WO2020087197A1 - 一种空芯光子带隙光纤干涉仪传感器、制作装置和方法 - Google Patents
一种空芯光子带隙光纤干涉仪传感器、制作装置和方法 Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
- G01L11/02—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00 by optical means
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- the invention relates to the field of interferometer sensor preparation, in particular to an Hollow-core photonic bandgap fiber (HC-PBF) interferometer sensor, manufacturing device and method.
- HC-PBF Hollow-core photonic bandgap fiber
- Existing barometric pressure measurement technology uses a bubble-forming Fabry-Perot interferometer sensor at the end of the single-mode fiber, with a pressure sensitivity of up to 1036pm / MPa (meaning 1036 picometers per megapascal), or fusion splicing at the end of the single-mode fiber
- a small section of hollow fiber is coated with a layer of nano-silver film or nano-graphene film to form a Fabry-Perot interferometer sensor.
- the pressure sensitivity of the former is 70.5nm / kPa (indicating 70.5nm per kilopascal), and the pressure sensitivity of the latter It is 39.4nm / kPa.
- the interferometer sensor made by this method of end bubble or nano-film coating has poor durability and mechanical structure. Because the nano film or bubble connected to the end is easy to break, it can only be measured in a low-pressure environment.
- a Mach-Zehnder interferometer sensor is made by welding a section of dual-core between two single-mode optical fibers or using a femtosecond laser to open a microcavity in a single-mode optical fiber. These interferometer sensors have low pressure response sensitivity and cannot be widely used.
- the main purpose of the present invention is to provide a hollow-core photonic bandgap fiber interferometer sensor, manufacturing device and method, which can solve the technical problems of the existing interferometer sensor, such as poor durability, poor mechanical structure and low pressure sensitivity.
- a first aspect of the present invention provides an air-core photonic band gap fiber interferometer sensor, characterized in that
- the interferometer sensor includes a first coupler, a second coupler, a first optical fiber, and a second optical fiber, and both the first optical fiber and the second optical fiber are hollow-core photonic bandgap fibers;
- the first arm of the first coupler is connected to one end of the first optical fiber, and the other end of the first fiber is connected to the first arm of the second coupler;
- the second arm of the first coupler is connected to one end of the second optical fiber, the other end of the second fiber is connected to the second arm of the second coupler, and one end of the second optical fiber is provided with air Microcavity.
- a second aspect of the present invention provides a manufacturing device for manufacturing the interferometer sensor, characterized in that the device includes a light source, a spectrometer, a cutting knife, a fusion splicer, and a femtosecond laser;
- the light source and the spectrometer are respectively connected to the third arm and the fourth arm of the first coupler, and the light emitted by the light source passes through the first coupler to generate a first interference spectrum on the spectrometer,
- the cutting blade is used to cut the first arm and the second arm of the first coupler based on the first interference spectrum;
- Disconnect the light source, the spectrometer and the first coupler, the light source and the spectrometer are respectively connected to the third arm and the fourth arm of the second coupler, the light emitted by the light source After passing through the second coupler, a second interference spectrum is generated on the spectrometer, and the cutting blade is used to cut the first arm and the second arm of the second coupler based on the second interference spectrum;
- the light source is connected to the third arm or the fourth arm of the first coupler, the spectrometer and the second coupler
- the third arm or the fourth arm is connected, and the light emitted by the light source is divided into two branches through the first coupler, one through the first optical fiber and the second coupler, and the other through the second optical fiber And the second coupler, generate a third interference spectrum on the spectrometer;
- the cutting blade is also used to cut the first optical fiber and the second optical fiber;
- the fusion splicer is used to weld the two ends of the first optical fiber to the first arm of the first coupler and the first arm of the second coupler, respectively, Ends are welded to the second arm of the first coupler and the second arm of the second coupler respectively;
- the femtosecond laser emits a femtosecond laser, and the femtosecond laser penetrates the upper wall of the core of the second optical fiber according to the third interference spectrum.
- a third aspect of the present invention provides a method for manufacturing the interferometer sensor by using the device, wherein the method includes:
- Step 101 based on the first interference spectrum and the second interference spectrum, using a precision micro-cutting method to use the cutter to the first arm and the second arm of the first coupler, and the The first arm and the second arm are cut;
- Step 102 the fusion splicer is used to weld the first arm and the second arm of the first coupler to the end of the first optical fiber and the end of the second optical fiber, and the precision micro-cutting method is used to The cleaver cuts the first optical fiber and the second optical fiber, and uses the fusion splicer to connect the other end of the first optical fiber and the other end of the second optical fiber to the first arm of the second coupler Welding process with the second arm;
- Step 103 based on the third interference spectrum, using a laser emitted by a femtosecond laser to perform an air microcavity treatment on one end of the second optical fiber.
- the invention provides a hollow-core photonic band gap fiber interferometer sensor, a manufacturing device and a method. Because the interferometer sensor uses an empty-core photonic bandgap fiber, the optical fiber uses the photonic bandgap effect to guide light, and its guided mode energy is almost completely limited to the fiber core. Therefore, the interferometer sensor made of the fiber has a low insertion
- the advantages of loss, low nonlinearity, and insensitivity to environmental refractive index and bending disturbance can overcome the problems of poor mechanical structure, low durability and low sensitivity, and achieve an extremely high pressure sensitivity of 2.32nm / kPa.
- FIG. 1 is a schematic structural diagram of a hollow-core photonic band gap fiber interferometer sensor provided by the first embodiment of the present invention
- FIG. 3 is a schematic cross-sectional view of the second optical fiber 4 provided with an air microcavity provided in the first embodiment of the present invention
- FIG. 4 is a graph and a linear fitting diagram of HC-PBF air pressure response of different lengths provided by the first embodiment of the present invention
- FIG. 5 is a schematic structural diagram of an interferometer sensor manufacturing device according to a second embodiment of the present invention.
- FIG. 6 is a schematic flowchart of a method for manufacturing an interferometer sensor according to a third embodiment of the present invention.
- step 7 is a schematic flowchart of the refinement step of step 101 in the third embodiment of the present invention.
- FIG. 8 is a schematic flowchart of the refinement step of step 103 in the third embodiment of the present invention.
- the present invention proposes a hollow-core photonic band gap fiber interferometer sensor, manufacturing device and method. Because the interferometer sensor uses an empty-core photonic bandgap fiber, the optical fiber uses the photonic bandgap effect to guide light, and its guided mode energy is almost completely limited to the fiber core. Therefore, the interferometer sensor made of the fiber has a low insertion
- the advantages of loss, low nonlinearity, and insensitivity to environmental refractive index and bending disturbance can overcome the problems of poor mechanical structure, low durability and low sensitivity, and achieve an extremely high pressure sensitivity of 2.32nm / kPa.
- FIG. 1 is a schematic structural diagram of a hollow-core photonic band gap fiber interferometer sensor according to a first embodiment of the present invention.
- the bold line in FIG. 1 represents the hollow-core photonic bandgap fiber, which are labeled 3 and 4, respectively, and the first coupler is labeled 1, specifically including the first arm 11, the second arm 12, the third arm 13, and the fourth
- the arm 14 and the second coupler have the reference number 2, specifically including a first arm 21, a second arm 22, a third arm 23, and a fourth arm 24. specific:
- the interferometer sensor includes a first coupler 1, a second coupler 2, a first optical fiber 3, and a second optical fiber 4, the first optical fiber 3 and the second optical fiber 4 are both hollow-core photonic bandgap fibers;
- the first arm 11 of the first coupler 1 is connected to one end of the first optical fiber 3, and the other end of the first optical fiber 3 is connected to the first arm 21 of the second coupler 2;
- the second arm 12 of the first coupler 1 is connected to one end of the second optical fiber 4, and the other end of the second optical fiber 4 is connected to the second arm 22 of the second coupler 2.
- One end of the second optical fiber 4 is provided with an air microcavity.
- the length difference between the first arm 11 of the first coupler 1 and the second arm 12 of the first coupler 1 is within ⁇ 10 microns;
- the length difference between the first arm 21 of the second coupler 2 and the second arm 22 of the second coupler 2 is within ⁇ 10 microns.
- the air microcavity is obtained by the femtosecond laser emitted by the femtosecond laser penetrating the upper wall of the core of the second optical fiber 4.
- the length difference between the second optical fiber 4 and the first optical fiber 3 is ⁇ 50 microns.
- the length of the first arm 11 of the first coupler 1 and the second arm 12 of the first coupler 1 are equal, the length is controlled at about 15 cm, and the first arm 21 of the second coupler 2 and the second coupler 2
- the length of the second arm 22 is equal, and the length is controlled at about 15 cm.
- the model of hollow-core photonic bandgap fiber is HC-1550-02. Both the first coupler and the second coupler are 3dB, 2 ⁇ 2 coupler.
- the materials of the first optical fiber 3 and the second optical fiber 4 are both quartz optical fiber materials, the length of the first optical fiber 3 can be any value, and the length difference between the second optical fiber 4 and the first optical fiber 3 is ⁇ 50 microns.
- FIG. 2 is an end-face electron micrograph of the hollow-core photonic bandgap fiber provided by the first embodiment of the present invention.
- FIG. 3 is a second fiber provided by the first embodiment of the present invention. 4.
- a schematic cross-sectional view of an open air microcavity Among them, 51 represents the fiber core (air hole), 52 represents the inner cladding composed of a silicon fiber array with air holes regularly arranged, and 53 represents the pure quartz outer cladding.
- the air microcavity is located on the second optical fiber 4 at the fusion point with the second arm 12 of the first coupler 1 or on the second optical fiber 4 at the fusion point with the second arm 22 of the second coupler 2 Location.
- the hollow core photonic band gap fiber interferometer sensor provided by the present invention is a super-sensitive air pressure sensor of Mach-Zehnder interferometer.
- the light emitted by the light source is received by the spectrometer through the sensor.
- the sensor consists of two equal-arm length 3dB fiber couplers and two different lengths of HC-PBF.
- the external parameter changes the optical path difference between the measuring arm (the arm fused with the second optical fiber 4) and the reference arm (the arm fused with the first optical fiber 3), and then uses the wavelength demodulation technology to learn the real-time change of the air pressure.
- the refractive index of the measuring arm changes, causing the optical path difference between the two arms to change accordingly.
- FIG. 4 is a graph and a linear fitting graph of HC-PBF pressure response of different lengths provided by the first embodiment of the present invention.
- the first optical fiber 3 and the second optical fiber 4 are both hollow-core photonic band gap optical fibers, and the lengths of the two are not equal.
- Two sections of hollow-core photonic bandgap fibers of different lengths were fused between the first coupler 1 and the second coupler 2 to form a Mach-Zehnder interferometer sensor, and the reference arm was an arm fused with the first fiber 3,
- the measuring arm is an arm to which the second optical fiber 4 is fused. Since the two output arms of each coupler are of equal length (referred to as 11 and 12 equal lengths, 21 and 22 equal lengths), the optical path difference of the interferometer sensor is ensured only by the length difference between the first optical fiber 3 and the second optical fiber 4 cause.
- the interferometer sensor uses a hollow-core photonic bandgap fiber
- the optical fiber uses the photonic bandgap effect to guide light, and its guided mode energy is almost completely limited to the fiber core. Therefore, the Mach-Zehnder interferometer made of this fiber
- the sensor has the advantages of low insertion loss, low nonlinearity, insensitivity to environmental refractive index and bending disturbance, and can overcome the problems of poor mechanical structure, low durability and low sensitivity, and achieve an extremely high pressure sensitivity of 2.32nm / kPa.
- its air pressure sensitivity is more than two orders of magnitude higher.
- the material of the hollow-core photonic band gap fiber is quartz fiber material, it can withstand high temperature and high pressure. Therefore, the interferometer The sensor is also suitable for high temperature and high pressure environments.
- FIG. 5 is a schematic structural diagram of an interferometer sensor manufacturing apparatus according to a second embodiment of the present invention.
- This device is a device for manufacturing an interferometer sensor according to the first embodiment of the present invention. It is particularly emphasized that the connection relationship shown in FIG. 3 is schematic and varies according to actual use. Specifically, the device includes a light source 6, a spectrometer 7, a cutting blade 8, a fusion splicer 9, and a femtosecond laser 10;
- the light source 6 and the spectrometer 7 are respectively connected to the third arm 13 and the fourth arm 14 of the first coupler 1.
- the light emitted by the light source 6 passes through the first coupler 1 to generate a first interference spectrum on the spectrometer 7 and the cutter 8 is used Yu cuts the first arm 11 and the second arm 12 of the first coupler 1 based on the first interference spectrum;
- the light source 6 Disconnect the light source 6, the spectrometer 7 and the second coupler 2, the light source 6 is connected to the third arm 13 or the fourth arm 14 of the first coupler 1, the spectrometer 7 and the third arm 23 of the second coupler 2 or The fourth arm 24 is connected, and the light emitted by the light source 6 is divided into two branches through the first coupler 1, one through the first optical fiber 3 and the second coupler 2, and the other through the second optical fiber 4 and the second coupler 2, in Generate a third interference spectrum on the spectrometer 7;
- the cleaver 8 is also used to cleave the first optical fiber 3 and the second optical fiber 4;
- the fusion splicer 9 is used to fuse the two ends of the first optical fiber 3 to the first arm 11 of the first coupler 1 and the first arm 21 of the second coupler 2 respectively, and to fuse the two ends of the second optical fiber 4 respectively On the second arm 12 of the first coupler 1 and the second arm 22 of the second coupler 2;
- the femtosecond laser 10 emits a femtosecond laser, and the femtosecond laser penetrates the upper wall of the core of the second optical fiber 4 according to the third interference spectrum.
- the device further includes an industrial camera 11, a first processor 12, and a one-dimensional manual displacement platform 13;
- the industrial camera 11 is connected to the first processor 12;
- the one-dimensional manual displacement platform 13 is used to fix and drive the movement of the first coupler 1, the second coupler 2, the first optical fiber 3, and the second optical fiber 4;
- the industrial camera 11 is used for imaging and displaying the image through the first processor 12 to facilitate the cutting process with the cutting blade 8.
- the device further includes a microscope 14, a second processor 15 and a three-dimensional electric displacement platform 16;
- the second processor 15 is connected to the microscope 14, the three-dimensional electric displacement platform 16, and the femtosecond laser 10;
- the three-dimensional electric displacement platform 16 is used to fix and tighten the second optical fiber 4 and drive the second optical fiber 4 to move along the three-dimensional coordinate direction established with the optical fiber axis as the X axis;
- the microscope 14 is used for imaging display and converging femtosecond laser on the surface of the second optical fiber 4;
- the second processor 15 is used to control the movement of the three-dimensional electric displacement platform 16 and control the femtosecond laser emitted by the femtosecond laser 10 to penetrate the upper wall of the core of the second optical fiber 4.
- the light source 6 is an amplified spontaneous emission (ASE) light source.
- ASE amplified spontaneous emission
- the cutting process of the first coupler 1 and the second coupler 2 and the cutting process and fusion process of the first optical fiber 3 and the second optical fiber 4 are all manually controlled, and the second optical fiber 4 is subjected to an open-air microcavity process It is electrically controlled by the second processor 15.
- the interferometer sensor manufacturing device emits light through the light source 6 and uses the spectrometer 7 to observe the interference spectrum after the light finally passes through the first coupler 1 or the second coupler 2 by Calculation to accurately control the arm length difference between the first coupler 1 and the second coupler 2 to make the pressure of the interferometer sensor made more sensitive; use the industrial camera 11 and the first processor 12 to amplify the part to be processed, can More precise control of cutting position and welding position; using femtosecond laser 10, microscope 14, second processor 15 and three-dimensional electric displacement platform 16 to electrically control the position of opening air microcavity, and accurately penetrate the fiber of second optical fiber 4
- the upper wall of the core finally makes the interferometer sensor have the advantages of low insertion loss, low nonlinearity, insensitivity to environmental refractive index and bending disturbances, which can overcome the problems of poor mechanical structure, low durability and low sensitivity, achieving 2.32nm / kPa Extremely high pressure sensitivity.
- FIG. 6 is a schematic flowchart of a method for manufacturing an interferometer sensor according to a third embodiment of the present invention.
- This method is a method of manufacturing the interferometer sensor of the first embodiment of the present invention using the manufacturing device of the second embodiment of the present invention. Specifically, the method includes:
- Step 101 Based on the first interference spectrum and the second interference spectrum, the first arm 11 and the second arm 12 of the first coupler 1 and the first One arm 21 and the second arm 22 perform cutting processing;
- FIG. 7 is a schematic flowchart of the detailed steps of step 101 in the third embodiment of the present invention.
- the refinement steps include:
- Step 104 Calculate the first arm length difference between the first arm 11 and the second arm 12 of the first coupler 1 by using the free spectral region in the first interference spectrum. Way, the cutting arm 8 is used to cut the first arm 11 and the second arm 12 of the first coupler 1;
- Step 105 using the free spectral region in the second interference spectrum to calculate the second arm length difference between the first arm 21 and the second arm 22 of the second coupler 2, and using precision micro-cutting according to the second arm length difference In this manner, the first arm 21 and the second arm 22 of the second coupler 2 are cut by the cutting blade 8.
- step 101 two arms on the same side of the 3dB coupler (the third arm 13 and the fourth arm 14 of the first coupler 1) are connected to the light source 6 with one arm and the spectrometer 7 with one arm.
- the two sides of the 3dB coupler (the first arm 11 and the second arm 12 of the first coupler 1) are welded to the hollow core photonic bandgap fiber one by one by precision microdissection, and two are prepared in sequence.
- Two arms of equal length fiber couplers (first coupler 1 and second coupler 2).
- the light source 6 and the spectrometer 7 are used to monitor the first coupler 1 or the second coupler 2 in real time, and pass the free spectrum region of the interference spectrum (Free Spectrum) Range, FSR) Calculate the arm length difference, and control the arm length difference within 10 microns by cutting.
- FSR Free Spectrum Range
- step 102 the first arm 11 and the second arm 12 of the first coupler 1 are fusion-spliced with the end of the first optical fiber 3 and the end of the second optical fiber 4 using a fusion splicer 9, using precision microdissection
- the cleaver 8 cuts the first optical fiber 3 and the second optical fiber 4, and uses the fusion splicer 9 to connect the other end of the first optical fiber 3 and the second fiber 4 to the first arm 21 of the second coupler 2 Perform welding process with the second arm 22;
- step 102 a length of hollow-core photonic bandgap fiber is fused on one arm of the first coupler 1, and then the hollow-core photonic bandgap fiber is precisely cut to retain a length of 2 cm, and then coupled with the second
- the two arms of the splitter 2 have been spliced (the two ends of the first optical fiber 3 are welded to the first arm 11 of the first coupler 1 and the first arm 21 of the second coupler 2).
- connection is used as a reference Arm; then the other arm of the first coupler 1 is fused with the hollow core photonic bandgap fiber, and the hollow core photonic bandgap fiber retention length differs from the previous retention length by 50 microns, and then with the other arm of the second coupler 2 Fusion (two ends of the second optical fiber 4 are respectively fused with the second arm 12 of the first coupler 1 and the second arm 22 of the second coupler 2), and this connection is used as a measurement arm.
- Step 103 based on the third interference spectrum, using the laser light emitted by the femtosecond laser 10 to perform an open-air microcavity treatment on one end of the second optical fiber 4.
- FIG. 8 is a schematic flowchart of the detailed steps of step 103 in the third embodiment of the present invention.
- the refining steps include:
- Step 106 in the image obtained by imaging the surface of the second optical fiber 4 by the microscope 14, find the fusion point of the second optical fiber 4 and the second arm 12 of the first coupler 1, or the second optical fiber 4 and the second coupler 2 The welding point of the second arm 22;
- Step 107 Based on the third interference spectrum, at the position of the fusion point of the second optical fiber 4, the upper wall of the core of the second optical fiber 4 is penetrated by the femtosecond laser emitted by the femtosecond laser 10.
- step 103 the welded Mach-Zehnder interferometer is placed on the femtosecond platform (three-dimensional electric displacement platform 16), and one end (the third arm 13 or the fourth arm 14 of the first coupler 1) ) Connect the light source 6, and one end (the third arm 13 or the fourth arm 14 of the second coupler 2) is connected to the spectrometer 7 to monitor the spectrum change of the interferometer in real time when the cavity is opened with a femtosecond laser.
- the interferometer sensor manufactured by the method has the advantages of low insertion loss, low nonlinearity, insensitivity to environmental refractive index and bending disturbance, and can overcome the problems of poor mechanical structure, low durability and low sensitivity , Achieve extremely high pressure sensitivity of 2.32nm / kPa.
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Abstract
本发明公开了一种空芯光子带隙光纤干涉仪传感器、制作装置和方法。该干涉仪传感器包括第一耦合器、第二耦合器、第一光纤和第二光纤,第一光纤与第二光纤均为空芯光子带隙光纤,第一耦合器的第一臂连接第一光纤的一端,第一光纤的另一端连接第二耦合器的第一臂,第一耦合器的第二臂连接第二光纤的一端,第二光纤的另一端连接第二耦合器的第二臂,第二光纤的其中一端开设有空气微腔。该干涉仪传感器使用了空芯光子带隙光纤,该光纤利用光子带隙效应导光,导模能量几乎完全限制在纤芯中传输,因此,利用该光纤制作的干涉仪传感器具有低插入损耗、低非线性、对环境折射率和弯曲扰动不敏感的优势,能克服结构机械性差、耐用性低和灵敏度低的问题。
Description
本发明涉及干涉仪传感器制备领域,尤其涉及一种空芯光子带隙光纤(Hollow-core photonic bandgap fiber,HC-PBF)干涉仪传感器、制作装置和方法。
现有测气压的技术利用在单模光纤末端制作一个气泡形成法布里珀罗干涉仪传感器,其气压灵敏度最高为1036pm/MPa(表示每兆帕1036皮米),或者在单模光纤末端熔接一小段空芯光纤再镀一层纳米银薄膜或纳米石墨烯薄膜形成法布里珀罗干涉仪传感器,前者的气压灵敏度为70.5nm/kPa(表示每千帕70.5纳米),后者的气压灵敏度为39.4nm/kPa。这种端面气泡或者镀纳米薄膜方法制成的干涉仪传感器耐用性和结构机械性差,因为连接在末端的纳米薄膜或者气泡容易破裂,故只能在低压环境测量。在两根单模光纤之间熔接一段双芯或在一根单模光纤利用飞秒激光开一个微腔制成马赫曾德尔干涉仪传感器,其气压灵敏度为9.6nm/MPa和8.39nm/MPa,这些干涉仪传感器气压响应灵敏度低,不能广泛应用。
本发明的主要目的在于提供一种空芯光子带隙光纤干涉仪传感器、制作装置和方法,可以解决现有的干涉仪传感器耐用性差、结构机械性差和气压灵敏度低的技术问题。
为实现上述目的,本发明第一方面提供一种空芯光子带隙光纤干涉仪传感器,其特征在于,
所述干涉仪传感器包括第一耦合器、第二耦合器、第一光纤和第二光纤,所述第一光纤与所述第二光纤均为空芯光子带隙光纤;
所述第一耦合器的第一臂连接所述第一光纤的一端,所述第一光纤的另一端连接所述第二耦合器的第一臂;
所述第一耦合器的第二臂连接所述第二光纤的一端,所述第二光纤的另一端连接所述第二耦合器的第二臂,所述第二光纤的其中一端开设有空气微腔。
为实现上述目的,本发明第二方面提供一种制作所述干涉仪传感器的制作装置,其特征在于,所述装置包括光源、光谱仪、切割刀、熔接机、飞秒激光器;
所述光源和所述光谱仪分别与所述第一耦合器的第三臂和第四臂连接,所述光源发射的光经过所述第一耦合器,在所述光谱仪上生成第一干涉光谱,所述切割刀用于基于所述第一干涉光谱对所述第一耦合器的第一臂和第二臂进行切割;
断开所述光源、所述光谱仪与所述第一耦合器的连接,所述光源和所述光谱仪分别与所述第二耦合器的第三臂和第四臂连接,所述光源发射的光经过所述第二耦合器,在所述光谱仪上生成第二干涉光谱,所述切割刀用于基于所述第二干涉光谱对所述第二耦合器的第一臂和第二臂进行切割;
断开所述光源、所述光谱仪与所述第二耦合器的连接,所述光源与所述第一耦合器的第三臂或者第四臂连接,所述光谱仪与所述第二耦合器的第三臂或者第四臂连接,所述光源发射的光经过所述第一耦合器分成两个分支,一个经过所述第一光纤和所述第二耦合器,另一个经过所述第二光纤和所述第二耦合器,在所述光谱仪上生成第三干涉光谱;
所述切割刀还用于对所述第一光纤和所述第二光纤进行切割处理;
所述熔接机用于将所述第一光纤的两端分别熔接在所述第一耦合器的第一臂和所述第二耦合器的第一臂上,及将所述第二光纤的两端分别熔接在所述第一耦合器的第二臂和所述第二耦合器的第二臂上;
所述飞秒激光器发射飞秒激光,根据所述第三干涉光谱使飞秒激光打穿所述第二光纤的纤芯上壁。
为实现上述目的,本发明第三方面提供一种应用所述装置制作所述干涉仪传感器的方法,其特征在于,所述方法包括:
步骤101,基于所述第一干涉光谱和所述第二干涉光谱,采用精密显微切割的方式利用所述切割刀对第一耦合器的第一臂与第二臂,和第二耦合器的第一臂与第二臂进行切割处理;
步骤102,利用所述熔接机将所述第一耦合器的第一臂和第二臂分别与第一光纤的一端及第二光纤的一端进行熔接处理,采用精密显微切割的方式利用所述切割刀对所述第一光纤和所述第二光纤进行切割处理,并利用所述熔接机将第一光纤的另一端与第二光纤的另一端分别与所述第二耦合器的第一臂和第二臂进行熔接处理;
步骤103,基于所述第三干涉光谱,利用飞秒激光器发射的激光在所述第二光纤的其中一端进行开空气微腔处理。
本发明提供一种空芯光子带隙光纤干涉仪传感器、制作装置和方法。由于该干涉仪传感器使用了空芯光子带隙光纤,该光纤利用光子带隙效应导光,其导模能量几乎完全限制在纤芯中传输,因此,利用该光纤制作的干涉仪传感器具有低插入损耗、低非线性、对环境折射率和弯曲扰动不敏感的优势,能够克服结构机械性差、耐用性低和灵敏度低的问题,实现2.32nm/kPa的极高气压灵敏度。
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明第一实施例提供的一种空芯光子带隙光纤干涉仪传感器的结构示意图;
图2为本发明第一实施例提供的空芯光子带隙光纤的端面电镜图;
图3为本发明第一实施例提供的第二光纤4上开空气微腔的截面示意图;
图4为本发明第一实施例提供的不同长度HC-PBF气压响应图与线性拟合图;
图5为本发明第二实施例提供的一种干涉仪传感器制作装置的结构示意图;
图6为本发明第三实施例提供的一种干涉仪传感器制作方法的流程示意图;
图7为本发明第三实施例中步骤101的细化步骤的流程示意图;
图8为本发明第三实施例中步骤103的细化步骤的流程示意图。
为使得本发明的发明目的、特征、优点能够更加的明显和易懂,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而非全部实施例。基于本发明中的实施例,本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
由于现有技术中存在现有的干涉仪传感器耐用性差、结构机械性差和气压灵敏度低的技术问题。
为了解决上述技术问题,本发明提出一种空芯光子带隙光纤干涉仪传感器、制作装置和方法。由于该干涉仪传感器使用了空芯光子带隙光纤,该光纤利用光子带隙效应导光,其导模能量几乎完全限制在纤芯中传输,因此,利用该光纤制作的干涉仪传感器具有低插入损耗、低非线性、对环境折射率和弯曲扰动不敏感的优势,能够克服结构机械性差、耐用性低和灵敏度低的问题,实现2.32nm/kPa的极高气压灵敏度。
请参阅图1,为本发明第一实施例提供的一种空芯光子带隙光纤干涉仪传感器的结构示意图。图1中加粗的线表示空芯光子带隙光纤,标号分别为3和4,第一耦合器的标号为1,具体包括第一臂11、第二臂12、第三臂13和第四臂14,第二耦合器的标号为2,具体包括第一臂21、第二臂22、第三臂23和第四臂24。具体的:
该干涉仪传感器包括第一耦合器1、第二耦合器2、第一光纤3和第二光纤4,第一光纤3与第二光纤4均为空芯光子带隙光纤;
第一耦合器1的第一臂11连接第一光纤3的一端,第一光纤3的另一端连接第二耦合器2的第一臂21;
第一耦合器1的第二臂12连接第二光纤4的一端,第二光纤4的另一端连接第二耦合器2的第二臂22,第二光纤4的其中一端开设有空气微腔。
进一步的,第一耦合器1的第一臂11与第一耦合器1的第二臂12的长度差在±10微米以内;
第二耦合器2的第一臂21与第二耦合器2的第二臂22的长度差在±10微米以内。
进一步的,空气微腔是由飞秒激光器发射的飞秒激光打穿第二光纤4的纤芯上壁得到的。
进一步的,第二光纤4与第一光纤3的长度差为±50微米。
优选的,第一耦合器1的第一臂11与第一耦合器1的第二臂12的长度相等,长度控制在15厘米左右,第二耦合器2的第一臂21与第二耦合器2的第二臂22的长度相等,长度控制在15厘米左右。空芯光子带隙光纤的型号为HC-1550-02。第一耦合器与第二耦合器均为3dB,2Í2耦合器。第一光纤3与第二光纤4的材料均为石英光纤材料,第一光纤3的长度可以为任意值,第二光纤4与第一光纤3的长度差为±50微米。
需要说明的是,请结合参阅图2和图3,图2为本发明第一实施例提供的空芯光子带隙光纤的端面电镜图,图3为本发明第一实施例提供的第二光纤4上开空气微腔的截面示意图。其中,51表示纤芯(空气孔),52表示由规则排列着空气孔的硅光纤阵列构成的内包层,53表示纯石英外包层。该空气微腔在第二光纤4上,与第一耦合器1的第二臂12的熔接点位置处,或者在第二光纤4上,与第二耦合器2的第二臂22的熔接点位置处。
进一步的,本发明提供的一种空芯光子带隙光纤干涉仪传感器是一种马赫-曾德尔干涉仪的超灵敏气压传感器。光源发出的光经过该传感器由光谱仪接收。该传感器由两个等臂长的3dB光纤耦合器和两段长度不同的HC-PBF组成。通过外界参量改变测量臂(熔接有第二光纤4的臂)和参考臂(熔接有第一光纤3的臂)之间的光程差,再利用波长解调技术获知气压的实时变化。当气压变化时,测量臂的折射率发生变化,从而引起两臂的光程差发生相应的变化。请参阅图4,为本发明第一实施例提供的不同长度HC-PBF气压响应图与线性拟合图。
在本发明实施例中,第一光纤3与第二光纤4均为空芯光子带隙光纤,且二者的长度不相等。将两段不同长度的空芯光子带隙光纤分别熔接到第一耦合器1和第二耦合器2之间,形成马赫-曾德尔干涉仪传感器,参考臂为熔接有第一光纤3的臂,测量臂为熔接有第二光纤4的臂。由于每个耦合器的两个输出臂等长(指11与12等长,21与22等长),从而保证干涉仪传感器的光程差仅由第一光纤3和第二光纤4的长度差引起。由于该干涉仪传感器使用了空芯光子带隙光纤,该光纤利用光子带隙效应导光,其导模能量几乎完全限制在纤芯中传输,因此,利用该光纤制作的马赫-曾德尔干涉仪传感器具有低插入损耗、低非线性、对环境折射率和弯曲扰动不敏感的优势,能够克服结构机械性差、耐用性低和灵敏度低的问题,实现2.32nm/kPa的极高气压灵敏度,与现有技术中报道的全石英光纤气压传感器相比,其气压灵敏度高两个数量级以上,同时,由于空芯光子带隙光纤的材料为石英光纤材料,本身可以耐高温和高压,因此,该干涉仪传感器也适用于高温高压环境中。
请参阅图5,为本发明第二实施例提供的一种干涉仪传感器制作装置的结构示意图。该装置是制作本发明第一实施例的干涉仪传感器的制作装置,特别强调的是,图3中所示的连接关系是示意性的,根据实际使用情况变动。具体的,该装置包括光源6、光谱仪7、切割刀8、熔接机9、飞秒激光器10;
光源6和光谱仪7分别与第一耦合器1的第三臂13和第四臂14连接,光源6发射的光经过第一耦合器1,在光谱仪7上生成第一干涉光谱,切割刀8用于基于第一干涉光谱对第一耦合器1的第一臂11和第二臂12进行切割;
断开光源6、光谱仪7与第一耦合器1的连接,光源6和光谱仪7分别与第二耦合器2的第三臂23和第四臂24连接,光源6发射的光经过第二耦合器2,在光谱仪7上生成第二干涉光谱,切割刀8用于基于第二干涉光谱对第二耦合器2的第一臂21和第二臂22进行切割;
断开光源6、光谱仪7与第二耦合器2的连接,光源6与第一耦合器1的第三臂13或者第四臂14连接,光谱仪7与第二耦合器2的第三臂23或者第四臂24连接,光源6发射的光经过第一耦合器1分成两个分支,一个经过第一光纤3和第二耦合器2,另一个经过第二光纤4和第二耦合器2,在光谱仪7上生成第三干涉光谱;
切割刀8还用于对第一光纤3和第二光纤4进行切割处理;
熔接机9用于将第一光纤3的两端分别熔接在第一耦合器1的第一臂11和第二耦合器2的第一臂21上,及将第二光纤4的两端分别熔接在第一耦合器1的第二臂12和第二耦合器2的第二臂22上;
飞秒激光器10发射飞秒激光,根据第三干涉光谱使飞秒激光打穿第二光纤4的纤芯上壁。
进一步的,该装置还包括工业相机11、第一处理器12与一维手动位移平台13;
工业相机11与第一处理器12连接;
一维手动位移平台13用于固定并带动第一耦合器1、第二耦合器2、第一光纤3和第二光纤4移动;
工业相机11用于成像并通过第一处理器12显示图像,便于利用切割刀8进行切割处理。
进一步的,该装置还包括显微镜14、第二处理器15与三维电动位移平台16;
第二处理器15与显微镜14、三维电动位移平台16、飞秒激光器10连接;
三维电动位移平台16用于固定绷紧第二光纤4,并带动第二光纤4沿以光纤轴向为X轴建立的三维坐标方向移动;
显微镜14用于对第二光纤4的表面成像显示和会聚飞秒激光;
第二处理器15用于控制三维电动位移平台16的移动,并控制飞秒激光器10发射的飞秒激光打穿第二光纤4的纤芯上壁。
需要说明的是,光源6为放大自发辐射(Amplified Spontaneous Emission,ASE)光源。对第一耦合器1、第二耦合器2的切割处理,及对第一光纤3、第二光纤4的切割处理和熔接处理均为手动控制的,对第二光纤4进行开空气微腔处理是由第二处理器15电动控制的。
在本发明实施例中,该干涉仪传感器制作装置通过光源6来发射光,利用光谱仪7来观察光最终经过第一耦合器1,或者第二耦合器2后的干涉光谱,通过对干涉光谱的计算,来精准控制第一耦合器1和第二耦合器2的臂长差,使制作的干涉仪传感器气压灵敏度更高;利用工业相机11和第一处理器12来放大需要处理的部位,能够更精确的控制切割位置和熔接位置;利用飞秒激光器10、显微镜14、第二处理器15和三维电动位移平台16来电动控制开空气微腔的位置,并精准打穿第二光纤4的纤芯上壁,最终使干涉仪传感器具有低插入损耗、低非线性、对环境折射率和弯曲扰动不敏感的优势,能够克服结构机械性差、耐用性低和灵敏度低的问题,实现2.32nm/kPa的极高气压灵敏度。
请结合图5参阅图6,图6为本发明第三实施例提供的一种干涉仪传感器制作方法的流程示意图。该方法是利用本发明第二实施例的制作装置制作本发明第一实施例的干涉仪传感器的制作方法。具体的,该方法包括:
步骤101,基于第一干涉光谱和第二干涉光谱,采用精密显微切割的方式利用切割刀8对第一耦合器1的第一臂11与第二臂12,和第二耦合器2的第一臂21与第二臂22进行切割处理;
具体的,请结合参阅图7,为本发明第三实施例中步骤101的细化步骤的流程示意图。该细化步骤包括:
步骤104,利用第一干涉光谱中的自由光谱区计算第一耦合器1的第一臂11和第二臂12之间的第一臂长差,根据第一臂长差采用精密显微切割的方式,利用切割刀8对第一耦合器1的第一臂11和第二臂12进行切割处理;
步骤105,利用第二干涉光谱中的自由光谱区计算第二耦合器2的第一臂21和第二臂22之间的第二臂长差,根据第二臂长差采用精密显微切割的方式,利用切割刀8对第二耦合器2的第一臂21和第二臂22进行切割处理。
需要说明的是,在步骤101中,将3dB耦合器同侧两个臂(第一耦合器1的第三臂13和第四臂14),一臂连接光源6,一臂连接光谱仪7,利用精密显微切割的方式将3dB耦合器另外一侧(第一耦合器1的第一臂11和第二臂12)将与空芯光子带隙光纤熔接的两条臂逐个切割,先后制备两个两臂等长的光纤耦合器(第一耦合器1和第二耦合器2)。切割过程中,利用迈克尔逊干涉原理,采用光源6及光谱仪7对第一耦合器1或者第二耦合器2实时监测,通过干涉光谱的自由光谱区(Free Spectrum
Range,FSR)计算臂长差,通过切割将臂长差控制在10微米以内。
步骤102,利用熔接机9将第一耦合器1的第一臂11和第二臂12分别与第一光纤3的一端及第二光纤4的一端进行熔接处理,采用精密显微切割的方式利用切割刀8对第一光纤3和第二光纤4进行切割处理,并利用熔接机9将第一光纤3的另一端与第二光纤4的另一端分别与第二耦合器2的第一臂21和第二臂22进行熔接处理;
需要说明的是,步骤102中先在第一耦合器1的一条臂上面熔接一段空芯光子带隙光纤,然后对空芯光子带隙光纤进行精密切割,保留2厘米长度,接着与第二耦合器2已经切好的一臂相熔接(第一光纤3的两端分别与第一耦合器1的第一臂11和第二耦合器2的第一臂21熔接),这个连接好后作为参考臂;再将第一耦合器1的另外一条臂与空芯光子带隙光纤熔接,空芯光子带隙光纤保留长度与之前保留长度相差50微米,再与第二耦合器2的另一条臂相熔接(第二光纤4的两端分别与第一耦合器1的第二臂12和第二耦合器2的第二臂22熔接),这个连接好后作为测量臂。
步骤103,基于第三干涉光谱,利用飞秒激光器10发射的激光在第二光纤4的其中一端进行开空气微腔处理。
具体的,请参阅图8,为本发明第三实施例中步骤103的细化步骤的流程示意图。具体的,该细化步骤包括:
步骤106,在显微镜14对第二光纤4的表面成像得到的图像中,查找第二光纤4与第一耦合器1的第二臂12的熔接点,或者第二光纤4与第二耦合器2的第二臂22的熔接点;
步骤107,基于第三干涉光谱,在第二光纤4的熔接点位置处,利用飞秒激光器10发射的飞秒激光打穿第二光纤4的纤芯上壁。
需要说明的是,步骤103中,将熔接好的马赫-曾德尔干涉仪放到飞秒平台(三维电动位移平台16)上,一端(第一耦合器1的第三臂13或者第四臂14)连接光源6,一端(第二耦合器2的第三臂13或者第四臂14)连接光谱仪7,实时监测在用飞秒激光开腔时干涉仪的光谱变化。用显微镜14观察光纤表面,在视场中找到测量臂上的空芯光子带隙光纤与其中一个耦合器一臂熔接的熔接点,在空芯光子带隙光纤上利用飞秒激光开空气微腔。
在本发明实施例中,应用该方法制作的干涉仪传感器具有低插入损耗、低非线性、对环境折射率和弯曲扰动不敏感的优势,能够克服结构机械性差、耐用性低和灵敏度低的问题,实现2.32nm/kPa的极高气压灵敏度。
需要说明的是,在本申请所提供的几个实施例中,应该理解到,所揭露的装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的。对于前述的各方法实施例,为了简便描述,故将其都表述为一系列的动作组合,但是本领域技术人员应该知悉,本发明并不受所描述的动作顺序的限制,因为依据本发明,某些步骤可以采用其它顺序或者同时进行。其次,本领域技术人员也应该知悉,说明书中所描述的实施例均属于优选实施例,所涉及的动作和模块并不一定都是本发明所必须的。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其它实施例的相关描述。
以上为对本发明所提供的一种空芯光子带隙光纤干涉仪传感器、制作装置和方法的描述,对于本领域的技术人员,依据本发明实施例的思想,在具体实施方式及应用范围上均会有改变之处,综上,本说明书内容不应理解为对本发明的限制。
Claims (10)
- 一种空芯光子带隙光纤干涉仪传感器,其特征在于,所述干涉仪传感器包括第一耦合器、第二耦合器、第一光纤和第二光纤,所述第一光纤与所述第二光纤均为空芯光子带隙光纤;所述第一耦合器的第一臂连接所述第一光纤的一端,所述第一光纤的另一端连接所述第二耦合器的第一臂;所述第一耦合器的第二臂连接所述第二光纤的一端,所述第二光纤的另一端连接所述第二耦合器的第二臂,所述第二光纤的其中一端开设有空气微腔。
- 根据权利要求1所述的干涉仪传感器,其特征在于,所述第一耦合器的第一臂与所述第一耦合器的第二臂的长度差在±10微米以内;所述第二耦合器的第一臂与所述第二耦合器的第二臂的长度差在±10微米以内。
- 根据权利要求1所述的干涉仪传感器,其特征在于,所述空气微腔是由飞秒激光器发射的飞秒激光打穿所述第二光纤的纤芯上壁得到的。
- 根据权利要求1所述的干涉仪传感器,其特征在于,所述第二光纤与所述第一光纤的长度差为±50微米。
- 一种制作如权利要求1至4任意一项所述干涉仪传感器的制作装置,其特征在于,所述装置包括光源、光谱仪、切割刀、熔接机、飞秒激光器;所述光源和所述光谱仪分别与所述第一耦合器的第三臂和第四臂连接,所述光源发射的光经过所述第一耦合器,在所述光谱仪上生成第一干涉光谱,所述切割刀用于基于所述第一干涉光谱对所述第一耦合器的第一臂和第二臂进行切割;断开所述光源、所述光谱仪与所述第一耦合器的连接,所述光源和所述光谱仪分别与所述第二耦合器的第三臂和第四臂连接,所述光源发射的光经过所述第二耦合器,在所述光谱仪上生成第二干涉光谱,所述切割刀用于基于所述第二干涉光谱对所述第二耦合器的第一臂和第二臂进行切割;断开所述光源、所述光谱仪与所述第二耦合器的连接,所述光源与所述第一耦合器的第三臂或者第四臂连接,所述光谱仪与所述第二耦合器的第三臂或者第四臂连接,所述光源发射的光经过所述第一耦合器分成两个分支,一个经过所述第一光纤和所述第二耦合器,另一个经过所述第二光纤和所述第二耦合器,在所述光谱仪上生成第三干涉光谱;所述切割刀还用于对所述第一光纤和所述第二光纤进行切割处理;所述熔接机用于将所述第一光纤的两端分别熔接在所述第一耦合器的第一臂和所述第二耦合器的第一臂上,及将所述第二光纤的两端分别熔接在所述第一耦合器的第二臂和所述第二耦合器的第二臂上;所述飞秒激光器发射飞秒激光,根据所述第三干涉光谱使飞秒激光打穿所述第二光纤的纤芯上壁。
- 根据权利要求5所述的装置,其特征在于,所述装置还包括工业相机、第一处理器与一维手动位移平台;所述工业相机与所述第一处理器连接;所述一维手动位移平台用于固定并带动所述第一耦合器、所述第二耦合器、所述第一光纤和所述第二光纤移动;所述工业相机用于成像并通过所述第一处理器显示图像,便于利用所述切割刀进行切割处理。
- 根据权利要求5所述的装置,其特征在于,所述装置还包括显微镜、第二处理器与三维电动位移平台;所述第二处理器与所述显微镜、所述三维电动位移平台、所述飞秒激光器连接;所述三维电动位移平台用于固定绷紧所述第二光纤,并带动所述第二光纤沿以光纤轴向为X轴建立的三维坐标方向移动;所述显微镜用于对所述第二光纤的表面成像显示和会聚飞秒激光;所述第二处理器用于控制所述三维电动位移平台的移动,并控制所述飞秒激光器发射的飞秒激光打穿所述第二光纤的纤芯上壁。
- 一种应用如权利要求5至7任意一项所述装置制作如权利要求1至4任意一项所述干涉仪传感器的方法,其特征在于,所述方法包括:步骤101,基于所述第一干涉光谱和所述第二干涉光谱,采用精密显微切割的方式利用所述切割刀对第一耦合器的第一臂与第二臂,和第二耦合器的第一臂与第二臂进行切割处理;步骤102,利用所述熔接机将所述第一耦合器的第一臂和第二臂分别与第一光纤的一端及第二光纤的一端进行熔接处理,采用精密显微切割的方式利用所述切割刀对所述第一光纤和所述第二光纤进行切割处理,并利用所述熔接机将第一光纤的另一端与第二光纤的另一端分别与所述第二耦合器的第一臂和第二臂进行熔接处理;步骤103,基于所述第三干涉光谱,利用飞秒激光器发射的激光在所述第二光纤的其中一端进行开空气微腔处理。
- 根据权利要求8所述的方法,其特征在于,所述步骤101的具体步骤包括:步骤104,利用所述第一干涉光谱中的自由光谱区计算所述第一耦合器的第一臂和第二臂之间的第一臂长差,根据所述第一臂长差采用精密显微切割的方式,利用所述切割刀对所述第一耦合器的第一臂和第二臂进行切割处理;步骤105,利用所述第二干涉光谱中的自由光谱区计算所述第二耦合器的第一臂和第二臂之间的第二臂长差,根据所述第二臂长差采用精密显微切割的方式,利用所述切割刀对所述第二耦合器的第一臂和第二臂进行切割处理。
- 根据权利要求8所述的方法,其特征在于,所述步骤103的具体步骤包括:步骤106,在所述显微镜对所述第二光纤的表面成像得到的图像中,查找所述第二光纤与所述第一耦合器的第二臂的熔接点,或者所述第二光纤与所述第二耦合器的第二臂的熔接点;步骤107,基于所述第三干涉光谱,在所述第二光纤的熔接点位置处,利用所述飞秒激光器发射的飞秒激光打穿所述第二光纤的纤芯上壁。
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