WO2020160757A1 - Appareil de dépôt et son procédé de surveillance - Google Patents

Appareil de dépôt et son procédé de surveillance Download PDF

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Publication number
WO2020160757A1
WO2020160757A1 PCT/EP2019/052772 EP2019052772W WO2020160757A1 WO 2020160757 A1 WO2020160757 A1 WO 2020160757A1 EP 2019052772 W EP2019052772 W EP 2019052772W WO 2020160757 A1 WO2020160757 A1 WO 2020160757A1
Authority
WO
WIPO (PCT)
Prior art keywords
coolant
seal
deposition apparatus
cathode assembly
cathode
Prior art date
Application number
PCT/EP2019/052772
Other languages
English (en)
Inventor
Joachim Sonnenschein
Daniel SCHÄFER-KOPYTTO
Tobias Bergmann
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020217028045A priority Critical patent/KR102598114B1/ko
Priority to CN201980090404.5A priority patent/CN113366605B/zh
Priority to PCT/EP2019/052772 priority patent/WO2020160757A1/fr
Publication of WO2020160757A1 publication Critical patent/WO2020160757A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Definitions

  • Embodiments described herein relate to layer deposition by sputtering from a target. Some embodiments particularly relate to sputtering layers on large area substrates. Embodiments described herein relate specifically to a sputter deposition apparatus including one or more cathode assemblies.
  • the substrates can be coated in one or more chambers of a coating apparatus.
  • the substrates may be coated in a vacuum, using a vapor deposition technique.
  • substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process etc.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • the process is performed in a process apparatus or process chamber where the substrate to be coated is located.
  • a deposition material is provided in the apparatus.
  • a plurality of materials, and also oxides, nitrides or carbides thereof, may be used for deposition on a substrate.
  • Coated materials may be used in several applications and in several technical fields.
  • substrates for displays are often coated by a physical vapor deposition (PVD) process.
  • Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFT), color filters or the like.
  • the deposition material can be present in the solid phase in a target.
  • atoms of the target material i.e. the material to be deposited
  • the atoms of the target material are deposited on the substrate to be coated.
  • the sputter material i.e. the material to be deposited on the substrate
  • the target may be made of the material to be deposited or may have a backing element on which the material to be deposited is fixed.
  • the target including the material to be deposited is supported or fixed in a predefined position in a deposition chamber.
  • segmentmented planar, monolithic planar and rotatable targets may be used for sputtering. Due to the geometry and design of the cathodes, rotatable targets typically have a higher utilization and an increased operation time than planar targets. The use of rotatable targets may prolong service life and reduces costs.
  • Sputtering can be conducted as magnetron sputtering, wherein a magnet assembly is utilized to confine the plasma for improved sputtering conditions.
  • the plasma confinement can be utilized for adjusting the participle distribution of the material to be deposited on the substrate.
  • deposition apparatuses are complex systems having a plurality of different components, be it electrical, mechanical or other types of components, there is a need to monitor the apparatus to make sure that the different components of the apparatus function properly. In some cases, an error or failure of a component can compromise the quality of the deposited layers, or in some cases even lead to damage or breakdown of the apparatus. Therefore, there is an ongoing need to improve the monitoring of deposition apparatuses.
  • a deposition apparatus for depositing a material on a substrate.
  • the deposition apparatus includes a cathode assembly.
  • the deposition apparatus includes a coolant receiving enclosure for receiving a coolant to cool the cathode assembly.
  • the deposition apparatus includes a sensor arranged outside the coolant receiving enclosure to detect a leakage of the coolant out of the coolant receiving enclosure.
  • a deposition apparatus for depositing a material on a substrate.
  • the deposition apparatus includes a cathode drive unit.
  • the cathode drive unit is connectable to a cathode assembly.
  • the cathode drive unit has a channel to drain a coolant of the cathode assembly.
  • the deposition apparatus includes a sensor for detecting coolant in the channel.
  • a deposition apparatus for depositing a material on a substrate.
  • the deposition apparatus includes a cathode assembly.
  • the cathode assembly has an enclosure for a coolant.
  • the apparatus includes a cathode drive unit supporting the cathode assembly.
  • the cathode drive unit includes a first seal.
  • the cathode drive unit includes a drainage channel separated from the enclosure by the first seal.
  • the deposition apparatus may include a sensor, particularly a leakage sensor. The sensor is arranged in or connected to the drainage channel.
  • a method for monitoring a deposition apparatus includes a cathode assembly.
  • the deposition apparatus includes a coolant receiving enclosure for receiving a coolant to cool the cathode assembly.
  • the method includes detecting a leakage of coolant out of the coolant receiving enclosure.
  • FIG. 1 shows a deposition apparatus according to embodiments described herein
  • FIG. 2 shows a deposition apparatus according to embodiments described herein, the deposition apparatus including a first seal, a channel and a sensor for leakage detection;
  • FIG.3 shows examples of a coolant receiving enclosure and a first seal as described herein;
  • FIG. 4 shows a deposition apparatus according to embodiments described herein having a first seal and a second seal
  • FIG. 5 shows an example of a sensor as described herein.
  • FIGS. 6-7 show a deposition apparatus according to embodiments described herein.
  • Embodiments described herein relate to a deposition apparatus for depositing a material on a substrate.
  • a deposition process or coating process a layer of target material is deposited on a substrate.
  • the substrate is coated with the material.
  • coating process and“deposition process” are used synonymously herein.
  • a deposition apparatus may be configured for deposition on vertically oriented substrates.
  • the term“vertically oriented” may include substrates which are arranged at a small deviation from exact verticality, e.g. an angle of up to 10° or even 15° may exist between the substrate and the exact vertical direction.
  • a deposition apparatus may be configured for deposition on large area substrates.
  • a substrate as described herein may be a large area substrate.
  • substrate as used herein includes substrates which are typically used for display manufacturing.
  • substrates as described herein can be substrates which are typically used for an LCD (Liquid Crystal Display), an OLED panel, and the like.
  • a large area substrate can be GEN 4.5, which corresponds to about 0.67 m 2 substrates (0.73 x 0.92m), GEN 5, which corresponds to about 1.4 m 2 substrates (1.1 m x 1.3 m), GEN 6, which corresponds to about 2.8 m 2 substrates (1.85 m x 1.5 m), GEN 7.5, which corresponds to about 4.29 m 2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m 2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • the term“substrate” as used herein shall particularly include substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate.
  • the substrates can be glass substrates and/or transparent substrates.
  • the present disclosure is not limited thereto and the term“substrate” may also embrace flexible substrates such as a web or a foil.
  • the term“substantially inflexible” is understood to distinguish over“flexible”.
  • a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.
  • a deposition apparatus can include one or more cathode assemblies, particularly a plurality of cathode assemblies.
  • a cathode assembly should be understood as an assembly which is adapted for being used as a cathode in a coating process, such as a sputter deposition process.
  • a cathode assembly may be a rotatable cathode assembly.
  • a cathode assembly may include a target, particularly a rotatable target.
  • a rotatable target may be rotatable around a rotation axis of the rotatable target.
  • a rotatable target may have a curved surface, for example a cylindrical surface.
  • the rotatable target may be rotated around the rotation axis being the axis of a cylinder or a tube.
  • a cathode assembly may include a backing tube.
  • a target material forming the target which may contain the material to be deposited onto a substrate during a coating process, may be mounted on the backing tube. Alternatively, the target material may be shaped as a tube without being provided on a backing tube.
  • a cathode assembly may include a magnet assembly.
  • a magnet assembly may be arranged in a cathode assembly of the cathode assembly.
  • a magnet assembly may be surrounded by target material.
  • a magnet assembly may be arranged so that the target material sputtered by the cathode assembly is sputtered towards a substrate.
  • a magnet assembly may generate a magnetic field.
  • the magnetic field may cause one or more plasma regions to be formed near the magnetic field during a sputter deposition process.
  • the position of the magnet assembly within a cathode assembly affects the direction in which target material is sputtered away from the cathode assembly during a sputter deposition process.
  • an un-cooled cathode assembly may become hot due to the fact that the magnet assembly is surrounded by target material that is bombarded with ions. The resulting collisions lead to a heating up of the cathode assembly.
  • a cooling of the cathode assembly, particularly of the target material and the magnet assembly may be provided.
  • a deposition apparatus may be configured for vacuum deposition.
  • the deposition apparatus may include a processing chamber, particularly a vacuum chamber.
  • a cathode assembly as described herein, or at least a part of the cathode assembly, may be arranged in the processing chamber.
  • Fig. 1 shows a cross-section of a deposition apparatus 100 according to embodiments described herein.
  • the cross-section is in a direction parallel to a rotation axis of the cathode assembly 10.
  • a deposition apparatus 100 for depositing a material on a substrate includes a cathode assembly 10.
  • the deposition apparatus 100 includes a coolant receiving enclosure 20 for receiving a coolant 22 to cool the cathode assembly 10.
  • the deposition apparatus 100 includes a sensor 30 arranged outside the coolant receiving enclosure 20 to detect a leakage of the coolant 22 out of the coolant receiving enclosure 20.
  • Embodiments described herein provide the advantage that, by way of the sensor 30, a leakage of the coolant 22 out of the coolant receiving enclosure 20 can be automatically detected. In light thereof, a potential malfunctioning of the deposition apparatus or damage to the deposition apparatus 100 resulting from the leaked coolant can be contained or even prevented. For example, short circuits or corrosion of parts of the deposition apparatus 100 can be avoided. If a leakage of coolant is detected by the sensor 30, any malfunctioning parts of the deposition apparatus 100 causing the leakage, such as e.g. the first seal 210 as described herein, may be replaced. In light thereof, embodiments described herein allow increasing the lifetime of the deposition apparatus.
  • a deposition apparatus 100 may be a sputter deposition apparatus.
  • a cathode assembly 10 as described herein may be a sputter cathode assembly.
  • the cathode assembly 10 may include a target as described herein.
  • the target may be rotatable around a rotation axis of the target.
  • the target may have a curved, e.g. substantially cylindrical, surface.
  • the cathode assembly 10 may include a magnet assembly as described herein. The magnet assembly may be arranged in the cathode assembly 10.
  • a cathode assembly 10 as described herein may include a target.
  • the cathode assembly 10 During operation of the cathode assembly 10, e.g. during a coating process in which material from the target is deposited on a substrate, the cathode assembly 10, particularly the target, may experience a heating.
  • the coolant receiving enclosure 20 having the coolant 22 may be configured to cool the target of the cathode assembly 10.
  • the coolant receiving enclosure 20 having the coolant 22 may be configured to cool the cathode assembly 10, particularly the target, during a deposition process, such as a sputtering process.
  • a coolant 22 as described herein may be configured for cooling the cathode assembly 10.
  • the coolant 22 may be configured for cooling a magnet assembly of the cathode assembly 10.
  • the magnet assembly may be arranged in an interior region of the cathode assembly, e.g. in a hollow region surrounded by target material.
  • the coolant 22 may be a liquid coolant, such as e.g. water, more particularly cooling water. Other liquid coolants suitable for cooling a cathode assembly 10 may also be used.
  • a sensor 30 as described herein may be a leakage sensor.
  • the sensor 30 may be configured to detect a leakage of coolant 22 out of the coolant receiving enclosure 20.
  • At least a portion of the coolant receiving enclosure 20 may be inside the cathode assembly 10. At least a portion, particularly a main portion, of the coolant receiving enclosure 20 may be surrounded by a curved surface, particularly a tube shaped surface, of the cathode assembly 10. The curved surface may be a curved surface of a target of the cathode assembly 10.
  • a portion of the coolant receiving enclosure 20 may be outside the cathode assembly 10, particularly below the cathode assembly 10.
  • the portion of the coolant receiving enclosure 20 outside the cathode assembly 10 may be inside a support device 230 as described herein.
  • the support device 230 may support the cathode assembly 10.
  • the portion of the coolant receiving enclosure 20 inside the cathode assembly 10 may be larger in volume than the remaining portion of the coolant receiving enclosure 20 outside of the cathode assembly 10.
  • Fig. 2 shows a cross-section of a deposition apparatus 100 according to embodiments described herein.
  • a cathode assembly 10 as described herein may be a rotatable cathode assembly.
  • the cathode assembly 10 may have a rotation axis 250 extending in a first direction 252, as shown for example in Fig. 2.
  • the cathode assembly 10 may be rotatable around the rotation axis 250.
  • the rotation axis 250 may be a vertical rotation axis.
  • the coolant receiving enclosure 20 may be a longitudinal enclosure having a length in the first direction 252. At least a portion of the coolant receiving enclosure 20 may extend in the first direction 252 over a length being 60% or more of a length of the cathode assembly 10 in the first direction 252.
  • the coolant receiving enclosure 20 may be configured to cool a target of the cathode assembly 10 substantially over an entire length of the target in the first direction 252.
  • a coolant receiving enclosure 20 as described herein may be tube-shaped in a direction parallel to a rotation axis of the cathode assembly 10.
  • a deposition apparatus 100 as described herein may include a support device 230 supporting the cathode assembly 10.
  • the cathode assembly 10 may have, or be mounted to, a flange.
  • the flange may be mounted on the support device 230.
  • a support device 230 as described herein may be adapted to be mounted to a non revolving part, typically to a wall, flap or door, of the deposition apparatus 100.
  • a support device 230 as described herein may be a cathode drive unit.
  • a cathode drive unit may be configured for supplying power to the cathode assembly 10.
  • a cathode drive unit may include or be connectable to a power supply for supplying power to the cathode assembly 10.
  • a cathode drive unit may be configured for supplying water or coolant to the cathode assembly 10 and/or to the coolant receiving enclosure 20.
  • a cathode drive unit may include or be connectable to a water or coolant supply for supplying water or coolant to the cathode assembly 10.
  • a cathode drive unit may be configured for driving a rotation of the cathode assembly 10.
  • a cathode drive unit may include an actuator for driving a rotation of the cathode assembly 10.
  • a cathode drive unit may be configured for performing any combination of the above-described functions.
  • a cathode drive unit as described herein may be referred to as an end block or cathode drive block.
  • a support device 230 as described herein may be arranged below the cathode assembly 10.
  • the support device 230 may have a body portion 232 or main body.
  • the body portion 232 may have a hollow space therein.
  • the support device 230, particularly the body portion 232 may be configured to remain stationary during a rotation of a target of the cathode assembly 10.
  • the target may be configured to rotate relative to the support device 230, particularly relative to the body portion 232.
  • the support device 230 does not rotate together with the target.
  • a support device 230 as described herein may include a first seal 210.
  • the first seal 210 may engage a portion of the cathode assembly 10.
  • the first seal 210 may be configured to prevent the coolant 22 from flowing out of the coolant receiving enclosure 20.
  • a first seal 210 as described herein may be configured to prevent an exchange of liquid, such as e.g. coolant, bearing grease and vacuum lubricants, between the coolant receiving enclosure 20 and the body portion 232 of the support device 230.
  • the first seal 210 may be configured to prevent coolant from the coolant receiving enclosure 20 from reaching the body portion 232. Further, penetration of grease into the coolant receiving enclosure system is avoided.
  • a first seal 210 as described may be configured to remain in a fixed position during rotation of the target of the cathode assembly 10.
  • the first seal 210 may be a stationary seal.
  • a support device 230 as described herein may include a channel 220 to drain coolant having leaked through the first seal 210.
  • a sensor 30 as described herein may be configured to detect coolant in the channel 220.
  • coolant may leak through the first seal, i.e. out of the coolant receiving enclosure 20.
  • a leakage of coolant through the first seal 210 and out of the coolant receiving enclosure 20 is illustrated in Fig. 2 by an arrow 260.
  • the channel 220 may be configured to receive the leaked coolant.
  • the leaked coolant may flow into the channel 220.
  • the channel 220 may transport the leaked coolant away from the first seal 210, e.g. to a position where the leaked coolant can safely be disposed.
  • the leaked coolant does not come into contact with other parts of the system.
  • a sensor 30 as described herein may be arranged in or connected to the channel 220.
  • the sensor 30 may be arranged in or connected to an interior region of the channel 220.
  • the interior region may be a region where fluid can flow through the channel. At least part of the sensor 30 may be arranged within the interior region of the channel 220.
  • Fig. 3 illustrates a first seal 210 as described herein.
  • a first seal 210 as described herein may have a first side 302 (or first surface) facing towards the interior of the coolant receiving enclosure 20.
  • the first seal 210 may have a second side 304 (or second surface) opposite the first side 302.
  • the first side 302 may be separated from the second side by a side surface or a thickness of the first seal 210.
  • the first side 302 and the second side 304 may be opposing ring-shaped surfaces of a ring-shaped first seal.
  • the first side 302 of the first seal 210 may be configured to be in contact with the coolant 22 in the coolant receiving enclosure 20. If the first seal 210 is operating without failure, the second side 304 of the first seal 210 may not be in contact with the coolant 22 of the coolant receiving enclosure 20.
  • the first side of the first seal 210 may be a wet side of the first seal 210.
  • the second side of the first seal 210 may be a dry side of the first seal 210.
  • Fig. 4 shows a cross-section of a deposition apparatus 100 according to embodiments described herein.
  • a channel 220 as described herein may be in fluid communication with a region at the second side of the first seal 210. If the first seal 210 is operating without failure, no coolant may flow into the channel 220.
  • a channel 220 as described herein may be a conduit, a tube-shaped channel or a tube.
  • the channel 220 may have a first end and a second end opposite the first end. Fluid can flow through the channel 220 from the first end to the second end.
  • the first end may be located in a region in the vicinity of the first seal 210.
  • the second end may be located in a region exterior to the support device 230.
  • the channel 220 may allow draining coolant having leaked through the first seal 210 to a region exterior to the support device 230.
  • At least a portion of the channel 220 may be part of a body portion 232 of the support device 230. At least a portion of the channel 220 may be provided in a tube-shaped recess in the body portion 232.
  • a support device 230 as described herein may include a second seal 410.
  • the second seal 410 may be spaced apart from the first seal 210.
  • the second seal 410 may be spaced from the first seal 210 in a direction parallel to a rotation axis 250 of the cathode assembly 10, e.g. the first direction 252 as described herein.
  • the support device 230 may include an element, e.g. a spacer, arranged between the first seal 210 and the second seal 410.
  • the first seal 210 and the second seal 410 may remain in a fixed position relative to each other during a rotation of the target of the cathode assembly 10.
  • the first seal 210 and/or the second seal 410 may remain in a fixed position relative to a body portion 232 of the support device 230 during a rotation of the target of the cathode assembly 10.
  • a first seal 210 as described herein may be a ring-shaped seal.
  • a second seal 410 as described herein may be a ring-shaped seal.
  • the first seal 210 and the second seal 410 may be substantially concentric ring-shaped seals.
  • the first seal 210 and/or the second seal 410 may be ring-shaped seals extending around an outer periphery of the coolant receiving enclosure 20.
  • a deposition apparatus 100 as described herein may include a movable part 420.
  • the movable part 420 may be a rotatable part.
  • the movable part 420 may be configured to rotate around a rotation axis of the cathode assembly 10.
  • the movable part 420 may be configured to rotate together with the target of the cathode assembly 10.
  • the movable part 420 may be a rotatable tube-shaped part as described herein.
  • the first seal 210 may provide a seal against a first surface of the movable part.
  • the second seal 410 may provide a seal against the first surface of the movable part 420.
  • the first seal 210 and/or the second seal 410 may be in sliding contact with the movable part 420.
  • the first surface of the movable part 420 may be in sliding contact with the first seal 210 and/or the second seal 410.
  • a movable part 420 as described herein may be a movable tube-shaped part, particularly a rotatable tube-shaped part.
  • the movable part 420 may be tube-shaped, e.g. substantially cylindrical, in a direction parallel to a rotation axis 250 of the cathode assembly 10.
  • the first surface, as described herein, of the movable part 420 may be a curved surface, particularly a tube-shaped surface.
  • the movable part 420 may define at least a portion of the coolant receiving enclosure 20.
  • a second surface of the movable part 420 may define at least a portion of the coolant receiving enclosure 20.
  • the first surface and the second surface of the movable part 420 may be opposing surfaces of the movable part 420, e.g. opposing surfaces of a substantially cylindrical movable part.
  • a deposition apparatus 100 as described herein may include a rotatable tube-shaped part.
  • the rotatable tube- shaped part may define at least a portion of the coolant receiving enclosure 20.
  • the rotatable tube-shaped part may be in sliding contact with the first seal 210.
  • a first seal 210 as described herein may be a primary seal to prevent an exchange of liquid between the coolant receiving enclosure 20 and a body portion 232, as described herein, of the support device 230.
  • a second seal 410 as described herein may be a secondary seal to prevent an exchange of liquid between the coolant receiving enclosure 20 and the body portion 232 of the support device 230 in case of a failure of the primary seal.
  • the second seal 410 may be a back-up seal in case of failure of the primary seal, i.e. in case coolant leaks through the first seal 210 out of the coolant receiving enclosure 20.
  • the channel 220 may be connected to a region located between the first seal 210 and the second seal 410. If coolant leaks through the first seal 210, the leaked coolant is drained by the channel 220.
  • the second seal 410 functions as a back-up or secondary seal. The second seal 410 provides the advantage that the coolant receiving enclosure 20 continues to be sealed even in the case of a leak in the first seal 210. The production can continue without interruption.
  • the first seal 210 may be arranged in a position for being in contact with the coolant in the coolant receiving enclosure 20.
  • the second seal 410 may be arranged behind the first seal 210, i.e. on a dry side of the first seal 210. If the first seal 210 operates without failure, the second seal 410 may not be in contact with the coolant 22 in the coolant receiving enclosure 20.
  • Fig. 5 shows an example of a sensor 30 as described herein.
  • the sensor 30 may include two electrodes 510 each connected to an interior region of the channel 220.
  • the sensor 30 may include a volt meter 520 for measuring a voltage across the two electrodes 510. If a liquid, e.g. coolant leaked out of the coolant receiving enclosure 20, flows through the channel 220, the liquid can come into contact with both electrodes. The liquid can act as a conducting line between the two electrodes 510. A measurement of the voltage across the two electrodes allows detecting, for example, whether or not liquid is present in the channel.
  • the sensor 30 shown in Fig. 5 is one particular example of a sensor 30 as described herein. Other examples are also possible, including sensors not based on voltage or current measurements for detecting the presence of liquid in the channel 220. According to embodiments described herein, any sensor suitable for detecting the presence of liquid in the channel 220 may be used.
  • Fig. 6 shows a cross-section of a deposition apparatus 100 according to embodiments described herein.
  • a support device 230 as described herein may include a coolant supply channel 610 for supplying coolant, particularly cold coolant, as indicated by the arrow 612.
  • a coolant receiving enclosure 20 as described herein may include a first coolant receiving portion 620 for receiving coolant.
  • the first coolant receiving portion 620 may define a volume.
  • the first coolant receiving portion 620 may be a radially outward portion of the coolant receiving enclosure 20.
  • the terms“radially outward” and“radially inward” may be defined relative to the rotation axis of the cathode assembly 10.
  • the first coolant receiving portion 620 may be surrounded by a first rotatable tube 622 of the cathode assembly 10.
  • the movable part 420 may be attached to the first rotatable tube 622.
  • the movable part 420 and the first rotatable tube 622 may be configured to rotate together around a rotation axis of the cathode assembly 10.
  • the coolant supply channel 610 may be configured for supplying coolant, particularly cold coolant, to the first coolant receiving portion 620.
  • the coolant supplied by the coolant supply channel 610 may be guided through the first coolant receiving portion 620, as indicated by the arrow 624.
  • the coolant may be guided in an upward direction through the first coolant receiving portion 620.
  • the coolant may be guided to a region adjacent to the target of the cathode assembly 10. As the coolant cools the target and/or magnet assembly, the coolant may absorb heat.
  • a coolant receiving enclosure 20 as described herein may include a second coolant receiving portion 630 for receiving coolant.
  • the second coolant receiving portion 630 may define a volume.
  • the second coolant receiving portion 630 may be downstream of the first coolant receiving portion 620 relative to a flow of coolant through the coolant receiving enclosure 20.
  • the second coolant receiving portion 630 may be a radially inward portion of the coolant receiving enclosure 20.
  • the second coolant receiving portion 630 may be a volume in an interior region of a rotary shaft 632 of the cathode assembly 10.
  • the rotary shaft 632 may be configured to be rotated for driving the rotation of the target.
  • the coolant may be guided through the second coolant receiving portion 630, as indicated by the arrow 634.
  • the coolant may be guided in a downward direction through the first coolant receiving portion 620, particularly through the rotary shaft 632.
  • the coolant flowing into the second coolant receiving portion 630 may be heated coolant e.g. coolant having been heated by absorbing heat from the target and/or magnet assembly during the cooling of the target and/or magnet assembly.
  • a support device 230 as described herein may include a coolant discharge channel 640 for discharging coolant, as indicated by the arrow 642.
  • the coolant discharge channel 640 may be in fluid connection with the coolant receiving enclosure 20.
  • the coolant discharge channel 640 may be configured to receive coolant from the coolant receiving enclosure 20, particularly from the second coolant receiving portion 630.
  • the coolant discharge channel 640 may be configured to discharge the received coolant, particularly heated coolant.
  • a coolant discharge channel 640 as described herein is different from the channel 220, i.e. a drainage channel, as described herein.
  • the channel 220 is provided for discharging coolant that has leaked through a seal, i.e. the first seal 210.
  • the channel 220 is separated from the coolant receiving enclosure 20 by the first seal 210.
  • the coolant discharge channel 640 is configured to discharge coolant during normal operation of the deposition apparatus.
  • the coolant discharge channel 640 is in fluid communication, particularly in direct fluid communication, with the coolant receiving enclosure 20. There is no seal separating the coolant discharge channel 640 from the coolant receiving enclosure 20.
  • a first seal 210 and a second seal 410 as described herein may be part of a first sealing assembly of the deposition apparatus 100.
  • the first seal 210 and/or the second seal 410 may be located in the vicinity of the coolant supply channel 610.
  • the deposition apparatus 100 may include a second sealing assembly, as shown in Fig. 6.
  • the deposition apparatus 100 may include a third seal 652 to prevent coolant from flowing out of the coolant receiving enclosure 20.
  • the third seal 652 may be located in the vicinity of the coolant discharge channel 640.
  • the function of the third seal 652 may be similar to the function of the first seal 210.
  • the third seal may be a primary seal, e.g. like the first seal 210.
  • support device 230 as described herein may include a second channel 660 to drain coolant having leaked through the third seal 652.
  • the function of the second channel 660 is similar to the function of the channel 220.
  • the deposition apparatus 100 may include a second sensor (not shown) arranged outside of the coolant receiving enclosure 20 to detect a leakage of the coolant 22 out of the coolant receiving enclosure 20.
  • the second sensor may be a leakage sensor.
  • the function of the second sensor may be similar to the function of the sensor 30.
  • the second sensor may be arranged in or connected to the second channel 660.
  • the second sensor may be configured to detect coolant in the second channel 660.
  • the sensor 30 may be configured to detect a leakage of both the first seal 210 and the third seal 652. Coolant flowing through the channel 220 and coolant flowing through the second channel 660 may both be guided, e.g., by a further conduit, to a common region. The sensor 30 may be connected to or arranged in the common region. Coolant flowing through the channel 220 and coolant flowing through the second channel 660 can both be detected by the sensor 30.
  • a third seal 652 as described herein may have a first side facing towards an interior of the coolant receiving enclosure and a second side opposite the first side.
  • the second channel 660 may be in fluid communication with a region at the second side of the third seal 652.
  • a deposition apparatus 100 may include a second rotatable tube- shaped part 670 defining at least a portion of the coolant receiving enclosure.
  • the second rotatable tube-shaped part 670 may be in sliding contact with the third seal 652.
  • a support device 230 as described herein may include a fourth seal 654 spaced from the third seal 652.
  • the second channel 660 may be in fluid communication with a region between the third seal 652 and the fourth seal 654.
  • the fourth seal may be a secondary seal, e.g. like the second seal 410 as described herein.
  • Fig. 7 schematically shows a cross section of a deposition apparatus 100 along the rotation axis 250 according to embodiments.
  • the deposition apparatus 100 may include a processing chamber 710 formed by walls 712 and 714.
  • the rotation axis 250, the target, and/or the backing tube are essentially parallel to the wall 712 to which the support device 230, particularly the cathode drive unit, is attached.
  • a drop-in configuration of the cathode assembly can be realized.
  • At least one support device 230 as described herein is mounted to the processing chamber 710 such that the body portion 232 of the support device 230 is not rotatable relative to the walls 712 of the processing chamber 710.
  • the body portion 232 is typically fastened via an insulating plate 722 to a flap or door 730 of the processing chamber 710. During sputtering, the flap or door 730 is closed. Accordingly, the body portion 232 is typically stationary, at least non-rotatable, during sputtering.
  • an external housing 735 may be fastened directly to a wall 712 of the processing chamber 710.
  • a target flange 770 is arranged on and vacuum tightly mounted to the bearing housing 723.
  • an O-ring seal is arranged between the bearing housing 723 and the target flange 770.
  • a rotatable target mounted on top of the target flange 723 may be rotated by a rotating drive.
  • the external housing does not typically rotate relative to the process chamber in which the sputtering is carried out .
  • at least an upper part or the target flange 770 is typically arranged outside the external housing, i.e. in a low pressure or vacuum environment. Different thereto, the internal space of the external housing is typically at normal and/or a higher pressure than the process chamber.
  • a rotating drive 750 typically an electrical drive, is arranged outside the processing chamber 710 via a mounting support 752.
  • the rotating drive 750 may also be placed within the external housing 735.
  • the rotating drive 750 drives the rotatable target 740 of the cathode assembly during sputtering via a motor axis 754, a pinion 753 connected thereto and a chain or a toothed belt (not shown) which loops around the pinion 753 and a gear-wheel 751 attached to a bearing housing 723 of a rotor 725.
  • the rotor 725 may be adapted to mechanically support the rotatable target 740.
  • coolant support tubes 734 and/or electrical support lines are fed from a coolant supply and discharge unit 780 and/or an electrical support unit through the external housing 735 to the outside of the processing chamber 710.
  • an apparatus for processing a substrate particularly a deposition apparatus 100 for depositing a material on a substrate.
  • the apparatus includes a cathode drive unit as described herein.
  • the cathode drive unit is connectable to a cathode assembly 10 as described herein.
  • the cathode drive unit has a channel 220 as described herein to drain a coolant of the cathode assembly.
  • the apparatus includes a sensor 30 as described herein for detecting coolant in the channel 220.
  • the cathode drive unit may include a first seal 210 as described herein.
  • the first seal 210 may be configured to engage a portion of the cathode assembly 10.
  • the channel 220 may be arranged to drain coolant having leaked through the first seal 210.
  • the cathode drive unit may include a second seal 410 as described herein.
  • the second seal 410 may be spaced from the first seal 210.
  • the channel 220 may be in fluid communication with a region between the first seal 210 and the second seal 410.
  • the deposition apparatus 100 may include the cathode assembly 10.
  • the deposition apparatus 100 may include a coolant receiving enclosure 20 as described herein.
  • the cathode drive unit may be a support device 230 as described herein.
  • a first seal 210 as described herein may be configured to engage a portion of the cathode assembly 10.
  • the first seal 210 may provide a seal against a surface of the cathode assembly 10.
  • the first seal 210 may be configured to be in sliding contact with the surface.
  • the first seal 210 may be a stationary seal.
  • the first seal 210 may not be configured to rotate together with the target of the cathode assembly 10.
  • a cathode drive unit as described herein may include a second seal 410 as described herein.
  • the second seal 410 may provide a seal against a surface of the cathode assembly 10.
  • the second seal 410 may be configured to be in sliding contact with the surface.
  • the first seal 210 and the second seal 410 may be configured to provide a seal against a same surface of the cathode assembly 10, e.g. a surface of a rotatable tube-shaped part as described herein.
  • the first seal 210 may be a primary seal of the cathode driving unit.
  • the second seal 410 may be a secondary seal, or back-up seal, of the cathode driving unit.
  • the second seal 410 may be arranged to act as a seal in case of failure of the first seal 210.
  • the channel 220 may be in fluid communication with a region adjacent to the first seal 210.
  • the channel 220 may be connected to a region located between the first seal 210 and the second seal 410.
  • a deposition apparatus 100 for depositing a material on a substrate is provided.
  • the deposition apparatus 100 includes a cathode assembly 10 as described herein.
  • the cathode assembly 10 has an enclosure for a coolant 22.
  • the enclosure may be a coolant receiving enclosure 20 as described herein.
  • the deposition apparatus 100 includes a cathode drive unit as described herein supporting the cathode assembly 10.
  • the cathode drive unit includes a first seal 210 as described herein.
  • the cathode drive unit includes a drainage channel separated from the enclosure by the first seal 210.
  • the drainage channel may be a channel 220 as described herein.
  • the deposition apparatus 100 may include a sensor 30 as described herein, particularly a leakage sensor. The sensor 30 is arranged in or connected to the drainage channel.
  • a method for monitoring a deposition apparatus 100 is provided.
  • the method may be a method of leak detection for the deposition apparatus 100.
  • the deposition apparatus 100 includes a cathode assembly 10 as described herein.
  • the deposition apparatus 100 includes a coolant receiving enclosure 20 as described herein.
  • the coolant receiving enclosure 20 contains a coolant 22 to cool the cathode assembly 10.
  • the deposition apparatus 100 may be a deposition apparatus according to any embodiment described herein, particularly a deposition apparatus as recited in any of the claims.
  • the method includes detecting a leakage of coolant 22 out of the coolant receiving enclosure 20.
  • the leakage may be detected using a sensor 30 as described herein.
  • the sensor 30 may be arranged outside of the coolant receiving enclosure 20.
  • the method may include cooling the cathode assembly by the coolant 22 in the coolant receiving enclosure 20.
  • the method may include guiding the coolant 22 along a coolant circuit passing through the coolant receiving enclosure 20.
  • the method may include guiding the coolant into the coolant receiving enclosure 20.
  • the method may include guiding coolant, particularly heated coolant, out of the coolant receiving enclosure 20.
  • the deposition apparatus 100 may include a first seal 210 as described herein.
  • the method may include preventing coolant from flowing out of the coolant receiving enclosure 20 by the first seal 210.
  • the deposition apparatus 100 may include a cathode drive unit as described herein supporting the cathode assembly 10.
  • the cathode drive unit may have a channel 220 to drain the coolant 22 of the cathode assembly 10.
  • Detecting the leakage of the coolant out of the coolant receiving enclosure 20 may include detecting coolant in the channel 220. If coolant is detected in the channel 220 by the sensor 30, it may be established that a leak, e.g. a leak of the first seal 210 as described herein, is present.
  • the method may include guiding leaked coolant away from the first seal 210.
  • the method may include draining leaked coolant by the channel 220.
  • the method may include generating an alert if a leakage of coolant out of the coolant receiving enclosure 20 is detected.
  • the alert may be generated if an amount of coolant is detected in the channel 220.
  • the method may include preventing coolant from flowing out of the coolant receiving enclosure 20 by a second seal 410, as described herein, in the case of a failure of the first seal 210.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un appareil de dépôt (100) permettant de déposer un matériau sur un substrat. L'appareil de dépôt comprend un ensemble cathode (10). L'appareil de dépôt comprend une enceinte de réception de liquide de refroidissement (20) pour recevoir un liquide de refroidissement (22) pour refroidir l'ensemble cathode. L'appareil de dépôt comprend un capteur (30) agencé à l'extérieur de l'enceinte de réception de liquide de refroidissement (20) pour détecter une fuite du fluide de refroidissement hors de l'enceinte de réception de liquide de refroidissement.
PCT/EP2019/052772 2019-02-05 2019-02-05 Appareil de dépôt et son procédé de surveillance WO2020160757A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020217028045A KR102598114B1 (ko) 2019-02-05 2019-02-05 증착 장치 및 증착 장치를 모니터링하기 위한 방법
CN201980090404.5A CN113366605B (zh) 2019-02-05 2019-02-05 沉积设备和用于监测沉积设备的方法
PCT/EP2019/052772 WO2020160757A1 (fr) 2019-02-05 2019-02-05 Appareil de dépôt et son procédé de surveillance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2019/052772 WO2020160757A1 (fr) 2019-02-05 2019-02-05 Appareil de dépôt et son procédé de surveillance

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WO2020160757A1 true WO2020160757A1 (fr) 2020-08-13

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Publication number Priority date Publication date Assignee Title
DE102021104791A1 (de) 2020-10-20 2022-04-21 VON ARDENNE Asset GmbH & Co. KG Magnetron-Endblockwelle, Magnetron-Endblock und Verfahren
WO2022268311A1 (fr) * 2021-06-23 2022-12-29 Applied Materials, Inc. Ensemble cathode, appareil de dépôt et procédé de désinstallation d'ensemble cathode

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US20080105543A1 (en) * 2004-10-18 2008-05-08 Bekaert Advanced Coatings Flat End-Block For Carrying A Rotatable Sputtering Target
WO2010115189A1 (fr) * 2009-04-03 2010-10-07 General Plasma, Inc. Magnétron rotatif
EP2966192A1 (fr) * 2014-07-09 2016-01-13 Soleras Advanced Coatings bvba Dispositif de pulvérisation avec cibles mobiles

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LU90179B1 (fr) * 1997-11-26 1999-05-27 Wurth Paul Sa Procede pour refroidir un dispositif de chargement d'un four a cuve
DE602005025588D1 (de) * 2004-01-13 2011-02-10 Koninkl Philips Electronics Nv Röntgenröhren-kühlkragen
US9096927B2 (en) * 2011-09-02 2015-08-04 Applied Materials, Inc. Cooling ring for physical vapor deposition chamber target
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US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target
US20080105543A1 (en) * 2004-10-18 2008-05-08 Bekaert Advanced Coatings Flat End-Block For Carrying A Rotatable Sputtering Target
WO2010115189A1 (fr) * 2009-04-03 2010-10-07 General Plasma, Inc. Magnétron rotatif
EP2966192A1 (fr) * 2014-07-09 2016-01-13 Soleras Advanced Coatings bvba Dispositif de pulvérisation avec cibles mobiles

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Publication number Priority date Publication date Assignee Title
DE102021104791A1 (de) 2020-10-20 2022-04-21 VON ARDENNE Asset GmbH & Co. KG Magnetron-Endblockwelle, Magnetron-Endblock und Verfahren
WO2022268311A1 (fr) * 2021-06-23 2022-12-29 Applied Materials, Inc. Ensemble cathode, appareil de dépôt et procédé de désinstallation d'ensemble cathode

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CN113366605A (zh) 2021-09-07
KR102598114B1 (ko) 2023-11-02
CN113366605B (zh) 2024-02-20
KR20210121219A (ko) 2021-10-07

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