WO2020080868A1

WO2020080868A1 - Scanner and electronic device having same

Info

Publication number: WO2020080868A1
Application number: PCT/KR2019/013706
Authority: WO
Inventors: 이병구; 박주도; 안재용; 김상천
Original assignee: 엘지전자 주식회사
Priority date: 2018-10-18
Filing date: 2019-10-18
Publication date: 2020-04-23

Abstract

The present invention relates to a scanner and an electronic device having same. The scanner of the present invention comprises: a mirror rotating around a first axis in a direct manner; a substrate spaced apart from the outside of the mirror; first and second mirror support members respectively connected to first and second sides of the mirror; first and second mirror springs respectively connected to the first and second mirror support members; and a plurality of combs which are formed on the substrate and which supply an electrostatic force-based rotational force to the mirror, wherein stepped portions are formed in a first region and a second region, which are partial regions of the substrate and are regions on both sides of the mirror. Therefore, light can be output in both directions of the mirror, thereby enabling wide-angle scanning.

Description

Scanner and electronic device equipped with the same

The present invention relates to a scanner and an electronic device having the same, and more particularly, to a scanner capable of wide-angle scanning, and an electronic device having the same.

Optical-based MEMS scanners are being developed for projector-based displays, and have recently been employed in riders, etc., for the detection of users in driving aids such as robots, drones, vehicles, or home appliances.

When the MEMS scanner is used for driving assistance or user detection, research has been conducted in consideration of the lowest frequency, driving angle, and mirror size to secure reliability.

An object of the present invention is to provide a scanner capable of wide-angle scanning, and an electronic device having the same.

Another object of the present invention is to provide a scanner capable of reducing an element size while reducing optical interference, and an electronic device having the same.

Another object of the present invention is to provide a scanner for preventing collisions when rotating a mirror and reducing damping caused by airflow generated by mirror rotation, and an electronic device having the same.

Another object of the present invention is to provide a scanner having improved horizontal and vertical resolution and beam reflection performance, and an electronic device having the same.

A scanner according to an embodiment of the present invention for achieving the above object, and an electronic device having the same, a mirror rotating about a first axis in a direct manner, a substrate formed spaced apart from the outside of the mirror, and a mirror First and second mirror support members connected to the first and second sides, first and second mirror springs respectively connected to the first and second mirror support members, and formed on the substrate. A step is formed in the first region and the second region, which include a plurality of combs for supplying the rotational force to the mirror, a partial region of the substrate, and both regions of the mirror.

On the other hand, when rotating about the first axis of the mirror, the size of the rotation angle relative to the second axis may be 25 to 40 degrees.

On the other hand, when rotating the mirror about the first axis, the size of the rotation angle relative to the second axis is θ, the thickness of the mirror is H, and the radius of the mirror is R, the height of the step formed on the substrate is R × It can correspond to sin (θ) + H × cos (θ).

Meanwhile, when the mirror is rotated about the first axis, the thickness of the mirror is referred to as H, and when the radius of the mirror is R, the height of the step formed on the substrate may be 0.42R + 0.9H to 0.64R + 0.76H.

Meanwhile, the substrate may include an upper substrate formed spaced apart from the outside of the mirror, and a lower substrate disposed under the upper substrate. At this time, the step is formed on the upper substrate and the lower substrate, and may be formed in the first region and the second region, which are both regions of the mirror.

Meanwhile, the steps formed in the first region and the second region may have an asymmetric shape.

Meanwhile, the width of the substrate may be greater than or equal to the diameter of the mirror.

On the other hand, in a plane formed by the third axis and the first axis orthogonal to the first axis and the second axis, light enters the mirror at a predetermined angle with the third axis or the third axis, and the first area and the second area Light may be reflected in a direction corresponding to.

Meanwhile, at least one opening may be formed in the substrate corresponding to the lower portion of the mirror.

At this time, it is preferable that the larger the width of the opening, the smaller the step formed on the mirror and the substrate.

A scanner according to another embodiment of the present invention for achieving the above object, and an electronic device having the same, a mirror rotating about a first axis in a direct manner, an upper substrate formed spaced apart from the outside of the mirror, and a mirror The first and second mirror support members are connected to the first and second sides of the first and second mirror springs respectively connected to the first and second mirror support members, and are formed on the upper substrate. A first region and a second region including a plurality of combs for supplying a power-based rotational force to the mirror, a lower substrate disposed under the upper substrate, a partial region of the upper substrate, and both regions of the lower portion of the mirror. In the region, a step may be formed.

On the other hand, when the mirror is rotated relative to the first axis, the size of the rotation angle relative to the second axis is θ, the thickness of the mirror is H, and the radius of the mirror is R, the height of the step formed on the upper substrate is R It can correspond to × sin (θ) + H × cos (θ).

On the other hand, when rotating about the first axis of the mirror, the thickness of the mirror is called H, and when the radius of the mirror is R, the height of the step formed on the upper substrate may be 0.42R + 0.9H to 0.64R + 0.76H. .

Meanwhile, the widths of the upper substrate and the lower substrate may be greater than or equal to the diameter of the mirror.

Meanwhile, at least one opening may be formed in the lower substrate corresponding to the lower portion of the mirror.

A scanner according to an embodiment of the present invention, and an electronic device having the same, include a mirror rotating about a first axis in a direct manner, a substrate formed spaced apart from the outside of the mirror, and first and second sides of the mirror First and second mirror support members connected to each of the first and second mirror springs connected to the first and second mirror support members, respectively, and formed on the substrate and supplying a constant power-based rotational force to the mirror A step is formed in the first region and the second region, which include a plurality of combs, are partial regions of the substrate, and are both regions of the mirror. Accordingly, light can be output in both directions of the mirror, and thus, wide-angle scanning is possible.

On the other hand, when rotating about the first axis of the mirror, the size of the rotation angle relative to the second axis may be 25 to 40 degrees. Accordingly, wide-angle scanning becomes possible.

On the other hand, when rotating the mirror about the first axis, the size of the rotation angle relative to the second axis is θ, the thickness of the mirror is H, and the radius of the mirror is R, the height of the step formed on the substrate is R × It can correspond to sin (θ) + H × cos (θ). Accordingly, collision with the substrate due to rotation of the mirror can be prevented. In addition, wide-angle scanning becomes possible.

Meanwhile, when the mirror is rotated about the first axis, the thickness of the mirror is referred to as H, and when the radius of the mirror is R, the height of the step formed on the substrate may be 0.42R + 0.9H to 0.64R + 0.76H. Accordingly, collision with the substrate due to rotation of the mirror can be prevented. In addition, wide-angle scanning becomes possible.

Meanwhile, the substrate may include an upper substrate formed spaced apart from the outside of the mirror, and a lower substrate disposed under the upper substrate. At this time, the step is formed on the upper substrate and the lower substrate, and may be formed in the first region and the second region, which are both regions of the mirror. Accordingly, light can be output in both directions of the mirror, and thus, wide-angle scanning is possible.

Meanwhile, a step may be formed on the upper substrate and the lower substrate, and through the step, collision with the lower substrate by rotation of the mirror may be prevented.

Meanwhile, the steps formed in the first region and the second region may have an asymmetric shape. Accordingly, when the incident angle is increased in the vertical incidence method, wide-angle scanning is possible.

Meanwhile, the width of the substrate may be greater than or equal to the diameter of the mirror. Accordingly, it is possible to prevent the mirror from being damaged while handling the substrate.

On the other hand, in a plane formed by the third axis and the first axis orthogonal to the first axis and the second axis, light enters the mirror at a predetermined angle with the third axis or the third axis, and the first area and the second area Light may be reflected in a direction corresponding to. Accordingly, wide-angle scanning is possible in the vertical incidence method.

Meanwhile, at least one opening may be formed in the substrate corresponding to the lower portion of the mirror. Accordingly, the damping effect due to the air flow occurring in the lower portion of the mirror according to the rotation of the mirror can be reduced.

On the other hand, as the width of the opening becomes larger, it is possible to prevent the substrate from colliding due to head rotation, and the step formed on the mirror and the substrate may be smaller. Accordingly, the height of the scanner can be reduced, and accordingly, a slim scanner can be implemented.

A scanner according to another embodiment of the present invention, and an electronic device having the same, include a mirror rotating about a first axis in a direct manner, an upper substrate formed spaced apart from the outside of the mirror, and a first side and a second side of the mirror The first and second mirror support members connected to the two sides, the first and second mirror springs connected to the first and second mirror support members, respectively, and formed on the upper substrate, mirror the rotational force based on the constant power. A plurality of combs to be supplied to and a lower substrate disposed under the upper substrate, a partial region of the upper substrate, and a step formed in the first region and the second region which are both regions of the lower portion of the mirror Can be. Accordingly, light can be output in both directions of the mirror, and thus, wide-angle scanning is possible.

On the other hand, when the mirror is rotated relative to the first axis, the size of the rotation angle relative to the second axis is θ, the thickness of the mirror is H, and the radius of the mirror is R, the height of the step formed on the upper substrate is R It can correspond to × sin (θ) + H × cos (θ). Accordingly, collision with the lower substrate by rotation of the mirror can be prevented. In addition, wide-angle scanning becomes possible.

On the other hand, when rotating about the first axis of the mirror, the thickness of the mirror is called H, and when the radius of the mirror is R, the height of the step formed on the upper substrate may be 0.42R + 0.9H to 0.64R + 0.76H. . Accordingly, collision with the lower substrate by rotation of the mirror can be prevented. In addition, wide-angle scanning becomes possible.

Meanwhile, a step may be formed only on the upper substrate, and through the step, collision with the lower substrate by rotation of the mirror may be prevented.

Meanwhile, the widths of the upper substrate and the lower substrate may be greater than or equal to the diameter of the mirror. Accordingly, it is possible to prevent the mirror from being damaged while handling the substrate.

Meanwhile, at least one opening may be formed in the lower substrate corresponding to the lower portion of the mirror. Accordingly, the damping effect due to the air flow occurring in the lower portion of the mirror according to the rotation of the mirror can be reduced.

On the other hand, it is preferable that the larger the width of the opening, the smaller the step formed on the mirror and the lower substrate. Accordingly, the height of the scanner can be reduced, and accordingly, a slim scanner can be implemented.

1 is a view showing an electronic device having a scanner according to an embodiment of the present invention.

2A illustrates an internal block diagram of an optical output unit having a scanner according to an embodiment of the present invention.

FIG. 2B is a diagram illustrating a scanning method during light projection of the scanner module of FIG. 2A.

2C is a view for explaining the operation of a conventional horizontal incidence scanner.

3A is a diagram illustrating a scanner according to an embodiment of the present invention.

3B to 4C are views referred to in the description of FIG. 3A.

5A is a diagram illustrating a scanner according to another embodiment of the present invention.

5B to 5C are views referred to in the description of FIG. 5A.

6A is a diagram illustrating a scanner according to another embodiment of the present invention.

6B to 6F are views referred to in the description of FIG. 6A.

7A is a diagram illustrating a scanner according to another embodiment of the present invention.

7B to 7C are views referred to in the description of FIG. 7A.

8A to 9C are diagrams illustrating scanners according to various embodiments of the present invention.

10 is a view showing incident light incident on a mirror.

Hereinafter, the present invention will be described in more detail with reference to the drawings.

The suffixes "modules" and "parts" for components used in the following description are given simply by considering the ease of writing the present specification, and do not give meanings or roles particularly important in themselves. Therefore, the "module" and the "unit" may be used interchangeably.

The electronic devices described in this specification include robots, drones, vehicles, and the like, which can be used for driving, and, for the detection of users, refrigerators, washing machines, air conditioners, electronic doors, and automatic temperature control devices And home appliances.

On the other hand, the scanner described in this specification is a scanner employed in Lidar or the like, and outputs light in front.

Referring to the drawings, the electronic device 200 may include an optical output unit 205 for optical output to the front. Meanwhile, the optical output unit 205 may be implemented as a scanner.

Meanwhile, the light output unit 205 may each include a scanner according to an embodiment of the present invention.

For example, the scanner in the light output unit 205 may output the scanned light OLa in front, approximately a few meters to several hundred meters ahead.

Meanwhile, the light output from the light output unit 205 is infrared light, and may have a wavelength of approximately 900-1550 nm.

Referring to the drawings, the light output unit 205 may output light scanned outside the electronic device.

It is preferable that the light output unit 205 uses a laser diode having good straightness as a light source in order to output the scanned light OLa, approximately a few meters to several hundred meters ahead.

Meanwhile, the light output unit 205 includes a light source unit 210 for outputting infrared light and a driving unit 286 for driving the light source unit 210.

For example, the light source unit 210 may output infrared light having a wavelength of approximately 900 to 1550 nm.

Meanwhile, the light source unit 210 may be driven by an electric signal from the driving unit 286, and an electric signal from the driving unit 286 may be generated by control of the processor 170.

The infrared light output from the light source unit 210 is collimated through each collimator lens in the light collecting unit 212.

The light reflection unit 220 reflects the infrared light output from the light source unit 210 or the condensing unit 212, and outputs the path-changed infrared light in one direction. To this end, the light reflection unit 220 may include a 1D MEMS mirror.

For example, the light reflection unit 220 reflects the infrared light output from the light source unit 210 or the light collecting unit 212, and outputs the path-changed infrared light in the direction of the scanner module 240.

Meanwhile, the line beam forming unit 222 may form light from the light reflection unit 220 as a line beam. To this end, when the light reflection unit 220 is provided as a 1D MEMS, the line beam forming unit 222 may be excluded.

In particular, the line beam forming unit 222 may form and output a line beam having a straight line shape in consideration of the scanner module 240, which is capable of only one-way scanning.

Next, the light reflection unit 256 may reflect the line beam from the line beam forming unit 222 in the direction of the scanner module 240. To this end, the light reflection unit 256 may be provided with Total Mirror (TM).

Meanwhile, the scanner module 240 may scan the line beam reflected from the light reflection unit 256 in the first direction.

That is, the scanner module 240 may sequentially and repeatedly perform input line beam scanning in the first direction. Thereby, the scanned light OL corresponding to infrared light may be output to the outside.

Referring to the drawings, light from the light source unit 210 is input to the scanner module 240 through the light reflection unit 220, the line beam forming unit 222, the light reflection unit 256, and the like, and the scanner module The 240 may sequentially and repeatedly perform the first direction scanning on the input light or line beam. .

As shown in the figure, the scanner module 240 may perform scanning from the left to the right in a diagonal direction or a horizontal direction, which is a first direction, with respect to the external area 40, centering on a scanable area. In addition, the scanning operation may be repeatedly performed on the entire external area 40.

By this scanning operation, it is possible to output infrared light scanned outside.

Meanwhile, the outer region 40 may be divided into a first region 42 and a second region 44, as shown in FIG. 2cb. Here, the first area 42 may be an area including the external object 43, that is, an active area 42, and the second area 44 does not include the external object 43 It may be a non-existing area, that is, a blank area 44.

Accordingly, the entire scanning section also includes a first scanning section corresponding to an active area 42 that is an area where an external object is present, and a blank area 44 which is an area where no external object is present. It may be divided into a second scanning section corresponding to.

The conventional horizontal incidence method was applied in a scanner 410x having an optical angle of 60 degrees or less, due to the breakage limit of a silicon-based mirror spring at a large-diameter mirror, a high driving frequency, and a wide driving angle.

Referring to the drawing, the horizontal incidence method is a method in which the second axis (Axisx) and the third axis (Axisz) enter at a predetermined angle with respect to the third axis (Axisz).

On the other hand, the scanner 410x with an optical angle of 60 degrees according to the conventional horizontal incidence method mirrors the incident light OLx incident at an angle of at least 15 degrees relative to the third axis (Axisz) to avoid light interference with the light source (MRx) By rotation of, it is possible to have a mirror (MRx) that outputs in one direction based on the incident light.

Accordingly, the incident light OLx incident at an angle of 15 degrees from the right with respect to the third axis (Axisz) is based on the incident light when the mirror is rotated 15 degrees to the left and right based on the center (MRC) of the mirror MRx To the left, reflected light (OLxa) is output.

In the drawing, it is shown that the optical angle of the mirror MRx is 60 degrees, which is the sum of 15 degrees on the right and 45 degrees on the left, compared to the third axis (Axisz).

That is, according to the conventional horizontal incidence-type scanner 410x of the conventional horizontal incidence of FIG. 2C, a minimum incidence angle to avoid light interference between the incident light and the scanning reflected light must be secured, and the larger the optical angle of the scanner, the larger the horizontal The angle of incidence must be secured. However, as the horizontal angle of incidence and the rotation angle of the mirror increase, the effective area of the mirror decreases from the point of view of the incident light, and thus the light efficiency decreases, which is not preferable for wide-angle applications.

Accordingly, in the present invention, a vertical incidence method is used instead of a horizontal incidence method to implement a wide-angle scanner.

The vertical incidence method is a method in which light enters at a predetermined angle with the third axis (Axisz) or the third axis (Axisz) in a plane formed by the first axis (Axisy) and the third axis (Axisz). Accordingly, a wide angle can be realized without light interference between incident light and reflected light.

Depending on the vertical incidence method, in the vicinity of the third axis (Axisz) or the third axis (Axisz), light is incident in the mirror direction, and reflected light is output in both left and right directions based on the center of the mirror (MRC). do. In particular, symmetrical reflected light may be output in both left and right directions. When outputting symmetrically, it is possible to construct an optical system without optical interference of incident light in the third axis (Axisz) by using a transflective mirror or the like. This will be described with reference to FIG. 3A and below.

3A is a diagram illustrating a scanner according to an embodiment of the present invention, and FIGS. 3B to 4C are diagrams referred to in the description of FIG. 3A. A diagram showing a scanner according to an embodiment of the invention.

3A is a perspective view of a scanner according to an embodiment of the present invention, FIG. 3B is a front view of a scanner according to an embodiment of the present invention, and FIG. 3C is a side view of a scanner according to an embodiment of the present invention.

Referring to the drawings, the scanner 410 according to an embodiment of the present invention may be a constant power based direct type scanner.

To this end, the scanner 410 is a first and second mirrors (MR) that rotates with respect to the first axis (Axisy) in a direct manner, and are respectively connected to the first and second sides of the mirror (MR) Mirror support members (SPa, SPb), first and second mirror springs (MSa, MSb) connected to the first and second mirror support members (SPa, SPb), respectively, and a constant power-based rotational force (MR) It includes a plurality of combs (CMBMa to CMBMd, CMBNa to CMBNd) supplied to), and a substrate SLC formed spaced apart from the outside of the mirror MR.

The substrate SLC is spaced apart from the mirror MR, and may be formed in a square shape outside the mirror MR.

Among the plurality of combs, the first comb CMBMa to CMBMd is a movable comb, connected to the first or second mirror support members SPa and SPb, and based on the constant power with the mirror MR It can transmit the rotational force.

Meanwhile, the second comb CMBNa to CMBNd among the plurality of combs may be a fixed comb formed on the substrate SLC and disposed in correspondence with the first combs CMBMa to CMBMd.

The rotational force is generated by the constant power between the first comb CMBMa to CMBMd and the second comb CMBNa to CMBNd, and the generated rotational force can be transmitted to the mirror MR.

On the other hand, in the drawing, in the first axis (Axisy) direction, the first and second mirror support members SPa and SPb are connected to the first and second sides of the mirror MR, and the first and second mirrors are connected. Although the first and second mirror springs MSa and MSb are respectively connected to the support members SPa and SPb, various modifications are possible.

For example, the scanner 410 further includes third and fourth mirror springs (not shown) connected to the first and second mirror support members SPa and SPb and symmetrically extending in the second axial direction. can do. Accordingly, it is possible to alleviate the stress of the first and second mirror springs MSa and MSb by the third and fourth mirror springs (not shown).

Meanwhile, steps EDba and EDaa are formed in the first region and the second region, which are a partial region of the substrate SLC, and are both regions of the mirror MR.

Here, the first region and the second region, which are both side regions, may mean both side regions of the mirror MR, but are not limited thereto, and may also include a space below the mirror MR. That is, the step may be formed in both side regions of the mirror MR, as well as in both side regions of the lower portion of the mirror MR.

Accordingly, light can be output in both directions of the mirror MR, and thus, wide-angle scanning is possible without light interference by the substrate.

Meanwhile, the steps EDba and EDaa formed in the first region and the second region may have an asymmetric shape. For example, the upper region of the steps EDba and EDaa may be larger than the lower region. Accordingly, when the incident angle is increased in the vertical incidence method, wide-angle scanning is possible.

Meanwhile, the width of the substrate SLC may be greater than or equal to the diameter of the mirror MR. Accordingly, it is possible to prevent damage to the mirror that may occur while handling the substrate SLC.

On the other hand, in the plane formed by the third axis (Axisz) and the first axis (Axisy) orthogonal to the first axis (Axisy) and the second axis (Axisx), the third axis (Axisz) or the third axis (Axisz) and Light may be incident on the mirror MR at a predetermined angle, and light may be reflected in directions corresponding to the first region and the second region. Accordingly, wide-angle scanning is possible in the vertical incidence method.

Meanwhile, a first pattern and a second pattern formed through etching may be further included on the rear surface of the mirror MR. Accordingly, the driving force of the scanner can be reduced by reducing the MOI (Moment Of Inertia) of the mirror while maintaining the rigidity of the mirror. Accordingly, through the scanner 410, horizontal resolution and vertical resolution and beam reflection performance can be improved.

Meanwhile, the first pattern and the second pattern may be arc shapes spaced apart from the circumference of the mirror MR. Accordingly, through the scanner 410, horizontal resolution and vertical resolution and beam reflection performance can be improved.

Meanwhile, in the present invention, a scanner capable of wide-angle scanning is proposed in a scanner employable in various electronic devices.

Meanwhile, as illustrated in FIG. 2C, the optical angle of the mirror MRx in the conventional horizontal incidence type scanner 410x was 60 degrees or less.

On the other hand, in order to realize a large-diameter mirror, a high driving frequency, and a wide driving angle in a horizontal incidence method, when the optical angle of the mirror MRx is designed to be 60 degrees or more, in order to avoid optical interference, the incident light angle is a third axis ( Axisz) standards should be increased further.

At this time, as the angle of the incident light with respect to the third axis (Axisz) increases, and as the rotation angle of the mirror increases, the effective area of the mirror decreases in terms of the incident light, thereby deteriorating light efficiency. In addition, as the rotation angle of the mirror MRx increases, there is a problem that the silicon-based mirror spring is easily damaged.

However, in the present invention, the scanner 410 having a high driving frequency and a wide driving angle is designed while reducing the possibility of damage such as a silicon-based mirror spring.

In particular, depending on the vertical incidence method, in the vicinity of the third axis (Axisz) or the third axis (Axisz), light is incident in the mirror direction, and based on the center of the mirror (MRC), in both left and right directions, reflected light Output. In particular, symmetrical reflected light is output in both left and right directions.

Accordingly, in the present invention, in the plane formed by the first axis (Axisy) and the third axis (Axisz), the third axis (Axisz) or the third axis (Axisz) with a predetermined angle, the mirror (MR) Let light enter.

This method is a vertical incidence method, compared to the horizontal incidence method of FIG. 2C, and has the advantage of being advantageous in realizing wide angle without light interference of incident light.

On the other hand, according to the rotation of the mirror MR of the scanner 410, the angle of the reflected light is changed. In the present invention, in consideration of the rotation of the mirror MR, the angle of the reflected light in the left direction compared to the incident light is at least 45 degrees. , Set the angle of the reflected light in the right direction compared to the incident light to be at least 45 degrees.

That is, according to the embodiment of the present invention, it is preferable to set the optical angle of the mirror MR of the scanner 410 to be at least 90 degrees.

This corresponds to the output of the reflected light OLxa at a 45-degree angle on the left side compared to the vertical axis (Axisz) of FIG. 2C.

According to this, the minimum optical angle in the vertical incidence method according to the embodiment of the present invention corresponds to the reflected light path of the left 45 degrees of FIG. 2C. Therefore, the reflected light path abnormality of the left 45 degrees in FIG. 2C is set as a wide-angle scanner.

On the other hand, when the optical angle of the mirror MR of the scanner 410 is less than 90 degrees, this is a case where the rotation angle of the mirror MR becomes small, which makes it impossible to perform wide-angle scanning.

On the other hand, when the optical angle of the mirror MR is 90 degrees, it is preferable that the final optical angle of the mirror MR is 100 degrees in consideration of 10 degrees of the margin optical angle. Therefore, the present invention proposes a scanner 410 having a final optical angle of the mirror MR of 100 degrees.

That is, when the mirror MR is rotated with respect to the first axis (Axisy), the rotation angle is greater than or equal to 22.5 degrees relative to the second axis (Axisx), and considering the 2.5 degree as the margin driving angle, finally, the second A scanner 410 in which the final rotation angle with respect to the axis (Axisx) is 25 degrees or more is proposed. According to this, it is preferable that the final optical angle of the mirror MR is 100 degrees or more.

On the other hand, as the final optical angle of the mirror MR increases, there is a disadvantage in that the loss of light due to the substrate located on the path of the reflected light or the size of the scanner increases due to the spaced apart arrangement of the substrate.

On the other hand, electronic devices employing LiDAR employ a wide-angle camera to obtain more image information, for example, a wide-angle camera having a maximum viewing angle of approximately 150 degrees. Therefore, in order to verify the overlap with a camera in an electronic device employing a lidar, it is preferable that the maximum angle of the optical angle of the mirror MR in the scanner 410 for use in the lidar of the present invention is 150 degrees.

On the other hand, it is preferable that the maximum value of the final optical angle of the mirror MR is 160 degrees, further considering the margin optical angle of 10 degrees to 150 degrees, which is the maximum value of the optical angle of the mirror MR. Therefore, in the present invention, a scanner in which the maximum value of the final optical angle of the mirror MR is 160 degrees is proposed.

That is, when the reference rotation of the first axis (Axisy) of the mirror MR, the maximum value of the rotation angle compared to the second axis (Axisx) is 37.5, and considering the margin driving angle of 2.5 degrees, finally, the second axis (Axisx) ) We propose a scanner with a maximum rotation angle of 40 degrees. According to this, it is preferable that the maximum value of the final optical angle of the mirror MR is 160 degrees.

On the other hand, when the maximum value exceeds 160 degrees, as the final optical angle of the mirror MR increases, light loss occurs due to the substrate located on the reflected light path and surrounding structures, or the silicon-based mirror spring is damaged. There is a disadvantage in that the risk is significantly increased, or the size of the scanner or scanner module is increased due to the separation of the substrate and surrounding structures.

Consequently, in the present invention, a scanner in which the size of the final optical angle of the mirror MR is 100 to 160 degrees is proposed.

That is, in the present invention, in consideration of the margin driving angle, when the reference rotation of the first axis (Axisy) of the mirror MR, the size of the final rotation angle compared to the second axis (Axisx) is 25 to 40 degrees. Suggest.

In particular, in the present invention, as a direct type scanner applicable to the constant power method, a scanner having a final optical angle of the mirror MR of 100 to 160 degrees is proposed. This will be described with reference to FIG. 4A.

4A illustrates that light is reflected in the direction of the first area of FIG. 3A.

Referring to the drawing, the mirror MR rotates with respect to the first axis Axis in a direct manner based on a constant power, and the substrate SLC is disposed spaced apart from the mirror MR. In practice, the substrate SLC may be disposed spaced apart from the side and rear surfaces of the mirror MR.

On the other hand, the right side of the mirror MR is a region corresponding to the first region of FIG. 3A, and the substrate SLC may be etched to form a step EDba.

Meanwhile, FIG. 4A illustrates that the mirror MR rotates in the downward direction with respect to the second axis Axis, by an angle of θ.

At this time, the incident light OLi incident on the right end MRED of the mirror MR rotating to the lower right is reflected by the mirror MR and passes through the point GBED on the second axis Axis.

Accordingly, by applying the step EDba corresponding to the first region, light is output to the outside without loss of light by the substrate.

On the other hand, the distance or distance Da between the center (MRC) of the mirror (MR) and the point (GBED) on the second axis (Axisx) corresponds to the path of the reflected light on the top of the first region substrate, as the sum of Dmo and Dm1 , It can be calculated by the following equation (1).

[Equation 1]

Da = Rcos (θ) + Rsin (θ) tan (2θ)

Here, R is the radius of the mirror MR, θ corresponds to the rotation angle of the mirror MR relative to the second axis Axis, Dmo corresponds to Rcos (θ), and Dm1 is Rsin (θ) tan (2θ).

According to this principle, for wide-angle scanning, the position of the side substrate positioned in the first region is preferably Da or higher. However, the wider the angle, the larger the size of Da and the larger the size of the device. Therefore, it is desirable to prevent light loss by applying a step EDba to the first region without increasing the device size.

On the other hand, based on Equation 1, the width Da corresponding to the first region corresponding to the optical angle of 100 degrees of the mirror MR corresponds to 1.41 times the radius R of the mirror MR, The width Da corresponding to the first region corresponding to the optical angle of 160 degrees of the mirror MR corresponds to 4.41 times the radius R of the mirror MR. Accordingly, the wider the angle, the larger the device is forced to prevent.

Accordingly, according to an embodiment of the present invention, it is preferable to apply a step EDba to the first region based on the second axis (Axisx) intersecting the first axis (Axisy) to prevent light loss without increasing the device size. Do.

4B illustrates that light is reflected in the direction of the second region of FIG. 3A.

Referring to the drawing, the mirror MR rotates with respect to the first axis Axis in a direct manner based on a constant power, and the substrate SLC is disposed under the mirror MR.

Meanwhile, FIG. 4B illustrates that the mirror MR rotates in the downward direction with respect to the second axis Axis, by an angle of θ.

At this time, the incident light OLi incident on the right end MRED of the mirror MR rotating to the lower right is reflected by the mirror MR and passes through the point GBEDb on the second axis Axisx.

Accordingly, by applying the step EDaa to the second region, light is output to the outside without light loss due to surrounding structures.

On the other hand, the distance or distance Da between the center MRC of the mirror MR and the point GBEDb on the second axis Axis corresponds to the path of the reflected light on the top of the second region substrate, and is the sum of Dmo and Dm1. , It can be calculated by Equation 1 above.

Next, FIG. 4C illustrates that light is reflected in the direction of the first region of FIG. 3A, similar to FIG. 4A.

Referring to the drawings, when the mirror MR is rotated by a θ angle in a downward direction with respect to the second axis Axis, the height Dpth of the step EDba formed on the substrate SLC is Dm2 and Dm3 It can be the sum of

When rotating based on the first axis (Axisy) of the mirror (MR), the size of the rotation angle compared to the second axis (Axisx) is called θ, the thickness of the mirror (MR) is called H, and the radius of the mirror (MR) is R In this case, the height Dpth of the step EDba formed on the substrate SLC may be calculated by Equation 2 below.

[Equation 2]

Dpth = R × sin (θ) + H × cos (θ)

Meanwhile, as described above, when the range of θ is 25 to 40 degrees, the height Dpth of the step EDba formed on the substrate SLC may be 0.42R + 0.9H to 0.64R + 0.76H. .

Accordingly, collision with the substrate SLC due to rotation of the mirror MR can be prevented. In addition, wide-angle scanning becomes possible.

Meanwhile, in FIGS. 3A to 4C, although a step is formed in some regions of the substrate SLC, the substrate may be formed by dividing the upper substrate and the lower substrate. This will be described with reference to FIGS. 5A to 5C.

5A is a perspective view of a scanner according to another embodiment of the present invention, FIG. 5B is a side view of the scanner of FIG. 5A, and FIG. 5C is a view referenced to the operation description of FIG. 5A.

Referring to the drawings, the scanner 410aa according to an embodiment of the present invention may be a constant power based direct scanner, similar to the scanner 410 of FIGS. 3A to 4C. Hereinafter, the difference will be mainly described.

To this end, the scanner 410aa includes first and second mirrors MR that rotate in a direct manner with respect to the first axis Axis, and first and second sides of the mirror MR, respectively. Mirror support members (SPa, SPb), first and second mirror springs (MSa, MSb) connected to the first and second mirror support members (SPa, SPb), respectively, and a constant power-based rotational force (MR) ) A plurality of combs to supply (CMBMa ~ CMBMd, CMBNa ~ CMBNd), the upper substrate (SLC) formed spaced apart from the outside of the mirror (MR), and the lower portion disposed under the upper substrate (SLC) And a substrate (DDSB).

The upper substrate SLC is spaced apart from the mirror MR, and may be formed in a square shape outside the mirror MR.

Meanwhile, steps EDba and EDaa are formed in the first and second regions, which are a partial region of the upper substrate SLC and the lower substrate DDSB, and are both regions of the mirror MR. Accordingly, light can be output in both directions of the mirror MR, and thus, wide-angle scanning is possible.

Meanwhile, steps EDba and EDaa may be formed on the upper substrate SLC and the lower substrate DDSB, and thus, collision of the lower substrate DDSB by rotation of the mirror MR may be prevented. There will be.

Meanwhile, the width of the upper substrate SLC and the lower substrate DDSB may be greater than or equal to the diameter of the mirror MR. Accordingly, according to this, it is possible to prevent damage to the mirror that may occur while handling the upper substrate SLC and the lower substrate DDSB.

Next, FIG. 5C illustrates that light is reflected in the direction of the first region.

Referring to the drawing, when the mirror MR is rotated by a θ angle in a downward direction, relative to the second axis Axis, the height of the step EDba formed on the upper substrate SLC and the lower substrate DDSB ( Dpth) may be the sum of Dm2 and Dm3.

When rotating based on the first axis (Axisy) of the mirror (MR), the size of the rotation angle compared to the second axis (Axisx) is called θ, the thickness of the mirror (MR) is called H, and the radius of the mirror (MR) is R In this case, the height Dpth of the step EDba formed on the upper substrate SLC and the lower substrate DDSB may be calculated by Equation 2 above.

On the other hand, as described above, when the range of θ is 25 to 40 degrees, the height (Dpth) of the step (EDba) formed in the upper substrate SLC and the lower substrate DDSB is 0.42R + 0.9H to 0.64 R + 0.76H.

Accordingly, collision with the lower substrate DDSB due to rotation of the mirror MR can be prevented. In addition, wide-angle scanning becomes possible.

Meanwhile, unlike FIGS. 3A to 5C, it is also possible that at least one opening OP is formed in a region corresponding to a lower portion of the mirror MR. This will be described with reference to FIG. 6A and below.

6A is a diagram illustrating a scanner according to another embodiment of the present invention, and FIGS. 6B to 6E are diagrams referred to in the description of FIG. 6A.

Referring to the drawings, the scanner 410ba according to an embodiment of the present invention may be a constant power-based direct scanner, similar to the scanner 410 of FIGS. 3A to 4C. Hereinafter, the difference will be mainly described.

To this end, the scanner 410aa includes first and second mirrors MR that rotate in a direct manner with respect to the first axis Axis, and first and second sides of the mirror MR, respectively. Mirror support members (SPa, SPb), first and second mirror springs (MSa, MSb) connected to the first and second mirror support members (SPa, SPb), respectively, and a constant power-based rotational force (MR) A plurality of combs (CMBMa to CMBMd, CMBNa to CMBNd) supplied to), and a substrate SLC formed spaced apart from the outside of the mirror MR, the substrate corresponding to the lower portion of the mirror MR An opening OP is formed in the SLC.

FIG. 6B shows a side view of FIG. 6A and illustrates that the opening OP is formed in the third region corresponding to the lower portion of the mirror MR. Accordingly, a damping effect due to airflow generated under the mirror due to rotation of the mirror MR may be reduced, and thus, a scanner driving force may be reduced. In addition, as the width of the opening increases, the mirror rotation space can be secured through the opening, so that the step formed on the mirror and the substrate can be reduced.

6C to 6F illustrate that light is reflected in the direction of the first region of FIG. 6A.

Referring to the drawings, the right side of the mirror MR is a region corresponding to the first region of FIG. 6A, and the substrate SLC may be etched to form a step EDba.

Meanwhile, FIGS. 6C to 6F illustrate that the mirror MR rotates by an angle of θ in a downward direction with respect to the second axis Axis.

On the other hand, Fig. 6C illustrates a scanner 410ba having a width of the opening OP formed in the substrate SLC, Wsa, and a height of the step EDba, which is Dptha.

Meanwhile, FIG. 6C illustrates a scanner 410ba in which the mirror MR rotates by a θ angle in a downward direction with respect to the second axis Axis.

On the other hand, FIG. 6D illustrates a scanner 410ba2 having a width of the opening OP formed on the substrate SLC, a Wsb smaller than Wsa, and a height of the step EDba being Dpthb larger than Dptha.

The smaller the width of the opening OP, the larger the damping of the airflow generated in the lower part of the mirror when the mirror MR is rotated, and the more difficult it is to secure the rotational space of the mirror through the opening. Accordingly, the height of the step EDba is It has no choice but to grow.

On the other hand, FIG. 6E illustrates a scanner 410ba3 in which the width of the opening OP formed in the substrate SLC is Wsc greater than Wsa and the height of the step EDba is Dpthc less than Dptha.

The larger the width of the opening OP, the more the damping effect due to the airflow occurring in the lower part of the mirror when the mirror MR is rotated can reduce the scanner driving force. In addition, the mirror rotation space can be secured through the opening, so that the height of the step EDba can be reduced. Accordingly, it is possible to implement a slim scanner.

Next, FIG. 6F shows a range of steps that can be formed when an opening is formed in the substrate.

Referring to the drawings, when an opening is formed in the substrate SLC, the mirror MR formed in the scanner 410ba4 and the step EDba formed in the substrate SLC may be between Dpthd and Dpthe.

Here, Dpthe is a value corresponding to R × sin (θ) + H × cos (θ) when a 40-degree rotation is not formed in the substrate SLC, and may be approximately 0.64R + 0.76H.

On the other hand, Dpthd corresponds to a step that must be etched to a minimum in order to avoid optical interference. In the case of a structure that avoids optical interference by etching the substrate SLC on the upper surface of the mirror, the distance of the second axis (Axisx) from the center of the mirror of the point where it meets the upper surface of the mirror at the minimum optical angle θ1 is half the opening size (Wsc) Is 1.41R. At this time, the step Dpthd for securing the maximum optical angle θ2 corresponds to 0.53R. In addition, when the step (Dpthhd) is less than 0.53R, a method of forming a step through etching on the upper surface will be more preferable than a method of reducing the step of the lower plate.

In addition, the minimum step (Dpthd) to prevent the optical interference when rotating at the maximum optical angle (θ2) can be calculated by the following equation (3).

[Equation 3]

Dpthd = R × sin (θ2)-[R × cos (θ1) + R × sin (θ1) × tan (2θ1) -R × cos (θ2)] / tan (2θ2)

As a result, when an opening is formed in the substrate SLC, the step formed on the substrate is compared with the upper surface of the mirror MR when the thickness of the mirror MR is H and the radius of the mirror MR is R. , 0.53R to 0.64R + 0.76H.

Meanwhile, in FIGS. 6A to 6F, a step is formed in some regions of the substrate SLC, and at least one opening is formed below the mirror MR, but the substrate is used as an upper substrate and a lower substrate. It is also possible to be divided. This will be described with reference to FIGS. 7A to 7C.

7A is a perspective view of a scanner according to another embodiment of the present invention, and FIGS. 7B to 7C are views referred to for describing the operation of FIG. 7A.

Referring to the drawings, the scanner 410bb according to an embodiment of the present invention may be a constant power-based direct scanner, similar to the scanners of FIGS. 6A to 6F. Hereinafter, the difference will be mainly described.

To this end, the scanner 410bb includes first and second mirrors MR rotating about the first axis Axis in a direct manner, and first and second sides of the mirror MR, respectively. Mirror support members (SPa, SPb), first and second mirror springs (MSa, MSb) connected to the first and second mirror support members (SPa, SPb), respectively, and a constant power-based rotational force (MR) ) A plurality of combs to supply (CMBMa ~ CMBMd, CMBNa ~ CMBNd), the upper substrate (SLC) formed spaced apart from the outside of the mirror (MR), and the lower portion disposed under the upper substrate (SLC) And a substrate (DDSB). Meanwhile, an opening OP is formed in the lower substrate DDSB corresponding to the lower portion of the mirror MR.

Meanwhile, the width of the upper substrate SLC and the lower substrate DDSB may be greater than or equal to the diameter of the mirror MR. Accordingly, it is possible to prevent damage to the mirror that may occur while handling the upper substrate SLC and the lower substrate DDSB.

Next, FIG. 7B illustrates that light is reflected in the direction of the first region.

Referring to the drawings, when the mirror MR is rotated by a θ angle in a downward direction, relative to the second axis Axis, the step EDba formed on the upper substrate SLC and the lower substrate DDSB is Dptha It can be formed of.

Meanwhile, an opening OP is formed in the lower substrate DDSB corresponding to the lower portion of the mirror MR.

Accordingly, a damping effect due to airflow generated in the lower portion of the mirror due to rotation of the mirror MR may be reduced, and thus the scanner driving force may be reduced.

On the other hand, the larger the width of the opening OP, the more the damping effect due to the airflow generated in the lower part of the mirror when the mirror MR is rotated, the scanner driving force can be reduced. In addition, the mirror rotation space can be secured through the opening, so that the height of the step EDba can be reduced. Accordingly, it is possible to implement a slim scanner.

Next, FIG. 7C shows a range of the stepped EDba that can be formed when a step EDba is formed on the upper substrate SLC and the lower substrate DDSB and an opening OP is formed on the lower substrate DDSB. .

Referring to the drawing, when the opening OP is formed in the lower substrate DDSB, the mirror MR formed in the scanner 410bb and the step EDba formed in the substrate SLC may be between Dpthd and Dpthe.

On the other hand, Dpthd corresponds to a step that must be etched to a minimum in order to avoid optical interference. In the case of a structure in which light interference is avoided by etching the upper substrate SLC on the upper surface of the mirror, the distance of the second axis (Axisx) from the center of the mirror of the point where the upper surface of the mirror meets the upper surface of the mirror at the minimum optical angle θ1 is the opening size (Wsc). It is 1.41R in half. At this time, the step Dpthd for securing the maximum optical angle θ2 corresponds to 0.53R. In addition, when the step (Dpthhd) is less than 0.53R, a method of forming a step through etching on the upper surface will be more preferable than a method of reducing the step of the lower plate.

In addition, the minimum step (Dpthd) that prevents optical interference when rotating at the maximum optical angle (θ2) can be calculated by Equation 3 above.

First, in the scanner 410ca of FIG. 8A, steps EDba and EDaa are formed in the first and second regions, which are both regions of the mirror MR, and a plurality of openings (below the mirror MR) are formed. OPaa ~ OPan) is illustrated.

The scanners shown in FIGS. 5A to 7B have openings greater than or equal to the size of the mirror MR, but, as with the scanner 410ca of FIG. 8A, to reduce the damping effect due to airflow, the mirror MR It is also preferable to form a plurality of openings smaller than the size of. According to this, it is also possible to easily form a plurality of openings.

Next, in the scanner 410cb of FIG. 8B, steps EDba and EDaa are formed in the first and second regions, which are both regions of the mirror MR, and two openings (at the bottom of the mirror MR) It is exemplified that OPb) is formed on both sides of the mirror MR.

Unlike the circular mirror (MR) shape, the two openings OPb in the drawing may be implemented in a square shape or the like.

Next, in the scanner 410cc of FIG. 8C, steps EDba and EDaa are formed in the first and second regions, which are both regions of the mirror MR, and one opening (at the bottom of the mirror MR) It illustrates that OPc) is formed.

In the drawing, it is exemplified that the opening OPc has a circular shape similar to the circular mirror MR shape, but is formed smaller than the size of the mirror MR.

Next, in the scanner 410cd of FIG. 8D, steps EDba and EDaa are formed in the first and second regions, which are both regions of the mirror MR, and one opening (at the bottom of the mirror MR) OPd) is illustrated.

The opening OPd in the drawing may be formed larger than a circular mirror MR shape.

Next, in the scanner 410ce of FIG. 8E, steps EDba and EDaa are formed in the first and second regions, which are both regions of the mirror MR, and one opening (at the bottom of the mirror MR) OPe) is illustrated.

Unlike the circular mirror (MR) shape, the opening OPe in the drawing may be implemented in a square shape or the like.

Next, the scanner 410cf of FIG. 8F is similar to the scanner 410cd of FIG. 8D, but the steps EDba and EDaa are formed on the upper substrate SLC and the lower substrate DDSBf, and the lower portion of the mirror MR In, it illustrates that one opening OPf is formed.

8G illustrates the lower substrate DDSBf of FIG. 8F.

The scanner 410ch in FIG. 8H is similar to the scanner 410cd in FIG. 8D, but is the first substrate SLC, the second of the first substrate SLC, the second substrate DDSBh1, and the third substrate DDSBh2. It is exemplified that steps EDba and EDaa are formed on the substrate DDSBh1, and one opening OPh is formed under the mirror MR.

8I illustrates the third substrate DDSBh2. In the third substrate DDSBh2, a step is not formed, and one opening OPh may be formed.

9A to 9C are diagrams illustrating a scanner according to another embodiment of the present invention.

Referring to the drawings, the scanners 410da, 410db, and 410dc of FIGS. 9A to 9C are mirrors that rotate relative to the first axis Axis in a direct manner, similar to the scanner 410 of FIGS. 3A to 3C. (MR), the substrate (SLC) formed spaced apart from the outside of the mirror (MR), and the first and second mirror support members (SPa, SPb) respectively connected to the first and second sides of the mirror (MR) ), The first and second mirror springs MSa and MSb connected to the first and second mirror support members SPa and SPb, respectively, and formed on the upper substrate SLC and mirroring the rotational force based on the constant power. A plurality of combs supplied to the MR and a lower substrate DDSB disposed under the upper substrate SLC, and a partial region of the upper substrate SLC and the lower substrate DDSB, and a mirror Steps (EDac, EDbc or EDad, EDbd or EDac, EDbc or EDae, EDbe) are formed in the first region and the second region, which are both side regions of the lower part of (MR). Accordingly, light can be output in both directions of the mirror MR, and thus, wide-angle scanning is possible.

Meanwhile, as shown in the scanner 410da of FIG. 9A, the side shapes of the steps EDac and EDbc formed on the upper substrate SLC and the lower substrate DDSB may be implemented in various shapes such as an angular shape and a circular shape.

Next, as in the scanner 410db of FIG. 9B, the width of the upper substrate SLC and the lower substrate DDSB may be greater than or equal to the diameter 2R of the mirror MR. Accordingly, it is possible to prevent the mirror from being damaged while handling the substrate.

Next, in the scanner 410dc of FIG. 9C, unlike the scanner 410 of FIGS. 3A to 3C, the steps EDae and EDbe formed on the upper substrate SLC and the lower substrate DDSB are formed asymmetrically in the vertical direction. Can be.

For example, as illustrated in FIG. 9C, more etching may be performed in the upward direction and less etching may be performed in the downward direction. Accordingly, when the incident angle is increased in the vertical incident method, light may be output in an upward direction.

10 is a view showing incident light incident on a mirror.

Referring to the drawings, in the present invention, in order to implement a wide-angle scanner, a vertical incident method is used instead of a horizontal incident method.

In the vertical incidence method, light (OLi) is incident at a predetermined angle with the third axis (Axisz) or the third axis (Axisz) in the plane (YZP) formed by the first axis (Axisy) and the third axis (Axisz). Way.

Depending on the vertical incidence method, in the vicinity of the third axis (Axisz) or the third axis (Axisz), light OLi is incident in the mirror direction, and based on the center of the mirror (MRC), left and right directions, reflected light Let this be output. In particular, symmetrical reflected light may be output in both left and right directions. Accordingly, a wide-angle scanner can be implemented.

In the above, preferred embodiments of the present invention have been illustrated and described, but the present invention is not limited to the specific embodiments described above, and it is usually in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims. Of course, various modifications can be implemented by a person having knowledge of these, and these modifications should not be understood individually from the technical idea or prospect of the present invention.

Claims

A mirror rotating about the first axis in a direct manner;

A substrate spaced apart from the outside of the mirror;

First and second mirror support members connected to the first and second sides of the mirror, respectively;

First and second mirror springs respectively connected to the first and second mirror support members;

It is formed on the substrate, a plurality of combs (comb) for supplying a rotational force based on the constant power to the mirror; includes,

A scanner is characterized in that a step is formed in the first region and the second region, which are a partial region of the substrate and are both regions of the mirror.
According to claim 1,

The substrate,

It includes; an upper substrate formed spaced apart from the outside of the mirror, and a lower substrate disposed under the upper substrate;

The plurality of combs are formed on the upper substrate,

The step is formed on the upper substrate and the lower substrate, the scanner characterized in that it is formed in the first area and the second area, which are both regions of the mirror.
According to claim 1,

When the mirror is rotated relative to the first axis, the size of the rotation angle compared to the second axis intersecting the first axis is 25 to 40 degrees.
According to claim 1,

When rotating about the first axis of the mirror, the magnitude of the rotation angle compared to the second axis intersecting the first axis is θ, the thickness of the mirror is H, and the radius of the mirror is R,

The height of the step formed on the substrate corresponds to R × sin (θ) + H × cos (θ).
According to claim 1,

When rotating about the first axis of the mirror, the thickness of the mirror is called H, and the radius of the mirror is called R.

The height of the step formed on the substrate is 0.42R + 0.9H to 0.64R + 0.76H, characterized in that the scanner.
According to claim 1,

The step formed in the first region and the second region, characterized in that the scanner has an asymmetric shape.
According to claim 1,

The width of the substrate, the scanner, characterized in that the diameter of the mirror or more.
According to claim 3,

In a plane formed by the first axis and the third axis orthogonal to the first axis and the second axis, light enters the mirror at a predetermined angle with the third axis or the third axis, and the first region And reflecting the light in a direction corresponding to the second region.
According to claim 1,

A scanner characterized in that at least one opening is formed in the substrate corresponding to the lower portion of the mirror.
According to claim 1,

And a third and fourth mirror springs respectively connected to the first and second mirror support members and symmetrically extending in a second axis direction that intersects the first axis.
According to claim 1,

In the state in which an opening is formed in the substrate, the step formed on the substrate is 0.53R to 0.64R + 0.76 compared to the upper surface of the mirror when the thickness of the mirror is H and the radius of the mirror is R Scanner formed by H.
A mirror rotating about the first axis in a direct manner;

An upper substrate spaced apart from the outside of the mirror;

First and second mirror support members connected to the first and second sides of the mirror, respectively;

First and second mirror springs respectively connected to the first and second mirror support members;

A plurality of combs formed on the upper substrate and supplying a rotational force based on a constant power to the mirror;

It includes; a lower substrate disposed under the upper substrate;

The scanner is characterized in that a step is formed in the first region and the second region, which are a partial region of the upper substrate and are both regions of the mirror.
The method of claim 12,

When the mirror is rotated relative to the first axis, the size of the rotation angle compared to the second axis intersecting the first axis is 25 to 40 degrees.
The method of claim 12,

When rotating about the first axis of the mirror, the magnitude of the rotation angle compared to the second axis intersecting the first axis is θ, the thickness of the mirror is H, and the radius of the mirror is R,

The height of the step formed on the upper substrate is characterized in that it corresponds to R × sin (θ) + H × cos (θ).
The method of claim 12,

When rotating about the first axis of the mirror, the thickness of the mirror is called H, and the radius of the mirror is called R.

The height of the step formed on the upper substrate, characterized in that the scanner is 0.42R + 0.9H to 0.64R + 0.76H.
The method of claim 12,

The width of the upper substrate and the lower substrate, the scanner, characterized in that the diameter of the mirror or more.
The method of claim 12,

And a third and fourth mirror springs respectively connected to the first and second mirror support members and symmetrically extending in a second axis direction intersecting the first axis.
The method of claim 12,

And at least one opening formed in the lower substrate corresponding to the lower portion of the mirror.
The method of claim 12,

In the state in which an opening is formed in the lower substrate, the step formed on the upper substrate is 0.53R to 0.64R compared to the upper surface of the mirror when the thickness of the mirror is H and the radius of the mirror is R A scanner characterized in that it is formed of + 0.76H.
An electronic device comprising a scanner according to any one of claims 1 to 19.