WO2020108543A1 - 一种背光模组光源组件 - Google Patents
一种背光模组光源组件 Download PDFInfo
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- WO2020108543A1 WO2020108543A1 PCT/CN2019/121351 CN2019121351W WO2020108543A1 WO 2020108543 A1 WO2020108543 A1 WO 2020108543A1 CN 2019121351 W CN2019121351 W CN 2019121351W WO 2020108543 A1 WO2020108543 A1 WO 2020108543A1
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- ink
- light source
- yellow phosphor
- backlight module
- source assembly
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133611—Direct backlight including means for improving the brightness uniformity
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133609—Direct backlight including means for improving the color mixing, e.g. white
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
- F21V7/30—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings the coatings comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Definitions
- the present disclosure relates to liquid crystal display backlight technology, in particular to a backlight module light source assembly.
- Quantum dots and Local Dimming dimming display technology have become the main direction to improve image quality display.
- Quantum dots and Local Dimming technology It is realized by using blue light direct backlight with small OD value (the light mixing distance from the diffuser to the diffuser is less than 10mm) together with related optical films such as quantum film. Due to the limited angle of LED light, the distribution of LED light intensity is concentrated directly above the LED. When using a white LED light source, the intensity of the light directly above the LED will cause uneven brightness of the display brightness, and there will be color difference in color.
- the difference that is, the LED is bluish directly above, diffuses outward in a circular manner and gradually weakens, and the optimal design adjustment of the LED lens can only change the intensity of its light intensity distribution, and cannot improve its image quality.
- the problem The prior art uses paints with yellow pigments for adjustment and optimization. However, yellow pigments have limited blue light absorption and cannot absorb blue light completely. If there are too many yellow pigments, the visual effect tastes yellowish, if yellow pigments are too Less, the visual effect will still be bluish, so that the visual effect taste is not improved.
- the present disclosure proposes a backlight module light source assembly that improves the color display and uneven brightness of the backlight module LED directly above.
- a backlight module light source component includes a PCB board and LEDs provided on the PCB board; a white solder mask layer is provided on the surface of the PCB board provided with the LED light source, and the white solder mask layer is provided with an LED that spreads outwards around the center Yellow phosphor ink coating unit
- the yellow phosphor ink coating units are distributed from the inner periphery to the outer periphery with the LED as the center and the density from dense to sparse.
- the yellow phosphor powder coating unit is a circular rectangle or a circular ring.
- the above-mentioned yellow phosphor ink coating unit is oval, diamond, triangular or hexagonal.
- the ink coating thickness of the yellow phosphor ink coating unit is 8 ⁇ m to 20 ⁇ m.
- the area ratio of the yellow phosphor ink coating unit on the PCB board is 5% to 45%.
- the ink in the yellow phosphor ink coating unit is acrylic ink, epoxy resin ink, polyurethane ink, polyester ink, vinyl acid ink, and rubber ink.
- the ink in the yellow phosphor ink coating unit is acrylic ink, epoxy resin ink, polyurethane ink, polyester ink, and vinyl acid ink.
- the inks in the yellow phosphor ink coating unit are acrylic inks, epoxy resin inks, polyurethane inks, polyester inks, and rubber inks.
- the above acrylic ink is preferably an epoxy acrylic ink, which is a yellow phosphor epoxy acrylic ink.
- the mass percentage of the yellow phosphor epoxy acrylic ink is 70% to 90% of epoxy acrylate resin, 2% to 10% of inorganic filler, 8% to 25% of diluent, yellow fluorescence Powder 5% ⁇ 25%.
- the polyurethane ink is preferably a polyurethane acrylic ink, which is a yellow phosphor polyurethane acrylic ink.
- the mass percentage of the yellow phosphor polyurethane acrylic ink is 50% to 70% of polyurethane acrylic resin, 6% to 20% of inorganic filler, 8% to 25% of diluent, 5% of yellow phosphor ⁇ 25%.
- the light source assembly of the backlight module adopts a phosphor yellow ink coating on the surface of the PCB board where the backlight LED is located .
- the proportion of the area is optimized and matched to make the LED light source achieve the best light Reflection, refraction or diffuse reflection, effectively improve the problem of uneven color development and uneven brightness of light directly above the backlight LED.
- FIG. 1 is a schematic structural diagram of a preferred embodiment 1 of a backlight module light source assembly of the present disclosure.
- FIG. 1 is an enlarged schematic view of the structure of part A in FIG. 1.
- FIG. 2-1 is a schematic structural diagram of a second preferred embodiment of a backlight module light source assembly of the present disclosure.
- Figure 2-2 is an enlarged schematic view of the structure of Part B in Figure 2-1.
- FIG. 3-1 is a schematic structural diagram of a preferred embodiment 3 of a backlight module light source assembly of the present disclosure.
- Figure 3-2 is an enlarged schematic view of the structure of part C in Figure 3-1.
- FIG. 4-1 is a schematic structural diagram of a preferred embodiment 4 of a backlight module light source assembly of the present disclosure.
- Figure 4-2 is an enlarged schematic view of the structure of Part D in Figure 4-1.
- the light-emitting effect of the backlight module fundamentally determines the display effect of the liquid crystal display device, and the use of quantum dot technology has become the main development direction for improving image quality.
- the LED light source in the backlight module uses a blue light source, there will be a color difference directly above the LED light source, that is, the LED is blue above the blue light, and the blue light is diffused in a circular way around the LED and gradually To reduce the phenomenon of halo formation, which causes uneven display brightness.
- the present disclosure proposes a new type of backlight module light source component, which can effectively emit the LED light source
- the blue light absorption improves the visual effect of the liquid crystal display device.
- FIG. 1 is a schematic structural diagram of a preferred embodiment of a backlight module light source assembly of the present disclosure.
- FIG. 1-2 is an enlarged schematic view of part A in FIG. 1, as shown in FIGS. 1 and 1-2, the backlight
- the module light source assembly includes the PCB board 10 and the LED 40 disposed on the PCB board 10. Since this disclosure only improves the part of the light source assembly in the backlight module, the figure only shows the structure of the PCB board and its surface.
- the surface of the PCB board 10 on which the LED light source is provided is provided with a white solder resist layer 20.
- the yellow phosphor ink coating unit 30 On the white solder resist layer 20 are provided a plurality of yellow phosphor ink coating units 30 that diffuse outward with the LED 40 as the center, and the yellow phosphor powder that surrounds the LED 40
- the specific structure of the ink coating unit 30 is shown in FIG. 1-2.
- the yellow phosphor ink coating unit 30 uses LED 40 as The center is distributed from the inside to the outer periphery, and the density is gradually distributed from dense to sparse.
- the shape of the yellow phosphor ink coating unit 30 in the preferred embodiment 1 of the present disclosure is circular, and the thickness of the ink coating of the yellow phosphor ink coating unit 30 is 8 ⁇ m to 20 ⁇ m, and the yellow phosphor
- the area ratio of the ink coating unit on the PCB board is 5% to 45%.
- the ink in the yellow phosphor ink coating unit in the present disclosure is acrylic ink, epoxy resin ink, polyurethane ink, polyester ink, vinyl acid ink and/or rubber Ink.
- the acrylic ink is preferably epoxy acrylic ink, which is yellow phosphor epoxy acrylic ink, and its mass percentage is 70% to 90% of epoxy acrylate resin and 2% of inorganic filler 10%, diluent 8%-25%, yellow phosphor 5%-25%.
- the polyurethane-based ink is preferably a polyurethane acrylic ink, which is a yellow phosphor polyurethane acrylic ink, and its mass percentage is 50% to 70% of polyurethane acrylic resin, 6% to 20% of inorganic filler, and 8% of diluent ⁇ 25%, yellow phosphor 5% ⁇ 25%.
- the present disclosure utilizes the characteristics of phosphors to convert blue light into white light, converts excessive blue light above LED 40 into white light, and then optimizes the design by the proportion of the area occupied by phosphor ink and white solder mask to achieve the best reflection of LED light , The effect of refraction or diffuse reflection, effectively improve the problem of uneven color development and uneven brightness of the backlight display LED directly above the LED.
- FIG. 2-1 is a schematic structural diagram of a preferred embodiment of a backlight module light source assembly of the present disclosure.
- FIG. 2-2 is an enlarged schematic view of part B in FIG. 2-1, as shown in FIGS. 2-1 and 2-
- the backlight module light source assembly includes a PCB board 10 and LEDs 40 disposed on the PCB board 10. Since this disclosure only improves the part of the light source assembly in the backlight module, the figure only shows the structure of the PCB board and its surface.
- the surface of the PCB board 10 on which the LED light source is provided is provided with a white solder resist layer 20, and on the white solder resist layer 20 is provided a yellow phosphor ink coating unit 30 that diffuses outwards with the LED 40 as the center, and the yellow phosphor ink diffused around the LED 40
- the specific structure of the coating unit 30 is shown in FIG. 2-2. As can be seen from the enlarged structure of the yellow phosphor ink coating unit that diffuses around the LED in FIG. 2-2, the yellow phosphor ink coating unit 30 is centered on the LED 40 From the inner to the outer periphery, the density is distributed from dense to sparse gradient.
- the shape of the yellow phosphor ink coating unit 30 in the preferred embodiment 2 of the present disclosure shown in FIG. 2-2 is rectangular, and the ink coating thickness of the yellow phosphor ink coating unit 30 It is 8 ⁇ m to 20 ⁇ m, and the area ratio of the yellow phosphor ink coating unit on the PCB board is 5% to 45%.
- the ink in the yellow phosphor ink coating unit in the present disclosure is acrylic ink, epoxy resin ink, polyurethane ink, polyester ink, vinyl acid ink and/or rubber Ink.
- the acrylic ink is preferably epoxy acrylic ink, which is yellow phosphor epoxy acrylic ink, and its mass percentage is 70% to 90% of epoxy acrylate resin and 2% of inorganic filler 10%, diluent 8%-25%, yellow phosphor 5%-25%.
- the polyurethane-based ink is preferably a polyurethane acrylic ink, which is a yellow phosphor polyurethane acrylic ink, and its mass percentage is 50% to 70% of polyurethane acrylic resin, 6% to 20% of inorganic filler, and 8% of diluent ⁇ 25%, yellow phosphor 5% ⁇ 25%.
- the present disclosure utilizes the characteristics of phosphors to convert blue light into white light, converts excessive blue light above LED 40 into white light, and then optimizes the design by the proportion of the area occupied by phosphor ink and white solder mask to achieve the best reflection of LED light , The effect of refraction or diffuse reflection, effectively improve the problem of uneven color development and uneven brightness of the backlight display LED directly above the LED.
- FIG. 3-1 is a schematic structural diagram of a preferred embodiment of a backlight module light source assembly of the present disclosure.
- FIG. 3-2 is an enlarged schematic view of part C in FIG. 3-1, as shown in FIGS. 3-1 and 3-
- the backlight module light source assembly includes a PCB board 10 and an LED 40 disposed on the PCB board 10. Since this disclosure only improves the part of the light source assembly in the backlight module, the figure only shows the structure of the PCB board and its surface.
- the surface of the PCB board 10 on which the LED light source is provided is provided with a white solder resist layer 20, and on the white solder resist layer 20 is provided a yellow phosphor ink coating unit 30 that diffuses outwards with the LED 40 as the center, and the yellow phosphor ink diffused around the LED 40
- the specific structure of the coating unit 30 is shown in FIG. 3-2. As can be seen from the enlarged structure of the yellow phosphor ink coating unit that diffuses around the LED in FIG. 3-2, the yellow phosphor ink coating unit 30 is centered on the LED 40 From the inner to the outer periphery, the density is distributed from dense to sparse gradient.
- the shape of the yellow phosphor ink coating unit 30 in the preferred embodiment 3 of the present disclosure shown in FIG. 3-2 is a ring shape, and the yellow phosphor ink coating unit 30
- the thickness of the ink coating is 8 ⁇ m to 20 ⁇ m, and the area ratio of the yellow phosphor ink coating unit on the PCB board is 5% to 45%.
- the ink in the yellow phosphor ink coating unit in the present disclosure is acrylic ink, epoxy resin ink, polyurethane ink, polyester ink, vinyl acid ink and/or rubber Ink.
- the acrylic ink is preferably epoxy acrylic ink, which is yellow phosphor epoxy acrylic ink, and its mass percentage is 70% to 90% of epoxy acrylate resin and 2% of inorganic filler 10%, diluent 8%-25%, yellow phosphor 5%-25%.
- the polyurethane-based ink is preferably a polyurethane acrylic ink, which is a yellow phosphor polyurethane acrylic ink, and its mass percentage is 50% to 70% of polyurethane acrylic resin, 6% to 20% of inorganic filler, and 8% of diluent ⁇ 25%, yellow phosphor 5% ⁇ 25%.
- the present disclosure utilizes the characteristics of phosphors to convert blue light into white light, converts excessive blue light above LED 40 into white light, and then optimizes the design by the proportion of the area occupied by phosphor ink and white solder mask to achieve the best reflection of LED light , The effect of refraction or diffuse reflection, effectively improve the problem of uneven color development and uneven brightness of the backlight display LED directly above the LED.
- FIG. 4-1 is a schematic structural diagram of the first preferred embodiment of the backlight module light source assembly of the present disclosure.
- FIG. 4-2 is an enlarged schematic view of part D in FIG. 4-1, as shown in FIGS. 4-1 and 4-
- the backlight module light source assembly includes a PCB board 10 and an LED 40 disposed on the PCB board 10. Since this disclosure only improves the part of the light source assembly in the backlight module, the figure only shows the structure of the PCB board and its surface.
- the surface of the PCB board 10 on which the LED light source is provided is provided with a white solder resist layer 20, and on the white solder resist layer 20 is provided a yellow phosphor ink coating unit 30 that diffuses outwards with the LED 40 as the center, and the yellow phosphor ink diffused around the LED 40
- the specific structure of the coating unit 30 is shown in FIG. 4-2. As can be seen from the enlarged structure of the yellow phosphor ink coating unit that diffuses around the LED in FIG. 4-2, the yellow phosphor ink coating unit 30 uses LED40 as the center From the inner to the outer periphery, the density is distributed from dense to sparse gradient.
- the shape of the yellow phosphor ink coating unit 30 in the preferred embodiment four of the present disclosure shown in FIG. 4-2 is a ring shape surrounding the LED, yellow fluorescent
- the ink coating thickness of the powder ink coating unit 30 is 8 ⁇ m to 20 ⁇ m, and the area ratio of the yellow phosphor ink coating unit on the PCB board is 5% to 45%.
- the ink in the yellow phosphor ink coating unit in the present disclosure is acrylic ink, epoxy resin ink, polyurethane ink, polyester ink, vinyl acid ink and/or rubber Ink.
- the acrylic ink is preferably epoxy acrylic ink, which is yellow phosphor epoxy acrylic ink, and its mass percentage is 70% to 90% of epoxy acrylate resin and 2% of inorganic filler 10%, diluent 8%-25%, yellow phosphor 5%-25%.
- the polyurethane-based ink is preferably a polyurethane acrylic ink, which is a yellow phosphor polyurethane acrylic ink, and its mass percentage is 50% to 70% of polyurethane acrylic resin, 6% to 20% of inorganic filler, and 8% of diluent ⁇ 25%, yellow phosphor 5% ⁇ 25%.
- the present disclosure utilizes the characteristics of phosphors to convert blue light into white light, converts excessive blue light above LED 40 into white light, and then optimizes the design by the proportion of the area occupied by phosphor ink and white solder mask to achieve the best reflection of LED light , The effect of refraction or diffuse reflection, effectively improve the problem of uneven color development and uneven brightness of the backlight display LED directly above the LED.
- the shape of the yellow phosphor ink coating unit may also be other shapes, such as triangle, diamond, and hexagon.
- the use of the backlight module light source component in the backlight module of the present disclosure can solve the problems of uneven color development and uneven brightness of the blue LED of the backlight module with a small OD value directly above the backlight module, greatly improving the display quality of the product.
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- Crystallography & Structural Chemistry (AREA)
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Abstract
一种背光模组光源组件,包括PCB板(10)及设置于PCB板(10)上的LED(40);设置LED光源的PCB板(10)表面设置有白色阻焊层(20),在白色阻焊层(20)上设置有以LED(40)为中心向外扩散的黄色荧光粉油墨涂层单元(30)。背光模组光源组件采用在背光源LED(40)所处PCB板(10)表面设置荧光粉黄色油墨涂层,通过荧光粉黄色油墨涂层实现对LED光源进行反射、折射或漫反射,再通过荧光粉油墨和PCB板(10)上白色阻焊层(20)所占面积比例进行优化设计搭配让LED光源的光达到最佳的反射、折射或漫反射,有效改善背光源LED(40)正上方颜色显色不均匀和亮度明暗不均匀的问题。
Description
本公开涉及液晶显示背光技术,尤其涉及一种背光模组光源组件。
目前,随着液晶显示技术的不断发展,消费者群体对于显示画质的品味要求越来越高,量子点配合Local Dimming调光显示技术已经成为改善画质显示主要方向,量子点配合Local Dimming技术是采用小OD值(光源至扩散板混光距离值小于10mm)的蓝光直下式背光搭配量子膜等相关光学膜片实现。由于LED发光角度有限,其LED发光光强分布集中在LED的正上方,在使用白光LED光源时,LED正上方的光强过强会导致显示亮度明暗不均,还会存在颜色上的色差变化差异,即LED正上方偏蓝,在外围以圆环的方式往外扩散并依次减弱,通过对LED透镜的优化设计调整仅能够改变其光强分布的强弱,并无法改善其画质品味偏蓝的问题。现有技术采用了带黄色颜料的涂料进行调整优化,但是,黄色颜料对其蓝光的吸收有限,无法彻底有效的将蓝光吸收,如果黄色颜料太多,视觉效果品味会偏黄,如果黄色颜料太少,视觉效果仍旧会偏蓝,以致视觉效果品味改善不佳。
因此,现有技术还有待于改进和发展。
发明内容
鉴于上述现有技术的不足之处,本公开为解决现有技术的缺陷和不足,提出一种改善背光模组LED正上方颜色显示和亮度明暗不均匀的背光模组光源组件。
本公开解决技术问题所采用的技术方案如下:
一种背光模组光源组件,包括PCB板及设置于PCB板上的LED;设置LED光源的PCB板表面设置有白色阻焊层,在白色阻焊层上设置有以LED为中心向外扩散的黄 色荧光粉油墨涂层单元
作为一种改进的技术方案,其中,所述黄色荧光粉油墨涂层单元采用以LED为中心由内向外周缘、密度由密向疏渐变方式分布。
作为一种改进的技术方案,上述黄色荧光粉油墨涂层单元为圆形矩形或圆环形。
作为一种改进的技术方案,上述黄色荧光粉油墨涂层单元为椭圆、菱形、三角形或六边形。
作为一种改进的技术方案,所述黄色荧光粉油墨涂层单元的油墨涂层厚度为8μm至20μm。
作为一种改进的技术方案,所述黄色荧光粉油墨涂层单元在所述PCB板上的面积占比为5%至45%。
作为一种改进的技术方案,所述黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨和橡胶类油墨。
作为一种改进的技术方案,所述黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨。
作为一种改进的技术方案,所述黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、橡胶类油墨。
作为一种改进的技术方案,上述丙烯酸类油墨优选环氧丙烯酸油墨,为黄色荧光粉环氧丙烯酸油墨。
作为一种改进的技术方案,所述黄色荧光粉环氧丙烯酸油墨的质量百分比为环氧丙烯酸酯树脂70%~90%、无机填料2%~10%、稀释剂8%~25%、黄色荧光粉5%~25%。
作为一种改进的技术方案,所述聚氨酯类油墨优选聚氨酯丙烯酸油墨,为黄色荧光粉聚氨酯丙烯酸油墨。
作为一种改进的技术方案,所述黄色荧光粉聚氨酯丙烯酸油墨的质量百分比为聚氨酯丙烯酸树脂50%~70%、无机填料6%~20%、稀释剂8%~25%、黄色荧光粉5%~25%。
与现有技术仅在背光源LED上方采用透镜来对LED的光强强度进行改善相比较,本公开提供的背光模组光源组件采用在背光源LED所处PCB板表面设置荧光粉黄色油 墨涂层,通过该荧光粉黄色油墨涂层实现对LED光源进行反射、折射或漫反射,再通过荧光粉油墨和PCB板上白色阻焊层所占面积比例进行优化设计搭配让LED光源的光达到最佳的反射、折射或漫反射,有效改善背光源LED正上方颜色显色不均匀和亮度明暗不均匀的问题。
图1是本公开背光模组光源组件优选实施例一的结构原理示意图。
图1-2是图1中A部结构的放大示意图。
图2-1是本公开背光模组光源组件优选实施例二的结构原理示意图。
图2-2是图2-1中B部结构的放大示意图。
图3-1是本公开背光模组光源组件优选实施例三的结构原理示意图。
图3-2是图3-1中C部结构的放大示意图。
图4-1是本公开背光模组光源组件优选实施例四的结构原理示意图。
图4-2是图4-1中D部结构的放大示意图。
为使本公开的目的、技术方案及优点更加清楚、明确,以下参照附图并举实施例对本公开进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本公开,并不用于限定本公开。
在液晶显示技术领域,背光模组的出光效果根本上决定了液晶显示装置的显示效果,量子点技术的使用成为改善画质的主要发展方向。当背光模组中的LED光源采用蓝光光源时,LED光源的正上方会存在颜色上的差别,即LED正上方偏蓝,偏蓝的光线以该LED为中心向外以圆环方式扩散并逐步减弱形成光晕,造成显示亮度不均匀的现象,本公开为了进一步改善液晶显示背光模组中光源出光形成的上述光晕现象,提出了一种新型背光模组光源组件,能够有效将LED光源出射的蓝光吸收,改善液晶显示装置的视效效果。
实施例一:
图1所示为本公开背光模组光源组件优选实施例一的结构原理示意图,图1-2所述为图1中A部的放大示意图,如图1和图1-2所示,该背光模组光源组件包括PCB板10及设置于PCB板10上的LED40。因本公开仅对背光模组中光源组件的部分进行改进,图仅示出PCB板及其表面的结构。设置LED光源的PCB板10表面设置有白色阻焊层20,在白色阻焊层20上设置有若干以LED40为中心向外扩散的黄色荧光粉油墨涂层单元30,围绕LED40扩散的黄色荧光粉油墨涂层单元30的具体结构参见图1-2,从图1-2的围绕LED扩散的黄色荧光粉油墨涂层单元的放大结构可见,所述黄色荧光粉油墨涂层单元30采用以LED40为中心由内向外周缘、密度由密向疏渐变方式分布。图1-2中所示为本公开优选实施例一中黄色荧光粉油墨涂层单元30的形状为圆形,黄色荧光粉油墨涂层单元30的油墨涂层厚度为8μm至20μm,黄色荧光粉油墨涂层单元在所述PCB板上的面积占比为5%至45%。
对于黄色荧光粉油墨的材料而言,本公开中黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨和/或橡胶类油墨。其中,当采用丙烯酸类油墨材料时,所述丙烯酸类油墨优选环氧丙烯酸油墨,为黄色荧光粉环氧丙烯酸油墨,其质量百分比为环氧丙烯酸酯树脂70%~90%、无机填料2%~10%、稀释剂8%~25%、黄色荧光粉5%~25%。当采用聚氨酯类油墨时,所述聚氨酯类油墨优选聚氨酯丙烯酸油墨,为黄色荧光粉聚氨酯丙烯酸油墨,其质量百分比为聚氨酯丙烯酸树脂50%~70%、无机填料6%~20%、稀释剂8%~25%、黄色荧光粉5%~25%。
本公开利用荧光粉具有将蓝光转换为白光的特性,将LED40上方过多的蓝光转成白光,再通过荧光粉油墨和白色阻焊所占面积比例进行优化设计将LED出射光达到最佳的反射、折射或漫反射的效果,有效改善背光显示LED正上方颜色显色不均匀和亮度明暗不均的问题。
实施例二:
图2-1所示为本公开背光模组光源组件优选实施例一的结构原理示意图,图2-2所述为图2-1中B部的放大示意图,如图2-1和图2-2所示,该背光模组光源组件包括PCB 板10及设置于PCB板10上的LED40。因本公开仅对背光模组中光源组件的部分进行改进,图仅示出PCB板及其表面的结构。设置LED光源的PCB板10表面设置有白色阻焊层20,在白色阻焊层20上设置有以LED40为中心向外扩散的黄色荧光粉油墨涂层单元30,围绕LED40扩散的黄色荧光粉油墨涂层单元30的具体结构参见图2-2,从图2-2的围绕LED扩散的黄色荧光粉油墨涂层单元的放大结构可见,所述黄色荧光粉油墨涂层单元30采用以LED40为中心由内向外周缘、密度由密向疏渐变方式分布。与上述优选实施例一不同的是,图2-2中所示本公开优选实施例二中黄色荧光粉油墨涂层单元30的形状为矩形,黄色荧光粉油墨涂层单元30的油墨涂层厚度为8μm至20μm,黄色荧光粉油墨涂层单元在所述PCB板上的面积占比为5%至45%。
对于黄色荧光粉油墨的材料而言,本公开中黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨和/或橡胶类油墨。其中,当采用丙烯酸类油墨材料时,所述丙烯酸类油墨优选环氧丙烯酸油墨,为黄色荧光粉环氧丙烯酸油墨,其质量百分比为环氧丙烯酸酯树脂70%~90%、无机填料2%~10%、稀释剂8%~25%、黄色荧光粉5%~25%。当采用聚氨酯类油墨时,所述聚氨酯类油墨优选聚氨酯丙烯酸油墨,为黄色荧光粉聚氨酯丙烯酸油墨,其质量百分比为聚氨酯丙烯酸树脂50%~70%、无机填料6%~20%、稀释剂8%~25%、黄色荧光粉5%~25%。
本公开利用荧光粉具有将蓝光转换为白光的特性,将LED40上方过多的蓝光转成白光,再通过荧光粉油墨和白色阻焊所占面积比例进行优化设计将LED出射光达到最佳的反射、折射或漫反射的效果,有效改善背光显示LED正上方颜色显色不均匀和亮度明暗不均的问题。
实施例三:
图3-1所示为本公开背光模组光源组件优选实施例一的结构原理示意图,图3-2所述为图3-1中C部的放大示意图,如图3-1和图3-2所示,该背光模组光源组件包括PCB板10及设置于PCB板10上的LED40。因本公开仅对背光模组中光源组件的部分进行改进,图仅示出PCB板及其表面的结构。设置LED光源的PCB板10表面设置有白色阻焊层20,在白色阻焊层20上设置有以LED40为中心向外扩散的黄色荧光粉油墨涂层 单元30,围绕LED40扩散的黄色荧光粉油墨涂层单元30的具体结构参见图3-2,从图3-2的围绕LED扩散的黄色荧光粉油墨涂层单元的放大结构可见,所述黄色荧光粉油墨涂层单元30采用以LED40为中心由内向外周缘、密度由密向疏渐变方式分布。与上述优选实施例一、二不同的是,图3-2中所示本公开优选实施例三中黄色荧光粉油墨涂层单元30的形状为圆环形状,黄色荧光粉油墨涂层单元30的油墨涂层厚度为8μm至20μm,黄色荧光粉油墨涂层单元在所述PCB板上的面积占比为5%至45%。
对于黄色荧光粉油墨的材料而言,本公开中黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨和/或橡胶类油墨。其中,当采用丙烯酸类油墨材料时,所述丙烯酸类油墨优选环氧丙烯酸油墨,为黄色荧光粉环氧丙烯酸油墨,其质量百分比为环氧丙烯酸酯树脂70%~90%、无机填料2%~10%、稀释剂8%~25%、黄色荧光粉5%~25%。当采用聚氨酯类油墨时,所述聚氨酯类油墨优选聚氨酯丙烯酸油墨,为黄色荧光粉聚氨酯丙烯酸油墨,其质量百分比为聚氨酯丙烯酸树脂50%~70%、无机填料6%~20%、稀释剂8%~25%、黄色荧光粉5%~25%。
本公开利用荧光粉具有将蓝光转换为白光的特性,将LED40上方过多的蓝光转成白光,再通过荧光粉油墨和白色阻焊所占面积比例进行优化设计将LED出射光达到最佳的反射、折射或漫反射的效果,有效改善背光显示LED正上方颜色显色不均匀和亮度明暗不均的问题。
优选实施例四:
图4-1所示为本公开背光模组光源组件优选实施例一的结构原理示意图,图4-2所述为图4-1中D部的放大示意图,如图4-1和图4-2所示,该背光模组光源组件包括PCB板10及设置于PCB板10上的LED40。因本公开仅对背光模组中光源组件的部分进行改进,图仅示出PCB板及其表面的结构。设置LED光源的PCB板10表面设置有白色阻焊层20,在白色阻焊层20上设置有以LED40为中心向外扩散的黄色荧光粉油墨涂层单元30,围绕LED40扩散的黄色荧光粉油墨涂层单元30的具体结构参见图4-2,从图4-2的围绕LED扩散的黄色荧光粉油墨涂层单元的放大结构可见,所述黄色荧光粉油墨涂层单元30采用以LED40为中心由内向外周缘、密度由密向疏渐变方式分布。与上述 本公开优选实施例一、二、三不同的是,图4-2中所示本公开优选实施例四中黄色荧光粉油墨涂层单元30的形状为围绕LED的圆环形状,黄色荧光粉油墨涂层单元30的油墨涂层厚度为8μm至20μm,黄色荧光粉油墨涂层单元在所述PCB板上的面积占比为5%至45%。
对于黄色荧光粉油墨的材料而言,本公开中黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨和/或橡胶类油墨。其中,当采用丙烯酸类油墨材料时,所述丙烯酸类油墨优选环氧丙烯酸油墨,为黄色荧光粉环氧丙烯酸油墨,其质量百分比为环氧丙烯酸酯树脂70%~90%、无机填料2%~10%、稀释剂8%~25%、黄色荧光粉5%~25%。当采用聚氨酯类油墨时,所述聚氨酯类油墨优选聚氨酯丙烯酸油墨,为黄色荧光粉聚氨酯丙烯酸油墨,其质量百分比为聚氨酯丙烯酸树脂50%~70%、无机填料6%~20%、稀释剂8%~25%、黄色荧光粉5%~25%。
本公开利用荧光粉具有将蓝光转换为白光的特性,将LED40上方过多的蓝光转成白光,再通过荧光粉油墨和白色阻焊所占面积比例进行优化设计将LED出射光达到最佳的反射、折射或漫反射的效果,有效改善背光显示LED正上方颜色显色不均匀和亮度明暗不均的问题。
以上是本公开四个优选实施例,在上述四个优选实施例的基础上,其黄色荧光粉油墨涂层单元的形状还可以是其他形状,比如,三角形、菱形、六边形均可以。本公开背光模组光源组件的在背光模组中的使用可以解决小OD值背光模组蓝光LED正上方颜色显色不均匀和亮度明暗不均的问题,大大提升产品的显示画质。
应当理解的是,以上所述仅为本公开的较佳实施例而已,并不足以限制本公开的技术方案,对本领域普通技术人员来说,在本公开的精神和原则之内,可以根据上述说明加以增减、替换、变换或改进,而所有这些增减、替换、变换或改进后的技术方案,都应属于本公开所附权利要求的保护范围。
Claims (14)
- 一种背光模组光源组件,其特征在于,包括PCB板及设置于PCB板上的LED;设置LED光源的PCB板表面设置有白色阻焊层,在白色阻焊层上设置有若干以LED为中心向外扩散的黄色荧光粉油墨涂层单元。
- 根据权利要求1所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元采用以LED为中心由内向外周缘、密度由密向疏渐变方式分布。
- 根据权利要求2所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元为圆形、矩形或圆环形。
- 根据权利要求2所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元为椭圆形、菱形、三角形或六边形。
- 根据权利要求1所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元的油墨涂层厚度为8μm至20μm。
- 根据权利要求2所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元的油墨涂层厚度为8μm至20μm。
- 根据权利要求1所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元在所述PCB板上的面积占比为5%至45%。
- 根据权利要求2所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元在所述PCB板上的面积占比为5%至45%。
- 根据权利要求7或8所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨和橡胶类油墨。
- 根据权利要求7或8所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、乙烯酸类油墨。11.根据权利要求7或8所述的背光模组光源组件,其特征在于,所述黄色荧光粉油墨涂层单元中油墨为丙烯酸类油墨、环氧树脂类油墨、聚氨酯类油墨、聚酯类油墨、橡胶类油墨。
- 根据权利要求11所述的背光模组光源组件,其特征在于,所述丙烯酸类油墨 为黄色荧光粉环氧丙烯酸油墨。
- 根据权利要求12所述的背光模组光源组件,其特征在于,所述黄色荧光粉环氧丙烯酸油墨的质量百分比为环氧丙烯酸酯树脂70%~90%、无机填料2%~10%、稀释剂8%~25%、黄色荧光粉5%~25%。
- 根据权利要求11所述的背光模组光源组件,其特征在于,所述聚氨酯类油墨为黄色荧光粉聚氨酯丙烯酸油墨。
- 根据权利要求14所述的背光模组光源组件,其特征在于,所述黄色荧光粉聚氨酯丙烯酸油墨的质量百分比为聚氨酯丙烯酸树脂50%~70%、无机填料6%~20%、稀释剂8%~25%、黄色荧光粉5%~25%。
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