WO2020130543A1 - Dispositif électronique de commande de détection tactile - Google Patents

Dispositif électronique de commande de détection tactile Download PDF

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Publication number
WO2020130543A1
WO2020130543A1 PCT/KR2019/017824 KR2019017824W WO2020130543A1 WO 2020130543 A1 WO2020130543 A1 WO 2020130543A1 KR 2019017824 W KR2019017824 W KR 2019017824W WO 2020130543 A1 WO2020130543 A1 WO 2020130543A1
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WIPO (PCT)
Prior art keywords
sensing
current
electronic device
circuit
compensation
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PCT/KR2019/017824
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English (en)
Korean (ko)
Inventor
고승훈
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삼성전자 주식회사
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Publication of WO2020130543A1 publication Critical patent/WO2020130543A1/fr

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/0418Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
    • G06F3/04182Filtering of noise external to the device and not generated by digitiser components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/041012.5D-digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface and also measures the distance of the input means within a short range in the Z direction, possibly with a separate measurement setup
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04106Multi-sensing digitiser, i.e. digitiser using at least two different sensing technologies simultaneously or alternatively, e.g. for detecting pen and finger, for saving power or for improving position detection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • Various embodiments relate to an electronic device that controls touch sensing.
  • a touch screen panel is an input device that senses the contact or hovering position of an object such as a user's hand or a touch pen and transmits a user's command.
  • the touch screen panel may be provided on the front surface of the display device or may be integrated with the display device.
  • Resistive, SAW (surface acoustic wave), infrared (IR), optical or capacitive methods are known as touch screen panel touch sensing methods.
  • the capacitive method may convert a touch position into an electrical signal based on the capacitance formed by an object such as a user's hand or a touch pen and a conductive electrode of the touch screen panel.
  • capacitive touch screen panels are mainly used in that the quality of the display is small and the thickness can be reduced. Since the touch screen panel is widely used in a mobile device, there is a need to develop a technology capable of more stably detecting a touch input in a noise environment. That is, in order to improve the sensitivity of the signal in the touch screen panel, effective noise removal is required.
  • an electronic device for controlling touch sensing that can improve a sensing precision of a touch or hovering input to a touch screen panel and reduce chip size.
  • a touch screen panel including one or more sensing electrodes, a touch screen panel and a sensing node, and providing a first compensation current based on a reference current to the sensing node
  • a compensation circuit including a first current path and a second current path based on the reference current and providing a second compensation current different in phase from the first compensation current to the sensing node and a driving signal to the one or more sensing electrodes
  • at least one control circuit for controlling to output a sensing signal from the one or more sensing electrodes, wherein the at least one control circuit is provided while the first or second compensation current is provided to the sensing node.
  • An electronic device that controls touch sensing provides a compensation circuit based on current driving that can reduce the complexity of the circuit, power consumption, and the processing range of the base capacitance to compensate for the offset capacitance of the touch screen panel And, through the operation of controlling the sensing signal outputted from the sensing electrode of the touch screen panel and the compensation by the compensation circuit to be performed simultaneously, while minimizing chip size and effectively removing noise, touch or hovering on the touch screen panel It is possible to improve the sensing accuracy of the input.
  • FIG. 1 is a block diagram of an electronic device in a network environment for controlling touch sensing, according to various embodiments.
  • FIG. 2 is a block diagram of a display device for controlling touch sensing according to various embodiments.
  • FIG. 3 is a block diagram schematically illustrating a touch screen panel and a touch control circuit according to various embodiments.
  • FIG. 4 is a block diagram schematically illustrating a touch screen panel and a touch control circuit according to various embodiments.
  • FIG. 5 is a block diagram illustrating a touch control circuit according to various embodiments.
  • FIG. 6 is a diagram for describing a touch control circuit according to various embodiments.
  • FIG. 7 is a circuit diagram schematically illustrating a compensation circuit according to various embodiments.
  • FIG. 8 is a circuit diagram illustrating a compensation circuit according to various embodiments.
  • FIG. 9 is a circuit diagram illustrating a first current path of a compensation circuit according to various embodiments.
  • FIG. 10 is a circuit diagram illustrating a second current path of a compensation circuit according to various embodiments.
  • FIG. 11 is a time flowchart for describing an operation of a touch control circuit according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through the first network 198 (eg, a short-range wireless communication network), or the second network 199. It may communicate with the electronic device 104 or the server 108 through (for example, a remote wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the first network 198 eg, a short-range wireless communication network
  • the server 108 for example, a remote wireless communication network
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module ( 176), interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ).
  • the components for example, the display device 160 or the camera module 180
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the display device 160 eg., a display
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120, for example. It can be controlled and can perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 120 may receive instructions or data received from other components (eg, the sensor module 176 or the communication module 190) in the volatile memory 132. Loaded into, process instructions or data stored in volatile memory 132, and store result data in non-volatile memory 134.
  • software eg, the program 140
  • the processor 120 may receive instructions or data received from other components (eg, the sensor module 176 or the communication module 190) in the volatile memory 132. Loaded into, process instructions or data stored in volatile memory 132, and store result data in non-volatile memory 134.
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together. , Sensor hub processor, or communication processor). Additionally or alternatively, the coprocessor 123 may be set to use less power than the main processor 121, or to be specialized for a designated function. The coprocessor 123 may be implemented separately from the main processor 121 or as part of it.
  • a main processor 121 eg, a central processing unit or an application processor
  • an auxiliary processor 123 eg, a graphics processing unit, an image signal processor
  • the coprocessor 123 may be set to use less power than the main processor 121, or to be specialized for a designated function.
  • the coprocessor 123 may be implemented separately from the main processor 121 or as part of it.
  • the coprocessor 123 may replace, for example, the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 may be active (eg, execute an application) ) With the main processor 121 while in the state, at least one component of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It can control at least some of the functions or states associated with.
  • the coprocessor 123 eg, image signal processor or communication processor
  • may be implemented as part of other functionally relevant components eg, camera module 180 or communication module 190). have.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176).
  • the data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.
  • the input device 150 may receive commands or data to be used for components (eg, the processor 120) of the electronic device 101 from outside (eg, a user) of the electronic device 101.
  • the input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (eg, a stylus pen).
  • the audio output device 155 may output an audio signal to the outside of the electronic device 101.
  • the audio output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call.
  • the receiver may be implemented separately from, or as part of, a speaker.
  • the display device 160 may visually provide information to the outside of the electronic device 101 (for example, a user).
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display device 160 may include a touch circuitry configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the strength of the force generated by the touch. have.
  • the audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 acquires sound through the input device 150, or an external electronic device connected directly or wirelessly to the sound output device 155 or the electronic device 101 (for example, Sound may be output through the electronic device 102) (eg, speakers or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biological sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that can be used for the electronic device 101 to directly or wirelessly connect to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or movement) or electrical stimuli that the user can perceive through tactile or motor sensations.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and videos. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101.
  • the power management module 388 may be implemented, for example, as at least part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 may be a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishing and performing communication through the established communication channel.
  • the communication module 190 is operated independently of the processor 120 (eg, an application processor) and may include one or more communication processors supporting direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : Local area network (LAN) communication module, or power line communication module.
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • LAN Local area network
  • Corresponding communication module among these communication modules includes a first network 198 (eg, a short-range communication network such as Bluetooth, Wi-Fi direct, or infrared data association (IrDA)) or a second network 199 (eg, a cellular network, the Internet) Or, it may communicate with an external electronic device through a computer network (eg, a telecommunication network such as LAN or WAN).
  • a computer network eg, a telecommunication network
  • the wireless communication module 192 uses a subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • IMSI International Mobile Subscriber Identifier
  • the antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive it from the outside.
  • the antenna module 197 may include a single antenna including a conductor formed on a substrate (eg, a PCB) or a radiator made of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network 198 or the second network 199, is transmitted from the plurality of antennas by, for example, the communication module 190. Can be selected.
  • the signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as part of the antenna module 197.
  • peripheral devices for example, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the electronic devices 102 and 104 may be the same or a different type of device from the electronic device 101.
  • all or some of the operations performed on the electronic device 101 may be performed on one or more external devices of the external electronic devices 102, 104, or 108.
  • the electronic device 101 executes the function or service itself.
  • one or more external electronic devices may be requested to perform at least a portion of the function or the service.
  • the one or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and deliver the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result, as it is or additionally, and provide it as at least part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology can be used.
  • the display device 160 may include a display 210 and a display driver IC (DDI) 230 for controlling the display 210.
  • the DDI 230 may include an interface module 231, a memory 233 (eg, a buffer memory), an image processing module 235, or a mapping module 237.
  • the DDI 230 receives, for example, image data or image information including an image control signal corresponding to a command for controlling the image data from the other components of the electronic device 101 through the interface module 231. can do.
  • the image information may include a processor 120 (eg, the main processor 121 (eg, an application processor) or an auxiliary processor 123 operated independently of the functions of the main processor 121 ( Example: a graphic processing device)
  • DDI 230 may communicate with the touch circuit 250 or the sensor module 176 through the interface module 231.
  • the DDI 230 may At least a portion of the received image information may be stored in the memory 233, for example, in units of frames.
  • the image processing module 235 may, for example, store at least a portion of the image data as a characteristic of the image data, or Pre-processing or post-processing (eg, resolution, brightness, or resizing) may be performed based on at least the characteristics of the display 210.
  • the mapping module 237 is pre-processed or post-processed through the image processing module 135.
  • a voltage value or a current value corresponding to the image data may be generated.
  • the generation of a voltage value or a current value may include, for example, properties of pixels of the display 210 (eg, an array of pixels ( RGB stripe or pentile structure), or the size of each of the sub-pixels) At least some pixels of the display 210 are, for example, based at least in part on the voltage value or the current value.
  • visual information eg, text, images, or icons
  • corresponding to the image data may be displayed through the display 210.
  • the display device 160 may further include a touch circuit 250.
  • the touch circuit 250 may include a touch sensor 251 and a touch sensor IC 253 for controlling the touch sensor 251.
  • the touch sensor IC 253 may control the touch sensor 251 to detect, for example, a touch input or a hovering input for a specific location of the display 210.
  • the touch sensor IC 253 may sense a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or charge amount) for a specific location of the display 210.
  • the touch sensor IC 253 may provide information about the sensed touch input or hovering input (eg, location, area, pressure, or time) to the processor 120.
  • At least a part of the touch circuit 250 is disposed as part of the display driver IC 230, or the display 210, or outside the display device 160. It may be included as part of other components (eg, coprocessor 123).
  • the display device 160 may further include at least one sensor (eg, a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module 176, or a control circuit therefor.
  • the at least one sensor or a control circuit therefor may be embedded in a part of the display device 160 (eg, the display 210 or DDI 230) or a part of the touch circuit 250.
  • the sensor module 176 embedded in the display device 160 includes a biometric sensor (eg, a fingerprint sensor)
  • the biometric sensor may be associated with biometric information through a partial area of the display 210. (Eg fingerprint image) can be acquired.
  • the pressure sensor may acquire pressure information associated with a touch input through a partial or entire area of the display 210.
  • the touch sensor 251 or the sensor module 176 may be disposed between pixels of a pixel layer of the display 210 or above or below the pixel layer.
  • FIG. 3 is a block diagram 300 schematically illustrating a touch screen panel and a touch control circuit according to various embodiments.
  • an electronic device eg, the electronic device 101 of FIG. 1 according to various embodiments includes a touch screen panel 310 (eg, the touch sensor 251 of FIG. 2) and a touch control circuit 320 ) (Eg, the touch sensor IC 253 of FIG. 2 ).
  • the touch screen panel 310 may generate a sensing signal corresponding to the touch input in response to the touch input, and provide the generated sensing signal to the touch control circuit 320.
  • the touch screen panel 310 may include one or more sensing electrodes 311.
  • the one or more sensing electrodes 311 may be arranged in the form of a dot matrix.
  • the touch screen panel 310 in which the sensing electrode 311 is disposed in the form of a dot matrix may be used in a self capacitance sensing method of measuring a capacitance between the sensing electrode 311 and ground.
  • the touch screen panel 310 in which the sensing electrode 311 is disposed in the form of a dot matrix can be implemented as a single indium tin oxide (ITO) layer, simplifying the manufacturing process of the touch screen panel and reducing the thickness of the display panel.
  • the touch screen panel 310 may be implemented with an on cell touch active matrix organic light-emitting diode (AMOLED), in which case the sensing electrode 311 may be deposited directly on the AMOLED display.
  • the touch screen panel 310 may be implemented as a Y-OCTA (youm-on cell touch active matrix organic light-emitting diode (AMOLED), in which case the sensing electrode 311 is on the flexible AMOLED display. It may be deposited directly
  • the touch screen panel 310 may be deposited inside the display panel.
  • the touch control circuit 320 may detect whether a touch input is generated in the touch screen panel 310 and a location where the touch input is applied. According to various embodiments, the touch control circuit 320 may sense a touch input using a self-capacitance sensing method. For example, the touch control circuit 320 provides a driving signal to one or more sensing electrodes 311, and uses a self-capacitance sensing method based on a sensing signal output from the one or more sensing electrodes to provide a touch screen panel ( 310) may be detected.
  • FIG. 4 is a block diagram 400 schematically illustrating a touch screen panel and a touch control circuit according to various embodiments.
  • an electronic device eg, the electronic device 101 of FIG. 1 according to various embodiments includes a touch screen panel 410 (eg, the touch sensor 251 of FIG. 2) and a touch control circuit 420 ) (Eg, the touch sensor IC 253 of FIG. 2 ).
  • the touch screen panel 410 may include one or more sensing electrodes 411.
  • one or more sensing electrodes 411 may be connected to adjacent sensing electrodes in the first direction to form a first sensing line 412.
  • the first sensing lines 412 may be arranged in a horizontal direction to form a plurality of first channels R1, R2, R3, ... Rn.
  • one or more sensing electrodes 411 may be connected to sensing electrodes adjacent to each other in a second direction to cross the first sensing line 412 to form a second sensing line 413.
  • the second sensing line 413 may form a plurality of second channels C1, C2, C3, ... Cm arranged in the vertical direction.
  • the plurality of first channels R1, R2, R3, ... Rn and the plurality of second channels C1, C2, C3, ... Cm are arranged in a two-dimensional matrix form Can be.
  • the plurality of first channels R1, R2, R3, ... Rn and the plurality of second channels C1, C2, C3, ... Cm may be formed in different layers. have.
  • the plurality of first channels R1, R2, R3, ... Rn and the plurality of second channels C1, C2, C3, ... Cm may be formed on the same layer. .
  • the touch screen panel 410 on which the sensing electrodes 411 are disposed in the form of a two-dimensional matrix is self-capacitance sensing that measures the capacitance between the first sensing line 412 or the second sensing line 413 and the ground independently of each other. Can be used in a manner.
  • the touch screen panel 410 in which the sensing electrode 411 is disposed in a two-dimensional matrix form senses mutual capacitance to measure the capacitance between the first sensing line 412 and the second sensing line 413. Can be used in a manner.
  • the touch screen panel 410 may be implemented with an on cell touch active matrix organic light-emitting diode (AMOLED), in which case the sensing electrode 411 may be deposited directly on the AMOLED display. have.
  • the touch screen panel 410 may be implemented as a Y-OCTA (youm-on cell touch active matrix organic light-emitting diode (AMOLED), in which case the sensing electrode 411 is on the flexible AMOLED display. It may be deposited directly
  • the touch screen panel 410 may be deposited inside the display panel.
  • the touch control circuit 420 may detect whether a touch input has occurred on the touch screen panel 410 and a location where the touch input is applied. According to various embodiments, the touch control circuit 420 may sense a touch input using a self-capacitance sensing method or a mutual capacitance sensing method. For example, the touch control circuit 420 provides driving signals independently of each other to the first sensing line 412 or the second sensing line 413 composed of one or more sensing electrodes 411, and the first sensing line 412 ) Or a touch or hovering input to the touch screen panel 410 may be detected using a self-capacitance sensing method based on sensing signals output independently from each other from the second sensing line 413.
  • the touch control circuit 420 provides a driving signal to the first sensing line 412 and uses a mutual capacitive sensing method based on the sensing signal output from the second sensing line 413 to touch the touch screen panel.
  • a touch or hovering input to 410 may be detected.
  • the touch control circuit 420 may detect a touch or hovering input by alternately applying a self-capacitance sensing method and a mutual capacitance sensing method.
  • FIG. 5 is a block diagram 500 illustrating a touch control circuit according to various embodiments.
  • the touch control circuit 520 may include at least one of an H/W accelerator 521, a memory 523, an MCU 522, a bus 524, or an analog front end (AFE) 530.
  • the analog front end 530 may include at least one of a driving circuit 531, a compensation circuit 532, or a sensing circuit 533.
  • the analog front end 530 may be output from, for example, a driving circuit 531 that provides an encoded driving signal to one or more sensing electrodes 311 included in the display panel 310, and one or more sensing electrodes 311.
  • the analog front end 530 may transmit the processed digital signal to the H/W accelerator 521 through a bus 524.
  • the H/W accelerator 521 is used instead of firmware to process digital signals at high speed, and may perform coordinate interpolation or basic correction.
  • the MCU 522 may control the entire operation of the touch control circuit 520 and may process a touch or hovering input to the touch screen panel 310. In one embodiment, processing of a touch or hovering input to the touch screen panel 310, for example, coordinate interpolation or basic correction, may be performed on at least one of the H/W accelerator 521 or the MCU 522.
  • the memory 523 may include, for example, at least one of data SRAM (data SRAM) or flash memory.
  • the memory 523 may store at least one of codes or parameters for control.
  • the memory 523 may store at least one of a set register value of the analog front end 530, raw data of a sensing signal, or reference data.
  • one or more sensing electrodes 311 of the touch screen panel 310 are illustrated in a dot matrix form, but these are merely exemplary, and one or more sensing electrodes, such as the touch screen panel 410 illustrated in FIG. 4 411 constitutes the first sensing line 412 and the second sensing line 413 and may be arranged in a two-dimensional matrix form.
  • FIG. 6 is a diagram 600 for describing a touch control circuit according to various embodiments.
  • a touch control circuit may include a driving circuit 610, a compensation circuit 620, and a sensing circuit 630.
  • the driving circuit 610 generates a driving signal, an encoding drive 612 encoding the generated driving signal, and one or more sensing electrodes of the touch screen panel 310 using the driving signal encoded by the encoding drive 612 (
  • a first switch array 613 selectively connected to 611 and a second switch array 614 for outputting a sensing signal from the one or more sensing electrodes 611 may be included.
  • the encoding driver 612 may encode a driving signal to provide a first driving signal having a first code and a second driving signal having a second code different in phase from the first code.
  • the encoding drive 612 may impart a pseudo-random (PR) code having random characteristics and orthogonality to the driving signal.
  • PR pseudo-random
  • the first switch array 613 may selectively connect a driving signal encoded by the encoding drive 612 to one or more sensing electrodes 611.
  • a driving signal is applied to the sensing electrode 611 connected by the first switch array 613, a self capacitance (C SC ) is formed between the ground and the charging electrode 611 to be charged.
  • C SC self capacitance
  • Can a human body capacitance (C HB ) between the user's body and the touch screen panel 310 ) May be further formed.
  • the second switch array 614 selectively connects one or more sensing electrodes 611 charged with self capacitance (C SC ) or human body capacitance (C HB ) to the sensing node 640. Can.
  • a sensing signal corresponding to the self capacitance (C SC ) charged in the sensing electrode 611 or the self-capacitance A sensing signal corresponding to the summation of (C SC ) and human body capacitance (C HB ) may be output.
  • the sensing circuit 630 measures the change in the signal size of the received sensing signal to measure the touch screen panel. A user's touch or hovering input to 310 may be sensed.
  • the sensing circuit 630 converts a sensing signal output from the sensing electrode 611 to a sensing voltage through a sensing node 640 connected to one or more sensing electrodes 611 to output a charge amplifier (CA) 631 ), correlated double sampler (CDS) 632 that filters noise by sampling the sensing voltage output from the charge amplifier 631, and converts the signal filtered by the correlated double sampler 632 into a digital signal. It may include an analog-to-digital converter (ADC) 633, and a decoding driver 634 that decodes the digital signal and outputs it as digital data.
  • ADC analog-to-digital converter
  • the charge amplifier 631 includes an amplifier 631a having a first input terminal connected to the sensing node 640 and a second input terminal to which a reference voltage is applied, and converts the sensing signal to a sensing voltage and outputs it.
  • the charge amplifier 631 is a feedback capacitor 631b connected between a first input terminal of the amplifier 631a and an output terminal outputting a sensing voltage and an initialization switch (initializing the feedback capacitor 631b) 631c).
  • the sensing signal output to the sensing circuit 630 may include various noises such as signals generated from the display.
  • the basic capacitance value of the self-capacitance may be increased.
  • a basic capacitance value of self-capacitance may have 500 ⁇ s or more. .
  • the processing range of the self-capacitance is widened by the thinning of the display, and even in a situation in which a sensing signal containing noise is detected, the processing range of the self-capacitance can be reduced and the noise component is effectively It is necessary to design a touch control circuit to remove and improve the signal-to-noise ratio (SNR).
  • SNR signal-to-noise ratio
  • the compensation circuit 620 is connected to a sensing signal output from one or more sensing electrodes 611 through a sensing node 640 between the driving circuit 610 and the sensing circuit 630. It can be configured to compensate for offset capacitance based on current driving.
  • FIG. 7 is a circuit diagram 700 schematically illustrating a compensation circuit according to various embodiments.
  • the compensation circuit 620 may compensate for offset capacitance based on current driving.
  • the compensation circuit 620 is connected through the touch screen panel 310 and the sensing node 640 and provides a first compensation current 712 based on the reference current to the sensing node 640, the first current path 710 And a second current path 720 based on the reference current and providing a second compensation current 722 that is out of phase with the first compensation current 712 to the sensing node 640.
  • the first compensation current 712 includes a sink current through which charge flows from the sensing node 640 to the compensation circuit 620
  • the second compensation current 722 is the compensation
  • the circuit 620 may include a source current through which charge flows to the sensing node 640.
  • the compensation circuit 620 provides a first or second compensation current to the sensing node 640 and switches to connect between the first current path 710 and the second current path 720 Circuit 730 may be included.
  • the switching circuit 730 includes a first switch 711 connecting the first current path 710 to the sensing node 640 and a second switch 721 connecting the second current path 720 to the sensing node 640.
  • the A sampling capacitor 740 may be included to sample one compensation current, that is, a sink current, as a second compensation current, that is, a source current reference voltage.
  • the first switch 711 may connect the first current path 710 to the sensing node 640.
  • the sensing node 640 receives the first compensation current 712 based on the reference current from the first current path 710. Can be provided on.
  • the first compensation current 712 may include a sink current through which charge flows from the sensing node 640 to the compensation circuit 620.
  • the first switch 711 is connected to the first current path 710 and the sensing node 640 while the first driving signal having the first sign (+) is provided from the driving circuit 610, and the sensing node 640 ) To provide a sink current through which charge flows to the compensation circuit 620.
  • the capacitance 750 of the first driving signal with the first sign (+) output from the sensing electrode 611 is compensated, and the capacitance 760 of the compensated sensing signal May be provided to the sensing circuit 630.
  • the second switch 721 may connect the second current path 720 to the sensing node 640.
  • the second current path 710 receives the second compensation current 722 based on the reference current from the sensing node 640.
  • the second compensation current 722 may include a source current through which charge flows from the compensation circuit 620 to the sensing node 640.
  • the second switch 721 senses the second current path 720 while the second driving signal having the second sign (-) different from the first sign (+) in the driving circuit 610 is provided.
  • the node 640 may be connected to provide a source current through which charge flows from the compensation circuit 620 to the sensing node 640.
  • the capacitance 750 of the second driving signal with the second sign (-) output from the sensing electrode 611 is compensated, and the capacitance 760 of the compensated sensing signal May be provided to the sensing circuit 630.
  • the third switch 730 may connect between the first current path 710 and the second current path 720.
  • the first current path 710 may generate a reference current based on the current supplied from the current source. While the first current path 710 and the second current path 720 are connected to each other by the third switch 730, the reference current generated by the first current path 710 is the second current path 720. To share.
  • the second current path 720 may provide the second compensation current 722 to the sensing node 640 based on the reference current shared from the first current path 710.
  • sampling capacitor 740 is located in the second current path 720 and is connected between the first current path 710 and the second current path 720 by the third switch 730, the first current path ( The reference current shared from 710) can be charged by sampling with a proportional voltage.
  • the compensation circuit 620 may correct the mismatch between sink and source currents by allowing the first current path 710 and the second current path 720 to share the same reference current.
  • FIG. 8 is a circuit diagram 800 illustrating a compensation circuit in accordance with various embodiments.
  • the compensation circuit 620 may include a plurality of first current paths 710 to share a reference current between the first current path 710 and the second current path 720.
  • FETs (812a, 812b, 812c, 812d, 812e, 812f, 812g, 813a, 813b, 813c, 813d, 813e, 813f) and the amplifier 811
  • the second current path 720 includes a plurality of FET (822a) , 822b, 822c, 822d, 822e, 823a, 823b, 823c, 823d) and can be implemented with a regulated cascode current mirror circuit with a wide swing including amplifier 821 have.
  • the compensation circuit 620 is implemented with a regulated cascode current mirror circuit having a wide swing, so that V x and V y on the second current path 720 are equal, resulting in a process change in the transistor and a drain voltage mismatch in the current mirror. All can be compensated.
  • the compensation circuit 620 includes a first transistor M P1 connected to both ends of a third switch 731 that connects between the first current path 710 and the second current path 720, and The second transistor M P2 may be included. After the first transistor M P1 and the second transistor M P2 are disconnected between the first current path 710 and the second current path 720, the first current path 710 and the second current are disconnected. The offset remaining between the paths 720 can be removed.
  • the first transistor M P1 and the second transistor M P2 may include PMOS transistors having different width/length ratios. May be, for example, the first transistors (M P1) the width / length ratio of the second transistor (M P2) the width / length ratio of the half (half) of the.
  • FIG. 9 is a circuit diagram 900 for describing a first current path of a compensation circuit according to various embodiments.
  • a reference current I REF is applied to a source terminal of the FET 812f of the first current path 710 of the compensation circuit 620 according to various embodiments, and a gate terminal of the FET 812f A bias voltage V bias may be applied to the.
  • the negative (-) terminal of the amplifier 811 is grounded, and the positive (+) terminal of the amplifier 811 may be applied with a reference current (I REF ) via the FET 812f.
  • the output terminal of the amplifier 811 may be connected to the gate terminal of the FET (812g).
  • a shared current (I copied ) corresponding to a reference current may be applied from the second current path 720 to the source terminal of the FET 812g.
  • the plurality of FETs 812f, 812g, 813e, and 813f of the first current path 710 and the amplifier 811 are connected in a feedback structure so that V DS1 and V DS2 can have the same voltage value. A mismatch between the first current path 710 and the second current path 720 may be corrected.
  • FIG. 10 is a circuit diagram 1000 for describing a second current path of a compensation circuit according to various embodiments.
  • a second current path 720 of the compensation circuit 620 has a reference current from the first current path 710 connected to the sampling capacitor 740 and a third switch 731 is connected. In the meantime, it can be converted into a proportional voltage and sampled.
  • the voltage sampled to the sampling capacitor 740 may be applied as the gate voltage V gs of the FET 823d, which is a shared current (I copied ) corresponding to the reference current through the drain terminal of the FET 823d. (822e).
  • the second switch 721 of the second current path 720 is connected to the sensing node 640, a source current corresponding to the shared current I copied is provided to the sensing node 640 Can.
  • the second current path 720 is connected to one end and the other end of the third switch 731 and remains after the connection between the first current path 710 and the second current path 720 is terminated. It may include a first transistor (M P1 ) And a second transistor (M P2 ) for removing the offset.
  • the first transistor M P1 and the second transistor M P2 may include PMOS transistors having different width/length ratios. For example, the width/length ratio of the first transistor M P1 is 5/0.35 ⁇ m, and the width/length ratio of the second transistor M P2 is 10/0.35 ⁇ m, which is the width of the first transistor M P1 .
  • the length ratio may be half of the width/length ratio of the second transistor M P2 .
  • the first transistor M P1 and the second transistor M P2 are connected between the first current path 710 and the second current path 720, when the connection of the third switch 731 is released, the first transistor M P1 is disconnected. The channel charge of the two transistors M P2 is trapped in the first transistor M P1 to remove the residual offset.
  • 11 is a time flow chart 1100 for describing the operation of the touch control circuit according to various embodiments.
  • a touch control circuit according to various embodiments (eg, a touch sensor IC 253 of FIG. 2, a touch control circuit 310 of FIG. 3, a touch control circuit 420 of FIG. 4) or FIG.
  • the sensing signal of the first code is output.
  • a period 1110 and a second period 1120 in which the sensing signal of the second code is output may be included.
  • the operation of the touch control circuit during the first period 1110 and the second period 1120 provides a first compensation current 712 in the first current path 710 and a second in the second current path 720. Except for providing the compensation current 722, since it may be performed in a substantially similar operation, in the following, the compensation circuit 620 compensates for the source current through the second current path 720, the second period 1120 Based on the description, the touch sensing control operation will be described.
  • the first switch array (S CHG ) 613 may be controlled to provide the driving signal of the driving circuit 610 to the sensing electrode 611.
  • the driving signal from the driving circuit 610 may be charged to the sensing electrode 611 by the first switch array 613.
  • the driving signal charged in the sensing electrode 611 is a sensing signal
  • the second switch array (S DHG ) 614 is provided to the sensing circuit 630 from the sensing electrode 611. Can be controlled.
  • the sensing signal may be discharged from the sensing electrode 611 by the first switch array 614.
  • the initialization switch S RST 631c is controlled to initialize the feedback capacitor 631b so that the charge amplifier 631 of the sensing circuit 630 can receive the sensing signal. Can.
  • the feedback capacitor 631c of the charge amplifier 631 can be initialized by the initialization switch 631c.
  • a third time period 1123 may be included between the first time period 1121 and the second time period 1122.
  • the third switch 731 of the compensation circuit 620 is controlled to connect between the first current path 710 and the second current path 720 of the compensation circuit 620.
  • Can. A reference between the first current path 710 and the second current path 720 by connecting the first current path 710 and the second current path 720 by a third switch (S CAL ) 731
  • the current can be shared. The operation of sharing the reference current may correct a mismatch between the sink current and the source current before compensating the sink current or source current by the compensation circuit 620.
  • the second switch (S SRC ) 721 of the compensation circuit 620 is controlled to connect the second current path 720 of the compensation circuit 620 to the sensing node 640. can do.
  • the second current path 720 and the sensing node 640 may be connected by the second switch 721 to provide the source current to the sensing node 640 in the second current path 720.
  • the operation of sharing a reference current between the first current path 710 and the second current path 720 in the first time period 1121 is performed in the third time period 1123.
  • the third switch 731 may be controlled for a time (Tcal) that may overlap at least partially with the operation of providing the source current to the sensing node 640. This makes it possible to prevent the deviation of the current from occurring by partially overlapping the compensation operation of the reference current and the operation of providing the source current.
  • the operation of providing the source current in the third time period to the sensing node 640 may include at least a portion of discharging the sensing signal from the sensing electrode 611 in the second time period.
  • the second switch array 614 may be controlled to be redundant. This is because when the provision of the source current and the discharge of the sensing signal are simultaneously performed, it may be difficult to accurately measure the movement of the excessive capacitance from the sensing electrode. Therefore, the operation of providing the source current is performed by first sensing and discharging the sensing signal The sensing signal may be compensated by maintaining the signal during the discharge operation.
  • the electronic device includes one or more sensing electrodes (eg, the sensing electrode 311 of FIG. 3, the sensing electrode 411 of FIG. 4, and the sensing of FIG. 5)
  • a touch screen panel including an electrode 311 or the sensing electrode 611 of FIG. 6 eg, the touch screen panel 310 of FIG. 3, the touch screen panel 410 of FIG. 4, or the touch screen panel of FIG. 5) 310
  • the touch screen panel and a sensing node for example, the sensing node 640 of FIG. 6 or the sensing node 640 of FIG.
  • the sensing node based on a first compensation current based on a reference current Based on the first current path (e.g., the first current path 710 of FIG. 7, the first current path 710 of FIG. 8 or the first current path 710 of FIG. 9) and the reference current
  • a second current path e.g, second current path 720 of FIG. 7, second current path 720 of FIG. 8 or a second current path that provides a second compensation current that is out of phase with the first compensation current to the sensing node.
  • Compensation circuit compensation circuit (compensation circuit 532 of FIG. 5), compensation circuit 620 of FIG. 6, compensation circuit 620 of FIG. 7 or compensation circuit 620 of FIG.
  • At least one control circuit eg, a touch sensor IC 253 of FIG. 2, 3 of FIG. 2 that provides a driving signal to the one or more sensing electrodes and controls to output a sensing signal from the one or more sensing electrodes.
  • the first compensation current includes a sink current through which charge flows from the sensing node to the compensation circuit.
  • the second compensation current may include a source current through which charge flows from the compensation circuit to the sensing node.
  • the at least one control circuit may be configured to perform the first operation signal while a first driving signal having a first code of the driving signal is provided. While providing a first compensation current to the sensing node and a second driving signal having a second sign that is out of phase with the first sign of the driving signal is provided, the second compensation current is controlled to be provided to the sensing node. Can.
  • the compensation circuit includes a regulated cascode current mirror circuit having a wide swing. can do.
  • the compensation circuit may include a first switch connecting the first current path to the sensing node (eg, the first of FIG. 7) Switch 711 or the first switch 711 in FIG. 8, a second switch connecting the second current path to the sensing node (eg, the second switch 721 in FIG. 7 or the second switch in FIG. 8) (721)), a third switch for connecting between the first and second current paths (eg, the third switch 730 of FIG. 7 or the third switch 730 of FIG. 8), and the first and first While the two current paths are connected, a sampling capacitor that samples the reference current (eg, the sampling capacitor 740 of FIG. 7, the sampling capacitor 740 of FIG. 8, or the sampling capacitor 740 of FIG. 10) ).
  • an electronic device eg, the electronic device 101 of FIG. 1 according to various embodiments, it is connected to one end and the other end of the third switch to remove residual offset between the first and second current paths.
  • a first transistor a second transistor (Fig. 8, the first transistors (M P1) or Fig. 10 the first transistors (M P1) of a) and the second transistor (second transistor of FIG. 8 (M P2) or 10 (M P2 )).
  • the first and second transistors may include PMOS transistors having different width/length ratios. .
  • the width/length ratio of the first transistor may be half of the width/length ratio of the second transistor.
  • the first driving signal having the first code and the first code by generating the driving signal and encoding the generated driving signal
  • a driving circuit eg, the driving circuit 531 of FIG. 5 or the driving circuit 610 of FIG. 6
  • the at least one sensing A sensing circuit eg, a sensing circuit 533 of FIG. 5
  • the sensing circuit 630 of 6 may be further included.
  • the sensing circuit includes an amplifier having a first input terminal connected to the sensing node and a second input terminal to which a reference voltage is applied ( Example: The amplifier 631a of FIG. 6 may be included, and a charge amplifier (CA) (eg, the charge amplifier 631 of FIG. 6) that converts and outputs the sensing signal to the sensing voltage may be included.
  • CA charge amplifier
  • the charge amplifier includes a feedback capacitor connected between the first input terminal of the amplifier and an output terminal outputting the sensing voltage ( feedback capacitor) (eg, feedback capacitor 631b in FIG. 6), and an initialization switch (eg, initialization switch 631c in FIG. 6) for initializing the feedback capacitor.
  • feedback capacitor eg, feedback capacitor 631b in FIG. 6
  • initialization switch eg, initialization switch 631c in FIG. 6
  • a first switch array for providing the driving signal provided from the driving circuit to the one or more sensing electrodes
  • the first switch array 613 of the first and the second switch array for outputting the sensing signal from the one or more sensing electrodes may be further included.
  • the at least one control circuit may include a first driving signal having a first sign of the driving signal or the second of the driving signal. While the second driving signal having the second code having a different phase from the first code is provided, in the first time period, the first switch array is controlled to charge the first or second driving signal to the one or more sensing electrodes. In the second time period, the first or second sensing signal corresponding to the first or second driving signal may be discharged from the one or more sensing electrodes by controlling the second switch array.
  • the at least one control circuit controls the initialization switch of the charge amplifier in the first time period to charge the charge amplifier. Can reset the feedback capacitor.
  • a third time interval between the first time interval and the second time interval, and the at least one control circuit In the first time period, connecting between the first and second current paths of the compensation circuit to share the reference current between the first current path and the second current path, and in the third time period , By connecting the first or second current path and the sensing node, the first or second compensation current may be provided to the sensing node.
  • the at least one control circuit may include the first current path and the second current path in the first time period.
  • the operation of sharing the reference current may be controlled to overlap at least partially with the operation of providing the first or second compensation current to the sensing node in the third time period.
  • the at least one control circuit may transmit the first or second compensation current in the third time period to the sensing node.
  • the provided operation may be controlled to overlap at least partially with the operation of discharging the sensing signal from the one or more sensing electrodes in the second time period.
  • the driving circuit, the compensation circuit, the sensing circuit, or the at least one control circuit has one analog front end. ; AFE) circuits.
  • the one or more sensing electrodes included in the touch screen panel are disposed in a dot matrix form
  • the at least one control circuit is Providing the driving signal to the one or more sensing electrodes, and using a self-capacitance sensing method based on a sensing signal output from the one or more sensing electrodes, inputs a touch or hover to the touch screen panel. Can be detected.
  • the one or more sensing electrodes included in the touch screen panel may include a first sensing line extending in a first direction (eg, FIG. 4) In the form of a two-dimensional matrix including a first sensing line (412) and a second sensing line (eg, the second sensing line 413 in FIG. 4) extending in a second direction to intersect with the first sensing line.
  • the at least one control circuit provides the driving signal independently of each other to the first sensing line or the second sensing line, and is output from the first sensing line and the second sensing line independently of each other.
  • a touch or hovering input to the touch screen panel is detected by using a self capacitance sensing method based on a sensing signal, or the driving signal is provided to the first sensing line, and the second sensing line is used.
  • a touch or hovering input to the touch screen panel may be detected using a mutual capacitance sensing method based on a sensing signal output from.
  • An electronic device may be a device of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • any (eg, first) component is referred to as “coupled” or “connected” to another (eg, second) component, with or without the term “functionally” or “communically” When referred to, it means that any of the above components can be connected directly to the other components (eg by wire), wirelessly, or through a third component.
  • module used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, components, or circuits.
  • the module may be an integrally configured component or a minimum unit of the component or a part thereof performing one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present disclosure may include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (e.g., program 140) that includes.
  • a processor eg, processor 120
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the storage medium readable by the device may be provided in the form of a non-transitory storage medium.
  • a signal eg, electromagnetic waves
  • a method according to various embodiments disclosed in this document may be provided as being included in a computer program product.
  • Computer program products can be traded between sellers and buyers as products.
  • the computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store TM ) or two user devices ( For example, it can be distributed directly (e.g., downloaded or uploaded) between smartphones).
  • a device such as a memory of a manufacturer's server, an application store's server, or a relay server, or may be temporarily generated.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, or omitted Or, one or more other actions can be added.

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Abstract

Selon divers modes de réalisation, un dispositif électronique peut comprendre : un panneau à écran tactile comprenant au moins une électrode de détection ; un circuit de compensation comprenant un premier trajet de courant qui est connecté au panneau d'écran tactile par l'intermédiaire d'un nœud de détection et fournit au nœud de détection un premier courant de compensation sur la base d'un courant de référence, et un second trajet de courant qui fournit au nœud de détection un second courant de compensation sur la base du courant de référence et ayant une phase différente de celle du premier courant de compensation ; et au moins un circuit de commande pour fournir à la ou les électrodes de détection un signal de commande et effectuer une commande de telle sorte qu'un signal de détection est émis à partir de la ou les électrodes de détection, le ou les circuits de commande effectuant une commande de telle sorte que le signal de détection ayant été compensé par le premier ou le second courant de compensation est délivré tandis que le premier ou le second courant de compensation est fourni au nœud de détection. D'autres modes de réalisation sont également possibles.
PCT/KR2019/017824 2018-12-18 2019-12-16 Dispositif électronique de commande de détection tactile WO2020130543A1 (fr)

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