIG. 23) or On the substrate 111 (as shown in Figure 24).
  • the light emitting component 113 and the light receiving component 114 can also be disposed on one side of the substrate 111 (not shown) or on the substrate 111 (as shown in FIG. 25) at the same time.
  • the light emitting components 113 can be arranged on the substrate 111 in parallel or obliquely (as shown in FIG. 26). And shown in Figure 27).
  • each light emitting component 113 may further include a damping unit 113d, pillars 113e, 113f, and a base 113g, and the light emitter 113a and pillars 113e, 113f may be disposed in a sealed housing In 113b, the light emitter 113a can be arranged on the pillar 113e, the damping unit 113d can be arranged between the sealed housing 113b and the pillars 113e, 113f, and the pillars 113e, 113f are arranged on the base 113g.
  • the sealed housing 113b and the base 113g can form a sealed space to accommodate the light emitter 113a and the pillars 113e, 113f.
  • the pillars 113e and 113f are extended from the base 113g to support the circuit boards (submount) 113h and 113i inside the light emitting assembly 113.
  • the pillars 113e and 113f may include a first pillar 113e and a second pillar 113f, and the second pillar 113f may be disposed on one side of the first pillar 113e and close to the sealed housing 113b.
  • the first post 113e is used to support the first circuit board 113h
  • the light emitter 113a is electrically connected to the first circuit board 113h
  • the second post 113f is used to support the second circuit board 113i
  • the second circuit board 113i is Used to electrically connect external signal lines (not labeled).
  • the circuit boards 113h and 113 may be provided with circuits, and the circuit boards 113h and 113 may be made of materials with good thermal conductivity (for example, ceramics, metallic copper) to improve heat dissipation efficiency.
  • the pillars 113e, 113f may be integrally formed on the base 113g, that is, the pillars 113e, 113f and the base 113g may have the same material, such as a metal with good thermal conductivity.
  • the pillars 113e, 113f may be rectangular pillars, but are not limited thereto.
  • the pillars 113e, 113f may be cylindrical, semicircular pillars, cones, or other three-dimensional shapes.
  • the damping unit 113d is arranged between the pillars 113e, 113f and the sealed housing 113b, and is used to absorb the electromagnetic energy inside the light emitting assembly 113 to destroy the high frequency resonance mode in the light emitting assembly 113. Improve the resonance phenomenon that occurs when transmitting high-frequency signals, thereby improving the signal distortion, and thus allowing the transmission of higher-frequency signals, such as 25Gbps-50Gbps NRZ, 25Gbps-100Gbps PAM4 or higher frequency signals.
  • the damping unit 113d may be one or more units of sheet, thin film, thick film, block, strip, powder or any shape formed of a predetermined damping material to absorb the light emitting component
  • the electromagnetic energy inside 113 reduces the high-frequency resonance phenomenon in the light emitting component 113.
  • the resistance value of the damping unit 113d may be between 1 ohm ( ⁇ ) and 500 ohms, for example, between 5 ohms ( ⁇ ) and 100 ohms.
  • the damping unit 113d may be, for example, a resistance unit formed of one or more materials to improve the high-frequency resonance phenomenon in the light emitting component 113.
  • the material of the damping unit 113d may include, for example, pure metal, metal alloy, metal compound, metal oxide, metal mixed material (for example, a combination of ceramic and metal), semiconductor or other materials.
  • the damping unit 113d may include a thin film layer and a metal layer (not shown).
  • the thin film layer is, for example, formed of an insulating material (such as ceramic) or a composite material.
  • the metal layer may be formed on both sides of the thin film layer.
  • the layer is formed of titanium, platinum, gold, other metals, or any alloy, for example.
  • the thickness of the damping unit 113d may be less than 1 mm, for example, 0.01 mm to 0.4 mm.
  • the damping unit 113d may be formed on the sides of the pillars 113e, 113f closest to the sealed housing 113b, for example.
  • the damping unit 113d may be formed on the side surface of the second pillar 113f and close to the sealed housing 113b to improve the high frequency resonance phenomenon in the light emitting assembly 113.
  • the damping unit 113d can also be formed on other positions of the pillars 113e and 113f to improve the high frequency resonance phenomenon in the light emitting component 113.
  • the damping unit 113d may also be formed on the side of the first pillar 113e and located between the pillar 113e and the sealed housing 113b to improve the high frequency resonance phenomenon in the light emitting assembly 113 .
  • each light emitting component 113 may further include a plurality of connecting wires 113j.
  • the connecting wires 113j may be formed of conductive metal materials and connected to the first pillar 113e and the second pillar Between 113f is used to improve the high-frequency resonance phenomenon in the light emitting component 113.
  • each light emitting component 113 may further include at least one optical lens 113L and an optical window 113w.
  • the optical lens 113L is disposed in the sealed housing 113b, and is located at the light emitter 113a to optically improve the light signal emitted by the light emitter 113a, such as focusing, collimating, and diverging.
  • the optical lens 113L may be disposed on the pillar 113e, and opposed to the light emitter 113a.
  • the optical lens 113L and the light emitter 113a can also be arranged on the same circuit board.
  • the optical window 113w is provided on the sealed housing 113b, for example, at the front end of the sealed housing 113b, and is located opposite to the optical lens 113L to allow the optical signal improved by the optical lens 113L to be sent Outside the sealed housing 113b.
  • the optical window 113w may be a flat light-transmitting plate to allow the optical signal improved by the optical lens 113L to be sent out of the sealed housing 113b.
  • the optical window 113w can further optically improve the optical signal after passing through the optical lens 113L, so as to improve the optical path after passing through the optical lens 113L.
  • the optical lens 113L can be directly arranged in the sealed housing 113b, and the pair is located in the light emitter 113a, the optical alignment between the optical lens 113L and the light emitter 113a can be more accurately controlled to Improve the accuracy of the optical path, thereby reducing the energy loss of the optical signal.
  • the material of the optical lens 113L may be different from the material of the optical window 113w.
  • the material of the optical lens 113L can be, for example, various glass materials or a new type of silicon-based micro-lens. These materials have low absorption rates for specific application wavelengths (for example, 1200 nm to 1600 nm). Optically transparent medium.
  • the light-receiving component 114 may include one or more light-receiving chips 114c.
  • the light-receiving chips 114c are, for example, elongated chips and can be connected to the substrate 111.
  • Each light receiving chip 114c may be provided with multiple light receivers (PD) 114p, and the multiple light receivers 114p are arranged along one direction, for example, may be along the long axis direction of the light receiving chip 114c and connected to the light receiving chip 114c.
  • the number of the plurality of optical fibers 131 of the chip 114c is less than the number of the plurality of light receivers 114p of the light receiving chip 114c.
  • each light receiving chip 114c can be arranged (for example, soldered) on the substrate 111 in a row.
  • each light receiving chip 114c may be provided with four light receivers 114p.
  • two optical fibers 131 may be connected to two of the light receivers 114p on the light receiving chip 114c.
  • the connection margin between the optical fiber 131 and the optical receiver 114p can be increased, and the connection accuracy between the optical fiber 131 and the optical receiver 114p can be improved, so as to increase the coupling accuracy between the optical fiber 131 and the optical receiver 114p .
  • each light receiving chip 114c may also be provided with more or less than 4 light receivers 114p.
  • the light receiving component 114 may include a sub-mount 114s, and the sub-mount 114s may be disposed on the substrate 111 to align the light receiving chip 114c.
  • the alignment base 114s can be provided with one or more alignment marks 114m, and the light receiving chip 114c can be set on the alignment base 114s, and the alignment can be performed by the alignment marks 114m to improve the optical fiber 131 and the light receiving chip 114c The alignment accuracy between the optical fiber 131 and the light receiving chip 114c is further improved.
  • the optical transceiver module 110 may further include a light-receiving fixing member 114h for disposing the light-receiving component 114 on the substrate 111, and may form a gap G (eg Between 10 microns and 5 cm) between the light receiving fixture 114h and the substrate 111 to allow more components (such as IC and/or passive components) to be placed in the gap G, thereby increasing the number of components on the substrate 111 Component setting space.
  • the light receiving fixing member 114h may include at least one supporting unit 114i, a fixing plane 114j, a positioning groove 114k, and a positioning pillar 114L.
  • the supporting unit 114i is formed on one side of the light receiving fixing member 114h to support the light receiving fixing member 114h on the substrate 111, and a gap G is formed between the light receiving fixing member 114h and the substrate 111.
  • the fixing plane 114j is formed on the opposite side of the light receiving fixing member 114h for the light receiving assembly 114 to be arranged.
  • the positioning groove 114k is formed on the light receiving fixing member 114h for positioning the light receiving assembly 114 and the optical fiber 131 on the light receiving fixing member 114h.
  • the fixing plane 114j may be formed in the positioning groove 114k.
  • the positioning pillar 114L may be formed on the supporting unit 114i for positioning the light receiving fixing member 114h on the substrate 111
  • the light receiving component 114 can be disposed on the fixing plane 114j of the light receiving fixing member 114h, and is electrically connected to the substrate 111 through a flexible circuit board 117c. Through the light receiving fixing member 114h, a gap G can be formed between the light receiving fixing member 114h and the substrate 111, so as to increase the assembly space on the substrate 111. It is worth noting that in some embodiments, the light receiving fixing member 114h may form more fixing planes 114j to provide more components.
  • the light receiving fixing member 114h may include, for example, two supporting units 114i to form an inverted U-shaped structure, but it is not limited to this. In other embodiments, the light receiving fixing member 114h may include One or more supporting units 114i are used to support the light receiving component 114 on the substrate 111.
  • the temperature control unit 119 in the light emitting assembly 113 may be disposed on the pillar 113e.
  • the pillar 113e can be arranged in the enclosed space formed by the sealed housing 113b and the base 113g, and is extended from the base 113g.
  • the refrigerator 119b of the temperature control unit 119 may be disposed on one side surface of the pillar 113e, and the light emitter 113a may be disposed on the refrigerator 119b.
  • the heat of the light emitter 113a can be greatly transferred to the refrigerator 119b, reducing the total heat capacity of the chip end of the light emitter 113a without adding additional heat sinks, so the refrigerator 119b can use less
  • the driving current can achieve a wide temperature control range, and at the same time improve the response time of thermal balance, and specifically achieve the effect of reducing product power consumption. It is worth noting that, in different embodiments, the configuration of the light emitter 113a on the refrigerator 119b can also be applied to an unsealed housing.
  • the largest surface of the circuit board 113h provided with the light emitter 113a can be directly attached to the largest surface of the refrigerator 119b, thus allowing the heat of the light emitter 113a to be directly and greatly increased.
  • the ground is conducted to the refrigerator 119b.
  • the maximum surface of the refrigerator 119b may be approximately perpendicular to the base 113g.
  • the thermistor 119a can be arranged on the circuit board 113h and electrically connected to the refrigerator 119b, and the temperature of the light emitter 113a can be detected through the thermistor 119a.
  • the pillar 113e may be formed of a material with good thermal conductivity and extended from the base 113g, and thus may be used as a heat sink for the light emitter 113a.
  • the light emitting assembly 113 further includes support blocks 113m and 113n, and the support blocks 113m and 113n can be used to shorten the length of the circuit board 113h for grounding and bonding.
  • the supporting blocks 113m and 113n can be arranged between the pillar 113e and the base 113g, or on both sides of the circuit board 113h (as shown in FIG. 35).
  • the support blocks 113m and 113n are connected between the ground terminal of the circuit board 113h and the base 113g. Therefore, the ground terminal of the circuit board 113h and the base 113g can be electrically connected through the support blocks 113m and 113n of conductive material. Between the grounding terminals of the light emitting component 113, thereby shortening the wire bonding length inside the light emitting component 113 to achieve high-speed signal performance.
  • one or more supporting blocks 113m can be directly integrally formed on the base 113g (as shown in FIGS. 32A and 32B). However, it is not limited to this. In some embodiments, one support block 113n (shown in FIGS. 33A and 33B) or a plurality of support blocks 113n (shown in FIGS. 34A and 34B) may also be separated from the base 113g. Outside.
  • a plurality of supporting blocks 113m and 113n may also be provided on both sides of the circuit board 113h to support the circuit board 113h and shorten the length of the circuit board 113h to be grounded.
  • the optical receiver 114p may also be integrated in the light emitting component 113.
  • the base 113g may be provided with a base recess 113r for accommodating the circuit board 114m, and the light receiver 114p may be fixed on the circuit board 114m, so the light receiver 114p may be arranged on the base 113g.
  • the optical receiver 114p and the optical transmitter 113a can be located in the same optical axis direction, so that the optical receiver 114p can obtain a larger backlight monitoring current value, which is beneficial to the matching design of TO and TRX circuit functions.
  • the base recess 113r of the base 113g may have an inclination angle (for example, 5 degrees to 45 degrees) for adjustment according to the incident angle of the light receiver 114p to improve The light receiving efficiency of the light receiver 114p.
  • a plurality of pillars 113e, 113f can be arranged on the base 113g, the first pillar 113e is used to support the first circuit board 113h and the refrigerator 119b, and the light emitter 113a is electrically connected On the first circuit board 113h, the second pillar 113f is used to support the second circuit board 113i, and the second circuit board 113i is used to electrically connect to external signal lines (not labeled).

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Abstract

本申请提供一种光学收发模组及光纤缆线模组。光学收发模组包括基板、光接收组件及多个光发射组件。光接收组件是设置于基板上，多个光发射组件连接于所述基板，其中光发射组件与所述基板之间具有一倾斜角度。光纤缆线模组包括光学收发模组及光纤缆线。

Description

光学收发模组及光纤缆线模组 技术领域
本申请涉及光纤通信技术领域，特别涉及一种光学收发模组及其应用的光纤缆线模组。
背景技术
在光纤通信技术的应用中，需要将电信号经过光发射组件(如激光器)转换为光信号，然后将光信号耦合进传导光信号的光纤中。
目前，对于计算装置的需求持续上升，甚至对于计算装置达到较高性能的需求亦在提升中。然而，传统的电性I/O(输入/输出)信号传递并无不预期会与对于性能增加的需求，特别是对于未来高性能计算的期待齐步并进。现今，I/O信号是通过电路板自处理器来回地电性传送并向外输送至周边装置。电性信号必需经过焊料接头、缆线及其他电性导体。因此，电性I/O信号速率会受电性连接器的电性特性所限制。
传统的电信传输系统逐渐被光纤传输系统所取代。光纤传输系统由于并不具有带宽限制，具有高速传输、传输距离长、材质不受电磁波干扰等优点，因此，目前电子产业多朝光纤传输的方向进行研发。
然而，近几年，要求光收发器等光学模组的进一步的小型化，因此需要对光纤传输系统的结构进行优化。
发明内容
本申请提出一种光学收发模组，以实现光学收发模组体积小型化。
本申请提出一种光学收发模组，包括：
壳体；
基板，设置在所述壳体内；
光接收组件，设置在所述基板上；
多个光发射组件，连接于所述基板，其中所述光发射组件与所述基板之间具有一倾斜角度。
本申请还提出一种光纤缆线模组，包括：
光纤缆线；
光学收发模组,包括：
壳体；
基板，设置在所述壳体内；
光接收组件，设置在所述基板上；
多个光发射组件，连接于所述基板，其中所述光发射组件与所述基板之间具有一倾斜角度。
本申请提出一种光发射组件、光学收发模组及其应用，光学收发模组结构简单，且可实现光学收发模组体积小型化。
附图说明
图1是使用本申请光学缆线模组的系统方块图；
图2至图4为本申请光学收发模组的一实施例的示意图；
图5A至图9为本申请基板的不同实施例的示意图；
图10至图11为本申请光发射组件及基板的不同实施例的示意图；
图12为本申请光发射组件的一实施例的示意图；
图13为本申请光发射组件的一实施例的示意图；
图14为本申请光学收发模组的一实施例的示意图；
图14A及图14B为本申请的光发射固定器的示意图；
图15至图17为本申请基板的不同实施例的示意图；
图18为本申请光接收组件与基板的一实施例的示意图；
图19A及图19B为本申请光接收固定器的一实施例的示意图；
图20为本申请光接收组件与基板的一实施例的示意图；
图21至图27为本申请光学收发模组的不同实施例的示意图；
图28为本申请光发射组件的一实施例的示意图；
图29为本申请光发射组件的一实施例的示意图；
图30A及图30B为本申请光接收芯片的一实施例的示意图；
图31A为本申请光接收组件及光接收固定件的一实施例的示意图；
图31B为本申请光接收固定件的一实施例的示意图；
图32A至图36为本申请光发射组件的不同实施例的示意图。
具体实施方式
以下各实施例的说明是参考附加的图式，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。
附图和说明被认为在本质上是示出性的，而不是限制性的。在图中，结构相似的单元是以相同标号表示。另外，为了理解和便于描述，附图中示出的每个组件的尺寸和厚度是任意示出的，但是本申请不限于此。
在附图中，为了清晰起见，夸大了层、膜、面板、区域等的厚度。在附图中，为了理解和便于描述，夸大了一些层和区域的厚度。将理解的是，当例如层、膜、区域或基底的组件被称作“在”另一组件“上”时，所述组件可以直接在所述另一组件上，或者也可以存在中间组件。
另外，在说明书中，除非明确地描述为相反的，否则词语“包括”将被理解为意指包括所述组件，但是不排除任何其它组件。此外，在说明书中，“在......上”意指位于目标组件上方或者下方，而不意指必须位于基于重力方向的顶部上。
请参阅图1，本实施例提出一种光学缆线模组100，图1为使用所述光学缆线模组100的流程图，所述光学缆线模组100包括光学收发模组110，光纤缆线130及电子装置101。所述电子装置101可以是许多运算或显示装置中的任何一种，其包括但不局限于数据中心、桌上型或膝上型计算机、笔记本电脑、超薄型笔记本、平板计算机、笔记本、或其它运算装置。除了运算装置之外，可被了解的是，许多其他类型的所述电子装置101可包含一或多种描述于本申请中的所述光学收发模组110及/或匹配端口102，且描述于本申请中的实施例可等效地应用在这些电子装置上。这些其它电子装置101的例子可包括电动车、手持式装置、智能型手机、媒体装置、个人数字助理(PDA)、超行动个人计算机、移动电话、多媒体装置、内存装置、照相机、录音机、I/O装置、服务器、机顶盒、打印机、扫描机、监视器、电视机、电子广告牌、投影机、娱乐控制单元、可携式音乐播放器、数字摄影机、上网装置、游戏设备、游戏主机、或任何可以包括所述光学收发模组110及/或所述匹配端口102的其它电子装置101。在其它实施例中，所述电子装置101可以是任何其他处理数据或影像的电子装置。
如图1所示，所述光纤缆线130是连接于所述光学收发模组110，用于传输光学信号。所述光纤缆线130可包括至少一或多条光纤芯，用于允许光学信号在光纤芯内传输。
请参阅图1，所述电子装置101可包括处理器103，其可代表任何类型的处理电性及/或光学I/O信号的处理组件。可理解的是，所述处理器103可以是一单一处理装置，或多个分开的装置。所述处理器103可包括或可以是一微处理器、可程序逻辑装置或数组、微型控制 器、讯号处理器、或某些组合。
请参阅图1，所述电子装置101的所述匹配端口102可用于作为一界面，以连接至所述光学收发模组110。所述光学收发模组110可允许另一周边装置105与所述电子装置101相互连接。本实施例的所述光学收发模组110可支持经由一光学界面的通信。在各种实施例中，所述光学收发模组110也可支持通过一电性界面的通信。
请参阅图1，所述周边装置105可以是一外围I/O装置。在各种实施例中，所述周边装置105可以是多种运算装置中的任何一种，其包括但不局限于桌上型或膝上型计算机、笔记本电脑、超薄型笔记本、平板计算机、笔记本、或其它运算装置。除了运算装置之外，可被了解的是，周边装置105可包括电动车、手持式装置、智能型手机、媒体装置、个人数字助理(PDA)、超行动个人计算机、移动电话、多媒体装置、内存装置、照相机、录音机、I/O装置、服务器、机顶盒、打印机、扫描机、监视器、电视机、电子广告牌、投影机、娱乐控制单元、可携式音乐播放器、数字摄影机、上网装置、游戏设备、游戏主机、或其他电子装置。
请参阅图1，在一实施例中，所述电子装置101也可包括内部的光学路径。所述光学路径可代表一或多个组件，其可包括在所述处理器103与所述匹配端口102之间传送一光学信号的处理及/或终止组件。传送一信号可包括产生及转换至光学性、或接收及转换至电性。在一实施例中，装置也可包括电性路径。电性路径代表在所述处理器103与所述匹配端口102之间传送一电信号的一或多个组件。
请参阅图1，所述光学收发模组110可用于对应配接所述电子装置101的匹配端口102。在本实施例中，将一连接器插头和另一者配接可以是用来提供一机械式连接。将一连接器插头与另一者配接通常亦提供通信连接。所述匹配端口102可包括一罩壳104，其可提供该机械式连接机构。所述匹配端口102可包括一或多个光学界面构件。路径106可代表一或多个构件，其可包括用来传递光讯号(或光讯号及电讯号)于所述处理器103和所述匹配端口102之间的处理及/或终止构件。传递讯号可包括产生并转换成光讯号、或接收并转换成电讯号。
请参阅图1，本申请的所述光学收发模组110可被称为光学连接器或光学接头。一般而言，此一光学连接器可用于提供和一匹配的连接器及一光学组件相界接的实体连接界面。所述光学收发模组110可为一光引擎，用于产生光讯号及/或接收并处理光讯号。所述光学收发模组110可提供从电-至-光信号或从光-至-电信号的转换。
在一些实施例中，所述光学收发模组110可用来遵照或依据一或多种通信协议处理该等光讯号。对于所述光学收发模组110用来传递一光讯号及一电讯号的实施例而言，光学界面和电性界面可依据相同的协议，但这并不是绝对必要的。不论所述光学收发模组110是依据电性I/O界面的协议，或是依据一不同的协议或标准来处理讯号，所述光学收发模组110都可为了一预期的(intended)的协议而被建构或程序化于一特定的模组内，且不同的收发模组或光引擎可为了不同的协定而被建构。
请参阅图2-4，其为本申请光学收发模组的一实施例的示意图。本实施例提出的光学收发模组110可包括基板111、处理器112、光发射组件113、光接收组件114、连接器115、壳体116、连接板117及光发射固定器118。基板111可具有相对的第一表面111a及第二表面111b，基板111例如为印刷电路板(PCB)或陶瓷基板，并可包括例如插脚或连接球，用于介接至一外部装置。处理器112是连接于基板111，处理器112可为任何类型的处理器晶粒或光学IC，而非限制于任一特定的处理器类型。光发射组件113及光接收组件114是连接至基板111上的处理器112，分别用于发射及接收光信号。光发射组件113及光接收组件114可包括传输电子信号之发射电路和接收电路，更具体的说，是处理对应光信号之电子信号的时序或其它协议方面的事项。壳体116可具有内部空间，用以容设基板111、处理器112、光发射组件113、光接收组件114、连接器115、连接板117及光发射固定器118。连接板117是连接于基板111及光发射组件113之间，光发射固定器118可用于定位及固定光发射组件 113的设置，以维持光纤通道以及光收发组件之间接合的特性损失和可靠性。
请参阅图4至图9，所述基板111是设置在所述壳体116内，所述基板111可包括至少一凸部111c和至少一凹部111d，凸部111c是突出于基板111，凹部111d是形成于凸部111c的至少一侧。其中，光发射组件113可容设于凹部111d内。亦即，光发射组件113可设置于凸部111c的至少一侧。值得注意是，电路或IC芯片亦可形成于基板111的凸部111c表面上，以增加电路的设置面积。
在不同实施例中，如图5至图7所示，基板111可具有一个或多个凸字形状，此时，多个凹部111d可分别位于所述凸部111c的相对两侧。其中，如图7所示，多个凹部111d之中亦可具有不同的长度或深度。如此，可依需求来容设不同尺寸的光发射组件113。再者，通过基板111的凸字形状，可隔离不同的电路(例如连接至光发射组件113的软性电路板)，避免因空间重叠而互相干扰的情形。
在不同实施例中，如图8所示，基板111可具有至少一L字形状，此时，至少一凹部111d可位于所述凸部111c的至少一侧。如图9所示，基板111可具有至少一阶梯形状，此时，多个凹部111d可位于所述凸部111c的至少一侧。
此外，在一些实施例中，基板111相对的第一表面111a及第二表面111b皆可设置有不同的电路，用于设置不同功能的电路、芯片或组件。举例说明，光接收组件114可设置于基板111的第一表面111a上，而处理器112及IC芯片(例如但不限于LDD、PA、CDR、DSP芯片等)可设置于基板111的第二表面111b上。如此，可增加电路或芯片的设置空间，并可对应缩减基板111的尺寸。在一些实施例中，光接收组件114也可通过芯片直接封装(chip on board)方式来固定于基板111的第一表面111a上。
在本实施例中，光学收发模组110可例如应用于四光纤通道并行传输(Parallel Single Mode 4 lane,PSM4)的技术，其是经由多个光发射组件113分别将四个激光源不同波长的光导入光纤中，通过光纤来进行中、长距离的传输。光接收组件114可接收光信号，并可将处理过的光信号分别导引至不同的通道。然不限于此，光学收发模组110除应用PSM4的技术外，亦可应用于各式多光纤信道波长分波多任务(multi-channel，二位相位偏移调变(Binary Phase Shift Keying，BPSK)，四位相位偏移调变(Quadrature Phase Shift Keying，QPSK)、粗式波长分割多任务转换(Conventional/Coarse Wavelength Division Multiplexing，CWDM)、高密度分波多任务(Dense Wavelength Division Multiplexing，DWDM)、光增/减多任务(Optical Add/Drop Multiplexer，OADM)、可调光增/减多任务(Reconfigurable Optical Add/Drop Multiplexer，ROADM)、LR4或类似之相关光通讯技术。
如图4所示，一个或多个光发射组件113可通过连接板117来连接于所述基板111，且多个光发射组件113可进行交错设置。其中，多个光发射组件113的出光方向(即光信号的射出方向)之间具有一夹角，此夹角例如是介于90度与180度之间，亦即多个光发射组件113之间可前后交错地设置排列。当多个光发射组件113之间为前后相互交错地设置排列时，多个光发射组件113的出光方向可大约为相互相反或相互不同，即多个光发射组件113的出光方向之间的夹角是大约为180度。
如图4所示，每一光发射组件113包括光发射器113a、密封型壳体113b及筒状件113c，且光发射器113a是完全地密封于一个或多个密封型壳体113b内，亦即光发射组件113内的光发射器113a并不会接触到光发射组件113之外的外部环境或空气，以避免光发射器113a的组件老化，确保光发射器113a的组件性能，大幅延长组件的使用寿命。其中，光发射组件113的密封程度为符合工业用途TO(Transmitter Optical Sub-Assembly)类型封装的气密要求。例如，每一多个光发射组件113的密封程度可为1x10 -12～5x10 -7(atm*cc/sec)。
在各种实施例中，光发射组件113的光发射器113a所发出的光信号的波长可位于近红外光至红外光的范围，约为830纳米(nm)～1660纳米。光发射器113a可为适于产生光信号之任一种类型的激光芯片(例如边射型激光装置，FP/DFB/EML激光，或垂直腔表面发光型激光， VCSEL)。
在不同实施例中，光发射器113a可直接密封于密封型壳体113b内，且不具有外露的间隙，以确保光发射组件113的密封性。在一些实施例中，密封型壳体113b例如为圆筒型壳体。筒状件113c是设置于密封型壳体113b的一侧。筒状件113c的内部可设有耦光透镜(未显示)，例如凸透镜或球形透镜，用于将光发射器113a所射出的光信号经由筒状件113c耦光至外部光纤。因此，每一光接收组件的出光方向是由密封型壳体113b内的光发射器113a朝向筒状件113c。
在不同实施例中，密封型壳体113b的直径或宽度可大于筒状件113c的直径或宽度。如此，通过多个光发射组件113之间的前后交错排列，可允许多个光发射组件113更紧密地排列配置，以减少多个光发射组件113的配置空间，因而可将更多个光发射组件113配置及封装于一小型的光学收发模组110内，实现光学收发模组的小型化。
如图10所示，在不同的实施例中，多个光发射组件113可分别位于基板111的上下两侧，并交错排列，因而实现多个光发射组件113在基板111的上下两侧的交错排列。
如图11所示，在不同的实施例中，多个光发射组件113可分别位于基板111的同一侧，并交错排列，因而实现多个光发射组件113在基板111的同一侧的交错排列。
如图12所示，在不同的实施例中，二个以上(例如三个或更多个)的光发射组件113可相互交错排列，以实现更多个光发射组件113的交错排列。
在一些实施例中，如图4及图10所示，光发射组件113与基板111之间可具有一倾斜角度，亦即光发射组件113的出光方向与基板111之间可具有一倾斜角度，光发射组件113与基板111之间的倾斜角度可小于90度，例如5度～85度，例如30度、60度或45度。因此，光发射组件113可倾斜地进行排列，以缩减光发射组件113的配置空间。具体地，在一些实施例中，可通过光发射固定器118来实现及固定光发射组件113的倾斜角度。然不限于此，在不同实施例中，亦可通过不同的构造或方式来实现及固定光发射组件113的倾斜角度。例如，在一些实施例中，亦可通过固定胶来固定光发射组件113的倾斜角度。
在本申请的实施例中，如图4所示，多个光发射组件113亦可上下交错排列，且同时倾斜设置。此时，由于光发射组件113的前后端尺寸不同，因而可更紧密地排列配置于光学收发模组110内，更好地实现光学收发模组的小型化。
请参阅图13，在不同的实施例中，每一光发射组件113还可包括温度控制单元119，所述温度控制单元119可设置在密封型壳体113b内。在一些实施例中，所述温度控制单元119可包括热敏电阻119a及致冷器119b，所述热敏电阻119a固定在所述光发射器113a的底座上，所述致冷器119b可例如为热电致冷器(TEC)或半导体致冷器(TEC)，并可例如固定在所述密封型壳体113b内并靠近光发射器113a，所述热敏电阻119a与所述致冷器119b电性连接。在本实施例中，通过所述光发射器113a的温度高低改变所述热敏电阻119a的阻值大小，故通过所述热敏电阻119a，可检测到所述光发射器113a的温度。接着，通过控制所述致冷器119b的电流流向，可冷却光发射器113a的温度，以控制所述光发射器113a在合理的温度范围内(例如在40-50度)工作，减少因温度变化造成所述光发射器113a发生波长漂移的现象。再者，由于光发射组件113整体的热负载可被大幅降低，因而可降低光发射组件113的耗电量。例如，单一个所述光发射组件113的耗电量范围可被降低在0.1-0.2W，例如四个所述光发射组件113的耗电量范围则可被降低在0.4-0.8W。在本实施例中，所述热敏电阻119a及致冷器119b可例如通过导热胶来固定在光发射器113a的底座上。
然不限于此，在一些实施例中，多个光发射组件113也可通过单一温度控制单元119来控制温度。
如图3所示，连接器115可提供复位向机制以便越过光纤(未示出)来改变光学收发模组110与外部的一些对象(例如，另一装置)之间的光线。例如，连接器115可通过反射面来提供光信号的复位向。连接器115的角度、一般尺寸和形状是取决于光的波长，以及用来制造 耦合器的材料和整个系统的要求。在一实施例中，连接器115可设计成提供来自基板111的垂直光和传至基板111的水平光的复位向。
此外，连接器115的尺寸、形状及组态和该标准有关，其包括用于相应的连接器配接的公差。因此，连接器用来整合光学I/O组件的布局(layout)可因为各式标准而有所不同。本领域技术者可理解的是，光学界面需要瞄准线(line-of-sight)连接，用以具有一和接收器界接之光讯号发送器(两者皆可被称为透镜)。因此，连接器的组态将使得透镜不会被相应的电性接点组件遮挡住。例如，光学界面透镜可被设置在该等接点组件的侧边、或上方或下方，端视该连接器内可用空间而定。
在本实施例中，连接器115可例如为MPO(Multi-Fibre Push On)的规格，光纤可以是以多通道的方式一对一的对接。在一些实施例中，可利用CWDM/WDM系统，并经由分光、解分光的步骤，来达到LR4的规格需求。
如图3所示，外壳体116是用于保护及组装基板111、处理器112、多个光发射组件113、光接收组件114及连接板117。在其他实施例中，光学收发模组110还可包括平面光-波芯片(PLC)及调变器。平面光-波芯片可为光的传输及其转换成电子信号提供一平面之整合组件，反之亦然。可以理解的是，平面光-波芯片(PLC)的功能也可以被整合于连接器115中。在本实施例中，所述壳体116可包括上壳体116a和下壳体116b，上壳体116a和下壳体116b可组合成一体，并可形成内部空间，以容设基板111、处理器112、多个光发射组件113、光接收组件114及连接板117。在一些实施例中，所述壳体116可例如由金属制成，以具有不但能电屏蔽封包在其中的电路、而且还能将电子电路产生的热量有效地散发到所述壳体116外面的功能。
如图4所示，连接板117是连接于基板111与光发射组件113之间，用以固定光发射组件113，并允许光发射组件113电性连接于基板111上。亦即，通过连接板117，基板111与光发射组件113之间可相互传送信号。具体地，连接板117可例如为软性电路板或软性印刷电路板(FPC)，以传送信号于基板111与光发射组件113之间。
又，如图4所示，通过连接板117，可允许光发射组件113被设置于基板111的凹部111d内。具体地，连接板117可设置于基板111的凹部111d内，并连接于基板111。且光发射组件113可设置于连接板117上，并连接于连接板117。因此，通过连接板117，光发射组件113被设置于基板111的凹部111d内，并电性连接于基板111。
又，如图4所示，连接板117可包括第一连接板117a及第二连接板117b。在一些实施例中，第一连接板117a的一端可连接于基板111的第一表面111a，第二连接板117b的一端可连接于基板111的第二表面111b。因此，通过第一连接板117a及第二连接板117b，多个光发射组件113可电性连接于基板111的相对两侧表面上的电路，且可形成上下位置的交错配置，因而可将多个光发射组件113配置及封装于一较小型的光学收发模组110内，实现光学收发模组的小型化。
然不限于此，在一些实施例中，第一连接板117a及第二连接板117b亦可连接于基板111的同一侧表面(第一表面111a或第二表面111b)上。
如图4所示，第一连接板117a及第二连接板117b可具有不同的长度。具体地，在一些实施例中，第二连接板117b的长度可大于第一连接板117a的长度。因此，通过第一连接板117a及第二连接板117b的不同长度，多个光发射组件113可形成前后位置的交错配置，因而可将多个光发射组件113同时配置及封装于一较小型的光学收发模组110内，实现光学收发模组的小型化。
又，如图4所示，连接板117的一端可具有弯折结构，并连接于光发射组件113，此弯折结构(未标示)可对应于光发射组件113的倾斜角度、位置或其他排列来形成弯折，以对应于光发射组件113的排列配置。
再者，当光学收发模组110的基板111上的IC在进行高速度运算时，会产生较大的耗 电及热量。此时，通过连接板117，可适度分离基板111与光发射组件113，避免热量直接传至光发射组件113，因而可有效地降低温度控制单元119的耗电与光学收发模组110的整体耗电量。
如图14所示，在不同的实施例中，可通过光发射固定器118来固定光发射组件113在光学收发模组110内的位置及排列配置。具体地，光发射固定器118可设置于光学收发模组110的壳体116或基板111上，以固定光发射组件113。在一些实施例中，光发射固定器118可例如是一体成型地形成于壳体116上。在一些实施例中，光发射固定器118可包括第一光发射固定器118a及第二光发射固定器118b，用以固定多个光发射组件113，并允许光发射组件113形成交错排列。如图3所示，第一光发射固定器118a可例如设置于上壳体116a上，第二光发射固定器118b可例如设置于下壳体116b上。再者，光发射固定器118可包括至少一固定凹槽118c，固定凹槽118c的凹槽形状是对应于光发射组件113的形状(例如密封型壳体113或筒状件113c的形状)，用以容设并卡合光发射组件113，以固定住光发射组件113。再者，固定凹槽118c的凹槽形状亦可对应于光发射组件113的倾斜角度来形成，使得光发射组件113被倾斜地固定。
具体地，如图14A及图14B所示，光发射固定器118(例如第一光发射固定器118a及第二光发射固定器118b)的固定凹槽118c可具有倾斜角度，且固定凹槽118c的倾斜角度可相同于光发射组件113的倾斜角度，以固定住光发射组件113的倾斜角度。
如图15所示，在一些实施例中，基板111的凹部111d可为镂空的凹洞，其形成于基板111上。又，如图16及图17所示，通过多个凹部111d形成在基板111上，基板111可具有I字形或F字形的结构。因此，通过基板111上的多个凹部111d，可容设多个光发射组件113于基板111上。
在不同实施例中，通过光发射组件113的设置排列及/或基板111的设计，基板111的尺寸可以为符合QSFP28，QSFP+或Micro QSFP+的要求之设计。例如，在一些实施例中，基板111的宽度可约为11～18mm，在一些实施例中，基板111的长度可约为58～73mm，以符合QSFP+或QSFP28的要求。因此，通过光发射组件113的设置排列及/或基板111的设计，可将多个光发射组件113配置及封装于一小型的光学收发模组110内，实现光学收发模组的小型化。
在不同实施例中，多个光接收组件114也可交错排列设置，所述多个光接收组件114的光接收方向之间可具有一夹角是介于90度与180度之间。
在不同实施例中，光接收组件114与基板之间可具有另一倾斜角度，光接收组件与基板之间的倾斜角度可小于90度，例如介于0度与90度之间，如1度、5度、30度、60度或45度。
如图18所示，在一些实施例中，光接收组件可例如为筒型光接收组件114a，又例如可为插件式筒型(TO-CAN)光接收组件。其中，筒型光接收组件114a的密封程度为符合工业用途TO(Transmitter Optical Sub-Assembly)类型封装的气密要求。例如，每一多个筒型光接收组件114a的密封程度可为1x 10-12～5*10-7(atm*cc/sec)。在一实施例中，更具体地，每一所述多个筒型光接收组件114a的密封程度可为1x 10-9～5x 10-8(atm*cc/sec)。
如图18所示，多个筒型光接收组件114a可通过光接收固定器120来进行组装。光接收固定器120是用于将所述多个筒型光接收组件114a组装成一体，其中所述多个筒型光接收组件114a是固定于所述光接收固定器120内。多个筒型光接收组件114a可通过连接板121来连接于基板111上的电路。连接板121可例如为软性电路板或软性印刷电路板(FPC)，用以传送信号于基板111与筒型光接收组件114a之间。具体地，在一实施例中，如图18所示，多个筒型光接收组件114a可通过连接板121来分别连接于基板111上的第一连接垫(Pad)122a及第二连接垫122b，其中第一连接垫122a及第二连接垫122b可通过表面贴合的方式来贴合固定于基板111上，并电性连接于基板111上的电路(未显示)。
如图19A及图19B所示，具体地，光接收固定器120可设有多个固定通孔120a，固定通孔120a的数量可对应于多个筒型光接收组件114a的数量，以对应供筒型光接收组件114a穿插于固定通孔120a，因而可固定多个筒型光接收组件114a于所述光接收固定器120内。每一所述固定通孔120a的内孔径或尺寸是对应于筒型光接收组件114a的外观尺寸，以紧密地套置固定筒型光接收组件114a于光接收固定器120内。具体地，举例说明，筒型光接收组件114a可具有不同大小的第一宽度及第二宽度(如图19A所示)，且固定通孔120a亦具有不同大小的第一内孔径及第二内孔径，以对应于筒型光接收组件114a的第一宽度及第二宽度。
如图20所示，在一实施例中，光接收固定器120可固定于基板111上，用以固定多个筒型光接收组件114a于基板111上。然不限于此，在一些实施例中，光接收固定器120亦可未固定基板111上(如图18所示)。
值得说明的是，在不同实施例中，光发射组件113及光接收组件114可以有不同的排列、组合、及/或配置。例如，在一些实施例中，光发射组件113及光接收组件114可设置于基板111的同一侧上。然不限于此，在一些实施例中，光发射组件113及光接收组件114也可分别设置于基板111的不同侧上。
在一些实施例中，一或多个光接收组件114可设置于基板111上，而一或多个光发射组件113可倾斜地设置于基板111的一侧(如图21所示)或基板111上(如图22所示)。
又，在一些实施例中，一或多个光接收组件113可设置于基板111上，而一或多个光接收组件114可倾斜地设置于基板111的一侧(如图23所示)或基板111上(如图24所示)。
然不限于此，在一些实施例中，光发射组件113及光接收组件114也可同时倾斜地设置于基板111的一侧(未显示)或基板111上(如图25所示)。
值得说明的是，当一或多个光接收组件114可设置于基板111的一侧(例如图18所示)时，光发射组件113可平行地或倾斜地设置于基板111上(如图26及图27所示)。
请参阅图28，在不同的实施例中，每一光发射组件113还可包括阻尼单元113d、支柱113e、113f及基座113g，光发射器113a及支柱113e、113f可设置于密封型壳体113b内，光发射器113a可设置于支柱113e上，阻尼单元113d可设置于密封型壳体113b与支柱113e、113f之间，支柱113e、113f是设置于基座113g上。
如图28所示，密封型壳体113b及基座113g可形成密闭空间，以容置光发射器113a及支柱113e、113f。支柱113e、113f是由基座113g所延伸而出设置，用以支撑光发射组件113内部的电路板(submount)113h、113i。支柱113e、113f可包括第一支柱113e及第二支柱113f，第二支柱113f可设置于第一支柱113e的一侧，且靠近于密封型壳体113b。第一支柱113e是用以支撑第一电路板113h，光发射器113a是电性连接于第一电路板113h上，第二支柱113f是用以支撑第二电路板113i，第二电路板113i是用以电性连接外部的信号线(未标示)。电路板113h、113可设有电路，且电路板113h、113可由良导热材料(例如陶瓷、金属铜)所制成，以改善散热效率。
在不同实施例中，支柱113e、113f可以是一体成型地形成于基座113g上，亦即支柱113e、113f与基座113g可具有相同材料，例如具有良好导热性的金属。在一些实施例中，支柱113e、113f可为矩形柱状，然不限于此，在一些实施例中，支柱113e、113f可为圆柱状、半圆形柱状、锥状或其他立体形状。
在不同实施例中，阻尼单元113d是设置于支柱113e、113f与密封型壳体113b之间，用于吸收光发射组件113内部的电磁能量，以破坏光发射组件113内的高频共振模式，改善在传送高频信号时发生的共振现象，进而可改善信号失真情形，因而可允许传送更高频的信号，例如可用于25Gbps～50Gbps NRZ、25Gbps～100Gbps PAM4或更高频的信号。
在不同实施例中，阻尼单元113d可以是由预定阻尼材料所形成的片状、薄膜、厚膜、块状、条状、粉状或任意形状的一个或多个单元，用以吸收光发射组件113内部的电磁能量， 减少光发射组件113内的高频共振现象。其中，阻尼单元113d的阻值可以是介于1奥姆(Ω)与500奥姆之间，又例如是介于5奥姆(Ω)与100奥姆之间。
在一些实施例中，阻尼单元113d例如可以是由一种或多种材料所形成的电阻单元，以改善光发射组件113内的高频共振现象。其中，阻尼单元113d的材料例如可包括纯金属、金属合金、金属化合物、金属氧化物、金属混合材料(例如陶瓷和金属的组合)、半导体或其他材料。
在一些实施例中，阻尼单元113d可以包括薄膜层及金属层(未显示)，薄膜层例如是由绝缘材料(如陶瓷)或复合材料所形成，金属层可形成于薄膜层的两侧，金属层例如是由钛、铂、金、其他金属或任意合金所形成。
在一些实施例中，阻尼单元113d的厚度可以是小于1mm，例如0.01mm～0.4mm。
在一些实施例中，阻尼单元113d例如可以是形成于最靠近密封型壳体113b的支柱113e、113f的侧面上。例如，在一实施例中，阻尼单元113d可以是形成于第二支柱113f的侧面上，且靠近密封型壳体113b，以改善光发射组件113内的高频共振现象。然不限于此，阻尼单元113d也可以形成于支柱113e、113f的其他位置上，用以改善光发射组件113内的高频共振现象。例如，在另一实施例中，阻尼单元113d也可以是形成于第一支柱113e的侧面上，并位于支柱113e与密封型壳体113b之间，以改善光发射组件113内的高频共振现象。
请再参阅图28，在不同的实施例中，每一光发射组件113还可包括多个连接导线113j，连接导线113j可以由导电金属材料所形成，并连接于第一支柱113e及第二支柱113f之间，用于改善光发射组件113内的高频共振现象。
请再参阅图29，在不同的实施例中，每一光发射组件113还可包括至少一光学透镜113L及光学窗113w。光学透镜113L是设置于密封型壳体113b内，且对位于光发射器113a，用以将光发射器113a所发出的光信号进行光学改善，例如聚焦、准直、发散等。在一些实施例中，光学透镜113L可设置于支柱113e上，且对位于光发射器113a。然不于此，在不同的实施例中，光学透镜113L及光发射器113a也可设置于同一电路板上。
如图29所示，光学窗113w是设置于密封型壳体113b上，例如设置于密封型壳体113b的前端，且对位于光学透镜113L，用以允许光学透镜113L所改善后的光信号发出密封型壳体113b之外。在一些实施例中，光学窗113w可以是平面型的透光板，以允许光学透镜113L所改善后的光信号发出密封型壳体113b之外。然不于此，在不同的实施例中，光学窗113w还可再对穿过光学透镜113L之后的光信号进行光学改善，以再次改善穿过光学透镜113L之后的光路。
值得注意的是，由于光学透镜113L可直接设置于密封型壳体113b内，而对位于光发射器113a，因而可更准确地控制光学透镜113L与光发射器113a之间的光学对准，以提高光路的准确性，进而可减少光信号的能量损失。在一些实施例中，光学透镜113L的材质可以不同于光学窗113w的材质。具体地，光学透镜113L的材质可以例如是采用各式玻璃材料或是新型的硅基材料(Silicon based micro-lens)，这些材料对特定应用波长(例如：1200nm～1600nm)是吸收率很小的光透明介质。
请再参阅图30A，在一些实施例中，光接收组件114可包括一或多个光接收芯片114c，光接收芯片114c例如为长条形的芯片，并可连接于基板111上。每一光接收芯片114c可设有多个光接收器(PD)114p，多个光接收器114p是沿着一方向上排列，例如可沿着光接收芯片114c的长轴方向，且连接于光接收芯片114c的多个光纤131的数量是少于光接收芯片114c的多个光接收器114p的数量。
如图30A所示，具体地，举例说明，在一实施例中，例如2个光接收芯片114c可排列设置(例如焊接)于基板111上。其中，每一光接收芯片114c例如可设有4个光接收器114p，此时，2个光纤131可连接于光接收芯片114c上的其中2个光接收器114p。通过此配置，可提高光纤131与光接收器114p之间的连接裕度，而提高光纤131与光接收器114p之间的 连接精度，以增加光纤131与光接收器114p之间的耦光精度。值得说明的是，然不限于此，在其他实施例中，每一光接收芯片114c也可设有多于或少于4个光接收器114p。
请再参阅图30B，在一些实施例中，光接收组件114可包括对位基台(sub-mount)114s，对位基台114s可设置于基板111上，用以对位光接收芯片114c。对位基台114s可设有一或多个对位标记114m，光接收芯片114c可设置于对位基台114s上，并通过对位标记114m来进行对位，以提高光纤131与光接收芯片114c之间的对位精度，进而提高增加光纤131与光接收芯片114c之间的耦光精度。
请再参阅图31A及图31B，在一些实施例中，光学收发模组110还可包括光接收固定件114h，用以设置光接收组件114于基板111上，并可形成一间隔G(例如介于10微米～5厘米)于所述光接收固定件114h与所述基板111之间，以允许设置更多的组件(例如IC及/或被动组件)于间隔G内，因而可增加基板111上的组件设置空间。光接收固定件114h可包括至少一支撑单元114i、固定平面114j、定位凹槽114k及定位柱114L。支撑单元114i是形成于光接收固定件114h的一侧，用以支撑光接收固定件114h于基板111上，而形成间隔G于所述光接收固定件114h与所述基板111之间。固定平面114j是形成于光接收固定件114h的相对另一侧，以供光接收组件114进行设置。定位凹槽114k是形成于光接收固定件114h上，用以定位光接收组件114及光纤131于光接收固定件114h上。在一些实施例中，固定平面114j可形成于定位凹槽114k内。定位柱114L可形成于支撑单元114i上，用以定位光接收固定件114h于基板111上
如图31A所示，光接收组件114可设置于光接收固定件114h的固定平面114j上，并通过软性电路板117c来电性连接于基板111。通过光接收固定件114h，可形成间隔G于光接收固定件114h与基板111之间，以增加基板111上的组件设置空间。值得说明的是，在一些实施例中，光接收固定件114h可形成更多的固定平面114j，以设置更多组件。
如图31B所示，具体地，光接收固定件114h可包括例如二个支撑单元114i，而形成例如倒U字形的结构，然不限于此，在其他实施例中，光接收固定件114h可包括一或更多的支撑单元114i，以支撑光接收组件114于基板111上。
如图32A至图35所示，在一些实施例中，光发射组件113中的温度控制单元119可设置于支柱113e上。支柱113e可设置于密封型壳体113b及基座113g所形成密闭空间内，并由基座113g所延伸而出设置。温度控制单元119的致冷器119b可设置于支柱113e上的一侧表面上，而光发射器113a可设置于致冷器119b上。通过此配置，光发射器113a的热量可大幅地传导至致冷器119b，降低光发射器113a芯片端的总热容量，而不需要再增加额外的散热块，因而致冷器119b可使用较少的驱动电流即可达成广大的温控区间，同时增进热平衡的反应时间，具体达成减少产品功耗(power consumption)的效果。值得说明的是，在不同的实施例中，光发射器113a在致冷器119b上的配置也可应用于非密封型的壳体内。
如图32A至图35所示，具体地，设有光发射器113a的电路板113h的最大表面可直接贴合于致冷器119b的最大表面上，因而允许光发射器113a的热量可直接大幅地传导至致冷器119b。此时，致冷器119b的最大表面可约略垂直于基座113g，具体地，致冷器119b的最大表面与基座113g的最大内表面之间可具有一角度，此角度可为80度～100度。此外，热敏电阻119a可设置于电路板113h上，并与所述致冷器119b电性连接，通过所述热敏电阻119a，可检测到所述光发射器113a的温度。
值得说明的是，在不同的实施例中，支柱113e可由良导热材料所形成，并由基座113g所延伸而出设置，因而可作为光发射器113a的散热件(heat sink)。
如图32A至图35所示，在不同实施例中，光发射组件113还包括支撑块113m、113n，支撑块113m、113n可以用于缩短电路板113h接地打线的长度。具体地，支撑块113m、113n可设置于支柱113e与基座113g之间，或设置电路板113h的两侧(如图35所示)。此外，支撑块113m、113n是连接于电路板113h的接地端与基座113g之间，因此，通过导电材质的 支撑块113m、113n，而可电性连接电路板113h的接地端与基座113g的接地端之间，进而缩短光发射组件113内部的打线长度，而达到高速信号性能。
在一些实施例中，一个或多个的支撑块113m可直接一体成型于基座113g上(如图32A及图32B所示)。然不限于此，在一些实施例中，一个支撑块113n(如图33A及图33B所示)或多个的支撑块113n(如图34A及图34B所示)也可以是分离于基座113g之外。
如图35所示，在一些实施例中，多个支撑块113m、113n也可设置电路板113h的两侧，以支撑电路板113h，并缩短电路板113h接地打线的长度。
如图32A至图34B所示，在不同的实施例中，光接收器114p也可整合于光发射组件113内。具体地，基座113g可设有基座凹部113r，用以容置电路板114m，光接收器114p可固定于电路板114m上，因而可配置光接收器114p于基座113g上。值得说明的是，光接收器114p与光发射器113a可在位于同一光轴方向上，使得光接收器114p可取得更大的背光监控电流值，利于TO与TRX电路功能之匹配设计。
再者，如图32A至图34B所示，基座113g的基座凹部113r可具有一倾斜角度(例如5度～45度)，用于依据光接收器114p的入光角度来调整，以提高光接收器114p的光接收效率。
再者，如图36所示，多个支柱113e、113f可设置于基座113g上，第一支柱113e是用以支撑第一电路板113h及致冷器119b，光发射器113a是电性连接于第一电路板113h上，第二支柱113f是用以支撑第二电路板113i，第二电路板113i是用以电性连接外部的信号线(未标示)。
“在一些实施例中”及“在各种实施例中”等用语被重复地使用。该用语通常不是指相同的实施例；但它亦可以是指相同的实施例。“包含”、“具有”及“包括”等用词是同义词，除非其前后文意显示出其它意思。
虽然各种方法、设备、及系统的例子已被描述于本文中，但本揭示内容涵盖的范围并不局限于此。相反地，本揭示内容涵盖所有合理地落在权利要求界定的范围内的方法、设备、系统及制造之物，权利要求的范围应依据已被建立的申请专利范围解释原理来加以解读。例如，虽然上面揭示的系统的例子在其它构件之外还包括可自硬件上执行的软件或韧体，但应被理解的是，该等系统只是示范性的例子，并应被解读为是限制性的例子。详言之，任何或所有被揭示的硬件、软件、及/或韧体构件可被专门地被体现为硬件、专门地被体现为软件、专门地被体现为韧体、或硬件、软件及/或韧体的一些组合。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种光学收发模组，包括：
    壳体；
    基板，设置在所述壳体内；
    光接收组件，设置在所述基板上；
    多个光发射组件，连接于所述基板，其中所述光发射组件与所述基板之间具有一倾斜角度。
  2. 根据权利要求1所述的光学收发模组，还包括固定器，用以固定所述光发射组件与所述基板之间的倾斜角度。
  3. 根据权利要求2所述的光学收发模组，其中所述固定器可包括第一固定器及第二固定器，用以固定多个所述光发射组件。
  4. 根据权利要求3所述的光学收发模组，其中所述第一固定器设置于所述壳体的上壳体上，所述第二固定器设置于所述壳体的下壳体上。
  5. 根据权利要求2所述的光学收发模组，其中所述固定器包括至少一固定凹槽，所述固定凹槽的凹槽形状是对应于所述光发射组件的形状。
  6. 根据权利要求5所述的光学收发模组，其中所述固定凹槽的凹槽形状对应于所述光发射组件的倾斜角度来形成。
  7. 根据权利要求1所述的光学收发模组，还包括连接板，所述光发射组件是通过所述连接板来连接于所述基板。
  8. 根据权利要求7所述的光学收发模组，其中所述连接板包括第一连接板及第二连接板，所述第一连接板及第二连接板具有不同的长度。
  9. 根据权利要求1所述的光学收发模组，其中所述基板包括至少一凸部和至少一凹部，所述凹部是形成于所述凸部的至少一侧，所述光发射组件被设置于所述基板的凹部内。
  10. 根据权利要求1所述的光学收发模组，其中所述多个光发射组件为交错排列设置。
  11. 根据权利要求1所述的光学收发模组，其中所述多个光发射组件为前后交错排列。
  12. 根据权利要求1所述的光学收发模组，其中所述多个光发射组件分别位于所述基板的上下两侧，并交错排列。
  13. 根据权利要求1所述的光学收发模组，其中所述多个光发射组件分别位于所述基板的同一侧，并交错排列。
  14. 根据权利要求1所述的光学收发模组，其中所述光发射组件是通过固定胶来固定所述倾斜角度。
  15. 根据权利要求1所述的光学收发模组，其中所述倾斜角度为5度～85度。
  16. 根据权利要求1所述的光学收发模组，其中所述多个光接收组件为交错排列设置。
  17. 根据权利要求1所述的光学收发模组，其中所述光接收组件与基板之间具有另一倾斜角度。
  18. 根据权利要求1所述的光学收发模组，其中所述光发射组件及光接收组件设置于所述基板的同一侧上。
  19. 根据权利要求1所述的光学收发模组，其中所述光发射组件及光接收组件分別设置于所述基板的不同侧上。
  20. 一种光纤缆线模组，包括：
    光纤缆线；
    光学收发模组，包括：
    壳体；
    基板，设置在所述壳体内；
    光接收组件，设置在所述基板上；
    多个光发射组件，连接于所述基板，其中所述光发射组件与所述基板之间具有一倾斜角度。
PCT/CN2020/077878 2019-03-18 2020-03-05 光学收发模组及光纤缆线模组 WO2020187034A1 (zh)

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