WO2020061606A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2020061606A1
WO2020061606A1 PCT/AT2019/060318 AT2019060318W WO2020061606A1 WO 2020061606 A1 WO2020061606 A1 WO 2020061606A1 AT 2019060318 W AT2019060318 W AT 2019060318W WO 2020061606 A1 WO2020061606 A1 WO 2020061606A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
rigid body
component
electronic device
Prior art date
Application number
PCT/AT2019/060318
Other languages
German (de)
French (fr)
Inventor
Franz STÖGER
Original Assignee
Stoeger Franz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stoeger Franz filed Critical Stoeger Franz
Priority to EP19790423.8A priority Critical patent/EP3858118A1/en
Publication of WO2020061606A1 publication Critical patent/WO2020061606A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
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    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Definitions

  • the invention relates to an improved electronic circuit of an electronic device, in particular for the field of audio electronics.
  • the printed circuit board having the circuit design, that is to say the electrical conductor tracks for connecting the components.
  • the components usually have connection pins, that is to say rigid wires, which protrude from their housing.
  • the components are attached to the circuit board by soldering their connection pins to the circuit board, usually by passing them through pinholes and soldering them to the back of the circuit board. It is disadvantageous that the components are connected to the printed circuit board by the rigid wires, so that vibrations and resonances are transmitted via the wires between the component and the printed circuit board.
  • cables which are not used to connect components attached to the printed circuit board. Sometimes cables are used to connect two positions on the circuit board, which cannot be connected via conductor tracks on the circuit board itself. Usually cables are used to connect several circuit boards to each other, or to connect circuit boards with fans or decentralized input or output components such as mechanical switches, potentiometers, buttons, loudspeakers, or display elements such as LEDs, which are remote from the circuit board on the housing of the electronic device are available and mostly used to interact with the user, e.g. as an on / off switch, volume control, status display etc.
  • the object of the invention is to provide an improved circuit structure, in particular for audio electronics devices, which can reduce interference of signals.
  • the principle of the invention is that electronic components or a component and a printed circuit board are mechanically firmly coupled to a mass or to the housing and are connected with a very flexible cable.
  • the invention achieves that resonances resulting from the current flow are not derived via the connections of the components, but rather directly to a defined ground. So no disturbing resonances flow through the connections, but the undisturbed current flow of the information to be processed (preferably music signal).
  • the flexibility of the cable is a decisive factor.
  • the cables preferably have a high degree of flexibility. Within the scope of the invention, cables which are particularly suitable for this purpose have been developed and are described in detail below.
  • the cables are preferably insulated, single-core stranded cables.
  • an electronic device comprising at least one printed circuit board and at least one electrical component, the component being fastened to a rigid body, the rigid body being rigidly connected to the printed circuit board and / or the housing of the electronic device, and that Component is connected to the printed circuit board and / or other electrical components with flexible cables.
  • the flexible cables are preferably single-core stranded cables.
  • a flexible cable is preferably attached to a contact of the component.
  • the at least one rigid body preferably comprises at least one solid cuboid, which extends away from the housing or the printed circuit board, preferably vertically, and is rigidly connected to it, the thickness D being the smallest dimension lying parallel to the housing or the printed circuit board Length of the cuboid is preferably at least 2 mm, particularly preferably at least 3 mm.
  • the rigid body is preferably attached to the printed circuit board, the component being at a distance from the printed circuit board, preferably perpendicular, above it, the connections of the component preferably pointing in the direction of the printed circuit board and a flexible cable between at least one connection of the component and the printed circuit board runs and wherein the length of the flexible cable is the same or preferably greater than the distance to be bridged, so that the flexible cable has a straight, or preferably winding or curved course.
  • the rigid body preferably consists of metal, in particular aluminum, copper, brass, stainless steel, steel or titanium.
  • the rigid body preferably has a weight of at least 3 grams, particularly preferably at least 5 grams.
  • the flexible cable is preferably a single-stranded stranded cable with a conductor diameter of at least 0.3 mm, 0.5 mm, 0.75 mm, 1.5 mm or 2.5 mm.
  • the flexible cable preferably has a jacket made of Teflon, polyvinyl chloride, polyethylene, foam polyethylene, polyamide, polytetrafluoroethylene, perfluoroalkoxytetrafluoroethylene, perfluoroethylene propylene,
  • Ethylene tetrafluoroethylene polypropylene, polyurethane, polyester elastomer or silicone rubber.
  • At least one component which is attached to a rigid body is preferably an ohmic resistor.
  • At least one component which is attached to a rigid body is preferably a transistor.
  • a plurality of components are preferably attached to a rigid body, each component being conductively connected to the printed circuit board or another component using flexible cables.
  • the invention also encompasses the method according to the invention for producing a circuit, it being proposed that at least one electrical component, which is conventionally fastened directly to a printed circuit board, in particular with connection pins, is fastened to a rigid body at a distance from the printed circuit board, which body in turn is attached to the circuit board or a housing part is fastened, the first end of each flexible cable being conductively connected to a respective connection pin of the electrical component, the other end of which is conductively connected to the connection point on the circuit board.
  • the ends of the flexible cable are preferably soldered to the connection pins and the connection points on the printed circuit board.
  • FIG. 1 schematically shows a circuit structure according to the invention in a side view.
  • FIG. 2 shows schematically the circuit structure according to the invention in a view from the front.
  • Fig. 3 shows schematically and greatly simplified the cross section of a cable, which is particularly preferably used in the present invention.
  • Fig. 4 shows schematically a circuit structure according to the prior art in front view.
  • Fig. 5 shows schematically an inventive circuit structure with a rigid body, to which several components are attached, in front view.
  • 6 schematically shows the circuit structure according to the invention with a rigid body, to which several components are fastened, in a view from the front.
  • FIG. 4 shows a circuit structure according to the prior art, in which an electrical component 4 is fastened to a printed circuit board 1 via connection pins 6 in pinholes 7 of a printed circuit board 1.
  • the electrical component 4 is shown as an example as a thick film resistor, which has an opening at the upper end of the housing, via which it can be screwed to a heat sink 10. If a heat sink 10 is present, the component 4 is fastened on the one hand to the heat sink 10 and on the other hand electrically and mechanically connected to the connection pins 6 on the printed circuit board 1.
  • the conductor length of the connecting pins 6 between the printed circuit board 1 and the component 4 corresponds to the distance between component 4 and the printed circuit board 1.
  • the connecting pins 6 generally run in a straight line along the shortest route between component 4 and the printed circuit board 1. Until now, it was considered advantageous to use the conductor length of Always make circuits as low as possible.
  • Heat sinks 10 are usually thin metal platelets, or filigree metal profiles, which have the largest possible surface for radiation of heat while using as little material or weight as possible.
  • circuit according to FIG. 4 comprising a printed circuit board 1 and at least one component 4, which is attached to a heat sink 10, is at least optically similar to the circuit in question, this known circuit structure of FIG. 4 can be regarded as the closest prior art.
  • a flexible cable 3 is provided between the printed circuit board 1 and each connection pin 6 or connection of the component 4.
  • the conductor length of the flexible cable 3 is preferably longer than the distance between the printed circuit board 1 and component 4, so that the latter has an at least slightly tortuous or curved course.
  • the flexible cable 3 can also run straight, that is to say have at least the same length as the distance between the printed circuit board 1 and component 4.
  • FIG. 2 schematically show circuits according to the invention, the flexible cables 3 of the components 4 on the right in the two figures not being shown.
  • the component 4 is fastened to a rigid body 2 which is rigidly connected to the printed circuit board 1 and / or to the housing of the electronic device which has the printed circuit board 1.
  • the component 4 is fastened to the rigid body 2 such that the connections or connection pins 6 of the component 4 are at a distance from the printed circuit board 1.
  • the component 4 can in particular be fastened to the rigid body 2 with at least one screw 5, a clamp or another suitable fastening means.
  • the component can be glued to the body 2 less preferably.
  • Several components 4 can also be attached to a rigid body 2.
  • a flexible cable 3 is attached, in particular soldered or welded, to each of the connections or connection pins 6 of the component 4.
  • each flexible cable 3 is attached to the corresponding position of the printed circuit board 1.
  • the attachment can be carried out by soldering the flexible cable 3 to connection pins 6 of the printed circuit board 1, soldering to contact surfaces on the surface of the printed circuit board 1, or guiding them in pinholes 7 of the printed circuit board 1 and soldering them therein.
  • the ends of the flexible cables 3 may or may not be provided with ferrules.
  • the flexible cables 3 are stranded cables, which have an electrical conductor made of thin strands 8, which are surrounded by a jacket 9 made of insulating material.
  • the strands 8 are preferably made of copper, silver or gold.
  • the flexible cable 3 preferably has a number of strands of at least 5, preferably at least 10, in particular at least 15, particularly preferably at least 20.
  • the strand diameter is preferably at least 0.03 mm, preferably at least 0.06 mm, in particular at least 0.9 mm.
  • a stranded cable with at least 20 x 0.1 (20 strands of 0.1 mm diameter each) is preferred.
  • the flexible cable 3 preferably has a conductor diameter [mm] of at least 0.3, 0.5, 0.75, 1.5 or 2.5.
  • the jacket 9 preferably has a thickness of at least 0.1 mm, preferably at least 0.2 mm.
  • Components 4 preferably have a spacing of at least 1 mm, particularly preferably at least 3 mm, from the top of the printed circuit board 1.
  • Connection points of the components 4 preferably have a spacing of at least 3 mm, particularly preferably at least 5 mm, in particular 8 mm, from the top of the printed circuit board 1.
  • Flexible cables 3 preferably have a length of at least 3 mm, preferably at least 5 mm, preferably at least 8 mm.
  • the rigid bodies 2 preferably consist of aluminum, copper, brass, steel, bronze, stainless steel, titanium or plastic.
  • a rigid body 2 preferably has a weight of at least 3 g, preferably at least 5 g.
  • a rigid body 2 preferably has a thickness D of at least 2 mm, preferably at least 3 mm, particularly preferably at least 5 mm.
  • a rigid body 2 preferably has a height H of at least 5 mm, preferably at least 1 cm, particularly preferably at least 3 cm.
  • a rigid body 2 preferably has a width B of at least 3 mm, preferably at least 5 mm, particularly preferably at least 1 cm.
  • the rigid body 2 has in particular a solid cuboid, which has the above minimum dimensions.
  • the rigid body 2 differs from conventional heat sinks 10 in that it is deliberately solid and heavy and does not seek, as in conventional heat sinks 10, to achieve the largest possible surface area with low material consumption or weight.
  • the printed circuit board 1 preferably has a thickness of at least 1 mm.
  • At least one component 4 is preferably a resistor, in particular a thick film resistor.
  • At least one component 4 is preferably a transistor, for example only transistors can be attached in the manner according to the invention.
  • the rigid bodies 2 shown in FIGS. 1 and 2 can also have a further component 4 on the back or on the side opposite the component 4. Components 4 could even be placed on the top of a rigid body 2. In contrast to the illustration, the connection points of the components 4 do not have to face the printed circuit board 1.
  • the components 4 can be attached to the rigid body 2 in any orientation, for example rotated 90 ° or 180 ° with respect to the orientation shown.
  • connection points of the components 4 can point away from the printed circuit board 1 (oriented upwards) in order to increase the distance between the connection points of the components 4 and the printed circuit board 1, so that the cable length can be maximized with a small distance between the component 4 and the printed circuit board 1.
  • the rigid body 2 of FIGS. 4 and 5 has three components 4 on both sides along its width B and one component 4 along its thickness D, so that a total of eight components 4 are present on the rigid body 2.
  • the rigid body 2 of FIGS. 5 and 6 could be designed as a hollow body.
  • components 4 can be present in indentations of the rigid body 2, or can be attached to a flat outer surface thereof.
  • the rigid bodies 2 are preferably firmly connected to the printed circuit board 1. For example, this can be done by screwing screws from the back of the printed circuit board 1 into the rigid body 2.
  • the rigid body 2 preferably extends perpendicularly away from the printed circuit board 1, but can also be oriented obliquely to it, or even have a tortuous course.
  • the rigid body 2 can also be fastened, in particular screwed, to the housing.
  • the rigid body 2 can, for example, be fastened to the housing by means of a screw through the printed circuit board 1.
  • the printed circuit board 1 can also have conventionally attached components which are attached in accordance with the known type illustrated in FIG. 4.
  • Passive components such as, in particular, resistors and capacitors, or discrete semiconductors and power semiconductors, such as, for example, diodes, transistors or thyristors, are particularly suitable for the attachment according to the invention.
  • the attachment according to the invention can even be carried out on more complex components, such as integrated circuits, that is, components with many connection pins with a small spacing from one another.
  • Components 4 which can be soldered manually and which have a sufficient distance between their connection pins 6, preferably at least 1 mm, are preferred.
  • Components 4 with a housing of flat construction with one-sided connection points and opening for screw fastening are preferred.
  • Such housing shapes are common, for example, for high-load resistors and transistors.
  • wired resistors can be held on the rigid body 2 with clips.
  • SMD resistors or other components 4 can (preferably directly, that is to say without a gap or without pins) be soldered to a small auxiliary circuit board which is attached to the rigid body 2 and which has the connection points, for example pins, for the flexible cables 3.
  • a mechanical attachment to the rigid body 2 and mechanical decoupling from the printed circuit board 1 can also take place in this way.
  • the rigid body 2 can also protrude through an opening in the printed circuit board 1.
  • the rigid body 2 can also extend away from the circuit board 1 on the other side, so that components 4 can be attached to the rigid body on both sides of the circuit board 1.
  • a further rigid body can also be arranged under the printed circuit board 1, which is parallel to this extends and forms a mounting plate or a mounting surface for the rigid body 2, which are present on the top of the circuit board 1.
  • Several rigid bodies 2 can also be monolithically, or positively or materially connected to a common fastening plate or mounting surface, the printed circuit board 1 with corresponding openings being able to be guided over the rigid body 2 before the components 4 are electrically connected to it.
  • the fastening plate or mounting surface can be a housing part or part of the housing of an electronic device, for example a base plate, cover plate, side wall, intermediate level or intermediate wall within the housing.
  • the printed circuit board 1 can also be present at an angle up to perpendicular to the housing part to which at least one rigid body 2 is attached.
  • the circuit board 1 can be attached to the housing and / or to at least one rigid body 2.
  • a rigid body 2 can be fastened to a housing part and a printed circuit board can be arranged normal to the housing part, this being at a distance from or adjacent to the rigid body and at least one component 4 is arranged on the rigid body, which is connected to flexible cables 3 is electrically connected to the circuit board 1.

Abstract

The invention relates to an electronic device comprising at least one printed circuit board (1) and at least one electric component (4). The component (4) is secured to a rigid body (2), and the rigid body (2) is rigidly connected to the printed circuit board (1) and/or a housing part of the electronic device. The component (4) is conductively connected to the printed circuit board (1) and/or other electric components (4) by means of flexible cables (3). The invention also relates to a method for producing such a circuit.

Description

Elektronisches Gerät  Electronic device
Die Erfindung betrifft eine verbesserte elektronische Schaltung eines elektronischen Geräts insbesondere für den Bereich der Audioelektronik.  The invention relates to an improved electronic circuit of an electronic device, in particular for the field of audio electronics.
Im Bereich der Audioelektronik werden elektrische Signale in Töne insbesondere Musik umgewandelt, wobei sich Störungen des Stromflusses negativ auf den Klang auswirken können. In the field of audio electronics, electrical signals are converted into sounds, particularly music, whereby disturbances in the flow of current can have a negative effect on the sound.
Bei elektronischen Schaltungen ist es üblich elektronische Bauteile auf Leiterplatinen anzubringen, wobei die Leiterplatine das Schaltungsdesign aufweist, also die elektrischen Leiterbahnen zur Verbindung der Bauteile. Üblicherweise weisen die Bauteile Anschlusspins, also starre Drähte auf, welche aus deren Gehäuse herausragen. Die Bauteile werden an der Leiterplatine befestigt indem deren Anschlusspins an der Leiterplatine verlötet werden, meist indem diese durch Pinholes geführt werden und an der Rückseite der Leiterplatine verlötet werden. Nachteilig ist, dass die Bauteile durch die starren Drähte mit der Leiterplatine verbunden sind, sodass Schwingungen und Resonanzen über die Drähte zwischen Bauteil und Leiterplatine übertragen werden. In electronic circuits, it is customary to mount electronic components on printed circuit boards, the printed circuit board having the circuit design, that is to say the electrical conductor tracks for connecting the components. The components usually have connection pins, that is to say rigid wires, which protrude from their housing. The components are attached to the circuit board by soldering their connection pins to the circuit board, usually by passing them through pinholes and soldering them to the back of the circuit board. It is disadvantageous that the components are connected to the printed circuit board by the rigid wires, so that vibrations and resonances are transmitted via the wires between the component and the printed circuit board.
Bei vielen Leiterplatten findet man auch Kabel wobei diese nicht zum Anschließen von auf der Leiterplatine angebrachten Bauteilen dienen. Manchmal dienen Kabel dazu, um zwei Positionen an der Leiterplatine zu verbinden, welche nicht über Leiterbahnen der Leiterplatine selbst verbunden werden können. Meist dienen Kabel dazu um mehrere Leiterplatinen untereinander zu verbinden, oder um Leiterplatinen mit Lüftern oder dezentralen Ein- oder Ausgabebauteilen wie beispielsweise mechanischen Schaltern, Potentiometern, Tastern, Lautsprechern, oder Anzeigeelementen wie LEDs zu verbinden, welche entfernt von der Leiterplatine am Gehäuse des elektronischen Gerätes vorliegen und meist zur Interaktion mit dem Benutzer dienen, z.B. als Ein- Ausschalter, Lautstärkenregler, Statusanzeige etc.  Many printed circuit boards also contain cables, which are not used to connect components attached to the printed circuit board. Sometimes cables are used to connect two positions on the circuit board, which cannot be connected via conductor tracks on the circuit board itself. Usually cables are used to connect several circuit boards to each other, or to connect circuit boards with fans or decentralized input or output components such as mechanical switches, potentiometers, buttons, loudspeakers, or display elements such as LEDs, which are remote from the circuit board on the housing of the electronic device are available and mostly used to interact with the user, e.g. as an on / off switch, volume control, status display etc.
Aufgabe der Erfindung ist es einen verbesserten Schaltungsaufbau, insbesondere für Geräte der Audioelektronik zur Verfügung zu stellen, welcher Störungen von Signalen reduzieren kann. The object of the invention is to provide an improved circuit structure, in particular for audio electronics devices, which can reduce interference of signals.
Erfindungsgemäß wird vorgeschlagen, den bekannten Schaltungsaufbau dahingehend zu verbessern, dass die Bauteile an starren Körpern mechanisch befestigt und mit flexiblen Kabeln mit der Leiterplatine elektrisch verbunden sind. According to the invention, it is proposed to improve the known circuit structure in such a way that the components are mechanically attached to rigid bodies and are electrically connected to the printed circuit board with flexible cables.
Dadurch wird erreicht, dass Schwingungen und/oder Resonanzen nicht über die Anschlussdrähte übertragen werden, sondern direkt von den starren Körpern aufgenommen werden.  This ensures that vibrations and / or resonances are not transmitted via the connecting wires, but are absorbed directly by the rigid bodies.
Das Prinzip der Erfindung besteht darin, dass elektronische Bauteile oder ein Bauteil und eine Leiterplatte mechanische fest an eine Masse oder an das Gehäuse angekoppelt sind und mit einem sehr flexiblen Kabel verbunden werden. Ohne an diese Theorie gebunden sein zu wollen, wird durch die Erfindung erreicht, dass durch den Stromfluss entstehende Resonanzen nicht über die Anschlüsse der Bauteile abgeleitet werden, sondern direkt an eine definierte Masse. So fließen über die Anschlüsse keine störenden Resonanzen, sondern der ungestörte Stromfluss der Information die verarbeitet werden soll (bevorzugt Musiksignal). Mitentscheidend ist die Flexibilität des Kabels. Bevorzugt weisen die Kabel eine hohe Flexibilität auf. Im Rahmen der Erfindung wurden eigens speziell für diesen Zweck besonders geeignete Kabel entwickelt, welche nachfolgend im Detail beschrieben werden.The principle of the invention is that electronic components or a component and a printed circuit board are mechanically firmly coupled to a mass or to the housing and are connected with a very flexible cable. Without wishing to be bound by this theory, the invention achieves that resonances resulting from the current flow are not derived via the connections of the components, but rather directly to a defined ground. So no disturbing resonances flow through the connections, but the undisturbed current flow of the information to be processed (preferably music signal). The flexibility of the cable is a decisive factor. The cables preferably have a high degree of flexibility. Within the scope of the invention, cables which are particularly suitable for this purpose have been developed and are described in detail below.
Die Kabel sind bevorzugt isolierte, einadrige Litzenkabel. Als einadrig (auch als einpolig bezeichnet) ist ein Kabel zu verstehen, dass nur eine Leitung (Leiter- bzw. Aderanzahl = 1) aufweist (auch als Einzeladerkabel bezeichnet). The cables are preferably insulated, single-core stranded cables. A single-core (also referred to as single-pole) cable is to be understood as having only one line (number of conductors or cores = 1) (also referred to as single-core cable).
Es wurde jedenfalls festgestellt, dass für Testpersonen der ETnterschied zu herkömmlichen Leiterplatinenaufbauten sehr deutlich im Klang zu hören und sofort nachvollziehbar ist.  In any case, it was found that the difference to conventional printed circuit board assemblies can be heard very clearly in the test subjects and is immediately understandable.
Konkret wird gemäß Anspruch 1 ein elektronisches Gerät vorgeschlagen, umfassend zumindest eine Leiterplatine und zumindest ein elektrisches Bauteil, wobei das Bauteil an einem starren Körper befestigt ist, wobei der starre Körper starr mit der Leiterplatine und/oder dem Gehäuse des elektronischen Geräts verbunden ist und das Bauteil mit flexiblen Kabeln mit der Leiterplatine und/oder anderen elektrischen Bauteilen leitend verbunden ist.  Specifically, an electronic device is proposed according to claim 1, comprising at least one printed circuit board and at least one electrical component, the component being fastened to a rigid body, the rigid body being rigidly connected to the printed circuit board and / or the housing of the electronic device, and that Component is connected to the printed circuit board and / or other electrical components with flexible cables.
Bevorzugt sind die flexiblen Kabel einadrige Litzenkabel. Bevorzugt ist jeweils ein flexibles Kabel an einem Kontakt des Bauteils angebracht.  The flexible cables are preferably single-core stranded cables. A flexible cable is preferably attached to a contact of the component.
Bevorzugt umfasst der zumindest eine starre Körper zumindest einen massiven Quader, der sich vom Gehäuse oder der Leiterplatine, bevorzugt senkrecht, weg erstreckt, und mit diesem starr verbunden ist, wobei die Dicke D, als jene parallel zum Gehäuse oder der Leiterplatte liegende Abmessung mit geringster Länge des Quaders bevorzugt zumindest 2 mm, besonders bevorzugt zumindest 3 mm beträgt.  The at least one rigid body preferably comprises at least one solid cuboid, which extends away from the housing or the printed circuit board, preferably vertically, and is rigidly connected to it, the thickness D being the smallest dimension lying parallel to the housing or the printed circuit board Length of the cuboid is preferably at least 2 mm, particularly preferably at least 3 mm.
Bevorzugt ist der starre Körper an der Leiterplatine angebracht, wobei das Bauteil mit Abstand zur Leiterplatine, bevorzugt senkrecht, über dieser vorliegt, wobei die Anschlüsse des Bauteils bevorzugt in Richtung der Leiterplatine weisen und wobei zwischen zumindest einem Anschluss des Bauteils und der Leiterplatine ein flexibles Kabel verläuft und wobei die Länge der flexiblen Kabels gleich groß oder bevorzugt größer ist, als die zu überbrückende Distanz, sodass das flexible Kabel einen geraden, oder bevorzugt gewundenen bzw. kurvigen Verlauf aufweist.  The rigid body is preferably attached to the printed circuit board, the component being at a distance from the printed circuit board, preferably perpendicular, above it, the connections of the component preferably pointing in the direction of the printed circuit board and a flexible cable between at least one connection of the component and the printed circuit board runs and wherein the length of the flexible cable is the same or preferably greater than the distance to be bridged, so that the flexible cable has a straight, or preferably winding or curved course.
Bevorzugt besteht der starre Körper aus Metall, insbesondere Aluminium, Kupfer, Messing, Edelstahl, Stahl oder Titan. Bevorzugt weist der starre Körper ein Gewicht von zumindest 3 Gramm, besonders bevorzugt mindestens 5 Gramm auf. Bevorzugt ist das flexible Kabel ein einadriges Litzenkabel mit einem Leiterdurchmesser von zumindest 0,3 mm, 0,5 mm, 0,75mm, l,5mm oder 2,5mm. Bevorzugt weist das flexible Kabel einen Mantel aus Teflon, Polyvinylchlorid, Polyethylen, Schaumpolyethylen, Polyamid, Polytetrafluorethylen, Perfluoralkoxytetrafluorethylen, Perfluor ethylenpropy len,The rigid body preferably consists of metal, in particular aluminum, copper, brass, stainless steel, steel or titanium. The rigid body preferably has a weight of at least 3 grams, particularly preferably at least 5 grams. The flexible cable is preferably a single-stranded stranded cable with a conductor diameter of at least 0.3 mm, 0.5 mm, 0.75 mm, 1.5 mm or 2.5 mm. The flexible cable preferably has a jacket made of Teflon, polyvinyl chloride, polyethylene, foam polyethylene, polyamide, polytetrafluoroethylene, perfluoroalkoxytetrafluoroethylene, perfluoroethylene propylene,
Ethylentetrafluorethylen, Polypropylen, Polyurethan, Polyester-Elastomer oder Silikon- Kautschuk auf. Ethylene tetrafluoroethylene, polypropylene, polyurethane, polyester elastomer or silicone rubber.
Bevorzugt ist zumindest ein Bauteil, welches an einem starren Körper angebracht ist, ein ohmscher Widerstand.  At least one component which is attached to a rigid body is preferably an ohmic resistor.
Bevorzugt ist zumindest ein Bauteil, welches an einem starren Körper angebracht ist, ein Transistor.  At least one component which is attached to a rigid body is preferably a transistor.
Bevorzugt sind an einem starren Körper mehrere Bauteile angebracht, wobei jedes Bauteil mit flexiblen Kabeln leitend mit der Leiterplatte oder einem anderen Bauteil verbunden ist.  A plurality of components are preferably attached to a rigid body, each component being conductively connected to the printed circuit board or another component using flexible cables.
Die Erfindung umfasst auch das erfmdungsgemäße Verfahren zur Herstellung einer Schaltung, wobei vorgeschlagen wird, dass zumindest ein elektrisches Bauteil, welches herkömmlich direkt, insbesondere mit Anschlusspins, an einer Leiterplatine befestigt wird, mit Abstand zur Leiterplatine an einem starren Körper befestigt wird, welcher seinerseits an der Leiterplatine oder einem Gehäuseteil befestigt wird, wobei an je einem Anschlusspin des elektrischen Bauteils das erste Ende je eines flexiblen Kabels leitend angeschlossen wird, dessen anderes Ende an der Anschlussstelle an der Leiterplatine leitend angeschlossen wird.  The invention also encompasses the method according to the invention for producing a circuit, it being proposed that at least one electrical component, which is conventionally fastened directly to a printed circuit board, in particular with connection pins, is fastened to a rigid body at a distance from the printed circuit board, which body in turn is attached to the circuit board or a housing part is fastened, the first end of each flexible cable being conductively connected to a respective connection pin of the electrical component, the other end of which is conductively connected to the connection point on the circuit board.
Bevorzugt werden die Enden des flexiblen Kabels an den Anschlusspins und den Anschlussstellen an der Leiterplatine verlötet.  The ends of the flexible cable are preferably soldered to the connection pins and the connection points on the printed circuit board.
Die Erfindung wird an Hand von Zeichnungen veranschaulicht: The invention is illustrated by means of drawings:
Fig. 1 : zeigt schematisch einen erfmdungsgemäßen Schaltungsaufbau in Seitenansicht. 1: schematically shows a circuit structure according to the invention in a side view.
Fig. 2: zeigt schematisch den erfmdungsgemäßen Schaltungsaufbau in Ansicht von vorne. 2: shows schematically the circuit structure according to the invention in a view from the front.
Fig. 3 : zeigt schematisch und stark vereinfacht den Querschnitt eines Kabels, welches besonders bevorzugt bei der gegenständlichen Erfindung verwendet wird. Fig. 3: shows schematically and greatly simplified the cross section of a cable, which is particularly preferably used in the present invention.
Fig. 4: zeigt schematisch einen Schaltungsaufbau nach dem Stand der Technik in Ansicht von vorne. Fig. 4: shows schematically a circuit structure according to the prior art in front view.
Fig. 5: zeigt schematisch einen erfmdungsgemäßen Schaltungsaufbau mit einem starren Körper, an welchem mehrere Bauteile befestigt sind, in Ansicht von vorne. Fig. 6 zeigt schematisch den erfmdungsgemäßen Schaltungsaufbau mit einem starren Körper, an welchem mehrere Bauteile befestigt sind, in Ansicht von vorne. Fig. 5: shows schematically an inventive circuit structure with a rigid body, to which several components are attached, in front view. 6 schematically shows the circuit structure according to the invention with a rigid body, to which several components are fastened, in a view from the front.
In Fig. 4 ist ein Schaltungsaufbau nach dem Stand der Technik veranschaulicht, bei welchem ein elektrisches Bauteil 4 an einer Leiterplatine 1 über Anschlusspins 6 in Pinholes 7 einer Leiterplatine 1 befestigt ist. Das elektrisches Bauteil 4 ist beispielhaft als Dickfilmwiderstand dargestellt, welcher am oberen Ende des Gehäuses eine Öffnung aufweist, über welche er an einem Kühlkörper 10 verschraubt werden kann. Sofern ein Kühlkörper 10 vorhanden ist, ist das Bauteil 4 einerseits am Kühlkörper 10 befestigt und andererseits an der Leiterplatine 1 mit den Anschlusspins 6 elektrisch und mechanisch verbunden. Die Leiterlänge der Anschlusspins 6 zwischen der Leiterplatine 1 und dem Bauteil 4 entspricht der Distanz zwischen Bauteil 4 und Leiterplatine 1. Die Anschlusspins 6 verlaufen in der Regel geradlinig auf kürzestem Weg zwischen Bauteil 4 und Leiterplatine 1. Bislang wurde es als vorteilhaft angesehen die Leiterlänge von Schaltungen immer so gering als möglich auszuführen. Kühlkörper 10 sind meist dünne Metallplättchen, oder filigrane Metallprofile, welche bei möglichst geringem Materialverbrauch bzw. Gewicht eine möglichst große Oberfläche zur Ab Strahlung von Wärme aufweisen. 4 shows a circuit structure according to the prior art, in which an electrical component 4 is fastened to a printed circuit board 1 via connection pins 6 in pinholes 7 of a printed circuit board 1. The electrical component 4 is shown as an example as a thick film resistor, which has an opening at the upper end of the housing, via which it can be screwed to a heat sink 10. If a heat sink 10 is present, the component 4 is fastened on the one hand to the heat sink 10 and on the other hand electrically and mechanically connected to the connection pins 6 on the printed circuit board 1. The conductor length of the connecting pins 6 between the printed circuit board 1 and the component 4 corresponds to the distance between component 4 and the printed circuit board 1. The connecting pins 6 generally run in a straight line along the shortest route between component 4 and the printed circuit board 1. Until now, it was considered advantageous to use the conductor length of Always make circuits as low as possible. Heat sinks 10 are usually thin metal platelets, or filigree metal profiles, which have the largest possible surface for radiation of heat while using as little material or weight as possible.
Da die Schaltung gemäß Fig. 4 umfassend eine Leiterplatine 1 und zumindest ein Bauteil 4, welches an einem Kühlkörper 10 angebracht ist, zumindest optisch Ähnlichkeit mit der gegenständlichen Schaltung aufweist, kann dieser bekannte Schaltungsaufbau der Fig. 4 als nächster Stand der Technik angesehen werden.  Since the circuit according to FIG. 4 comprising a printed circuit board 1 and at least one component 4, which is attached to a heat sink 10, is at least optically similar to the circuit in question, this known circuit structure of FIG. 4 can be regarded as the closest prior art.
Wenn man Fig. 4 und Fig. 2 vergleicht, wird der Unterschied des erfmdungsgemäßen Schaltungsaufbaus zum herkömmlichen Schaltungsaufbau besonders gut ersichtlich.  If one compares FIG. 4 and FIG. 2, the difference between the circuit structure according to the invention and the conventional circuit structure becomes particularly clear.
Anstelle die Bauteile 4 mit starren Anschlusspins 6 auf kurzen bzw. kürzestem Weg mit der Leiterplatine 1 zu verbinden, ist zwischen Leiterplatine 1 und jedem Anschlusspin 6 bzw. Anschluss des Bauteils 4 ein flexibles Kabel 3 vorgesehen. Die Leiterlänge des flexiblen Kabels 3 ist bevorzugt länger, als die Distanz zwischen Leiterplatine 1 und Bauteil 4, sodass dieses einen zumindest leicht gewundenen bzw. kurvigen Verlauf aufweist. Das flexible Kabel 3 kann aber auch gerade verlaufen, also zumindest dieselbe Länge aufweisen, wie die Distanz zwischen Leiterplatine 1 und Bauteil 4.  Instead of connecting the components 4 with rigid connection pins 6 to the printed circuit board 1 in a short or shortest way, a flexible cable 3 is provided between the printed circuit board 1 and each connection pin 6 or connection of the component 4. The conductor length of the flexible cable 3 is preferably longer than the distance between the printed circuit board 1 and component 4, so that the latter has an at least slightly tortuous or curved course. However, the flexible cable 3 can also run straight, that is to say have at least the same length as the distance between the printed circuit board 1 and component 4.
In Fig. 1 und Fig. 2 sind erfmdungsgemäße Schaltungen schematisch dargestellt, wobei die flexiblen Kabel 3 der in den beiden Figuren rechten Bauteile 4 nicht dargestellt sind.  1 and FIG. 2 schematically show circuits according to the invention, the flexible cables 3 of the components 4 on the right in the two figures not being shown.
Das Bauteil 4 ist an einem starren Körper 2 befestigt, welcher starr mit der Leiterplatine 1 und/oder mit dem Gehäuse des elektronischen Geräts verbunden sind, welches die Leiterplatine 1 aufweist. Das Bauteil 4 ist derart am starren Körper 2 befestigt, dass die Anschlüsse bzw. Anschlusspins 6 des Bauteils 4 mit Abstand zur Leiterplatine 1 vorliegen. Das Bauteil 4 kann insbesondere mit zumindest einer Schraube 5, einer Klammer oder einem anderen geeigneten Befestigungsmittel am starren Körper 2 befestigt sein. Weniger bevorzugt kann das Bauteil am Körper 2 verklebt werden. An einem starren Körper 2 können auch mehrere Bauteile 4 angebracht sein. The component 4 is fastened to a rigid body 2 which is rigidly connected to the printed circuit board 1 and / or to the housing of the electronic device which has the printed circuit board 1. The component 4 is fastened to the rigid body 2 such that the connections or connection pins 6 of the component 4 are at a distance from the printed circuit board 1. The component 4 can in particular be fastened to the rigid body 2 with at least one screw 5, a clamp or another suitable fastening means. The component can be glued to the body 2 less preferably. Several components 4 can also be attached to a rigid body 2.
An den Anschlüssen bzw. Anschlusspins 6 des Bauteils 4 ist je ein flexibles Kabel 3 angebracht, insbesondere angelötet oder geschweißt.  A flexible cable 3 is attached, in particular soldered or welded, to each of the connections or connection pins 6 of the component 4.
Das andere Ende jedes flexiblen Kabels 3 ist an der entsprechend dafür vorgesehenen Position der Leiterplatine 1 befestigt. Das Befestigen kann dadurch erfolgen, dass das flexible Kabel 3 an Anschlusspins 6 der Leiterplatine 1 verlötet wird, an der Oberfläche der Leiterplatine 1 an Kontaktflächen verlötet wird, oder in Pinholes 7 der Leiterplatine 1 geführt wird und in diesen verlötet wird. Die Enden der flexiblen Kabel 3 können mit Aderendhülsen versehen sein, oder nicht.  The other end of each flexible cable 3 is attached to the corresponding position of the printed circuit board 1. The attachment can be carried out by soldering the flexible cable 3 to connection pins 6 of the printed circuit board 1, soldering to contact surfaces on the surface of the printed circuit board 1, or guiding them in pinholes 7 of the printed circuit board 1 and soldering them therein. The ends of the flexible cables 3 may or may not be provided with ferrules.
Bei den flexiblen Kabeln 3 handelt es sich um Litzenkabel, welche einen elektrischen Leiter aus dünnen Litzen 8 aufweisen, welche von einem Mantel 9 aus Isoliermaterial umgeben sind.  The flexible cables 3 are stranded cables, which have an electrical conductor made of thin strands 8, which are surrounded by a jacket 9 made of insulating material.
Die Litzen 8 bestehen bevorzugt aus Kupfer, Silber oder Gold.  The strands 8 are preferably made of copper, silver or gold.
Bevorzugt weist das flexible Kabel 3 eine Litzenanzahl von mindestens 5, bevorzugt mindestens 10, insbesondere mindestens 15, besonders bevorzugt zumindest 20 auf. Der Litzendurchmesser beträgt bevorzugt zumindest 0,03mm, bevorzugt zumindest 0,06mm insbesondere zumindest 0,9mm. Bevorzugt wird ein Litzenkabel mit zumindest 20 x 0,1 (20 Litzen zu je 0, lmm Durchmesser).  The flexible cable 3 preferably has a number of strands of at least 5, preferably at least 10, in particular at least 15, particularly preferably at least 20. The strand diameter is preferably at least 0.03 mm, preferably at least 0.06 mm, in particular at least 0.9 mm. A stranded cable with at least 20 x 0.1 (20 strands of 0.1 mm diameter each) is preferred.
Bevorzugt weist das flexible Kabel 3 einen Leiterdurchmesser [mm] von zumindest 0,3, 0,5, 0,75, 1,5 oder 2,5 auf.  The flexible cable 3 preferably has a conductor diameter [mm] of at least 0.3, 0.5, 0.75, 1.5 or 2.5.
Bevorzugt weist der Mantel 9 eine Dicke von zumindest 0, lmm bevorzugt zumindest 0,2mm auf. Bevorzugt weisen Bauteile 4 einen Anstand von mindestens 1 mm, besonders bevorzugt zumindest 3 mm zur Oberseite der Leiterplatine 1 auf. Bevorzugt weisen Anschlussstellen der Bauteile 4 einen Anstand von mindestens 3 mm, besonders bevorzugt zumindest 5 mm, insbesondere 8 mm zur Oberseite der Leiterplatine 1 auf.  The jacket 9 preferably has a thickness of at least 0.1 mm, preferably at least 0.2 mm. Components 4 preferably have a spacing of at least 1 mm, particularly preferably at least 3 mm, from the top of the printed circuit board 1. Connection points of the components 4 preferably have a spacing of at least 3 mm, particularly preferably at least 5 mm, in particular 8 mm, from the top of the printed circuit board 1.
Bevorzugt weisen flexible Kabel 3 eine Länge von mindestens 3 mm auf, bevorzugt mindestens 5 mm, bevorzugt zumindest 8 mm.  Flexible cables 3 preferably have a length of at least 3 mm, preferably at least 5 mm, preferably at least 8 mm.
Bevorzugt bestehen die starren Körper 2 aus Aluminium, Kupfer, Messing, Stahl, Bronze, Edelstahl, Titan oder aus Kunststoff. Bevorzugt hat ein starrer Körper 2 ein Gewicht von zumindest 3 g, bevorzugt zumindest 5 Gramm. Bevorzugt hat ein starrer Körper 2 eine Dicke D von zumindest 2 mm, bevorzugt zumindest 3 mm, besonders bevorzugt zumindest 5 mm. The rigid bodies 2 preferably consist of aluminum, copper, brass, steel, bronze, stainless steel, titanium or plastic. A rigid body 2 preferably has a weight of at least 3 g, preferably at least 5 g. A rigid body 2 preferably has a thickness D of at least 2 mm, preferably at least 3 mm, particularly preferably at least 5 mm.
Bevorzugt hat ein starrer Körper 2 eine Höhe H von zumindest 5 mm, bevorzugt zumindest 1 cm, besonders bevorzugt zumindest 3 cm.  A rigid body 2 preferably has a height H of at least 5 mm, preferably at least 1 cm, particularly preferably at least 3 cm.
Bevorzugt hat ein starrer Körper 2 eine Breite B von zumindest 3 mm, bevorzugt zumindest 5 mm, besonders bevorzugt zumindest 1 cm.  A rigid body 2 preferably has a width B of at least 3 mm, preferably at least 5 mm, particularly preferably at least 1 cm.
Der starre Körper 2 weist insbesondere einen massiven Quader auf, welcher die obigen Mindestabmessungen aufweist. Der starre Körper 2 unterscheidet sich von herkömmlichen Kühlkörpern 10, dahingehend, dass dieses bewusst massiv und schwer ausgebildet ist und nicht wie bei herkömmlichen Kühlkörpern 10 danach getrachtet wird, eine möglichst große Oberfläche bei geringem Materialverbrauch bzw. Gewicht zu erreichen.  The rigid body 2 has in particular a solid cuboid, which has the above minimum dimensions. The rigid body 2 differs from conventional heat sinks 10 in that it is deliberately solid and heavy and does not seek, as in conventional heat sinks 10, to achieve the largest possible surface area with low material consumption or weight.
Bevorzugt weist die Leiterplatine 1 eine Dicke von mindestens 1 mm auf.  The printed circuit board 1 preferably has a thickness of at least 1 mm.
Bevorzugt handelt es sich bei zumindest einem Bauteil 4 um einen Widerstand, insbesondere um einen Dickfilmwiderstand.  At least one component 4 is preferably a resistor, in particular a thick film resistor.
Bevorzugt handelt es sich bei zumindest einem Bauteil 4 um einen Transistor, beispielsweise können auch ausschließlich Transistoren auf die erfindungsgemäße Art angebracht werden.  At least one component 4 is preferably a transistor, for example only transistors can be attached in the manner according to the invention.
Bei den in Fig. 1 und 2 dargestellten starren Körpern 2 ist jeweils ein Bauteil 4 angebracht. Die in Fig. 1 und 2 dargestellten starren Körpern 2 können aber auch auf der Rückseite bzw. der dem Bauteil 4 gegenüberliegenden Seite ein weiteres Bauteil 4 aufweisen. Selbst auf der Oberseite eines starren Körpers 2 könnten Bauteile 4 platziert werden. Anders als dargestellt müssen die Anschlussstellen der Bauteile 4 nicht der Leiterplatine 1 zugewandt liegen. Die Bauteile 4 können in einer beliebigen Ausrichtung am starren Körper 2 befestigt sein, beispielsweise 90° oder 180° gegenüber der dargestellten Ausrichtung gedreht. Beispielsweise können die Anschlussstellen der Bauteile 4 von der Leiterplatine 1 weg weisen (nach oben ausgerichtet), um den Abstand der Anschlussstellen der Bauteile 4 zur Leiterplatine 1 zu vergrößern, sodass die Kabellänge bei geringem Abstand des Bauteils 4 zur Leiterplatine 1 maximiert werden kann.  In the rigid bodies 2 shown in FIGS. 1 and 2, one component 4 is attached in each case. The rigid bodies 2 shown in FIGS. 1 and 2 can also have a further component 4 on the back or on the side opposite the component 4. Components 4 could even be placed on the top of a rigid body 2. In contrast to the illustration, the connection points of the components 4 do not have to face the printed circuit board 1. The components 4 can be attached to the rigid body 2 in any orientation, for example rotated 90 ° or 180 ° with respect to the orientation shown. For example, the connection points of the components 4 can point away from the printed circuit board 1 (oriented upwards) in order to increase the distance between the connection points of the components 4 and the printed circuit board 1, so that the cable length can be maximized with a small distance between the component 4 and the printed circuit board 1.
Wenn man die Breite und Dicke der starren Körper 2 erhöht, können auch mehr als zwei Bauteile 4 an diesen angebracht werden, wie in den Fig. 4 und 6 veranschaulicht ist. Der starre Körper 2 der Fig. 4 und 5 weist entlang seiner Breite B beidseits drei Bauteile 4 auf und entlang seiner Dicke D jeweils ein Bauteil 4, sodass am starren Körper 2 insgesamt acht Bauteile 4 vorliegen. Der starre Körper 2 der Fig. 5 und 6 könnte als Hohlkörper ausgeführt sein.  If the width and thickness of the rigid bodies 2 are increased, more than two components 4 can also be attached to them, as illustrated in FIGS. 4 and 6. The rigid body 2 of FIGS. 4 and 5 has three components 4 on both sides along its width B and one component 4 along its thickness D, so that a total of eight components 4 are present on the rigid body 2. The rigid body 2 of FIGS. 5 and 6 could be designed as a hollow body.
Wie in Fig. 5 und 6 dargestellt ist, können Bauteile 4 in Einbuchtungen des starren Körpers 2 vorliegen, oder an einer planen Außenfläche dessen angebracht sein. Bevorzugt sind die starren Körper 2 fest mit der Leiterplatine 1 verbunden. Beispielsweise kann dies dadurch erfolgen, dass Schrauben von der Rückseite der Leiterplatine 1 her in die starren Körper 2 geschraubt werden. Der starre Körper 2 erstreckt sich bevorzugt senkrecht von der Leiterplatine 1 weg, kann aber auch schräg zu dieser ausgerichtet sein, oder sogar einen gewundenen verlauf aufweisen. Der starre Körper 2 kann auch am Gehäuse befestigt insbesondere verschraubt sein. Der starre Körper 2 kann beispielsweise mit einer Schraube durch die Leiterplatine 1 hindurch am Gehäuse befestigt werden. As shown in FIGS. 5 and 6, components 4 can be present in indentations of the rigid body 2, or can be attached to a flat outer surface thereof. The rigid bodies 2 are preferably firmly connected to the printed circuit board 1. For example, this can be done by screwing screws from the back of the printed circuit board 1 into the rigid body 2. The rigid body 2 preferably extends perpendicularly away from the printed circuit board 1, but can also be oriented obliquely to it, or even have a tortuous course. The rigid body 2 can also be fastened, in particular screwed, to the housing. The rigid body 2 can, for example, be fastened to the housing by means of a screw through the printed circuit board 1.
Anstelle die flexiblen Kabel 3 vom Bauteil 4 zur Leiterplatine 1 zu führen, könnten diese auch direkt zu anderen Bauteilen 4 verlaufen, welche auf der Leiterplatine 1 befestigt sind. Die Leiterplatine 1 kann neben den erfindungsgemäß angebrachten Bauteilen 4 auch herkömmlich angebrachte Bauteile aufweisen, welche gemäß der in Fig. 4 veranschaulichten bekannten Art angebracht sind.  Instead of leading the flexible cables 3 from the component 4 to the printed circuit board 1, they could also run directly to other components 4 which are fastened on the printed circuit board 1. In addition to the components 4 attached according to the invention, the printed circuit board 1 can also have conventionally attached components which are attached in accordance with the known type illustrated in FIG. 4.
Zur erfindungsgemäßen Anbringung eignen sich insbesondere passive Bauelemente, wie insbesondere Widerstände und Kondensatoren, oder diskrete Halbleiter und Leistungshalbleiter, wie beispielsweise Dioden, Transistoren oder Thyristoren.  Passive components, such as, in particular, resistors and capacitors, or discrete semiconductors and power semiconductors, such as, for example, diodes, transistors or thyristors, are particularly suitable for the attachment according to the invention.
Selbst an komplexeren Bausteinen, wie integrierten Schaltkreisen, also Bausteinen mit vielen Anschlusspins mit geringem Abstand zueinander, kann die erfindungsgemäße Anbringung erfolgen.  The attachment according to the invention can even be carried out on more complex components, such as integrated circuits, that is, components with many connection pins with a small spacing from one another.
Bevorzugt werden Bauteile 4, welche sich manuell verlöten lassen, welche als einen ausreichenden Abstand zwischen ihren Anschlusspins 6 aufweisen, bevorzugt zumindest 1 mm.  Components 4 which can be soldered manually and which have a sufficient distance between their connection pins 6, preferably at least 1 mm, are preferred.
Bevorzugt werden Bauteile 4 mit Gehäuse in Flachbauweise mit einseitigen Anschlussstellen und Öffnung für Schraubenbefestigung. Solche Gehäuseformen sind beispielsweise bei Hochlast- Widerständen und Transistoren gebräuchlich.  Components 4 with a housing of flat construction with one-sided connection points and opening for screw fastening are preferred. Such housing shapes are common, for example, for high-load resistors and transistors.
Andere Gehäuseformen können mit entsprechenden Befestigungsmitteln angebracht werden. Beispielsweise können bedrahtete Wiederstände mit Klammern am starren Körper 2 gehalten werden. SMD-Widerstände oder andere Bauteile 4 können (bevorzugt direkt, also ohne Abstand bzw. ohne Pins) an einer kleinen Hilfsplatine verlötet werden, welche am starren Körpern 2 befestigt wird und welche die Anschlussstellen, beispielsweise Pins, für die flexiblen Kabel 3 aufweist. Auch so kann eine mechanische Anbringung an den starren Körper 2 und mechanische Entkopplung von der Leiterplatine 1 erfolgen.  Other housing shapes can be attached with appropriate fasteners. For example, wired resistors can be held on the rigid body 2 with clips. SMD resistors or other components 4 can (preferably directly, that is to say without a gap or without pins) be soldered to a small auxiliary circuit board which is attached to the rigid body 2 and which has the connection points, for example pins, for the flexible cables 3. A mechanical attachment to the rigid body 2 and mechanical decoupling from the printed circuit board 1 can also take place in this way.
Der starre Körper 2 kann auch durch eine Öffnung der Leiterplatine 1 ragen. Der starre Körper 2 kann sich an der anderen Seite der Leiterplatine 1 ebenfalls von dieser weg erstrecken, sodass beidseits der Leiterplatine 1 Bauteile 4 am starren Körper angebracht werden können. Unter der Leiterplatine 1 kann auch ein weiterer starrer Körper angeordnet sein, welcher sich parallel zu dieser erstreckt und eine Befestigungsplatte bzw. eine Montagefläche für die starren Körper 2 bildet, welche an der Oberseite der Leiterplatine 1 vorliegen. Mehrere starre Körper 2 können auch monolithisch, oder form- oder stoffschlüssig verbunden mit einer gemeinsamen Befestigungsplatte bzw. Montagefläche vorliegen, wobei die Leiterplatine 1 mit entsprechenden Öffnungen über die starren Körper 2 geführt werden kann, bevor die Bauteile 4 elektrisch mit dieser verbunden werden. The rigid body 2 can also protrude through an opening in the printed circuit board 1. The rigid body 2 can also extend away from the circuit board 1 on the other side, so that components 4 can be attached to the rigid body on both sides of the circuit board 1. A further rigid body can also be arranged under the printed circuit board 1, which is parallel to this extends and forms a mounting plate or a mounting surface for the rigid body 2, which are present on the top of the circuit board 1. Several rigid bodies 2 can also be monolithically, or positively or materially connected to a common fastening plate or mounting surface, the printed circuit board 1 with corresponding openings being able to be guided over the rigid body 2 before the components 4 are electrically connected to it.
Die Befestigungsplatte bzw. Montagefläche kann ein Gehäuseteil bzw. ein Teil des Gehäuses eines elektronischen Geräts sein, beispielsweise eine Bodenplatte, Deckplatte, Seitenwand, Zwischenebene oder Zwischenwand innerhalb des Gehäuses.  The fastening plate or mounting surface can be a housing part or part of the housing of an electronic device, for example a base plate, cover plate, side wall, intermediate level or intermediate wall within the housing.
Die Leiterplatine 1 kann auch schräg bis hin zu senkrecht zu jenem Gehäuseteil vorliegen, an welchen zumindest ein starrer Körper 2 befestigt ist. Die Leiterplatine 1 kann dabei am Gehäuse und/oder an zumindest einem starren Körper 2 befestigt sein. Beispielsweise kann ein starrer Körper 2 an einem Gehäuseteil befestigt sein und eine Leiterplatine normal zum Gehäuseteil angeordnet sein, wobei diese mit Abstand zum starren Körper, oder an diesem anliegend vorliegt und am starren Körper zumindest ein Bauteil 4 angeordnet ist, welches mit flexiblen Kabeln 3 an mit der Leiterplatine 1 elektrisch verbunden ist.  The printed circuit board 1 can also be present at an angle up to perpendicular to the housing part to which at least one rigid body 2 is attached. The circuit board 1 can be attached to the housing and / or to at least one rigid body 2. For example, a rigid body 2 can be fastened to a housing part and a printed circuit board can be arranged normal to the housing part, this being at a distance from or adjacent to the rigid body and at least one component 4 is arranged on the rigid body, which is connected to flexible cables 3 is electrically connected to the circuit board 1.

Claims

Ansprüche Expectations
1. Elektronisches Gerät umfassend zumindest eine Leiterplatine (1) und zumindest ein elektrisches Bauteil (4), dadurch gekennzeichnet, dass das Bauteil (4) an einem starren Körper (2) befestigt ist, wobei der starre Körper (2) starr mit der Leiterplatine (1) und/oder einem Gehäuseteil des elektronischen Geräts verbunden ist und das Bauteil (4) mit flexiblen Kabeln (3) mit der Leiterplatine (1) und/oder anderen elektrischen Bauteilen (4) leitend verbunden ist.  1. Electronic device comprising at least one printed circuit board (1) and at least one electrical component (4), characterized in that the component (4) is attached to a rigid body (2), the rigid body (2) being rigid with the printed circuit board (1) and / or a housing part of the electronic device and the component (4) with flexible cables (3) with the circuit board (1) and / or other electrical components (4) is conductively connected.
2. Elektronisches Gerät nach Anspruch 1, dadurch gekennzeichnet, dass die flexiblen Kabel (3) Litzenkabel sind, wobei jeweils ein flexibles Kabel (3) an einem Kontakt des Bauteils (4) angebracht ist. 2. Electronic device according to claim 1, characterized in that the flexible cables (3) are stranded cables, wherein in each case a flexible cable (3) is attached to a contact of the component (4).
3. Elektronisches Gerät nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der zumindest eine starre Körper (2) zumindest einen massiven Quader umfasst, der sich vom Gehäuse oder der Leiterplatine (1) weg erstreckt und mit diesem starr verbunden ist, wobei die Dicke D, als jene parallel zum Gehäuse oder der Leiterplatte (1) liegende Abmessung mit geringster Länge des Quaders zumindest 3 mm beträgt. 3. Electronic device according to claim 1 or 2, characterized in that the at least one rigid body (2) comprises at least one solid cuboid which extends away from the housing or the printed circuit board (1) and is rigidly connected to the latter, the thickness D, than that dimension parallel to the housing or the printed circuit board (1) with the smallest length of the cuboid is at least 3 mm.
4. Elektronisches Gerät nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass der starre Körper (2) an der Leiterplatine (1) angebracht ist, wobei das Bauteil (4) mit Abstand zur Leiterplatine (1) über dieser am starren Körper (4) vorliegt, wobei zwischen zumindest einem Anschluss des Bauteils (4) und der Leiterplatine (1) ein flexibles Kabel (3) verläuft und wobei die Länge der flexiblen Kabels (3) gleich groß oder bevorzugt größer ist, als die zu überbrückende Distanz, sodass das flexible Kabel (3) einen geraden, oder bevorzugt gewundenen bzw. kurvigen Verlauf aufweist. 4. Electronic device according to one of claims 1 to 3, characterized in that the rigid body (2) is attached to the printed circuit board (1), the component (4) at a distance from the printed circuit board (1) above the rigid body ( 4) is present, a flexible cable (3) running between at least one connection of the component (4) and the printed circuit board (1) and the length of the flexible cable (3) being equal to or preferably greater than the distance to be bridged, so that the flexible cable (3) has a straight, or preferably winding or curving course.
5. Elektronisches Gerät nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der starre Körper (2) aus Metall besteht und ein Gewicht von zumindest 3 Gramm aufweist. 5. Electronic device according to one of claims 1 to 4, characterized in that the rigid body (2) consists of metal and has a weight of at least 3 grams.
6. Elektronisches Gerät nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass das flexible Kabel (3) ein einadriges Litzenkabel mit einem Leiterdurchmesser von 0,1 bis 2,5mm ist und einen Mantel (9) aus isolierendem Kunststoff aufweist. 6. Electronic device according to one of claims 1 to 5, characterized in that the flexible cable (3) is a single-core stranded cable with a conductor diameter of 0.1 to 2.5 mm and has a jacket (9) made of insulating plastic.
7. Elektronisches Gerät nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass zumindest ein Bauteil (4), welches an einem starren Körper (2) angebracht ist, ein ohmscher Widerstand oder ein Transistor ist. 7. Electronic device according to one of claims 1 to 6, characterized in that at least one component (4) which is attached to a rigid body (2) is an ohmic resistor or a transistor.
8. Elektronisches Gerät nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass an einem starren Körper (2) mehrere Bauteile (4) angebracht sind, wobei jedes dieser Bauteile (4) mit flexiblen Kabeln (3) leitend mit der Leiterplatine (1) oder einem anderen Bauteil (4) verbunden ist. 8. Electronic device according to one of claims 1 to 7, characterized in that on a rigid body (2) a plurality of components (4) are attached, each of these components (4) with flexible cables (3) conductive with the circuit board (1 ) or another component (4) is connected.
9. Verfahren zur Herstellung einer Schaltung, dadurch gekennzeichnet, dass zumindest ein elektrisches Bauteil (4), welches herkömmlich mit seinen Anschlussstellen, insbesondere Anschlusspins (6), direkt an einer Leiterplatine (1) befestigt wird, mit Abstand zur Leiterplatine (1) an einem starren Körper (2) befestigt wird, welcher seinerseits an der Leiterplatine (1) und/oder einer unter der Leiterplatine (1) liegenden Montagefläche befestigt ist, wobei an zumindest einer Anschlussstelle des elektrischen Bauteils (4) das erste Ende eines flexiblen Kabels (3) leitend angeschlossen wird, dessen anderes Ende an der Anschlussstelle an der Leiterplatine (1) leitend angeschlossen wird. 9. A method for producing a circuit, characterized in that at least one electrical component (4), which is conventionally fastened directly to a printed circuit board (1) with its connection points, in particular connection pins (6), at a distance from the printed circuit board (1) a rigid body (2) is fastened, which in turn is fastened to the printed circuit board (1) and / or to a mounting surface lying under the printed circuit board (1), the first end of a flexible cable (4) being connected to at least one connection point of the electrical component (4). 3) is connected conductively, the other end of which is conductively connected to the connection point on the printed circuit board (1).
10. Verfahren nach Anspruch 9, dadurch gekennzeichnet, dass die Enden des flexiblen Kabels (3) an den Anschlusspins (6) und den Anschlussstellen an der Leiterplatine (1) verlötet werden. 10. The method according to claim 9, characterized in that the ends of the flexible cable (3) to the connection pins (6) and the connection points on the circuit board (1) are soldered.
PCT/AT2019/060318 2018-09-28 2019-09-27 Electronic device WO2020061606A1 (en)

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