WO2020065909A1

WO2020065909A1 - Slit coater, coating method, and display device production method

Info

Publication number: WO2020065909A1
Application number: PCT/JP2018/036219
Authority: WO
Inventors: 杉本　宏; 哲憲田中
Original assignee: シャープ株式会社
Priority date: 2018-09-28
Filing date: 2018-09-28
Publication date: 2020-04-02

Abstract

This slit coater comprises a coater head (50) that is provided with a feed port (51) to which a liquid material is supplied and with a dispensing port (52) for dispensing the liquid material on a surface that is being coated. On at least one of the two ends (E1, E2) of the coater head in the longitudinal direction, a discharge port (53, 54) for discharging liquid material (Lh), which is inside the end, to the outside of the surface being coated is provided so as to be separated from the dispensing port (52).

Description

Slit coater, coating method, display device manufacturing method

The present invention relates to a slit coater, a coating method, and a method for manufacturing a display device.

Patent Document 1 discloses a slit coater for manufacturing a display device.

Japanese Unexamined Patent Publication "Japanese Patent Application Laid-Open No. 2007-203293 (August 16, 2007)"

構成 In the configuration of Patent Document 1, there is a problem that foreign matter accumulated at the end of the coater head (slit nozzle) is discharged from the discharge port and is applied (discharged) to the substrate (coated surface).

A slit coater according to one embodiment of the present invention includes a coater head provided with a supply port through which a liquid material is supplied and a discharge port that discharges the liquid material on a surface to be coated, and both ends in a longitudinal direction of the coater head. In at least one of the portions, a discharge port for discharging the liquid material in the end portion other than the surface to be coated is provided separately from the discharge port.

According to one aspect of the present invention, it is possible to prevent foreign matter in the coater head from being discharged to the surface to be coated.

5 is a flowchart illustrating an example of a method for manufacturing a display device. It is sectional drawing of the display area of a display device. FIG. 2A is a block diagram illustrating a configuration of the slit coater according to the first embodiment. It is a top view showing composition of a slit coater of Embodiment 1, and (b) is bb sectional drawing of (a). It is a top view which shows the example of a structure of the discharge port and discharge port of a slit coater. (A), (b) is explanatory drawing which shows operation | movement of the slit coater of Embodiment 1. FIG. (A) is a top view showing a modification of the slit coater of Embodiment 1, and (b) is a bb sectional view of (a). (A) is a top view showing a modification of the slit coater of Embodiment 1, and (b) is a bb sectional view of (a). (A), (b) is sectional drawing which shows the modification of the slit coater of Embodiment 1. FIG. (A) is a block diagram which shows the modification of the slit coater of Embodiment 2, (b) is explanatory drawing which shows the operation | movement of the slit coater of (a). FIG. 13 is a block diagram illustrating a configuration of a slit coater according to a third embodiment. (A) is a plan view showing the configuration of the slit coater of Embodiment 3, and (b) is a bb cross-sectional view of (a). FIG. 14 is a block diagram illustrating a configuration of a slit coater according to a fourth embodiment.

FIG. 1 is a flowchart illustrating an example of a method for manufacturing a display device. FIG. 2A is a cross-sectional view illustrating a configuration on a supporting substrate, and FIG. 2B is a configuration illustrating a configuration on a lower film. It is sectional drawing.

As shown in FIGS. 1 and 2, when manufacturing the flexible display device 2, first, the resin layer 12 is formed on the translucent support substrate 100 (for example, mother glass) (Step S1). Next, the barrier layer 3 is formed (Step S2). Next, the TFT layer 4 is formed (Step S3). Next, a top emission type light emitting element layer 5 is formed (Step S4). Thereby, the light emitting element ES is formed in the display area. Next, the sealing layer 6 is formed (Step S5). Next, an upper surface film is attached on the sealing layer 6 (Step S6). Next, the support substrate 100 is separated from the resin layer 12 by laser light irradiation or the like (Step S7). Next, the lower surface film 10 is attached to the lower surface of the resin layer 12 (Step S8). Next, the laminate including the lower film 10, the resin layer 12, the barrier layer 3, the TFT layer 4, the light emitting element layer 5, and the sealing layer 6 is divided to obtain a plurality of pieces (Step S9). Next, the functional film 39 is attached to the obtained individual pieces (Step S10). Next, an electronic circuit board (a driver chip, a flexible printed board, or the like) is mounted on the terminal portion in the frame area (step S11). Steps S1 to S11 are performed by a display device manufacturing apparatus (including a film forming apparatus that performs each step of steps S1 to S5).

ポリイミド As a material of the resin layer 12, for example, polyimide or the like can be used. The barrier layer 3 is a layer that prevents foreign substances such as water, oxygen, and mobile ions from entering the TFT layer 4 and the light emitting element layer 5. For example, a silicon oxide film, a silicon nitride film, Alternatively, it can be composed of a silicon oxynitride film or a stacked film of these.

低温 The semiconductor layer 15 of the TFT layer 4 can be made of low-temperature polysilicon (LTPS) or an oxide semiconductor (for example, an In-Ga-Zn-O-based semiconductor). The transistor Tr is configured to include the semiconductor layer 15 and the gate electrode GE.

The gate electrode GE, the gate wiring GH, the capacitor electrode CE, and the source wiring SH included in the TFT layer 4 are, for example, single-layer metal films containing at least one of aluminum, tungsten, molybdenum, tantalum, chromium, titanium, and copper. Or it is constituted by a multilayer metal film.

(4) The inorganic

insulating films

16, 18, and 19 can be composed of, for example, a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, or a laminated film of these films formed by a CVD method. The interlayer insulating film 21 can be made of, for example, an applyable organic material such as polyimide or acrylic resin.

The light emitting element layer 5 includes the anode 22, an edge cover 23 covering the edge of the anode 22, an EL (electroluminescence) layer 24, and a cathode 25 above the EL layer 24. For the edge cover 23, for example, an applyable organic material such as polyimide or acrylic resin can be used.

表示 In the display area, a display element is provided for each sub-pixel. The display element includes a light-emitting element ES (for example, OLED: organic light-emitting diode, QLED: quantum dot light-emitting diode) formed on the light-emitting element layer 5 including the island-shaped anode 22, the EL layer 24, and the cathode 25; A control circuit for the element ES (formed on the TFT layer 4 and including the transistor Tr).

The EL layer 24 is formed by, for example, stacking a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the lower layer side. The light emitting layer is formed in an island shape by an evaporation method or an ink jet method so as to overlap the opening of the third resin layer (edge cover) 23. Other layers are formed in an island shape or a solid shape (common layer). Further, a configuration in which one or more of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer are not formed is also possible.

In the case where the light emitting layer of the OLED is formed by vapor deposition, an FMM (fine metal mask) is used. The FMM is a sheet having a large number of through-holes (for example, made of Invar material), and an island-shaped light-emitting layer (corresponding to one sub-pixel) is formed by an organic substance passing through one through-hole.

The light emitting layer of the QLED can form an island-shaped light emitting layer (corresponding to one sub-pixel), for example, by inkjet coating a solvent in which quantum dots are diffused.

The anode (anode) 22 is made of, for example, a laminate of ITO (Indium Tin Oxide) and Ag (silver) or an alloy containing Ag, and has light reflectivity. The cathode (cathode) 25 can be made of a light-transmitting conductive material such as an MgAg alloy (extremely thin film), ITO, or IZO (Indium Zinc Oxide).

When the light emitting element ES is an OLED, holes and electrons are recombined in the light emitting layer due to a driving current between the anode 22 and the cathode 25, and light is emitted in a process in which the generated excitons transition to the ground state. . Since the cathode 25 is translucent and the anode 22 is light-reflective, the light emitted from the EL layer 24 is directed upward, resulting in top emission.

When the light emitting device ES is a QLED, holes and electrons are recombined in the light emitting layer due to the driving current between the anode 22 and the cathode 25, and the excitons generated by the recombination generate conduction band levels of the quantum dots. Light (fluorescence) is emitted in the process of transitioning from to the valence band (valence band).

発光 A light emitting element (such as an inorganic light emitting diode) other than the OLED and QLED may be formed in the light emitting element layer 5.

The sealing layer 6 is translucent, and covers an inorganic sealing film 26 covering the cathode 25, an organic buffer film 27 above the inorganic sealing film 26, and an inorganic sealing film 28 above the organic buffer film 27. And The sealing layer 6 covering the light emitting element layer 5 prevents foreign substances such as water, oxygen, and mobile ions from penetrating into the light emitting element layer 5.

The lower surface film 10 is, for example, a PET film for realizing a display device having excellent flexibility by peeling off the support substrate 100 and attaching the lower surface film 10 to the lower surface of the resin layer 12. The functional film 39 has, for example, at least one of an optical compensation function, a touch sensor function, and a protection function.

[Embodiment 1]
FIG. 3A is a block diagram illustrating a configuration of the slit coater according to the first embodiment. FIG. 4A is a plan view illustrating a configuration of the slit coater according to the first embodiment, and FIG. 4B is a cross-sectional view taken along line bb of FIG. 4A. FIG. 5 is a plan view showing a configuration example of a discharge port and a discharge port of the slit coater.

The slit coater SC is used, for example, in the process of forming the resin layer (resin film) 12, the interlayer insulating film (resin film) 21, and the edge cover (resin film) 23 in FIG.

As shown in FIGS. 3 and 4, the slit coater SC drives a control unit 40 that controls each unit of the slit coater SC, a coater head 50 that discharges a liquid material (also referred to as a slit nozzle), and a coater head 50. A head driving unit 60 that supplies the liquid material L to the coater head 50; and a recovery mechanism 80 that recovers the liquid material Lh.

The coater head 50 has an elongated cylindrical housing, and is set so as to straddle the substrate TK placed on the stage ST. Both ends E1 and E2 in the longitudinal direction of the coater head 50 do not overlap with the substrate TK in plan view.

The coater head 50 has a supply port 51 for receiving the supply of the liquid material L from the liquid material supply unit 70, a discharge port 52 for discharging the liquid material Lk to the upper surface (application surface) of the substrate TK, and a longitudinal end of the coater head 50.

Discharge ports

53 and 54 are provided for discharging the liquid material Lh (the liquid material likely to include the foreign matter Pz) in the end portions E1 and E2 in the directions. The distance between the discharge port 52 and the upper surface of the substrate TK is 100 μm to 300 μm.

The substrate TK may be, for example, the support substrate 100 in FIG. 2 or a laminate of the support substrate 100, the resin layer 12, the barrier layer 3, and a part of the TFT layer 4 (up to the source layer including the source wiring SH). Is also good.

The liquid material L is, for example, a precursor (polyamic acid) of polyimide. However, there is a case where foreign matter Pz (silicon-based or metal-based substance) is mixed in the liquid material L supplied from the liquid material supply unit 70. In addition, in addition, foreign matter Pz (a substance in which the liquid material is solidified) may be generated even in the liquid stopping area of the coater head 50, and these foreign matter Pz tends to accumulate at the longitudinal ends E1 and E2 of the coater head 50. .

In FIG. 4, a discharge port 52 and

discharge ports

53 and 54 are provided on the bottom surface of the coater head 50 facing the surface to be coated, and a discharge port 53 is formed at one end E1 of the coater head 50 in the longitudinal direction. An outlet 54 is formed at the end E2. The discharge port 52 is formed in the gap between the

discharge ports

53 and 54 so as to be separated from the

discharge ports

53 and 54.
The supply port 51 is provided at the center of the coater head 50 (a gap between both ends E1 and E2). Providing the supply port 51 at the center makes it easier to adjust the pressure in the head than when it is provided at both ends.

As shown in FIG. 5, the discharge port 52 includes a plurality of discharge slits 52s arranged in the longitudinal direction of the coater head (a direction orthogonal to the coater moving direction), and the discharge port 53 includes a plurality of discharge slits 53s arranged in the longitudinal direction. The discharge port 54 is composed of a plurality of discharge slits 54s arranged in the longitudinal direction. The separation distance Df (longitudinal separation distance) between the discharge port 52 and the

discharge ports

53 and 54 is larger than the width dimension Wy (size in the longitudinal direction) of the discharge port. Therefore, it is possible to reliably discharge the liquid material from the

discharge ports

53 and 54 while preventing the liquid material from being discharged more than necessary to a portion other than the upper surface of the substrate TK.

開口 The opening areas of the discharge slits 53s and 54s are smaller than the opening area of the discharge slit 52s. The width Wy of the

discharge ports

53 and 54 is smaller than the width Wx of the discharge port 52, and the width Wd of the discharge slits 53s and 54s is smaller than the width Wk of the discharge slit.

The collection mechanism 80 includes a storage section 83 for receiving the liquid material Lh discharged below the

discharge ports

53 and 54, and a discharge pipe section 84 for flowing the stored liquid material Lh.

(4) The head driving section 60 drives the coater head 50 in the direction of the arrow in FIG. 4A (downward in the figure) based on the instruction signal from the control section 40. The liquid material supply unit 70 supplies the liquid material L to the coater head 50 from a liquid material tank (not shown) based on an instruction signal from the control unit 40.

FIGS. 6A and 6B are explanatory diagrams showing the operation of the slit coater of the first embodiment. In the case of FIG. 6A, the liquid material Lh including the foreign matter Pz is discharged from the

discharge ports

53 and 54 and stored in the storage section 83 during the application period in which the liquid material Lk is coated on the substrate TK. Thereby, the possibility that the foreign matter Pz in the coater head 50 is discharged from the discharge port 52 and applied to the substrate TK is reduced. Regarding the discharge slits 53s and 54s of the

discharge ports

53 and 54, the liquid material at the end is discharged from the discharge slits 53s and 54s by the pressure in the head during the coating period (the pressure of the liquid material filled in the coater head). Shape.

As shown in FIG. 6B, the liquid material Lh may not be discharged during the application period, and may be discharged from the

discharge ports

53 and 54 during a maintenance period provided after the application period. The discharge slits 53s and 54s of the

discharge ports

53 and 54 are formed so that the liquid material Lh is not discharged from the

discharge ports

53 and 54 by the pressure in the head during the application period. In the maintenance period, the pressure in the head is set higher than that in the application period, and the liquid material Lh at the end is discharged from the

outlets

53 and 54. At this time, since the liquid material is also discharged from the discharge port 52, it is desirable to place a storage pan or a dummy substrate so as not to stain the stage ST.

7 (a) is a plan view showing a modification of the slit coater of Embodiment 1, and FIG. 7 (b) is a cross-sectional view taken along the line bb of FIG. 7 (a). As shown in FIG. 7, a discharge port 53 can be provided only at one end E1 of the coater head 50.

FIG. 8A is a plan view showing a modification of the slit coater according to the first embodiment, and FIG. 8B is a cross-sectional view taken along line bb of FIG. In FIG. 4, the

outlets

53 and 54 are provided on the bottom surface of the coater head 50, but the present invention is not limited to this. As shown in FIG. 8,

discharge ports

53 and 54 may be provided on two side surfaces (both side surfaces perpendicular to the bottom surface) of the coater head 50 facing in the longitudinal direction.

FIGS. 9A and 9B are cross-sectional views showing a modification of the slit coater of the first embodiment. As shown in FIG. 9A, a housing 83 that wraps the outlets 53 and 54 (formed on the bottom surfaces of both ends E1 and E2) of the coater head 50 may be attached to the coater head 50, As shown in FIG. 9B, a housing 83 that wraps the outlets 53 and 54 (formed on the side surfaces of both ends E1 and E2) of the coater head 50 may be attached to the coater head 50.

[Embodiment 2]
FIG. 10A is a block diagram illustrating a modified example of the slit coater according to the second embodiment, and FIG. 10B is an explanatory diagram illustrating an operation of the slit coater illustrated in FIG. In the first embodiment, the liquid material Lh at the end is discharged from the

outlets

53 and 54, but is not limited thereto. As shown in FIG. 10, a suction unit 81 is provided in the collection mechanism 80, and during the maintenance period after the application period (for example, after applying a predetermined number of substrates), the liquid material Lh at the end is discharged to the

outlets

53 and 54. It can also be sucked out and discharged. Note that, during the application period, the liquid material Lh at the end can be sucked and discharged from the

discharge ports

53 and 54.

[Embodiment 3]
FIG. 11 is a block diagram illustrating a configuration of the slit coater according to the third embodiment. FIG. 12A is a plan view showing the configuration of the slit coater according to the third embodiment, and FIG. 12B is a cross-sectional view taken along line bb of FIG. 12A. In the third embodiment, the collection unit 80 is provided with the

transport units

82a and 82b. As illustrated in FIG. 11, the transport unit 82a includes a plurality of rollers Ra arranged in the traveling direction below the coater head 50, intersects one end E1 of the coater head 50, and overlaps the discharge port 53 in a plan view. . The transport section 82b includes a plurality of rollers Rb arranged in the traveling direction below the coater head 50, crosses the other end E2 of the coater head 50, and overlaps the discharge port 54 in a plan view.

In the third embodiment, the liquid material Lh discharged from the

discharge ports

53 and 54 is transported by the rotating rollers Ra and Rb, and is collected in the storage unit 83. Thereby, the discharge efficiency from the

discharge ports

53 and 54 can be increased, and the rebound of the liquid material can be prevented. The discharge of the liquid material Lh may be performed during the application period as shown in FIG. 6A, or may be performed during the maintenance period as shown in FIG. 6B.

The top positions (vertical positions) of the plurality of rollers Ra and Rb may be lower than the

outlets

53 and 54, but the top positions of the rollers Ra and Rb are determined by the level of the upper surface (coated surface) of the substrate TK. (Vertical position).

[Embodiment 4]
FIG. 13 is a block diagram illustrating a configuration of the slit coater according to the fourth embodiment. In the fourth embodiment, a recycling unit 85 is provided in the collection mechanism 80. The recycling unit 85 removes foreign matter by passing the liquid material Lh collected through the storage unit 83 and the drainage unit 84 through a filter, and returns the liquid material Lc containing no foreign matter to the liquid material supply unit 70. This eliminates waste of the liquid material and can reduce the cost.

[For each embodiment]
As an example of the liquid material L, a polyimide precursor is mentioned, but it is not limited to this. Any liquid material that can be applied on the substrate may be used. For example, a resist material used in the film forming step of FIG. 1 may be used.

In each embodiment, the plurality of discharge slits 52s functioning as the discharge ports 52 are provided in the coater head 50, but the present invention is not limited to this. The number of the discharge slits 52s may be one.

In each embodiment, a plurality of discharge slits 53s or a plurality of discharge slits 54s are provided at both ends of the coater head 50, but the present invention is not limited to this. One discharge slit may be provided at each end.

形態 A form in which a plurality of forms in the first to fourth embodiments are combined is also included in the present embodiment.

[Summary]
[Aspect 1]
A supply port to which a liquid material is supplied, and a coater head provided with a discharge port for discharging the liquid material on a surface to be coated,
A slit coater in which a discharge port for discharging a liquid material in an end portion other than the surface to be coated is provided at at least one of both ends in a longitudinal direction of the coater head, away from the discharge port.

[Aspect 2]
The slit coater according to aspect 1, for example, wherein the coater head is an elongated tubular body, and the supply port is provided at a central portion in the longitudinal direction.

[Aspect 3]
The bottom surface of the coater head faces the surface to be coated,
The slit coater according to mode 1 or mode 2, for example, wherein the discharge port and the discharge port are provided on a bottom surface of the coater head.

[Aspect 4]
The bottom surface of the coater head faces the surface to be coated,
The slit coater according to, for example, aspect 1 or aspect 2, wherein the discharge port is provided on a bottom surface of the coater head, and the discharge port is provided on a side surface of the coater head.

[Aspect 5]
The slit coater according to any one of aspects 1 to 4, wherein the shape of the discharge port and the shape of the discharge port are different.

[Aspect 6]
The slit coater according to any one of the first to fifth aspects, for example, provided with a recovery mechanism for recovering the liquid material discharged from the discharge port.

[Aspect 7]
The slit coater according to aspect 6, for example, wherein the recovery mechanism includes a storage unit that receives the discharged liquid material.

[Aspect 8]
The slit coater according to aspect 6, for example, wherein the recovery mechanism includes a transport unit that transports the liquid material discharged by a plurality of rollers.

[Aspect 9]
The slit coater according to aspect 6, for example, wherein the recovery mechanism includes a suction unit that suctions the liquid material from the outlet.

[Aspect 10]
The slit coater according to any one of the sixth to ninth aspects, for example, wherein the recovery mechanism includes a recycling unit that returns the recovered liquid material to a supply source of the liquid material after removing foreign matter through a filter.

[Aspect 11]
The slit coater according to any one of aspects 1 to 10, for example, wherein a distance between the discharge port and the discharge port is larger than a width dimension of the discharge port.

[Aspect 12]
The slit coater according to example 1, wherein the coater head includes a plurality of discharge slits functioning as the discharge ports and a plurality of discharge slits functioning as the discharge ports.

[Aspect 13]
The slit coater according to aspect 12, for example, wherein an opening area of each of the plurality of discharge slits is smaller than an opening area of each of the plurality of discharge slits.

[Aspect 14]
14. The slit coater according to any one of aspects 1 to 13, wherein the distance between the discharge port and the surface to be coated is 100 μm to 300 μm.

[Aspect 15]
15. The slit coater according to any one of aspects 1 to 14, for example, wherein the liquid material is a precursor of polyimide.

[Aspect 16]
15. The slit coater according to any one of aspects 1 to 14, wherein the liquid material is a resist material.

[Aspect 17]
A coater head including a supply port to which a liquid material is supplied and a discharge port for discharging the liquid material on a surface to be coated is provided, and at least one of both ends in the longitudinal direction of the coater head has an end portion other than the surface to be coated. A coating method for applying the liquid material to the surface to be coated from the discharge port using a slit coater provided with a discharge port for discharging the liquid material separated from the discharge port.

[Aspect 18]
The coating method according to, for example, aspect 17, wherein during the maintenance period, the liquid material is discharged from the discharge port by increasing the liquid material pressure in the coater head as compared with a period during which the liquid material is coated on the surface to be coated.

[Aspect 19]
The coating method according to, for example, aspect 17, wherein the liquid material is sucked outside from the outlet using a suction unit.

[Aspect 20]
A method for manufacturing a display device including a resin film,
In the step of forming the resin film, a coater head including a supply port to which a liquid material as a resin material is supplied and a discharge port for discharging the liquid material on a surface to be coated is provided, and both ends in a longitudinal direction of the coater head. In at least one of the above, the discharge material for discharging the liquid material in the end portion other than the surface to be coated is provided with a slit coater provided apart from the discharge port, and the liquid material is discharged from the discharge port to the surface to be coated. A method for manufacturing a display device.

Reference Signs List 2 display device 3 barrier layer 4 TFT layer 5 light emitting element layer 6 sealing layer 50 coater head 51 supply port 52 discharge port 53/54 discharge port 52 discharge slit 53s / 54s discharge slit ST stage TK substrate 82a / 82b transport unit 83 accommodation Department

Claims

A supply port to which a liquid material is supplied, and a coater head provided with a discharge port for discharging the liquid material on a surface to be coated,
A slit coater in which a discharge port for discharging a liquid material in an end portion other than the surface to be coated is provided at at least one of both ends in a longitudinal direction of the coater head, away from the discharge port.
The slit coater according to claim 1, wherein the coater head is an elongated tubular body, and the supply port is provided at a central portion in the longitudinal direction.
The bottom surface of the coater head faces the surface to be coated,
The slit coater according to claim 1, wherein the discharge port and the discharge port are provided on a bottom surface of the coater head.
The bottom surface of the coater head faces the surface to be coated,
The slit coater according to claim 1, wherein the discharge port is provided on a bottom surface of the coater head, and the discharge port is provided on a side surface of the coater head.
The slit coater according to any one of claims 1 to 4, wherein the discharge port and the discharge port have different shapes.
The slit coater according to any one of claims 1 to 5, further comprising a recovery mechanism for recovering the liquid material discharged from the discharge port.
7. The slit coater according to claim 6, wherein the recovery mechanism includes a storage unit that receives the discharged liquid material.
The slit coater according to claim 6, wherein the recovery mechanism includes a transport unit that transports the liquid material discharged by the plurality of rollers.
The slit coater according to claim 6, wherein the recovery mechanism includes a suction unit that suctions the liquid material from the discharge port.
The slit coater according to any one of claims 6 to 9, wherein the collection mechanism includes a recycling unit that passes the collected liquid material through a filter to remove foreign substances and then returns the collected liquid material to a liquid material supply source.
The slit coater according to any one of claims 1 to 10, wherein a separation distance between the discharge port and the discharge port is larger than a width dimension of the discharge port.
The slit coater according to claim 1, wherein the coater head includes a plurality of discharge slits functioning as the discharge port and a plurality of discharge slits functioning as the discharge port.
The slit coater according to claim 12, wherein an opening area of each of the plurality of discharge slits is smaller than an opening area of each of the plurality of discharge slits.
The slit coater according to any one of claims 1 to 13, wherein a distance between the discharge port and the surface to be coated is 100 μm to 300 μm.
The slit coater according to any one of claims 1 to 14, wherein the liquid material is a precursor of polyimide.
The slit coater according to any one of claims 1 to 14, wherein the liquid material is a resist material.
A coater head including a supply port to which the liquid material is supplied and a discharge port for discharging the liquid material on a surface to be coated is provided, and at least one of both ends in the longitudinal direction of the coater head has an end portion other than the surface to be coated. A coating method for applying the liquid material to the surface to be coated from the discharge port using a slit coater provided with a discharge port for discharging the liquid material separated from the discharge port.
18. The coating method according to claim 17, wherein in the maintenance period, the liquid material is discharged from the discharge port by increasing a liquid material pressure in the coater head as compared with a period in which the liquid material is coated on the surface to be coated.
18. The coating method according to claim 17, wherein the liquid material is sucked outside from the outlet using a suction unit.
A method for manufacturing a display device including a resin film,
In the step of forming the resin film, a coater head including a supply port to which a liquid material as a resin material is supplied and a discharge port for discharging the liquid material on a surface to be coated is provided, and both ends in a longitudinal direction of the coater head. In at least one of the above, the discharge material for discharging the liquid material in the end portion other than the surface to be coated is provided with a slit coater provided apart from the discharge port, and the liquid material is discharged from the discharge port to the surface to be coated. A method for manufacturing a display device.