WO2020091962A1 - Data relocation in memory - Google Patents
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- WO2020091962A1 WO2020091962A1 PCT/US2019/055289 US2019055289W WO2020091962A1 WO 2020091962 A1 WO2020091962 A1 WO 2020091962A1 US 2019055289 W US2019055289 W US 2019055289W WO 2020091962 A1 WO2020091962 A1 WO 2020091962A1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0628—Interfaces specially adapted for storage systems making use of a particular technique
- G06F3/0638—Organizing or formatting or addressing of data
- G06F3/064—Management of blocks
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
- G06F3/0604—Improving or facilitating administration, e.g. storage management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/0223—User address space allocation, e.g. contiguous or non contiguous base addressing
- G06F12/023—Free address space management
- G06F12/0238—Memory management in non-volatile memory, e.g. resistive RAM or ferroelectric memory
- G06F12/0246—Memory management in non-volatile memory, e.g. resistive RAM or ferroelectric memory in block erasable memory, e.g. flash memory
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
- G06F3/0614—Improving the reliability of storage systems
- G06F3/0616—Improving the reliability of storage systems in relation to life time, e.g. increasing Mean Time Between Failures [MTBF]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0628—Interfaces specially adapted for storage systems making use of a particular technique
- G06F3/0646—Horizontal data movement in storage systems, i.e. moving data in between storage devices or systems
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
- G06F3/0671—In-line storage system
- G06F3/0673—Single storage device
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
- G06F3/0671—In-line storage system
- G06F3/0673—Single storage device
- G06F3/0679—Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2212/00—Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
- G06F2212/10—Providing a specific technical effect
- G06F2212/1016—Performance improvement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2212/00—Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
- G06F2212/10—Providing a specific technical effect
- G06F2212/1032—Reliability improvement, data loss prevention, degraded operation etc
- G06F2212/1036—Life time enhancement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2212/00—Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
- G06F2212/72—Details relating to flash memory management
- G06F2212/7211—Wear leveling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Definitions
- the present disclosure relates generally to semiconductor memory and methods, and more particularly, to data relocation in memory.
- Memory devices are typically provided as internal,
- Volatile memory can require power to maintain its data and can include random-access memory (RAM), dynamic random access memory’ (DRAM), and synchronous dynamic random access memory (SDRAM), among others.
- RAM random-access memory
- DRAM dynamic random access memory
- SDRAM synchronous dynamic random access memory
- Non-volatile memory can provide persistent data by retaining stored data when not powered and can include NAND flash memory ' , NOR flash memory’, read only memory’ (ROM), and resistance variable memory such as phase change random access memory (PCRAM), resistive random access memory (RRAM), and magnetic random access memory (MRAM), among others.
- PCRAM phase change random access memory
- RRAM resistive random access memory
- MRAM magnetic random access memory
- SSD solid state drive
- MMC embedded MultiMediaCard
- UFS universal flash storage
- An SSD, e.MMC, and/or UFS device can include non volatile memory (e.g., NAND flash memory' and/or NOR flash memory), and/or can include volatile memory (e.g., DRAM and/or SDRAM), among various other types of non-volatile and volatile memory'.
- Non-volatile memory may be used in a wide range of electronic applications such as personal computers, portable memory sticks, digital cameras, cellular telephones, portable music players such as MP3 players, movie players, among others.
- Flash memory devices can include memory cells storing data in a charge storage structure such as a floating gate, for instance. Flash memory devices typically use a one-transistor memory cell that allows for high memory' densities, high reliability', and low power consumption.
- Resistance variable memory devices can include resistive memory cells that can store data based on the resistance state of a storage element (e.g., a resistive memory element having a variable resistance).
- Memory cells can be arranged into arrays, and memory cells in an array architecture can be programmed to a target (e.g.. desired) state. For instance, electric charge can be placed on or removed from the charge storage structure (e.g., floating gate) of a flash memory cell to program the cell to a particular data state.
- the stored charge on the charge storage structure of the cell can indicate a thr eshold voltage (Vt) of the cell.
- Vt thr eshold voltage
- a state of a flash memory cell can be determined by sensing the stored charge on the charge storage structure (e.g., the Vt) of the cell.
- resistive memory cells can be programmed to store data corresponding to a target data state by varying the resistance level of the resistive memory' element.
- Resistive memory' cells can be programmed to a target data state (e.g., corresponding to a particular resistance state) by applying sources of an electrical field or energy, such as positive or negative electrical pulses (e.g., positive or negative voltage or current pulses) to the cells (e.g., to the resistive memory element of the cells) for a particular duration.
- a state of a resistive memory' cell can be determined by sensing current through the cell responsive to an applied interrogation voltage. The sensed current, which varies based on the resistance level of the cell, can indicate the state of the cell.
- a single level memory cell can be programmed to a targeted one of two different data states, which can be represented by' the binary units 1 or 0.
- Some flash and resistive memory cells can be programmed to a targeted one of more than tw'o data states (e.g., 1111, 01 11 , 0011, 1011, 1001, 0001, 0101, 1101, 1100, 0100, 0000, 1000, 1010, 0010, 0110, and 1110).
- Such cells may' be referred to as multi state memory cells, multiunit cells, or multilevel cells (MLCs).
- MLCs can provide higher density memories wdthout increasing the number of memory cells since each cell can represent more than one digit (e.g., more than one bit).
- Figure 1 illustrates a diagram of a portion of a memory ar ray having a number of physical blocks in accordance with an embodiment of the present disclosure.
- Figure 2 is a block diagram of a computing system including a host and an apparatus in the form of a memory device in accordance with an embodiment of the present disclosure.
- Figure 3 illustrates a conceptual example of a group of memory cells that includes a plurality of physical units of memory cells in accordance with an embodiment of the present di sclosure.
- Figure 4 illustrates a conceptual example of a sequence of da ta relocation operations performed in memory in accordance with an embodiment of the present disclosure.
- Figure 5 illustrates a method for an algebraic mapping to identify a physical location to which data has been relocated in memory in accordance with an embodiment of the present disclosure.
- the present disclosure includes apparatuses, methods, and systems for data relocation in memory.
- An embodiment includes a controller, and a memory having a plurality of physical units of memory cells. Each of the physical units has a different sequential physical address associated therewith, a first number of the physical units have data stored therein, a second number of the physical units do not have data stored therein, and the physical address associated with each respective one of the second number of physical units is a different consecutive physical address in the sequence.
- the controller can relocate the data stored in the physical unit of the first number of physical units, whose physical address in the sequence is immediately before the first of the consecutive physical addresses associated with the second number of physical units, to the last of the consecutive physical addresses associated with the second number of physical units.
- a w3 ⁇ 4ar-leveiing operation can include and/or refer to an operation to relocate data currently being stored in one physical location of a memory to another physical location of the memory, in order to more uniformly distribute memory cell wear that may be caused by program (e.g., write) operations across the memory.
- Performing wear-levelin operations can increase the performance (e.g., increase the speed, increase the reliability, and/or decrease the power consumption) of the memory, and/or can increase the endurance (e.g., lifetime) of the memory.
- Previous wear-leveling operations may use tables to relocate the data in the memory.
- tables may be large (e.g., may use a large amount of space in the memory), may be complex (e.g., may use a large amount of resources) and may cause the wear-leveling operations to be slow' (e.g., may cause latency in the memory).
- operations to relocate data in accordance with the present disclosure may maintain an algebraic mapping (e.g., an algebraic mapping between logical and physical addresses) for use in identifying the physical location to which the data has been relocated.
- an algebraic mapping e.g., an algebraic mapping between logical and physical addresses
- operations to relocate data in accordance with the present disclosure may use less space in the memory, may use less resources, and may be faster, than previous wear-leveling operations.
- operations to relocate data in accordance with the present disclosure may provide a greater increase to (e.g., closer to the theoretical maximum of) the performance and/or endurance of the memory' than previous w'ear-leveling operations.
- operations to relocate data in accordance with the present disclosure may be flexible and/or changeable (e.g. tunable), in order to match the wear to the current workloads across the memory, increase or decrease the endurance of the memory to match the current needs of the memory, meet the endurance requirements of certain workloads that would otherwise wear out the memory, and/or match the wear leveling to different types of memory'.
- previous wear-leveling operations may not have such flexibility.
- operations to relocate data in accordance with the present disclosure can provide protection from pathological workloads and/or attacks on targeted memory cells having the intention of causing early failure of the memory.
- operations to relocate data in accordance with the present disclosure may be implementable in hardware.
- operations to relocate data in accordance with the present disclosure may be implementable in the controller of the memory completely as hardware, or as a combination of hardware and software. Accordingly, operations to relocate data in accordance with the present disclosure may not impact the latency of the memory, and may not add additional overhead to the memory.
- a memory' device can refer to one or more memory' devices, and a plurality of memory devices can refer to two or more memory devices.
- designators“R”,“B”,“S”, and“N”, as used herein, particularly with respect to reference numerals in the drawings, indicates that a number of the particular feature so designated can be included with a number of embodiments of the present disclosure.
- FIG. 1 illustrates a diagram of a portion of a memory' array 101 having a number of physical blocks in accordance with an embodiment of the present disclosure.
- Memory array 101 can be, for example, a NAND flash memory array.
- memory array 101 can be a storage class memory' (SCM) array, such as, for instance, a three-dimensional cross- point (3D XPoint) memory array', a ferroelectric RAM (FRAM) array, or a resistance variable memory' array such as a PCRAM, RRAM, or spin torque transfer (STT) array, among others.
- SCM storage class memory'
- memory array 101 can be located on a particular semiconductor die along with various peripheral circuitry associated with the operation thereof.
- memory array 101 has a number of physical blocks 107-0 (BLOCK 0), 107-1 (BLOCK 1), . . ., 107-B (BLOCK B) of memory cells.
- the memory cells can be single level cells and'or multilevel ceils such as, for instance, two level ceils, triple level cells (TLCs) or quadruple level cells (QLCs).
- the number of physical blocks in memory array 101 may be 128 blocks, 512 blocks, or 1,024 blocks, but embodiments are not limited to a particular power of two or to any particular number of physical blocks in memory array 101.
- a number of physical blocks of memory cells e.g., blocks 107-0,
- 107-1, . . ., 107-B can be included in a plane of memory cells, and a number of planes of memory cells can be included on a die.
- each physical block 107-0, 107-1, . . ., 107-B can be part of a single die. That is, the portion of memory array 101 illustrated in Figure 1 can be a die of memory cells.
- B includes a number of physical rows (e.g., 103-0, 103-1, . . ., 103-R) of memory cells coupled to access lines (e.g., word lines).
- the number of rows (e.g., word lines) in each physical block can be 32, but embodiments are not limited to a particular number of rows 103-0, 103-1, . . ., 103-R per physical block.
- the memory cells can be coupled to sense lines (e.g., data lines and/or digit lines).
- each row 103-0, 103- 1, . . ., 103-R comprises one physical page of memory cells.
- each row' can comprise multiple physical pages of memory cells (e.g., one or more even pages of memory cells coupled to even-numbered bit lines, and one or more odd pages of memory cells coupled to odd numbered bit lines).
- a physical page of memory cells can store multiple pages (e.g., logical pages) of data (e.g., an upper page of data and a lower page of data, with each cell in a physical page storing one or more bits towards an upper page of data and one or more bits towards a lower page of data).
- pages e.g., logical pages
- data e.g., an upper page of data and a lower page of data, with each cell in a physical page storing one or more bits towards an upper page of data and one or more bits towards a lower page of data.
- a page of memory cells can comprise a number of physical sectors 105-0, 105-1 , . . ., 105-S (e.g., subsets of memory cells).
- Each physical sector 105-0, 105-1, . . ., 105-S of cells can store a number of logical sectors of data.
- each logical sector of data can correspond to a portion of a particular page of data.
- a first logical sector of data stored in a particular phy sical sector can correspond to a logical sector corresponding to a first page of data
- a second logical sector of data stored in the particular physical sector can correspond to a second page of data.
- Each physical sector 105-0, 105-1, . . ., 105-S can store system and/or user data, and/or can include overhead data, such as error correction code (ECC) data, logical block address (LBA) data, and metadata.
- ECC error correction code
- LBA logical block address
- Logical block addressing is a scheme that can be used by a host for identifying a logical sector of data.
- each logical sector can correspond to a unique logical block address (LBA).
- LBA may also correspond (e.g., dynamically map) to a physical address, such as a physical block address (PBA), that may indicate the physical location of that logical sector of data in the memory.
- PBA physical block address
- a logical sector of data can be a number of bytes of data (e.g., 256 bytes, 512 bytes. 1,024 bytes or 4,096 bytes). However, embodiments are not limited to these examples.
- rows 103-0, 103-1, . . ., 103-R, sectors 105-0, 105-1, . . ., 105- S, and pages are possible.
- rows 103-0, 103-1 , . . ., 103-R of physical blocks 107-0, 107-1 , . . ., 107-B can each store data corresponding to a single logical sector which can include, for example, more or less than 512 bytes of data.
- FIG. 2 is a block diagram of a computing system 200 including a host 202 and an apparatus in the form of a memory device 206 in accordance with an embodiment of the present disclosure.
- an“apparatus” can refer to, but is not limited to, any of a variety of structures or combinations of structures, such as a circuit or circuitry, a die or dice, a module or modules, a device or devices, or a system or systems, for example.
- computing system 200 can include a number of memory devices analogous to memory device 206.
- memory device 206 can include a memory 216 having a number of memory arrays 201-1, 201-2, . . ., 201-N.
- Memory' arrays 201-1, 201-2, . . ., 201-N can be analogous to memory array 101 previously described in connection with Figure 1.
- memory arrays 201-1, 201-2, . . 201-N can be NAND flash memory arrays and/or SCM arrays.
- Memory arrays 201-1, 201-2, . . 201-N can include (e.g., be divided into) a number of groups (e.g., zones or regions) of memory cells. Each respective group can include a plurality of physical units of memory' cells, such as, for instance, a plurality of physical pages and/or blocks of memory cells, in a maimer analogous to memory array 101 previously described in connection with Figure 1.
- a physical unit (e.g., physical page or block) of memory cells can refer to a unit of programing and/or sensing (e.g., a number of memory cells that are programmed and/or sensed together as a functional group), as previously described in connection with Figure 1.
- Each of the physical units of each respective group of memory cells can have a different sequential physical address (e.g., a different physical address in a sequence of physical addresses) associated therewith.
- a first number of the physical units of each respective group may have data (e.g., user data) stored therein, and each respective one of these first number of physical units of each respective group can also have a different sequential logical address (e.g. a different logical address in a sequence of logical addresses) associated therewith.
- a second number of (e.g., the remaining) physical units of each respective group may not have data stored therein or a sequential logical address associated therewith, and the physical address associated with each respective one of the second number of physical units of each respective group can be a different consecutive physical address in the sequence.
- the first number of physical units of each respective group may be referred to herein as the user units of that group, and the second number of physical units of each respective group may be referred to herein as the spare units of that group.
- An example illustrating the user units and spare units of a group of memory cells will be further described herein (e.g., in connection with Figure 3).
- each of the physical units of each respective group of memory' cells can have the same size.
- each of the physical units of each respective group can have the same number of memory cells, and/or can be capable of storing the same amount of data.
- the spare units of each respective group of memory cells can comprise a prime number of physical units (e.g., the number of spare imits of each respective group can be a prime number), such that the greatest common denominator of the number of user units and the number of spare units of each respective group is one.
- a prime numerical relationship between the number of user units and the number of spare units of each respective group can prevent oscillation of the spare units of the group as they move (e.g., slide) through the group, as will be further described herein.
- host 202 can be coupled to the memory device 206 via interface 204.
- Host 202 and memory device 206 can be coupled to the memory device 206 via interface 204.
- Host 202 and memory device 206 can be coupled to the memory device 206 via interface 204.
- Host 202 can be a laptop computer, personal computer, digital camera, digital recording and playback device, mobile telephone, PDA, memory card reader, or interface hub, among other host systems, and can include a memory access device (e.g., a processor).
- a processor can intend one or more processors, such as a parallel processing system, a number of coprocessors, etc.
- Interface 204 can be in the form of a standardized physical interface.
- interface 204 can be a serial advanced technology attachment (SATA) physical interface, a peripheral component interconnect express (PCIe) physical interface, a universal serial bus (USB) physical interface, or a small computer system interface (SCSI), among other physical connectors and or interfaces.
- SATA serial advanced technology attachment
- PCIe peripheral component interconnect express
- USB universal serial bus
- SCSI small computer system interface
- interface 204 can provide an interface for passing control, address, information (e.g., data), and other signals between memory’ device 206 and a host (e.g., host 202) having compatible receptors for interface 204.
- host e.g., host 202
- Memory device 206 includes controller 208 to communicate with host 202 and with memory 216 (e.g., memory arrays 201-1, 201-2, . . ., 201-N). For instance, controller 208 can send commands to perform operations on memory? arrays 201-1, 201-2, . . ., 201-N, including operations to sense (e.g., read), program (e.g., write), move, and/or erase data, among other operations.
- sense e.g., read
- program e.g., write
- move e.g., move
- erase data e.g., among other operations.
- Controller 208 can be included on the same physical device (e.g., the same die) as memory ’ 216. Alternatively, controller 208 can be included on a separate physical device that is communicatively coupled to the physical device that includes memory 216. In an embodiment, components of controller 208 can be spread across multiple physical devices (e.g., some components on the same die as the memory, and some components on a different die, module, or board) as a distributed controller.
- Host 202 can include a host controller (not shown Figure 2) to communicate with memory' device 206.
- the host controller can send commands to memory' device 206 via interface 204.
- the host controller can communicate with memory device 206 and/or the controller 208 on the memory device 206 to read, write, and/or erase data, among other operations.
- Controller 208 on memory' device 206 and/or the host controller on host 202 can include control circuitry ' and/or logic (e.g., hardware and firmware).
- controller 208 on memory device 206 and/or the host controller on host 202 can be an application specific integrated circuit (ASIC) coupled to a printed circuit board including a physical interface.
- ASIC application specific integrated circuit
- memory device 206 and/or host 202 can include a buffer of volatile and/or non volatile memory and a number of registers.
- memory device can include circuitry 210.
- circuitry' 210 is included in controller 208.
- circuitry 214 may be included in (e.g., on the same die as) memory 216 (e.g., instead of in controller 208).
- Circuitry' 210 can comprise, for instance, hardware and/or software.
- Circuitry 210 can perform wear leveling operations to relocate data stored in memory' arrays 201-1 , 201-2, . . ., 201-N in accordance with the present disclosure (e.g., without using a table, such as a lookup table or an address translation table).
- circuitry 214 can, for a group of memory cells, relocate the data stored in the physical unit of the user units of that group, whose physical address in the physical address sequence is immediately before (e.g., in front of) the first of the consecutive physical addresses associated with the spare units of that group, to the last of the consecutive physical addresses associated with the spare units of that group (e.g., the data is relocated from the user unit that is immediately before the first spare unit in the sequence to the last spare unit in the sequence). That is, the physical address associated with the physical unit from which the data is relocated is immediately before the first of the sequential physical addresses associated with the spare units, and the physical address associated with the physical unit to which the data is relocated is the last of the sequential physical addresses associated with the spare units.
- Such a data relocation may result in the user unit from which the data was relocated becoming the spare unit that has the first of the consecutive physical addresses associated with the spare units, and the spare unit that had the next-to-last of the consecutive physical addresses associated with the spare units becoming the spare unit that has the last of the consecutive physical addresses associated with the spare units (e.g., the user unit from which the data is relocated becomes the first spare unit in the sequence, and the next-to- last spare unit in the sequence becomes the last spare unit in the sequence).
- An example illustrating such a data relocation operation will be further described herein (e.g., in connection with Figure 4).
- circuitry 210 may perform such a wear leveling operation to relocate the data responsive to a triggering event.
- the triggering event may be, for example, a particular number of program operations being performed (e.g., executed) on memory' 216.
- circuitry 210 can include a counter 212 (e.g., a write interval counter) that can count the number of program operations being performed on memory 216, and send a signal to initiate the relocation of the data in response to the particular number of program operations being performed. Circuitry 210 may then perform the operation to relocate the data in response to the initiation signal from counter 212, and counter 212 may be reset to zero upon the data being relocated.
- a counter 212 e.g., a write interval counter
- the particular number of program operations that may trigger the data relocation may be selected based on the total number of physical units (e.g., the sum of the user units and spare units) of the group, and the theoretical maximum endurance of memory 216. For instance, the particular number of program operations may be selected such that the total number of physical units of the group is much less than the theoretical maximum endurance of memory 216 divided by the particular number of program operations.
- circuitry 210 can include a register
- Register 214 can store the logical address (e.g., a value indicating the logical address) associated with the user unit of the group whose physical address in the physical address sequence is the first of the physical addresses in the sequence (e.g., the logical starting location of the user units). Once the spare units of the group have moved through the entire group, register 214 may be incremented by one element.
- logical address e.g., a value indicating the logical address
- controller 208 can include additional (e.g., separate) circuitry analogous to circuitry 210 for each respective group that can perform wear leveling operations in accordance with the present disclosure on its respective group.
- controller 208 can include separate circuitry for each respective group that can, for its respective group, relocate the data stored in the physical unit of the user units of that group, whose physical address in the physical address sequence is immediately before the first of the consecutive physical addresses associated with the spare units of that group, to the last of the consecutive physical addresses associated with the spare units of that group, in a manner analogous to that described for circuitry 210.
- Dividing memory arrays 201-1, 201-2, . . ., 201-N into multiple groups in such a manner can reduce the number of user units per group. Reducing the number of user units per group can increase the frequency at which the spare units of each respective group rotate and/or move through memory arrays 201-1, 201-2, . . 202-N, which can increase the endurance of memory 216 closer to its theoretical maximum. Further, the wear across memory 216 can evened out by performing zone swapping.
- the circuitry can swap a“hot” zone of memory 216 (e.g., a zone whose data is being accessed at a high frequency during program and/or sense operations) with a“cold” zone of memory 216 (e.g., a zone whose data is being accessed at a low frequency during program and/or sense operations) by setting (e.g. using an extended base address counter) a particular wear thr eshold for a“hot” zone, and tracking the number of times the spare units of a zone rotate and/or move through all the physical units of that zone.
- a“hot” zone of memory 216 e.g., a zone whose data is being accessed at a high frequency during program and/or sense operations
- a“cold” zone of memory 216 e.g., a zone whose data is being accessed at a low frequency during program and/or sense operations
- circuitry 210 can change (e.g., tune) the number (e.g., quantity) of the physical units of a group that do not have data stored therein (e.g., change the number of spare units of the group). For example, circuitry 210 can increase the number of spare units of the group to increase the endurance (e.g., the lifetime) of memory 216 (e.g., of the memory cells of memory 216), or decrease the number of spare units of the group to store (e.g., to make room to store) more user data in memory 216. The number of spar e units of the group can be changed before or after the data has been relocated in the group.
- the number of spare units of the group may be changed , for example, based on the average endurance (e.g. lifetime) of memory 216 (e.g., of the memory cells of memory 216). For instance, the number of spare units may be tuned to match the average endurance of memory 216. As an additional example, the number of spare units of the group may be changed based on the workload of memory 216. For instance, the number of spare units may be tuned to meet the endurance requirements of certain workloads being performed, or to be performed, on memory 216. As an additional example, the number of spare units of the group may be changed based on the type of memory 216 (e.g., NAND flash, SCM, etc.). For instance, the number of spare units may be tuned based on the write endurance parameters for the type of memory' 216.
- the average endurance e.g. lifetime
- the number of spare units of the group may be changed based on the workload of memory 216. For instance, the number of spare units may be tuned to meet the endurance requirements of certain workloads being performed, or
- circuitry ' 210 can use algebraic mapping to identify the physical location in memory 216 to which the data has been relocated.
- circuitry 210 can use algebraic mapping (e.g., algebraic logical to physical mapping) to identify (e.g., compute) the physical address associated with the spare unit in the sequence to which the data has been relocated.
- circuitry 214 can use the algebraic mapping to identify the physical address associated with the spare unit in the sequence to which the data has been relocated during an operation to sense that relocated data (e.g. upon receiving a request from host 202 to read that relocated data).
- Such an algebraic mapping will be further described herein (e.g., in connection with Figure 5).
- circuitry' 210 can randomize the logical addresses associated with the user units.
- Circuitry 210 can randomize the logical addresses associated with the user units, for example, by using a static address randomizer that utilizes a Feistel network, random invertible binary' matrix, or fixed address bit scrambling, to randomly map the logical addresses to intermediate addresses. Randomizing the logical addresses associated with the user units can reduce the spatial correlation of (e.g.. spatially separate) heavily written (e.g., hot) user units (which otherwise tend to be spatially close to each other), which can increase the endurance of memory 216 closer to its theoretical maximum.
- Circuitry 210 can perform additional (e.g., subsequent) wear leveling operations to further relocate the data stored in memory arrays 201-1, 201-2, . . ., 201-N throughout the lifetime of memory 216. For instance, circuitry 210 can perform an additional (e.g., subsequent) operation to relocate the data responsive to an additional (e.g., subsequent) triggering event.
- additional wear leveling operations e.g., subsequent wear leveling operations to further relocate the data stored in memory arrays 201-1, 201-2, . . ., 201-N throughout the lifetime of memory 216.
- circuitry 210 can perform an additional (e.g., subsequent) operation to relocate the data responsive to an additional (e.g., subsequent) triggering event.
- circuitry 210 can relocate the data stored in the physical unit of the user units, whose physical address in the physical address sequence is immediately before the physical address associated with the user unit from which the data was relocated in the previous relocation operation (e.g., immediatefy before the unit that has now become the first of the spare units in the sequence), to the physical address of the spare unit that was previously the next-to-last of the consecutive physical addresses associated with the spare units (e.g., to the spare unit that has now become the last of the spare units in the sequence).
- the data stored in the physical unit of the user units whose physical address in the physical address sequence is immediately before the physical address associated with the user unit from which the data was relocated in the previous relocation operation (e.g., immediatefy before the unit that has now become the first of the spare units in the sequence), to the physical address of the spare unit that was previously the next-to-last of the consecutive physical addresses associated with the spare units (e.g., to the spare unit that has now become the last of the spare units in the sequence).
- Such a data relocation may once again result in the user unit from which the data was relocated becoming the spare unit that has the first of the consecutive physical addresses associated with the spare units, and the spare unit that had the next-to-last of the consecutive physical addresses associated with the spare units becoming the spare unit that has the last of the consecutive physical addresses associated with the spare units, and subsequent data relocation operations can continue to be performed in an analogous manner.
- An example illustrating a sequence of such subsequent data relocation operations will be further described herein (e.g., in connection with Figure 4).
- memory device 206 can include address circuitry to latch address signals provided over I/O connectors through I/O circuitry. Address signals can be received and decoded by a row' decoder and a column decoder, to access memory arrays 201-1, 201-2, . . ., 201- N. Further, memory device 206 can include a main memory, such as, for instance, a DRAM or SDRAM, that is separate from and'or in addition to memory arrays 201-1, 201-2, . . ., 201-N.
- main memory such as, for instance, a DRAM or SDRAM
- Figure 3 illustrates a conceptual example 320 of a group of memory cells that includes (e.g., is divided into) a plurality of physical units of memory cells in accordance with an embodiment of the present disclosure.
- the group includes 13 physical units (e.g., physical units 322-0 through 322-12).
- embodiments of the present disclosure are not limited to a particular number of physical units per group.
- the physical units can be, for instance, units of programming and/or sensing, as previously described herein, and each respective physical unit can have the same size, as previously described herein.
- each physical unit 322-0 through 322-12 has a different sequential physical address associated therewith.
- the physical address for each respective physical unit is illustrated (e.g., represented) in Figure 3 as the number that is in parentheses for that physical unit. For instance, in the example illustrated in Figure 3, the sequence of physical addresses runs from 0 to 12, with the physical address for physical unit 322-0 being 0, the physical address for physical unit 322-1 being 1, and so on, up to the physical address for physical unit 322-12 being 12.
- physical units 322-0 through 322-9 have data (e.g. user data) stored therein. These physical units may be referred to collectively as user units 324-1. Although the group includes ten user units in the example illustrated in Figure 3, embodiments of the present disclosure are not limited to a particular number of user units per group.
- the group ma include enough user units such that the spare units of the group rotate through the group multiple times before the theoretical maximum endurance of the memory ceils of the group is reached.
- each respective one of the user units 324-1 has a different sequential logical address associated therewith, represented by the number that is not in parentheses for that physical unit.
- the sequence of logical addresses runs from 0 to 9, with the logical address for user unit 322-0 being 0, the logical address for user unit 322-1 being 1 , and so on, up to the logical address for user unit 322-9 being 9.
- the user unit whose logical address is first in the logical address sequence of the group can be referred to herein as the base unit.
- user unit 322-0 is the base unit.
- the physical address associated with the base unit e.g., 0 in the example illustrated in Figure 3
- physical units 322-10 through 322-12 do not have data stored therein. Further, physical units 322-10 through 322-12 do not have a sequential logical address associated therewith, as represented by the‘X’ in those physical units. These physical units may be referred to collectively as spare units 324-2, and can comprise a prime number of physical units (e.g., three), as previously described herein.
- the physical address associated with each respective one of the spare units 324-2 is a different consecutive physical address in the physical address sequence of the group.
- the physical address associated with spare unit 322-10 is 10
- the physical address associated with spare unit 322-1 1 is 11
- the physical address associated with spare unit 322-12 is 12.
- the first spare unit in the spare unit sequence of the group can be referred to herein as the edge unit.
- spare unit 322-10 is the edge unit.
- the physical address associated with the edge unit e.g., 10 in the example illustrated in Figure 3
- Figure 4 illustrates a conceptual example 403 of a sequence of data relocation operations performed in memory in accordance with an embodiment of the present disclosure.
- the memory' may be, for example, memory 216 previously described in connection with Figure 2, and may include a group of memory cells having a plurality of physical units of memory cells, each unit having a different sequential physical address 0 to 12 associated therewith, in a manner analogous to that previously described in connection with Figure 3.
- the group may include ten user units each having a different sequential logical address 0 to 9 associated therewith, and three spare units that do not have data stored therein or a sequential logical address associated therewith, in a manner analogous to that previously described in connection with Figure 3.
- the data relocation operations may be performed by, for example, circuitry’ 210 previously described in connection with Figure 2.
- the first (e.g., top) row in Figure 4 shows the allocation of the user units and the spare units of the group before the first data relocation operation of the sequence is performed, and is analogous to the allocation described in connection with Figure 3.
- the user units have the first ten (e.g., 0 to 9) of the sequential physical addresses associated therewith, and the spare units have the last three (e.g., 10 to 12) of the sequential physical addresses associated therewith.
- Each subsequent row below the first row in Figure 4 shows the allocation of the user units and spare units of the group after the performance of each respective data relocation operation in the sequence.
- the second row in Figure 4 shows the unit allocation after the performance of the first data relocation operation
- the third row in Figure 4 shows the unit allocation after the performance of the second data relocation, and so on, down to the last (e.g., bottom) row in Figure 4 that shows the unit allocation after the
- the user unit from which the data was relocated (e.g., the physical unit w’hose physical address is 9) has become the first spare unit in the spare unit sequence, and the spare unit that had been the next-to-last spare unit in the spare unit sequence (e.g., the physical unit whose physical address is 11) bas become the last spare unit in the spare unit sequence.
- the user unit from which the data was relocated during the second data relocation operation (e.g., the physical unit whose physical address is 8) has become the first spare unit in the spare unit sequence, and the spare unit that had been the next-to-last spare unit in the spare unit sequence before the second data relocation operation (e.g., the physical unit whose physical address is 10) has become the last spare unit in the spare unit sequence.
- the user unit from which the data w r as relocated during the third data relocation operation (e.g., the physical unit wfiose physical address is 7) has become the first spare unit in the spare unit sequence, and the spare unit that had been the next-to-last spare unit in the spare unit sequence before the third data relocation operation (e.g., the physical unit wfiose physical address is 9) has become the last spare unit in the spare unit sequence.
- the remaining data relocation operations of the sequence can continue in an analogous manner, as shown in the remaining rows in Figure 4.
- the effect of the data relocation operations is to sequentially move (e.g., slide) the spare units through the user units, until the spare units have rotated through the entire group.
- Each respective data relocation operation in the sequence can be performed responsive to a separate triggering event, as previously described herein (e.g., in connection with Figure 2).
- Figure 5 illustrates a method 540 for an algebraic mapping to identify a physical location to which data has been relocated in memory in accordance with an embodiment of the present disclosure.
- the memory' may be, for example, memory 216 previously described in connection with Figure 2, and may include a group of memory cells having a plurality of physical units (e.g., user units and spare units) of memory cells, each unit having a different sequential physical address associated therewith, in a manner analogous to that previously described in connection with Figures 2-3.
- Method 540 e.g., the algebraic mapping illustrated in Figure 5
- a physical address for the relocated data is determined (e.g., calculated).
- the physical address (PA) for the relocated data is given by:
- PA (LA + BASE) % (U N) where LA is the logical address of the relocated data in the memory, BASE is the physical address associated with the base unit of the group, U is the number of user units in the group, and N is the number of spare units in the group (e.g., U+N is the total number of physical units in the group).
- the physical address calculated at block 542 is determined whether the physical address for the relocated data calculated at block 542 is greater than or equal to the physical address associated with the edge unit of the group. If it is determined that the physical address calculated at block 542 is not greater than or equal to the physical address associated with the edge unit of the group, then the physical address calculated at block 542 is determined to be the physical location to which the data has been relocated in the memory, and that physical address is returned as the identified physical location (e.g., the identified physical address) at block 548.
- method 540 proceeds to block 546, where a different physical address for the relocated data is determined (e.g., calculated). As shown in Figure 5, this physical address (PA) is calculated by adding the number of spare units in the group (N) to the physical address (PA) calculated at block 542. This physical address calculated at block 546 is then returned as the identified physical location (e.g., the identified physical address) to which the data has been relocated at block 548.
- a different physical address for the relocated data is determined (e.g., calculated).
- this physical address (PA) is calculated by adding the number of spare units in the group (N) to the physical address (PA) calculated at block 542.
- This physical address calculated at block 546 is then returned as the identified physical location (e.g., the identified physical address) to which the data has been relocated at block 548.
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Abstract
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JP2021523480A JP2022506259A (en) | 2018-11-01 | 2019-10-09 | Data relocation in memory |
KR1020217015011A KR20210063432A (en) | 2018-11-01 | 2019-10-09 | data relocation in memory |
CN201980071737.3A CN112997160A (en) | 2018-11-01 | 2019-10-09 | Data relocation in memory |
EP19877648.6A EP3874374A4 (en) | 2018-11-01 | 2019-10-09 | Data relocation in memory |
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US16/177,985 US10795576B2 (en) | 2018-11-01 | 2018-11-01 | Data relocation in memory |
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US10795576B2 (en) * | 2018-11-01 | 2020-10-06 | Micron Technology, Inc. | Data relocation in memory |
CN113568562A (en) * | 2020-04-28 | 2021-10-29 | 华为技术有限公司 | Storage system, memory management method and management node |
US20210012844A1 (en) * | 2020-09-25 | 2021-01-14 | Intel Corporation | Endurance and serviceability in solid state drives |
US11960753B2 (en) * | 2021-08-25 | 2024-04-16 | Western Digital Technologies, Inc. | Solution for super device imbalance in ZNS SSD |
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US20200142589A1 (en) | 2020-05-07 |
KR20210063432A (en) | 2021-06-01 |
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US10795576B2 (en) | 2020-10-06 |
JP2022506259A (en) | 2022-01-17 |
US20210019052A1 (en) | 2021-01-21 |
EP3874374A1 (en) | 2021-09-08 |
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