WO2020087698A1 - Movable platform and host thereof - Google Patents

Movable platform and host thereof Download PDF

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Publication number
WO2020087698A1
WO2020087698A1 PCT/CN2018/122120 CN2018122120W WO2020087698A1 WO 2020087698 A1 WO2020087698 A1 WO 2020087698A1 CN 2018122120 W CN2018122120 W CN 2018122120W WO 2020087698 A1 WO2020087698 A1 WO 2020087698A1
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WO
WIPO (PCT)
Prior art keywords
interface
expansion
board
host
speed
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PCT/CN2018/122120
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French (fr)
Chinese (zh)
Inventor
郑伟鑫
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深圳市大疆创新科技有限公司
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Publication of WO2020087698A1 publication Critical patent/WO2020087698A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00Television systems
    • H04N7/18Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast

Definitions

  • Embodiments of the present invention relate to the field of mobile platforms, and in particular, to a host and a mobile platform including the host.
  • an object of the present invention is to provide a host for a mobile platform.
  • Another object of the present invention is to provide a movable platform including the above host.
  • the technical solution in the first aspect of the embodiments of the present invention provides a host for a movable platform, the host is detachably mounted on the movable platform, the host includes: a housing , A plurality of expansion interfaces are provided on the casing, and the plurality of expansion interfaces are distributed on at least one side of the casing; a circuit board is provided in the casing and is provided with a plurality of expansion interfaces A corresponding circuit interface unit; the circuit board includes a CPU board and an expansion board, the expansion board and the CPU board are stacked and distributed, and are electrically connected to the CPU board through a first connector; wherein, multiple The expansion interface includes a high-speed interface and a low-speed interface, and at least a part of the plurality of circuit interface units is distributed on the expansion board.
  • the host provided by the technical solution of the first aspect of the embodiment of the present invention adds an expansion board in the casing, and a circuit interface unit for connecting to an external device is provided on the expansion board, thereby increasing the number of expansion interfaces of the host and further increasing The expansion function of the host; because the expansion board is electrically connected to the CPU board through the first connector, the external device can be electrically connected to the CPU board after inserting the expansion interface, and multiple expansion interfaces include both high-speed and low-speed interfaces Interface, low-speed interface can be used to control external devices, and high-speed interface can be used to achieve high-speed communication with external devices, which is beneficial to meet different needs of users; and because the expansion board and the CPU board are stacked, the size of the host can be minimized. That is: on the basis of satisfying the miniaturization of the host, the number of host expansion interfaces is increased, which meets the user's demand for industrial application PCs, and is beneficial to meet more needs of industry development enthusiasts.
  • the first connector fastens the CPU board and the expansion board together to realize the mechanical connection of the CPU board and the expansion board, ensure the stable cooperation of the CPU board and the expansion board, and reduce the distance between the CPU board and the expansion board, Conducive to reducing the height of the host, thereby reducing the size of the host.
  • the high-speed interface refers to an interface with a transmission speed greater than or equal to 500 MB / s
  • the low-speed interface refers to an interface with a transmission speed less than 500 MB / s.
  • the installation component of the microwave oven in the above technical solution provided by the embodiment of the present invention may further have the following additional technical features:
  • the number of the expansion boards is plural, and a plurality of the expansion boards are stacked; wherein, adjacent expansion boards are electrically connected through a second connector, and the CPU The board is electrically connected to one of the plurality of expansion boards through the first connector, or the CPU board is electrically connected to each of the plurality of expansion boards through the first connector .
  • the number of expansion boards is multiple, and each expansion board can be provided with one or more circuit interface units for connecting with external devices, so that it can further expand more functions and further meet the needs of industry development enthusiasts. Further improve the user experience; and multiple expansion boards are stacked, and the number of expansion boards is generally not too large. Therefore, adding multiple expansion boards (such as two) will not cause a significant increase in the size of the host, which is beneficial to Miniaturized design, and only need to increase the expansion interface on the shell, can be used to expand more functions.
  • the adjacent expansion boards are electrically connected through the second connector, and the CPU board and one of the plurality of expansion boards are electrically connected through the first connector, so that the circuit interface unit on one of the expansion boards
  • the first connector is electrically connected to the CPU board, and the circuit interface units on other expansion boards are electrically connected to the CPU board through the second connector and the first connector. In this way, only one connector interface needs to be provided on the CPU board, which is beneficial to simplify the structure of the CPU board.
  • the CPU board and each of the multiple expansion boards are electrically connected through the first connector, that is, any expansion board is electrically connected to the CPU board through the first connector, so that each expansion board circuit
  • the signal transmission paths between the interface unit and the CPU board are short, which is beneficial to improve the control accuracy and response speed.
  • the expansion board is a flexible circuit board, and a part of the plurality of circuit interface units is provided on the flexible circuit board; or, the expansion board is a rigid circuit board, a plurality of the circuits The interface units are all provided on the expansion board.
  • the expansion board can be a flexible circuit board.
  • the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bendability, which is not only conducive to designing more circuit interface units to expand more functions, but also conducive to expansion Further reduce the height of the host to further reduce the volume of the host and further reduce the weight of the host. Since the CPU board generally uses a rigid circuit board, in the actual production process, the circuit interface unit corresponding to the low-speed interface can be arranged on the flexible circuit board, and the circuit interface unit corresponding to the high-speed interface can be arranged on the CPU board to Meet the user's needs for high-speed and low-speed interfaces.
  • the expansion board can also be a rigid circuit board.
  • the rigid circuit board has the characteristics of high density, high reliability, designability, manufacturability, testability, etc., so it is also conducive to designing more circuit interface units to expand more. It is multifunctional, and the circuit interface unit corresponding to the high-speed interface and the circuit interface unit corresponding to the low-speed interface can be set. Therefore, in the actual generation process, multiple circuit interface units may be provided on the expansion board to simplify the structure of the CPU board.
  • the CPU board is located above the expansion board.
  • the CPU board is arranged above the expansion board, so that the expansion interface on the casing can be located at the lower part of the casing, which on the one hand improves the aesthetics of the product, and also facilitates the expansion interface and external devices (such as camera, projection Instrument, mobile hard disk, etc.).
  • the high-speed interface includes any one or more of an ETH network interface, a USB3.0 data interface, a high-definition multimedia HDMI data interface, and a wireless communication interface;
  • the low-speed interface includes a controller area network Any one or more of CAN data interface, universal asynchronous transceiver UART data interface, serial peripheral interface SPI, I2C data interface, OTG interface.
  • the high-speed interface includes any one or more of the ETH network interface, USB3.0 data interface, high-definition multimedia HDMI data interface, and wireless communication interface, that is, the type of the high-speed interface may include only any one of the above interfaces, and Any number of the above interfaces can be included at the same time, and the number of any high-speed interfaces included can be one or more.
  • the number of USB3.0 data interfaces is multiple. In the actual production process, it can be based on the specific product Adjust the structure, specific use and product positioning.
  • the ETH (Ethernet, Ethernet) network interface is an Ethernet port. It is a working interface for PCs and other devices connected to the local area network.
  • the data transmission speed of the USB3.0 data interface can reach 500MB / s, the maximum transmission bandwidth is up to 5Gb / s (that is, 640MB / s), which can meet the needs of users for high-speed data transmission, and can also be backward compatible with USB2.0 external devices; Multimedia interface)
  • the data interface is a digital video / audio interface technology, a dedicated digital interface suitable for image transmission; the wireless communication interface can realize wireless communication between the product and external devices (such as remote controls, mobile phones, personal computers, etc.). Set on the CPU board.
  • the above-mentioned interfaces are relatively commonly used high-speed interfaces, which can basically meet users' demands for high-speed interfaces.
  • the low-speed interface includes any one or more of the controller area network CAN data interface, the universal asynchronous transceiver UART data interface, the serial peripheral interface SPI, the I2C data interface, and the OTG interface, that is, the type of the low-speed interface can be only Including any of the above interfaces, it can also contain any number of the above interfaces, and the number of any high-speed interfaces included can be one or more, such as the controller area network CAN data interface and universal asynchronous transceiver transmission
  • the number of UART data interfaces is multiple, and can be adjusted according to the specific structure of the product, specific use and product positioning in the actual production process.
  • the controller area network CAN (Controller Area Network) data interface is a bus interface that implements the ISO international standardized serial communication protocol;
  • serial peripheral interface SPI Serial Peripheral Interface, serial peripheral interface
  • the I2C data interface is also a bus interface.
  • the I2C bus is a simple, bidirectional two-wire synchronous serial bus developed by Philips; OTG (On-The- Go), or microUSB interface, is mainly used to connect various devices or mobile devices to exchange data.
  • the above-mentioned interfaces are relatively commonly used low-speed interfaces, which can basically meet the needs of users for low-speed interfaces.
  • the wireless communication interface includes any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface.
  • the wireless communication interface includes: any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface, that is, the type of the wireless communication interface may include only the above interface Any one of them may also include any of the above interfaces at the same time. In the actual production process, it can be adjusted according to the specific structure, specific use and product positioning of the product.
  • the WiFi (Wireless-Fidelity, wireless broadband, wireless network) transmission interface can realize the connection between the host and the wireless LAN;
  • the mobile communication interface can realize the communication between the host and the fixed point user or mobile user;
  • the infrared communication transmission interface allows the host It can realize the transmission of language, text, data, images and other information through infrared rays and peripheral devices;
  • the Bluetooth communication interface enables the host to transmit the language, text, data, images and other information through Bluetooth technology;
  • the short-range laser communication interface enables The host can realize short-distance information transmission by laser.
  • the above-mentioned interfaces are relatively common wireless communication interfaces, which can basically satisfy users' demands for wireless communication interfaces.
  • the high-speed interface and the low-speed interface are distributed on different sides of the housing.
  • Distributing the high-speed interface and the low-speed interface on different sides of the housing realizes the separate layout of the low-speed interface and the high-speed interface.
  • the circuit interface units corresponding to the high-speed interface and the low-speed interface are also implemented separately, which can effectively prevent the mutual interference between the circuit interface units corresponding to the high-speed interface and the low-speed interface, thereby improving the Use reliability.
  • the number of the high-speed interfaces is multiple, and the multiple high-speed interfaces are all distributed on the first side of the housing; the number of the low-speed interfaces is multiple, and the multiple low-speed interfaces Both are distributed on the second side of the housing, and the first side is opposite to the second side.
  • the number of high-speed interfaces is multiple. Multiple high-speed interfaces can meet the needs of users.
  • the multiple high-speed interfaces are distributed on the first side of the housing, which makes the product structure more regular and the position of the first side is reasonably used. , Help to simplify the product structure.
  • the number of low-speed interfaces is multiple. Multiple low-speed interfaces can meet the needs of users.
  • the multiple low-speed interfaces are concentrated on the second side of the casing, which makes the product structure more regular and the second side is used reasonably. The location is conducive to simplifying the product structure.
  • the orientation of the low-speed interface and the high-speed interface is completely opposite, which can prevent the external devices connected to the low-speed interface and the high-speed interface from interfering with each other, which is convenient for connecting multiple external
  • it also makes the distance between the circuit interface units corresponding to the low-speed interface and the high-speed interface relatively long, thereby further reducing the risk of mutual interference and further improving the reliability of the use of each circuit interface unit.
  • the power interface of the host is provided on the side between the first side and the second side in the housing; the host also has a storage interface in the housing, A circuit interface unit corresponding to the storage interface is provided on the circuit board, and the storage interface faces a side of the housing opposite to the side where the power interface is located.
  • a storage interface is also provided in the casing, and a circuit interface unit corresponding to the storage interface is provided on the circuit board, so that the host can also connect to a storage device (such as an SSD (Solid State Drives)),
  • a storage device such as an SSD (Solid State Drives)
  • the host can add a solid-state hard drive), which can significantly increase the storage space of the host to meet the higher demands of users.
  • the storage interface faces the side opposite to the side where the power interface is located in the housing, which rationally uses the internal space of the host, does not interfere with the circuit interface unit and the power interface, and optimizes the product layout.
  • you cancel the storage interface you can also set the expansion interface on the side.
  • the main body has a rectangular parallelepiped shape as a whole, the first side face and the second side face are parallel to each other, the side face provided with the power interface is a third side face, and the area of the third side face is smaller than that of the first The area of one side surface is recorded as the fourth side surface parallel to the third side surface, and the storage interface faces the fourth side surface.
  • the main unit is in the shape of a rectangular parallelepiped, and the structure is relatively regular, which is convenient for processing and molding.
  • the first side and the second side are parallel to each other, the third side and the fourth side are parallel to each other, and the area of the third side and the fourth side is smaller than the area of the first side and the second side, that is: the expansion interface is arranged on the housing On the large-area side, the power supply interface is arranged on the small-area side of the housing, so that it is convenient to set more expansion interfaces, and the layout is more reasonable.
  • a plurality of the expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other.
  • the multiple expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other, which corresponds to the layout of the circuit board.
  • the structure is relatively regular, which is convenient for processing and molding, and the structure and layout of the product are further optimized , And improve the aesthetics of the product.
  • the technical solution of the second aspect of the present invention provides a movable platform, including a fuselage and the host according to any one of the technical solutions of the first aspect, the host being mounted on the fuselage.
  • the mobile platform provided by the technical solution of the second aspect of the present invention includes the host as described in any one of the technical solutions of the first aspect, and thus has all the beneficial effects of any of the foregoing technical solutions, which will not be repeated here. .
  • the movable platform is a drone or a robot.
  • FIG. 1 is a schematic perspective structural view of a host according to some embodiments of the present invention from a perspective;
  • FIG. 2 is a schematic perspective structural view of the host shown in FIG. 1 from another perspective;
  • FIG. 3 is a schematic view of the main structure of the host shown in FIG. 1;
  • FIG. 4 is a schematic view of the right side structure of the host shown in FIG. 1;
  • FIG. 5 is a schematic diagram of the rear view of the host shown in FIG. 1;
  • FIG. 6 is a schematic view of the top structure of the host shown in FIG. 1;
  • FIG. 7 is a schematic view of the left side structure of the host shown in FIG. 1;
  • FIG. 8 is a schematic diagram of the bottom view of the host shown in FIG. 1.
  • 10 host 11 shell, 111 first side, 112 second side, 113 third side, 114 fourth side, 12 ETH network interface, 13 USB3.0 data interface, 14 high-definition multimedia HDMI data interface, 15 controller Local area network CAN data interface, 16 universal asynchronous transceiver UART data interface, 17 OTG interface, 18 I / O interface, 19 power interface.
  • a mobile platform such as a mobile platform in the air (for example, a fixed-wing aircraft, such as an airplane, a taxi, a rotorcraft, such as a helicopter, or other aircraft, such as a soft airship , Balloons), movable platforms in water (eg, submarines, boats, ships), movable platforms on land (eg, motor vehicles such as cars, motorcycles, buses, trucks, vans; or hand-held components, such as Fishing rods, selfie sticks or other types of movable supports or frames; and trains, subways, etc.), movable platforms in space (eg, satellites, space stations, spaceships).
  • a fixed-wing aircraft such as an airplane, a taxi
  • a rotorcraft such as a helicopter, or other aircraft, such as a soft airship , Balloons
  • movable platforms in water eg, submarines, boats, ships
  • movable platforms on land eg, motor vehicles such as cars, motorcycles, buses, trucks, vans
  • the movable platform can move freely in an environment (such as land, water, air, space), or follow a preset path, orbit, or move in an agreed manner.
  • the movable platform can move in one, two or three dimensions.
  • the movable platform can move automatically in response to the signal instead of moving manually.
  • the movable platform may be a transportation means, such as a transportation means in the air, a transportation means on land, a transportation means in water, a transportation means in space, or a combination thereof.
  • the vehicle can move freely in one or more designated environments, or along a track or a fixed path.
  • the vehicle may include a power system.
  • the power system utilizes electric motors, engines, electronic components, magnetic mechanisms, gravity, wind power, combustion, and / or other power mechanisms.
  • a manual power system, a human power system, or a power system with the help of other organisms can also be applied on a movable platform, for example, a transportation vehicle.
  • the movable platform may be a rotorcraft, which may be driven or controlled by the rotation of one or more blades.
  • the movable platform can be driven or repositioned by means of one or more rotating blades, propellers, wheels, magnets, rails, or other mechanisms.
  • the movable platform is an unmanned vehicle, such as an unmanned aerial vehicle (Unmanned Aerial Vehicle, UAV), which may also be called a drone.
  • UAV Unmanned Aerial Vehicle
  • the UAV can hover, adjust direction, and / or adjust position.
  • the host and the mobile platform according to some embodiments of the present invention are described below with reference to FIGS. 1 to 8.
  • a host 10 for a mobile platform provided by an embodiment of the first aspect of the present invention is used to be detachably mounted on a mobile platform.
  • the host 10 includes: a housing 11 and a circuit board.
  • a plurality of expansion interfaces are provided on the housing 11, and the plurality of expansion interfaces are distributed on at least one side of the housing 11; the circuit board is disposed in the housing 11, and a circuit interface unit corresponding to the plurality of expansion interfaces is provided ;
  • the circuit board includes a CPU board and an expansion board, and the expansion board and the CPU board are stacked and electrically connected to the CPU board through a first connector; wherein, the plurality of expansion interfaces include a high-speed interface and a low-speed interface, and a plurality of circuit interface units At least part of is distributed on the expansion board.
  • an expansion board is additionally provided in the casing 11, and a circuit interface unit for connecting to an external device is provided on the expansion board, thereby increasing the number of expansion interfaces of the host 10 and further increasing
  • the host 10 can expand the function; because the expansion board is electrically connected to the CPU board through the first connector, the external device can be electrically connected to the CPU board after inserting the expansion interface, and multiple expansion interfaces include both high-speed interfaces and Including low-speed interface, the low-speed interface can be used to control external devices, and the high-speed interface can be used to achieve high-speed communication with external devices, which is beneficial to meet the different needs of users;
  • the volume that is: on the basis of meeting the miniaturization of the host 10, the number of expansion interfaces of the host 10 is increased, which meets the user's demand for industry application PCs, and is beneficial to meet more needs of industry development enthusiasts.
  • the first connector fastens the CPU board and the expansion board together to realize the mechanical connection of the CPU board and the expansion board, ensure the stable cooperation of the CPU board and the expansion board, and reduce the distance between the CPU board and the expansion board, It is beneficial to reduce the height of the host 10 and further reduce the volume of the host 10.
  • a high-speed interface refers to an interface with a transmission speed greater than or equal to 500 MB / s
  • a low-speed interface refers to an interface with a transmission speed less than 500 MB / s.
  • the high-speed interface and the low-speed interface may be relative concepts.
  • the USB1.0 data interface, the USB2.0 data interface, and the USB3.0 data interface are used as examples.
  • Those skilled in the art usually use the USB3.0 data interface as the high-speed interface.
  • USB1.0 data interface and USB2.0 data interface are compared, it is also possible to use USB1.0 data interface as a low-speed interface and USB2.0 data interface as a high-speed interface.
  • the number of expansion boards is one.
  • the expansion board is a rigid circuit board, and multiple circuit interface units are all provided on the expansion board.
  • the expansion board can also be a rigid circuit board.
  • the rigid circuit board has the characteristics of high density, high reliability, designability, manufacturability, testability, etc., so it is also conducive to designing more circuit interface units to expand more. It is multifunctional, and the circuit interface unit corresponding to the high-speed interface and the circuit interface unit corresponding to the low-speed interface can be set. Therefore, in the actual generation process, multiple circuit interface units may be provided on the expansion board to simplify the structure of the CPU board.
  • the CPU board is located above the expansion board.
  • the CPU board is arranged above the expansion board, so that the expansion interface on the casing 11 can be located at the lower part of the casing 11, which on the one hand improves the aesthetics of the product, and also facilitates the expansion interface and external devices (such as a camera) , Projector, mobile hard disk, etc.).
  • the expansion interface on the casing 11 can be located at the lower part of the casing 11, which on the one hand improves the aesthetics of the product, and also facilitates the expansion interface and external devices (such as a camera) , Projector, mobile hard disk, etc.).
  • the high-speed interface includes any one or more of an ETH network interface 12, a USB 3.0 data interface 13, a high-definition multimedia HDMI data interface 14, and a wireless communication interface, as shown in FIG. 3;
  • the low-speed interface includes a controller Any one or more of the local area network CAN data interface 15, universal asynchronous transceiver UART data interface 16, serial peripheral interface SPI, I2C data interface, OTG interface 17, as shown in FIG. 5.
  • the high-speed interface includes any one or more of the ETH network interface 12, the USB3.0 data interface 13, the high-definition multimedia HDMI data interface 14, and the wireless communication interface, that is, the type of the high-speed interface may include only any of the above interfaces
  • the number of USB3.0 data interfaces 13 is multiple, which can be used in the actual production process. Adjust according to the specific structure, specific use and product positioning of the product.
  • the ETH (Ethernet, Ethernet) network interface is an Ethernet port. It is a working interface for PCs and other devices connected to the local area network. It is the most commonly used network interface; the data transmission speed of the USB3.0 data interface can reach 500MB / s, the maximum transmission bandwidth is up to 5Gb / s (that is, 640MB / s), which can meet the needs of users for high-speed data transmission, and is also backward compatible with USB2.0 external devices; High-definition multimedia HDMI (High Definition Multimedia Interface, high-definition Multimedia interface)
  • the data interface is a digital video / audio interface technology, a dedicated digital interface suitable for image transmission; the wireless communication interface can realize wireless communication between the product and external devices (such as remote controls, mobile phones, personal computers, etc.). Set on the CPU board.
  • the above-mentioned interfaces are relatively commonly used high-speed interfaces, which can basically meet users' demands for high-speed interfaces.
  • the low-speed interface includes any one or more of the controller area network CAN data interface 15, the universal asynchronous transceiver UART data interface 16, the serial peripheral interface SPI, the I2C data interface, and the OTG interface 17, namely: the low-speed interface
  • the type may include only any one of the above-mentioned interfaces, or may include any number of the above-mentioned interfaces at the same time, and the number of any one of the included high-speed interfaces may be one or more, such as the controller area network CAN data interface 15 and
  • the number of the UART data interface 16 of the universal asynchronous transceiver transmitter and receiver is multiple, and can be adjusted according to the specific structure, specific use and product positioning of the product in the actual production process.
  • the controller area network CAN (Controller Area Network) data interface is a bus interface that implements the ISO international standardized serial communication protocol;
  • serial peripheral interface SPI Serial Peripheral Interface, serial peripheral interface
  • the I2C data interface is also a bus interface.
  • the I2C bus is a simple, bidirectional two-wire synchronous serial bus developed by Philips; OTG (On-The- Go), or microUSB interface, is mainly used to connect various devices or mobile devices to exchange data.
  • the above-mentioned interfaces are relatively common low-speed interfaces, which can basically meet users' demands for low-speed interfaces.
  • the wireless communication interface includes any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface.
  • the wireless communication interface includes: any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface, that is, the type of the wireless communication interface may include only the above interface Any one of them may also include any of the above interfaces at the same time. In the actual production process, it can be adjusted according to the specific structure, specific use and product positioning of the product.
  • WiFi Wireless-Fidelity, wireless broadband, wireless network
  • the mobile communication interface can realize the communication between the host 10 and the fixed-point user or mobile user
  • infrared communication transmission interface Enables the host 10 to transmit language, text, data, images and other information through infrared and peripheral devices
  • Bluetooth communication interface enables the host 10 to transmit language, text, data, images and other information through Bluetooth technology
  • the laser communication interface enables the host 10 to realize short-distance information transmission through the laser.
  • the above-mentioned interfaces are relatively common wireless communication interfaces, which can basically satisfy users' demands for wireless communication interfaces.
  • the expansion board is a flexible circuit board, and a part of the plurality of circuit interface units is provided on the flexible circuit board.
  • the expansion board can be a flexible circuit board.
  • the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bendability, which is not only conducive to designing more circuit interface units to expand more functions, but also conducive to expansion
  • the height of the host 10 is further reduced to further reduce the volume of the host 10 and further reduce the weight of the host 10. Since the CPU board generally uses a rigid circuit board, in the actual production process, the circuit interface unit corresponding to the low-speed interface can be arranged on the flexible circuit board, and the circuit interface unit corresponding to the high-speed interface can be arranged on the CPU board to Meet the user's needs for high-speed and low-speed interfaces.
  • Embodiment 1 or Embodiment 2 The difference from Embodiment 1 or Embodiment 2 is that: the number of expansion boards is multiple, and multiple expansion boards are distributed in a stack; wherein, adjacent expansion boards are electrically connected by a second connector, and the CPU board is One of the multiple expansion boards is electrically connected through the first connector.
  • the number of expansion boards is multiple, and each expansion board can be provided with one or more circuit interface units for connecting with external devices, so that it can further expand more functions and further meet the needs of industry development enthusiasts. Further improve the user experience; and multiple expansion boards are stacked, and the number of expansion boards is generally not too large, so adding multiple expansion boards (such as two) will not cause the volume of the host 10 to increase significantly. It is conducive to miniaturization design, and only needs to add an expansion interface on the casing 11 to expand more functions.
  • the adjacent expansion boards are electrically connected through the second connector, and the CPU board and one of the plurality of expansion boards are electrically connected through the first connector, so that the circuit interface unit on one of the expansion boards
  • the first connector is electrically connected to the CPU board, and the circuit interface units on other expansion boards are electrically connected to the CPU board through the second connector and the first connector. In this way, only one connector interface needs to be provided on the CPU board, which is beneficial to simplify the structure of the CPU board.
  • the difference from the third embodiment is that the CPU board and each of the plurality of expansion boards are electrically connected through the first connector.
  • the CPU board and each of the multiple expansion boards are electrically connected through the first connector, that is, any expansion board is electrically connected to the CPU board through the first connector, so that the circuit interface unit on each expansion board
  • the signal transmission paths with the CPU board are short, which is helpful to improve the control accuracy and response speed.
  • the difference from any of the foregoing embodiments is that: on the basis of any of the foregoing embodiments, further, the high-speed interface and the low-speed interface are distributed on different sides of the housing 11, as shown in FIGS. 3 and 5.
  • the high-speed interface and the low-speed interface are distributed on different sides of the housing 11 to realize the separate layout of the low-speed interface and the high-speed interface.
  • the circuit interface units corresponding to the high-speed interface and the low-speed interface are also implemented separately, which can effectively prevent the mutual interference between the circuit interface units corresponding to the high-speed interface and the low-speed interface, thereby improving the Use reliability.
  • the number of high-speed interfaces is multiple, and multiple high-speed interfaces are distributed on the first side 111 of the housing 11, as shown in FIGS. 1 and 3; the number of low-speed interfaces is multiple, and multiple low-speed interfaces are distributed On the second side 112 of the housing 11, as shown in FIGS. 2 and 5, the first side 111 is opposite to the second side 112.
  • the number of high-speed interfaces is multiple, and multiple high-speed interfaces can meet multiple needs of users, and the multiple high-speed interfaces are distributed on the first side 111 of the housing 11 so that the product structure is relatively regular and the first side is reasonably utilized
  • the position of 111 helps to simplify the product structure.
  • the number of low-speed interfaces is multiple. Multiple low-speed interfaces can meet multiple needs of users.
  • the multiple low-speed interfaces are distributed on the second side 112 of the housing 11 so that the structure of the product is relatively regular and the The position of the two sides 112 is helpful to simplify the product structure.
  • the orientations of the low-speed interface and the high-speed interface are completely opposite. At the same time, it also makes the distance between the circuit interface units corresponding to the low-speed interface and the high-speed interface relatively long, thereby further reducing the risk of mutual interference and further improving the reliability of the use of each circuit interface unit.
  • the power interface 19 of the host 10 is provided on the side between the first side 111 and the second side 112 in the housing 11, as shown in FIGS. 1 and 4; the host 10 also has a storage interface in the housing 11 A circuit interface unit corresponding to the storage interface is provided on the circuit board, and the storage interface faces the side of the housing 11 opposite to the side where the power interface 19 is located.
  • the power interface 19 of the host 10 is provided on the side of the housing 11 between the first side 111 and the second side 112, which can not only prevent interference between the power cord and the device connected to the expansion interface, but also facilitate the first Arranging more expansion interfaces on the side 111 and the second side 112 is also helpful to increase the distance between the adjacent expansion interfaces on the first side 111 and the second side 112, and thus it is beneficial to connect multiple peripheral devices at the same time.
  • the housing 11 is also provided with a storage interface, and a circuit interface unit corresponding to the storage interface is provided on the circuit board, so that the host 10 can also be connected to a storage device (such as an SSD (Solid State Drives)).
  • a storage device such as an SSD (Solid State Drives)
  • the host 10 can add a solid-state hard disk), which can significantly increase the storage space of the host 10, thereby meeting higher demands of users.
  • the storage interface faces the side of the housing 11 opposite to the side where the power interface 19 is located. This reasonably uses the internal space of the host 10 and does not interfere with the circuit interface unit and the power interface 19, which optimizes the product layout. Of course, if you cancel the storage interface, you can also set the expansion interface on the side.
  • the host 10 has a rectangular parallelepiped shape as a whole.
  • the first side 111 and the second side 112 are parallel to each other.
  • the side where the power interface 19 is provided is the third side 113.
  • the area of the third side 113 is smaller than the first
  • the area of one side 111 is described as the side parallel to the third side 113 is the fourth side 114, and the storage interface faces the fourth side 114.
  • the host 10 has a rectangular parallelepiped shape as a whole, and the structure is relatively regular, which is convenient for processing and molding.
  • the first side 111 and the second side 112 are parallel to each other, the third side 113 and the fourth side 114 are parallel to each other, and the area of the third side 113 and the fourth side 114 is smaller than the area of the first side 111 and the second side 112, namely :
  • the expansion interface is arranged on the large-area side of the housing 11 and the power supply interface 19 is arranged on the small-area side of the housing 11, so that it is convenient to set more expansion interfaces and the layout is more reasonable.
  • multiple expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other, as shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 5.
  • the multiple expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other, which corresponds to the layout of the circuit board.
  • the structure is relatively regular, which is convenient for processing and molding, and the structure and layout of the product are further optimized. , And improve the aesthetics of the product.
  • the movable platform (not shown in the figure) provided by the embodiment of the second aspect of the present invention includes a fuselage and the host 10 according to any one of the embodiments of the first aspect, and the host 10 is mounted on the fuselage.
  • the mobile platform provided by the embodiment of the second aspect of the present invention includes the host 10 as described in any one of the embodiments of the first aspect, and thus has all the beneficial effects of any of the foregoing embodiments, which will not be repeated here.
  • the movable platform is a drone or robot.
  • this application proposes a host 10, which is applied to an unmanned aerial vehicle.
  • the host 10 adopts a complete machine design with an integrated interface layout. Specifically, a low-speed interface and a high-speed interface are integrated on the host 10.
  • the interface includes CAN (two ), UART (two), IIC, SPI (IIC and SPI corresponding to I / O interface 18 in the figure), microB (also called microUSB interface, corresponding to OTG interface 17 in the figure), USB3.0 (two ), HDMI, ETH, etc., and separate high-speed and low-speed interfaces.
  • the low-speed port can be used to control peripheral devices, while the high-speed interface can achieve high-speed communication with external devices, such as the camera mounted on the UAV's gimbal, which realizes a highly integrated interface layout.
  • external devices such as the camera mounted on the UAV's gimbal, which realizes a highly integrated interface layout.
  • the low-speed interface can also be used to communicate with the external device, and the high-speed interface can be used to control the peripheral device.
  • the design is as follows, the following interfaces are integrated on the host 10 of 90mm ⁇ 60mm ⁇ 35mm, and their distribution is shown in Figure 1 to Figure 8, where Figure 3 is mainly a high-speed interface, and Figure 5 is mainly a low-speed debugging and control interface;
  • Figure 3 is mainly a high-speed interface
  • Figure 5 is mainly a low-speed debugging and control interface;
  • the internal design of the whole machine it is divided into 2 single boards, one of which is used for CPU control and processing (that is, the CPU board), and the other one realizes the function of the interface board (that is, the expansion board), and the two single boards are fastened through the connector Together, the expansion of functions and interfaces is realized.
  • the integrated layout interface realizes more functional interfaces in a smaller volume to meet the needs of different users; 2)
  • the high-speed interface and the low-speed debugging interface Separate layouts facilitate wiring problems for users.
  • the host provided by the present invention has an expansion board added in the casing, and a circuit interface unit for connecting to an external device is provided on the expansion board, thereby increasing the number of expansion interfaces of the host, thereby increasing the expansion of the host
  • the expansion board is electrically connected to the CPU board through the first connector, so that the external device can be electrically connected to the CPU board after inserting the expansion interface, and multiple expansion interfaces include both high-speed interfaces and low-speed interfaces.
  • the low-speed interface can control external devices, and the high-speed interface can realize high-speed communication with external devices, which is beneficial to meet different needs of users; and because the expansion board and the CPU board are stacked, the size of the host can be minimized, that is On the basis of the miniaturization of the host, the number of host expansion interfaces is increased, which meets the user's demand for industrial application PCs, which is beneficial to meet more needs of industry development enthusiasts.
  • connection can be a fixed connection, a detachable connection, or an integral connection; “connection” can It is directly connected, or indirectly connected through an intermediary.

Abstract

A movable platform and a host (10) thereof. The host (10) is detachably mounted on the movable platform. The host (10) comprises: a housing (11), the housing (11) being provided with a plurality of extended interfaces, the plurality of extended interfaces being distributed on at least one side surface of the housing (11); and a circuit board disposed in the housing (11) and provided with circuit interface units having one-to-one correspondence to the plurality of extended interfaces, the circuit board comprising a CPU board and an extending board, the extending board being stacked with the CPU board and electrically connected to the CPU board by means of a first connector, wherein the plurality of extended interfaces comprise high-speed interfaces and low-speed interfaces, and at least some of the plurality of circuit interface units are distributed on the extending board. By integrately distributing interfaces, the host (10) has more functional interfaces while implementing a less volume, and satisfies the requirements of different users.

Description

可移动平台及其主机Removable platform and its host 技术领域Technical field
本发明实施例涉及可移动平台领域,具体而言,涉及一种主机及包含该主机的可移动平台。Embodiments of the present invention relate to the field of mobile platforms, and in particular, to a host and a mobile platform including the host.
背景技术Background technique
目前,用户对于行业应用PC的需求越来越偏向于小型化,同时希望集成度高、可扩展应用功能多。尤其针对行业开发爱好者,更加偏向于希望更小的主机上具有更多的扩展接口,用于扩展更多功能。而现有的无人机等可移动平台的miniPC一般没有扩展类似这么多功能接口。At present, users' demand for industrial application PCs is more and more inclined to miniaturization, and at the same time, they hope to have high integration and expandable application functions. Especially for industry development enthusiasts, it is more inclined to hope that there are more expansion interfaces on smaller hosts for expanding more functions. However, the existing miniPCs of mobile platforms such as drones generally do not extend such multifunctional interfaces.
发明内容Summary of the invention
为了解决上述技术问题至少之一,本发明的一个目的在于提供一种用于可移动平台的主机。In order to solve at least one of the above technical problems, an object of the present invention is to provide a host for a mobile platform.
本发明的另一个目的在于提供一种包括上述主机的可移动平台。Another object of the present invention is to provide a movable platform including the above host.
为了实现上述目的,本发明实施例第一方面的技术方案提供了一种用于可移动平台的主机,所述主机用于可拆卸地安装在所述可移动平台上,所述主机包括:外壳,所述外壳上设有多个扩展接口,多个所述扩展接口分布在所述外壳的至少一个侧面上;电路板,设置在所述外壳内,并设有与多个所述扩展接口一一对应的电路接口单元;所述电路板包括CPU板和扩展板,所述扩展板与所述CPU板叠层分布,并通过第一连接器与所述CPU板电性连接;其中,多个所述扩展接口包括高速接口和低速接口,多个所述电路接口单元中的至少一部分分布在所述扩展板上。In order to achieve the above objective, the technical solution in the first aspect of the embodiments of the present invention provides a host for a movable platform, the host is detachably mounted on the movable platform, the host includes: a housing , A plurality of expansion interfaces are provided on the casing, and the plurality of expansion interfaces are distributed on at least one side of the casing; a circuit board is provided in the casing and is provided with a plurality of expansion interfaces A corresponding circuit interface unit; the circuit board includes a CPU board and an expansion board, the expansion board and the CPU board are stacked and distributed, and are electrically connected to the CPU board through a first connector; wherein, multiple The expansion interface includes a high-speed interface and a low-speed interface, and at least a part of the plurality of circuit interface units is distributed on the expansion board.
本发明实施例第一方面的技术方案提供的主机,在外壳内增设了扩展板,扩展板上设置了用于与外接设备相连的电路接口单元,从而增加了主机扩展接口的数量,进而增加了主机能够扩展的功能;由于扩展板通过第一连接器与CPU板电性连接,因而外接设备插入扩展接口后能够与CPU 板实现电性连接,且多个扩展接口既包括高速接口,又包括低速接口,利用低速接口可以控制外接设备,利用高速接口可以实现与外接设备的高速通信,从而有利于满足用户的不同需求;且由于扩展板与CPU板层叠分布,因而能够尽量小型化主机的体积,即:在满足主机小型化的基础上,增加了主机扩展接口的数量,符合用户对于行业应用PC的需求,有利于满足行业开发爱好者的更多需求。The host provided by the technical solution of the first aspect of the embodiment of the present invention adds an expansion board in the casing, and a circuit interface unit for connecting to an external device is provided on the expansion board, thereby increasing the number of expansion interfaces of the host and further increasing The expansion function of the host; because the expansion board is electrically connected to the CPU board through the first connector, the external device can be electrically connected to the CPU board after inserting the expansion interface, and multiple expansion interfaces include both high-speed and low-speed interfaces Interface, low-speed interface can be used to control external devices, and high-speed interface can be used to achieve high-speed communication with external devices, which is beneficial to meet different needs of users; and because the expansion board and the CPU board are stacked, the size of the host can be minimized. That is: on the basis of satisfying the miniaturization of the host, the number of host expansion interfaces is increased, which meets the user's demand for industrial application PCs, and is beneficial to meet more needs of industry development enthusiasts.
进一步地,第一连接器将CPU板与扩展板紧扣在一起,实现CPU板与扩展板的机械连接,保证CPU板与扩展板的稳定配合,且缩小CPU板与扩展板之间的距离,有利于减小主机的高度,进而缩小主机的体积。Further, the first connector fastens the CPU board and the expansion board together to realize the mechanical connection of the CPU board and the expansion board, ensure the stable cooperation of the CPU board and the expansion board, and reduce the distance between the CPU board and the expansion board, Conducive to reducing the height of the host, thereby reducing the size of the host.
可以理解的是,高速接口指的是传输速度大于或等于500MB/s的接口,低速接口指的是传输速度小于500MB/s的接口。It can be understood that the high-speed interface refers to an interface with a transmission speed greater than or equal to 500 MB / s, and the low-speed interface refers to an interface with a transmission speed less than 500 MB / s.
另外,本发明实施例提供的上述技术方案中的微波炉的安装组件还可以具有如下附加技术特征:In addition, the installation component of the microwave oven in the above technical solution provided by the embodiment of the present invention may further have the following additional technical features:
在上述技术方案中,所述扩展板的数量为多个,多个所述扩展板叠层分布;其中,相邻的所述扩展板之间通过第二连接器电性连接,且所述CPU板与多个所述扩展板中的其中一个通过所述第一连接器电性连接,或者,所述CPU板与多个所述扩展板中的每一个通过所述第一连接器电性连接。In the above technical solution, the number of the expansion boards is plural, and a plurality of the expansion boards are stacked; wherein, adjacent expansion boards are electrically connected through a second connector, and the CPU The board is electrically connected to one of the plurality of expansion boards through the first connector, or the CPU board is electrically connected to each of the plurality of expansion boards through the first connector .
扩展板的数量为多个,每个扩展板上均可以设置一个或多个用于与外接设备相连的电路接口单元,因而能够进一步扩展更多功能,进一步满足行业开发爱好者的更多需求,进一步提高用户的使用体验;且多个扩展板层叠分布,而扩展板的数量一般也不会过多,因而增加多个扩展板(如两个)不会导致主机的体积显著增大,有利于小型化设计,且只需在外壳上相应增加扩展接口,即可用于扩展更多功能。The number of expansion boards is multiple, and each expansion board can be provided with one or more circuit interface units for connecting with external devices, so that it can further expand more functions and further meet the needs of industry development enthusiasts. Further improve the user experience; and multiple expansion boards are stacked, and the number of expansion boards is generally not too large. Therefore, adding multiple expansion boards (such as two) will not cause a significant increase in the size of the host, which is beneficial to Miniaturized design, and only need to increase the expansion interface on the shell, can be used to expand more functions.
其中,相邻的扩展板之间通过第二连接器电性连接,且CPU板与多个扩展板中的其中一个通过第一连接器电性连接,这样,其中一个扩展板上的电路接口单元通过第一连接器与CPU板电性连接,而其他扩展板上的电路接口单元则通过第二连接器及第一连接器与CPU板电性连接。这样,CPU板上只需设置一个连接器接口,有利于简化CPU板的结构。Among them, the adjacent expansion boards are electrically connected through the second connector, and the CPU board and one of the plurality of expansion boards are electrically connected through the first connector, so that the circuit interface unit on one of the expansion boards The first connector is electrically connected to the CPU board, and the circuit interface units on other expansion boards are electrically connected to the CPU board through the second connector and the first connector. In this way, only one connector interface needs to be provided on the CPU board, which is beneficial to simplify the structure of the CPU board.
或者,CPU板与多个扩展板中的每一个均通过第一连接器电性连接,即:任一扩展板均通过第一连接器与CPU板电性连接,这样,每个扩展板上电路接口单元与CPU板之间的信号传输路径均较短,有利于提高控制精度和响应速度。Alternatively, the CPU board and each of the multiple expansion boards are electrically connected through the first connector, that is, any expansion board is electrically connected to the CPU board through the first connector, so that each expansion board circuit The signal transmission paths between the interface unit and the CPU board are short, which is beneficial to improve the control accuracy and response speed.
在上述技术方案中,所述扩展板为柔性电路板,多个所述电路接口单元中的一部分设置在所述柔性电路板上;或者,所述扩展板为刚性电路板,多个所述电路接口单元均设置在所述扩展板上。In the above technical solution, the expansion board is a flexible circuit board, and a part of the plurality of circuit interface units is provided on the flexible circuit board; or, the expansion board is a rigid circuit board, a plurality of the circuits The interface units are all provided on the expansion board.
扩展板可以为柔性电路板,柔性电路板具有配线密度高、重量轻、厚度薄、弯折性好的特点,因而既有利于设计更多的电路接口单元以扩展更多功能,也有利于进一步降低主机的高度,以进一步缩小主机的体积以及进一步减轻主机的重量。由于CPU板一般采用刚性电路板,故而实际生产过程中,可以将与低速接口相对应的电路接口单元布置在柔性电路板上,将与高速接口相对应的电路接口单元布置在CPU板上,以满足用户对高速接口和低速接口的需求。The expansion board can be a flexible circuit board. The flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bendability, which is not only conducive to designing more circuit interface units to expand more functions, but also conducive to expansion Further reduce the height of the host to further reduce the volume of the host and further reduce the weight of the host. Since the CPU board generally uses a rigid circuit board, in the actual production process, the circuit interface unit corresponding to the low-speed interface can be arranged on the flexible circuit board, and the circuit interface unit corresponding to the high-speed interface can be arranged on the CPU board to Meet the user's needs for high-speed and low-speed interfaces.
扩展板也可以为刚性电路板,刚性电路板具有可高密度化、高可靠性、可设计型、可生产性、可测试性等特点,因而也有利于设计更多的电路接口单元以扩展更多功能,且与高速接口相对应的电路接口单元及与低速接口相对应的电路接口单元均可以设置。因而在实际生成过程中,可以将多个电路接口单元均设置在扩展板上,以简化CPU板的结构。The expansion board can also be a rigid circuit board. The rigid circuit board has the characteristics of high density, high reliability, designability, manufacturability, testability, etc., so it is also conducive to designing more circuit interface units to expand more. It is multifunctional, and the circuit interface unit corresponding to the high-speed interface and the circuit interface unit corresponding to the low-speed interface can be set. Therefore, in the actual generation process, multiple circuit interface units may be provided on the expansion board to simplify the structure of the CPU board.
在上述技术方案中,所述CPU板位于所述扩展板的上方。In the above technical solution, the CPU board is located above the expansion board.
将CPU板布置在扩展板的上方,使得外壳上的扩展接口能够位于外壳的下部,这样一方面提高了产品的美观度,也便于产品放置在台面上时扩展接口与外接设备(如相机、投影仪、移动硬盘等)的连接。The CPU board is arranged above the expansion board, so that the expansion interface on the casing can be located at the lower part of the casing, which on the one hand improves the aesthetics of the product, and also facilitates the expansion interface and external devices (such as camera, projection Instrument, mobile hard disk, etc.).
在上述技术方案中,所述高速接口包括ETH网络接口、USB3.0数据接口、高清晰度多媒体HDMI数据接口、无线通信接口中的任一种或多种;所述低速接口包括控制器局域网络CAN数据接口、通用异步收发传输器UART数据接口、串行外设接口SPI、I2C数据接口、OTG接口中的任一种或多种。In the above technical solution, the high-speed interface includes any one or more of an ETH network interface, a USB3.0 data interface, a high-definition multimedia HDMI data interface, and a wireless communication interface; the low-speed interface includes a controller area network Any one or more of CAN data interface, universal asynchronous transceiver UART data interface, serial peripheral interface SPI, I2C data interface, OTG interface.
高速接口包括ETH网络接口、USB3.0数据接口、高清晰度多媒体 HDMI数据接口、无线通信接口中的任一种或多种,即:高速接口的种类可以仅包括上述接口中的任一个,也可以同时包含上述接口中的任意多个,且包含的任一种高速接口的数量可以为一个或多个,比如USB3.0数据接口的数量为多个,在实际生产过程中可以根据产品的具体结构、具体用途及产品定位进行调整。其中,ETH(Ethernet,以太网)网络接口是以太网口,是一种连接局域网的PC机等设备的工作接口,是最常用的网络接口;USB3.0数据接口的数据传输速度可以达到500MB/s,最大传输带宽高达5Gb/s(即640MB/s),能够满足用户高速传输数据的需求,同时也可以向下兼容USB2.0外接设备;高清晰度多媒体HDMI(High Definition Multimedia Interface,高清晰度多媒体接口)数据接口是一种数字化视频/音频接口技术,适合影像传输的专用型数字化接口;无线通信接口能够实现产品与外接设备(如遥控器、手机、个人电脑等)的无线通信,一般设置在CPU板上。上述几种接口是较为常用的高速接口,基本能够满足用户对高速接口的需求。The high-speed interface includes any one or more of the ETH network interface, USB3.0 data interface, high-definition multimedia HDMI data interface, and wireless communication interface, that is, the type of the high-speed interface may include only any one of the above interfaces, and Any number of the above interfaces can be included at the same time, and the number of any high-speed interfaces included can be one or more. For example, the number of USB3.0 data interfaces is multiple. In the actual production process, it can be based on the specific product Adjust the structure, specific use and product positioning. Among them, the ETH (Ethernet, Ethernet) network interface is an Ethernet port. It is a working interface for PCs and other devices connected to the local area network. It is the most commonly used network interface; the data transmission speed of the USB3.0 data interface can reach 500MB / s, the maximum transmission bandwidth is up to 5Gb / s (that is, 640MB / s), which can meet the needs of users for high-speed data transmission, and can also be backward compatible with USB2.0 external devices; Multimedia interface) The data interface is a digital video / audio interface technology, a dedicated digital interface suitable for image transmission; the wireless communication interface can realize wireless communication between the product and external devices (such as remote controls, mobile phones, personal computers, etc.). Set on the CPU board. The above-mentioned interfaces are relatively commonly used high-speed interfaces, which can basically meet users' demands for high-speed interfaces.
低速接口包括控制器局域网络CAN数据接口、通用异步收发传输器UART数据接口、串行外设接口SPI、I2C数据接口、OTG接口中的任一种或多种,即:低速接口的种类可以仅包括上述接口中的任一个,也可以同时包含上述接口中的任意多个,且包含的任一种高速接口的数量可以为一个或多个,比如控制器局域网络CAN数据接口及通用异步收发传输器UART数据接口的数量为多个,在实际生产过程中可以根据产品的具体结构、具体用途及产品定位进行调整。其中,控制器局域网络CAN(Controller Area Network,控制器局域网络)数据接口,是一种总线接口,实行ISO国际标准化的串行通信协议;通用异步收发传输器UART(Universal Asynchronous Receiver/Transmitter,通用异步收发传输器)数据接口,它将要传输的资料在串行通信与并行通信之间加以转换,也是一种总线接口;串行外设接口SPI(Serial Peripheral Interface,串行外设接口),是一种高速的、全双工、同步的通信总线接口;I2C数据接口也是一种总线接口,I2C总线是由Philips公司开发的一种简单、双向二线制同步串行总线;OTG(On-The-Go),或者叫microUSB接口,主要应用于各种不同的设备或移动设备件的联接,进行数据交换。上述几种接口是较为常用的低速接口, 基本能够满足用户对低速接口的需求。The low-speed interface includes any one or more of the controller area network CAN data interface, the universal asynchronous transceiver UART data interface, the serial peripheral interface SPI, the I2C data interface, and the OTG interface, that is, the type of the low-speed interface can be only Including any of the above interfaces, it can also contain any number of the above interfaces, and the number of any high-speed interfaces included can be one or more, such as the controller area network CAN data interface and universal asynchronous transceiver transmission The number of UART data interfaces is multiple, and can be adjusted according to the specific structure of the product, specific use and product positioning in the actual production process. Among them, the controller area network CAN (Controller Area Network) data interface is a bus interface that implements the ISO international standardized serial communication protocol; the universal asynchronous transceiver transmitter UART (Universal Asynchronous Receiver / Transmitter, universal Asynchronous transceiver) data interface, which converts the data to be transmitted between serial communication and parallel communication, is also a bus interface; serial peripheral interface SPI (Serial Peripheral Interface, serial peripheral interface), is A high-speed, full-duplex, synchronous communication bus interface; the I2C data interface is also a bus interface. The I2C bus is a simple, bidirectional two-wire synchronous serial bus developed by Philips; OTG (On-The- Go), or microUSB interface, is mainly used to connect various devices or mobile devices to exchange data. The above-mentioned interfaces are relatively commonly used low-speed interfaces, which can basically meet the needs of users for low-speed interfaces.
在上述技术方案中,所述无线通信接口包括:WiFi传输接口、移动通信传输接口、红外通信传输接口、蓝牙通信传输接口、短距离激光通讯接口中的任一种或多种。In the above technical solution, the wireless communication interface includes any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface.
无线通信接口包括:WiFi传输接口、移动通信传输接口、红外通信传输接口、蓝牙通信传输接口、短距离激光通讯接口中的任一种或多种,即:无线通信接口的种类可以仅包括上述接口中的任一个,也可以同时包含上述接口中的任意多个,在实际生产过程中可以根据产品的具体结构、具体用途及产品定位进行调整。其中,WiFi(Wireless-Fidelity,无线宽带、无线网)传输接口,能够实现主机与无线局域网的连接;移动通信接口能够实现主机与固定点用户或移动用户之间的通信;红外通信传输接口使主机能够通过红外线与外围设备实现语言、文字、数据、图像等信息的传输;蓝牙通信接口使主机能够通过蓝牙技术与外围设备实现语言、文字、数据、图像等信息的传输;短距离激光通讯接口使主机能够通过激光实现短距离信息传输。上述几种接口是较为常用的无线通信接口,基本能够满足用户对无线通信接口的需求。The wireless communication interface includes: any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface, that is, the type of the wireless communication interface may include only the above interface Any one of them may also include any of the above interfaces at the same time. In the actual production process, it can be adjusted according to the specific structure, specific use and product positioning of the product. Among them, the WiFi (Wireless-Fidelity, wireless broadband, wireless network) transmission interface can realize the connection between the host and the wireless LAN; the mobile communication interface can realize the communication between the host and the fixed point user or mobile user; the infrared communication transmission interface allows the host It can realize the transmission of language, text, data, images and other information through infrared rays and peripheral devices; the Bluetooth communication interface enables the host to transmit the language, text, data, images and other information through Bluetooth technology; and the short-range laser communication interface enables The host can realize short-distance information transmission by laser. The above-mentioned interfaces are relatively common wireless communication interfaces, which can basically satisfy users' demands for wireless communication interfaces.
在上述技术方案中,所述高速接口和所述低速接口分布在所述外壳的不同侧面上。In the above technical solution, the high-speed interface and the low-speed interface are distributed on different sides of the housing.
将高速接口和低速接口分布在外壳的不同侧面上,实现了低速接口与高速接口的分开布局。相应地,与高速接口和低速接口相对应的电路接口单元也实现了分开布局,这样能够有效防止与高速接口和低速接口相对应的电路接口单元之间相互干扰,从而提高了各个电路接口单元的使用可靠性。Distributing the high-speed interface and the low-speed interface on different sides of the housing realizes the separate layout of the low-speed interface and the high-speed interface. Correspondingly, the circuit interface units corresponding to the high-speed interface and the low-speed interface are also implemented separately, which can effectively prevent the mutual interference between the circuit interface units corresponding to the high-speed interface and the low-speed interface, thereby improving the Use reliability.
在上述技术方案中,所述高速接口的数量为多个,多个所述高速接口均分布在所述外壳的第一侧面上;所述低速接口的数量为多个,多个所述低速接口均分布在所述外壳的第二侧面上,所述第一侧面与所述第二侧面相背设置。In the above technical solution, the number of the high-speed interfaces is multiple, and the multiple high-speed interfaces are all distributed on the first side of the housing; the number of the low-speed interfaces is multiple, and the multiple low-speed interfaces Both are distributed on the second side of the housing, and the first side is opposite to the second side.
高速接口的数量为多个,多个高速接口能够满足用户的多个需求,将多个高速接口集中分布在外壳的第一侧面上,使得产品结构较为规整,且 合理利用了第一侧面的位置,有利于简化产品结构。The number of high-speed interfaces is multiple. Multiple high-speed interfaces can meet the needs of users. The multiple high-speed interfaces are distributed on the first side of the housing, which makes the product structure more regular and the position of the first side is reasonably used. , Help to simplify the product structure.
低速接口的数量为多个,多个低速接口能够满足用户的多个需求,将多个低速接口集中分布在外壳的第二侧面上,使得产品的结构也较为规整,且合理利用了第二侧面的位置,有利于简化产品结构。The number of low-speed interfaces is multiple. Multiple low-speed interfaces can meet the needs of users. The multiple low-speed interfaces are concentrated on the second side of the casing, which makes the product structure more regular and the second side is used reasonably. The location is conducive to simplifying the product structure.
进一步地,第一侧面与第二侧面相背设置,则低速接口和高速接口的朝向完全相反,这样能够防止与低速接口和高速接口相连的外接设备相互之间发生干涉,便于同时连接多种外接设备;同时,也使得与低速接口和高速接口相对应的电路接口单元之间的距离相对较远,从而进一步降低了相互干扰的风险,进一步提高了各个电路接口单元的使用可靠性。Further, if the first side and the second side are opposite to each other, the orientation of the low-speed interface and the high-speed interface is completely opposite, which can prevent the external devices connected to the low-speed interface and the high-speed interface from interfering with each other, which is convenient for connecting multiple external At the same time, it also makes the distance between the circuit interface units corresponding to the low-speed interface and the high-speed interface relatively long, thereby further reducing the risk of mutual interference and further improving the reliability of the use of each circuit interface unit.
在上述技术方案中,所述主机的电源接口设置在所述外壳中所述第一侧面与所述第二侧面之间的侧面上;所述主机还设有位于所述外壳内的存储接口,所述电路板上设有与所述存储接口相对应的电路接口单元,所述存储接口朝向所述外壳中与所述电源接口的所在侧面相背设置的侧面。In the above technical solution, the power interface of the host is provided on the side between the first side and the second side in the housing; the host also has a storage interface in the housing, A circuit interface unit corresponding to the storage interface is provided on the circuit board, and the storage interface faces a side of the housing opposite to the side where the power interface is located.
将主机的电源接口设置在外壳中第一侧面与第二侧面之间的侧面上,这样既能够防止电源线与连接扩展接口的设备之间发生干涉,又有利于在第一侧面与第二侧面上布置更多的扩展接口,也有利于增加第一侧面和第二侧面上相邻的扩展接口之间的距离,进而有利于同时连接多个外围设备。Set the power interface of the host on the side between the first side and the second side of the housing, which can not only prevent interference between the power cord and the device connected to the expansion interface, but also facilitate the connection between the first side and the second side Arranging more expansion interfaces on the top is also helpful for increasing the distance between the adjacent expansion interfaces on the first side and the second side, and thus is beneficial for connecting multiple peripheral devices at the same time.
进一步地,外壳内还设有存储接口,电路板上设有与存储接口相对应的电路接口单元,使得主机还能够连接存储设备(如存储接口为SSD(Solid State Drives,固态硬盘)硬盘接口,则主机可以增加固态硬盘),能够显著增加主机的存储空间,进而满足用户的更高需求。其中,存储接口朝向外壳中与电源接口所在侧面相背设置的侧面,这合理利用了主机的内部空间,不会与电路接口单元及电源接口发生干涉,优化了产品布局。当然,如果取消存储接口,也可以在该侧面上设置扩展接口。Further, a storage interface is also provided in the casing, and a circuit interface unit corresponding to the storage interface is provided on the circuit board, so that the host can also connect to a storage device (such as an SSD (Solid State Drives)), The host can add a solid-state hard drive), which can significantly increase the storage space of the host to meet the higher demands of users. Among them, the storage interface faces the side opposite to the side where the power interface is located in the housing, which rationally uses the internal space of the host, does not interfere with the circuit interface unit and the power interface, and optimizes the product layout. Of course, if you cancel the storage interface, you can also set the expansion interface on the side.
优选地,所述主机整体呈长方体状,所述第一侧面与所述第二侧面相互平行,记设有所述电源接口的侧面为第三侧面,所述第三侧面的面积小于所述第一侧面的面积,记与所述第三侧面相平行的侧面为第四侧面,所述存储接口朝向所述第四侧面。Preferably, the main body has a rectangular parallelepiped shape as a whole, the first side face and the second side face are parallel to each other, the side face provided with the power interface is a third side face, and the area of the third side face is smaller than that of the first The area of one side surface is recorded as the fourth side surface parallel to the third side surface, and the storage interface faces the fourth side surface.
主机整体呈长方体状,结构较为规整,便于加工成型。第一侧面与第 二侧面相互平行,第三侧面与第四侧面相互平行,且第三侧面、第四侧面的面积小于第一侧面、第二侧面的面积,即:将扩展接口布置在外壳的大面积侧面上,将电源接口布置在外壳的小面积侧面上,这样便于设置更多的扩展接口,布局较为合理。The main unit is in the shape of a rectangular parallelepiped, and the structure is relatively regular, which is convenient for processing and molding. The first side and the second side are parallel to each other, the third side and the fourth side are parallel to each other, and the area of the third side and the fourth side is smaller than the area of the first side and the second side, that is: the expansion interface is arranged on the housing On the large-area side, the power supply interface is arranged on the small-area side of the housing, so that it is convenient to set more expansion interfaces, and the layout is more reasonable.
在上述任一技术方案中,多个所述扩展接口在相应侧面上排列成单排形式或者排列成相互平行的多排形式。In any one of the above technical solutions, a plurality of the expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other.
使多个扩展接口在相应侧面上排列成单排形式或者排列成相互平行的多排形式,与电路板的排布形式相对应,结构较为规整,便于加工成型,进一步优化了产品的结构和布局,且提高了产品的美观度。The multiple expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other, which corresponds to the layout of the circuit board. The structure is relatively regular, which is convenient for processing and molding, and the structure and layout of the product are further optimized , And improve the aesthetics of the product.
本发明第二方面的技术方案提供了一种可移动平台,包括机身以及如第一方面技术方案中任一项所述的主机,所述主机搭载在所述机身上。The technical solution of the second aspect of the present invention provides a movable platform, including a fuselage and the host according to any one of the technical solutions of the first aspect, the host being mounted on the fuselage.
本发明第二方面的技术方案提供的可移动平台,因包括如第一方面技术方案中任一项所述的主机,因而具有上述任一技术方案所具有的一切有益效果,在此不再赘述。The mobile platform provided by the technical solution of the second aspect of the present invention includes the host as described in any one of the technical solutions of the first aspect, and thus has all the beneficial effects of any of the foregoing technical solutions, which will not be repeated here. .
在上述任一技术方案中,所述可移动平台为无人机或机器人。In any of the above technical solutions, the movable platform is a drone or a robot.
本发明的附加方面和优点将在下面的描述部分中变得明显,或通过本发明的实践了解到。Additional aspects and advantages of the present invention will become apparent in the following description, or will be learned through the practice of the present invention.
附图说明BRIEF DESCRIPTION
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
图1是本发明一些实施例所述的主机一个视角的立体结构示意图;FIG. 1 is a schematic perspective structural view of a host according to some embodiments of the present invention from a perspective;
图2是图1所示主机另一个视角的立体结构示意图;FIG. 2 is a schematic perspective structural view of the host shown in FIG. 1 from another perspective;
图3是图1所示主机的主视结构示意图;3 is a schematic view of the main structure of the host shown in FIG. 1;
图4是图1所示主机的右视结构示意图;4 is a schematic view of the right side structure of the host shown in FIG. 1;
图5是图1所示主机的后视结构示意图;5 is a schematic diagram of the rear view of the host shown in FIG. 1;
图6是图1所示主机的俯视结构示意图;6 is a schematic view of the top structure of the host shown in FIG. 1;
图7是图1所示主机的左视结构示意图;7 is a schematic view of the left side structure of the host shown in FIG. 1;
图8是图1所示主机的仰视结构示意图。FIG. 8 is a schematic diagram of the bottom view of the host shown in FIG. 1.
其中,图1至图8中的附图标记与部件名称之间的对应关系为:Among them, the correspondence between the reference numerals in FIGS. 1 to 8 and the component names is:
10主机,11外壳,111第一侧面,112第二侧面,113第三侧面,114第四侧面,12 ETH网络接口,13 USB3.0数据接口,14高清晰度多媒体HDMI数据接口,15控制器局域网络CAN数据接口,16通用异步收发传输器UART数据接口,17 OTG接口,18 I/O接口,19电源接口。10 host, 11 shell, 111 first side, 112 second side, 113 third side, 114 fourth side, 12 ETH network interface, 13 USB3.0 data interface, 14 high-definition multimedia HDMI data interface, 15 controller Local area network CAN data interface, 16 universal asynchronous transceiver UART data interface, 17 OTG interface, 18 I / O interface, 19 power interface.
具体实施方式detailed description
为了能够更清楚地理解本发明的上述目的、特征和优点,下面结合附图和具体实施方式对本发明进行进一步的详细描述。需要说明的是,在不冲突的情况下,本申请的实施例及实施例中的特征可以相互组合。In order to be able to understand the above objects, features and advantages of the present invention more clearly, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other if there is no conflict.
在下面的描述中阐述了很多具体细节以便于充分理解本发明,但是,本发明还可以采用其他不同于在此描述的其他方式来实施,因此,本发明的保护范围并不受下面公开的具体实施例的限制。In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways than those described here. Therefore, the scope of protection of the present invention is not subject to the specifics disclosed below. Limitations of the embodiment.
本公开所描述的技术可以应用在可移动平台上,如空中的可移动平台(例如,固定翼飞行器,例如飞机、滑行机,旋翼飞行器,如直升飞机,或者其它的飞行器,如软式飞艇、气球),水中的可移动平台(例如,潜艇,小船,轮船),陆地上的可移动平台(例如,机动车,如轿车、摩托车、公共汽车、卡车、运货车;或手持部件,例如鱼竿、自拍杆或其它类型的可移动的支持物或者框架;以及火车、地铁等),太空中的可移动平台(如,卫星、空间站、宇宙飞船)。可移动平台可以在一个环境中(如陆地上、水中、空中、太空)自由移动,或者沿着预设的路径、轨道、或者以约定的方式移动。该可移动平台可以一维、二维或者三维的移动。可移动平台可以响应信号自动移动,而不用手动移动。某些实施例中,所述可移动平台可以是运输工具,如空中的运输工具、陆地上的运输工具、水中的运输工具、太空中的运输工具,或者他们的结合。运输工具可以在一个或者多个指定的环境中自由移动,或者沿着轨道或者固定的路径移动。运输工具可包括动力系统。所述动力系统利用电动机、引擎、电子元件、磁性机构、重力、风力、燃烧、及/或者其 它的动力机构。在某些实施例中,手动动力系统、人力动力系统、或者借助于其它生物体的动力系统也可以应用在可移动平台上,例如,运输工具。在某些实施例中,所述可移动平台可以是旋翼飞行器,该旋翼飞行器可以通过一个或者多个叶片的旋转驱动或者控制。所述可移动平台可借助一个或者多个旋转叶片、螺旋桨、轮子、磁铁、轨道、或者其它机构,被驱动或者重新定位。在某些实施例中,所述可移动平台是无人运输工具,如无人飞行器(Unmanned Aerial Vehicle,UAV),也可称为无人机。无人飞行器能够悬停、调整方向、和/或者调整位置。The technology described in the present disclosure can be applied to a mobile platform, such as a mobile platform in the air (for example, a fixed-wing aircraft, such as an airplane, a taxi, a rotorcraft, such as a helicopter, or other aircraft, such as a soft airship , Balloons), movable platforms in water (eg, submarines, boats, ships), movable platforms on land (eg, motor vehicles such as cars, motorcycles, buses, trucks, vans; or hand-held components, such as Fishing rods, selfie sticks or other types of movable supports or frames; and trains, subways, etc.), movable platforms in space (eg, satellites, space stations, spaceships). The movable platform can move freely in an environment (such as land, water, air, space), or follow a preset path, orbit, or move in an agreed manner. The movable platform can move in one, two or three dimensions. The movable platform can move automatically in response to the signal instead of moving manually. In some embodiments, the movable platform may be a transportation means, such as a transportation means in the air, a transportation means on land, a transportation means in water, a transportation means in space, or a combination thereof. The vehicle can move freely in one or more designated environments, or along a track or a fixed path. The vehicle may include a power system. The power system utilizes electric motors, engines, electronic components, magnetic mechanisms, gravity, wind power, combustion, and / or other power mechanisms. In some embodiments, a manual power system, a human power system, or a power system with the help of other organisms can also be applied on a movable platform, for example, a transportation vehicle. In some embodiments, the movable platform may be a rotorcraft, which may be driven or controlled by the rotation of one or more blades. The movable platform can be driven or repositioned by means of one or more rotating blades, propellers, wheels, magnets, rails, or other mechanisms. In some embodiments, the movable platform is an unmanned vehicle, such as an unmanned aerial vehicle (Unmanned Aerial Vehicle, UAV), which may also be called a drone. The UAV can hover, adjust direction, and / or adjust position.
下面参照图1至图8描述根据本发明一些实施例所述的主机及可移动平台。The host and the mobile platform according to some embodiments of the present invention are described below with reference to FIGS. 1 to 8.
如图1至图8所示,本发明第一方面的实施例提供的用于可移动平台的主机10,主机10用于可拆卸地安装在可移动平台上,主机10包括:外壳11和电路板。As shown in FIGS. 1 to 8, a host 10 for a mobile platform provided by an embodiment of the first aspect of the present invention is used to be detachably mounted on a mobile platform. The host 10 includes: a housing 11 and a circuit board.
具体地,外壳11上设有多个扩展接口,多个扩展接口分布在外壳11的至少一个侧面上;电路板设置在外壳11内,并设有与多个扩展接口一一对应的电路接口单元;电路板包括CPU板和扩展板,扩展板与CPU板叠层分布,并通过第一连接器与CPU板电性连接;其中,多个扩展接口包括高速接口和低速接口,多个电路接口单元中的至少一部分分布在扩展板上。Specifically, a plurality of expansion interfaces are provided on the housing 11, and the plurality of expansion interfaces are distributed on at least one side of the housing 11; the circuit board is disposed in the housing 11, and a circuit interface unit corresponding to the plurality of expansion interfaces is provided ; The circuit board includes a CPU board and an expansion board, and the expansion board and the CPU board are stacked and electrically connected to the CPU board through a first connector; wherein, the plurality of expansion interfaces include a high-speed interface and a low-speed interface, and a plurality of circuit interface units At least part of is distributed on the expansion board.
本发明第一方面的实施例提供的主机10,在外壳11内增设了扩展板,扩展板上设置了用于与外接设备相连的电路接口单元,从而增加了主机10扩展接口的数量,进而增加了主机10能够扩展的功能;由于扩展板通过第一连接器与CPU板电性连接,因而外接设备插入扩展接口后能够与CPU板实现电性连接,且多个扩展接口既包括高速接口,又包括低速接口,利用低速接口可以控制外接设备,利用高速接口可以实现与外接设备的高速通信,从而有利于满足用户的不同需求;且由于扩展板与CPU板层叠分布,因而能够尽量小型化主机10的体积,即:在满足主机10小型化的基础上,增加了主机10扩展接口的数量,符合用户对于行业应用PC的需求,有利于满足行业开发爱好者的更多需求。In the host 10 provided by the embodiment of the first aspect of the present invention, an expansion board is additionally provided in the casing 11, and a circuit interface unit for connecting to an external device is provided on the expansion board, thereby increasing the number of expansion interfaces of the host 10 and further increasing The host 10 can expand the function; because the expansion board is electrically connected to the CPU board through the first connector, the external device can be electrically connected to the CPU board after inserting the expansion interface, and multiple expansion interfaces include both high-speed interfaces and Including low-speed interface, the low-speed interface can be used to control external devices, and the high-speed interface can be used to achieve high-speed communication with external devices, which is beneficial to meet the different needs of users; The volume, that is: on the basis of meeting the miniaturization of the host 10, the number of expansion interfaces of the host 10 is increased, which meets the user's demand for industry application PCs, and is beneficial to meet more needs of industry development enthusiasts.
进一步地,第一连接器将CPU板与扩展板紧扣在一起,实现CPU板与 扩展板的机械连接,保证CPU板与扩展板的稳定配合,且缩小CPU板与扩展板之间的距离,有利于减小主机10的高度,进而缩小主机10的体积。Further, the first connector fastens the CPU board and the expansion board together to realize the mechanical connection of the CPU board and the expansion board, ensure the stable cooperation of the CPU board and the expansion board, and reduce the distance between the CPU board and the expansion board, It is beneficial to reduce the height of the host 10 and further reduce the volume of the host 10.
可以理解的是,在本申请中,高速接口指的是传输速度大于或等于500MB/s的接口,低速接口指的是传输速度小于500MB/s的接口。其中,高速接口与低速接口可以是相对概念,比如以USB1.0数据接口、USB2.0数据接口、USB3.0数据接口为例,本领域的技术人员通常会以USB3.0数据接口作为高速接口,将USB1.0数据接口及USB2.0数据接口作为低速接口。但是如果仅以USB1.0数据接口、USB2.0数据接口作比较,则也有可能将USB1.0数据接口作为低速接口,将USB2.0数据接口作为高速接口。It can be understood that, in this application, a high-speed interface refers to an interface with a transmission speed greater than or equal to 500 MB / s, and a low-speed interface refers to an interface with a transmission speed less than 500 MB / s. Among them, the high-speed interface and the low-speed interface may be relative concepts. For example, the USB1.0 data interface, the USB2.0 data interface, and the USB3.0 data interface are used as examples. Those skilled in the art usually use the USB3.0 data interface as the high-speed interface. , Take USB1.0 data interface and USB2.0 data interface as low-speed interface. However, if only USB1.0 data interface and USB2.0 data interface are compared, it is also possible to use USB1.0 data interface as a low-speed interface and USB2.0 data interface as a high-speed interface.
下面结合一些实施例来详细描述本申请提供的主机10的具体结构。The specific structure of the host 10 provided by the present application will be described in detail below in conjunction with some embodiments.
实施例一Example one
扩展板的数量为一个。The number of expansion boards is one.
将扩展板的数量设计为一个,既能够增加主机10扩展接口的数量,又有利于简化主机10的结构,缩小主机10的体积,尽可能实现主机10的小型化。Designing the number of expansion boards as one can not only increase the number of expansion interfaces of the host 10, but also help simplify the structure of the host 10, reduce the volume of the host 10, and minimize the size of the host 10 as much as possible.
进一步地,扩展板为刚性电路板,多个电路接口单元均设置在扩展板上。Further, the expansion board is a rigid circuit board, and multiple circuit interface units are all provided on the expansion board.
扩展板也可以为刚性电路板,刚性电路板具有可高密度化、高可靠性、可设计型、可生产性、可测试性等特点,因而也有利于设计更多的电路接口单元以扩展更多功能,且与高速接口相对应的电路接口单元及与低速接口相对应的电路接口单元均可以设置。因而在实际生成过程中,可以将多个电路接口单元均设置在扩展板上,以简化CPU板的结构。The expansion board can also be a rigid circuit board. The rigid circuit board has the characteristics of high density, high reliability, designability, manufacturability, testability, etc., so it is also conducive to designing more circuit interface units to expand more. It is multifunctional, and the circuit interface unit corresponding to the high-speed interface and the circuit interface unit corresponding to the low-speed interface can be set. Therefore, in the actual generation process, multiple circuit interface units may be provided on the expansion board to simplify the structure of the CPU board.
优选地,CPU板位于扩展板的上方。Preferably, the CPU board is located above the expansion board.
将CPU板布置在扩展板的上方,使得外壳11上的扩展接口能够位于外壳11的下部,这样一方面提高了产品的美观度,也便于产品放置在台面上时扩展接口与外接设备(如相机、投影仪、移动硬盘等)的连接。The CPU board is arranged above the expansion board, so that the expansion interface on the casing 11 can be located at the lower part of the casing 11, which on the one hand improves the aesthetics of the product, and also facilitates the expansion interface and external devices (such as a camera) , Projector, mobile hard disk, etc.).
进一步地,高速接口包括ETH网络接口12、USB3.0数据接口13、高清晰度多媒体HDMI数据接口14、无线通信接口中的任一种或多种,如图3所示;低速接口包括控制器局域网络CAN数据接口15、通用异步收发传输器UART数据接口16、串行外设接口SPI、I2C数据接口、OTG接口17中的任 一种或多种,如图5所示。Further, the high-speed interface includes any one or more of an ETH network interface 12, a USB 3.0 data interface 13, a high-definition multimedia HDMI data interface 14, and a wireless communication interface, as shown in FIG. 3; the low-speed interface includes a controller Any one or more of the local area network CAN data interface 15, universal asynchronous transceiver UART data interface 16, serial peripheral interface SPI, I2C data interface, OTG interface 17, as shown in FIG. 5.
高速接口包括ETH网络接口12、USB3.0数据接口13、高清晰度多媒体HDMI数据接口14、无线通信接口中的任一种或多种,即:高速接口的种类可以仅包括上述接口中的任一个,也可以同时包含上述接口中的任意多个,且包含的任一种高速接口的数量可以为一个或多个,比如USB3.0数据接口13的数量为多个,在实际生产过程中可以根据产品的具体结构、具体用途及产品定位进行调整。The high-speed interface includes any one or more of the ETH network interface 12, the USB3.0 data interface 13, the high-definition multimedia HDMI data interface 14, and the wireless communication interface, that is, the type of the high-speed interface may include only any of the above interfaces One can also contain any number of the above interfaces, and the number of any high-speed interfaces included can be one or more. For example, the number of USB3.0 data interfaces 13 is multiple, which can be used in the actual production process. Adjust according to the specific structure, specific use and product positioning of the product.
其中,ETH(Ethernet,以太网)网络接口是以太网口,是一种连接局域网的PC机等设备的工作接口,是最常用的网络接口;USB3.0数据接口的数据传输速度可以达到500MB/s,最大传输带宽高达5Gb/s(即640MB/s),能够满足用户高速传输数据的需求,同时也可以向下兼容USB2.0外接设备;高清晰度多媒体HDMI(High Definition Multimedia Interface,高清晰度多媒体接口)数据接口是一种数字化视频/音频接口技术,适合影像传输的专用型数字化接口;无线通信接口能够实现产品与外接设备(如遥控器、手机、个人电脑等)的无线通信,一般设置在CPU板上。上述几种接口是较为常用的高速接口,基本能够满足用户对高速接口的需求。Among them, the ETH (Ethernet, Ethernet) network interface is an Ethernet port. It is a working interface for PCs and other devices connected to the local area network. It is the most commonly used network interface; the data transmission speed of the USB3.0 data interface can reach 500MB / s, the maximum transmission bandwidth is up to 5Gb / s (that is, 640MB / s), which can meet the needs of users for high-speed data transmission, and is also backward compatible with USB2.0 external devices; High-definition multimedia HDMI (High Definition Multimedia Interface, high-definition Multimedia interface) The data interface is a digital video / audio interface technology, a dedicated digital interface suitable for image transmission; the wireless communication interface can realize wireless communication between the product and external devices (such as remote controls, mobile phones, personal computers, etc.). Set on the CPU board. The above-mentioned interfaces are relatively commonly used high-speed interfaces, which can basically meet users' demands for high-speed interfaces.
低速接口包括控制器局域网络CAN数据接口15、通用异步收发传输器UART数据接口16、串行外设接口SPI、I2C数据接口、OTG接口17中的任一种或多种,即:低速接口的种类可以仅包括上述接口中的任一个,也可以同时包含上述接口中的任意多个,且包含的任一种高速接口的数量可以为一个或多个,比如控制器局域网络CAN数据接口15及通用异步收发传输器UART数据接口16的数量为多个,在实际生产过程中可以根据产品的具体结构、具体用途及产品定位进行调整。The low-speed interface includes any one or more of the controller area network CAN data interface 15, the universal asynchronous transceiver UART data interface 16, the serial peripheral interface SPI, the I2C data interface, and the OTG interface 17, namely: the low-speed interface The type may include only any one of the above-mentioned interfaces, or may include any number of the above-mentioned interfaces at the same time, and the number of any one of the included high-speed interfaces may be one or more, such as the controller area network CAN data interface 15 and The number of the UART data interface 16 of the universal asynchronous transceiver transmitter and receiver is multiple, and can be adjusted according to the specific structure, specific use and product positioning of the product in the actual production process.
其中,控制器局域网络CAN(Controller Area Network,控制器局域网络)数据接口,是一种总线接口,实行ISO国际标准化的串行通信协议;通用异步收发传输器UART(Universal Asynchronous Receiver/Transmitter,通用异步收发传输器)数据接口,它将要传输的资料在串行通信与并行通信之间加以转换,也是一种总线接口;串行外设接口SPI(Serial Peripheral Interface,串行外设接口),是一种高速的、全双工、同步的通信总线接口;I2C数据接 口也是一种总线接口,I2C总线是由Philips公司开发的一种简单、双向二线制同步串行总线;OTG(On-The-Go),或者叫microUSB接口,主要应用于各种不同的设备或移动设备件的联接,进行数据交换。上述几种接口是较为常用的低速接口,基本能够满足用户对低速接口的需求。Among them, the controller area network CAN (Controller Area Network) data interface is a bus interface that implements the ISO international standardized serial communication protocol; the universal asynchronous transceiver transmitter UART (Universal Asynchronous Receiver / Transmitter, universal Asynchronous transceiver) data interface, which converts the data to be transmitted between serial communication and parallel communication, is also a bus interface; serial peripheral interface SPI (Serial Peripheral Interface, serial peripheral interface), is A high-speed, full-duplex, synchronous communication bus interface; the I2C data interface is also a bus interface. The I2C bus is a simple, bidirectional two-wire synchronous serial bus developed by Philips; OTG (On-The- Go), or microUSB interface, is mainly used to connect various devices or mobile devices to exchange data. The above-mentioned interfaces are relatively common low-speed interfaces, which can basically meet users' demands for low-speed interfaces.
具体地,无线通信接口包括:WiFi传输接口、移动通信传输接口、红外通信传输接口、蓝牙通信传输接口、短距离激光通讯接口中的任一种或多种。Specifically, the wireless communication interface includes any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface.
无线通信接口包括:WiFi传输接口、移动通信传输接口、红外通信传输接口、蓝牙通信传输接口、短距离激光通讯接口中的任一种或多种,即:无线通信接口的种类可以仅包括上述接口中的任一个,也可以同时包含上述接口中的任意多个,在实际生产过程中可以根据产品的具体结构、具体用途及产品定位进行调整。其中,WiFi(Wireless-Fidelity,无线宽带、无线网)传输接口,能够实现主机10与无线局域网的连接;移动通信接口能够实现主机10与固定点用户或移动用户之间的通信;红外通信传输接口使主机10能够通过红外线与外围设备实现语言、文字、数据、图像等信息的传输;蓝牙通信接口使主机10能够通过蓝牙技术与外围设备实现语言、文字、数据、图像等信息的传输;短距离激光通讯接口使主机10能够通过激光实现短距离信息传输。上述几种接口是较为常用的无线通信接口,基本能够满足用户对无线通信接口的需求。The wireless communication interface includes: any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface, that is, the type of the wireless communication interface may include only the above interface Any one of them may also include any of the above interfaces at the same time. In the actual production process, it can be adjusted according to the specific structure, specific use and product positioning of the product. Among them, WiFi (Wireless-Fidelity, wireless broadband, wireless network) transmission interface can realize the connection between the host 10 and the wireless local area network; the mobile communication interface can realize the communication between the host 10 and the fixed-point user or mobile user; infrared communication transmission interface Enables the host 10 to transmit language, text, data, images and other information through infrared and peripheral devices; Bluetooth communication interface enables the host 10 to transmit language, text, data, images and other information through Bluetooth technology; The laser communication interface enables the host 10 to realize short-distance information transmission through the laser. The above-mentioned interfaces are relatively common wireless communication interfaces, which can basically satisfy users' demands for wireless communication interfaces.
实施例二Example 2
与实施例一的区别在于:扩展板为柔性电路板,多个电路接口单元中的一部分设置在柔性电路板上。The difference from the first embodiment is that the expansion board is a flexible circuit board, and a part of the plurality of circuit interface units is provided on the flexible circuit board.
扩展板可以为柔性电路板,柔性电路板具有配线密度高、重量轻、厚度薄、弯折性好的特点,因而既有利于设计更多的电路接口单元以扩展更多功能,也有利于进一步降低主机10的高度以进一步缩小主机10的体积以及进一步减轻主机10的重量。由于CPU板一般采用刚性电路板,故而实际生产过程中,可以将与低速接口相对应的电路接口单元布置在柔性电路板上,将与高速接口相对应的电路接口单元布置在CPU板上,以满足用户对高速接口和低速接口的需求。The expansion board can be a flexible circuit board. The flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bendability, which is not only conducive to designing more circuit interface units to expand more functions, but also conducive to expansion The height of the host 10 is further reduced to further reduce the volume of the host 10 and further reduce the weight of the host 10. Since the CPU board generally uses a rigid circuit board, in the actual production process, the circuit interface unit corresponding to the low-speed interface can be arranged on the flexible circuit board, and the circuit interface unit corresponding to the high-speed interface can be arranged on the CPU board to Meet the user's needs for high-speed and low-speed interfaces.
实施例三Example Three
与实施例一或实施例二的区别在于:扩展板的数量为多个,多个扩展板叠层分布;其中,相邻的扩展板之间通过第二连接器电性连接,且CPU板与多个扩展板中的其中一个通过第一连接器电性连接。The difference from Embodiment 1 or Embodiment 2 is that: the number of expansion boards is multiple, and multiple expansion boards are distributed in a stack; wherein, adjacent expansion boards are electrically connected by a second connector, and the CPU board is One of the multiple expansion boards is electrically connected through the first connector.
扩展板的数量为多个,每个扩展板上均可以设置一个或多个用于与外接设备相连的电路接口单元,因而能够进一步扩展更多功能,进一步满足行业开发爱好者的更多需求,进一步提高用户的使用体验;且多个扩展板层叠分布,而扩展板的数量一般也不会过多,因而增加多个扩展板(如两个)不会导致主机10的体积显著增大,有利于小型化设计,且只需在外壳11上相应增加扩展接口,即可用于扩展更多功能。The number of expansion boards is multiple, and each expansion board can be provided with one or more circuit interface units for connecting with external devices, so that it can further expand more functions and further meet the needs of industry development enthusiasts. Further improve the user experience; and multiple expansion boards are stacked, and the number of expansion boards is generally not too large, so adding multiple expansion boards (such as two) will not cause the volume of the host 10 to increase significantly. It is conducive to miniaturization design, and only needs to add an expansion interface on the casing 11 to expand more functions.
其中,相邻的扩展板之间通过第二连接器电性连接,且CPU板与多个扩展板中的其中一个通过第一连接器电性连接,这样,其中一个扩展板上的电路接口单元通过第一连接器与CPU板电性连接,而其他扩展板上的电路接口单元则通过第二连接器及第一连接器与CPU板电性连接。这样,CPU板上只需设置一个连接器接口,有利于简化CPU板的结构。Among them, the adjacent expansion boards are electrically connected through the second connector, and the CPU board and one of the plurality of expansion boards are electrically connected through the first connector, so that the circuit interface unit on one of the expansion boards The first connector is electrically connected to the CPU board, and the circuit interface units on other expansion boards are electrically connected to the CPU board through the second connector and the first connector. In this way, only one connector interface needs to be provided on the CPU board, which is beneficial to simplify the structure of the CPU board.
实施例四Example 4
与实施例三的区别在于:CPU板与多个扩展板中的每一个通过第一连接器电性连接。The difference from the third embodiment is that the CPU board and each of the plurality of expansion boards are electrically connected through the first connector.
CPU板与多个扩展板中的每一个均通过第一连接器电性连接,即:任一扩展板均通过第一连接器与CPU板电性连接,这样,每个扩展板上电路接口单元与CPU板之间的信号传输路径均较短,有利于提高控制精度和响应速度。The CPU board and each of the multiple expansion boards are electrically connected through the first connector, that is, any expansion board is electrically connected to the CPU board through the first connector, so that the circuit interface unit on each expansion board The signal transmission paths with the CPU board are short, which is helpful to improve the control accuracy and response speed.
实施例五Example 5
与上述任一实施例的区别在于:在上述任一实施例的基础上,进一步地,高速接口和低速接口分布在外壳11的不同侧面上,如图3和图5所示。The difference from any of the foregoing embodiments is that: on the basis of any of the foregoing embodiments, further, the high-speed interface and the low-speed interface are distributed on different sides of the housing 11, as shown in FIGS. 3 and 5.
将高速接口和低速接口分布在外壳11的不同侧面上,实现了低速接口与高速接口的分开布局。相应地,与高速接口和低速接口相对应的电路接口单元也实现了分开布局,这样能够有效防止与高速接口和低速接口相对应的电路接口单元之间相互干扰,从而提高了各个电路接口单元的使用可靠性。The high-speed interface and the low-speed interface are distributed on different sides of the housing 11 to realize the separate layout of the low-speed interface and the high-speed interface. Correspondingly, the circuit interface units corresponding to the high-speed interface and the low-speed interface are also implemented separately, which can effectively prevent the mutual interference between the circuit interface units corresponding to the high-speed interface and the low-speed interface, thereby improving the Use reliability.
进一步地,高速接口的数量为多个,多个高速接口均分布在外壳11的第 一侧面111上,如图1和图3所示;低速接口的数量为多个,多个低速接口均分布在外壳11的第二侧面112上,如图2和图5所示,第一侧面111与第二侧面112相背设置。Further, the number of high-speed interfaces is multiple, and multiple high-speed interfaces are distributed on the first side 111 of the housing 11, as shown in FIGS. 1 and 3; the number of low-speed interfaces is multiple, and multiple low-speed interfaces are distributed On the second side 112 of the housing 11, as shown in FIGS. 2 and 5, the first side 111 is opposite to the second side 112.
高速接口的数量为多个,多个高速接口能够满足用户的多个需求,将多个高速接口集中分布在外壳11的第一侧面111上,使得产品结构较为规整,且合理利用了第一侧面111的位置,有利于简化产品结构。The number of high-speed interfaces is multiple, and multiple high-speed interfaces can meet multiple needs of users, and the multiple high-speed interfaces are distributed on the first side 111 of the housing 11 so that the product structure is relatively regular and the first side is reasonably utilized The position of 111 helps to simplify the product structure.
低速接口的数量为多个,多个低速接口能够满足用户的多个需求,将多个低速接口集中分布在外壳11的第二侧面112上,使得产品的结构也较为规整,且合理利用了第二侧面112的位置,有利于简化产品结构。The number of low-speed interfaces is multiple. Multiple low-speed interfaces can meet multiple needs of users. The multiple low-speed interfaces are distributed on the second side 112 of the housing 11 so that the structure of the product is relatively regular and the The position of the two sides 112 is helpful to simplify the product structure.
进一步地,第一侧面111与第二侧面112相背设置,则低速接口和高速接口的朝向完全相反,这样能够防止与低速接口和高速接口相连的外接设备相互之间发生干涉,便于同时连接多种外接设备;同时,也使得与低速接口和高速接口相对应的电路接口单元之间的距离相对较远,从而进一步降低了相互干扰的风险,进一步提高了各个电路接口单元的使用可靠性。Further, if the first side 111 and the second side 112 are opposite to each other, the orientations of the low-speed interface and the high-speed interface are completely opposite. At the same time, it also makes the distance between the circuit interface units corresponding to the low-speed interface and the high-speed interface relatively long, thereby further reducing the risk of mutual interference and further improving the reliability of the use of each circuit interface unit.
进一步地,主机10的电源接口19设置在外壳11中第一侧面111与第二侧面112之间的侧面上,如图1和图4所示;主机10还设有位于外壳11内的存储接口,电路板上设有与存储接口相对应的电路接口单元,存储接口朝向外壳11中与电源接口19的所在侧面相背设置的侧面。Further, the power interface 19 of the host 10 is provided on the side between the first side 111 and the second side 112 in the housing 11, as shown in FIGS. 1 and 4; the host 10 also has a storage interface in the housing 11 A circuit interface unit corresponding to the storage interface is provided on the circuit board, and the storage interface faces the side of the housing 11 opposite to the side where the power interface 19 is located.
将主机10的电源接口19设置在外壳11中第一侧面111与第二侧面112之间的侧面上,这样既能够防止电源线与连接扩展接口的设备之间发生干涉,又有利于在第一侧面111与第二侧面112上布置更多的扩展接口,也有利于增加第一侧面111和第二侧面112上相邻的扩展接口之间的距离,进而有利于同时连接多个外围设备。The power interface 19 of the host 10 is provided on the side of the housing 11 between the first side 111 and the second side 112, which can not only prevent interference between the power cord and the device connected to the expansion interface, but also facilitate the first Arranging more expansion interfaces on the side 111 and the second side 112 is also helpful to increase the distance between the adjacent expansion interfaces on the first side 111 and the second side 112, and thus it is beneficial to connect multiple peripheral devices at the same time.
进一步地,外壳11内还设有存储接口,电路板上设有与存储接口相对应的电路接口单元,使得主机10还能够连接存储设备(如存储接口为SSD(Solid State Drives,固态硬盘)硬盘接口,则主机10可以增加固态硬盘),能够显著增加主机10的存储空间,进而满足用户的更高需求。其中,存储接口朝向外壳11中与电源接口19所在侧面相背设置的侧面,这合理利用了主机10的内部空间,不会与电路接口单元及电源接口19发生干涉,优化了产品布局。 当然,如果取消存储接口,也可以在该侧面上设置扩展接口。Further, the housing 11 is also provided with a storage interface, and a circuit interface unit corresponding to the storage interface is provided on the circuit board, so that the host 10 can also be connected to a storage device (such as an SSD (Solid State Drives)). Interface, the host 10 can add a solid-state hard disk), which can significantly increase the storage space of the host 10, thereby meeting higher demands of users. Among them, the storage interface faces the side of the housing 11 opposite to the side where the power interface 19 is located. This reasonably uses the internal space of the host 10 and does not interfere with the circuit interface unit and the power interface 19, which optimizes the product layout. Of course, if you cancel the storage interface, you can also set the expansion interface on the side.
优选地,主机10整体呈长方体状,如图1所示,第一侧面111与第二侧面112相互平行,记设有电源接口19的侧面为第三侧面113,第三侧面113的面积小于第一侧面111的面积,记与第三侧面113相平行的侧面为第四侧面114,存储接口朝向第四侧面114。Preferably, the host 10 has a rectangular parallelepiped shape as a whole. As shown in FIG. 1, the first side 111 and the second side 112 are parallel to each other. The side where the power interface 19 is provided is the third side 113. The area of the third side 113 is smaller than the first The area of one side 111 is described as the side parallel to the third side 113 is the fourth side 114, and the storage interface faces the fourth side 114.
主机10整体呈长方体状,结构较为规整,便于加工成型。第一侧面111与第二侧面112相互平行,第三侧面113与第四侧面114相互平行,且第三侧面113、第四侧面114的面积小于第一侧面111、第二侧面112的面积,即:将扩展接口布置在外壳11的大面积侧面上,将电源接口19布置在外壳11的小面积侧面上,这样便于设置更多的扩展接口,布局较为合理。The host 10 has a rectangular parallelepiped shape as a whole, and the structure is relatively regular, which is convenient for processing and molding. The first side 111 and the second side 112 are parallel to each other, the third side 113 and the fourth side 114 are parallel to each other, and the area of the third side 113 and the fourth side 114 is smaller than the area of the first side 111 and the second side 112, namely : The expansion interface is arranged on the large-area side of the housing 11 and the power supply interface 19 is arranged on the small-area side of the housing 11, so that it is convenient to set more expansion interfaces and the layout is more reasonable.
在上述任一实施例中,多个扩展接口在相应侧面上排列成单排形式或者排列成相互平行的多排形式,如图1、图2、图3和图5所示。In any of the above embodiments, multiple expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other, as shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 5.
使多个扩展接口在相应侧面上排列成单排形式或者排列成相互平行的多排形式,与电路板的排布形式相对应,结构较为规整,便于加工成型,进一步优化了产品的结构和布局,且提高了产品的美观度。The multiple expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other, which corresponds to the layout of the circuit board. The structure is relatively regular, which is convenient for processing and molding, and the structure and layout of the product are further optimized. , And improve the aesthetics of the product.
本发明第二方面的实施例提供的可移动平台(图中未示出),包括机身以及如第一方面实施例中任一项的主机10,主机10搭载在机身上。The movable platform (not shown in the figure) provided by the embodiment of the second aspect of the present invention includes a fuselage and the host 10 according to any one of the embodiments of the first aspect, and the host 10 is mounted on the fuselage.
本发明第二方面的实施例提供的可移动平台,因包括如第一方面实施例中任一项的主机10,因而具有上述任一实施例所具有的一切有益效果,在此不再赘述。The mobile platform provided by the embodiment of the second aspect of the present invention includes the host 10 as described in any one of the embodiments of the first aspect, and thus has all the beneficial effects of any of the foregoing embodiments, which will not be repeated here.
在上述任一实施例中,可移动平台为无人机或机器人。In any of the above embodiments, the movable platform is a drone or robot.
下面结合一个具体实施例来详细描述本申请提供的可移动平台中主机的10具体结构:The following describes the specific structure of the host in the mobile platform provided by the present application in detail with reference to a specific embodiment:
现有的行业应用PC机,其接口较少,较难满足用户的实际需求,用户需要外接扩展,一方面整体外观尺寸变大,而且一旦想扩展接口,必定需要增加硬件与软件,另一方面成本变高,针对用户体验较差。Existing industrial application PCs have fewer interfaces and it is more difficult to meet the actual needs of users. Users need external expansion. On the one hand, the overall appearance size becomes larger, and once you want to expand the interface, you must add hardware and software. On the other hand The cost becomes higher and the user experience is poor.
基于以上问题,本申请提出一种主机10,应用于无人机,主机10采用集成化接口布局的整机设计,具体在主机10上将低速接口与高速接口集成化 布局,接口包括CAN(两个)、UART(两个)、IIC、SPI(IIC和SPI对应图中的I/O接口18)、microB(也可以叫microUSB接口,对应图中的OTG接口17)、USB3.0(两个)、HDMI及ETH等,并且将高速接口与低速接口分开布局。针对行业应用,利用低速口可以控制外围设备,而高速接口可以实现与外接设备的高速通信,如无人机的云台上搭载的相机,实现了高度集成化接口布局。当然,可以理解,也可以利用低速接口与外接设备进行通信,利用高速接口控制外围设备。Based on the above problems, this application proposes a host 10, which is applied to an unmanned aerial vehicle. The host 10 adopts a complete machine design with an integrated interface layout. Specifically, a low-speed interface and a high-speed interface are integrated on the host 10. The interface includes CAN (two ), UART (two), IIC, SPI (IIC and SPI corresponding to I / O interface 18 in the figure), microB (also called microUSB interface, corresponding to OTG interface 17 in the figure), USB3.0 (two ), HDMI, ETH, etc., and separate high-speed and low-speed interfaces. For industry applications, the low-speed port can be used to control peripheral devices, while the high-speed interface can achieve high-speed communication with external devices, such as the camera mounted on the UAV's gimbal, which realizes a highly integrated interface layout. Of course, it can be understood that the low-speed interface can also be used to communicate with the external device, and the high-speed interface can be used to control the peripheral device.
本设计如下所示,在90mm×60mm×35mm的主机10上集成了以下接口,其分布如图1至图8所示,其中图3主要为高速接口,图5主要为低速调试及控制接口;在整机内部设计中分为2块单板,其中一块用于CPU控制及处理(即CPU板),另一块则实现接口板的功能(即扩展板),两块单板通过连接器紧扣在一起,实现了功能与接口扩展。The design is as follows, the following interfaces are integrated on the host 10 of 90mm × 60mm × 35mm, and their distribution is shown in Figure 1 to Figure 8, where Figure 3 is mainly a high-speed interface, and Figure 5 is mainly a low-speed debugging and control interface; In the internal design of the whole machine, it is divided into 2 single boards, one of which is used for CPU control and processing (that is, the CPU board), and the other one realizes the function of the interface board (that is, the expansion board), and the two single boards are fastened through the connector Together, the expansion of functions and interfaces is realized.
由此,本申请具有以下有益的技术效果:1)集成化布局接口实现了在更小的体积下能有更多的功能接口,满足了不同用户的需求;2)将高速接口与低速调试接口分开布局,方便了用户使用的接线问题。Therefore, the present application has the following beneficial technical effects: 1) The integrated layout interface realizes more functional interfaces in a smaller volume to meet the needs of different users; 2) The high-speed interface and the low-speed debugging interface Separate layouts facilitate wiring problems for users.
综上所述,本发明提供的主机,在外壳内增设了扩展板,扩展板上设置了用于与外接设备相连的电路接口单元,从而增加了主机扩展接口的数量,进而增加了主机能够扩展的功能;由于扩展板通过第一连接器与CPU板电性连接,因而外接设备插入扩展接口后能够与CPU板实现电性连接,且多个扩展接口既包括高速接口,又包括低速接口,利用低速接口可以控制外接设备,利用高速接口可以实现与外接设备的高速通信,从而有利于满足用户的不同需求;且由于扩展板与CPU板层叠分布,能够尽量小型化主机的体积,即:在满足主机小型化的基础上,增加了主机扩展接口的数量,符合用户对于行业应用PC的需求,有利于满足行业开发爱好者的更多需求。In summary, the host provided by the present invention has an expansion board added in the casing, and a circuit interface unit for connecting to an external device is provided on the expansion board, thereby increasing the number of expansion interfaces of the host, thereby increasing the expansion of the host The expansion board is electrically connected to the CPU board through the first connector, so that the external device can be electrically connected to the CPU board after inserting the expansion interface, and multiple expansion interfaces include both high-speed interfaces and low-speed interfaces. The low-speed interface can control external devices, and the high-speed interface can realize high-speed communication with external devices, which is beneficial to meet different needs of users; and because the expansion board and the CPU board are stacked, the size of the host can be minimized, that is On the basis of the miniaturization of the host, the number of host expansion interfaces is increased, which meets the user's demand for industrial application PCs, which is beneficial to meet more needs of industry development enthusiasts.
在本发明中,术语“第一”、“第二”、“第三”仅用于描述的目的,而不能理解为指示或暗示相对重要性;术语“多个”则指两个或两个以上,除非另有明确的限定。术语“安装”、“相连”、“连接”、“固定”等术语均应做广义理解,例如,“连接”可以是固定连接,也可以是可拆卸连接,或一体地连接;“相连”可以是直接相连,也可以通过中间媒介间接相连。 对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance; the term "plurality" refers to two or two Unless otherwise specified. The terms "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "connection" can It is directly connected, or indirectly connected through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
本发明的描述中,需要理解的是,术语“上”、“下”、“左”、“右”、“前”、“后”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或单元必须具有特定的方向、以特定的方位构造和操作,因此,不能理解为对本发明的限制。In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc. indicate the orientation or positional relationship based on the orientation shown in the drawings Or the positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction and be constructed and operated in a specific orientation, therefore, it should not be construed as limiting the present invention.
在本说明书的描述中,术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或实例。而且,描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in the present invention In at least one embodiment or example. In this specification, the schematic expression of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims (20)

  1. 一种用于可移动平台的主机,其特征在于,所述主机用于可拆卸地安装在所述可移动平台上,所述主机包括:A host for a mobile platform, wherein the host is detachably installed on the mobile platform, the host includes:
    外壳,所述外壳上设有多个扩展接口,多个所述扩展接口分布在所述外壳的至少一个侧面上;A housing, the housing is provided with a plurality of expansion interfaces, and the plurality of expansion interfaces are distributed on at least one side of the housing;
    电路板,设置在所述外壳内,并设有与多个所述扩展接口一一对应的电路接口单元;The circuit board is arranged in the casing, and is provided with a circuit interface unit corresponding to each of the plurality of expansion interfaces in one-to-one manner;
    所述电路板包括CPU板和扩展板,所述扩展板与所述CPU板叠层分布,并通过第一连接器与所述CPU板电性连接;The circuit board includes a CPU board and an expansion board, the expansion board and the CPU board are stacked and distributed, and are electrically connected to the CPU board through a first connector;
    其中,多个所述扩展接口包括高速接口和低速接口,多个所述电路接口单元中的至少一部分分布在所述扩展板上。Wherein, the plurality of expansion interfaces include a high-speed interface and a low-speed interface, and at least a part of the plurality of circuit interface units are distributed on the expansion board.
  2. 根据权利要求1所述的主机,其特征在于,The host according to claim 1, wherein:
    所述扩展板的数量为多个,多个所述扩展板叠层分布;The number of the expansion boards is plural, and a plurality of the expansion boards are distributed in layers;
    其中,相邻的所述扩展板之间通过第二连接器电性连接,且所述CPU板与多个所述扩展板中的其中一个通过所述第一连接器电性连接,或者,所述CPU板与多个所述扩展板中的每一个通过所述第一连接器电性连接。Wherein the adjacent expansion boards are electrically connected through a second connector, and the CPU board and one of the plurality of expansion boards are electrically connected through the first connector, or The CPU board and each of the plurality of expansion boards are electrically connected through the first connector.
  3. 根据权利要求1所述的主机,其特征在于,The host according to claim 1, wherein:
    所述扩展板为柔性电路板,多个所述电路接口单元中的一部分设置在所述柔性电路板上;或者The expansion board is a flexible circuit board, and a part of the plurality of circuit interface units is provided on the flexible circuit board; or
    所述扩展板为刚性电路板,多个所述电路接口单元均设置在所述扩展板上。The expansion board is a rigid circuit board, and a plurality of the circuit interface units are all provided on the expansion board.
  4. 根据权利要求1所述的主机,其特征在于,The host according to claim 1, wherein:
    所述CPU板位于所述扩展板的上方。The CPU board is located above the expansion board.
  5. 根据权利要求1所述的主机,其特征在于,The host according to claim 1, wherein:
    所述高速接口包括ETH网络接口、USB3.0数据接口、高清晰度多媒体HDMI数据接口、无线通信接口中的任一种或多种;The high-speed interface includes any one or more of an ETH network interface, a USB3.0 data interface, a high-definition multimedia HDMI data interface, and a wireless communication interface;
    所述低速接口包括控制器局域网络CAN数据接口、通用异步收发传输器UART数据接口、串行外设接口SPI、I2C数据接口、OTG接口中的任一种或多种。The low speed interface includes any one or more of a controller area network CAN data interface, a universal asynchronous transceiver UART data interface, a serial peripheral interface SPI, an I2C data interface, and an OTG interface.
  6. 根据权利要求5所述的主机,其特征在于,The host according to claim 5, characterized in that
    所述无线通信接口包括:WiFi传输接口、移动通信传输接口、红外通信传输接口、蓝牙通信传输接口、短距离激光通讯接口中的任一种或多种。The wireless communication interface includes any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface.
  7. 根据权利要求5所述的主机,其特征在于,The host according to claim 5, characterized in that
    所述高速接口和所述低速接口分布在所述外壳的不同侧面上。The high-speed interface and the low-speed interface are distributed on different sides of the housing.
  8. 根据权利要求7所述的主机,其特征在于,The host according to claim 7, characterized in that
    所述高速接口的数量为多个,多个所述高速接口均分布在所述外壳的第一侧面上;The number of the high-speed interfaces is multiple, and the multiple high-speed interfaces are all distributed on the first side of the housing;
    所述低速接口的数量为多个,多个所述低速接口均分布在所述外壳的第二侧面上,所述第一侧面与所述第二侧面相背设置。The number of the low-speed interfaces is multiple, and the plurality of low-speed interfaces are all distributed on the second side of the housing, and the first side is opposite to the second side.
  9. 根据权利要求8所述的主机,其特征在于,所述主机的电源接口设置在所述外壳中所述第一侧面与所述第二侧面之间的侧面上;The host according to claim 8, wherein the power interface of the host is provided on the side between the first side and the second side in the housing;
    所述主机还设有位于所述外壳内的存储接口,所述电路板上设有与所述存储接口相对应的电路接口单元,所述存储接口朝向所述外壳中与所述电源接口的所在侧面相背设置的侧面。The host is also provided with a storage interface in the housing, and a circuit interface unit corresponding to the storage interface is provided on the circuit board, and the storage interface faces the location of the power interface in the housing Sides opposite to each other.
  10. 根据权利要求1至9中任一项所述的主机,其特征在于,The host according to any one of claims 1 to 9, characterized in that
    多个所述扩展接口在相应侧面上排列成单排形式或者排列成相互平行的多排形式。A plurality of the expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other.
  11. 一种可移动平台,其特征在于,包括机身以及主机,所述主机搭载在所述机身上,所述主机用于可拆卸地安装在所述可移动平台上,所述主机包括:A movable platform is characterized by comprising a fuselage and a host, the host is mounted on the fuselage, the host is used to be detachably mounted on the movable platform, the host includes:
    外壳,所述外壳上设有多个扩展接口,多个所述扩展接口分布在所述外壳的至少一个侧面上;A housing, the housing is provided with a plurality of expansion interfaces, and the plurality of expansion interfaces are distributed on at least one side of the housing;
    电路板,设置在所述外壳内,并设有与多个所述扩展接口一一对应的 电路接口单元;The circuit board is arranged in the casing, and is provided with a circuit interface unit corresponding to each of the plurality of expansion interfaces in one-to-one manner;
    所述电路板包括CPU板和扩展板,所述扩展板与所述CPU板叠层分布,并通过第一连接器与所述CPU板电性连接;The circuit board includes a CPU board and an expansion board, the expansion board and the CPU board are stacked and distributed, and are electrically connected to the CPU board through a first connector;
    其中,多个所述扩展接口包括高速接口和低速接口,多个所述电路接口单元中的至少一部分分布在所述扩展板上。Wherein, the plurality of expansion interfaces include a high-speed interface and a low-speed interface, and at least a part of the plurality of circuit interface units are distributed on the expansion board.
  12. 根据权利要求11所述的可移动平台,其特征在于,The movable platform according to claim 11, wherein:
    所述扩展板的数量为多个,多个所述扩展板叠层分布;The number of the expansion boards is plural, and a plurality of the expansion boards are distributed in layers;
    其中,相邻的所述扩展板之间通过第二连接器电性连接,且所述CPU板与多个所述扩展板中的其中一个通过所述第一连接器电性连接,或者,所述CPU板与多个所述扩展板中的每一个通过所述第一连接器电性连接。Wherein the adjacent expansion boards are electrically connected through a second connector, and the CPU board and one of the plurality of expansion boards are electrically connected through the first connector, or The CPU board and each of the plurality of expansion boards are electrically connected through the first connector.
  13. 根据权利要求11所述的可移动平台,其特征在于,The movable platform according to claim 11, wherein:
    所述扩展板为柔性电路板,多个所述电路接口单元中的一部分设置在所述柔性电路板上;或者The expansion board is a flexible circuit board, and a part of the plurality of circuit interface units is provided on the flexible circuit board; or
    所述扩展板为刚性电路板,多个所述电路接口单元均设置在所述扩展板上。The expansion board is a rigid circuit board, and a plurality of the circuit interface units are all provided on the expansion board.
  14. 根据权利要求11所述的可移动平台,其特征在于,The movable platform according to claim 11, wherein:
    所述CPU板位于所述扩展板的上方。The CPU board is located above the expansion board.
  15. 根据权利要求11所述的可移动平台,其特征在于,The movable platform according to claim 11, wherein:
    所述高速接口包括ETH网络接口、USB3.0数据接口、高清晰度多媒体HDMI数据接口、无线通信接口中的任一种或多种;The high-speed interface includes any one or more of an ETH network interface, a USB3.0 data interface, a high-definition multimedia HDMI data interface, and a wireless communication interface;
    所述低速接口包括控制器局域网络CAN数据接口、通用异步收发传输器UART数据接口、串行外设接口SPI、I2C数据接口、OTG接口中的任一种或多种。The low-speed interface includes any one or more of a controller area network CAN data interface, a universal asynchronous transceiver UART data interface, a serial peripheral interface SPI, an I2C data interface, and an OTG interface.
  16. 根据权利要求15所述的可移动平台,其特征在于,The movable platform according to claim 15, wherein:
    所述无线通信接口包括:WiFi传输接口、移动通信传输接口、红外通信传输接口、蓝牙通信传输接口、短距离激光通讯接口中的任一种或多种。The wireless communication interface includes any one or more of a WiFi transmission interface, a mobile communication transmission interface, an infrared communication transmission interface, a Bluetooth communication transmission interface, and a short-range laser communication interface.
  17. 根据权利要求15所述的可移动平台,其特征在于,The movable platform according to claim 15, wherein:
    所述高速接口和所述低速接口分布在所述外壳的不同侧面上。The high-speed interface and the low-speed interface are distributed on different sides of the housing.
  18. 根据权利要求17所述的可移动平台,其特征在于,The movable platform according to claim 17, wherein:
    所述高速接口的数量为多个,多个所述高速接口均分布在所述外壳的第一侧面上;The number of the high-speed interfaces is multiple, and the multiple high-speed interfaces are all distributed on the first side of the housing;
    所述低速接口的数量为多个,多个所述低速接口均分布在所述外壳的第二侧面上,所述第一侧面与所述第二侧面相背设置。The number of the low-speed interfaces is multiple, and the plurality of low-speed interfaces are all distributed on the second side of the housing, and the first side is opposite to the second side.
  19. 根据权利要求18所述的可移动平台,其特征在于,所述主机的电源接口设置在所述外壳中所述第一侧面与所述第二侧面之间的侧面上;The movable platform according to claim 18, wherein the power interface of the host is provided on the side between the first side and the second side in the housing;
    所述主机还设有位于所述外壳内的存储接口,所述电路板上设有与所述存储接口相对应的电路接口单元,所述存储接口朝向所述外壳中与所述电源接口的所在侧面相背设置的侧面。The host is also provided with a storage interface in the housing, and a circuit interface unit corresponding to the storage interface is provided on the circuit board, and the storage interface faces the location of the power interface in the housing Sides opposite to each other.
  20. 根据权利要求11至19中任一项所述的可移动平台,其特征在于,The movable platform according to any one of claims 11 to 19, characterized in that
    多个所述扩展接口在相应侧面上排列成单排形式或者排列成相互平行的多排形式。A plurality of the expansion interfaces are arranged in a single row on the corresponding side or in multiple rows parallel to each other.
PCT/CN2018/122120 2018-10-29 2018-12-19 Movable platform and host thereof WO2020087698A1 (en)

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CN111316184A (en) * 2019-05-13 2020-06-19 深圳市大疆创新科技有限公司 Mobile device and control method
CN110888506B (en) * 2019-11-29 2021-06-25 深圳市核芯智联科技开发有限公司 Multimedia dual-core industrial control mainboard

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