WO2020145449A1

WO2020145449A1 - Organic light-emitting display device

Info

Publication number: WO2020145449A1
Application number: PCT/KR2019/002603
Authority: WO
Inventors: 이승헌; 김명화; 김재범; 손경석; 이승준; 임준형
Original assignee: 삼성디스플레이 주식회사
Priority date: 2019-01-10
Filing date: 2019-03-06
Publication date: 2020-07-16
Also published as: US20220028963A1; CN113272969A; KR20200087368A

Abstract

An organic light-emitting display device may comprise: a substrate; a first active layer provided on the substrate; a gate insulating layer; a first gate electrode; a first interlayer insulating layer and a second interlayer insulating layer; a first source electrode which is provided on the second interlayer insulating layer and contacts the first active layer via a contact hole formed by removing portions of the gate insulating layer, the first interlayer insulating layer, and the second interlayer insulating layer; a protective insulating layer provided on the first source electrode; a first drain electrode which is provided on the protective insulating layer and contacts the first active layer via a contact hole formed by removing portions of the gate insulating layer, the first interlayer insulating layer, the second interlayer insulating layer, and the protective insulating layer; and a sub-pixel structure provided on the first drain electrode. Accordingly, the organic light-emitting display device can be operated at high resolution.

Description

Organic light emitting diode display

The present invention relates to an organic light emitting display device. More specifically, the present invention relates to an organic light emitting display device including different types of transistors.

The flat panel display device is used as a display device to replace the cathode ray tube display device due to characteristics such as light weight and thinness. A typical example of such a flat panel display device is a liquid crystal display device and an organic light emitting display device.

Recently, an organic light emitting display device including a silicon-based semiconductor element and a metal oxide-based semiconductor element has been developed. In order for the organic light emitting diode display to be driven at a high resolution, the organic light emitting diode display may include a relatively large number of signal lines. When the organic light emitting diode display includes a relatively large number of signal wires, a problem in that the width of the signal wires can be relatively reduced and the specific resistance of the signal wires is increased to arrange the signal wires in a limited space. Can occur. Also, two data lines may be included in the sub-pixel circuit in order to drive the organic light emitting diode display at a high speed. When the sub-pixel circuit includes two data lines, a problem may arise in that characteristics of a driving transistor disposed adjacent to the data lines are changed due to a variable voltage level of the data lines.

An object of the present invention is to provide an organic light emitting display device including different types of transistors.

However, the present invention is not limited by the above-described objects, and may be variously extended without departing from the spirit and scope of the present invention.

In order to achieve the above object of the present invention, an organic light emitting diode display according to exemplary embodiments of the present invention includes a substrate having a light emitting area including a first area and a second area, and the first area on the substrate. A first active layer having source and drain regions disposed thereon, a gate insulating layer disposed on the first active layer, a first gate electrode disposed on the gate insulating layer, and a first interlayer disposed on the first gate electrode An insulating layer, a second interlayer insulating layer disposed on the first interlayer insulating layer, a portion of the gate insulating layer, the first interlayer insulating layer, and the second interlayer insulating layer disposed on the second interlayer insulating layer A first source electrode connected to the source region of the first active layer through a contact hole formed by removing the protective insulating layer disposed on the first source electrode, disposed on the protective insulating layer, and gate insulating The first active layer is connected to the drain region of the first active layer through a contact hole formed by removing a portion of the layer, the first interlayer insulating layer, the second interlayer insulating layer, and the protective insulating layer. A first gate electrode, a first drain electrode defined as a driving transistor together with the first source electrode, a switching transistor disposed in the second region between the substrate and the protective insulating layer, and disposed on the switching and driving transistors It may include a lower electrode, a light emitting layer disposed on the lower electrode, and an upper electrode disposed on the light emitting layer.

In example embodiments, the first drain electrode may extend in a first direction, which is a direction from the first region to the second region on the protective insulating layer.

In example embodiments, a portion of the first drain electrode may overlap the first source electrode.

In example embodiments, a portion of the first drain electrode may overlap the first gate electrode.

In example embodiments, the first source electrode may include a single layer, and the first drain electrode may include a plurality of layers.

In example embodiments, the first source electrode may include molybdenum, and the first drain electrode may have a stacked structure of titanium/aluminum/titanium.

In example embodiments, the signal wiring disposed on the first drain electrode may be further included.

In example embodiments, a data signal is applied to the signal wiring, a high power voltage is applied to the first drain electrode, and a low power voltage is applied to the upper electrode.

In example embodiments, the switching transistor includes a second gate electrode, a second active layer disposed on the second gate electrode, and a second source and second drain electrode disposed on both sides of the second active layer. It may include.

In example embodiments, the first drain electrode may not overlap the second active layer.

In example embodiments, the driving transistor has an upper gate structure, the first active layer includes a silicon-based semiconductor, the switching transistor has a lower gate structure, and the second active layer is a metal oxide-based semiconductor. It may include.

In example embodiments, the first active layer of the first driving transistor may include amorphous silicon or polysilicon.

In example embodiments, a gate electrode pattern disposed on the first gate electrode may be further included.

In example embodiments, the gate electrode pattern may be on the same layer as the second gate electrode.

In example embodiments, the substrate may include a first organic layer, a first barrier layer disposed on the first organic layer, a second organic layer disposed on the first barrier layer, and a second organic layer disposed on the second organic layer. 2 may include a barrier layer.

In example embodiments, the substrate may further include a bending region spaced apart from the light emitting region, and the second barrier layer may have an opening exposing an upper surface of the second organic layer positioned in the bending region. have.

In example embodiments, the substrate further includes a bending region positioned apart from the light emitting region, disposed in the first and second regions on the substrate, extending to the bending region, and the bending region. A buffer layer having a first opening exposing an upper surface of the substrate positioned on the second opening covering the first active layer in the first region on the buffer layer and extending to the bending region, and overlapping the first opening The insulating layer further includes a gate insulating layer having an insulating layer and a third opening covering the first gate electrode in the first region on the gate insulating layer and extending to the bending region and overlapping the first and second openings. can do.

In example embodiments, further comprising a thin film encapsulation structure disposed on the upper electrode, the thin film encapsulation structure is a first thin film encapsulation layer comprising an inorganic material having flexibility, on the first thin film encapsulation layer The second thin film encapsulation layer may be disposed on the second thin film encapsulation layer, and the third thin film encapsulation layer may include an inorganic material having flexibility.

In example embodiments, the first source electrode may have a first thickness, and the first drain electrode may have a second thickness greater than the first thickness.

In order to achieve the above object of the present invention, an organic light emitting diode display according to exemplary embodiments of the present invention includes a substrate having a light emitting area and a bending area including a first area and a second area, and the agent on the substrate. A first active layer disposed in one region, having source and drain regions, a first gate electrode disposed on the first active layer, disposed on the first gate electrode, and disposed through the first contact hole. It is connected to the source region of the active layer, is disposed on the first source electrode and the first source electrode having a first thickness, is connected to the drain region of the first active layer through a second contact hole, the A driving transistor including a first drain electrode having a second thickness greater than a first thickness, a switching transistor disposed in the second region on the substrate, and a sub-pixel structure disposed on the switching and driving transistors may be included. have.

The organic light emitting diode display according to the exemplary embodiments of the present invention includes a driving transistor including a first drain electrode and a first source electrode disposed on different layers, so that the first drain electrode has a relatively large width and a large thickness. It can function as a wiring having a. Accordingly, the organic light emitting diode display can be driven at a high resolution.

In addition, a parasitic capacitance between the signal wiring and the driving transistor may not be formed by the organic light emitting diode display according to example embodiments of the present invention including a first drain electrode shielding the first active layer. Accordingly, the organic light emitting display device may maintain characteristics of the driving transistor.

However, the effects of the present invention are not limited to the above-described effects, and may be variously extended without departing from the spirit and scope of the present invention.

1 is a plan view illustrating an organic light emitting diode display according to example embodiments of the present invention.

2 is a plan view illustrating an example of the organic light emitting diode display of FIG. 1.

3 is a perspective view illustrating a shape in which the organic light emitting diode display of FIG. 1 is bent.

4 is a block diagram illustrating an external device electrically connected to the organic light emitting diode display of FIG. 1.

5 is a circuit diagram illustrating a sub pixel circuit and an organic light emitting diode disposed in the sub pixel circuit area of FIG. 1.

6 is a cross-sectional view of the organic light emitting display of FIG. 1 taken along the line I-I'.

7 to 13 are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to example embodiments of the present invention.

14 is a cross-sectional view illustrating an organic light emitting diode display according to example embodiments of the present invention.

15 is a cross-sectional view illustrating an example of the OLED display of FIG. 14.

Hereinafter, an organic light emitting display device and a method of manufacturing the organic light emitting display device according to exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or similar reference numerals are used for the same or similar components.

1 is a plan view showing an organic light emitting display device according to exemplary embodiments of the present invention, FIG. 2 is a plan view showing an example of the organic light emitting display device of FIG. 1, and FIG. 3 is an organic light emitting display device of FIG. 1. Is a perspective view for explaining a bent shape, and FIG. 4 is a block diagram for explaining an external device electrically connected to the organic light emitting display device of FIG. 1.

1, 3 and 4, the organic light emitting diode display 100 (eg, the substrate 110 of FIG. 6) may include a display area 10 and a pad area 60. The display area 10 may include a light emitting area 30 including a plurality of sub-pixel circuit areas 20 and a peripheral area 40 surrounding the light emitting area 30, and the light emitting area 30 includes The sub-pixel circuit regions 20 may be arranged as a whole. For example, a sub-pixel circuit (SUB-PIXEL CIRCUIT) of FIG. 5 (for example, a driving transistor 250 and a switching transistor 255 of FIG. 6) may be disposed in each of the sub-pixel circuit regions 20. The organic light emitting diode OLED (eg, the sub pixel structure 200 of FIG. 6) may be disposed on the sub pixel circuit SUB-PIXEL CIRCUIT. An image may be displayed on the display area 10 through a sub-pixel circuit (SUB-PIXEL CIRCUIT) and an organic light emitting diode (OLED).

For example, first, second, and third sub pixel circuits may be disposed in the sub pixel circuit regions 20. The first sub-pixel circuit may be connected to a first organic light-emitting diode that can emit red light, and the second sub-pixel circuit may be connected to a second organic light-emitting diode that can emit green light. The 3 sub-pixel circuit may be connected to a third organic light emitting diode capable of emitting blue light.

In example embodiments, the first organic light emitting diode may be disposed to overlap the first sub pixel circuit, and the second organic light emitting diode may be disposed to overlap the second sub pixel circuit, and the first The three organic light emitting diodes may be disposed to overlap the third sub pixel circuit. Optionally, the first organic light emitting diode may be disposed to overlap with a part of the first sub pixel circuit and a part of a sub pixel circuit different from the first sub pixel circuit, and the second organic light emitting diode may include the second organic light emitting diode. A portion of the sub-pixel circuit and a portion of the second sub-pixel circuit and other sub-pixel circuits may be disposed to overlap, and the third organic light emitting diode may be disposed with a portion of the third sub-pixel circuit and the third sub-pixel circuit. It may be arranged to overlap with a part of another sub-pixel circuit. For example, the first to third organic light emitting diodes are the RGB stripe method in which rectangles of the same size are sequentially arranged, and an S-stripe including a blue organic light emitting diode having a relatively large area. ) Method, a WRGB method further including a white organic light emitting diode, and a pentile method listed in a RG-GB repetition form.

Also, at least one driving transistor, at least one switching transistor, and at least one capacitor may be disposed in each of the plurality of sub-pixel circuit regions 20. In example embodiments, one driving transistor (eg, the first transistor TR1 in FIG. 5) and six switching transistors (eg, FIG. 5) are provided in each of the sub-pixel circuit regions 20. The second to seventh transistors TR2, TR3, TR4, TR5, TR6, TR7, one storage capacitor (for example, the storage capacitor CST of FIG. 5) may be disposed.

However, although the shape of each of the display area 10, the peripheral area 20, and the sub-pixel circuit area 30 of the present invention has been described as having a rectangular planar shape, the shape is not limited thereto. For example, the shape of each of the display area 10, the peripheral area 20, and the sub-pixel circuit area 30 is a triangular plane shape, a rhombus plane shape, a polygonal plane shape, a circular plane shape, a track shape It may have a flat shape or an oval flat shape.

Moreover, a plurality of wires may be disposed in the peripheral area 40. For example, the wires may include a data signal wire, a gate signal wire, a light emission control signal wire, a gate initialization signal wire, an initialization voltage, and a power voltage wire. The wirings may extend from the peripheral area 40 to the light emitting area 30 to be electrically connected to a sub-pixel circuit (SUB-PIXEL CIRCUIT) and an organic light emitting diode (OLED). Moreover, a gate driver, a data driver, and the like may be disposed in the peripheral area 40.

The pad area 60 may be positioned on one side of the display area 10, and the pad area 60 may include a bending area 50 and a pad electrode area 70. The pad electrodes 470 electrically connected to the external device 101 may be disposed in the pad electrode area 70. Also, the bending area 50 may be positioned between the display area 10 and the pad electrode area 70, and connection electrodes may be disposed in the bending area 50. For example, the connection electrodes may electrically connect the pad electrodes 470 and the sub-pixel circuit (SUB-PIXEL CIRCUIT). In example embodiments, the organic light emitting diode display 100 may have the same width in the horizontal direction (eg, the third direction D3).

In other exemplary embodiments, as illustrated in FIG. 2, the width of the pad area 60 may be smaller than the width of the display area 10. For example, in the plan view of the organic light emitting diode display 100, the display area 10 extends in a direction parallel to the top surface of the organic light emitting diode display 100 (eg, in the third direction D3). It may have a width, and the pad area 60 may extend in the third direction D3 and have a second width smaller than the first width.

However, although the width of the peripheral region 40 surrounding the light emitting region 30 is shown in FIG. 1, the configuration of the present invention is not limited thereto. For example, the peripheral area 40 may include a first peripheral area extending in the third direction D3 and a first extending area D1 or the second direction D2 orthogonal to the third direction D3. 2 may include a surrounding area. In other words, the first peripheral area of the peripheral area 40 may be positioned adjacent to the upper and bending areas 50 of the light emitting area 30, and the second peripheral area of the peripheral area 40 may include the light emitting area 30. ) May be located on both sides (for example, left and right sides of the emission region 30 ). Here, the width extending in the third direction D3 of the second peripheral area may be relatively smaller than the width extending in the first direction D1 or the second direction D2 of the first peripheral area. By bending the bending area 50 in the third direction D3 as an axis, the pad electrode area 70 may be positioned on the bottom surface of the organic light emitting display device 100 (see FIG. 3 ). In other words, when the pad electrode area 70 is positioned on the bottom surface of the organic light emitting diode display 100, the bending area 50 may have a curved shape.

The external device 101 may be electrically connected to the organic light emitting diode display 100 through a flexible printed circuit board or a printed circuit board. For example, one side of the flexible printed circuit board may directly contact the pad electrodes 470, and the other side of the flexible printed circuit board may directly contact the external device 101. The external device 101 may provide a data signal, a gate signal, a light emission control signal, a gate initialization signal, an initialization voltage, and a power supply voltage to the organic light emitting diode display 100. Further, a driving integrated circuit may be mounted on the flexible printed circuit board. In other exemplary embodiments, the driving integrated circuit may be mounted on the organic light emitting diode display 100 adjacent to the pad electrodes 470.

Referring to FIG. 5, a sub-pixel circuit (SUB-PIXEL CIRCUIT: SPC) and an organic light-emitting diode (OLED) may be disposed in each of the sub-pixel circuit regions 20 of the organic light-emitting display device 100, and The sub-pixel circuit SPC includes an organic light emitting diode (OLED) (eg, the sub-pixel structure 200 of FIG. 6 ), and the first to seventh transistors TR1, TR2, TR3, TR4, TR5, TR6, TR7 ) And storage capacitor (CST), high power voltage (ELVDD) wiring, low power supply voltage (ELVSS) wiring, initialization voltage (VINT) wiring, data signal (DATA) wiring, gate signal (GW) wiring, gate initialization signal (GI) ) Wiring, emission control signal (EM) wiring, diode initialization signal (GB) wiring, and the like.

The organic light emitting diode OLED may output light based on the driving current ID. The organic light emitting diode OLED may include a first terminal and a second terminal. In example embodiments, the second terminal of the organic light emitting diode OLED may be supplied with a low power voltage ELVSS. For example, the first terminal of the organic light emitting diode (OLED) may be an anode terminal, and the second terminal of the organic light emitting diode (OLED) may be a cathode terminal. Optionally, the first terminal of the organic light emitting diode (OLED) may be a cathode terminal, and the second terminal of the organic light emitting diode (OLED) may be an anode terminal. In example embodiments, the anode terminal of the organic light emitting diode (OLED) may correspond to the lower electrode 290 of FIG. 6, and the cathode terminal of the organic light emitting diode (OLED) may include the upper electrode of FIG. 6 ( 340).

The first transistor TR1 (eg, corresponding to the driving transistor 250 of FIG. 6) may include a gate terminal, a first terminal, and a second terminal. In example embodiments, the first terminal of the first transistor TR1 may be a source terminal, and the second terminal of the first transistor TR1 may be a drain terminal. Optionally, the first terminal of the first transistor TR1 may be a drain terminal, and the second terminal of the first transistor TR1 may be a source terminal.

The first transistor TR1 may generate a driving current ID. In example embodiments, the first transistor TR1 may operate in the saturation region. In this case, the first transistor TR1 may generate a driving current ID based on a voltage difference between the gate terminal and the source terminal. In addition, the gradation may be expressed based on the size of the driving current ID supplied to the organic light emitting diode OLED. Alternatively, the first transistor TR1 may operate in a linear region. In this case, the gradation may be expressed based on the sum of the time at which the driving current is supplied to the organic light emitting diode (OLED) within one frame.

The second transistor TR2 may include a gate terminal, a first terminal, and a second terminal. The gate terminal GW may be supplied to the gate terminal of the second transistor TR2. The first terminal of the second transistor TR2 may receive a data signal DATA. The second terminal of the second transistor TR2 may be connected to the first terminal of the first transistor TR1. For example, the gate signal GW may be provided from the gate driver, and the gate signal GW may be applied to the gate terminal of the second transistor TR2 through the gate signal GW wiring. In example embodiments, the first terminal of the second transistor TR2 may be a source terminal, and the second terminal of the second transistor TR2 may be a drain terminal. Optionally, the first terminal of the second transistor TR2 may be a drain terminal, and the second terminal of the second transistor TR2 may be a source terminal.

The second transistor TR2 may supply the data signal DATA to the first terminal of the first transistor TR1 during the activation period of the gate signal GW. In this case, the second transistor TR2 may operate in a linear region.

The third transistor TR3 may include a gate terminal, a first terminal, and a second terminal. The gate terminal GW may be supplied to the gate terminal of the third transistor TR3. The first terminal of the third transistor TR3 may be connected to the gate terminal of the first transistor TR1. The second terminal of the third transistor TR3 may be connected to the second terminal of the first transistor TR1. For example, a gate signal GW may be provided from the gate driver, and the gate signal GW may be applied to the gate terminal of the third transistor TR3 through the gate signal GW wiring. In example embodiments, the first terminal of the third transistor TR3 may be a source terminal, and the second terminal of the third transistor TR3 may be a drain terminal. Optionally, the first terminal of the third transistor TR3 may be a drain terminal, and the second terminal of the third transistor TR3 may be a source terminal.

The third transistor TR3 may connect the gate terminal of the first transistor TR1 and the second terminal of the first transistor TR1 during the activation period of the gate signal GW. In this case, the third transistor TR3 may operate in a linear region. That is, the third transistor TR3 may diode-connect the first transistor TR1 during the activation period of the gate signal GW. Since the first transistor TR1 is diode-connected, a voltage difference as much as the threshold voltage of the first transistor TR1 may occur between the first terminal of the first transistor TR1 and the gate terminal of the first transistor TR1. As a result, the voltage added to the voltage of the data signal DATA supplied to the first terminal of the first transistor TR1 by the voltage difference (that is, the threshold voltage) during the activation period of the gate signal GW is the first transistor. It may be supplied to the gate terminal of (TR1). That is, the data signal DATA can be compensated by the threshold voltage of the first transistor TR1, and the compensated data signal DATA can be supplied to the gate terminal of the first transistor TR1. As a result of performing the threshold voltage compensation, a problem in driving current non-uniformity caused by a threshold voltage deviation of the first transistor TR1 may be solved.

The input terminal of the initialization voltage wiring provided with the initialization voltage VINT may be connected to the first terminal of the fourth transistor TR4 and the first terminal of the seventh transistor TR7, and the output terminal of the initialization voltage wiring is the fourth transistor It may be connected to the second terminal of (TR4) and the first terminal of the storage capacitor (CST).

The fourth transistor TR4 may include a gate terminal, a first terminal, and a second terminal. The gate terminal of the fourth transistor TR4 may receive a gate initialization signal GI. The first terminal of the fourth transistor TR4 may be supplied with an initialization voltage VINT. The second terminal of the fourth transistor TR4 may be connected to the gate terminal of the first transistor TR1. In example embodiments, the first terminal of the fourth transistor TR4 may be a source terminal, and the second terminal of the fourth transistor TR4 may be a drain terminal. Optionally, the first terminal of the fourth transistor TR4 may be a drain terminal, and the second terminal of the fourth transistor TR4 may be a source terminal.

The fourth transistor TR4 may supply the initialization voltage VINT to the gate terminal of the first transistor TR1 during the activation period of the gate initialization signal GI. In this case, the fourth transistor TR4 may operate in a linear region. That is, the fourth transistor TR4 may initialize the gate terminal of the first transistor TR1 to the initialization voltage VINT during the activation period of the gate initialization signal GI. In example embodiments, the voltage level of the initialization voltage VINT may have a voltage level sufficiently lower than the voltage level of the data signal DATA maintained by the storage capacitor CST in the previous frame, and the initialization voltage (VINT) may be supplied to the gate terminal of the first transistor TR1. In other exemplary embodiments, the voltage level of the initialization voltage may have a voltage level sufficiently higher than the voltage level of the data signal held by the storage capacitor in the previous frame, and the initialization voltage is applied to the gate terminal of the first transistor. Can be supplied.

In example embodiments, the gate initialization signal GI may be a signal substantially the same as the gate signal GW one horizontal time ago. For example, a gate initialization signal GI supplied to a sub-pixel circuit in the nth (where n is an integer greater than or equal to 2) row among a plurality of sub-pixel circuits included in the organic light emitting diode display 100 is the sub-pixel. It may be a signal substantially the same as the gate signal GW supplied to the sub-pixel circuit in the (n-1) row among the circuits. That is, by supplying the activated gate signal GW to the first sub-pixel circuit in the (n-1) row of the sub-pixel circuits SPC, the n-th first sub-pixel circuit in the sub-pixel circuits SPC It is possible to supply an activated gate initialization signal (GI). As a result, the first transistor TR1 included in the sub-pixel circuit of the n-row among the sub-pixel circuits SPC while supplying the data signal DATA to the sub-pixel circuit of the (n-1) row of the sub-pixel circuits ) May be initialized with the initialization voltage VINT.

The fifth transistor TR5 may include a gate terminal, a first terminal, and a second terminal. The gate terminal may be supplied with a light emission control signal EM. The first terminal may be connected to a high power voltage (ELVDD) wire. The second terminal may be connected to the first terminal of the first transistor TR1. For example, the emission control signal EM may be provided from the emission control driver, and the emission control signal EM may be applied to the gate terminal of the fifth transistor TR5 through the emission control signal EM wiring. . In example embodiments, the first terminal of the fifth transistor TR5 may be a source terminal, and the second terminal of the fifth transistor TR5 may be a drain terminal. Optionally, the first terminal of the fifth transistor TR5 may be a drain terminal, and the second terminal of the fifth transistor TR5 may be a source terminal.

The fifth transistor TR5 may supply the high power voltage ELVDD to the first terminal of the first transistor TR1 during the activation period of the emission control signal EM. Conversely, the fifth transistor TR5 may block the supply of the high power voltage ELVDD during an inactive period of the emission control signal EM. In this case, the fifth transistor TR5 may operate in the linear region. The fifth transistor TR5 supplies the high power voltage ELVDD to the first terminal of the first transistor TR1 during the activation period of the emission control signal EM, so that the first transistor TR1 has the driving current ID. Can generate In addition, the data signal DATA supplied to the first terminal of the first transistor TR1 is blocked by the fifth transistor TR5 blocking the supply of the high power voltage ELVDD during the inactive period of the emission control signal EM. It may be supplied to the gate terminal of the first transistor TR1.

The sixth transistor TR6 may include a gate terminal, a first terminal, and a second terminal. The gate terminal may be supplied with a light emission control signal EM. The first terminal may be connected to the second terminal of the first transistor TR1. The second terminal may be connected to the first terminal of the organic light emitting diode (OLED). In example embodiments, the first terminal of the sixth transistor TR6 may be a source terminal, and the second terminal of the sixth transistor TR6 may be a drain terminal. Optionally, the first terminal of the sixth transistor TR6 may be a drain terminal, and the second terminal of the sixth transistor TR6 may be a source terminal.

The sixth transistor TR6 may supply the driving current ID generated by the first transistor TR1 during the activation period of the emission control signal EM to the organic light emitting diode OLED. In this case, the sixth transistor TR6 may operate in a linear region. That is, the organic light emitting diode OLED is provided by the sixth transistor TR6 supplying the driving current ID generated by the first transistor TR1 to the organic light emitting diode OLED during the activation period of the light emission control signal EM. Can output light. In addition, the sixth transistor TR6 electrically separates the first transistor TR1 and the organic light emitting diode OLED from each other during an inactive period of the emission control signal EM, thereby connecting the second terminal of the first transistor TR1 to the second terminal. The supplied data signal DATA (in other words, a data signal with threshold voltage compensation) may be supplied to the gate terminal of the first transistor TR1.

The seventh transistor TR7 may include a gate terminal, a first terminal, and a second terminal. The gate terminal may receive a diode initialization signal GB. The first terminal may be supplied with an initialization voltage VINT. The second terminal may be connected to the first terminal of the organic light emitting diode (OLED). In example embodiments, the first terminal of the seventh transistor TR7 may be a source terminal, and the second terminal of the seventh transistor TR7 may be a drain terminal. Optionally, the first terminal of the seventh transistor TR7 may be a drain terminal, and the second terminal of the seventh transistor TR7 may be a source terminal.

The seventh transistor TR7 may supply the initialization voltage VINT to the first terminal of the organic light emitting diode OLED during the activation period of the diode initialization signal GB. In this case, the seventh transistor TR7 may operate in a linear region. That is, the seventh transistor TR7 may initialize the first terminal of the organic light emitting diode OLED to the initialization voltage VINT during the activation period of the diode initialization signal GB.

Alternatively, the gate initialization signal GI and the diode initialization signal GB may be substantially the same signal. The operation of initializing the gate terminal of the first transistor TR1 and the operation of initializing the first terminal of the organic light emitting diode OLED may not affect each other. That is, the operation of initializing the gate terminal of the first transistor TR1 and the operation of initializing the first terminal of the organic light emitting diode OLED may be independent of each other. Accordingly, by not separately generating the diode initialization signal GB, the economic efficiency of the process can be improved.

The storage capacitor CST may include a first terminal and a second terminal. The storage capacitor CST may be connected between the high power voltage ELVDD line and the gate terminal of the first transistor TR1. For example, the first terminal of the storage capacitor CST may be connected to the gate terminal of the first transistor TR1, and the second terminal of the storage capacitor CST may be connected to the high power voltage ELVDD wiring. The storage capacitor CST may maintain the voltage level of the gate terminal of the first transistor TR1 during an inactive period of the scan signal GW. The deactivation period of the scan signal GW may include an activation period of the emission control signal EM, and the driving current ID generated by the first transistor TR1 during the activation period of the emission control signal EM is organic. It can be supplied to the light emitting diode (OLED). Therefore, the driving current ID generated by the first transistor TR1 may be supplied to the organic light emitting diode OLED based on the voltage level maintained by the storage capacitor CST.

However, although the sub-pixel circuit (SPC) of the present invention has been described as including seven transistors and one storage capacitor, the configuration of the present invention is not limited thereto. For example, the sub-pixel circuit SPC may have a configuration including at least one transistor and at least one storage capacitor.

6 is a cross-sectional view of the organic light emitting display device of FIG. 1 taken along an I-I' line, FIG. 7 is a cross-sectional view showing an example of the organic light emitting display device of FIG. 6, and FIG. 8 is an organic light emitting display of FIG. 6 It is a sectional view showing another example of the device.

Referring to FIG. 6, the organic light emitting diode display 100 includes a substrate 110, a buffer layer 115, a driving transistor 250, a switching transistor 255, a gate electrode pattern 180, a gate insulating layer 150, The first interlayer insulating layer 190, the second interlayer insulating layer 195, the protective insulating layer 400, the first flattening layer 270, the signal wiring 350, the connection pattern 370, the second flattening layer ( 275), a sub-pixel structure 200, a pixel defining layer 310, a thin film encapsulation structure 450, and the like. Here, the substrate 110 may include a first organic layer 111, a first barrier layer 112, a second organic layer 113, and a second barrier layer 114. The organic light emitting diode display 100 includes a display area 10 including a light emitting area 30 and a peripheral area 40, and a pad area 60 including a bending area 50 and a pad electrode area 70. Accordingly, the substrate 110 may also be divided into a display area 10 and a pad area 60. In addition, the driving transistor 250 may include a first active layer 130, a first gate electrode 170, a first source electrode 210 and a first drain electrode 230, and a switching transistor 255 The second active layer 135, the second gate electrode 175, the second source electrode 215 and the second drain electrode 235 may be included. Moreover, the sub-pixel structure 200 may include a lower electrode 290, a light emitting layer 330, and an upper electrode 340, and the thin film encapsulation structure 450 includes a first thin film encapsulation layer 451 and a second thin film. An encapsulation layer 452 and a third thin film encapsulation layer 453 may be included.

The organic light emitting display device 100 may function as a flexible organic light emitting display device by including the flexible substrate 110 and the thin film encapsulation structure 450.

The first organic layer 111 may be provided. The first organic layer 111 may include an organic material having flexibility. In example embodiments, the first organic layer 111 may include polyimide or the like.

The first barrier layer 112 may be entirely disposed on the first organic layer 111. The first barrier layer 112 may block moisture penetrating through the first organic layer 111. The first barrier layer 112 may include an inorganic material having flexibility. In example embodiments, the first barrier layer 112 may include silicon oxide or silicon nitride.

The second organic layer 113 may be disposed on the first barrier layer 112. The second organic layer 113 may be entirely disposed on the first barrier layer 112. The second organic layer 113 may include a flexible organic material. In example embodiments, the second organic layer 115 may include polyimide or the like.

The second barrier layer 114 may be disposed on the second organic layer 113. In example embodiments, the second barrier layer 114 may have an opening exposing the top surface of the second organic layer 113 positioned in the bending region 50. The second barrier layer 114 may block moisture penetrating through the second organic layer 113. The second barrier layer 114 may include an inorganic material having flexibility. In example embodiments, the second barrier layer 114 may include silicon oxide or silicon nitride. Optionally, an opening is not formed in the second barrier layer 114 positioned in the bending region 50 or an opening is formed in the second organic layer 113 and the second barrier layer 114 positioned in the bending region 50. It may be.

Accordingly, the substrate 110 including the first organic layer 111, the first barrier layer 112, the second organic layer 113, and the second barrier layer 114 may be configured. In example embodiments, the substrate 110 may have a first region 11 and a second region 12, and the first region 11 and the second region 12 may be positioned adjacently. have. For example, the first region 11 may be a region in which a driving transistor is disposed, and the second region 12 may be a region in which a switching transistor is disposed. In example embodiments, since the opening is formed in the second barrier layer 114, the substrate 110 may have a groove in the bending region 50.

However, although the substrate 110 has been described as having four layers, the configuration of the present invention is not limited thereto. For example, in other example embodiments, the substrate 110 may include a single layer or at least two layers.

In other example embodiments, the substrate 110 may include a transparent or opaque material. For example, the substrate 110 may be a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz substrate, a sodalime glass substrate, or a non-alkali substrate. alkali) glass substrates and the like.

The buffer layer 115 may be disposed on the substrate 110. In example embodiments, the buffer layer 115 may be extended to the bending region 50 while being disposed in the first region 11 and the second region 12 on the substrate 110, and the bending region 50 A first opening exposing the upper surface of the substrate 110 (eg, the upper surface of the second organic layer 113) may be provided. The buffer layer 115 may prevent diffusion of metal atoms or impurities from the substrate 110 to the driving transistor 250, the switching transistor 255, and the sub-pixel structure 200, and the first active layer 130 It is possible to obtain a substantially uniform first active layer 130 by controlling the rate of heat transfer during the crystallization process to form. In addition, when the surface of the substrate 110 is not uniform, the buffer layer 115 may serve to improve the flatness of the surface of the substrate 110. Depending on the type of the substrate 110, two or more buffer layers 115 may be provided on the substrate 110, or the buffer layer 115 may not be disposed. For example, the buffer layer 115 may include an organic material or an inorganic material.

The first active layer 130 may be disposed in the first region 11 on the buffer layer 115. For example, the first active layer 130 may include an oxide semiconductor, amorphous silicon, poly silicon, or an organic semiconductor. In example embodiments, the first active layer 130 may include a silicon-based semiconductor, and may be formed of the amorphous silicon or the polysilicon. In example embodiments, the first active layer 130 may have a source region and a drain region.

The gate insulating layer 150 may be disposed in the first region 11 and the second region 12 on the buffer layer 115 and the first active layer 130. In example embodiments, the gate insulating layer 150 covers the first active layer 130 in the first region 11 on the substrate 110 and may extend into the bending region 50, It may have a second opening overlapping the first opening. For example, the gate insulating layer 150 may sufficiently cover the first active layer 130 on the buffer layer 115, and may have a substantially flat top surface without generating a step around the first active layer 130. Can. Alternatively, the gate insulating layer 150 covers the first active layer 130 on the buffer layer 115 and may be disposed to have substantially the same thickness along the profile of the first active layer 130. The gate insulating layer 150 may include silicon compounds, metal oxides, and the like. For example, the gate insulating layer 150 includes silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon oxycarbide (SiOxCy), silicon carbonitride (SiCxNy), aluminum oxide (AlOx), Aluminum nitride (AlNx), tantalum oxide (TaOx), hafnium oxide (HfOx), zirconium oxide (ZrOx), titanium oxide (TiOx), and the like. Optionally, the gate insulating layer 150 may have a multi-layer structure having a plurality of insulating layers comprising different materials from each other.

The first gate electrode 170 may be disposed in the first region 11 on the gate insulating layer 150. For example, the first gate electrode 170 may be disposed on a portion of the gate insulating layer 150 on which the first active layer 130 is located. The first gate electrode 170 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, and a transparent conductive material. These may be used alone or in combination with each other. Optionally, the first gate electrode 170 may have a multi-layer structure including a plurality of layers.

The first interlayer insulating layer 190 may be disposed in the first region 11 and the second region 12 on the gate insulating layer 150 and the first gate electrode 170. In example embodiments, the first interlayer insulating layer 190 covers the first gate electrode 170 in the first region 11 on the gate insulating layer 150 and extends to the bending region 50. And a third opening overlapping the first and second openings. For example, the first interlayer insulating layer 190 may sufficiently cover the first gate electrode 170 on the gate insulating layer 150, and substantially without generating a step around the first gate electrode 170. It can have a flat top surface. Alternatively, the first interlayer insulating layer 190 covers the first gate electrode 170 on the gate insulating layer 150 and may be disposed to have substantially the same thickness along the profile of the first gate electrode 170. . The first interlayer insulating layer 190 may include a silicon compound, a metal oxide, and the like. Optionally, the first interlayer insulating layer 190 may have a multi-layer structure having a plurality of insulating layers comprising different materials from each other.

The gate electrode pattern 180 may be disposed in the first region 11 on the interlayer insulating layer 190. The gate electrode pattern 180 may be disposed on a portion of the first interlayer insulating layer 190 on which the first gate electrode 170 is located. In another cross-sectional view of the organic light emitting diode display 100, the first gate electrode 170 and the gate electrode pattern 180 may function as the storage capacitor CST of FIG. 5. The gate electrode pattern 180 may include metal, metal alloys, metal nitrides, conductive metal oxides, and transparent conductive materials. Optionally, the gate electrode pattern 180 may have a multi-layer structure including a plurality of layers.

The second gate electrode 175 may be disposed in the second region 12 on the interlayer insulating layer 190. In other words, the second gate electrode 175 may be spaced apart from the gate electrode pattern 180. In example embodiments, the second gate electrode 175 may be positioned on the same layer as the gate electrode pattern 180, and may be simultaneously formed using the same material. The second gate electrode 175 may include metal, metal alloys, metal nitrides, conductive metal oxides, and transparent conductive materials.

A second interlayer insulating layer 195 may be disposed in the first region 11 and the second region 12 on the gate electrode pattern 180 and the second gate electrode 175. In example embodiments, the second interlayer insulating layer 195 includes a gate electrode pattern 180 in the first region 11 on the first interlayer insulating layer 190 and a second gate in the second region 12. The electrode 175 may be covered, extend to the bending region 50, and have a fourth opening overlapping the first to third openings. For example, the second interlayer insulating layer 195 may sufficiently cover the gate electrode pattern 180 and the second gate electrode 175 on the first interlayer insulating layer 190, and the gate electrode pattern 180 and the first 2 It is possible to have a substantially flat top surface without generating a step around the gate electrode 175. Alternatively, the second interlayer insulating layer 195 covers the gate electrode pattern 180 and the second gate electrode 175 on the first interlayer insulating layer 190, and the gate electrode pattern 180 and the second gate electrode It may be disposed substantially the same thickness along the profile of (175). The second interlayer insulating layer 195 may include a silicon compound, a metal oxide, or the like. Optionally, the second interlayer insulating layer 195 may have a multi-layer structure having a plurality of insulating layers comprising different materials from each other.

The first source electrode 210 may be disposed in the first region 11 on the second interlayer insulating layer 195. The first source electrode 210 is first through the first contact hole 212 formed by removing a portion of the gate insulating layer 150, the first interlayer insulating layer 190, and the second interlayer insulating layer 195. The active layer 130 may be connected to a source region. The first source electrode 210 may include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, and the like. For example, the first source electrode 210 is gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg) ), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), alloy containing aluminum, aluminum nitride (AlNx), alloy containing silver, tungsten nitride (WNx), alloy containing copper, alloy containing molybdenum, titanium nitride (TiNx), chromium nitride (CrNx), tantalum nitride (TaNx), strontium ruthenium oxide (SrRuxOy), zinc oxide (ZnOx), indium tin oxide (ITO), tin oxide (SnOx), indium oxide (InOx), gallium oxide (GaOx), indium zinc Oxides (IZO), and the like. These may be used alone or in combination with each other.

In example embodiments, the first source electrode 210 may have a first thickness T1 and may be formed as a single layer. For example, the first source electrode 210 may include molybdenum. Also, the first source electrode 210 may function as an electrode. In other words, since the first source electrode 210 functions as an electrode, the first drain electrode 230 functioning as a wiring, the signal wiring 350 and the connection pattern 370 may have a relatively high resistivity. In other example embodiments, the first source electrode 210 may have a multi-layer structure including a plurality of layers.

The second active layer 135 may be disposed in the second region 12 on the second interlayer insulating layer 195. The second active layer 135 may be disposed on a portion of the second interlayer insulating layer 195 where the second gate electrode 175 is positioned below. The second active layer 135 may include an oxide semiconductor. In other words, the second active layer 135 is indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr) , It may be a semiconductor oxide layer including a bi-component compound (ABx), ternary compound (ABxCy), tetra-component compound (ABxCyDz) containing magnesium (Mg) and the like. For example, the second active layer 135 includes zinc oxide (ZnOx), gallium oxide (GaOx), titanium oxide (TiOx), tin oxide (SnOx), indium oxide (InOx), indium-gallium oxide (IGO), Indium-zinc oxide (IZO), indium-tin oxide (ITO), gallium-zinc oxide (GZO), zinc-magnesium oxide (ZMO), zinc-tin oxide (ZTO), zinc-zirconium oxide (ZnZrxOy), indium- Including gallium-zinc oxide (IGZO), indium-zinc-tin oxide (IZTO), indium-gallium-hafnium oxide (IGHO), tin-aluminum-zinc oxide (TAZO), and indium-gallium-tin oxide (IGTO) can do.

The second source electrode 215 and the second drain electrode 235 may be disposed in the second region 12 on the second interlayer insulating layer 195. The second source electrode 215 may cover the first side of the second active layer 135, and the second drain electrode 235 may be a second side different from the first side of the second active layer 135. Can cover. In other words, the second source and

second drain electrodes

215 and 235 may be disposed on both sides of the second active layer 135 and expose a portion of the upper surface of the second active layer 135. . Each of the second source electrode 215 and the second drain electrode 235 may include metal, alloy, metal nitride, conductive metal oxide, and transparent conductive material. These may be used alone or in combination with each other.

In example embodiments, each of the second source electrode 215 and the second drain electrode 235 may have a first thickness T1 and may be formed as a single layer. For example, each of the second source electrode 215 and the second drain electrode 235 may include molybdenum. In addition, each of the second source electrode 215 and the second drain electrode 235 may function as an electrode. In other words, since each of the second source electrode 215 and the second drain electrode 235 functions as an electrode, relative to the first drain electrode 230 functioning as a wiring, the signal wiring 350 and the connection pattern 370 As a result, it can have a high specific resistance. In other exemplary embodiments, the second drain electrode 235 and the first source electrode 210 may be integrally formed.

In example embodiments, the first source electrode 210 and the second source and

second drain electrodes

215 and 235 may be located on the same layer and may be formed simultaneously using the same material. In other exemplary embodiments, each of the second source electrode 215 and the second drain electrode 235 may have a multi-layer structure including a plurality of layers. Accordingly, the switching transistor 255 including the second active layer 135, the second gate electrode 175, the second source electrode 215, and the second drain electrode 235 may be configured. Here, the switching transistor 255 may function as a switching transistor including an oxide-based semiconductor. In addition, the switching transistor 255 may function as a transistor having a lower gate structure. For example, the switching transistor 255 may be one of the second to seventh transistors TR2, TR3, TR4, TR5, TR6, and TR7 illustrated in FIG. 5.

A protective insulating layer (195) on the first region 11 and the second region 12 on the second interlayer insulating layer 195, the first source electrode 210, and the second source and

second drain electrodes

215, 235 400) may be disposed. In example embodiments, the protective insulating layer 400 includes a first source electrode 210 in the first region 11 on the second interlayer insulating layer 195 and a second source in the second region 12. The

second drain electrodes

215 and 235 may be covered, extend to the bending region 50, and have a fifth opening overlapping the first to fourth openings. For example, the protective insulating layer 400 may sufficiently cover the first source electrode 210 and the second source and

second drain electrodes

215 and 235 on the second interlayer insulating layer 195. A substantially flat top surface may be formed without generating a step around the source electrode 210 and the second source and

second drain electrodes

215 and 235. Alternatively, the protective insulating layer 400 covers the first source electrode 210 and the second source and

second drain electrodes

215 and 235 on the second interlayer insulating layer 195, and the first source electrode ( 210) and the second source and

second drain electrodes

215 and 235 may be disposed to have substantially the same thickness. The protective insulating layer 400 may include silicon compounds, metal oxides, and the like. Optionally, the protective insulating layer 400 may have a multi-layer structure having a plurality of insulating layers including different materials from each other.

The first drain electrode 230 may be disposed in the first region 11 on the protective insulating layer 400. In other words, the first source electrode 210 and the first drain electrode 230 may be disposed on different layers. The first drain electrode 230 is a second contact hole formed by removing a portion of the gate insulating layer 150, the first interlayer insulating layer 190, the second interlayer insulating layer 195, and the protective insulating layer 400 The drain region of the first active layer 130 may be connected through 232. In example embodiments, the first drain electrode 230 may have a second thickness T2 greater than the first thickness T1, and may be formed of a plurality of layers.

The first drain electrode 230 may include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, and the like. These may be used alone or in combination with each other. In example embodiments, the first drain electrode 230 may have a stacked structure of titanium/aluminum/titanium. Also, the first drain electrode 230 may function as a wiring. In other words, since the first drain electrode 230 functions as a wiring, it has a relatively low resistivity than the first source electrode 210, the second source electrode 215, and the second drain electrode 235, which function as an electrode. Can.

For example, in order for a conventional organic light emitting diode display to be driven at a high resolution, the conventional organic light emitting diode display must include a relatively large number of signal wires. In this case, the signal wires may be disposed on the second interlayer insulating layer 195. When the conventional organic light emitting diode display includes a relatively large number of signal wires, the width of the signal wires can be relatively reduced to arrange the signal wires in a limited space, and the resistivity of the signal wires increases Can be. That is, it is not possible to manufacture an organic light emitting display device having a high resolution in a conventional manner.

In exemplary embodiments of the present invention, the first drain electrode 230 of the driving transistor 250 included in the organic light emitting diode display 100 is disposed on a different layer from the first source electrode 210 so that the first The drain electrode 230 may be formed of wiring having a relatively large width and a large thickness. That is, the first drain electrode 230 may have a relatively low resistivity, and the organic light emitting diode display 100 may form signal wires on the protective insulating layer 400. Accordingly, the organic light emitting diode display 100 has a driving transistor 250 including a first drain electrode 230 having a relatively large width and a large thickness, so that the organic light emitting diode display 100 is driven at a high resolution. Can.

Further, in example embodiments, the first drain electrode 230 may extend in a first direction D1 that is a direction from the first region 11 to the second region 12. In other words, a portion of the first drain electrode 230 may overlap the first gate electrode 170, the gate electrode pattern 180 and the first source electrode 210, and the second active layer 135 may It may not overlap (eg, the first drain electrode 230 does not overlap the second active layer 135 so as not to affect the driving of the switching transistor 255). A high power voltage (eg, corresponding to the high power voltage ELVDD of FIG. 5) may be applied to the first drain electrode 230. That is, the first drain electrode 230 may shield the driving transistor 250 from the signal line 350 to which the data signal (eg, the data signal DATA of FIG. 5) is applied.

For example, in a conventional organic light emitting diode display, characteristics of a driving transistor disposed adjacent to the signal wiring may be changed due to a variable voltage level of the signal wiring.

In exemplary embodiments of the present invention, a constant voltage (eg, high power voltage ELVDD) is applied to the first drain electrode 230 of the driving transistor 250 included in the organic light emitting diode display 100. By shielding the driving transistor 250 from the signal wiring 350, characteristics of the driving transistor 250 can be maintained.

Accordingly, the driving transistor 250 including the first active layer 130, the first gate electrode 170, the first source electrode 210, and the first drain electrode 230 may be configured. Here, the driving transistor 250 may function as a driving transistor including a silicon-based semiconductor. Further, the driving transistor 250 may function as a transistor having an upper gate structure. For example, the driving transistor 250 may correspond to the first transistor TR1 illustrated in FIG. 5.

However, although the organic light emitting diode display 100 is described as having a configuration including two transistors (for example, a driving transistor 250 and a switching transistor 255), the configuration of the present invention is not limited thereto. For example, the organic light emitting diode display 100 may have a configuration including at least two transistors and at least one capacitor.

The first planarization layer 270 may be disposed on the protective insulating layer 400 and the first drain electrode 230. The first planarization layer 270 may be entirely disposed on the protective insulating layer 400. For example, the first planarization layer 270 may be disposed with a relatively thick thickness to sufficiently cover the first drain electrode 230, in which case, the first planarization layer 270 may have a substantially flat top surface. A planarization process may be added to the first planarization layer 270 to implement a flat top surface of the first planarization layer 270. In example embodiments, the first planarization layer 270 may fill the first to fifth openings positioned in the bending area 50. In other words, the first planarization layer 270 may directly contact the upper surface of the second organic layer 113 positioned in the bending region 50. The first planarization layer 270 may include an organic material or an inorganic material. In example embodiments, the first planarization layer 270 may include an organic material. For example, the first planarization layer 270 may include photoresist, polyacrylic resin, polyimide resin, polyamide resin, siloic acid resin, acrylic resin, epoxy resin, and the like.

The signal wiring 350 and the connection pattern 370 may be disposed on the first planarization layer 270. A data signal (for example, the data signal DATA shown in FIG. 5) may be applied to the signal line 350, and a high power voltage (eg, the high voltage shown in FIG. 5) may be applied to the connection pattern 370. The original voltage ELVDD may be applied. In other words, the signal wiring 350 may correspond to the data signal DATA wiring illustrated in FIG. 5, and the connection pattern 370 may correspond to the second terminal of the sixth transistor TR6 illustrated in FIG. 5. Can. For example, the signal wiring 350 may transmit the data signal DATA to the switching transistor 255, and the switching transistor 255 (eg, the second drain electrode 235 of the switching transistor 255) The data signal DATA transferred to may be applied to the driving transistor 250 (eg, the first gate electrode 170 of the driving transistor 250). Further, the first drain electrode 230 of the driving transistor 250 applies a high power voltage ELVDD to the connection pattern 370 (eg, the second terminal of the sixth transistor TR6 shown in FIG. 5 ). The high power voltage ELVDD transferred to the connection pattern 370 may be applied to the lower electrode 290.

Each of the signal wiring 350 and the connection pattern 370 may include metal, alloy, metal nitride, conductive metal oxide, and transparent conductive material. These may be used alone or in combination with each other. In example embodiments, each of the signal wiring 350 and the connection pattern 370 may function as a wiring, and may have a stacked structure of titanium/aluminum/titanium.

The second planarization layer 275 may be disposed on the first planarization layer 270, the signal wiring 350, and the connection pattern 370. The second planarization layer 275 may be entirely disposed on the first planarization layer 270. For example, the second planarization layer 275 may be disposed to have a relatively thick thickness to sufficiently cover the signal wiring 350 and the connection pattern 370, and in this case, the second planarization layer 275 is substantially It may have a flat top surface, and a planarization process may be added to the second flattening layer 275 to implement the flat top surface of the second flattening layer 275. Optionally, the second planarization layer 275 may not be disposed in the pad region 60. The second planarization layer 275 may include an organic material or an inorganic material. In example embodiments, the second planarization layer 275 may include an organic material.

The lower electrode 290 may be disposed on the second planarization layer 275. The lower electrode 290 may be connected to the connection pattern 370 through a contact hole formed by removing a portion of the second planarization layer 275. The lower electrode 290 may include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, and the like. These may be used alone or in combination with each other. Optionally, the lower electrode 290 may have a multi-layer structure including a plurality of layers.

The pixel defining layer 310 may be disposed on a portion of the lower electrode 290 and on the second planarization layer 275. The pixel defining layer 310 may cover both sides of the lower electrode 290 and expose a portion of the upper surface of the lower electrode 290. The pixel defining layer 310 may be formed of an organic material or an inorganic material. In example embodiments, the pixel defining layer 310 may include an organic material. Alternatively, the pixel defining layer 310 may not be disposed in the pad area 60.

The emission layer 330 may be disposed on the lower electrode 290 exposed by the pixel defining layer 310. The light emitting layer 330 may be formed using at least one of light emitting materials capable of emitting different color lights (ie, red light, green light, blue light, etc.) according to sub-pixels. Alternatively, the light emitting layer 330 may emit white light as a whole by stacking a plurality of light emitting materials capable of generating different color lights such as red light, green light, and blue light. In this case, a color filter may be disposed on the light emitting layer 330 (eg, disposed to overlap the light emitting layer 330 on the top surface of the thin film encapsulation structure 450 ). The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. Optionally, the color filter may include a yellow color filter, a cyan color filter, and a purple color filter. The color filter may include photosensitive resin, color photoresist, and the like.

The upper electrode 340 may be disposed on the pixel defining layer 310 and the emission layer 330. The upper electrode 340 may cover the light emitting layer 330 and the pixel defining layer 310, and may be entirely disposed on the light emitting layer 330 and the pixel defining layer 310. In example embodiments, a low power voltage (eg, a low power voltage ELVSS shown in FIG. 5) may be applied to the upper electrode 340. The upper electrode 340 may include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, and the like. These may be used alone or in combination with each other. Optionally, the upper electrode 340 may have a multi-layer structure including a plurality of layers. Accordingly, the sub-pixel structure 200 including the lower electrode 290, the emission layer 330, and the upper electrode 340 may be configured.

The first thin film encapsulation layer 451 may be disposed in the emission region 30 on the upper electrode 340. The first thin film encapsulation layer 451 covers the upper electrode 340 in the emission region 30 and may be disposed along the profile of the upper electrode 340 with a uniform thickness. The first thin film encapsulation layer 451 may prevent the sub-pixel structure 200 from deteriorating due to penetration of moisture, oxygen, and the like. In addition, the first thin film encapsulation layer 451 may also function to protect the sub-pixel structure 200 from external impact. The first thin film encapsulation layer 451 may include flexible inorganic materials.

The second thin film encapsulation layer 452 may be disposed in the light emitting region 30 on the first thin film encapsulation layer 451. The second thin film encapsulation layer 452 may improve the flatness of the organic light emitting diode display 100 and protect the sub-pixel structure 200. The second thin film encapsulation layer 452 may include flexible organic materials.

A third thin film encapsulation layer 453 may be disposed in the light emitting region 30 on the second thin film encapsulation layer 452. The third thin film encapsulation layer 453 covers the second thin film encapsulation layer 452 in the emission region 30 and may be disposed along the profile of the second thin film encapsulation layer 452 with a uniform thickness. The third thin film encapsulation layer 453 may prevent the light emitting structure 300 from being deteriorated due to penetration of moisture, oxygen, etc. together with the first thin film encapsulation layer 451. In addition, the third thin film encapsulation layer 453 may also function to protect the light emitting structure 300 together with the first thin film encapsulation layer 451 and the second thin film encapsulation layer 452 from external impact. The third thin film encapsulation layer 453 may include inorganic materials having flexibility. Accordingly, the thin film encapsulation structure 450 including the first thin film encapsulation layer 451, the second thin film encapsulation layer 452, and the third thin film encapsulation layer 453 may be configured. Optionally, the thin film encapsulation structure 450 may be configured as a five-layer structure laminated with first to fifth thin film encapsulation layers or a seven-layer structure laminated with first to seventh thin film encapsulation layers.

The organic light emitting diode display 100 according to example embodiments of the present invention includes a driving transistor 250 including a first drain electrode 230 and a first source electrode 210 disposed on different layers. The first drain electrode 230 may function as a wiring having a relatively large width and a large thickness. Accordingly, the organic light emitting diode display 100 may be driven at a high resolution.

In addition, the organic light emitting diode display 100 according to exemplary embodiments of the present invention includes a first drain electrode 230 that shields the first active layer 130 so that the signal wiring 350 and the driving transistor 250 are included. ) Parasitic capacitance may not be formed. Accordingly, the organic light emitting diode display 100 may maintain characteristics of the driving transistor 250.

Referring to FIG. 7, a rigid glass substrate 105 may be provided. The first organic layer 111 may be formed on the glass substrate 105. The first organic layer 111 may be formed entirely on the glass substrate 105 and may be formed using an organic material having flexibility such as polyimide.

The first barrier layer 112 may be formed entirely on the first organic layer 111. The first barrier layer 112 may block moisture penetrating through the first organic layer 111. The first barrier layer 112 may be formed using an inorganic material having flexibility such as silicon oxide or silicon nitride.

The second organic layer 113 may be formed on the first barrier layer 112. The second organic layer 113 may be formed entirely on the first barrier layer 112, and may be formed using an organic material having flexibility such as polyimide.

The second barrier layer 114 may be formed on the second organic layer 113 as a whole. The second barrier layer 114 may block moisture penetrating through the second organic layer 113. The second barrier layer 114 may be formed using an inorganic material having flexibility such as silicon oxide or silicon nitride. Accordingly, the substrate 110 including the first organic layer 111, the first barrier layer 112, the second organic layer 113, and the second barrier layer 114 may be formed.

Since the substrate 110 is thin and flexible, it supports the formation of an upper structure (eg, a driving transistor 250, a switching transistor 255, a sub-pixel structure 200, a thin film encapsulation structure 450, etc.). For this, the substrate 110 may be formed on the rigid glass substrate 105. For example, after forming the upper structure on the substrate 110, the glass substrate 105 may be removed. In other words, because of the flexible properties of the first organic layer 111, the first barrier layer 112, the second organic layer 113, and the second barrier layer 114, the first organic layer 111, the first barrier layer ( 112), it may be difficult to directly form the upper structure on the second organic layer 113 and the second barrier layer 114. In consideration of this point, the upper structure is formed using the glass substrate 105, and then the glass substrate 105 is removed to remove the first organic layer 111, the first barrier layer 112, and the second organic layer ( 113) and the second barrier layer 114 may be used as the substrate 110.

The buffer layer 115 may be formed on the substrate 110. In example embodiments, the buffer layer 115 may be formed in the first region 11 and the second region 12 on the substrate 110 and extend to the bending region 50. That is, the buffer layer 115 may be formed entirely on the substrate 110. The buffer layer 115 may prevent diffusion of metal atoms or impurities from the substrate 110 to the driving transistor 250, the switching transistor 255, and the sub-pixel structure 200, and the first active layer 130 It is possible to obtain a substantially uniform first active layer 130 by controlling the rate of heat transfer during the crystallization process to form. In addition, when the surface of the substrate 110 is not uniform, the buffer layer 115 may serve to improve the flatness of the surface of the substrate 110. Depending on the type of the substrate 110, two or more buffer layers 115 may be provided on the substrate 110, or the buffer layer 115 may not be formed. For example, the buffer layer 115 may be formed using an organic material or an inorganic material.

The first active layer 130 may be formed in the first region 11 on the buffer layer 115. For example, the first active layer 130 may include oxide semiconductor, amorphous silicon, polysilicon or organic semiconductor. In example embodiments, the first active layer 130 may include a silicon-based semiconductor, and may be formed using the amorphous silicon or the polysilicon. In example embodiments, the first active layer 130 may have a source region and a drain region.

Referring to FIG. 8, a gate insulating layer 150 may be formed in the first region 11 and the second region 12 on the buffer layer 115 and the first active layer 130. For example, the gate insulating layer 150 covers the first active layer 130 in the first region 11 on the substrate 110 and may extend to the bending region 50. That is, the gate insulating layer 150 may be entirely formed on the buffer layer 115. For example, the gate insulating layer 150 may sufficiently cover the first active layer 130 on the buffer layer 115, and may have a substantially flat top surface without generating a step around the first active layer 130. Can. Alternatively, the gate insulating layer 150 covers the first active layer 130 on the buffer layer 115 and may be formed to have substantially the same thickness along the profile of the first active layer 130. The gate insulating layer 150 may be formed using a silicon compound, metal oxide, or the like. For example, the gate insulating layer 150 may include silicon oxide, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbonitride, aluminum oxide, aluminum nitride, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, and the like. Can. Optionally, the gate insulating layer 150 may have a multi-layer structure having a plurality of insulating layers comprising different materials from each other.

The first gate electrode 170 may be formed in the first region 11 on the gate insulating layer 150. For example, the first gate electrode 170 may be formed on a portion of the gate insulating layer 150 on which the first active layer 130 is located. The first gate electrode 170 may be formed using a metal, a metal alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other. Optionally, the first gate electrode 170 may have a multi-layer structure including a plurality of layers.

A first interlayer insulating layer 190 may be formed in the first region 11 and the second region 12 on the gate insulating layer 150 and the first gate electrode 170. For example, the first interlayer insulating layer 190 covers the first gate electrode 170 in the first region 11 on the gate insulating layer 150 and may extend to the bending region 50. That is, the first interlayer insulating layer 190 may be entirely formed on the gate insulating layer 150. For example, the first interlayer insulating layer 190 may sufficiently cover the first gate electrode 170 on the gate insulating layer 150, and substantially without generating a step around the first gate electrode 170. It can have a flat top surface. Alternatively, the first interlayer insulating layer 190 covers the first gate electrode 170 on the gate insulating layer 150 and may be formed to have substantially the same thickness along the profile of the first gate electrode 170. . The first interlayer insulating layer 190 may be formed using a silicon compound, metal oxide, or the like. Optionally, the first interlayer insulating layer 190 may have a multi-layer structure having a plurality of insulating layers comprising different materials from each other.

The gate electrode pattern 180 may be formed in the first region 11 on the interlayer insulating layer 190. The gate electrode pattern 180 may be formed on a portion of the first interlayer insulating layer 190 where the first gate electrode 170 is located. The gate electrode pattern 180 may be formed using a metal, a metal alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. Optionally, the gate electrode pattern 180 may have a multi-layer structure including a plurality of layers.

The second gate electrode 175 may be formed in the second region 12 on the interlayer insulating layer 190. In example embodiments, the second gate electrode 175 may be positioned on the same layer as the gate electrode pattern 180, and may be simultaneously formed using the same material. The second gate electrode 175 may be formed using a metal, a metal alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material.

A second interlayer insulating layer 195 may be formed in the first region 11 and the second region 12 on the gate electrode pattern 180 and the second gate electrode 175. For example, the second interlayer insulating layer 195 includes a gate electrode pattern 180 in the first region 11 on the first interlayer insulating layer 190 and a second gate electrode 175 in the second region 12. Covering, it may extend to the bending area (50). That is, the second interlayer insulating layer 195 may be entirely formed on the first interlayer insulating layer 190. For example, the second interlayer insulating layer 195 may sufficiently cover the gate electrode pattern 180 and the second gate electrode 175 on the first interlayer insulating layer 190, and the gate electrode pattern 180 and the first 2 It is possible to have a substantially flat top surface without generating a step around the gate electrode 175. Alternatively, the second interlayer insulating layer 195 covers the gate electrode pattern 180 and the second gate electrode 175 on the first interlayer insulating layer 190, and the gate electrode pattern 180 and the second gate electrode It may be formed to substantially the same thickness along the profile of (175). The second interlayer insulating layer 195 may be formed using a silicon compound, metal oxide, or the like. Optionally, the second interlayer insulating layer 195 may have a multi-layer structure having a plurality of insulating layers comprising different materials from each other.

The second active layer 135 may be formed in the second region 12 on the second interlayer insulating layer 195. The second active layer 135 may be formed on a portion of the second interlayer insulating layer 195 where the second gate electrode 175 is positioned below. The second active layer 135 may be formed using an oxide semiconductor. In other words, the second active layer 135 is a semiconductor oxide layer including a binary component compound, a ternary compound, a tetracomponent compound, etc., containing indium, zinc, gallium, tin, titanium, aluminum, hafnium, zirconium, magnesium, and the like. Can. For example, the second active layer 135 includes zinc oxide, gallium oxide, titanium oxide, tin oxide, indium oxide, indium-gallium oxide, indium-zinc oxide, indium-tin oxide, gallium-zinc oxide, zinc-magnesium Oxides, zinc-tin oxide, zinc-zirconium oxide, indium-gallium-zinc oxide, indium-zinc-tin oxide, indium-gallium-hafnium oxide, tin-aluminum-zinc oxide and indium-gallium-tin oxide, etc. Can.

After the second active layer 135 is formed, a portion of the gate insulating layer 150, the first interlayer insulating layer 190, and the second interlayer insulating layer 195 is removed to source the first active layer 130 A first contact hole 212 exposing the region may be formed.

Referring to FIG. 9, the first source electrode 210 may be connected to the source region of the first active layer 130 through the first contact hole 212. The first source electrode 210 may be formed using a metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, or the like. For example, the first source electrode 210 is gold, silver, aluminum, platinum, nickel, titanium, palladium, magnesium, calcium, lithium, chromium, tantalum, tungsten, copper, molybdenum, scandium, neodymium, iridium, Alloy containing aluminum, aluminum nitride, alloy containing silver, tungsten nitride, alloy containing copper, alloy containing molybdenum, titanium nitride, chromium nitride, tantalum nitride, strontium ruthenium oxide, zinc oxide, indium tin Oxide, tin oxide, indium oxide, gallium oxide, indium zinc oxide, and the like. These may be used alone or in combination with each other.

In example embodiments, the first source electrode 210 may have a first thickness T1 and may be formed as a single layer. For example, the first source electrode 210 may be formed using molybdenum. In other example embodiments, the first source electrode 210 may have a multi-layer structure including a plurality of layers.

The second source electrode 215 and the second drain electrode 235 may be formed in the second region 12 on the second interlayer insulating layer 195. The second source electrode 215 may cover the first side of the second active layer 135, and the second drain electrode 235 may be a second side different from the first side of the second active layer 135. Can cover. In other words, the second source and

second drain electrodes

215 and 235 may be formed on both sides of the second active layer 135 and expose a portion of the upper surface of the second active layer 135. . Each of the second source electrode 215 and the second drain electrode 235 may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other.

In example embodiments, each of the second source electrode 215 and the second drain electrode 235 may have a first thickness T1 and may be formed as a single layer. For example, each of the second source electrode 215 and the second drain electrode 235 may include molybdenum. In addition, the first source electrode 210 and the second source and

second drain electrodes

215 and 235 may be located on the same layer and may be simultaneously formed using the same material. In other exemplary embodiments, each of the second source electrode 215 and the second drain electrode 235 may have a multi-layer structure including a plurality of layers. Accordingly, a switching transistor 255 including the second active layer 135, the second gate electrode 175, the second source electrode 215, and the second drain electrode 235 may be formed.

second drain electrodes

215, 235 400) may be formed. For example, the protective insulating layer 400 includes a first source electrode 210 in the first region 11 and a second source and second drain electrode in the second region 12 on the second interlayer insulating layer 195. The

fields

215 and 235 may be covered and extended to the bending region 50. That is, the protective insulating layer 400 may be entirely formed on the second interlayer insulating layer 195. For example, the protective insulating layer 400 may sufficiently cover the first source electrode 210 and the second source and

second drain electrodes

215 and 235 may be formed to have substantially the same thickness. The protective insulating layer 400 may be formed using a silicon compound, metal oxide, or the like. Optionally, the protective insulating layer 400 may have a multi-layer structure having a plurality of insulating layers including different materials from each other.

Referring to FIG. 10, after the protective insulating layer 400 is formed, a portion of the gate insulating layer 150, the first interlayer insulating layer 190, the second interlayer insulating layer 195, and the protective insulating layer 400 The second contact hole 232 and the second barrier layer 114, the buffer layer 115, the gate insulating layer 150, and the first interlayer insulating layer exposing the drain region of the first active layer 130 by removing the ( 190), an opening 102 exposing the upper surface of the second organic layer 113 positioned in the bending region 50 by removing portions of the second interlayer insulating layer 195 and the protective insulating layer 400 may be formed. Can.

Referring to FIG. 11, the first drain electrode 230 may be connected to the drain region of the first active layer 130 through the second contact hole 232. In example embodiments, the first drain electrode 230 may have a second thickness T2 greater than the first thickness T1, and may be formed of a plurality of layers. The first drain electrode 230 may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other. In example embodiments, the first drain electrode 230 may have a stacked structure of titanium/aluminum/titanium. Also, the first drain electrode 230 may extend in a first direction D1 that is a direction from the first region 11 to the second region 12. In other words, a portion of the first drain electrode 230 may overlap the first gate electrode 170, the gate electrode pattern 180 and the first source electrode 210, and the second active layer 135 It may not overlap. Accordingly, a driving transistor 250 including a first active layer 130, a first gate electrode 170, a first source electrode 210, and a first drain electrode 230 can be formed.

The first planarization layer 270 may be formed on the protective insulating layer 400 and the first drain electrode 230. The first planarization layer 270 may be formed entirely on the protective insulating layer 400. For example, the first planarization layer 270 may be formed with a relatively thick thickness to sufficiently cover the first drain electrode 230, and in this case, the first planarization layer 270 may have a substantially flat top surface. A planarization process may be added to the first planarization layer 270 to implement a flat top surface of the first planarization layer 270. In example embodiments, the first planarization layer 270 may fill the opening 102 located in the bending region 50. In other words, the first planarization layer 270 may directly contact the upper surface of the second organic layer 113 positioned in the bending region 50. The first planarization layer 270 may include an organic material or an inorganic material. In example embodiments, the first planarization layer 270 may be formed using an organic material. For example, the first planarization layer 270 may include photoresist, polyacrylic resin, polyimide resin, polyamide resin, siloic acid resin, acrylic resin, epoxy resin, and the like.

Referring to FIG. 12, a signal line 350 and a connection pattern 370 may be formed on the first planarization layer 270. Each of the signal wiring 350 and the connection pattern 370 may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other. In example embodiments, the signal wiring 350 and the connection pattern 370 may be simultaneously formed using the same material, and may have a stacked structure of titanium/aluminum/titanium.

A second planarization layer 275 may be formed on the first planarization layer 270, the signal wiring 350, and the connection pattern 370. The second planarization layer 275 may be entirely formed on the first planarization layer 270. For example, the second planarization layer 275 may be formed to have a relatively thick thickness to sufficiently cover the signal wiring 350 and the connection pattern 370, and in this case, the second planarization layer 275 is substantially It may have a flat top surface, and a planarization process may be added to the second flattening layer 275 to implement the flat top surface of the second flattening layer 275. Optionally, the second planarization layer 275 may not be formed in the pad region 60. The second planarization layer 275 may include an organic material or an inorganic material. In example embodiments, the second planarization layer 275 may be formed using an organic material.

The lower electrode 290 may be formed on the second planarization layer 275. The lower electrode 290 may be connected to the connection pattern 370 through a contact hole formed by removing a portion of the second planarization layer 275. The lower electrode 290 may be formed using a metal, alloy, metal nitride, conductive metal oxide, or transparent conductive material. These may be used alone or in combination with each other. Optionally, the lower electrode 290 may have a multi-layer structure including a plurality of layers.

The pixel defining layer 310 may be formed on a portion of the lower electrode 290 and on the second planarization layer 275. The pixel defining layer 310 may cover both sides of the lower electrode 290 and expose a portion of the upper surface of the lower electrode 290. The pixel defining layer 310 may be formed of an organic material or an inorganic material. In example embodiments, the pixel defining layer 310 may be formed using an organic material. Alternatively, the pixel defining layer 310 may not be formed in the pad area 60.

Referring to FIG. 13, the emission layer 330 may be formed on the lower electrode 290 exposed by the pixel defining layer 310. The light emitting layer 330 may be formed using at least one of light emitting materials capable of emitting different color lights (ie, red light, green light, blue light, etc.) according to sub-pixels. Alternatively, the light emitting layer 330 may emit white light as a whole by stacking a plurality of light emitting materials capable of generating different color lights such as red light, green light, and blue light. In this case, a color filter may be formed on the light emitting layer 330. The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. Optionally, the color filter may include a yellow color filter, a blue-blue color filter, and a purple color filter. The color filter may be formed using a photosensitive resin, color photoresist, or the like.

The upper electrode 340 may be formed on the pixel defining layer 310 and the emission layer 330. The upper electrode 340 may cover the emission layer 330 and the pixel definition layer 310, and may be formed entirely on the emission layer 330 and the pixel definition layer 310. The upper electrode 340 may be formed using a metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, or the like. These may be used alone or in combination with each other. Optionally, the upper electrode 340 may have a multi-layer structure including a plurality of layers. Accordingly, a sub-pixel structure 200 including the lower electrode 290, the emission layer 330, and the upper electrode 340 may be formed.

The first thin film encapsulation layer 451 may be formed in the emission region 30 on the upper electrode 340. The first thin film encapsulation layer 451 covers the upper electrode 340 in the emission region 30 and may be formed along the profile of the upper electrode 340 with a uniform thickness. The first thin film encapsulation layer 451 may prevent the sub-pixel structure 200 from deteriorating due to penetration of moisture, oxygen, and the like. In addition, the first thin film encapsulation layer 451 may also function to protect the sub-pixel structure 200 from external impact. The first thin film encapsulation layer 451 may be formed using flexible inorganic materials.

A second thin film encapsulation layer 452 may be formed in the emission region 30 on the first thin film encapsulation layer 451. The second thin film encapsulation layer 452 may improve the flatness of the organic light emitting diode display and protect the sub-pixel structure 200. The second thin film encapsulation layer 452 may be formed using flexible organic materials.

A third thin film encapsulation layer 453 may be formed in the emission region 30 on the second thin film encapsulation layer 452. The third thin film encapsulation layer 453 covers the second thin film encapsulation layer 452 in the emission region 30 and may be formed along the profile of the second thin film encapsulation layer 452 with a uniform thickness. The third thin film encapsulation layer 453 may prevent the light emitting structure 300 from being deteriorated due to penetration of moisture, oxygen, etc. together with the first thin film encapsulation layer 451. In addition, the third thin film encapsulation layer 453 may also function to protect the light emitting structure 300 together with the first thin film encapsulation layer 451 and the second thin film encapsulation layer 452 from external impact. The third thin film encapsulation layer 453 may include inorganic materials having flexibility. Accordingly, a thin film encapsulation structure 450 including a first thin film encapsulation layer 451, a second thin film encapsulation layer 452, and a third thin film encapsulation layer 453 may be formed. Optionally, the thin film encapsulation structure 450 may be formed of a five-layer structure stacked with first to fifth thin film encapsulation layers or a seven-layer structure stacked with first to seventh thin film encapsulation layers.

After the thin film encapsulation structure 450 is formed, the glass substrate 105 may be removed. Accordingly, the organic light emitting display device 100 illustrated in FIG. 6 may be manufactured.

14 is a cross-sectional view illustrating an organic light emitting display device according to example embodiments, and FIG. 15 is a cross-sectional view showing an example of an organic light emitting display device of FIG. 14. The organic light emitting display device 500 illustrated in FIG. 14 is substantially the same as the organic light emitting display device 100 described with reference to FIGS. 1 to 6 except for the first signal line 350 and the second signal line 355. Or similar configurations. In FIG. 14, overlapping descriptions of components that are substantially the same or similar to those described with reference to FIGS. 1 to 6 are omitted.

Referring to FIG. 14, the organic light emitting diode display 500 includes a substrate 110, a buffer layer 115, a driving transistor 250, a switching transistor 255, a gate electrode pattern 180, a gate insulating layer 150, The first interlayer insulating layer 190, the second interlayer insulating layer 195, the protective insulating layer 400, the first planarization layer 270, the first signal wiring 350, the second signal wiring 355, connection A pattern 370, a second planarization layer 275, a sub-pixel structure 200, a pixel defining layer 310, and a thin film encapsulation structure 450 may be included.

The first signal line 350 and the second signal line 355 may be disposed on the first planarization layer 270 to be spaced apart from each other. Data signals may be applied to the first signal line 350 and the second signal line 355. For example, the sub-pixel circuit SPC of FIG. 5 may include two data lines in order for the organic light emitting diode display 500 to be driven at a high speed. For example, the speed at which the data signal is transmitted may be doubled because the sub-pixel circuit SPC included in the organic light emitting diode display 500 includes two data lines, and the organic light emitting diode display 500 may It can be driven at high speed.

Although the first signal line 350 and the second signal line 355 are disposed, the organic light emitting diode display 500 has a relatively increased width and includes a first drain electrode 230 to which a constant voltage is applied. The characteristics of 250 can be maintained.

In other exemplary embodiments, as illustrated in FIG. 15, the shape of the first source electrode 210 and the shape of the first drain electrode 230 may be changed and arranged as compared to FIG. 14. . In other words, the first source electrode 210 may be formed of wiring having a relatively large width and a large thickness.

In the above description, the present invention has been described with reference to exemplary embodiments of the present invention, but those skilled in the art will not depart from the spirit and scope of the present invention as set forth in the claims below. It will be understood that various modifications and changes can be made.

The present invention can be applied to various display devices that can include an organic light emitting display device. For example, the present invention is applicable to numerous display devices such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for exhibition or information transmission, medical display devices, and the like.

10: display area 11: first area

12: second area 20: sub-pixel circuit areas

30: light emitting area 40: peripheral area

50: bending area 60: pad area

70: pad electrode area 100, 500: organic light emitting display device

101: external device 102: opening

105: glass substrate 110: substrate

111: first organic layer 112: first barrier layer

113: second organic layer 114: second barrier layer

115: buffer layer 130: first active layer

135: second active layer 150: gate insulating layer

170: first gate electrode 175: second gate electrode

180: gate electrode pattern 190: first interlayer insulating layer

195: second interlayer insulating layer 200: sub-pixel structure

210: first source electrode 215: second source electrode

230: first drain electrode 235: second drain electrode

250: driving transistor 255: switching transistor

270: first planarization layer 275: second planarization layer

290: lower electrode 310: pixel defining layer

330: light emitting layer 340: upper electrode

350: signal wiring 370: connection pattern

400: protective insulating layer 450: thin film encapsulation structure

451: first thin film encapsulation layer 452: second thin film encapsulation layer

453: third thin film encapsulation layer 470: pad electrodes

Claims

A substrate having a light emitting region including a first region and a second region;

A first active layer having source and drain regions disposed in the first region on the substrate;

A gate insulating layer disposed on the first active layer;

A first gate electrode disposed on the gate insulating layer;

A first interlayer insulating layer disposed on the first gate electrode;

A second interlayer insulating layer disposed on the first interlayer insulating layer;

It is disposed on the second interlayer insulating layer, and is connected to the source region of the first active layer through a contact hole formed by removing a portion of the gate insulating layer, the first interlayer insulating layer, and the second interlayer insulating layer. A first source electrode;

A protective insulating layer disposed on the first source electrode;

The drain of the first active layer through a contact hole disposed on the protective insulating layer and formed by removing a portion of the gate insulating layer, the first interlayer insulating layer, the second interlayer insulating layer, and the protective insulating layer A first drain electrode connected to a region and defined as a driving transistor together with the first active layer, the first gate electrode, and the first source electrode;

A switching transistor disposed in the second region between the substrate and the protective insulating layer;

A lower electrode disposed on the switching and driving transistors;

A light emitting layer disposed on the lower electrode; And

An organic light emitting display device including an upper electrode disposed on the emission layer.
The organic light emitting diode display as claimed in claim 1, wherein the first drain electrode extends on the protective insulating layer in a first direction that is a direction from the first region to the second region.
The organic light emitting display device of claim 1, wherein a portion of the first drain electrode overlaps the first source electrode.
The organic light emitting display device of claim 1, wherein a portion of the first drain electrode overlaps the first gate electrode.
The organic light emitting diode display as claimed in claim 1, wherein the first source electrode includes a single layer, and the first drain electrode includes a plurality of layers.
The organic light emitting display device of claim 5, wherein the first source electrode comprises molybdenum, and the first drain electrode has a stacked structure of titanium/aluminum/titanium.
According to claim 1,

And a signal wiring disposed on the first drain electrode.
The organic light emitting display device of claim 7, wherein a data signal is applied to the signal wiring, a high power voltage is applied to the first drain electrode, and a low power voltage is applied to the upper electrode.
The method of claim 1, wherein the switching transistor,

A second gate electrode;

A second active layer disposed on the second gate electrode; And

And second source and second drain electrodes on both sides of the second active layer.
The organic light emitting display device of claim 9, wherein the first drain electrode does not overlap the second active layer.
10. The method of claim 9, The driving transistor has an upper gate structure, the first active layer comprises a silicon-based semiconductor,

The switching transistor has a lower gate structure, and the second active layer comprises a metal oxide semiconductor.
The organic light emitting display device of claim 11, wherein the first active layer of the first driving transistor comprises amorphous silicon or polysilicon.
The method of claim 9,

And a gate electrode pattern disposed on the first gate electrode.
The organic light emitting display device of claim 13, wherein the gate electrode pattern is on the same layer as the second gate electrode.
The method of claim 1, wherein the substrate,

A first organic layer;

A first barrier layer disposed on the first organic layer;

A second organic layer disposed on the first barrier layer; And

And a second barrier layer disposed on the second organic layer.
The method of claim 15, wherein the substrate,

Further comprising a bending area spaced from the light emitting area,

The second barrier layer has an opening exposing an upper surface of the second organic layer positioned in the bending area.
The method of claim 1, wherein the substrate,

Further comprising a bending area spaced from the light emitting area,

A buffer layer disposed in the first and second regions on the substrate, extending into the bending region, and having a first opening exposing an upper surface of the substrate positioned in the bending region;

A gate insulating layer covering the first active layer in the first region on the buffer layer and extending to the bending region and having a second opening overlapping the first opening; And

Further comprising an interlayer insulating layer covering the first gate electrode in the first region on the gate insulating layer and extending to the bending region and having a third opening overlapping the first and second openings. Organic light emitting display device.
According to claim 1,

Further comprising a thin film encapsulation structure disposed on the upper electrode,

The thin film encapsulation structure,

A first thin film encapsulation layer comprising a flexible inorganic material;

A second thin film encapsulation layer disposed on the first thin film encapsulation layer and including a flexible organic material; And

And a third thin film encapsulation layer disposed on the second thin film encapsulation layer and including a flexible inorganic material.
The organic light emitting display device of claim 1, wherein the first source electrode has a first thickness, and the first drain electrode has a second thickness greater than the first thickness.
A substrate having a light emitting region and a bending region including a first region and a second region;

Disposed in the first region on the substrate,

A first active layer having source and drain regions;

A first gate electrode disposed on the first active layer;

A first source electrode disposed on the first gate electrode, connected to the source region of the first active layer through a first contact hole, and having a first thickness; And

A driving transistor disposed on the first source electrode, connected to the drain region of the first active layer through a second contact hole, and including a first drain electrode having a second thickness greater than the first thickness;

A switching transistor disposed in the second region on the substrate; And

And a sub-pixel structure on the switching and driving transistors.