WO2020158793A1 - Resonator, filter and communication device - Google Patents

Resonator, filter and communication device Download PDF

Info

Publication number
WO2020158793A1
WO2020158793A1 PCT/JP2020/003152 JP2020003152W WO2020158793A1 WO 2020158793 A1 WO2020158793 A1 WO 2020158793A1 JP 2020003152 W JP2020003152 W JP 2020003152W WO 2020158793 A1 WO2020158793 A1 WO 2020158793A1
Authority
WO
WIPO (PCT)
Prior art keywords
resonant element
conductor
conductor portion
resonator
resonance
Prior art date
Application number
PCT/JP2020/003152
Other languages
French (fr)
Japanese (ja)
Inventor
吉川 博道
浩児 濱田
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2020569678A priority Critical patent/JPWO2020158793A1/en
Publication of WO2020158793A1 publication Critical patent/WO2020158793A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/205Comb or interdigital filters; Cascaded coaxial cavities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • H01P7/04Coaxial resonators

Definitions

  • the present disclosure relates to a resonator, a filter using the resonator, and a communication device.
  • the resonator of the present disclosure is a shield housing having a cavity inside, and is located on a first conductor portion located on the first direction side and on a second direction side opposite to the first direction.
  • a shield housing including a second conductor portion;
  • a first resonant element made of a tubular dielectric, wherein an end in the second direction is joined to the second conductor portion, and an end in the first direction is located apart from the first conductor portion.
  • the filter of the present disclosure is a resonator, and a plurality of resonators arranged in a row so as to be electromagnetically coupled to each other, A first terminal portion electrically or electromagnetically connected to the resonator located at one end of the row; A second terminal portion electrically or electromagnetically connected to the resonator located at the other end of the row.
  • the communication device of the present disclosure has a configuration including an antenna, a communication circuit, and the above-mentioned filter connected to the antenna and the communication circuit.
  • FIG. 3 is a cross-sectional view schematically showing the resonator of the first embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional view of the resonator shown in FIG. 1 taken along section line II-II. It is a graph which shows the relationship between the 3rd space
  • DELTA 3rd space
  • FIG. 5 is a cross-sectional view schematically showing a resonator according to a second embodiment of the present disclosure.
  • FIG. 6 is a cross-sectional view schematically showing a resonator according to a third embodiment of the present disclosure.
  • FIG. 19 is a block diagram showing a communication device in which the filters shown in FIGS. 17 and 18 are incorporated.
  • a resonator based on the resonator of the present disclosure a resonator in which a columnar conductor whose one end is grounded is housed in a shield case is known. Further, a resonator in which a columnar dielectric is housed in a shield case is known.
  • FIG. 1 is a cross-sectional view schematically showing the resonator according to the first embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view taken along the section line II-II in FIG.
  • the right side of FIG. 1 is +X direction
  • the left side of FIG. 1 is ⁇ X direction
  • the depth direction perpendicular to the plane is the +Y direction
  • the front side perpendicular to the paper surface of FIG. 1 is the ⁇ Y direction
  • the upper side of FIG. 1 is the +Z direction
  • the resonator according to the present embodiment includes the first conductor portion 5 located on the ⁇ Z direction side, which is the first direction, and the second conductor located on the +Z direction side, which is the second direction opposite to the ⁇ Z direction.
  • the shield housing 1 including the portion 6 and having the cavity 7 therein, the end in the +Z direction is joined to the second conductor portion 6, and the end in the ⁇ Z direction is located away from the first conductor portion 5.
  • the first resonant element 2 made of a cylindrical dielectric material disposed in the cavity 7 is joined to the first conductor portion 5 at the ⁇ Z direction end, and the second conductor portion 6 is connected at the +Z direction end.
  • a cylindrical second resonance element 3 which is disposed in the cavity 7 so as to be separated from the first resonance element 2 and is surrounded by the first resonance element 2, and an end in the +Z direction is joined to the second conductor portion 6, And a cylindrical third resonance element 4 disposed in the cavity 7 so as to be separated from the first conductor portion 5 and surrounded by the second resonance element 3.
  • the second resonant element 3 is made of a cylindrical conductor.
  • the third resonance element 4 is made of a cylindrical conductor having a diameter smaller than that of the second resonance element 3.
  • a bonding layer made of a conductor between the +Z direction end of the first resonant element 2 and the second conductor portion 6 and joining the +Z direction end of the first resonant element 2 and the second conductor portion 6 together. 8 are provided.
  • the “Q value” is a dimensionless parameter index indicating the energy storage capacity represented by the reciprocal (1/tan ⁇ ) of the dielectric loss (tan ⁇ ), and this value Means that the higher is, the less the dielectric loss is.
  • the conductors forming the second resonant element 3 and the third resonant element 4 can be formed using various known conductive materials such as metal and non-metal conductive materials.
  • a conductive material containing an Ag alloy as a main component such as Ag, Ag—Pd, or Ag—Pt, or a Cu-based, W-based, Mo-based, or Pd-based conductive material is used.
  • a material or the like can be used.
  • the shield casing 1 has a rectangular parallelepiped box shape having a cavity 7 as a resonance space inside, and is connected to a reference potential.
  • the reference potential refers to a potential also called a ground potential, a ground potential, or a ground potential.
  • the shield housing 1 includes a first conductor portion 5 located on the ⁇ Z direction (lower side in FIG. 1) side and a plate-shaped second conductor portion 6 located on the +Z direction (upper side in FIG. 1) side. , And are joined by a conductive joining material.
  • the first conductor portion 5 is a bottomed tubular body that is configured by four side wall portions and a bottom portion and has a concave cross section that is open in the +Z direction.
  • the second conductor portion 6 is a rectangular flat plate-shaped body.
  • Through holes 9 and 10 used for connection with an external circuit are formed in the two opposing side wall parts of the first conductor part 5.
  • a peripheral edge portion of the surface of the second conductor portion 6 facing in the ⁇ Z direction is joined to the end surface of the first conductor portion 5 facing in the +Z direction by a conductive bonding material, and the opening of the first conductor portion 5 is formed in the second conductor portion. Blocked by 6.
  • the first conductor portion 5 and the second conductor portion 6 can be formed using various known conductive materials such as metal and non-metal conductive materials.
  • a conductive material containing an Ag alloy as a main component such as Ag, Ag—Pd, or Ag—Pt, or a Cu-based, W-based, Mo-based, or Pd-based conductive material. Materials can be used.
  • the conductive bonding material for bonding the first conductor portion 5 and the second conductor portion 6 various known conductive bonding materials such as solder and conductive adhesive can be used.
  • the first conductor portion 5 and the second conductor portion 6 may be mechanically fastened and joined to each other with screws or bolts while being electrically connected to each other.
  • the inside of the cavity 7 is filled with air, it may be vacuum or filled with a gas other than air, for example, an inert gas.
  • the first resonant element 2 is arranged in the center of the cavity 7 in the plan view shown in FIG. 2 and has a cylindrical shape extending in the Z direction. Further, the first resonance element 2 is joined at the +Z direction end to the second conductor portion 6 by the joining layer 8 made of a conductive joining material.
  • the bonding layer 13 has a thickness of about 1 mm by metalizing. The ⁇ Z direction end of the first resonant element 2 and the bottom surface of the first conductor portion 5 of the shield housing 1 are separated by a first distance ⁇ L1 in the ⁇ Z direction.
  • the entire end surface of the first resonant element 2 in the +Z direction is joined to the surface of the second conductor portion 6 on the cavity 7 side, and the end surface of the first resonant element 2 in the ⁇ Z direction and the shield housing.
  • the first conductor portion 5 and the bottom surface of the first conductor portion 5 are separated from each other by a first distance ⁇ L1 in the ⁇ Z direction.
  • the resonance frequency can be lowered, but the resonance frequency of the higher mode is also lowered. Therefore, by separating the first resonant element 2 and the shield casing 1 with such a first gap ⁇ L1, the first resonant element 2 made of a dielectric material and the shield casing 1 made of metal are separated from each other.
  • the resonance frequency of the higher-order mode can be increased by interposing the space filled with air or the inert gas having a low dielectric constant.
  • the first resonant element 2 is made of a dielectric material as described above, and the second and third resonant elements 3 and 4 are made of conductors.
  • the first resonant element 2, the second resonant element 3, and the third resonant element 4 are arranged on the same axis with a straight line parallel to the Z axis as the central axis. That is, the second resonance element 3 is arranged in the center of the cavity 7 on the same axis as the first resonance element 2, and is realized as a cylindrical body having a straight line parallel to the ⁇ Z directions as its center line.
  • the third resonant element 4 is arranged so as to form the same axis as the first resonant element 2 and the second resonant element 3 in a plan view.
  • the second resonant element 3 is spaced apart from the first resonant element 2 by a third distance ⁇ L3 in the radial direction, and is disposed in the cavity 7 while being surrounded by the first resonant element 2.
  • the end face of the ⁇ Z direction end of the second resonant element 3 is joined to the surface of the bottom of the first conductor portion 5 by a conductive joining material.
  • the end face of the +Z direction end of the second resonant element 3 is separated from the surface of the second conductor portion 6 facing the +Z direction with a second gap ⁇ L2 in the +Z direction.
  • the outer peripheral surface of the second resonant element 3 and the inner peripheral surface of the first resonant element 2 are spaced apart by a third distance ⁇ L3 in the radial direction.
  • the end surface of the +Z direction end of the third resonant element 4 is joined to the surface of the second conductor portion 6 facing the ⁇ Z direction by a conductive bonding material, and the end surface of the ⁇ Z direction end of the third resonant element 4 is
  • the second resonance element 3 extends in the ⁇ Z direction from the end surface of the +Z direction end and is inserted into the second resonance element 3.
  • the outer peripheral surface of the third resonant element 4 is spaced apart from the inner peripheral surface of the second resonant element 3 by a fourth distance ⁇ L4 in the radial direction, and in the XZ plane including the Z axis, the distance L1 in the Z direction. However, it is disposed so as to overlap the second resonant element 3.
  • the space between the second resonant element 3 and the second conductor portion 6 serves as a dielectric gap that acts as a storage capacitor for electromagnetic energy, and the resonance is adjusted by adjusting the second spacing ⁇ L2.
  • the frequency and Q factor can be controlled.
  • the space between the first resonant element 2 and the second resonant element 3 becomes a capacitive gap that acts as a storage capacitance of electric field energy by the third interval ⁇ L3, and by adjusting the third interval ⁇ L3, the resonance frequency and The Q value can be controlled.
  • the space between the second resonant element 3 and the third resonant element 4 serves as a dielectric gap that acts as a storage capacity for electromagnetic energy, and by adjusting the fourth spacing ⁇ L4, the resonance frequency and The Q value can be controlled.
  • the second resonant element 3 and the third resonant element 4 of the present embodiment can be formed using various known conductive materials such as metal and non-metal conductive materials.
  • a conductive material containing an Ag alloy as a main component such as Ag, Ag—Pd, or Ag—Pt, or a Cu-based, W-based, Mo-based, or Pd-based conductive material. Materials and the like can be appropriately selected and used.
  • the length of the first resonant element 2 in the Z direction may be 80% or more of the size of the cavity 7 in the ⁇ Z direction, or 90% or more of the size of the cavity 7 in the ⁇ Z direction.
  • the second resonant element 3 may be surrounded by the first resonant element 2 at a portion that is half the length in the ⁇ Z direction or more.
  • the Z-direction length of the portion of the second resonance element 3 surrounded by the first resonance element 2 may be 50% or more of the Z-direction length of the first resonance element 2. From the viewpoint of further improving the electrical characteristics, the above ratio may be 80% or more. If it is 90% or more, the electrical characteristics are further improved.
  • the coupling between the even mode and the odd mode of the second resonance element 3 and the third resonance element 4 is used.
  • the larger the ratio of the lengths of the third resonance element 4 surrounded by the second resonance element 3 in the ⁇ Z direction the stronger the coupling between the even mode and the odd mode, and the further the resonance frequency of the even and odd mode becomes apart. ..
  • the volume of the dielectric of the first resonant element 2 can further reduce the resonant frequency. Therefore, it is important that the ratio of the lengths of the first resonant element 2 and the second resonant element 3 in the ⁇ Z direction is large to some extent.
  • the size of the cavity 7, the diameter of the first resonant element 2, the fourth distance ⁇ L4 between the first resonant element 2 and the second resonant element 3, the thickness of the first resonant element 2 and the thickness of the second resonant element 3 are , The desired size, the resonance frequency of the fundamental mode resonance, and the resonance frequency of the higher order mode resonance.
  • Such a resonator functions as a resonator having a resonance mode similar to a TEM (Transverse Electric and Magnetic) mode.
  • the pore area ratio of the joint portion 28 with the second conductor portion 6 may be lower than the pore area ratio of the central portion in the axial direction ( ⁇ Z direction in the example shown in FIG. 1).
  • the pore area ratio at the central portion in the axial direction is 3% or less
  • the difference from the pore area ratio of the joint portion 28 with the second conductor portion 6 is: It is 0.1% or more.
  • the joint portion 28 with the second conductor portion 6 refers to a region within a length of 10% in the ⁇ Z direction from the end face on the second conductor portion 6 side with respect to the entire length of the first resonant element 2 in the ⁇ Z direction.
  • the central portion in the axial direction refers to an area within 10% in the +Z direction and within 10% in the ⁇ Z direction from an imaginary plane located at the center between the end surfaces.
  • the pore area ratio of the inner peripheral surface layer portion and the outer peripheral surface layer portion are higher than the pore area ratio of the intermediate portion located between the inner peripheral surface layer portion and the outer peripheral surface layer portion. May be.
  • the intermediate portion maintains high characteristics.
  • the inner peripheral surface layer portion and the outer peripheral surface layer portion have a high anchor effect on the coating layer, and reliability can be maintained even if heat is repeatedly generated. It is also possible to form a coating layer on the outer peripheral surface and the inner peripheral surface to relieve the residual stress when minute voids remain in the pores.
  • the pore area ratio of the middle portion is 1.5% or less, and the difference between the pore area ratio of the inner peripheral surface layer portion and the outer peripheral surface layer portion is 0.1% to 1%. is there.
  • the inner peripheral side surface layer portion is a region within 10% in the thickness direction from the inner peripheral surface with respect to the wall thickness of the first resonant element 2, and the outer peripheral side surface layer portion is relative to the wall thickness of the first resonant element 2.
  • the intermediate portion refers to an area having a thickness of 10% or less from the virtual circumferential surface located between the inner peripheral surface and the outer peripheral surface toward the inner peripheral surface and a length of 10% or less toward the outer peripheral surface.
  • the porosity area ratio in each of the above areas may be obtained using the image analysis software “A image-kun” (ver2.52) (registered trademark, manufactured by Asahi Kasei Engineering Co., Ltd.).
  • a cross section of the end face, the outer peripheral face, the inner peripheral face, and the central portion in the axial direction of the first resonant element 2 is used by using diamond abrasive grains having an average particle diameter D 50 of 3 ⁇ m.
  • the cross section of the intermediate part is polished with a copper plate.
  • the surface to be measured is obtained by polishing with a tin plate using diamond abrasive grains having an average particle diameter D 50 of 0.5 ⁇ m.
  • the arithmetic mean roughness Ra of the surface to be measured is, for example, 0.01 ⁇ m to 0.2 ⁇ m.
  • the surface to be measured is observed at a magnification of 200, and an average range is selected. For example, a range having an area of 0.105 mm 2 (horizontal length 374 ⁇ m, vertical length 280 ⁇ m) is selected. Take an image with a CCD camera to obtain an observation image. For this observation image, the pore area ratio may be obtained by a method called particle analysis using the image analysis software “A image kun (ver2.52)”.
  • a threshold value which is an index showing the brightness of an image, is 86, brightness is dark, a small figure removal area is 1 ⁇ m 2 , and a noise removal filter is provided.
  • the threshold value may be adjusted according to the brightness of the observed image. The brightness was set to dark, the binarization method was set to manual, the small figure removal area was set to 1 ⁇ m 2 and a noise removal filter was provided, and the threshold value was set so that the marker appearing in the observed image matches the shape of the pores. Should be adjusted.
  • dielectric material of the first resonant element 2 a known dielectric material such as dielectric ceramics can be used.
  • dielectric ceramics an oxide containing a rare earth element (Ln), Al, M (M is at least one of Ca and Sr) and Ti, Ba 3 Ti 12 Zn 7 O 34 , BaTiO 3 , Pb 4 Fe 2 Nb 2 O 12 , Ferroelectric ceramics containing TiO 2 or the like can be preferably used.
  • an oxide containing a rare earth element (Ln), Al, M (M is at least one of Ca and Sr) and Ti is used as the dielectric ceramic, the composition formula is aLn 2 O x ⁇ bAl 2 O 3 ⁇ cMO ⁇ dTiO 3.
  • the crystal system is an oxide having at least one of hexagonal crystal and orthorhombic crystal of 80% by volume or more, and at least a part of the oxide of Al is ⁇ -Al 2 O 3 and ⁇ -Al 2 with present as at least one of the crystalline phases of O 3, may beta-Al 2 O 3 and ⁇ -Al 2 O 3 of which at least one crystalline phase 1 / 100,000 include 1-3% by volume.
  • the first resonant element 2 having a high relative permittivity ⁇ r and a high Q value in a high frequency region can be obtained.
  • ⁇ -Al 2 O 3 and ⁇ -Al 2 O 3 crystals were carried out by processing the above dielectric ceramics using an ion thinning device (for example, manufactured by Technoorg Linda), It may be performed by observation with a transmission electron microscope, analysis with a selected area electron diffraction image, measurement with energy-dispersive X-ray spectroscopy (EDS analysis), measurement with a minute X-ray diffraction method, or the like.
  • an ion thinning device for example, manufactured by Technoorg Linda
  • the first resonant element 2 having a high relative permittivity ⁇ r and a high Q value in a high frequency region can be obtained.
  • Ba 3 Ti 12 Zn 7 O 34 , BaTi 4 O 9 and Ba 3 Ti 12 Zn 7 O 34 were identified by an X-ray diffraction method, and the Rietveld method was used as the main component, which was the most abundant component. Just specify.
  • a resin such as an epoxy resin can be used.
  • the first resonant element 2 and the shield housing 1 are joined by the joining layer 13.
  • the conductive bonding material of the bonding layer 13 various known conductive bonding materials such as a conductive adhesive can be used.
  • the resonator having a configuration based on the resonator of the present disclosure described in the above-mentioned Patent Document 1 and the like has a problem that miniaturization is difficult.
  • the size is reduced by filling the entire inside of the shield case with a dielectric material, the resonance frequency of higher-order mode resonance is greatly reduced and approaches the resonance frequency of fundamental-mode resonance, which causes a problem that electrical characteristics deteriorate. is there.
  • a dielectric is arranged between the open end of the columnar conductor as the first resonance element and the shield case to reduce the size, there is a problem that the Q value is greatly reduced and the electrical characteristics are deteriorated.
  • the resonator of the present embodiment described above is smaller than the resonator based on the resonator of the present disclosure such as Patent Document 1. And the reduction of the resonance frequency of higher-order mode resonance is suppressed as compared with a resonator having a configuration based on the resonator of the present disclosure such as Patent Document 1 filled with a dielectric inside the shield case. Further, it is possible to suppress a decrease in Q value more than a case where a dielectric is arranged between the open end of the columnar conductor of the resonator having a configuration based on the resonator of the present disclosure such as Patent Document 1 and the shield case. be able to.
  • the resonator of the present embodiment has a large difference between the resonance frequency of the fundamental mode resonance and the resonance frequency of the higher order mode resonance, has a high Q value, has excellent electrical characteristics, and is small in size. That is, the resonator of this embodiment is small and has excellent electric characteristics.
  • the resonator of the present embodiment having the above-mentioned configuration can be manufactured, for example, as follows. First, a structure in which the +Z direction ends of the first resonance element 2 and the third resonance element 4 are joined to the second conductor portion 6 is produced. In addition, a structure in which the +Z direction end of the second resonant element 3 is joined to the first conductor portion 5 is manufactured. Then, by joining the first conductor portion 5 and the second conductor portion 6 so that the first resonant element 2 and the third resonant element 4 are located inside the second resonant element 3, the present embodiment Can be manufactured.
  • the +Z-direction ends of the first resonance element 2 and the third resonance element 4 are reliably bonded to the second conductor portion 6, and the +Z-direction ends of the second resonance element 3 are reliably bonded to the first conductor portion 5. It is possible to easily manufacture a resonator having high reliability.
  • the second resonant element 3 and the third resonant element 4 have a tubular shape. Therefore, the single first resonance element 2 having a simple shape can surround the second resonance element 3 and the third resonance element 4 with a fourth distance ⁇ L4 from the second resonance element 3 in the radial direction. Therefore, it is more excellent in mass productivity.
  • FIG. 3 is a graph showing the relationship between the third spacing ⁇ L3 between the second resonant element 3 and the third resonant element 4 and the resonant frequency
  • FIG. 4 shows the relationship between the second resonant element 3 and the third resonant element 4.
  • 6 is a graph showing the relationship between the third interval ⁇ L3 and the Q value
  • FIG. 5 is a graph showing the relationship between the length of the third resonant element 4 and the resonant frequency
  • FIG. 6 is a graph showing the relationship between the resonance frequency and the Q value
  • FIG. 7 is a graph showing the relationship between the resonance frequency and the Q value.
  • the inventor of the present invention has found that the third radial spacing ⁇ L3 between the second resonant element 3 and the third resonant element 4 and the length in the ⁇ Z direction in which the third resonant element 4 is surrounded by the second resonant element 3.
  • a numerical analysis using a computer was performed, and a simulation analysis was performed using a numerical analysis model simulating the resonator of the present embodiment.
  • the through holes 9 and 10 in the numerical analysis model of the resonator were omitted and the numerical analysis processing was performed.
  • the dielectric material forming the first resonant element 2 has a relative permittivity of 43 and a dielectric loss tangent of 3 ⁇ 10 ⁇ 5 .
  • the electrical conductivity of the second resonant element 3 and the third resonant element 4 was 4.2 ⁇ 10 7 S/m.
  • the dimension of the cavity 7 in the ⁇ X direction and the dimension of the ⁇ Y direction was 38 mm, and the dimension of the cavity 7 in the ⁇ Z direction was 20 mm.
  • the inner diameter of the first resonant element 2 was 11.2 mm
  • the outer diameter of the second resonant element 3 was 25.2 mm
  • the length of the first resonant element 2 in the ⁇ Z direction was 19 mm.
  • the inner diameter of the second resonant element 3 was 8 mm, the outer diameter of the second resonant element 3 was 10 mm, and the length of the second resonant element 3 in the ⁇ Z direction was 19 mm.
  • the inner diameter of the third resonant element 4 is 4 mm, the outer diameter of the third resonant element 4 is 6 mm, and the lengths of the third resonant element 4 in the ⁇ Z direction are 5 mm, 7 mm, 10 mm, 12 mm, 14 mm, 16 mm, There are seven types of 18 mm.
  • the third radial distance ⁇ L3 between the second resonant element 3 and the third resonant element 4 was changed in multiple steps such as 1.0 mm, 0.5 mm, and 0.5 mm to 2.0 mm.
  • the third distance ⁇ L3 in the radial direction between the second resonant element 3 and the third resonant element 4 is set to a constant value of 1.0 mm, and the length of the third resonant element 4 in the ⁇ Z direction is set.
  • the resonance frequency and the Q value were calculated for each length of 5 mm to 18 mm.
  • the third distance ⁇ L3 in the radial direction between the second resonant element 3 and the third resonant element 4 is set to a constant value of 0.5 mm, and the length of the third resonant element 4 in the ⁇ Z direction is set.
  • the resonance frequency and Q value were calculated for each length of 5 mm to 12 mm.
  • the Q value when the length of the third resonant element 4 is 5 mm is 3005, whereas the Q value when the maximum length is 12 mm is 2421. Therefore, it was confirmed that the shorter the length of the third resonant element 4, the higher the Q value.
  • the Q value in Table 2 in which the third interval ⁇ L3 is 0.5 mm is 3005, whereas the third interval ⁇ L3 is 1 mm.
  • Table 1 of 0.0 mm it was confirmed that the Q value was as high as 3212, and that the larger the radial distance between the second resonant element 3 and the third resonant element 4, the higher the Q value obtained.
  • the third radial spacing ⁇ L3 between the second resonant element 3 and the third resonant element 4 is 0.5 mm, 0.8 mm, 1.0 mm, 1.5 mm, 2.0 mm.
  • the length of the third resonance element 4 in the ⁇ Z direction was changed to a constant value of 12 mm. As a result, it was confirmed that, when the length of the third resonant element 4 was constant, the Q value increased as the third interval ⁇ L3 increased.
  • FIG. 8 is a sectional view schematically showing the resonator according to the second embodiment of the present disclosure.
  • the resonator of the present embodiment is provided at the bottom of the first conductor portion 5, is made of a conductor, and changes the amount of protrusion in the +Z direction from the first conductor portion 5 inside the second resonant element 3 to change the frequency. It further includes a first frequency adjuster 14 for adjusting, and a screw member 15 made of a conductive material for joining the third resonant element 4 to the second conductor portion 6.
  • the resonance frequency can be adjusted with high accuracy by adjusting the amount of protrusion of the first frequency adjuster 14 into the cavity 7.
  • the first frequency adjuster 14 functions as a tuning screw, and by adjusting the protrusion amount of the first frequency adjuster 14, the capacitive gap changes, and thus the resonance frequency can be controlled.
  • Such a resonator structure is called a re-entrant combline resonator.
  • FIG. 9 is a sectional view schematically showing a resonator according to the third embodiment of the present disclosure.
  • the resonator of the present embodiment is provided in the second conductor portion 6 and is made of a conductor.
  • the frequency is adjusted by changing the amount of protrusion in the ⁇ Z direction from the second conductor portion 6 inside the third resonant element 4. It further includes a second frequency adjuster 16 for doing so, and a screw member 17 made of a conductive material for joining the second resonant element 3 to the first conductor portion 5.
  • the resonance frequency can be adjusted with high accuracy by adjusting the amount of protrusion of the second frequency adjuster 16 into the cavity 7.
  • FIG. 10 is a cross-sectional view schematically showing the resonator according to the fourth embodiment of the present disclosure.
  • the same reference numerals are given to the portions corresponding to the above-described embodiment.
  • the second resonance element 3 has the dielectric layer 18 made of a dielectric material, and the coating layer 19 made of a conductor formed on the outer peripheral surface of the dielectric layer 18, and the -Z direction. Is joined to the first conductor portion 5 by a joining layer 20 made of a conductive material.
  • the dielectric layer 18 is made of the same material as the first resonant element 2, that is, a conductive material containing Ag alloy such as Ag, Ag—Pd, and Ag—Pt as a main component, or Cu-based, W-based, Mo-based, or Pd-based material.
  • An electrically conductive material of a system can be appropriately selected and used, and is formed as a conductive film having a thickness of, for example, 5 to 20 ⁇ m by a metallizing process. The minimum film thickness needs to be thicker than the thickness of the skin effect at the frequency used.
  • the bonding layer 20 and the first conductor portion 5 may be bonded using solder or the like. In this case, the solder functions as a conductive bonding material. By adopting such a structure, the Q value can be increased by about 40 in calculation.
  • FIG. 11 is a cross-sectional view schematically showing the resonator according to the fifth embodiment of the present disclosure.
  • the resonator of the present embodiment has a configuration in which the first frequency adjuster 14 and the screw member 15 of the embodiment shown in FIG. 8 are used, and the second resonance including the dielectric layer 18 and the coating layer 19 of the embodiment shown in FIG. The element 3 is combined.
  • the first frequency adjuster 14 functions as a tuning screw, and by adjusting the protrusion amount of the first frequency adjuster 14, the capacitive gap is reduced.
  • the resonance frequency can be adjusted accordingly.
  • FIG. 12 is a sectional view schematically showing the resonator according to the sixth embodiment of the present disclosure.
  • the same reference numerals are given to the portions corresponding to the above-described embodiment.
  • the second resonance element 3 has the dielectric layer 18 and the coating layer 19 made of a conductor formed on the outer peripheral surface of the dielectric layer 18.
  • the third resonance element 4 is configured to have the dielectric layer 21 and the coating layer 22 made of a conductor formed on the outer peripheral surface of the dielectric layer 21.
  • the second resonant element 3 and the third resonant element 4 can be realized by, for example, a cylindrical dielectric and a metal film covering the outer peripheral surface thereof.
  • the weight can be reduced and the weight can be reduced as compared with the case where the second resonant element 3 and the third resonant element 4 are made of only metal.
  • FIG. 13 is a sectional view schematically showing the resonator according to the seventh embodiment of the present disclosure.
  • the resonator of the present embodiment includes a first frequency adjuster 14 similar to that of the embodiment of FIG. 11, in addition to the configuration of the embodiment shown in FIG. Even with such a configuration, as in the above-described embodiment, by adjusting the amount of protrusion of the first frequency adjuster 14 into the cavity 7, fine adjustment of the resonance frequency is possible, and the size of the resonator can be reduced. Can be planned.
  • FIG. 14 is a sectional view schematically showing the resonator of the eighth embodiment of the present disclosure.
  • the resonator of the present embodiment is made of a conductor, and an outer peripheral surface coating layer 25 provided so as to cover at least a part of the outer peripheral surface of the first resonant element 2 in the vicinity of an end in the +Z direction, and the first resonant element 2
  • the inner peripheral surface coating layer 26 may be provided so as to cover at least a part of the inner peripheral surface near the end in the +Z direction.
  • the metal film may be formed on the outer peripheral surface and the inner peripheral surface of the cylindrical dielectric by a known film forming method, the outer peripheral surface coating layer 25 and the inner peripheral surface can be easily formed.
  • the first resonant element 2 having the surface coating layer 26 can be manufactured, and the manufacturing of the resonator can be facilitated.
  • FIG. 15 is a sectional view schematically showing the resonator according to the ninth embodiment of the present disclosure.
  • the same reference numerals are given to the portions corresponding to the above-described embodiment.
  • the end of the first resonant element 2 on the +Z direction side and the end of the third resonant element 4 on the +Z direction side are on the surface of the second conductor portion 6 facing in the ⁇ Z direction. It may be joined to the supporting portion 27 made of a dielectric material provided.
  • the support portion 27 has a plate-shaped base portion 27a and a protrusion portion 27b integrally provided on one main surface of the base portion 27a.
  • a concave portion 6a into which the protrusion 27b is fitted is formed on the one main surface side of the second conductor portion 6 which faces the cavity 7.
  • the support portion 27 in which the first resonant element 2 and the third resonant element 4 are joined by the conductive joining material is prepared, and the protrusion 27b is provided in the concave portion 6a of the second conductor portion 6. Since the support portion 27 is joined with the conductive joining material while fitting the fitting portion in the recess 6a and the assembly is joined to the first conductor portion 5, the assembling work is simplified and the manufacturing process of the resonator is facilitated. Can be converted. With such a configuration, the resonance frequency can be finely adjusted and the size of the resonator can be reduced, as in the above-described embodiment.
  • FIG. 16 is a cross-sectional view schematically showing the resonator according to the tenth embodiment of the present disclosure.
  • the portions corresponding to those in the above-described embodiments are designated by the same reference numerals.
  • the outer diameter of the second frequency adjuster 16 is larger than that of the embodiment of FIG.
  • ⁇ Filter> 17 is a cross-sectional view schematically showing the filter of the embodiment of the present disclosure
  • FIG. 18 is a perspective view of the filter shown in FIG.
  • the filter F of the present embodiment includes a plurality of resonators 30a and 30b forming a row, a first terminal portion 31 electrically or electromagnetically connected to the resonator 30a located at one end of the row, and a row of the resonators 30a and 30b.
  • the resonator 30b located at the other end has a second terminal portion 32 that is electrically or electromagnetically connected.
  • the filter is used as a filter of a microwave communication device typified by a mobile phone, that is, a filter, and passes only the frequency band required for transmission and reception and blocks the unnecessary frequency band.
  • a filter In other communication terminals, it is mainly used as an antenna duplexer such as a duplexer.
  • the filter of this embodiment has no mechanical vibration, and the electromagnetic wave itself resonates in the cavity 7. In the cavity 7, since the wavelength of the electromagnetic wave is shortened to 1/ ⁇ r ( ⁇ r: relative permittivity) of free space, the size of the resonance system can be reduced.
  • FIG. 19 is a block diagram showing a communication device in which the filters shown in FIGS. 17 and 18 are incorporated.
  • the communication device of this embodiment includes an antenna 40, a communication circuit 41, and a filter F connected to the antenna 40 and the communication circuit 41.
  • the filter F is the filter of the above-described embodiment.
  • the antenna 40 and communication circuit 41 are known and conventional.
  • the communication device of the present embodiment having such a configuration can be downsized and improve communication quality because it removes unnecessary electric signals by using the above-described filter that is small and has excellent electric characteristics. You can
  • the present disclosure can have the following embodiments.
  • the resonator of the present disclosure is a shield housing having a cavity inside, and is located on a first conductor portion located on the first direction side and on a second direction side opposite to the first direction.
  • a shield housing including a second conductor portion;
  • a first resonant element made of a tubular dielectric, wherein an end in the second direction is joined to the second conductor portion, and an end in the first direction is located apart from the first conductor portion.
  • the filter of the present disclosure is a resonator, and a plurality of resonators arranged in a row so as to be electromagnetically coupled to each other, A first terminal portion electrically or electromagnetically connected to the resonator located at one end of the row; A second terminal portion electrically or electromagnetically connected to the resonator located at the other end of the row.
  • the communication device of the present disclosure has a configuration including an antenna, a communication circuit, and the above-mentioned filter connected to the antenna and the communication circuit.
  • a small-sized resonator having excellent electric characteristics can be obtained.
  • a filter having a small size and excellent electric characteristics can be obtained.
  • the communication device of the present disclosure it is possible to obtain a small-sized communication device having excellent communication quality.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

A resonator according to the invention is provided with: a shield casing which has a cavity therein and includes a first conductor portion positioned on a −Z direction side and a second conductor portion positioned on a +Z direction side; a first resonance element which consists of a cylindrical dielectric and a +Z direction end of which is joined to the second conductor portion and a −Z direction end of which is located within the cavity in such a manner that the −Z direction end is so positioned as to be spaced from the first conductor portion; a second resonance element a −Z direction end of which is joined to the first conductor portion and a +Z direction end of which is spaced from the second conductor potion and located within the cavity in such a manner that this +Z direction end is surrounded by the first resonance element; and a third resonance element a +Z direction end of which is joined to the second conductor portion and a −Z direction end of which is spaced from the first conductor portion and located within the cavity in such a manner that this −Z direction end is surrounded by the second resonance element.

Description

共振器、フィルタおよび通信装置Resonator, filter and communication device
 本開示は、共振器、それを用いたフィルタおよび通信装置に関する。 The present disclosure relates to a resonator, a filter using the resonator, and a communication device.
 従来技術の一例は、特許文献1および2に記載されている。 An example of conventional technology is described in Patent Documents 1 and 2.
特開2011-35792号公報JP, 2011-35792, A 実開昭63-159904号公報Japanese Utility Model Publication No. 63-159904
 本開示の共振器は、内部に空洞を有するシールド筐体であって、第1方向の側に位置する第1導体部と、前記第1方向と反対方向である第2方向の側に位置する第2導体部とを含むシールド筐体と、
 筒状の誘電体から成る第1共振素子であって、前記第2方向の端が前記第2導体部に接合され、前記第1方向の端が、前記第1導体部から離間して位置するように前記空洞内に配設された第1共振素子と、
 筒状の第2共振素子であって、前記第1方向の端が前記第1導体部に接合され、前記第2方向の端が、前記第2導体部から離間し、かつ前記第1共振素子に取り囲まれるように前記空洞内に配設された第2共振素子と、
 筒状の第3共振素子であって、前記第2方向の端が前記第2導体部に接合され、前記第1方向の端が、前記第1導体部から離間し、かつ前記第2共振素子に取り囲まれるように前記空洞内に配設された第3共振素子と、を備えた構成である。
The resonator of the present disclosure is a shield housing having a cavity inside, and is located on a first conductor portion located on the first direction side and on a second direction side opposite to the first direction. A shield housing including a second conductor portion;
A first resonant element made of a tubular dielectric, wherein an end in the second direction is joined to the second conductor portion, and an end in the first direction is located apart from the first conductor portion. A first resonant element disposed in the cavity as described above,
A cylindrical second resonance element, wherein an end in the first direction is joined to the first conductor portion, an end in the second direction is separated from the second conductor portion, and the first resonance element is provided. A second resonant element disposed in the cavity so as to be surrounded by
A cylindrical third resonance element, wherein an end in the second direction is joined to the second conductor portion, an end in the first direction is separated from the first conductor portion, and the second resonance element is provided. And a third resonance element disposed in the cavity so as to be surrounded by.
 本開示のフィルタは、共振器であって、互いに電磁気的に結合するように列を成して配設された複数の共振器と、
 前記列の一方端に位置する共振器に、電気的または電磁気的に接続される第1端子部と、
 前記列の他方端に位置する共振器に、電気的または電磁気的に接続される第2端子部と、を有する構成である。
The filter of the present disclosure is a resonator, and a plurality of resonators arranged in a row so as to be electromagnetically coupled to each other,
A first terminal portion electrically or electromagnetically connected to the resonator located at one end of the row;
A second terminal portion electrically or electromagnetically connected to the resonator located at the other end of the row.
 本開示の通信装置は、アンテナと、通信回路と、前記アンテナおよび前記通信回路に接続された上述のフィルタと、を有する構成である。 The communication device of the present disclosure has a configuration including an antenna, a communication circuit, and the above-mentioned filter connected to the antenna and the communication circuit.
 本開示の目的、特色、および利点は、下記の詳細な説明と図面とからより明確になるであろう。 Objects, features, and advantages of the present disclosure will be more apparent from the following detailed description and drawings.
本開示の第1実施形態の共振器を模式的に示す断面図である。FIG. 3 is a cross-sectional view schematically showing the resonator of the first embodiment of the present disclosure. 図1に示す共振器を切断面線II-IIから見た断面図である。FIG. 2 is a cross-sectional view of the resonator shown in FIG. 1 taken along section line II-II. 第2共振素子および第3共振素子間の第3間隔ΔL3と共振周波数との関係を示すグラフである。It is a graph which shows the relationship between the 3rd space|interval (DELTA)L3 between a 2nd resonance element and a 3rd resonance element, and resonance frequency. 第2共振素子および第3共振素子間の第3間隔ΔL3とQ値との関係を示すグラフである。It is a graph which shows the 3rd space|interval (DELTA)L3 between a 2nd resonance element and a 3rd resonance element, and the relationship of Q value. 第3共振素子の長さと共振周波数との関係を示すグラフである。It is a graph which shows the relationship between the length of a 3rd resonance element, and resonance frequency. 共振周波数とQ値との関係を示すグラフである。It is a graph which shows the relationship between resonance frequency and Q value. 共振周波数とQ値との関係を示すグラフである。It is a graph which shows the relationship between resonance frequency and Q value. 本開示の第2実施形態の共振器を模式的に示す断面図である。FIG. 5 is a cross-sectional view schematically showing a resonator according to a second embodiment of the present disclosure. 本開示の第3実施形態の共振器を模式的に示す断面図である。FIG. 6 is a cross-sectional view schematically showing a resonator according to a third embodiment of the present disclosure.
本開示の第4実施形態の共振器を模式的に示す断面図である。It is sectional drawing which shows typically the resonator of 4th Embodiment of this indication. 本開示の第5実施形態の共振器を模式的に示す断面図である。It is sectional drawing which shows the resonator of 5th Embodiment of this indication typically. 本開示の第6実施形態の共振器を模式的に示す断面図である。It is sectional drawing which shows the resonator of 6th Embodiment of this indication typically. 本開示の第7実施形態の共振器を模式的に示す断面図である。It is sectional drawing which shows the resonator of 7th Embodiment of this indication typically. 本開示の第8実施形態の共振器を模式的に示す断面図である。It is sectional drawing which shows the resonator of 8th Embodiment of this indication typically. 本開示の第9実施形態の共振器を模式的に示す断面図である。It is sectional drawing which shows the resonator of 9th Embodiment of this indication typically. 本開示の第10実施形態の共振器を模式的に示す断面図である。It is sectional drawing which shows the resonator of 10th Embodiment of this indication typically. 本開示の実施形態のフィルタを模式的に示す断面図である。It is sectional drawing which shows the filter of embodiment of this indication typically. 図17に示すフィルタの斜視図である。It is a perspective view of the filter shown in FIG. 図17および図18に示すフィルタが込み組まれた通信装置を示すブロック図である。FIG. 19 is a block diagram showing a communication device in which the filters shown in FIGS. 17 and 18 are incorporated.
 まず、本開示の共振器が基礎とする構成の共振器として、一方端を接地した柱状導体をシールドケース内に収容した共振器が知られている。また、柱状誘電体をシールドケース内に収容した共振器が知られている。 First, as a resonator based on the resonator of the present disclosure, a resonator in which a columnar conductor whose one end is grounded is housed in a shield case is known. Further, a resonator in which a columnar dielectric is housed in a shield case is known.
 以下、本開示の実施形態に係る共振器、フィルタおよび通信装置について、図面を参照しつつ詳細に説明する。 Hereinafter, a resonator, a filter, and a communication device according to embodiments of the present disclosure will be described in detail with reference to the drawings.
<第1実施形態>
 図1は本開示の第1実施形態の共振器を模式的に示す断面図であり、図2は図1の切断面線II-IIから見た断面図である。なお、以下の説明において、互いに直交するX軸、Y軸、Z軸の3軸座標系を想定し、図1の右方を+X方向、図1の左方を-X方向、図1の紙面に垂直な奥行き方向を+Y方向、図1の紙面に垂直手前側を-Y方向、図1の上方を+Z方向、図3の下方を-Z方向とする。
<First Embodiment>
1 is a cross-sectional view schematically showing the resonator according to the first embodiment of the present disclosure, and FIG. 2 is a cross-sectional view taken along the section line II-II in FIG. In the following description, assuming a three-axis coordinate system of X-axis, Y-axis, and Z-axis orthogonal to each other, the right side of FIG. 1 is +X direction, the left side of FIG. 1 is −X direction, and the plane of FIG. The depth direction perpendicular to the plane is the +Y direction, the front side perpendicular to the paper surface of FIG. 1 is the −Y direction, the upper side of FIG. 1 is the +Z direction, and the lower side of FIG.
 本実施形態の共振器は、第1方向である-Z方向の側に位置する第1導体部5、および-Z方向と反対方向の第2方向である+Z方向の側に位置する第2導体部6を含み、内部に空洞7を有するシールド筐体1と、+Z方向の端が第2導体部6に接合され、-Z方向の端が、第1導体部5から離間して位置するように空洞7内に配設された、筒状の誘電体から成る第1共振素子2と、-Z方向の端が第1導体部5に接合され、+Z方向の端が、第2導体部6から離間し、かつ第1共振素子2に取り囲まれるように空洞7内に配設された筒状の第2共振素子3と、+Z方向の端が第2導体部6に接合され、-Z方向の端が、第1導体部5から離間し、かつ第2共振素子3に取り囲まれるように空洞7内に配設された筒状の第3共振素子4と、を含んで構成される。 The resonator according to the present embodiment includes the first conductor portion 5 located on the −Z direction side, which is the first direction, and the second conductor located on the +Z direction side, which is the second direction opposite to the −Z direction. The shield housing 1 including the portion 6 and having the cavity 7 therein, the end in the +Z direction is joined to the second conductor portion 6, and the end in the −Z direction is located away from the first conductor portion 5. The first resonant element 2 made of a cylindrical dielectric material disposed in the cavity 7 is joined to the first conductor portion 5 at the −Z direction end, and the second conductor portion 6 is connected at the +Z direction end. And a cylindrical second resonance element 3 which is disposed in the cavity 7 so as to be separated from the first resonance element 2 and is surrounded by the first resonance element 2, and an end in the +Z direction is joined to the second conductor portion 6, And a cylindrical third resonance element 4 disposed in the cavity 7 so as to be separated from the first conductor portion 5 and surrounded by the second resonance element 3.
 第2共振素子3は、円筒状の導体から成る。第3共振素子4は、第2共振素子3よりも小径の円筒状の導体から成る。第1共振素子2の+Z方向の端と、第2導体部6との間には、導体から成り、かつ第1共振素子2の+Z方向の端と第2導体部6とを接合する接合層8が設けられる。 The second resonant element 3 is made of a cylindrical conductor. The third resonance element 4 is made of a cylindrical conductor having a diameter smaller than that of the second resonance element 3. A bonding layer made of a conductor between the +Z direction end of the first resonant element 2 and the second conductor portion 6 and joining the +Z direction end of the first resonant element 2 and the second conductor portion 6 together. 8 are provided.
 ここで、本実施形態において、「Q値」(Quality Factor)とは、誘電損失(tanδ)の逆数(1/tanδ)で表されるエネルギ蓄積能力を示す無次元のパラメータ指数であり、この値が高いほど誘電損失が少ないことを意味する。 Here, in the present embodiment, the “Q value” (Quality Factor) is a dimensionless parameter index indicating the energy storage capacity represented by the reciprocal (1/tan δ) of the dielectric loss (tan δ), and this value Means that the higher is, the less the dielectric loss is.
 第2共振素子3および第3共振素子4を構成する導体としては、金属および非金属導電性物質などの既知の種々の導電性材料を用いて形成することができる。共振器の特性を向上させるためには、たとえば、Ag、Ag-Pd、Ag-PtなどのAg合金を主成分とする導電性材料、あるいはCu系、W系、Mo系、Pd系の導電性材料などを用いることができる。 The conductors forming the second resonant element 3 and the third resonant element 4 can be formed using various known conductive materials such as metal and non-metal conductive materials. In order to improve the characteristics of the resonator, for example, a conductive material containing an Ag alloy as a main component such as Ag, Ag—Pd, or Ag—Pt, or a Cu-based, W-based, Mo-based, or Pd-based conductive material is used. A material or the like can be used.
 シールド筐体1は、内部に共振空間としての空洞7を有する直方体の箱状の形状を有しており、基準電位に接続される。基準電位は、グランド電位、アース電位または接地電位とも呼ばれる電位をいう。シールド筐体1は、-Z方向(図1では下方)の側に位置する第1導体部5と、+Z方向(図1では上方)の側に位置する板状の第2導体部6とが、導電性接合材によって接合されて構成される。第1導体部5は、4つの側壁部と底部とによって構成され、+Z方向に開放した断面が凹状の有底筒体である。第2導体部6は、矩形の平板状の板状体である。第1導体部5の対向する2つ側壁部には、外部回路との接続に利用される貫通孔9および貫通孔10が形成される。第1導体部5の+Z方向に臨む端面には、第2導体部6の-Z方向に臨む表面の周縁部が導電性接合材によって接合され、第1導体部5の開口が第2導体部6によって塞がれている。 The shield casing 1 has a rectangular parallelepiped box shape having a cavity 7 as a resonance space inside, and is connected to a reference potential. The reference potential refers to a potential also called a ground potential, a ground potential, or a ground potential. The shield housing 1 includes a first conductor portion 5 located on the −Z direction (lower side in FIG. 1) side and a plate-shaped second conductor portion 6 located on the +Z direction (upper side in FIG. 1) side. , And are joined by a conductive joining material. The first conductor portion 5 is a bottomed tubular body that is configured by four side wall portions and a bottom portion and has a concave cross section that is open in the +Z direction. The second conductor portion 6 is a rectangular flat plate-shaped body. Through holes 9 and 10 used for connection with an external circuit are formed in the two opposing side wall parts of the first conductor part 5. A peripheral edge portion of the surface of the second conductor portion 6 facing in the −Z direction is joined to the end surface of the first conductor portion 5 facing in the +Z direction by a conductive bonding material, and the opening of the first conductor portion 5 is formed in the second conductor portion. Blocked by 6.
 第1導体部5および第2導体部6は、金属および非金属導電性物質などの既知の種々の導電性材料を用いて形成することができる。共振器の特性を向上させるためには、たとえば、Ag、Ag-Pd、Ag-PtなどのAg合金を主成分とする導電性材料、またはCu系、W系、Mo系、Pd系の導電性材料を用いることができる。 The first conductor portion 5 and the second conductor portion 6 can be formed using various known conductive materials such as metal and non-metal conductive materials. In order to improve the characteristics of the resonator, for example, a conductive material containing an Ag alloy as a main component such as Ag, Ag—Pd, or Ag—Pt, or a Cu-based, W-based, Mo-based, or Pd-based conductive material. Materials can be used.
 第1導体部5と第2導体部6とを接合する導電性接合材としては、半田や導電性接着剤など、種々の既知の導電性接合材を用いることができる。場合によっては、ねじまたはボルトによって第1導体部5と第2導体部6とを互いに電気的に接続された状態で機械的に締結して接合してもよい。空洞7内は、空気で満たされているが、真空であってもよく、空気以外の気体、たとえば不活性ガスで満たされていてもよい。 As the conductive bonding material for bonding the first conductor portion 5 and the second conductor portion 6, various known conductive bonding materials such as solder and conductive adhesive can be used. In some cases, the first conductor portion 5 and the second conductor portion 6 may be mechanically fastened and joined to each other with screws or bolts while being electrically connected to each other. Although the inside of the cavity 7 is filled with air, it may be vacuum or filled with a gas other than air, for example, an inert gas.
 第1共振素子2は、図2に示す平面視において、空洞7の中央に配置されており、Z方向に延びる円筒状の形状を有している。また、第1共振素子2は、+Z方向の端が第2導体部6に導電性接合材から成る接合層8によって接合されている。接合層13は、メタライジング(Metalizing)によって約1mmの厚さを有する。第1共振素子2の-Z方向の端と、シールド筐体1の第1導体部5の底面とは、±Z方向に第1間隔ΔL1をあけて離間している。すなわち、第1共振素子2の+Z方向の端の端面全体が第2導体部6の空洞7側の表面に接合しており、第1共振素子2の-Z方向の端の端面とシールド筐体1の第1導体部5の底面との間は、±Z方向に第1間隔ΔL1をあけて離間している。誘電体に電界を集中させると、共振周波数を下げることができるが、高次モードの共振周波数も下がってしまう。そのため、このような第1間隔ΔL1をあけて第1共振素子2とシールド筐体1とを離間させることによって、誘電体から成る第1共振素子2と金属から成るシールド筐体1との間に誘電率の低い上記の空気または不活性ガスなどで満たされた空間を介在させ、高次モードの共振周波数を高くすることができる。 The first resonant element 2 is arranged in the center of the cavity 7 in the plan view shown in FIG. 2 and has a cylindrical shape extending in the Z direction. Further, the first resonance element 2 is joined at the +Z direction end to the second conductor portion 6 by the joining layer 8 made of a conductive joining material. The bonding layer 13 has a thickness of about 1 mm by metalizing. The −Z direction end of the first resonant element 2 and the bottom surface of the first conductor portion 5 of the shield housing 1 are separated by a first distance ΔL1 in the ±Z direction. That is, the entire end surface of the first resonant element 2 in the +Z direction is joined to the surface of the second conductor portion 6 on the cavity 7 side, and the end surface of the first resonant element 2 in the −Z direction and the shield housing. The first conductor portion 5 and the bottom surface of the first conductor portion 5 are separated from each other by a first distance ΔL1 in the ±Z direction. When the electric field is concentrated on the dielectric, the resonance frequency can be lowered, but the resonance frequency of the higher mode is also lowered. Therefore, by separating the first resonant element 2 and the shield casing 1 with such a first gap ΔL1, the first resonant element 2 made of a dielectric material and the shield casing 1 made of metal are separated from each other. The resonance frequency of the higher-order mode can be increased by interposing the space filled with air or the inert gas having a low dielectric constant.
 本実施形態では、第1共振素子2は前述のように誘電体によって構成され、第2および第3共振素子3,4は導体によって構成されている。第1共振素子2、第2共振素子3および第3共振素子4は、Z軸に平行な一直線を中心軸線として同一軸線上に配設されている。すなわち、第2共振素子3は、空洞7の中央に第1共振素子2と同一軸線上に配置されており、±Z方向に平行な直線を中心線とする円筒体として実現されている。 In this embodiment, the first resonant element 2 is made of a dielectric material as described above, and the second and third resonant elements 3 and 4 are made of conductors. The first resonant element 2, the second resonant element 3, and the third resonant element 4 are arranged on the same axis with a straight line parallel to the Z axis as the central axis. That is, the second resonance element 3 is arranged in the center of the cavity 7 on the same axis as the first resonance element 2, and is realized as a cylindrical body having a straight line parallel to the ±Z directions as its center line.
 第2共振素子3の内側には、平面視において、第3共振素子4が第1共振素子2および第2共振素子3と同一軸線を成して配設されている。第2共振素子3は、第1共振素子2と半径方向に第3間隔ΔL3をあけて離間し、第1共振素子2によって取り囲まれた状態で空洞7内に配設されている。第2共振素子3の-Z方向の端の端面は、第1導体部5の底部の表面に導電性接合材によって接合されている。第2共振素子3の+Z方向の端の端面は、第2導体部6の+Z方向に臨む表面から+Z方向に第2間隔ΔL2をあけて離間している。第2共振素子3の外周面と第1共振素子2の内周面とは、半径方向に第3間隔ΔL3をあけて離間している。 Inside the second resonant element 3, the third resonant element 4 is arranged so as to form the same axis as the first resonant element 2 and the second resonant element 3 in a plan view. The second resonant element 3 is spaced apart from the first resonant element 2 by a third distance ΔL3 in the radial direction, and is disposed in the cavity 7 while being surrounded by the first resonant element 2. The end face of the −Z direction end of the second resonant element 3 is joined to the surface of the bottom of the first conductor portion 5 by a conductive joining material. The end face of the +Z direction end of the second resonant element 3 is separated from the surface of the second conductor portion 6 facing the +Z direction with a second gap ΔL2 in the +Z direction. The outer peripheral surface of the second resonant element 3 and the inner peripheral surface of the first resonant element 2 are spaced apart by a third distance ΔL3 in the radial direction.
 第3共振素子4の+Z方向の端の端面は、第2導体部6の-Z方向に臨む表面に導電性接合材によって接合され、第3共振素子4の-Z方向の端の端面は、第2共振素子3の+Z方向の端の端面よりも-Z方向に延び、第2共振素子3内に挿入している。第3共振素子4の外周面は、第2共振素子3の内周面から半径方向に第4間隔ΔL4をあけて離間しており、Z軸を含むX-Z平面において、Z方向に距離L1だけ第2共振素子3と重なるように配設されている。 The end surface of the +Z direction end of the third resonant element 4 is joined to the surface of the second conductor portion 6 facing the −Z direction by a conductive bonding material, and the end surface of the −Z direction end of the third resonant element 4 is The second resonance element 3 extends in the −Z direction from the end surface of the +Z direction end and is inserted into the second resonance element 3. The outer peripheral surface of the third resonant element 4 is spaced apart from the inner peripheral surface of the second resonant element 3 by a fourth distance ΔL4 in the radial direction, and in the XZ plane including the Z axis, the distance L1 in the Z direction. However, it is disposed so as to overlap the second resonant element 3.
 このような第2間隔ΔL2によって、第2共振素子3と第2導体部6との間の空間が、電磁エネルギの蓄積容量として働く誘電性ギャップとなり、第2間隔ΔL2を調整することによって、共振周波数およびQ値を制御することができる。また、第3間隔ΔL3によって、第1共振素子2と第2共振素子3との間の空間が電界エネルギの蓄積容量として働く容量性ギャップとなり、第3間隔ΔL3を調整することによって、共振周波数およびQ値を制御することができる。さらに、第4間隔ΔL4によって、第2共振素子3と第3共振素子4との間の空間が電磁エネルギの蓄積容量として働く誘電性ギャップとなり、第4間隔ΔL4を調整することによって、共振周波数およびQ値を制御することができる。 With such a second spacing ΔL2, the space between the second resonant element 3 and the second conductor portion 6 serves as a dielectric gap that acts as a storage capacitor for electromagnetic energy, and the resonance is adjusted by adjusting the second spacing ΔL2. The frequency and Q factor can be controlled. In addition, the space between the first resonant element 2 and the second resonant element 3 becomes a capacitive gap that acts as a storage capacitance of electric field energy by the third interval ΔL3, and by adjusting the third interval ΔL3, the resonance frequency and The Q value can be controlled. Further, due to the fourth spacing ΔL4, the space between the second resonant element 3 and the third resonant element 4 serves as a dielectric gap that acts as a storage capacity for electromagnetic energy, and by adjusting the fourth spacing ΔL4, the resonance frequency and The Q value can be controlled.
 本実施形態の第2共振素子3および第3共振素子4は、金属や非金属導電性物質のような既知の種々の導電性材料を用いて形成することができる。共振器の特性を向上させるためには、たとえば、Ag、Ag-Pd、Ag-PtなどのAg合金を主成分とする導電性材料、またはCu系、W系、Mo系、Pd系の導電性材料などを適宜選択して用いることができる。 The second resonant element 3 and the third resonant element 4 of the present embodiment can be formed using various known conductive materials such as metal and non-metal conductive materials. In order to improve the characteristics of the resonator, for example, a conductive material containing an Ag alloy as a main component such as Ag, Ag—Pd, or Ag—Pt, or a Cu-based, W-based, Mo-based, or Pd-based conductive material. Materials and the like can be appropriately selected and used.
 第1共振素子2のZ方向の長さは、空洞7の±Z方向の寸法の80%以上であってもよく、空洞7の±Z方向の寸法の90%以上であってもよい。また、第2共振素子3は、±Z方向の長さの半分以上の部分が第1共振素子2によって囲まれていてもよい。第2共振素子3における第1共振素子2に囲まれている部分のZ方向の長さは、第1共振素子2のZ方向の長さの50%以上であってもよい。さらに電気特性を向上するという観点からは、上記比率は80%以上であってもよい。90%以上とすれば、さらに電気特性が向上する。この理由としては、本共振モードの原理として、第2共振素子3と第3共振素子4の偶モードと奇モードとの結合を利用しているためである。この場合、第3共振素子4の第2共振素子3によって囲まれている±Z方向の長さの比率が大きいほど、偶モードと奇モードとの結合が強くなり、偶奇モードの共振周波数が離れる。それに加えて、第1共振素子2の誘電体の体積によって、より共振周波数を下げることができる。このため、第1共振素子2と第2共振素子3との±Z方向の長さの比率は、ある程度大きいことが重要である。空洞7の大きさ、第1共振素子2の直径、第1共振素子2と第2共振素子3との第4間隔ΔL4、第1共振素子2の厚さおよび第2共振素子3の厚さは、所望するサイズ、基本モード共振の共振周波数および高次モード共振の共振周波数に応じて適宜設定される。このような共振器は、TEM(Transverse Electric and Magnetic)モードに類似した共振モードを有する共振器として機能する。 The length of the first resonant element 2 in the Z direction may be 80% or more of the size of the cavity 7 in the ±Z direction, or 90% or more of the size of the cavity 7 in the ±Z direction. The second resonant element 3 may be surrounded by the first resonant element 2 at a portion that is half the length in the ±Z direction or more. The Z-direction length of the portion of the second resonance element 3 surrounded by the first resonance element 2 may be 50% or more of the Z-direction length of the first resonance element 2. From the viewpoint of further improving the electrical characteristics, the above ratio may be 80% or more. If it is 90% or more, the electrical characteristics are further improved. This is because, as the principle of this resonance mode, the coupling between the even mode and the odd mode of the second resonance element 3 and the third resonance element 4 is used. In this case, the larger the ratio of the lengths of the third resonance element 4 surrounded by the second resonance element 3 in the ±Z direction, the stronger the coupling between the even mode and the odd mode, and the further the resonance frequency of the even and odd mode becomes apart. .. In addition, the volume of the dielectric of the first resonant element 2 can further reduce the resonant frequency. Therefore, it is important that the ratio of the lengths of the first resonant element 2 and the second resonant element 3 in the ±Z direction is large to some extent. The size of the cavity 7, the diameter of the first resonant element 2, the fourth distance ΔL4 between the first resonant element 2 and the second resonant element 3, the thickness of the first resonant element 2 and the thickness of the second resonant element 3 are , The desired size, the resonance frequency of the fundamental mode resonance, and the resonance frequency of the higher order mode resonance. Such a resonator functions as a resonator having a resonance mode similar to a TEM (Transverse Electric and Magnetic) mode.
 第1共振素子2は、第2導体部6との接合部28の気孔面積率が軸方向(図1に示す例では、±Z方向)中央部の気孔面積率より低くてもよい。 In the first resonant element 2, the pore area ratio of the joint portion 28 with the second conductor portion 6 may be lower than the pore area ratio of the central portion in the axial direction (±Z direction in the example shown in FIG. 1).
 このような構成であると、共振に伴って第1共振素子2で発生した熱の第2導体部6への伝達が促進されるため、発熱による共振器の特性(例えば、共振周波数、Q値)への悪影響を低減することができる。 With such a configuration, the transfer of heat generated in the first resonant element 2 to the second conductor portion 6 due to resonance is promoted, so that the characteristics of the resonator due to heat generation (for example, resonance frequency, Q value). ) Can be reduced.
 例えば、軸方向(図1に示す例では、±Z方向)中央部の気孔面積率は、3%以下であって、第2導体部6との接合部28の気孔面積率との差は、0.1%以上である。 For example, the pore area ratio at the central portion in the axial direction (±Z direction in the example shown in FIG. 1) is 3% or less, and the difference from the pore area ratio of the joint portion 28 with the second conductor portion 6 is: It is 0.1% or more.
 第2導体部6との接合部28とは、第1共振素子2の±Z方向の全長に対して、第2導体部6側の端面からーZ方向に長さ10%以内の領域をいい、軸方向中央部とは、両端面間の中央に位置する仮想平面から+Z方向に長さ10%以内の領域および-Z方向に長さ10%以内の領域をいう。 The joint portion 28 with the second conductor portion 6 refers to a region within a length of 10% in the −Z direction from the end face on the second conductor portion 6 side with respect to the entire length of the first resonant element 2 in the ±Z direction. The central portion in the axial direction refers to an area within 10% in the +Z direction and within 10% in the −Z direction from an imaginary plane located at the center between the end surfaces.
 第1共振素子2は、内周側表層部の気孔面積率および外周側表層部の気孔面積率が内周側表層部と外周側表層部との間に位置する中間部の気孔面積率より高くてもよい。 In the first resonant element 2, the pore area ratio of the inner peripheral surface layer portion and the outer peripheral surface layer portion are higher than the pore area ratio of the intermediate portion located between the inner peripheral surface layer portion and the outer peripheral surface layer portion. May be.
 このような構成であると、第1共振素子2の外周面や内周面に被覆層(後述する外周面被覆層および内周面被覆層)を形成する場合、中間部は高い特性を維持しつつ、内周側表層部および外周側表層部は、被覆層に対するアンカー効果が高くなり、発熱が繰り返し生じても信頼性を維持することができる。外周面や内周面に被覆層を形成して、気孔内に微小空隙が残った場合には残留応力を緩和することもできる。 With such a configuration, when a coating layer (an outer peripheral surface coating layer and an inner peripheral surface coating layer described later) is formed on the outer peripheral surface or the inner peripheral surface of the first resonant element 2, the intermediate portion maintains high characteristics. On the other hand, the inner peripheral surface layer portion and the outer peripheral surface layer portion have a high anchor effect on the coating layer, and reliability can be maintained even if heat is repeatedly generated. It is also possible to form a coating layer on the outer peripheral surface and the inner peripheral surface to relieve the residual stress when minute voids remain in the pores.
 例えば、中間部の気孔面積率は、1.5%以下であって、内周側表層部の気孔面積率および外周側表層部の気孔面積率との差は、0.1%~1%である。 For example, the pore area ratio of the middle portion is 1.5% or less, and the difference between the pore area ratio of the inner peripheral surface layer portion and the outer peripheral surface layer portion is 0.1% to 1%. is there.
 内周側表層部とは、第1共振素子2の肉厚に対して、内周面から厚み方向に10%以内の領域、外周側表層部とは、第1共振素子2の肉厚に対して、外周面から厚み方向に10%以内の領域をいう。中間部は、内周面と外周面との間に位置する仮想円周面から内周面に向かって厚み10%以内の領域および外周面に向かって長さ10%以内の領域をいう。 The inner peripheral side surface layer portion is a region within 10% in the thickness direction from the inner peripheral surface with respect to the wall thickness of the first resonant element 2, and the outer peripheral side surface layer portion is relative to the wall thickness of the first resonant element 2. The area within 10% from the outer peripheral surface in the thickness direction. The intermediate portion refers to an area having a thickness of 10% or less from the virtual circumferential surface located between the inner peripheral surface and the outer peripheral surface toward the inner peripheral surface and a length of 10% or less toward the outer peripheral surface.
 上記各領域における気孔面積率は、画像解析ソフト「A像くん」(ver2.52)」(登録商標、旭化成エンジニアリング(株)製)を用いて求めればよい。 The porosity area ratio in each of the above areas may be obtained using the image analysis software “A image-kun” (ver2.52) (registered trademark, manufactured by Asahi Kasei Engineering Co., Ltd.).
 具体的には、まず、測定対象面を得るために、平均粒径D50が3μmのダイヤモンド砥粒を用いて第1共振素子2の端面、外周面、内周面、軸方向中央部の断面および中間部の断面をそれぞれ銅盤にて研磨する。その後、平均粒径D50が0.5μmのダイヤモンド砥粒を用いて錫盤にて研磨することにより測定対象面を得る。ここで測定対象面の算術平均粗さRaは、例えば、0.01μm~0.2μmである。 Specifically, first, in order to obtain a surface to be measured, a cross section of the end face, the outer peripheral face, the inner peripheral face, and the central portion in the axial direction of the first resonant element 2 is used by using diamond abrasive grains having an average particle diameter D 50 of 3 μm. And the cross section of the intermediate part is polished with a copper plate. Then, the surface to be measured is obtained by polishing with a tin plate using diamond abrasive grains having an average particle diameter D 50 of 0.5 μm. Here, the arithmetic mean roughness Ra of the surface to be measured is, for example, 0.01 μm to 0.2 μm.
 測定対象面を200倍の倍率で観察し、平均的な範囲を選択して、例えば、面積が0.105mm(横方向の長さが374μm、縦方向の長さが280μm)となる範囲をCCDカメラで撮影して、観察像を得る。この観察像を対象として、画像解析ソフト「A像くん(ver2.52)」を用いて粒子解析という手法で気孔面積率を求めればよい。 The surface to be measured is observed at a magnification of 200, and an average range is selected. For example, a range having an area of 0.105 mm 2 (horizontal length 374 μm, vertical length 280 μm) is selected. Take an image with a CCD camera to obtain an observation image. For this observation image, the pore area ratio may be obtained by a method called particle analysis using the image analysis software “A image kun (ver2.52)”.
 この手法の設定条件としては、例えば、画像の明暗を示す指標であるしきい値を86、明度を暗、小図形除去面積を1μm、雑音除去フィルタを有とすればよい。観察像の明るさに応じて、しきい値を調整してもよい。明度を暗とし、2値化の方法を手動とし、小図形除去面積を1μmおよび雑音除去フィルタを有とした上で、観察像に現れるマーカーが気孔の形状と一致するように、しきい値を調整すればよい。 As a setting condition of this method, for example, a threshold value, which is an index showing the brightness of an image, is 86, brightness is dark, a small figure removal area is 1 μm 2 , and a noise removal filter is provided. The threshold value may be adjusted according to the brightness of the observed image. The brightness was set to dark, the binarization method was set to manual, the small figure removal area was set to 1 μm 2 and a noise removal filter was provided, and the threshold value was set so that the marker appearing in the observed image matches the shape of the pores. Should be adjusted.
 第1共振素子2の誘電体材料としては、誘電体セラミックスなどの既知の誘電体材料を用いることができる。たとえば、希土類元素(Ln)、Al、M(MはCaおよびSrの少なくともいずれか)およびTiを含む酸化物、BaTi12Zn34、BaTiO、PbFeNb12、TiOなどを含有する強誘電性セラミックスを好適に用いることができる。希土類元素(Ln)、Al、M(MはCaおよびSrの少なくともいずれか)およびTiを含む酸化物を誘電体セラミックスとして用いる場合、組成式をaLn・bAl・cMO・dTiO(但し、3≦x≦4)と表したとき、a、b、c、dが、
0.056≦a≦0.214                 …(1)
0.056≦b≦0.214                 …(2)
0.286≦c≦0.500                 …(3)
0.230<d<0.470                 …(4)
a+b+c+d=1                     …(5)
を満足し、結晶系が六方晶および斜方晶の少なくともいずれかの結晶を80体積%以上有する酸化物からなり、Alの酸化物の少なくとも一部がβ-Alおよびθ-Alの少なくともいずれかの結晶相として存在するとともに、β-Alおよびθ-Alの少なくともいずれかの結晶相を1/100000~3体積%含んでいるとよい。
As the dielectric material of the first resonant element 2, a known dielectric material such as dielectric ceramics can be used. For example, an oxide containing a rare earth element (Ln), Al, M (M is at least one of Ca and Sr) and Ti, Ba 3 Ti 12 Zn 7 O 34 , BaTiO 3 , Pb 4 Fe 2 Nb 2 O 12 , Ferroelectric ceramics containing TiO 2 or the like can be preferably used. When an oxide containing a rare earth element (Ln), Al, M (M is at least one of Ca and Sr) and Ti is used as the dielectric ceramic, the composition formula is aLn 2 O x ·bAl 2 O 3 ·cMO ·dTiO 3. 2 (where 3≦x≦4), a, b, c and d are
0.056≦a≦0.214 (1)
0.056≦b≦0.214 (2)
0.286≦c≦0.500 (3)
0.230<d<0.470 (4)
a+b+c+d=1 (5)
Satisfying the above condition, the crystal system is an oxide having at least one of hexagonal crystal and orthorhombic crystal of 80% by volume or more, and at least a part of the oxide of Al is β-Al 2 O 3 and θ-Al 2 with present as at least one of the crystalline phases of O 3, may beta-Al 2 O 3 and θ-Al 2 O 3 of which at least one crystalline phase 1 / 100,000 include 1-3% by volume.
 このような構成であると、高周波領域で高い比誘電率εrおよび高いQ値を兼ね備えた第1共振素子2とすることができる。 With such a configuration, the first resonant element 2 having a high relative permittivity εr and a high Q value in a high frequency region can be obtained.
 β-Alおよびθ-Alの結晶の存在、各結晶の結晶系の同定は、上記誘電体セラミックスをイオンシニング装置(例えば、Technoorg Linda製)を用いて加工した後、透過電子顕微鏡による観察、制限視野電子回折像による解析、エネルギ-分散型X線分光分析(EDS分析)による測定、微小X線回折法などによる測定等により行えばよい。 The existence of β-Al 2 O 3 and θ-Al 2 O 3 crystals, and the identification of the crystal system of each crystal, were carried out by processing the above dielectric ceramics using an ion thinning device (for example, manufactured by Technoorg Linda), It may be performed by observation with a transmission electron microscope, analysis with a selected area electron diffraction image, measurement with energy-dispersive X-ray spectroscopy (EDS analysis), measurement with a minute X-ray diffraction method, or the like.
 BaTi12Zn34を含む誘電体セラミックスとして用いる場合、BaTi12Zn34を主成分とし、BaTiおよびBaTi12Zn34の少なくともいずれかを含んでいるとよい。 When used as a dielectric ceramic containing Ba 3 Ti 12 Zn 7 O 34 , it contains Ba 3 Ti 12 Zn 7 O 34 as a main component and contains at least one of BaTi 4 O 9 and Ba 3 Ti 12 Zn 7 O 34. I hope you are there.
 このような構成の場合も、高周波領域で高い比誘電率εrおよび高いQ値を兼ね備えた第1共振素子2とすることができる。 Also in the case of such a configuration, the first resonant element 2 having a high relative permittivity εr and a high Q value in a high frequency region can be obtained.
 BaTi12Zn34、BaTiおよびBaTi12Zn34の同定は、X線回折法を用いて行い、最も多い成分である主成分は、リートベルト法を用いて特定すればよい。 Ba 3 Ti 12 Zn 7 O 34 , BaTi 4 O 9 and Ba 3 Ti 12 Zn 7 O 34 were identified by an X-ray diffraction method, and the Rietveld method was used as the main component, which was the most abundant component. Just specify.
場合によっては、エポキシ樹脂などの樹脂を用いることもできる。第1共振素子2とシールド筐体1とは、接合層13によって接合される。接合層13の導電性接合材としては、たとえば導電性接着剤のような種々の既知の導電性接合材を用いることができる。 In some cases, a resin such as an epoxy resin can be used. The first resonant element 2 and the shield housing 1 are joined by the joining layer 13. As the conductive bonding material of the bonding layer 13, various known conductive bonding materials such as a conductive adhesive can be used.
 前述の特許文献1などに記載される本開示の共振器が基礎とする構成の共振器は、小型化が困難であるという問題がある。そして、シールドケースの内側の全体に誘電体を充填することによって小型化すると、高次モード共振の共振周波数が大きく低下して基本モード共振の共振周波数に近接し、電気特性が悪化するという問題がある。また、第1共振素子としての柱状導体の開放端とシールドケースとの間に誘電体を配置して小型化すると、Q値が大きく低下して電気特性が悪化するという問題がある。 The resonator having a configuration based on the resonator of the present disclosure described in the above-mentioned Patent Document 1 and the like has a problem that miniaturization is difficult. When the size is reduced by filling the entire inside of the shield case with a dielectric material, the resonance frequency of higher-order mode resonance is greatly reduced and approaches the resonance frequency of fundamental-mode resonance, which causes a problem that electrical characteristics deteriorate. is there. Further, when a dielectric is arranged between the open end of the columnar conductor as the first resonance element and the shield case to reduce the size, there is a problem that the Q value is greatly reduced and the electrical characteristics are deteriorated.
 このような本開示の共振器が基礎とする構成の共振器に対し、前述の本実施形態の共振器は、特許文献1などの本開示の共振器が基礎とする構成の共振器よりも小型化することができ、特許文献1などの本開示の共振器が基礎とする構成の共振器のシールドケースの内側全体に誘電体を充填したものよりも高次モード共振の共振周波数の低下を抑制でき、さらに特許文献1などの本開示の共振器が基礎とする構成の共振器の柱状導体の開放端とシールドケースとの間に誘電体を配置したものよりも、Q値の低下を抑制することができる。すなわち、本実施形態の共振器は、基本モード共振の共振周波数と高次モード共振の共振周波数との差が大きく、Q値が高い、優れた電気特性を有しているとともに小型である。すなわち、本実施形態の共振器は、小型で電気特性が優れている。 In contrast to such a resonator based on the resonator of the present disclosure, the resonator of the present embodiment described above is smaller than the resonator based on the resonator of the present disclosure such as Patent Document 1. And the reduction of the resonance frequency of higher-order mode resonance is suppressed as compared with a resonator having a configuration based on the resonator of the present disclosure such as Patent Document 1 filled with a dielectric inside the shield case. Further, it is possible to suppress a decrease in Q value more than a case where a dielectric is arranged between the open end of the columnar conductor of the resonator having a configuration based on the resonator of the present disclosure such as Patent Document 1 and the shield case. be able to. That is, the resonator of the present embodiment has a large difference between the resonance frequency of the fundamental mode resonance and the resonance frequency of the higher order mode resonance, has a high Q value, has excellent electrical characteristics, and is small in size. That is, the resonator of this embodiment is small and has excellent electric characteristics.
 また、上述した構成を有する本実施形態の共振器は、たとえば、以下のようにして作製することができる。まず、第1共振素子2および第3共振素子4の+Z方向の端を第2導体部6に接合した構造体を作製する。また、第2共振素子3の+Z方向の端を第1導体部5に接合した構造体を作製する。そして、第1共振素子2および第3共振素子4が第2共振素子3の内側に位置するように、上記の第1導体部5と第2導体部6とを接合することによって、本実施形態の共振器を製造することができる。よって、第1共振素子2および第3共振素子4の+Z方向の端が第2導体部6に確実に接合され、第2共振素子3の+Z方向の端が第1導体部5に確実に接合された、信頼性が高い共振器を、容易に製造することができる。 Further, the resonator of the present embodiment having the above-mentioned configuration can be manufactured, for example, as follows. First, a structure in which the +Z direction ends of the first resonance element 2 and the third resonance element 4 are joined to the second conductor portion 6 is produced. In addition, a structure in which the +Z direction end of the second resonant element 3 is joined to the first conductor portion 5 is manufactured. Then, by joining the first conductor portion 5 and the second conductor portion 6 so that the first resonant element 2 and the third resonant element 4 are located inside the second resonant element 3, the present embodiment Can be manufactured. Therefore, the +Z-direction ends of the first resonance element 2 and the third resonance element 4 are reliably bonded to the second conductor portion 6, and the +Z-direction ends of the second resonance element 3 are reliably bonded to the first conductor portion 5. It is possible to easily manufacture a resonator having high reliability.
 また、本実施形態の共振器では、第2共振素子3および第3共振素子4が筒状の形状を有している。よって、単純な形状を有する1つの第1共振素子2によって、第2共振素子3から半径方向に第4間隔ΔL4をあけて第2共振素子3および第3共振素子4の周囲を取り囲むことができるので、さらに量産性に優れている。 Further, in the resonator of the present embodiment, the second resonant element 3 and the third resonant element 4 have a tubular shape. Therefore, the single first resonance element 2 having a simple shape can surround the second resonance element 3 and the third resonance element 4 with a fourth distance ΔL4 from the second resonance element 3 in the radial direction. Therefore, it is more excellent in mass productivity.
 図3は第2共振素子3および第3共振素子4の間の第3間隔ΔL3と共振周波数との関係を示すグラフであり、図4は第2共振素子3および第3共振素子4の間の第3間隔ΔL3とQ値との関係を示すグラフであり、図5は第3共振素子4の長さと共振周波数との関係を示すグラフである。図6は共振周波数とQ値との関係を示すグラフであり、図7は共振周波数とQ値との関係を示すグラフである。 FIG. 3 is a graph showing the relationship between the third spacing ΔL3 between the second resonant element 3 and the third resonant element 4 and the resonant frequency, and FIG. 4 shows the relationship between the second resonant element 3 and the third resonant element 4. 6 is a graph showing the relationship between the third interval ΔL3 and the Q value, and FIG. 5 is a graph showing the relationship between the length of the third resonant element 4 and the resonant frequency. FIG. 6 is a graph showing the relationship between the resonance frequency and the Q value, and FIG. 7 is a graph showing the relationship between the resonance frequency and the Q value.
 本件発明者は、第2共振素子3と第3共振素子4との間の半径方向の第3間隔ΔL3および第3共振素子4が第2共振素子3によって囲まれている±Z方向の長さに対する共振器の電気特性を確認するため、コンピュータを用いた数値解析によって、本実施形態の共振器を模擬した数値解析モデルによってシミュレーション解析を行なった。なお、このシミュレーション解析を行なうに際して、共振器の数値解析モデルにおける貫通孔9,10は省略して数値解析処理を行った。 The inventor of the present invention has found that the third radial spacing ΔL3 between the second resonant element 3 and the third resonant element 4 and the length in the ±Z direction in which the third resonant element 4 is surrounded by the second resonant element 3. In order to confirm the electrical characteristics of the resonator with respect to, a numerical analysis using a computer was performed, and a simulation analysis was performed using a numerical analysis model simulating the resonator of the present embodiment. In performing this simulation analysis, the through holes 9 and 10 in the numerical analysis model of the resonator were omitted and the numerical analysis processing was performed.
 数値解析モデルにおいて、第1共振素子2を構成する誘電体は、比誘電率を43とし、誘電正接を3×10-5とした。第2共振素子3および第3共振素子4の導電率は、4.2×10S/mとした。空洞7の±X方向の寸法および±Y方向の寸法は38mmとし、空洞7の±Z方向の寸法は20mmとした。第1共振素子2の内径は11.2mmとし、第2共振素子3の外径は25.2mmとし、第1共振素子2の±Z方向の長さは19mmとした。第2共振素子3の内径は8mmとし、第2共振素子3の外径は10mmとし、第2共振素子3の±Z方向に長さの長さは19mmとした。また、第3共振素子4の内径は4mmとし、第3共振素子4の外径は6mmとし、第3共振素子4の±Z方向の長さは5mm、7mm、10mm、12mm、14mm、16mm、18mmの7種類とした。第2共振素子3と第3共振素子4との間の半径方向の第3間隔ΔL3は、1.0mm、0.5mm、0.5mm~2.0mmのように多段階的に変化させた。 In the numerical analysis model, the dielectric material forming the first resonant element 2 has a relative permittivity of 43 and a dielectric loss tangent of 3×10 −5 . The electrical conductivity of the second resonant element 3 and the third resonant element 4 was 4.2×10 7 S/m. The dimension of the cavity 7 in the ±X direction and the dimension of the ±Y direction was 38 mm, and the dimension of the cavity 7 in the ±Z direction was 20 mm. The inner diameter of the first resonant element 2 was 11.2 mm, the outer diameter of the second resonant element 3 was 25.2 mm, and the length of the first resonant element 2 in the ±Z direction was 19 mm. The inner diameter of the second resonant element 3 was 8 mm, the outer diameter of the second resonant element 3 was 10 mm, and the length of the second resonant element 3 in the ±Z direction was 19 mm. The inner diameter of the third resonant element 4 is 4 mm, the outer diameter of the third resonant element 4 is 6 mm, and the lengths of the third resonant element 4 in the ±Z direction are 5 mm, 7 mm, 10 mm, 12 mm, 14 mm, 16 mm, There are seven types of 18 mm. The third radial distance ΔL3 between the second resonant element 3 and the third resonant element 4 was changed in multiple steps such as 1.0 mm, 0.5 mm, and 0.5 mm to 2.0 mm.
 シミュレーションの結果を、以下の表1、表2、表3に示す。
Figure JPOXMLDOC01-appb-T000001
The results of the simulation are shown in Table 1, Table 2 and Table 3 below.
Figure JPOXMLDOC01-appb-T000001
 表1に示すように、第2共振素子3と第3共振素子4との間の半径方向の第3間隔ΔL3を1.0mmの一定値とし、第3共振素子4の±Z方向の長さを、5mm、7mm、10mm、12mm、14mm、16mm、18mmのそれぞれに変化させ、各長さ5mm~18mmのそれぞれについて共振周波数およびQ値を算出した。その結果、第2共振素子3と第3共振素子4との間の半径方向の第3間隔ΔL3が一定であるとき、第3共振素子4の±Z方向の長さが短いほど、高いQ値が得られることが確認された。 As shown in Table 1, the third distance ΔL3 in the radial direction between the second resonant element 3 and the third resonant element 4 is set to a constant value of 1.0 mm, and the length of the third resonant element 4 in the ±Z direction is set. Was changed to 5 mm, 7 mm, 10 mm, 12 mm, 14 mm, 16 mm, and 18 mm, and the resonance frequency and the Q value were calculated for each length of 5 mm to 18 mm. As a result, when the radial third spacing ΔL3 between the second resonant element 3 and the third resonant element 4 is constant, the shorter the length of the third resonant element 4 in the ±Z direction, the higher the Q value. It was confirmed that
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
 表2に示すように、第2共振素子3と第3共振素子4との間の半径方向の第3間隔ΔL3を0.5mmの一定値とし、第3共振素子4の±Z方向の長さを、5mm、7mm、10mm、12mmのそれぞれに変化させ、各長さ5mm~12mmのそれぞれについて共振周波数およびQ値を算出した。その結果、第3共振素子4の長さが5mmのQ値は3005であるのに対し、最長の長さ12mmした場合のQ値は2421である。したがって第3共振素子4の長さは短いほどQ値は高くなることが確認された。また、第3共振素子が上記の表1および表2において同一の5mmの場合、第3間隔ΔL3を0.5mmとした表2のQ値が3005であるのに対し、第3間隔ΔL3が1.0mmの表1では、Q値が3212と高く、第2共振素子3と第3共振素子4との間の半径方向の間隔が大きいほど、高いQ値が得られることが確認された。 As shown in Table 2, the third distance ΔL3 in the radial direction between the second resonant element 3 and the third resonant element 4 is set to a constant value of 0.5 mm, and the length of the third resonant element 4 in the ±Z direction is set. Was changed to 5 mm, 7 mm, 10 mm, and 12 mm, and the resonance frequency and Q value were calculated for each length of 5 mm to 12 mm. As a result, the Q value when the length of the third resonant element 4 is 5 mm is 3005, whereas the Q value when the maximum length is 12 mm is 2421. Therefore, it was confirmed that the shorter the length of the third resonant element 4, the higher the Q value. When the third resonant element has the same 5 mm in Table 1 and Table 2 described above, the Q value in Table 2 in which the third interval ΔL3 is 0.5 mm is 3005, whereas the third interval ΔL3 is 1 mm. In Table 1 of 0.0 mm, it was confirmed that the Q value was as high as 3212, and that the larger the radial distance between the second resonant element 3 and the third resonant element 4, the higher the Q value obtained.
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
 表3に示すように、第2共振素子3と第3共振素子4との間の半径方向の第3間隔ΔL3を0.5mm、0.8mm、1.0mm、1.5mm、2.0mmのそれぞれに変化させ、第3共振素子4の±Z方向の長さは12mmの一定値とした。その結果、第3共振素子4の長さを一定とした場合、第3間隔ΔL3が大きいほど、Q値も高くなることが確認された。 As shown in Table 3, the third radial spacing ΔL3 between the second resonant element 3 and the third resonant element 4 is 0.5 mm, 0.8 mm, 1.0 mm, 1.5 mm, 2.0 mm. The length of the third resonance element 4 in the ±Z direction was changed to a constant value of 12 mm. As a result, it was confirmed that, when the length of the third resonant element 4 was constant, the Q value increased as the third interval ΔL3 increased.
<第2実施形態>
 図8は本開示の第2実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、第1導体部5の底部に設けられ、導体から成り、第2共振素子3の内側で第1導体部5からの+Z方向の突出量を変化させることによって周波数を調整するための第1周波数調整具14と、第2導体部6に第3共振素子4を接合する導電性材料から成るねじ部材15とを、さらに含む。このような第1周波数調整具14の空洞7への突出量を調整することによって、共振周波数を高精度で調整することができる。第1周波数調整具14は、チューニングねじとして機能し、第1周波数調整具14の突出量を調整することによって、容量性ギャップが変化し、よって共振周波数を制御することができる。このような共振器構造は、リエントラント(re-entrant)コムライン共振器と呼ばれる。
<Second Embodiment>
FIG. 8 is a sectional view schematically showing the resonator according to the second embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. The resonator of the present embodiment is provided at the bottom of the first conductor portion 5, is made of a conductor, and changes the amount of protrusion in the +Z direction from the first conductor portion 5 inside the second resonant element 3 to change the frequency. It further includes a first frequency adjuster 14 for adjusting, and a screw member 15 made of a conductive material for joining the third resonant element 4 to the second conductor portion 6. The resonance frequency can be adjusted with high accuracy by adjusting the amount of protrusion of the first frequency adjuster 14 into the cavity 7. The first frequency adjuster 14 functions as a tuning screw, and by adjusting the protrusion amount of the first frequency adjuster 14, the capacitive gap changes, and thus the resonance frequency can be controlled. Such a resonator structure is called a re-entrant combline resonator.
<第3実施形態>
 図9は本開示の第3実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、第2導体部6に設けられ、導体から成り、第3共振素子4の内側で第2導体部6からの-Z方向の突出量を変化させることによって周波数を調整するための第2周波数調整具16と、第1導体部5に第2共振素子3を接合する導電性材料から成るねじ部材17とを、さらに含む。このような第2周波数調整具16の空洞7への突出量を調整することによって、共振周波数を高精度で調整することができる。
<Third Embodiment>
FIG. 9 is a sectional view schematically showing a resonator according to the third embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. The resonator of the present embodiment is provided in the second conductor portion 6 and is made of a conductor. The frequency is adjusted by changing the amount of protrusion in the −Z direction from the second conductor portion 6 inside the third resonant element 4. It further includes a second frequency adjuster 16 for doing so, and a screw member 17 made of a conductive material for joining the second resonant element 3 to the first conductor portion 5. The resonance frequency can be adjusted with high accuracy by adjusting the amount of protrusion of the second frequency adjuster 16 into the cavity 7.
<第4実施形態>
 図10は本開示の第4実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、第2共振素子3が、誘電体から成る誘電体層18と、誘電体層18の外周面に形成された導体から成る被覆層19とを有し、-Z方向の端が第1導体部5に導電性材料から成す接合層20によって接合される。誘電体層18は、第1共振素子2と同様な材料、すなわちAg、Ag-Pd、Ag-PtなどのAg合金を主成分とする導電性材料、またはCu系、W系、Mo系、Pd系の導電性材料などを適宜選択して用いることができ、メタライズ処理によって、たとえば厚さ5~20μmの導電膜として形成される。最低限度の膜厚としては、使用する周波数における表皮効果の厚みよりも厚い必要がある。接合層20と第1導体部5とは、半田などを用いて接合してもよい。この場合には、半田が導電性接合材として機能する。このような構造を採用することによって、計算上、Q値を約40程度上昇させることができる。
<Fourth Embodiment>
FIG. 10 is a cross-sectional view schematically showing the resonator according to the fourth embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. In the resonator of the present embodiment, the second resonance element 3 has the dielectric layer 18 made of a dielectric material, and the coating layer 19 made of a conductor formed on the outer peripheral surface of the dielectric layer 18, and the -Z direction. Is joined to the first conductor portion 5 by a joining layer 20 made of a conductive material. The dielectric layer 18 is made of the same material as the first resonant element 2, that is, a conductive material containing Ag alloy such as Ag, Ag—Pd, and Ag—Pt as a main component, or Cu-based, W-based, Mo-based, or Pd-based material. An electrically conductive material of a system can be appropriately selected and used, and is formed as a conductive film having a thickness of, for example, 5 to 20 μm by a metallizing process. The minimum film thickness needs to be thicker than the thickness of the skin effect at the frequency used. The bonding layer 20 and the first conductor portion 5 may be bonded using solder or the like. In this case, the solder functions as a conductive bonding material. By adopting such a structure, the Q value can be increased by about 40 in calculation.
<第5実施形態>
 図11は本開示の第5実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、図8に示す実施形態の第1周波数調整具14およびねじ部材15を用いる構成に、図10に示す実施形態の誘電体層18および被覆層19から成る第2共振素子3が組み合わされた構成とされる。
<Fifth Embodiment>
FIG. 11 is a cross-sectional view schematically showing the resonator according to the fifth embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. The resonator of the present embodiment has a configuration in which the first frequency adjuster 14 and the screw member 15 of the embodiment shown in FIG. 8 are used, and the second resonance including the dielectric layer 18 and the coating layer 19 of the embodiment shown in FIG. The element 3 is combined.
 このような構成によっても、前述の第2実施形態と同様に、第1周波数調整具14は、チューニングねじとして機能し、第1周波数調整具14の突出量を調整することによって、容量性ギャップが変化し、これによって共振周波数を調整することができる。 With such a configuration, as in the above-described second embodiment, the first frequency adjuster 14 functions as a tuning screw, and by adjusting the protrusion amount of the first frequency adjuster 14, the capacitive gap is reduced. The resonance frequency can be adjusted accordingly.
<第6実施形態>
 図12は本開示の第6実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、図10の実施形態と同様に、第2共振素子3が誘電体層18と、誘電体層18の外周面に形成された導体から成る被覆層19とを有する構成とされ、第3共振素子4が誘電体層21と、誘電体層21の外周面に形成された導体から成る被覆層22とを有する構成とされる。このような構成を採用することによって、第2共振素子3および第3共振素子4を、例えば、円筒状の誘電体とその外周面を被覆する金属膜とによって実現することができる。これによって第2共振素子3および第3共振素子4を金属だけで構成する場合に比べて、重量を低減し、軽量化を図ることができる。
<Sixth Embodiment>
FIG. 12 is a sectional view schematically showing the resonator according to the sixth embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. In the resonator of the present embodiment, as in the embodiment of FIG. 10, the second resonance element 3 has the dielectric layer 18 and the coating layer 19 made of a conductor formed on the outer peripheral surface of the dielectric layer 18. The third resonance element 4 is configured to have the dielectric layer 21 and the coating layer 22 made of a conductor formed on the outer peripheral surface of the dielectric layer 21. By adopting such a configuration, the second resonant element 3 and the third resonant element 4 can be realized by, for example, a cylindrical dielectric and a metal film covering the outer peripheral surface thereof. As a result, the weight can be reduced and the weight can be reduced as compared with the case where the second resonant element 3 and the third resonant element 4 are made of only metal.
<第7実施形態>
 図13は本開示の第7実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、図12に示す実施形態の構成に加えて、図11の実施形態と同様な第1周波数調整具14を備える。このような構成によっても、前述の実施形態と同様に、第1周波数調整具14の空洞7内への突出量を調整することによって、共振周波数の微調整を可能とし、共振器の小型化を図ることができる。
<Seventh Embodiment>
FIG. 13 is a sectional view schematically showing the resonator according to the seventh embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. The resonator of the present embodiment includes a first frequency adjuster 14 similar to that of the embodiment of FIG. 11, in addition to the configuration of the embodiment shown in FIG. Even with such a configuration, as in the above-described embodiment, by adjusting the amount of protrusion of the first frequency adjuster 14 into the cavity 7, fine adjustment of the resonance frequency is possible, and the size of the resonator can be reduced. Can be planned.
<第8実施形態>
 図14は本開示の第8実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、導体から成り、第1共振素子2の外周面の+Z方向の端付近の少なくとも一部を被覆するように設けられた外周面被覆層25と、第1共振素子2の内周面の+Z方向の端付近の少なくとも一部を被覆するように設けられた内周面被覆層26とを有する構成であってもよい。このような構成を採用することによって、例えば、円筒状の誘電体の外周面および内周面に既知の成膜法によって金属膜を形成すればよいので、容易に外周面被覆層25および内周面被覆層26を有する第1共振素子2を作製することができ、共振器の製造を容易化することができる。
<Eighth Embodiment>
FIG. 14 is a sectional view schematically showing the resonator of the eighth embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. The resonator of the present embodiment is made of a conductor, and an outer peripheral surface coating layer 25 provided so as to cover at least a part of the outer peripheral surface of the first resonant element 2 in the vicinity of an end in the +Z direction, and the first resonant element 2 The inner peripheral surface coating layer 26 may be provided so as to cover at least a part of the inner peripheral surface near the end in the +Z direction. By adopting such a configuration, for example, since the metal film may be formed on the outer peripheral surface and the inner peripheral surface of the cylindrical dielectric by a known film forming method, the outer peripheral surface coating layer 25 and the inner peripheral surface can be easily formed. The first resonant element 2 having the surface coating layer 26 can be manufactured, and the manufacturing of the resonator can be facilitated.
<第9実施形態>
 図15は本開示の第9実施形態の共振器を模式的に示す断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、第1共振素子2の+Z方向の側の端と、第3共振素子4の+Z方向の側の端とが、第2導体部6の-Z方向に臨む表面に設けられた誘電体から成る支持部27に接合されてもよい。支持部27は、板状の基部27aと、基部27aの一方の主面に一体に設けられる突部27bとを有する。この場合、第2導体部6の空洞7に臨む一主面側に、突部27bが嵌合する凹部6aが形成される。このような構成を採用することによって、第1共振素子2および第3共振素子4が導電性接合材によって接合された支持部27を準備し、第2導体部6の凹部6aに、突部27bを凹部6aに嵌合させながら支持部27を導電性接合材によって接合し、この組立て体を第1導体部5に接合すればよいので、組立て作業が簡素化され、共振器の製造工程を容易化することができる。このような構成によっても、前述の実施形態と同様に、共振周波数の微調整を可能とし、共振器の小型化を図ることができる。
<Ninth Embodiment>
FIG. 15 is a sectional view schematically showing the resonator according to the ninth embodiment of the present disclosure. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. In the resonator of the present embodiment, the end of the first resonant element 2 on the +Z direction side and the end of the third resonant element 4 on the +Z direction side are on the surface of the second conductor portion 6 facing in the −Z direction. It may be joined to the supporting portion 27 made of a dielectric material provided. The support portion 27 has a plate-shaped base portion 27a and a protrusion portion 27b integrally provided on one main surface of the base portion 27a. In this case, a concave portion 6a into which the protrusion 27b is fitted is formed on the one main surface side of the second conductor portion 6 which faces the cavity 7. By adopting such a configuration, the support portion 27 in which the first resonant element 2 and the third resonant element 4 are joined by the conductive joining material is prepared, and the protrusion 27b is provided in the concave portion 6a of the second conductor portion 6. Since the support portion 27 is joined with the conductive joining material while fitting the fitting portion in the recess 6a and the assembly is joined to the first conductor portion 5, the assembling work is simplified and the manufacturing process of the resonator is facilitated. Can be converted. With such a configuration, the resonance frequency can be finely adjusted and the size of the resonator can be reduced, as in the above-described embodiment.
<第10実施形態>
 図16は本開示の第10実施形態の共振器を模式的に示す断面図である、なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の共振器は、第2周波数調整具16の外径が図9の実施形態に比べて大きく構成される。第2周波数調整具16の外径が大きいほど、調整可能なチューニングレンジとも称される周波数調整範囲が大きくなるので、共振周波数の調整幅が広い共振器を実現することができる。このような構成によっても、前述の実施形態と同様に、共振周波数の微調整を可能とし、共振器の小型化を図ることができるとともに、共振周波数の調整具が一体となった共振器が実現されるので、異なる共振周波数であっても同じ構成の共振器によって実現することが可能となり、製造コストを低減し、生産性を向上することができる。
<Tenth Embodiment>
FIG. 16 is a cross-sectional view schematically showing the resonator according to the tenth embodiment of the present disclosure. The portions corresponding to those in the above-described embodiments are designated by the same reference numerals. In the resonator of this embodiment, the outer diameter of the second frequency adjuster 16 is larger than that of the embodiment of FIG. The larger the outer diameter of the second frequency adjuster 16 is, the larger the frequency adjustment range, which is also referred to as the adjustable tuning range, is. Therefore, it is possible to realize a resonator having a wide adjustment range of the resonance frequency. With such a configuration, similarly to the above-described embodiment, it is possible to finely adjust the resonance frequency, reduce the size of the resonator, and realize the resonator in which the resonance frequency adjuster is integrated. Therefore, even if the resonance frequencies are different, it is possible to realize the resonators having the same configuration, and it is possible to reduce the manufacturing cost and improve the productivity.
<フィルタ>
 図17は本開示の実施形態のフィルタを模式的に示す断面図であり、図18は図17に示すフィルタの斜視図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態のフィルタFは、列を成す複数の共振器30a,30bと、列の一方端に位置する共振器30aに、電気的または電磁気的に接続される第1端子部31と、列の他方端に位置する共振器30bに、電気的または電磁気的に接続される第2端子部32とを有する。
<Filter>
17 is a cross-sectional view schematically showing the filter of the embodiment of the present disclosure, and FIG. 18 is a perspective view of the filter shown in FIG. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. The filter F of the present embodiment includes a plurality of resonators 30a and 30b forming a row, a first terminal portion 31 electrically or electromagnetically connected to the resonator 30a located at one end of the row, and a row of the resonators 30a and 30b. The resonator 30b located at the other end has a second terminal portion 32 that is electrically or electromagnetically connected.
 このような構成によって、フィルタは、携帯電話に代表されるマイクロ波通信機器のフィルタ、すなわち濾波器として使用され、送受信に必要な周波数帯域のみを通過させ、不要な周波数帯域を遮断する。またその他の通信端末では、主にデュプレクサなどのアンテナ共用器としても使用される。本実施形態のフィルタは,圧電素子を応用したフィルタとは異なり機械的な振動は全くなく、電磁波自体が空洞7内で共振する。空洞7内においては,電磁波の波長が自由空間の1/√εr (εr:比誘電率) に短縮されるため、共振系寸法を小さくすることができる。 With such a configuration, the filter is used as a filter of a microwave communication device typified by a mobile phone, that is, a filter, and passes only the frequency band required for transmission and reception and blocks the unnecessary frequency band. In other communication terminals, it is mainly used as an antenna duplexer such as a duplexer. Unlike the filter using the piezoelectric element, the filter of this embodiment has no mechanical vibration, and the electromagnetic wave itself resonates in the cavity 7. In the cavity 7, since the wavelength of the electromagnetic wave is shortened to 1/√εr (εr: relative permittivity) of free space, the size of the resonance system can be reduced.
<通信装置>
 図19は図17および図18に示すフィルタが込み組まれた通信装置を示すブロック図である。なお、前述の実施形態と対応する部分には、同一の参照符を付す。本実施形態の通信装置は、アンテナ40と、通信回路41と、アンテナ40および通信回路41に接続されたフィルタFとを有している。フィルタFは、前述した一実施形態のフィルタである。アンテナ40および通信回路41は、既知の従来のものである。
<Communication device>
FIG. 19 is a block diagram showing a communication device in which the filters shown in FIGS. 17 and 18 are incorporated. In addition, the same reference numerals are given to the portions corresponding to the above-described embodiment. The communication device of this embodiment includes an antenna 40, a communication circuit 41, and a filter F connected to the antenna 40 and the communication circuit 41. The filter F is the filter of the above-described embodiment. The antenna 40 and communication circuit 41 are known and conventional.
 このような構成を有する本実施形態の通信装置は、小型で電気特性が優れた前述のフィルタを用いて不要な電気信号を除去することから、小型化が可能であり、通信品質を良くすることができる。 The communication device of the present embodiment having such a configuration can be downsized and improve communication quality because it removes unnecessary electric signals by using the above-described filter that is small and has excellent electric characteristics. You can
 本開示は次の実施の形態が可能である。 The present disclosure can have the following embodiments.
 本開示の共振器は、内部に空洞を有するシールド筐体であって、第1方向の側に位置する第1導体部と、前記第1方向と反対方向である第2方向の側に位置する第2導体部とを含むシールド筐体と、
 筒状の誘電体から成る第1共振素子であって、前記第2方向の端が前記第2導体部に接合され、前記第1方向の端が、前記第1導体部から離間して位置するように前記空洞内に配設された第1共振素子と、
 筒状の第2共振素子であって、前記第1方向の端が前記第1導体部に接合され、前記第2方向の端が、前記第2導体部から離間し、かつ前記第1共振素子に取り囲まれるように前記空洞内に配設された第2共振素子と、
 筒状の第3共振素子であって、前記第2方向の端が前記第2導体部に接合され、前記第1方向の端が、前記第1導体部から離間し、かつ前記第2共振素子に取り囲まれるように前記空洞内に配設された第3共振素子と、を備えた構成である。
The resonator of the present disclosure is a shield housing having a cavity inside, and is located on a first conductor portion located on the first direction side and on a second direction side opposite to the first direction. A shield housing including a second conductor portion;
A first resonant element made of a tubular dielectric, wherein an end in the second direction is joined to the second conductor portion, and an end in the first direction is located apart from the first conductor portion. A first resonant element disposed in the cavity as described above,
A cylindrical second resonance element, wherein an end in the first direction is joined to the first conductor portion, an end in the second direction is separated from the second conductor portion, and the first resonance element is provided. A second resonant element disposed in the cavity so as to be surrounded by
A cylindrical third resonance element, wherein an end in the second direction is joined to the second conductor portion, an end in the first direction is separated from the first conductor portion, and the second resonance element is provided. And a third resonance element disposed in the cavity so as to be surrounded by.
 本開示のフィルタは、共振器であって、互いに電磁気的に結合するように列を成して配設された複数の共振器と、
 前記列の一方端に位置する共振器に、電気的または電磁気的に接続される第1端子部と、
 前記列の他方端に位置する共振器に、電気的または電磁気的に接続される第2端子部と、を有する構成である。
The filter of the present disclosure is a resonator, and a plurality of resonators arranged in a row so as to be electromagnetically coupled to each other,
A first terminal portion electrically or electromagnetically connected to the resonator located at one end of the row;
A second terminal portion electrically or electromagnetically connected to the resonator located at the other end of the row.
 本開示の通信装置は、アンテナと、通信回路と、前記アンテナおよび前記通信回路に接続された上述のフィルタと、を有する構成である。 The communication device of the present disclosure has a configuration including an antenna, a communication circuit, and the above-mentioned filter connected to the antenna and the communication circuit.
 本開示の共振器によれば、小型で電気特性の優れた共振器を得ることができる。本開示のフィルタによれば、小型で電気特性の優れたフィルタを得ることができる。本開示の通信装置によれば、小型で通信品質の優れた通信装置を得ることができる。 According to the resonator of the present disclosure, a small-sized resonator having excellent electric characteristics can be obtained. According to the filter of the present disclosure, a filter having a small size and excellent electric characteristics can be obtained. According to the communication device of the present disclosure, it is possible to obtain a small-sized communication device having excellent communication quality.
 本開示は、その精神または主要な特徴から逸脱することなく、他のいろいろな形態で実施できる。したがって、前述の実施形態はあらゆる点で単なる例示に過ぎず、本開示の範囲は特許請求の範囲に示すものであって、明細書本文には何ら拘束されない。さらに、特許請求の範囲に属する変形や変更は全て本開示の範囲内のものである。 The present disclosure can be implemented in various other forms without departing from the spirit or the main feature. Therefore, the above-described embodiments are merely examples in all respects, and the scope of the present disclosure is set forth in the claims and is not bound by the specification text. Furthermore, all modifications and changes belonging to the scope of the claims are within the scope of the present disclosure.
 1 シールド筐体
 2 第1共振素子
 3 第2共振素子
 4 第3共振素子
 5 第1導体部
 6 第2導体部
 7 空洞
 8,9 貫通孔
 13,20 接合層
 14 第1周波数調整具
 15,17 ねじ部材
 16 第2周波数調整具
 18,21 誘電体層
 19,22 被覆層
 25 外周面被覆層
 26 内周面被覆層
 28 接合部
DESCRIPTION OF SYMBOLS 1 Shield case 2 1st resonance element 3 2nd resonance element 4 3rd resonance element 5 1st conductor part 6 2nd conductor part 7 Cavity 8 and 9 Through hole 13 and 20 Bonding layer 14 1st frequency adjusting tool 15 and 17 Screw member 16 Second frequency adjuster 18,21 Dielectric layer 19,22 Covering layer 25 Outer peripheral surface coating layer 26 Inner peripheral surface coating layer 28 Joining portion

Claims (15)

  1.  内部に空洞を有するシールド筐体であって、第1方向の側に位置する第1導体部と、前記第1方向と反対方向である第2方向の側に位置する第2導体部とを含むシールド筐体と、
     筒状の誘電体から成る第1共振素子であって、前記第2方向の端が前記第2導体部に接合され、前記第1方向の端が、前記第1導体部から離間して位置するように前記空洞内に配設された第1共振素子と、
     筒状の第2共振素子であって、前記第1方向の端が前記第1導体部に接合され、前記第2方向の端が、前記第2導体部から離間し、かつ前記第1共振素子に取り囲まれるように前記空洞内に配設された第2共振素子と、
     筒状の第3共振素子であって、前記第2方向の端が前記第2導体部に接合され、前記第1方向の端が、前記第1導体部から離間し、かつ前記第2共振素子に取り囲まれるように前記空洞内に配設された第3共振素子と、を備えた共振器。
    A shield housing having a cavity inside, including a first conductor portion located on the first direction side and a second conductor portion located on the second direction side opposite to the first direction. A shield housing,
    A first resonant element made of a tubular dielectric, wherein an end in the second direction is joined to the second conductor portion, and an end in the first direction is located apart from the first conductor portion. A first resonant element disposed in the cavity as described above,
    A cylindrical second resonance element, wherein an end in the first direction is joined to the first conductor portion, an end in the second direction is separated from the second conductor portion, and the first resonance element is provided. A second resonant element disposed in the cavity so as to be surrounded by
    A cylindrical third resonance element, wherein an end in the second direction is joined to the second conductor portion, an end in the first direction is separated from the first conductor portion, and the second resonance element is provided. A third resonance element disposed in the cavity so as to be surrounded by the resonator.
  2.  前記第2共振素子は、導体から成る、請求項1に記載の共振器。 The resonator according to claim 1, wherein the second resonant element is made of a conductor.
  3.  前記第2共振素子は、誘電体から成る誘電体層と、前記誘電体層の外周面に形成された導体から成る被覆層と、を有する請求項1に記載の共振器。 The resonator according to claim 1, wherein the second resonant element includes a dielectric layer made of a dielectric material and a coating layer made of a conductor formed on an outer peripheral surface of the dielectric layer.
  4.  前記第3共振素子は、導体から成る、請求項1~3のいずれか1つに記載の共振器。 The resonator according to any one of claims 1 to 3, wherein the third resonant element is made of a conductor.
  5.  前記第3共振素子は、誘電体から成る誘電体層と、前記誘電体層の外周面に形成された導体から成る被覆層と、を有する請求項1~3のいずれか1つに記載の共振器。 The resonance according to any one of claims 1 to 3, wherein the third resonant element includes a dielectric layer made of a dielectric material and a coating layer made of a conductor formed on an outer peripheral surface of the dielectric layer. vessel.
  6.  前記第1共振素子の前記第2方向の端と、前記第2導体部との間に位置し、導体から成り、前記第1共振素子の前記第2方向の端と前記第2導体部とを接合する接合層を、さらに備える請求項1~5のいずれか1つに記載の共振器。 It is located between the end of the first resonant element in the second direction and the second conductor portion and is made of a conductor. The end of the first resonant element in the second direction and the second conductor portion are connected to each other. The resonator according to any one of claims 1 to 5, further comprising a bonding layer for bonding.
  7.  第1周波数調整具であって、第1導体部に設けられ、導体から成り、前記第2共振素子の内側で前記第1導体部からの突出量を変化させることによって周波数を調整するための第1周波数調整具を、さらに備える請求項1~6のいずれか1つに記載の共振器。 A first frequency adjuster, which is provided on the first conductor portion and is made of a conductor, for adjusting the frequency by changing the protrusion amount from the first conductor portion inside the second resonant element. 7. The resonator according to claim 1, further comprising one frequency adjuster.
  8.  第2周波数調整具であって、前記第2導体部に設けられ、導体から成り、前記第3共振素子の内側で前記第2導体部からの突出量を変化させることによって周波数を調整するための第2周波数調整具を、さらに備える請求項1~7のいずれか1つに記載の共振器。 A second frequency adjuster, which is provided on the second conductor portion and is made of a conductor, for adjusting the frequency by changing the protrusion amount from the second conductor portion inside the third resonant element. The resonator according to any one of claims 1 to 7, further comprising a second frequency adjuster.
  9.  前記第2導体部と前記第1共振素子の前記第2方向の端との間に位置し、誘電体から成る支持部を有する、請求項1~8のいずれか1つに記載の共振器。 The resonator according to any one of claims 1 to 8, which has a support portion which is located between the second conductor portion and an end of the first resonance element in the second direction and which includes a support made of a dielectric material.
  10.  導体から成り、前記第1共振素子の外周面の少なくとも一部を被覆するように設けられた外周面被覆層を有する、請求項1~9のいずれか1つに記載の共振器。 The resonator according to any one of claims 1 to 9, comprising a conductor, and an outer peripheral surface coating layer provided so as to cover at least a part of an outer peripheral surface of the first resonant element.
  11.  導体から成り、前記第1共振素子の内周面の少なくとも一部を被覆するように設けられた内周面被覆層を有する、請求項1~10のいずれか1つに記載の共振器。 The resonator according to any one of claims 1 to 10, comprising a conductor, and an inner peripheral surface coating layer provided so as to cover at least a part of an inner peripheral surface of the first resonant element.
  12.  前記第1共振素子は、前記第2導体部との接合部の気孔面積率が軸方向中央部の気孔面積率より低い、請求項1~11のいずれか1つに記載の共振器。 The resonator according to any one of claims 1 to 11, wherein the first resonant element has a pore area ratio of a joint portion with the second conductor portion lower than a pore area ratio of a central portion in the axial direction.
  13.  前記第1共振素子は、内周側表層部の気孔面積率および外周側表層部の気孔面積率が前記内周側表層部と前記外周側表層部との間に位置する中間部の気孔面積率より高い、請求項1~12のいずれか1つに記載の共振器。 In the first resonant element, the pore area ratio of the inner peripheral side surface layer portion and the outer peripheral side surface layer portion have a pore area ratio of an intermediate portion located between the inner peripheral side surface layer portion and the outer peripheral side surface layer portion. Resonator according to any one of claims 1 to 12, which is higher.
  14.  請求項1~13のいずれか1つに記載の共振器であって、互いに電磁気的に結合するように列を成して配設された複数の共振器と、
     前記列の一方端に位置する共振器に、電気的または電磁気的に接続される第1端子部と、
     前記列の他方端に位置する共振器に、電気的または電磁気的に接続される第2端子部と、を有するフィルタ。
    The resonator according to any one of claims 1 to 13, wherein the plurality of resonators are arranged in a row so as to be electromagnetically coupled to each other,
    A first terminal portion electrically or electromagnetically connected to the resonator located at one end of the row;
    A filter having a second terminal portion electrically or electromagnetically connected to the resonator located at the other end of the row.
  15.  アンテナと、通信回路と、前記アンテナおよび前記通信回路に接続された請求項14に記載のフィルタと、を有する通信装置。 A communication device having an antenna, a communication circuit, and the filter according to claim 14 connected to the antenna and the communication circuit.
PCT/JP2020/003152 2019-01-29 2020-01-29 Resonator, filter and communication device WO2020158793A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020569678A JPWO2020158793A1 (en) 2019-01-29 2020-01-29 Resonators, filters and communication devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019013658 2019-01-29
JP2019-013658 2019-01-29

Publications (1)

Publication Number Publication Date
WO2020158793A1 true WO2020158793A1 (en) 2020-08-06

Family

ID=71841357

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/003152 WO2020158793A1 (en) 2019-01-29 2020-01-29 Resonator, filter and communication device

Country Status (2)

Country Link
JP (1) JPWO2020158793A1 (en)
WO (1) WO2020158793A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022090089A1 (en) * 2020-10-29 2022-05-05 Nokia Solutions And Networks Oy Resonator

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957008U (en) * 1982-10-07 1984-04-13 株式会社村田製作所 dielectric resonator
JPS62143502A (en) * 1985-12-18 1987-06-26 Fujitsu Ltd Dielectric composite filter
JPS63266902A (en) * 1987-04-23 1988-11-04 Murata Mfg Co Ltd Dielectric resonator
WO2016047531A1 (en) * 2014-09-24 2016-03-31 京セラ株式会社 Resonator, filter, and communication device
WO2016198466A1 (en) * 2015-06-10 2016-12-15 Alcatel Lucent A resonator assembly and filter

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957008U (en) * 1982-10-07 1984-04-13 株式会社村田製作所 dielectric resonator
JPS62143502A (en) * 1985-12-18 1987-06-26 Fujitsu Ltd Dielectric composite filter
JPS63266902A (en) * 1987-04-23 1988-11-04 Murata Mfg Co Ltd Dielectric resonator
WO2016047531A1 (en) * 2014-09-24 2016-03-31 京セラ株式会社 Resonator, filter, and communication device
WO2016198466A1 (en) * 2015-06-10 2016-12-15 Alcatel Lucent A resonator assembly and filter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HALLET, C. ET AL.: "Optimization of an air filled compact re-entrant coaxial resonator for a C-band bandpass filter", IEEE ACCESS, vol. 6, 24 September 2018 (2018-09-24), pages 54117 - 54125, XP011693063, DOI: 10.1109/ACCESS.2018.2870903 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022090089A1 (en) * 2020-10-29 2022-05-05 Nokia Solutions And Networks Oy Resonator

Also Published As

Publication number Publication date
JPWO2020158793A1 (en) 2021-11-11

Similar Documents

Publication Publication Date Title
KR102631870B1 (en) Radio frequency filter
US6002311A (en) Dielectric TM mode resonator for RF filters
US7138891B2 (en) Dielectric resonator device, dielectric filter, composite dielectric filter, and communication apparatus
CN109411852B (en) Cavity high-Q three-mode dielectric resonance structure and filter comprising same
WO2020158793A1 (en) Resonator, filter and communication device
US20210344092A1 (en) Resonator, filter, and communication device
JP2010226469A (en) Band pass filter
US10693205B2 (en) Resonator, filter, and communication device
JP4803255B2 (en) Dielectric resonator, dielectric filter, and communication device
EP1901391A1 (en) Dielectric filter for base station communication equipment
WO2020090547A1 (en) Resonator, filter, and communication device
US9871280B2 (en) Dielectric resonator, dielectric filter, and communication apparatus
JP2004349981A (en) Resonator device, filter, compound filter device, and communication apparatus
JP2021175104A (en) Dielectric ceramics, resonator, filter, and communication device
JP3570417B2 (en) Dielectric notch filter
Ghadiya et al. Q-band cross-coupled dielectric resonator filter using TM mode for satellite application
JP2004349823A (en) Resonator device, filter, composite filter device, and communication apparatus
JP3376716B2 (en) Dielectric resonator, dielectric notch filter and dielectric filter
CN116632479A (en) Coaxial cavity resonator and filter
JP2003273605A (en) Waveguide type filter
GB2570765A (en) Resonator apparatus and method of use thereof
JP2003124717A (en) Dielectric resonator
JP2003124704A (en) Dielectric filter
JP2000295006A (en) Dielectric resonance filter
JPS6226201B2 (en)

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20748917

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020569678

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20748917

Country of ref document: EP

Kind code of ref document: A1