WO2020101881A1

WO2020101881A1 - Connector interface assembly

Info

Publication number: WO2020101881A1
Application number: PCT/US2019/058501
Authority: WO
Inventors: Valentin DE LA FUENTE
Original assignee: Google Llc
Priority date: 2018-11-14
Filing date: 2019-10-29
Publication date: 2020-05-22

Abstract

In a general aspect, an apparatus can include a grounding shell having a lumen defined therethrough. The lumen can be aligned along an axis and configured to receive a connector plug receptacle from a first side of the apparatus. The apparatus can also include a trim ring having a lumen defined therethrough. The lumen of the trim ring can be aligned along the axis and configured to receive a connector plug corresponding with the connector plug receptacle from a second side of the apparatus. The second side can be opposite the first side. The apparatus can further include a mounting plate configured to couple the apparatus with at least one of a circuit board or a housing of an electronic device. The grounding shell, the trim ring and the mounting plate can be monolithically integrated.

Description

CONNECTOR INTERFACE ASSEMBLY

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application claims priority to, and the benefit of, U.S. Provisional Application No. 62/767,110, filed on November 14, 2018, which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

[0002] This document relates, generally, to connector interfaces. More specifically, this document relates to apparatus and systems that include a connector interface having an integrated (monolithic) grounding shell, trim ring and mounting plate.

BACKGROUND

[0003] Electronic devices, such as laptop computers, tablet computers, netbook computers, etc., can include one or more input/output (I/O) interfaces. Such I/O interfaces can include a circuit board that includes I/O circuity of the electronic device, and an I/O connector assembly for connecting external devices to the I/O circuitry (e.g., using a plug and/or cable, etc.). Current implementations of I/O connector assemblies include a connector plug receptacle (e.g., a USB-C female plug receptacle, etc.) and a grounding shell. The grounding shell is electrically coupled with a circuit board of the I/O interface. The connector plug receptacle is held in place in the grounding shell using a structural bracket that is coupled to the circuit board of the I/O interface and/or to a housing of an associated electronic device in which the I/O interface is implemented. Such I/O connectors also include a compressible foam material (e.g. a conductive foam material) that is disposed between the connector plug receptacle and the structural bracket, to fill space (e.g., take up tolerances, etc.) between the connector plug receptacle and the structural bracket. Current I/O connectors (e.g., USB-C connectors) also include a trim ring that is disposed in a housing of the electronic device, where the trim ring can align a plug of an I/O interface cable (e.g., a male USB-C plug) with the connector plug of the I/O interface (e.g., a USB-C female plug receptacle), as well as protect the housing from damage to the housing from I/O interface (e.g., male) cable plugs. Current implementations of I/O connector assemblies have certain drawbacks, such as susceptibility to mechanical (and associated electrical) failure, as well as complexity of assembly. SUMMARY

[0004] In a general aspect, an apparatus can include a grounding shell having a lumen defined therethrough. The lumen can be aligned along an axis and configured to receive a connector plug receptacle from a first side of the apparatus. The apparatus can also include a trim ring having a lumen defined therethrough. The lumen of the trim ring can be aligned along the axis and configured to receive a connector plug corresponding with the connector plug receptacle from a second side of the apparatus. The second side can be opposite the first side. The apparatus can further include a mounting plate configured to couple the apparatus with at least one of a circuit board or a housing of an electronic device. The grounding shell, the trim ring and the mounting plate can be monolithically integrated. In a further general aspect, an electronic device can include a housing and an input/output (I/O) interface circuit board disposed within the housing. The electronic device can also include an I/O connector assembly operationally coupled with the I/O interface circuit board, the I/O connector assembly including an apparatus according to the first general aspect.

BRIEF DESCRIPTION OF DRAWINGS

[0005] FIG. 1 is a block diagram schematically illustrating an electronic device, according to an implementation.

[0006] FIG. 2 is a diagram illustrating an isometric view of a monolithically integrated grounding shell, trim ring and mounting plate apparatus for an input/output (I/O) connector assembly, according to an implementation.

[0007] FIG. 3 is a diagram schematically illustrating an isometric view of a section of an electronic device including the apparatus of FIG. 2, according to an implementation.

[0008] FIG. 4 is a diagram illustrating an exploded, isometric view of a section of an electronic device including the apparatus of FIG. 2, according to an implementation.

[0009] FIG. 5 is a diagram illustrating an isometric view of a section of an electronic device including the apparatus of FIG. 2, according to an implementation.

[0010] FIG. 6 is a diagram illustrating an isometric, cross-sectional view of the electronic device of FIG. 5, according to an implementation.

[0011 ] In the drawings, which are not necessarily drawn to scale, like reference symbols may indicate like and/or similar components (elements, structures, etc.) in different views. The drawings illustrate generally, by way of example, but not by way of limitation, various implementations discussed in the present disclosure. Reference symbols shown in one drawing may not be repeated for the same, and/or similar elements in related views. Reference symbols that are repeated in multiple drawings may not be specifically discussed with respect to each of those drawings, but are provided for context between related views. Also, not all like elements in the drawings are specifically referenced with a reference symbol when multiple instances of an element are illustrated.

DETAILED DESCRIPTION

[0012] FIG. 1 is block diagram schematically illustrating an electronic device 5, in accordance with an implementation. In some implementations, the device 5 can be a laptop computer, a netbook computer, a tablet computer, etc. As shown in FIG. 1, the device 5 can include an input/output (I/O) interface 10, which can be implemented, e.g., on a printed circuit board. The device 5 also includes a housing 20, where various elements of the device 5, such as the I/O interface 10, are included in (disposed in, implemented in, etc.) the housing 20. The elements of device 5 shown in FIG. 1 are given by way of example, and for purposes of illustration. Depending on the particular implementation, an electronic device, such as the device 5, can include additional, fewer and/or other elements than those shown in FIG. 1. In the example of FIG. 1, the device 5 further includes a processor 12 (such as a

microprocessor), memory 14 (such as volatile and/or non-volatile memory), a display 16 and input devices 18 (such as a keyboard and/or a pointing device). In some implementations, the display 16 can be a touchscreen display that also operates as input device of the input devices 18.

[0013] As shown in FIG. 1, the I/O interface 10 can include a monolithically integrated grounding shell, trim ring and mounting plate apparatus 100 that is included in an I/O connector assembly of the I/O interface 10 and the device 5. In this example, the apparatus 100 includes a grounding shell 110, a trim ring 120 and a mounting plate 130, where the grounding shell 110, the trim ring 120 and the mounting plate 130 are

monolithically integrated. In FIG. 1, dashed lines are shown to delineate, by way of example, the various portions of the apparatus (e.g., the grounding shell 110, the trim ring 120 and the mounting plate 130). In the example of FIG. 1, the mounting plate 130 can extend from the grounding shell 110. In some implementations, a portion of the mounting plate 130 (e.g., a central portion of the mounting plate 130) can be monolithically integrated with the grounding shell 110 and/or the trim ring 120.

[0014] Implementations of the apparatus 100, examples of which are described below with respect to FIGs. 2-6, can provide improved structural (mechanical) integrity, as compared to current implementations, such as those described above. Accordingly, the apparatus 100, as compared to current implementations, can reduce incidences of mechanical failures (and associated electrical failures) associated with a corresponding I/O interface, such as due to drop events, or mechanical shock to the electronic device (e.g., via a plug coupled with the I/O interface 10).

[0015] Further, as shown in FIG. 1, a plug receptacle 150 (e.g., a grounding shroud of a USB-C female plug receptacle) can be disposed within (e.g., laser welded to, laser welded directly to, coupled with, etc.) the grounding shell 110 of the apparatus 100. Such an arrangement can allow for eliminating the use of conductive foam to take up any tolerance variance between the grounding shell 110 and the plug receptacle 150, and eliminate the use of separate mounting brackets and trim rings (as well as further improve mechanical integrity).

[0016] In some implementations, such as in the device 5 shown in FIG. 1, a portion of the trim ring 120 of the apparatus 100 can extend through the housing 20 of the device 5 (e.g., through an aperture in the housing 20), such that a portion of the trim ring 120 is disposed outside the housing 20. In such an arrangement, the portion of the trim ring 120 that is disposed outside the housing 20 can protect the housing 20 from damage, e.g., from I/O connector plugs, when being inserted into the trim ring 20 (e.g., to connect with the I/O interface 10) and not properly aligned with a lumen of the trim ring 120.

[0017] FIG. 2 is a diagram illustrating an isometric view of a monolithically integrated grounding shell, trim ring and mounting plate apparatus 200 for an input/output (I/O) connector assembly, according to an implementation. For purposes of illustration, portions of the apparatus 200 (e.g., external structure of the apparatus 200) are illustrated as being transparent in FIG. 2, so that internal structure of the apparatus 200 is visible in the drawing.

[0018] In some implementations, the apparatus 200 can be included in an I/O interface in an electronic device, such as a laptop computer, a netbook computer, a tablet computer, etc. For purposes of illustration, the apparatus 200 is described and illustrated herein in conjunction with a Universal Serial Bus (USB) Type-C (USB-C) I/O interface. It will be appreciated, however, that a monolithically integrated grounding shell, trim ring and mounting plate apparatus, such as the apparatus 200, can be included in a number of different I/O interfaces, e.g., other types of USB interfaces, a High Definition Multimedia Interface (HDMI) interface, etc.

[0019] As shown in FIG. 2, the apparatus 200 includes a grounding shell 210, a trim ring 220 and a mounting plate 230, where the grounding shell 210, the trim ring 220 and the mounting plate 230 are monolithically integrated. As noted above with respect to the apparatus 100 of FIG. 1, the apparatus 200 can provide improved structural (mechanical) integrity, as compared to current implementations, such as those described above.

Accordingly, the apparatus 200, as compared to current implementations, can reduce incidences of mechanical failures (and associated electrical failures) associated with a corresponding I/O interface, such as due to drop events, or mechanical shock to the electronic device (e.g., via a plug coupled with an associated I/O interface).

[0020] Further, the apparatus 200 can reduce overall cost of an I/O interface, as compared to current approaches, as use of the apparatus 200 (e.g., as a monolithically integrated apparatus) can reduce manufacturing complexity (and cost). For instance, a plug receptacle 250 (e.g., a grounding shroud of a USB-C female plug receptacle) can be laser welded to (directly to) the grounding shell 210 of the apparatus 200 which can allow for eliminating the use of conductive foam to take up any tolerance variance between the grounding shell 210 and the plug receptacle 250, and eliminate the use of separate mounting brackets and trim rings (as well as further improve mechanical integrity).

[0021] In some implementations, the apparatus 200 can be formed of high grade stainless steel, or other electrically conductive material. In some implementations, the apparatus 200 can be formed using metal injection molding, milling and/or machining processes. For instance, the apparatus 200 can be formed, at least in part, using a computer numeric control (CNC) machine (e.g., a CNC mill, a CNC router, etc.). In some

implementations, the apparatus can be formed, at least in part, using a die process, using a stamping process, and/or using other appropriate metal fabrication processes.

[0022] As shown in FIG. 2, the grounding shell 210 can have a lumen defined therethrough. Said another way, the grounding shell 210 can define a lumen that extends through the grounding shell 210. The lumen of the grounding shell 210 can be aligned along an axis L, as shown in FIG. 2. In the apparatus 200, the grounding shell 210 is configured to receive the connector plug receptacle 250 (e.g., a USB-C female plug receptacle) from a first side of the apparatus 200 (e.g., a back side in FIG. 2). That is, the receptacle 250 can be disposed, at least in part, in the lumen of the grounding shell 210.

[0023] As shown in FIG. 2, the trim ring 220 of the apparatus 200 can also have a lumen defined therethrough. Said another way, the trim ring 220 can define a lumen that extends through the trim ring 220. In the apparatus 200, the lumen of the trim ring 220 can be aligned along the axis L (e.g., along the same axis as the lumen of the grounding shell 210). Further, the trim ring 220 can be configured to receive (via its lumen) a connector plug (e.g., a USB-C male plug) corresponding with the connector plug receptacle 250 (e.g., the USB-C female plug receptacle) from a second side of the apparatus (e.g., a front side in FIG. 2). That is, in some implementations, the second side of the apparatus 200 can be opposite the first side of the apparatus 200. In some implementations, the lumen of the trim ring 220 can be further configured to align an inserted connector plug with the plug receptacle 250.

[0024] In the example apparatus 200 of FIG. 2, the lumen of the grounding shell 210 and the lumen of the trim ring 220 are concentric and fluidically connected. In other words, the lumen of the grounding shell 210 and the lumen of the trim ring 220 are concentrically aligned with one another and, collectively, form (define, etc.) a lumen that extends through the apparatus 200 (e.g., from the first side of the apparatus 200 to the second side of the apparatus 200). In some implementations, an inner diameter D1 of the lumen of the trim ring 220 can be less than an inner diameter D2 of the grounding shell 110, such that the trim ring 220 defines a mechanical stop 225 for the connector plug receptacle 250 when inserted into the lumen of the grounding shell 210 from the first side of the apparatus 200.

[0025] As shown in FIG. 2, the mounting plate 230 can extend from the grounding shell 210 and have through holes 232 and 234 defined therein. In some implementations, the mounting plate 230 can be configured to couple the apparatus 200 with at least one of a circuit board (e.g., a circuit board for an I/O interface), and/or with a housing of an electronic device, such as a laptop computer, a netbook computer, a tablet computer, etc. For instance, the apparatus 200 can be coupled with a circuit board and/or an electronic device housing using screws that are inserted in the through holes 232 and 234, and then threaded into the circuit board and/or the electronic device housing (e.g., using threaded holes defined in the circuit board and or the housing), such as in the examples shown in FIGs. 4, 5 and 6. In some implementations, such as the example of FIG. 2, the mounting plate 230 can be arranged along a plane, such as the plane defined by the axes X and Y in FIG. 2. In some

implementations, the plane of the mounting plate 230 can be parallel with the axis L along which the respective lumens of the grounding shell 210 and the trim ring 220 are defined.

[0026] FIG. 3 is a diagram schematically illustrating an isometric view of a section of an electronic device 300 including the apparatus 200 of FIG. 2, according to an

implementation. In some implementations, the electronic device 300 can be a laptop computer, a netbook computer, a tablet computer, etc. As shown in FIG. 3, the electronic device 300 includes a circuit board 310 (e.g., a circuit board implementing an I/O interface, such as a USB-C interface), a housing 320 (e.g., a structural shell), and a I/O connector plug receptacle 350 disposed, at least in part, in the apparatus 200 (e.g., in a lumen of the grounding shell of the apparatus 200), such as was discussed above with respect to FIG. 2. In FIG. 3, the housing 320 is illustrated as being transparent, so as to illustrate the arrangement of the other (e.g., internal) elements of the device 300 within the housing 320. In the device 300, the circuit board 310 and the apparatus 200 (which can be laser welded to a shroud of the receptacle 350) are aligned within the housing 320, such as shown in FIG. 3.

[0027] In some implementations, such as in the device 300 (e.g., as was discussed above with respect to FIG. 1), the housing 320 can include an aperture 360, and the trim ring 220 of the apparatus 200 can extend through the aperture 360, such that a portion of the trim ring 220 is disposed outside the housing 320 (e.g., on an exterior surface of the housing 320). In such an arrangement, the portion of the trim ring 220 that is disposed outside the housing 320 can protect the housing 320 from damage, e.g., from I/O connector plugs, when being inserted into the trim ring 220 (e.g., to connect with the I/O interface circuit board 210) and not properly aligned with a lumen of the trim ring 220.

[0028] FIG. 4 is a diagram illustrating an exploded, isometric view of a section of an electronic device 400 including the apparatus 200 of FIG. 2, according to an implementation. As with the device 300, in some implementations, the device 400 can be a laptop computer, a netbook computer, a tablet computer, etc. As shown in the exploded view of FIG. 4, the electronic device 400 includes a circuit board 410 (e.g., a circuit board implementing an I/O interface, such as a USB-C interface), a housing 420 (e.g., a structural shell), and a I/O connector plug receptacle 450 disposed, at least in part, on the circuit board 410 (e.g., where the receptacle 450 can be inserted in a lumen of the grounding shell of the apparatus 200). In FIG. 4, the housing 430 is illustrated as being transparent, so as to illustrate the internal structure of the housing 420.

[0029] In the device 400, the circuit board 410 and the apparatus 200 (e.g., after laser welding the apparatus 200 to a shroud of the receptacle 450) can be coupled with (affixed to, attached to, etc.) the housing 420 using the screws 430 and 432, which can be inserted through respective through holes in the apparatus 200 (e.g., through holes 232 and 234 referenced in FIG. 2) and threaded into mounting holes 434 and 436 in the housing 420. As shown in FIG. 4, similar to the housing 320 and the aperture 360, the housing 420 can include an aperture 460, and the trim ring 220 of the apparatus 200 (e.g., when coupled with the housing 420) can extend through the aperture 460, such that a portion of the trim ring 220 is disposed outside the housing 420 (e.g., to protect the housing 420 from damage due to attempting to couple a misaligned plug with the device 400, such as to the circuit board 410 via the lumen of the trim ring 220). [0030] FIG.5 is a diagram illustrating an isometric view of a section of an electronic device 500 including the apparatus 200 of FIG. 2, according to an implementation. In some implementations, the electronic device 500 can be a laptop computer, a netbook computer, a tablet computer, etc. As shown in FIG. 5, the device 500 includes a circuit board 510 (e.g., a circuit board implementing an I/O interface, such as a USB-C interface), a housing 520 (e.g., a structural shell), and a I/O connector plug receptacle 550 disposed, at least in part, in the apparatus 200 (e.g., in a lumen of the grounding shell of the apparatus 200), such as was discussed above with respect to FIG. 2. In FIG. 5, as with the housing 320 of FIG. 3, the housing 520 is illustrated as being transparent, so as to illustrate the arrangement of the other elements of the device 500 within the housing 520. In the device 500, the circuit board 510 and the apparatus 200 (which can be laser welded to a shroud of the receptacle 550) are coupled within the housing 520 using screws 530 and 532.

[0031] As shown in FIG. 5, similar to the housing 320 and the aperture 360 in FIG. 3, the housing 520 can include an aperture 560, and the trim ring 220 of the apparatus 200 (e.g., when coupled with the housing 520) can extend through the aperture 560, such that a portion of the trim ring 220 is disposed outside the housing 520 (e.g., to protect the housing 520 from damage due to attempts to couple misaligned plugs with the device 500 (e.g., to the circuit board 510 via the lumen of the trim ring 220).

[0032] FIG. 6 is a diagram illustrating an isometric, cross-sectional view of the electronic device 500 of FIG. 5, according to an implementation. The cross-sectional view of the device 500 shown in FIG. 6 is taken along the section line 6-6 in FIG. 5. In the cross- sectional view of FIG. 6, the relationship of the lumens of the grounding shell 210 and the trim ring 220 of the apparatus 200 is illustrated. For instance, the mechanical stop 225 defined by the smaller diameter of the lumen of the trim ring 220 (as compared to the diameter of the lumen of the grounding shell) is shown. Further, the relationship of the receptacle 550 with the mechanical stop 225 is also shown. Further in FIG. 6, an example arrangement of (and relationship between) the circuit board 510, the housing 520, the receptacle 550 and the apparatus 200 is shown.

[0033] In a general aspect, an apparatus can include a grounding shell having a lumen defined therethrough. The lumen can be aligned along an axis and configured to receive a connector plug receptacle from a first side of the apparatus. The apparatus can also include a trim ring having a lumen defined therethrough. The lumen of the trim ring can be aligned along the axis and configured to receive a connector plug corresponding with the connector plug receptacle from a second side of the apparatus. The second side can be opposite the first side. The apparatus can further include a mounting plate configured to couple the apparatus with at least one of a circuit board or a housing of an electronic device. The grounding shell, the trim ring and the mounting plate can be monolithically integrated.

[0034] Implementations can include one of more of the following features. For example, the mounting plate can be aligned along a plane that is parallel to the axis. The mounting plate can include a plurality of through holes defined therein. Each of the plurality of through holes can be configured to receive a respective screw for coupling the apparatus to the at least one of the circuit board or the housing of the electronic device.

[0035] The grounding shell, the trim ring and the mounting plate can include stainless steel. The stainless steel can be injection molded stainless steel and/or machined stainless steel.

[0036] The apparatus can include a connector plug receptacle disposed, at least in part, within the lumen of the grounding shell. The grounding shell can be laser welded to a shroud of the connector plug receptacle.

[0037] The lumen of the trim ring and the lumen of the grounding shell can be concentric. An inner diameter of the lumen of the trim ring can be less than an inner diameter of the grounding shell, such that the trim ring defines a mechanical stop for the connector plug receptacle when inserted in the lumen of the grounding shell from the first side of the apparatus.

[0038] A number of embodiments have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the disclosure.

[0039] In addition, the logic flows depicted in the figures do not require the particular order shown, or sequential order, to achieve desirable results. In addition, other steps may be provided, or steps may be eliminated, from the described flows, and other components may be added to, or removed from, the described systems. Accordingly, other embodiments are within the scope of the following claims.

[0040] While certain features of the described implementations have been illustrated as described herein, many modifications, substitutions, changes and equivalents will now occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the scope of the implementations. It should be understood that they have been presented by way of example only, not limitation, and various changes in form and details may be made. Any portion of the apparatus and/or methods described herein may be combined in any combination, except mutually exclusive combinations. The implementations described herein can include various combinations and/or sub-combinations of the functions, components and/or features of the different implementations described.

Claims

WHAT IS CLAIMED IS:

1. An apparatus comprising:

a grounding shell having a lumen defined therethrough, the lumen being aligned along an axis and configured to receive a connector plug receptacle from a first side of the apparatus;

a trim ring having a lumen defined therethrough, the lumen of the trim ring being aligned along the axis and configured to receive a connector plug corresponding with the connector plug receptacle from a second side of the apparatus, the second side being opposite the first side; and

a mounting plate configured to couple the apparatus with at least one of a circuit board or a housing of an electronic device,

the grounding shell, the trim ring and the mounting plate being monolithically integrated.

2. The apparatus of claim 1, wherein the mounting plate is aligned along a plane that is parallel to the axis.

3. The apparatus of claim 1 or 2, wherein the mounting plate includes a plurality of through holes defined therein, each of the plurality of through holes being configured to receive a respective screw for coupling the apparatus to the at least one of the circuit board or the housing of the electronic device.

4. The apparatus of any of the preceding claims, wherein the grounding shell, the trim ring and the mounting plate include stainless steel.

5. The apparatus of claim 4, wherein the stainless steel is one of injection molded stainless steel or machined stainless steel.

6. The apparatus of any of the preceding claims, further comprising a connector plug receptacle disposed, at least in part, within the lumen of the grounding shell

7. The apparatus of claim 6, wherein the grounding shell is laser welded to a shroud of the connector plug receptacle.

8. The apparatus of any of the preceding claims, wherein:

the lumen of the trim ring and the lumen of the grounding shell are concentric; and an inner diameter of the lumen of the trim ring is less than an inner diameter of the grounding shell, such that the trim ring defines a mechanical stop for the connector plug receptacle when inserted in the lumen of the grounding shell from the first side of the apparatus.

9. An electronic device comprising:

a housing;

an input/output (I/O) interface circuit board disposed within the housing; and an I/O connector assembly operationally coupled with the I/O interface circuit board, the I/O connector assembly including:

a grounding shell having a lumen defined therethrough, the lumen being aligned along an axis and configured to receive a connector plug receptacle from a first side of the I/O connector assembly;

a trim ring having a lumen defined therethrough, the lumen of the trim ring being aligned along the axis and configured to receive a connector plug corresponding with the connector plug receptacle from a second side of the I/O connector assembly, the second side being opposite the first side; and

a mounting plate configured to mechanically couple the I/O connector assembly with at least one of the I/O interface circuit board or the housing, the grounding shell, the trim ring and the mounting plate being monolithically integrated.

10. The electronic device of claim 9, wherein the mounting plate is aligned along a plane that is parallel to the axis.

11. The electronic device of claim 9 or 10, wherein the mounting plate includes a plurality of through holes defined therein, each of the plurality of through holes being configured to receive a respective screw for coupling the apparatus to the at least one of the circuit board or the housing of the electronic device.

12. The electronic device of any of claims 9-11, wherein the grounding shell, the trim ring and the mounting plate include stainless steel.

13. The electronic device of any of claims 9-12, wherein the stainless steel is one of injection molded stainless steel or machined stainless steel.

14. The electronic device of any of claims 9-13, further comprising a connector plug receptacle disposed, at least in part, within the lumen of the grounding shell

15. The electronic device of claim 14, wherein the grounding shell is laser welded to a shroud of the connector plug receptacle.

16. The electronic device of any of claims 9-15, wherein:

17. The electronic device of any of claims 9-16, wherein the housing has an aperture defined therein, at least a portion of the trim ring extending through the aperture.

18. The electronic device of any of claims 9-17, wherein at least a portion of the trim ring is disposed outside the housing.

19. The electronic device of claim 18, wherein the at least a portion of the trim ring disposed outside the housing is disposed on an exterior surface of the housingA

20. The electronic device of any of claims 9-19, wherein the electronic device is one of a laptop computer, a netbook computer, or a table computer.