WO2020063703A1 - Led display screen - Google Patents

Led display screen Download PDF

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Publication number
WO2020063703A1
WO2020063703A1 PCT/CN2019/107995 CN2019107995W WO2020063703A1 WO 2020063703 A1 WO2020063703 A1 WO 2020063703A1 CN 2019107995 W CN2019107995 W CN 2019107995W WO 2020063703 A1 WO2020063703 A1 WO 2020063703A1
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WO
WIPO (PCT)
Prior art keywords
emitting chip
light
light emitting
led lamp
display screen
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Application number
PCT/CN2019/107995
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French (fr)
Chinese (zh)
Inventor
胡飞
李士杰
李屹
Original Assignee
深圳光峰科技股份有限公司
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Publication of WO2020063703A1 publication Critical patent/WO2020063703A1/en

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the invention relates to an LED display screen, and belongs to the technical field of LED display screen manufacturing.
  • LED lamp beads have the characteristics of high luminous brightness.
  • the large screen composed of LED lamp bead matrix has high brightness (higher than 1000Nit) and high display uniformity, so it has a better viewing effect than projection.
  • LED array display has other advantages, such as fast response speed of each LED lamp bead, which can be individually controlled on and off. It can be completely turned off when displaying a black field, so it has a high contrast ratio.
  • the LED lamp bead has a narrow spectrum and high brightness. It still maintains a wide color gamut.
  • FIG. 1 is a schematic structural view of a conventional LED lamp bead
  • FIG. 2 is a perspective view showing a structure of a conventional LED lamp bead.
  • traditional LED lamp beads generally include three-color light-emitting chips arranged in a straight line: a first light-emitting chip 11 (such as a red light-emitting chip), a second light-emitting chip 12 (such as a green light-emitting chip), and a third The light-emitting chip 13 (blue light-emitting chip), because the three-color light-emitting chips are arranged in a straight line, and the distance from the light-shielding frame is different.
  • a first light-emitting chip 11 such as a red light-emitting chip
  • a second light-emitting chip 12 such as a green light-emitting chip
  • the light-emitting chip 13 blue light-emitting chip
  • the first light-emitting chip 11 and the second light-emitting chip emit light.
  • the distance between the chip 12 and the third light-emitting chip 13 from the light-shielding frame is different, so the light-shielding frame does not block the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 differently, and directly from the light-emitting chip without going through the light-shielding frame.
  • the emitted light has a greater light intensity, so when viewing a screen composed of traditional LED lamp beads, a color difference at a certain viewing angle will appear, and the color is biased to the light-emitting chip's light-emitting color.
  • FIG. 3 is a light intensity distribution diagram of a conventional LED lamp bead in the state of FIG. 2.
  • FIG. 3 shows light intensity distributions of the first light emitting chip 11, the second light emitting chip 12, and the third light emitting chip 13 from left to right. It can be seen that the light distribution of the three light-emitting chips is different, and the vertical angle distribution of red and blue light is inconsistent.
  • u 'and v' as the color coordinates in the CIE-LUV color coordinate system
  • u ' ref and v' ref Is the color coordinate at 0 ° viewing angle
  • the technical problem to be solved by the present invention is to address the shortcomings of the prior art, and provide an LED display screen.
  • the pixel filling rate of the LED display screen is improved by using a diffusion film, and a matrix shading frame is used to avoid mutual crosstalk between pixels.
  • the centrally distributed LED lamp beads effectively solve the problem of color difference generated when viewing LED display screens at different angles.
  • the present invention provides an LED display screen.
  • the LED display screen includes an LED lamp bead array and a matrix shading frame.
  • the matrix shading frame is disposed on a light emitting side of the LED lamp bead array, and the LED lamp bead array includes a plurality of LED lights.
  • the LED lamp beads include a first light emitting chip, a second light emitting chip, and a third light emitting chip, and the first light emitting chip, the second light emitting chip, and the third light emitting chip are symmetrically distributed with respect to the center of the LED light bead, respectively.
  • the first light emitting chip is one of a red light emitting chip, a green light emitting chip, and a blue light emitting chip
  • the second light emitting chip is another one of the red light emitting chip, the green light emitting chip, and the blue light emitting chip.
  • the third light emitting chip is the last one of a red light emitting chip, a green light emitting chip, and a blue light emitting chip.
  • the number of the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are two, and the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are matrixed in a manner of three rows and two columns.
  • the first row is the first light emitting chip and the third light emitting chip
  • the second row is the second light emitting chip
  • the third row is the third light emitting chip and the first light emitting chip.
  • the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are arranged in an “X” shape.
  • the number of the first light emitting chip and the third light emitting chip are two, the number of the second light emitting chip is one, the second light emitting chip is located at the center, the first light emitting chip and the second light emitting chip, and the third light emitting chip.
  • Located on a straight line, another first light-emitting chip, another third light-emitting chip, and a second light-emitting chip are located on another straight line. The two straight lines cross each other in an “X” shape.
  • a plurality of the LED lamp beads are arranged on the substrate in a rectangular array.
  • the substrate is coated with a black light absorbing layer on the side where the LED lamp beads are disposed.
  • the matrix shading frame is provided with a plurality of hollow grids, the number of the hollow grids is the same as the number of the LED lamp beads, and each of the LED lamp beads is arranged corresponding to the center of the hollow grid.
  • the thickness of the side wall of the hollow grid is gradually reduced in a direction away from the LED lamp bead array.
  • the LED display screen further includes a diffusion film, which is disposed on a side of the matrix light-shielding frame away from the LED lamp bead array.
  • the diffusion film is a surface diffusion film, a bulk diffusion film, or a double-layer laminated diffusion film
  • the double-layer laminated diffusion film is composed of a hard plate and a diffusion layer.
  • the first light emitting chip, the second light emitting chip and the third light emitting chip are separately packaged to form an LED lamp bead.
  • the first light emitting chip, the second light emitting chip and the third light emitting chip are integrally packaged to form an LED lamp bead.
  • the invention uses a diffusing film to improve the pixel filling rate of an LED display screen, uses a matrix shading frame to avoid mutual crosstalk between pixels, and effectively solves the problems caused by viewing LED display screens at different angles by setting LED lamp beads that are symmetrically distributed in the center. Chromatic aberration.
  • FIG. 1 is a schematic structural diagram of a conventional LED lamp bead
  • FIG. 2 is a perspective view of a structure of a conventional LED lamp bead
  • FIG. 3 is a light intensity distribution diagram of a conventional LED lamp bead in the state of FIG. 2;
  • FIG. 5 is a cross-sectional view of a single pixel of the LED display screen of the present invention.
  • FIG. 6 is a sectional view of an LED lamp bead integrally packaged with a light emitting chip according to the present invention
  • FIG. 7 is a sectional view of an LED lamp bead individually packaged by a light emitting chip of the present invention.
  • FIG. 10 is a front view of a single pixel of an LED display screen according to a first embodiment of the present invention.
  • FIG. 11 is a lateral oblique view of a single pixel of an LED display screen according to a first embodiment of the present invention
  • FIG. 12 is a longitudinal oblique view of a single pixel of an LED display screen according to a first embodiment of the present invention
  • FIG. 13 is a luminous intensity distribution diagram of the LED lamp beads in the state of FIG. 12;
  • FIG. 14 is a front view of a single pixel of an LED display screen according to a first embodiment of the present invention.
  • 15 is a lateral oblique view of a single pixel of an LED display screen according to a first embodiment of the present invention.
  • 16 is a longitudinal perspective view of a single pixel of an LED display screen according to a first embodiment of the present invention.
  • FIG. 17 is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 16.
  • FIG. 4 is a structural exploded view of the LED display screen of the present invention
  • FIG. 5 is a cross-sectional view of a single pixel of the LED display screen of the present invention.
  • the present invention provides an LED display screen.
  • the LED display screen includes an LED lamp bead array 100, a matrix shading frame 102, and a diffusion film 101.
  • the diffusion film 101 is disposed on the LED lamp bead array.
  • the matrix light-shielding frame 102 is disposed between the LED lamp bead array 100 and the diffusion film 101, that is, the matrix light-shielding frame 102 is disposed at the light-emitting side of the LED lamp bead array 100.
  • the LED lamp bead array includes a substrate, a driving circuit, a driving chip and a plurality of LED lamp beads 10 disposed on the substrate.
  • the substrate may be a PCB (Printed Circuit Board) circuit board, and the LED lamp beads 10 include a first light-emitting chip 11, a second light-emitting chip 12, and a third light-emitting chip 13, preferably a first light-emitting chip. 11. LED chips in which the second light emitting chip 12 and the third light emitting chip 13 are packaged together.
  • Each LED lamp bead represents a pixel.
  • a plurality of the LED lamp beads are preferably arranged in a rectangular array on the PCB circuit board.
  • the substrate is coated with a black light absorbing layer on the side where the LED lamp beads 10 are disposed.
  • the LED lamp beads can be fixed on the substrate by means of reflow soldering, and the driving circuit and the driving chip are used to control the brightness of the first light emitting chip 11, the second light emitting chip 12, and the third light emitting chip 13 in the LED light beads 10. .
  • the colors of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are different.
  • the first light-emitting chip 11 is one of a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip.
  • the second light emitting chip 12 is another one of the red light emitting chip, the green light emitting chip, and the blue light emitting chip
  • the third light emitting chip 13 is the last one of the red light emitting chip, the green light emitting chip, and the blue light emitting chip.
  • the colors of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are different from each other and can be interchanged.
  • the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 in the LED lamp beads 10 may not be packaged together, but light-emitting chips of each color may be separately packaged.
  • the individually packaged light-emitting chips constitute an LED lamp bead.
  • 6 is a cross-sectional view of an LED lamp bead packaged with a light-emitting chip as a whole
  • FIG. 7 is a cross-sectional view of an LED lamp bead packaged with a light-emitting chip alone. As shown in FIG. 6, the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are packaged together to form an LED lamp bead.
  • the first light-emitting chip 11 the first A reflective layer 123 is provided around the two light emitting chips 12 and the third light emitting chip 13. As shown in FIG. 7, the light emitting chip is separately packaged.
  • This structure is generally used when the distribution area of the LED light emitting chip is large. For example, when the distribution area is larger than 3 * 3 mm 2 , this structure can be used.
  • the LED display screen further includes a diffusion film 101, which is arranged on the matrix shading frame 102 The side far from the LED lamp bead array 100, that is, the light exit side of the matrix light-shielding frame 102.
  • the diffusion film 101 may be a surface diffusion film or a body diffusion film, and may also be a two-layer laminated diffusion film composed of a rigid plate such as an acrylic plate or a glass plate and a diffusion layer, wherein the diffusion layer is disposed on the outside, that is, away from the LED lamp.
  • the light emitted by the LED lamp bead array 100 is irradiated on the diffusion film 101, and each pixel formed on the diffusion film 101 corresponds to the LED lamp beads 10 in the LED lamp bead array 100 one by one.
  • FIG. 8 is a sectional view of light distribution of the LED lamp beads of the present invention
  • FIG. 9 is a sectional view of light distribution of the LED lamp beads of the present invention.
  • the pixel fill ratio is defined as the ratio of the light emitting area of the LED lamp beads to the pixel area, when the surface of the LED lamp beads is covered with a diffusion film, the distance between the LED lamp beads and the diffusion film is h.
  • the method for determining the light emitting area is: take the spot corresponding to a single pixel, and the central illuminance value is L, then the area of the light spot with an illuminance value not less than aL is the light spot area of the pixel (that is, the light emitting area), where 0 ⁇ a ⁇ 0.5, and the distance p between adjacent LED lamp beads, since the illuminated area on the surface of the diffusion film can be defined by the spot radius r (or spot diameter D), the pixel fill ratio can be defined as the ratio of the spot area to the pixel area:
  • the light emitted from the LED lamp beads 10 irradiates the diffusion film 101 to form a light spot larger than the area of the LED lamp beads, so that the pixel lattice on the diffusion film 101 has a higher pixel filling rate than the pixel lattice of the LED lamp beads.
  • a viewer looks at a screen composed of an LED lamp bead array and sees a plurality of LED lamp beads 10. After the diffuser film 101 is provided, the viewer views For the screen of the diffusion film, the entire diffusion film 101 is seen, and the pixel filling rate of the screen is significantly increased.
  • the diffusion film 101 is adhered to the matrix light-shielding frame 102 by a transparent ultraviolet glue, and the diffusion angle of the diffusion film 101 is 30 ° in the transverse direction and 15 ° in the longitudinal direction.
  • the matrix shading frame 102 is used to block crosstalk light from adjacent LED lamp beads 10.
  • the matrix shading frame 102 is provided with a plurality of hollow grids 103.
  • the number of the hollow grids 103 is the same as the number of the LED lamp beads 10.
  • Each of the LED lamp beads 10 and the center of the hollow grid 103 Correspondingly set, that is, in a direction perpendicular to the substrate, the center of the LED lamp beads 10 coincides with the center of the hollow grid 103, and the center of the LED lamp beads 10 is also the center of the pixel. Factors, the coincidence recorded here allows a certain error, and when there is a certain error, the problem of color difference can still be solved.
  • the matrix light-shielding frame 102 may be made of metal or plastic, and an inner layer is coated with an absorption layer, a reflection layer, or a scattering layer for preventing crosstalk.
  • a side wall of the matrix light-shielding frame may be coated with a Gaussian scattering angle.
  • a 15 ° high reflectivity paint is used as the reflective layer 1022, so that the light emitted by each LED lamp bead 10 is restricted to propagate within the hollow grid 103.
  • the hollow grid 103 of the matrix shading frame 102 may be circular or rectangular, preferably square.
  • the thickness of the side wall of the hollow grid 103 is gradually reduced in the direction away from the LED lamp bead array 100, that is, the width w of the side of the side of the hollow grid 103 near the LED lamp bead array 100 is greater than the distance away from the LED lamp bead array 100 side width g.
  • the cross section of the side wall of the hollow grid 103 is trapezoidal.
  • the matrix shading frame 102 can be fixedly connected to the LED lamp bead array 100 by means of a buckle or the like.
  • the first light emitting chip, the second light emitting chip, and the third light emitting chip in the LED lamp beads 10 are arranged in a certain form for eliminating the light emitting chip.
  • the chromatic aberration of the emitted light at a certain viewing angle Specifically, the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are symmetrically distributed with respect to the center of the LED lamp bead, respectively.
  • the center-symmetric figure refers to rotating a figure 180 ° around a point in the plane, if the rotated figure can coincide with the original figure, this figure is called a center-symmetric figure, and this point is called its center of symmetry.
  • the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are respectively symmetrically distributed with respect to the center of the LED lamp bead.
  • the first light-emitting chip 11 The second light-emitting chip 12 and the third light-emitting chip 13 are arranged in a center-symmetrical pattern, and the colors of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 cannot all be the same.
  • the color positions of a plurality of light-emitting chips arranged in a line are changed after rotation and cannot overlap, and they are not center-symmetrical figures.
  • the above structure can make the viewer have a color difference du 'within a range of ⁇ 70 ° in the horizontal direction and ⁇ 50 ° in the vertical direction.
  • v ' is consistently less than 0.008, that is, the color difference phenomenon cannot be noticed.
  • FIG. 10 is a front view of a single pixel of an LED display screen according to a first embodiment of the present invention
  • FIG. 11 is a lateral oblique view of a single pixel of an LED display screen according to an embodiment of the present invention
  • Oblique view As shown in FIG. 5 to FIG. 12, in this embodiment, the number of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 included in the LED lamp beads are two. The distance p between the LED lamp beads is 2.5 mm.
  • the LED lamp beads are packaged using SMT (Surface Mount Technology). The size of the LED lamp beads after packaging is 1.5mm ⁇ 1.5mm, and the side length d of the light emitting chip is 0.001mm to 1mm, preferably 0.1mm to 0.3mm.
  • the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are arranged in a matrix of three rows and two columns, and the first row from left to right is the first light-emitting chip 11 and the third
  • the light-emitting chips 13 are in the second row each of the second light-emitting chip 12, and the third row is the third light-emitting chip 13 and the first light-emitting chip 11 from left to right.
  • each of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 is blocked by the matrix light-shielding frame 102 without affecting the color.
  • Balance as shown in FIG. 12, when the LED lamp beads are viewed in the longitudinal direction (V direction), each of the first light-emitting chip 11 and the third light-emitting chip 13 is blocked by the matrix shading frame 102, which also does not affect the color balance.
  • FIG. 13 is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 12.
  • FIG. 13 shows the light emission intensity distributions of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 from left to right.
  • the red, green and blue light-emitting chips The angular distributions of the luminous intensity are symmetrical.
  • the material of the matrix light-shielding frame 102 is polycarbonate (PC), and the inner surface of the side wall is coated with a diffuse reflection layer with a Gaussian scattering angle of 20 °, and the reflectance is 85%.
  • PC polycarbonate
  • the width w of the side of the side wall of the hollow grid 103 near the LED lamp bead array 100 is 2.2 mm
  • the width of the side of the side wall away from the LED lamp bead array 100 is 1.3 mm
  • the height of the matrix shading frame 102 h is 3 mm.
  • the shading frame is fixed in the welding seam of the substrate and the LED lamp beads by buckles.
  • FIG. 14 is a front view of a single pixel of the LED display screen according to the first embodiment of the present invention
  • FIG. 15 is a horizontal oblique view of a single pixel of the LED display screen according to the first embodiment of the present invention
  • Angle view is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 16.
  • the number of the first light emitting chip 11 and the third light emitting chip 13 included in the LED lamp beads are two, and the number of the second light emitting chip 12 is one.
  • the distance p between the LED lamp beads is 5 mm.
  • the LED lamp beads are packaged using SMT (Surface Mount Technology). After the package, the size of the LED lamp beads is 2.5mm ⁇ 2.5mm, and the side length d of the light-emitting chip is 0.001mm to 1mm, preferably 0.1mm to 0.3mm.
  • the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are arranged in an "X" shape, wherein the second light-emitting chip 12 is located at the center, and one first light-emitting chip 11 and the second light-emitting chip
  • the chip 12 and a third light-emitting chip 13 are located on a straight line, and the other first light-emitting chip 11 and another third light-emitting chip 13 and the second light-emitting chip 12 are located on another straight line.
  • the two lines cross each other to form an “X”. Font.
  • each of the first light-emitting chip 11 and the third light-emitting chip 13 is blocked by the matrix shading frame 102, which does not affect the color balance, as shown in FIG. 16.
  • the matrix shading frame 102 As shown, when the LED lamp beads are viewed in the longitudinal direction (V direction), each of the first light-emitting chip 11 and the third light-emitting chip 13 is blocked by the matrix light-shielding frame 102, which also does not affect the color balance.
  • FIG. 17 is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 16.
  • FIG. 17 shows the light emission intensity distribution of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 from left to right.
  • the red, green and blue light-emitting chips The angular distributions of the luminous intensity are symmetrical.
  • the material of the matrix light-shielding frame 102 is polycarbonate (PC), and the inner surface of the sidewall is coated with a diffuse reflection layer having a Gaussian scattering angle of 15 °, and the reflectance is 50% to 95%, preferably 95%.
  • PC polycarbonate
  • the width w of the side of the side wall of the hollow grid 103 near the LED lamp bead array 100 is 1.2 mm
  • the width g of the side of the side wall away from the LED lamp bead array 100 is 0.5 mm.
  • the height of the matrix shading frame 102 h is 5mm.
  • the shading frame is fixed in the welding seam of the substrate and the LED lamp beads by buckles.
  • the embodiments described above are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
  • the light-emitting chip with the matrix structure of three rows and two columns in the first embodiment is defined as the first structure
  • the light-emitting chip of the "X" shape in the second embodiment is defined as the second structure, which is composed of a plurality of the first structure and / or the second structure.
  • the centrally symmetric pattern can also be used as an embodiment of the present invention.
  • the present invention uses a diffuser film to improve the pixel fill rate of an LED display screen, and uses a matrix shading frame to avoid mutual crosstalk between pixels.
  • a diffuser film to improve the pixel fill rate of an LED display screen
  • a matrix shading frame to avoid mutual crosstalk between pixels.

Abstract

An LED display screen is disclosed. The LED display screen comprises an LED lamp bead array (100) and a matrix shading frame (102), wherein the matrix shading frame (102) is disposed on a light emergent side of the LED lamp bead array (100); the LED lamp bead array (100) includes a plurality of LED lamp beads (10); the LED lamp beads (10) comprise a first light-emitting chip (11), a second light-emitting chip (12) and a third light-emitting chip (13); and the first light-emitting chip (11), the second light-emitting chip (12) and the third light-emitting chip (13) are symmetrically distributed with respect to the center of the LED lamp beads (10), respectively. A pixel filling rate of an LED display screen is improved by using a diffusion film (101), and the mutual crosstalk between pixels is avoided by using the matrix shading frame (102). By setting the LED lamp beads (10) to be symmetrically distributed in the center, the problem of a color difference generated when the LED display screen is viewed at different angles is effectively solved.

Description

LED显示屏LED display 技术领域Technical field
本发明涉及一种LED显示屏,属于LED显示屏制造技术领域。The invention relates to an LED display screen, and belongs to the technical field of LED display screen manufacturing.
背景技术Background technique
LED灯珠具有发光亮度高的特点,由LED灯珠点阵组成的大屏幕显示亮度高(高于1000Nit),显示均匀性高,因此拥有比投影更为优异的观影效果。LED阵列显示还有其他优点,例如每个LED灯珠响应速度快,可单独控制亮灭,在显示黑场时可以完全关闭,从而拥有很高的对比度;另外LED灯珠光谱窄,在高亮度时依然保持着宽广的色域。LED lamp beads have the characteristics of high luminous brightness. The large screen composed of LED lamp bead matrix has high brightness (higher than 1000Nit) and high display uniformity, so it has a better viewing effect than projection. LED array display has other advantages, such as fast response speed of each LED lamp bead, which can be individually controlled on and off. It can be completely turned off when displaying a black field, so it has a high contrast ratio. In addition, the LED lamp bead has a narrow spectrum and high brightness. It still maintains a wide color gamut.
但是目前LED阵列显示屏存在一个问题:通过设置遮光架虽然能防止像素间相互串扰,但会出现色差问题。However, at present, there is a problem in LED array display screens: although the cross-talk between pixels can be prevented by setting a shading frame, the problem of color difference will occur.
图1为传统LED灯珠的结构示意图;图2为传统LED灯珠的结构斜视图。如图1和图2所示,传统LED灯珠通常包含沿直线排列的三色发光芯片:第一发光芯片11(例如红色发光芯片)、第二发光芯片12(例如绿色发光芯片)和第三发光芯片13(蓝色发光芯片),由于三色发光芯片呈直线排列,其与遮光架之间的距离不同,因此,当从斜向观察LED灯珠时,第一发光芯片11、第二发光芯片12和第三发光芯片13距离遮光架的距离不同,故遮光架对于第一发光芯片11、第二发光芯片12和第三发光芯片13遮挡程度不一样,而不经过遮光架直接从发光芯片出射的光线有更大光强,所以在观看传统LED灯珠组成的屏幕时,会出现一定视角下的色差,颜色偏向于被遮挡程度小的发光芯片的发光颜色。图3为图2状态下传统LED灯珠的发光强度分布图,图3从左到右示出了第一发光芯片11、第二发光芯片12和第三发光芯片13的发光强度分布,从图中可以看出,三种发光芯片的发光分布不同,红色和蓝色发光的纵向角分布不一致,定义u’和v’为CIE-LUV 色坐标系统中的色坐标,u’ ref和v’ ref是0°视角时的色坐标,则色差du’v’为 FIG. 1 is a schematic structural view of a conventional LED lamp bead; FIG. 2 is a perspective view showing a structure of a conventional LED lamp bead. As shown in Figures 1 and 2, traditional LED lamp beads generally include three-color light-emitting chips arranged in a straight line: a first light-emitting chip 11 (such as a red light-emitting chip), a second light-emitting chip 12 (such as a green light-emitting chip), and a third The light-emitting chip 13 (blue light-emitting chip), because the three-color light-emitting chips are arranged in a straight line, and the distance from the light-shielding frame is different. Therefore, when the LED lamp beads are viewed from an oblique direction, the first light-emitting chip 11 and the second light-emitting chip emit light. The distance between the chip 12 and the third light-emitting chip 13 from the light-shielding frame is different, so the light-shielding frame does not block the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 differently, and directly from the light-emitting chip without going through the light-shielding frame. The emitted light has a greater light intensity, so when viewing a screen composed of traditional LED lamp beads, a color difference at a certain viewing angle will appear, and the color is biased to the light-emitting chip's light-emitting color. FIG. 3 is a light intensity distribution diagram of a conventional LED lamp bead in the state of FIG. 2. FIG. 3 shows light intensity distributions of the first light emitting chip 11, the second light emitting chip 12, and the third light emitting chip 13 from left to right. It can be seen that the light distribution of the three light-emitting chips is different, and the vertical angle distribution of red and blue light is inconsistent. Define u 'and v' as the color coordinates in the CIE-LUV color coordinate system, u ' ref and v' ref Is the color coordinate at 0 ° viewing angle, then the color difference du'v 'is
Figure PCTCN2019107995-appb-000001
Figure PCTCN2019107995-appb-000001
观看者在大视角观看传统LED灯珠组成的屏幕时,会觉察到色差现象。When viewing a screen made of traditional LED lamp beads at a large viewing angle, the viewer will notice the color difference phenomenon.
发明内容Summary of the Invention
本发明所要解决的技术问题在于针对现有技术的不足,提供一种LED显示屏,通过使用扩散膜提高了LED显示屏的像素填充率,使用矩阵遮光架避免了像素间的相互串扰,通过设置呈中心对称分布的LED灯珠有效解决了在不同角度观看LED显示屏时产生的色差问题。The technical problem to be solved by the present invention is to address the shortcomings of the prior art, and provide an LED display screen. The pixel filling rate of the LED display screen is improved by using a diffusion film, and a matrix shading frame is used to avoid mutual crosstalk between pixels. The centrally distributed LED lamp beads effectively solve the problem of color difference generated when viewing LED display screens at different angles.
本发明所要解决的技术问题是通过如下技术方案实现的:The technical problem to be solved by the present invention is achieved through the following technical solutions:
本发明提供一种LED显示屏,所述LED显示屏包含LED灯珠阵列和矩阵遮光架,所述矩阵遮光架设置在LED灯珠阵列的出光侧,所述LED灯珠阵列包含多个LED灯珠,所述LED灯珠包含第一发光芯片、第二发光芯片和第三发光芯片,所述第一发光芯片、第二发光芯片和第三发光芯片分别相对于LED灯珠的中心对称分布。The present invention provides an LED display screen. The LED display screen includes an LED lamp bead array and a matrix shading frame. The matrix shading frame is disposed on a light emitting side of the LED lamp bead array, and the LED lamp bead array includes a plurality of LED lights. The LED lamp beads include a first light emitting chip, a second light emitting chip, and a third light emitting chip, and the first light emitting chip, the second light emitting chip, and the third light emitting chip are symmetrically distributed with respect to the center of the LED light bead, respectively.
为消除色差,所述第一发光芯片为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的一种,所述第二发光芯片为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的另一种,所述第三发光芯片为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的最后一种。To eliminate chromatic aberration, the first light emitting chip is one of a red light emitting chip, a green light emitting chip, and a blue light emitting chip, and the second light emitting chip is another one of the red light emitting chip, the green light emitting chip, and the blue light emitting chip. One type, the third light emitting chip is the last one of a red light emitting chip, a green light emitting chip, and a blue light emitting chip.
优选地,所述第一发光芯片、第二发光芯片和第三发光芯片的数量均为两个,所述第一发光芯片、第二发光芯片以及第三发光芯片以三行两列的方式矩阵排布,第一行为第一发光芯片和第三发光芯片,第二行均为第二发光芯片,第三行为第三发光芯片和第一发光芯片。Preferably, the number of the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are two, and the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are matrixed in a manner of three rows and two columns. In the arrangement, the first row is the first light emitting chip and the third light emitting chip, the second row is the second light emitting chip, and the third row is the third light emitting chip and the first light emitting chip.
优选地,所述第一发光芯片、第二发光芯片和第三发光芯片呈“X”字型排布。所述第一发光芯片和第三发光芯片的数量均为两个,第二发光芯片的数量为一个,第二发光芯片位于中心,一个第一发光芯片与第二发光芯片以及一个第三发光芯片位于一条直线上,另一个第一发光芯片与另一个第三发光芯片以及第二发光芯片位于另一条直线 上,两条直线相互交叉呈“X”字型。Preferably, the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are arranged in an “X” shape. The number of the first light emitting chip and the third light emitting chip are two, the number of the second light emitting chip is one, the second light emitting chip is located at the center, the first light emitting chip and the second light emitting chip, and the third light emitting chip. Located on a straight line, another first light-emitting chip, another third light-emitting chip, and a second light-emitting chip are located on another straight line. The two straight lines cross each other in an “X” shape.
优选地,多个所述LED灯珠以矩形阵列排布在基板上。Preferably, a plurality of the LED lamp beads are arranged on the substrate in a rectangular array.
为了减少对环境光的反射,所述基板在设置LED灯珠的一侧涂覆黑色吸光层。In order to reduce reflection of ambient light, the substrate is coated with a black light absorbing layer on the side where the LED lamp beads are disposed.
优选地,所述矩阵遮光架上设有多个镂空栅格,所述镂空栅格的数量与LED灯珠的数量相同,每一个所述LED灯珠与所述镂空栅格的中心对应设置。Preferably, the matrix shading frame is provided with a plurality of hollow grids, the number of the hollow grids is the same as the number of the LED lamp beads, and each of the LED lamp beads is arranged corresponding to the center of the hollow grid.
为了方便成型,所述镂空栅格的侧壁厚度沿远离LED灯珠阵列方向逐渐减小。In order to facilitate molding, the thickness of the side wall of the hollow grid is gradually reduced in a direction away from the LED lamp bead array.
为了增加像素填充率,所述LED显示屏还包含扩散膜,所述扩散膜设置在所述矩阵遮光架远离LED灯珠阵列的一侧。In order to increase the pixel filling rate, the LED display screen further includes a diffusion film, which is disposed on a side of the matrix light-shielding frame away from the LED lamp bead array.
优选地,所述扩散膜为表面扩散膜、体扩散膜或者双层贴合扩散膜,所述双层贴合扩散膜由硬板和扩散层组成。Preferably, the diffusion film is a surface diffusion film, a bulk diffusion film, or a double-layer laminated diffusion film, and the double-layer laminated diffusion film is composed of a hard plate and a diffusion layer.
优选地,所述第一发光芯片、第二发光芯片和第三发光芯片单独封装组成一个LED灯珠。Preferably, the first light emitting chip, the second light emitting chip and the third light emitting chip are separately packaged to form an LED lamp bead.
优选地,所述第一发光芯片、第二发光芯片和第三发光芯片整体封装组成一个LED灯珠。Preferably, the first light emitting chip, the second light emitting chip and the third light emitting chip are integrally packaged to form an LED lamp bead.
本发明使用扩散膜提高了LED显示屏的像素填充率,使用矩阵遮光架避免了像素间的相互串扰,通过设置呈中心对称分布的LED灯珠有效解决了在不同角度观看LED显示屏时产生的色差问题。The invention uses a diffusing film to improve the pixel filling rate of an LED display screen, uses a matrix shading frame to avoid mutual crosstalk between pixels, and effectively solves the problems caused by viewing LED display screens at different angles by setting LED lamp beads that are symmetrically distributed in the center. Chromatic aberration.
下面结合附图和具体实施例,对本发明的技术方案进行详细地说明。The technical solution of the present invention will be described in detail below with reference to the drawings and specific embodiments.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为传统LED灯珠的结构示意图;FIG. 1 is a schematic structural diagram of a conventional LED lamp bead;
图2为传统LED灯珠的结构斜视图;2 is a perspective view of a structure of a conventional LED lamp bead;
图3为图2状态下传统LED灯珠的发光强度分布图;3 is a light intensity distribution diagram of a conventional LED lamp bead in the state of FIG. 2;
图4为本发明LED显示屏的结构爆炸图;4 is a structural exploded view of the LED display screen of the present invention;
图5为本发明LED显示屏单个像素的剖视图;5 is a cross-sectional view of a single pixel of the LED display screen of the present invention;
图6为本发明发光芯片整体封装的LED灯珠剖视图;6 is a sectional view of an LED lamp bead integrally packaged with a light emitting chip according to the present invention;
图7为本发明发光芯片单独封装的LED灯珠剖视图;7 is a sectional view of an LED lamp bead individually packaged by a light emitting chip of the present invention;
图8为本发明LED灯珠的出光分布剖视图;8 is a sectional view of light distribution of the LED lamp beads of the present invention;
图9为本发明LED灯珠的出光分布剖视图;9 is a sectional view of light distribution of the LED lamp beads of the present invention;
图10为本发明实施例一LED显示屏单个像素的主视图;10 is a front view of a single pixel of an LED display screen according to a first embodiment of the present invention;
图11为本发明实施例一LED显示屏单个像素的横向斜视图;11 is a lateral oblique view of a single pixel of an LED display screen according to a first embodiment of the present invention;
图12为本发明实施例一LED显示屏单个像素的纵向斜视图;12 is a longitudinal oblique view of a single pixel of an LED display screen according to a first embodiment of the present invention;
图13为图12状态下LED灯珠的发光强度分布图;FIG. 13 is a luminous intensity distribution diagram of the LED lamp beads in the state of FIG. 12; FIG.
图14为本发明实施例一LED显示屏单个像素的主视图;14 is a front view of a single pixel of an LED display screen according to a first embodiment of the present invention;
图15为本发明实施例一LED显示屏单个像素的横向斜视图;15 is a lateral oblique view of a single pixel of an LED display screen according to a first embodiment of the present invention;
图16为本发明实施例一LED显示屏单个像素的纵向斜视图;16 is a longitudinal perspective view of a single pixel of an LED display screen according to a first embodiment of the present invention;
图17为图16状态下LED灯珠的发光强度分布图。FIG. 17 is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 16.
【附图标记说明】[Description of Reference Signs]
LED灯珠阵列      100LED lamp bead array
扩散膜           101 Diffusion film 101
矩阵遮光架       102 Matrix shading frame 102
镂空栅格         103 Hollow grid 103
LED灯珠          10 LED lamp beads 10
第一发光芯片     11The first light-emitting chip
第二发光芯片     12Second light emitting chip 12
第三发光芯片     13The third light-emitting chip
反光层           123 Reflective layer 123
反射层           1022 Reflective layer 1022
具体实施方式detailed description
图4为本发明LED显示屏的结构爆炸图;图5为本发明LED显示屏单个像素的剖视图。如图4和图5所示,本发明提供一种LED显示屏,所述LED显示屏包含LED灯珠阵列100、矩阵遮光架102以及扩散膜101,所述扩散膜101设置在LED灯珠阵列100的出光侧,所述矩阵遮光架102设置在LED灯珠阵列100和扩散膜101之间,即:所述矩阵遮光架102设置在LED灯珠阵列100的出光侧。FIG. 4 is a structural exploded view of the LED display screen of the present invention; and FIG. 5 is a cross-sectional view of a single pixel of the LED display screen of the present invention. As shown in FIGS. 4 and 5, the present invention provides an LED display screen. The LED display screen includes an LED lamp bead array 100, a matrix shading frame 102, and a diffusion film 101. The diffusion film 101 is disposed on the LED lamp bead array. At the light-emitting side of 100, the matrix light-shielding frame 102 is disposed between the LED lamp bead array 100 and the diffusion film 101, that is, the matrix light-shielding frame 102 is disposed at the light-emitting side of the LED lamp bead array 100.
所述LED灯珠阵列包含基板以及设置在基板上的驱动电路、驱动芯片和多个LED灯珠10。所述基板可以为PCB(Printed Circuit Board,印制电路板)电路板,所述LED灯珠10包含第一发光芯片11、第二发光芯片12和第三发光芯片13,优选为第一发光芯片11、第二发光芯片12和第三发光芯片13封装在一起的LED芯片,每一个LED灯珠代表一个像素,多个所述LED灯珠优选以矩形阵列排布在所述PCB电路板上。为了减少对环境光的反射,所述基板在设置LED灯珠10的一侧涂覆黑色吸光层。所述LED灯珠可以通过回流焊等方式固定在基板上,所述驱动电路、驱动芯片用于控制LED灯珠10中第一发光芯片11、第二发光芯片12和第三发光芯片13的明暗。The LED lamp bead array includes a substrate, a driving circuit, a driving chip and a plurality of LED lamp beads 10 disposed on the substrate. The substrate may be a PCB (Printed Circuit Board) circuit board, and the LED lamp beads 10 include a first light-emitting chip 11, a second light-emitting chip 12, and a third light-emitting chip 13, preferably a first light-emitting chip. 11. LED chips in which the second light emitting chip 12 and the third light emitting chip 13 are packaged together. Each LED lamp bead represents a pixel. A plurality of the LED lamp beads are preferably arranged in a rectangular array on the PCB circuit board. In order to reduce reflection of ambient light, the substrate is coated with a black light absorbing layer on the side where the LED lamp beads 10 are disposed. The LED lamp beads can be fixed on the substrate by means of reflow soldering, and the driving circuit and the driving chip are used to control the brightness of the first light emitting chip 11, the second light emitting chip 12, and the third light emitting chip 13 in the LED light beads 10. .
第一发光芯片11、第二发光芯片12和第三发光芯片13的颜色各不相同,优选地,所述第一发光芯片11为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的一种,所述第二发光芯片12为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的另一种,所述第三发光芯片13为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的最后一种。换句话说,第一发光芯片11、第二发光芯片12和第三发光芯片13的颜色各不相同,且可以互换。The colors of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are different. Preferably, the first light-emitting chip 11 is one of a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. The second light emitting chip 12 is another one of the red light emitting chip, the green light emitting chip, and the blue light emitting chip, and the third light emitting chip 13 is the last one of the red light emitting chip, the green light emitting chip, and the blue light emitting chip. One. In other words, the colors of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are different from each other and can be interchanged.
需要补充的是,所述LED灯珠10中的第一发光芯片11、第二发光芯片12以及第三发光芯片13也可以不封装在一起,而是每个颜色的发光芯片单独封装,三种单独封装的发光芯片组成一个LED灯珠。图6为本发明发光芯片整体封装的LED灯珠剖视图;图7为本发明发光芯片单独封装的LED灯珠剖视图。如图6所示,第一发光芯片11、第二发光芯片12以及第三发光芯片13封装在一起形成一个LED灯珠,为了增加不同颜色的混光效果,所述第一发光芯片11、第二发光芯片12以及第三发光芯片13四周设有反光层123。如图7所示,发光芯片单独封装,此结构一般用于LED发光芯片的分布面积较大时的情况,如分布面积大于3*3mm 2时,可以选用此结构。 It should be added that the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 in the LED lamp beads 10 may not be packaged together, but light-emitting chips of each color may be separately packaged. The individually packaged light-emitting chips constitute an LED lamp bead. 6 is a cross-sectional view of an LED lamp bead packaged with a light-emitting chip as a whole; FIG. 7 is a cross-sectional view of an LED lamp bead packaged with a light-emitting chip alone. As shown in FIG. 6, the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are packaged together to form an LED lamp bead. In order to increase the light mixing effect of different colors, the first light-emitting chip 11, the first A reflective layer 123 is provided around the two light emitting chips 12 and the third light emitting chip 13. As shown in FIG. 7, the light emitting chip is separately packaged. This structure is generally used when the distribution area of the LED light emitting chip is large. For example, when the distribution area is larger than 3 * 3 mm 2 , this structure can be used.
为了增加LED显示屏的像素填充率,减少观影者观看时因颗粒感明显而产生的不良观影体验,所述LED显示屏还包含扩散膜101,所述扩散膜101设置在矩阵遮光架102远离LED灯珠阵列100的一侧, 即矩阵遮光架102的出光侧。所述扩散膜101可以是表面扩散膜或者是体扩散膜,还可以是亚克力板或者玻璃板等硬板和扩散层组成的双层贴合扩散膜,其中扩散层设置在外侧,即远离LED灯珠阵列100的一侧。LED灯珠阵列100发出的光线照射在扩散膜101上,扩散膜101上形成的一个个像素点与LED灯珠阵列100中的LED灯珠10一一对应。In order to increase the pixel filling rate of the LED display screen and reduce the bad viewing experience caused by the obvious graininess of the viewer when watching, the LED display screen further includes a diffusion film 101, which is arranged on the matrix shading frame 102 The side far from the LED lamp bead array 100, that is, the light exit side of the matrix light-shielding frame 102. The diffusion film 101 may be a surface diffusion film or a body diffusion film, and may also be a two-layer laminated diffusion film composed of a rigid plate such as an acrylic plate or a glass plate and a diffusion layer, wherein the diffusion layer is disposed on the outside, that is, away from the LED lamp. One side of the bead array 100. The light emitted by the LED lamp bead array 100 is irradiated on the diffusion film 101, and each pixel formed on the diffusion film 101 corresponds to the LED lamp beads 10 in the LED lamp bead array 100 one by one.
图8为本发明LED灯珠的出光分布剖视图;图9为本发明LED灯珠的出光分布剖视图。如图8和图9所示,由于像素填充率定义为LED灯珠的发光面积和像素面积的比例,当在LED灯珠表面覆盖有扩散膜的时候,LED灯珠距离扩散膜的距离为h,发光面积的确定方法为:取对应单个像素的光斑,其中心照度值为L,则该光斑的照度值不小于aL的区域为该像素的光斑面积(即发光面积),其中0<a<0.5,而相邻LED灯珠之间的间距p,由于扩散膜表面的照射区域可以由光斑半径r(或光斑直径D)来定义,可以将像素填充率定义为光斑面积和像素面积的比率:8 is a sectional view of light distribution of the LED lamp beads of the present invention; FIG. 9 is a sectional view of light distribution of the LED lamp beads of the present invention. As shown in Figures 8 and 9, since the pixel fill ratio is defined as the ratio of the light emitting area of the LED lamp beads to the pixel area, when the surface of the LED lamp beads is covered with a diffusion film, the distance between the LED lamp beads and the diffusion film is h. The method for determining the light emitting area is: take the spot corresponding to a single pixel, and the central illuminance value is L, then the area of the light spot with an illuminance value not less than aL is the light spot area of the pixel (that is, the light emitting area), where 0 <a < 0.5, and the distance p between adjacent LED lamp beads, since the illuminated area on the surface of the diffusion film can be defined by the spot radius r (or spot diameter D), the pixel fill ratio can be defined as the ratio of the spot area to the pixel area:
Figure PCTCN2019107995-appb-000002
Figure PCTCN2019107995-appb-000002
LED灯珠10发出的光线照射在扩散膜101上形成大于LED灯珠面积的光斑,从而使扩散膜101上的像素点阵拥有比LED灯珠像素点阵更高的像素填充率。换句话说,当不设置扩散膜101时,观看者观看LED灯珠阵列组成的屏幕,看到的是多个LED灯珠10,而设置扩散膜101之后,观看者观看包含LED灯珠阵列和扩散膜的屏幕,看到的是整个扩散膜101,其像素填充率明显增大。另外,光线经过扩散膜101之后角度扩大,使得拥有扩散膜101的LED显示屏有更大的可视角。具体来说,所述扩散膜101通过透明紫外胶贴合在矩阵遮光架102上,扩散膜101的扩散角度是横向高斯30°*纵向高斯15°。The light emitted from the LED lamp beads 10 irradiates the diffusion film 101 to form a light spot larger than the area of the LED lamp beads, so that the pixel lattice on the diffusion film 101 has a higher pixel filling rate than the pixel lattice of the LED lamp beads. In other words, when the diffuser film 101 is not provided, a viewer looks at a screen composed of an LED lamp bead array and sees a plurality of LED lamp beads 10. After the diffuser film 101 is provided, the viewer views For the screen of the diffusion film, the entire diffusion film 101 is seen, and the pixel filling rate of the screen is significantly increased. In addition, after the light passes through the diffusion film 101, the angle is enlarged, so that the LED display screen having the diffusion film 101 has a larger viewing angle. Specifically, the diffusion film 101 is adhered to the matrix light-shielding frame 102 by a transparent ultraviolet glue, and the diffusion angle of the diffusion film 101 is 30 ° in the transverse direction and 15 ° in the longitudinal direction.
所述矩阵遮光架102用于遮挡相邻LED灯珠10的串扰光线。所述矩阵遮光架102上设有多个镂空栅格103,所述镂空栅格103的数量与LED灯珠10的数量相同,每一个所述LED灯珠10与所述镂空栅格103的中心对应设置,即在沿垂直于基板方向上,LED灯珠10的中心与所述镂空栅格103的中心重合,LED灯珠10的中心也是像素中心, 需要补充的是,考虑到加工精度等其他因素,此处记载的重合允许存在一定误差,当存在一定误差时,仍然可以解决色差问题。所述矩阵遮光架102可以是金属材质或者是塑料材质,其内侧上涂覆用于防止串扰的吸收层、反射层或者散射层,例如,可以在矩阵遮光架的侧壁上涂覆高斯散射角度为15°的高反射率漆作为反射层1022,从而使得每个LED灯珠10发出的光线被限制在镂空栅格103内传播。所述矩阵遮光架102的镂空栅格103可以是圆形或者矩形,优选正方形。为了方便成型,所述镂空栅格103的侧壁厚度沿远离LED灯珠阵列100方向逐渐减小,即镂空栅格103侧壁靠近LED灯珠阵列100的一面的宽度w大于远离LED灯珠阵列100的一面的宽度g。优选地,所述镂空栅格103的侧壁截面为梯形。所述矩阵遮光架102可以通过卡扣等方式与LED灯珠阵列100固定连接。The matrix shading frame 102 is used to block crosstalk light from adjacent LED lamp beads 10. The matrix shading frame 102 is provided with a plurality of hollow grids 103. The number of the hollow grids 103 is the same as the number of the LED lamp beads 10. Each of the LED lamp beads 10 and the center of the hollow grid 103 Correspondingly set, that is, in a direction perpendicular to the substrate, the center of the LED lamp beads 10 coincides with the center of the hollow grid 103, and the center of the LED lamp beads 10 is also the center of the pixel. Factors, the coincidence recorded here allows a certain error, and when there is a certain error, the problem of color difference can still be solved. The matrix light-shielding frame 102 may be made of metal or plastic, and an inner layer is coated with an absorption layer, a reflection layer, or a scattering layer for preventing crosstalk. For example, a side wall of the matrix light-shielding frame may be coated with a Gaussian scattering angle. A 15 ° high reflectivity paint is used as the reflective layer 1022, so that the light emitted by each LED lamp bead 10 is restricted to propagate within the hollow grid 103. The hollow grid 103 of the matrix shading frame 102 may be circular or rectangular, preferably square. In order to facilitate molding, the thickness of the side wall of the hollow grid 103 is gradually reduced in the direction away from the LED lamp bead array 100, that is, the width w of the side of the side of the hollow grid 103 near the LED lamp bead array 100 is greater than the distance away from the LED lamp bead array 100 side width g. Preferably, the cross section of the side wall of the hollow grid 103 is trapezoidal. The matrix shading frame 102 can be fixedly connected to the LED lamp bead array 100 by means of a buckle or the like.
为了减小观看者在不同角度观看LED显示屏时产生的色差现象,所述LED灯珠10中第一发光芯片、第二发光芯片以及第三发光芯片排布成一定形式,用于消除发光芯片发出的光线在一定视角下的色差。具体来说,所述第一发光芯片11、第二发光芯片12和第三发光芯片13分别相对于LED灯珠的中心对称分布。由于中心对称图形是指在平面内,把一个图形绕着某个点旋转180°,如果旋转后的图形能与原来的图形重合,那么这个图形叫做中心对称图形,这个点叫做它的对称中心,而本发明中第一发光芯片11、第二发光芯片12和第三发光芯片13分别相对于LED灯珠的中心对称分布,因此,换句话说,在本发明中,所述第一发光芯片11、第二发光芯片12和第三发光芯片13排布成中心对称图形,且所述第一发光芯片11、第二发光芯片12和第三发光芯片13的颜色不能全部相同。而现有技术中,呈直线排列的多个发光芯片经旋转后其颜色位置发生变化,无法重合,其并非中心对称图形。通过试验可以得出,采用中心对称结构的LED灯珠在横向和纵向上发光强度对称分布,具体来说,上述结构能够使得观看者在横向±70°纵向±50°的范围内,色差du’v’一致小于0.008,即无法注意到色差现象。In order to reduce the chromatic aberration phenomenon when the viewer watches the LED display screen at different angles, the first light emitting chip, the second light emitting chip, and the third light emitting chip in the LED lamp beads 10 are arranged in a certain form for eliminating the light emitting chip. The chromatic aberration of the emitted light at a certain viewing angle. Specifically, the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are symmetrically distributed with respect to the center of the LED lamp bead, respectively. Since the center-symmetric figure refers to rotating a figure 180 ° around a point in the plane, if the rotated figure can coincide with the original figure, this figure is called a center-symmetric figure, and this point is called its center of symmetry. In the present invention, the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are respectively symmetrically distributed with respect to the center of the LED lamp bead. Therefore, in other words, in the present invention, the first light-emitting chip 11 The second light-emitting chip 12 and the third light-emitting chip 13 are arranged in a center-symmetrical pattern, and the colors of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 cannot all be the same. However, in the prior art, the color positions of a plurality of light-emitting chips arranged in a line are changed after rotation and cannot overlap, and they are not center-symmetrical figures. Through experiments, it can be concluded that the centrally symmetrical structure of the LED lamp beads has a symmetrical distribution of light emission in the horizontal and vertical directions. Specifically, the above structure can make the viewer have a color difference du 'within a range of ± 70 ° in the horizontal direction and ± 50 ° in the vertical direction. v 'is consistently less than 0.008, that is, the color difference phenomenon cannot be noticed.
下面结合具体实施例对本发明中LED灯珠10的结构进行详细介绍。The structure of the LED lamp beads 10 in the present invention is described in detail below with reference to specific embodiments.
实施例一Example one
图10为本发明实施例一LED显示屏单个像素的主视图;图11为本发明实施例一LED显示屏单个像素的横向斜视图;图12为本发明实施例一LED显示屏单个像素的纵向斜视图。如图5至图12所示,在本实施例中,所述LED灯珠包含的第一发光芯片11、第二发光芯片12以及第三发光芯片13的数量均为两个。所述LED灯珠之间的间距p为2.5mm。LED灯珠使用SMT(表面贴装技术)封装,封装后LED灯珠的尺寸为1.5mm×1.5mm,发光芯片的边长d为0.001mm到1mm,优选为0.1mm到0.3mm。FIG. 10 is a front view of a single pixel of an LED display screen according to a first embodiment of the present invention; FIG. 11 is a lateral oblique view of a single pixel of an LED display screen according to an embodiment of the present invention; Oblique view. As shown in FIG. 5 to FIG. 12, in this embodiment, the number of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 included in the LED lamp beads are two. The distance p between the LED lamp beads is 2.5 mm. The LED lamp beads are packaged using SMT (Surface Mount Technology). The size of the LED lamp beads after packaging is 1.5mm × 1.5mm, and the side length d of the light emitting chip is 0.001mm to 1mm, preferably 0.1mm to 0.3mm.
具体来说,所述第一发光芯片11、第二发光芯片12以及第三发光芯片13以三行两列的方式矩阵排布,第一行从左到右为第一发光芯片11和第三发光芯片13,第二行均为第二发光芯片12,第三行从左到右为第三发光芯片13和第一发光芯片11。Specifically, the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are arranged in a matrix of three rows and two columns, and the first row from left to right is the first light-emitting chip 11 and the third The light-emitting chips 13 are in the second row each of the second light-emitting chip 12, and the third row is the third light-emitting chip 13 and the first light-emitting chip 11 from left to right.
如图11所示,横向(L向)观察LED灯珠时,第一发光芯片11、第二发光芯片12以及第三发光芯片13中各一颗发光芯片被矩阵遮光架102阻挡,不影响色彩平衡,如图12所示,纵向(V向)观察LED灯珠时,第一发光芯片11和第三发光芯片13中各一颗发光芯片被矩阵遮光架102阻挡,同样不影响色彩平衡。As shown in FIG. 11, when the LED lamp beads are viewed in the lateral direction (L direction), each of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 is blocked by the matrix light-shielding frame 102 without affecting the color. Balance, as shown in FIG. 12, when the LED lamp beads are viewed in the longitudinal direction (V direction), each of the first light-emitting chip 11 and the third light-emitting chip 13 is blocked by the matrix shading frame 102, which also does not affect the color balance.
图13为图12状态下LED灯珠的发光强度分布图。图13从左到右示出了第一发光芯片11、第二发光芯片12和第三发光芯片13的发光强度分布,从图中可以看出,在纵向视角中,红绿蓝三色发光芯片的发光强度角分布都是对称的。FIG. 13 is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 12. FIG. 13 shows the light emission intensity distributions of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 from left to right. As can be seen from the figure, in the vertical viewing angle, the red, green and blue light-emitting chips The angular distributions of the luminous intensity are symmetrical.
在本实施例中,所述矩阵遮光架102的材质为聚碳酸脂(PC),侧壁内表面涂覆有高斯散射角度为20°的扩散反射层,反射率85%。结合图5,镂空栅格103侧壁靠近LED灯珠阵列100的一面的宽度w为2.2mm,侧壁远离LED灯珠阵列100的一面的宽度g为1.3mm,所述矩阵遮光架102的高度h为3mm。遮光架通过卡扣固定在基板和LED灯珠的焊缝中。In this embodiment, the material of the matrix light-shielding frame 102 is polycarbonate (PC), and the inner surface of the side wall is coated with a diffuse reflection layer with a Gaussian scattering angle of 20 °, and the reflectance is 85%. With reference to FIG. 5, the width w of the side of the side wall of the hollow grid 103 near the LED lamp bead array 100 is 2.2 mm, the width of the side of the side wall away from the LED lamp bead array 100 is 1.3 mm, and the height of the matrix shading frame 102 h is 3 mm. The shading frame is fixed in the welding seam of the substrate and the LED lamp beads by buckles.
实施例二Example two
图14为本发明实施例一LED显示屏单个像素的主视图;图15为本发明实施例一LED显示屏单个像素的横向斜视图;图16为本发明实施例一LED显示屏单个像素的纵向斜视图;图17为图16状态下LED灯珠的发光强度分布图。如图14至图16所示,在本实施例中,所述LED灯珠包含的第一发光芯片11和第三发光芯片13的数量均为两个,第二发光芯片12的数量为一个。所述LED灯珠之间的间距p为5mm。LED灯珠使用SMT(表面贴装技术)封装,封装后LED灯珠的尺寸为2.5mm×2.5mm,发光芯片的边长d为0.001mm到1mm,优选为0.1mm到0.3mm。FIG. 14 is a front view of a single pixel of the LED display screen according to the first embodiment of the present invention; FIG. 15 is a horizontal oblique view of a single pixel of the LED display screen according to the first embodiment of the present invention; Angle view; FIG. 17 is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 16. As shown in FIG. 14 to FIG. 16, in this embodiment, the number of the first light emitting chip 11 and the third light emitting chip 13 included in the LED lamp beads are two, and the number of the second light emitting chip 12 is one. The distance p between the LED lamp beads is 5 mm. The LED lamp beads are packaged using SMT (Surface Mount Technology). After the package, the size of the LED lamp beads is 2.5mm × 2.5mm, and the side length d of the light-emitting chip is 0.001mm to 1mm, preferably 0.1mm to 0.3mm.
具体来说,所述第一发光芯片11、第二发光芯片12以及第三发光芯片13排列成“X”字型,其中第二发光芯片12位于中心,一个第一发光芯片11与第二发光芯片12以及一个第三发光芯片13位于一条直线上,另一个第一发光芯片11与另一个第三发光芯片13以及第二发光芯片12位于另一条直线上,两条直线相互交叉呈“X”字型。Specifically, the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 are arranged in an "X" shape, wherein the second light-emitting chip 12 is located at the center, and one first light-emitting chip 11 and the second light-emitting chip The chip 12 and a third light-emitting chip 13 are located on a straight line, and the other first light-emitting chip 11 and another third light-emitting chip 13 and the second light-emitting chip 12 are located on another straight line. The two lines cross each other to form an “X”. Font.
如图15所示,横向(L向)观察LED灯珠时,第一发光芯片11、以及第三发光芯片13中各一颗发光芯片被矩阵遮光架102阻挡,不影响色彩平衡,如图16所示,纵向(V向)观察LED灯珠时,第一发光芯片11和第三发光芯片13中各一颗发光芯片被矩阵遮光架102阻挡,同样不影响色彩平衡。As shown in FIG. 15, when the LED lamp beads are viewed in the lateral direction (L direction), each of the first light-emitting chip 11 and the third light-emitting chip 13 is blocked by the matrix shading frame 102, which does not affect the color balance, as shown in FIG. 16. As shown, when the LED lamp beads are viewed in the longitudinal direction (V direction), each of the first light-emitting chip 11 and the third light-emitting chip 13 is blocked by the matrix light-shielding frame 102, which also does not affect the color balance.
图17为图16状态下LED灯珠的发光强度分布图。图17从左到右示出了第一发光芯片11、第二发光芯片12和第三发光芯片13的发光强度分布,从图中可以看出,在纵向视角中,红绿蓝三色发光芯片的发光强度角分布都是对称的。FIG. 17 is a light intensity distribution diagram of the LED lamp beads in the state of FIG. 16. FIG. 17 shows the light emission intensity distribution of the first light-emitting chip 11, the second light-emitting chip 12, and the third light-emitting chip 13 from left to right. As can be seen from the figure, in the vertical viewing angle, the red, green and blue light-emitting chips The angular distributions of the luminous intensity are symmetrical.
在本实施例中,所述矩阵遮光架102的材质为聚碳酸脂(PC),侧壁内表面涂覆有高斯散射角度为15°的扩散反射层,反射率为50%到95%,优选为95%。结合图5,镂空栅格103侧壁靠近LED灯珠阵列100的一面的宽度w为1.2mm,侧壁远离LED灯珠阵列100的一面的宽度g为0.5mm,所述矩阵遮光架102的高度h为5mm。遮光架通过卡扣固定在基板和LED灯珠的焊缝中。In this embodiment, the material of the matrix light-shielding frame 102 is polycarbonate (PC), and the inner surface of the sidewall is coated with a diffuse reflection layer having a Gaussian scattering angle of 15 °, and the reflectance is 50% to 95%, preferably 95%. With reference to FIG. 5, the width w of the side of the side wall of the hollow grid 103 near the LED lamp bead array 100 is 1.2 mm, and the width g of the side of the side wall away from the LED lamp bead array 100 is 0.5 mm. The height of the matrix shading frame 102 h is 5mm. The shading frame is fixed in the welding seam of the substrate and the LED lamp beads by buckles.
需要补充的是,上述所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所得到的所有其他实施例,都属于本发明所保护的范围。例如,定义实施例一中三行两列矩阵排布结构的发光芯片为结构一,定义实施例二中“X”字型的发光芯片为结构二,由多个结构一和/或结构二组成的中心对称图形也可作为本发明的实施例。It should be added that the embodiments described above are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. For example, the light-emitting chip with the matrix structure of three rows and two columns in the first embodiment is defined as the first structure, and the light-emitting chip of the "X" shape in the second embodiment is defined as the second structure, which is composed of a plurality of the first structure and / or the second structure. The centrally symmetric pattern can also be used as an embodiment of the present invention.
综上所述,本发明使用扩散膜提高了LED显示屏的像素填充率,使用矩阵遮光架避免了像素间的相互串扰,通过设置呈中心对称分布的LED灯珠有效解决了在不同角度观看LED显示屏时产生的色差问题。In summary, the present invention uses a diffuser film to improve the pixel fill rate of an LED display screen, and uses a matrix shading frame to avoid mutual crosstalk between pixels. By setting LED lamp beads that are symmetrically distributed in the center, viewing LEDs at different angles is effectively solved Color aberration issues when displaying a display.

Claims (12)

  1. 一种LED显示屏,其特征在于,所述LED显示屏包含LED灯珠阵列和矩阵遮光架,所述矩阵遮光架设置在LED灯珠阵列的出光侧,所述LED灯珠阵列包含多个LED灯珠,所述LED灯珠包含第一发光芯片、第二发光芯片和第三发光芯片,所述第一发光芯片、第二发光芯片和第三发光芯片分别相对于LED灯珠的中心对称分布。An LED display screen, characterized in that the LED display screen comprises an LED lamp bead array and a matrix shading frame, the matrix shading frame is arranged on the light emitting side of the LED lamp bead array, and the LED lamp bead array includes a plurality of LEDs Lamp beads, the LED lamp beads including a first light emitting chip, a second light emitting chip, and a third light emitting chip, and the first light emitting chip, the second light emitting chip, and the third light emitting chip are symmetrically distributed with respect to the center of the LED light bead, respectively .
  2. 如权利要求1所述的LED显示屏,其特征在于,所述第一发光芯片为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的一种,所述第二发光芯片为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的另一种,所述第三发光芯片为红色发光芯片、绿色发光芯片以及蓝色发光芯片中的最后一种。The LED display screen according to claim 1, wherein the first light emitting chip is one of a red light emitting chip, a green light emitting chip, and a blue light emitting chip, and the second light emitting chip is a red light emitting chip, The other of the green light emitting chip and the blue light emitting chip, the third light emitting chip is the last one of the red light emitting chip, the green light emitting chip, and the blue light emitting chip.
  3. 如权利要求2所述的LED显示屏,其特征在于,所述第一发光芯片、第二发光芯片和第三发光芯片的数量均为两个,所述第一发光芯片、第二发光芯片以及第三发光芯片以三行两列的方式矩阵排布,第一行为第一发光芯片和第三发光芯片,第二行均为第二发光芯片,第三行为第三发光芯片和第一发光芯片。The LED display screen according to claim 2, wherein the number of the first light emitting chip, the second light emitting chip, and the third light emitting chip are two, and the first light emitting chip, the second light emitting chip, and The third light-emitting chip is arranged in a matrix of three rows and two columns. The first line is the first light-emitting chip and the third light-emitting chip, the second line is the second light-emitting chip, and the third line is the third light-emitting chip and the first light-emitting chip. .
  4. 如权利要求2所述的LED显示屏,其特征在于,所述第一发光芯片、第二发光芯片和第三发光芯片呈“X”字型排布。The LED display screen of claim 2, wherein the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are arranged in an “X” shape.
  5. 如权利要求4所述的LED显示屏,其特征在于,所述第一发光芯片和第三发光芯片的数量均为两个,第二发光芯片的数量为一个,第二发光芯片位于中心,一个第一发光芯片与第二发光芯片以及一个第三发光芯片位于一条直线上,另一个第一发光芯片与另一个第三发光芯片以及第二发光芯片位于另一条直线上,两条直线相互交叉呈“X”字型。The LED display screen according to claim 4, wherein the number of the first light emitting chip and the third light emitting chip are two, the number of the second light emitting chip is one, the second light emitting chip is located at the center, and one The first light-emitting chip, the second light-emitting chip, and a third light-emitting chip are located on a straight line, and the other first light-emitting chip, another third light-emitting chip, and the second light-emitting chip are located on another straight line. "X" font.
  6. 如权利要求2所述的LED显示屏,其特征在于,多个所述LED 灯珠以矩形阵列排布在基板上。The LED display screen of claim 2, wherein a plurality of the LED lamp beads are arranged on a substrate in a rectangular array.
  7. 如权利要求6所述的LED显示屏,其特征在于,所述基板在设置LED灯珠的一侧涂覆黑色吸光层。The LED display screen of claim 6, wherein the substrate is coated with a black light absorbing layer on a side where the LED lamp beads are disposed.
  8. 如权利要求6所述的LED显示屏,其特征在于,所述矩阵遮光架上设有多个镂空栅格,所述镂空栅格的数量与LED灯珠的数量相同,每一个所述LED灯珠与所述镂空栅格的中心对应设置。The LED display screen according to claim 6, wherein the matrix shading frame is provided with a plurality of hollow grids, and the number of the hollow grids is the same as the number of the LED lamp beads, and each of the LED lights The beads are arranged corresponding to the center of the hollow grid.
  9. 如权利要求8所述的LED显示屏,其特征在于,所述镂空栅格的侧壁厚度沿远离LED灯珠阵列方向逐渐减小。The LED display screen of claim 8, wherein a thickness of a side wall of the hollow grid gradually decreases in a direction away from the LED lamp bead array.
  10. 如权利要求1所述的LED显示屏,其特征在于,所述LED显示屏还包含扩散膜,所述扩散膜设置在所述矩阵遮光架远离LED灯珠阵列的一侧。The LED display screen according to claim 1, wherein the LED display screen further comprises a diffusion film, and the diffusion film is disposed on a side of the matrix light-shielding frame far from the LED lamp bead array.
  11. 如权利要求10所述的LED显示屏,其特征在于,所述扩散膜为表面扩散膜、体扩散膜或者双层贴合扩散膜,所述双层贴合扩散膜由硬板和扩散层组成。The LED display screen according to claim 10, wherein the diffusion film is a surface diffusion film, a body diffusion film, or a double-layer laminated diffusion film, and the double-layer laminated diffusion film is composed of a hard plate and a diffusion layer. .
  12. 如权利要求1所述的LED显示屏,其特征在于,所述第一发光芯片、第二发光芯片和第三发光芯片单独封装组成一个LED灯珠,或者,所述第一发光芯片、第二发光芯片和第三发光芯片整体封装组成一个LED灯珠。The LED display screen of claim 1, wherein the first light emitting chip, the second light emitting chip, and the third light emitting chip are separately packaged to form an LED lamp bead, or the first light emitting chip, the second light emitting chip, The light emitting chip and the third light emitting chip are integrally packaged to form an LED lamp bead.
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