WO2020087933A1 - Antenna unit, antenna module and large-scale array antenna - Google Patents

Antenna unit, antenna module and large-scale array antenna Download PDF

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Publication number
WO2020087933A1
WO2020087933A1 PCT/CN2019/090785 CN2019090785W WO2020087933A1 WO 2020087933 A1 WO2020087933 A1 WO 2020087933A1 CN 2019090785 W CN2019090785 W CN 2019090785W WO 2020087933 A1 WO2020087933 A1 WO 2020087933A1
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WIPO (PCT)
Prior art keywords
antenna
feeding
post
metallic
substrate
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PCT/CN2019/090785
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French (fr)
Chinese (zh)
Inventor
段红彬
李明超
潘荫杰
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京信通信技术(广州)有限公司
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Publication of WO2020087933A1 publication Critical patent/WO2020087933A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0006Particular feeding systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061Two dimensional planar arrays

Definitions

  • the invention relates to the technical field of mobile communication, and relates to an antenna unit, an antenna module and a large-scale array antenna.
  • the antenna unit usually includes a metal base plate and a metal partition plate provided on the metal base plate.
  • the metal base plate is often formed by metal die-casting or sheet metal technology
  • the partition is usually formed by metal die-casting, aluminum extrusion pultrusion or sheet metal technology to meet the diverse layout space requirements of antennas based on 5G large-scale dense high-frequency arrays
  • the antenna unit is heavy, which makes it difficult to achieve a lightweight design for the entire antenna system
  • Second, the size of the base plate of the 5G large-scale dense high-frequency array is often large.
  • the thickness of the metal base plate often needs to be thickened, which will further increase the weight of the antenna unit;
  • the metal spacer can only be fixed to the metal base plate by screws Or use welding / metal die-casting process to fix the connection with the metal base plate.
  • 5G high-frequency applications it is difficult to meet the requirements of 5G high-band antennas for the radiation boundary gap on the other hand.
  • any of the connection methods there is a high insertion loss and intermodulation of the 5G antenna Increased risk of poor consistency and assembly complex issues.
  • the feed network is mostly in the form of PCB.
  • the feed network is usually fixed and connected to the base plate of the substrate by a screw.
  • the radiating unit usually uses metal die casting, sheet metal or PCB vibrator.
  • the electrical networks are usually directly welded or connected by coaxial cable. Not only is the assembly complicated, the production cost is high, but also there are many solder joints. It is also difficult to meet the requirements of low insertion loss, low intermodulation and high consistency.
  • the present invention provides an antenna unit, an antenna module and a large-scale array antenna, aiming to realize the lightweight of the antenna, while simplifying the antenna structure and improving the antenna performance.
  • the technical solutions adopted by the antenna unit of the present invention are:
  • An antenna unit including:
  • the non-metallic substrate includes a substrate bottom plate and a partition plate provided on the top surface of the substrate bottom plate, the top surface of the substrate bottom plate is provided with a first metal layer, and the first metal layer is at least partially As a feeding network circuit layer, the bottom surface of the base substrate is provided with a second metal layer that enables the base substrate to serve as a reflective plate, and at least one side surface of the separator is provided with a substrate that enables the separator to serve as a radiation boundary Third metal layer;
  • a first feeding column is disposed on the top surface of the base plate, the first feeding column is used to support the radiating unit and electrically connect the radiating unit and the feeding network circuit Floor;
  • a second feeding post, the second feeding post is provided on the bottom surface of the base plate and used for electrically connecting a calibration network provided on the bottom of the base plate;
  • the first power feeding column, the second power feeding column and the non-metallic substrate form an integral body through an integral molding process.
  • first feeding pillar and / or the second feeding pillar include a non-metallic pillar and a fourth metal layer provided on the outer surface of the non-metallic pillar, the radiating unit and the feeding network
  • the circuit layers are electrically connected by the fourth metal layer, and the non-metal pillar and the non-metal matrix are integrally injection-molded.
  • first feeding post and / or the second feeding post are metal posts, and the non-metallic substrate and the metal posts are integrally formed through an injection molding process and fixedly connected to each other.
  • the second feeding column includes a first column for electrically connecting to the circuit layer of the calibration network and a second column for connecting to the ground layer of the calibration network, the first The cylinder is spaced from the second cylinder.
  • the radiation unit includes a non-metal substrate and a fifth metal layer provided on the surface of the non-metal substrate.
  • the radiation unit is electrically connected to the first feed post through the fifth metal layer.
  • the radiation unit is made of metal material or PCB board.
  • each of the radiating units is provided on a different first feeding column;
  • the feeding network circuit layer includes a power division circuit, and at least two of the radiation units are connected by the power division circuit to form a sub-array.
  • the radiation unit is provided with a mounting positioning hole
  • a top of the first feeding column is provided with a positioning column smaller in size than the first feeding column and capable of cooperating with the mounting positioning hole.
  • An antenna module includes a plurality of the above antenna units, a plurality of non-metallic substrates of the antenna units are integrally formed, and the plurality of antenna units are distributed in an array.
  • a large-scale array antenna includes the above antenna module.
  • the antenna unit, antenna module and large-scale array antenna of the present invention have at least the following beneficial effects compared to the prior art:
  • the antenna unit, the antenna module and the large-scale array antenna of the present invention adopt the non-metallic base body integrally formed by the base plate and the partition plate, and make the first and second feeding posts and the non-metallic base
  • the base body is formed into a whole through an integrated molding process, which can achieve a high degree of integration of the reflector, the radiation boundary and the feed network, which greatly reduces the weight of the antenna, and can greatly simplify the processing and assembly process, reduce production costs, and the overall structure is simple
  • the compactness and good product consistency are conducive to reaching the high standard of 5G high-band antennas for product accuracy, reducing insertion loss, and reducing the potential for intermodulation, so that the electrical performance of the entire antenna system is significantly improved; in addition, the base plate can also be used as
  • the dielectric layer of the feed network, the integrated first feed column and the second feed column conveniently realize the feed connection between the radiating unit and the calibration network, compared with the traditional structure using balun and feed ring It is also conducive to achieving a low-profile
  • FIG. 1 is a schematic diagram of an exploded front view of an antenna unit according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an exploded back view of the antenna unit shown in FIG. 1;
  • FIG. 3 is a schematic diagram of a partial structure of an antenna module to which the antenna unit shown in FIG. 1 is applied;
  • FIG. 4 is a schematic diagram of an exploded front view of an antenna module to which the antenna unit shown in FIG. 1 is applied;
  • FIG. 5 is a schematic diagram of a back-view exploded structure of the antenna module shown in FIG. 4;
  • FIGS. 4 and 5 is an isometric view of the antenna module shown in FIGS. 4 and 5;
  • 100-radiation unit 101-installation positioning hole; 200-non-metallic substrate; 210-substrate bottom plate; 220-separator; 310-first feeding column; 311-positioning column; 320-second feeding column; 320a- First cylinder; 320b-second cylinder; 400-feed network circuit layer; 500-calibration network; 501-first pad; 502-second pad.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • orientation such as top, bottom, top, bottom, and side in the following embodiments are only relative concepts or refer to the normal use status of the product, and should not be considered as limiting of.
  • an embodiment of the present invention provides an antenna unit, including: an integrally formed non-metallic substrate 200, the non-metallic substrate 200 includes a substrate bottom plate 210 and a spacer 220 provided on the top surface of the substrate bottom plate 210,
  • the top surface of the base substrate 210 is provided with at least part of the first metal layer as the feed network circuit layer 400
  • the bottom surface of the base substrate 210 is provided with a second metal layer that enables the base substrate 210 to serve as a reflective plate, and at least one of the separators 220
  • the side is provided with a third metal layer that enables the separator 220 to serve as a radiation boundary
  • a first feeding post 310 is provided on the top surface of the base plate 210, and the first feeding post 310 is used to support radiation
  • the unit 100 is electrically connected to the radiating unit 100 and the feeding network circuit layer 400
  • a second feeding post 320 is provided on the bottom surface of the base substrate 210 and is used to electrically connect the one provided on the bottom of the base
  • an embodiment of the present invention further provides an antenna module, including a plurality of the above antenna units, a non-metallic base 200 of the plurality of antenna units is integrally formed, and the plurality of antenna units are distributed in an array.
  • the above-mentioned antenna unit and antenna module are formed by integrally forming the non-metallic substrate 200 of the base plate 210 and the separator 220, and forming the first and second feeding posts 310 and 320 and the non-metallic substrate 200 through an integral molding process
  • it can achieve a high degree of integration of the reflector, the radiation boundary and the feed network, which greatly reduces the weight of the antenna, and can greatly simplify the manufacturing and assembly process, reduce production costs, the overall structure is simple and compact, and the product consistency is good.
  • the base plate 210 can also be used as the dielectric layer of the feed network .
  • the integrated first feed post 310 and second feed post 320 conveniently realize the feed connection between the radiating unit 100 and the calibration network 500. Compared with the traditional structure using baluns and feed loops, It is beneficial to achieve a low-profile design, meet the higher requirements of 5G antennas for miniaturization, and suitable for large-scale commercial use.
  • the second feed post 320 includes a first post 320 a for electrically connecting with the circuit layer of the calibration network 500 and a second post for ground connection with the calibration network 500 320b, the first column 320a and the second column 320b are spaced apart. Both the first pillar 320a and the second pillar 320b may be integrated with the base plate 210 to form a whole, to further improve integration.
  • the calibration network 500 is provided with a first pad 501 for connecting the first pillar 320a for feeding and a second pad 502 for grounding.
  • the above first feed pillar 310 may include a non-metal pillar and a fourth metal layer provided on the outer surface of the non-metal pillar, the radiation unit 100 and the feed network circuit layer 400 pass between The fourth metal layer of the first feed post 310 is electrically connected, and the non-metal post and the non-metal base 200 are integrally injection molded.
  • the second feeding post 320 may also include a non-metallic post and a fourth metal layer provided on the outer surface of the non-metallic post.
  • the first post 320a serving as the second feeding post 320 and Each of the second pillars 320b may include a non-metal pillar and a fourth metal layer provided on the outer surface of the non-metal pillar, so that the fourth metal layer passing through the first pillar 320a between the radiation unit 100 and the circuit layer of the calibration network 500 Electrical connection, the ground layer of the calibration network 500 and the second metal layer are electrically connected by the fourth metal layer of the second pillar 320b, and the non-metal pillar and the non-metal matrix 200 are integrally injection molded; in this case, it should be understood
  • the base plate 210 is also preferably provided with metalized vias to realize the feed network circuit layer 400 and the first The fourth metal layer of the pillar 320a is electrically connected.
  • the first feeding post 310 may also be a metal post, and the non-metallic base 200 and the metal post are integrally formed through an injection molding process and fixedly connected to each other.
  • the second feeding post 320 may also be a metal post, and the non-metallic substrate 200 is integrally formed on the bottom of the metal post through an injection molding process and fixedly connected to each other.
  • the metal post as the first feed post 310 and the metal post as the second feed post 320 may be placed in an injection mold, so that the non-metallic substrate 200 is fixed to the metal post after injection molding Into a whole. With this structure, the manufacturing process flow is simple, and it is easy to mass-produce.
  • connection strength between the first and second feeding posts 310 and 320 and the non-metallic substrate 200 be better, but it can also be easily achieved.
  • the assembly accuracy is good.
  • the above-mentioned base plate 210 can also be fixedly connected to the metal post through a hot-melt process; making full use of the non-metallic plasticity, the reliable connection between the metal post and the base plate 210 can also be conveniently achieved.
  • the above radiating unit 100 may be made of a metal radiating sheet formed by die-casting a metal material or integrally formed with sheet metal or using a PCB board.
  • the radiation unit 100 includes a non-metal substrate and a fifth metal layer disposed on the surface of the non-metal substrate.
  • the radiation unit 100 is electrically connected to the first feed post 310 through the fifth metal layer. In this way, the weight of the radiation unit 100 can be reduced, the accuracy of the radiation unit 100 can be improved, the structure of the radiation unit 100 can be simplified, the processing can be facilitated, and it has a better effect for further achieving the weight reduction of the antenna.
  • the non-metallic substrate 200 and the non-metallic substrate of the radiation unit 100 are preferably integrally injection-molded.
  • non-metallic materials such as resin and plastic may be integrally molded by an injection process.
  • the first metal layer, the second metal layer, the third metal layer, the fourth metal layer and the fifth metal layer can be realized by surface plating, LDS (laser direct forming) process, printing and other metallization processes; the material of each metal layer Both are preferably copper.
  • the antenna unit may include at least two radiating units 100 and at least two first feeding posts 310, and each radiating unit 100 is provided on a different On the first feeding post 310; the feeding network circuit layer 400 includes a power dividing circuit, and a plurality of radiating units 100 are connected through the power dividing circuit to form a sub-array.
  • each sub-array may include two, three, four, or six equal numbers of radiation units 100, and it should be understood that the radiation units 100 of each sub-array are arranged at intervals. Combine multiple radiation units 100 into a sub-array through the power division circuit, which can reduce the number of joints and reduce costs.
  • the spatial layout structure of the radiation unit 100 and the feed network is more compact. In the 5G large-scale array antenna array space is limited Under the premise, it can greatly reduce the difficulty of actual deployment.
  • each radiating unit 100 is preferably supported by four first feeding posts 310, and the four first feeding posts 310 are evenly distributed on the bottom of the radiating unit 100
  • the radiation unit 100 is beneficial to improve the stability and reliability of the antenna unit structure.
  • the radiation unit 100 is provided with a mounting positioning hole 101, and the top of the first feed post 310 is provided with a size smaller than the first feed
  • the post 310 is also capable of cooperating with the positioning post 311 of the installation positioning hole 101. In this way, not only the reliable installation of the radiation unit 100 can be conveniently achieved, but also the assembly accuracy can be improved, and the consistency of the antenna can be better.
  • the positioning post 311 is also preferably integrally injection-molded with a non-metallic post and the non-metallic base 200.
  • the radiation unit 100 is included in the installation range of the partition 220.
  • a partition 220 may be provided around each sub-array. For 5G high-band antennas, it can play a better isolation effect, reduce the mutual coupling between each antenna sub-array, and the electrical performance is more excellent.
  • An embodiment of the present invention also provides a large-scale array antenna, including the above antenna module.
  • a large-scale array antenna may include a plurality of separately manufactured antenna modules.
  • the multiple antenna modules may be assembled in a radome by splicing and distributed in an array to further improve the convenience of assembly and reduce the difficulty of manufacturing .
  • the above-mentioned large-scale array antenna is based on the same concept as the above-mentioned antenna unit and antenna module embodiments, and its technical effects are the same as those of the antenna unit and antenna module embodiments of the present invention. The description in the example will not be repeated here.
  • antenna unit and antenna module are not limited to large-scale array antennas used for 5G mobile communication, but can also be used in antennas for 2G, 3G, and 4G mobile communication.

Abstract

The present invention provides an antenna unit, comprising: a non-metallic base, which is integrally formed and comprises a base bottom plate and a partition plate provided on the top surface of the base bottom plate, the top surface of the base bottom plate being provided with a first metallic layer which at least partially serves as a feed network circuit layer, the bottom surface of the base bottom plate being provided with a second metallic layer, and at least one side surface of the partition plate being provided with a third metallic layer; first feed posts, which are provided on the top surface of the base bottom plate and are used for supporting a radiation unit and electrically connecting the radiation unit and the feed network circuit layer; and second feed posts, which are provided on the bottom surface of the base bottom plate and are used for electrically connecting a calibration network provided at the bottom of the base bottom plate. The first feed posts and the second feed posts are integrally formed with the non-metallic base by means of an integral forming process. The structure of the antenna unit is simple and compact, achieves lightweight and high integration, and also has good product consistency, facilitating improvement of the electrical performance of an antenna. The present invention further provides an antenna module comprising said antenna unit, and a large-scale array antenna.

Description

天线单元、天线模块及大规模阵列天线Antenna unit, antenna module and large-scale array antenna 技术领域Technical field
本发明涉及移动通信技术领域,涉及一种天线单元、天线模块及大规模阵列天线。The invention relates to the technical field of mobile communication, and relates to an antenna unit, an antenna module and a large-scale array antenna.
背景技术Background technique
随着移动通信技术和应用的迅猛发展,关于第五代移动通信技术(外文缩写为5G)已进入试商用阶段。With the rapid development of mobile communication technology and applications, the fifth-generation mobile communication technology (abbreviated as 5G in foreign language) has entered the stage of commercial trial.
目前,现有技术提出的5G天线方案,其天线单元通常包括金属基体底板和设于金属基体底板上的金属隔板。其中,金属基体底板常采用金属压铸或钣金工艺成型,隔板通常采用金属压铸、铝型材拉挤或钣金工艺成型,以满足基于5G大规模密集高频阵列的天线对布局空间多样的需求,然而在工程实践中这样的结构具有以下弊端:一是天线单元较重,从而导致天线整机系统难以实现轻量化设计;二是5G大规模密集高频阵列的基体底板尺寸往往较大,在金属基体底板一体成型的过程中,为了提高产品的一致性,金属基体底板的厚度往往需增厚,由此将进一步加重天线单元重量;三是金属隔离件只能通过螺钉固定于金属基体底板上或者采用焊接/金属压铸工艺与金属基体底板固定连接,一方面在5G高频段应用的背景下,采用螺钉固定的方式难以满足5G高频段天线对辐射边界缝隙的要求,另一方面无论上述三种中的任意一种连接方式,都存在5G天线的插损较高、互调隐患增多、一致性较差以及装配复杂的问题。At present, in the 5G antenna solution proposed by the prior art, the antenna unit usually includes a metal base plate and a metal partition plate provided on the metal base plate. Among them, the metal base plate is often formed by metal die-casting or sheet metal technology, and the partition is usually formed by metal die-casting, aluminum extrusion pultrusion or sheet metal technology to meet the diverse layout space requirements of antennas based on 5G large-scale dense high-frequency arrays However, in engineering practice, such a structure has the following disadvantages: First, the antenna unit is heavy, which makes it difficult to achieve a lightweight design for the entire antenna system; Second, the size of the base plate of the 5G large-scale dense high-frequency array is often large. In the process of integrally forming the metal base plate, in order to improve the consistency of the product, the thickness of the metal base plate often needs to be thickened, which will further increase the weight of the antenna unit; third, the metal spacer can only be fixed to the metal base plate by screws Or use welding / metal die-casting process to fix the connection with the metal base plate. On the one hand, in the context of 5G high-frequency applications, it is difficult to meet the requirements of 5G high-band antennas for the radiation boundary gap on the other hand. In any of the connection methods, there is a high insertion loss and intermodulation of the 5G antenna Increased risk of poor consistency and assembly complex issues.
此外,现有技术提出的5G天线方案,其馈电网络多采用PCB形式,馈电网络通常采用螺钉固定连接与基体底板上,辐射单元通常采用金属压铸、钣金或PCB振子,辐射单元与馈电网络之间通常直接焊接或通过同轴电缆焊接连接,不仅装配复杂,生产成本较高,还会具有较多焊点,同样难以满足低插损、低互调和高一致性的指标要求。In addition, in the 5G antenna solution proposed in the prior art, the feed network is mostly in the form of PCB. The feed network is usually fixed and connected to the base plate of the substrate by a screw. The radiating unit usually uses metal die casting, sheet metal or PCB vibrator. The electrical networks are usually directly welded or connected by coaxial cable. Not only is the assembly complicated, the production cost is high, but also there are many solder joints. It is also difficult to meet the requirements of low insertion loss, low intermodulation and high consistency.
由此可见,现有技术提出的5G天线方案仍存在较多技术问题,面对5G产 业全球进程的加快,如何实现天线轻量化,同时简化天线结构,提升天线性能指标,已变得日益迫切。It can be seen that there are still many technical problems in the 5G antenna solution proposed by the existing technology. In the face of the acceleration of the global process of the 5G industry, how to achieve lightweight antennas, while simplifying the antenna structure and improving antenna performance indicators has become increasingly urgent.
发明内容Summary of the invention
基于此,本发明提供了一种天线单元、天线模块及大规模阵列天线,旨在实现天线的轻量化,同时简化天线结构,提升天线性能。Based on this, the present invention provides an antenna unit, an antenna module and a large-scale array antenna, aiming to realize the lightweight of the antenna, while simplifying the antenna structure and improving the antenna performance.
为了解决上述技术问题,本发明的天线单元采用的技术方案是:In order to solve the above technical problems, the technical solutions adopted by the antenna unit of the present invention are:
一种天线单元,包括:An antenna unit, including:
一体成型的非金属基体,所述非金属基体包括基体底板和设于所述基体底板顶面的隔板,所述基体底板的顶面设有第一金属层,所述第一金属层至少部分作为馈电网络电路层,所述基体底板的底面设有使所述基体底板能作为反射板的第二金属层,所述隔板的至少一个侧面设有使所述隔板能作为辐射边界的第三金属层;An integrally formed non-metallic substrate, the non-metallic substrate includes a substrate bottom plate and a partition plate provided on the top surface of the substrate bottom plate, the top surface of the substrate bottom plate is provided with a first metal layer, and the first metal layer is at least partially As a feeding network circuit layer, the bottom surface of the base substrate is provided with a second metal layer that enables the base substrate to serve as a reflective plate, and at least one side surface of the separator is provided with a substrate that enables the separator to serve as a radiation boundary Third metal layer;
第一馈电柱,所述第一馈电柱设于所述基体底板的顶面,所述第一馈电柱用于支承辐射单元并电性连接所述辐射单元和所述馈电网络电路层;A first feeding column, the first feeding column is disposed on the top surface of the base plate, the first feeding column is used to support the radiating unit and electrically connect the radiating unit and the feeding network circuit Floor;
第二馈电柱,所述第二馈电柱设于所述基体底板的底面并用于电性连接设于所述基体底板底部的校准网络;A second feeding post, the second feeding post is provided on the bottom surface of the base plate and used for electrically connecting a calibration network provided on the bottom of the base plate;
所述第一馈电柱和所述第二馈电柱与所述非金属基体通过一体成型工艺形成一个整体。The first power feeding column, the second power feeding column and the non-metallic substrate form an integral body through an integral molding process.
进一步的,所述第一馈电柱和/或所述第二馈电柱包括非金属柱及设于所述非金属柱外表面的第四金属层,所述辐射单元和所述馈电网络电路层之间通过所述第四金属层电性连接,所述非金属柱与所述非金属基体一体注塑成型。Further, the first feeding pillar and / or the second feeding pillar include a non-metallic pillar and a fourth metal layer provided on the outer surface of the non-metallic pillar, the radiating unit and the feeding network The circuit layers are electrically connected by the fourth metal layer, and the non-metal pillar and the non-metal matrix are integrally injection-molded.
进一步的,所述第一馈电柱和/或所述第二馈电柱为金属柱,所述非金属基体与所述金属柱通过注塑工艺一体成型并相互固定连接在一起。Further, the first feeding post and / or the second feeding post are metal posts, and the non-metallic substrate and the metal posts are integrally formed through an injection molding process and fixedly connected to each other.
进一步的,所述第二馈电柱包括用于与所述校准网络的电路层电性连接的第一柱体以及用于与所述校准网络的地层连接的第二柱体,所述第一柱体与所 述第二柱体间隔设置。Further, the second feeding column includes a first column for electrically connecting to the circuit layer of the calibration network and a second column for connecting to the ground layer of the calibration network, the first The cylinder is spaced from the second cylinder.
进一步的,所述辐射单元包括非金属基板及设于所述非金属基板表面的第五金属层,所述辐射单元通过所述第五金属层与所述第一馈电柱电性连接。Further, the radiation unit includes a non-metal substrate and a fifth metal layer provided on the surface of the non-metal substrate. The radiation unit is electrically connected to the first feed post through the fifth metal layer.
进一步的,所述辐射单元由金属材料或PCB板制成。Further, the radiation unit is made of metal material or PCB board.
进一步的,所述辐射单元至少有两个,所述第一馈电柱至少有两个,各所述辐射单元分别设于不同的所述第一馈电柱上;Further, there are at least two radiating units, and at least two first feeding columns, and each of the radiating units is provided on a different first feeding column;
所述馈电网络电路层包括功分电路,至少两个所述辐射单元之间通过所述功分电路连接从而组成一个子阵。The feeding network circuit layer includes a power division circuit, and at least two of the radiation units are connected by the power division circuit to form a sub-array.
进一步的,所述辐射单元上设有安装定位孔,所述第一馈电柱的顶部设有尺寸小于所述第一馈电柱并能与所述安装定位孔配合的定位柱。Further, the radiation unit is provided with a mounting positioning hole, and a top of the first feeding column is provided with a positioning column smaller in size than the first feeding column and capable of cooperating with the mounting positioning hole.
本发明提供的天线模块采用的技术方案是:The technical solutions adopted by the antenna module provided by the present invention are:
一种天线模块,包括多个上述天线单元,多个所述天线单元的非金属基体一体成型,多个所述天线单元呈阵列分布。An antenna module includes a plurality of the above antenna units, a plurality of non-metallic substrates of the antenna units are integrally formed, and the plurality of antenna units are distributed in an array.
本发明提供的大规模阵列天线采用的技术方案是:The technical solution adopted by the large-scale array antenna provided by the present invention is:
一种大规模阵列天线,包括上述天线模块。A large-scale array antenna includes the above antenna module.
基于上述技术方案,本发明的天线单元、天线模块及大规模阵列天线,相对于现有技术至少具有以下有益效果:Based on the above technical solutions, the antenna unit, antenna module and large-scale array antenna of the present invention have at least the following beneficial effects compared to the prior art:
本发明的天线单元、天线模块及大规模阵列天线,通过采用基体底板和隔板一体成型的非金属基体,并使所述第一馈电柱和所述第二馈电柱与所述非金属基体通过一体成型工艺形成一个整体,可实现反射板、辐射边界及馈电网络的高度集成,大幅减轻了天线的重量,并能极大的简化加工制作及装配流程,降低生产成本,整体结构简单紧凑,产品一致性好,有利于达到5G高频段天线对产品精度的高标准、降低插损、减少互调隐患,使天线整机系统的电气性能得到明显提升;此外,还可利用基体底板作为馈电网络的介质层,一体化的第一馈电柱和第二馈电柱方便的实现了辐射单元和校准网络的馈电连接,相对于传统的采用巴伦及馈电环的结构而言,还有利于实现低剖面设计,满足5G天线 对于小型化更高要求,适用于大规模商用。The antenna unit, the antenna module and the large-scale array antenna of the present invention adopt the non-metallic base body integrally formed by the base plate and the partition plate, and make the first and second feeding posts and the non-metallic base The base body is formed into a whole through an integrated molding process, which can achieve a high degree of integration of the reflector, the radiation boundary and the feed network, which greatly reduces the weight of the antenna, and can greatly simplify the processing and assembly process, reduce production costs, and the overall structure is simple The compactness and good product consistency are conducive to reaching the high standard of 5G high-band antennas for product accuracy, reducing insertion loss, and reducing the potential for intermodulation, so that the electrical performance of the entire antenna system is significantly improved; in addition, the base plate can also be used as The dielectric layer of the feed network, the integrated first feed column and the second feed column conveniently realize the feed connection between the radiating unit and the calibration network, compared with the traditional structure using balun and feed ring It is also conducive to achieving a low-profile design, meeting the higher requirements of 5G antennas for miniaturization, and suitable for large-scale commercial use.
附图说明BRIEF DESCRIPTION
图1为本发明实施例提供的一种天线单元的正视分解结构示意图;1 is a schematic diagram of an exploded front view of an antenna unit according to an embodiment of the present invention;
图2为图1所示天线单元的背视分解结构示意图;FIG. 2 is a schematic diagram of an exploded back view of the antenna unit shown in FIG. 1;
图3为应用图1所示天线单元的天线模块的局部结构示意图;3 is a schematic diagram of a partial structure of an antenna module to which the antenna unit shown in FIG. 1 is applied;
图4为应用图1所示天线单元的天线模块的正视分解结构示意图;4 is a schematic diagram of an exploded front view of an antenna module to which the antenna unit shown in FIG. 1 is applied;
图5为图4所示天线模块的背视分解结构示意图;FIG. 5 is a schematic diagram of a back-view exploded structure of the antenna module shown in FIG. 4;
图6为图4和图5所示天线模块的轴测视图;6 is an isometric view of the antenna module shown in FIGS. 4 and 5;
附图标记说明:Description of reference signs:
100-辐射单元;101-安装定位孔;200-非金属基体;210-基体底板;220-隔板;310-第一馈电柱;311-定位柱;320-第二馈电柱;320a-第一柱体;320b-第二柱体;400-馈电网络电路层;500-校准网络;501-第一焊盘;502-第二焊盘。100-radiation unit; 101-installation positioning hole; 200-non-metallic substrate; 210-substrate bottom plate; 220-separator; 310-first feeding column; 311-positioning column; 320-second feeding column; 320a- First cylinder; 320b-second cylinder; 400-feed network circuit layer; 500-calibration network; 501-first pad; 502-second pad.
具体实施方式detailed description
为了使本发明要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not intended to limit the present invention.
需要说明的是,当元件被称为“固定于”或“设于”另一个元件上时,它可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为是“连接”另一个元件,它可以是直接连接另一个元件或者可能同时存在居中元件。It should be noted that when an element is referred to as being "fixed" or "provided on" another element, it may be directly on the other element or there may be a center element at the same time. When an element is said to "connect" another element, it may be directly connected to the other element or there may be a center element at the same time.
在本发明的描述中,需要理解的是,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中,“多个”的含义是两个或两个以上, 除非另有明确具体的限定。In the description of the present invention, it should be understood that the terms “first” and “second” are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise specifically limited.
还需要说明的是,以下实施例中的上、下、顶、底、侧等方位用语,仅是互为相对概念或是以产品的正常使用状态为参考的,而不应该认为是具有限制性的。It should also be noted that the terms of orientation such as top, bottom, top, bottom, and side in the following embodiments are only relative concepts or refer to the normal use status of the product, and should not be considered as limiting of.
参照图1和图2,本发明实施例提供了一种天线单元,包括:一体成型的非金属基体200,该非金属基体200包括基体底板210和设于基体底板210顶面的隔板220,基体底板210的顶面设有至少部分作为馈电网络电路层400的第一金属层,基体底板210的底面设有使基体底板210能作为反射板的第二金属层,隔板220的至少一个侧面设有使隔板220能作为辐射边界的第三金属层;第一馈电柱310,该第一馈电柱310设于基体底板210的顶面,第一馈电柱310用于支承辐射单元100并电性连接辐射单元100和馈电网络电路层400;第二馈电柱320,该第二馈电柱320设于基体底板210的底面并用于电性连接设于基体底板210底部的校准网络500;第一馈电柱310和第二馈电柱320与非金属基体200通过一体成型工艺形成一个整体。1 and 2, an embodiment of the present invention provides an antenna unit, including: an integrally formed non-metallic substrate 200, the non-metallic substrate 200 includes a substrate bottom plate 210 and a spacer 220 provided on the top surface of the substrate bottom plate 210, The top surface of the base substrate 210 is provided with at least part of the first metal layer as the feed network circuit layer 400, the bottom surface of the base substrate 210 is provided with a second metal layer that enables the base substrate 210 to serve as a reflective plate, and at least one of the separators 220 The side is provided with a third metal layer that enables the separator 220 to serve as a radiation boundary; a first feeding post 310 is provided on the top surface of the base plate 210, and the first feeding post 310 is used to support radiation The unit 100 is electrically connected to the radiating unit 100 and the feeding network circuit layer 400; a second feeding post 320 is provided on the bottom surface of the base substrate 210 and is used to electrically connect the one provided on the bottom of the base substrate 210 Calibration network 500; the first feed post 310 and the second feed post 320 and the non-metallic substrate 200 form an integral body through an integral molding process.
参照图3至图6,本发明实施例还提供了一种天线模块,包括多个上述天线单元,多个天线单元的非金属基体200一体成型,多个天线单元呈阵列分布。Referring to FIGS. 3 to 6, an embodiment of the present invention further provides an antenna module, including a plurality of the above antenna units, a non-metallic base 200 of the plurality of antenna units is integrally formed, and the plurality of antenna units are distributed in an array.
上述天线单元和天线模块,通过采用基体底板210和隔板220一体成型的非金属基体200,并使第一馈电柱310和第二馈电柱320与非金属基体200通过一体成型工艺形成一个整体,可实现反射板、辐射边界及馈电网络的高度集成,大幅减轻了天线的重量,并能极大的简化加工制作及装配流程,降低生产成本,整体结构简单紧凑,产品一致性好,有利于达到5G高频段天线对产品精度的高标准、降低插损、减少互调隐患,使天线整机系统的电气性能得到明显提升;此外,还可利用基体底板210作为馈电网络的介质层,一体化的第一馈电柱310和第二馈电柱320方便的实现了辐射单元100和校准网络500的馈电连接,相对于传统的采用巴伦及馈电环的结构而言,还有利于实现低剖面设计,满足5G天线对于小型化更高要求,适用于大规模商用。The above-mentioned antenna unit and antenna module are formed by integrally forming the non-metallic substrate 200 of the base plate 210 and the separator 220, and forming the first and second feeding posts 310 and 320 and the non-metallic substrate 200 through an integral molding process Overall, it can achieve a high degree of integration of the reflector, the radiation boundary and the feed network, which greatly reduces the weight of the antenna, and can greatly simplify the manufacturing and assembly process, reduce production costs, the overall structure is simple and compact, and the product consistency is good. It is beneficial to achieve the high standard of 5G high-band antenna for product accuracy, reduce insertion loss, and reduce the potential for intermodulation, so that the electrical performance of the entire antenna system is significantly improved; in addition, the base plate 210 can also be used as the dielectric layer of the feed network , The integrated first feed post 310 and second feed post 320 conveniently realize the feed connection between the radiating unit 100 and the calibration network 500. Compared with the traditional structure using baluns and feed loops, It is beneficial to achieve a low-profile design, meet the higher requirements of 5G antennas for miniaturization, and suitable for large-scale commercial use.
参照图2,在实际应用时,第二馈电柱320包括用于与校准网络500的电路层电性连接的第一柱体320a以及用于与校准网络500的地层接地连接的第二柱体320b,第一柱体320a与第二柱体320b间隔设置。第一柱体320a和第二柱体320b可以都与基体底板210一体成型工艺形成一个整体,以进一步提高集成化。对应的,在校准网络500上设有用于连接第一柱体320a以馈电的第一焊盘501和用于接地的第二焊盘502。具体在本实施例中,第二柱体320b有两个,在校准网络500上设有两个第二焊盘502,各第二焊盘502与各第二柱体320b一一对应。Referring to FIG. 2, in actual application, the second feed post 320 includes a first post 320 a for electrically connecting with the circuit layer of the calibration network 500 and a second post for ground connection with the calibration network 500 320b, the first column 320a and the second column 320b are spaced apart. Both the first pillar 320a and the second pillar 320b may be integrated with the base plate 210 to form a whole, to further improve integration. Correspondingly, the calibration network 500 is provided with a first pad 501 for connecting the first pillar 320a for feeding and a second pad 502 for grounding. Specifically in this embodiment, there are two second pillars 320b, and two second pads 502 are provided on the calibration network 500, and each second pad 502 corresponds to each second pillar 320b in one-to-one relationship.
在部分实施例中,为了进一步简化工艺,上述第一馈电柱310可包括非金属柱和设于非金属柱外表面的第四金属层,辐射单元100和馈电网络电路层400之间通过第一馈电柱310的第四金属层电性连接,非金属柱与非金属基体200一体注塑成型。同理,上述第二馈电柱320也可包括非金属柱和设于非金属柱外表面的第四金属层,具体在本实施例中作为第二馈电柱320的第一柱体320a和第二柱体320b均可以包括非金属柱和设于非金属柱外表面的第四金属层,如此,辐射单元100和校准网络500的电路层之间通过第一柱体320a的第四金属层电性连接,校准网络500的地层和第二金属层之间通过第二柱体320b的第四金属层电性连接,非金属柱与非金属基体200一体注塑成型;这种情况下,应当理解的是,为了实现第一金属层中的馈电网络电路层400与校准网络500的电性连接,基体底板210上还优选设有金属化过孔,以实现馈电网络电路层400与第一柱体320a的第四金属层的电性连接。In some embodiments, in order to further simplify the process, the above first feed pillar 310 may include a non-metal pillar and a fourth metal layer provided on the outer surface of the non-metal pillar, the radiation unit 100 and the feed network circuit layer 400 pass between The fourth metal layer of the first feed post 310 is electrically connected, and the non-metal post and the non-metal base 200 are integrally injection molded. Similarly, the second feeding post 320 may also include a non-metallic post and a fourth metal layer provided on the outer surface of the non-metallic post. Specifically, in this embodiment, the first post 320a serving as the second feeding post 320 and Each of the second pillars 320b may include a non-metal pillar and a fourth metal layer provided on the outer surface of the non-metal pillar, so that the fourth metal layer passing through the first pillar 320a between the radiation unit 100 and the circuit layer of the calibration network 500 Electrical connection, the ground layer of the calibration network 500 and the second metal layer are electrically connected by the fourth metal layer of the second pillar 320b, and the non-metal pillar and the non-metal matrix 200 are integrally injection molded; in this case, it should be understood In order to achieve the electrical connection between the feed network circuit layer 400 and the calibration network 500 in the first metal layer, the base plate 210 is also preferably provided with metalized vias to realize the feed network circuit layer 400 and the first The fourth metal layer of the pillar 320a is electrically connected.
在部分实施例中,上述第一馈电柱310也可以采用金属柱,非金属基体200与金属柱通过注塑工艺一体成型并相互固定连接在一起。同理,上述第二馈电柱320也可以采用金属柱,非金属基体200通过注塑工艺一体成型于金属柱的底部并相互固定连接在一起。例如,在注塑工艺中,可以将作为第一馈电柱310的金属柱和作为第二馈电柱320的金属柱置于注塑模具中,从而使非金属基体200注塑成型后与金属柱固连成一个整体。这样的结构,制作工艺流程简单, 易于大批量生产,不仅可使第一馈电柱310和第二馈电柱320与非金属基体200之间连接强度较好,还可很容易的达到较好的组装精度,具有较好的一致性。在部分实施例中,上述基体底板210还可通过热熔工艺与金属柱固定连接在一起;充分利用非金属的可塑性,同样可以较为方便的实现金属柱与基体底板210的可靠连接。In some embodiments, the first feeding post 310 may also be a metal post, and the non-metallic base 200 and the metal post are integrally formed through an injection molding process and fixedly connected to each other. Similarly, the second feeding post 320 may also be a metal post, and the non-metallic substrate 200 is integrally formed on the bottom of the metal post through an injection molding process and fixedly connected to each other. For example, in the injection molding process, the metal post as the first feed post 310 and the metal post as the second feed post 320 may be placed in an injection mold, so that the non-metallic substrate 200 is fixed to the metal post after injection molding Into a whole. With this structure, the manufacturing process flow is simple, and it is easy to mass-produce. Not only can the connection strength between the first and second feeding posts 310 and 320 and the non-metallic substrate 200 be better, but it can also be easily achieved. The assembly accuracy is good. In some embodiments, the above-mentioned base plate 210 can also be fixedly connected to the metal post through a hot-melt process; making full use of the non-metallic plasticity, the reliable connection between the metal post and the base plate 210 can also be conveniently achieved.
在部分实施例中,上述辐射单元100可以采用金属材料压铸或钣金一体成型的金属辐射片或者采用PCB板制成。In some embodiments, the above radiating unit 100 may be made of a metal radiating sheet formed by die-casting a metal material or integrally formed with sheet metal or using a PCB board.
在部分实施例中,上述辐射单元100包括非金属基板及设于非金属基板表面的第五金属层,辐射单元100通过第五金属层与第一馈电柱310电性连接。这样可减轻辐射单元100的重量,提高辐射单元100的精度,简化辐射单元100的结构,便于加工,对进一步实现天线的轻量化具有更好的效果。In some embodiments, the radiation unit 100 includes a non-metal substrate and a fifth metal layer disposed on the surface of the non-metal substrate. The radiation unit 100 is electrically connected to the first feed post 310 through the fifth metal layer. In this way, the weight of the radiation unit 100 can be reduced, the accuracy of the radiation unit 100 can be improved, the structure of the radiation unit 100 can be simplified, the processing can be facilitated, and it has a better effect for further achieving the weight reduction of the antenna.
上述非金属基体200以及辐射单元100的非金属基板均优选一体注塑成型,具体可采用树脂、塑料等非金属材料通过注塑工艺一体成型。上述第一金属层、第二金属层、第三金属层、第四金属层及第五金属层可采用表面电镀、LDS(激光直接成型)工艺、印刷等金属化工艺实现;各金属层的材质均优选为铜。The non-metallic substrate 200 and the non-metallic substrate of the radiation unit 100 are preferably integrally injection-molded. Specifically, non-metallic materials such as resin and plastic may be integrally molded by an injection process. The first metal layer, the second metal layer, the third metal layer, the fourth metal layer and the fifth metal layer can be realized by surface plating, LDS (laser direct forming) process, printing and other metallization processes; the material of each metal layer Both are preferably copper.
参照图1、图3、图4和图6,在部分实施例中,该天线单元可包括至少两个辐射单元100和至少两个第一馈电柱310,各辐射单元100分别设于不同的第一馈电柱310上;馈电网络电路层400包括功分电路,多个辐射单元100之间通过功分电路连接从而组成一个子阵。具体在本实施例中,每个子阵可以包括两个或三个或四个或六个等数量的辐射单元100,且应当理解的是,每个子阵的各辐射单元100之间间隔设置。通过功分电路将多个辐射单元100合并成一个子阵,可减小接头数量,降低成本,辐射单元100与馈电网络的空间布局结构更加紧凑,在5G大规模阵列天线组阵空间有限的前提下,能大幅降低实际部署难度。Referring to FIGS. 1, 3, 4 and 6, in some embodiments, the antenna unit may include at least two radiating units 100 and at least two first feeding posts 310, and each radiating unit 100 is provided on a different On the first feeding post 310; the feeding network circuit layer 400 includes a power dividing circuit, and a plurality of radiating units 100 are connected through the power dividing circuit to form a sub-array. Specifically in this embodiment, each sub-array may include two, three, four, or six equal numbers of radiation units 100, and it should be understood that the radiation units 100 of each sub-array are arranged at intervals. Combine multiple radiation units 100 into a sub-array through the power division circuit, which can reduce the number of joints and reduce costs. The spatial layout structure of the radiation unit 100 and the feed network is more compact. In the 5G large-scale array antenna array space is limited Under the premise, it can greatly reduce the difficulty of actual deployment.
参照图1、图3和图4,具体在本实施例中,每个辐射单元100优选由四个第一馈电柱310支撑,四个第一馈电柱310均匀分布于辐射单元100的底部辐 射单元100,以利于提高天线单元结构的稳定性和可靠性。Referring to FIGS. 1, 3 and 4, specifically in this embodiment, each radiating unit 100 is preferably supported by four first feeding posts 310, and the four first feeding posts 310 are evenly distributed on the bottom of the radiating unit 100 The radiation unit 100 is beneficial to improve the stability and reliability of the antenna unit structure.
参照图1、图3、图4和图6,作为本发明的一个优选实施例,上述辐射单元100上设有安装定位孔101,第一馈电柱310的顶部设有尺寸小于第一馈电柱310并能与安装定位孔101配合的定位柱311。如此,不仅能方便的实现辐射单元100的可靠安装,还可有利于提高装配精度,进而使得天线的一致性更好。当上述第一馈电柱310采用非金属柱与非金属基体200一体注塑成型时,上述定位柱311也优选采用非金属柱与上述非金属基体200一体注塑成型。Referring to FIGS. 1, 3, 4 and 6, as a preferred embodiment of the present invention, the radiation unit 100 is provided with a mounting positioning hole 101, and the top of the first feed post 310 is provided with a size smaller than the first feed The post 310 is also capable of cooperating with the positioning post 311 of the installation positioning hole 101. In this way, not only the reliable installation of the radiation unit 100 can be conveniently achieved, but also the assembly accuracy can be improved, and the consistency of the antenna can be better. When the first feeding post 310 is integrally injection-molded with a non-metallic post and a non-metallic base 200, the positioning post 311 is also preferably integrally injection-molded with a non-metallic post and the non-metallic base 200.
作为本发明的一个优选实施例,参照图1、图3和图6,在基体底板210的正投影面上,辐射单元100被包括在隔板220的设置范围内。在实际应用时,可在各子阵的四周设置隔板220。这对于5G高频段天线而言,可以起到更好的隔离效果,减少各天线子阵间的互耦,电气性能更加优异。As a preferred embodiment of the present invention, referring to FIG. 1, FIG. 3 and FIG. 6, on the front projection surface of the base plate 210, the radiation unit 100 is included in the installation range of the partition 220. In practical applications, a partition 220 may be provided around each sub-array. For 5G high-band antennas, it can play a better isolation effect, reduce the mutual coupling between each antenna sub-array, and the electrical performance is more excellent.
本发明实施例还提供了一种大规模阵列天线,包括上述天线模块。应当理解的是,在大规模阵列天线中可以包括多个分别制作的天线模块,多个天线模块可以通过拼接组装于天线罩中并呈阵列分布,以进一步提高组装的便利性,并降低制作难度。An embodiment of the present invention also provides a large-scale array antenna, including the above antenna module. It should be understood that a large-scale array antenna may include a plurality of separately manufactured antenna modules. The multiple antenna modules may be assembled in a radome by splicing and distributed in an array to further improve the convenience of assembly and reduce the difficulty of manufacturing .
上述大规模阵列天线,由于与上述天线单元和天线模块实施例基于同一构思,其带来的技术效果与本发明天线单元和天线模块实施例相同,具体内容可参见本发明天线单元和天线模块实施例中的叙述,此处不再赘述。The above-mentioned large-scale array antenna is based on the same concept as the above-mentioned antenna unit and antenna module embodiments, and its technical effects are the same as those of the antenna unit and antenna module embodiments of the present invention. The description in the example will not be repeated here.
需要说明的是,上述天线单元和天线模块并不局限用于5G移动通信的大规模阵列天线,也可用于2G、3G、4G移动通信的天线中。It should be noted that the above antenna unit and antenna module are not limited to large-scale array antennas used for 5G mobile communication, but can also be used in antennas for 2G, 3G, and 4G mobile communication.
以上仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention Inside.

Claims (10)

  1. 一种天线单元,其特征在于,包括:An antenna unit, characterized in that it includes:
    一体成型的非金属基体,所述非金属基体包括基体底板和设于所述基体底板顶面的隔板,所述基体底板的顶面设有第一金属层,所述第一金属层至少部分作为馈电网络电路层,所述基体底板的底面设有使所述基体底板能作为反射板的第二金属层,所述隔板的至少一个侧面设有使所述隔板能作为辐射边界的第三金属层;An integrally formed non-metallic substrate, the non-metallic substrate includes a substrate bottom plate and a partition plate provided on the top surface of the substrate bottom plate, the top surface of the substrate bottom plate is provided with a first metal layer, and the first metal layer is at least partially As a feeding network circuit layer, the bottom surface of the base substrate is provided with a second metal layer that enables the base substrate to serve as a reflective plate, and at least one side surface of the separator is provided with a substrate that enables the separator to serve as a radiation boundary Third metal layer;
    第一馈电柱,所述第一馈电柱设于所述基体底板的顶面,所述第一馈电柱用于支承辐射单元并电性连接所述辐射单元和所述馈电网络电路层;A first feeding column, the first feeding column is disposed on the top surface of the base plate, the first feeding column is used to support the radiating unit and electrically connect the radiating unit and the feeding network circuit Floor;
    第二馈电柱,所述第二馈电柱设于所述基体底板的底面并用于电性连接设于所述基体底板底部的校准网络;A second feeding post, the second feeding post is provided on the bottom surface of the base plate and used for electrically connecting a calibration network provided on the bottom of the base plate;
    所述第一馈电柱和所述第二馈电柱与所述非金属基体通过一体成型工艺形成一个整体。The first power feeding column, the second power feeding column and the non-metallic substrate form an integral body through an integral molding process.
  2. 根据权利要求1所述的天线单元,其特征在于,所述第一馈电柱和/或所述第二馈电柱包括非金属柱及设于所述非金属柱外表面的第四金属层,所述辐射单元和所述馈电网络电路层之间通过所述第四金属层电性连接,所述非金属柱与所述非金属基体一体注塑成型。The antenna unit according to claim 1, wherein the first feeding post and / or the second feeding post include a non-metallic post and a fourth metal layer provided on the outer surface of the non-metallic post , The radiation unit and the circuit layer of the feeding network are electrically connected by the fourth metal layer, and the non-metallic post and the non-metallic base are integrally injection molded.
  3. 根据权利要求1所述的天线单元,其特征在于,所述第一馈电柱和/或所述第二馈电柱为金属柱,所述非金属基体与所述金属柱通过注塑工艺一体成型并相互固定连接在一起。The antenna unit according to claim 1, wherein the first feeding post and / or the second feeding post are metal posts, and the non-metallic substrate and the metal posts are integrally formed by an injection molding process And fixedly connected to each other.
  4. 根据权利要求1所述的天线单元,其特征在于,所述第二馈电柱包括用于与所述校准网络的电路层电性连接的第一柱体以及用于与所述校准网络的地层接地连接的第二柱体,所述第一柱体与所述第二柱体间隔设置。The antenna unit according to claim 1, wherein the second feeding post includes a first post for electrically connecting with a circuit layer of the calibration network and a ground layer for connecting with the calibration network A second pillar connected to the ground, the first pillar is spaced from the second pillar.
  5. 根据权利要求1所述的天线单元,其特征在于,所述辐射单元包括非金属基板及设于所述非金属基板表面的第五金属层,所述辐射单元通过所述第五 金属层与所述第一馈电柱电性连接。The antenna unit according to claim 1, wherein the radiation unit comprises a non-metallic substrate and a fifth metal layer provided on the surface of the non-metallic substrate, and the radiation unit passes through the fifth metal layer and the The first feed post is electrically connected.
  6. 根据权利要求1所述的天线单元,其特征在于,所述辐射单元由金属材料或PCB板制成。The antenna unit according to claim 1, wherein the radiation unit is made of a metal material or a PCB board.
  7. 根据权利要求1所述的天线单元,其特征在于,The antenna unit according to claim 1, wherein:
    所述辐射单元至少有两个,所述第一馈电柱至少有两个,各所述辐射单元分别设于不同的所述第一馈电柱上;There are at least two radiating units, and at least two first feeding columns, and each of the radiating units is provided on a different first feeding column;
    所述馈电网络电路层包括功分电路,至少两个所述辐射单元之间通过所述功分电路连接从而组成一个子阵。The feeding network circuit layer includes a power division circuit, and at least two of the radiation units are connected by the power division circuit to form a sub-array.
  8. 根据权利要求1所述的天线单元,其特征在于,所述辐射单元上设有安装定位孔,所述第一馈电柱的顶部设有尺寸小于所述第一馈电柱并能与所述安装定位孔配合的定位柱。The antenna unit according to claim 1, wherein the radiating unit is provided with an installation positioning hole, and the top of the first feeding post is provided with a size smaller than the first feeding post and can be connected with the Install the positioning posts that fit the positioning holes.
  9. 一种天线模块,其特征在于,包括多个如权利要求1至8中任意一项所述的天线单元,多个所述天线单元的非金属基体一体成型,多个所述天线单元呈阵列分布。An antenna module, characterized by comprising a plurality of antenna units according to any one of claims 1 to 8, a non-metal matrix of the plurality of antenna units is integrally formed, and the plurality of antenna units are distributed in an array .
  10. 一种大规模阵列天线,其特征在于,包括如权利要求9所述的天线模块。A large-scale array antenna is characterized by comprising the antenna module according to claim 9.
PCT/CN2019/090785 2018-10-31 2019-06-11 Antenna unit, antenna module and large-scale array antenna WO2020087933A1 (en)

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