WO2020037849A1

WO2020037849A1 - Mounting structure for thin film temperature sensor, and temperature sensing device

Info

Publication number: WO2020037849A1
Application number: PCT/CN2018/116167
Authority: WO
Inventors: 花国樑
Original assignee: 深圳市敏杰电子科技有限公司
Priority date: 2018-08-20
Filing date: 2018-11-19
Publication date: 2020-02-27
Also published as: CN110849497A

Abstract

A mounting structure (801) for a thin film temperature sensor, and a temperature sensing device. The thin film temperature sensor has a thermistor (301, 601, 702, 821) and a lead (304, 604). The mounting structure (801) comprises: a pressing structure (200, 500, 721) made out of a heat insulating material and comprising an attaching structure (201, 501) attached to a temperature sensing surface of a thin film temperature sensor and a fixing structure (205, 505), the attaching structure (201, 501) being used for planar attaching or curved attaching and having a recess (202, 502), and the fixing structure (205, 505) being used for fixing the mounting structure (801) for the thin film temperature sensor; and a fastening structure (100, 400) comprising a fastening body (101, 401) in the shape of a metal sheet and metal fasteners (103, 104, 403, 404) extending from or coupled to the fastening body (101, 401), the fastening body (101, 401) having a temperature measurement surface contacting an object to be measured, the temperature measurement surface having an opening (102, 402), wherein the fastening structure (100, 400) is tightly fixed to the attaching structure (200, 500, 721) to press the head of the thermistor (301, 601, 702, 821) of the thin film temperature sensor into the recess (202, 502) of the pressing structure (200, 500, 721) and to cause the head of the thermistor (301, 601, 702, 821) to expose from the opening (102, 402) of the temperature measurement surface, so as to be flush with or higher than the temperature measurement surface.

Description

Mounting structure of film temperature sensor and temperature sensing device

Technical field

The present disclosure relates to a temperature sensor, in particular to a mounting structure of a thin-film temperature sensor and a temperature sensing device.

Background technique

In the prior art, a thin film temperature sensor is fixed on a mounting structure with glue, and then mounted on an object to be measured. However, because the glue is a chemical, it is easy to pollute the environment, and there is no way to adhere firmly. In addition, in high-temperature or humid environments, the viscosity of the glue is greatly reduced, causing the film temperature sensor to fall off. At the same time, the cleverness of the installation structure of the thin film temperature sensor is related to whether the reaction speed of the thin film temperature sensor is accelerated.

Summary of the Invention

In view of one or more problems in the prior art, a mounting structure and a temperature sensing device for a thin film temperature sensor are proposed.

In one aspect of the present disclosure, a mounting structure of a thin-film temperature sensor is provided. The thin-film temperature sensor is provided with a thermistor and a lead, and includes a crimping structure made of a heat-insulating material, including a sensing effect on the thin-film temperature sensor. Warm surface tight structure and fixed structure, the tight structure is flat or curved, and has a concave portion, and the fixing mechanism is used to fix the installation structure of the thin film temperature sensor; the snap structure includes a metal sheet and the metal Sheet metal extension or metal buckle coupled with the metal sheet, the metal sheet has a temperature measuring surface in contact with the measured object, and the temperature measuring surface of the metal buckle has an opening, wherein the metal buckle is fastened to the pressing Structurally, the head of the thermistor of the thin-film temperature sensor is pressed into the recessed position of the pressing structure, and the head of the thermistor of the thin-film temperature sensor is exposed through the opening of the temperature measuring surface of the metal snap. Is flush with or higher than the temperature measuring surface of the metal buckle.

According to some embodiments of the present disclosure, the thickness of the metal sheet of the buckle structure is less than 4 mm, and the temperature measurement surface is a flat surface or a curved surface that fits the surface of the measured object. .

According to some embodiments of the present disclosure, the thermal insulation material includes at least one of bakelite, plastic, fiberglass, ceramic, and silicone rubber.

According to some embodiments of the present disclosure, the recess of the pressing structure is a closed hole, and the mounting structure further includes a heat-insulating and insulating gasket disposed in the hole.

According to some embodiments of the present disclosure, the pressing structure has a slit, and the metal buckle passes through the slit and is fastened to the pressing structure.

According to some embodiments of the present disclosure, the pressing structure is a shell of a thermal fuse.

According to some embodiments of the present disclosure, the thermistor is composed of a bare chip thermistor and a glass-sealed thermistor.

In another aspect of the present disclosure, a temperature sensing device is provided, including: a thin-film temperature sensor with a thermistor and a lead; a crimping structure made of a heat-insulating material including a temperature-sensing surface of the thin-film temperature sensor The fastening structure is a flat or curved surface, and has a recess. The fixing mechanism is used to fix the installation structure of the thin film temperature sensor. The snap structure includes a metal sheet and extends from the metal sheet. Or a metal buckle coupled to the metal sheet, the metal sheet has a temperature measuring surface in contact with the measured object, the metal buckle temperature measuring surface has an opening, and the metal buckle is fastened and pressed against the structure, Pressing the head of the thermistor of the thin-film temperature sensor into the recessed position of the pressing structure, and exposing the head of the thermistor of the thin-film temperature sensor from the opening of the temperature measuring surface of the metal snap, Flush with or higher than the temperature measuring surface of the metal buckle

According to some embodiments of the present disclosure, there are grooves on both sides of the pressing structure, and the metal buckle passes through the groove to be fastened to the pressing structure.

In yet another aspect of the present disclosure, a temperature sensing device is provided, including: a thin-film temperature sensor having a thermistor and a lead, wherein a temperature-measuring surface of the thin-film temperature sensor is in contact with a measured object; It includes a temperature fuse wrapped by an insulation structure and a terminal connected to the temperature fuse, wherein the insulation structure of the temperature fuse has a hole, and when the temperature fuse structure is pressed on the film temperature sensor, the head of the thermistor is exposed from the hole A fastening structure pressed on the temperature fuse insulating structure, and the fastening structure is coupled to the object to be measured, thereby pressing the temperature fuse structure and the thin film temperature sensor on the object to be measured.

According to some embodiments of the present disclosure, an extension direction of the thin film temperature sensor is the same as or different from an extension direction of the temperature fuse structure.

According to some embodiments of the present disclosure, the insulation structure of the temperature fuse structure is made of ceramic.

In yet another aspect of the present disclosure, a temperature sensing device is provided, including: a thin-film temperature sensor having a thermistor and a lead; a mounting structure having a surface in contact with an object to be measured and a notch on a side thereof; There is an opening on the surface. When the thin film temperature sensor is inserted into the slot, the head of the thin film temperature sensor is exposed from the opening, and the front half of the film is stuck, and a wedge is inserted into the slot to hold the thin film temperature sensor. The second half of the film; the fastening structure is coupled to the mounting structure, and the fastening structure is coupled to the object to be measured, thereby pressing the installation structure with the film temperature sensor inserted on the object to be measured.

According to some embodiments of the present disclosure, a bottom surface of the opening has a protrusion, and the thin film temperature sensor is directed toward an object to be measured.

According to some embodiments of the present disclosure, the material of the mounting structure is an insulating material, including bakelite or plastic or ceramic.

With the solution of the above embodiment, the glue is replaced with a new installation structure, which protects the environment, and can also maintain the stability of temperature measurement in high temperature and humid environments. In addition, the solutions of some embodiments mentioned above also solve the problem of temperature measurement on curved surfaces. Because the thermistor in the thin film temperature sensor is arranged in the recess of the structure insulation heat insulation material, a thermal reflow is formed due to the opening effect on the temperature measurement surface of the metal buckle, which greatly improves the reaction speed of the thin film temperature sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to better understand the present disclosure, the present disclosure will be described in detail with reference to the following drawings:

1A is a schematic perspective view of a buckle structure of a mounting structure of a thin film temperature sensor according to an embodiment of the present disclosure;

1B is a top view of the buckle structure shown in FIG. 1A;

1C is a bottom view of the snap structure shown in FIG. 1A;

1D is a side view of the buckle structure shown in FIG. 1A;

2A is a schematic perspective view of a pressing structure of a mounting structure of a thin film temperature sensor according to an embodiment of the present disclosure;

2B is a top view of the mounting structure shown in FIG. 2A;

2C is a bottom view of the mounting structure shown in FIG. 2A;

2D is a cross-sectional view taken along A-A 'in FIG. 2B;

3A is a schematic diagram of setting a thin film temperature sensor in a pressing structure according to an embodiment of the present disclosure;

3B is a schematic diagram of fastening a film temperature sensor to a pressing structure by using a snap structure in an embodiment of the present disclosure;

3C is another schematic diagram of fastening the film temperature sensor to the pressing structure by using a snap structure in an embodiment of the present disclosure;

3D is a cross-sectional view taken along B-B 'in FIG. 3B;

4A is a schematic perspective view of a buckle structure of a mounting structure of a thin film temperature sensor in another embodiment of the present disclosure;

4B is a top view of the buckle structure shown in FIG. 4A;

4C is a side view of the buckle structure shown in FIG. 4A;

4D is another side view of the buckle structure shown in FIG. 4A;

5A is a schematic perspective view of a pressing structure of a mounting structure of a thin film temperature sensor according to an embodiment of the present disclosure;

5B is a schematic view of the mounting structure shown in FIG. 5A along the AA direction;

5C is a schematic view of the mounting structure shown in FIG. 5A along the BB direction;

5D is a cross-sectional view taken along C-C 'in FIG. 5C;

6A is a schematic diagram of a thin film temperature sensor disposed in a pressing structure in another embodiment of the present disclosure;

FIG. 6B is a schematic diagram of fastening a film temperature sensor to a pressing structure using a snap structure in another embodiment of the present disclosure; FIG.

6C is another schematic view of fastening the film temperature sensor to the pressing structure by using a snap structure in another embodiment of the present disclosure;

6D is a sectional view taken along D-D 'in FIG. 6B;

7A is a schematic diagram of pressing a temperature fuse structure on a thin film temperature sensor according to another embodiment of the present disclosure;

7B is a schematic view of pressing a fastening structure on a temperature insurance structure according to another embodiment of the present disclosure;

7C is a cross-sectional view taken along E-E 'in FIG. 7B;

8A is a perspective view of a temperature sensing device according to another embodiment of the present disclosure;

8B is a top view of the temperature sensing device shown in FIG. 8A;

8C is a side view of the temperature sensing device shown in FIG. 8A;

8D is a cross-sectional view taken along a dotted line E-E 'shown in FIG. 8B;

8E is a cross-sectional view taken along a dotted line F-F 'shown in FIG. 8B;

9A illustrates a perspective view of a thin film temperature sensor inserted into a mounting structure according to another embodiment of the present disclosure;

9B is a top view of the temperature sensing device shown in FIG. 9A;

9C is a cross-sectional view taken along a dotted line G-G 'shown in FIG. 9B; and

Fig. 9D is a partially enlarged view of Fig. 9C.

detailed description

Specific embodiments of the present disclosure will be described in detail below. It should be noted that the embodiments described here are only for illustration and are not intended to limit the present disclosure. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that these specific details need not be employed to practice the present disclosure. In other instances, to avoid obscuring the present disclosure, well-known structures, materials, or methods have not been described in detail.

Reference throughout the specification to "one embodiment", "an embodiment", "an example", or "an example" means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in the present disclosure In at least one embodiment. Thus, the appearances of the phrases "in one embodiment", "in an embodiment", "an example", or "example" in various places throughout the specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or subcombination. Furthermore, those of ordinary skill in the art will understand that the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

In view of the problems caused by using a glue to bond a thin film temperature sensor to a mounting structure in the prior art, an embodiment of the present disclosure proposes a mounting structure of a thin film temperature sensor, including a pressing structure of the thin film temperature sensor, and a close contact with the thin film temperature. The temperature-sensing surface of the sensor is fixed with a metal buckle structure of a pressing structure. The pressing structure includes a close structure and a fixed structure, and the close structure has a recess, such as a closed hole, whose diameter is larger than the diameter of the thermistor in the thin film temperature sensor. The outer edge of the recess is on a flat surface or a curved surface, so that the flat surface or the curved surface is tight. Since the thermistor in the thin film temperature sensor protrudes from the surface of the film, when the thin film temperature sensor is fixed by the pressing structure, the thermistor in the thin film temperature sensor is forced to squeeze to the recessed position of the pressing structure, and at the same time, the reaction force promotes the protrusion The thermistor head on the film surface is closely attached to the temperature measurement surface of the object to be measured. The close structure of the crimping structure is to ensure that the crimping structure composed of insulating material isolates the surrounding environment from the impact on temperature measurement, and at the same time, to ensure that the thermistor in the film temperature sensor is strongly squeezed during the entire fixing process The key is that the thermistor is not crushed. The metal buckle structure completely wraps the thermistor in the thin film temperature sensor, and only the thermistor in the thin film temperature sensor is exposed to sense the temperature. When the crimping structure is fixed, the metal buckle structure is closely attached to the surface of the object to be measured. At this time, because the metal heat transfer speed is faster than the crimping structure composed of insulating material, it immediately forms around the thermistor in the thin film temperature sensor Heat conduction and heat reflow greatly accelerate the response speed of the thin film temperature sensor.

According to some embodiments, the pressing structure is composed of insulating materials such as bakelite, plastic, and glass fiber. The pressing structure is divided into a close structure and a fixed structure for the temperature sensing surface of the thin film temperature sensor, and the close structure is also divided into a flat surface or a curved surface. The fixed structure can be a hole fixed with a nut, or a pressing piece and other similar functions. the way. The fixed structure and the close structure may be on the same plane or different planes.

According to some embodiments, the metal buckle structure material is composed of a metal or alloy sheet with a thickness of less than 4 mm, and its surface is flat or curved. The metal buckle structure is a metal inner circle outer structure (that is, an opening) that has a temperature sensing surface covering the film temperature sensor and exposes the thermistor. It also has the function of fixing the crimping structure. The sensor slides out of the snap. After the metal buckle structure holds the film and presses the structure, its plane is lower than the height of the thermistor in the film temperature sensor. In this way, when an external force pulls the film temperature sensor outward, the thermistor that is higher than the plane of the metal buckle structure becomes another obstacle to prevent the film temperature sensor from being pulled outward. Therefore, it is ensured that the film temperature sensor is firmly fixed on the pressing structure. When the pressing structure is fixed, the thermistor protruding from the surface of the film is forced to squeeze into the closed hole of the pressing structure, and at the same time, the reaction force promotes the thermistor protruding from the surface of the film to closely adhere to the temperature measurement surface of the object to be measured. . The metal inner circle outer structure in the metal snap structure immediately forms heat conduction and heat reflow around the thermistor in the thin film temperature sensor, thereby greatly speeding up the reaction speed of the thin film temperature sensor.

According to some embodiments, the thin film temperature sensor is composed of a thermistor and a film covering the thermistor and its leads, and the thermistor and its leads may be composed of a thermistor soldered with a flexible cable or a wire, or a thermistor As well as its own lead composition. The thermistor can be composed of a bare chip thermistor and a glass-encapsulated thermistor. The crimping structure may be a shell of a thermal fuse, for example, it may be made of ceramic or other thermal insulation materials.

According to some embodiments, the fixing piece (fixing structure) of the pressing structure may be composed of metal materials such as galvanized iron, stainless steel, and the like.

FIG. 1A is a schematic perspective view of a buckle structure of a mounting structure of a thin film temperature sensor according to an embodiment of the present disclosure. FIG. 1B is a top view of the buckle structure shown in FIG. 1A. Fig. 1C is a bottom view of the snap structure shown in Fig. 1A. FIG. 1D is a side view of the buckle structure shown in FIG. 1A.

As shown in FIGS. 1A, 1B, 1C, and 1D, the buckle structure 100 may include a metal sheet-shaped buckle body 101, a metal buckle 103 extending from or coupled to the buckle body 101. And 104, for fastening the thin film temperature sensor to the pressing structure. As shown in the figure, the flat temperature measurement surface of the snap body 101 has an opening 102. When the thin film temperature sensor is fastened to the pressing structure, the thermistor of the thin film temperature sensor is exposed through the opening 102 and contacts the measured object.

According to the above embodiment, the material of the buckle structure 100 is composed of a metal or alloy sheet, and the thickness is less than 4 mm, and the temperature measurement surface is flat. The buckle structure 100 specifically has a metal inner circle outer structure that wraps the temperature-sensing surface of the film temperature sensor and exposes the thermistor, and also has the function of fixing the pressing structure, and one or more of which prevent the film temperature sensor from sliding out. Metal buckle. After the buckle structure clamps the film temperature sensor and the pressing structure, the temperature measurement plane is lower than the height of the thermistor in the film temperature sensor.

Although the buckle body 101 is formed in a square shape in the above-mentioned embodiment, those skilled in the art may think that the buckle body may be formed into other shapes in other embodiments, such as a rectangle, a circle, an oval, or the like. Although the opening 102 is formed in a circular shape in the above-mentioned embodiment, those skilled in the art may think that the opening may be formed in other shapes in other embodiments, such as an oval shape, a square shape, or a rectangular shape. Although in the above embodiment, the buckle structure 100 has two

metal buckles

103 and 104, those skilled in the art can think of providing more metal buckles or one metal buckle in other embodiments as long as they can The film temperature sensor can be fastened to the pressing structure.

2A is a schematic perspective view of a pressing structure of a mounting structure of a thin-film temperature sensor according to an embodiment of the present disclosure. FIG. 2B is a top view of the mounting structure shown in FIG. 2A. Fig. 2C is a bottom view of the mounting structure shown in Fig. 2A. Fig. 2D is a sectional view taken along A-A 'in Fig. 2B.

The pressing structure according to this embodiment includes a close structure (for example, a pressure plate 201) and a fixed structure (for example, a fixed structure 205). The close structure has a recess, such as a closed hole, and has a diameter larger than that of the thermal sensor in the film temperature sensor. The diameter of the resistor. The outer edge of the recess is on a plane, so that the plane is tightly attached. As shown in FIGS. 2A, 2B, 2C, and 2D, the pressing structure 200 according to the present embodiment is made of a heat-insulating material, and is formed to have a recess 202. According to the embodiment of the present disclosure, the pressing structure 200 is composed of insulating materials such as bakelite, plastic, fiberglass, ceramic, and silicon rubber. The pressing structure 200 includes a pressing plate 201 and a fixing structure 205 extending from the pressing plate. A recessed portion 202 is formed in the pressure plate 201, and the shape of the outer edge is, for example, a circle, but it may also be an oval, a square, or a rectangle to accommodate a thermistor of a thin film temperature sensor. As shown in the figure, a protruding portion 207 is formed on the outer side of the recessed portion 202 of the pressure plate 202, and slits 203 and 204 are formed between the recessed portion 202 and the protruding portion 207 to facilitate the metal buckle of the metal buckle structure to pass through. Thus, the thin film temperature sensor is fastened to the pressing structure 200. In addition, as shown in the figure, a fixing hole is formed in the fixing structure 205, which is convenient for fixing the pressing structure to the measured object by using screws or rivets.

Although in the above embodiments, the protrusions 207 are formed on the three sides of the pressure plate 201, those skilled in the art can think of forming the protrusions 207 only on one or two sides, or without providing protrusions. unit. Although two

slits

203 and 204 are formed in the above embodiment, those skilled in the art can think of other shapes can be formed in other embodiments, such as through holes or grooves formed on the side of the pressing plate, etc. Three or more slits can also be formed, as long as the metal buckle that can facilitate the buckle structure fixes the film temperature sensor to the pressing structure.

According to other embodiments, a heat-insulating insulating gasket may be provided at the bottom of the recess 202 for buffering the pressure on the thermistor. In addition, when at least one protruding portion 207 is provided outside the recessed portion 202, the temperature measurement surface of the snap structure is flush with the top end of the protruding portion 207 or slightly protrudes beyond the protruding portion 207.

FIG. 3A is a schematic diagram of setting a thin film temperature sensor in a pressing structure according to an embodiment of the present disclosure. FIG. 3B is a schematic diagram of fastening the film temperature sensor to the pressing structure by using a snap structure in an embodiment of the present disclosure. FIG. 3C is another schematic diagram of fastening the film temperature sensor to the pressing structure by using a snap structure in an embodiment of the present disclosure. Fig. 3D is a sectional view taken along B-B 'in Fig. 3B.

As shown in FIG. 3A, a thin film temperature sensor according to an embodiment of the present disclosure includes a thermistor 301, a lead 304 connected to the thermistor, a thin film 303 covering the thermistor, and a thin film 302 covering the lead 304, and here the thin film 203 The thin film 303 may be formed integrally. The thin film temperature sensor is placed on the pressure plate 201, so that the head of the thermistor 301 is embedded in the position of the recess 202 of the pressure plate 201, such as a hole. For the convenience of the reader, the various parts of the crimping structure are filled with diagonal lines in FIGS. 3A and 3B and 3C.

Then, as shown in FIG. 3B, the metal buckle of the buckle structure is passed through the slit of the pressing structure, and the film temperature sensor is fastened to the pressing structure, so that the thermistor 301 is removed from the buckling body of the buckling structure. The opening 102 on 101 is exposed. As shown in FIG. 3C, the metal buckles 103 and 104 fasten the film temperature sensor to the pressing structure after passing through the slit. In addition, the cross-sectional view of FIG. 3D also shows a situation in which the pressing structure is fixed to the measured object by inserting the screw into the hole 206.

As described above, the opposite side of the temperature sensing surface side of the thin film temperature sensor is attached to the pressing structure 200, and the opposite side of the temperature sensing surface side of the thermistor 301 in the thin film temperature sensor is directly facing the recess 202 in the pressing structure 200, such as a circle Shaped hole. The film temperature sensor, the buckle structure 100 and the pressing structure 200 are combined together by a jig, and the temperature sensing surface of the thermistor 301 of the film temperature sensor is exposed in the opening 102 of the temperature measurement plane of the buckle structure 100. In the application, the pressing structure 200 and the temperature measurement plane of the object to be measured can be pressed with screws. The opposite side of the temperature sensing surface of the thermistor 301 in the thin film temperature sensor is forced into the recess 202 of the pressing structure 200, and the reaction force is at the same time. Promote the thermistor 301 temperature sensing surface closely to the temperature measurement surface of the object to be measured, and the recess 202 can ensure that the pressing structure composed of heat insulation material isolates the impact of the surrounding environment on the temperature measurement, and at the same time, ensures the film temperature The thermistor in the sensor is squeezed vigorously during the whole fixing process, and the thermistor is not crushed, which makes the thermistor 301 temperature measurement more accurate. At this time, after the buckle structure 100 catches the film temperature sensor and the pressing structure 200, its plane is lower than the height of the thermistor 301 in the film temperature sensor. In this way, when an external force is used to pull the film temperature sensor outward, the thermistor 301 that is higher than the temperature measurement plane of the buckle structure 100 becomes an obstacle to prevent the film temperature sensor from being pulled outward. Therefore, it is ensured that the film temperature sensor is fixed on the pressing structure 200. When the thin film temperature sensor 303 is fixed on the pressing structure and is closely attached to the temperature measurement surface of the object to be measured, the thermistor 301 protruding from the surface of the film is forced to the position of the recess 202 of the pressing structure 200, and the reaction force promotes Because the film surface thermistor 301 is closely attached to the temperature measurement surface of the object to be measured. The opening structure of the metal inner circle and the outer side of the buckle structure 100 immediately forms heat conduction and heat backflow around the thermistor 301 in the film temperature sensor, thereby greatly speeding up the reaction speed of the film temperature sensor. The pressing structure here has a slit, which facilitates the metal sheet of the metal buckle structure to pass through the slit, bend, and fasten to the pressing structure.

Although the above description is a case where the temperature measurement surface is a plane, those skilled in the art can think that the present disclosure is not limited to this, but can be applied to other temperature measurement surfaces, such as curved surfaces.

4A is a schematic perspective view of a buckle structure of a mounting structure of a thin film temperature sensor in another embodiment of the present disclosure. FIG. 4B is a top view in the AA direction of the snap structure shown in FIG. 4A. 4C is a side view of the buckle structure shown in FIG. 4A in the BB direction. FIG. 4D is a side view of the buckle structure shown in FIG. 4A in the CC direction.

As shown in FIGS. 4A, 4B, 4C, and 4D, the buckle structure 400 may include a metal sheet-shaped buckle body 401, a metal buckle 403 extending from or coupled to the buckle body 401. And 404 for fastening the thin film temperature sensor to the crimping structure. As shown in the figure, the curved surface (such as a curved surface) of the snap body 401 has an opening 402. When the film temperature sensor is fastened to the pressing structure, the thermistor of the film temperature sensor is exposed through the opening 402, and The measured object is in contact. As shown in the figure, the buckle structure 400 may further include

anti-sliding members

405 and 406 extending from the buckle body 401 or coupled to the buckle body 401 to prevent the film temperature sensor from being pressed between the pressing structure and the buckle structure. Occasionally slip out.

According to the above embodiment, the material of the buckle structure 400 is composed of a metal or alloy sheet with a thickness of less than 4 mm, and the temperature measurement surface thereof is a curved surface (for example, a curved surface). The buckle structure 400 specifically has a metal inner circle outer structure that wraps the temperature-sensing surface of the film temperature sensor and exposes the thermistor, and also has the function of fixing the pressing structure, and one or more of which prevent the film temperature sensor from sliding out. Buckle. After the buckle structure clamps the film temperature sensor and the pressing structure, the temperature measurement plane is lower than the height of the thermistor in the film temperature sensor.

Although in the above embodiment, the buckle body 401 is formed as a square with a curved surface, those skilled in the art may think that the buckle body may be formed into other shapes in other embodiments, such as a rectangle with a curved surface, a circle, or Oval and so on. Although the opening 402 is formed in a circular shape in the above-mentioned embodiment, those skilled in the art may think that the opening may be formed in other shapes in other embodiments, such as an oval shape, a square shape, or a rectangular shape. Although in the above embodiment, the buckle structure 400 has two

metal buckles

403 and 404, those skilled in the art can think of providing more metal buckles or one metal buckle in other embodiments, as long as they can The film temperature sensor can be fastened to the pressing structure. Although in the above embodiment, the buckle structure 400 has two

anti-sliding members

405 and 406, those skilled in the art can think of providing more anti-sliding members or one anti-sliding member in other embodiments as long as It is sufficient to prevent the film temperature sensor from sliding out between the pressing structure and the snap structure.

FIG. 5A is a schematic perspective view of a pressing structure of a mounting structure of a thin film temperature sensor according to an embodiment of the present disclosure. 5B is a schematic view of the mounting structure shown in FIG. 5A along the AA direction. 5C is a schematic view of the mounting structure shown in FIG. 5A along the BB direction. Fig. 5D is a sectional view taken along C-C 'in Fig. 5C.

The pressing structure according to this embodiment includes a close structure (for example, a pressing plate 501) and a fixed structure (for example, a fixed structure 505). The close structure has a recess, such as a closed hole, and has a diameter larger than that of the thermal sensitivity in the film temperature sensor. The diameter of the resistor. The outer edge of the recess is on a curved surface, so that the curved surface is tight. As shown in FIGS. 5A, 5B, 5C, and 5D, the pressing structure 500 according to the present embodiment is made of a heat-insulating material, and is formed to have a recessed portion 502. According to the embodiment of the present disclosure, the crimping structure 500 is composed of insulating materials such as bakelite, plastic, fiberglass, ceramic, and silicon rubber. The pressing structure 500 includes a pressing plate 501 and a fixing structure 505 extending from the pressing plate. A recessed portion 502 is formed on the pressure plate 501, and the shape of the outer edge is, for example, a circular shape on an arc surface, but it may also be an oval shape, a square shape, or a rectangular shape on the arc surface to accommodate the thermistor of the film temperature sensor. As shown in the figure, a plurality of protruding

portions

506, 507, and 508 are formed on the outer side of the recessed portion 502 of the pressing plate 502, and

grooves

503 and 504 are formed on both sides to facilitate the buckle of the buckle structure to pass through the film. The temperature sensor is fastened to the crimping structure 500.

Although in the above embodiment, the

protrusions

506, 507, and 508 are formed on the three sides of the pressing plate 501, those skilled in the art can think of forming the protrusions only on one or two sides, or No protrusions are provided. Although two

grooves

503 and 504 are formed in the above embodiment, those skilled in the art can think of other shapes can be formed in other embodiments, such as through holes or slits passing through the pressure plate, etc. Three or more grooves can be formed, as long as the buckle of the buckle structure can be used to fix the film temperature sensor to the pressing structure.

According to other embodiments, a thermal insulation pad may be provided at the bottom of the recess 502 for buffering the pressure on the thermistor. In addition, when at least one protruding portion 507 is provided outside the recessed portion 502, the temperature measurement surface of the snap structure is flush with the top end of the protruding portion 507 or slightly protrudes beyond the protruding portion 507.

FIG. 6A is a schematic diagram of setting a thin film temperature sensor in a pressing structure in another embodiment of the present disclosure. FIG. 6B is a schematic diagram of fastening the film temperature sensor to the pressing structure by using a snap structure in another embodiment of the present disclosure. FIG. 6C is another schematic view of fastening the film temperature sensor to the pressing structure by using a snap structure in another embodiment of the present disclosure. Fig. 6D is a sectional view taken along D-D 'in Fig. 6B.

As shown in FIG. 6A, a thin film temperature sensor according to an embodiment of the present disclosure includes a thermistor 601, a lead 604 connected to the thermistor, a thin film 603 covering the thermistor, and a thin film 602 covering the lead 604. It can be formed in one piece or in sections. The thin film temperature sensor is placed on the pressure plate 501 so that the head of the thermistor 601 is embedded in the position of the recess of the pressure plate 501, such as a hole.

Then, as shown in FIG. 6B, the metal buckle of the buckle structure is passed through the groove on the side of the pressing structure, and the film temperature sensor is fastened to the pressing structure, so that the thermistor 601 is removed from the buckle of the buckle structure An opening 402 in the main body 401 is exposed. As shown in FIG. 6C, the metal buckles 403 and 404 fasten the film temperature sensor to the pressing structure after passing through the groove. In addition, in the diagram of FIG. 6B and the cross-sectional view of FIG. 6D,

anti-slip members

405 and 406 are also shown to prevent the film temperature sensor from slipping out.

As described above, the opposite side of the temperature sensing surface side of the thin film temperature sensor is attached to the pressing structure 500, and the opposite side of the temperature sensing surface side of the thermistor 601 in the thin film temperature sensor is directly facing the recess in the pressing structure 500, such as a circle Hole. The film temperature sensor, the buckle structure 400 and the pressing structure 500 are combined together by a jig, and the temperature sensing surface of the thermistor 301 of the film temperature sensor is exposed in the opening 402 of the temperature measurement plane of the buckle structure 400. In the application, the pressing structure 500 is pressed against the temperature measurement plane of the object to be measured, and the opposite side of the temperature sensing surface of the thermistor 601 in the film temperature sensor is forced into the recess of the pressing structure 500, and the reaction force promotes the thermistor. The 501 temperature sensing surface is closely attached to the curved temperature measurement surface of the object to be measured, and the recessed portion can ensure that the pressing structure composed of heat insulation material isolates the surrounding environment from the impact on the temperature measurement, and at the same time, ensures the heat In the entire fixing process, the thermistor is squeezed vigorously, and the thermistor is not crushed, so that the temperature measurement of the thermistor 601 is more accurate. At this time, after the buckle structure 400 catches the thin film temperature sensor and presses the structure 500, its plane is lower than the height of the thermistor 601 in the thin film temperature sensor. In this way, when an external force is used to pull the film temperature sensor outward, the thermistor 601, which is higher than the temperature measurement plane of the buckle structure 400, becomes an obstacle to prevent the film temperature sensor from being pulled outward. Therefore, it is ensured that the film temperature sensor is fixed on the pressing structure 500. When the pressing structure fixes the thin film temperature sensor 303 tightly to the temperature measurement surface of the object to be measured, the thermistor 601 protruding from the surface of the film is forced into the recess of the pressing structure 500, and at the same time, the reaction force promotes the protrusion The thermistor 601 on the film surface is closely attached to the temperature measurement surface of the object to be measured. The opening structure of the metal inner circle and the outer side of the buckle structure 400 immediately forms thermal conduction and thermal backflow around the thermistor 601 in the film temperature sensor, thereby greatly speeding up the reaction speed of the film temperature sensor.

FIG. 7A is a schematic diagram of pressing a temperature fuse structure on a thin film temperature sensor according to another embodiment of the present disclosure. FIG. 7B is a schematic diagram of pressing the fastening structure on the temperature insurance structure according to another embodiment of the present disclosure. Fig. 7C is a sectional view taken along E-E 'in Fig. 7B.

The temperature sensor shown in the figure may include a thin film temperature sensor, which has a thermistor 702 and its covering film 701, a lead connected to the thermistor and its covering film 703. The film 701 and the film 703 may be integrally formed, and Can be formed in sections.

The temperature sensor shown in the figure also includes a temperature fuse structure, including a temperature fuse wrapped by an insulation structure 711 and leads 712 and 713 connected to the temperature fuse. The insulation structure 711 of the temperature fuse has a hole. When on a thin film temperature sensor, the thermistor 702 is exposed from the hole 714.

The temperature sensor of this embodiment further includes a fastening structure 721 pressed on the temperature fuse structure, and the fastening structure is coupled to the object to be measured, thereby pressing the temperature fuse structure and the thin film temperature sensor on the measured object. On the object.

According to other embodiments, the extension direction of the thin film temperature sensor is the same as or different from the extension direction of the temperature fuse structure. Here, the insulation structure 714 of the thermal fuse structure is made of ceramic.

In the embodiment shown in the figure, the mounting structure of the thin-film temperature sensor includes a thin-film temperature sensor 701, a temperature fuse 711 that is close to the thin-film temperature sensor 701, and a pressing structure 721 that fixes the fuse. The temperature fuse 711 has a closed hole 714. When the film temperature sensor is fixed by the pressing structure 721, the temperature fuse will serve as an overheat protection when the temperature exceeds a specified temperature. The temperature fuse 711 can be pressed by the pressing structure 721, and then the film temperature sensor 702 is pressed by the temperature fuse 711. The film temperature sensor 702 and the temperature fuse 711 overlap at various angles such as 90 degrees, 180 degrees, or other angles. fixed.

FIG. 8A is a perspective view of a temperature sensing device according to another embodiment of the present disclosure. FIG. 8B is a plan view of the temperature sensing device shown in FIG. 8A. FIG. 8C is a side view of the temperature sensing device shown in FIG. 8A. Fig. 8D is a sectional view taken along a dotted line E-E 'shown in Fig. 8B. Fig. 8E is a sectional view taken along a broken line F-F 'shown in Fig. 8B.

The temperature sensing device shown in the figure includes a mounting structure 801 and a fastening structure 805 for mounting a thin film temperature sensor on an object to be inspected. The thin film temperature sensor includes a thermistor and a lead wire. The mounting structure 801 has a surface in contact with the object to be measured and a notch 802 on the side, the surface has an opening, and when the film temperature sensor is inserted into the notch 802, the head of the film temperature sensor is exposed through the opening, The front half of the film of the film temperature sensor head is stuck, and a wedge 830 can be inserted into the slot 802 to hold the back half of the film of the film temperature sensor head. The fastening structure 805 is coupled to the mounting structure 810, and the fastening structure 805 is coupled to the object to be measured, so as to press the mounting structure with the thin film temperature sensor inserted on the object to be measured. There are one or more protrusions 803 in the opening of the mounting structure, which are used to push the film temperature sensor toward the measured object. The fastening structure 805 has a hole position 810, which is convenient for installation on the object to be measured. For example, the fastening structure 805 can be fixed by screws, or the lower ring can be inserted and fixed.

FIG. 9A illustrates a perspective view of inserting a thin film temperature sensor into a mounting structure according to another embodiment of the present disclosure. FIG. 9B is a plan view of the temperature sensing device shown in FIG. 9A. Fig. 9C is a sectional view taken along a dotted line G-G 'shown in Fig. 9B. Fig. 9D is a partially enlarged view of Fig. 9C.

In FIG. 9A, the tight and pressed structure is an integrated structure, which pushes the thin film 820 in front of the thermistor in the thin film temperature sensor into the groove, and the thin film thermistor 821 is higher than the entire temperature measurement surface by means of an arc structure 803 in the middle. There is a cavity under the thermistor 821. When the thermistor 821 is squeezed, the opposite side of the thermistor 821's temperature-sensitive surface is forced to squeeze into the cavity, and at the same time, the reaction force causes the thermistor 821's temperature-sensitive surface to be closely attached. The surface is used to measure the temperature of the curved surface of the object to be measured, and the cavity can ensure that the pressing structure composed of heat insulation material isolates the surrounding environment from the impact on the temperature measurement. At the same time, it also ensures that the thermistor in the film temperature sensor is fixed during the entire fixing process. The key to squeeze the thermistor without crushing is to make the thermistor temperature measurement more accurate. The film behind the thermistor in the film temperature sensor is also in the slot. When a wedge 830 is inserted into the slot under the film tail 815, the film temperature sensor in the slot is completely fixed and pressed into an integrated structure. It is close and pressed into an integrated structure composed of insulating materials, including bakelite or plastic or ceramic.

The above technical solution replaced the glue with a new structure to protect the environment. It can also maintain the stability of temperature measurement in high temperature and humid environments, laying the foundation for further fully automatic production and solving the problem of curved surface temperature measurement. At the same time, the reaction speed of the thin film temperature sensor is greatly improved.

Although the present disclosure has been described with reference to several exemplary embodiments, it should be understood that the terminology used is illustrative and exemplary, and not restrictive. Since the present disclosure can be embodied in various forms without departing from the spirit or essence of the disclosure, it should be understood that the above-mentioned embodiments are not limited to any of the foregoing details, but should be broadly interpreted within the spirit and scope defined by the appended claims. , Therefore, all changes and modifications falling within the scope of the claims or their equivalents shall be covered by the appended claims.

Claims

A mounting structure for a thin-film temperature sensor, the thin-film temperature sensor having a thermistor and a lead, including:

The crimping structure is made of heat-insulating and insulating materials, and includes a close structure and a fixed structure for the temperature sensing surface of the thin film temperature sensor. The close structure is a flat or curved surface, and has a recess. Installation structure of temperature sensor;

The buckle structure includes a metal sheet and a metal buckle extending from the metal sheet or coupled to the metal sheet, the metal sheet has a temperature measuring surface in contact with the measured object, and the temperature measuring surface has an opening, The metal buckle is fastened to the pressing structure, presses the head of the thermistor of the thin film temperature sensor into the recessed position of the pressing structure, and presses the heat of the thin film temperature sensor. The head of the resistor is exposed from the opening of the temperature measuring surface, and is flush with or higher than the temperature measuring surface.
The mounting structure according to claim 1, wherein the thickness of the metal piece of the buckle structure is less than 4 mm and the temperature measurement surface is a flat surface or a curved surface that fits the surface of the measured object.
The mounting structure according to claim 1, wherein the heat insulation material comprises at least one of bakelite, plastic, glass fiber, ceramic, and silicone rubber.
The mounting structure according to claim 1, wherein the recess of the pressing structure is a closed hole, and the mounting structure further comprises a heat-insulating and insulating gasket disposed in the hole.
The temperature sensing device according to claim 1, wherein two sides of the pressing structure have grooves respectively, and the metal buckle passes through the grooves and is fastened to the pressing structure.
The mounting structure according to claim 1, wherein the pressing structure is a housing of a thermal fuse.
The mounting structure according to claim 1, wherein the thermistor is composed of a bare chip thermistor and a glass-sealed thermistor.
A temperature sensing device includes:

Thin film temperature sensor with thermistor and leads;

The crimping structure is made of heat-insulating and insulating materials, and includes a close structure and a fixed structure for the temperature sensing surface of the thin film temperature sensor. The close structure is a flat or curved surface, and has a recess. The fixed structure is used to fix the film. Installation structure of temperature sensor;

The buckle structure includes a metal sheet and a metal buckle extending from the metal sheet or coupled to the metal sheet, the metal sheet has a temperature measuring surface in contact with the measured object, and the metal buckle temperature measuring surface Having an opening in which a metal buckle is fastened to the pressing structure, pressing the head of the thermistor of the film temperature sensor into the recessed position of the pressing structure, and pressing the head of the thermistor of the film temperature sensor The part is exposed from the opening of the temperature measuring surface of the metal buckle, and is flush with or higher than the temperature measuring surface of the metal buckle.
The temperature sensing device according to claim 8, wherein two sides of the pressing structure have grooves respectively, and the metal buckle passes through the grooves and is fastened to the pressing structure.
A temperature sensing device includes:

A thin film temperature sensor with a thermistor and a lead, wherein the temperature measurement surface of the thin film temperature sensor is in contact with the measured object;

The temperature fuse structure includes a temperature fuse wrapped by an insulation structure and a terminal connected to the temperature fuse. The insulation structure of the temperature fuse has a hole. When the temperature fuse structure is pressed on a thin film temperature sensor, the head of the thermistor The part is exposed from the hole;

The fastening structure is pressed on the temperature fuse structure, and the fastening structure is coupled to the object to be measured, thereby pressing the temperature fuse structure and the thin film temperature sensor on the object to be measured.
The temperature sensing device according to claim 10, wherein an extension direction of the thin film temperature sensor is the same as or different from an extension direction of the temperature fuse structure.
The temperature sensing device according to claim 10, wherein an insulation structure of the temperature fuse structure is made of ceramic.
A temperature sensing device includes:

Thin film temperature sensor with thermistor and leads;

Mounting structure having a surface in contact with the object to be measured and a notch on the side, said surface having an opening, and when the thin film temperature sensor is inserted into the notch, the head of the thin film temperature sensor is exposed from the opening and the film is stuck The first half of the temperature sensor head film, a wedge inserted into the notch to hold the rear half of the film temperature sensor head film;

The fastening structure is coupled to the mounting structure, and the fastening structure is coupled to the object to be measured, so as to press the mounting structure with the film temperature sensor inserted on the object to be measured.
The temperature sensing device according to claim 13, wherein a bottom surface of the opening has a protrusion, and the thin film temperature sensor is directed toward the object to be measured.
The temperature sensing device according to claim 13, wherein a material of the mounting structure is an insulating material, including bakelite, plastic, or ceramic.