WO2020065967A1 - Method for manufacturing display device and apparatus for manufacturing display device - Google Patents

Method for manufacturing display device and apparatus for manufacturing display device Download PDF

Info

Publication number
WO2020065967A1
WO2020065967A1 PCT/JP2018/036455 JP2018036455W WO2020065967A1 WO 2020065967 A1 WO2020065967 A1 WO 2020065967A1 JP 2018036455 W JP2018036455 W JP 2018036455W WO 2020065967 A1 WO2020065967 A1 WO 2020065967A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrodeposition
head
substrate
liquid
display device
Prior art date
Application number
PCT/JP2018/036455
Other languages
French (fr)
Japanese (ja)
Inventor
惇 佐久間
豪 鎌田
青森　繁
康 浅岡
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to PCT/JP2018/036455 priority Critical patent/WO2020065967A1/en
Publication of WO2020065967A1 publication Critical patent/WO2020065967A1/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present invention relates to a display device manufacturing method and a display device manufacturing apparatus which form a functional layer of a display device by electrodeposition.
  • Patent Document 1 discloses a method of forming an organic light emitting layer by an electrodeposition method in manufacturing an organic light emitting device.
  • the method for manufacturing a display device of the present invention includes an electrodeposition liquid supply port and an electrodeposition head electrode, using an electrodeposition head having an electrode surface smaller in area than the substrate,
  • a method for manufacturing a display device for performing electrodeposition on a substrate electrode formed on the substrate comprising: a sweeping step of relatively moving at least one of the electrodeposition head and the substrate; A contacting step of contacting the electrodeposition liquid containing the functional material with the surface of the substrate in an area smaller than the area of the substrate, applying a first potential to the electrodeposition head electrode, and contacting at least the electrodeposition liquid;
  • a display device manufacturing apparatus for performing electrodeposition on a substrate electrode formed on a substrate, comprising: an electrodeposition liquid supply port and an electrodeposition head.
  • An electrodeposition head having an electrode surface having an area smaller than that of the substrate, and a sweeper for relatively moving at least one of the electrodeposition head and the substrate, and supplied from the electrodeposition liquid supply port.
  • the electrodeposition liquid containing the functional material is brought into contact with the surface of the substrate in an area smaller than the area of the substrate, a first potential is applied to the electrodeposition head electrode, and at least the electrodeposition liquid is in contact with the electrodeposition liquid.
  • a second potential is applied to a substrate electrode on which the functional material is not electrodeposited
  • a third potential is applied to a substrate electrode on which the functional material is electrodeposited
  • the first potential and the third potential are applied. Absolute difference from the potential of But larger than the absolute value of the difference between the second potential and the first potential.
  • FIG. 4 is a schematic diagram for explaining the method for manufacturing the display device according to the first embodiment of the present invention.
  • 1 is a block diagram of a display device manufacturing apparatus according to Embodiment 1 of the present invention.
  • FIG. 9 is a schematic diagram for explaining the method for manufacturing the display device according to the second embodiment of the present invention.
  • FIG. 7 is a schematic diagram for explaining a method for manufacturing a display device according to Embodiment 3 of the present invention.
  • FIG. 14 is a schematic diagram for explaining the method for manufacturing the display device according to the fourth embodiment of the present invention. It is a schematic diagram for explaining the manufacturing method of the display device concerning Embodiment 5 of the present invention. It is a schematic diagram for explaining the manufacturing method of the display device concerning Embodiment 6 of the present invention. It is a schematic diagram for explaining the manufacturing method of the display device concerning Embodiment 7 of the present invention.
  • FIG. 2 is a block diagram of the display device manufacturing apparatus 2 according to the present embodiment. Note that FIG. 2 shows a cross section of an electrodeposition head 6 and an electrodeposition liquid storage tank 8 described later. The cross section of the electrodeposition head 6 and the storage tank for storing the liquid is shown in FIGS. 1 and 3 and thereafter.
  • the display device manufacturing apparatus 2 includes a controller 4, an electrodeposition head 6, an electrodeposition liquid storage tank 8, a substrate-side power supply 10, a sweep unit 12, and a substrate holder 14. Prepare.
  • the controller 4 controls the operations of the electrodeposition head 6, the electrodeposition liquid storage tank 8, the substrate-side power supply 10, the sweep unit 12, and the substrate holder 14.
  • the electrodeposition head 6 includes an electrodeposition head side power supply 16, an electrodeposition head electrode 18, and an electrodeposition liquid supply path 20.
  • the electrodeposition head 6 has an electrodeposition surface 6S on a surface facing a substrate holder 14 described later.
  • the electrodeposition head side power supply 16 is built in the electrodeposition head 6 and controls a voltage applied to the electrodeposition head electrode 18.
  • the electrodeposition head electrode 18 has an electrodeposition head electrode surface 18S (electrode surface) exposed from the electrodeposition surface 6S of the electrodeposition head 6.
  • An electrodeposition liquid supply port 20A which is an opening communicating with the electrodeposition liquid supply path 20, is formed on the electrodeposition surface 6S.
  • the electrodeposition liquid storage tank 8 communicates with the electrodeposition liquid supply path 20 of the electrodeposition head 6 via the connection pipe 22.
  • the electrodeposition liquid storage tank 8 includes a stirrer 24 that stirs the liquid inside the electrodeposition liquid storage tank 8.
  • the electrode-side power supply 10 is a power supply for applying a voltage to each electrode of the substrate held by the substrate holder 14 described later.
  • the sweep unit 12 sweeps at least one of the electrodeposition head 6 and a substrate holder 14 described later, and relatively moves the electrodeposition head 6 and the substrate held by the substrate holder 14.
  • the substrate holder 14 holds a substrate to be described later on a surface facing the electrodeposition head 6.
  • the substrate holder 14 may be, for example, a vacuum chuck.
  • FIG. 1 is a schematic diagram showing an example of a method for performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
  • the substrate C includes a plurality of first electrodes E1, second electrodes E2, and third electrodes E3 as substrate electrodes.
  • all the first electrodes E1 are short-circuited
  • all the second electrodes E2 are short-circuited
  • all the third electrodes E3 are short-circuited.
  • the first electrode E1, the second electrode E2, and the third electrode E3 are insulated.
  • the plurality of substrates C include a substrate surface CS on which electrodeposition is performed. In FIG. 1, a cross section of the substrate C is illustrated, but each electrode of the substrate C may be formed in a plane such as a matrix on the substrate C, for example.
  • the second electrode E2 and the third electrode E3 are substrate electrodes in which a functional layer containing a functional material is not formed on the overlapping substrate surface CS.
  • the first electrode E1 is a substrate electrode on which a functional material is electrodeposited on the overlapping substrate surface CS to form a functional layer containing the functional material.
  • the surfaces of the first electrode E1, the second electrode E2, and the third electrode E3 may be exposed from the substrate surface CS.
  • the present invention is not limited to this, and in the present embodiment, the substrate C may have one or more layered members formed on the substrate surface CS.
  • the electrodeposition liquid L1 having a functional material to be electrodeposited on the substrate surface CS is stored in the electrodeposition liquid storage tank 8 in advance.
  • the functional material may be, for example, a light emitting material or a material included in a hole transport layer or an electron transport layer.
  • the electrodeposition liquid L1 stored in the electrodeposition liquid storage tank 8 may be stirred by rotating the stirrer 24.
  • the substrate C is held on one surface of the substrate holder 14 using the substrate holder 14.
  • the substrate holder 14 adsorbs the back surface opposite to the substrate surface CS side, so that the substrate surface CS side of the surface of the substrate C on which the electrodeposition is performed,
  • the substrate C is held so as to face the electrodeposition surface 6S.
  • the electrodeposition liquid L1 in the electrodeposition liquid storage tank 8 is sent out in the direction of arrow A1, and is supplied to the electrodeposition liquid supply port 20A via the connection pipe 22 and the electrodeposition liquid supply path 20 in order.
  • the electrodeposition liquid L1 overflowing from the electrodeposition liquid supply port 20A is stored on the electrodeposition surface 6S of the electrodeposition head 6.
  • the supply of the electrodeposition liquid L1 may be performed by sending out the electrodeposition liquid L1 by a pump (not shown) in the electrodeposition liquid storage tank 8.
  • the electrodeposition liquid L1 may be supplied to the electrodeposition liquid supply port 20A via the connection pipe 22 and the electrodeposition liquid supply path 20 by capillary action.
  • the electrodeposition liquid L1 stored on the electrodeposition surface 6S contacts the substrate surface CS of the substrate C facing the electrodeposition surface 6S. Therefore, a part of each electrode of the substrate C that overlaps with the substrate surface CS in contact with the electrodeposition liquid L1 faces the electrodeposition head electrode 18 via the electrodeposition liquid L1. Further, in the present embodiment, the area of the electrodeposition surface 6S is smaller than the area of the substrate surface CS, so that the area where the electrodeposition liquid L1 contacts the substrate surface CS is smaller than the area of the substrate surface CS. That is, the area of the electrodeposition head electrode surface 18S where the electrodeposition head electrode 18 is exposed from the electrodeposition surface 6S is smaller than the area of the substrate surface CS.
  • the first electric potential V1 is applied to the electrodeposition head electrode 18 under the control of the electrodeposition head side power supply 16.
  • the second potential V2 is applied to the second electrode E2 and the third electrode E3, which are the substrate electrodes on which the functional material is not electrodeposited on the overlapping substrate surface CS.
  • a third potential V3 is applied to the first electrode E1, which is a substrate electrode for electrodepositing a functional material on the overlapping substrate surface CS.
  • the absolute value of the difference between the first potential V1 and the third potential V3 is larger than the absolute value of the difference between the first potential V1 and the second potential V2. That is, in the present embodiment, V1, V2, and V3 satisfy the following expression (1).
  • the functional material contained in the electrodeposition liquid L1 has a functional group, and the functional group is positively or negatively charged.
  • the polarity at which the functional group of the functional material contained in the electrodeposition liquid L1 is charged is regarded as the polarity of the functional material.
  • the functional material contained in the electrodeposition liquid L1 migrates toward the first electrode E1 by Coulomb interaction due to an electric field generated between the electrodeposition head electrode 18 and the first electrode E1.
  • the voltage applied to each electrode is controlled.
  • FIG. 1 shows a case where the polarity of the functional material contained in the electrodeposition liquid L1 is negative. That is, a negative polarity voltage is applied to the electrodeposition head electrode 18, the second electrode E2, and the third electrode E3, and a positive polarity voltage is applied to the first electrode E1.
  • the polarity of the functional material contained in the electrodeposition liquid L1 is reversed, the polarity of the voltage applied to each electrode may be reversed. Note that V1 and V2 may have the same potential.
  • the functional material contained in the electrodeposition liquid L1 on the electrodeposition surface 6S does not migrate toward the second electrode E2 and the third electrode E3, but migrates only toward the first electrode E1. For this reason, the functional material contained in the electrodeposition liquid L1 on the electrodeposition surface 6S is adsorbed on the first electrode E1 that is in contact with the electrodeposition liquid L1. As a result, a layer containing the functional material contained in the electrodeposition liquid L1 is formed only at the position of the electrode included in the substrate C that overlaps with the first electrode E1.
  • the sweeping unit 12 sweeps at least one of the electrodeposition head 6 and the substrate holder 14 to relatively move the electrodeposition head 6 and the substrate holder 14. At this time, the electrodeposition head 6 and the substrate holder 14 are relatively moved while the distance between the electrodeposition head 6 and the substrate holder 14 is kept constant. In FIG. 1, for example, the substrate holder 14 is moved in the direction of arrow A2. The present invention is not limited to this, and the sweeping unit 12 may sweep the substrate holder 14 in the direction opposite to the arrow A2 or toward the back or front toward the paper surface of FIG.
  • the electrodeposition at the position overlapping the second electrode E2 may be performed.
  • the electrodeposition at the position overlapping the second electrode E2 is performed by changing the voltage applied to the second electrode E2 to V3 and changing the voltage applied to the first electrode E1 and the third electrode E3 to V2. 6 and the substrate holder 14 may be moved relative to each other.
  • the layer formed at the position overlapping with the second electrode E2 may include a different functional material from the layer formed at the position overlapping with the first electrode E1.
  • the electrodeposition liquid containing a functional material different from the functional material contained in the electrodeposition liquid L1 is stored in the electrodeposition liquid storage tank 8, and the electrodeposition liquid is supplied to the electrodeposition head 6, as described above. This can be performed by performing electrodeposition.
  • another functional layer may be formed on the substrate C by the same method as the electrodeposition method described above, and a laminate may be formed on the substrate C. Further, at least a part of the other functional layers may be formed by various conventionally known methods. As a result, a display device including the laminate on the substrate C can be manufactured.
  • the electrodeposition head 6 and the substrate holder 14 are relatively moved to perform electrodeposition of a layer containing a functional material on each electrode of the substrate C.
  • the area of the electrodeposition surface 6S of the electrodeposition head 6 is smaller than the area of the substrate surface CS of the substrate C.
  • the electrodeposition head 6S having the electrodeposition surface 6S having a smaller area and, consequently, the electrodeposition head electrode surface 18S having a smaller area, than performing electrodeposition using the opposite substrate having the same area as the substrate C. Can be used for electrodeposition. Therefore, downsizing of the electrodeposition head 6 can be realized, which contributes to downsizing of the entire display device manufacturing apparatus 2.
  • electrodeposition is performed in a state where only the electrodeposition liquid L1 on the electrodeposition surface 6S of the electrodeposition head 6 is in contact with the substrate C. This eliminates the need for an electrodeposition bath in which the entire substrate C is immersed, which further contributes to downsizing of the display device manufacturing apparatus 2.
  • the electrodeposition head electrode 18 is located in a direction facing the substrate C. Therefore, in the electrodeposition step, the first electrode E1 that is in contact with the electrodeposition liquid L1 and the electrodeposition head electrode 18 face each other via the electrodeposition liquid L1. As a result, the distance between the electrodeposition head electrode 18 and the first electrode E1 is closer, so that electrodeposition can be performed more efficiently. Specifically, in the electrodeposition step, electrodeposition can be performed at a lower voltage or with a smaller amount of the electrodeposition liquid.
  • the electrodeposition liquid storage tank 8 includes the stirrer 24. For this reason, the electrodeposition liquid L1 can be stirred in the electrodeposition liquid storage tank 8 until immediately before electrodeposition, so that a functional layer containing a functional material can be more uniformly formed by electrodeposition.
  • the functional material included in the electrodeposition liquid L1 may be, for example, nanoparticles having polarity.
  • the nanoparticles may be, for example, semiconductor nanoparticles having a core-shell structure, that is, quantum dots.
  • the display device manufacturing apparatus 2 can manufacture a display device including a light emitting layer including quantum dots as a functional layer.
  • Electrodeposition in the present specification includes an electrochemical film forming method of forming a thin film made of a material in a solution by generating a potential difference between two electrodes in the solution.
  • Electrodeposition herein may include, for example, techniques such as electrodeposition, electrodeposition coating, electrophoretic deposition, dielectrophoretic deposition, micellar electric field, electroplating, or electroforming. . Even when any one of these methods is selected as the above-described electrodeposition step, a method and an apparatus for manufacturing a display device having the above-described effects can be provided.
  • FIG. 3 is a schematic diagram illustrating an example of a method of performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
  • the controller 4, the electrodeposition liquid storage tank 8, the substrate-side power supply 10, and the sweep unit 12 may be omitted for simplification of the drawings referred to.
  • the controller 4, the electrodeposition liquid storage tank 8, the substrate-side power supply 10, and the sweeping unit 12 may have the same configuration and function as the previous embodiment.
  • the display device manufacturing apparatus 2 further includes a cleaning head 26.
  • the cleaning head 26 includes a cleaning liquid supply path 28.
  • the cleaning head 26 has a cleaning surface 26S on a surface facing the substrate holder 14.
  • a cleaning liquid supply port 28A which is an opening communicating with the cleaning liquid supply path 28, is formed in the cleaning surface 26S.
  • the cleaning liquid supply path 28 communicates with a cleaning liquid storage tank (not shown).
  • the cleaning liquid storage tank may have the same configuration as the electrodeposition liquid storage tank 8 except for the liquid stored inside, and may not include the stirrer 24 as compared with the electrodeposition liquid storage tank 8. .
  • the electrodeposition method using the display device manufacturing apparatus 2 according to the present embodiment may be the same as the electrodeposition method described in the previous embodiment, except for the matters described below.
  • the cleaning head 26 passes through the same position after the electrodeposition head 6 has passed.
  • the cleaning liquid LC in the cleaning liquid storage tank is sent out in the direction of arrow A2, and supplied to the cleaning liquid supply port 28A via the cleaning liquid supply path 28.
  • the cleaning liquid LC overflowing from the cleaning liquid supply port 28A is stored on the cleaning surface 26S of the cleaning head 26.
  • the supply of the cleaning liquid LC may be realized by the same principle as the supply of the electrodeposition liquid L1 to the electrodeposition head 6.
  • the cleaning liquid LC stored on the cleaning surface 26S comes into contact with the substrate surface CS of the substrate C facing the cleaning surface 26S. Therefore, the surface of the substrate C on which the electrodeposition has been performed is cleaned by the cleaning liquid LC.
  • the area of the cleaning surface 26S is smaller than the area of the substrate surface CS, the area where the cleaning liquid LC contacts the substrate surface CS is smaller than the area of the substrate surface CS.
  • the sweeping unit 12 moves the electrodeposition head 6, the cleaning head 26, or the substrate holder so that the substrate C passes through the electrodeposition head 6 and then passes through the cleaning head 26. 14 by sweeping at least one of them.
  • the substrate C on which electrodeposition has been completed can be quickly cleaned with the cleaning liquid LC before the electrodeposition liquid L1 adhered to the substrate C is dried. Thereby, contamination of the substrate C, which may be caused by drying the electrodeposition liquid L1 attached to the substrate C, can be reduced. Further, since it is not necessary to immerse the entire substrate C in a cleaning tank or the like for cleaning the substrate C, it contributes to downsizing of the entire apparatus.
  • FIG. 4 is a schematic diagram illustrating an example of a method of performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
  • the display device manufacturing apparatus 2 according to the present embodiment includes a first electrodeposition head 6A and a second electrodeposition head 6B as electrodeposition heads. Further, the display device manufacturing apparatus 2 according to the present embodiment includes a plurality of cleaning heads 26.
  • the present embodiment it is possible to individually apply a voltage to all of the first electrode E1, the second electrode E2, and the third electrode E3 by controlling the substrate-side power supply 10.
  • This configuration is realized by forming active elements such as TFTs for all of the first electrode E1, the second electrode E2, and the third electrode E3, and the substrate-side power supply 10 individually controlling the active elements. I do.
  • the display device manufacturing apparatus 2 according to the present embodiment has the same configuration as the display device manufacturing apparatus 2 according to the previous embodiment.
  • the first electrodeposition head 6A and the second electrodeposition head 6B have the same configuration as the electrodeposition head 6 in the previous embodiment.
  • the first electrodeposition head 6A and the second electrodeposition head 6B include an electrodeposition surface 6AS and an electrodeposition surface 6BS, respectively.
  • the electrodeposition liquid L1 is supplied to the first electrodeposition head 6A while the electrodeposition liquid L1 is supplied to the second electrodeposition head 6B.
  • An electrodeposition liquid L2 containing different functional materials is supplied.
  • the electrodeposition liquid L1 and the electrodeposition liquid L2 may be supplied from different electrodeposition liquid storage tanks.
  • the functional material included in the electrodeposition liquid L1 is electrodeposited at a position overlapping the first electrode E1 of the substrate C, and the functional material included in the electrodeposition liquid L2 is further Electrodeposition is performed at a position overlapping the two electrodes E2.
  • the electrodeposition liquid L1 supplied to the first electrodeposition head 6A when the electrodeposition liquid L1 supplied to the first electrodeposition head 6A is in contact with a position overlapping the first electrode E1 on the substrate C, V3 is applied to the first electrode E1 at.
  • V2 is applied to the second electrode E2 and the third electrode E3 around the position.
  • the layer containing the functional material contained in the electrodeposition liquid L1 is electrodeposited by the first electrodeposition head 6A only at the position overlapping the first electrode E1 of the substrate C.
  • the electrodeposition liquid L2 supplied to the second electrodeposition head 6B when the electrodeposition liquid L2 supplied to the second electrodeposition head 6B is in contact with a position overlapping the second electrode E2 of the substrate C, V3 is applied to the two electrodes E2. On the other hand, V2 is applied to the first electrode E1 and the third electrode E3 around the position.
  • the functional layer containing the functional material contained in the electrodeposition liquid L2 is electrodeposited by the second electrodeposition head 6B only at a position overlapping the second electrode E2 of the substrate C.
  • the sweeping unit 12 sweeps at least one of the first electrodeposition head 6A and the second electrodeposition head 6B, or the substrate holder 14.
  • the voltage applied to the first electrode E1, the second electrode E2, and the third electrode E3 is sequentially switched under the control of the substrate-side power supply 10.
  • a layer containing a different functional material is formed at a position overlapping each of the first electrode E1 and the second electrode E2.
  • a certain cleaning head 26 passes after the first electrodeposition head 6A passes, and another cleaning head 26 passes after the second electrodeposition head 6B passes. Therefore, between the electrodeposition of the first electrodeposition head 6A at the position overlapping the first electrode E1 and the electrodeposition of the second electrodeposition head 6B at the position overlapping the second electrode E2, the cleaning head is provided. The cleaning of the substrate C by 26 is performed. Also, after the electrodeposition by the second electrodeposition head 6B on the position overlapping the second electrode E2, the cleaning of the substrate C by the cleaning head 26 is performed.
  • the electrodeposition surface of each of the first electrodeposition head 6A and the second electrodeposition head 6B has a smaller area than the substrate surface CS of the substrate C. Contributes to downsizing. Further, while switching the voltage applied to each electrode of the substrate C, a functional layer containing a different functional material can be formed at a position overlapping each of the different electrodes by one sweep. For this reason, in this embodiment, it contributes to the reduction of the tact time in the electrodeposition process.
  • the electrodeposition of the first electrodeposition head 6A at the position overlapping the first electrode E1 and the electrodeposition of the second electrodeposition head 6B at the position overlapping the second electrode E2 are performed. Meanwhile, the cleaning of the substrate C by the cleaning head 26 is performed. For this reason, the contamination of the electrodeposition liquid between different electrodes is reduced, and the possibility that a functional layer containing a plurality of different functional materials is electrodeposited at a position overlapping a certain electrode can be reduced.
  • the functional material included in the electrodeposition liquid L1 may be a first light emitting material that emits light having the first wavelength
  • the functional material included in the electrodeposition liquid L2 may be the first material.
  • a second light-emitting material that emits light having a second wavelength different from the wavelength may be used.
  • each light-emitting layer including a plurality of light-emitting materials that emit light of different colors can be formed at positions overlapping with different electrodes. Therefore, the light emitting layer of the display device can be individually formed for each pixel by using the display device manufacturing apparatus 2 according to the present embodiment.
  • the apparatus for manufacturing a display device is further supplied with an electrodeposition liquid L3 containing a functional material different from the functional material contained in each of the electrodeposition liquid L1 and the electrodeposition liquid L2.
  • a head 6C may be further provided.
  • the cleaning head 26 is disposed between the electrodeposition of the second electrodeposition head 6B at the position overlapping the second electrode E2 and the electrodeposition of the third electrodeposition head 6C at the position overlapping the third electrode E3. Cleaning of the substrate C may be performed.
  • FIG. 5 is a schematic diagram illustrating an example of a method for performing electrodeposition on the substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
  • the display device manufacturing apparatus 2 according to the present embodiment includes a display according to the first embodiment, except that the display device manufacturing apparatus 2 further includes a first additive storage tank 30A and a second additive storage tank 30B. It has the same configuration as the device manufacturing apparatus 2.
  • the first additive storage tank 30A and the second additive storage tank 30B communicate with the electrodeposition liquid supply passage 20 of the electrodeposition head 6 via the connection pipe 32 and the connection pipe 22.
  • the electrodeposition liquid L3 containing no additive is stored in the electrodeposition liquid storage tank 8. That is, the electrodeposition liquid storage tank 8 functions as a functional material storage tank that stores the electrodeposition liquid L3 containing the functional material. Further, different additives L4 and L5 are stored in the first additive storage tank 30A and the second additive storage tank 30B, respectively. By adding the additive L4 and the additive L5 to the electrodeposition liquid L3, an electrodeposition liquid L1 used for electrodeposition by the electrodeposition head 6 is obtained.
  • the electrodeposition liquid L3 is supplied to the electrodeposition head 6.
  • the additive L4 and the additive L5 are connected from the first additive storage tank 30A and the second additive storage tank 30B, respectively. It is supplied to the connection pipe 22 via the pipe 32.
  • the electrodeposition liquid L3 is added with the additive L4 and the additive L5 in the connection pipe 22, and is supplied to the electrodeposition liquid supply path 20 of the electrodeposition head 6 as the electrodeposition liquid L1.
  • the supply of the additive L4 and the additive L5 to the connection pipe 22 may be realized by sending out the additive by a pump provided in each of the first additive storage tank 30A and the second additive storage tank 30B. .
  • the supply of the additive L4 and the additive L5 to the connection pipe 22 is performed by adding the additive L4 and the additive L5 from the connection pipe 32 toward the connection pipe 22 by the Bernoulli effect caused by the flow of the electrodeposition liquid L3 through the connection pipe 22. It may be realized by attracting the agent L4 and the additive L5.
  • At least one of the additive L4 and the additive L5 may be an antioxidant for a functional material included in the electrodeposition liquid L3, or a diluent of the electrodeposition liquid L3, including a solvent or the like of the electrodeposition liquid L3. It may be.
  • the electrodeposition on the substrate C using the electrodeposition head 6 in the present embodiment may be performed by the same method as the electrodeposition in the embodiments described above.
  • This embodiment also has the effect of reducing the size of the electrodeposition device described above.
  • the additive L4 and the additive L5 are added to the electrodeposition liquid L3 immediately before the electrodeposition is performed. Therefore, the electrodeposition liquid L3 is stored in the electrodeposition liquid storage tank 8. There is no need to mix additive L4 and additive L5. For this reason, the additive which may deteriorate the functional material contained in the electrodeposition liquid L3 due to being in a state of being mixed with the electrodeposition liquid L3 for a long time can be mixed immediately before the electrodeposition. Therefore, the yield of the electrodeposition step of the functional layer is improved, or the degree of freedom in selecting an additive is improved.
  • different additives can be supplied to the electrodeposition liquid L3 from the plurality of additive storage tanks. Therefore, a plurality of additives, at least one of which may deteriorate due to being mixed with each other for a long time, can be mixed immediately before electrodeposition. Therefore, the yield in the electrodeposition step of the functional layer is improved, or the degree of freedom in selecting an additive is improved.
  • a single additive storage tank may be used, and a single additive may be added to the electrodeposition liquid L3.
  • FIG. 6 is a schematic diagram illustrating an example of a method of performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
  • the display device manufacturing apparatus 2 according to the present embodiment includes an additive storage tank 30 and a functional material storage tank 34, except that the display device manufacturing apparatus 2 according to the present embodiment further includes an additive storage tank 30 and a functional material storage tank 34. 2 has the same configuration.
  • the additive storage tank 30 communicates with the electrodeposition liquid storage tank 8 through the connection pipe 32, and the functional material storage tank 34 similarly stores the electrodeposition liquid storage tank through the connection pipe 36. It communicates with the tank 8.
  • the additive L4 is stored in the additive storage tank 30.
  • the functional material storage tank 34 stores an electrodeposition liquid L3 containing no additive. Further, the additive L4 in the additive storage tank 30 and the electrodeposition liquid L3 in the functional material storage tank 34 are supplied to the electrodeposition liquid storage tank 8. The supply of the additive L4 and the electrodeposition liquid L3 is performed by a pump (not shown) provided in each of the additive storage tank 30 and the functional material storage tank 34 sending out the additive L4 and the electrodeposition liquid L3. You may.
  • the additive L4 supplied from the additive storage tank 30 via the connection pipe 32 and the electrodeposition liquid L3 supplied from the functional material storage tank 34 via the connection pipe 36 are electrodeposited.
  • the electrodeposition liquid L1 is formed in the electrodeposition liquid storage tank 8.
  • the mixing of the electrodeposition liquid L3 and the additive L4 may be performed by stirring both liquids with the stirrer 24 in the electrodeposition liquid storage tank 8. That is, the electrodeposition liquid storage tank 8 has a function as a mixing tank for mixing the electrodeposition liquid L3 and the additive L4.
  • the electrodeposition on the substrate C may be performed by the same method as described above.
  • the display device manufacturing apparatus 2 may include, in addition to the additive storage tank 30, another additive storage tank that stores an additive different from the additive L4.
  • the electrodeposition liquid L3 and the additive L4 are mixed in the electrodeposition liquid storage tank 8, which is a mixing tank. Therefore, since the electrodeposition liquid L3 and the additive L4 can be mixed more uniformly, a more uniform layer can be formed by electrodeposition.
  • FIG. 7 is a schematic diagram illustrating an example of a method for performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
  • the display device manufacturing apparatus 2 according to the present embodiment has the same configuration as the display device manufacturing apparatus 2 according to the first embodiment except that the display device manufacturing apparatus 2 further includes a collection tank 38.
  • the recovery tank 38 is a tank for collecting the electrodeposition liquid that has reached the edge of the substrate C after coming into contact with the substrate C in the electrodeposition step and then traveling along the substrate surface CS.
  • the recovery tank 38 has an opening at a position overlapping the end of the substrate C.
  • the collection tank 38 communicates with the electrodeposition liquid storage tank 8 via the connection pipe 40.
  • the collection tank 38 includes a concentration detection unit 42 inside.
  • the concentration detecting section 42 detects the concentration of the functional material contained in the liquid in the collection tank 38.
  • the electrodeposition liquid storage tank 8 further includes a concentration detection unit 42, and the concentration detection unit 42 includes a functional material contained in the liquid in the electrodeposition liquid storage tank 8. May be detected.
  • the electrodeposition step in this embodiment is performed by the same method as the electrodeposition step described above.
  • the electrodeposition liquid L6 having a reduced concentration of the functional material adheres to the substrate surface CS because the functional layer containing the functional material is formed on the substrate C in contact with the substrate C. .
  • At least a part of the electrodeposition liquid L ⁇ b> 6 travels along the substrate surface CS and reaches an end overlapping the collection tank 38 of the substrate C.
  • the electrodeposition liquid L6 In order to make it easier for the electrodeposition liquid L6 to reach the end of the substrate C that overlaps with the collecting tank 38, as shown in FIG.
  • the substrate C is inclined such that the portion is lower than the other end.
  • the electrodeposition liquid L6 attached to the substrate surface CS flows toward the end overlapping the collection tank 38 of the substrate C according to gravity.
  • the electrodeposition liquid L6 that has reached the end of the substrate C that overlaps the collection tank 38 is dropped by gravity and falls into the collection tank 38 through the opening of the collection tank 38. As described above, the electrodeposition liquid L6 having a reduced concentration of the functional material is recovered in the recovery tank 38.
  • the electrodeposition liquid L6 recovered in the recovery tank 38 is supplied to the electrodeposition liquid storage tank 8 via the connection pipe 40.
  • the supply of the electrodeposition liquid L6 may be performed by a pump (not shown) provided in the recovery tank 38 sending out the electrodeposition liquid L6.
  • the electrodeposition liquid L3, the additive L4, and the electrodeposition liquid L6 are mixed in the electrodeposition liquid storage tank 8, and become the electrodeposition liquid L1.
  • the electrodeposition liquid L3 has a higher concentration of the functional material than the electrodeposition liquid L1.
  • the concentration detector 42 of the recovery tank 38 detects the concentration of the functional material of the electrodeposition liquid L6 in the recovery tank 38.
  • the amount of L3 supplied from the functional material storage tank 34 to the electrodeposition liquid storage tank 8 is determined from the difference between the concentration of the functional material of the electrodeposition liquid L6 and the desired concentration of the functional material of the electrodeposition liquid L1. May be determined.
  • the concentration detector 42 in the collection tank 38 connects the collection tank 38 to the connection pipe 40. It is desirable to be installed near the part.
  • the concentration detecting section 42 of the electrodeposition liquid storage tank 8 detects the concentration of the functional material of the electrodeposition liquid L1 in the electrodeposition liquid storage tank 8. In the present embodiment, whether or not the concentration of the functional material of the electrodeposition liquid L1 is maintained may be monitored. From the viewpoint of more accurately detecting the concentration of the functional material of the electrodeposition liquid L1 immediately before being supplied to the electrodeposition head 6, the concentration detector 42 in the electrodeposition liquid storage tank 8 is connected to the electrodeposition liquid storage tank 8. It is desirable to be installed near the connection with the pipe 22.
  • the electrodeposition liquid L6 in which the concentration of the functional material is reduced by contacting the substrate C and performing the electrodeposition is collected and mixed with another electrodeposition liquid.
  • the electrodeposition liquid L6 is reused. For this reason, since the total amount of the electrodeposition liquid to be used can be reduced, the manufacturing cost of the display device can be reduced.
  • the electrodeposition liquid L6 having a reduced concentration of the functional material is collected from the edge of the substrate C through the surface of the substrate C. For this reason, a mechanism for collecting the electrodeposition liquid L6 can be constituted only by the collection tank 38. Therefore, it contributes to simplification and miniaturization of the display device manufacturing apparatus 2.
  • FIG. 8 is a schematic diagram illustrating an example of a method for performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
  • the electrodeposition head 6 is disposed on the side opposite to the electrodeposition liquid supply path 20 via the electrodeposition head electrode 18 and the electrodeposition liquid recovery path. 44.
  • An electrodeposition liquid recovery port 44A which is an opening communicating with the electrodeposition liquid recovery path 44, is formed on the electrodeposition surface 6S on the side opposite to the electrodeposition liquid supply port 20A via the electrodeposition head electrode surface 18S. Have been. Further, the electrodeposition liquid storage tank 8 and the electrodeposition liquid recovery path 44 are connected via a connection pipe 46.
  • the display device manufacturing apparatus 2 according to the present embodiment has the same configuration as the display device manufacturing apparatus 2 according to the fifth embodiment.
  • the electrodeposition step in this embodiment is performed by the same method as the electrodeposition step described above.
  • the electrodeposition liquid on the electrodeposition surface 6S flows in the direction of arrow A6 shown in FIG. 8, that is, from the electrodeposition liquid supply port 20A to the electrodeposition liquid recovery port 44A. Flows towards.
  • the functional material in the electrodeposition liquid on the electrodeposition surface 6S in contact with the substrate C is the first material of the substrate C. Electrodeposition is performed at a position overlapping with the electrode E1.
  • the concentration of the functional material in the electrodeposition liquid on the electrodeposition surface 6S decreases.
  • the electrodeposition liquid L1 supplied from the electrodeposition liquid supply port 20A has changed to the electrodeposition liquid L6 in which the concentration of the functional material has decreased at the electrodeposition liquid recovery port 44A.
  • the electrodeposition liquid L6 that has reached the electrodeposition liquid recovery port 44A flows in the electrodeposition liquid recovery path 44 in the direction of arrow A7 shown in FIG. For this reason, the electrodeposition liquid L6 is supplied to the electrodeposition liquid storage tank 8 from the electrodeposition liquid recovery port 44A via the electrodeposition liquid recovery path 44 and the connection pipe 46. Thereby, similarly to the previous embodiment, the electrodeposition liquid L3, the additive L4, and the electrodeposition liquid L6 are mixed in the electrodeposition liquid storage tank 8, and become the electrodeposition liquid L1.
  • a pump for supplying the electrodeposition liquid L1 from the electrodeposition liquid storage tank 8 transfers the electrodeposition liquid L6 from the electrodeposition liquid recovery path 44. It may be realized by drawing into the liquid storage tank 8. Further, similarly to the previous embodiment, the electrodeposition liquid storage tank 8 may be provided with a concentration detection unit 42 to monitor the concentration of the electrodeposition liquid L1 in the electrodeposition liquid storage tank 8.
  • the electrodeposition liquid flows from the electrodeposition liquid supply port 20A to the electrodeposition liquid recovery port 44A, the electrodeposition liquid always exists on the electrodeposition surface 6S. Therefore, the above-described electrodeposition step can be performed efficiently, and the electrodeposition liquid L6 can be more reliably recovered as compared with the previous embodiment.
  • the display device manufactured by the method for manufacturing a display device according to each of the above-described embodiments may include a display panel having a flexible and bendable display element.
  • the display elements include a display element whose luminance and transmittance are controlled by a current, and a display element whose luminance and transmittance are controlled by a voltage.
  • the display device may include an OLED (Organic Light Emitting Diode) as a current control display element.
  • the display device according to the present embodiment may be an organic EL (Electro Luminescence) display.
  • the display device may include an inorganic light emitting diode as a current control display element.
  • the display device may be a QLED display including an EL display QLED (Quantum dot Light Emitting Diode) such as an inorganic EL display.
  • QLED Quantum dot Light Emitting Diode
  • a display element for voltage control there is a liquid crystal display element or the like.
  • Electrodeposition head 6A First electrodeposition head 6B Second electrodeposition head 6S, 6AS, 6BS Electrodeposition surface 8 Electrodeposition liquid storage tank 12 Sweep unit 18 Electrodeposition head electrode 18S Electrodeposition head electrode surface (Electrode surface) 20A Electrodeposition liquid supply port 24 Stirrer 26 Cleaning head 28A Cleaning liquid supply port 30 Additive storage tank 30A First additive storage tank 30B Second additive storage tank 34 Functional material storage tank 38 Recovery tank 42 Concentration detector 44A Electrodeposition liquid Collection port C Substrate CS Substrate surface E1 First electrode E2 Second electrode E3 Third electrode L1, L2, L3, L6 Electrodeposition liquid L4, L5 Additive LC Cleaning liquid V1 First potential V2 Second potential V3 Third potential

Abstract

This method for manufacturing a display device comprises: a sweeping step; a contacting step; and an electrodeposition step. In the sweeping step, at least one of an electrodeposition head (6) and a substrate (C) relatively moves. In the contacting step, an electrodeposition liquid (L1) containing a functional material supplied from an electrodeposition supply port (20A) contacts the surface of the substrate in an area smaller than the area of the substrate. In the electrodeposition step, a first potential is applied to the electrodeposition head electrode. Among at least substrate electrodes (E1, E2, E3) that are in contact with the electrodeposition liquid, a second potential is applied to the substrate electrodes (E2, E3) that do not electrodeposit the functional material, and a third potential is applied to the substrate electrode (E1) that electrodeposits the functional material. An absolute value of a difference between the first potential and the third potential is larger than an absolute value of a difference between the first potential and the second potential.

Description

表示デバイスの製造方法、表示デバイスの製造装置Display device manufacturing method and display device manufacturing apparatus
　本発明は、表示デバイスの機能層を電着により形成する、表示デバイスの製造方法および表示デバイスの製造装置に関する。 The present invention relates to a display device manufacturing method and a display device manufacturing apparatus which form a functional layer of a display device by electrodeposition.
　特許文献１には、有機発光素子の製造において、有機発光層を電着法によって形成する方法が開示されている。 Patent Document 1 discloses a method of forming an organic light emitting layer by an electrodeposition method in manufacturing an organic light emitting device.
日本国再公表特許公報「国際公開番号ＷＯ２００５／０１３６４５」Japanese republished patent gazette "International publication number WO2005 / 013645"
　特許文献１に記載の技術においては、上記電着法のために、別途白金電極等の対向電極、および電着槽が必要であり、電着装置が長大となる傾向がある。 (4) In the technique described in Patent Literature 1, a counter electrode such as a platinum electrode and an electrodeposition tank are separately required for the electrodeposition method, and the electrodeposition apparatus tends to be long.
　上記課題を解決するために、本発明の表示デバイスの製造方法は、電着液供給口と電着ヘッド電極とを備えた、基板よりも面積が小さい電極表面を有する電着ヘッドを用いて、前記基板に形成された基板電極に対する電着を行う表示デバイスの製造方法であって、前記電着ヘッドおよび前記基板の少なくとも一方を相対移動させる掃引工程と、前記電着液供給口から供給された機能材料を含む電着液を、前記基板の面積より小さい面積において前記基板の表面に接触させる接触工程と、前記電着ヘッド電極に第１の電位を印加し、少なくとも前記電着液に接触している前記基板電極のうち、前記機能材料を電着しない基板電極に第２の電位を印加し、機能材料を電着する基板電極に第３の電位を印加する電着工程とを備え、前記第１の電位と前記第３の電位との差の絶対値が、前記第１の電位と前記第２の電位との差の絶対値よりも大きい。 In order to solve the above problems, the method for manufacturing a display device of the present invention includes an electrodeposition liquid supply port and an electrodeposition head electrode, using an electrodeposition head having an electrode surface smaller in area than the substrate, A method for manufacturing a display device for performing electrodeposition on a substrate electrode formed on the substrate, comprising: a sweeping step of relatively moving at least one of the electrodeposition head and the substrate; A contacting step of contacting the electrodeposition liquid containing the functional material with the surface of the substrate in an area smaller than the area of the substrate, applying a first potential to the electrodeposition head electrode, and contacting at least the electrodeposition liquid; An electrodeposition step of applying a second potential to a substrate electrode on which the functional material is not electrodeposited, and applying a third potential to a substrate electrode on which the functional material is electrodeposited, First potential Absolute value of the difference between the third potential is larger than the absolute value of the difference between the second potential and the first potential.
　また、上記課題を解決するために、本発明の表示デバイスの製造装置は、基板に形成された基板電極に対する電着を行う表示デバイスの製造装置であって、電着液供給口と電着ヘッド電極とを備え、前記基板よりも面積が小さい電極表面を有する電着ヘッドと、前記電着ヘッドおよび前記基板の少なくとも一方を相対移動させる掃引部とを備え、前記電着液供給口から供給された機能材料を含む電着液を、前記基板の面積より小さい面積において前記基板の表面に接触させ、前記電着ヘッド電極に第１の電位を印加し、少なくとも前記電着液に接触している前記基板電極のうち、前記機能材料を電着しない基板電極に第２の電位を印加し、機能材料を電着する基板電極に第３の電位を印加し、前記第１の電位と前記第３の電位との差の絶対値が、前記第１の電位と前記第２の電位との差の絶対値よりも大きい。 According to another aspect of the present invention, there is provided a display device manufacturing apparatus for performing electrodeposition on a substrate electrode formed on a substrate, comprising: an electrodeposition liquid supply port and an electrodeposition head. An electrodeposition head having an electrode surface having an area smaller than that of the substrate, and a sweeper for relatively moving at least one of the electrodeposition head and the substrate, and supplied from the electrodeposition liquid supply port. The electrodeposition liquid containing the functional material is brought into contact with the surface of the substrate in an area smaller than the area of the substrate, a first potential is applied to the electrodeposition head electrode, and at least the electrodeposition liquid is in contact with the electrodeposition liquid. Among the substrate electrodes, a second potential is applied to a substrate electrode on which the functional material is not electrodeposited, and a third potential is applied to a substrate electrode on which the functional material is electrodeposited, and the first potential and the third potential are applied. Absolute difference from the potential of But larger than the absolute value of the difference between the second potential and the first potential.
　上記構成により、表示デバイスの製造において、電着を実施するための装置の小型化を実現できる。 According to the above configuration, in manufacturing a display device, it is possible to reduce the size of an apparatus for performing electrodeposition.
本発明の実施形態１に係る表示デバイスの製造方法を説明するための概略図である。FIG. 4 is a schematic diagram for explaining the method for manufacturing the display device according to the first embodiment of the present invention. 本発明の実施形態１に係る表示デバイスの製造装置のブロック図である。1 is a block diagram of a display device manufacturing apparatus according to Embodiment 1 of the present invention. 本発明の実施形態２に係る表示デバイスの製造方法を説明するための概略図である。FIG. 9 is a schematic diagram for explaining the method for manufacturing the display device according to the second embodiment of the present invention. 本発明の実施形態３に係る表示デバイスの製造方法を説明するための概略図である。FIG. 7 is a schematic diagram for explaining a method for manufacturing a display device according to Embodiment 3 of the present invention. 本発明の実施形態４に係る表示デバイスの製造方法を説明するための概略図である。FIG. 14 is a schematic diagram for explaining the method for manufacturing the display device according to the fourth embodiment of the present invention. 本発明の実施形態５に係る表示デバイスの製造方法を説明するための概略図である。It is a schematic diagram for explaining the manufacturing method of the display device concerning Embodiment 5 of the present invention. 本発明の実施形態６に係る表示デバイスの製造方法を説明するための概略図である。It is a schematic diagram for explaining the manufacturing method of the display device concerning Embodiment 6 of the present invention. 本発明の実施形態７に係る表示デバイスの製造方法を説明するための概略図である。It is a schematic diagram for explaining the manufacturing method of the display device concerning Embodiment 7 of the present invention.
　〔実施形態１〕
　図２は、本実施形態に係る表示デバイスの製造装置２のブロック図である。なお、図２においては、後述する電着ヘッド６および電着液貯留槽８について、断面を示している。なお、電着ヘッド６と液体を貯留する貯留槽とに関しては、図１および図３以降の各図においても、断面を示している。 [Embodiment 1]
FIG. 2 is a block diagram of the display device manufacturing apparatus 2 according to the present embodiment. Note that FIG. 2 shows a cross section of an electrodeposition head 6 and an electrodeposition liquid storage tank 8 described later. The cross section of the electrodeposition head 6 and the storage tank for storing the liquid is shown in FIGS. 1 and 3 and thereafter.
　図２に示すように、表示デバイスの製造装置２は、コントローラ４と、電着ヘッド６と、電着液貯留槽８と、基板側電源１０と、掃引部１２と、基板保持具１４とを備える。コントローラ４は、電着ヘッド６と、電着液貯留槽８と、基板側電源１０と、掃引部１２と、基板保持具１４との動作を制御する。 As shown in FIG. 2, the display device manufacturing apparatus 2 includes a controller 4, an electrodeposition head 6, an electrodeposition liquid storage tank 8, a substrate-side power supply 10, a sweep unit 12, and a substrate holder 14. Prepare. The controller 4 controls the operations of the electrodeposition head 6, the electrodeposition liquid storage tank 8, the substrate-side power supply 10, the sweep unit 12, and the substrate holder 14.
　電着ヘッド６は、電着ヘッド側電源１６と、電着ヘッド電極１８と、電着液供給路２０とを備える。電着ヘッド６は、後述する基板保持具１４と対向する面に、電着面６Ｓを有する。電着ヘッド側電源１６は、電着ヘッド６に内蔵され、電着ヘッド電極１８に印加する電圧を制御する。電着ヘッド電極１８は、電着ヘッド６の電着面６Ｓから露出する電着ヘッド電極表面１８Ｓ（電極表面）を有する。電着面６Ｓには、電着液供給路２０と連通する開口である、電着液供給口２０Ａが形成されている。 The electrodeposition head 6 includes an electrodeposition head side power supply 16, an electrodeposition head electrode 18, and an electrodeposition liquid supply path 20. The electrodeposition head 6 has an electrodeposition surface 6S on a surface facing a substrate holder 14 described later. The electrodeposition head side power supply 16 is built in the electrodeposition head 6 and controls a voltage applied to the electrodeposition head electrode 18. The electrodeposition head electrode 18 has an electrodeposition head electrode surface 18S (electrode surface) exposed from the electrodeposition surface 6S of the electrodeposition head 6. An electrodeposition liquid supply port 20A, which is an opening communicating with the electrodeposition liquid supply path 20, is formed on the electrodeposition surface 6S.
　電着液貯留槽８は、接続管２２を介して、電着ヘッド６の電着液供給路２０と連通する。電着液貯留槽８は、電着液貯留槽８内部の液体を撹拌する攪拌機２４を備える。 The electrodeposition liquid storage tank 8 communicates with the electrodeposition liquid supply path 20 of the electrodeposition head 6 via the connection pipe 22. The electrodeposition liquid storage tank 8 includes a stirrer 24 that stirs the liquid inside the electrodeposition liquid storage tank 8.
　電極側電源１０は、後述する基板保持具１４に保持された基板の各電極に対し、電圧を印加するための電源である。 The electrode-side power supply 10 is a power supply for applying a voltage to each electrode of the substrate held by the substrate holder 14 described later.
　掃引部１２は、電着ヘッド６および後述する基板保持具１４の少なくとも一方を掃引し、電着ヘッド６と基板保持具１４に保持された基板とを相対移動させる。 The sweep unit 12 sweeps at least one of the electrodeposition head 6 and a substrate holder 14 described later, and relatively moves the electrodeposition head 6 and the substrate held by the substrate holder 14.
　基板保持具１４は、電着ヘッド６と対向する面に、後述する基板を保持する。基板保持具１４は、例えば、真空チャックであってもよい。 The substrate holder 14 holds a substrate to be described later on a surface facing the electrodeposition head 6. The substrate holder 14 may be, for example, a vacuum chuck.
　図１は、本実施形態に係る表示デバイスの製造装置２を使用して、基板Ｃに対し電着を実施する方法の一例を示す概略図である。 FIG. 1 is a schematic diagram showing an example of a method for performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment.
　本実施形態においては、基板Ｃは、基板電極として、第１電極Ｅ１、第２電極Ｅ２、および第３電極Ｅ３をそれぞれ複数備える。また、本実施形態においては、全ての第１電極Ｅ１同士が短絡し、全ての第２電極Ｅ２同士が短絡し、全ての第３電極Ｅ３同士が短絡している。なお、第１電極Ｅ１と、第２電極Ｅ２と、第３電極Ｅ３との間は絶縁されている。さらに、複数の基板Ｃは、電着を行う面である基板表面ＣＳを備えている。図１においては、基板Ｃのある断面について図示を行っているが、基板Ｃの各電極は、基板Ｃに対し、例えば、マトリクス状等、平面的に形成されていてもよい。 In the present embodiment, the substrate C includes a plurality of first electrodes E1, second electrodes E2, and third electrodes E3 as substrate electrodes. In this embodiment, all the first electrodes E1 are short-circuited, all the second electrodes E2 are short-circuited, and all the third electrodes E3 are short-circuited. The first electrode E1, the second electrode E2, and the third electrode E3 are insulated. Further, the plurality of substrates C include a substrate surface CS on which electrodeposition is performed. In FIG. 1, a cross section of the substrate C is illustrated, but each electrode of the substrate C may be formed in a plane such as a matrix on the substrate C, for example.
　本実施形態においては、基板Ｃに対し、機能材料を含む機能層を、電着によって形成する方法を説明する。本実施形態においては、第２電極Ｅ２と第３電極Ｅ３とを、重畳する基板表面ＣＳに機能材料を含む機能層を形成しない基板電極とする。また、本実施形態においては、第１電極Ｅ１を、重畳する基板表面ＣＳに機能材料を電着し、当該機能材料を含む機能層を形成する基板電極とする。 In this embodiment, a method for forming a functional layer containing a functional material on the substrate C by electrodeposition will be described. In the present embodiment, the second electrode E2 and the third electrode E3 are substrate electrodes in which a functional layer containing a functional material is not formed on the overlapping substrate surface CS. In the present embodiment, the first electrode E1 is a substrate electrode on which a functional material is electrodeposited on the overlapping substrate surface CS to form a functional layer containing the functional material.
　本実施形態においては、基板表面ＣＳから、第１電極Ｅ１、第２電極Ｅ２、および第３電極Ｅ３の表面が露出していてもよい。しかしながら、これに限られず、本実施形態においては、基板Ｃには、基板表面ＣＳ上に一層以上の層状部材が形成されていてもよい。 In the present embodiment, the surfaces of the first electrode E1, the second electrode E2, and the third electrode E3 may be exposed from the substrate surface CS. However, the present invention is not limited to this, and in the present embodiment, the substrate C may have one or more layered members formed on the substrate surface CS.
　また、本実施形態においては、基板表面ＣＳに対し電着される機能材料を備えた電着液Ｌ１が、あらかじめ電着液貯留槽８内に貯留されている。機能材料は、例えば、発光材料、あるいは、正孔輸送層または電子輸送層に含まれる材料であってもよい。本実施形態の電着工程の間、電着液貯留槽８内に貯留する電着液Ｌ１は、攪拌機２４が回転することにより撹拌されていてもよい。 In the present embodiment, the electrodeposition liquid L1 having a functional material to be electrodeposited on the substrate surface CS is stored in the electrodeposition liquid storage tank 8 in advance. The functional material may be, for example, a light emitting material or a material included in a hole transport layer or an electron transport layer. During the electrodeposition step of the present embodiment, the electrodeposition liquid L1 stored in the electrodeposition liquid storage tank 8 may be stirred by rotating the stirrer 24.
　本実施形態に係る表示デバイスの製造方法においては、はじめに、基板保持具１４を用いて、基板保持具１４の一面に基板Ｃを保持させる。この際、基板保持具１４は、基板表面ＣＳ側とは反対側の裏面を吸着する等して、基板Ｃの表面のうち、電着を行う面である基板表面ＣＳ側が、電着ヘッド６の電着面６Ｓと対向するように、基板Ｃを保持する。 In the method for manufacturing a display device according to the present embodiment, first, the substrate C is held on one surface of the substrate holder 14 using the substrate holder 14. At this time, the substrate holder 14 adsorbs the back surface opposite to the substrate surface CS side, so that the substrate surface CS side of the surface of the substrate C on which the electrodeposition is performed, The substrate C is held so as to face the electrodeposition surface 6S.
　次いで、電着液貯留槽８内の電着液Ｌ１を、矢印Ａ１の方向に送り出し、接続管２２および電着液供給路２０を順に介し、電着液供給口２０Ａに供給する。電着液供給口２０Ａからあふれた電着液Ｌ１は、電着ヘッド６の電着面６Ｓ上に貯留する。 Next, the electrodeposition liquid L1 in the electrodeposition liquid storage tank 8 is sent out in the direction of arrow A1, and is supplied to the electrodeposition liquid supply port 20A via the connection pipe 22 and the electrodeposition liquid supply path 20 in order. The electrodeposition liquid L1 overflowing from the electrodeposition liquid supply port 20A is stored on the electrodeposition surface 6S of the electrodeposition head 6.
　なお、電着液Ｌ１の供給は、電着液貯留槽８内の図示しないポンプによって、電着液Ｌ１を送り出すことにより実施されてもよい。このほかにも、電着液Ｌ１の供給は、毛管現象によって、電着液Ｌ１が、接続管２２および電着液供給路２０を介して、電着液供給口２０Ａに供給されてもよい。 The supply of the electrodeposition liquid L1 may be performed by sending out the electrodeposition liquid L1 by a pump (not shown) in the electrodeposition liquid storage tank 8. In addition, the electrodeposition liquid L1 may be supplied to the electrodeposition liquid supply port 20A via the connection pipe 22 and the electrodeposition liquid supply path 20 by capillary action.
　ここで、図１に示すように、電着面６Ｓ上に貯留した電着液Ｌ１は、電着面６Ｓと対向する基板Ｃの基板表面ＣＳと接触する。このため、電着液Ｌ１に接触している基板表面ＣＳと重畳する基板Ｃの各電極の一部が、電着ヘッド電極１８と電着液Ｌ１を介して対向する。また、本実施形態においては、電着面６Ｓの面積は、基板表面ＣＳの面積よりも小さいため、電着液Ｌ１が基板表面ＣＳと接触する面積は、基板表面ＣＳの面積よりも小さい。すなわち、電着ヘッド電極１８が電着面６Ｓから露出する、電着ヘッド電極表面１８Ｓの面積は、基板表面ＣＳの面積よりも小さい。 Here, as shown in FIG. 1, the electrodeposition liquid L1 stored on the electrodeposition surface 6S contacts the substrate surface CS of the substrate C facing the electrodeposition surface 6S. Therefore, a part of each electrode of the substrate C that overlaps with the substrate surface CS in contact with the electrodeposition liquid L1 faces the electrodeposition head electrode 18 via the electrodeposition liquid L1. Further, in the present embodiment, the area of the electrodeposition surface 6S is smaller than the area of the substrate surface CS, so that the area where the electrodeposition liquid L1 contacts the substrate surface CS is smaller than the area of the substrate surface CS. That is, the area of the electrodeposition head electrode surface 18S where the electrodeposition head electrode 18 is exposed from the electrodeposition surface 6S is smaller than the area of the substrate surface CS.
　次いで、電着ヘッド側電源１６の制御により、電着ヘッド電極１８に第１の電位Ｖ１が印加される。これと同様に、基板側電源１０の制御により、重畳する基板表面ＣＳに機能材料を電着しない基板電極である、第２電極Ｅ２と第３電極Ｅ３とに、第２の電位Ｖ２が印加される。さらに、基板側電源１０の制御により、重畳する基板表面ＣＳに機能材料を電着する基板電極である、第１電極Ｅ１に、第３の電位Ｖ３が印加される。 Next, the first electric potential V1 is applied to the electrodeposition head electrode 18 under the control of the electrodeposition head side power supply 16. Similarly, under the control of the substrate-side power supply 10, the second potential V2 is applied to the second electrode E2 and the third electrode E3, which are the substrate electrodes on which the functional material is not electrodeposited on the overlapping substrate surface CS. You. Further, under the control of the substrate-side power supply 10, a third potential V3 is applied to the first electrode E1, which is a substrate electrode for electrodepositing a functional material on the overlapping substrate surface CS.
　ここで、全ての第１電極Ｅ１は短絡しているため、１つの第１電極Ｅ１に対し基板側電源１０から電圧を印加することにより、全ての第１電極Ｅ１に対する電圧印加が可能である。このことは、第２電極Ｅ２および第３電極Ｅ３においても同様である。 Here, since all the first electrodes E1 are short-circuited, it is possible to apply a voltage to all the first electrodes E1 by applying a voltage from the substrate-side power supply 10 to one of the first electrodes E1. This is the same for the second electrode E2 and the third electrode E3.
　ここで、本実施形態においては、第１の電位Ｖ１と第３の電位Ｖ３との差の絶対値は、第１の電位Ｖ１と第２の電位Ｖ２との差の絶対値よりも大きい。すなわち、本実施形態においては、Ｖ１、Ｖ２、およびＶ３が、下記式（１）を満たす。
｜Ｖ１－Ｖ３｜＞｜Ｖ１－Ｖ２｜・・・式（１）
　ここで、電着液Ｌ１に含まれる機能材料は官能基を有し、当該官能基は正または負の何れかに帯電している。本実施形態においては、電着液Ｌ１に含まれる機能材料の官能基が帯電している極性を、当該機能材料の極性とみなす。 Here, in the present embodiment, the absolute value of the difference between the first potential V1 and the third potential V3 is larger than the absolute value of the difference between the first potential V1 and the second potential V2. That is, in the present embodiment, V1, V2, and V3 satisfy the following expression (1).
| V1-V3 |> | V1-V2 | (1)
Here, the functional material contained in the electrodeposition liquid L1 has a functional group, and the functional group is positively or negatively charged. In the present embodiment, the polarity at which the functional group of the functional material contained in the electrodeposition liquid L1 is charged is regarded as the polarity of the functional material.
　この状態において、上述した電圧印加を実行すると、電着ヘッド電極１８と第１電極Ｅ１、第２電極Ｅ２、および第３電極Ｅ３との間に、それぞれ電界が発生する。この際、上述した式（１）より、電着ヘッド電極１８と第１電極Ｅ１との間に生じる電界は、電着ヘッド電極１８と第２電極Ｅ２、および第３電極Ｅ３との間に生じる電界よりも大きい。 In this state, when the above-described voltage application is performed, an electric field is generated between the electrodeposition head electrode 18 and each of the first electrode E1, the second electrode E2, and the third electrode E3. At this time, from the above-described formula (1), the electric field generated between the electrodeposition head electrode 18 and the first electrode E1 is generated between the electrodeposition head electrode 18 and the second electrode E2, and between the electrodeposition head electrode 18 and the third electrode E3. Larger than the electric field.
　さらに、本実施形態においては、電着ヘッド電極１８と第１電極Ｅ１との間に生じる電界によって、電着液Ｌ１に含まれる機能材料が、クーロン相互作用により、第１電極Ｅ１に向かって泳動するように、各電極に印加される電圧が制御される。 Further, in the present embodiment, the functional material contained in the electrodeposition liquid L1 migrates toward the first electrode E1 by Coulomb interaction due to an electric field generated between the electrodeposition head electrode 18 and the first electrode E1. Thus, the voltage applied to each electrode is controlled.
　図１においては、電着液Ｌ１に含まれる機能材料が有する極性が、負極性である場合を記載している。すなわち、電着ヘッド電極１８、第２電極Ｅ２、および第３電極Ｅ３には負の極性の電圧を印加し、第１電極Ｅ１には正の極性の電圧を印加している。なお、電着液Ｌ１に含まれる機能材料が有する極性が逆転した場合、各電極に印加する電圧の極性についても逆転させればよい。なお、Ｖ１とＶ２とは、同電位としてもよい。 FIG. 1 shows a case where the polarity of the functional material contained in the electrodeposition liquid L1 is negative. That is, a negative polarity voltage is applied to the electrodeposition head electrode 18, the second electrode E2, and the third electrode E3, and a positive polarity voltage is applied to the first electrode E1. When the polarity of the functional material contained in the electrodeposition liquid L1 is reversed, the polarity of the voltage applied to each electrode may be reversed. Note that V1 and V2 may have the same potential.
　ゆえに、電着面６Ｓ上の電着液Ｌ１に含まれる機能材料は、第２電極Ｅ２、および第３電極Ｅ３に向かっては泳動せず、第１電極Ｅ１のみに向かって泳動する。このため、電着面６Ｓ上の電着液Ｌ１に含まれる機能材料は、電着液Ｌ１と接触している第１電極Ｅ１に吸着される。これにより、基板Ｃが備える電極のうち、第１電極Ｅ１と重畳する位置のみに、電着液Ｌ１に含まれる機能材料を含む層が形成される。 Therefore, the functional material contained in the electrodeposition liquid L1 on the electrodeposition surface 6S does not migrate toward the second electrode E2 and the third electrode E3, but migrates only toward the first electrode E1. For this reason, the functional material contained in the electrodeposition liquid L1 on the electrodeposition surface 6S is adsorbed on the first electrode E1 that is in contact with the electrodeposition liquid L1. As a result, a layer containing the functional material contained in the electrodeposition liquid L1 is formed only at the position of the electrode included in the substrate C that overlaps with the first electrode E1.
　上述した電着工程の間、掃引部１２が、電着ヘッド６または基板保持具１４の少なくとも一方を掃引することにより、電着ヘッド６と基板保持具１４とを相対移動させる。この際、電着ヘッド６と基板保持具１４との間の距離を一定に保持しつつ、電着ヘッド６と基板保持具１４とを相対移動させる。図１においては、例えば、矢印Ａ２の方向に基板保持具１４を移動させる。これに限られず、掃引部１２は、基板保持具１４を、矢印Ａ２とは反対方向、あるいは、図１の紙面に向かって奥または手前に掃引してもよい。 の 間 During the above-described electrodeposition step, the sweeping unit 12 sweeps at least one of the electrodeposition head 6 and the substrate holder 14 to relatively move the electrodeposition head 6 and the substrate holder 14. At this time, the electrodeposition head 6 and the substrate holder 14 are relatively moved while the distance between the electrodeposition head 6 and the substrate holder 14 is kept constant. In FIG. 1, for example, the substrate holder 14 is moved in the direction of arrow A2. The present invention is not limited to this, and the sweeping unit 12 may sweep the substrate holder 14 in the direction opposite to the arrow A2 or toward the back or front toward the paper surface of FIG.
　掃引部１２による電着ヘッド６と基板保持具１４との相対移動により、電着面６Ｓ上の電着液Ｌ１が接触する基板Ｃの電極の位置が変更される。このため、電着液Ｌ１に含まれる機能材料を含む層が形成される位置についても変更される。このように、機能材料を含む層が形成される位置を逐次変更しつつ、上述した電着を実行することにより、全ての第１電極Ｅ１と重畳する位置に、電着液Ｌ１に含まれる機能材料を含む層が形成される。 相 対 By the relative movement of the electrodeposition head 6 and the substrate holder 14 by the sweep unit 12, the position of the electrode of the substrate C on which the electrodeposition liquid L1 contacts the electrodeposition surface 6S is changed. For this reason, the position where the layer containing the functional material contained in the electrodeposition liquid L1 is formed is also changed. As described above, by performing the above-described electrodeposition while sequentially changing the position at which the layer containing the functional material is formed, the functions included in the electrodeposition liquid L1 are overlapped with all the first electrodes E1. A layer containing the material is formed.
　なお、本実施形態においては、第１電極Ｅ１と重畳する位置に対する電着の完了後、第２電極Ｅ２と重畳する位置に対する電着を実行してもよい。第２電極Ｅ２と重畳する位置に対する電着は、第２電極Ｅ２に印加する電圧をＶ３に変更し、第１電極Ｅ１および第３電極Ｅ３に印加する電圧をＶ２に変更して、電着ヘッド６と基板保持具１４との相対移動を実施すればよい。 In the present embodiment, after the electrodeposition at the position overlapping the first electrode E1 is completed, the electrodeposition at the position overlapping the second electrode E2 may be performed. The electrodeposition at the position overlapping the second electrode E2 is performed by changing the voltage applied to the second electrode E2 to V3 and changing the voltage applied to the first electrode E1 and the third electrode E3 to V2. 6 and the substrate holder 14 may be moved relative to each other.
　この場合、第２電極Ｅ２と重畳する位置に対し形成する層は、第１電極Ｅ１と重畳する位置に対し形成する層と、異なる機能材料を含んでいてもよい。これは、電着液Ｌ１に含まれる機能材料とは異なる機能材料を含む電着液を、電着液貯留槽８に貯留し、当該電着液を電着ヘッド６に供給して、上述した電着を実施することにより実行できる。 In this case, the layer formed at the position overlapping with the second electrode E2 may include a different functional material from the layer formed at the position overlapping with the first electrode E1. This is because the electrodeposition liquid containing a functional material different from the functional material contained in the electrodeposition liquid L1 is stored in the electrodeposition liquid storage tank 8, and the electrodeposition liquid is supplied to the electrodeposition head 6, as described above. This can be performed by performing electrodeposition.
　以上の工程を、第３電極Ｅ３と重畳する位置に対しても実行することにより、第１電極Ｅ１、第２電極Ｅ２、および第３電極Ｅ３それぞれと重畳する位置に対する、基板Ｃへの機能材料を含む層の形成が完了する。 By performing the above steps also on the position overlapping with the third electrode E3, the functional material on the substrate C with respect to the position overlapping each of the first electrode E1, the second electrode E2, and the third electrode E3. Is completed.
　この後、上述した電着方法と同一の手法によって、基板Ｃ上に他の機能層を形成し、基板Ｃ上に積層体を形成してもよい。また、他の機能層の少なくとも一部が、種々の従来公知の手法により形成されてもよい。これにより、基板Ｃ上に積層体を備えた表示デバイスが製造できる。 After that, another functional layer may be formed on the substrate C by the same method as the electrodeposition method described above, and a laminate may be formed on the substrate C. Further, at least a part of the other functional layers may be formed by various conventionally known methods. As a result, a display device including the laminate on the substrate C can be manufactured.
　本実施形態においては、電着ヘッド６と基板保持具１４とを相対移動させて、基板Ｃの各電極上に、機能材料を含む層の電着を実施する。さらに、電着ヘッド６の電着面６Ｓの面積は、基板Ｃの基板表面ＣＳの面積よりも小さい。このため、基板Ｃと同面積を有する対向基板を用いて電着を実施するよりも、より小さな面積の電着面６Ｓ、ひいては、より小さな面積の電着ヘッド電極表面１８Ｓを有する電着ヘッド６を用いて電着が可能である。したがって、電着ヘッド６の小型化が実現でき、表示デバイスの製造装置２全体の小型化に寄与する。 In this embodiment, the electrodeposition head 6 and the substrate holder 14 are relatively moved to perform electrodeposition of a layer containing a functional material on each electrode of the substrate C. Further, the area of the electrodeposition surface 6S of the electrodeposition head 6 is smaller than the area of the substrate surface CS of the substrate C. For this reason, the electrodeposition head 6S having the electrodeposition surface 6S having a smaller area and, consequently, the electrodeposition head electrode surface 18S having a smaller area, than performing electrodeposition using the opposite substrate having the same area as the substrate C. Can be used for electrodeposition. Therefore, downsizing of the electrodeposition head 6 can be realized, which contributes to downsizing of the entire display device manufacturing apparatus 2.
　さらに、本実施形態においては、電着ヘッド６の電着面６Ｓ上の電着液Ｌ１のみを、基板Ｃと接触させた状態において電着を実施する。このため、基板Ｃの全体を浸漬する電着槽が不要となるため、さらに表示デバイスの製造装置２の小型化に寄与する。 In the present embodiment, electrodeposition is performed in a state where only the electrodeposition liquid L1 on the electrodeposition surface 6S of the electrodeposition head 6 is in contact with the substrate C. This eliminates the need for an electrodeposition bath in which the entire substrate C is immersed, which further contributes to downsizing of the display device manufacturing apparatus 2.
　本実施形態においては、電着ヘッド６において、電着ヘッド電極１８が、基板Ｃと対向する方向に位置している。このため、上記電着工程において、電着液Ｌ１に接触している第１電極Ｅ１と、電着ヘッド電極１８とが、電着液Ｌ１を介して対向している。これにより、電着ヘッド電極１８と第１電極Ｅ１との距離がより近接するため、より効率よく電着が実行できる。具体的には、上記電着工程においては、より低い電圧にて、もしくは、より少ない電着液量にて、電着を実施することができる。 In the present embodiment, in the electrodeposition head 6, the electrodeposition head electrode 18 is located in a direction facing the substrate C. Therefore, in the electrodeposition step, the first electrode E1 that is in contact with the electrodeposition liquid L1 and the electrodeposition head electrode 18 face each other via the electrodeposition liquid L1. As a result, the distance between the electrodeposition head electrode 18 and the first electrode E1 is closer, so that electrodeposition can be performed more efficiently. Specifically, in the electrodeposition step, electrodeposition can be performed at a lower voltage or with a smaller amount of the electrodeposition liquid.
　本実施形態においては、電着液貯留槽８が攪拌機２４を備える。このため、電着の直前まで、電着液Ｌ１を電着液貯留槽８において攪拌することができるため、より均一に機能材料を含んだ機能層を電着により形成することができる。 In the present embodiment, the electrodeposition liquid storage tank 8 includes the stirrer 24. For this reason, the electrodeposition liquid L1 can be stirred in the electrodeposition liquid storage tank 8 until immediately before electrodeposition, so that a functional layer containing a functional material can be more uniformly formed by electrodeposition.
　本実施形態において、電着液Ｌ１に含まれる機能材料は、例えば、極性を有するナノ粒子であってもよい。ナノ粒子としては、例えば、コア－シェル構造を有する半導体ナノ粒子、すなわち、量子ドットであってもよい。この場合、表示デバイスの製造装置２は、量子ドットを含む発光層を機能層として備えた表示デバイスを製造できる。 In the present embodiment, the functional material included in the electrodeposition liquid L1 may be, for example, nanoparticles having polarity. The nanoparticles may be, for example, semiconductor nanoparticles having a core-shell structure, that is, quantum dots. In this case, the display device manufacturing apparatus 2 can manufacture a display device including a light emitting layer including quantum dots as a functional layer.
　なお、本明細書における「電着」とは、溶液中において二電極間に電位差を生じさせることにより、当該溶液中の材料からなる薄膜を成膜する電気化学的成膜方法を含んでいる。本明細書における「電着」は、例えば、電着法、電着塗装法、電気泳動堆積法、誘電泳動堆積法、ミセル電界法、電気めっき、または電鋳等の手法を含んでいてもよい。これらの何れかの手法を、上述の電着工程として選択した場合であっても、上述した効果を奏する表示デバイスの製造方法および製造装置を提供できる。 Note that “electrodeposition” in the present specification includes an electrochemical film forming method of forming a thin film made of a material in a solution by generating a potential difference between two electrodes in the solution. "Electrodeposition" herein may include, for example, techniques such as electrodeposition, electrodeposition coating, electrophoretic deposition, dielectrophoretic deposition, micellar electric field, electroplating, or electroforming. . Even when any one of these methods is selected as the above-described electrodeposition step, a method and an apparatus for manufacturing a display device having the above-described effects can be provided.
　〔実施形態２〕
　図３は、本実施形態に係る表示デバイスの製造装置２を使用して、基板Ｃに対し電着を実施する方法の一例を示す概略図である。なお、本実施形態以降において、参照する図面の簡単のため、コントローラ４、電着液貯留槽８、基板側電源１０、および掃引部１２の一部または全ての図示を省略する場合がある。特に説明のない場合、コントローラ４、電着液貯留槽８、基板側電源１０、および掃引部１２は、前実施形態と同一の構成および機能を備えていてもよい。 [Embodiment 2]
FIG. 3 is a schematic diagram illustrating an example of a method of performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment. Note that in the following embodiments, some or all of the controller 4, the electrodeposition liquid storage tank 8, the substrate-side power supply 10, and the sweep unit 12 may be omitted for simplification of the drawings referred to. Unless otherwise specified, the controller 4, the electrodeposition liquid storage tank 8, the substrate-side power supply 10, and the sweeping unit 12 may have the same configuration and function as the previous embodiment.
　図３に示すように、本実施形態に係る表示デバイスの製造装置２は、さらに、洗浄ヘッド２６を備える。洗浄ヘッド２６は、洗浄液供給路２８を備える。洗浄ヘッド２６は、基板保持具１４と対向する面に、洗浄面２６Ｓを有する。洗浄面２６Ｓには、洗浄液供給路２８と連通する開口である、洗浄液供給口２８Ａが形成されている。洗浄液供給路２８は、図示しない洗浄液貯留槽と連通している。洗浄液貯留槽は、内部に貯留する液体を除いて、電着液貯留槽８と同一の構成を備えていてもよく、電着液貯留槽８と比較して、攪拌機２４を備えていなくともよい。 As shown in FIG. 3, the display device manufacturing apparatus 2 according to the present embodiment further includes a cleaning head 26. The cleaning head 26 includes a cleaning liquid supply path 28. The cleaning head 26 has a cleaning surface 26S on a surface facing the substrate holder 14. A cleaning liquid supply port 28A, which is an opening communicating with the cleaning liquid supply path 28, is formed in the cleaning surface 26S. The cleaning liquid supply path 28 communicates with a cleaning liquid storage tank (not shown). The cleaning liquid storage tank may have the same configuration as the electrodeposition liquid storage tank 8 except for the liquid stored inside, and may not include the stirrer 24 as compared with the electrodeposition liquid storage tank 8. .
　本実施形態に係る表示デバイスの製造装置２を使用した電着方法は、下記に説明する事項を除き、前実施形態において説明した電着方法と同一であってもよい。ここで、本実施形態においては、掃引部１２による電着ヘッド６と基板保持具１４との相対移動の間、電着ヘッド６が通過した後に、洗浄ヘッド２６が同じ位置を通過する。 電 The electrodeposition method using the display device manufacturing apparatus 2 according to the present embodiment may be the same as the electrodeposition method described in the previous embodiment, except for the matters described below. Here, in the present embodiment, during the relative movement of the electrodeposition head 6 and the substrate holder 14 by the sweep unit 12, the cleaning head 26 passes through the same position after the electrodeposition head 6 has passed.
　ここで、洗浄液貯留槽内の洗浄液ＬＣを、矢印Ａ２の方向に送り出し、洗浄液供給路２８を介し、洗浄液供給口２８Ａに供給する。洗浄液供給口２８Ａからあふれた洗浄液ＬＣは、洗浄ヘッド２６の洗浄面２６Ｓ上に貯留する。なお、洗浄液ＬＣの供給は、電着液Ｌ１の電着ヘッド６への供給と同一の原理によって実現してもよい。 Here, the cleaning liquid LC in the cleaning liquid storage tank is sent out in the direction of arrow A2, and supplied to the cleaning liquid supply port 28A via the cleaning liquid supply path 28. The cleaning liquid LC overflowing from the cleaning liquid supply port 28A is stored on the cleaning surface 26S of the cleaning head 26. The supply of the cleaning liquid LC may be realized by the same principle as the supply of the electrodeposition liquid L1 to the electrodeposition head 6.
　ここで、図３に示すように、洗浄面２６Ｓ上に貯留した洗浄液ＬＣは、洗浄面２６Ｓと対向する基板Ｃの基板表面ＣＳと接触する。このため、電着が実施された基板Ｃの表面が、洗浄液ＬＣによって洗浄される。なお、本実施形態においては、洗浄面２６Ｓの面積は、基板表面ＣＳの面積よりも小さいため、洗浄液ＬＣが基板表面ＣＳと接触する面積は、基板表面ＣＳの面積よりも小さい。 Here, as shown in FIG. 3, the cleaning liquid LC stored on the cleaning surface 26S comes into contact with the substrate surface CS of the substrate C facing the cleaning surface 26S. Therefore, the surface of the substrate C on which the electrodeposition has been performed is cleaned by the cleaning liquid LC. In the present embodiment, since the area of the cleaning surface 26S is smaller than the area of the substrate surface CS, the area where the cleaning liquid LC contacts the substrate surface CS is smaller than the area of the substrate surface CS.
　洗浄ヘッド２６による基板Ｃの洗浄は、基板Ｃに対し、電着ヘッド６が通過した後に、洗浄ヘッド２６が通過するよう、掃引部１２が、電着ヘッド６、洗浄ヘッド２６、または基板保持具１４の少なくとも一つを掃引することにより実現する。 In the cleaning of the substrate C by the cleaning head 26, the sweeping unit 12 moves the electrodeposition head 6, the cleaning head 26, or the substrate holder so that the substrate C passes through the electrodeposition head 6 and then passes through the cleaning head 26. 14 by sweeping at least one of them.
　本実施形態においては、電着が完了した基板Ｃを、基板Ｃに付着した電着液Ｌ１が乾燥する前に、速やかに洗浄液ＬＣによって洗浄することができる。これにより、基板Ｃに付着した電着液Ｌ１が乾燥することにより生じうる、基板Ｃの汚染を低減できる。また、基板Ｃの洗浄のために、基板Ｃ全体を洗浄槽等に浸漬する必要がないため、装置全体の小型化に寄与する。 In the present embodiment, the substrate C on which electrodeposition has been completed can be quickly cleaned with the cleaning liquid LC before the electrodeposition liquid L1 adhered to the substrate C is dried. Thereby, contamination of the substrate C, which may be caused by drying the electrodeposition liquid L1 attached to the substrate C, can be reduced. Further, since it is not necessary to immerse the entire substrate C in a cleaning tank or the like for cleaning the substrate C, it contributes to downsizing of the entire apparatus.
　〔実施形態３〕
　図４は、本実施形態に係る表示デバイスの製造装置２を使用して、基板Ｃに対し電着を実施する方法の一例を示す概略図である。図４に示すように、本実施形態に係る表示デバイスの製造装置２は、電着ヘッドとして、第１電着ヘッド６Ａと第２電着ヘッド６Ｂとを備える。さらに、本実施形態に係る表示デバイスの製造装置２は、洗浄ヘッド２６を複数備える。 [Embodiment 3]
FIG. 4 is a schematic diagram illustrating an example of a method of performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment. As shown in FIG. 4, the display device manufacturing apparatus 2 according to the present embodiment includes a first electrodeposition head 6A and a second electrodeposition head 6B as electrodeposition heads. Further, the display device manufacturing apparatus 2 according to the present embodiment includes a plurality of cleaning heads 26.
　なお、本実施形態においては、全ての第１電極Ｅ１、第２電極Ｅ２、および第３電極Ｅ３に対し、基板側電源１０の制御により、個々に電圧を印加することが可能である。当該構成は、全ての第１電極Ｅ１、第２電極Ｅ２、および第３電極Ｅ３のそれぞれに対し、ＴＦＴ等の能動素子を形成し、基板側電源１０が個々に能動素子を制御することによって実現する。 In the present embodiment, it is possible to individually apply a voltage to all of the first electrode E1, the second electrode E2, and the third electrode E3 by controlling the substrate-side power supply 10. This configuration is realized by forming active elements such as TFTs for all of the first electrode E1, the second electrode E2, and the third electrode E3, and the substrate-side power supply 10 individually controlling the active elements. I do.
　上述した点を除いて、本実施形態に係る表示デバイスの製造装置２は、前実施形態に係る表示デバイスの製造装置２と同一の構成を備える。 除 い Except for the points described above, the display device manufacturing apparatus 2 according to the present embodiment has the same configuration as the display device manufacturing apparatus 2 according to the previous embodiment.
　第１電着ヘッド６Ａと第２電着ヘッド６Ｂとは、前実施形態における電着ヘッド６と同一の構成を備える。また、第１電着ヘッド６Ａと第２電着ヘッド６Ｂとは、それぞれ、電着面６ＡＳと電着面６ＢＳとを備える。 The first electrodeposition head 6A and the second electrodeposition head 6B have the same configuration as the electrodeposition head 6 in the previous embodiment. The first electrodeposition head 6A and the second electrodeposition head 6B include an electrodeposition surface 6AS and an electrodeposition surface 6BS, respectively.
　本実施形態に係る表示デバイスの製造方法における、電着工程においては、第１電着ヘッド６Ａに、電着液Ｌ１が供給される一方、第２電着ヘッド６Ｂに、電着液Ｌ１とは異なる機能材料を含む、電着液Ｌ２が供給される。電着液Ｌ１と電着液Ｌ２とは、それぞれ異なる電着液貯留槽から供給されていてもよい。 In the electrodeposition step in the method for manufacturing a display device according to the present embodiment, the electrodeposition liquid L1 is supplied to the first electrodeposition head 6A while the electrodeposition liquid L1 is supplied to the second electrodeposition head 6B. An electrodeposition liquid L2 containing different functional materials is supplied. The electrodeposition liquid L1 and the electrodeposition liquid L2 may be supplied from different electrodeposition liquid storage tanks.
　本実施形態においては、電着液Ｌ１に含まれる機能材料を、基板Ｃの第１電極Ｅ１と重畳する位置に電着し、さらに、電着液Ｌ２に含まれる機能材料を、基板Ｃの第２電極Ｅ２と重畳する位置に電着する。 In the present embodiment, the functional material included in the electrodeposition liquid L1 is electrodeposited at a position overlapping the first electrode E1 of the substrate C, and the functional material included in the electrodeposition liquid L2 is further Electrodeposition is performed at a position overlapping the two electrodes E2.
　具体的には、例えば、図４に示すように、基板Ｃの第１電極Ｅ１と重畳する位置に、第１電着ヘッド６Ａに供給された電着液Ｌ１が接触している場合、当該位置における第１電極Ｅ１にＶ３を印加する。一方、当該位置の周囲における第２電極Ｅ２および第３電極Ｅ３にはＶ２を印加する。これにより、第１電着ヘッド６Ａによって、基板Ｃの第１電極Ｅ１と重畳する位置のみに、電着液Ｌ１に含まれる機能材料を含む層を電着する。 Specifically, for example, as shown in FIG. 4, when the electrodeposition liquid L1 supplied to the first electrodeposition head 6A is in contact with a position overlapping the first electrode E1 on the substrate C, V3 is applied to the first electrode E1 at. On the other hand, V2 is applied to the second electrode E2 and the third electrode E3 around the position. Thus, the layer containing the functional material contained in the electrodeposition liquid L1 is electrodeposited by the first electrodeposition head 6A only at the position overlapping the first electrode E1 of the substrate C.
　同様に、例えば、図４に示すように、基板Ｃの第２電極Ｅ２と重畳する位置に、第２電着ヘッド６Ｂに供給された電着液Ｌ２が接触している場合、当該位置における第２電極Ｅ２にＶ３を印加する。一方、当該位置の周囲における第１電極Ｅ１および第３電極Ｅ３にはＶ２を印加する。これにより、第２電着ヘッド６Ｂによって、基板Ｃの第２電極Ｅ２と重畳する位置のみに、電着液Ｌ２に含まれる機能材料を含む機能層を電着する。 Similarly, for example, as shown in FIG. 4, when the electrodeposition liquid L2 supplied to the second electrodeposition head 6B is in contact with a position overlapping the second electrode E2 of the substrate C, V3 is applied to the two electrodes E2. On the other hand, V2 is applied to the first electrode E1 and the third electrode E3 around the position. Thus, the functional layer containing the functional material contained in the electrodeposition liquid L2 is electrodeposited by the second electrodeposition head 6B only at a position overlapping the second electrode E2 of the substrate C.
　この際、掃引部１２により、第１電着ヘッド６Ａおよび第２電着ヘッド６Ｂ、または基板保持具１４の少なくとも一方を掃引する。この間、基板側電源１０の制御により、逐次、第１電極Ｅ１、第２電極Ｅ２、および第３電極Ｅ３に印加する電圧を切り替える。これにより、全ての第１電極Ｅ１および第２電極Ｅ２にそれぞれ重畳する位置に、異なる機能材料を含む層を形成する。 At this time, the sweeping unit 12 sweeps at least one of the first electrodeposition head 6A and the second electrodeposition head 6B, or the substrate holder 14. During this time, the voltage applied to the first electrode E1, the second electrode E2, and the third electrode E3 is sequentially switched under the control of the substrate-side power supply 10. As a result, a layer containing a different functional material is formed at a position overlapping each of the first electrode E1 and the second electrode E2.
　さらに、本実施形態においては、第１電着ヘッド６Ａが通過した後に、ある洗浄ヘッド２６が通過し、第２電着ヘッド６Ｂが通過した後に、他の洗浄ヘッド２６が通過する。このため、第１電着ヘッド６Ａによる第１電極Ｅ１と重畳する位置への電着と、第２電着ヘッド６Ｂによる第２電極Ｅ２と重畳する位置への電着との間に、洗浄ヘッド２６による基板Ｃの洗浄が実施される。また、第２電着ヘッド６Ｂによる第２電極Ｅ２と重畳する位置への電着の後においても、洗浄ヘッド２６による基板Ｃの洗浄が実施される。 Further, in the present embodiment, a certain cleaning head 26 passes after the first electrodeposition head 6A passes, and another cleaning head 26 passes after the second electrodeposition head 6B passes. Therefore, between the electrodeposition of the first electrodeposition head 6A at the position overlapping the first electrode E1 and the electrodeposition of the second electrodeposition head 6B at the position overlapping the second electrode E2, the cleaning head is provided. The cleaning of the substrate C by 26 is performed. Also, after the electrodeposition by the second electrodeposition head 6B on the position overlapping the second electrode E2, the cleaning of the substrate C by the cleaning head 26 is performed.
　本実施形態においても、第１電着ヘッド６Ａおよび第２電着ヘッド６Ｂのそれぞれの電着面は、基板Ｃの基板表面ＣＳよりも面積が小さいため、前実施形態と同様に、電着装置の小型化に寄与する。さらに、基板Ｃのそれぞれの電極に印加する電圧を切り替えつつ、異なる機能材料を含む機能層を、異なる電極のそれぞれに重畳する位置に、一度の掃引によって形成できる。このため、本実施形態においては、電着工程のタクトタイムの低減に寄与する。 Also in the present embodiment, the electrodeposition surface of each of the first electrodeposition head 6A and the second electrodeposition head 6B has a smaller area than the substrate surface CS of the substrate C. Contributes to downsizing. Further, while switching the voltage applied to each electrode of the substrate C, a functional layer containing a different functional material can be formed at a position overlapping each of the different electrodes by one sweep. For this reason, in this embodiment, it contributes to the reduction of the tact time in the electrodeposition process.
　また、本実施形態においては、第１電着ヘッド６Ａによる第１電極Ｅ１と重畳する位置への電着と、第２電着ヘッド６Ｂによる第２電極Ｅ２と重畳する位置への電着との間に、洗浄ヘッド２６による基板Ｃの洗浄が実施される。このため、異なる電極間における電着液の汚染が低減され、ある電極と重畳する位置において、異なる複数の機能材料を含む機能層が電着される可能性を低減できる。 In the present embodiment, the electrodeposition of the first electrodeposition head 6A at the position overlapping the first electrode E1 and the electrodeposition of the second electrodeposition head 6B at the position overlapping the second electrode E2 are performed. Meanwhile, the cleaning of the substrate C by the cleaning head 26 is performed. For this reason, the contamination of the electrodeposition liquid between different electrodes is reduced, and the possibility that a functional layer containing a plurality of different functional materials is electrodeposited at a position overlapping a certain electrode can be reduced.
　特に、本実施形態においては、電着液Ｌ１が含む機能材料が、第１の波長を有する光を発する第１発光材料であってもよく、電着液Ｌ２が含む機能材料が、第１の波長と異なる第２の波長を有する光を発する第２発光材料であってもよい。この場合、異なる色の光を発する複数の発光材料を含む発光層それぞれを、異なる電極と重畳する位置に成膜することが可能である。したがって、本実施形態における表示デバイスの製造装置２を用いて、表示デバイスの発光層を、画素ごとに個別に形成することができる。 In particular, in the present embodiment, the functional material included in the electrodeposition liquid L1 may be a first light emitting material that emits light having the first wavelength, and the functional material included in the electrodeposition liquid L2 may be the first material. A second light-emitting material that emits light having a second wavelength different from the wavelength may be used. In this case, each light-emitting layer including a plurality of light-emitting materials that emit light of different colors can be formed at positions overlapping with different electrodes. Therefore, the light emitting layer of the display device can be individually formed for each pixel by using the display device manufacturing apparatus 2 according to the present embodiment.
　なお、本実施形態に係る表示デバイスの製造装置は、さらに、電着液Ｌ１および電着液Ｌ２のそれぞれが含む機能材料と異なる機能材料を含む電着液Ｌ３が供給される、第３電着ヘッド６Ｃをさらに備えていてもよい。この場合、一度の掃引によって、電着液Ｌ３が含む機能材料を備えた機能層を、さらに第３電極Ｅ３と重畳する位置に電着をすることが可能である。また、第２電着ヘッド６Ｂによる第２電極Ｅ２と重畳する位置への電着と、第３電着ヘッド６Ｃによる第３電極Ｅ３と重畳する位置への電着との間に、洗浄ヘッド２６による基板Ｃの洗浄を実施してもよい。 The apparatus for manufacturing a display device according to the present embodiment is further supplied with an electrodeposition liquid L3 containing a functional material different from the functional material contained in each of the electrodeposition liquid L1 and the electrodeposition liquid L2. A head 6C may be further provided. In this case, it is possible to electrodeposit a functional layer provided with a functional material contained in the electrodeposition liquid L3 at a position overlapping with the third electrode E3 by a single sweep. The cleaning head 26 is disposed between the electrodeposition of the second electrodeposition head 6B at the position overlapping the second electrode E2 and the electrodeposition of the third electrodeposition head 6C at the position overlapping the third electrode E3. Cleaning of the substrate C may be performed.
　〔実施形態４〕
　図５は、本実施形態に係る表示デバイスの製造装置２を使用して、基板Ｃに対し電着を実施する方法の一例を示す概略図である。図５に示すように、本実施形態に係る表示デバイスの製造装置２は、第１添加剤貯留槽３０Ａと第２添加剤貯留槽３０Ｂとをさらに備える点を除いて、実施形態１に係る表示デバイスの製造装置２と同一の構成を備える。 [Embodiment 4]
FIG. 5 is a schematic diagram illustrating an example of a method for performing electrodeposition on the substrate C using the display device manufacturing apparatus 2 according to the present embodiment. As shown in FIG. 5, the display device manufacturing apparatus 2 according to the present embodiment includes a display according to the first embodiment, except that the display device manufacturing apparatus 2 further includes a first additive storage tank 30A and a second additive storage tank 30B. It has the same configuration as the device manufacturing apparatus 2.
　第１添加剤貯留槽３０Ａと第２添加剤貯留槽３０Ｂとは、接続管３２および接続管２２を介して、電着ヘッド６の電着液供給路２０と連通する。 The first additive storage tank 30A and the second additive storage tank 30B communicate with the electrodeposition liquid supply passage 20 of the electrodeposition head 6 via the connection pipe 32 and the connection pipe 22.
　本実施形態における電着工程においては、電着液貯留槽８には、添加剤を含まない電着液Ｌ３が貯留している。すなわち、電着液貯留槽８は、機能材料を含む電着液Ｌ３を貯留する、機能材料貯留槽として機能する。また、第１添加剤貯留槽３０Ａと第２添加剤貯留槽３０Ｂとのそれぞれには、互いに異なる添加剤Ｌ４と添加剤Ｌ５とが貯留している。電着液Ｌ３に、添加剤Ｌ４と添加剤Ｌ５とを添加することにより、電着ヘッド６による電着に使用される電着液Ｌ１が得られる。 に お い て In the electrodeposition step in this embodiment, the electrodeposition liquid L3 containing no additive is stored in the electrodeposition liquid storage tank 8. That is, the electrodeposition liquid storage tank 8 functions as a functional material storage tank that stores the electrodeposition liquid L3 containing the functional material. Further, different additives L4 and L5 are stored in the first additive storage tank 30A and the second additive storage tank 30B, respectively. By adding the additive L4 and the additive L5 to the electrodeposition liquid L3, an electrodeposition liquid L1 used for electrodeposition by the electrodeposition head 6 is obtained.
　ここで、本実施形態に係る表示デバイスの製造方法においては、始めに、電着液Ｌ３が電着ヘッド６に供給される。ここで、電着液Ｌ３が接続管２２を通過している間に、第１添加剤貯留槽３０Ａと第２添加剤貯留槽３０Ｂとのそれぞれから、添加剤Ｌ４と添加剤Ｌ５とが、接続管３２を介して接続管２２に供給される。このため、電着液Ｌ３は、接続管２２において、添加剤Ｌ４と添加剤Ｌ５とを添加され、電着液Ｌ１として電着ヘッド６の電着液供給路２０に供給される。 Here, in the display device manufacturing method according to the present embodiment, first, the electrodeposition liquid L3 is supplied to the electrodeposition head 6. Here, while the electrodeposition liquid L3 is passing through the connection pipe 22, the additive L4 and the additive L5 are connected from the first additive storage tank 30A and the second additive storage tank 30B, respectively. It is supplied to the connection pipe 22 via the pipe 32. For this reason, the electrodeposition liquid L3 is added with the additive L4 and the additive L5 in the connection pipe 22, and is supplied to the electrodeposition liquid supply path 20 of the electrodeposition head 6 as the electrodeposition liquid L1.
　接続管２２への添加剤Ｌ４と添加剤Ｌ５との供給は、第１添加剤貯留槽３０Ａと第２添加剤貯留槽３０Ｂとのそれぞれが備えるポンプによって添加剤を送り出すことにより実現してもよい。他にも、接続管２２への添加剤Ｌ４と添加剤Ｌ５との供給は、電着液Ｌ３が接続管２２を流動することによるベルヌーイ効果によって、接続管３２から接続管２２に向かって、添加剤Ｌ４と添加剤Ｌ５とが引きつけられることにより実現してもよい。 The supply of the additive L4 and the additive L5 to the connection pipe 22 may be realized by sending out the additive by a pump provided in each of the first additive storage tank 30A and the second additive storage tank 30B. . In addition, the supply of the additive L4 and the additive L5 to the connection pipe 22 is performed by adding the additive L4 and the additive L5 from the connection pipe 32 toward the connection pipe 22 by the Bernoulli effect caused by the flow of the electrodeposition liquid L3 through the connection pipe 22. It may be realized by attracting the agent L4 and the additive L5.
　添加剤Ｌ４と添加剤Ｌ５との少なくとも一方は、電着液Ｌ３が含む機能材料の酸化防止剤であってもよく、または、電着液Ｌ３の溶媒等を含む、電着液Ｌ３の希釈液であってもよい。 At least one of the additive L4 and the additive L5 may be an antioxidant for a functional material included in the electrodeposition liquid L3, or a diluent of the electrodeposition liquid L3, including a solvent or the like of the electrodeposition liquid L3. It may be.
　本実施形態における、電着ヘッド６を用いた基板Ｃへの電着は、前述までの実施形態における電着と同一の手法により実施されてもよい。 電 The electrodeposition on the substrate C using the electrodeposition head 6 in the present embodiment may be performed by the same method as the electrodeposition in the embodiments described above.
　本実施形態においても、前述した電着装置の小型化の効果を奏する。また、本実施形態においては、電着が実施される直前に、電着液Ｌ３に対し、添加剤Ｌ４と添加剤Ｌ５とを添加するため、電着液貯留槽８において、電着液Ｌ３を添加剤Ｌ４および添加剤Ｌ５とを混合する必要がない。このため、長時間電着液Ｌ３と混合された状態にあることにより、電着液Ｌ３が含む機能材料が劣化する可能性のある添加剤を、電着の直前に混合させることができる。したがって、機能層の電着工程の歩留まりが改善し、あるいは、添加剤の選択の自由度が向上する。 に お い て This embodiment also has the effect of reducing the size of the electrodeposition device described above. In this embodiment, the additive L4 and the additive L5 are added to the electrodeposition liquid L3 immediately before the electrodeposition is performed. Therefore, the electrodeposition liquid L3 is stored in the electrodeposition liquid storage tank 8. There is no need to mix additive L4 and additive L5. For this reason, the additive which may deteriorate the functional material contained in the electrodeposition liquid L3 due to being in a state of being mixed with the electrodeposition liquid L3 for a long time can be mixed immediately before the electrodeposition. Therefore, the yield of the electrodeposition step of the functional layer is improved, or the degree of freedom in selecting an additive is improved.
　本実施形態においては、複数の添加剤貯留槽から、互いに異なる添加剤を、電着液Ｌ３に供給できる。このため、長時間互いに混合された状態にあることにより、少なくとも一方が劣化する可能性のある複数の添加剤を、電着の直前に混合させることができる。したがって、機能層の電着工程の歩留まりが改善し、または、添加剤の選択の自由度が向上する。なお、本実施形態においては、添加剤貯留槽が単一であり、単一の添加剤を電着液Ｌ３に添加する構成であってもよい。 In the present embodiment, different additives can be supplied to the electrodeposition liquid L3 from the plurality of additive storage tanks. Therefore, a plurality of additives, at least one of which may deteriorate due to being mixed with each other for a long time, can be mixed immediately before electrodeposition. Therefore, the yield in the electrodeposition step of the functional layer is improved, or the degree of freedom in selecting an additive is improved. In the present embodiment, a single additive storage tank may be used, and a single additive may be added to the electrodeposition liquid L3.
　〔実施形態５〕
　図６は、本実施形態に係る表示デバイスの製造装置２を使用して、基板Ｃに対し電着を実施する方法の一例を示す概略図である。図６に示すように、本実施形態に係る表示デバイスの製造装置２は、添加剤貯留槽３０と機能材料貯留槽３４とをさらに備える点を除いて、実施形態１に係る表示デバイスの製造装置２と同一の構成を備える。 [Embodiment 5]
FIG. 6 is a schematic diagram illustrating an example of a method of performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment. As shown in FIG. 6, the display device manufacturing apparatus 2 according to the present embodiment includes an additive storage tank 30 and a functional material storage tank 34, except that the display device manufacturing apparatus 2 according to the present embodiment further includes an additive storage tank 30 and a functional material storage tank 34. 2 has the same configuration.
　本実施形態において、添加剤貯留槽３０は、接続管３２を介して、電着液貯留槽８に連通し、同様に、機能材料貯留槽３４は、接続管３６を介して、電着液貯留槽８に連通する。 In the present embodiment, the additive storage tank 30 communicates with the electrodeposition liquid storage tank 8 through the connection pipe 32, and the functional material storage tank 34 similarly stores the electrodeposition liquid storage tank through the connection pipe 36. It communicates with the tank 8.
　本実施形態における電着工程においては、添加剤貯留槽３０には、添加剤Ｌ４が貯留している。また、機能材料貯留槽３４には、添加剤を含まない電着液Ｌ３が貯留している。さらに、添加剤貯留槽３０内の添加剤Ｌ４と、機能材料貯留槽３４内の電着液Ｌ３とは、電着液貯留槽８に供給される。添加剤Ｌ４と電着液Ｌ３との供給は、添加剤貯留槽３０と機能材料貯留槽３４とのそれぞれが備える、図示しないポンプが、添加剤Ｌ４と電着液Ｌ３とを送り出すことにより実施してもよい。 に お い て In the electrodeposition step in the present embodiment, the additive L4 is stored in the additive storage tank 30. The functional material storage tank 34 stores an electrodeposition liquid L3 containing no additive. Further, the additive L4 in the additive storage tank 30 and the electrodeposition liquid L3 in the functional material storage tank 34 are supplied to the electrodeposition liquid storage tank 8. The supply of the additive L4 and the electrodeposition liquid L3 is performed by a pump (not shown) provided in each of the additive storage tank 30 and the functional material storage tank 34 sending out the additive L4 and the electrodeposition liquid L3. You may.
　本実施形態においては、添加剤貯留槽３０から接続管３２を介して供給された添加剤Ｌ４と、機能材料貯留槽３４から接続管３６を介して供給された電着液Ｌ３とが、電着液貯留槽８において混合されることにより、電着液貯留槽８において電着液Ｌ１となる。電着液Ｌ３と添加剤Ｌ４との混合は、電着液貯留槽８において、両液体を、攪拌機２４によって撹拌することにより実施されてもよい。すなわち、電着液貯留槽８は、電着液Ｌ３と添加剤Ｌ４とを混合する、混合槽としての機能を有する。 In the present embodiment, the additive L4 supplied from the additive storage tank 30 via the connection pipe 32 and the electrodeposition liquid L3 supplied from the functional material storage tank 34 via the connection pipe 36 are electrodeposited. By being mixed in the liquid storage tank 8, the electrodeposition liquid L1 is formed in the electrodeposition liquid storage tank 8. The mixing of the electrodeposition liquid L3 and the additive L4 may be performed by stirring both liquids with the stirrer 24 in the electrodeposition liquid storage tank 8. That is, the electrodeposition liquid storage tank 8 has a function as a mixing tank for mixing the electrodeposition liquid L3 and the additive L4.
　電着液貯留槽８における電着液Ｌ１を、上述した手法により電着ヘッド６に供給することにより、前述と同一の手法により、基板Ｃに対する電着が実施されてもよい。なお、本実施形態に係る表示デバイスの製造装置２は、添加剤貯留槽３０の他に、添加剤Ｌ４とは異なる添加剤を貯留する他の添加剤貯留槽を備えていてもよい。 供給 す る By supplying the electrodeposition liquid L1 in the electrodeposition liquid storage tank 8 to the electrodeposition head 6 by the above-described method, the electrodeposition on the substrate C may be performed by the same method as described above. Note that the display device manufacturing apparatus 2 according to the present embodiment may include, in addition to the additive storage tank 30, another additive storage tank that stores an additive different from the additive L4.
　本実施形態においては、混合槽である電着液貯留槽８において、電着液Ｌ３と添加剤Ｌ４とが混合される。したがって、電着液Ｌ３と添加剤Ｌ４とをより均質に混合できるため、より均質な層を電着にて形成することができる。 In the present embodiment, the electrodeposition liquid L3 and the additive L4 are mixed in the electrodeposition liquid storage tank 8, which is a mixing tank. Therefore, since the electrodeposition liquid L3 and the additive L4 can be mixed more uniformly, a more uniform layer can be formed by electrodeposition.
　〔実施形態６〕
　図７は、本実施形態に係る表示デバイスの製造装置２を使用して、基板Ｃに対し電着を実施する方法の一例を示す概略図である。図７に示すように、本実施形態に係る表示デバイスの製造装置２は、回収槽３８をさらに備える点を除いて、実施形態１に係る表示デバイスの製造装置２と同一の構成を備える。 [Embodiment 6]
FIG. 7 is a schematic diagram illustrating an example of a method for performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment. As shown in FIG. 7, the display device manufacturing apparatus 2 according to the present embodiment has the same configuration as the display device manufacturing apparatus 2 according to the first embodiment except that the display device manufacturing apparatus 2 further includes a collection tank 38.
　回収槽３８は、電着工程において、基板Ｃに接触した後、基板表面ＣＳを伝って、基板Ｃの端部まで到達した電着液を回収するための槽である。回収槽３８は、基板Ｃの端部と重畳する位置に開口を備える。回収槽３８は、接続管４０を介して、電着液貯留槽８と連通する。 (4) The recovery tank 38 is a tank for collecting the electrodeposition liquid that has reached the edge of the substrate C after coming into contact with the substrate C in the electrodeposition step and then traveling along the substrate surface CS. The recovery tank 38 has an opening at a position overlapping the end of the substrate C. The collection tank 38 communicates with the electrodeposition liquid storage tank 8 via the connection pipe 40.
　本実施形態において、回収槽３８は、内部に濃度検出部４２を備える。濃度検出部４２は、回収槽３８における液体中に含まれる機能材料の濃度を検出する。なお、図７に示すように、本実施形態においては、さらに、電着液貯留槽８が濃度検出部４２を備え、濃度検出部４２が電着液貯留槽８における液体中に含まれる機能材料の濃度を検出してもよい。 In the present embodiment, the collection tank 38 includes a concentration detection unit 42 inside. The concentration detecting section 42 detects the concentration of the functional material contained in the liquid in the collection tank 38. As shown in FIG. 7, in the present embodiment, the electrodeposition liquid storage tank 8 further includes a concentration detection unit 42, and the concentration detection unit 42 includes a functional material contained in the liquid in the electrodeposition liquid storage tank 8. May be detected.
　本実施形態における電着工程は、前述した電着工程と同一の手法により実施される。この際、本実施形態においては、基板Ｃに接触し、機能材料を含む機能層が基板Ｃに形成されたことにより、機能材料の濃度が低下した電着液Ｌ６が、基板表面ＣＳに付着する。電着液Ｌ６の少なくとも一部は、基板表面ＣＳを伝って、基板Ｃの回収槽３８と重畳する端部まで到達する。 電 The electrodeposition step in this embodiment is performed by the same method as the electrodeposition step described above. At this time, in the present embodiment, the electrodeposition liquid L6 having a reduced concentration of the functional material adheres to the substrate surface CS because the functional layer containing the functional material is formed on the substrate C in contact with the substrate C. . At least a part of the electrodeposition liquid L <b> 6 travels along the substrate surface CS and reaches an end overlapping the collection tank 38 of the substrate C.
　なお、基板Ｃの回収槽３８と重畳する端部まで電着液Ｌ６が到達しやすくなるよう、図７に示すように、上述した電着工程の間、基板Ｃの回収槽３８と重畳する端部が他方の端部よりも下方になるように、基板Ｃを傾斜させる。これにより、基板表面ＣＳに付着した電着液Ｌ６は、重力にしたがって、基板Ｃの回収槽３８と重畳する端部に向かって流動する。 In order to make it easier for the electrodeposition liquid L6 to reach the end of the substrate C that overlaps with the collecting tank 38, as shown in FIG. The substrate C is inclined such that the portion is lower than the other end. As a result, the electrodeposition liquid L6 attached to the substrate surface CS flows toward the end overlapping the collection tank 38 of the substrate C according to gravity.
　基板Ｃの回収槽３８と重畳する端部に到達した電着液Ｌ６は、重力にしたがって滴下し、回収槽３８の開口を通って回収槽３８内に落下する。このように、機能材料の濃度が低下した電着液Ｌ６を、回収槽３８内に回収する。 (4) The electrodeposition liquid L6 that has reached the end of the substrate C that overlaps the collection tank 38 is dropped by gravity and falls into the collection tank 38 through the opening of the collection tank 38. As described above, the electrodeposition liquid L6 having a reduced concentration of the functional material is recovered in the recovery tank 38.
　回収槽３８内に回収された電着液Ｌ６は、接続管４０を介して電着液貯留槽８に供給される。電着液Ｌ６の供給は、回収槽３８が備える図示しないポンプが、電着液Ｌ６を送り出すことにより実施してもよい。このため、電着液Ｌ３と、添加剤Ｌ４と、電着液Ｌ６とは、電着液貯留槽８において混合され、電着液Ｌ１となる。電着液Ｌ１の機能材料の濃度を維持するために、電着液Ｌ３は電着液Ｌ１よりも機能材料の濃度が高いことが望ましい。 電 The electrodeposition liquid L6 recovered in the recovery tank 38 is supplied to the electrodeposition liquid storage tank 8 via the connection pipe 40. The supply of the electrodeposition liquid L6 may be performed by a pump (not shown) provided in the recovery tank 38 sending out the electrodeposition liquid L6. For this reason, the electrodeposition liquid L3, the additive L4, and the electrodeposition liquid L6 are mixed in the electrodeposition liquid storage tank 8, and become the electrodeposition liquid L1. In order to maintain the concentration of the functional material in the electrodeposition liquid L1, it is desirable that the electrodeposition liquid L3 has a higher concentration of the functional material than the electrodeposition liquid L1.
　また、回収槽３８の濃度検出部４２は、回収槽３８中の電着液Ｌ６の機能材料の濃度を検出する。本実施形態においては、電着液Ｌ６の機能材料の濃度と、望ましい電着液Ｌ１の機能材料の濃度との差から、機能材料貯留槽３４から電着液貯留槽８に供給するＬ３の量が決定されてもよい。電着液貯留槽８において混合させる直前における電着液Ｌ６の機能材料の濃度をより正確に検出する観点から、回収槽３８中の濃度検出部４２は、回収槽３８と接続管４０との接続部付近に設置されることが望ましい。 (4) The concentration detector 42 of the recovery tank 38 detects the concentration of the functional material of the electrodeposition liquid L6 in the recovery tank 38. In the present embodiment, the amount of L3 supplied from the functional material storage tank 34 to the electrodeposition liquid storage tank 8 is determined from the difference between the concentration of the functional material of the electrodeposition liquid L6 and the desired concentration of the functional material of the electrodeposition liquid L1. May be determined. From the viewpoint of more accurately detecting the concentration of the functional material of the electrodeposition liquid L6 immediately before mixing in the electrodeposition liquid storage tank 8, the concentration detector 42 in the collection tank 38 connects the collection tank 38 to the connection pipe 40. It is desirable to be installed near the part.
　さらに、電着液貯留槽８の濃度検出部４２は、電着液貯留槽８中の電着液Ｌ１の機能材料の濃度を検出する。本実施形態においては、当該電着液Ｌ１の機能材料の濃度が維持されているか否かを監視されてもよい。電着ヘッド６に供給される直前における電着液Ｌ１の機能材料の濃度をより正確に検出する観点から、電着液貯留槽８中の濃度検出部４２は、電着液貯留槽８と接続管２２との接続部付近に設置されることが望ましい。 Furthermore, the concentration detecting section 42 of the electrodeposition liquid storage tank 8 detects the concentration of the functional material of the electrodeposition liquid L1 in the electrodeposition liquid storage tank 8. In the present embodiment, whether or not the concentration of the functional material of the electrodeposition liquid L1 is maintained may be monitored. From the viewpoint of more accurately detecting the concentration of the functional material of the electrodeposition liquid L1 immediately before being supplied to the electrodeposition head 6, the concentration detector 42 in the electrodeposition liquid storage tank 8 is connected to the electrodeposition liquid storage tank 8. It is desirable to be installed near the connection with the pipe 22.
　本実施形態に係る表示デバイスの製造方法においては、基板Ｃに接触し、電着が実行されたことにより、機能材料の濃度が低下した電着液Ｌ６を回収し、他の電着液と混合することにより、電着液Ｌ６を再利用する。このため、使用する電着液の全体量を低減できるため、表示デバイスの製造コストを低減できる。 In the method for manufacturing a display device according to the present embodiment, the electrodeposition liquid L6 in which the concentration of the functional material is reduced by contacting the substrate C and performing the electrodeposition is collected and mixed with another electrodeposition liquid. By doing so, the electrodeposition liquid L6 is reused. For this reason, since the total amount of the electrodeposition liquid to be used can be reduced, the manufacturing cost of the display device can be reduced.
　本実施形態に係る表示デバイスの製造方法においては、機能材料の濃度が低下した電着液Ｌ６を、基板Ｃの表面を介して基板Ｃの端部から回収する。このため、電着液Ｌ６を回収するための機構が、回収槽３８のみにて構成できる。したがって、表示デバイスの製造装置２の簡素化および小型化に寄与する。 In the method for manufacturing a display device according to the present embodiment, the electrodeposition liquid L6 having a reduced concentration of the functional material is collected from the edge of the substrate C through the surface of the substrate C. For this reason, a mechanism for collecting the electrodeposition liquid L6 can be constituted only by the collection tank 38. Therefore, it contributes to simplification and miniaturization of the display device manufacturing apparatus 2.
　〔実施形態７〕
　図８は、本実施形態に係る表示デバイスの製造装置２を使用して、基板Ｃに対し電着を実施する方法の一例を示す概略図である。図８に示すように、本実施形態に係る表示デバイスの製造装置２は、電着ヘッド６が、電着ヘッド電極１８を介して電着液供給路２０と反対側に、電着液回収路４４を備える。 [Embodiment 7]
FIG. 8 is a schematic diagram illustrating an example of a method for performing electrodeposition on a substrate C using the display device manufacturing apparatus 2 according to the present embodiment. As shown in FIG. 8, in the display device manufacturing apparatus 2 according to the present embodiment, the electrodeposition head 6 is disposed on the side opposite to the electrodeposition liquid supply path 20 via the electrodeposition head electrode 18 and the electrodeposition liquid recovery path. 44.
　また、電着面６Ｓには、電着ヘッド電極表面１８Ｓを介して電着液供給口２０Ａと反対側に、電着液回収路４４と連通する開口である、電着液回収口４４Ａが形成されている。さらに、電着液貯留槽８と電着液回収路４４とが、接続管４６を介して接続されている。 An electrodeposition liquid recovery port 44A, which is an opening communicating with the electrodeposition liquid recovery path 44, is formed on the electrodeposition surface 6S on the side opposite to the electrodeposition liquid supply port 20A via the electrodeposition head electrode surface 18S. Have been. Further, the electrodeposition liquid storage tank 8 and the electrodeposition liquid recovery path 44 are connected via a connection pipe 46.
　上述した点を除いて、本実施形態に係る表示デバイスの製造装置２は、実施形態５に係る表示デバイスの製造装置２と同一の構成を備える。 て Except for the points described above, the display device manufacturing apparatus 2 according to the present embodiment has the same configuration as the display device manufacturing apparatus 2 according to the fifth embodiment.
　本実施形態における電着工程は、前述した電着工程と同一の手法により実施される。この際、本実施形態においては、電着工程の間、電着面６Ｓ上の電着液は、図８に示す矢印Ａ６の方向、すなわち、電着液供給口２０Ａから電着液回収口４４Ａに向かって流動する。電着液供給口２０Ａから電着液回収口４４Ａへの電着液の流動の間、基板Ｃと接触している電着面６Ｓ上の電着液中の機能材料は、基板Ｃの第１電極Ｅ１と重畳する位置に電着される。 電 The electrodeposition step in this embodiment is performed by the same method as the electrodeposition step described above. At this time, in the present embodiment, during the electrodeposition step, the electrodeposition liquid on the electrodeposition surface 6S flows in the direction of arrow A6 shown in FIG. 8, that is, from the electrodeposition liquid supply port 20A to the electrodeposition liquid recovery port 44A. Flows towards. During the flow of the electrodeposition liquid from the electrodeposition liquid supply port 20A to the electrodeposition liquid recovery port 44A, the functional material in the electrodeposition liquid on the electrodeposition surface 6S in contact with the substrate C is the first material of the substrate C. Electrodeposition is performed at a position overlapping with the electrode E1.
　このため、電着面６Ｓ上の電着液が電着液供給口２０Ａから電着液回収口４４Ａへ流動する間に、電着面６Ｓ上の電着液における機能材料の濃度は低下する。本実施形態において、電着液供給口２０Ａから供給された電着液Ｌ１は、電着液回収口４４Ａにおいて、機能材料の濃度が低下した電着液Ｌ６に変化しているとする。 Therefore, while the electrodeposition liquid on the electrodeposition surface 6S flows from the electrodeposition liquid supply port 20A to the electrodeposition liquid recovery port 44A, the concentration of the functional material in the electrodeposition liquid on the electrodeposition surface 6S decreases. In the present embodiment, it is assumed that the electrodeposition liquid L1 supplied from the electrodeposition liquid supply port 20A has changed to the electrodeposition liquid L6 in which the concentration of the functional material has decreased at the electrodeposition liquid recovery port 44A.
　電着液回収口４４Ａに到達した電着液Ｌ６は、図８に示す矢印Ａ７の方向に、電着液回収路４４内を流動する。このため、電着液Ｌ６は、電着液回収口４４Ａから、電着液回収路４４と接続管４６とを介して、電着液貯留槽８に供給される。これにより、前実施形態と同様に、電着液Ｌ３と、添加剤Ｌ４と、電着液Ｌ６とは、電着液貯留槽８において混合され、電着液Ｌ１となる。 電 The electrodeposition liquid L6 that has reached the electrodeposition liquid recovery port 44A flows in the electrodeposition liquid recovery path 44 in the direction of arrow A7 shown in FIG. For this reason, the electrodeposition liquid L6 is supplied to the electrodeposition liquid storage tank 8 from the electrodeposition liquid recovery port 44A via the electrodeposition liquid recovery path 44 and the connection pipe 46. Thereby, similarly to the previous embodiment, the electrodeposition liquid L3, the additive L4, and the electrodeposition liquid L6 are mixed in the electrodeposition liquid storage tank 8, and become the electrodeposition liquid L1.
　なお、電着液Ｌ６の電着液貯留槽８への供給は、電着液貯留槽８から電着液Ｌ１を供給するためのポンプが、電着液回収路４４から電着液Ｌ６を電着液貯留槽８に引き込むことにより実現してもよい。さらに、前実施形態と同様に、電着液貯留槽８は濃度検出部４２を備え、電着液貯留槽８内の電着液Ｌ１の濃度を監視してもよい。 In supplying the electrodeposition liquid L6 to the electrodeposition liquid storage tank 8, a pump for supplying the electrodeposition liquid L1 from the electrodeposition liquid storage tank 8 transfers the electrodeposition liquid L6 from the electrodeposition liquid recovery path 44. It may be realized by drawing into the liquid storage tank 8. Further, similarly to the previous embodiment, the electrodeposition liquid storage tank 8 may be provided with a concentration detection unit 42 to monitor the concentration of the electrodeposition liquid L1 in the electrodeposition liquid storage tank 8.
　本実施形態においては、電着液供給口２０Ａから電着液回収口４４Ａまで電着液が流動する間、電着液が常に電着面６Ｓ上に存在している。このため、効率的に上述した電着工程が実施できるとともに、前実施形態と比較して、より確実に電着液Ｌ６を回収することができる。 In the present embodiment, while the electrodeposition liquid flows from the electrodeposition liquid supply port 20A to the electrodeposition liquid recovery port 44A, the electrodeposition liquid always exists on the electrodeposition surface 6S. Therefore, the above-described electrodeposition step can be performed efficiently, and the electrodeposition liquid L6 can be more reliably recovered as compared with the previous embodiment.
　上述の各実施形態に係る表示デバイスの製造方法によって製造される表示デバイスは、柔軟性を有し、屈曲可能な表示素子を備えた表示パネルを備えていてもよい。上記表示素子は、電流によって輝度や透過率が制御される表示素子と、電圧によって輝度や透過率が制御される表示素子とがある。 The display device manufactured by the method for manufacturing a display device according to each of the above-described embodiments may include a display panel having a flexible and bendable display element. The display elements include a display element whose luminance and transmittance are controlled by a current, and a display element whose luminance and transmittance are controlled by a voltage.
　例えば、上述の各実施形態に係る表示デバイスは、電流制御の表示素子として、ＯＬＥＤ（Organic Light Emitting Diode：有機発光ダイオード）を備えていてもよい。この場合、本実施形態に係る表示デバイスは、有機ＥＬ（Electro Luminescence：エレクトロルミネッセンス）ディスプレイであってもよい。 For example, the display device according to each of the above-described embodiments may include an OLED (Organic Light Emitting Diode) as a current control display element. In this case, the display device according to the present embodiment may be an organic EL (Electro Luminescence) display.
　または、上述の各実施形態に係る表示デバイスは、電流制御の表示素子として、無機発光ダイオードを備えていてもよい。この場合、本実施形態に係る表示デバイスは、無機ＥＬディスプレイ等のＥＬディスプレイＱＬＥＤ（Quantum dot Light Emitting Diode：量子ドット発光ダイオード）を備えた、ＱＬＥＤディスプレイであってもよい。 Alternatively, the display device according to each of the above embodiments may include an inorganic light emitting diode as a current control display element. In this case, the display device according to the present embodiment may be a QLED display including an EL display QLED (Quantum dot Light Emitting Diode) such as an inorganic EL display.
　また、電圧制御の表示素子としては、液晶表示素子等がある。 表示 Further, as a display element for voltage control, there is a liquid crystal display element or the like.
　本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。さらに、各実施形態にそれぞれ開示された技術的手段を組み合わせることにより、新しい技術的特徴を形成することができる。 The present invention is not limited to the embodiments described above, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.
２　　　　　　　　　　　表示デバイスの製造装置
６　　　　　　　　　　　電着ヘッド
６Ａ　　　　　　　　　　第１電着ヘッド
６Ｂ　　　　　　　　　　第２電着ヘッド
６Ｓ、６ＡＳ、６ＢＳ　　電着面
８　　　　　　　　　　　電着液貯留槽
１２　　　　　　　　　　掃引部
１８　　　　　　　　　　電着ヘッド電極
１８Ｓ　　　　　　　　　電着ヘッド電極表面（電極表面）
２０Ａ　　　　　　　　　電着液供給口
２４　　　　　　　　　　攪拌機
２６　　　　　　　　　　洗浄ヘッド
２８Ａ　　　　　　　　　洗浄液供給口
３０　　　　　　　　　　添加剤貯留槽
３０Ａ　　　　　　　　　第１添加剤貯留槽
３０Ｂ　　　　　　　　　第２添加剤貯留槽
３４　　　　　　　　　　機能材料貯留槽
３８　　　　　　　　　　回収槽
４２　　　　　　　　　　濃度検出部
４４Ａ　　　　　　　　　電着液回収口
Ｃ　　　　　　　　　　　基板
ＣＳ　　　　　　　　　　基板表面
Ｅ１　　　　　　　　　　第１電極
Ｅ２　　　　　　　　　　第２電極
Ｅ３　　　　　　　　　　第３電極
Ｌ１、Ｌ２、Ｌ３、Ｌ６　電着液
Ｌ４、Ｌ５　　　　　　　添加剤
ＬＣ　　　　　　　　　　洗浄液
Ｖ１　　　　　　　　　　第１の電位
Ｖ２　　　　　　　　　　第２の電位
Ｖ３　　　　　　　　　　第３の電位 2 Display device manufacturing apparatus 6 Electrodeposition head 6A First electrodeposition head 6B Second electrodeposition head 6S, 6AS, 6BS Electrodeposition surface 8 Electrodeposition liquid storage tank 12 Sweep unit 18 Electrodeposition head electrode 18S Electrodeposition head electrode surface (Electrode surface)
20A Electrodeposition liquid supply port 24 Stirrer 26 Cleaning head 28A Cleaning liquid supply port 30 Additive storage tank 30A First additive storage tank 30B Second additive storage tank 34 Functional material storage tank 38 Recovery tank 42 Concentration detector 44A Electrodeposition liquid Collection port C Substrate CS Substrate surface E1 First electrode E2 Second electrode E3 Third electrode L1, L2, L3, L6 Electrodeposition liquid L4, L5 Additive LC Cleaning liquid V1 First potential V2 Second potential V3 Third potential

Claims (25)

  1. 　電着液供給口と電着ヘッド電極とを備えた、基板よりも面積が小さい電極表面を有する電着ヘッドを用いて、前記基板に形成された基板電極に対する電着を行う表示デバイスの製造方法であって、
    　前記電着ヘッドおよび前記基板の少なくとも一方を相対移動させる掃引工程と、
    　前記電着液供給口から供給された機能材料を含む電着液を、前記基板の面積より小さい面積において前記基板の表面に接触させる接触工程と、
    　前記電着ヘッド電極に第１の電位を印加し、少なくとも前記電着液に接触している前記基板電極のうち、前記機能材料を電着しない基板電極に第２の電位を印加し、機能材料を電着する基板電極に第３の電位を印加する電着工程とを備え、
    　前記第１の電位と前記第３の電位との差の絶対値が、前記第１の電位と前記第２の電位との差の絶対値よりも大きい表示デバイスの製造方法。     A method of manufacturing a display device for performing electrodeposition on a substrate electrode formed on a substrate by using an electrodeposition head having an electrode surface having an area smaller than that of a substrate and having an electrodeposition liquid supply port and an electrodeposition head electrode And
    A sweeping step of relatively moving at least one of the electrodeposition head and the substrate,
    A contacting step of contacting the electrodeposition liquid containing the functional material supplied from the electrodeposition liquid supply port with the surface of the substrate in an area smaller than the area of the substrate,
    Applying a first electric potential to the electrodeposition head electrode, and applying a second electric potential to at least a substrate electrode which does not electrodeposit the functional material among the substrate electrodes in contact with the electrodeposition liquid; An electrodeposition step of applying a third potential to a substrate electrode for electrodepositing
    A method for manufacturing a display device, wherein an absolute value of a difference between the first potential and the third potential is larger than an absolute value of a difference between the first potential and the second potential.
  2. 　少なくとも前記電着液に接触している前記基板の表面と重畳する前記基板電極のうち、前記機能材料を電着する基板電極と前記電着ヘッド電極とが、前記電着液を介して対向する請求項１に記載の表示デバイスの製造方法。 Of the substrate electrodes overlapping at least the surface of the substrate in contact with the electrodeposition liquid, the substrate electrode for electrodepositing the functional material and the electrodeposition head electrode face each other via the electrodeposition liquid. A method for manufacturing the display device according to claim 1.
  3. 　前記掃引工程が、前記電着ヘッドが通過した後に、洗浄液供給口を備えた洗浄ヘッドを通過させ、洗浄液により前記基板を洗浄する洗浄工程を備えた請求項１または２に記載の表示デバイスの製造方法。 3. The manufacturing of the display device according to claim 1, wherein the sweeping step includes a cleaning step of cleaning the substrate with a cleaning liquid after passing the electrodeposition head through a cleaning head having a cleaning liquid supply port. 4. Method.
  4. 　前記電着ヘッドが、第１電着ヘッドと、該第１電着ヘッドと異なる第２電着ヘッドとを備え、
    　前記掃引工程において、第１の波長を発光する画素に対応する電着液を供給する前記第１電着ヘッドが相対移動して、かつ、第１の波長と異なる第２の波長を発光する画素に対応する電着液を供給する前記第２電着ヘッドが相対移動して、
    　前記電着工程が、第１材料を所定の基板電極に成膜する第１電着工程と、前記第１材料と異なる第２材料を所定の基板電極に成膜する第２電着工程とを含む請求項１から３の何れか１項に記載の表示デバイスの製造方法。     The electrodeposition head includes a first electrodeposition head and a second electrodeposition head different from the first electrodeposition head,
    In the sweeping step, the first electrodeposition head for supplying the electrodeposition liquid corresponding to the pixel emitting the first wavelength relatively moves, and the pixel emits the second wavelength different from the first wavelength. The second electrodeposition head that supplies the electrodeposition liquid corresponding to
    The electrodeposition step includes a first electrodeposition step of forming a first material on a predetermined substrate electrode and a second electrodeposition step of forming a second material different from the first material on a predetermined substrate electrode. The method for manufacturing a display device according to claim 1, further comprising:
  5. 　前記第１材料と前記第２材料との少なくとも何れかが、発光材料である請求項４に記載の表示デバイスの製造方法。 The method according to claim 4, wherein at least one of the first material and the second material is a light emitting material.
  6. 　前記掃引工程が、前記第１電着ヘッドと前記第２電着ヘッドとの相対移動の間に、洗浄液供給口を備えた洗浄ヘッドを通過させ、洗浄液により前記基板を洗浄する洗浄工程を備えた請求項４または５に記載の表示デバイスの製造方法。 The sweeping step includes a cleaning step of passing a cleaning head provided with a cleaning liquid supply port and cleaning the substrate with a cleaning liquid during a relative movement between the first electrodeposition head and the second electrodeposition head. A method for manufacturing a display device according to claim 4.
  7. 　前記電着ヘッドが、前記電着ヘッドに前記電着液を供給するための電着液貯留槽と連通し、前記電着液貯留槽において前記電着液を攪拌する請求項１から６の何れか１項に記載の表示デバイスの製造方法。 7. The electrodeposition head according to claim 1, wherein the electrodeposition head communicates with an electrodeposition liquid storage tank for supplying the electrodeposition liquid to the electrodeposition head, and stirs the electrodeposition liquid in the electrodeposition liquid storage tank. 9. The method for manufacturing a display device according to claim 1.
  8. 　前記電着ヘッドが、前記電着ヘッドに前記電着液を供給するための機能材料貯留槽および添加剤貯留槽と連通し、前記機能材料貯留槽における機能材料と前記添加剤貯留槽における添加剤とが混合されて前記電着液となり、前記電着ヘッドに供給される請求項１から６の何れか１項に記載の表示デバイスの製造方法。 The electrodeposition head communicates with a functional material storage tank and an additive storage tank for supplying the electrodeposition liquid to the electrodeposition head, and a functional material in the functional material storage tank and an additive in the additive storage tank The method according to any one of claims 1 to 6, wherein the liquid is mixed with the electrodeposition liquid to be supplied to the electrodeposition head.
  9. 　前記添加剤貯留槽が複数である請求項８に記載の表示デバイスの製造方法。 方法 The method for manufacturing a display device according to claim 8, wherein the additive storage tank is plural.
  10. 　前記機能材料と前記添加剤とが、前記電着ヘッドと連通する混合槽において混合される請求項８または９に記載の表示デバイスの製造方法。 10. The method of manufacturing a display device according to claim 8, wherein the functional material and the additive are mixed in a mixing tank communicating with the electrodeposition head.
  11. 　接触工程が、前記基板に接触し、前記機能材料の濃度が低下した前記電着液を回収する回収工程を備える請求項１から１０の何れか１項に記載の表示デバイスの製造方法。 The method of manufacturing a display device according to any one of claims 1 to 10, wherein the contacting step includes a collecting step of collecting the electrodeposition liquid having a reduced concentration of the functional material in contact with the substrate.
  12. 　回収工程において、前記電着液が、前記基板の表面を介して前記基板の端部から回収される請求項１１に記載の表示デバイスの製造方法。 The method for manufacturing a display device according to claim 11, wherein in the collecting step, the electrodeposition liquid is collected from an end of the substrate via a surface of the substrate.
  13. 　前記電着ヘッドが、さらに、前記基板に接触し、前記機能材料の濃度が低下した前記電着液を回収するための電着液回収口を備え、
    　前記掃引工程において、前記電着ヘッドと前記基板とが相対移動して前記機能材料を前記基板電極に電着している間、前記電着液が前記電着液供給口から前記電着液回収口へ流動する請求項１１に記載の表示デバイスの製造方法。     The electrodeposition head further comprises an electrodeposition liquid recovery port for collecting the electrodeposition liquid having a reduced concentration of the functional material in contact with the substrate,
    In the sweeping step, while the electrodeposition head and the substrate relatively move to electrodeposit the functional material on the substrate electrode, the electrodeposition liquid is collected from the electrodeposition liquid supply port while the electrodeposition liquid is collected. The method for manufacturing a display device according to claim 11, wherein the display device flows to a mouth.
  14. 　前記電着ヘッドが、前記電着液供給口と前記電着液回収口との間に前記電着ヘッド電極を備えた請求項１３に記載の表示デバイスの製造方法。 14. The method for manufacturing a display device according to claim 13, wherein the electrodeposition head includes the electrodeposition head electrode between the electrodeposition liquid supply port and the electrodeposition liquid recovery port.
  15. 　前記機能材料の濃度が低下した前記電着液を再利用する請求項１１から１４の何れか１項に記載の表示デバイスの製造方法。 The method according to any one of claims 11 to 14, wherein the electrodeposition liquid having a reduced concentration of the functional material is reused.
  16. 　前記機能材料がナノ粒子を含む請求項１から１５の何れか１項に記載の表示デバイスの製造方法。 The method according to any one of claims 1 to 15, wherein the functional material includes nanoparticles.
  17. 　基板に形成された基板電極に対する電着を行う表示デバイスの製造装置であって、
    　電着液供給口と電着ヘッド電極とを備え、前記基板よりも面積が小さい電極表面を有する電着ヘッドと、
    　前記電着ヘッドおよび前記基板の少なくとも一方を相対移動させる掃引部とを備え、
    　前記電着液供給口から供給された機能材料を含む電着液を、前記基板の面積より小さい面積において前記基板の表面に接触させ、前記電着ヘッド電極に第１の電位を印加し、少なくとも前記電着液に接触している前記基板電極のうち、前記機能材料を電着しない基板電極に第２の電位を印加し、機能材料を電着する基板電極に第３の電位を印加し、前記第１の電位と前記第３の電位との差の絶対値が、前記第１の電位と前記第２の電位との差の絶対値よりも大きい表示デバイスの製造装置。     An apparatus for manufacturing a display device for performing electrodeposition on a substrate electrode formed on a substrate,
    An electrodeposition head having an electrodeposition liquid supply port and an electrodeposition head electrode, and having an electrode surface having an area smaller than the substrate,
    A sweep unit that relatively moves at least one of the electrodeposition head and the substrate,
    The electrodeposition liquid containing the functional material supplied from the electrodeposition liquid supply port is brought into contact with the surface of the substrate in an area smaller than the area of the substrate, and a first potential is applied to the electrodeposition head electrode, Of the substrate electrodes in contact with the electrodeposition liquid, a second potential is applied to a substrate electrode that does not electrodeposit the functional material, and a third potential is applied to a substrate electrode that electrodeposits the functional material, An apparatus for manufacturing a display device, wherein an absolute value of a difference between the first potential and the third potential is larger than an absolute value of a difference between the first potential and the second potential.
  18. 　前記電着ヘッドにおいて、前記電着ヘッド電極が、前記基板と対向する方向に位置している請求項１７に記載の表示デバイスの製造装置。 18. The display device manufacturing apparatus according to claim 17, wherein in the electrodeposition head, the electrodeposition head electrode is located in a direction facing the substrate.
  19. 　前記電着ヘッドが複数である請求項１７または１８に記載の表示デバイスの製造装置。 19. The display device manufacturing apparatus according to claim 17, wherein the plurality of electrodeposition heads are provided.
  20. 　前記複数の電着ヘッドの間において、前記電着ヘッドに供給される前記電着液が含む機能材料が異なる請求項１９に記載の表示デバイスの製造装置。 20. The apparatus for manufacturing a display device according to claim 19, wherein the functional material contained in the electrodeposition liquid supplied to the electrodeposition head differs between the plurality of electrodeposition heads.
  21. 　前記電着液を含む機能材料貯留槽と、添加剤を含む添加剤貯留槽をさらに備え、前記添加剤と前記機能材料貯留槽における前記電着液とが混合される請求項１７から２０の何れか１項に記載の表示デバイスの製造装置。 21. Any of claims 17 to 20, further comprising a functional material storage tank containing the electrodeposition liquid, and an additive storage tank containing an additive, wherein the additive and the electrodeposition liquid in the functional material storage tank are mixed. 2. The apparatus for manufacturing a display device according to claim 1.
  22. 　前記電着液を含む機能材料貯留槽と、前記基板に接触し、前記機能材料の濃度が低下した前記電着液を含む回収槽と、前記機能材料貯留槽中の前記電着液と、前記回収槽中の前記電着液とを混合する混合槽とを備え、
    　前記混合槽が、前記機能材料の濃度を検出する濃度検出部を備え、
    　前記混合槽において混合された前記電着液を前記電着ヘッドに供給する請求項１７から２０の何れか１項に記載の表示デバイスの製造装置。     A functional material storage tank containing the electrodeposition liquid, a collection tank containing the electrodeposition liquid having a reduced concentration of the functional material in contact with the substrate, and the electrodeposition liquid in the functional material storage tank; A mixing tank for mixing the electrodeposition liquid in the recovery tank,
    The mixing tank includes a concentration detector that detects the concentration of the functional material,
    21. The display device manufacturing apparatus according to claim 17, wherein the electrodeposition liquid mixed in the mixing tank is supplied to the electrodeposition head.
  23. 　前記回収槽中に、前記濃度検出部を備えた請求項２２に記載の表示デバイスの製造装置。 23. The apparatus for manufacturing a display device according to claim 22, wherein the concentration detector is provided in the collection tank.
  24. 　前記電着ヘッドが、さらに、前記基板に接触し、前記機能材料の濃度が低下した前記電着液を回収するための電着液回収口を備え、
    　前記電着液を含む機能材料貯留槽と、前記機能材料貯留槽中の前記電着液と、前記電着液回収口を介して回収された前記電着液とを混合する混合槽とを備え、
    　前記混合槽が、前記機能材料の濃度を検出する濃度検出部を備え、
    　前記混合槽において混合された前記電着液を前記電着ヘッドに供給する請求項１７から２０の何れか１項に記載の表示デバイスの製造装置。     The electrodeposition head further comprises an electrodeposition liquid recovery port for collecting the electrodeposition liquid having a reduced concentration of the functional material in contact with the substrate,
    A functional material storage tank containing the electrodeposition liquid, and a mixing tank for mixing the electrodeposition liquid in the functional material storage tank and the electrodeposition liquid collected through the electrodeposition liquid recovery port. ,
    The mixing tank includes a concentration detector that detects the concentration of the functional material,
    21. The display device manufacturing apparatus according to claim 17, wherein the electrodeposition liquid mixed in the mixing tank is supplied to the electrodeposition head.
  25. 　添加剤を含む添加剤貯留槽をさらに備え、前記混合槽において、前記添加剤と前記混合槽における前記電着液とが混合される請求項２２から２４の何れか１項に記載の表示デバイスの製造装置。 The display device according to any one of claims 22 to 24, further comprising an additive storage tank containing an additive, wherein the additive and the electrodeposition liquid in the mixing tank are mixed in the mixing tank. Manufacturing equipment.
PCT/JP2018/036455 2018-09-28 2018-09-28 Method for manufacturing display device and apparatus for manufacturing display device WO2020065967A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/036455 WO2020065967A1 (en) 2018-09-28 2018-09-28 Method for manufacturing display device and apparatus for manufacturing display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/036455 WO2020065967A1 (en) 2018-09-28 2018-09-28 Method for manufacturing display device and apparatus for manufacturing display device

Publications (1)

Publication Number Publication Date
WO2020065967A1 true WO2020065967A1 (en) 2020-04-02

Family

ID=69952977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/036455 WO2020065967A1 (en) 2018-09-28 2018-09-28 Method for manufacturing display device and apparatus for manufacturing display device

Country Status (1)

Country Link
WO (1) WO2020065967A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539595A (en) * 1990-11-28 1993-02-19 Somar Corp Method for electrodeposition coating and device therefor
JP2001073193A (en) * 1999-09-08 2001-03-21 Dainippon Printing Co Ltd Formation of insulated film and electronic member
WO2001078151A2 (en) * 2000-04-11 2001-10-18 Rockwell Technologies, Llc Patterning of polymer light emitting devices using electrochemical polymerization
JP2001291588A (en) * 2000-02-04 2001-10-19 Semiconductor Energy Lab Co Ltd Thin film forming device and manufacturing method of self-illuminating device using the same
JP2002313565A (en) * 2001-04-17 2002-10-25 Sharp Corp Method of manufacturing luminescent display element
JP2003098331A (en) * 2001-09-20 2003-04-03 Fuji Xerox Co Ltd Method for forming polymer thin film, and color filter
WO2011001613A1 (en) * 2009-07-02 2011-01-06 シャープ株式会社 Organic el element, process for manufacturing organic el element, and organic el display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539595A (en) * 1990-11-28 1993-02-19 Somar Corp Method for electrodeposition coating and device therefor
JP2001073193A (en) * 1999-09-08 2001-03-21 Dainippon Printing Co Ltd Formation of insulated film and electronic member
JP2001291588A (en) * 2000-02-04 2001-10-19 Semiconductor Energy Lab Co Ltd Thin film forming device and manufacturing method of self-illuminating device using the same
WO2001078151A2 (en) * 2000-04-11 2001-10-18 Rockwell Technologies, Llc Patterning of polymer light emitting devices using electrochemical polymerization
JP2002313565A (en) * 2001-04-17 2002-10-25 Sharp Corp Method of manufacturing luminescent display element
JP2003098331A (en) * 2001-09-20 2003-04-03 Fuji Xerox Co Ltd Method for forming polymer thin film, and color filter
WO2011001613A1 (en) * 2009-07-02 2011-01-06 シャープ株式会社 Organic el element, process for manufacturing organic el element, and organic el display device

Similar Documents

Publication Publication Date Title
US7404614B2 (en) Droplet discharge device, method of discharging droplet, method of manufacturing electro-optical device, electro-optical device and electro equipment
US7408699B2 (en) Electrophoretic display and methods of addressing such display
US7910175B2 (en) Processes for the production of electrophoretic displays
US7219976B2 (en) Wiping device, droplet discharge device, electro-optical device, method for manufacturing an electro-optical device, and electronic equipment
US7308913B2 (en) Liquid filling method, liquid filling apparatus, and discharge apparatus
CN104979484A (en) Organic light emitting diode display device and method of fabricating the same
WO2020136713A1 (en) Method for manufacturing light-emitting device
US11111592B2 (en) Manufacturing apparatus and manufacturing method for semiconductor device
WO2020065967A1 (en) Method for manufacturing display device and apparatus for manufacturing display device
JP4774891B2 (en) Display device and manufacturing method thereof
JP2009146860A (en) Organic electroluminescent element, and method of driving organic electroluminescent element
JP2008225348A (en) Inspection measuring instrument for droplet discharge device, droplet discharge device equipped with the same, manufacturing method of electro-optical device, the electro-optical device, and electronic equipment
CN106476433B (en) Droplet discharge method and method for manufacturing organic EL device
CN104118211A (en) Method for discharging liquid body, method for manufacturing color filter, and method for manufacturing organic EL device
KR101947377B1 (en) Electrophoretic display device and method for manufacturing the same
JP2009043561A (en) Element material deposition method, and element material deposition apparatus
EP2503032A1 (en) A method of cleaning a surface
WO1997019373A1 (en) Method and device for manufacturing color filter
KR20170058685A (en) Electro hydro dynamic inkjet apparatus
JP2008153550A (en) Semiconductor device, manufacturing method of semiconductor device, electrooptical device, and electronic apparatus
KR20150039162A (en) Apparatus and method for treating substrate
JP3631091B2 (en) Method for manufacturing electrophoretic display device
CN217835113U (en) Ink jet printing apparatus
US20070146400A1 (en) Inkjet apparatus and inkjet method for ink deposition with improved precision
JP4967732B2 (en) Discharge control method for liquid droplet ejection apparatus, liquid droplet ejection apparatus, and electro-optical device manufacturing method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18935046

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18935046

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP