WO2020042845A1

WO2020042845A1 - Mobile terminal

Info

Publication number: WO2020042845A1
Application number: PCT/CN2019/098058
Authority: WO
Inventors: 喻俊峰; 田昂; 王涛; 汪晓永
Original assignee: 华为技术有限公司
Priority date: 2018-08-29
Filing date: 2019-07-27
Publication date: 2020-03-05
Also published as: CN209517201U

Abstract

The present application provides a mobile terminal; said mobile terminal comprises a middle frame, and a laminated transparent cover panel and a display module; when specifically arranging the transparent cover panel and the display module, the laminated transparent cover panel and the display module are located in the middle frame and the edge of the transparent cover panel protrudes outside the display module, and the convex edge of the transparent cover panel is lapped with the first side wall of the middle frame; at such time, there is an accommodating gap between the first side wall and the display module, and a light sensing component can be placed in the accommodating gap; from the preceding description, it can be seen that the light sensing component is arranged by means of using a gap between the first side wall and the display module; the light sensing component is located in a non-display region of the display module; since the light sensing component is located in the non-display region of the display module and light is transmitted directly by means of the transparent cover panel, the arrangement of the light sensing component in a narrow-frame mobile terminal is facilitated.

Description

Mobile terminal

Technical field

The present application relates to the technical field of mobile terminals, and in particular, to a mobile terminal.

Background technique

At present, mobile phones have ambient light sensors (ALS, Ambient Light Sensing). The role of ALS is to automatically adjust the brightness of the backlight. Increasing the screen brightness during the day makes the screen clearer; reducing the screen brightness at night makes the screen less glare. Can also be used for automatic white balance when taking pictures. It can also be used with the distance sensor below to detect if the phone is in your pocket to prevent accidental touch.

The technical solution of the first prior art is that the ambient light sensor chip is directly combined with the TP, and the sensor small board, the small board and the main board connector are elevated and connected to the main board. At present, the black edges (or the depth of the black edges of the notch screen) on mobile phones in the market are all above 6mm, which is enough to accommodate the width of the ambient light sensor chip. As the black edges on the upper and lower sides of the mobile phone screen become narrower and narrower, the above-mentioned method of attaching the ambient light sensor chip to the touch screen (TP) or the slit will no longer be applicable. There is also a method of using a narrow slit, but the slit has a great influence on the viewing angle of the ambient light sensor chip.

Summary of the Invention

The present application provides a mobile terminal for facilitating the setting of a light sensing device in a narrow frame structure.

According to a first aspect, a mobile terminal is provided. The mobile terminal includes a middle frame, and a laminated transparent cover and a display module. When a transparent cover and a display module are specifically provided, the laminated transparent cover and the The display module is located in the middle frame, and the edge of the transparent cover plate is protruded outside the display module, and the convex edge of the transparent cover plate overlaps the first side wall of the middle frame. At this time, the first An accommodation gap is provided between a side wall and the display module, and a light sensing device can be placed in the accommodation gap. It can be seen from the above description that the light sensing device is set by using a gap between the first side wall and the display module; The light sensing device is located in the non-display area of the display module. Since the light sensing device is located in the non-display area of the display module and transmits light directly through the transparent cover, it is convenient for the light sensing device to move in a narrow frame. Settings in the terminal.

When a light sensing device is specifically set, the display module includes a first layer structure, and the first layer structure is spaced from the transparent cover plate, so that a gap exists between the first layer structure and the transparent cover plate, The light sensing device is located in a gap between the transparent cover plate and the first layer structure, thereby further bringing the light sensing device closer to a display area of the display module, thereby making the entire structure more compact.

In addition to the above-mentioned first layer structure, the display module further includes a second layer structure and a third layer structure laminated with the first layer structure, wherein the second layer structure and the third layer structure It is located between the transparent cover plate and the first layer structure, and the first layer structure has an edge protruding outward from the second layer structure. The edge of the first layer structure protruding to the second layer structure forms a gap with the transparent cover.

When the first layer structure is specifically set, the first layer structure may be a structure of different layers in the display module, such as an array substrate, a color film substrate, a backlight module, and other structures. In a specific embodiment, the first layer structure is an array substrate.

The second layer structure and the third layer structure are a color filter substrate and a first polarizer, respectively, and the first polarizer is adhesively connected to the transparent cover plate through an optical glue.

When an array substrate is used in the first layer structure, the array substrate and the light sensing device are connected to the main board of the mobile terminal through a flexible circuit board. This facilitates the wiring of the circuit connected between the light sensing device and the motherboard.

When a light-sensing device is specifically set, along the stacking direction of the transparent cover and the display module, the thickness of the light-sensing device is smaller than the vertical distance between the first layer structure and the transparent cover. Thereby it is convenient to set the light sensing device.

Different structures can be adopted for the light sensing device, and different methods can be adopted when the light sensing device is fixed, for example, the light sensing device includes a light sensing chip and a packaging layer; and the light sensing chip is encapsulated in the packaging layer through the packaging layer. On the transparent cover or the first layer structure. At this time, the light-sensitive chip is directly packaged on the transparent cover plate or the first layer structure. Alternatively, the light sensing device may also include a light sensing chip and a packaging layer for packaging the light sensing chip, wherein the packaging layer of the light sensing device is fixedly connected to the transparent cover plate or the first layer structure. . During the specific connection, the encapsulation layer is soldered to the first layer structure.

BRIEF DESCRIPTION OF THE DRAWINGS

1 is a schematic structural diagram of a mobile terminal in the prior art;

2 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application;

3 is a structural block diagram of a display module according to an embodiment of the present application;

FIG. 4 is an assembly schematic diagram of a light sensing device according to an embodiment of the present application; FIG.

FIG. 5 is an assembly schematic diagram of a light sensing device according to an embodiment of the present application.

detailed description

In order to facilitate understanding of the mobile terminal provided in the embodiment of the present application, the mobile terminal provided in the embodiment of the present application will be described first. In the embodiment of the present application, the mobile terminal may be a common mobile terminal such as a mobile phone or a tablet computer, and the mobile terminal The terminal has a light sensing device to sense external ambient light. In the prior art, due to the narrow bezel design of the mobile terminal, the light-sensing device is disposed in the bottom bezel of the mobile terminal, and an opening needs to be provided on the cover of the mobile terminal so that the ambient light sensed by the light-sensing device is external . In the structure shown in FIG. 1, the light sensing device 3 is disposed in the middle frame 4 and is arranged side by side with the display module. At the same time, a narrow slot 2 is provided on the front cover 1 of the mobile terminal to transmit light. When this structure is adopted, since the slit 2 is easily clogged, the photosensitive effect of the light sensing device 3 is relatively poor. In order to solve this problem, an embodiment of the present application provides a mobile terminal to improve the light sensing effect of the light sensing device 3.

Referring to FIG. 2, FIG. 2 shows a specific structure of a mobile terminal provided by an embodiment of the present application. The mobile terminal includes a middle frame 50 in which the display module 10 and a transparent cover plate 20 are stacked. The transparent cover plate 20 is used to close the display module 10, and may be a glass cover plate or a plastic cover plate, for example, a glass cover plate is used. When the transparent cover plate 20 is fixed, the edges of the transparent cover plate 20 protrude outward from the display module 10 and overlap with the middle frame 50. When overlapping, the middle frame 50 is provided with a cooperation with the transparent cover plate 20. A ring-shaped boss, the four edges of the transparent cover plate 20 are overlapped on the boss. In addition, there is an accommodating gap between the side wall of the middle frame 50 and the display module 10, and the accommodating gap is a gap for accommodating the light sensing device 30. For the convenience of description, the side wall is defined as a first side wall, and the first side wall is any one of the side walls on the middle frame 50, and may be either a long side wall on the middle frame 50 or a middle frame. 50 short side walls on shorter lengths. The short side wall corresponds to both ends of the mobile terminal, and the long side wall corresponds to both sides of the mobile terminal. The two ends of the mobile terminal are the ends where the camera and fingerprint are unlocked in the mobile terminal. The side between the two ends of the mobile terminal. In a specific embodiment, the first wall may be a side wall of the middle frame 50 corresponding to the end provided with the fingerprint unlocking on the mobile terminal.

With continued reference to FIG. 2, when the light sensing device 30 is specifically set, the light sensing device 30 is embedded in the display module 10. As shown in FIG. 2, the display module 10 includes a first layer structure 13, and the first layer structure 13 and the transparent cover plate 20 are spaced from each other. When specifically forming the space setting, the display module 10 is disposed on the transparent cover. Other layer structures between the plate 20 and the first layer structure 13 are implemented. For convenience of description, other layer structures provided between the transparent cover plate 20 and the first layer structure 13 are named as supporting layer structures. As can be seen from FIG. 2, the support layer structure is interposed between the first layer structure 13 and the transparent cover plate 20, and the support layer and the transparent cover plate 20 are fixedly connected. In addition, the transparent cover plate 20 and the first layer structure 13 protrude outward from the support layer structure. The sides of the transparent cover plate 20, the support layer, and the first layer structure 13 near the first wall are formed into a "匚" shape. There is a gap between the transparent cover plate 20 and the first layer structure 13, and the gap is a receiving gap of the light sensing device 30. When the light-sensing device 30 is provided, the light-sensing device 30 is located in a recessed area of the “匚” -shaped structure.

When setting the light sensing device 30 in detail, it should be understood that the thickness of the light sensing device 30 in the stacking direction of the transparent substrate and the array substrate should be smaller than the thickness of the support layer, that is, The vertical height of the space should be greater than the thickness of the light sensing device 30 to ensure that the light sensing device 30 can be placed in the receiving gap. Therefore, when setting the support layer, attention should be paid to the height of the support layer so that the thickness of the light sensing device 30 is smaller than the first layer along the stacking direction of the transparent cover plate 20 and the display module 10. The vertical distance between the structure 13 and the transparent cover 20 ensures sufficient space for placing the light sensing device 30.

The supporting layer may have a different structure, and the supporting layer may be a structure in the display module 10 or may not belong to the structure of the display module 10. For example, in a specific embodiment, the support layer does not belong to the structure of the display module 10, and the support layer may be a touch layer and an adhesive layer that adheres the touch layer to the transparent cover 20, or it may be an For any function of the support layer, such as a transparent passivation layer, it should be noted that regardless of the above-mentioned layer structure, it should be able to maintain the overall height of the support layer to ensure that the light sensing device 30 can be placed.

Alternatively, the support layer may also belong to the display module 10. At this time, the support layer may be a part of the structure of the display module 10. The support layer includes a second layer structure 12 and a third layer structure 11. The two-layer structure 12 and the third-layer structure 11 are located between the transparent cover plate 20 and the first-layer structure 13, and the first-layer structure 13 has edges protruding outward from the second-layer structure 12 and the third-layer structure 11. The edge of the first layer structure 13 protruding to the second layer structure 12 and the transparent cover plate 20 form a gap as described above. The first layer structure 13, the second layer structure 12 and the third layer structure 11 can be different layer structures in the display module 10. It only needs to satisfy that the first layer structure 13 is extended to the second layer structure 12 during the setting. And just outside the third layer structure 11. It should be understood that the second layer structure 12 and the third layer structure 11 are only examples, and the layer structure between the first layer structure 13 and the transparent cover plate 20 is not limited to the two-layer structure described above, but may also be a first layer structure. The one-layer structure 13 and the transparent cover plate 20 are separated by one-layer structure, three-layer structure, or four-layer or five-layer layer structures. However, it should be noted that the layer structure between the transparent cover plate 20 and the first layer structure 13 should be able to form a “匚” -shaped structure, and the supporting layer has a sufficient height to accommodate the light sensing device 30.

For the above-mentioned first layer structure 13, second layer structure 12, and third layer structure 11, they can be different layer structures in the display module 10, for example, the first layer structure 13 is an array substrate, a color film One layer structure among different layer structures such as the substrate and the backlight module 18. In specific setting, different layer structures may be adopted as the first layer structure 13 according to the situation of the light-sensing device 30 to surround the transparent cover 20 to form a space accommodating the light-sensing device 30. Take the display module 10 shown in FIG. 3 as an example. The display module 10 has a multilayered structure. With the display direction of the display module 10 shown in FIG. 3 as a reference direction, the multilayered structure is from the top. From the bottom to the bottom: first polarizer, color filter substrate, array substrate, second polarizer 14, first light-enhancing sheet 15, second light-enhancing sheet 16, diffusion sheet 17, and backlight module 18. In the display module 10 shown in FIG. 3, the first layer structure 13 is an array substrate, and the second layer structure 12 and the third layer structure 11 are a first polarizer and a color filter substrate, respectively. As can be seen from FIG. 3, the first polarizer is connected to the transparent cover 20 through an adhesive layer. At this time, the structure forming the entire support layer includes a first polarizer, a color filter substrate, and an adhesive layer. When setting, the total height of the first polarizer, the color filter substrate and the adhesive layer should be greater than the thickness of the light sensing device 30 to ensure that the light sensing device 30 can be placed between the transparent cover plate 20 and the first layer structure 13. In addition, the array substrate in the display module 10 needs to be connected to the motherboard 40 of the mobile terminal through a flexible circuit board 60. At this time, the edge of the array substrate needs to protrude out of the color filter substrate to provide the flexible circuit board 60. It can be seen from the above description that the array substrate of the display module 10 itself has a structure protruding outward from the color filter substrate. Therefore, when the array substrate of the first layer structure 13 is used, there is no need to change the structure of the display module 10, only It is necessary to place the light sensing device 30 between the transparent cover plate 20 and the array substrate.

It should be understood that FIG. 2 only shows a specific implementation manner of the display module 10. The display module 10 provided in the embodiment of the present application may also be other common display modules 10. In addition, the first layer structure 13 is an array substrate, the second layer structure 12 is a color filter substrate, and the third layer structure 11 is a first polarizer, which is only a specific embodiment. Different layer structures are used in the display module 10 In this case, the first layer structure 13, the second layer structure 12 and the third layer structure 11 may be different layer structures in the display module 10.

When a light sensor device 30 is specifically provided, the light sensor device 30 includes a light sensor chip 32 and a packaging layer 31, wherein the light sensor chip 32 is a wafer. In specific preparation, a smaller nm process, a thinner wafer, and a thinner package thickness are adopted, so that the prepared light sensing device 30 has a smaller size. Conveniently placed between the transparent cover plate 20 and the first layer structure 13.

When the light sensing device 30 is specifically fixed, the light sensing device 30 may be fixed on a different structure, such as the transparent cover plate 20 or the first layer structure 13. In a specific embodiment, as shown in FIG. 4, the photosensitive chip 32 is directly packaged on the transparent cover 20 or the first layer structure 13 through the packaging layer 31. At this time, the sensor manufacturer does not produce the packaged light-sensing device 30, but sends the wafer to the LCD factory, and the LCD manufacturer completes the packaging and testing. At this time, the light sensing device 30 is directly packaged on the transparent cover 20 or the first layer structure 13, so that the thickness of the entire light sensing device 30 can be reduced, so that the light sensing device 30 can be disposed on the first layer structure 13 and transparent. Between the cover plates 20. Alternatively, as shown in FIG. 5, the wafer is first packaged through the packaging layer 31, and then the packaging layer 31 of the light sensing device 30 is fixedly connected to the transparent cover plate 20 or the first layer structure 13. During the specific connection, the packaging layer 31 is soldered to the first layer structure 13. For example, if the bottom pad of the light sensing device 30 is soldered to the first layer structure 13, there is a certain gap between the top of the light sensing device 30 and the transparent cover plate 20. Alternatively, the light sensing device 30 is adhered to the side of the transparent cover 20 facing the display module 10 through the light-transmitting glue.

It should be understood that no matter which of the above schemes is adopted, when the light sensing device 30 is set, the photosensitive side of the light sensing device 30 faces the transparent cover 20, and the external ambient light is irradiated to the light sensing device 30 through the transparent cover 20. in.

In the embodiment of the present application, since the light sensing device 30 is not directly disposed on the main board 40, a line is required to connect the light sensing device 30 and the main board 40. Taking the first layer structure 13 as an array substrate as an example, in the prior art, the array substrate needs to be connected to the motherboard 40 through a flexible circuit board 60. When the light sensing device 30 is disposed between the first layer structure 13 and the transparent cover plate 20, the flexible circuit board 60 on the array substrate can also be used to connect the light sensing device 30 to the main board 40, so that the light sensing device No additional wiring design is needed, and the wiring setting can be completed by using the wiring space formed when the original array substrate and the motherboard 40 are connected. In specific setting, the array substrate and the light sensing device 30 are respectively connected to the flexible circuit board 60, and the flexible circuit board 60 is connected to the main board 40 through a connector. It should be understood that the flexible circuit board 60 connected to the array substrate and the main board 40 in the embodiments of the present application is compared with the flexible circuit board 60 connected to the array substrate and the main board 40 in the display module 10 in the prior art. There are more lines corresponding to the connection between the light sensing device 30 and the motherboard 40.

When the array substrate and the flexible circuit board 60 are specifically set, the array substrate and the flexible circuit board 60 correspond to a non-display area in the display module 10 and are located at the end of the entire mobile terminal near the fingerprint sensor. In adopting this structure, a space in which the fingerprint sensor and the above-mentioned array substrate and flexible circuit board 60 are set is reserved in the middle frame 50. In addition, when the light sensing device 30 is provided, it can be seen from FIG. 2 that the light sensing device 30 is disposed between the transparent cover 20 and the first layer structure 13. At this time, the light sensing device is correspondingly located in the display module 10. In the non-display area, and lighting is performed through the transparent cover plate 20, there is no need to set holes or the like on the front cover plate of the mobile terminal.

In addition, as can be seen from the above description, since the light sensing device 30 is located between the transparent cover plate 20 and the first layer structure 13, it can be understood that the light sensing device 30 is embedded in the display module 10. As can be seen from FIG. 2, the vertical projection of the light sensing device 30 on the plane where the transparent cover 20 is located and the vertical projection of the display module 10 and the plane where the transparent cover 20 is located partially overlap. Thereby, the space inside the mobile terminal is fully utilized to set the light sensing device 30. Compared with the scheme in which the display module 10 and the light-sensing device 30 are arranged side by side in FIG. 1, the space occupied by the light-sensing device 30 is reduced, which facilitates the development of the narrow frame of the mobile terminal. In addition, the space structure inside the mobile terminal is fully utilized, and the light sensing device 30 is disposed between the transparent cover 20 and the first layer structure 13, so that the light sensing device 30 can be brought closer to the external environment and the detection accuracy can be improved. Sex.

The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in this application, which should be covered. Within the scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A mobile terminal is characterized by comprising a middle frame, a laminated transparent cover and a display module; wherein the laminated transparent cover and the display module are located in the middle frame, and the transparent cover The edge of the board is protruded outside the display module, and the convex edge of the transparent cover is overlapped with the first side wall of the middle frame, and the first side wall and the display module have The accommodating gap further includes a light sensing device located in the accommodating gap.
The mobile terminal according to claim 1, wherein the display module includes a first layer structure, and the first layer structure is spaced from the transparent cover plate, and the light sensing device is located in the transparent layer. Between the cover plate and the first layer structure.
The mobile terminal according to claim 2, wherein the display module further comprises a second layer structure and a third layer structure laminated with the first layer structure, wherein the second layer structure and the The third layer structure is located between the transparent cover plate and the first layer structure, and the first layer structure has an edge protruding outward from the second layer structure.
The mobile terminal according to claim 3, wherein the first layer structure is an array substrate.
The mobile terminal according to claim 4, wherein the second layer structure and the third layer structure are a color filter substrate and a first polarizer, respectively, and the first polarizer and the The transparent cover is connected by adhesive.
The mobile terminal according to claim 4, wherein the array substrate and the light sensing device are connected to a main board of the mobile terminal through a flexible circuit board.
The mobile terminal according to any one of claims 3 to 6, characterized in that, along the laminating direction of the transparent cover and the display module, the thickness of the light sensing device is smaller than that of the first layer structure and A vertical distance of the transparent cover.
The mobile terminal according to any one of claims 2 to 5, wherein the light sensing device comprises a light sensing chip and a packaging layer; and the light sensing chip is packaged on the transparent cover plate through the packaging layer. Or on the first layer structure.
The mobile terminal according to any one of claims 2 to 5, wherein the light sensing device comprises a light sensing chip and a packaging layer for packaging the light sensing chip, wherein the packaging layer and the transparent cover The board or the first layer structure is fixedly connected.
The mobile terminal according to claim 9, wherein the packaging layer is soldered to the first layer structure.