WO2020029964A1 - 光模块 - Google Patents

光模块 Download PDF

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Publication number
WO2020029964A1
WO2020029964A1 PCT/CN2019/099466 CN2019099466W WO2020029964A1 WO 2020029964 A1 WO2020029964 A1 WO 2020029964A1 CN 2019099466 W CN2019099466 W CN 2019099466W WO 2020029964 A1 WO2020029964 A1 WO 2020029964A1
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WO
WIPO (PCT)
Prior art keywords
protrusion
circuit board
region
optical module
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/099466
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English (en)
French (fr)
Inventor
郑龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to US16/567,884 priority Critical patent/US20200049873A1/en
Publication of WO2020029964A1 publication Critical patent/WO2020029964A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals

Definitions

  • Embodiments of the present disclosure relate to the field of optical modules, and in particular, to an optical module.
  • An optical module usually includes a housing and a circuit board disposed inside the housing. In order to facilitate users to understand the operating status of the optical module, an indicator light needs to be provided in the optical module.
  • Some embodiments of the present disclosure provide an optical module, which improves the security performance of the optical module.
  • some embodiments of the present disclosure are directed to an optical module including a housing, a circuit board, an indicator light, and a laser driving chip.
  • the circuit board is disposed inside the housing, and light emitted by the indicator light is transmitted To the outside of the housing, wherein the circuit board includes a first region, a second region, and a metal strip, and the metal strip closes the first region to isolate the first region and the second region
  • the first area is used to supply power to the indicator light, and the second area is electrically connected to the laser driving chip;
  • the housing includes a first portion, a second portion, and a protrusion, and the protrusion closes the housing. Said first part is to isolate said first part and said second part, and said protrusion is abutted with said metal strip.
  • An optical module includes a housing, a circuit board, an indicator light, and a laser driving chip.
  • the circuit board is disposed inside the housing, and light emitted by the indicator light is transmitted to the outside of the housing.
  • the circuit board includes a first area, a first Two areas and a metal bar, the metal bar encloses the first area to isolate the first area from the second area, the first area is used to supply power to the indicator light, and the second area is electrically connected to the laser driving chip;
  • the housing includes a first part, The second part and the protrusion, the protrusion closes the first part, so that the first part and the second part are separated, and the protrusion and the metal strip fit together.
  • FIG. 1 is a schematic structural diagram of an optical module according to some embodiments of the present disclosure.
  • FIG. 2 is a first schematic structural diagram of a circuit board according to some embodiments of the present disclosure
  • FIG. 3 is a second schematic structural diagram of a circuit board according to some embodiments of the present disclosure.
  • FIG. 4 is a third structural schematic diagram of a circuit board according to some embodiments of the present disclosure.
  • FIG. 5 is a fourth structural schematic diagram of a circuit board according to some embodiments of the present disclosure.
  • FIG. 6 is a schematic structural diagram of an upper case according to some embodiments of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a lower case according to some embodiments of the present disclosure.
  • FIG. 8 is a schematic structural diagram of an upper case and a circuit board according to some embodiments of the present disclosure.
  • a light-emitting component is provided inside the housing. One end of the light-emitting component is connected to the circuit board. The light-emitting component is controlled by the circuit board to emit light, and the other end of the light-emitting component extends to the light outlet on the housing so that the light outlet The indicator light is formed so that the circuit board communicates with the light outlet.
  • the circuit board is also provided with a laser driving chip, a gold finger and other components. During the working process of the laser driving chip and the gold finger, electromagnetic waves are generated. The electromagnetic waves can leak to the outside of the housing through the light outlet, resulting in the leaked electromagnetic waves on the optical module. Other electronic devices nearby cause interference, resulting in poor safety performance of the optical module.
  • FIG. 1 is a schematic structural diagram of an optical module according to some embodiments of the present disclosure.
  • the optical module includes a housing 11, a circuit board 12, an indicator light 13, and a laser driving chip 14.
  • the circuit board 12 is disposed inside the housing 11, and light emitted by the indicator light 13 propagates to the outside of the housing 11.
  • the case is made of a metal material, so that the case can isolate electromagnetic waves generated by a laser driving chip and other components in the circuit board.
  • circuit board In order to facilitate the understanding of the present application, the structures of the circuit board and the casing are respectively described in detail below.
  • the circuit board shown in some embodiments of the present disclosure includes a first area, a second area, and a metal bar.
  • the metal bar closes the first area to isolate the first area from the second area, and the first area is used to indicate an indicator light.
  • the second area is electrically connected with the laser driving chip.
  • the first region is located at an edge region of the circuit board, or may be located at a middle region of the circuit board.
  • the first region is located at an edge region of the circuit board, or may be located at a middle region of the circuit board.
  • FIG. 2 is a first schematic structural diagram of a circuit board according to some embodiments of the present disclosure.
  • the circuit board 12 includes a first region 121, a second region 122, and a metal bar 123.
  • the first region 121 is located at an edge region of the circuit board 12, and the metal strips 123 are respectively connected to the edge of the circuit board 12 end to end to close the first region 121.
  • the first area 121 is used to supply power to the indicator 13, and the second area 122 is electrically connected to the laser driving chip 14.
  • the first region 121 includes a top corner of the circuit board.
  • the metal strip 123 is L-shaped, one end of the metal strip 123 is connected to the left edge of the circuit board 12, and the other end of the metal strip 123 is connected to the lower edge of the circuit board 12 so that the metal strip 123 and the left side of the circuit board 12 A closed first area 121 is formed below the edge and to the left of the lower edge of the circuit board 12.
  • the metal strip 123 has other shapes, for example, the metal strip 123 may be arc-shaped, linear, or the like.
  • the shape of the metal bar 123 may be designed according to actual needs, which is not specifically limited in some embodiments of the present disclosure.
  • the laser driving chip 14 is used to control the light emission of the laser used in the optical module. During the operation of the driving chip 14, electromagnetic waves are generated.
  • the laser driving chip 14 is electrically connected to the second region 122 by soldering, or the laser driving chip 14 is electrically connected to the second region 122 by a wire.
  • a manner of electrically connecting the laser driving chip 14 and the second region 122 may be configured according to actual needs, and some embodiments of the present disclosure do not specifically limit this manner.
  • components such as an integrated circuit (IC) and a gold finger are provided in the second area 122.
  • IC integrated circuit
  • FIG. 3 is a second structural schematic diagram of a circuit board according to some embodiments of the present disclosure.
  • the indicator 13 is disposed in the first area 121.
  • One end of the light guide 15 receives the light emitted by the indicator 13, and the other end of the light guide 15 extends to the light outlet 11 of the housing.
  • the indicator light 13 is provided in the first area 121 by soldering, and the indicator light 13 is connected to the first area 121 through a wire, a flexible printed circuit (FPC), or the like.
  • FPC flexible printed circuit
  • the distance between one end of the light guide 15 and the indicator 13 is smaller than the first preset distance, so that the light guide 15 can receive the light emitted by the indicator 13.
  • the first preset distance may be 0.1 mm or the like.
  • the first preset distance is designed according to actual needs, and some embodiments of the present disclosure do not specifically limit this situation.
  • FIG. 4 is a third structural schematic diagram of a circuit board according to some embodiments of the present disclosure.
  • the indicator light 13 is located at the light exit of the housing 11, and the indicator light 13 is electrically connected to the first region 121 through the conductive connection member 16.
  • the conductive connecting member 16 is a wire, FPC, or the like.
  • the first region is located at an edge region of the circuit board, so that the light guide or the conductive connection member can extend to the light exit of the housing through the edge of the circuit board, and the light guide The component or the conductive connection does not need to cross the second area, so that the first area can be better closed.
  • FIG. 5 is a fourth structural schematic diagram of a circuit board according to some embodiments of the present disclosure.
  • the first region 121 is located in a middle region of the circuit board 12, and the metal bar 123 is a closed curve to close the first region 121.
  • the second area 122 is an area of the circuit board other than the first area 121 and the metal bar 123.
  • the second area 122 is electrically connected to the laser driving chip 14.
  • the metal strip 123 is other shapes, for example, the metal strip 123 is rectangular, circular, or irregularly shaped.
  • the shape of the metal bar 123 may be designed according to actual needs, and some embodiments of the present disclosure do not specifically limit this situation.
  • the housing shown in some embodiments of the present disclosure includes a first portion, a second portion, and a protrusion.
  • the protrusion closes the first portion to isolate the first portion and the second portion, and the protrusion is attached to the metal bar.
  • the shape of the protrusion is similar to or matched with the shape of the metal bar, so that the protrusion and the metal bar can fit together.
  • the casing includes an upper casing and a lower casing, and the upper casing and the lower casing are fastened to form a casing.
  • the upper case and the lower case are usually designed symmetrically so that the upper case and the lower case can be snapped together.
  • the protrusion includes a first protrusion and a second protrusion, the first protrusion is provided on the upper case, and the second protrusion is provided on the lower case.
  • the metal strip includes a first metal strip and a second metal strip. The first metal strip is disposed on an upper surface of the circuit board, and the second metal strip is disposed on a lower surface of the circuit board. The first protrusion and the first metal strip are bonded together. , The second protrusion is attached to the second metal bar.
  • the shapes of the first metal bar and the second metal bar are similar or match.
  • the first metal bar and the second metal bar are oppositely disposed in the circuit.
  • the first metal bar and the second metal bar run through the circuit board.
  • the shape of the first protrusion is similar to or matches the shape of the first metal bar, so that the first protrusion can be attached to the first metal bar.
  • the shape of the second protrusion and the shape of the second metal bar are similar or match, so that the second protrusion can be attached to the second metal bar.
  • FIG. 6 is a schematic structural diagram of an upper case according to some embodiments of the present disclosure. Referring to FIG. 6, a first protrusion 171 of the protrusions is disposed on the upper case 111.
  • the left side of the first protrusion 171 is a first portion
  • the right side of the first protrusion 171 is a second portion
  • the first protrusion 171 separates the first portion from the second portion.
  • the upper case shown in FIG. 6 is described with the first region of the circuit board located at an edge region of the circuit board.
  • the position and shape of the first protrusion 171 in the upper casing 111 are also adaptively changed, so that the first protrusion 171 and the first metal strip are bonded together.
  • FIG. 7 is a schematic structural diagram of a lower case according to some embodiments of the present disclosure. Referring to FIG. 7, a second protrusion 172 of the protrusions is disposed on the lower case 112.
  • the left side of the second protrusion 172 is the first portion
  • the right side of the second protrusion 172 is the second portion
  • the second protrusion 172 separates the first portion from the second portion.
  • a fourth protrusion 182 is provided on the lower casing 112.
  • a second notch 1821 is provided on the fourth protrusion 182, and the second notch 1821 is designed to allow the optical fiber in the circuit board 12 to pass through.
  • a third protrusion is provided on the upper casing 111, and a first notch is provided on the third protrusion.
  • the first notch is designed to allow the optical fiber in the circuit board 12 to pass through.
  • a gap is provided only on the fourth protrusion or the third protrusion, and a gap may also be provided on the fourth protrusion and the third protrusion at the same time.
  • the height of the fourth protrusion is greater than the height of the second protrusion, and The height difference is equal to the thickness of the circuit board. Since a circuit board needs to be provided between the first protrusion and the second protrusion, the circuit board is sandwiched between the first protrusion and the second protrusion. Therefore, through the above design, the first protrusion and the second protrusion can be improved.
  • the sealing performance of the cavity formed by the first protrusion, the third protrusion, the fourth protrusion, and the side of the housing can further prevent the electromagnetic waves generated by the components in the circuit board from leaking out.
  • the height of the second protrusion is the same as the height of the fourth protrusion
  • the height of the third protrusion is greater than the height of the first protrusion
  • the height difference between the third protrusion and the first protrusion is equal to the circuit The thickness of the board. Since a circuit board needs to be provided between the first protrusion and the second protrusion, the circuit board is sandwiched between the first protrusion and the second protrusion. Therefore, through the above design, the first protrusion and the second protrusion can be improved.
  • the sealing performance of the cavity formed by the first protrusion, the third protrusion, the fourth protrusion, and the side of the housing can further prevent the electromagnetic waves generated by the components in the circuit board from leaking out.
  • the optical module includes a housing, a circuit board, an indicator light, and a laser driving chip.
  • the circuit board is disposed inside the housing, and the light emitted by the indicator light can be transmitted to the outside of the housing.
  • the circuit board includes a first area, The second area and the metal bar, the metal bar encloses the first area to isolate the first area from the second area, the first area is used to supply power to the indicator light, and the second area is electrically connected to the laser driving chip;
  • the housing includes the first part , The second part and the protrusion, the protrusion closes the first part to isolate the first part from the second part, and the protrusion and the metal strip fit together.
  • the side wall, the protrusion and the metal strip of the housing can form two isolated cavities, so that the first area of the circuit board is located in one cavity and the second area of the circuit board is located in another A cavity to isolate the first area and the second area of the circuit board from each other, to prevent the second area from communicating with the light outlet on the housing, and thus to avoid components in the second area (such as laser driver chips, gold fingers, etc.)
  • the generated electromagnetic wave leaks to the outside of the casing through the light outlet on the casing, which prevents electromagnetic waves generated by components in the second area from causing interference to other nearby electronic devices, thereby improving the safety performance of the optical module.
  • FIG. 8 is a schematic structural diagram of an upper case and a circuit board according to some embodiments of the present disclosure.
  • the circuit board 12 is disposed in the upper case 111, and the circuit board 12 covers the first protrusions in the upper case 111, so that the first protrusions and the metal strip 123 on the lower side of the circuit board 12 fit together.
  • a third protrusion 181 is also provided inside the upper casing 111, and a first notch 1811 is provided on the third protrusion 181.
  • the optical fiber in the circuit board 12 can pass through the first notch 1811. .
  • the first protrusion 171 in the upper case 111 is attached to the first metal bar on the circuit board 12 side, and the second protrusion 172 in the lower case 112 It is bonded to the second metal bar on the other side of the circuit board 12, and the third protrusion 181 in the upper case 111 is bonded to the fourth protrusion 182 in the lower case 112.
  • the cavity formed by the first protrusion 171, the second protrusion 172, the third protrusion 181, the fourth protrusion 182 and the side surface of the casing 11 surrounds the second region of the circuit board 12.
  • the electromagnetic waves generated by the components in the middle cause interference to other nearby electronic equipment, thereby improving the safety performance of the optical module.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Lasers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

本公开一些实施例提供一种光模块，所述光模块包括：壳体、电路板、指示灯及激光器驱动芯片，所述电路板设置在所述壳体内部，所述指示灯发出的光传播至所述壳体外部，其中，所述电路板包括第一区域、第二区域和金属条，所述金属条封闭所述第一区域，以使所述第一区域和所述第二区域隔离，所述第一区域用于向所述指示灯供电，所述第二区域与所述激光器驱动芯片电连接；所述壳体包括第一部分、第二部分和凸起，所述凸起封闭所述第一部分，以使所述第一部分和所述第二部分隔离，所述凸起与所述金属条贴合。用于提高光模块的安全性能。

Description

光模块
本申请要求于2018年08月08日提交中国专利局、申请号为201810899205.6、申请名称为“光模块”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开实施例涉及光模块领域，尤其涉及一种光模块。
背景技术
光模块通常包括壳体和设置在壳体内部的电路板，为了便于用户了解光模块的运行状态，需要在光模块中设置指示灯。
发明内容
本公开一些实施例提供一种光模块，提高了光模块的安全性能。
第一方面，本公开一些实施例针对一种光模块，包括：壳体、电路板、指示灯及激光器驱动芯片，所述电路板设置在所述壳体内部，所述指示灯发出的光传播至所述壳体外部，其中，所述电路板包括第一区域、第二区域和金属条，所述金属条封闭所述第一区域，以使所述第一区域和所述第二区域隔离，所述第一区域用于向所述指示灯供电，所述第二区域与所述激光器驱动芯片电连接；所述壳体包括第一部分、第二部分和凸起，所述凸起封闭所述第一部分，以使所述第一部分和所述第二部分隔离，所述凸起与所述金属条贴合。
根据本公开一些实施例的光模块包括壳体、电路板、指示灯及激光器驱动芯片，电路板设置在壳体内部，指示灯发出的光传播至壳体外部，电路板包括第一区域、第二区域和金属条，金属条封闭第一区域，以使第一区域和第二区域隔离，第一区域用于向指示灯供电，第二区域与激光器驱动芯片电连接；壳体包括第一部分、第二部分和凸起，凸起封闭第一部分，以使第一部分和第二部分隔离，凸起与金属条贴合。
附图说明
为了更清楚地说明本公开一些实施例中的技术方案，下面将对一些实施例描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为根据本公开一些实施例的光模块的结构示意；
图2为根据本公开一些实施例的电路板的结构示意图一；
图3为根据本公开一些实施例的电路板的结构示意图二；
图4为根据本公开一些实施例的电路板的结构示意图三；
图5为根据本公开一些实施例的电路板的结构示意图四；
图6为根据本公开一些实施例的上壳体的结构示意图；
图7为根据本公开一些实施例的下壳体的结构示意图；
图8为根据本公开一些实施例的上壳体和电路板的结构示意图。
11：壳体；
12：电路板；
13：指示灯；
14：激光器驱动芯片；
15：导光件；
16：导电连接件；
111：上壳体；
112：下壳体；
121：第一区域；
122：第二区域；
123：金属条；
171：第一凸起；
172：第二凸起；
181：第三凸起；
182：第四凸起；
1811：第一缺口；
1821：第二缺口。
具体实施方式
为使本公开一些实施例的目的、技术方案和优点更加清楚，下面将结合本公开一些实施例中的附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的一些实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的一些实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
光模块中，在壳体内部设置有发光部件，发光部件的一端与电路板连接，由电路板中控制发光部件发光，发光部件的另一端延伸至壳体上的出光口，以在出光口处形成指示灯，使得电路板与出光口连通。在电路板中还设置有激光器驱动芯片、金手指等部件，在激光器驱动芯片、金手指等部件工作过程中会产生电磁波，电磁波可以通过出光口泄露至壳体外部，导致泄露的电磁波对光模块附近的其它电子设备造成干扰，导致光模块的安全性能差。
图1为根据本公开一些实施例的光模块的结构示意图。参见图1，光模块包括壳体11、电路板12、指示灯13和激光器驱动芯片14，电路板12设置在壳体11内部，指示灯13发出的光传播至壳体11外部。
可选的，壳体由金属材质制成，使得壳体可以隔离电路板中的激光器驱动芯片等部件产生的电磁波。
为了便于对本申请的理解，下面，分别对电路板和壳体的结构进行详细说明。
本公开一些实施例所示的电路板包括第一区域、第二区域和金属条，金属条封闭第一区域，以使第一区域和所述第二区域隔离，第一区域用于向指示灯供电，第二区域与所述 激光器驱动芯片电连接。
可选的，第一区域位于电路板的边缘区域，也可以位于电路板的中间区域。具体的，进一步地讨论请参见图2-图5所示的一些实施例。
图2为根据本公开一些实施例的电路板的结构示意图一。参见图2，电路板12包括第一区域121、第二区域122和金属条123。第一区域121位于电路板12的边缘区域，金属条123首尾分别与电路板12边缘连接，以封闭第一区域121。第一区域121用于向指示灯13供电，第二区域122与激光器驱动芯片14电连接。
可选的，第一区域121包括电路板的一个顶角。
参见图2，金属条123呈L形，金属条123的一端与电路板12左边缘连接，金属条123的另一端与电路板12的下边缘连接，以使金属条123、电路板12的左边缘下方、电路板12的下边缘左方围成一个封闭的第一区域121。
可选的，金属条123为其它形状，例如，金属条123可以为弧状、线状等。在实际场景中，可以根据实际需要设计金属条123的形状，本公开一些实施例对此不作具体限定。
激光器驱动芯片14用于控制用于光模块中的激光器发光。在驱动芯片14的工作过程中，产生电磁波。
可选的，激光器驱动芯片14通过焊接方式与第二区域122电连接，或者，激光器驱动芯片14通过导线与第二区域122电连接。在实际应用过程中，可以根据实际需要配置激光器驱动芯片14与第二区域122电连接的方式，本公开一些实施例对此方式不作具体限定。
可选的，在第二区域122中设置有集成电路(Integrated Circuit，简称IC)、金手指等部件。
下面，结合图3-图4的电路板的结构示意图，对第一区域121向指示灯13供电的方式进行详细说明。
图3为根据本公开一些实施例的电路板的结构示意图二。参见图3，指示灯13设置在第一区域121，导光件15的一端接收指示灯13发出的光，导光件15的另一端延伸至壳体的11出光口处。
可选的，指示灯13通过焊接方式设置在第一区域121，指示灯13通过导线、柔性电路板(Flexible Printed Circuit，简称FPC)等与第一区域121连接。
可选的，导光件15的一端与指示灯13的距离小于第一预设距离，以使导光件15可以接收到指示灯13发出的光。
可选的，第一预设距离可以为0.1毫米等。
当然，在实际应用过程中，根据实际需要设计第一预设距离，本公开一些实施例对此情况不作具体限定。
图4为根据本公开一些实施例的电路板的结构示意图三。参见图4，所述指示灯13位于壳体11的出光口处，指示灯13通过导电连接件16与第一区域121电连接。
可选的，导电连接件16为导线、FPC等。
在图3-图4所示的一些实施例中，第一区域位于电路板的边缘区域，可以使得导光件或者导电连接件通过电路板的边缘延伸至壳体的出光口处，且导光件或者导电连接件无需跨越第二区域，进而可以更好地封闭第一区域。
图5为根据本公开一些实施例的电路板的结构示意图四。参见图5，第一区域121位于电路板12的中间区域，金属条123呈闭合曲线，以封闭第一区域121。
参见图5，第二区域122为电路板中除第一区域121以及金属条123之外的区域，第二区域122与激光器驱动芯片14电连接。
可选的，金属条123为其它形状，例如，金属条123为矩形、圆形、不规则形状等。在实际应用过程中，可以根据实际需要设计金属条123的形状，本公开一些实施例对此情况不作具体限定。
本公开一些实施例所示的壳体包括第一部分、第二部分和凸起，凸起封闭第一部分，以使第一部分和第二部分隔离，凸起与金属条贴合。
可选的，凸起的形状与金属条的形状相似或者匹配，以使凸起和金属条可以贴合。
可选的，壳体包括上壳体和下壳体，上壳体和下壳体被扣合，以形成壳体。上壳体和下壳体通常对称设计，以使上壳体和下壳体可以扣合。相应的，凸起包括第一凸起和第二凸起，第一凸起设置在上壳体上，第二凸起设置在下壳体上。金属条包括第一金属条和第二金属条，第一金属条设置在电路板的上表面，第二金属条设置在电路板的下表面，其中，第一凸起和第一金属条贴合，第二凸起与第二金属条贴合。
可选的，第一金属条和第二金属条的形状相似或者匹配。
可选的，第一金属条和第二金属条在电路上中相对设置。
可选的，第一金属条和第二金属条贯穿电路板。
可选的，第一凸起的形状和第一金属条的形状相似或匹配，使得第一凸起可以和第一金属条贴合。
可选的，第二凸起的形状和第二金属条的形状相似或匹配，使得第二凸起可以和第二金属条贴合。
下面，结合图6-图7分别对上壳体和下壳体进行详细说明。
图6为根据本公开一些实施例的上壳体的结构示意图。参见图6，凸起中的第一凸起171设置在上壳体111上。
参见图6，在上壳体111中，第一凸起171的左侧为第一部分，第一凸起171的右侧为第二部分，第一凸起171将第一部分和第二部分隔离。
需要说明的是，图6所示的上壳体是以电路板的第一区域位于电路板的边缘区域位置进行说明。当第一区域位于电路板的中间区域时，上壳体111中第一凸起171的位置及形状也进行适应性改变，以使第一凸起171与第一金属条贴合。
图7为根据本公开一些实施例的下壳体的结构示意图。参见图7，凸起中的第二凸起172设置在下壳体112上。
参见图7，在下壳体112中，第二凸起172的左侧为第一部分，第二凸起172的右侧为第二部分，第二凸起172将第一部分和第二部分隔离。
可选的，下壳体112上设置有第四凸起182。
可选的，在第四凸起182上设置第二缺口1821，第二缺口1821设计为使电路板12中的光纤穿过。
相应的，上壳体111上设置有第三凸起，第三凸起上设置有第一缺口，第一缺口设计为使电路板12中的光纤穿过。
需要说明的是，在实际应用过程中，仅在第四凸起或者第三凸起上设置缺口，也可以在第四凸起和第三凸起上同时设置缺口，本公开一些实施例对此情况不作具体限定。
可选的，当上壳体中第一凸起的高度与第三凸起的高度相同时，第四凸起的高度大于第二凸起的高度，且第四凸起与第二凸起的高度差等于电路板的厚度。由于第一凸起和第二凸起之间需要设置电路板，电路板被夹在第一凸起和第二凸起之间，因此，通过上述设计，可以提高第一凸起、第二凸起、第三凸起、第四凸起和壳体的侧面形成的腔体的密封性能，进而可以更好的避免电路板中的部件产生的电磁波外泄。
可选的，当第二凸起的高度与第四凸起的高度相同时，第三凸起的高度大于第一凸起的高度，且第三凸起与第一凸起的高度差等于电路板的厚度。由于第一凸起和第二凸起之间需要设置电路板，电路板被夹在第一凸起和第二凸起之间，因此，通过上述设计，可以提高第一凸起、第二凸起、第三凸起、第四凸起和壳体的侧面形成的腔体的密封性能，进而可以更好的避免电路板中的部件产生的电磁波外泄。
需要说明的是，图7所示的上壳体是以电路板的第一区域位于电路板的边缘区域位置进行说明。当第一区域位于电路板的中间区域时，下壳体112中第二凸起172的位置及形状也进行相应改变，以使第二凸起172与第一金属条贴合。
根据本公开一些实施例的光模块包括壳体、电路板、指示灯及激光器驱动芯片，电路板设置在壳体内部，指示灯发出的光能够传播至壳体外部，电路板包括第一区域、第二区域和金属条，金属条封闭第一区域，以使第一区域和第二区域隔离，第一区域用于向指示灯供电，第二区域与激光器驱动芯片电连接；壳体包括第一部分、第二部分和凸起，凸起封闭第一部分，以使第一部分和第二部分隔离，凸起与金属条贴合。在凸起与金属条贴合时，壳体的侧壁、凸起以及金属条可以形成两个隔离的腔体，使得电路板的第一区域位于一个腔体，电路板的第二区域位于另一个腔体，使得电路板的第一区域和第二区域相互隔离，避免第二区域与壳体上的出光口连通，进而可以避免第二区域中的部件(例如激光器驱动芯片、金手指等)产生电磁波通过壳体上的出光口泄露至壳体外部，避免了第二区域中的部件产生的电磁波对附近其它电子设备造成干扰，进而提高了光模块的安全性能。
下面，参考图8所示实施例对电路板在上壳体中的设置方式进行说明。
图8为根据本公开一些实施例的上壳体和电路板的结构示意图。参见图8，电路板12设置在上壳体111中，电路板12覆盖上壳体111中的第一凸起，使得第一凸起与电路板12下侧的金属条123贴合。
上壳体111内部还设置有第三凸起181，第三凸起181上设置有第一缺口1811，电路板12中的光纤可以穿过第一缺口1811。。
在上壳体111和下壳体112扣合时，上壳体111中的第一凸起171与电路板12一侧的第一金属条贴合，下壳体112中的第二凸起172与电路板12另一侧的第二金属条贴合，上壳体111中的第三凸起181与下壳体112中的第四凸起182贴合。其中，第一凸起171、第二凸起172、第三凸起181、第四凸起182和壳体11的侧面形成的腔体包裹电路板12的第二区域。避免第二区域与壳体上的出光口连通，进而可以避免第二区域中的部件(例如激光器、金手指等)产生电磁波通过壳体上的出光口泄露至壳体外部，避免了第二区域中的部件产生的电磁波对附近其它电子设备造成干扰，进而提高了光模块的安全性能。
最后应说明的是：以上各实施例仅用以说明本公开一些实施例的技术方案，而非对其 限制；尽管参照前述各实施例对本公开一些实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开一些实施例方案的范围。

Claims (9)

  1. 一种光模块，包括：壳体、电路板、指示灯及激光器驱动芯片，
    所述壳体，包括第一部分、第二部分和凸起，所述凸起配置为封闭所述第一部分，以使所述第一部分和所述第二部分隔离；
    所述电路板，设置在所述壳体内部，包括用于向所述指示灯供电的第一区域、第二区域和金属条，所述第二区域配置为与激光器驱动芯片电连接，所述金属条配置为封闭所述第一区域，以使所述第一区域和所述第二区域隔离，并且所述金属条与所述凸起贴合；
    所述指示灯，配置为发出指示光。
  2. 根据权利要求1所述的光模块，所述第一区域位于所述电路板的中间区域，所述金属条呈闭合曲线，以封闭所述第一区域。
  3. 根据权利要求2所述的光模块，所述第一部分位于所述壳体的中间部分，所述凸起呈闭合曲线，以封闭所述第一部分。
  4. 根据权利要求1所述的光模块，所述第一区域位于所述电路板的边缘区域，所述金属条首尾分别与电路板边缘连接，以封闭所述第一区域。
  5. 根据权利要求1所述的光模块，所述壳体包括上壳体和下壳体，所述凸起包括第一凸起和第二凸起，所述第一凸起设置在所述上壳体上，所述第二凸起设置在所述下壳体上；所述金属条包括第一金属条和第二金属条，所述第一金属条设置在所述电路板的上表面，所述第二金属条设置在所述电路板的下表面，其中，
    所述第一凸起和所述第一金属条贴合，所述第二凸起与所述第二金属条贴合。
  6. 根据权利要求1所述的光模块，所述光模块还包括导光件，其中，
    所述指示灯设置在所述第一区域；
    所述导光件配置为一端接收所述指示灯发出的光，另一端延伸至所述壳体的出光口处。
  7. 根据权利要求1所述的光模块，所述指示灯，设置于所述壳体的出光口处，所述指示灯通过导电连接件与所述第一区域电连接。
  8. 根据权利要求1所述的光模块，所述凸起的形状与所述金属条的形状匹配。
  9. 根据权利要求8所述的光模块，所述第一区域包括所述电路板的一个顶角。
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