WO2020130272A1 - Glass bonding film and manufacturing method thereof - Google Patents

Glass bonding film and manufacturing method thereof Download PDF

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Publication number
WO2020130272A1
WO2020130272A1 PCT/KR2019/010299 KR2019010299W WO2020130272A1 WO 2020130272 A1 WO2020130272 A1 WO 2020130272A1 KR 2019010299 W KR2019010299 W KR 2019010299W WO 2020130272 A1 WO2020130272 A1 WO 2020130272A1
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Prior art keywords
film
glass
glass bonding
depth
bonding
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PCT/KR2019/010299
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French (fr)
Korean (ko)
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김혜진
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에스케이씨 주식회사
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Publication of WO2020130272A1 publication Critical patent/WO2020130272A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/30Extrusion nozzles or dies
    • B29C48/305Extrusion nozzles or dies having a wide opening, e.g. for forming sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/101Esters; Ether-esters of monocarboxylic acids
    • C08K5/103Esters; Ether-esters of monocarboxylic acids with polyalcohols

Definitions

  • the present invention relates to a film for glass bonding and a method for manufacturing the same.
  • laminated glass composed of a pair of glass panels and a synthetic resin film interposed between the panels is excellent in safety because the fragments do not scatter even when damaged, and the Widely used in windowpanes and building windowpanes.
  • a polyvinyl acetal resin having high affinity for inorganic materials is applied to the film applied to the laminated glass.
  • Laminate glass which places a film between a pair of glass panels, has the basic properties required for laminated glass, such as penetration resistance or difficulty in shattering glass, but may have poor moisture resistance, in which case laminated glass in a high humidity atmosphere
  • the interlayer film directly contacts the air and whitening occurs in the periphery. And, for the purpose of preventing such a whitening phenomenon, an additive for adjusting the bonding force between the film and glass is used.
  • Japanese Unexamined Patent Publication No. 1998-139496 discloses a film that does not undergo whitening as an interlayer film for laminated glass containing polyvinyl butyral, plasticizer, carboxyl metal salt and modified silicone oil.
  • the film has reduced compatibility with polyvinyl butyral resins due to the use of modified silicone oils with low polarity, resulting in increased haze in the final film, and functional groups of the glass to react with hydroxyl groups of the polyvinyl butyral resin.
  • the bonding strength is significantly reduced due to interference with the modified silicone oil, penetration resistance and impact resistance are deteriorated.
  • An object of the present invention is to provide a method for manufacturing a glass bonding film and a glass bonding film having improved durability and moisture resistance.
  • an aspect of the present invention is a melting step of manufacturing a molten resin by melting a composition comprising a polyvinyl acetal resin and an additive; And, it provides a method for manufacturing a film for glass bonding, including a molding step of discharging the molten resin through a molding unit and molding in a film form to form a film for glass bonding.
  • the additive contains a metal salt.
  • the forming unit applies electric force to the molten resin.
  • the glass bonding film satisfies Equation 1 below.
  • M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film
  • the M2 is the surface of the glass bonding film.
  • D1 and D2 are respectively values of 60 nm or less
  • D3 and D4 are values of 80 nm or more, respectively.
  • the molded part may include a tee die located at one end.
  • the forming unit may apply a voltage of 10 kV or less.
  • a voltage of 10 kV or less may be applied to the forming part.
  • the electric force may apply an attraction force to the forming portion to the metal ion.
  • an attraction force to the forming part may be applied to the metal ion.
  • the D1 may belong to 0.1 nm to 15 nm.
  • the D2 may belong to 40 nm to 55 nm.
  • the D3 may belong to 80 nm to 95 nm.
  • the D4 may belong to 135 nm to 150 nm.
  • the difference between D2 and D1 may correspond to the difference between D4 and D3.
  • the D1 may be 5 nm.
  • the D2 may be 55 nm.
  • the D3 may be 90 nm.
  • the D4 may be 140 nm.
  • the M1 may be three or more times the M2.
  • another aspect of the present invention includes a polyvinyl acetal resin, a metal salt or a metal ion together with a plasticizer, and satisfies Equation 1 below, to provide a film for glass bonding.
  • M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film
  • the M2 is the surface of the glass bonding film.
  • D1 and D2 are respectively values of 60 nm or less
  • D3 and D4 are values of 80 nm or more, respectively.
  • the first depth and the second depth may be the same value or different values.
  • the first depth and the second depth may be a value having a difference of 3 or more, and a value having a difference of 5 or more.
  • the third depth and the fourth depth may be the same value or different values.
  • the third depth and the fourth depth may be a value having a difference of 3 or more, and a value having a difference of 5 or more.
  • the D1 may belong to 0.1 nm to 15 nm.
  • the D2 may belong to 40 nm to 55 nm.
  • the D3 may belong to 80 nm to 95 nm.
  • the D4 may belong to 135 nm to 150 nm.
  • the difference between D2 and D1 may correspond to the difference between D4 and D3.
  • the D1 may be 5 nm.
  • the D2 may be 55 nm.
  • the D3 may be 90 nm.
  • the D4 may be 140 nm.
  • the M1 may be three or more times the M2.
  • the metal ion may include a divalent metal ion.
  • An average whitening distance value of the glass laminate laminated with the glass bonding film therebetween may be 5 mm or less.
  • the glass bonding film may have 3 to 4 stages of the level of the strength of the laminated glass to form a film.
  • another aspect of the present invention is a first glass substrate; A second glass substrate facing the first glass substrate; And a glass bonding film interposed between the first glass substrate and the second glass substrate and bonded to the first glass substrate and the second glass substrate, wherein the film for glass bonding is a polyvinyl acetal resin, It contains a metal salt or a metal ion together with a plasticizer, and satisfies Equation 1 below.
  • the M1 is the average content of metal ions from the first depth (D1) to the second depth (D2) based on the surface of the film for glass bonding, and the M2 is based on the surface of the film for glass bonding.
  • the average content of metal ions from 3 depths (D3) to 4th depths (D4), D1 and D2 are respectively 60 nm or less, and D3 and D4 are 80 nm or more, respectively.
  • the film for glass bonding of the present invention can provide a film for glass bonding or the like, which has excellent bonding force control effect even if a relatively small amount of metal salt is applied, and which does not substantially exhibit reduced moisture resistance or long-term durability.
  • the method for manufacturing a glass bonding film of the present invention can control the concentration of metal salts (or metal ions) depending on the depth of the film by applying an electric force, so that the glass bonding film is controlled with properties such as glass bonding strength and moisture resistance. Can be produced.
  • FIG. 1 is a schematic diagram illustrating a device structure of a die lip for adjusting the ion concentration of a film surface applied in an embodiment of the present invention.
  • FIG. 2 is a view for explaining a method of measuring a whitening distance measured in an embodiment of the present invention.
  • FIG 3 is a conceptual diagram (a) for explaining a cross section of a laminated glass according to an embodiment of the present invention, and a conceptual diagram (b) for explaining the first to fourth depths of the equation.
  • Figure 4 is a graph showing the average value in the range of 5 to 105 nm in the results of evaluating the surface ion concentration of the film in the embodiment of the present invention in 10 nm units, the horizontal axis represents the depth (depth, nm) and the vertical axis It means intensity (counts), and #1 and #2 represent Example 1 and Example 2, respectively.
  • the term “combination of these” included in the expression of the marki form means one or more mixtures or combinations selected from the group consisting of the components described in the expression of the marki form, the component. It means to include one or more selected from the group consisting of.
  • the “ ⁇ ” system may mean that a compound corresponding to “ ⁇ ” or a derivative of “ ⁇ ” is included in the compound.
  • B is located on A means that B is directly in contact with A, or that B is located on A while another layer is positioned between them, and B is placed in contact with the surface of A. It is not limited to being interpreted.
  • the inventors of the present invention when applying a relatively large amount of the metal salt compound, the effect of controlling the bonding force can be sufficiently obtained, but the finding that the yellowing phenomenon is likely to occur, while researching a solution to this, the bonding force is more effective even in a small amount
  • the present invention was completed by developing a film for controlling glass.
  • the present invention is to produce a film having a concentration gradient so that the metal salt ions are more arranged toward the surface by a method such as applying a voltage during the manufacturing process of the film, while reducing the applied amount of the metal salt compound to less than or equal to obtain a sufficient bonding force control effect, , It is also possible to manufacture a film for glass bonding, etc. with substantially improved moisture resistance and/or durability.
  • FIG. 1 is a schematic diagram illustrating a device structure of a die lip for adjusting the ion concentration of a film surface applied in an embodiment of the present invention
  • FIG. 2 is a diagram illustrating a method of measuring the whitening distance measured in an embodiment of the present invention
  • 3 is a conceptual diagram (a) for explaining a cross section of a laminated glass according to an embodiment of the present invention, and a conceptual diagram (b) for explaining the first to fourth formulas.
  • the present invention will be described in more detail with reference to FIGS. 1 to 3.
  • a method of manufacturing a film for glass bonding according to an embodiment of the present invention including a melting step and a molding step, in the molding step, the molten resin is applied with electric force through the molding part, A glass bonding film 110 satisfying Equation 1 below is prepared.
  • M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film
  • the M2 is the surface of the glass bonding film.
  • D1 and D2 are respectively values of 60 nm or less
  • D3 and D4 are values of 80 nm or more, respectively.
  • the melting step is a step of manufacturing a molten resin by melting a composition comprising a polyvinyl acetal resin and an additive.
  • the additive may contain a metal salt.
  • the melting step may be applied to a resin melting method applied to a conventional film production, for example, a twin-screw extruder may be applied.
  • composition comprising the polyvinyl acetal resin and the additive and the metal salt contained in the additive will be described later.
  • the forming step is a step of discharging the molten resin through a molding part and forming a film 110 for glass bonding by molding in a film form.
  • the molding part may be applied as long as it can be manufactured in a film form while controlling the thickness, and in the case of manufacturing a single-layer film, it is put into an extruder (for example, a twin-screw extruder) and melt-discharged to control the thickness through a T-die to be produced in a film form.
  • an extruder for example, a twin-screw extruder
  • melt-discharged to control the thickness through a T-die to be produced in a film form.
  • a multi-layer film it may be melt-extruded in an extruder, and then laminated through a laminating device such as a feed block and a multi-manifold, and molded into a film form in a T-die (coextrusion method).
  • the molding unit may include a T-die 200 positioned at one end.
  • electric power may be applied to the molten resin 1 through the forming part.
  • a voltage of 10 kV or less may be applied to the forming part.
  • the attraction force to the forming part may be applied to the metal ion.
  • the molding step will be described by way of example where the T-die is located in the molding part.
  • the T-die 200 is located at one end of the molding part, and the T-die 200 has an inlet (not shown) through which the molten resin composition 1 is introduced and an outlet through which the molten resin composition is discharged.
  • Die ribs 210 and 230 are located on both sides of the portion where the molten resin composition is discharged.
  • the voltage applying parts 220 and 240 are located on the die lips 210 and 230 on both sides.
  • the voltage applying units 220 and 240 are voltage applying devices such as, for example, tungsten wire, and are devices capable of applying the applied voltage to the die lips 210 and 230.
  • the voltage applying units 220 and 240 are electrically connected to an external power supply (not shown).
  • the voltage application parts 220 and 240 adjust the voltage of the die lip so that the molten resin 1 becomes a charged molten resin 2.
  • the charged molten resin 2 includes a high concentration region 3 formed by moving metal ions contained in the molten resin 1 to the surface.
  • the high concentration region 3 refers to a region in which the surface ion concentration described below is higher than the film average ion concentration.
  • Both surfaces of the film for glass bonding may contain the metal salt or the metal ion more distributed compared to the center of the film for glass bonding.
  • the charged molten resin 2 having the high concentration region 3 on the surface side may then form a glass bonding film having a U-type metal ion concentration gradient in the thickness direction.
  • a voltage applied to the forming unit may be applied with a voltage of 10 kV or less, and a voltage of 1 to 10 kV may be applied.
  • a voltage of 1.5 to 8 kV may be applied to a voltage applied to the molding part, and a voltage of 2.5 to 6 kV may be applied.
  • the voltage is too low, the force pulling the metal ion, which is a cation, toward the surface of the film is weak, so that a sufficient concentration gradient may not be induced, and if a too strong voltage is applied, deterioration may occur in the polymer film, and the film for glass bonding It may affect the film properties such as the optical properties and long-term durability of the film, which may degrade the properties of the film.
  • a voltage applied by the voltage application part may be applied at 4 to 6 kV.
  • a voltage of 3 to 4 kV may be applied.
  • the voltage may be applied to pull the metal ion, which is a cation, and specifically, may be applied to have a negative charge.
  • an electric force may be applied to the molten resin by static electricity.
  • static electricity generated by friction remains in the molding unit, and an electric force may be applied to the molten resin through the molding unit.
  • the molded part may not be grounded so that static electricity remaining in the molded part is not easily discharged.
  • the resistance of the ground wire connected to the molding part is high, so that some static electricity remains, the amount of static electricity discharged may be adjusted.
  • the molten resin 2 charged in the forming step may be discharged at a rate of 5 to 15 m per minute to form a film.
  • the speed may be 5 to 15 m per minute, or 7 to 13 m.
  • the polyvinyl acetal may be polyvinyl acetal obtained by acetalizing polyvinyl alcohol having a polymerization degree of 1,600 to 3,000, and may be polyvinyl acetal obtained by acetalizing polyvinyl alcohol having a polymerization degree of 1,700 to 2,500. .
  • a polyvinyl acetal When such a polyvinyl acetal is applied, it is possible to sufficiently improve mechanical properties such as penetration resistance.
  • the polyvinyl acetal may be a synthesis of polyvinyl alcohol and aldehyde, and the type of the aldehyde is not limited.
  • the aldehyde may be any one selected from the group consisting of n-butyl aldehyde, isobutyl aldehyde, n-barrel aldehyde, 2-ethyl butyl aldehyde, n-hexyl aldehyde and blend resins thereof.
  • the prepared polyvinyl acetal resin may have a refractive index characteristic with a small difference in refractive index of glass and excellent bonding strength with glass.
  • the additives include plasticizers.
  • the plasticizer is triethylene glycol bis 2-ethylhexanoate (3G8), tetraethylene glycol diheptanoate (4G7), triethylene glycol bis 2-ethylbutyrate (3GH), triethylene glycol bis 2-heptanoate (3G7) ), dibutoxyethoxyethyl adipate (DBEA), butyl carbitol adipate (DBEEA), dibutyl sebacate (DBS), bis 2-hexyl adipate (DHA) and mixtures thereof. More specifically, triethylene glycol bis 2-ethylhexanoate (3G8) may be applied as the plasticizer.
  • the additive includes a metal salt compound.
  • the metal salt compound is applied to obtain the effect of controlling the bonding force, specifically, a metal salt of a carboxylic acid having 2 to 16 carbon atoms may be applied, and more specifically, a metal salt of a divalent metal having 2 to 12 carbon atoms, or 1 to 2 carbon atoms. Metal salts of temporary metals may be applied.
  • the metal ion contained in the metal salt compound may be any one selected from the group consisting of sodium monovalent cation, magnesium divalent cation, and potassium monovalent cation.
  • the metal salt compound may be applied to the composition in the form of a metal salt compound or in an ionized state dissolved in a solvent, and serves as a bonding power regulator. Specifically, the bonding force between the film and the glass surface can be adjusted.
  • the metal salt compound is applied to the composition in a solution state, dispersion and movement of ions derived from the metal salt compound or the metal salt compound may be more easily performed in a film or a bonding layer prepared.
  • the metal salt compound may be included in less than 1.0% by weight, less than 0.5% by weight, and may be included in 0.35% by weight or less based on the entire molten resin. In addition, the metal salt compound may be included in an amount of 0.01 to 0.5% by weight, 0.01 to 0.35% by weight, 0.01 to 0.25% by weight, and 0.01 to 0.2% by weight based on the entire molten resin. Can.
  • the molten resin may constitute a single-layer film or a surface layer of a multilayer film.
  • the metal salt compound may be included so that the content of metal ions derived from the metal salt compound is 150 ppm or less, and 100 ppm or less based on the entire molten resin.
  • the content of the metal ion may be included to be 1 to 70 ppm based on the entire molten resin, may be included to be 1 to 50 ppm, may be included to be 1 to 35 ppm. Even if the metal salt compound or the metal salt ion is contained in such a very low content, the metal ion is positioned on a surface requiring a bonding power control effect by the method applied in the present invention, so that a sufficient bonding power control effect can be obtained. At this time, ppm is calculated based on the weight.
  • the metal salt compound is included in the amount described above based on the entire composition, to prepare a single layer glass bonding film, and when preparing a multilayer glass bonding film, the surface layer of the composition containing the metal salt compound ( Bonding layer).
  • an ultraviolet stabilizer (ultraviolet absorber) may be applied together to enhance the UV blocking effect, and a benzotriazole-based compound may also be applied as such an ultraviolet stabilizer.
  • the benzotriazole-based compound may cause a change in the binding structure of the benzotriazole-based compound due to the interaction between the hydroxyl group in the molecule and the nitrogen contained in the triazole ring located close to the hydroxyl group for energy of ultraviolet rays, At this time, if metal ions are involved, the effect as an ultraviolet stabilizer may be reduced.
  • the benzotriazole-based compound is coordinated with polyvalent metal ions to form a chelate ring.
  • the benzotriazole-based compound formed with the chelate ring does not sufficiently function as an ultraviolet stabilizer and may weaken the durability of the entire film. .
  • the ultraviolet stabilizer may be applied without limitation as long as it is applied as an ultraviolet stabilizer, and it is also possible to apply an ultraviolet stabilizer containing a benzotriazole-based compound.
  • an ultraviolet stabilizer containing a benzotriazole-based compound Specifically, Chemisorb 12, Chemisolve 79, Chemisolve 74, Chemisolve 102, BASF's Tinuvin 328, Tinuvin 329, Tinuvin 326, etc. may be used.
  • the present invention in order to sufficiently function as a UV stabilizer of the benzotriazole-based compound applied to the production of a film for glass bonding and to improve the durability of the film itself, even if a small amount is applied, it has an excellent bonding strength control effect.
  • the metal salt compound may include 16 parts by weight or less, 12 parts by weight or less, and 1 to 10 parts by weight.
  • the metal salt compound is contained in an amount of less than 1 part by weight based on 100 parts by weight of the benzotriazole-based compound, the effect of adjusting the bonding strength obtained by adding the metal salt compound may not be sufficient, and when it is included in more than 16 parts by weight, water resistance is rather Can fall.
  • the composition may further contain an additive selected from the group consisting of an antioxidant, a heat stabilizer, an IR absorber, and a combination thereof, as necessary.
  • the additive may be included in at least one of the layers above, or may be included in the entire film.
  • the additive in the composition, it is possible to further improve long-term durability and scattering prevention performance, such as thermal stability and light stability of the film.
  • the antioxidant may be a hindered amine (hindered amine) system or a hindered phenol (hindered phenol) system.
  • a hindered phenolic antioxidant is more preferable in a polyvinyl butyral (PVB) manufacturing process requiring a process temperature of 150°C or higher.
  • Hindered phenolic antioxidants for example, BASF's IRGANOX 1076, 1010 and the like can be used.
  • the thermal stabilizer may be a phosphite-based thermal stabilizer when considering compatibility with an antioxidant.
  • BASF's IRGAFOS 168 can be used.
  • ITO, ATO, AZO, etc. may be used as the IR absorber, but the present invention is not limited thereto.
  • the glass bonding film has the characteristics described below, and the detailed description thereof will be omitted because it overlaps with the description below.
  • the film 110 for glass bonding according to another embodiment of the present invention is a film for glass bonding containing a metal salt, wherein the average content of metal ions within a depth of 50 nm from the surface is the metal ion of the entire film for glass bonding. Higher than the average content.
  • the film 110 for glass bonding includes a metal salt or a metal ion together with a polyvinyl acetal resin and a plasticizer, and satisfies Equation 1 below.
  • M1 is the average content of metal ions from the first depth (D1) to the second depth (D2) based on one surface 111 of the film for glass bonding
  • the M2 is the film for the glass bonding film.
  • D1 and D2 are values of 60 nm or less, and D3 and D4 are 80 nm or more Is the value.
  • the first depth and the second depth may be the same value or different values.
  • the third depth and the fourth depth may be the same value or different values.
  • the first depth (D1), the second depth (D2), the third depth (D3) and the fourth depth (D4) are each of the film for the glass bonding It means a predetermined depth from one surface 111.
  • one surface 111 of the glass bonding film may be a bonding surface of the glass bonding film 110 that is directly contacted with a glass substrate or the like and is bonded to the glass substrate or the like.
  • the D1 belongs to 0.1 nm to 15 nm
  • the D2 belongs to 40 nm to 55 nm
  • the D3 belongs to 80 nm to 95 nm
  • the D4 belongs to 135 nm to 150 nm.
  • the difference between D2 and D1 may correspond to the difference between D4 and D3. That is, the difference between the first depth and the second depth may be substantially the same as the difference between the third depth and the fourth depth.
  • the D1 is 5 nm
  • the D2 is 55 nm
  • the D3 is 90 nm
  • the 140 nm the D1 is 5 nm
  • the D2 is 55 nm
  • the D3 is 90 nm
  • the 140 nm the D1 is 5 nm
  • the D2 is 55 nm
  • the D3 is 90 nm
  • the 140 nm the 140 nm.
  • the M1 may be 3 times or more of the M2, 3.5 times or more, 8 times or less, and 6 times or less.
  • the concentration gradient is concentrated so that the distribution of the metal salt compound, especially the metal cation, is concentrated on the surface. It is possible to provide a film for glass bonding.
  • the film for glass bonding may have an average content of metal ions within a depth of 50 nm from a surface of at least 1.2 times and 1.5 times higher than the average content of metal ions in the entire film for glass bonding.
  • the film for glass bonding may have an average content of metal ions within a depth of 50 nm from the surface of the glass bonding film 1.5 to 4 times, more specifically 1.9 to 3 times higher than the average content of metal ions in the entire film.
  • the metal ion may include a divalent metal ion.
  • the metal ion may be formed of a divalent metal ion.
  • the metal ion may be magnesium divalent ion.
  • the film for glass bonding is to have the laminated glass containing the film for glass bonding in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks, and then take it out, and the measured whitening distance is 5 mm or less, and has excellent moisture resistance. Can.
  • the amount of change in yellowness before and after leaving the laminated glass containing the glass bonding film in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks may be 2.5 or less.
  • the film for bonding the glass may have a grade of 3 to 4 in the degree of a polymer bonding strength of the laminated glass including the film for bonding the glass.
  • the thickness of the film for glass bonding may be 0.4 mm or more, specifically 0.4 to 1.6 mm, 0.5 to 1.2 mm, and 0.6 to 0.9 mm. In the case of manufacturing the film with such a thickness, it is possible to provide a film having characteristics such as excellent impact resistance and penetration resistance while being thin and light.
  • the glass bonding film may have a single-layer structure, a structure having two or more layers, a structure having three or more layers, or a structure having five or more layers.
  • a layer positioned therein except for the surface layers on both sides may be a functional layer.
  • the functional layer may be, for example, a sound insulating layer that imparts sound insulating functionality to the film for glass bonding.
  • the functional layer may be, for example, a wedge layer capable of imparting the functionality of the head-up display.
  • the characteristic for the metal salt or metal ion described above may be a characteristic applied to the surface layer.
  • the laminated glass 100 includes a laminate including the glass bonding film 110 described above between two sheets of glass 120 and 130.
  • the laminated glass 100 includes a first glass substrate 120; A second glass substrate 130 facing the first glass substrate; And a glass bonding film 110 interposed between the first glass substrate 120 and the second glass substrate 130 and bonded to the first glass substrate 120 and the second glass substrate 130. It includes.
  • the glass bonding film 110 includes a metal salt or metal ion together with a polyvinyl acetal resin and a plasticizer, and satisfies Equation 1 below.
  • M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film
  • the M2 is the surface of the glass bonding film.
  • D1 and D2 are respectively values of 60 nm or less
  • D3 and D4 are values of 80 nm or more, respectively.
  • the two sheets of glass are the first glass substrate and the second glass substrate, which are described herein as glass, but can be applied to any light-transmitting panel, and materials such as plastic are also applicable.
  • the laminated glass may have an average whitening distance of 5 mm or less, and may be 0 to 5 mm, after measuring a specimen of 100 mm*100 mm area for 2 weeks in a constant temperature and humidity chamber at 65° C. and 95% rh. mm.
  • This average whitening distance means that it has excellent water resistance even under high temperature and high humidity conditions.
  • the amount of change in yellowness before and after the laminated glass is left for 2 weeks in a constant temperature and humidity chamber at 65°C and 95%rh may be 2.5 or less. This is a result showing that it has excellent long-term durability, in particular, it can be evaluated as a better result in a film containing a benzotriazole-based compound and a metal salt at the same time.
  • the laminated glass may have a grade of 3 to 4 in the bonding strength of the polymer. This means that the bonding force between the glass and the film has a sufficient bonding force to function as a safety glass in an appropriate range.
  • the additive composition 1 was prepared by mixing the antioxidant Irganox1010 with 0.15 wt% based on the total film, the UV absorber TINUVIN P with 0.3wt%, and the metal salt adhesion control agent magnesium acetate with 0.18 wt%.
  • Magnesium acetate (Mg acetate) was prepared in the same manner as the additive composition 1 except that 1.25 wt% was applied to prepare an additive composition 2.
  • a polyvinyl acetal resin having a degree of polymerization of 1700 and a degree of saponification of 99 and n-butanal were introduced into the reactor, and the process of synthesizing a conventional polyvinyl butyral resin was followed by hydroxyl 19.5 wt%, butyral group 79.8 wt%, acetyl 0.7 wt% A polyvinyl butyral resin was obtained.
  • Both ends of the tungsten wire are connected to an electric generator, and it is possible to apply voltage to the tungsten wire, and depending on the mode of the generator, POSITIVE or NEGATIVE can be selected to impart (+) or (-) characteristics to the wire. .
  • the NEGATIVE mode was selected and used to control the concentration distribution of metal ions in Examples (see FIG. 1 ).
  • a film of Example 2 was prepared in the same manner as the film of Example 1, except that the applied voltage was lowered to 4.5 KV.
  • Examples 1 and 2 were left at 20°C and 30%RH for 1 week, and then cut to a size of 100mm*100mm horizontally and vertically and placed 2.1T (mm, hereinafter the same) transparent glass on both sides to place 2.1T.
  • 2.1T mm, hereinafter the same transparent glass on both sides to place 2.1T.
  • preliminary bonding was performed for 20 seconds at 120'C in a vacuum laminator and 1 atmosphere.
  • a laminated body of pre-bonded glass-film-glass was subjected to main bonding in an autoclave to obtain a laminated glass sample.
  • the conditions of the main bonding were applied at room temperature from room temperature to 140'C for 25 minutes, and at 140'C for 25 minutes.
  • the yellowness initial value (YI initial ) at the center of the center of the laminated glass sample prepared above was measured using the UltraScan Pro manufactured by Hunter Lab, under the conditions of D65 and 10° C. according to ASTM E313 standards. After the yellowness initial value measurement has been completed, the specimen is left in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks, taken out, and the yellowness is measured again in the same manner as above to measure the yellowness completion value (YI final ) and the yellowness difference. was calculated by the following equation (5).
  • the laminated glass sample 100 prepared above was left in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks, and then taken out and visually confirmed the area where haze occurred (the area where whitening occurred, 10) from the center of the four sides.
  • the distance was measured with a ruler (refer to FIG. 2), and the average value of the four sides was calculated according to the following equation (6) and expressed as the whitening distance (mm).
  • the distances at which the whitening phenomenon measured in the center of the first to fourth sides appeared are referred to as d11 to d14, respectively (unit is mm).
  • the bonding strength between the polyvinyl acetal film and the glass was evaluated through the evaluation of the pummel bonding force.
  • the PVB films prepared in Examples 1 and 2 were left at 20° C. and 30% RH for 1 week, and then placed two sheets of 2.1T transparent glass on both sides to produce 2.1T glass with a width*length of 100mm ⁇ 150mm.
  • a laminated structure of film-2.1T glass was prepared.
  • the laminated structure was pre-bonded at 150'C in a vacuum laminator and 20 seconds at 1 atmosphere. Subsequently, the pre-bonded laminated structure was subjected to main bonding in an autoclave at room temperature from room temperature to 140'C for 25 minutes, and retention time at 140'c for 25 minutes to obtain a specimen of laminated glass.
  • a secondary ion mass spectrometer capable of measuring the strength of the surface ions was used.
  • a pretreatment process was performed to remove the surface roughness of the manufactured film.
  • the pre-treatment method was performed by heat-treating for 3 minutes under a condition of 1 atm and 150 degrees in a vacuum laminator to flatten the pattern on the surface, and then allowed to stand at 20°C and 30% RH (Relative Humidity) for 1 hour to remove heat. .
  • the pre-treated film was sampled in a size of 10 mm*10 mm in width*length, mounted on a sample holder, and measured. After sputtering once in TOF-SIMS, the thickness of the surface to be cut was set to 1 nm, and after sputtering and measuring about 160 times, data up to 160 nm in depth were obtained and used to conduct ion concentration analysis according to depth. For a more accurate comparison, data up to 4 or 5 nm from the surface was excluded and evaluated to remove noise caused by foreign matter on the surface.
  • the values in the range of 5 to 105 nm were averaged in 10 nm units and shown in the graph of FIG. 4.
  • the horizontal axis represents depth (nm)
  • the vertical axis represents intensity (counts)
  • #1 and #2 represent Example 1 and Example 2, respectively.
  • Example 2 Average at 5-55 nm 50.69 39.21 Average at 90-140 nm 11.51 10.81
  • Example 1 and Example 2 showed a concentration difference of about 4.4 times for Example 1 and about 3.6 times for Example 2. These results show that the average value of metal ions obtained at a depth of approximately 5 to 55 nm differs from the average value of metal ions obtained at 90 to 140 nm, which is thought to be a result showing characteristics obtained in Examples of the present invention. do.
  • Example 1 Depending on the depth (nm) Example 1 Example 2 6-15 89.96 83.73 16-25 60.02 45.57 26-35 42.86 29.93 36-45 31.33 18.11 46-55 24.52 13.21 56-65 19.41 12.61 66-75 15.11 11.71 76-85 13.21 11.31 86-95 13.61 11.91 96-105 12.21 11.00
  • Example 1 Metal salt input (ppm) Mg Acetate 33 33 Applied voltage 5 kV 4.5kV evaluation Fummel bonding power Pass Pass Moisture resistance Pass Pass durability Pass Pass
  • the films of Examples 1 and 2 prepared by applying a voltage had a high concentration of magnesium ions derived from metal salts on the surface. Particularly, it was confirmed that the concentration gradient of the metal ion appeared to a thickness deeper than that of Example 2 in the case of Example 1 in which the voltage was applied more strongly. These characteristics can be confirmed by looking at the difference between the average surface ion concentration except for the surface ion concentration and the surface ion concentration evaluated based on about 50 nm.
  • first glass 130 second glass
  • T-die 210 first die lip
  • first voltage application unit 230 second die lip
  • d11 whitening distance at the first side
  • d12 whitening distance at the second side
  • d13 whitening distance at the third side
  • d14 whitening distance at the fourth side

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Abstract

A method for manufacturing a glass bonding film according to one embodiment of the present invention comprises: a melting step of manufacturing a molten resin by melting a composition comprising a polyvinyl acetal resin and an additive; and a molding step of forming a glass bonding film by discharging the molten resin through a molding part and molding the resin into a film shape, wherein the additive contains a metal salt, and an electric force is applied through the molding part to the molten resin in the molding step so as to prepare a glass bonding film that satisfies equation 1 described in the detailed description.

Description

유리접합용 필름 및 이의 제조방법 Glass bonding film and manufacturing method thereof
본 발명은 유리접합용 필름 및 이의 제조방법에 관한 것이다.The present invention relates to a film for glass bonding and a method for manufacturing the same.
일반적으로, 한 쌍의 유리 패널과 이들 패널 사이에 삽입된 합성수지 필름으로 구성되는 합판유리(강화유리, 안전유리)는 파손 시에도 그 파편이 비산하지 않기 때문에 안전성이 뛰어나, 자동차와 같은 도로 차량의 창유리 및 빌딩의 창유리에 널리 사용된다. 이러한 합판유리에 적용되는 필름에는 무기계 재료에 대한 친화성이 높은 폴리비닐아세탈 수지가 적용되는 경우가 많다.In general, laminated glass (tempered glass, safety glass) composed of a pair of glass panels and a synthetic resin film interposed between the panels is excellent in safety because the fragments do not scatter even when damaged, and the Widely used in windowpanes and building windowpanes. In many cases, a polyvinyl acetal resin having high affinity for inorganic materials is applied to the film applied to the laminated glass.
한 쌍의 유리 패널 사이에 필름을 위치시키는 합판유리는 내관통성이나 유리 파편이 비산하기 어려운 등의 합판유리에 필요한 기본적인 물성을 가지나, 내습성이 떨어질 수 있고, 이러한 경우 습도가 높은 분위기에서 합판유리의 주연에서 중간막이 직접 공기와 접하면서 주변부에 백화 현상을 나타내기도 한다. 그리고, 이러한 백화 현상을 막는 등의 목적으로 필름과 유리 사이의 접합력 조정을 위한 첨가제가 사용된다.Laminate glass, which places a film between a pair of glass panels, has the basic properties required for laminated glass, such as penetration resistance or difficulty in shattering glass, but may have poor moisture resistance, in which case laminated glass in a high humidity atmosphere On the periphery of the film, the interlayer film directly contacts the air and whitening occurs in the periphery. And, for the purpose of preventing such a whitening phenomenon, an additive for adjusting the bonding force between the film and glass is used.
일본 공개특허공보 제1998-139496호(출원 1996-290261호)는 폴리비닐부티랄, 가소제, 카르복실 금속염 및 변성실리콘 오일을 함유하는 합판유리용 중간막으로서 백화가 일어나지 않는 필름을 개시하고 있다. 그러나, 상기 필름은 극성이 낮은 변성 실리콘 오일을 사용함으로 인해 폴리비닐부티랄 수지와 상용성을 떨어뜨려 최종 필름의 헤이즈(Haze)가 올라가고, 폴리비닐부티랄 수지의 수산기와 반응할 유리의 관능기가 변성실리콘 오일에 방해를 받아 접합력이 현저히 떨어지게 되면서 내관통성 및 내충격성이 저하된다.Japanese Unexamined Patent Publication No. 1998-139496 (Application No. 1996-290261) discloses a film that does not undergo whitening as an interlayer film for laminated glass containing polyvinyl butyral, plasticizer, carboxyl metal salt and modified silicone oil. However, the film has reduced compatibility with polyvinyl butyral resins due to the use of modified silicone oils with low polarity, resulting in increased haze in the final film, and functional groups of the glass to react with hydroxyl groups of the polyvinyl butyral resin. As the bonding strength is significantly reduced due to interference with the modified silicone oil, penetration resistance and impact resistance are deteriorated.
또한, 접합력 조절효과를 위해 과량의 첨가제를 적용하면 오히려 내습성이 저하되며 장기내구성 평가에서 황색도가 증가될 수 있다.In addition, if an excessive amount of additive is applied for the effect of controlling the bonding force, moisture resistance is lowered, and yellowness may be increased in long-term durability evaluation.
본 발명의 목적은 내구성, 내습성이 개선된 유리접합용 필름의 제조방법 및 유리접합용 필름을 제공하는 것이다.An object of the present invention is to provide a method for manufacturing a glass bonding film and a glass bonding film having improved durability and moisture resistance.
상기 목적을 달성하기 위하여, 본 발명의 일 양태는 폴리비닐아세탈 수지 및 첨가제를 포함하는 조성물을 용융하여 용융수지를 제조하는 용융단계; 그리고, 성형부를 통하여 상기 용융수지를 토출하고, 필름 형태로 성형하여 유리접합용 필름을 형성하는 성형단계를 포함하는 유리접합용 필름의 제조방법을 제공한다.In order to achieve the above object, an aspect of the present invention is a melting step of manufacturing a molten resin by melting a composition comprising a polyvinyl acetal resin and an additive; And, it provides a method for manufacturing a film for glass bonding, including a molding step of discharging the molten resin through a molding unit and molding in a film form to form a film for glass bonding.
상기 첨가제는 금속염을 함유한다.The additive contains a metal salt.
상기 성형부는 상기 용융수지에 전기력을 인가한다.The forming unit applies electric force to the molten resin.
상기 유리접합용 필름은 하기 수식 1을 만족한다.The glass bonding film satisfies Equation 1 below.
[수식 1][Equation 1]
M1 > M2M1> M2
상기 수식 1에서, 상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.In Equation 1, M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film, and the M2 is the surface of the glass bonding film. With reference to, the average content of metal ions from the third depth (D3) to the fourth depth (D4), D1 and D2 are respectively values of 60 nm or less, and D3 and D4 are values of 80 nm or more, respectively.
상기 성형부는 일 말단에 위치하는 티다이를 포함할 수 있다.The molded part may include a tee die located at one end.
상기 성형부는 10 kV 이하의 전압을 인가할 수 있다.The forming unit may apply a voltage of 10 kV or less.
상기 성형단계에서 상기 성형부에 10 kV 이하의 전압이 인가될 수 있다.In the forming step, a voltage of 10 kV or less may be applied to the forming part.
상기 전기력은 상기 성형부로의 인력을 상기 금속이온에 인가할 수 있다.The electric force may apply an attraction force to the forming portion to the metal ion.
상기 성형단계에서 상기 전기력에 의해서, 상기 성형부로의 인력이 상기 금속이온에 작용될 수 있다.By the electric force in the forming step, an attraction force to the forming part may be applied to the metal ion.
상기 D1은 0.1㎚ 내지 15㎚에 속할 수 있다. 상기 D2는 40㎚ 내지 55㎚에 속할 수 있다. 상기 D3는 80㎚ 내지 95nm 에 속할 수 있다. 상기 D4는 135㎚ 내지 150㎚ 에 속할 수 있다.The D1 may belong to 0.1 nm to 15 nm. The D2 may belong to 40 nm to 55 nm. The D3 may belong to 80 nm to 95 nm. The D4 may belong to 135 nm to 150 nm.
상기 D2와 상기 D1의 차이는 상기 D4와 상기 D3의 차이에 대응될 수 있다.The difference between D2 and D1 may correspond to the difference between D4 and D3.
상기 D1은 5㎚일 수 있다. 상기 D2는 55㎚일 수 있다. 상기 D3는 90㎚일 수 있다. 상기 D4는 140㎚일 수 있다.The D1 may be 5 nm. The D2 may be 55 nm. The D3 may be 90 nm. The D4 may be 140 nm.
상기 M1은 상기 M2의 3배 이상일 수 있다.The M1 may be three or more times the M2.
상기 목적을 달성하기 위하여, 본 발명의 다른 일 양태는 폴리비닐아세탈 수지, 가소제와 함께 금속염 또는 금속이온을 포함하고, 하기의 수식 1을 만족하는, 유리접합용 필름을 제공한다.In order to achieve the above object, another aspect of the present invention includes a polyvinyl acetal resin, a metal salt or a metal ion together with a plasticizer, and satisfies Equation 1 below, to provide a film for glass bonding.
[수식 1][Equation 1]
M1 > M2M1> M2
상기 수식 1에서, 상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.In Equation 1, M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film, and the M2 is the surface of the glass bonding film. With reference to, the average content of metal ions from the third depth (D3) to the fourth depth (D4), D1 and D2 are respectively values of 60 nm or less, and D3 and D4 are values of 80 nm or more, respectively.
상기 제1깊이와 상기 제2깊이는 서로 같은 값일 수도 서로 다른 값일 수도 있다. 상기 제1깊이와 상기 제2깊이는 3 이상의 차이가 나는 값일 수 있고, 5 이상 차이가 나는 값일 수 있다.The first depth and the second depth may be the same value or different values. The first depth and the second depth may be a value having a difference of 3 or more, and a value having a difference of 5 or more.
상기 제3깊이와 상기 제4깊이는 서로 같은 값일 수도 서로 다른 값일 수도 있다. 상기 제3깊이와 상기 제4깊이는 3 이상의 차이가 나는 값일 수 있고, 5 이상 차이가 나는 값일 수 있다.The third depth and the fourth depth may be the same value or different values. The third depth and the fourth depth may be a value having a difference of 3 or more, and a value having a difference of 5 or more.
상기 D1은 0.1㎚ 내지 15㎚에 속할 수 있다. 상기 D2는 40㎚ 내지 55㎚에 속할 수 있다. 상기 D3는 80㎚ 내지 95nm에 속할 수 있다. 상기 D4는 135㎚ 내지 150㎚에 속할 수 있다.The D1 may belong to 0.1 nm to 15 nm. The D2 may belong to 40 nm to 55 nm. The D3 may belong to 80 nm to 95 nm. The D4 may belong to 135 nm to 150 nm.
상기 D2와 상기 D1의 차이는 상기 D4와 상기 D3의 차이에 대응될 수 있다.The difference between D2 and D1 may correspond to the difference between D4 and D3.
상기 D1은 5㎚일 수 있다. 상기 D2는 55㎚일 수 있다. 상기 D3는 90㎚일 수 있다. 상기 D4는 140㎚일 수 있다.The D1 may be 5 nm. The D2 may be 55 nm. The D3 may be 90 nm. The D4 may be 140 nm.
상기 M1은 상기 M2의 3배 이상일 수 있다.The M1 may be three or more times the M2.
상기 금속이온은 2가 금속이온을 포함할 수 있다.The metal ion may include a divalent metal ion.
상기 유리접합용 필름을 사이에 두고 적층된 유리 적층체의 평균 백화거리 값이 5 mm 이하일 수 있다.An average whitening distance value of the glass laminate laminated with the glass bonding film therebetween may be 5 mm or less.
상기 유리접합용 필름을 사이에 두고 적층된 유리의 펌멜 접합력 등급이 3 내지 4 단계일 수 있다.The glass bonding film may have 3 to 4 stages of the level of the strength of the laminated glass to form a film.
상기 목적을 달성하기 위하여, 본 발명의 또 다른 일 양태는 제1유리기판; 상기 제1유리기판에 대향되는 제2유리기판; 및 상기 제1유리기판 및 상기 제2유리기판 사이에 개재되고, 상기 제1유리 기판 및 상기 제2유리 기판에 접합되는 유리접합용 필름을 포함하고, 상기 유리접합용 필름은 폴리비닐아세탈 수지, 가소제와 함께 금속염 또는 금속이온을 포함하고, 하기의 수식 1을 만족한다.In order to achieve the above object, another aspect of the present invention is a first glass substrate; A second glass substrate facing the first glass substrate; And a glass bonding film interposed between the first glass substrate and the second glass substrate and bonded to the first glass substrate and the second glass substrate, wherein the film for glass bonding is a polyvinyl acetal resin, It contains a metal salt or a metal ion together with a plasticizer, and satisfies Equation 1 below.
[수식 1][Equation 1]
M1 > M2M1> M2
상기 수식 1에서, In Equation 1 above,
상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.The M1 is the average content of metal ions from the first depth (D1) to the second depth (D2) based on the surface of the film for glass bonding, and the M2 is based on the surface of the film for glass bonding. The average content of metal ions from 3 depths (D3) to 4th depths (D4), D1 and D2 are respectively 60 nm or less, and D3 and D4 are 80 nm or more, respectively.
본 발명의 유리접합용 필름은 상대적으로 적은 양의 금속염을 적용하더라도 접합력 조절효과가 우수하고, 내습성 저하나 장기내구성 저하가 실질적으로 나타나지 않는 유리접합용 필름 등을 제공할 수 있다.The film for glass bonding of the present invention can provide a film for glass bonding or the like, which has excellent bonding force control effect even if a relatively small amount of metal salt is applied, and which does not substantially exhibit reduced moisture resistance or long-term durability.
본 발명의 유리접합용 필름의 제조방법은 전기력을 인가하는 방식으로 필름의 깊이에 따른 금속염(또는 금속이온)의 농도를 조절할 수 있어서, 유리접합력, 내습성 등의 특성이 조절된 유리접합용 필름을 제조할 수 있다.The method for manufacturing a glass bonding film of the present invention can control the concentration of metal salts (or metal ions) depending on the depth of the film by applying an electric force, so that the glass bonding film is controlled with properties such as glass bonding strength and moisture resistance. Can be produced.
도 1은 본 발명의 실시예에서 적용한 필름 표면의 이온농도를 조절하기 위한 다이립의 장치 구조를 설명하는 개략도.1 is a schematic diagram illustrating a device structure of a die lip for adjusting the ion concentration of a film surface applied in an embodiment of the present invention.
도 2는 본 발명의 실시예에서 측정하는 백화거리의 측정 방법을 설명하는 도면.2 is a view for explaining a method of measuring a whitening distance measured in an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 접합 유리의 단면을 설명하는 개념도(a)와, 수식 제1깊이 내지 제4깊이를 설명하는 개념도(b).3 is a conceptual diagram (a) for explaining a cross section of a laminated glass according to an embodiment of the present invention, and a conceptual diagram (b) for explaining the first to fourth depths of the equation.
도 4은 본 발명의 실시예에서 필름의 표면이온농도를 평가한 결과를 5 내지 105 nm 범위의 값을 10 nm 단위로 평균을 내어 나타낸 그래프로, 가로축은 깊이(depth, nm)를 나타내고 세로축은 강도(intensity, counts)를 의미하며, #1과 #2는 각각 실시예 1과 실시예 2를 나타낸다.Figure 4 is a graph showing the average value in the range of 5 to 105 nm in the results of evaluating the surface ion concentration of the film in the embodiment of the present invention in 10 nm units, the horizontal axis represents the depth (depth, nm) and the vertical axis It means intensity (counts), and #1 and #2 represent Example 1 and Example 2, respectively.
* 연관된 출원과의 상호참조* Cross-referencing with associated applications
본 출원은 2018년 12월 20일에 출원된 대한민국 특허출원번호 제10-2018-0166257호에 의한 우선권의 이익을 가지며, 상기 우선권의 기초 출원의 내용 모두는 본 출원의 내용으로 포함된다.This application has the benefit of priority under Korean Patent Application No. 10-2018-0166257 filed on December 20, 2018, and all of the basic applications of the priority are included as content of this application.
이하, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시예에 대하여 첨부한 도면을 참고로 하여 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 명세서 전체를 통하여 유사한 부분에 대해서는 동일한 도면 부호를 붙였다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains may easily practice. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. The same reference numerals are used for similar parts throughout the specification.
본 명세서 전체에서, 마쿠시 형식의 표현에 포함된 "이들의 조합"의 용어는 마쿠시 형식의 표현에 기재된 구성 요소들로 이루어진 군에서 선택되는 하나 이상의 혼합 또는 조합을 의미하는 것으로서, 상기 구성 요소들로 이루어진 군에서 선택되는 하나 이상을 포함하는 것을 의미한다.Throughout the present specification, the term “combination of these” included in the expression of the marki form means one or more mixtures or combinations selected from the group consisting of the components described in the expression of the marki form, the component. It means to include one or more selected from the group consisting of.
본 명세서 전체에서, “제1”, “제2” 또는 “A”, “B”와 같은 용어는 동일한 용어를 서로 구별하기 위하여 사용된다. 또한, 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다.Throughout this specification, terms such as “first”, “second” or “A” and “B” are used to distinguish the same terms from each other. In addition, a singular expression includes a plural expression unless the context clearly indicates otherwise.
본 명세서에서, “~”계는, 화합물 내에 “~”에 해당하는 화합물 또는 “~”의 유도체를 포함하는 것을 의미하는 것일 수 있다.In the present specification, the “~” system may mean that a compound corresponding to “~” or a derivative of “~” is included in the compound.
본 명세서에서, A 상에 B가 위치한다는 의미는 A 상에 직접 맞닿게 B가 위치하거나 그 사이에 다른 층이 위치하면서 A 상에 B가 위치하는 것을 의미하며 A의 표면에 맞닿게 B가 위치하는 것으로 한정되어 해석되지 않는다.In the present specification, the meaning that B is located on A means that B is directly in contact with A, or that B is located on A while another layer is positioned between them, and B is placed in contact with the surface of A. It is not limited to being interpreted.
본 명세서에서 단수 표현은 특별한 설명이 없으면 문맥상 해석되는 단수 또는 복수를 포함하는 의미로 해석된다.In the present specification, a singular expression is interpreted to include a singular or plural number that is interpreted in context unless otherwise specified.
본 발명의 발명자들은, 금속염 화합물을 비교적 다량 적용하는 경우 접합력 조절효과는 충분하게 얻을 수 있으나 황변 현상이 나타나기 쉽다는 점을 발견하고, 이에 대한 해결방법을 연구하던 중, 적은 양으로도 보다 효과적으로 접합력을 조절한 유리접합용 필름을 개발하여 본 발명을 완성하였다.The inventors of the present invention, when applying a relatively large amount of the metal salt compound, the effect of controlling the bonding force can be sufficiently obtained, but the finding that the yellowing phenomenon is likely to occur, while researching a solution to this, the bonding force is more effective even in a small amount The present invention was completed by developing a film for controlling glass.
본 발명은 필름의 제조과정에서 전압을 인가하는 등의 방법으로 금속염 이온이 표면 쪽으로 더 많이 배치되도록 농도구배를 갖게 필름을 제조하여, 금속염 화합물의 적용량을 동등 이하로 줄이면서도 충분한 접합력조절 효과를 얻으며, 내습성 및/또는 내구성도 실질적으로 향상된 유리접합용 필름 등을 제조할 수 있다.The present invention is to produce a film having a concentration gradient so that the metal salt ions are more arranged toward the surface by a method such as applying a voltage during the manufacturing process of the film, while reducing the applied amount of the metal salt compound to less than or equal to obtain a sufficient bonding force control effect, , It is also possible to manufacture a film for glass bonding, etc. with substantially improved moisture resistance and/or durability.
도 1은 본 발명의 실시예에서 적용한 필름 표면의 이온농도를 조절하기 위한 다이립의 장치 구조를 설명하는 개략도이고, 도 2는 본 발명의 실시예에서 측정하는 백화거리의 측정 방법을 설명하는 도면이며, 도 3은 본 발명의 일 실시예에 따른 접합 유리의 단면을 설명하는 개념도(a)와, 수식 제1깊이 내지 제4깊이를 설명하는 개념도(b)이다. 도 1 내지 도 3을 참고하여, 본 발명을 보다 상세하게 설명한다.1 is a schematic diagram illustrating a device structure of a die lip for adjusting the ion concentration of a film surface applied in an embodiment of the present invention, and FIG. 2 is a diagram illustrating a method of measuring the whitening distance measured in an embodiment of the present invention 3 is a conceptual diagram (a) for explaining a cross section of a laminated glass according to an embodiment of the present invention, and a conceptual diagram (b) for explaining the first to fourth formulas. The present invention will be described in more detail with reference to FIGS. 1 to 3.
상기 목적을 달성하기 위하여, 본 발명의 일 실시예에 따른 유리접합용 필름의 제조방법은, 용융단계 그리고 성형단계를 포함하여, 상기 성형단계에서 상기 융용수지에는 상기 성형부를 통하여 전기력이 인가되어, 하기의 수식 1을 만족하는 유리접합용 필름(110)을 제조한다.In order to achieve the above object, a method of manufacturing a film for glass bonding according to an embodiment of the present invention, including a melting step and a molding step, in the molding step, the molten resin is applied with electric force through the molding part, A glass bonding film 110 satisfying Equation 1 below is prepared.
[수식 1][Equation 1]
M1 > M2M1> M2
상기 수식 1에서, 상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.In Equation 1, M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film, and the M2 is the surface of the glass bonding film. With reference to, the average content of metal ions from the third depth (D3) to the fourth depth (D4), D1 and D2 are respectively values of 60 nm or less, and D3 and D4 are values of 80 nm or more, respectively.
상기 용융단계는 폴리비닐아세탈 수지 및 첨가제를 포함하는 조성물을 용융하여 용융수지를 제조하는 단계이다.The melting step is a step of manufacturing a molten resin by melting a composition comprising a polyvinyl acetal resin and an additive.
상기 첨가제는 금속염을 함유할 수 있다.The additive may contain a metal salt.
상기 용융단계는 통상의 필름 제조에 적용되는 수지용융방법이 적용될 수 있으며, 예를 들어 2축압출기가 적용될 수 있다.The melting step may be applied to a resin melting method applied to a conventional film production, for example, a twin-screw extruder may be applied.
상기 폴리비닐아세탈 수지 및 첨가제를 포함하는 조성물과 상기 첨가제에 포함되는 금속염에 대해서는 뒤에서 설명한다.The composition comprising the polyvinyl acetal resin and the additive and the metal salt contained in the additive will be described later.
상기 성형단계는 성형부를 통하여 상기 용융수지를 토출하고, 필름 형태로 성형하여 유리접합용 필름(110)을 형성하는 단계이다.The forming step is a step of discharging the molten resin through a molding part and forming a film 110 for glass bonding by molding in a film form.
상기 성형부는 두께를 제어하면서 필름 형태로 제조할 수 있는 것이라면 적용될 수 있고, 단층 필름을 제조하는 경우에는 압출기(예시, 이축 압출기)에 넣고 용융 토출하여 티다이를 통해 두께를 제어하면서 필름 형태로 제조할 수 있으며, 다층 필름인 경우에는 압출기에서 각각 용융압출된 후 피드블록, 멀티매니폴드 등의 적층장치를 통해 적층되고 티다이에서 필름 형태로 성형될 수 있다(공압출 방식).The molding part may be applied as long as it can be manufactured in a film form while controlling the thickness, and in the case of manufacturing a single-layer film, it is put into an extruder (for example, a twin-screw extruder) and melt-discharged to control the thickness through a T-die to be produced in a film form. In the case of a multi-layer film, it may be melt-extruded in an extruder, and then laminated through a laminating device such as a feed block and a multi-manifold, and molded into a film form in a T-die (coextrusion method).
상기 성형부는 일 말단에 위치하는 티다이(200)를 포함할 수 있다.The molding unit may include a T-die 200 positioned at one end.
상기 성형단계에서 상기 융용수지(1)에는 상기 성형부를 통하여 전기력이 인가될 수 있다. In the forming step, electric power may be applied to the molten resin 1 through the forming part.
상기 성형단계에서 상기 성형부에 10 kV 이하의 전압이 인가될 수 있다.In the forming step, a voltage of 10 kV or less may be applied to the forming part.
상기 성형단계에서 상기 전기력에 의해서, 상기 성형부로의 인력이 상기 금속이온에 인가될 수 있다.By the electric force in the forming step, the attraction force to the forming part may be applied to the metal ion.
상기 성형단계를 상기 성형부에 티다이가 위치한 경우를 예시적으로 설명한다. 상기 성형부의 일 말단에 티다이(200)가 위치하며, 상기 티다이(200)는 용융수지조성물(1)이 유입되는 유입구(미도시)와 용융수지조성물이 토출되는 유출구를 갖고, 상기 유출구의 용융수지조성물이 토출되는 부분 양측에 다이립(210, 230)이 위치한다. 본 발명에서는 상기 양측의 다이립(210, 230)에 전압인가부(220, 240)이 각각 위치한다. 상기 전압인가부(220, 240)은 예를 들어 텅스텐와이어와 같은 전압인가장치로, 상기 다이립(210, 230)에 인가전압을 줄 수 있는 장치이다. 상기 전압인가부(220, 240)은 외부의 전원장치(미도시)와 전기적으로 연결된다. The molding step will be described by way of example where the T-die is located in the molding part. The T-die 200 is located at one end of the molding part, and the T-die 200 has an inlet (not shown) through which the molten resin composition 1 is introduced and an outlet through which the molten resin composition is discharged. Die ribs 210 and 230 are located on both sides of the portion where the molten resin composition is discharged. In the present invention, the voltage applying parts 220 and 240 are located on the die lips 210 and 230 on both sides. The voltage applying units 220 and 240 are voltage applying devices such as, for example, tungsten wire, and are devices capable of applying the applied voltage to the die lips 210 and 230. The voltage applying units 220 and 240 are electrically connected to an external power supply (not shown).
상기 전압인가부(220, 240)은 상기 다이립의 전압을 조절하여 상기 용융수지(1)을 대전된 용융수지(2)이 되도록 한다.The voltage application parts 220 and 240 adjust the voltage of the die lip so that the molten resin 1 becomes a charged molten resin 2.
상기 대전된 용융수지(2)는 용융수지(1)에 포함되어 있던 금속이온들이 표면으로 이동되어 형성되는 고농도영역(3)을 포함한다. 상기 고농도영역(3)은 이하에서 설명하는 표면이온농도가 필름평균이온농도보다 높은 영역을 의미한다.The charged molten resin 2 includes a high concentration region 3 formed by moving metal ions contained in the molten resin 1 to the surface. The high concentration region 3 refers to a region in which the surface ion concentration described below is higher than the film average ion concentration.
상기 유리접합용 필름의 양 표면은 상기 유리접합용 필름의 중앙과 비교하여 더 많이 분포된 상기 금속염 또는 상기 금속이온을 함유할 수 있다.Both surfaces of the film for glass bonding may contain the metal salt or the metal ion more distributed compared to the center of the film for glass bonding.
상기 표면 측에 고농도영역(3)을 갖는 대전된 용융수지(2)는 이후 두께 방향으로 U 형태의 금속이온 농도구배를 갖는 유리접합필름을 형성할 수 있다.The charged molten resin 2 having the high concentration region 3 on the surface side may then form a glass bonding film having a U-type metal ion concentration gradient in the thickness direction.
구체적으로, 상기 성형부에 인가되는 전압은 10 kV 이하의 전압이 적용될 수 있고, 1 내지 10 kV의 전압이 적용될 수 있다. 상기 성형부에 인가되는 전압은 1.5 내지 8 kV의 전압이 적용될 수 있고, 2.5 내지 6 kV의 전압이 적용될 수 있다.Specifically, a voltage applied to the forming unit may be applied with a voltage of 10 kV or less, and a voltage of 1 to 10 kV may be applied. A voltage of 1.5 to 8 kV may be applied to a voltage applied to the molding part, and a voltage of 2.5 to 6 kV may be applied.
상기 전압이 너무 낮으면, 양이온인 금속이온을 필름 표면 쪽으로 끌어당기는 힘이 약해 충분한 농도구배를 유도하지 못할 수 있고, 너무 강한 전압이 적용되는 경우 고분자 필름에 열화가 발생할 수 있으며, 유리접합용 필름의 광학특성, 장기내구성과 같은 필름물성에 영향을 주어 오히려 필름의 특성을 떨어뜨릴 수 있다. If the voltage is too low, the force pulling the metal ion, which is a cation, toward the surface of the film is weak, so that a sufficient concentration gradient may not be induced, and if a too strong voltage is applied, deterioration may occur in the polymer film, and the film for glass bonding It may affect the film properties such as the optical properties and long-term durability of the film, which may degrade the properties of the film.
상기 용융수지가 금속염 0.1 내지 0.3 wt%을 함유하는 경우에는 상기 전압인가부에서 인가하는 전압을 4 내지 6kV로 적용할 수 있다.When the molten resin contains 0.1 to 0.3 wt% of the metal salt, a voltage applied by the voltage application part may be applied at 4 to 6 kV.
상기 용융수지가 금속염을 0.3 wt% 초과 0.8 wt% 이하로 포함할 경우에는 전압을 3 내지 4kV로 적용할 수 있다.When the molten resin contains more than 0.3 wt% and 0.8 wt% or less of the metal salt, a voltage of 3 to 4 kV may be applied.
상기 전압은 양이온인 상기 금속이온을 당기도록 인가될 수 있고, 구체적으로 음의 전하를 띄도록 인가할 수 있다.The voltage may be applied to pull the metal ion, which is a cation, and specifically, may be applied to have a negative charge.
이와는 다르게, 정전기에 의해서, 상기 용융수지에 전기력이 인가될 수 있다. 예를 들어, 상기 융용수지가 압출될 때, 마찰에 의해서 발생되는 정전기가 상기 성형부에 남아있어서, 상기 용융수지에 상기 성형부를 통하여, 전기력이 인가될 수 있다. 예를 들어, 상기 성형부에 남아있는 정전기가 쉽게 배출되지 않도록, 상기 성형부가 접지되지 않을 수 있다. 또한, 상기 성형부가 접지되더라도, 상기 성형부와 연결되는 접지선의 저항이 높아서, 일부 정전기가 남도록, 배출되는 정전기의 양이 조절될 수 있다.Alternatively, an electric force may be applied to the molten resin by static electricity. For example, when the molten resin is extruded, static electricity generated by friction remains in the molding unit, and an electric force may be applied to the molten resin through the molding unit. For example, the molded part may not be grounded so that static electricity remaining in the molded part is not easily discharged. In addition, even if the molding part is grounded, the resistance of the ground wire connected to the molding part is high, so that some static electricity remains, the amount of static electricity discharged may be adjusted.
상기 성형단계에서 대전된 용융수지(2)는 분당 5 내지 15 m의 속도로 토출되어 필름으로 형성될 수 있다. 상기 속도는 분당 5 내지 15 m일 수 있고, 7 내지 13 m일 수 있다.The molten resin 2 charged in the forming step may be discharged at a rate of 5 to 15 m per minute to form a film. The speed may be 5 to 15 m per minute, or 7 to 13 m.
상기 성형단계 이후에는 통상 유리접합용 필름 제조에 적용되는 공정이 동일하게 적용될 수 있으며, 구체적인 설명은 생략한다. After the forming step, a process commonly applied to manufacturing a film for glass bonding can be applied in the same way, and detailed description is omitted.
상기 용융수지 형성에 적용되는 상기 폴리비닐아세탈 수지 및 첨가제를 설명한다.The polyvinyl acetal resin and additives applied to the molten resin formation will be described.
상기 폴리비닐아세탈은 중합도가 1,600 내지 3,000인 폴리비닐알코올을 알데하이드로 아세탈화하여 얻어진 폴리비닐아세탈일 수 있고, 중합도가 1,700 내지 2,500인 폴리비닐알코올을 알데하이드로 아세탈화하여 얻어진 폴리비닐아세탈일 수 있다. 이러한 폴리비닐아세탈를 적용하는 경우 내관통성과 같은 기계적인 물성을 충분히 향상시킬 수 있다.The polyvinyl acetal may be polyvinyl acetal obtained by acetalizing polyvinyl alcohol having a polymerization degree of 1,600 to 3,000, and may be polyvinyl acetal obtained by acetalizing polyvinyl alcohol having a polymerization degree of 1,700 to 2,500. . When such a polyvinyl acetal is applied, it is possible to sufficiently improve mechanical properties such as penetration resistance.
상기 폴리비닐아세탈는 폴리비닐알코올과 알데하이드를 합성한 것일 수 있으며, 상기 알데하이드는 그 종류를 한정되지 않는다. 구체적으로 상기 알데하이드는, n-부틸 알데하이드, 이소부틸 알데하이드, n-배럴 알데하이드, 2-에틸 부틸 알데하이드, n-헥실 알데하이드 및 이들의 블랜드 수지로 이루어진 군에서 선택된 어느 하나일 수 있다. 상기 알데하이드로 n-부틸 알데하이드를 적용하는 경우 제조된 폴리비닐아세탈 수지가 유리의 굴절율과 그 차이가 적은 굴절율 특성을 갖고 유리 등과의 접합력이 우수한 특성을 가질 수 있다.The polyvinyl acetal may be a synthesis of polyvinyl alcohol and aldehyde, and the type of the aldehyde is not limited. Specifically, the aldehyde may be any one selected from the group consisting of n-butyl aldehyde, isobutyl aldehyde, n-barrel aldehyde, 2-ethyl butyl aldehyde, n-hexyl aldehyde and blend resins thereof. When the n-butyl aldehyde is applied to the aldehyde, the prepared polyvinyl acetal resin may have a refractive index characteristic with a small difference in refractive index of glass and excellent bonding strength with glass.
상기 첨가제는 가소제를 포함한다.The additives include plasticizers.
상기 가소제는 트리에틸렌글리콜 비스 2-에틸헥사노에이트(3G8), 테트라에틸렌글리콜 디헵타노에이트(4G7), 트리에틸렌글리콜 비스 2-에틸부티레이트(3GH), 트리에틸렌글리콜 비스 2-헵타노에이트(3G7), 디부톡시에톡시에틸 아디페이트(DBEA), 부틸 카르비톨 아디페이트(DBEEA), 디부틸 세바케이트(DBS), 비스 2-헥실 아디페이트(DHA) 및 이들의 혼합물로 이루어진 군에서 선택될 수 있으며, 더 구체적으로 상기 가소제로는 트리에틸렌글리콜 비스 2-에틸헥사노에이트(3G8)가 적용될 수 있다.The plasticizer is triethylene glycol bis 2-ethylhexanoate (3G8), tetraethylene glycol diheptanoate (4G7), triethylene glycol bis 2-ethylbutyrate (3GH), triethylene glycol bis 2-heptanoate (3G7) ), dibutoxyethoxyethyl adipate (DBEA), butyl carbitol adipate (DBEEA), dibutyl sebacate (DBS), bis 2-hexyl adipate (DHA) and mixtures thereof. More specifically, triethylene glycol bis 2-ethylhexanoate (3G8) may be applied as the plasticizer.
상기 첨가제는 금속염 화합물을 포함한다. The additive includes a metal salt compound.
상기 금속염 화합물은 접합력 조절 효과를 얻기 위해 적용되며, 구체적으로 탄소수 2 내지 16의 카르복실산의 금속염이 적용될 수 있고, 더 구체적으로 탄소수 2 내지 12의 2가금속의 금속염, 또는 탄소수 2 내지 6의 1가 금속의 금속염이 적용될 수 있다.The metal salt compound is applied to obtain the effect of controlling the bonding force, specifically, a metal salt of a carboxylic acid having 2 to 16 carbon atoms may be applied, and more specifically, a metal salt of a divalent metal having 2 to 12 carbon atoms, or 1 to 2 carbon atoms. Metal salts of temporary metals may be applied.
상기 금속염 화합물에 포함되는 금속이온은 나트륨 1가 양이온, 마그네슘 2가 양이온 및 칼륨 1가 양이온으로 이루어진 군에서 선택된 어느 하나일 수 있다.The metal ion contained in the metal salt compound may be any one selected from the group consisting of sodium monovalent cation, magnesium divalent cation, and potassium monovalent cation.
상기 금속염 화합물은 금속염 화합물 상태 그대로 또는 용매에 용해되어 이온화된 상태로 상기 조성물에 적용될 수 있으며, 접합력 조절제로 역할한다. 구체적으로 필름과 유리 표면과의 접합력을 조절할 수 있다. 상기 금속염 화합물이 용액 상태로 상기 조성물에 적용되는 경우 제조되는 필름 또는 접합층 내에서 보다 금속염 화합물 또는 상기 금속염 화합물에서 유래하는 이온들의 분산과 이동을 보다 용이하게 할 수 있다.The metal salt compound may be applied to the composition in the form of a metal salt compound or in an ionized state dissolved in a solvent, and serves as a bonding power regulator. Specifically, the bonding force between the film and the glass surface can be adjusted. When the metal salt compound is applied to the composition in a solution state, dispersion and movement of ions derived from the metal salt compound or the metal salt compound may be more easily performed in a film or a bonding layer prepared.
상기 금속염 화합물은 상기 용융수지 전체를 기준으로 1.0 중량% 미만으로 포함될 수 있고, 0.5 중량% 미만으로 포함될 수 있으며, 0.35 중량% 이하로 포함될 수 있다. 또한, 상기 금속염 화합물은 상기 용융수지 전체를 기준으로 0.01 내지 0.5 중량%로 포함될 수 있고, 0.01 내지 0.35 중량%로 포함될 수 있으며, 0.01 내지 0.25 중량%로 포함될 수 있으며, 0.01 내지 0.2 중량%로 포함될 수 있다. 상기 용융수지는 단층 필름을 구성할 수도, 다층 필름의 표면층을 구성할 수도 있다.The metal salt compound may be included in less than 1.0% by weight, less than 0.5% by weight, and may be included in 0.35% by weight or less based on the entire molten resin. In addition, the metal salt compound may be included in an amount of 0.01 to 0.5% by weight, 0.01 to 0.35% by weight, 0.01 to 0.25% by weight, and 0.01 to 0.2% by weight based on the entire molten resin. Can. The molten resin may constitute a single-layer film or a surface layer of a multilayer film.
상기 금속염 화합물은 상기 용융수지 전체를 기준으로 상기 금속염 화합물에서 유래하는 금속이온의 함량이 150 ppm이하가 되도록 포함될 수 있고, 100 ppm 이하가 되도록 포함될 수 있다. 또한 상기 금속이온의 함량은 상기 용융수지 전체를 기준으로 1 내지 70 ppm이 되도록 포함될 수 있고, 1 내지 50 ppm이 되도록 포함될 수 있으며, 1 내지 35 ppm이 되도록 포함될 수 있다. 이렇게 상당히 낮은 함량으로 상기 금속염 화합물 또는 금속염 이온을 함유하더라도 본 발명에서 적용하는 방법으로 접합력 조절 효과가 필요한 표면에 금속 이온이 위치하도록 하여 충분한 접합력 조절 효과를 얻을 수 있도록 한다. 이때, ppm은 중량을 기준으로 계산한다.The metal salt compound may be included so that the content of metal ions derived from the metal salt compound is 150 ppm or less, and 100 ppm or less based on the entire molten resin. In addition, the content of the metal ion may be included to be 1 to 70 ppm based on the entire molten resin, may be included to be 1 to 50 ppm, may be included to be 1 to 35 ppm. Even if the metal salt compound or the metal salt ion is contained in such a very low content, the metal ion is positioned on a surface requiring a bonding power control effect by the method applied in the present invention, so that a sufficient bonding power control effect can be obtained. At this time, ppm is calculated based on the weight.
상기 금속염 화합물은 상기 조성물 전체를 기준으로 위에서 설명한 함량으로 포함되어, 단층인 유리접합용 필름을 제조할 수 있고, 다층인 유리접합용 필름을 제조하는 경우에는 상기 금속염 화합물이 포함된 조성물로 표면층(접합층)을 형성할 수 있다.The metal salt compound is included in the amount described above based on the entire composition, to prepare a single layer glass bonding film, and when preparing a multilayer glass bonding film, the surface layer of the composition containing the metal salt compound ( Bonding layer).
접합유리의 제조에 적용되는 폴리비닐아세탈 수지 조성물은, 자외선 차단 효과를 높이기 위하여 자외선 안정제(자외선 흡수제)가 함께 적용되기도 하며, 벤조트리아졸계 화합물이 이러한 자외선 안정제로 적용되기도 한다.In the polyvinyl acetal resin composition applied to the production of laminated glass, an ultraviolet stabilizer (ultraviolet absorber) may be applied together to enhance the UV blocking effect, and a benzotriazole-based compound may also be applied as such an ultraviolet stabilizer.
벤조트리아졸계 화합물은 자외선의 에너지에 위해 분자 내의 하이드록실기와 상기 하이드록실기와 가까이 위치하는 트리아졸 링에 포함되는 질소 사이의 상호작용으로 벤조트리아졸계 화합물의 결합 구조의 변화가 발생할 수 있고, 이 때 금속 이온이 관여하게 되면 자외선 안정제로써의 효과가 저하될 수 있다. 또한, 벤조트리아졸계 화합물은 다가 금속이온과 배위결합되어 킬레이트 링을 형성하기도 하는데, 이렇게 킬레이트 링이 형성된 벤조트리아졸계 화합물은 자외선 안정제로써의 기능을 충분히 하지 못하고, 필름 전체의 내구성을 약화시킬 수 있다.The benzotriazole-based compound may cause a change in the binding structure of the benzotriazole-based compound due to the interaction between the hydroxyl group in the molecule and the nitrogen contained in the triazole ring located close to the hydroxyl group for energy of ultraviolet rays, At this time, if metal ions are involved, the effect as an ultraviolet stabilizer may be reduced. In addition, the benzotriazole-based compound is coordinated with polyvalent metal ions to form a chelate ring. The benzotriazole-based compound formed with the chelate ring does not sufficiently function as an ultraviolet stabilizer and may weaken the durability of the entire film. .
상기 자외선 안정제는 자외선 안정제로 적용되는 것이라면 제한 없이 적용될 수 있으며, 벤조트리아졸계 화합물을 포함하는 자외선 안정제를 적용하는 것도 가능하다. 구체적으로 케미프로화성사의 케미솔브(Chemisorb) 12, 케미솔브 79, 케미솔브 74, 케미솔브 102, BASF사의 티누빈(Tinuvin) 328, 티누빈 329, 티누빈 326 등을 사용할 수 있다.The ultraviolet stabilizer may be applied without limitation as long as it is applied as an ultraviolet stabilizer, and it is also possible to apply an ultraviolet stabilizer containing a benzotriazole-based compound. Specifically, Chemisorb 12, Chemisolve 79, Chemisolve 74, Chemisolve 102, BASF's Tinuvin 328, Tinuvin 329, Tinuvin 326, etc. may be used.
본 발명에서는 유리접합용 필름 제조에 적용되는 벤조트리아졸계 화합물의 자외선 안정제로써의 기능을 충분히 하고 필름 자체의 내구성을 향상시키기 위해서는, 소량을 적용하여도 우수한 접합력 조절 효과를 갖도록 하였다.In the present invention, in order to sufficiently function as a UV stabilizer of the benzotriazole-based compound applied to the production of a film for glass bonding and to improve the durability of the film itself, even if a small amount is applied, it has an excellent bonding strength control effect.
상기 벤조트리아졸계 화합물 100 중량부를 기준으로 상기 금속염 화합물을 16 중량부 이하로 포함할 수 있고, 12 중량부 이하로 포함할 수 있으며 1 내지 10 중량부로 포함할 수 있다. 상기 금속염 화합물을 상기 벤조트리아졸계 화합물 100 중량부를 기준으로 1 중량부 미만으로 포함하게 되면 상기 금속염 화합물 첨가로 얻게 되는 접합력 조절 효과가 충분하지 않을 수 있고, 16 중량부 초과로 포함하는 경우 내수성이 오히려 떨어질 수 있다.Based on 100 parts by weight of the benzotriazole-based compound, the metal salt compound may include 16 parts by weight or less, 12 parts by weight or less, and 1 to 10 parts by weight. When the metal salt compound is contained in an amount of less than 1 part by weight based on 100 parts by weight of the benzotriazole-based compound, the effect of adjusting the bonding strength obtained by adding the metal salt compound may not be sufficient, and when it is included in more than 16 parts by weight, water resistance is rather Can fall.
상기 조성물은 필요에 따라 산화방지제, 열안정제, IR 흡수제 및 이의 조합으로 이루어진 군에서 선택되는 첨가제를 더 함유할 수 있다. 상기 첨가제는 위에서 각 층들 중 적어도 하나의 층에 포함될 수 있고 전체 필름에 포함될 수도 있다.The composition may further contain an additive selected from the group consisting of an antioxidant, a heat stabilizer, an IR absorber, and a combination thereof, as necessary. The additive may be included in at least one of the layers above, or may be included in the entire film.
상기 첨가제를 상기 조성물에 포함함으로써 필름의 열안정성, 광안정성과 같은 장기내구성 및 비산방지 성능을 보다 향상시킬 수 있다.By including the additive in the composition, it is possible to further improve long-term durability and scattering prevention performance, such as thermal stability and light stability of the film.
상기 산화방지제는 힌더드 아민(hindered amine)계나 힌더드 페놀(hindered phenol)계를 사용될 수 있다. 구체적으로, 150 ℃이상의 공정온도를 요하는 폴리비닐 부티랄(PVB) 제조공정상 힌더드 페놀계의 산화방지제가 보다 바람직하다. 힌더드 페놀계의 산화방지제는 예를 들어, BASF사의 IRGANOX 1076, 1010 등을 사용할 수 있다.The antioxidant may be a hindered amine (hindered amine) system or a hindered phenol (hindered phenol) system. Specifically, a hindered phenolic antioxidant is more preferable in a polyvinyl butyral (PVB) manufacturing process requiring a process temperature of 150°C or higher. Hindered phenolic antioxidants, for example, BASF's IRGANOX 1076, 1010 and the like can be used.
상기 열안정제는 산화방지제와의 적합성을 고려할 때 포스파이트(phosphite) 계 열안정제를 사용할 수 있다. 예를 들어, BASF사의 IRGAFOS 168을 사용할 수 있다. 상기 IR 흡수제로는 ITO, ATO, AZO 등을 사용할 수 있으나, 본 발명이 이에 한정되는 것은 아니다.The thermal stabilizer may be a phosphite-based thermal stabilizer when considering compatibility with an antioxidant. For example, BASF's IRGAFOS 168 can be used. ITO, ATO, AZO, etc. may be used as the IR absorber, but the present invention is not limited thereto.
상기 유리접합용 필름은 이하에서 설명하는 특징을 가지며, 그 구체적인 설명은 아래 기재와 중복되므로 생략한다.The glass bonding film has the characteristics described below, and the detailed description thereof will be omitted because it overlaps with the description below.
본 발명의 다른 일 실시예에 따른 유리접합용 필름(110)은, 금속염을 함유하는 유리접합용 필름으로, 표면으로부터 50 nm 깊이 내의 금속이온의 평균 함량이 상기 유리접합용 필름 전체의 금속이온의 평균 함량보다 높다.The film 110 for glass bonding according to another embodiment of the present invention is a film for glass bonding containing a metal salt, wherein the average content of metal ions within a depth of 50 nm from the surface is the metal ion of the entire film for glass bonding. Higher than the average content.
보다 구체적으로, 본 발명의 일 실시예에 따른 유리접합용 필름(110)은 폴리비닐아세탈 수지, 가소제와 함께 금속염 또는 금속이온을 포함하고, 하기의 수식 1을 만족한다.More specifically, the film 110 for glass bonding according to an embodiment of the present invention includes a metal salt or a metal ion together with a polyvinyl acetal resin and a plasticizer, and satisfies Equation 1 below.
[수식 1][Equation 1]
M1 > M2M1> M2
여기서, 상기 M1은 상기 유리접합용 필름의 일 표면(111)을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 일 표면(111)을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 60nm 이하의 값이고, 상기 D3 및 상기 D4는 80nm 이상의 값이다.Here, M1 is the average content of metal ions from the first depth (D1) to the second depth (D2) based on one surface 111 of the film for glass bonding, and the M2 is the film for the glass bonding film. Based on one surface 111, the average content of metal ions from the third depth D3 to the fourth depth D4, D1 and D2 are values of 60 nm or less, and D3 and D4 are 80 nm or more Is the value.
상기 제1깊이와 상기 제2깊이는 서로 같은 값일 수도 서로 다른 값일 수도 있다.The first depth and the second depth may be the same value or different values.
상기 제3깊이와 상기 제4깊이는 서로 같은 값일 수도 서로 다른 값일 수도 있다.The third depth and the fourth depth may be the same value or different values.
도 3을 참조하여 보다 구체적으로 설명하면, 상기 제1깊이(D1), 상기 제2깊이(D2), 상기 제3깊이(D3) 및 상기 제4깊이(D4)는 각각 상기 유리접합용 필름의 일 표면(111)으로부터 소정의 깊이를 의미한다. 여기서, 상기 유리접합용 필름의 일 표면(111)은 유리 기판 등에 직접 접촉하여, 상기 유리 기판 등에 접합되는 유리접합용 필름(110)의 접합면일 수 있다.Referring to Figure 3 in more detail, the first depth (D1), the second depth (D2), the third depth (D3) and the fourth depth (D4) are each of the film for the glass bonding It means a predetermined depth from one surface 111. Here, one surface 111 of the glass bonding film may be a bonding surface of the glass bonding film 110 that is directly contacted with a glass substrate or the like and is bonded to the glass substrate or the like.
일 실시예에서, 상기 D1은 0.1㎚ 내지 15㎚에 속하고, 상기 D2는 40㎚ 내지 55㎚에 속하고, 상기 D3는 80㎚ 내지 95nm에 속하고, 상기 D4는 135㎚ 내지 150㎚에 속할 수 있다.In one embodiment, the D1 belongs to 0.1 nm to 15 nm, the D2 belongs to 40 nm to 55 nm, the D3 belongs to 80 nm to 95 nm, and the D4 belongs to 135 nm to 150 nm. Can.
일 실시예에서, 상기 D2와 상기 D1 사이의 차이는 상기 D4와 상기 D3의 차이에 대응될 수 있다. 즉, 상기 제1깊이와 상기 제2깊이 사이의 차이는 상기 제3깊이와 상기 제4깊이 사이의 차이와 실질적으로 동일할 수 있다.In one embodiment, the difference between D2 and D1 may correspond to the difference between D4 and D3. That is, the difference between the first depth and the second depth may be substantially the same as the difference between the third depth and the fourth depth.
일 실시예에서, 상기 D1은 5㎚이고, 상기 D2는 55㎚이고, 상기 D3는 90㎚이고, 상기 140㎚일 수 있다.In one embodiment, the D1 is 5 nm, the D2 is 55 nm, the D3 is 90 nm, and the 140 nm.
또한, 일 실시예에서, 상기 M1은 상기 M2의 3배 이상일 수 있고, 3.5 배 이상일 수 있고, 8배 이하일 수 있고, 6배 이하일 수 있다.In addition, in one embodiment, the M1 may be 3 times or more of the M2, 3.5 times or more, 8 times or less, and 6 times or less.
상기 유리접합용 필름의 표면에서부터 안쪽으로 두께에 따라 금속이온의 농도가 다르게 적용되면, 동등한 양의 금속염 화합물을 접합력조절제로 적용하였다고 하더라도 금속염 화합물, 특히 금속양이온의 분포가 표면에 집중되도록 농도구배를 갖는 유리접합용 필름을 제공할 수 있다.When the concentration of metal ions is differently applied depending on the thickness from the surface of the film for the glass bonding, even if an equal amount of the metal salt compound is applied as a bonding force control agent, the concentration gradient is concentrated so that the distribution of the metal salt compound, especially the metal cation, is concentrated on the surface. It is possible to provide a film for glass bonding.
이는, 접합되는 유리와 상호작용하는 유리접합용 필름의 표면에 접합력 조절효과를 갖는 첨가제(이 첨가제로부터 유래되는 물질을 포함한다)가 충분히 작용하면서도 필름 전체적으로는 적은 양의 금속염 화합물이 적용된다는 것을 의미하는 것으로, 이를 통해서 필름의 수분 민감도를 개선하는 효과도 얻을 수 있다.This means that a small amount of a metal salt compound is applied to the entire surface of the film while the additive having the effect of controlling the bonding force (including the material derived from this additive) works sufficiently on the surface of the glass bonding film that interacts with the glass to be bonded. By doing this, it is also possible to obtain the effect of improving the moisture sensitivity of the film.
상기 유리접합용 필름은 표면으로부터 50 nm 깊이 내의 금속이온의 평균 함량이 상기 유리접합용 필름 전체의 금속이온의 평균 함량보다 1.2 배 이상, 1.5 배 이상 높을 수 있다.The film for glass bonding may have an average content of metal ions within a depth of 50 nm from a surface of at least 1.2 times and 1.5 times higher than the average content of metal ions in the entire film for glass bonding.
상기 유리접합용 필름은 표면으로부터 50 nm 깊이 내의 금속이온의 평균 함량이 상기 유리접합용 필름 전체의 금속이온의 평균 함량보다 1.5 내지 4배, 더 구체적으로 1.9배 내지 3배 높을 수 있다.The film for glass bonding may have an average content of metal ions within a depth of 50 nm from the surface of the glass bonding film 1.5 to 4 times, more specifically 1.9 to 3 times higher than the average content of metal ions in the entire film.
이렇게 분명한 표면으로부터의 깊이에 따른 금속이온농도의 분포를 갖는 경우, 보다 소량의 금속염을 적용하고도 우수한 접합력조절효과를 얻을 수 있다.When the metal ion concentration is distributed according to the depth from the clear surface, an excellent bonding force control effect can be obtained even if a smaller amount of the metal salt is applied.
상기 금속이온은 2가 금속이온을 포함할 수 있다.The metal ion may include a divalent metal ion.
상기 금속이온은 2가 금속이온으로 이루어질 수 있다.The metal ion may be formed of a divalent metal ion.
상기 금속이온은 마그네슘 2가이온일 수 있다.The metal ion may be magnesium divalent ion.
상기 유리접합용 필름은 상기 유리접합용 필름을 포함하는 접합유리를 65℃ 95%rh의 항온항습챔버에서 2주 동안 방치한 뒤 꺼내어 측정한 백화거리가 5 mm 이하로, 우수한 내습특성을 갖는 것일 수 있다.The film for glass bonding is to have the laminated glass containing the film for glass bonding in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks, and then take it out, and the measured whitening distance is 5 mm or less, and has excellent moisture resistance. Can.
상기 유리접합용 필름은 상기 유리접합용 필름을 포함하는 접합유리를 65℃ 95%rh의 항온항습챔버에서 2주 동안 방치하기 전과 후의 황색도 변화량이 2.5 이하일 수 있다.In the glass bonding film, the amount of change in yellowness before and after leaving the laminated glass containing the glass bonding film in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks may be 2.5 or less.
상기 유리접합용 필름을 상기 유리접합용 필름을 포함하는 접합유리의 펌멜 접합력 등급이 3 내지 4 단계일 수 있다.The film for bonding the glass may have a grade of 3 to 4 in the degree of a polymer bonding strength of the laminated glass including the film for bonding the glass.
상기 유리접합용 필름의 두께는 0.4 mm 이상, 구체적으로 0.4 내지 1.6 ㎜일 수 있고, 0.5 내지 1.2 mm일 수 있으며, 0.6 내지 0.9 mm일 수 있다. 이러한 두께로 상기 필름을 제조하는 경우, 얇고 가벼우면서도 우수한 내충격성, 내관통성 등의 특성을 갖는 필름을 제공할 수 있다.The thickness of the film for glass bonding may be 0.4 mm or more, specifically 0.4 to 1.6 mm, 0.5 to 1.2 mm, and 0.6 to 0.9 mm. In the case of manufacturing the film with such a thickness, it is possible to provide a film having characteristics such as excellent impact resistance and penetration resistance while being thin and light.
상기 유리접합용 필름은 단층 구조일 수 있고, 2층 이상의 구조를 가질 수 있으며, 3층 이상의 구조를 가질 수 있으며, 5층 이상의 구조를 가질 수 있다.The glass bonding film may have a single-layer structure, a structure having two or more layers, a structure having three or more layers, or a structure having five or more layers.
상기 유리접합용 필름이 3층 이상의 구조를 갖는 경우, 양 측의 표면층을 제외하고 그 내부에 위치하는 층은 기능층일 수 있다.When the film for glass bonding has a structure of three or more layers, a layer positioned therein except for the surface layers on both sides may be a functional layer.
상기 기능층은 예시적으로 차음 기능성을 상기 유리접합용 필름에 부여하는 차음층일 수 있다.The functional layer may be, for example, a sound insulating layer that imparts sound insulating functionality to the film for glass bonding.
상기 기능층은 예시적으로 헤드업디스플레이의 기능성을 부여할 수 있는 쐐기층일 수 있다.The functional layer may be, for example, a wedge layer capable of imparting the functionality of the head-up display.
상기 유리접합용 필름이 3층 이상의 구조를 갖는 경우, 위에서 설명한 금속염 또는 금속이온에 대한 특징은 표면층에 적용되는 특징일 수 있다.When the film for glass bonding has a structure of three or more layers, the characteristic for the metal salt or metal ion described above may be a characteristic applied to the surface layer.
본 발명의 또 다른 일 실시예에 따른 접합유리(100)는 두 장의 유리(120, 130) 사이에 위에서 설명한 유리접합용 필름(110)을 포함하는 적층체를 포함한다.The laminated glass 100 according to another embodiment of the present invention includes a laminate including the glass bonding film 110 described above between two sheets of glass 120 and 130.
구체적으로, 상기 접합유리(100)는 제1유리기판(120); 상기 제1유리기판에 대향되는 제2유리기판(130); 및 상기 제1유리기판(120) 및 상기 제2유리기판(130) 사이에 개재되고, 상기 제1유리기판(120) 및 상기 제2유리기판(130)에 접합되는 유리접합용 필름(110)을 포함한다.Specifically, the laminated glass 100 includes a first glass substrate 120; A second glass substrate 130 facing the first glass substrate; And a glass bonding film 110 interposed between the first glass substrate 120 and the second glass substrate 130 and bonded to the first glass substrate 120 and the second glass substrate 130. It includes.
상기 유리접합용 필름(110)은 폴리비닐아세탈 수지, 가소제와 함께 금속염 또는 금속이온을 포함하고, 하기의 수식 1을 만족한다.The glass bonding film 110 includes a metal salt or metal ion together with a polyvinyl acetal resin and a plasticizer, and satisfies Equation 1 below.
[수식 1][Equation 1]
M1 > M2M1> M2
상기 수식 1에서, 상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.In Equation 1, M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film, and the M2 is the surface of the glass bonding film. With reference to, the average content of metal ions from the third depth (D3) to the fourth depth (D4), D1 and D2 are respectively values of 60 nm or less, and D3 and D4 are values of 80 nm or more, respectively.
상기 두 장의 유리는 상기 제1유리기판과 상기 제2유리기판으로, 본 명세서에서 유리로 설명하나 광투과 패널이라면 적용 가능하며, 플라스틱 등의 소재도 적용 가능하다.The two sheets of glass are the first glass substrate and the second glass substrate, which are described herein as glass, but can be applied to any light-transmitting panel, and materials such as plastic are also applicable.
상기 유리접합용 필름의 구체적인 구조, 조성, 특징, 제조방법 등에 대한 내용은 위에서 설명한 내용과 중복되므로 그 기재를 생략한다.Details of the specific structure, composition, characteristics, manufacturing method, etc. of the glass bonding film are overlapped with those described above, and thus description thereof is omitted.
상기 접합유리는 65℃ 95%rh의 항온항습챔버에서 2주 동안 100mm*100mm 면적의 시편을 방치한 뒤 측정한 평균 백화 거리가 5 mm 이하일 수 있고, 0 내지 5 mm 일 수 있으며, 0.1 내지 5 mm일 수 있다. 이러한 평균 백화 거리는 고온다습 조건에서도 상당히 우수한 내수성을 갖는다는 것을 의미한다.The laminated glass may have an average whitening distance of 5 mm or less, and may be 0 to 5 mm, after measuring a specimen of 100 mm*100 mm area for 2 weeks in a constant temperature and humidity chamber at 65° C. and 95% rh. mm. This average whitening distance means that it has excellent water resistance even under high temperature and high humidity conditions.
상기 접합유리를 65℃ 95%rh의 항온항습챔버에서 2주 동안 방치하기 전과 후의 황색도 변화량이 2.5 이하일 수 있다. 이는 우수한 장기내구성을 갖는다는 점을 보여주는 결과로, 특히 벤조트리아졸계 화합물과 금속염을 동시에 포함하는 필름에서는 더욱 우수한 결과로 평가될 수 있다. The amount of change in yellowness before and after the laminated glass is left for 2 weeks in a constant temperature and humidity chamber at 65°C and 95%rh may be 2.5 or less. This is a result showing that it has excellent long-term durability, in particular, it can be evaluated as a better result in a film containing a benzotriazole-based compound and a metal salt at the same time.
상기 접합유리의 펌멜 접합력 등급이 3 내지 4 단계일 수 있다. 이는 유리와 필름 사이의 접합력 적절한 범위로 안전유리로써 기능하기 충분한 접합력을 갖는다는 것을 의미한다.The laminated glass may have a grade of 3 to 4 in the bonding strength of the polymer. This means that the bonding force between the glass and the film has a sufficient bonding force to function as a safety glass in an appropriate range.
이하, 구체적인 실시예를 통해 본 발명을 보다 구체적으로 설명한다. 하기 실시예는 본 발명의 이해를 돕기 위한 예시에 불과하며, 본 발명의 범위가 이에 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail through specific examples. The following examples are only examples for helping the understanding of the present invention, and the scope of the present invention is not limited thereto.
1. 재료의 준비1. Preparation of ingredients
1) 첨가제 조성물의 제조1) Preparation of additive composition
산화방지제인 Irganox1010을 전체 필름을 기준으로 0.15 wt%, 자외선흡수제인 TINUVIN P를 0.3wt%, 그리고 금속염 접합력조절제인 마그네슘 아세테이트(Mg acetate)를 0.18 wt% 혼합하여 첨가제 조성물 1을 제조하였다.The additive composition 1 was prepared by mixing the antioxidant Irganox1010 with 0.15 wt% based on the total film, the UV absorber TINUVIN P with 0.3wt%, and the metal salt adhesion control agent magnesium acetate with 0.18 wt%.
마그네슘 아세테이트(Mg acetate)를 1.25 wt% 적용한 것만 제외하고 상기 첨가제 조성물 1과 동일하게 제조하여 첨가제 조성물 2를 제조하였다.Magnesium acetate (Mg acetate) was prepared in the same manner as the additive composition 1 except that 1.25 wt% was applied to prepare an additive composition 2.
2) 폴리비닐부티랄 수지(A)의 제조2) Preparation of polyvinyl butyral resin (A)
중합도 1700, 검화도 99인 폴리비닐아세탈 수지와 n-부타날을 반응기에 투입하고 통상의 폴리비닐부티랄 수지의 합성과정을 진행하여 수산기 19.5 wt%, 부티랄기 79.8 wt%, 아세틸 0.7 wt%인 폴리비닐부티랄 수지를 얻었다.A polyvinyl acetal resin having a degree of polymerization of 1700 and a degree of saponification of 99 and n-butanal were introduced into the reactor, and the process of synthesizing a conventional polyvinyl butyral resin was followed by hydroxyl 19.5 wt%, butyral group 79.8 wt%, acetyl 0.7 wt% A polyvinyl butyral resin was obtained.
2. 폴리비닐부티랄 필름의 제조2. Preparation of polyvinyl butyral film
1) 실시예의 필름 제조를 위한 세팅1) Setting for film production of the example
필름 표면의 이온농도를 조절하기 위하여 다이립(DIE LIP) 부분에 텅스텐와이어(VWF Industries社 제)가 장착되어 있는 특수한 형태의 장치를 적용하였다.In order to control the ion concentration of the film surface, a special type device in which a tungsten wire (manufactured by VWF Industries) is mounted on a die lip portion was applied.
텅스텐 와이어의 양쪽 끝은 전기 발전기와 연결되어 상기 텅스텐 와이어에 전압을 인가하는 것이 가능하고, 발전기의 모드에 따라서 POSITIVE 또는 NEGATIVE를 선택하여 와이어에 (+) 또는 (-)의 특성을 부여할 수 있다. 본 발명에서는 실시예에서 금속이온의 농도 분포를 제어하기 위하여 NEGATIVE 모드를 선택하여 사용하였다(도 1 참고).Both ends of the tungsten wire are connected to an electric generator, and it is possible to apply voltage to the tungsten wire, and depending on the mode of the generator, POSITIVE or NEGATIVE can be selected to impart (+) or (-) characteristics to the wire. . In the present invention, the NEGATIVE mode was selected and used to control the concentration distribution of metal ions in Examples (see FIG. 1 ).
2) 실시예 1의 필름 제조2) Preparation of the film of Example 1
2축 압출기에 폴리비닐부티랄수지(A) 72.37wt%에 가소제로 3G8을 27wt%와 첨가제 조성물 1 0.63wt%를 넣고 용융 압출한 뒤 위에서 세팅한 장치가 된 티-다이를 통해 분당 10M의 속도로 전체 두께 780㎛의 필름형태를 제조하였다. 이때, 인가 전류는 5kV로 하였다.A polyvinyl butyral resin (A) in a twin-screw extruder, 3G8 was added to 72.37wt% as a plasticizer, 27wt% and 0.63wt% of the additive composition was melt-extruded, and then 10M per minute through the T-die, which was the device set above A film shape having an overall thickness of 780 µm was prepared. At this time, the applied current was 5 kV.
3) 실시예 2의 필름 제조3) Preparation of the film of Example 2
인가전압을 4.5KV로 낮추어 적용한 것 외에는 실시예 1의 필름과 동일하게 실시예 2의 필름을 제조하였다.A film of Example 2 was prepared in the same manner as the film of Example 1, except that the applied voltage was lowered to 4.5 KV.
3. 폴리비닐부티랄 필름의 물성 평가3. Evaluation of physical properties of polyvinyl butyral film
1) 내구성/내수성 평가용 접합유리 샘플의 제조1) Preparation of laminated glass samples for evaluation of durability/water resistance
실시예 1 및 2을 20℃, 30%RH에서 1주일간 방치한 뒤 가로*세로 100mm*100mm의 사이즈로 절단하고, 양면에 2.1T(mm, 이하 동일함) 투명 유리 두 장을 위치시켜 2.1T유리-필름-2.1T유리의 적층구조로 진공라미네이터에서 120’C, 1기압에서 20초간 예비 접합을 실시하였다.Examples 1 and 2 were left at 20°C and 30%RH for 1 week, and then cut to a size of 100mm*100mm horizontally and vertically and placed 2.1T (mm, hereinafter the same) transparent glass on both sides to place 2.1T. As a laminated structure of glass-film-2.1T glass, preliminary bonding was performed for 20 seconds at 120'C in a vacuum laminator and 1 atmosphere.
이후, 예비 접합된 유리-필름-유리의 적층체를 오토클레이브에서 본접합을 실시하여 접합유리 샘플을 얻었다. 본접합의 조건은, 상온에서 140’C까지 승온시간 25 분, 140’C에서 유지시간 25 분으로 적용했다.Thereafter, a laminated body of pre-bonded glass-film-glass was subjected to main bonding in an autoclave to obtain a laminated glass sample. The conditions of the main bonding were applied at room temperature from room temperature to 140'C for 25 minutes, and at 140'C for 25 minutes.
2) 내구성 평가: 황색도 변화량(d-YI) 평가 방법2) Durability evaluation: yellowness change amount (d-YI) evaluation method
상기에서 제조된 접합유리 샘플의 정 중앙의 황색도 초기값(YI initial)을 헌터랩 사의 울트라스캔 프로를 사용하여 D65, 10 ℃ 조건에서 ASTM E313규격에 의거해 황색도 초기값을 측정하였다. 황색도 초기값 측정이 완료된 시편을 65℃ 95%rh의 항온항습챔버에서 2주 동안 방치하고, 꺼내어 다시 황색도를 위와 동일한 방법으로 측정하여 황색도 완료값(YI final)을 측정하고 황변도차를 다음의 식 (5)에 의하여 계산하였다.The yellowness initial value (YI initial ) at the center of the center of the laminated glass sample prepared above was measured using the UltraScan Pro manufactured by Hunter Lab, under the conditions of D65 and 10° C. according to ASTM E313 standards. After the yellowness initial value measurement has been completed, the specimen is left in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks, taken out, and the yellowness is measured again in the same manner as above to measure the yellowness completion value (YI final ) and the yellowness difference. Was calculated by the following equation (5).
식 (5) d-YI = YI final - YI initial Equation (5) d-YI = YI final -YI initial
상기 식에 의해 구해진 값이 2.5 이하인 경우 Pass로, 2.5 초과인 경우 Fail로 평가했다.When the value obtained by the above formula was 2.5 or less, it was evaluated as Pass, and when it was more than 2.5, it was evaluated as Fail.
3) 내습성 평가: 백화거리 측정3) Moisture resistance evaluation: Whitening distance measurement
상기에서 제조된 접합유리 샘플(100)을 65℃ 95%rh의 항온항습챔버에서 2주 동안 방치한 뒤 꺼내어 4변의 중앙으로부터 haze가 발생한 부분(백화현상이 나타난 영역, 10)을 육안으로 확인하여 그 거리를 자로 측정하여(도 2 참고), 아래 식 (6)에 따라 4변의 값의 평균값을 계산하여 백화거리(mm)로 나타냈다.The laminated glass sample 100 prepared above was left in a constant temperature and humidity chamber at 65°C and 95%rh for 2 weeks, and then taken out and visually confirmed the area where haze occurred (the area where whitening occurred, 10) from the center of the four sides. The distance was measured with a ruler (refer to FIG. 2), and the average value of the four sides was calculated according to the following equation (6) and expressed as the whitening distance (mm).
식 (6) 평균백화거리 = (d11+ d12+ d13+ d14)÷ 4 Equation (6) Average whitening distance = (d11+ d12+ d13+ d14)÷ 4
상기 식 (6)에서, 제1변 내지 제4변의 중앙에서 측정한 백화현상이 나타난 거리를 각각 d11 내지 d14로 칭함(단위는 mm).In the formula (6), the distances at which the whitening phenomenon measured in the center of the first to fourth sides appeared are referred to as d11 to d14, respectively (unit is mm).
평균 백화거리가 5 mm 이하인 경우 Pass, 5 mm 초과인 경우 Fail로 평가했다.When the average whitening distance was 5 mm or less, it was evaluated as a pass, and when it exceeded 5 mm, it was evaluated as a fail.
4) 펌멜접합력 평가4) Evaluation of Fummel bonding power
펌멜(pummel) 접합력 평가를 통해 폴리비닐아세탈 필름과 유리간의 접합력을 평가하였다. 구체적으로, 실시예 1와 2에서 제조된 PVB 필름을 20℃, 30%RH에서 1주일간 방치한 뒤, 양면에 2.1T의 투명 유리 두 장을 위치시켜 가로*세로 100mm×150mm의 2.1T유리-필름-2.1T유리의 적층구조체를 제조했다. 상기 적층구조체를 진공라미네이터에서 150’C, 1기압에서 20초간 예비 접합하였다. 이후 예비접합된 적층구조체를 오토클레이브에서 상온에서 140’C까지 승온시간 25 분, 140’c에서 유지시간 25 분의 조건으로 본접합을 실시하여 접합유리 형태의 시편을 얻었다.The bonding strength between the polyvinyl acetal film and the glass was evaluated through the evaluation of the pummel bonding force. Specifically, the PVB films prepared in Examples 1 and 2 were left at 20° C. and 30% RH for 1 week, and then placed two sheets of 2.1T transparent glass on both sides to produce 2.1T glass with a width*length of 100mm×150mm. A laminated structure of film-2.1T glass was prepared. The laminated structure was pre-bonded at 150'C in a vacuum laminator and 20 seconds at 1 atmosphere. Subsequently, the pre-bonded laminated structure was subjected to main bonding in an autoclave at room temperature from room temperature to 140'C for 25 minutes, and retention time at 140'c for 25 minutes to obtain a specimen of laminated glass.
상기 접합유리형태의 시편을 -20℃에서 4시간 동안 냉각한 뒤, 해머를 이용하여 연달아 친 후에, 필름에 남아있는 유리의 양의 정도를 측정하였다. 타격 후 필름에 접합되어 남아있는 유리의 양에 따라서 모두 탈락되는 경우를 0등급으로, 필름에 유리가 모두 남아있는 경우를 8등급으로 하여, 0등급으로부터 8등급까지의 값을 매겼고, 펌멜 등급이 3 내지 4사이일 경우를 Pass, 5 이상이거나 2 이하일 경우 Fail로 표시하였다.After cooling the specimen in the form of laminated glass at -20°C for 4 hours, after hitting with a hammer, the degree of the amount of glass remaining in the film was measured. After hitting, it was bonded to the film and dropped out according to the amount of glass remaining, and the grade of 0 was assigned to the case where all the glass remained on the film, and the value from grade 0 to grade 8 was assigned. In the case of between 3 and 4, Pass, 5 or more, or 2 or less, was marked as Fail.
5) 표면이온농도의 평가5) Evaluation of surface ion concentration
필름의 표면이온 농도를 확인하기 위해 표면 이온의 강도 측정할 수 있는 이차이온질량분석기(TOF SIMS)를 사용하였다. 먼저, 분석의 정밀도를 높이기 위하여 제조된 필름의 표면 조도를 없애는 전처리 과정을 진행했다. 전처리의 방법은, 진공라미네이터에서 1기압, 150도의 조건으로 3분간 열처리하여 표면의 패턴을 평평하게 만든 뒤 20℃, 30%RH(Relative Humidity)에서 1시간 방치해 열을 제거하는 방식으로 진행되었다.To check the surface ion concentration of the film, a secondary ion mass spectrometer (TOF SIMS) capable of measuring the strength of the surface ions was used. First, in order to increase the precision of the analysis, a pretreatment process was performed to remove the surface roughness of the manufactured film. The pre-treatment method was performed by heat-treating for 3 minutes under a condition of 1 atm and 150 degrees in a vacuum laminator to flatten the pattern on the surface, and then allowed to stand at 20°C and 30% RH (Relative Humidity) for 1 hour to remove heat. .
전처리된 필름은 가로*세로 10mm*10mm의 사이즈로 샘플링하여 샘플 홀더에 장착하고 측정을 진행하였다. TOF-SIMS에서 1회 스퍼터링 시 깎이는 표면의 두께가 1 nm가 되도록 세팅한 뒤, 약 160회의 스퍼터링 및 측정을 반복하며 깊이 160 nm까지의 data를 얻어 깊이에 따른 이온농도 분석을 진행하는데 사용하였다. 보다 정확한 비교를 위해서 표면의 이물에 의한 noise를 제거하기 위하여 표면에서 4 또는 5 nm까지의 data는 제외한 후 평가하였다.The pre-treated film was sampled in a size of 10 mm*10 mm in width*length, mounted on a sample holder, and measured. After sputtering once in TOF-SIMS, the thickness of the surface to be cut was set to 1 nm, and after sputtering and measuring about 160 times, data up to 160 nm in depth were obtained and used to conduct ion concentration analysis according to depth. For a more accurate comparison, data up to 4 or 5 nm from the surface was excluded and evaluated to remove noise caused by foreign matter on the surface.
필름의 표면이온농도를 평가한 결과를 5 내지 105 nm 범위의 값을 10 nm 단위로 평균을 내어 도 4의 그래프로 나타냈다. 도 4에서 가로축은 깊이(depth, nm)를 나타내고 세로축은 강도(intensity, counts)를 의미하며, #1과 #2는 각각 실시예 1과 실시예 2를 나타낸다.As a result of evaluating the surface ion concentration of the film, the values in the range of 5 to 105 nm were averaged in 10 nm units and shown in the graph of FIG. 4. In FIG. 4, the horizontal axis represents depth (nm), and the vertical axis represents intensity (counts), and #1 and #2 represent Example 1 and Example 2, respectively.
이 중 변화를 뚜렷하게 확인할 수 있는 깊이 5 내지 55 nm와 90 내지 140 nm의 값은 아래 표 1에 나타내었다.Among them, values of depths of 5 to 55 nm and 90 to 140 nm that can clearly identify changes are shown in Table 1 below.
깊이에 따른According to depth 실시예 1Example 1 실시예 2Example 2
5-55 nm에서 평균Average at 5-55 nm 50.6950.69 39.2139.21
90-140 nm에서 평균Average at 90-140 nm 11.5111.51 10.8110.81
상기 표 1을 참조하면, 실시예 1과 실시예 2에서 실시예 1의 경우 약 4.4배, 그리고 실시예 2의 경우에는 약 3.6 배의 농도 차이를 보였다. 이러한 이러한 결과는 대략 5 내지 55 nm 정도의 깊이에서 얻어진 금속이온의 평균값이 90 내지 140 nm에서 얻어진 금속이온의 평균값과 비교하여 차이가 나며, 이는 본 발명의 실시예에서 얻어지는 특징임을 보여주는 결과라 생각된다.Referring to Table 1, Example 1 and Example 2 showed a concentration difference of about 4.4 times for Example 1 and about 3.6 times for Example 2. These results show that the average value of metal ions obtained at a depth of approximately 5 to 55 nm differs from the average value of metal ions obtained at 90 to 140 nm, which is thought to be a result showing characteristics obtained in Examples of the present invention. do.
또한, 깊이에 따른 농도 변화가 큰 5 내지 145 nm 범위의 값을 10 단위로 평균을 내어 아래 표 2과 도 4에 나타냈다. 기타 측정값들과 조건은 아래 표 3에 나타냈다.In addition, the values in the range of 5 to 145 nm with a large concentration change according to the depth are averaged in 10 units, and are shown in Table 2 and FIG. 4 below. Other measured values and conditions are shown in Table 3 below.
깊이에 따른 (nm)Depending on the depth (nm) 실시예 1Example 1 실시예 2Example 2
6-156-15 89.9689.96 83.7383.73
16-2516-25 60.0260.02 45.5745.57
26-3526-35 42.8642.86 29.9329.93
36-4536-45 31.3331.33 18.1118.11
46-5546-55 24.5224.52 13.2113.21
56-6556-65 19.4119.41 12.6112.61
66-7566-75 15.1115.11 11.7111.71
76-8576-85 13.2113.21 11.3111.31
86-9586-95 13.6113.61 11.9111.91
96-10596-105 12.2112.21 11.0011.00
실시예 1Example 1 실시예 2Example 2
금속염 투입량(ppm)Metal salt input (ppm) Mg AcetateMg Acetate 3333 3333
인가 전압Applied voltage 5kV5 kV 4.5kV4.5kV
평가evaluation 펌멜접합력Fummel bonding power Pass Pass Pass Pass
내습성 Moisture resistance Pass Pass Pass Pass
내구성durability Pass Pass Pass Pass
위의 표 2, 도 4 및 표 3를 참고하면, 전압을 인가하여 제조한 실시예 1과 실시예 2의 필름은 표면에서 금속염에서 유래한 마그네슘이온의 농도가 상당히 높게 나타나는 것을 확인할 수 있다. 특히 전압을 더 강하게 인가한 실시예 1의 경우가 실시예 2의 경우보다 더 깊게 두께까지 금속이온의 농도구배가 나타나는 것을 확인할 수 있었다. 이러한 특징은, 약 50 nm를 기준으로 평가한 표면이온농도와 이를 제외한 표면제외평균이온농도의 차이를 보아도 확인할 수 있다.Referring to Tables 2, 4, and 3 above, it can be seen that the films of Examples 1 and 2 prepared by applying a voltage had a high concentration of magnesium ions derived from metal salts on the surface. Particularly, it was confirmed that the concentration gradient of the metal ion appeared to a thickness deeper than that of Example 2 in the case of Example 1 in which the voltage was applied more strongly. These characteristics can be confirmed by looking at the difference between the average surface ion concentration except for the surface ion concentration and the surface ion concentration evaluated based on about 50 nm.
펌멜접합력의 경우, 실시예 1, 2가 Pass로 나타나 적절한 접합력조절효과를 갖는 것으로 나타났고, 실시예 1과 2의 경우 내습상이나 내구성도 우수하여, 동시에 얻기 어려운 3가지 특성 조건을 모두 만족하는 것으로 확인하였다.In the case of the Fummel bonding force, Examples 1 and 2 were shown as Pass, and it was found to have an appropriate bonding force control effect. In the case of Examples 1 and 2, it was excellent in moisture resistance and durability, and satisfies all three characteristics conditions that are difficult to obtain at the same time. Confirmed.
이상에서 본 발명의 바람직한 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.
*부호의 설명*Description of code
1: 용융수지 2: 대전된 용융수지1: molten resin 2: charged molten resin
3: 고농도영역 3: High concentration area
100: 접합유리 110: 유리접합용 필름100: laminated glass 110: glass bonding film
111: 유리접합용 필름의 일 표면111: one surface of the film for glass bonding
120: 유리, 제1유리 130: 제2유리120: glass, first glass 130: second glass
200: 티다이 210: 제1다이립200: T-die 210: first die lip
220: 제1전압인가부 230: 제2다이립220: first voltage application unit 230: second die lip
240: 제2전압인가부 100: 접합유리240: second voltage application part 100: laminated glass
10: 백화현상이 나타난 영역 20: 백화현상이 나타나지 않은 영역10: area where whitening occurred 20: area where whitening did not appear
d11: 제1변에서의 백화거리 d12: 제2변에서의 백화거리d11: whitening distance at the first side d12: whitening distance at the second side
d13: 제3변에서의 백화거리 d14: 제4변에서의 백화거리d13: whitening distance at the third side d14: whitening distance at the fourth side

Claims (16)

  1. 폴리비닐아세탈 수지 및 첨가제를 포함하는 조성물을 용융하여 용융수지를 제조하는 용융단계; 그리고 성형부를 통하여 상기 용융수지를 토출하고 필름 형태로 성형하여 유리접합용 필름을 형성하는 성형단계를 포함하고,Melting step of melting a composition comprising a polyvinyl acetal resin and an additive to prepare a molten resin; And a molding step of discharging the molten resin through a molding part and forming a film to form a glass bonding film,
    상기 첨가제는 금속염을 함유하고,The additive contains a metal salt,
    상기 성형부는 상기 용융수지에 전기력을 인가하고, The molding unit applies an electric force to the molten resin,
    상기 유리접합용 필름은 하기의 수식 1을 만족하는, 유리접합용 필름의 제조방법:The film for glass bonding satisfies Equation 1 below, a method for manufacturing a film for glass bonding:
    [수식 1][Equation 1]
    M1 > M2M1> M2
    상기 수식 1에서, 상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.In Equation 1, M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film, and the M2 is the surface of the glass bonding film. With reference to, the average content of metal ions from the third depth (D3) to the fourth depth (D4), D1 and D2 are respectively values of 60 nm or less, and D3 and D4 are values of 80 nm or more, respectively.
  2. 제1항에 있어서, According to claim 1,
    상기 성형부는 일 말단에 위치하는 티다이를 포함하는, 유리접합용 필름의 제조방법.The forming portion includes a tea die located at one end, a method for manufacturing a glass bonding film.
  3. 제1항에 있어서, According to claim 1,
    상기 성형부는 10 kV 이하의 전압을 인가하는, 유리접합용 필름의 제조방법.The molding unit is a method of manufacturing a film for glass bonding, applying a voltage of 10 kV or less.
  4. 제1항에 있어서, According to claim 1,
    상기 전기력은 상기 성형부로의 인력을 상기 금속이온에 인가하는, 유리접합용 필름의 제조방법.The electric force is a method of manufacturing a film for glass bonding, applying an attraction force to the molding part to the metal ion.
  5. 제1항에 있어서, According to claim 1,
    상기 D1은 0.1㎚ 내지 15㎚에 속하고, 상기 D2는 40㎚ 내지 55㎚에 속하고, 상기 D3는 80㎚ 내지 95nm에 속하고, 상기 D4는 135㎚ 내지 150㎚에 속하는, 유리접합용 필름의 제조방법.The D1 belongs to 0.1 nm to 15 nm, the D2 belongs to 40 nm to 55 nm, the D3 belongs to 80 nm to 95 nm, and the D4 belongs to 135 nm to 150 nm. Method of manufacturing.
  6. 제5항에 있어서, The method of claim 5,
    상기 D2와 상기 D1의 차이는 상기 D4와 상기 D3의 차이에 대응되는, 유리접합용 필름의 제조방법.The difference between the D2 and the D1 corresponds to the difference between the D4 and the D3, a method for manufacturing a glass bonding film.
  7. 제1항에 있어서, According to claim 1,
    상기 D1은 5㎚이고, 상기 D2는 55㎚이고, 상기 D3는 90㎚이고, 상기 D4는 140㎚이고, 상기 M1은 상기 M2의 3배 이상인, 유리접합용 필름의 제조방법.The D1 is 5 nm, the D2 is 55 nm, the D3 is 90 nm, the D4 is 140 nm, and the M1 is three or more times the M2, a method for manufacturing a glass bonding film.
  8. 폴리비닐아세탈 수지, 가소제와 함께 금속염 또는 금속이온을 포함하고, Contains polyvinyl acetal resin and a plasticizer together with a metal salt or metal ion,
    하기의 수식 1을 만족하는, 유리접합용 필름:Film for glass bonding, which satisfies the following Equation 1:
    [수식 1][Equation 1]
    M1 > M2M1> M2
    상기 수식 1에서, In Equation 1 above,
    상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.The M1 is the average content of metal ions from the first depth (D1) to the second depth (D2) based on the surface of the film for glass bonding, and the M2 is based on the surface of the film for glass bonding. The average content of metal ions from 3 depths (D3) to 4th depths (D4), D1 and D2 are respectively 60 nm or less, and D3 and D4 are 80 nm or more, respectively.
  9. 제8항에 있어서, The method of claim 8,
    상기 D1은 0.1㎚ 내지 15㎚에 속하고, 상기 D2는 40㎚ 내지 55㎚에 속하고, 상기 D3는 80㎚ 내지 95nm에 속하고, 상기 D4는 135㎚ 내지 150㎚에 속하는, 유리접합용 필름.The D1 belongs to 0.1 nm to 15 nm, the D2 belongs to 40 nm to 55 nm, the D3 belongs to 80 nm to 95 nm, and the D4 belongs to 135 nm to 150 nm. .
  10. 제9항에 있어서, The method of claim 9,
    상기 D2와 상기 D1 사이의 차이는 상기 D4와 상기 D3의 차이에 대응되는, 유리접합용 필름.The difference between D2 and D1 corresponds to the difference between D4 and D3, the film for glass bonding.
  11. 제8항에 있어서, The method of claim 8,
    상기 D1은 5㎚이고, 상기 D2는 55㎚이며, 상기 D3는 90㎚이고, 상기 D4는 140㎚인, 유리접합용 필름.The D1 is 5 nm, the D2 is 55 nm, the D3 is 90 nm, and the D4 is 140 nm, the film for glass bonding.
  12. 제8항 내지 제11항 중 어느 한 항에 있어서,The method according to any one of claims 8 to 11,
    상기 M1은 상기 M2의 3배 이상인 유리접합용 필름.The M1 is a film for glass bonding three times or more of the M2.
  13. 제8항에 있어서,The method of claim 8,
    상기 금속이온은 2가 금속이온을 포함하는, 유리접합용 필름.The metal ion comprises a divalent metal ion, the glass bonding film.
  14. 제13항에 있어서,The method of claim 13,
    상기 유리접합용 필름을 사이에 두고 적층된 유리 적층체의 평균 백화거리 값이 5 mm 이하인, 유리접합용 필름.The glass bonding film having an average whitening distance value of 5 mm or less of the glass laminate laminated with the glass bonding film therebetween.
  15. 제13항에 있어서,The method of claim 13,
    상기 유리접합용 필름을 사이에 두고 적층된 유리의 펌멜 접합력 등급이 3 내지 4 단계인, 유리접합용 필름.A film for glass bonding, wherein the glass bonding film has 3 to 4 stages of the degree of the polymer bonding strength of the laminated glass.
  16. 제1유리기판;A first glass substrate;
    상기 제1유리기판에 대향되는 제2유리기판; 및A second glass substrate facing the first glass substrate; And
    상기 제1유리기판 및 상기 제2유리기판 사이에 개재되고, 상기 제1유리기판 및 상기 제2유리기판에 접합되는 유리접합용 필름을 포함하고,And a film for glass bonding interposed between the first glass substrate and the second glass substrate, and bonded to the first glass substrate and the second glass substrate.
    상기 유리접합용 필름은 폴리비닐아세탈 수지, 가소제와 함께 금속염 또는 금속이온을 포함하고, 하기의 수식 1을 만족하는, 접합유리;The glass bonding film includes a polyvinyl acetal resin and a plasticizer together with a metal salt or metal ion, and satisfies the following formula 1, laminated glass;
    [수식 1][Equation 1]
    M1 > M2M1> M2
    상기 수식 1에서, 상기 M1은 상기 유리접합용 필름의 표면을 기준으로, 제1깊이(D1)로부터 제2깊이(D2)까지의 금속이온 평균 함량이고, 상기 M2는 상기 유리접합용 필름의 표면을 기준으로, 제3깊이(D3)로부터 제4깊이(D4)까지의 금속이온 평균 함량이고, 상기 D1 및 상기 D2는 각각 60nm 이하의 값이고, 상기 D3 및 상기 D4는 각각 80nm 이상의 값이다.In Equation 1, M1 is an average metal ion content from a first depth (D1) to a second depth (D2) based on the surface of the glass bonding film, and the M2 is the surface of the glass bonding film. With reference to, the average content of metal ions from the third depth (D3) to the fourth depth (D4), D1 and D2 are respectively values of 60 nm or less, and D3 and D4 are values of 80 nm or more, respectively.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130051925A (en) * 2010-03-31 2013-05-21 가부시키가이샤 구라레 Polyvinyl acetal film and uses thereof
JP2015516934A (en) * 2012-03-09 2015-06-18 ソルティア・インコーポレーテッド High rigidity intermediate layer and lightweight laminated multilayer panel
KR20180052593A (en) * 2015-09-11 2018-05-18 세키스이가가쿠 고교가부시키가이샤 Interlayer and laminated glass for laminated glass
KR20180086415A (en) * 2015-11-27 2018-07-31 세키스이가가쿠 고교가부시키가이샤 Interlayer and laminated glass for laminated glass
JP2018145068A (en) * 2017-03-08 2018-09-20 積水化学工業株式会社 Intermediate film for glass laminate, glass laminate, and glass laminate system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5618863A (en) 1996-03-25 1997-04-08 Monsanto Company UV stable polyvinyl butyral sheet
JPH10139496A (en) 1996-10-31 1998-05-26 Sekisui Chem Co Ltd Safety glass interlayer and safety glass
JP2003261362A (en) * 2002-03-11 2003-09-16 Sekisui Chem Co Ltd Interlayer film for laminated glass and laminated glass
JP2011026184A (en) 2009-02-17 2011-02-10 Sekisui Chem Co Ltd Method for producing intermediate film for laminated glass, intermediate film for laminated glass and laminated glass
KR101295650B1 (en) * 2011-11-03 2013-08-13 에스케이씨 주식회사 Polyvinyl acetal film having improved uv resistance and preparation method thereof
JP2015189652A (en) 2014-03-28 2015-11-02 積水化学工業株式会社 Interlayer for laminated glass and laminated glass

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130051925A (en) * 2010-03-31 2013-05-21 가부시키가이샤 구라레 Polyvinyl acetal film and uses thereof
JP2015516934A (en) * 2012-03-09 2015-06-18 ソルティア・インコーポレーテッド High rigidity intermediate layer and lightweight laminated multilayer panel
KR20180052593A (en) * 2015-09-11 2018-05-18 세키스이가가쿠 고교가부시키가이샤 Interlayer and laminated glass for laminated glass
KR20180086415A (en) * 2015-11-27 2018-07-31 세키스이가가쿠 고교가부시키가이샤 Interlayer and laminated glass for laminated glass
JP2018145068A (en) * 2017-03-08 2018-09-20 積水化学工業株式会社 Intermediate film for glass laminate, glass laminate, and glass laminate system

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