WO2020134453A1 - 相控阵天线 - Google Patents

相控阵天线 Download PDF

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Publication number
WO2020134453A1
WO2020134453A1 PCT/CN2019/113304 CN2019113304W WO2020134453A1 WO 2020134453 A1 WO2020134453 A1 WO 2020134453A1 CN 2019113304 W CN2019113304 W CN 2019113304W WO 2020134453 A1 WO2020134453 A1 WO 2020134453A1
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WO
WIPO (PCT)
Prior art keywords
layer
phased array
array antenna
storage unit
combined network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/113304
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English (en)
French (fr)
Inventor
刘毛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aac Microtech Suzhou Co Ltd
AAC Technologies Holdings Shenzhen Co Ltd
Original Assignee
Aac Microtech Suzhou Co Ltd
AAC Acoustic Technologies Shenzhen Co Ltd
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Publication date
Application filed by Aac Microtech Suzhou Co Ltd, AAC Acoustic Technologies Shenzhen Co Ltd filed Critical Aac Microtech Suzhou Co Ltd
Publication of WO2020134453A1 publication Critical patent/WO2020134453A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/007—Details of, or arrangements associated with, antennas specially adapted for indoor communication
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/22—Antenna units of the array energised non-uniformly in amplitude or phase, e.g. tapered array or binomial array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
    • H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
    • H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
    • H01Q3/36—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with variable phase-shifters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays

Definitions

  • the invention relates to the technical field of antennas, in particular to a phased array antenna.
  • the fifth generation of communication technology is dedicated to building an ecosystem of information and communication technology and is one of the hottest topics in the industry. Unlike the previous 2G, 3G and 4G, 5G is not only an upgrade of mobile communication technology, but also a driving platform for the future digital world and an infrastructure for the development of the Internet of Things. It will truly create a new era of full connectivity.
  • the object of the present invention is to provide a phased array antenna with low reflection coefficient and high isolation.
  • a phased array antenna includes a core board, antenna modules and radio frequency modules separately arranged on both sides of the core board, and the radio frequency module includes a sticker attached to the core board away from the core board
  • the circuit layer electrically connected to the device, the device and the circuit layer at least form a phase control unit to control the phase of each antenna unit in the antenna module and the beam synthesis unit to control the phased array antenna Beam shape.
  • the line layer includes a control line layer, a power supply layer, a first combined network ground layer, a combined network layer, a second combined network ground layer, a surface-mounted device ground layer and a surface-mounted device sequentially spaced from top to bottom Layer
  • the device includes at least a memory cell, an RFIC chip, and a plug provided on the surface-mounted device layer.
  • the storage unit includes a first storage unit and a second storage unit, the first storage unit, the RFIC chip and the second storage unit are all electrically connected to the surface-mount device layer, the control The wire layer and the surface-mounted device ground layer are electrically connected to the first storage unit through the surface-mounted device layer, and the antenna module, the control line layer, and the combined network layer are respectively connected to the RFIC
  • the chip is electrically connected, the combination network layer is electrically connected to the plug, and the power supply layer and the surface-mount device ground layer are electrically connected to the second storage unit through the surface-mount device layer, respectively.
  • the radio frequency module further includes a first prepreg interposed between the control line layer and the power supply layer, and a first interlayer between the power supply layer and the first combined network ground layer A medium layer, a second prepreg and a second medium layer interposed between the first combination network ground layer and the combination network layer, and a second medium layer interposed between the combination network layer and the second combination circuit
  • the thicknesses of the first prepreg, the first dielectric layer, the second prepreg, the third prepreg, the fourth prepreg, and the fourth dielectric layer are all 0.1016 mm, and the thickness of the second dielectric layer and the third dielectric The thickness is 0.254mm.
  • the thickness of the core board is 0.3 mm.
  • control line layer, the power supply layer, the first combined network ground layer, the combined network layer, the second combined network ground layer, the surface mount device ground layer and the surface mount The device layers are all copper layers.
  • both the first storage unit and the second storage unit are MLC.
  • the phased array antenna adopts any one of a 2 ⁇ 2 array, a 4 ⁇ 4 array or an 8 ⁇ 8 array.
  • the phased array antenna provided by the present invention has the following advantages: adopting the AIP vertical stack structure, the overall thickness is thin, the reflection coefficient of the antenna unit is small, and the isolation between the antenna units is large, which can meet indoor 5G communication Base station requirements.
  • FIG. 1 is a first perspective three-dimensional structure diagram of a phased array antenna of the present invention
  • FIG. 2 is a schematic diagram of a second perspective stereo structure of a phased array antenna of the present invention.
  • FIG. 3 is a schematic cross-sectional view of a partial structure of a phased array antenna of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the phased array antenna of the present invention using a 2 ⁇ 2 array;
  • FIG. 5 is a reflection coefficient diagram of each antenna element in the phased array antenna shown in FIG. 4;
  • FIG. 6 is a diagram of isolation between antenna elements of the phased array antenna shown in FIG. 4;
  • FIG. 7 is a reflection coefficient diagram of the phased array antenna shown in FIG. 4;
  • FIG. 8 is a gain diagram of the phased array antenna shown in FIG. 4;
  • FIG. 9 is a schematic diagram of the structure of the phased array antenna of the present invention using a 4 ⁇ 4 array
  • FIG. 10 is a reflection coefficient diagram of each antenna element of the phased array antenna shown in FIG. 9;
  • FIG. 11 is a diagram of isolation between antenna elements of the phased array antenna shown in FIG. 9;
  • FIG. 12 is a reflection coefficient diagram of the phased array antenna shown in FIG. 9;
  • FIG. 13 is a gain diagram of the phased array antenna shown in FIG. 9;
  • FIG. 14 is a schematic diagram of the structure of the phased array antenna of the present invention using an 8 ⁇ 8 array
  • FIG. 16 is a diagram of the isolation between the antenna elements of the phased array antenna shown in FIG. 14;
  • FIG. 17 is a reflection coefficient diagram of the phased array antenna shown in FIG. 14;
  • FIG. 18 is a gain diagram of the phased array antenna shown in FIG. 14.
  • an embodiment of the present invention provides a phased array antenna 200, which includes a core board 1, an antenna module 2 and a radio frequency module 3 disposed on both sides of the core board 1, respectively.
  • the thickness of the core board 1 is 0.3 mm. In other embodiments, the thickness of the core board 1 is adjustable.
  • the antenna module 2 includes a plurality of antenna units 100 arranged in an array.
  • the radio frequency module 3 includes a device 31 attached to the surface away from the core board 1 and a circuit layer 32 electrically connected to the device 31.
  • the device 31 and the circuit layer 32 at least constitute a phase control unit to control the phase and beam synthesis unit of each antenna unit 100 in the antenna module 2 to control the beam shape of the phased array antenna 200.
  • the circuit layer 32 includes a control line layer 321, a power supply layer 322, a first combined network ground layer 323, a combined network layer 324, a second combined network ground layer 325, and a surface-mounted device ground layer 326 that are sequentially spaced from above ⁇ Device layer 327.
  • the control line layer 321, the power layer 322, the first combined network ground layer 323, the combined network layer 324, the second combined network ground layer 325, and the surface-mount device ground layer Both 326 and the surface-mounted device layer 327 are copper layers.
  • the device 31 includes at least a storage unit 311, an RFIC chip 312 and a plug 313 provided on the surface-mounted device layer 327.
  • the storage unit 311 includes a first storage unit 3111 and a second storage unit 3112.
  • the first storage unit 3111, the RFIC chip 312, and the second storage unit 3112 are electrically connected to the surface-mount device layer 327 Connection
  • the control line layer 321 and the surface-mount device ground layer 326 are electrically connected to the first storage unit 3111 through the surface-mount device layer 327
  • the antenna module 2 the control line layer 321 and
  • the combining network layer 324 is electrically connected to the RFIC chip 312, the combining network layer 324 is electrically connected to the plug 313, and the power layer 322 and the surface-mount device ground layer 326 pass through the table
  • the device attaching layer 327 is electrically connected to the second storage unit 3112.
  • both the first storage unit 3111 and the second storage unit 3112 are MLC (Multi-Level Cell, multi-level cell).
  • the radio frequency module 3 further includes a first prepreg 33 interposed between the control line layer 321 and the power layer 322, and between the power layer 322 and the first integrated network ground layer 323
  • the first dielectric layer 34, the second prepreg 35 and the second dielectric layer 36 interposed between the first combined network ground layer 323 and the combined network layer 324, are interposed between the combined network Layer 324 and the third prepreg 37 and the third dielectric layer 38 of the second integrated network formation 325, and the fourth prepreg sandwiched between the second integrated network formation 325 and the surface-mounted device formation 326 39 and a fourth dielectric layer 30 interposed between the surface-mounted device ground layer 326 and the surface-mounted device layer 327.
  • the thicknesses of the first prepreg 33, the first dielectric layer 34, the second prepreg 35, the third prepreg 37, the fourth prepreg 39, and the fourth dielectric layer 30 are all 0.1016mm, and the second dielectric layer 36
  • the thickness of the third dielectric layer 38 is 0.254 mm.
  • the phased array antenna 200 may adopt any one of a 2 ⁇ 2 array, a 4 ⁇ 4 array, or an 8 ⁇ 8 array.
  • the phased array antenna 200 provided by the present invention will now be described in detail in three specific array modes: 2 ⁇ 2 array, 4 ⁇ 4 array, and 8 ⁇ 8 array.
  • the phased array antenna 200 of the 2 ⁇ 2 array provided by the present invention is shown in FIG. 4, and combined with FIGS. 5 and 6, it can be seen that the single antenna unit 100 of the phased array antenna 200 is in the frequency band of 24.75-27.5 GHz , The reflection coefficient is less than -12dB, and the isolation is less than -19dB; combined with FIGS. 7 and 8, it can be seen that the phased array antenna 200 is in the frequency band of 24.75-27.5GHz, the port reflection coefficient is less than -10dB, and the gain is greater than 10dB.
  • the phased array antenna 200 of the 4 ⁇ 4 array provided by the present invention is shown in FIG. 9, and combined with FIGS. 10 and 11, it can be seen that the single antenna unit 100 of the phased array antenna 200 is in the frequency band of 24.75-27.5 GHz , The reflection coefficient is less than -11dB, the isolation is less than -18.6dB; combined with Figures 12 and 13, it can be seen that the phased array antenna 200 is in the frequency band of 24.75-27.5GHz, the port reflection coefficient is less than -11dB, and the gain is greater than 16dB .
  • the phased array antenna 200 of the 8 ⁇ 8 array provided by the present invention is shown in FIG. 14, and combined with FIGS. 15 and 16, it can be seen that the single antenna unit 100 of the phased array antenna 200 is in the frequency band of 24.75-27.5 GHz , The reflection coefficient is less than -12dB, the isolation is less than -17.8dB; combined with Figures 17 and 18, it can be seen that the phased array antenna 200 is in the frequency band of 24.75-27.5GHz, the port reflection coefficient is less than -10dB, and the gain is greater than 23dB .
  • the phased array antenna provided by the present invention has the following advantages: adopting the AIP vertical stack structure, the overall thickness is thin, the reflection coefficient of the antenna unit is small, and the isolation between the antenna units is large, which can meet indoor 5G communication Base station requirements.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

本发明提供了一种相控阵天线，包括芯板、分设于所述芯板两侧的天线模组和射频模组，所述射频模组包括贴设于其远离所述芯板的表面的器件以及与所述器件电连接的线路层，所述器件和所述线路层至少构成相位控制单元以控制天线模组中各天线单元的相位和波束合成单元以控制相控阵天线的波束形状。与相关技术相比，本发明提供的一种相控阵天线具有如下优点：采用AIP型垂直堆叠结构，整体厚度薄，天线单元反射系数小，天线单元间的隔离度大，可满足室内5G通信基站的要求。

Description

相控阵天线 技术领域
本发明涉及天线技术领域，尤其涉及一种相控阵天线。
 背景技术
第五代通信技术（5G）致力于构建信息与通信技术的生态系统，是目前业界最热的课题之一。不同于以前的2G、3G和4G，5G不仅仅是移动通信技术的升级换代，更是未来数字世界的驱动平台和物联网发展的基础设施，将真正创建一个全联接的新时代。
但是随着5G技术的发展，现有的毫米波天线已经难以满足室内基站的要求。
 技术问题
本发明的目的在于提供一种低反射系数、高隔离度的相控阵天线。
 技术解决方案
本发明的技术方案如下：一种相控阵天线，包括芯板、分设于所述芯板两侧的天线模组和射频模组，所述射频模组包括贴设于其远离所述芯板的表面的器件以及与所述器件电连接的线路层，所述器件和所述线路层至少构成相位控制单元以控制天线模组中各天线单元的相位和波束合成单元以控制相控阵天线的波束形状。
优选的，所述线路层包括从上之下依次间隔设置的控制线层、电源层、第一合路网络地层、合路网络层、第二合路网络地层、表贴器件地层以及表贴器件层，所述器件至少包括设置于所述表贴器件层的存储单元、RFIC芯片和插头。
优选的，所述存储单元包括第一存储单元和第二存储单元，所述第一存储单元、所述RFIC芯片以及所述第二存储单元均与所述表贴器件层电连接，所述控制线层和所述表贴器件地层均通过所述表贴器件层与所述第一存储单元电连接，所述天线模组、所述控制线层以及所述合路网络层分别与所述RFIC芯片电连接，所述合路网络层与所述插头电连接，所述电源层和所述表贴器件地层分别通过所述表贴器件层与所述第二存储单元电连接。
优选的，所述射频模组还包括夹设于所述控制线层与所述电源层之间的第一半固化片、夹设于所述电源层与所述第一合路网络地层之间的第一介质层、夹设于所述第一合路网络地层与所述合路网络层之间的第二半固化片和第二介质层、夹设于所述合路网络层与所述第二合路网络地层的第三半固化片和第三介质层、夹设于所述第二合路网络地层与所述表贴器件地层之间的第四半固化片以及夹设于所述表贴器件地层与所述表贴器件层之间的第四介质层。
优选的，所述第一半固化片、第一介质层、第二半固化片、第三半固化片、第四半固化片以及第四介质层的厚度均为0.1016mm，所述第二介质层和所述第三介质的厚度均为0.254mm。
优选的，所述芯板的厚度为0.3mm。
优选的，所述控制线层、所述电源层、所述第一合路网络地层、所述合路网络层、所述第二合路网络地层、所述表贴器件地层以及所述表贴器件层均为铜层。
优选的，所述第一存储单元和所述第二存储单元均为MLC。
优选的，所述相控阵天线采用2×2阵列、4×4阵列或者8×8阵列中的任意一种。
 有益效果
与相关技术相比，本发明提供的一种相控阵天线具有如下优点：采用AIP型垂直堆叠结构，整体厚度薄，天线单元反射系数小，天线单元间的隔离度大，可满足室内5G通信基站的要求。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明相控阵天线的第一视角立体结构示意图；
图2为本发明相控阵天线的第二视角立体结构示意图；
图3为本发明相控阵天线的部分结构的剖视示意图；
图4为本发明相控阵天线采用2×2阵列的结构示意图；
图5为图4所示相控阵天线中各天线单元的反射系数图；
图6为图4所示相控阵天线的各天线单元间的隔离度图；
图7为图4所示相控阵天线的反射系数图；
图8为图4所示相控阵天线的增益图；
图9为本发明相控阵天线采用4×4阵列的结构示意图；
图10为图9所示相控阵天线的各天线单元的反射系数图；
图11为图9所示相控阵天线的各天线单元间的隔离度图；
图12为图9所示相控阵天线的反射系数图；
图13为图9所示相控阵天线的增益图；
图14为本发明相控阵天线采用8×8阵列的结构示意图；
图15为图14所示相控阵天线的各天线单元的反射系数图；
图16为图14所示相控阵天线的各天线单元间的隔离度图；
图17为图14所示相控阵天线的反射系数图；
图18为图14所示相控阵天线的增益图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1-3，本发明实施例提供了一种相控阵天线200，包括芯板1、分设于所述芯板1两侧的天线模组2和射频模组3。在本发明的具体实施方式中，所述芯板1的厚度为0.3mm，在其他实施方式中，所述芯板1为厚度可调。所述天线模组2包括多个阵列设置的天线单元100。
其中所述射频模组3包括贴设于其远离所述芯板1的表面的器件31以及与所述器件31电连接的线路层32。所述器件31和所述线路层32至少构成相位控制单元以控制天线模组2中各天线单元100的相位和波束合成单元以控制相控阵天线200的波束形状。
所述线路层32包括从上之下依次间隔设置的控制线层321、电源层322、第一合路网络地层323、合路网络层324、第二合路网络地层325、表贴器件地层326以及表贴器件层327。优选地，所述控制线层321、所述电源层322、所述第一合路网络地层323、所述合路网络层324、所述第二合路网络地层325、所述表贴器件地层326以及所述表贴器件层327均为铜层。
所述器件31至少包括设置于所述表贴器件层327的存储单元311、RFIC芯片312和插头313。其中所述存储单元311包括第一存储单元3111和第二存储单元3112，所述第一存储单元3111、所述RFIC芯片312以及所述第二存储单元3112均与所述表贴器件层327电连接，所述控制线层321和所述表贴器件地层326均通过所述表贴器件层327与所述第一存储单元3111电连接，所述天线模组2、所述控制线层321以及所述合路网络层324分别与所述RFIC芯片312电连接，所述合路网络层324与所述插头313电连接，所述电源层322和所述表贴器件地层326分别通过所述表贴器件层327与所述第二存储单元3112电连接。
在本发明的优选实施方式中，所述第一存储单元3111和所述第二存储单元3112均为MLC（Multi-Level Cell，多层单元）。
所述射频模组3还包括夹设于所述控制线层321与所述电源层322之间的第一半固化片33、夹设于所述电源层322与所述第一合路网络地层323之间的第一介质层34、夹设于所述第一合路网络地层323与所述合路网络层324之间的第二半固化片35和第二介质层36、夹设于所述合路网络层324与所述第二合路网络地层325的第三半固化片37和第三介质层38、夹设于所述第二合路网络地层325与所述表贴器件地层326之间的第四半固化片39以及夹设于所述表贴器件地层326与所述表贴器件层327之间的第四介质层30。优选地，所述第一半固化片33、第一介质层34、第二半固化片35、第三半固化片37、第四半固化片39以及第四介质层30的厚度均为0.1016mm，所述第二介质层36和第三介质层38的厚度均为0.254mm。
所述相控阵天线200可采用2×2阵列、4×4阵列或者8×8阵列中的任意一种。 现以2×2阵列、4×4阵列和8×8阵列三种具体阵列方式对本发明提供的所述相控阵天线200进行详细说明。
实施例一
本发明提供的2×2阵列的所述相控阵天线200如图4所示，再结合图5和6，可见，所述相控阵天线200的单个天线单元100在24.75-27.5GHz频段内，反射系数小于-12dB，隔离度小于-19dB；再结合图7和8所示，可见，所述相控阵天线200在24.75-27.5GHz频段内，端口反射系数小于-10dB，增益大于10dB。
实施例二
本发明提供的4×4阵列的所述相控阵天线200如图9所示，再结合图10和11，可见，所述相控阵天线200的单个天线单元100在24.75-27.5GHz频段内，反射系数小于-11dB，隔离度小于-18.6dB；再结合图12和13所示，可见，所述相控阵天线200在24.75-27.5GHz频段内，端口反射系数小于-11dB，增益大于16dB。
实施例三
本发明提供的8×8阵列的所述相控阵天线200如图14所示，再结合图15和16，可见，所述相控阵天线200的单个天线单元100在24.75-27.5GHz频段内，反射系数小于-12dB，隔离度小于-17.8dB；再结合图17和18所示，可见，所述相控阵天线200在24.75-27.5GHz频段内，端口反射系数小于-10dB，增益大于23dB。
与相关技术相比，本发明提供的一种相控阵天线具有如下优点：采用AIP型垂直堆叠结构，整体厚度薄，天线单元反射系数小，天线单元间的隔离度大，可满足室内5G通信基站的要求。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (9)

  1. 一种相控阵天线，其特征在于，包括芯板、分设于所述芯板两侧的天线模组和射频模组，所述射频模组包括贴设于其远离所述芯板的表面的器件以及与所述器件电连接的线路层，所述器件和所述线路层至少构成相位控制单元以控制天线模组中各天线单元的相位和波束合成单元以控制相控阵天线的波束形状。
  2. 根据权利要求1所述的相控阵天线，其特征在于，所述线路层包括从上之下依次间隔设置的控制线层、电源层、第一合路网络地层、合路网络层、第二合路网络地层、表贴器件地层以及表贴器件层，所述器件至少包括设置于所述表贴器件层的存储单元、RFIC芯片和插头。
  3. 根据权利要求2所述的相控阵天线，其特征在于，所述存储单元包括第一存储单元和第二存储单元，所述第一存储单元、所述RFIC芯片以及所述第二存储单元均与所述表贴器件层电连接，所述控制线层和所述表贴器件地层均通过所述表贴器件层与所述第一存储单元电连接，所述天线模组、所述控制线层以及所述合路网络层分别与所述RFIC芯片电连接，所述合路网络层与所述插头电连接，所述电源层和所述表贴器件地层分别通过所述表贴器件层与所述第二存储单元电连接。
  4. 根据权利要求3所述的相控阵天线，其特征在于，所述射频模组还包括夹设于所述控制线层与所述电源层之间的第一半固化片、夹设于所述电源层与所述第一合路网络地层之间的第一介质层、夹设于所述第一合路网络地层与所述合路网络层之间的第二半固化片和第二介质层、夹设于所述合路网络层与所述第二合路网络地层的第三半固化片和第三介质层、夹设于所述第二合路网络地层与所述表贴器件地层之间的第四半固化片以及夹设于所述表贴器件地层与所述表贴器件层之间的第四介质层。
  5. 根据权利要求4所述的相控阵天线，其特征在于，所述第一半固化片、第一介质层、第二半固化片、第三半固化片、第四半固化片以及第四介质层的厚度均为0.1016mm，所述第二介质层和所述第三介质的厚度均为0.254mm。
  6. 根据权利要求1所述的相控阵天线，其特征在于，所述芯板的厚度为0.3mm。
  7. 根据权利要求2所述的相控阵天线，其特征在于，所述控制线层、所述电源层、所述第一合路网络地层、所述合路网络层、所述第二合路网络地层、所述表贴器件地层以及所述表贴器件层均为铜层。
  8. 根据权利要求3所述的相控阵天线，其特征在于，所述第一存储单元和所述第二存储单元均为MLC。
  9. 根据权利要求1所述的相控阵天线，其特征在于，所述相控阵天线采用2×2阵列、4×4阵列或者8×8阵列中的任意一种。
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