WO2020095635A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2020095635A1
WO2020095635A1 PCT/JP2019/040567 JP2019040567W WO2020095635A1 WO 2020095635 A1 WO2020095635 A1 WO 2020095635A1 JP 2019040567 W JP2019040567 W JP 2019040567W WO 2020095635 A1 WO2020095635 A1 WO 2020095635A1
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WO
WIPO (PCT)
Prior art keywords
electronic control
control device
groove
control unit
adhesive
Prior art date
Application number
PCT/JP2019/040567
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French (fr)
Japanese (ja)
Inventor
諒 秋葉
河合　義夫
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Priority to JP2020556717A priority Critical patent/JPWO2020095635A1/en
Publication of WO2020095635A1 publication Critical patent/WO2020095635A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • the present invention relates to an electronic control device.
  • a common method is to dispose an adhesive between the outer peripheral portions of the exterior members that are joined to each other.
  • the material strength of the adhesive is not more than 1/10 of that of the exterior member, and the adhesive is subjected to stress due to the difference in the thermal expansion coefficient and the thermal contraction rate between the exterior parts. There is a risk of damage when exposed to a wide temperature environment.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic control device capable of improving heat resistance.
  • an electronic control device including a circuit board on which electronic components are mounted, and a housing that houses the circuit board, wherein the housing is A first housing provided with a concave portion, and a second housing provided with a convex portion arranged in the concave portion via a sealing material, and at least one of the concave portion and the convex portion.
  • An inclined side surface was formed.
  • heat resistance can be improved.
  • FIG. 3 is an exploded perspective view of the electronic control device according to the first embodiment.
  • Explanatory drawing of stress distribution of an adhesive agent Explanatory drawing of the relationship between the thickness and the maximum stress of the adhesive agent which concerns on 4th Embodiment.
  • FIG. 1 is a perspective view of the electronic control device according to the first embodiment.
  • the electronic control unit A1 is mounted on an automobile by inserting bolts into fixing holes formed in the pair of brackets 11 to control an engine, a transmission, or a brake.
  • FIG. 2 is an exploded perspective view of the electronic control device according to the first embodiment.
  • the electronic control unit A1 includes a circuit board 5, a base 7 as an example of a “first housing”, and a cover 1 as an example of a “second housing”.
  • the connector 3 and the electronic component 4 are mounted on the circuit board 5.
  • the connector 3 electrically connects an electric circuit formed on the circuit board 5 and an external device.
  • the circuit board 5 is fixed to the base 7 by the screws 2.
  • the circuit board 5 may be fixed to the cover 1 with screws 2.
  • the base 7 has a bottomed tubular shape including a rectangular bottom surface and a frame portion provided upright along the outer periphery of the bottom surface.
  • the base 7 houses the circuit board 5.
  • a groove v1 as an example of a “recess” is formed at the tip of the frame portion of the base 7 over the entire circumference. That is, the groove v1 is formed along the outer periphery of the base 7.
  • the cover 1 has a bottomed tubular shape including a rectangular upper surface having an opening 12 formed therein and a frame portion provided upright along the outer periphery of the upper surface.
  • the cover 1 covers the circuit board 5 accommodated in the base 7 by inserting the connector 3 into the opening 12.
  • a protrusion w1 as an example of a “projection” is formed on the entire tip of the frame portion of the cover 1. That is, the protrusion w1 is formed along the outer periphery of the cover 1.
  • a liquid adhesive 6 as an example of a "sealing material” is applied and then cured, so that the cover 1 and the connector 3 are The packing 8 is arranged between them.
  • the adhesive is applied to the protrusion w1 and the groove v1 in this way, the adhesive area of the adhesive 6 is expanded, and the airtightness inside the electronic control unit A1 can be enhanced.
  • a plurality of electronic components may be mounted on the circuit board 5.
  • the groove v1 may be formed in the cover 1 and the protrusion w1 may be formed in the base 7.
  • FIG 3 is a perspective view and a cross-sectional view of a conventional electronic control device.
  • the groove v0 has the same width on the outer side surface c1 and the inner side surface c2 toward the bottom surface, and the protrusion w0 has the same thickness on the outer side surface d1 and the inner side surface d2 toward the tip.
  • the adhesive 6 of such a conventional electronic control unit B is sandwiched between the outer side surface c1 of the groove v0 and the outer side surface d1 of the protrusion w0. Therefore, when the adhesive 6 exposed to the high temperature environment tries to expand, a force g1 is generated on the outer side surface d1 of the projection w0 in a direction perpendicular to the outer side surface d1 and an inner side surface d2 of the projection w0. Force h1 is generated in the direction perpendicular to the inner side surface d2. At this time, the force g1 and the force h1 are equal in magnitude and opposite to each other. Therefore, the force g1 and the force h1 cancel each other out, and the protrusion w0 does not move.
  • a force j1 is generated on the outer side surface c1 of the groove v0 in a direction perpendicular to the outer side surface c1
  • a force k1 is generated on the inner side surface c2 of the groove v0 in a direction perpendicular to the inner side surface c2.
  • the force j1 and the force k1 are equal in magnitude and opposite to each other. Therefore, the force j1 and the force k1 cancel each other out, and the groove v0 does not move. As a result, the expansion of the adhesive 6 is blocked by the protrusion w0 and the groove v0, and a high stress is generated in the adhesive 6.
  • FIG. 4 is a perspective view and a sectional view of the electronic control device according to the first embodiment.
  • the electronic control unit A1 is different from the conventional electronic control unit B in FIG. 3 in that the inclined inner side surface e1 is formed over the half circumference of the groove v1 and the inclined outer side surface f1 is formed over the half circumference of the protrusion w1. There is.
  • the inclined inner side surface e1 is inclined inward by ⁇ 1 with respect to the outer inner side surface c1 perpendicular to the circuit board 5. That is, the groove v1 is formed with the inclined inner side surface e1 in which the width of the groove v1 is reduced toward the bottom surface.
  • the inclined inner side surface e1 and the inclined outer side surface f1 are arranged so as to face each other with the adhesive 6.
  • a force n1 is generated in a direction perpendicular to the inclined inner side surface e1
  • a force k1 is generated in a direction perpendicular to the outer inner side surface c1. Occur.
  • the groove v1 moves in the direction of the force q1 (the direction away from the protrusion w1), which is the sum of these forces n1 and k1.
  • the expansion of the adhesive 6 is allowed only by the movement range of the projection w1 and the groove v1 (range separated from each other), and therefore, compared with the structure of the conventional electronic control unit B of FIG.
  • the stress generated in the adhesive 6 is reduced.
  • the gap (clearance) x1 between the outer side surface d1 of the protrusion w1 and the outer side surface c1 of the groove v1 and the gap y1 between the inclined outer side surface f1 of the protrusion w1 and the inclined inner side surface e1 of the groove v1 are as shown in FIG. Is equal to the gaps x1 and y1 in the conventional electronic control unit B.
  • the electronic control unit A2 according to the second embodiment will be described.
  • the electronic control device A2 according to the second embodiment is different from the electronic control device A1 according to the first embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device according to the first embodiment. It is the same as the control device A1. Therefore, the differences from the first embodiment will be mainly described.
  • FIG. 5 is a perspective view and a cross-sectional view of the electronic control device according to the second embodiment.
  • the inclined inner side surface e1 is formed in the groove v1 on one side (left side in FIG. 5) of the circuit board 5, and the groove v2 on the other side (right side in FIG. 5) of the circuit board 5 is formed.
  • An inclined inner side surface e2 is formed on the other side.
  • the inclined inner side surface e2 is inclined outward by ⁇ 3 with respect to the inner side surface c2 perpendicular to the circuit board 5.
  • the outer side surface f2 is formed.
  • the electronic control unit A3 according to the third embodiment will be described.
  • the electronic control device A3 according to the third embodiment is different from the electronic control device A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A2 according to the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
  • FIG. 6 is a perspective view and a sectional view of the electronic control device according to the third embodiment.
  • the inclined inner side surface e1 is formed in the groove v1 on one side (left side in FIG. 6) of the circuit board 5 and the groove v3 on the other side (right side in FIG. 6) of the circuit board 5 is formed.
  • An inclined inner side surface e3 is formed on one side.
  • the inclined inner side surface e3 of the groove v3 is inclined inward by ⁇ 5 with respect to the outer inner side surface c3 perpendicular to the circuit board 5.
  • a slanted outer surface f3 that is slanted inward by ⁇ 6 with respect to the outer outer surface d3 is formed in a portion w3 (hereinafter, the projection w3) of the projection w1 that faces the outer inner surface e3.
  • the electronic control device A4 according to the fourth embodiment will be described.
  • the electronic control device A4 according to the fourth embodiment is different from the electronic control device A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A2 according to the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
  • FIG. 7 is a perspective view and a sectional view of the electronic control device according to the fourth embodiment.
  • the gap x4 between the outer side surface d4 of the projection w4 and the inner side surface c4 of the groove v4 is larger than the gap y4 between the slanted outer side surface f4 of the projection w4 and the slanted inner side surface e4 of the groove v4.
  • the value of the gap x1 + the gap y1 is set to the same value as in the case of the electronic control unit A2 of the second embodiment so that the usage amount of the adhesive 6 does not change.
  • FIG. 8 is an explanatory diagram of the stress distribution of the adhesive
  • FIG. 9 is an explanatory diagram of the relationship between the adhesive thickness and the maximum stress according to the fourth embodiment.
  • the largest stress is generated at the interface between the outer side surface d1 of the protrusion w1 and the outer side surface c1 of the groove v1.
  • the maximum stress generated in the adhesive 6 when the magnitude relationship between the gap x1 and the gap y1 is changed in order to reduce this stress is a parabola as shown in FIG.
  • the stress is minimum when x1> y1. Therefore, the electronic control unit A4 of the fourth embodiment can further reduce the stress generated in the adhesive 6 as compared with the electronic control unit A2 of the second embodiment.
  • the electronic control unit A5 according to the fifth embodiment will be described.
  • the electronic control device A5 according to the fifth embodiment is different from the electronic control device A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A2 according to the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
  • FIG. 10 is a perspective view and a cross-sectional view of the electronic control device according to the fifth embodiment
  • FIG. 11 is an explanatory diagram of the relationship between the inclination angle of the side surface of the protrusion and the side surface of the groove and the maximum stress of the adhesive. ..
  • the outer side surface d5 of the projection w5 and the outer side surface c5 of the groove v5 are provided with an inclination angle ⁇ 7 of 5 ° or less, which is a general draft, and the inclined outer surface f5 of the projection w5 and The inclination angle ⁇ 8 of the inclined inner side surface e5 of the groove v5 has a relationship of ⁇ 7 ⁇ 8.
  • the electronic control unit A6 according to the sixth embodiment will be described.
  • the electronic control unit A6 according to the sixth embodiment is different from the electronic control unit A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those of the electronic control unit A2 in the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
  • FIG. 12 is a perspective view and a sectional view of the electronic control device according to the sixth embodiment.
  • the bottom surface of the base 7 and the top surface of the cover 1 have a pentagonal shape, and the space between the cover 1 and the base 7 is fixed by four screws 9a to 9d as an example of a "fastening member". is doing.
  • the distance between the screws 9a and 9d is N
  • the distance between the screws 9a and 9b is B
  • the distance between the screws 9b and 9c is C
  • the distance between the screws 9c and 9d is D.
  • the slanted inner side surface e1 extends along the outer peripheries G and H that form the two sides between the screw 9a and the screw 9d having the longest screw distance in the groove v1.
  • the inclined outer side surface f1 was formed on the projection w6.
  • the inclined outer side surface f1 of the protrusion w6 and the inclined inner side surface e1 of the groove v6 are opposed to each other.
  • a portion where the distance between the bolts 9a and 9d is long has a larger dimensional change due to a change in environmental temperature than other portions, and thus the stress generated in the adhesive 6 applied thereto is large. .. Therefore, by reducing the stress in this portion, the heat resistance can be improved while suppressing the amount of the adhesive 6 used, as compared with the case where the stress generated in other portions is reduced.
  • the electronic control unit A7 according to the seventh embodiment will be described.
  • the electronic control device A7 according to the seventh embodiment is different from the electronic control device A6 according to the sixth embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A6 according to the sixth embodiment. This is the same as the control device A6. Therefore, differences from the sixth embodiment will be mainly described.
  • FIG. 13 is a perspective view and a sectional view of the electronic control device according to the seventh embodiment.
  • the electronic control unit A7 is different from the sixth embodiment in that the region forming the inclined outer side face f1 of the projection w6 and the inclined inner side face e1 of the groove v6 is limited to the central portion J between the bolts 9a and 9d. There is. That is, the slanted outer side surface f1 of the protrusion w6 and the slanted inner side surface e1 of the groove v6 are formed in portions separated from the bolts 9a to 9d. The stress generated in the adhesive 6 due to the environmental temperature change becomes the largest in the central portion J between the bolts 9a and 9d. Therefore, reducing the stress in this portion is more effective than reducing the stress generated in other portions. ⁇ Eighth Embodiment>
  • the electronic control device A8 according to the eighth embodiment will be described.
  • the electronic control unit A8 according to the eighth embodiment is different from the electronic control unit A6 according to the sixth embodiment only in the configuration of the groove and the protrusion, and other configurations are the same as those in the electronic control unit A6 according to the sixth embodiment. This is the same as the control device A6. Therefore, differences from the sixth embodiment will be mainly described.
  • FIG. 14 is a perspective view and a sectional view of the electronic control device according to the eighth embodiment.
  • the electronic control device A8 forms the inclined outer side surface e2 in the groove v6 other than the area forming the inclined inner side surface e1 and also forms the inclined outer side surface e2 in the protrusion w6 other than the area forming the inclined outer side surface f1.
  • f2 was formed. That is, the inclined inner side surface e1 is formed over the half circumference in the groove v1 on one side of the circuit board 5 (between the screws 9a, 9d and 9c) and the other side of the circuit board 5 (between the screws 9a, 9b and 9c).
  • the inclined inner side surface e3 is formed over one half of one side of the groove v3.
  • the electronic control unit A8 can further reduce the stress generated in the adhesive 6 as compared with the electronic control unit A6 of the sixth embodiment.
  • the electronic control unit A9 according to the ninth embodiment will be described.
  • the electronic control unit A9 according to the ninth embodiment is different from the electronic control unit A6 according to the sixth embodiment only in the configuration of the base, and other configurations are the electronic control unit according to the sixth embodiment. The same as A6. Therefore, differences from the sixth embodiment will be mainly described.
  • FIG. 15 is a perspective view of an electronic control device according to the ninth embodiment
  • FIG. 16 is an exploded perspective view of the electronic control device according to the ninth embodiment
  • FIG. 17 is an electronic device according to the ninth embodiment. It is a XVII-XVII sectional view of a control apparatus.
  • the base 71 of the electronic control unit A9 has a cylindrical accommodating portion 72 that stands from the bottom surface on the side opposite to the groove v1.
  • the accommodation portion 72 is higher on the other side (on the right side in FIG. 17) provided with the groove v2 than on the one side (on the left side in FIG. 17) provided with the groove v1.
  • Brackets 73 are erected outwardly at four corners on the opposite side of the bottom surface of the housing portion 72.
  • the electronic control unit A9 is fixed via a bracket 73 to an opening formed in a mission case as an example of a "mounting device" mounted on an automobile, and the opening formed in the mission case is tilted to one side. Close up.
  • the inclined inner side surface e1 is formed in the groove v1 and the inclined outer side surface f1 is formed in the protrusion w1.
  • the invention is not limited to this, and only either the inclined inner side surface e1 or the inclined outer side surface f1 may be formed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The present invention provides an electronic control device capable of obtaining improved heat resistance. An electronic control device A1 is provided with: a circuit board 5 on which an electronic component is mounted; and a casing that houses the circuit board 5. The casing is provided with a base 7 and a cover 1. A groove v1 is provided to the base 7. The cover 1 is provided with a projection w1 which is disposed in the groove v1 by means of an adhesive 6. A slope inner surface e1 is formed in the groove v1. A slope outer surface f1 is formed in the projection w1.

Description

電子制御装置Electronic control unit
　本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
　近年、自動車は、電子電動化と、自動運転技術を始めとした高機能化とが進んでいる。
しかし、市場競争力を確保するためには、機能アップ分をそのまま車両価格に転嫁できないため、電子制御装置を含む各構成部品の低コスト競争は、益々激化している。 2. Description of the Related Art In recent years, automobiles have become more electronic and more sophisticated, including autonomous driving technology.
However, in order to secure the market competitiveness, the increased cost cannot be directly transferred to the vehicle price, and thus the low cost competition of each component including the electronic control device is intensifying.
　このような背景の中、電子制御装置は、ハーネス及びコネクタの削減を目的として、エンジン、トランスミッション、及びモーターの制御対象物に対して、近接化及び機電一体化が進んでいる。このため、エンジンルーム内の過酷な温度環境及び振動環境であっても使用可能な安価な電子制御装置の必要性が高まっている。 Against this background, electronic control devices are becoming closer to the control target of the engine, transmission, and motor, and integration of electromechanical devices is being promoted in order to reduce harnesses and connectors. Therefore, there is an increasing need for an inexpensive electronic control device that can be used even in a severe temperature environment and vibration environment in the engine room.
　上記エンジンルーム内のような水が掛かる環境に電子制御装置を搭載する場合、電子制御装置を防水化及び防塵化する必要がある。互いに接合される外装部材の外周部の間に接着剤を配置する方法が一般的である。しかし、接着剤の材料強度は、外装部材の１０分の１以下の低さであり、且つ、接着剤は、外装部品間の熱膨張率及び熱収縮率の差による応力を受けるため、特に過酷な温度環境に晒された場合には破損する虞がある。 When installing the electronic control device in an environment where water is splashed, such as in the engine room above, it is necessary to make the electronic control device waterproof and dustproof. A common method is to dispose an adhesive between the outer peripheral portions of the exterior members that are joined to each other. However, the material strength of the adhesive is not more than 1/10 of that of the exterior member, and the adhesive is subjected to stress due to the difference in the thermal expansion coefficient and the thermal contraction rate between the exterior parts. There is a risk of damage when exposed to a wide temperature environment.
特開２０１６－５４５４１４号公報JP, 2016-545414, A
　これに対し、両外装部品の外周部の内、接着剤が膨張及び収縮し難い部分において、接着剤の断面積を減少させることによって、防水性を維持しつつ、接着剤の使用量を減らす方法が特許文献1に開示されている。ところで、電子制御装置には、接着剤の使用量の抑制だけでなく、耐熱性の向上も求められる。 On the other hand, a method of reducing the amount of adhesive used while maintaining waterproofness by reducing the cross-sectional area of the adhesive in the area where the adhesive is less likely to expand and contract in the outer peripheral parts of both exterior parts Is disclosed in Patent Document 1. By the way, the electronic control device is required not only to suppress the amount of the adhesive used but also to improve the heat resistance.
　本発明は、上記事情に鑑みてなされたもので、その目的は、耐熱性を向上することができる電子制御装置を提供することにある。 The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic control device capable of improving heat resistance.
　上記課題を解決すべく、本発明に従う電子制御装置は、電子部品が実装された回路基板と、前記回路基板を収容する筐体と、を備えた電子制御装置であって、前記筐体は、凹部が設けられた第一筐体と、前記凹部内にシール材を介して配置される凸部が設けられた第二筐体と、を備え、前記凹部または前記凸部の少なくとも何れか一方に傾斜側面を形成した。 In order to solve the above problems, an electronic control device according to the present invention is an electronic control device including a circuit board on which electronic components are mounted, and a housing that houses the circuit board, wherein the housing is A first housing provided with a concave portion, and a second housing provided with a convex portion arranged in the concave portion via a sealing material, and at least one of the concave portion and the convex portion. An inclined side surface was formed.
　本発明によれば、耐熱性を向上することができる。 According to the present invention, heat resistance can be improved.
第１実施形態に係る電子制御装置の斜視図。The perspective view of the electronic control unit concerning a 1st embodiment. 第１実施形態に係る電子制御装置の分解斜視図。FIG. 3 is an exploded perspective view of the electronic control device according to the first embodiment. 従来の電子制御装置の斜視図及び断面部。A perspective view and a section of a conventional electronic control unit. 第１実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional drawing of the electronic control unit which concern on 1st Embodiment. 第２実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional view of the electronic control unit concerning a 2nd embodiment. 第３実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional view of the electronic control unit concerning a 3rd embodiment. 第４実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional view of the electronic control unit concerning a 4th embodiment. 接着剤の応力分布の説明図。Explanatory drawing of stress distribution of an adhesive agent. 第４実施形態に係る接着剤の厚みと最大応力との関係の説明図。Explanatory drawing of the relationship between the thickness and the maximum stress of the adhesive agent which concerns on 4th Embodiment. 第５実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional view of the electronic control unit concerning a 5th embodiment. 突起の側面及び溝の側面の傾斜角度と接着剤の最大応力との関係の説明図。Explanatory drawing of the relationship between the inclination angle of the side surface of a protrusion and the side surface of a groove, and the maximum stress of an adhesive agent. 第６実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional view of the electronic control unit concerning a 6th embodiment. 第７実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional view of the electronic control unit concerning a 7th embodiment. 第８実施形態に係る電子制御装置の斜視図及び断面図。The perspective view and sectional view of the electronic control unit concerning an 8th embodiment. 第９実施形態に係る電子制御装置の斜視図。The perspective view of the electronic control unit concerning a 9th embodiment. 第９実施形態に係る電子制御装置の分解斜視図。The exploded perspective view of the electronic control unit concerning a 9th embodiment. 第９実施形態に係る電子制御装置のＸＶＩＩ－ＸＶＩＩ断面図。XVII-XVII sectional drawing of the electronic controller which concerns on 9th Embodiment.
　幾つかの実施形態について、図面を参照しながら説明する。尚、以下に説明する実施形態は特許請求の範囲に係る発明を限定するものではなく、また実施形態の中で説明されている諸要素およびその組み合わせの全てが発明の解決手段に必須であるとは限らない。各図において共通の構成については、同一の参照符号が付されている。
＜第1実施形態＞ Some embodiments will be described with reference to the drawings. The embodiments described below do not limit the invention according to the claims, and all of the elements and combinations described in the embodiments are indispensable for solving the invention. Not necessarily. In each figure, the same reference numerals are attached to the common configurations.
<First embodiment>
　図１は、第１実施形態に係る電子制御装置の斜視図である。 FIG. 1 is a perspective view of the electronic control device according to the first embodiment.
　電子制御装置Ａ１は、一対のブラケット１１に形成された固定孔にボルトが挿通されることによって自動車に搭載されて、エンジン、トランスミッション、又はブレーキを制御する。 The electronic control unit A1 is mounted on an automobile by inserting bolts into fixing holes formed in the pair of brackets 11 to control an engine, a transmission, or a brake.
　図２は、第１実施形態に係る電子制御装置の分解斜視図である。 FIG. 2 is an exploded perspective view of the electronic control device according to the first embodiment.
　電子制御装置A１は、回路基板５と、「第一筐体」の一例としてのベース７と、「第二筐体」の一例としてのカバー１と、を備えている。回路基板５には、コネクタ３及び電子部品４が実装されている。コネクタ３は、回路基板５に形成される電気回路と外部機器とを電気的に接続する。回路基板５は、ネジ２によってベース７に固定される。回路基板５は、ネジ２によってカバー１に固定されてよい。 The electronic control unit A1 includes a circuit board 5, a base 7 as an example of a “first housing”, and a cover 1 as an example of a “second housing”. The connector 3 and the electronic component 4 are mounted on the circuit board 5. The connector 3 electrically connects an electric circuit formed on the circuit board 5 and an external device. The circuit board 5 is fixed to the base 7 by the screws 2. The circuit board 5 may be fixed to the cover 1 with screws 2.
　ベース７は、矩形の底面と、この底面の外周に沿って立設した枠部とを備えた有底筒状をなしている。ベース７は、回路基板５を収容する。ベース７の枠部の先端部には、「凹部」の一例としての溝ｖ１が全周に亘って形成されている。即ち、溝ｖ１は、ベース７の外周に沿って形成されている。 The base 7 has a bottomed tubular shape including a rectangular bottom surface and a frame portion provided upright along the outer periphery of the bottom surface. The base 7 houses the circuit board 5. A groove v1 as an example of a “recess” is formed at the tip of the frame portion of the base 7 over the entire circumference. That is, the groove v1 is formed along the outer periphery of the base 7.
　カバー１は、開口１２が形成された矩形の上面と、この上面の外周に沿って立設した枠部とを備えた有底筒状をなしている。カバー１は、開口１２にコネクタ３を挿通させてベース７に収容された回路基板５を覆う。カバー１の枠部の先端部には、「凸部」の一例としての突起ｗ１が全周に亘って形成されている。即ち、突起ｗ１は、カバー１の外周に沿って形成されている。 The cover 1 has a bottomed tubular shape including a rectangular upper surface having an opening 12 formed therein and a frame portion provided upright along the outer periphery of the upper surface. The cover 1 covers the circuit board 5 accommodated in the base 7 by inserting the connector 3 into the opening 12. A protrusion w1 as an example of a “projection” is formed on the entire tip of the frame portion of the cover 1. That is, the protrusion w1 is formed along the outer periphery of the cover 1.
　カバー１に設けられた突起ｗ１とベース７に形成された溝ｖ１との間には、「シール材」の一例としての液体状の接着剤６を塗布した後に硬化され、カバー１とコネクタ３との間には、パッキン８が配置される。このように突起ｗ１及び溝ｖ１に接着剤を塗布すると、接着剤６の接着面積が広がり、電子制御装置Ａ１の内部の気密性を高めることができる。尚、回路基板５には、図示した電子部品４以外にも電子部品が複数実装されてよい。さらに、カバー１に溝ｖ１を形成すると共に、ベース７に突起ｗ１を形成してよい。 Between the protrusion w1 provided on the cover 1 and the groove v1 formed on the base 7, a liquid adhesive 6 as an example of a "sealing material" is applied and then cured, so that the cover 1 and the connector 3 are The packing 8 is arranged between them. When the adhesive is applied to the protrusion w1 and the groove v1 in this way, the adhesive area of the adhesive 6 is expanded, and the airtightness inside the electronic control unit A1 can be enhanced. In addition to the illustrated electronic component 4, a plurality of electronic components may be mounted on the circuit board 5. Further, the groove v1 may be formed in the cover 1 and the protrusion w1 may be formed in the base 7.
　ここで、従来の電子制御装置Ｂの接着剤６が、高温環境に晒された状態について説明する。 Here, the state where the adhesive 6 of the conventional electronic control unit B is exposed to a high temperature environment will be described.
　図３は、従来の電子制御装置の斜視図及び断面部である。 3 is a perspective view and a cross-sectional view of a conventional electronic control device.
　従来の電子制御装置Ｂにおいて、溝ｖ０は、外側側面ｃ１及び内側側面ｃ２が底面に向かって同一幅であり、突起ｗ０は、外側側面ｄ１及び内側側面ｄ２が先端に向かって同一厚みである。 In the conventional electronic control unit B, the groove v0 has the same width on the outer side surface c1 and the inner side surface c2 toward the bottom surface, and the protrusion w0 has the same thickness on the outer side surface d1 and the inner side surface d2 toward the tip.
　このような従来の電子制御装置Ｂの接着剤６は、溝ｖ０の外側側面ｃ１と、突起ｗ０の外側側面ｄ１との間に挟さまれている。このため、高温環境に晒された接着剤６が膨張しようとした場合、突起ｗ０の外側側面ｄ１には、この外側側面ｄ１に垂直な方向に力ｇ１が発生すると共に、突起ｗ０の内側側面ｄ２には、この内側側面ｄ２に垂直な方向に力ｈ１が発生する。このとき、これら力ｇ１と力ｈ１とは、大きさが等しく、且つ互いに逆向きである。したがって、力ｇ１と力ｈ１とは、互いに相殺されて、突起ｗ０は移動しない。 The adhesive 6 of such a conventional electronic control unit B is sandwiched between the outer side surface c1 of the groove v0 and the outer side surface d1 of the protrusion w0. Therefore, when the adhesive 6 exposed to the high temperature environment tries to expand, a force g1 is generated on the outer side surface d1 of the projection w0 in a direction perpendicular to the outer side surface d1 and an inner side surface d2 of the projection w0. Force h1 is generated in the direction perpendicular to the inner side surface d2. At this time, the force g1 and the force h1 are equal in magnitude and opposite to each other. Therefore, the force g1 and the force h1 cancel each other out, and the protrusion w0 does not move.
　一方、溝ｖ０の外側側面ｃ１には、この外側側面ｃ１に垂直な方向に力ｊ１が発生し、溝ｖ０の内側側面ｃ２には、この内側側面ｃ２に垂直な方向に力ｋ１が発生する。これら力ｊ１と力ｋ１とは、大きさが等しく、且つ互いに逆向きである。したがって、力ｊ１と力ｋ１とは、互いに相殺されて、溝ｖ０は移動しない。これらの結果、接着剤６の膨張は、突起ｗ０及び溝ｖ０によって阻まれ、接着剤６には、高い応力が発生する。 On the other hand, a force j1 is generated on the outer side surface c1 of the groove v0 in a direction perpendicular to the outer side surface c1, and a force k1 is generated on the inner side surface c2 of the groove v0 in a direction perpendicular to the inner side surface c2. The force j1 and the force k1 are equal in magnitude and opposite to each other. Therefore, the force j1 and the force k1 cancel each other out, and the groove v0 does not move. As a result, the expansion of the adhesive 6 is blocked by the protrusion w0 and the groove v0, and a high stress is generated in the adhesive 6.
　図４は、第１実施形態に係る電子制御装置の斜視図及び断面図である。 FIG. 4 is a perspective view and a sectional view of the electronic control device according to the first embodiment.
　電子制御装置Ａ１は、図３の従来の電子制御装置Ｂに対し、溝ｖ１の半周に亘って傾斜内側面ｅ１が形成されると共に、突起ｗ１の半周に亘って傾斜外側面ｆ１が形成されている。傾斜内側面ｅ１は、回路基板５に垂直な外側内側面ｃ１に対してθ１だけ内側に傾斜している。即ち、溝ｖ１には、溝ｖ１の幅を底面に向かって減少させた傾斜内側面ｅ１が形成されている。一方、突起ｗ１の傾斜外側面ｆ１は、回路基板５に垂直な外側外側面ｄ１に対してθ２（＝θ１）分だけ内側に傾斜している。即ち、突起ｗ１は、突起ｗ１の厚みを先端側に向かって増加させた傾斜外側面ｆ１を有する。これら傾斜内側面ｅ１と、傾斜外側面ｆ１とは、接着剤６を介して対向するように配置される。 The electronic control unit A1 is different from the conventional electronic control unit B in FIG. 3 in that the inclined inner side surface e1 is formed over the half circumference of the groove v1 and the inclined outer side surface f1 is formed over the half circumference of the protrusion w1. There is. The inclined inner side surface e1 is inclined inward by θ1 with respect to the outer inner side surface c1 perpendicular to the circuit board 5. That is, the groove v1 is formed with the inclined inner side surface e1 in which the width of the groove v1 is reduced toward the bottom surface. On the other hand, the inclined outer side surface f1 of the protrusion w1 is inclined inward by an amount of θ2 (= θ1) with respect to the outer side surface d1 perpendicular to the circuit board 5. That is, the protrusion w1 has the inclined outer side surface f1 in which the thickness of the protrusion w1 is increased toward the tip side. The inclined inner side surface e1 and the inclined outer side surface f1 are arranged so as to face each other with the adhesive 6.
　これにより、高温環境で接着剤６が膨張しようとした場合、突起ｗ１の傾斜外側面ｆ１には、この傾斜外側面ｆ１に垂直な方向に力ｍ１が発生し、突起ｗ１の外側外側面ｄ１には、この外側外側面ｄ１に垂直な方向に力ｈ１が発生する。このとき、突起ｗ１は、これら力ｍ１と力ｈ１とを足し合わせた力ｐ１の方向（溝ｖ１から離れる方向）に移動する。 As a result, when the adhesive 6 tries to expand in a high temperature environment, a force m1 is generated on the inclined outer side surface f1 of the projection w1 in a direction perpendicular to the inclined outer side surface f1, and the outer side surface d1 of the projection w1 is generated. Generates a force h1 in a direction perpendicular to the outer side surface d1. At this time, the protrusion w1 moves in the direction of the force p1 (the direction away from the groove v1), which is the sum of the force m1 and the force h1.
　一方、溝ｖ１の傾斜内側面ｅ１には、この傾斜内側面ｅ１に垂直方向に力ｎ１が発生し、溝ｖ１の外側内側面ｃ１には、この外側内側面ｃ１に垂直な方向に力ｋ１が発生する。
このとき、溝ｖ１は、これら力ｎ１と力ｋ１とを足し合わせた力ｑ１の方向（突起ｗ１から離れる方向）に移動する。 On the other hand, on the inclined inner side surface e1 of the groove v1, a force n1 is generated in a direction perpendicular to the inclined inner side surface e1, and on the outer inner side surface c1 of the groove v1, a force k1 is generated in a direction perpendicular to the outer inner side surface c1. Occur.
At this time, the groove v1 moves in the direction of the force q1 (the direction away from the protrusion w1), which is the sum of these forces n1 and k1.
　この構成によれば、接着剤６の膨張が、突起ｗ１及び溝ｖ１の移動範囲（互いに離間する範囲）分だけ許容されるため、図３の従来の電子制御装置Ｂの構造と比較して、接着剤６に発生する応力が低減する。さらに、突起ｗ１の外側外側面ｄ１と溝ｖ１の外側内側面ｃ１との間隙（クリアランス）ｘ１と、突起ｗ１の傾斜外側面ｆ１と溝ｖ１の傾斜内側面ｅ１との間隙ｙ１とは、図３の従来の電子制御装置Ｂにおけるの間隙ｘ１，ｙ１と等しい。このため、従来の電子制御装置Ｂに比べて、電子制御装置Ａ１における間隙ｘ１，ｙ１に塗布される接着剤６の量は増えない。よって、電子制御装置Ａ１には、コストアップが発生しない。
＜第２実施形態＞ According to this configuration, the expansion of the adhesive 6 is allowed only by the movement range of the projection w1 and the groove v1 (range separated from each other), and therefore, compared with the structure of the conventional electronic control unit B of FIG. The stress generated in the adhesive 6 is reduced. Further, the gap (clearance) x1 between the outer side surface d1 of the protrusion w1 and the outer side surface c1 of the groove v1 and the gap y1 between the inclined outer side surface f1 of the protrusion w1 and the inclined inner side surface e1 of the groove v1 are as shown in FIG. Is equal to the gaps x1 and y1 in the conventional electronic control unit B. Therefore, the amount of the adhesive 6 applied to the gaps x1 and y1 in the electronic control unit A1 does not increase as compared with the conventional electronic control unit B. Therefore, no cost increase occurs in the electronic control unit A1.
<Second Embodiment>
　第２実施形態に係る電子制御装置Ａ２について説明する。尚、第２実施形態に係る電子制御装置Ａ２は、第１実施形態に係る電子制御装置Ａ１とは、溝及び突起の構成が異なるだけであり、その他の構成は、第１実施形態に係る電子制御装置Ａ１と同様である。したがって、第１実施形態との相違点を中心に述べる。 The electronic control unit A2 according to the second embodiment will be described. The electronic control device A2 according to the second embodiment is different from the electronic control device A1 according to the first embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device according to the first embodiment. It is the same as the control device A1. Therefore, the differences from the first embodiment will be mainly described.
　図５は、第２実施形態に係る電子制御装置の斜視図及び断面図である。 FIG. 5 is a perspective view and a cross-sectional view of the electronic control device according to the second embodiment.
　電子制御装置Ａ２は、回路基板５の一側（図５中、左側）における溝ｖ１に傾斜内側面ｅ１が形成されると共に、回路基板５の他側（図５中、右側）における溝ｖ２の他側に傾斜内側面ｅ２が形成されている。溝ｖ２の内、傾斜内側面ｅ２は、回路基板５に垂直な内側内側面ｃ２に対してθ３分だけ外側に傾斜している。一方、カバー１の突起ｗ１と回路基板５を挟んで反対側に形成された突起ｗ２には、傾斜内側面ｅ２と対向する部分に、内側内側面ｄ２に対してθ４分だけ外側に傾斜した傾斜外側面ｆ２が形成されている。 In the electronic control unit A2, the inclined inner side surface e1 is formed in the groove v1 on one side (left side in FIG. 5) of the circuit board 5, and the groove v2 on the other side (right side in FIG. 5) of the circuit board 5 is formed. An inclined inner side surface e2 is formed on the other side. In the groove v2, the inclined inner side surface e2 is inclined outward by θ3 with respect to the inner side surface c2 perpendicular to the circuit board 5. On the other hand, in the protrusion w2 formed on the opposite side of the protrusion w1 of the cover 1 with the circuit board 5 interposed therebetween, the slope inclined outward by θ4 with respect to the inner inner side face d2 at a portion facing the inner slant side face e2. The outer side surface f2 is formed.
　この第二実施形態では、傾斜内側面ｅ１が溝ｖ２の内側に形成されている場合、傾斜内側面ｅ２は、溝ｖ３の外側に形成する。よって、ｘ１＝ｙ１＝ｘ２＝ｙ２且つθ１＝θ２＝θ３＝θ４の場合、突起ｗ１に発生する力ｐ１と、突起ｗ２に発生する力ｐ２とは大きさが等しく、且つ互いに同じ方向となる。これにより、これらｐ１とｐ２とを足し合わせた力ｐ３は、第１実施形態の電子制御装置Ａ１の接着剤６に発生するｐ１の２倍となり、カバー１がより大きくベース７から離間するように移動するため、接着剤６の膨張をより許容しやすくなる。尚、これは溝ｖ１側についても同様である。
＜第3実施形態＞ In the second embodiment, when the inclined inner side surface e1 is formed inside the groove v2, the inclined inner side surface e2 is formed outside the groove v3. Therefore, when x1 = y1 = x2 = y2 and θ1 = θ2 = θ3 = θ4, the force p1 generated on the protrusion w1 and the force p2 generated on the protrusion w2 are equal in magnitude and in the same direction. As a result, the force p3, which is the sum of these p1 and p2, becomes twice as large as p1 generated in the adhesive 6 of the electronic control unit A1 of the first embodiment, so that the cover 1 is further separated from the base 7. Since it moves, it becomes easier to allow the expansion of the adhesive 6. This is the same for the groove v1 side.
<Third embodiment>
　第３実施形態に係る電子制御装置Ａ３について説明する。尚、第３実施形態に係る電子制御装置Ａ３は、第２実施形態に係る電子制御装置Ａ２とは、溝及び突起の構成が異なるだけであり、その他の構成は、第２実施形態に係る電子制御装置Ａ２と同様である。したがって、第２実施形態との相違点を中心に述べる。 The electronic control unit A3 according to the third embodiment will be described. The electronic control device A3 according to the third embodiment is different from the electronic control device A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A2 according to the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
　図６は、第３実施形態に係る電子制御装置の斜視図及び断面図である。 FIG. 6 is a perspective view and a sectional view of the electronic control device according to the third embodiment.
　電子制御装置Ａ３は、回路基板５の一側（図６中、左側）における溝ｖ１に傾斜内側面ｅ１が形成されると共に、回路基板５の他側（図６中、右側）における溝ｖ３の一側に傾斜内側面ｅ３が形成されている。溝ｖ３の内、傾斜内側面ｅ３は、回路基板５に垂直な外側内側面ｃ３に対してθ５分だけ内側に傾斜している。一方、突起ｗ１の内、外側内側面ｅ３に対向する部分ｗ３（以下、突起ｗ３）には、外側外側面ｄ３に対してθ６分だけ内側に傾斜した傾斜外側面ｆ３が形成されている。 In the electronic control unit A3, the inclined inner side surface e1 is formed in the groove v1 on one side (left side in FIG. 6) of the circuit board 5 and the groove v3 on the other side (right side in FIG. 6) of the circuit board 5 is formed. An inclined inner side surface e3 is formed on one side. The inclined inner side surface e3 of the groove v3 is inclined inward by θ5 with respect to the outer inner side surface c3 perpendicular to the circuit board 5. On the other hand, a slanted outer surface f3 that is slanted inward by θ6 with respect to the outer outer surface d3 is formed in a portion w3 (hereinafter, the projection w3) of the projection w1 that faces the outer inner surface e3.
　この第三実施形態では、両傾斜内側面ｅ１，ｅ３が溝ｖ１，ｖ３の内側に形成されている場合、突起ｗ１に発生する力ｐ１と、突起ｗ３に発生する力ｐ３とを足し合わせた力Ｐ４は、ｈ１とｈ３とが互いに逆方向であるために相殺される。したがって、相殺された分、力Ｐ４は、第2実施形態の電子制御装置Ａ２における接着剤６に発生するｐ３よりも小さくなる。これにより、溝ｖ１，ｖ３及び突起ｗ１，ｗ３に傾斜内側面ｅ１，ｅ３及び傾斜外側面ｆ１，ｆ３を形成し易くすることができる。
＜第４実施形態＞ In this third embodiment, when both inclined inner side surfaces e1 and e3 are formed inside the grooves v1 and v3, the force p1 generated on the protrusion w1 and the force p3 generated on the protrusion w3 are added together. P4 is offset because h1 and h3 are in opposite directions. Therefore, the force P4 is smaller than the force p4 generated in the adhesive 6 in the electronic control unit A2 of the second embodiment by the offset amount. This makes it easier to form the inclined inner side surfaces e1 and e3 and the inclined outer side surfaces f1 and f3 on the grooves v1 and v3 and the protrusions w1 and w3.
<Fourth Embodiment>
　第４実施形態に係る電子制御装置Ａ４について説明する。尚、第４実施形態に係る電子制御装置Ａ４は、第２実施形態に係る電子制御装置Ａ２とは、溝及び突起の構成が異なるだけであり、その他の構成は、第２実施形態に係る電子制御装置Ａ２と同様である。したがって、第２実施形態との相違点を中心に述べる。 The electronic control device A4 according to the fourth embodiment will be described. The electronic control device A4 according to the fourth embodiment is different from the electronic control device A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A2 according to the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
　図７は、第４実施形態に係る電子制御装置の斜視図及び断面図である。 FIG. 7 is a perspective view and a sectional view of the electronic control device according to the fourth embodiment.
　電子制御装置Ａ４は、突起ｗ４の傾斜外側面ｆ４と溝ｖ４の傾斜内側面ｅ４との間隙ｙ４よりも、突起ｗ４の外側側面ｄ４と溝ｖ４の内側側面ｃ４との間隙ｘ４が大きい。但し、接着剤６の使用量が変わらないように、間隙ｘ１＋間隙ｙ１の値は、第２実施形態の電子制御装置Ａ２の場合と同じ程度の値とする。 In the electronic control unit A4, the gap x4 between the outer side surface d4 of the projection w4 and the inner side surface c4 of the groove v4 is larger than the gap y4 between the slanted outer side surface f4 of the projection w4 and the slanted inner side surface e4 of the groove v4. However, the value of the gap x1 + the gap y1 is set to the same value as in the case of the electronic control unit A2 of the second embodiment so that the usage amount of the adhesive 6 does not change.
　ここで、第２実施形態の電子制御装置Ａ２において、ＣＡＥ解析によって算出した、接着剤６に発生する応力分布について説明する。 Here, the stress distribution generated in the adhesive 6 calculated by CAE analysis in the electronic control unit A2 of the second embodiment will be described.
　図８は、接着剤の応力分布の説明図であり、図９は、第４実施形態に係る接着剤の厚みと最大応力との関係の説明図である。 FIG. 8 is an explanatory diagram of the stress distribution of the adhesive, and FIG. 9 is an explanatory diagram of the relationship between the adhesive thickness and the maximum stress according to the fourth embodiment.
　図８に示すように、突起ｗ１の外側側面ｄ１と溝ｖ１の外側側面ｃ１との界面に最も大きな応力が発生している。この応力を低減すべく、間隙ｘ１と間隙ｙ１の大小関係を変化させたときに接着剤６に発生する最大応力は、図９に示すような放物線となる。図９に示すように、ｘ１＞ｙ１の場合に応力が最小となる。したがって、第４実施形態の電子制御装置Ａ４は、第２実施形態の電子制御装置Ａ２よりも、接着剤６に発生する応力をさらに低減できる。
＜第５実施形態＞ As shown in FIG. 8, the largest stress is generated at the interface between the outer side surface d1 of the protrusion w1 and the outer side surface c1 of the groove v1. The maximum stress generated in the adhesive 6 when the magnitude relationship between the gap x1 and the gap y1 is changed in order to reduce this stress is a parabola as shown in FIG. As shown in FIG. 9, the stress is minimum when x1> y1. Therefore, the electronic control unit A4 of the fourth embodiment can further reduce the stress generated in the adhesive 6 as compared with the electronic control unit A2 of the second embodiment.
<Fifth Embodiment>
　第５実施形態に係る電子制御装置Ａ５について説明する。尚、第５実施形態に係る電子制御装置Ａ５は、第２実施形態に係る電子制御装置Ａ２とは、溝及び突起の構成が異なるだけであり、その他の構成は、第２実施形態に係る電子制御装置Ａ２と同様である。したがって、第２実施形態との相違点を中心に述べる。 The electronic control unit A5 according to the fifth embodiment will be described. The electronic control device A5 according to the fifth embodiment is different from the electronic control device A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A2 according to the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
　図１０は、第５実施形態に係る電子制御装置の斜視図及び断面図であり、図１１は、突起の側面及び溝の側面の傾斜角度と接着剤の最大応力との関係の説明図である。 FIG. 10 is a perspective view and a cross-sectional view of the electronic control device according to the fifth embodiment, and FIG. 11 is an explanatory diagram of the relationship between the inclination angle of the side surface of the protrusion and the side surface of the groove and the maximum stress of the adhesive. ..
　電子制御装置Ａ５は、突起ｗ５の外側外側面ｄ５及び溝ｖ５の外側内側面ｃ５に一般的な抜き勾配である５°以下だけ傾斜角度θ７が設けられており、突起ｗ５の傾斜外側面ｆ５及び溝ｖ５の傾斜内側面ｅ５の傾斜角度θ８が、θ７＜θ８の関係を有している。このとき、θ７が０°のときのθ８の最大角度をθ８ｍａｘとすると、θ７が５°の場合、θ８＝θ７－５°とすれば、電子制御装置Ａ５が大型化することはなく、接着剤６の使用量が増加して電子制御装置Ａ５がコストアップすることもない。θ８ｍａｘ＝２０°とし、θ７とθ８とを下記の条件（１）～（５）の通り変化させたときの最大応力を図１１に示す。 In the electronic control unit A5, the outer side surface d5 of the projection w5 and the outer side surface c5 of the groove v5 are provided with an inclination angle θ7 of 5 ° or less, which is a general draft, and the inclined outer surface f5 of the projection w5 and The inclination angle θ8 of the inclined inner side surface e5 of the groove v5 has a relationship of θ7 <θ8. At this time, when the maximum angle of θ8 when θ7 is 0 ° is θ8max, when θ7 is 5 ° and θ8 = θ7−5 °, the electronic control unit A5 does not increase in size and the adhesive agent The electronic control unit A5 does not increase in cost due to an increase in the usage amount of No. 6. FIG. 11 shows the maximum stress when θ8max = 20 ° and θ7 and θ8 are changed under the following conditions (1) to (5).
　θ７＝０°、θ８＝０°…（１）        
　θ７＝５°、θ８＝５°…（２）        
　θ７＝１０°、θ８＝１０°…（３）
　θ７＝５°、θ８＝１５°…（４） θ7 = 0 °, θ8 = 0 ° (1)
θ7 = 5 °, θ8 = 5 ° (2)
θ7 = 10 °, θ8 = 10 ° (3)
θ7 = 5 °, θ8 = 15 ° (4)
　図１１に示すように、接着剤６に発生する最大応力は、条件（１）＞条件（２）＞条件
（３）＞条件（４）の順となる。よって、θ７＜θ８とする電子制御装置Ａ５は、θ７＝θ８とした一般的な電子制御装置と比較して、接着剤６に発生する応力をさらに低減できる。
＜第６実施形態＞ As shown in FIG. 11, the maximum stress generated in the adhesive 6 is in the order of condition (1)> condition (2)> condition (3)> condition (4). Therefore, the electronic control device A5 with θ7 <θ8 can further reduce the stress generated in the adhesive 6 as compared with a general electronic control device with θ7 = θ8.
<Sixth Embodiment>
　第６実施形態に係る電子制御装置Ａ６について説明する。尚、第６実施形態に係る電子制御装置Ａ６は、第２実施形態に係る電子制御装置Ａ２とは、溝及び突起の構成が異なるだけであり、その他の構成は、第２実施形態に係る電子制御装置Ａ２と同様である。したがって、第２実施形態との相違点を中心に述べる。 The electronic control unit A6 according to the sixth embodiment will be described. The electronic control unit A6 according to the sixth embodiment is different from the electronic control unit A2 according to the second embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those of the electronic control unit A2 in the second embodiment. It is similar to the control device A2. Therefore, the differences from the second embodiment will be mainly described.
　図１２は、第６実施形態に係る電子制御装置の斜視図及び断面図である。 FIG. 12 is a perspective view and a sectional view of the electronic control device according to the sixth embodiment.
　電子制御装置Ａ６は、ベース７の底面及びカバー１の上面が五角形状をなしており、カバー１とベース７との間を、「締結部材」の一例としての4本のネジ９ａ～９ｄで固定している。この電子制御装置Ａ６において、ネジ９ａ及びネジ９ｄ間の距離をＮ、ネジ９ａ及びネジ９ｂ間の距離をＢ、ネジ９ｂ及びネジ９ｃ間の距離をＣ、ネジ９ｃ及びネジ９ｄ間の距離をＤとする。それらの距離の関係がＮ＞Ｃ＞Ｂ＞Ｄである場合、溝ｖ１の内、ネジ間距離が最も長いネジ９ａ及びネジ９ｄ間の二辺をなす外周Ｇ，Ｈに亘って傾斜内側面ｅ１を形成すると共に、突起ｗ６に傾斜外側面ｆ１を形成した。 In the electronic control unit A6, the bottom surface of the base 7 and the top surface of the cover 1 have a pentagonal shape, and the space between the cover 1 and the base 7 is fixed by four screws 9a to 9d as an example of a "fastening member". is doing. In this electronic control unit A6, the distance between the screws 9a and 9d is N, the distance between the screws 9a and 9b is B, the distance between the screws 9b and 9c is C, and the distance between the screws 9c and 9d is D. And When the relationship between the distances is N> C> B> D, the slanted inner side surface e1 extends along the outer peripheries G and H that form the two sides between the screw 9a and the screw 9d having the longest screw distance in the groove v1. And the inclined outer side surface f1 was formed on the projection w6.
　そのとき、突起ｗ６の傾斜外側面ｆ１と溝ｖ６の傾斜内側面ｅ１とは、対向させる。突起ｗ６及び溝ｖ６の内、ボルト９ａ，９ｄ間の距離が長い部分は、環境温度変化による寸法変化が他と比較して大きいことから、そこに塗布された接着剤６に発生する応力が大きい。したがって、この部分の応力を低減させることにより、他の部分に発生する応力を低減させた場合よりも、接着剤６の使用量を抑制しながら、耐熱性を向上することができる。
＜第７実施形態＞ At that time, the inclined outer side surface f1 of the protrusion w6 and the inclined inner side surface e1 of the groove v6 are opposed to each other. Of the protrusion w6 and the groove v6, a portion where the distance between the bolts 9a and 9d is long has a larger dimensional change due to a change in environmental temperature than other portions, and thus the stress generated in the adhesive 6 applied thereto is large. .. Therefore, by reducing the stress in this portion, the heat resistance can be improved while suppressing the amount of the adhesive 6 used, as compared with the case where the stress generated in other portions is reduced.
<Seventh Embodiment>
　第７実施形態に係る電子制御装置Ａ７について説明する。尚、第７実施形態に係る電子制御装置Ａ７は、第６実施形態に係る電子制御装置Ａ６とは、溝及び突起の構成が異なるだけであり、その他の構成は、第６実施形態に係る電子制御装置Ａ６と同様である。したがって、第６実施形態との相違点を中心に述べる。 The electronic control unit A7 according to the seventh embodiment will be described. The electronic control device A7 according to the seventh embodiment is different from the electronic control device A6 according to the sixth embodiment only in the configuration of the groove and the protrusion, and the other configurations are the same as those in the electronic control device A6 according to the sixth embodiment. This is the same as the control device A6. Therefore, differences from the sixth embodiment will be mainly described.
　図１３は、第７実施形態に係る電子制御装置の斜視図及び断面図である。 FIG. 13 is a perspective view and a sectional view of the electronic control device according to the seventh embodiment.
　電子制御装置Ａ７は、第６実施形態に対し、突起ｗ６の傾斜外側面ｆ１及び溝ｖ６の傾斜内側面ｅ１を形成する領域を、ボルト９ａとボルト９ｄとの間の内の中央部Ｊのみとしている。即ち、突起ｗ６の傾斜外側面ｆ１及び溝ｖ６の傾斜内側面ｅ１は、ボルト９ａ～９ｄから離間した部分に形成されている。環境温度変化によって接着剤６に発生する応力は、ボルト９ａ，９ｄ間の中央部Ｊが最も大きくなる。したがって、この部分の応力を低減させることにより、他の部分に発生する応力を低減させた場合よりも有効である。
＜第８実施形態＞ The electronic control unit A7 is different from the sixth embodiment in that the region forming the inclined outer side face f1 of the projection w6 and the inclined inner side face e1 of the groove v6 is limited to the central portion J between the bolts 9a and 9d. There is. That is, the slanted outer side surface f1 of the protrusion w6 and the slanted inner side surface e1 of the groove v6 are formed in portions separated from the bolts 9a to 9d. The stress generated in the adhesive 6 due to the environmental temperature change becomes the largest in the central portion J between the bolts 9a and 9d. Therefore, reducing the stress in this portion is more effective than reducing the stress generated in other portions.
<Eighth Embodiment>
　第８実施形態に係る電子制御装置Ａ８について説明する。尚、第８実施形態に係る電子制御装置Ａ８は、第６実施形態に係る電子制御装置Ａ６とは、溝及び突起の構成が異なるだけであり、その他の構成は、第６実施形態に係る電子制御装置Ａ６と同様である。したがって、第６実施形態との相違点を中心に述べる。 The electronic control device A8 according to the eighth embodiment will be described. The electronic control unit A8 according to the eighth embodiment is different from the electronic control unit A6 according to the sixth embodiment only in the configuration of the groove and the protrusion, and other configurations are the same as those in the electronic control unit A6 according to the sixth embodiment. This is the same as the control device A6. Therefore, differences from the sixth embodiment will be mainly described.
　図１４は、第８実施形態に係る電子制御装置の斜視図及び断面図である。 FIG. 14 is a perspective view and a sectional view of the electronic control device according to the eighth embodiment.
　電子制御装置Ａ８は、溝ｖ６の内、傾斜内側面ｅ１を形成する領域以外に、傾斜外側面ｅ２を形成すると共に、突起ｗ６の内、傾斜外側面ｆ１を形成する領域以外に、傾斜外側面ｆ２を形成した。即ち、回路基板５の一側（ネジ９ａ、９ｄ及び９ｃ間）における溝ｖ１に傾斜内側面ｅ１が半周に亘って形成されると共に、回路基板５の他側（ネジ９ａ、９ｂ及び９ｃ間）における溝ｖ３の一側に傾斜内側面ｅ３が半周に亘って形成されている。
これにより、電子制御装置Ａ８は、第６実施形態の電子制御装置Ａ６よりも、接着剤６に発生する応力をさらに低減できる。
＜第９実施形態＞ The electronic control device A8 forms the inclined outer side surface e2 in the groove v6 other than the area forming the inclined inner side surface e1 and also forms the inclined outer side surface e2 in the protrusion w6 other than the area forming the inclined outer side surface f1. f2 was formed. That is, the inclined inner side surface e1 is formed over the half circumference in the groove v1 on one side of the circuit board 5 (between the screws 9a, 9d and 9c) and the other side of the circuit board 5 (between the screws 9a, 9b and 9c). The inclined inner side surface e3 is formed over one half of one side of the groove v3.
Thereby, the electronic control unit A8 can further reduce the stress generated in the adhesive 6 as compared with the electronic control unit A6 of the sixth embodiment.
<Ninth Embodiment>
　第９実施形態に係る電子制御装置Ａ９について説明する。尚、第９実施形態に係る電子制御装置Ａ９は、第６実施形態に係る電子制御装置Ａ６とは、ベースの構成が異なるだけであり、その他の構成は、第６実施形態に係る電子制御装置Ａ６と同様である。したがって、第６実施形態との相違点を中心に述べる。 The electronic control unit A9 according to the ninth embodiment will be described. The electronic control unit A9 according to the ninth embodiment is different from the electronic control unit A6 according to the sixth embodiment only in the configuration of the base, and other configurations are the electronic control unit according to the sixth embodiment. The same as A6. Therefore, differences from the sixth embodiment will be mainly described.
　図１５は、第９実施形態に係る電子制御装置の斜視図であり、図１６は、第９実施形態に係る電子制御装置の分解斜視図であり、図１７は、第９実施形態に係る電子制御装置のＸＶＩＩ－ＸＶＩＩ断面図である。 15 is a perspective view of an electronic control device according to the ninth embodiment, FIG. 16 is an exploded perspective view of the electronic control device according to the ninth embodiment, and FIG. 17 is an electronic device according to the ninth embodiment. It is a XVII-XVII sectional view of a control apparatus.
　電子制御装置Ａ９のベース７１は、底面から溝ｖ１とは反対側に立設する筒状の収容部７２を有している。収容部７２は、溝ｖ１が設けられた一側（図１７中、左側）よりも溝ｖ２が設けられた他側（図１７中、右側）が高い。収容部７２の底面とは反対側の四隅には、ブラケット７３が外側に向かってそれぞれ立設されている。電子制御装置Ａ９は、自動車に搭載される「搭載装置」の一例としてのミッションケースに形成された開口にブラケット７３を介して固定され、一側に傾いた状態でミッションケースに形成された開口を塞ぐ。 The base 71 of the electronic control unit A9 has a cylindrical accommodating portion 72 that stands from the bottom surface on the side opposite to the groove v1. The accommodation portion 72 is higher on the other side (on the right side in FIG. 17) provided with the groove v2 than on the one side (on the left side in FIG. 17) provided with the groove v1. Brackets 73 are erected outwardly at four corners on the opposite side of the bottom surface of the housing portion 72. The electronic control unit A9 is fixed via a bracket 73 to an opening formed in a mission case as an example of a "mounting device" mounted on an automobile, and the opening formed in the mission case is tilted to one side. Close up.
　以上、本発明に係る電子制御装置の実施形態について詳述したが、本発明は、前記の実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の精神を逸脱しない範囲で、種々の設計変更を行うことができるものである。 Although the embodiments of the electronic control device according to the present invention have been described above in detail, the present invention is not limited to the above-mentioned embodiments and does not depart from the spirit of the present invention described in the claims. Therefore, various design changes can be made.
　例えば、上記した実施形態では、溝ｖ１に傾斜内側面ｅ１を形成すると共に、突起ｗ１に傾斜外側面ｆ１を形成した。これに限らず、傾斜内側面ｅ１及び傾斜外側面ｆ１の何れかのみを形成してもよい。 For example, in the above-described embodiment, the inclined inner side surface e1 is formed in the groove v1 and the inclined outer side surface f1 is formed in the protrusion w1. The invention is not limited to this, and only either the inclined inner side surface e1 or the inclined outer side surface f1 may be formed.
　A…電子制御装置、１…カバー、４…電子部品、５…回路基板、６…接着剤、７…ベース、９ａ…ネジ、９ｂ…ネジ、９ｃ…ネジ、９ｄ…ネジ、ｗ１…突起、ｖ１…溝、ｅ１…傾斜内側面、ｆ１…傾斜外側面、ｗ２…突起、ｖ２…溝、ｅ２…傾斜内側面、ｆ２…傾斜外側面、ｗ３…突起、ｖ３…溝、ｅ３…傾斜内側面、ｆ３…傾斜外側面、ｗ４…突起、ｖ４…溝、ｅ４…傾斜内側面、ｆ４…傾斜外側面、ｘ４…間隙、ｙ４…間隙、θ７…抜き勾配、θ８…傾斜角度 A ... Electronic control device, 1 ... Cover, 4 ... Electronic component, 5 ... Circuit board, 6 ... Adhesive, 7 ... Base, 9a ... Screw, 9b ... Screw, 9c ... Screw, 9d ... Screw, w1 ... Protrusion, v1 ... Groove, e1 ... Inclined inner side surface, f1 ... Inclined outer side surface, w2 ... Protrusion, v2 ... Groove, e2 ... Inclined inner side surface, f2 ... Inclined outer side surface, w3 ... Projection, v3 ... Groove, e3 ... Inclined inner side surface, f3 ... inclined outer surface, w4 ... protrusion, v4 ... groove, e4 ... inclined inner side surface, f4 ... inclined outer surface, x4 ... gap, y4 ... gap, θ7 ... draft, θ8 ... inclination angle

Claims (10)

  1. 　電子部品が実装された回路基板と、
    　前記回路基板を収容する筐体と、を備えた電子制御装置であって、
    　前記筐体は、凹部が設けられた第一筐体と、前記凹部内にシール材を介して配置される凸部が設けられた第二筐体と、を備え、
    　前記凹部または前記凸部の内の少なくとも何れか一方に傾斜側面を形成した電子制御装置。     A circuit board on which electronic components are mounted,
    An electronic control device comprising: a casing that houses the circuit board,
    The housing includes a first housing having a concave portion and a second housing having a convex portion arranged in the concave portion via a sealing material,
    An electronic control device in which an inclined side surface is formed on at least one of the concave portion and the convex portion.
  2. 　前記凹部には、当該凹部の幅を底面に向かって減少させた傾斜内側面を形成した、請求項１に記載の電子制御装置。 The electronic control unit according to claim 1, wherein an inclined inner side surface is formed in the recess so that the width of the recess is reduced toward the bottom surface.
  3. 　前記凸部には、当該凸部の厚みを先端に向かって増加させた傾斜外側面を形成した、請求項２に記載の電子制御装置。 The electronic control unit according to claim 2, wherein the convex portion is formed with an inclined outer surface in which the thickness of the convex portion is increased toward the tip.
  4. 　前記傾斜内側面及び前記傾斜外側面が対向する、請求項３に記載の電子制御装置。 The electronic control unit according to claim 3, wherein the inclined inner side surface and the inclined outer side surface face each other.
  5. 　前記凹部は、前記第一筐体の外周に沿った溝であり、
    　前記凸部は、前記第二筐体の外周に沿ったリブである、請求項３に記載の電子制御装置。     The recess is a groove along the outer periphery of the first housing,
    The electronic control device according to claim 3, wherein the convex portion is a rib along the outer periphery of the second housing.
  6. 　前記回路基板の一側における前記溝の他側、及び前記回路基板の他側における前記溝の他側に、前記傾斜内側面を形成した、請求項５に記載の電子制御装置。 The electronic control device according to claim 5, wherein the inclined inner side surface is formed on the other side of the groove on one side of the circuit board and the other side of the groove on the other side of the circuit board.
  7. 　前記傾斜内側面と前記傾斜外側面との間隙は、前記溝と前記リブとの間隙の内、他の部分よりも狭い、請求項５に記載の電子制御装置。 The electronic control device according to claim 5, wherein a gap between the inclined inner side surface and the inclined outer side surface is narrower than other portions of the gap between the groove and the rib.
  8. 　前記傾斜内側面及び前記傾斜外側面は、抜き勾配よりも傾斜させた、請求項５に記載の電子制御装置。 The electronic control unit according to claim 5, wherein the inclined inner side surface and the inclined outer side surface are inclined more than a draft.
  9. 　前記第一筐体及び前記第二筐体は、複数の締結部材によって固定されており、
    　前記傾斜内側面及び前記傾斜外側面は、前記溝の内、前記複数の締結部材から離間した部分に形成された、請求項５に記載の電子制御装置。     The first housing and the second housing are fixed by a plurality of fastening members,
    The electronic control device according to claim 5, wherein the inclined inner side surface and the inclined outer side surface are formed in portions of the groove that are separated from the plurality of fastening members.
  10. 　前記筐体には、車載装置のケースに形成された開口の外周に固定可能なブラケットを設けた、請求項１に記載の電子制御装置。 The electronic control device according to claim 1, wherein the housing is provided with a bracket that can be fixed to the outer periphery of an opening formed in the case of the vehicle-mounted device.
PCT/JP2019/040567 2018-11-09 2019-10-16 Electronic control device WO2020095635A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07237267A (en) * 1994-02-28 1995-09-12 Nippondenso Co Ltd Structure for bonding resin case
JP2005143138A (en) * 2005-01-31 2005-06-02 Fujitsu Frontech Ltd Drip-proof joint structure for cover
JP2010056493A (en) * 2008-08-29 2010-03-11 Hitachi Automotive Systems Ltd Electronic control device
WO2015146366A1 (en) * 2014-03-25 2015-10-01 日立オートモティブシステムズ株式会社 Motor vehicle internal combustion engine control apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07237267A (en) * 1994-02-28 1995-09-12 Nippondenso Co Ltd Structure for bonding resin case
JP2005143138A (en) * 2005-01-31 2005-06-02 Fujitsu Frontech Ltd Drip-proof joint structure for cover
JP2010056493A (en) * 2008-08-29 2010-03-11 Hitachi Automotive Systems Ltd Electronic control device
WO2015146366A1 (en) * 2014-03-25 2015-10-01 日立オートモティブシステムズ株式会社 Motor vehicle internal combustion engine control apparatus

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