WO2020046100A1 - Modular system with remote connectivity for controlling and sensing parameters - Google Patents
Modular system with remote connectivity for controlling and sensing parameters Download PDFInfo
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- WO2020046100A1 WO2020046100A1 PCT/MX2018/000086 MX2018000086W WO2020046100A1 WO 2020046100 A1 WO2020046100 A1 WO 2020046100A1 MX 2018000086 W MX2018000086 W MX 2018000086W WO 2020046100 A1 WO2020046100 A1 WO 2020046100A1
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- module
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- sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B15/00—Systems controlled by a computer
- G05B15/02—Systems controlled by a computer electric
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
Definitions
- the present invention relates to a modular type system that has a remote connectivity for the control and sensing of parameters that occur externally around it, in such a way that it allows a wide integration of peripherals for information capture and sensing, of such that there is no need to make hardware modifications for such integration with the system of the present application.
- a Modular System with Remote Connectivity which has the advantage that it has the ability to integrate peripherals for parameter control and sensing.
- Interchangeable modules are provided through which the adaptation of the Modular System can be made depending on the technical needs of capture, analysis and communication of the signals involved.
- Figure 1 is the block diagram in accordance with the Modular System with Remote Connectivity for the Control and Sensing of Parameters of the present invention.
- FIG. 1 is the schematic diagram of the main card of the
- FIG. 3 is the schematic diagram of the connections to the
- Figure 4 is the schematic diagram of a LoadSwitch controlled by the Microcontroller (5).
- FIG. 5 is the schematic diagram of the Battery (14) and the Panel
- FIG. 1 is the schematic diagram of the Programming Port (11).
- Figure 7 is the schematic diagram of the connections to the Sensor Adaptation Module (4).
- Figure 8 is the schematic diagram of the Battery Charger (13).
- Figure 9 is the schematic diagram of the Voltage Regulator (9).
- Figure 10 is the schematic diagram of the Battery Meter (10).
- Figure 11 is the schematic diagram of the Sensor Adaptation Module (4).
- Figure 12 is the schematic diagram of the Connectivity Module
- the Modular System with Remote Connectivity for Control and Sensing of Parameters described below must be composed of four modules:
- MCU Processing Unit Module
- each of the four modules allows to carry out each of the functions, as well as to implement all the connectivity parameters necessary for the system to function correctly in a modular way.
- Figure 3 shows the connections to the Connectivity Module (2) which contains a pair of headers (A and A ').
- Figure 4 shows a LoadSwitch controlled by the Microcontroller (5), to switch the Power Source Module (3) to the Connectivity Module (2) and the Sensor Adaptation Module (4), this allows control in consumption of energy to make the Modular System more efficient.
- FIG. 5 shows the Solar / Micro USB Panel (15) and the Battery (14).
- Figure 6 shows the Programming Port (11) of the System
- Figure 7 shows the connections to the Sensor Adaptation Module (4), where there are a pair of headers (B and B ') that map all the signals of the physical connections of the Sensor Adaptation Module (4), in the same way there are the physical connections (C, C ⁇ C ", C” ⁇ C ,, H and C "'") of the different sensors used, where up to six sensors can be connected in a header (B and B '), the connection type can be of Plug & Play and Poka-Yoke type to avoid any type of error in the coupling.
- the power to these connections is controlled by the LoadSwitch to avoid power consumption when the sensors are not being used.
- FIG 8 shows the Battery Charger (13) which is composed of a regulated 5V source and a 6V solar panel, likewise has a pair of
- FIG 10 shows the Battery Meter (10) which identifies the different parameters of the Battery (14), this information is collected by the Microcontroller (5) to send the status of said Battery (14) through the Connectivity Module (2) operatively connected.
- Figure 11 shows the Sensor Adaptation Module (4) where the OpAmp operational amplifier (17), the ID_SENSOR Identifier (6), the Sensor Connection (16), the RS485 Driver (18) and the UART Driver are located l 2 C (19).
- Figure 12 shows the Connectivity Module (2) where the Data Transmission Element (8), Identifier ID_SHIELD (7) is located. Through the headers (D and D ") of this module, the operational connection of the Connectivity Module (2) to the Processing Unit Module (MCU) (1) is established.
- MCU Processing Unit Module
- the Processing Unit Module (MCU) (1) is integrated into a main card ( Figure 2), which includes a Mcrocontroller (5) and media to interact with the other modules of which the Modular System consists.
- the Mlcrocontroller (5) parallel processes a Sensor_ID Identifier (6) of sensors operatively linked from the Sensor Adaptation Module (4) and an ID_SHIELD ID (7) from the Connectivity Module (2) that is operatively linked for later establish the necessary parameters to generate a two-way communication and transmit the information of the sensors connected to the system through the Data Transmission Element (8) found in the Connectivity Module (2), where the Identifier ID_SHIELD (7) allows the Mlcrocontroller (5) to identify which Connectivity Module (2) is operatively connected to the Module
- MCU Processing Unit
- the Mlcrocontroller (5) is configured in such a way that it can include any combination of memory elements, for example of the Flash, RAM or ROM type, allowing its processing speed to be efficient enough to be able to transmit data in real time.
- the main board includes a high efficiency Voltage Regulator (9) that allows to keep the power stable, regardless of the voltage variations that may occur in the Power Source Module (3), it also consists of a Battery Meter ( 10) which mainly has the function of communicating with the Mlcrocontroller (5) to record the status of the Power Source Module (3).
- the main card contains a Port of
- the Connectivity Module (2) is located on a card that includes connection and communication means to connect operatively to the main card of the Processing Unit Module (MCU) (1), said Connectivity Module (2) integrates an Identifier ID_SHIELD (7) referred to the Data Transmission Element (8), which allows the Microcontroller (5) to transmit the information with different communication technologies without the need to make changes in the sensor software.
- the Data Transmission Element Identifier ID_SHIELD
- the Power Source Module (3) is integrated in the main card, which includes a Battery Charger (13) and connection means to interact with the other systems of this Module, where the Battery Charger (13 ), which is operatively linked to said main card, allows recharge the Battery (14) by means of a power supply, for example the Panel
- the Sensor Adaptation Module (4) is located on a card that includes connection and communication means to connect to the main card of the
- this Sensor Adaptation Module (4) is operatively linked to the Microcontroller (5) through one of its communication ports.
- the Sensor Adaptation Module (4) integrates an ID_SENSOR Identifier (6) with respect to the sensor operatively connected through the Sensor Connection (16), which allows the Microcontroller (5) of the Module
- MCU Processing Unit
- the sensors that are operatively linked to the Sensor Connection (16) can be analog or digital.
- the Sensor Adaptation Module (4) integrates an OpAmp operational amplifier (17) that allows to keep the data temporarily so that they can be processed by the Microcontroller (5), this process is established with analog type sensors .
- a communication medium is integrated for sensors that require the RS485 protocol through the RS485 Driver (18), which interprets the protocol of the respective sensor that is connected and converts it to the UART protocol who in turn is able to convert it to a protocol l 2 C through the Driver UART l 2 C (19) in case it is necessary to complete the communication with the Microcontroller (5).
- the Sensor Adaptation Module (4) can be omitted to operatively connect the Sensor Connection (16) with the Processing Unit Module (MCU) (1), as long as the connected sensor is directly supported on the Microcontroller (5).
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Abstract
Description
SISTEMA MODULAR CON CONECTIVIDAD REMOTA PARA EL CONTROL MODULAR SYSTEM WITH REMOTE CONNECTIVITY FOR CONTROL
Y SENSADO DE PARÁMETROS AND SENSE OF PARAMETERS
CAMPO DE LA INVENCIÓN FIELD OF THE INVENTION
La presente invención se refiere a un sistema de tipo modular que tiene una conectividad remota para el control y sensado de parámetros que ocurren de manera extema a su alrededor, de tal manera que permite una integración amplia de periféricos de captura de información y sensado, de tal manera que no existe la necesidad de hacer modificaciones de hardware para dicha integración con el sistema de la presente solicitud. The present invention relates to a modular type system that has a remote connectivity for the control and sensing of parameters that occur externally around it, in such a way that it allows a wide integration of peripherals for information capture and sensing, of such that there is no need to make hardware modifications for such integration with the system of the present application.
ANTECEDENTES DE LA INVENCIÓN BACKGROUND OF THE INVENTION
Se conoce en el campo técnico de los sistemas modulares, que la integración de sensores resulta complicado debido a la incompatibilidad en hardware y/o software que existe, de tal manera que en la mayoría de las ocasiones este tipo de sistemas están limitados a los periféricos que fueron diseñados exclusivamente para su integración. It is known in the technical field of modular systems, that the integration of sensors is complicated due to the incompatibility in hardware and / or software that exists, so that in most cases this type of systems are limited to peripherals They were designed exclusively for integration.
Es por ello que existe la necesidad de un sistema modular que sea capaz de integrar una amplia variedad de periféricos sin que necesariamente éstos hayan sido diseñados para su uso con el sistema, es decir, integrar cualquier tipo de periféricos para que trabajen con el sistema sin la necesidad de que sean alterados en hardware y/o software. BREVE DESCRIPCIÓN DE LA INVENCIÓN That is why there is a need for a modular system that is capable of integrating a wide variety of peripherals without necessarily having been designed for use with the system, that is, integrating any type of peripherals to work with the system without the need for them to be altered in hardware and / or software. BRIEF DESCRIPTION OF THE INVENTION
De conformidad con un primer aspecto de la presente invención, se proporciona un Sistema Modular con Conectividad Remota el cual tiene la ventaja de que tiene la capacidad de integrar periféricos para el control y sensado de parámetros. In accordance with a first aspect of the present invention, a Modular System with Remote Connectivity is provided which has the advantage that it has the ability to integrate peripherals for parameter control and sensing.
De conformidad con un segundo aspecto de la presente invención, se proporcionan módulos Intercambiables a través de los cuales se puede hacer la adecuación del Sistema Modular dependiendo de las necesidades técnicas de captura, análisis y comunicación de las señales involucradas. In accordance with a second aspect of the present invention, Interchangeable modules are provided through which the adaptation of the Modular System can be made depending on the technical needs of capture, analysis and communication of the signals involved.
BREVE DESCRIPCIÓN DE LAS FIGURAS BRIEF DESCRIPTION OF THE FIGURES
La Figura 1 , es el diagrama a bloques de conformidad con el Sistema Modular con Conectividad Remota para el Control y Sensado de Parámetros de la presente invención. Figure 1 is the block diagram in accordance with the Modular System with Remote Connectivity for the Control and Sensing of Parameters of the present invention.
La Figura 2, es el diagrama esquemático de la tarjeta principal del Figure 2 is the schematic diagram of the main card of the
Sistema Modular de la presente invención. Modular System of the present invention.
La Figura 3, es el diagrama esquemático de las conexiones hacia el Figure 3 is the schematic diagram of the connections to the
Módulo de Conectividad (2). Connectivity Module (2).
La Figura 4, es el diagrama esquemático de un LoadSwitch controlado por el Microcontrolador (5). Figure 4 is the schematic diagram of a LoadSwitch controlled by the Microcontroller (5).
La Figura 5, es el diagrama esquemático de la Batería (14) y el Panel Figure 5 is the schematic diagram of the Battery (14) and the Panel
Solar/Micro USB (15). Solar / Micro USB (15).
La Figura 6, es el diagrama esquemático del Puerto de Programación (11). Figure 6 is the schematic diagram of the Programming Port (11).
La Figura 7, es el diagrama esquemático de las conexiones hacia el Módulo de Adecuación de Sensores (4). La Figura 8, es el diagrama esquemático del Cargador de Batería (13). La Figura 9, es el diagrama esquemático del Regulador de Voltaje (9). La Figura 10, es el diagrama esquemático del Medidor de Batería (10). La Figura 11 , es el diagrama esquemático del Módulo de Adecuación de Sensores (4). Figure 7 is the schematic diagram of the connections to the Sensor Adaptation Module (4). Figure 8 is the schematic diagram of the Battery Charger (13). Figure 9 is the schematic diagram of the Voltage Regulator (9). Figure 10 is the schematic diagram of the Battery Meter (10). Figure 11 is the schematic diagram of the Sensor Adaptation Module (4).
La Figura 12, es el diagrama esquemático del Módulo de Conectividad Figure 12 is the schematic diagram of the Connectivity Module
(2). (two).
DESCRIPCIÓN DETALLADA DE LA INVENCIÓN DETAILED DESCRIPTION OF THE INVENTION
De conformidad con las figuras de la presente solicitud, se tiene que el Sistema Modular con Conectividad Remota para Control y Sensado de Parámetros que a continuación se describe, se compone de cuatro módulos: In accordance with the figures of the present application, the Modular System with Remote Connectivity for Control and Sensing of Parameters described below must be composed of four modules:
Módulo de Unidad de Procesamiento (MCU) (1), Processing Unit Module (MCU) (1),
Módulo de Conectividad (2), Connectivity Module (2),
Módulo de Fuente de Energía (3), y Power Source Module (3), and
- Módulo de Adecuación de Sensores (4). - Sensor Adaptation Module (4).
La interacción de cada uno de los cuatro módulos permite llevar a cabo cada una de las funciones, asi como implementar todos los parámetros de conectividad necesarios para que el sistema funcione correctamente de forma modular. The interaction of each of the four modules allows to carry out each of the functions, as well as to implement all the connectivity parameters necessary for the system to function correctly in a modular way.
La Figura 3 muestra las conexiones hacia el Módulo de Conectividad (2) el cual contiene un par de headers (A y A'). Figure 3 shows the connections to the Connectivity Module (2) which contains a pair of headers (A and A ').
La Figura 4 muestra un LoadSwitch controlado por el Microcontrolador (5), para conmutar el Módulo de Fuente de Energía (3) hacia el Módulo de Conectividad (2) y el Módulo de Adecuación de Sensores (4), esto permite controlar en consumo de energía para que sea más eficiente el Sistema Modular. Figure 4 shows a LoadSwitch controlled by the Microcontroller (5), to switch the Power Source Module (3) to the Connectivity Module (2) and the Sensor Adaptation Module (4), this allows control in consumption of energy to make the Modular System more efficient.
La Figura 5 muestra el Panel Solar/Micro USB (15) y la Batería (14). La Figura 6 muestra el Puerto de Programación (11) del SistemaFigure 5 shows the Solar / Micro USB Panel (15) and the Battery (14). Figure 6 shows the Programming Port (11) of the System
Modular. Modular.
La Figura 7 muestra las conexiones hacia el Módulo de Adecuación de Sensores (4), en donde se encuentran un par de headers (B y B') que mapean todas las señales de las conexiones físicas del Módulo de Adecuación de Sensores (4), de igual manera se encuentran las conexiones físicas (C, C\ C", C"\ C,,H y C"'") de los diferentes sensores que se utilizan, en donde se pueden conectar hasta seis sensores en un header (B y B'), el tipo de conexión puede ser de tipo Plug&Play y Poka-Yoke para evitar cualquier tipo de error en el acoplamiento. La alimentación a estas conexiones es controlada por el LoadSwitch para evitar el consumo de energía cuando no se están utilizando los sensores. Figure 7 shows the connections to the Sensor Adaptation Module (4), where there are a pair of headers (B and B ') that map all the signals of the physical connections of the Sensor Adaptation Module (4), in the same way there are the physical connections (C, C \ C ", C" \ C ,, H and C "'") of the different sensors used, where up to six sensors can be connected in a header (B and B '), the connection type can be of Plug & Play and Poka-Yoke type to avoid any type of error in the coupling. The power to these connections is controlled by the LoadSwitch to avoid power consumption when the sensors are not being used.
La Figura 8 muestra el Cargador de Batería (13) el cual se compone de una fuente regulada de 5V y un panel solar de 6V, de igual manera tiene un par de Figure 8 shows the Battery Charger (13) which is composed of a regulated 5V source and a 6V solar panel, likewise has a pair of
Led's que sirven como indicadores visuales para conocer si esta conectado operativamente alguna fuente de alimentación y si la Batería (14) se encuentra en un proceso de recarga. Led's that serve as visual indicators to know if any power supply is operatively connected and if the Battery (14) is in a recharging process.
La Figura 10 muestra el Medidor de Batería (10) el cual identifica los diferentes parámetros de la Batería (14), ésta información es recabada por el Microcontrolador (5) para enviar el estado de dicha Batería (14) a través del Módulo de Conectividad (2) conectado operativamente. Figure 10 shows the Battery Meter (10) which identifies the different parameters of the Battery (14), this information is collected by the Microcontroller (5) to send the status of said Battery (14) through the Connectivity Module (2) operatively connected.
La Figura 11 muestra el Módulo de Adecuación de Sensores (4) en donde se encuentra el amplificador operacional OpAmp (17), el Identificador ID_SENSOR (6), la Conexión a Sensores (16), el Driver RS485 (18) y el Driver UART l2C (19). Figure 11 shows the Sensor Adaptation Module (4) where the OpAmp operational amplifier (17), the ID_SENSOR Identifier (6), the Sensor Connection (16), the RS485 Driver (18) and the UART Driver are located l 2 C (19).
La Figura 12 muestra el Módulo de Conectividad (2) en donde se encuentra el Elemento de Transmisión de Datos (8), el Identificador ID_SHIELD (7). Mediante los headers (D y D") de éste módulo se establece la conexión operativa del Módulo de Conectividad (2) al Módulo de Unidad de Procesamiento (MCU) (1). Figure 12 shows the Connectivity Module (2) where the Data Transmission Element (8), Identifier ID_SHIELD (7) is located. Through the headers (D and D ") of this module, the operational connection of the Connectivity Module (2) to the Processing Unit Module (MCU) (1) is established.
El Módulo de Unidad de Procesamiento (MCU) (1) está integrado en una tarjeta principal (Figura 2), la cual Incluye un Mlcrocontrolador (5) y medios de comunicación para interactuar con los otros módulos de los que consta el Sistema Modular. Inlclalmente el Mlcrocontrolador (5) procesa paralelamente un Identificador ID_SENSOR (6) de sensores unidos operativamente provenientes del Módulo de Adecuación de Sensores (4) y un Identificador ID_SHIELD (7) proveniente del Módulo de Conectividad (2) que se encuentra unido operativamente para posteriormente establecer los parámetros necesarios para generar una comunicación bidlrecdonal y transmitir la Información de los sensores conectados al sistema por medio del Elemento de Transmisión de Datos (8) que se encuentra en el Módulo de Conectividad (2), en donde el Identificador ID_SHIELD (7) le permite al Mlcrocontrolador (5) identificar qué Módulo de Conectividad (2) se conecto operativamente al Módulo deThe Processing Unit Module (MCU) (1) is integrated into a main card (Figure 2), which includes a Mcrocontroller (5) and media to interact with the other modules of which the Modular System consists. In addition, the Mlcrocontroller (5) parallel processes a Sensor_ID Identifier (6) of sensors operatively linked from the Sensor Adaptation Module (4) and an ID_SHIELD ID (7) from the Connectivity Module (2) that is operatively linked for later establish the necessary parameters to generate a two-way communication and transmit the information of the sensors connected to the system through the Data Transmission Element (8) found in the Connectivity Module (2), where the Identifier ID_SHIELD (7) allows the Mlcrocontroller (5) to identify which Connectivity Module (2) is operatively connected to the Module
Unidad de Procesamiento (MCU) (1). Processing Unit (MCU) (1).
El Mlcrocontrolador (5) se configura de tal manera que pueda Incluir cualquier combinación de elementos de memoria, por ejemplo de tipo Flash, RAM o ROM permitiendo que su velocidad de procesamiento sea lo suficientemente eficiente para poder realizar la transmisión de datos en tiempo real. The Mlcrocontroller (5) is configured in such a way that it can include any combination of memory elements, for example of the Flash, RAM or ROM type, allowing its processing speed to be efficient enough to be able to transmit data in real time.
La tarjeta principal Incluye un Regulador de Voltaje (9) de alta eficiencia que permite mantener la alimentación estable, Independientemente de las variaciones de voltaje que puedan presentarse en el Módulo de Fuente de Energía (3), así mismo consta de un Medidor de Batería (10) el cual principalmente tiene la función de comunicarse con el Mlcrocontrolador (5) para registrar el estado del Módulo de Fuente de Energía (3). Complementariamente la tarjeta principal contiene un Puerto deThe main board includes a high efficiency Voltage Regulator (9) that allows to keep the power stable, regardless of the voltage variations that may occur in the Power Source Module (3), it also consists of a Battery Meter ( 10) which mainly has the function of communicating with the Mlcrocontroller (5) to record the status of the Power Source Module (3). In addition, the main card contains a Port of
Programación (11) conectado operativamente con el Microcontrolador (5), de tal manera que a través de éste puerto se asignan y definen cada una de las operaciones del Microcontrolador (5). Programming (11) operatively connected to the Microcontroller (5), so that through this port each of the operations of the Microcontroller (5) are assigned and defined.
Módulo de Conectividad Connectivity Module
El Módulo de Conectividad (2) se encuentra en una tarjeta que incluye medios de unión y comunicación para conectarse operativamente a la tarjeta principal del Módulo de Unidad de Procesamiento (MCU) (1), dicho Módulo de Conectividad (2) integra un Identificador ID_SHIELD (7) referido al Elemento de Transmisión de Datos (8), el cual permite al Microcontrolador (5) transmitir la información con diferentes tecnologías de comunicación sin necesidad de realizar modificaciones en el software de los sensores. De manera complementaria, el Elemento de Transmisión de Datos The Connectivity Module (2) is located on a card that includes connection and communication means to connect operatively to the main card of the Processing Unit Module (MCU) (1), said Connectivity Module (2) integrates an Identifier ID_SHIELD (7) referred to the Data Transmission Element (8), which allows the Microcontroller (5) to transmit the information with different communication technologies without the need to make changes in the sensor software. In addition, the Data Transmission Element
(8) lleva a cabo una comunicación serial tipo UART ( Universal Asynchronous Racaiver-Transmitter en ingles) con comandos AT (ATention command set en ingles) para lograr la inicialización, configuración y transmisión de datos con el Microcontrolador (5), así también como para recuperar información de dicho Microcontrolador (5) y transmitirla a cualquier dispositivo remoto mediante la Antena(8) carries out a serial communication type UART (Universal Asynchronous Racaiver-Transmitter in English) with AT commands (ATention command set in English) to achieve initialization, configuration and transmission of data with the Microcontroller (5), as well as to retrieve information from said Microcontroller (5) and transmit it to any remote device through the Antenna
(12) de comunicación remota que se encuentra unida operativamente al Elemento de Transmisión de Datos (8). (12) of remote communication that is operatively linked to the Data Transmission Element (8).
Módulo de Fuente de Energía Power Source Module
El Módulo de Fuente de Energía (3) se encuentra Integrado en la tarjeta principal, en donde se incluye un Cargador de Bateria (13) y medios de conexión para interactuar con los otros sistemas de éste Módulo, en donde el Cargador de Batería (13), que se encuentra unido operativamente con dicha tarjeta principal, permite recargar la Batería (14) por medio de una fuente de alimentación, por ejemplo el PanelThe Power Source Module (3) is integrated in the main card, which includes a Battery Charger (13) and connection means to interact with the other systems of this Module, where the Battery Charger (13 ), which is operatively linked to said main card, allows recharge the Battery (14) by means of a power supply, for example the Panel
Solar/Micro USB (15) que se encuentra operativamente unido. Solar / Micro USB (15) that is operatively linked.
Módulo de Adecuación de Sensores Sensor Adaptation Module
El Módulo de Adecuación de Sensores (4) se encuentra en una tarjeta que incluye medios de unión y comunicación para conectarse a la tarjeta principal del The Sensor Adaptation Module (4) is located on a card that includes connection and communication means to connect to the main card of the
Módulo de Unidad de Procesamiento (MCU) (1) y a la Conexión de Sensores (16), éste Módulo de Adecuación de Sensores (4) está unido operativamente con el Microcontrolador (5) a través de alguno de sus puertos de comunicación. Processing Unit Module (MCU) (1) and the Sensor Connection (16), this Sensor Adaptation Module (4) is operatively linked to the Microcontroller (5) through one of its communication ports.
De igual manera, el Módulo de Adecuación de Sensores (4) se integra un Identlficador ID_SENSOR (6) respecto al sensor unido operativamente a través de la Conexión a Sensores (16), lo cual le permite al Microcontrolador (5) del Módulo de Similarly, the Sensor Adaptation Module (4) integrates an ID_SENSOR Identifier (6) with respect to the sensor operatively connected through the Sensor Connection (16), which allows the Microcontroller (5) of the Module
Unidad de Procesamiento (MCU) (1) funcionar con sensores de diferentes protocolos de comunicación sin la necesidad de modificar el software de los sensores. Los sensores que están unidos operativamente con la Conexión a Sensores (16) pueden ser analógicos o digitales. Processing Unit (MCU) (1) operate with sensors of different communication protocols without the need to modify the sensor software. The sensors that are operatively linked to the Sensor Connection (16) can be analog or digital.
Por otra parte, el Módulo de Adecuación de Sensores (4) integra un amplificador operacional OpAmp (17) que permite mantener los datos de manera temporal para que puedan ser procesador por el Microcontrolador (5), éste proceso se establece con sensores de tipo analógicos. On the other hand, the Sensor Adaptation Module (4) integrates an OpAmp operational amplifier (17) that allows to keep the data temporarily so that they can be processed by the Microcontroller (5), this process is established with analog type sensors .
En el Módulo de Adecuación de Sensores (4) se integra un medio de comunicación para sensores que requieran el protocolo RS485 a través del Driver RS485 (18), el cual interpreta el protocolo del respectivo sensor que se encuentra conectado y lo convierte al protocolo UART quien a su vez es capaz de convertirlo a un protocolo l2C a través del Driver UART l2C (19) en caso de que sea necesario para completar la comunicación con el Microcontrolador (5). De manera opcional, el Módulo de Adecuación de Sensores (4) puede ser omitido para unir operativamente la Conexión a Sensores (16) con el Módulo de Unidad de Procesamiento (MCU) (1 ), siempre y cuando el sensor conectado sea soportado directamente en el Microcontrolador (5). In the Sensor Adaptation Module (4) a communication medium is integrated for sensors that require the RS485 protocol through the RS485 Driver (18), which interprets the protocol of the respective sensor that is connected and converts it to the UART protocol who in turn is able to convert it to a protocol l 2 C through the Driver UART l 2 C (19) in case it is necessary to complete the communication with the Microcontroller (5). Optionally, the Sensor Adaptation Module (4) can be omitted to operatively connect the Sensor Connection (16) with the Processing Unit Module (MCU) (1), as long as the connected sensor is directly supported on the Microcontroller (5).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MX2018010493A MX393981B (en) | 2018-08-30 | 2018-08-30 | MODULAR SYSTEM WITH REMOTE CONNECTIVITY FOR PARAMETER CONTROL AND SENSING. |
| MXMX/A/2018/010493 | 2018-08-30 |
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| Publication Number | Publication Date |
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| WO2020046100A1 true WO2020046100A1 (en) | 2020-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/MX2018/000086 WO2020046100A1 (en) | 2018-08-30 | 2018-09-12 | Modular system with remote connectivity for controlling and sensing parameters |
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| WO (1) | WO2020046100A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6531965B1 (en) * | 2000-04-11 | 2003-03-11 | Northrop Grumman Corporation | Modular open system architecture for unattended ground sensors |
| US20070063833A1 (en) * | 2005-09-20 | 2007-03-22 | Lawrence Kates | Programmed wireless sensor system |
| US20080111884A1 (en) * | 2006-11-14 | 2008-05-15 | Harris Corporation | Multipurpose unattended ground sensor node with relay capability |
| US20080136606A1 (en) * | 2006-12-06 | 2008-06-12 | Electronics And Telecommunications Research Institute | Separable device for controlling node and sensor network node |
| ES2326020A1 (en) * | 2008-03-27 | 2009-09-28 | Libelium Comunicaciones Distribuidas, S.L. | Stand-alone detection, measurement, geopositioning, response and communication system |
-
2018
- 2018-08-30 MX MX2018010493A patent/MX393981B/en unknown
- 2018-09-12 WO PCT/MX2018/000086 patent/WO2020046100A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6531965B1 (en) * | 2000-04-11 | 2003-03-11 | Northrop Grumman Corporation | Modular open system architecture for unattended ground sensors |
| US20070063833A1 (en) * | 2005-09-20 | 2007-03-22 | Lawrence Kates | Programmed wireless sensor system |
| US20080111884A1 (en) * | 2006-11-14 | 2008-05-15 | Harris Corporation | Multipurpose unattended ground sensor node with relay capability |
| US20080136606A1 (en) * | 2006-12-06 | 2008-06-12 | Electronics And Telecommunications Research Institute | Separable device for controlling node and sensor network node |
| ES2326020A1 (en) * | 2008-03-27 | 2009-09-28 | Libelium Comunicaciones Distribuidas, S.L. | Stand-alone detection, measurement, geopositioning, response and communication system |
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| MX393981B (en) | 2025-03-24 |
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