WO2020147675A1 - 连接器、连接器的加工方法及终端设备 - Google Patents

连接器、连接器的加工方法及终端设备 Download PDF

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WO2020147675A1
WO2020147675A1 PCT/CN2020/071753 CN2020071753W WO2020147675A1 WO 2020147675 A1 WO2020147675 A1 WO 2020147675A1 CN 2020071753 W CN2020071753 W CN 2020071753W WO 2020147675 A1 WO2020147675 A1 WO 2020147675A1
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terminal
terminals
row
connector
frequency signal
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French (fr)
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朱中武
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve

Definitions

  • the embodiments of the present disclosure relate to the field of communication technology, and in particular, to a connector, a connector processing method, and a terminal device.
  • USB Universal Serial Bus
  • terminal devices are generally equipped with a high-current fast charging function. Therefore, the current transmission capability of the connector is relatively high.
  • 5G era With the advent of the 5G era, the demand for high-speed transmission has also emerged. Under the requirements of 5G, at least 5Gbps or even 10Gbps high-frequency transmission needs must be met. Therefore, connectors are required to have high-frequency signal transmission capabilities.
  • the embodiments of the present disclosure provide a connector, a processing method of the connector, and a terminal device.
  • an embodiment of the present disclosure provides a connector including: a first row of terminals and a second row of terminals; the first row of terminals includes four high-frequency signal transmission terminals, two power terminals, and two grounding terminals. Terminals; the second row of terminals includes four high-frequency signal transmission terminals, two power terminals and two ground terminals;
  • the power terminal and the ground terminal adopt a first type terminal, and the first type terminal is used for large current transmission;
  • the high frequency signal transmission terminal adopts a second type terminal, and the second type terminal is used for high frequency signal transmission.
  • embodiments of the present disclosure also provide a method for processing a connector, the connector including the connector of the first aspect; the method includes:
  • the high-frequency signal transmission terminals in the first row and the second row are respectively stamped and formed, and electroplated;
  • power terminals and ground terminals are installed corresponding to the high-frequency signal transmission terminals in the first row and the second row, respectively.
  • embodiments of the present disclosure also provide a terminal device, including the connector described in the first aspect.
  • the power terminal and the ground terminal of the connector adopt the first type terminal for high current transmission; the high frequency signal transmission terminal of the connector adopts the second type terminal for high frequency signal transmission. Therefore, with the solutions of the embodiments of the present disclosure, the requirements for high current transmission and high frequency signal transmission can be met at the same time.
  • Figure 1 is a schematic diagram of a connector provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a blanking type terminal provided by an embodiment of the present disclosure
  • FIG. 3 is one of the schematic diagrams of the shrapnel type terminal provided by the embodiment of the present disclosure.
  • FIG. 4 is the second schematic diagram of the shrapnel type terminal provided by the embodiment of the present disclosure.
  • Figure 5 is a flowchart of a connector processing method provided by an embodiment of the present disclosure.
  • Figure 6- Figure 14 are schematic diagrams of the connector processing process
  • Figure 15 is a schematic diagram of the finished connector.
  • the embodiments of the present disclosure provide a connector, a processing method of the connector, and a terminal device, so as to solve the problem that the connector cannot satisfy high current transmission and high frequency signal transmission at the same time.
  • Fig. 1 is a schematic diagram of a connector of an embodiment of the present disclosure. As shown in Figure 1, it includes: a first row of terminals 11 and a second row of terminals 12; the first row of terminals includes four high-frequency signal transmission terminals, two power terminals and two ground terminals; the second row The terminals include four high-frequency signal transmission terminals, two power terminals and two ground terminals.
  • the power terminal and the ground terminal adopt a first type terminal, and the first type terminal is used for large current transmission; the high-frequency signal transmission terminal adopts a second type terminal, and the second type terminal is used for For high-frequency signal transmission.
  • Table 1 it is a schematic diagram of each terminal.
  • the power terminals for charging that is, as the power pins for charging;
  • RX2+/TX2+, RX2-/TX2-, TX1-/RX1- , TX1+/RX1+ are high-frequency signal transmission terminals, that is, as high-frequency signal transmission pins.
  • the first row of terminals may be the high-frequency signal transmission terminals in A1-A12 in Table 1, and correspondingly, the second row of terminals may be the high-frequency signals in B1-B12 in Table 1.
  • Transmission terminals; or, the first row of terminals can be the high-frequency signal transmission terminals in B1-B12 in Table 1, and the second row of terminals can be the high-frequency signal transmission terminals in A1-A12 in Table 1.
  • the first type terminal includes: a blanking type terminal; the second type terminal includes: a shrapnel type terminal.
  • the connector can not only meet the requirements of high-current charging, but also meet the requirements of high-speed transmission.
  • VBUS and GND use blanking terminals, RX2+/TX2+, RX2-/TX2-, TX1-/RX1-, TX1+/RX1+ use shrapnel terminals, and other terminals Either blank type terminals or bent shrapnel type terminals can be used.
  • the blank terminal includes: a terminal body 31, a connecting portion 32 is formed at one end of the terminal body 31, and a welding portion 33 is formed at the other end of the terminal body; A thorn 34 is formed at the first position of the welding portion 33.
  • the role of the puncture is to prevent the terminal from retreating after being installed in the plastic terminal slot.
  • the width of the terminal body at the second position 31D is greater than the width of the connecting portion 32, and the second position 31D is located between the connecting portion 32 and the thorn 34.
  • the conductor width of the blank terminal is not uniform, and the width at the second position 31D is larger than the width at 32A. Therefore, this type of terminal can improve the overcurrent (current) capability. Therefore, the blanking type terminal adopts the assembly process, which can meet the large current transmission. However, the uneven cross-section has a great influence on the high-frequency characteristics and cannot meet the high-frequency characteristics requirements. In addition, the design of the stab will also affect the high frequency characteristics.
  • shrapnel-type terminals are used for high-frequency signal transmission terminals.
  • the shrapnel-type terminal includes: a terminal body 41, a welding part 42 is formed at one end of the terminal body 41, and a contact part 43 is formed at the other end of the terminal body; the contact part 43 Bend in the first direction.
  • the first direction faces the inner diameter direction of the terminal body.
  • the conductor width of the shrapnel terminal (also known as the bent shrapnel terminal) is uniform, and the width B and the width A on the terminal body are not much different, which is suitable for high-frequency signal transmission.
  • the bent shrapnel terminal is embedded Type injection molding does not require card points. Synchronization can reduce the impact on the signal and is also beneficial to high-frequency transmission.
  • the power terminal and the ground terminal of the connector adopt the first type terminal for high current transmission; the high frequency signal transmission terminal of the connector adopts the second type terminal for high frequency signal transmission. Therefore, with the solutions of the embodiments of the present disclosure, the requirements for high current transmission and high frequency signal transmission can be met at the same time.
  • the processing method of the connector in the embodiment of the present disclosure includes:
  • Step 501 The high-frequency signal transmission terminals in the first row and the second row are respectively stamped and formed, and electroplated.
  • Step 502 Perform embedded injection molding of the electroplated high-frequency signal transmission terminals in the first row and the second row, and assemble them into the first housing.
  • Step 503 Put the first shell into the second shell.
  • the semi-finished product after step 502 is put into the second housing.
  • Step 504 In the second housing, corresponding to the high-frequency signal transmission terminals in the first row and the second row, respectively, a power terminal and a ground terminal are installed.
  • the power terminals corresponding to the high-frequency signal transmission terminals in the first row are installed, corresponding to the high-frequency signals in the second row.
  • the signal transmission terminal is installed in the ground terminal; or, the high-frequency signal transmission terminal in the first row is installed in the ground terminal, and the high-frequency signal transmission terminal in the second row is installed in the power terminal.
  • the power terminal and the ground terminal of the connector adopt the first type terminal for high current transmission; the high frequency signal transmission terminal of the connector adopts the second type terminal for high frequency signal transmission. Therefore, with the solutions of the embodiments of the present disclosure, the requirements for high current transmission and high frequency signal transmission can be met at the same time.
  • step 503 may further include: installing an electromagnetic interference (EMI) grounding spring sheet in the first housing. Then, step 503 may specifically include installing the first housing containing the EMI grounding elastic sheet into the second housing.
  • EMI electromagnetic interference
  • a first hook may be installed on the first side of the second housing, and the second housing The second side of the body is inserted into the second hook.
  • the high-frequency signal transmission terminals in the first row and the second row are respectively stamped and formed, and electroplated.
  • the electroplated high-frequency signal transmission terminals in the first row and the second row are embedded injection molding.
  • the first row of high-frequency signal transmission terminals and the second row of high-frequency signal transmission terminals after injection molding are assembled together.
  • the semi-finished product assembled in FIG. 8 is put into the first housing (front plastic housing).
  • an electromagnetic interference grounding elastic sheet is installed in the first housing.
  • the first shell completed in FIG. 10 is put into the second shell (outer iron shell).
  • power terminals and ground terminals are installed from the rear of the second housing.
  • a first hook is installed on the left side of the second housing, and a second hook is installed on the right side of the second housing.
  • the new connector (Type C plug) can meet the requirements of high current transmission and high frequency signal transmission.
  • an embodiment of the present disclosure also provides a terminal including any of the aforementioned connectors.
  • the problem that the Type C plug that meets the functions of USB3.0 and USB3.1 cannot be charged with high current is avoided; the Type C plug that meets the high current charging function cannot meet the problem of USB3.0 and USB3. 1 function problem.
  • high-speed transmission and fast charging can also be realized.
  • the methods in the above embodiments can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware, but in many cases the former is better Implementation.
  • the technical solution of the present disclosure can be embodied in the form of a software product in essence or the part that contributes to the related technology.
  • the computer software product is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk). ) Includes several instructions to make a terminal device (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) execute the method described in each embodiment of the present disclosure.

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种连接器、连接器的加工方法及终端设备,该连接器包括:第一排端子(11)和第二排端子(12);该第一排端子包括四个高频信号传输端子、两个电源端子和两个接地端子;该第二排端子包括四个高频信号传输端子、两个电源端子和两个接地端子;该电源端子和该接地端子采用第一类型端子,该第一类型端子用于进行大电流传输;该高频信号传输端子采用第二类型端子,该第二类型端子用于进行高频信号传输。该连接器通过采用不同结构的端子,既可满足大电流充电的要求,又可满足高速传输的要求。

Description

连接器、连接器的加工方法及终端设备
相关申请的交叉引用
本申请主张在2019年1月15日在中国提交的中国专利申请No.201910035890.2的优先权,其全部内容通过引用包含于此。
技术领域
本公开实施例涉及通信技术领域,尤其涉及一种连接器、连接器的加工方法及终端设备。
背景技术
通用串行总线(Universal Serial Bus,USB)连接器承载着终端设备的数据传输和充电的功能。相关技术中的终端设备使用的连接器,也开始从micro USB向Type C(类型C)连接器过渡。
为提升用户充电体验,终端设备普遍配备大电流快充功能,因此,对连接器的电流传输能力要求比较高。而随着5G时代的到来,高速传输的需求也应运而生。在5G的需求下,至少要满足5Gbps甚至10Gbps的高频传输需求,因此,要求连接器具有高频信号传输能力。
而相关技术中的连接器无法同时满足上述要求。
发明内容
本公开实施例提供一种连接器、连接器的加工方法及终端设备。
第一方面,本公开实施例提供了一种连接器,包括:第一排端子和第二排端子;所述第一排端子包括四个高频信号传输端子、两个电源端子和两个接地端子;所述第二排端子包括四个高频信号传输端子、两个电源端子和两个接地端子;
所述电源端子和所述接地端子采用第一类型端子,所述第一类型端子用于进行大电流传输;
所述高频信号传输端子采用第二类型端子,所述第二类型端子用于进行 高频信号传输。
第二方面,本公开实施例还提供一种连接器的加工方法,所述连接器包括第一方面的连接器;所述方法包括:
分别将第一排和第二排中的高频信号传输端子冲压成型,并进行电镀;
将第一排和第二排中电镀后的高频信号传输端子进行嵌入式注射成型,并组装入第一壳体中;
将所述第一壳体装入第二壳体中;
在所述第二壳体中,分别对应第一排和第二排中的高频信号传输端子,装入电源端子和接地端子。
第三方面,本公开实施例还提供一种终端设备,包括第一方面所述的连接器。
在本公开实施例中,连接器的电源端子和接地端子采用第一类型端子,用于进行大电流传输;连接器的高频信号传输端子采用第二类型端子,用于进行高频信号传输。因此,利用本公开实施例的方案,可同时满足大电流传输和高频信号传输的需求。
附图说明
为了更清楚地说明本公开实施例的技术方案,下面将对本公开实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本公开实施例提供的连接器的示意图;
图2是本公开实施例提供的下料式端子的示意图;
图3是本公开实施例提供的弹片式端子的示意图之一;
图4是本公开实施例提供的弹片式端子的示意图之二;
图5是本公开实施例提供的连接器的加工方法的流程图;
图6-图14分别为连接器的加工过程示意图;
图15为加工完成的连接器的示意图。
具体实施方式
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。
本公开实施例提供一种连接器、连接器的加工方法及终端设备,以解决连接器无法同时满足大电流传输和高频信号传输的问题。
参见图1,图1是本公开实施例的连接器的示意图。如图1所示,包括:第一排端子11和第二排端子12;所述第一排端子包括四个高频信号传输端子、两个电源端子和两个接地端子;所述第二排端子包括四个高频信号传输端子、两个电源端子和两个接地端子。其中,所述电源端子和所述接地端子采用第一类型端子,所述第一类型端子用于进行大电流传输;所述高频信号传输端子采用第二类型端子,所述第二类型端子用于进行高频信号传输。
其中,每一排中各端子的排列结合表1描述。结合表1所示,为各端子的示意图。其中,如A12/B1、A9/B4、A4/B9、A1/B12是充电使用的电源端子,即作为充电使用的电源引脚;如RX2+/TX2+,RX2-/TX2-,TX1-/RX1-,TX1+/RX1+则是高频信号传输端子,即作为高频信号传输引脚。
表1
Figure PCTCN2020071753-appb-000001
其中,在本公开实施例中,第一排端子可以是表1中A1-A12中的高频信号传输端子,相应地,第二排端子则可以是表1中B1-B12中的高频信号传输端子;或者,第一排端子可以是表1中B1-B12中的高频信号传输端子,那么,第二排端子可以是表1中A1-A12中的高频信号传输端子。在本公开实施例中,所述第一类型端子包括:下料式端子;所述第二类型端子包括:弹片 式端子。
也即,第一排和第二排中的:电源端子和接地端子采用下料式端子;第一排和第二排中的:高频信号传输端子采用弹片式端子。通过采用该不同结构的端子,该连接器既可满足大电流充电的要求,又可满足高速传输的要求。
在实际应用中,第一排和第二排中的:VBUS和GND采用下料式端子,RX2+/TX2+,RX2-/TX2-,TX1-/RX1-,TX1+/RX1+采用弹片式端子,其他端子可使用下料式端子,也可使用折弯弹片式端子。
如图2所示,下料式端子包括:端子本体31,在端子本体31的一端形成有连接部32,在所述端子本体的另一端形成有焊接部33;在所述端子本体31靠近所述焊接部33的第一位置形成有卡刺34。其中,卡刺的作用在于防止端子装入塑胶端子槽后出现后退的现象。
其中,所述端子本体在第二位置31D的宽度大于所述连接部32的宽度,所述第二位置31D位于所述连接部32和所述卡刺34之间。
由图2可以看出,下料式端子的导体宽度不均匀,第二位置31D处的宽度大于32A处的宽度,因此,该类型端子可以提高过流(电流)能力。所以,下料式端子采用装配工艺,可满足大电流传输。但是截面不均匀对高频特性影响很大,不能满足高频特性需求。另外卡刺的设计也会影响高频特性。
为了弥补上述缺陷,高频信号传输端子采用弹片式端子。
如图3所示,所述弹片式端子包括:端子本体41,在所述端子本体41的一端形成有焊接部42,在所述端子本体的另一端形成有接触部43;所述接触部43向第一方向弯曲。结合图3,所述第一方向朝向所述端子本体的内径方向。
结合图4,弹片式端子(又可称为折弯弹片式端子)的导体宽度均匀,端子本体上的宽度B和宽度A相差不大,适合高频信号传输,另外折弯弹片式端子靠嵌入式注射成型,不需要卡点,同步可以减小对信号的影响,也对高频传输有利。
在本公开实施例中,连接器的电源端子和接地端子采用第一类型端 子,用于进行大电流传输;连接器的高频信号传输端子采用第二类型端子,用于进行高频信号传输。因此,利用本公开实施例的方案,可同时满足大电流传输和高频信号传输的需求。
如图5所示,本公开实施例连接器的加工方法,包括:
步骤501、分别将第一排和第二排中的高频信号传输端子冲压成型,并进行电镀。
步骤502、将第一排和第二排中电镀后的高频信号传输端子进行嵌入式注射成型,并组装入第一壳体中。
步骤503、将所述第一壳体装入第二壳体中。
在此,将步骤502后的半成品,装入第二壳体中。
步骤504、在所述第二壳体中,分别对应第一排和第二排中的高频信号传输端子,装入电源端子和接地端子。
具体地,根据第一排端子和第二排端子所包括的具体端子的不同,在此步骤中,对应第一排中的高频信号传输端子装入电源端子,对应第二排中的高频信号传输端子,装入接地端子;或者,对应第一排中的高频信号传输端子装入接地端子,对应第二排中的高频信号传输端子,装入电源端子。
在本公开实施例中,连接器的电源端子和接地端子采用第一类型端子,用于进行大电流传输;连接器的高频信号传输端子采用第二类型端子,用于进行高频信号传输。因此,利用本公开实施例的方案,可同时满足大电流传输和高频信号传输的需求。
在以上的实施例中,为增强连接器的可靠性,控制电磁干扰,在步骤503之前,还可包括:在所述第一壳体中装入电磁干扰(Electromagnetic Interference,EMI)接地弹片。那么,步骤503可具体为将装入有所述EMI接地弹片的第一壳体装入第二壳体中。
在以上的实施例中,为增强连接器的可靠性,保证可靠连接,在步骤504之后,还可在所述第二壳体的第一侧面装入第一卡勾,在所述第二壳体的第二侧面装入第二卡勾。
以下,结合具体示意图,详细描述一下连接器的加工过程。
结合图6所示,分别将第一排和第二排中的高频信号传输端子冲压成型, 并进行电镀。
结合图7所示,将第一排和第二排中电镀后的高频信号传输端子进行嵌入式注射成型。
结合图8所示,将注射成型后的第一排高频信号传输端子和第二排高频信号传输端子组装在一起。
结合图9所示,图8组装后的半成品入第一壳体(前塑胶壳体)中。
结合图10所示,在所述第一壳体中装入电磁干扰接地弹片。
结合图11所示,将图10完成的所述第一壳体装入第二壳体(外铁壳)中。
结合图12和13所示,在所述第二壳体中,从第二壳体的尾部,装入电源端子和接地端子。
结合图14所示,在所述第二壳体的左侧装入第一卡勾,在所述第二壳体的右侧装入第二卡勾。
装配完成后的连接器如图15所示。
通过以上可以看出,通过对端子进行差异设计,采用不同组装、成型工艺,新连接器(Type C插头)即可满足大电流传输也满足高频信号传输。
以上只是列举了一种连接器的加工示意图。在实际应用中,高频信号传输端子和电源端子均可通过用插PIN方式进行安装。
此外,本公开实施例还提供了一种终端,包括前述任一的连接器。
利用本公开实施例的连接器,规避了满足USB3.0、USB3.1功能的Type C插头不能大电流充电的问题;规避了满足大电流充电功能的Type C插头不能满足USB3.0、USB3.1功能的问题。同时,还可实现高速传输、快速充电。
需要说明的是,在本文中,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括 该要素的过程、方法、物品或者装置中还存在另外的相同要素。
通过以上的实施方式的描述,本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现,当然也可以通过硬件,但很多情况下前者是更佳的实施方式。基于这样的理解,本公开的技术方案本质上或者说对相关技术做出贡献的部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中,包括若干指令用以使得一台终端设备(可以是手机,计算机,服务器,空调器,或者网络设备等)执行本公开各个实施例所述的方法。
上面结合附图对本公开的实施例进行了描述,但是本公开并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本公开的启示下,在不脱离本公开宗旨和权利要求所保护的范围情况下,还可做出很多形式,均属于本公开的保护之内。

Claims (8)

  1. 一种连接器,包括:第一排端子和第二排端子;所述第一排端子包括四个高频信号传输端子、两个电源端子和两个接地端子;所述第二排端子包括四个高频信号传输端子、两个电源端子和两个接地端子;其中,
    所述电源端子和所述接地端子采用第一类型端子,所述第一类型端子用于进行大电流传输;
    所述高频信号传输端子采用第二类型端子,所述第二类型端子用于进行高频信号传输。
  2. 根据权利要求1所述的连接器,其中,
    所述第一类型端子包括:下料式端子;所述第二类型端子包括:弹片式端子。
  3. 根据权利要求2所述的连接器,其中,所述下料式端子包括:
    端子本体,在所述端子本体的一端形成有连接部,在所述端子本体的另一端形成有焊接部;在所述端子本体靠近所述焊接部的第一位置形成有卡刺;
    其中,所述端子本体在第二位置的宽度大于所述连接部的宽度,所述第二位置位于所述连接部和所述卡刺之间。
  4. 根据权利要求2所述的连接器,其中,所述弹片式端子包括:
    端子本体,在所述端子本体的一端形成有焊接部,在所述端子本体的另一端形成有接触部;所述接触部向第一方向弯曲;
    所述第一方向朝向所述端子本体的内径方向。
  5. 一种连接器的加工方法,其中,所述连接器包括权利要求1-4任一项所述的连接器;所述方法包括:
    分别将第一排和第二排中的高频信号传输端子冲压成型,并进行电镀;
    将第一排和第二排中电镀后的高频信号传输端子进行嵌入式注射成型,并组装入第一壳体中;
    将所述第一壳体装入第二壳体中;
    在所述第二壳体中,装入电源端子和接地端子。
  6. 根据权利要求5所述的方法,其中,在所述将所述第一壳体装入第二 壳体中之前,还包括:
    在所述第一壳体中装入电磁干扰EMI接地弹片;
    所述将所述第一壳体装入第二壳体中,具体为:
    将装入有所述EMI接地弹片的第一壳体装入第二壳体中。
  7. 根据权利要求5或6所述的方法,其中,在所述装入电源端子和接地端子之后,所述方法还包括:
    在所述第二壳体的第一侧面装入第一卡勾,在所述第二壳体的第二侧面装入第二卡勾。
  8. 一种终端设备,包括:权利要求1-4任一项所述的连接器。
PCT/CN2020/071753 2019-01-15 2020-01-13 连接器、连接器的加工方法及终端设备 Ceased WO2020147675A1 (zh)

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