WO2020003873A1 - Joint body and production method for joint body - Google Patents

Joint body and production method for joint body Download PDF

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Publication number
WO2020003873A1
WO2020003873A1 PCT/JP2019/021429 JP2019021429W WO2020003873A1 WO 2020003873 A1 WO2020003873 A1 WO 2020003873A1 JP 2019021429 W JP2019021429 W JP 2019021429W WO 2020003873 A1 WO2020003873 A1 WO 2020003873A1
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WIPO (PCT)
Prior art keywords
carbon atoms
group
joined
joined body
bonding agent
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PCT/JP2019/021429
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French (fr)
Japanese (ja)
Inventor
明寛 昆野
村山 利美
浩幸 佐藤
Original Assignee
株式会社クレハ
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Publication of WO2020003873A1 publication Critical patent/WO2020003873A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

Definitions

  • the present invention relates to a conjugate and a method for producing the same, and more particularly, to a conjugate joined via a molecular bonding agent and a method for producing the same.
  • CFRP CFRP
  • a resin-based material such as CFRP is increasingly used in addition to a high-strength steel sheet (high-tensile steel) or a lightweight metal such as Al.
  • these cannot be sufficiently joined by conventional welding techniques.
  • Patent Literature 1 discloses a technique in which a ferroelectric material layer made of polyvinylidene fluoride resin and a metal layer are bonded using aminosilane as a primer.
  • Patent Document 2 discloses a technique for bonding polyvinylidene fluoride using an adhesive.
  • Patent Literature 1 and Patent Literature 2 have an insufficient peel strength of about 0.5 N / mm.
  • an adhesive when used, there is a problem that the selection of the adhesive is complicated and the thickness of the obtained structure is increased by the thickness of the adhesive layer.
  • the present invention has been made in view of the above problems, and an object thereof is to provide a bonded body having a high peel strength in which another bonded body is bonded to a vinylidene fluoride polymer, and a manufacturing method thereof. To provide.
  • the inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a very strong bonding can be realized by covalently bonding a molecular bonding agent having an NH 2 group to a vinylidene fluoride polymer.
  • the invention has been completed.
  • the present invention includes a molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component, and a joined body joined to the molded article, and the molded article
  • the bonding with the object is via a molecular bonding agent.
  • the molecular bonding agent is a compound having —NX 1 X 2 and an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and have a peel strength of greater than 0.6 N / mm between the molded body and the bonded body in a 90 ° peel test. is there.
  • the present invention includes a molecular bonding agent, one or both of a molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component and an object to be joined to the molded article.
  • surface treatment solution surface treated with, and after the surface treatment step includes a contact step of contacting the shaped body and the object to be bonded at 80 ° C. or higher, the molecular bonding agent, -NX 1 X 2 and a compound having an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. .
  • a bonded body having a high peel strength in which another bonded body is bonded to a vinylidene fluoride polymer, and a method for producing the same.
  • a molded body molded from a vinylidene fluoride polymer and a joined body joined to the molded body are joined via a molecular joining agent.
  • the molded article in the present embodiment is molded from a vinylidene fluoride polymer.
  • the vinylidene fluoride polymer in the present embodiment has a structural unit derived from vinylidene fluoride as a main component.
  • “being the main component” means that the content is 50 mol% or more.
  • the vinylidene fluoride polymer may be a homopolymer of vinylidene fluoride or a copolymer of vinylidene fluoride with a structural unit derived from a copolymerizable monomer.
  • monomers copolymerizable with vinylidene fluoride include fluorine-containing monomers, hydrocarbon monomers such as ethylene and propylene, acrylic monomers such as alkyl (meth) acrylate compounds and carboxy group-containing acrylate compounds, and maleic monomers.
  • examples include acids, unsaturated dibasic acid derivative monomers such as monomethyl maleate and dimethyl maleate, and carboxylic acid anhydride group-containing monomers.
  • fluorine-containing monomers are preferable from the viewpoint of weather resistance and chemical resistance.
  • the other monomers may be used alone or in combination of two or more.
  • fluorinated monomer examples include vinyl fluoride, trifluoroethylene, tetrafluoroethylene, chlorotrifluoroethylene, hexafluoropropylene, and perfluoroalkyl vinyl ether represented by perfluoromethyl vinyl ether.
  • Examples of the unsaturated dibasic acid derivative monomer include maleic acid, citraconic acid, monomethyl maleate, dimethyl maleate and monomethyl citraconic acid.
  • alkyl (meth) acrylate compound examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl (meth) acrylate, N-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, chloromethyl (meth) acrylate, 2-chloroethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2,3,4,5,6-pentahydroxyhexyl (meth) acrylate, 2,3,4,5-tetrahydroxypentyl (meth) acrylate, 2- (hydroxy Methyl) methyl acrylate and 2- (hydroxyethyl) methyl acrylate.
  • carboxy group-containing acrylate compound examples include (meth) acrylic acid, 2-carboxyethyl acrylate, (meth) acryloyloxypropyl succinic acid, (meth) acryloyloxyethyl succinic acid, 2-hydroxyethyl acrylate and hydroxypropyl acrylate. Is mentioned.
  • the inherent viscosity of the vinylidene fluoride polymer according to the present embodiment is not particularly limited, but is preferably in a range of 0.5 to 7.0 dL / g, and is preferably 0.7 to 5.0 dL / g. The value is more preferably in the range of g, and even more preferably in the range of 1.0 to 4.0 dL / g.
  • the inherent viscosity of the vinylidene fluoride polymer can be determined as the logarithmic viscosity at 30 ° C. of a solution obtained by dissolving 4 g of the resin in 1 liter of N, N-dimethylformamide.
  • the vinylidene fluoride polymer according to the present embodiment can be manufactured by, for example, suspension polymerization, emulsion polymerization, or the like.
  • the molded article molded from the vinylidene fluoride polymer according to the present embodiment may be prepared by injection molding, press molding, calender molding, extrusion molding, or melting in the same manner as in the production of a molded article of ordinary vinylidene fluoride polymer. It can be manufactured by a known method such as spinning. Further, the production method can be selected according to the desired form of the molded body.
  • the form of the molded body is not particularly limited, and examples thereof include a plate, a rod, a sphere, a hemisphere, a fiber, a powder, a cloth, a net, a film, a sheet, and a laminate.
  • the surface of the molded body is bonded to the body to be bonded by covalently bonding a molecular bonding agent to the surface. Therefore, from the viewpoint of the airtightness and design of the joined body, it is preferable that the surface is smooth. However, if the surface of the joined body is smooth, the surface may be rough.
  • the article to be joined in this embodiment is joined to the molded body via a molecular joining agent.
  • Examples of the member to be joined include metal materials (including alloys), various resins, ceramic materials, and composite materials thereof, and are preferably formed from resin or metal.
  • metal material examples include various metals and alloys thereof.
  • metals include Be, Mg, Ca, Sr, Ba, Ra, Sc, Y, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Rh, Ir, and Ni.
  • Pd, Pt Cu, Ag, Au, Zn, Cd, Hg, Al, Ge, Sn, Pb, Sb, Bi and Nd.
  • the resin examples include a thermoplastic resin, a thermosetting resin, a fiber reinforced plastic, a photocurable resin, a vulcanized rubber, and an uncrosslinked rubber.
  • examples thereof include olefin polymers such as polyethylene, polypropylene, ethylene-propylene polymer, or poly (4-methyl-1-pentene); halogen-containing polymers such as vinyl chloride or chlorinated vinyl resin; Acrylic polymers such as polymethyl methacrylate; styrene polymers such as polystyrene, styrene-methyl methacrylate copolymer, styrene-acrylonitrile copolymer, or acrylonitrile-butadiene-styrene block copolymer; polyethylene terephthalate, poly Polyester such as butylene terephthalate or polyethylene naphthalate; polyamide such as nylon 6, nylon 66 or nylon 610; polyacetal; polycarbonate; polyphenylene oxide; Polyimide (PPS);
  • the ceramic material examples include porcelain (such as kaolin, frog-eye clay, pottery stone, feldspar, quartzite, quartz, or alumina), glass, cement, gypsum, and enamel. From the viewpoint of composition, oxides, zirconia, hydroxides, carbides, carbonates, nitrides, halides, phosphates, and the like can be given.
  • the form of the joined body is not particularly limited, and examples thereof include a plate, a rod, a sphere, a hemisphere, a fiber, a powder, a cloth, a net, a film, a sheet, and a laminate.
  • the surface of the joined body is preferably a smooth surface, but may be a rough surface if the molded body is a smooth surface.
  • the molecular bonding agent in the present embodiment is a compound that bonds a molded body molded from a vinylidene fluoride polymer and a body to be bonded.
  • the molecular bonding agent according to the present embodiment has —NX 1 X 2 and an alkoxysilyl group or a silanol group.
  • X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.
  • X 1 is preferably a hydrogen atom.
  • the number of carbon atoms in the alkoxy moiety of the alkoxysilyl group is not particularly limited, but is preferably 1 to 5 carbon atoms.
  • the molecular bonding agent in the present embodiment is preferably a compound represented by the following general formula (I).
  • R 1 represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms, represented by C 1-5 aminoalkyl groups or the following general formula carbons (II)
  • R 2 is C 1 -
  • R 3 to R 5 are each independently a hydroxy group, an alkoxy group having 1 to 5 carbon atoms or an alkyl group having 1 to 5 carbon atoms, and at least one of R 3 to R 5 One is a hydroxy group or an alkoxy group having 1 to 5 carbon atoms.
  • R 6 is an alkylene group having 1 to 10 carbon atoms
  • R 7 is —NH—R 8 —NH 2 or —NR 9 R 10
  • R 8 has 1 to 10 carbon atoms
  • R 9 and R 10 are each independently an alkyl group having 1 to 5 carbon atoms.
  • the symbol * represents a bonding site to the nitrogen atom to which R 1 in the formula (I) is bonded.
  • R 1 is preferably a hydrogen atom, an aminoalkyl group having 1 to 3 carbon atoms or a group represented by the general formula (II), and is preferably a hydrogen atom or a group represented by the general formula (II). More preferably, it is more preferably a group represented by the general formula (II).
  • R 2 is preferably an alkylene group having 1 to 8 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and further preferably an alkylene group having 2 to 5 carbon atoms. .
  • R 3 to R 5 are preferably a hydroxy group or an alkoxy group having 1 to 4 carbon atoms, and more preferably an alkoxy group having 1 to 3 carbon atoms.
  • R 6 is preferably an alkylene group having 1 to 8 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and further preferably an alkylene group having 1 to 3 carbon atoms. .
  • R 7 is preferably —NH—R 8 —NH 2 .
  • R 8 is preferably an alkylene group having 1 to 8 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and more preferably an alkylene group having 1 to 3 carbon atoms. More preferably, it is particularly preferably an alkylene group having 1 to 2 carbon atoms.
  • More preferred molecular bonding agents are those wherein R 1 is represented by the general formula (II), R 2 is an alkylene group having 1 to 5 carbon atoms, and R 3 to R 5 are an alkoxy group having 1 to 3 carbon atoms; A compound in which R 6 is an alkylene group having 1 to 3 carbon atoms, R 7 is —NH—R 8 —NH 2 , and R 8 is an alkylene group having 1 to 3 carbon atoms.
  • the most preferred molecular conjugating agent is N, N'-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine (hereinafter, referred to as N, N'-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine).
  • N, N'-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine (hereinafter, referred to as N, N'-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine).
  • A-TES N, N'-bis (2-aminoethyl) -6- (3-
  • R 1 may be a hydrogen atom or an aminoalkyl group having 1 to 5 carbon atoms
  • R 2 may be an alkylene group having 1 to 10 carbon atoms
  • R 3 to R 5 May be an alkoxy group having 1 to 5 carbon atoms.
  • a molded body and a joined body are joined via a molecular joining agent.
  • the distance between the molded body and the object to be bonded is extremely small and substantially directly in contact with each other. More specifically, the molded body is covalently bonded to the molecular bonding agent, and the body to be bonded is covalently bonded to the molecular bonding agent.
  • the molded article and the molecular bonding agent are covalently bonded to each other at —NX 1 X 2 of the molecular bonding agent.
  • the covalent bond between the bonded object and the molecular bonding agent is different depending on whether the surface of the bonded object is a metal or ceramic or a resin.
  • the molecular bonding agent covalently bonds to the metal or ceramic at the alkoxysilyl group or silanol group of the molecular bonding agent.
  • the bonded object is covalently bonded to a molecular bonding agent that is (or is) covalently bonded to the molded body.
  • the molded body and the joined body are joined.
  • the molecular bonding agent and the joined body are different from each other in -NX 1 X 2 of the molecular joining agent. Covalently bond. Then, the molded article and the article to be joined are joined by condensation of alkoxysilyl groups or silanol groups of the molecular joining agent covalently bonded to both.
  • each molecular bonding agent there may be a plurality of alkoxy groups or hydroxy groups in the alkoxysilyl group or silanol group, and it is sufficient that at least one of these groups is condensed.
  • an example of the molecular bonding agent when one is condensed is shown in the following general formula (III). In the formula (III), R 1 to R 4 are the same as those described for the general formula (I) shown above.
  • the object to be bonded may be covalently bonded to the molecular bonding agent that is (or is) bonded to the molded body.
  • the molecular bonding is performed by performing a pre-treatment for binding the molecular bonding agent to the object, which will be described later.
  • the bonding agent and the object to be bonded are covalently bonded at the alkoxysilyl group or silanol group of the molecular bonding agent.
  • the bonded body according to the present embodiment is bonding via a molecular bonding agent, whereby the distance between the molded body and the body to be bonded is within the range of one to several molecular bonding agents. Can be. Therefore, the distance between the molded object and the object to be joined may be 0.1 ⁇ m or less, may be 0.05 ⁇ m or less, and may be 10 nm or less. As described above, in the joined body according to the present embodiment, the distance between the molded body and the joined body is extremely small, and the joined body is substantially directly in contact with and joined. Therefore, stress, heat, and the like are transmitted without interruption at the joining surface between the molded body and the joined body. Thereby, it is possible to impart new physical properties to the joined body according to the present embodiment. Further, non-covalent bonding occurs between the molded body and the joined body, and the joining between the molded body and the joined body is further strengthened.
  • the joining between the molded body and the joined body is very strong, and the molded body and the joined body are separated from each other by the 90 ° peel test at room temperature.
  • the strength is greater than 0.6 N / mm.
  • the 90 ° C. peeling test is based on JIS @ K6584-1. The larger the peel strength is, the better.
  • the bonded body according to the present embodiment may be 0.7 N / mm or more, may be 1.0 N / mm or more, and may be 2.0 N / mm or more.
  • the molded article and the article to be joined in the present embodiment are bonded by a covalent bond via a molecular joining agent. For this reason, stronger bonding is enabled as compared with bonding using a conventional adhesive utilizing non-bonding force such as hydrogen bonding. Therefore, even if the contact area is small, for example, the contact surface is smooth, a strong connection is possible. Further, unlike the adhesive, the bonded portion does not deteriorate even under severe environments such as high temperature and high pressure. Therefore, high joining reliability can be obtained.
  • a material having a smooth surface and a thickness sufficient to absorb the surface roughness is sandwiched between the materials, and the materials are brought into contact by pressing or melting.
  • materials having rough surfaces can be joined.
  • the material whose surface is smooth and has a thickness capable of absorbing the surface roughness may be any of resin, metal, and ceramic, but is preferably resin from the viewpoint of contacting the rough surface.
  • the object to be joined in the present embodiment can be made of various materials as listed above, but the object to be joined can be any material by covalently bonding the molecular joining agent as described above. Can be bonded to the molded body in the same manner. Also, the bonding is strong.
  • the method for manufacturing a joined body according to this embodiment includes a surface treatment in which one or both of the above-described molded body and the joined body are subjected to a surface treatment using a solution containing a molecular joining agent (hereinafter, also referred to as a molecular joining agent solution). And a contact step of contacting the molded body and the object to be joined at 80 ° C. or higher after the surface treatment step.
  • a molecular joining agent solution hereinafter, also referred to as a molecular joining agent solution
  • the surface treatment step in the method for manufacturing a joined body according to the present embodiment is a step of subjecting one or both of the molded body and the joined body to a surface treatment using a molecular bonding agent solution.
  • the molded body and the joined body are collectively referred to as “joining material”.
  • the surface treatment step according to the present embodiment includes an immersion treatment of immersing the bonding material in a molecular bonding agent solution.
  • the content of the molecular bonding agent in the solution is preferably at most 1 wt%, more preferably at most 0.5 wt%, even more preferably at most 0.1 wt%.
  • the solvent of the molecular bonding agent solution is preferably water, but may be, for example, an alcohol solvent such as ethanol, an ether solvent, a ketone solvent or a mixed solvent thereof.
  • 10 10 seconds is sufficient for the immersion time, but it is preferably 30 seconds or more, and more preferably 60 seconds or more.
  • the joining material is not limited to the immersion treatment, and the solution to be joined may be directly applied to only the portion to be joined, or a sprayer or the like, since the portion to be joined only needs to be treated with the solution of the molecular bonding agent. May be used to spray the solution.
  • any one of the molded body and the object to be joined may be subjected to surface treatment, but from the viewpoint of covalently bonding more joining agent to the surface of the joining material, It is preferable to subject the object to be surface-treated.
  • the article to be joined is a resin having reactivity with —NX 1 X 2 such as a vinylidene fluoride polymer
  • a resin having reactivity with -NX 1 X 2 such as a vinylidene fluoride polymer is covalently bonded to -NX 1 X 2 of the molecular bonding agent.
  • the molded article and the article to be joined are joined by condensing the alkoxysilyl groups or silanol groups of the molecular joining agent covalently bonded to both.
  • the surface treatment step may include other treatments in addition to the immersion treatment described above.
  • a method of bonding a compound having both a functional group that binds to the bond and a functional group that binds to the molecular bonding agent to the surface of the bond is used. More specifically, it is preferable to bond a compound having an azide group and an alkoxysilyl group or a silanol group.
  • Examples of such a compound include those represented by the following general formula (IV).
  • R 11 is an alkylene group having 1 to 10 carbon atoms
  • R 12 to R 14 are each independently a hydroxy group, an alkoxy group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms.
  • An alkyl group, at least one of R 12 to R 14 is a hydroxy group or an alkoxy group having 1 to 5 carbon atoms
  • R 15 is an azide group or an alkyl group having 1 to 10 carbon atoms.
  • R 11 is preferably an alkylene group having 1 to 5 carbon atoms, and more preferably an alkylene group having 2 to 4 carbon atoms.
  • R 12 to R 14 are preferably a hydroxy group or an alkoxy group having 1 to 4 carbon atoms, and more preferably an alkoxy group having 1 to 3 carbon atoms.
  • the most preferred compound is 6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-dithiol (hereinafter, P-TES).
  • the method for bonding such a compound to the surface of the object is not particularly limited.
  • a method in which the object is immersed in a solution containing the compound and a radical generation reaction is performed by irradiation with ultraviolet light is exemplified.
  • the solution containing the compound of the formula (IV) may contain a molecular bonding agent in advance.
  • a step of immersing the compound of the formula (IV) in a molecular bonding agent solution after the treatment with the compound and the ultraviolet irradiation, or a molecular bonding The step of applying the agent solution can be omitted.
  • the contacting step in the method for manufacturing a joined body according to the present embodiment is a step of bringing the joining materials into contact at 80 ° C. or higher after the surface treatment step.
  • Examples of the contacting method include, but are not limited to, a pressing method, and a method of performing injection molding after inserting a processing substrate.
  • the temperature at which the contact is performed is 80 ° C. or higher, and a more preferable temperature is mp ⁇ 50 ° C. or higher and mp + 50 ° C. or lower, where mp is the higher of the melting points of the bonding materials. It is -30 ° C or more and mp + 30 ° C or less. Thereby, it is possible to join the joining materials close to a distance at which they can react with each other.
  • the more preferable contact temperature is sp-50 ° C or more and sp + 50 ° C or less, and further preferably sp-30 ° C or more and sp + 30 ° C or less.
  • the “softening point” in the present specification refers to a workable temperature at which the amorphous resin can flow and deform.
  • the joining materials can be joined at a shorter distance.
  • a vinylidene fluoride polymer can be partially substituted with an amino group by reacting with an amine. Therefore, some molecular bonding agents may bond to the molded body without going through the contacting step.
  • a covalent bond with a molded body is formed in many molecular bonding agents. As a result, it is possible to obtain a bonded body that is very strongly bonded.
  • the present invention includes the following.
  • the bonding is through a molecular bonding agent, and the molecular bonding agent is a compound having —NX 1 X 2 and an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently A joined body, which is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and has a peel strength of greater than 0.6 N / mm between the molded body and the joined body in a 90 ° peel test.
  • the object to be joined is formed of resin or metal.
  • X 1 is preferably a hydrogen atom.
  • the molecular bonding agent is preferably a compound represented by the following general formula (I).
  • R 1 is represented by a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an aminoalkyl group having 1 to 5 carbon atoms or the following general formula (II), and R 2 is an alkylene having 1 to 10 carbon atoms.
  • R 3 to R 5 are each independently a hydroxy group, an alkoxy group having 1 to 5 carbon atoms or an alkyl group having 1 to 5 carbon atoms, and at least one of R 3 to R 5 is a hydroxy group Or an alkoxy group having 1 to 5 carbon atoms, R 6 is an alkylene group having 1 to 5 carbon atoms, R 7 is —NH—R 8 —NH 2 or —NR 9 R 10 , and R 8 Is an alkylene group having 1 to 5 carbon atoms, and R 9 and R 10 are each independently an alkyl group having 1 to 5 carbon atoms.
  • an asterisk (*) indicates a bonding site to the nitrogen atom to which R 1 in the formula (I) is bonded.
  • R 1 is preferably represented by the general formula (II).
  • the molecular bonding agent is —NN′-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine. Is preferred.
  • the R 1 is a hydrogen atom.
  • the distance between the molded body and the object to be joined is 0.1 ⁇ m or less.
  • a surface on which one or both of a molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component and an object to be joined to the molded article are subjected to surface treatment using a molecular bonding agent solution
  • the method includes a contact step of contacting the molded body and the article to be joined at 80 ° C.
  • the molecular joining agent comprises —NX 1 X 2 , and an alkoxysilyl group or A method for producing a conjugate, which is a compound having a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.
  • the surface treatment step it is preferable to perform a surface treatment on both the molded body and the joined body.
  • the method further includes, before the surface treatment step, a treatment for binding the molecular bonding agent to the object.
  • the contacting step is preferably a pressing step.
  • the contacting step is a step of injection molding.
  • the content of the molecular bonding agent in the solution is preferably 1 wt% or less.
  • PVDF bonded body A polyvinylidene fluoride (PVDF) film (# 1000, manufactured by Kureha Corporation) having a width of 25 mm, a length of 60 mm and a thickness of 79 ⁇ m was ultrasonically washed with ethanol for 10 minutes. After drying, a corona treatment was performed using a table type surface treatment device (manufactured by Kasuga Electric Co., Ltd.) under the conditions of an output power of 150 W, a gap length of 2 mm, a moving speed of 4 m / min, and a moving frequency of 4 times. Thereafter, the sample was immersed in a 0.1 wt% A-TES aqueous solution (manufactured by Io Chemical Laboratory Co., Ltd.) to obtain a sample A-1.
  • PVDF polyvinylidene fluoride
  • PV A 25 mm wide, 60 mm long, 1 mm thick PVDF sheet (# 2300, manufactured by Kureha Corporation) was ultrasonically washed with ethanol for 10 minutes to obtain a sample B-1.
  • a polyimide tape was attached to the upper end of the treated surface of sample B-1, and sample A-1 was placed thereon with the A-TES treated surface inside, and placed at 135 ° C., 2 MPa
  • AYSR-5 manufactured by Shindo Metal Industry Co., Ltd.
  • Example 2 A PPS plate (1130TX1, manufactured by Polyplastics) having a width of 30 mm, a length of 50 mm, and a thickness of 3 mm was ultrasonically cleaned with acetone for 10 minutes. After drying, the resultant was dipped in a 0.1 wt% P-TES ethanol solution (manufactured by Io Chemical Laboratory Co., Ltd.) and dried. After drying, UV irradiation was performed under the condition that the integrated light amount was 200 mJ / cm 2 . After UV irradiation, the sample was ultrasonically washed with ethanol, dipped again in a P-TES ethanol solution, irradiated with UV, ethanol ultrasonically washed, and the sample was dried. Thereafter, the sample was immersed in a 0.1 wt% A-TES aqueous solution to obtain a sample A-2.
  • P-TES ethanol solution manufactured by Io Chemical Laboratory Co., Ltd.
  • PV A 30 mm wide, 50 mm long, 79 ⁇ m thick PVDF film (# 1000, manufactured by Kureha Corporation) was ultrasonically washed with ethanol for 10 minutes to obtain a sample B-2.
  • Example 2 Same as Example 1 except that a polyimide tape was stuck on the upper end of the treated surface of sample A-2, and sample B-2 was placed thereon, and the temperature was set to 180 ° C. in order to obtain a handle portion during the peeling test. To obtain a bonded body of a PVDF film and a PPS plate.
  • Example 3 The same processing as in Example 2 was performed except that the PPS plate was changed to a PEEK plate (450 G, manufactured by Victrex), and a sample A-3 was obtained instead of the sample A-2. Next, the same process as in Example 2 was performed except that Sample A-2 was changed to Sample A-3, to obtain a joined body of the PVDF film and the PEEK plate.
  • Example 4 A sample A-4 was obtained in place of the sample A-2, except that the PPS plate was changed to a 9T polyamide plate (Kuraray Co., Genestar TA-112). Next, the same process as in Example 2 was performed except that Sample A-2 was changed to Sample A-4, to obtain a joined body of a PVDF film and a 9T polyamide plate.
  • Example 5 A steel plate (SPCC, manufactured by Testpiece Co., Ltd.) having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm was ultrasonically cleaned with acetone for 10 minutes. After drying, it was immersed in a 0.1 wt% A-TES aqueous solution to obtain a sample A-5.
  • SPCC manufactured by Testpiece Co., Ltd.
  • PV A 25 mm wide, 100 mm long and 79 ⁇ m thick PVDF film (# 1000, manufactured by Kureha Corporation) was ultrasonically washed with ethanol for 10 minutes to obtain a sample B-3.
  • Example 2 Same as Example 1 except that a polyimide tape was attached to the upper end of the treated surface of sample A-5, and sample B-3 was placed thereon, and the temperature was set to 180 ° C. in order to obtain a handle portion during the peeling test. To obtain a bonded body of a PVDF film and a steel sheet.
  • Example 6 A sample A-6 was obtained in place of the sample A-5, except that the steel plate was a ceramic plate having a thickness of 1.0 mm (alumina ceramics manufactured by Testpiece Co., Ltd.). . Next, the same process as in Example 5 was performed except that Sample A-5 was changed to Sample A-6, to obtain a joined body of the PVDF film and the ceramics plate.
  • Example 7 An aluminum plate (A5052P, manufactured by Testpiece Co., Ltd.) having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm was ultrasonically cleaned with acetone for 10 minutes. After drying, it was immersed in a 5 wt% aqueous solution of SK-144 (manufactured by JCU Corporation) at 70 ° C. for 1 minute, and then ultrasonically washed with ion-exchanged water for 3 minutes. After drying, the sample was immersed in a 0.1 wt% A-TES aqueous solution to obtain a sample A-7.
  • SK-144 manufactured by Testpiece Co., Ltd.
  • Example 5 (4) The same processing as in Example 5 was performed to obtain a sample B-3.
  • Example 2 Same as Example 1 except that a polyimide tape was attached to the upper end of the treated surface of sample A-7, and sample B-3 was placed thereon, and the temperature was set to 180 ° C. in order to obtain a handle portion during the peeling test. To obtain a bonded body of a PVDF film and an Al plate.
  • Example 8 The same treatment as in Example 7 was performed, except that the A-TES aqueous solution was changed to an aqueous solution of 3-aminoprolyltriethoxysilane (hereinafter, APS, manufactured by Tokyo Chemical Industry Co., Ltd.). 8 was obtained. Next, the same process as in Example 7 was performed except that Sample A-7 was changed to Sample A-8, to obtain a joined body of the PVDF film and the Al plate.
  • APS 3-aminoprolyltriethoxysilane
  • Example 9 In this example, unlike Example 8, a treatment using a molecular bonding agent was performed on a PVDF film instead of an Al plate.
  • a polyimide tape was attached to the upper end of the treated surface of sample A-9, sample B-4 was placed thereon, and hot press molding was performed as in Example 7, and a PVDF film was formed. And an Al plate were obtained.
  • Example 5 (4) The same processing as in Example 5 was performed to obtain a sample B-3.
  • a polyimide tape was attached to the upper end of sample A-10, and sample B-3 was placed thereon, and hot pressed at 180 ° C., 2 MPa, and 5 minutes. Was peeled off, and a joined body of the PVDF film and the Al plate could not be obtained.

Abstract

Provided are: a joint body that has a high peel strength when being bonded to another joint body through a vinylidene fluoride polymer; and a production method for the joint body. This joint body comprises: a molded article that is molded from a vinylidene fluoride polymer containing, as a main component, a vinylidene fluoride-derived constituent unit; and a joining partner body that is joined to the molded article, wherein the molded article and the joining partner body are joined together using a molecular bonding agent, the molecular bonding agent is a compound having -NX1X2 and an alkoxysilyl group or silanol group, where X1 and X2 each independently represent a hydrogen atom or an alkyl group having 1-5 carbon atoms, and the peel strength between the molded article and the joining partner body as measured by a 90° peel test is greater than 0.6 N/mm.

Description

接合体および接合体の製造方法Joint and method of manufacturing joint
 本発明は接合体およびその製造方法に関し、より詳細には分子接合剤を介して接合している接合体およびその製造方法に関する。 The present invention relates to a conjugate and a method for producing the same, and more particularly, to a conjugate joined via a molecular bonding agent and a method for producing the same.
 近年、特に自動車分野において、製品の軽量化またはその構造の複雑化のために、マルチマテリアル化が進められている。製品の材料としては、高張力鋼板(ハイテン鋼)またはAlなどの軽量金属に加え、CFRPなどの樹脂系材料が採用されることが増えている。しかし、従来の溶接技術ではこれらを十分に接合することはできない。 In recent years, especially in the field of automobiles, the use of multi-materials has been promoted in order to reduce the weight of products or to complicate their structures. As a material of a product, a resin-based material such as CFRP is increasingly used in addition to a high-strength steel sheet (high-tensile steel) or a lightweight metal such as Al. However, these cannot be sufficiently joined by conventional welding techniques.
 これに対し、各種接着工法の検討が行われている。例えば、特許文献1では、ポリフッ化ビニリデン系樹脂からなる強誘電性材料層と金属層とをアミノシランをプライマーとして接着する技術が開示されている。また、特許文献2では、接着剤を用いてポリフッ化ビニリデンを接着する技術が開示されている。 に 対 し In response, various bonding methods are being studied. For example, Patent Literature 1 discloses a technique in which a ferroelectric material layer made of polyvinylidene fluoride resin and a metal layer are bonded using aminosilane as a primer. Patent Document 2 discloses a technique for bonding polyvinylidene fluoride using an adhesive.
日本国公開特許公報 特開2006-299007Japanese Patent Laid-open Publication No. 2006-299007 日本国公開特許公報 特開2012-056975Japanese Patent Laid-Open Publication No. 2012-056975
 しかしながら、特許文献1および特許文献2何れに記載の技術でも、剥離強度が0.5N/mm程度と不十分である。また、接着剤を用いる場合に、接着剤の選定が煩雑であったり、得られる構造体の厚みが接着剤層の分だけ厚くなってしまったりするという課題を有する。 However, none of the techniques described in Patent Literature 1 and Patent Literature 2 has an insufficient peel strength of about 0.5 N / mm. In addition, when an adhesive is used, there is a problem that the selection of the adhesive is complicated and the thickness of the obtained structure is increased by the thickness of the adhesive layer.
 そこで、本発明は上記の問題点に鑑みてなされたものであり、その目的は、フッ化ビニリデン重合体に対して他の接合体を接合させた剥離強度の高い接合体、およびその製造方法を提供することにある。 Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a bonded body having a high peel strength in which another bonded body is bonded to a vinylidene fluoride polymer, and a manufacturing method thereof. To provide.
 発明者らは上記課題を解決するために鋭意検討した結果、フッ化ビニリデン重合体に対してNH基を有する分子接合剤を共有結合させることで非常に強固な接合を実現できることを見出し、本発明を完成させるに至った。 The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a very strong bonding can be realized by covalently bonding a molecular bonding agent having an NH 2 group to a vinylidene fluoride polymer. The invention has been completed.
 すなわち、本発明は、フッ化ビニリデン由来の構成単位を主成分とするフッ化ビニリデン重合体から成形された成形体と、上記成形体に接合された被接合体と、を備え、上記成形体と上記被接合体との接合は、分子接合剤を介したものであり、上記分子接合剤は、-NX、およびアルコキシシリル基またはシラノール基を有する化合物であり、ここでXおよびXは、それぞれ独立に、水素原子または炭素数1~5のアルキル基であり、90°剥離試験による上記成形体と上記被接合体との剥離強度が0.6N/mmより大きい、接合体である。 That is, the present invention includes a molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component, and a joined body joined to the molded article, and the molded article The bonding with the object is via a molecular bonding agent. The molecular bonding agent is a compound having —NX 1 X 2 and an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and have a peel strength of greater than 0.6 N / mm between the molded body and the bonded body in a 90 ° peel test. is there.
 また、本発明は、フッ化ビニリデン由来の構成単位を主成分とするフッ化ビニリデン重合体から成形された成形体および上記成形体に接合させる被接合体の一方または両方を、分子接合剤を含む溶液を用いて表面処理する表面処理工程、および上記表面処理工程後、上記成形体と上記被接合体とを80℃以上で当接させる当接工程を含み、上記分子接合剤は、-NX、およびアルコキシシリル基またはシラノール基を有する化合物であり、ここでXおよびXは、それぞれ独立に、水素原子または炭素数1~5のアルキル基である、接合体の製造方法である。 Further, the present invention includes a molecular bonding agent, one or both of a molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component and an object to be joined to the molded article. surface treatment solution surface treated with, and after the surface treatment step includes a contact step of contacting the shaped body and the object to be bonded at 80 ° C. or higher, the molecular bonding agent, -NX 1 X 2 and a compound having an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. .
 本発明によれば、フッ化ビニリデン重合体に対して他の接合体を接合させた剥離強度の高い接合体およびその製造方法を提供することができる。 According to the present invention, it is possible to provide a bonded body having a high peel strength in which another bonded body is bonded to a vinylidene fluoride polymer, and a method for producing the same.
 <接合体>
 本実施形態に係る接合体は、フッ化ビニリデン重合体から成形された成形体と、成形体に接合された被接合体とが、分子接合剤を介して接合しているものである。
<Joint body>
In the joined body according to the present embodiment, a molded body molded from a vinylidene fluoride polymer and a joined body joined to the molded body are joined via a molecular joining agent.
 〔成形体〕
 本実施形態における成形体は、フッ化ビニリデン重合体から成形されている。本実施形態におけるフッ化ビニリデン重合体は、フッ化ビニリデン由来の構成単位を主成分としている。ここで、「主成分としている」とは含有率が50モル%以上であることを指すものとする。
(Molded body)
The molded article in the present embodiment is molded from a vinylidene fluoride polymer. The vinylidene fluoride polymer in the present embodiment has a structural unit derived from vinylidene fluoride as a main component. Here, “being the main component” means that the content is 50 mol% or more.
 フッ化ビニリデン重合体は、フッ化ビニリデン単独重合体であってもよいし、フッ化ビニリデンと共重合可能なモノマーに由来する構成単位との共重合体であってもよい。 The vinylidene fluoride polymer may be a homopolymer of vinylidene fluoride or a copolymer of vinylidene fluoride with a structural unit derived from a copolymerizable monomer.
 フッ化ビニリデンと共重合可能なモノマーの具体例としては、含フッ素モノマー、エチレンおよびプロピレンなどの炭化水素系モノマー、(メタ)アクリル酸アルキル化合物およびカルボキシ基含有アクリレート化合物などのアクリル酸系モノマー、マレイン酸、マレイン酸モノメチルおよびマレイン酸ジメチルなどの不飽和二塩基酸誘導体モノマー、カルボン酸無水物基含有モノマーなどが挙げられるが、中でも耐候性および耐薬品性の観点から含フッ素モノマーが好ましい。なお、他のモノマーは、一種単独でも二種以上でもよい。 Specific examples of monomers copolymerizable with vinylidene fluoride include fluorine-containing monomers, hydrocarbon monomers such as ethylene and propylene, acrylic monomers such as alkyl (meth) acrylate compounds and carboxy group-containing acrylate compounds, and maleic monomers. Examples include acids, unsaturated dibasic acid derivative monomers such as monomethyl maleate and dimethyl maleate, and carboxylic acid anhydride group-containing monomers. Among them, fluorine-containing monomers are preferable from the viewpoint of weather resistance and chemical resistance. The other monomers may be used alone or in combination of two or more.
 含フッ素モノマーとしては、フッ化ビニル、トリフルオロエチレン、テトラフルオロエチレン、クロロトリフルオロエチレン、ヘキサフルオロプロピレン、ペルフルオロメチルビニルエーテルに代表されるペルフルオロアルキルビニルエーテルなどが挙げられる。 フ ッ 素 Examples of the fluorinated monomer include vinyl fluoride, trifluoroethylene, tetrafluoroethylene, chlorotrifluoroethylene, hexafluoropropylene, and perfluoroalkyl vinyl ether represented by perfluoromethyl vinyl ether.
 不飽和二塩基酸誘導体モノマーとしては、マレイン酸、シトラコン酸、マレイン酸モノメチル、マレイン酸ジメチルおよびシトラコン酸モノメチルなどが挙げられる。 モ ノ マ ー Examples of the unsaturated dibasic acid derivative monomer include maleic acid, citraconic acid, monomethyl maleate, dimethyl maleate and monomethyl citraconic acid.
 (メタ)アクリル酸アルキル化合物としては(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n-プロピル、(メタ)アクリル酸n-ブチル、(メタ)アクリル酸t-ブチル、(メタ)アクリル酸n-ヘキシル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸ベンジル、(メタ)アクリル酸クロロメチル、(メタ)アクリル酸2-クロロエチル、(メタ)アクリル酸2-ヒドロキシエチル、(メタ)アクリル酸3-ヒドロキシプロピル、(メタ)アクリル酸2,3,4,5,6-ペンタヒドロキシヘキシル、(メタ)アクリル酸2,3,4,5-テトラヒドロキシペンチル、2-(ヒドロキシメチル)アクリル酸メチルおよび2-(ヒドロキシエチル)アクリル酸メチルなどが挙げられる。 Examples of the alkyl (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl (meth) acrylate, N-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, chloromethyl (meth) acrylate, 2-chloroethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2,3,4,5,6-pentahydroxyhexyl (meth) acrylate, 2,3,4,5-tetrahydroxypentyl (meth) acrylate, 2- (hydroxy Methyl) methyl acrylate and 2- (hydroxyethyl) methyl acrylate.
 カルボキシ基含有アクリレート化合物としては、(メタ)アクリル酸、2-カルボキシエチルアクリレート、(メタ)アクリロイロキシプロピルコハク酸、(メタ)アクリロイロキシエチルコハク酸、2-ヒドロキシエチルアクリレートおよびヒドロキシプロピルアクリレートなどが挙げられる。 Examples of the carboxy group-containing acrylate compound include (meth) acrylic acid, 2-carboxyethyl acrylate, (meth) acryloyloxypropyl succinic acid, (meth) acryloyloxyethyl succinic acid, 2-hydroxyethyl acrylate and hydroxypropyl acrylate. Is mentioned.
 また、本実施形態に係るフッ化ビニリデン重合体のインヘレント粘度は特に限られないが、0.5~7.0dL/gの範囲内の値であることが好ましく、0.7~5.0dL/gの範囲内の値であることがより好ましく、1.0~4.0dL/gの範囲内の値であることがさらに好ましい。フッ化ビニリデン重合体のインヘレント粘度は、樹脂4gを1リットルのN,N-ジメチルホルムアミドに溶解させた溶液の30℃における対数粘度として求めることができる。 Further, the inherent viscosity of the vinylidene fluoride polymer according to the present embodiment is not particularly limited, but is preferably in a range of 0.5 to 7.0 dL / g, and is preferably 0.7 to 5.0 dL / g. The value is more preferably in the range of g, and even more preferably in the range of 1.0 to 4.0 dL / g. The inherent viscosity of the vinylidene fluoride polymer can be determined as the logarithmic viscosity at 30 ° C. of a solution obtained by dissolving 4 g of the resin in 1 liter of N, N-dimethylformamide.
 本実施形態に係るフッ化ビニリデン重合体は、例えば、懸濁重合および乳化重合などにより製造することが可能である。 ビ The vinylidene fluoride polymer according to the present embodiment can be manufactured by, for example, suspension polymerization, emulsion polymerization, or the like.
 また、本実施形態に係るフッ化ビニリデン重合体から成形された成形体は、通常のフッ化ビニリデン重合体の成形品の製造と同様に、射出成形、プレス成形、カレンダー成形、押出成形、または溶融紡糸などの公知の方法によって製造することができる。また、所望の成形体の形態に合わせてその製造方法を選択することができる。 Further, the molded article molded from the vinylidene fluoride polymer according to the present embodiment may be prepared by injection molding, press molding, calender molding, extrusion molding, or melting in the same manner as in the production of a molded article of ordinary vinylidene fluoride polymer. It can be manufactured by a known method such as spinning. Further, the production method can be selected according to the desired form of the molded body.
 成形体の形態は特に限られず、例えば、板状、棒状、球状、半球状、繊維状、紛体、布状、網状、フィルム状、シート状、および積層体などが挙げられる。なお、成形体の表面は、分子接合剤をその表面に共有結合させることで被接合体に接合する。そのため、接合体の気密性および意匠性という観点から平滑面であることが好ましいが、被接合体の表面が平滑である場合には粗面であってもよい。 形態 The form of the molded body is not particularly limited, and examples thereof include a plate, a rod, a sphere, a hemisphere, a fiber, a powder, a cloth, a net, a film, a sheet, and a laminate. In addition, the surface of the molded body is bonded to the body to be bonded by covalently bonding a molecular bonding agent to the surface. Therefore, from the viewpoint of the airtightness and design of the joined body, it is preferable that the surface is smooth. However, if the surface of the joined body is smooth, the surface may be rough.
 〔被接合体〕
 本実施形態における被接合体は、成形体に分子接合剤を介して接合されている。
(Joint)
The article to be joined in this embodiment is joined to the molded body via a molecular joining agent.
 被接合体としては、金属材料(合金を含む)、各種樹脂、セラミック材料、およびこれらの複合材などが挙げられるが、樹脂または金属から成形されていることが好ましい。 (5) Examples of the member to be joined include metal materials (including alloys), various resins, ceramic materials, and composite materials thereof, and are preferably formed from resin or metal.
 金属材料としては、各種の金属およびその合金などが挙げられる。金属の具体例としては、Be、Mg、Ca、Sr、Ba、Ra、Sc、Y、Ti、Zr、V、Nb、Ta、Cr、Mo、W、Mn、Fe、Co、Rh、Ir、Ni、Pd、Pt、Cu、Ag、Au、Zn、Cd、Hg、Al、Ge、Sn、Pb、Sb、BiおよびNdなどが挙げられる。 Examples of the metal material include various metals and alloys thereof. Specific examples of metals include Be, Mg, Ca, Sr, Ba, Ra, Sc, Y, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Rh, Ir, and Ni. , Pd, Pt, Cu, Ag, Au, Zn, Cd, Hg, Al, Ge, Sn, Pb, Sb, Bi and Nd.
 樹脂としては、熱可塑性樹脂、熱硬化性樹脂、繊維強化プラスチック、光硬化性樹脂、加硫ゴム、および未架橋ゴムなどが挙げられる。これらの例としては、ポリエチレン、ポリプロピレン、エチレン-プロピレン重合体、またはポリ(4-メチル-1-ペンテン)などのオレフィン系重合体;塩化ビニル、または塩素化ビニル樹脂などの含ハロゲン系重合体;ポリメタクリル酸メチルなどのアクリル系重合体;ポリスチレン、スチレン-メタクリル酸メチル共重合体、スチレン-アクリロニトリル共重合体、またはアクリロニトリル-ブタジエン-スチレンブロック共重合体などのスチレン系重合体;ポリエチレンテレフタレート、ポリブチレンテレフタレート、またはポリエチレンナフタレートなどのポリエステル;ナイロン6、ナイロン66、またはナイロン610などのポリアミド;ポリアセタール;ポリカーボネート;ポリフェニレンオキシド;ポリフェニレンスルフィド(PPS);ポリエーテルエーテルケトン(PEEK);ポリサルホン;ポリエーテルサルホン;ポリオキシペンジレン;ポリイミド;ポリアミドイミド;ポリブタジエン系ゴム、アクリル系ゴムを配合したABS樹脂またはASA樹脂などのゴム質重合体;などが挙げられる。中でも、C=O結合を有する樹脂が好ましく、特に、ポリカーボネート、ポリエチレンテレフタレート、およびポリイミドが好ましい。 Examples of the resin include a thermoplastic resin, a thermosetting resin, a fiber reinforced plastic, a photocurable resin, a vulcanized rubber, and an uncrosslinked rubber. Examples thereof include olefin polymers such as polyethylene, polypropylene, ethylene-propylene polymer, or poly (4-methyl-1-pentene); halogen-containing polymers such as vinyl chloride or chlorinated vinyl resin; Acrylic polymers such as polymethyl methacrylate; styrene polymers such as polystyrene, styrene-methyl methacrylate copolymer, styrene-acrylonitrile copolymer, or acrylonitrile-butadiene-styrene block copolymer; polyethylene terephthalate, poly Polyester such as butylene terephthalate or polyethylene naphthalate; polyamide such as nylon 6, nylon 66 or nylon 610; polyacetal; polycarbonate; polyphenylene oxide; Polyimide (PPS); Polyetheretherketone (PEEK); Polysulfone; Polyethersulfone; Polyoxypendylene; Polyimide; Polyamideimide; Rubber such as ABS resin or ASA resin blended with polybutadiene rubber and acrylic rubber. And a polymer. Among them, a resin having a C = O bond is preferable, and particularly, polycarbonate, polyethylene terephthalate, and polyimide are preferable.
 セラミック材料としては、例えば、陶磁器(カオリン、蛙目粘土、陶石、長石、珪石、石英、またはアルミナなど)、ガラス、セメント、石膏、および琺瑯などが挙げられる。組成上からは、酸化物系、ジルコニア系、水酸化物系、炭化物系、炭酸塩系、窒化物系、ハロゲン化物系、およびリン酸塩系などが挙げられる。 Examples of the ceramic material include porcelain (such as kaolin, frog-eye clay, pottery stone, feldspar, quartzite, quartz, or alumina), glass, cement, gypsum, and enamel. From the viewpoint of composition, oxides, zirconia, hydroxides, carbides, carbonates, nitrides, halides, phosphates, and the like can be given.
 被接合体の形態は特に限られず、例えば、板状、棒状、球状、半球状、繊維状、紛体、布状、網状、フィルム状、シート状、および積層体などが挙げられる。 形態 The form of the joined body is not particularly limited, and examples thereof include a plate, a rod, a sphere, a hemisphere, a fiber, a powder, a cloth, a net, a film, a sheet, and a laminate.
 なお、被接合体の表面は平滑面であることが好ましいが、成形体が平滑面である場合には、粗面であってもよい。 The surface of the joined body is preferably a smooth surface, but may be a rough surface if the molded body is a smooth surface.
 上述の被接合体は、いずれも当業者によく知られた方法で製造することができる。 い ず れ All of the above-mentioned joined bodies can be manufactured by a method well known to those skilled in the art.
 〔分子接合剤〕
 本実施形態における分子接合剤は、フッ化ビニリデン重合体から成形された成形体と被接合体とを接合させる化合物である。本実施形態における分子接合剤は、-NX、およびアルコキシシリル基またはシラノール基を有する。ここでXおよびXは、それぞれ独立に、水素原子または炭素数1~5のアルキル基である。なお、Xは、水素原子であることが好ましい。アルコキシシリル基のアルコキシ部分における炭素数に特に制限はないが、炭素数1~5であることが好ましい。
(Molecular bonding agent)
The molecular bonding agent in the present embodiment is a compound that bonds a molded body molded from a vinylidene fluoride polymer and a body to be bonded. The molecular bonding agent according to the present embodiment has —NX 1 X 2 and an alkoxysilyl group or a silanol group. Here, X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. Note that X 1 is preferably a hydrogen atom. The number of carbon atoms in the alkoxy moiety of the alkoxysilyl group is not particularly limited, but is preferably 1 to 5 carbon atoms.
 また、本実施形態における分子接合剤は、以下の一般式(I)で表される化合物であることが好ましい。
Figure JPOXMLDOC01-appb-C000003
式(I)中、Rは、水素原子、炭素数1~5のアルキル基、炭素数1~5のアミノアルキル基または以下の一般式(II)で表され、Rは炭素数1~10のアルキレン基であり、R~Rは、それぞれ独立に、ヒドロキシ基、炭素数1~5のアルコキシ基または炭素数1~5のアルキル基であって、R~Rの少なくとも1つはヒドロキシ基または炭素数1~5のアルコキシ基である。
Figure JPOXMLDOC01-appb-C000004
式(II)中、Rは、炭素数1~10のアルキレン基であり、Rは、-NH-R-NHまたは-NR10であり、Rは、炭素数1~10のアルキレン基であり、RおよびR10は、それぞれ独立に、炭素数1~5のアルキル基である。また、*印は、式(I)のRが結合している窒素原子との結合部位である。
Further, the molecular bonding agent in the present embodiment is preferably a compound represented by the following general formula (I).
Figure JPOXMLDOC01-appb-C000003
In formula (I), R 1 represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms, represented by C 1-5 aminoalkyl groups or the following general formula carbons (II), R 2 is C 1 - And R 3 to R 5 are each independently a hydroxy group, an alkoxy group having 1 to 5 carbon atoms or an alkyl group having 1 to 5 carbon atoms, and at least one of R 3 to R 5 One is a hydroxy group or an alkoxy group having 1 to 5 carbon atoms.
Figure JPOXMLDOC01-appb-C000004
In the formula (II), R 6 is an alkylene group having 1 to 10 carbon atoms, R 7 is —NH—R 8 —NH 2 or —NR 9 R 10 , and R 8 has 1 to 10 carbon atoms. And R 9 and R 10 are each independently an alkyl group having 1 to 5 carbon atoms. The symbol * represents a bonding site to the nitrogen atom to which R 1 in the formula (I) is bonded.
 Rとしては、中でも、水素原子、炭素数1~3のアミノアルキル基または一般式(II)で表される基であることが好ましく、水素原子または一般式(II)で表される基であることがより好ましく、一般式(II)で表される基であることがさらに好ましい。 R 1 is preferably a hydrogen atom, an aminoalkyl group having 1 to 3 carbon atoms or a group represented by the general formula (II), and is preferably a hydrogen atom or a group represented by the general formula (II). More preferably, it is more preferably a group represented by the general formula (II).
 Rとしては、中でも、炭素数1~8のアルキレン基であることが好ましく、炭素数1~5のアルキレン基であることがより好ましく、炭素数2~5のアルキレン基であることがさらに好ましい。 Among them, R 2 is preferably an alkylene group having 1 to 8 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and further preferably an alkylene group having 2 to 5 carbon atoms. .
 R~Rとしては、中でも、ヒドロキシ基または炭素数1~4のアルコキシ基であることが好ましく、炭素数1~3のアルコキシ基であることがより好ましい。 Among them, R 3 to R 5 are preferably a hydroxy group or an alkoxy group having 1 to 4 carbon atoms, and more preferably an alkoxy group having 1 to 3 carbon atoms.
 Rとしては、中でも、炭素数1~8のアルキレン基であることが好ましく、炭素数1~5のアルキレン基であることがより好ましく、炭素数1~3のアルキレン基であることがさらに好ましい。 Among them, R 6 is preferably an alkylene group having 1 to 8 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and further preferably an alkylene group having 1 to 3 carbon atoms. .
 Rとしては、中でも、-NH-R-NHであることが好ましい。また、Rとしては、中でも、炭素数1~8のアルキレン基であることが好ましく、炭素数1~5のアルキレン基であることがより好ましく、炭素数1~3のアルキレン基であることがさらに好ましく、炭素数1~2のアルキレン基であることが特に好ましい。 Among them, R 7 is preferably —NH—R 8 —NH 2 . R 8 is preferably an alkylene group having 1 to 8 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and more preferably an alkylene group having 1 to 3 carbon atoms. More preferably, it is particularly preferably an alkylene group having 1 to 2 carbon atoms.
 さらに好ましい分子接合剤は、Rが一般式(II)で表され、Rが炭素数1~5のアルキレン基であり、R~Rが炭素数1~3のアルコキシ基であり、Rが炭素数1~3のアルキレン基であり、Rが-NH-R-NHであり、Rが炭素数1~3のアルキレン基である化合物である。分子接合剤として最も好ましいのは、N,N’-ビス(2-アミノエチル)-6-(3-トリエトキシシリルプロピル)アミノ-1,3,5-トリアジン-2,4-ジアミン(以下、A-TES)である。 More preferred molecular bonding agents are those wherein R 1 is represented by the general formula (II), R 2 is an alkylene group having 1 to 5 carbon atoms, and R 3 to R 5 are an alkoxy group having 1 to 3 carbon atoms; A compound in which R 6 is an alkylene group having 1 to 3 carbon atoms, R 7 is —NH—R 8 —NH 2 , and R 8 is an alkylene group having 1 to 3 carbon atoms. The most preferred molecular conjugating agent is N, N'-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine (hereinafter, referred to as N, N'-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine). A-TES).
 また、他の実施形態においては、Rは水素原子または炭素数1~5のアミノアルキル基であってよく、Rは炭素数1~10のアルキレン基であってよく、R~Rは、炭素数1~5のアルコキシ基であってよい。 In another embodiment, R 1 may be a hydrogen atom or an aminoalkyl group having 1 to 5 carbon atoms, R 2 may be an alkylene group having 1 to 10 carbon atoms, and R 3 to R 5 May be an alkoxy group having 1 to 5 carbon atoms.
 〔接合体の特性〕
 本実施形態に係る接合体は、成形体と被接合体とが、分子接合剤を介して接合したものである。
[Characteristics of the joined body]
In the joined body according to the present embodiment, a molded body and a joined body are joined via a molecular joining agent.
 成形体と被接合体とは、分子接合剤を介しているものの、成形体と被接合体との距離が極めて小さく実質的に直接接しており、強固に接合している。より詳細には、成形体は分子接合剤と共有結合しており、被接合体は分子接合剤と共有結合している。 Although the molded body and the object to be bonded are interposed through the molecular bonding agent, the distance between the molded body and the object to be bonded is extremely small and substantially directly in contact with each other. More specifically, the molded body is covalently bonded to the molecular bonding agent, and the body to be bonded is covalently bonded to the molecular bonding agent.
 成形体と分子接合剤とは、分子接合剤が有する-NXにおいて、共有結合する。被接合体と分子接合剤との共有結合は、被接合体の表面が金属またはセラミックの場合と樹脂の場合とで異なっている。 The molded article and the molecular bonding agent are covalently bonded to each other at —NX 1 X 2 of the molecular bonding agent. The covalent bond between the bonded object and the molecular bonding agent is different depending on whether the surface of the bonded object is a metal or ceramic or a resin.
 被接合体の表面が金属またはセラミックの場合、分子接合剤は、分子接合剤のアルコキシシリル基またはシラノール基において金属またはセラミックと共有結合する。このとき、被接合体は、成形体と共有結合する(している)分子接合剤と共有結合する。これによって成形体と被接合体とが接合する。 場合 When the surface of the object to be bonded is metal or ceramic, the molecular bonding agent covalently bonds to the metal or ceramic at the alkoxysilyl group or silanol group of the molecular bonding agent. At this time, the bonded object is covalently bonded to a molecular bonding agent that is (or is) covalently bonded to the molded body. As a result, the molded body and the joined body are joined.
 被接合体の表面が、フッ化ビニリデン重合体など、-NXとの反応性を有する樹脂の場合、分子接合剤と被接合体とは、分子接合剤が有する-NXにおいて共有結合する。そして、成形体と被接合体とは、両者それぞれと共有結合している分子接合剤の、アルコキシシリル基同士またはシラノール基同士が縮合することによって接合する。なお、各分子接合剤においてアルコキシシリル基またはシラノール基におけるアルコキシ基またはヒドロキシ基は複数存在し得るが、このうちの一つ以上において縮合していればよい。なお、一つにおいて縮合している場合の分子接合剤の一例を、以下の一般式(III)に示す。
Figure JPOXMLDOC01-appb-C000005
式(III)中、R~Rは上に示した一般式(I)について記載したものと同様である。
In the case where the surface of the joined body is a resin having reactivity with -NX 1 X 2 such as a vinylidene fluoride polymer, the molecular bonding agent and the joined body are different from each other in -NX 1 X 2 of the molecular joining agent. Covalently bond. Then, the molded article and the article to be joined are joined by condensation of alkoxysilyl groups or silanol groups of the molecular joining agent covalently bonded to both. In addition, in each molecular bonding agent, there may be a plurality of alkoxy groups or hydroxy groups in the alkoxysilyl group or silanol group, and it is sufficient that at least one of these groups is condensed. In addition, an example of the molecular bonding agent when one is condensed is shown in the following general formula (III).
Figure JPOXMLDOC01-appb-C000005
In the formula (III), R 1 to R 4 are the same as those described for the general formula (I) shown above.
 なお、分子接合剤が-NXを複数有する場合には、被接合体は成形体と共有結合する(している)分子接合剤と共有結合することがある。 When the molecular bonding agent has a plurality of —NX 1 X 2 , the object to be bonded may be covalently bonded to the molecular bonding agent that is (or is) bonded to the molded body.
 一方、被接合体の表面が、-NXとの反応性を有していない樹脂の場合、後述する、分子接合剤を被接合体に結合させるための事前処理を行うことにより、分子接合剤と被接合体とが、分子接合剤が有するアルコキシシリル基またはシラノール基において共有結合した状態となる。 On the other hand, when the surface of the object is a resin that does not have reactivity with —NX 1 X 2 , the molecular bonding is performed by performing a pre-treatment for binding the molecular bonding agent to the object, which will be described later. The bonding agent and the object to be bonded are covalently bonded at the alkoxysilyl group or silanol group of the molecular bonding agent.
 本実施形態に係る接合体は、分子接合剤を介した接合であり、それにより、成形体と被接合体との距離を、分子接合剤1~数個分の大きさの範囲内に収めることができる。したがって、成形体と被接合体との距離は0.1μm以下であり得、0.05μm以下でもあり得、10nm以下でもあり得る。このように、本実施形態における接合体は、成形体と被接合体との距離が非常に小さく、実質的に直接接して接合しているものである。そのため、成形体と被接合体との間で応力または熱などが接合面で途切れることなく伝わる。これにより、本実施形態に係る接合体に新たな物性を付与することが可能である。さらに、成形体と被接合体との間に非共有結合が生じ、成形体と被接合体との接合がさらに強固なものとなる。 The bonded body according to the present embodiment is bonding via a molecular bonding agent, whereby the distance between the molded body and the body to be bonded is within the range of one to several molecular bonding agents. Can be. Therefore, the distance between the molded object and the object to be joined may be 0.1 μm or less, may be 0.05 μm or less, and may be 10 nm or less. As described above, in the joined body according to the present embodiment, the distance between the molded body and the joined body is extremely small, and the joined body is substantially directly in contact with and joined. Therefore, stress, heat, and the like are transmitted without interruption at the joining surface between the molded body and the joined body. Thereby, it is possible to impart new physical properties to the joined body according to the present embodiment. Further, non-covalent bonding occurs between the molded body and the joined body, and the joining between the molded body and the joined body is further strengthened.
 以上のように、本実施形態に係る接合体では、成形体と被接合体との接合が非常に強固なものであり、常温下で、90°剥離試験による成形体と被接合体との剥離強度が0.6N/mmより大きなものである。ここで、90℃剥離試験は、JIS K6854-1に準拠したものである。剥離強度は大きいほどよく、本実施形態に係る接合体では、0.7N/mm以上であり得、1.0N/mm以上でもあり得、さらには2.0N/mm以上でもあり得る。 As described above, in the joined body according to the present embodiment, the joining between the molded body and the joined body is very strong, and the molded body and the joined body are separated from each other by the 90 ° peel test at room temperature. The strength is greater than 0.6 N / mm. Here, the 90 ° C. peeling test is based on JIS @ K6584-1. The larger the peel strength is, the better. The bonded body according to the present embodiment may be 0.7 N / mm or more, may be 1.0 N / mm or more, and may be 2.0 N / mm or more.
 上述のように、本実施形態における成形体と被接合体とは、分子接合剤を介した共有結合によって結合している。そのため、水素結合など、非結合性の力を利用した従来の接着剤を用いた接合に比べ、強固な接合を可能にしている。そのため、接触面が平滑であるなどして接触面積が小さくとも、強固な結合が可能である。さらに、接着剤と異なり、高温、高圧など厳しい環境下においても結合部分が変質することがない。そのため、高い接合信頼性を得ることができる。 成形 As described above, the molded article and the article to be joined in the present embodiment are bonded by a covalent bond via a molecular joining agent. For this reason, stronger bonding is enabled as compared with bonding using a conventional adhesive utilizing non-bonding force such as hydrogen bonding. Therefore, even if the contact area is small, for example, the contact surface is smooth, a strong connection is possible. Further, unlike the adhesive, the bonded portion does not deteriorate even under severe environments such as high temperature and high pressure. Therefore, high joining reliability can be obtained.
 なお、接触面が粗面同士である材料を接合させる場合には、表面が平滑かつ表面粗さを吸収できる程度の厚さを有する材料を間に挟み、プレス、または溶融により当接させることで、表面が粗面同士である材料を接合させることができる。表面が平滑かつ表面粗さを吸収できる程度の厚さを有する材料は、樹脂、金属、またはセラミックのいずれであってもよいが、粗面に当接させる観点から、樹脂であることが好ましい。 When joining materials whose contact surfaces are rough surfaces, a material having a smooth surface and a thickness sufficient to absorb the surface roughness is sandwiched between the materials, and the materials are brought into contact by pressing or melting. In addition, materials having rough surfaces can be joined. The material whose surface is smooth and has a thickness capable of absorbing the surface roughness may be any of resin, metal, and ceramic, but is preferably resin from the viewpoint of contacting the rough surface.
 本実施形態における被接合体は、上に列挙したように様々な材料とすることができるが、上述のように分子接合剤を共有結合させることで、どのような材料の被接合体であっても同様の方法で成形体と接合させることができる。また、その接合は強固である。 The object to be joined in the present embodiment can be made of various materials as listed above, but the object to be joined can be any material by covalently bonding the molecular joining agent as described above. Can be bonded to the molded body in the same manner. Also, the bonding is strong.
 さらに、従来のように被接合体の材料によって接着剤を選定する必要がない。なお、分子接合剤はほとんど厚みを有しないため、接着剤を使用する場合と比べて、得られる構造体の厚みが接着剤層の分だけ厚くなってしまうことを防ぐことができる。 Furthermore, there is no need to select an adhesive according to the material of the object to be joined as in the conventional case. In addition, since the molecular bonding agent has almost no thickness, it is possible to prevent the thickness of the obtained structure from being increased by the amount of the adhesive layer as compared with the case where an adhesive is used.
 <接合体の製造方法>
 以下に、本実施形態に係る接合体の製造方法を述べる。
<Method of manufacturing bonded body>
Hereinafter, a method for manufacturing the joined body according to the present embodiment will be described.
 本実施形態に係る接合体の製造方法は、上述の成形体および被接合体の一方または両方を、分子接合剤を含む溶液(以下、分子接合剤溶液ともいう)を用いて表面処理する表面処理工程、および表面処理工程後に成形体と被接合体とを80℃以上で当接させる当接工程を含む。 The method for manufacturing a joined body according to this embodiment includes a surface treatment in which one or both of the above-described molded body and the joined body are subjected to a surface treatment using a solution containing a molecular joining agent (hereinafter, also referred to as a molecular joining agent solution). And a contact step of contacting the molded body and the object to be joined at 80 ° C. or higher after the surface treatment step.
 〔表面処理工程〕
 本実施形態に係る接合体の製造方法における表面処理工程は、成形体および被接合体の一方または両方を、分子接合剤溶液を用いて表面処理する工程である。以下、成形体および被接合体をまとめて「接合材料」と称する。
(Surface treatment step)
The surface treatment step in the method for manufacturing a joined body according to the present embodiment is a step of subjecting one or both of the molded body and the joined body to a surface treatment using a molecular bonding agent solution. Hereinafter, the molded body and the joined body are collectively referred to as “joining material”.
 本実施形態に係る表面処理工程では、接合材料を、分子接合剤溶液に浸漬する、浸漬処理を含む。溶液中の分子接合剤の含有量は、1wt%以下であることが好ましく、0.5wt%以下であることがより好ましく、0.1wt%以下であることがさらに好ましい。分子接合剤溶液の溶媒は水であることが好ましいが、例えば、エタノール等のアルコール系溶媒、エーテル系溶媒、ケトン系溶媒またはその混合溶媒であってもよい。 表面 The surface treatment step according to the present embodiment includes an immersion treatment of immersing the bonding material in a molecular bonding agent solution. The content of the molecular bonding agent in the solution is preferably at most 1 wt%, more preferably at most 0.5 wt%, even more preferably at most 0.1 wt%. The solvent of the molecular bonding agent solution is preferably water, but may be, for example, an alcohol solvent such as ethanol, an ether solvent, a ketone solvent or a mixed solvent thereof.
 浸漬する時間は10秒で十分であるが、30秒以上であることが好ましく、60秒以上であることがより好ましい。 10 10 seconds is sufficient for the immersion time, but it is preferably 30 seconds or more, and more preferably 60 seconds or more.
 なお、接合材料は、接合しようとする部分が分子接合剤の溶液で処理されればよいため、浸漬処理に限らず、接合しようとする部分のみに溶液を直接塗布してもよいし、噴霧器などで溶液を吹き付けるなどしてもよい。 The joining material is not limited to the immersion treatment, and the solution to be joined may be directly applied to only the portion to be joined, or a sprayer or the like, since the portion to be joined only needs to be treated with the solution of the molecular bonding agent. May be used to spray the solution.
 被接合体の表面が金属またはセラミックである場合には、成形体および被接合体のいずれか一方を表面処理すればよいが、接合材料の表面により多くの接合剤を共有結合させるという観点から、被接合体を表面処理することが好ましい。 When the surface of the object to be joined is metal or ceramic, any one of the molded body and the object to be joined may be subjected to surface treatment, but from the viewpoint of covalently bonding more joining agent to the surface of the joining material, It is preferable to subject the object to be surface-treated.
 被接合体がフッ化ビニリデン重合体など、-NXとの反応性を有する樹脂である場合には、成形体および被接合体の両方を表面処理することが好ましい。上述したように、フッ化ビニリデン重合体など-NXとの反応性を有する樹脂は、分子接合剤が有する-NXにおいて、共有結合する。そして、成形体と被接合体とは、両者それぞれと共有結合している分子接合剤の、アルコキシシリル基同士またはシラノール基同士が縮合することによって接合するためである。 When the article to be joined is a resin having reactivity with —NX 1 X 2 such as a vinylidene fluoride polymer, it is preferable to subject both the molded article and the article to surface treatment. As described above, a resin having reactivity with -NX 1 X 2 such as a vinylidene fluoride polymer is covalently bonded to -NX 1 X 2 of the molecular bonding agent. The molded article and the article to be joined are joined by condensing the alkoxysilyl groups or silanol groups of the molecular joining agent covalently bonded to both.
 表面処理工程では、上述の浸漬処理以外に、他の処理を含んでいてもよい。例えば、被接合体がC=O結合を含まず、C-H結合を含む場合は、浸漬処理の前に分子接合剤を被接合体に結合させるための事前処理を行うことが好ましい。 The surface treatment step may include other treatments in addition to the immersion treatment described above. For example, when the article does not contain a C = O bond but contains a CH bond, it is preferable to perform a pretreatment for binding the molecular joining agent to the article before the immersion treatment.
 事前処理としては、例えば、被接合体の表面に、被接合体に結合する官能基および分子接合剤に結合する官能基の両方を有する化合物を結合させる方法が挙げられる。より具体的には、アジド基、およびアルコキシシリル基またはシラノール基を有する化合物を結合させることが好ましい。このような化合物としては、以下の一般式(IV)で表されるものが挙げられる。
Figure JPOXMLDOC01-appb-C000006
式(IV)中、R11は、炭素数1~10のアルキレン基であり、R12~R14は、それぞれ独立に、ヒドロキシ基、炭素数1~5のアルコキシ基または炭素数1~5のアルキル基であり、R12~R14の少なくとも1つは、ヒドロキシ基または炭素数1~5のアルコキシ基であり、R15は、アジド基または炭素数1~10のアルキル基である。
As the pretreatment, for example, a method of bonding a compound having both a functional group that binds to the bond and a functional group that binds to the molecular bonding agent to the surface of the bond is used. More specifically, it is preferable to bond a compound having an azide group and an alkoxysilyl group or a silanol group. Examples of such a compound include those represented by the following general formula (IV).
Figure JPOXMLDOC01-appb-C000006
In the formula (IV), R 11 is an alkylene group having 1 to 10 carbon atoms, and R 12 to R 14 are each independently a hydroxy group, an alkoxy group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms. An alkyl group, at least one of R 12 to R 14 is a hydroxy group or an alkoxy group having 1 to 5 carbon atoms, and R 15 is an azide group or an alkyl group having 1 to 10 carbon atoms.
 R11としては、中でも、炭素数1~5のアルキレン基であることが好ましく、炭素数2~4のアルキレン基であることがより好ましい。 Among them, R 11 is preferably an alkylene group having 1 to 5 carbon atoms, and more preferably an alkylene group having 2 to 4 carbon atoms.
 R12~R14としては、中でも、ヒドロキシ基または炭素数1~4のアルコキシ基であることが好ましく、炭素数1~3のアルコキシ基であることがより好ましい。 R 12 to R 14 are preferably a hydroxy group or an alkoxy group having 1 to 4 carbon atoms, and more preferably an alkoxy group having 1 to 3 carbon atoms.
 R15としてはアジド基がより好ましい。 More preferably an azide group as R 15.
 最も好ましい化合物としては、6-(3-トリエトキシシリルプロピル)アミノ-1,3,5-トリアジン-2,4-ジチオール(以下、P-TES)が挙げられる。 The most preferred compound is 6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-dithiol (hereinafter, P-TES).
 このような化合物を被接合体の表面に結合させる方法は特に限られないが、例えば、被接合体を、化合物を含む溶液にくぐらせ、紫外線照射によってラジカル発生反応をおこなう方法が挙げられる。 The method for bonding such a compound to the surface of the object is not particularly limited. For example, a method in which the object is immersed in a solution containing the compound and a radical generation reaction is performed by irradiation with ultraviolet light is exemplified.
 このとき、事前に、被接合体に対し、被接合体の濡れ性を高めるコロナ処理などを行うことが好ましい。また、反応の前後では、被接合体の汚れ、または未反応物および副生成物を除去するためにアセトンまたはエタノールなどを用いた超音波洗浄を行うことが好ましい。これらの処理の順序などは適宜決定することができる。 At this time, it is preferable to perform a corona treatment or the like on the article to be joined in advance to increase the wettability of the article. Before and after the reaction, it is preferable to perform ultrasonic cleaning using acetone or ethanol or the like in order to remove stains on the object to be bonded or unreacted substances and by-products. The order of these processes can be determined as appropriate.
 なお、上記式(IV)の化合物を用いた事前処理を行う場合、式(IV)の化合物を含む溶液に、予め分子接合剤を含ませておいてもよい。式(IV)の化合物および分子接合剤の両方を含む溶液を用いて処理することにより、式(IV)の化合物および紫外線照射による処理を行った後、分子接合剤溶液へ浸漬する工程または分子接合剤溶液を塗布する工程を省略することができる。 In the case of performing the pretreatment using the compound of the formula (IV), the solution containing the compound of the formula (IV) may contain a molecular bonding agent in advance. By treating with a solution containing both the compound of the formula (IV) and the molecular bonding agent, a step of immersing the compound of the formula (IV) in a molecular bonding agent solution after the treatment with the compound and the ultraviolet irradiation, or a molecular bonding The step of applying the agent solution can be omitted.
 〔当接工程〕
 本実施形態に係る接合体の製造方法における当接工程は、表面処理工程後に接合材料同士を80℃以上で当接させる工程である。
(Contact process)
The contacting step in the method for manufacturing a joined body according to the present embodiment is a step of bringing the joining materials into contact at 80 ° C. or higher after the surface treatment step.
 当接させる方法としては、プレスする方法、および処理基板をインサートした上で射出成形する方法などが挙げられるがこれに限らない。 (4) Examples of the contacting method include, but are not limited to, a pressing method, and a method of performing injection molding after inserting a processing substrate.
 当接させる際の温度は、80℃以上であるが、より好ましい温度は、接合材料それぞれの融点のうち高い方をmpとすると、mp-50℃以上mp+50℃以下であり、さらに好ましくは、mp-30℃以上mp+30℃以下である。これにより、接合材料同士を反応し得る距離に近づけて接合させることができる。 The temperature at which the contact is performed is 80 ° C. or higher, and a more preferable temperature is mp−50 ° C. or higher and mp + 50 ° C. or lower, where mp is the higher of the melting points of the bonding materials. It is -30 ° C or more and mp + 30 ° C or less. Thereby, it is possible to join the joining materials close to a distance at which they can react with each other.
 あるいは、接合材料それぞれの軟化点のうち高い方をspとすると、より好ましい当接温度はsp-50℃以上sp+50℃以下であり、さらに好ましくは、sp-30℃以上sp+30℃以下である。ここで、本明細書における「軟化点」とは、非晶性樹脂が流動、変形し得る加工可能な温度を指す。 Alternatively, assuming that the higher of the softening points of the joining materials is sp, the more preferable contact temperature is sp-50 ° C or more and sp + 50 ° C or less, and further preferably sp-30 ° C or more and sp + 30 ° C or less. Here, the “softening point” in the present specification refers to a workable temperature at which the amorphous resin can flow and deform.
 接合材料同士を、融点付近または軟化点付近において当接させることによって、接合材料同士をより近い距離で接合させることができる。 さ せ る By bringing the joining materials into contact with each other near the melting point or the softening point, the joining materials can be joined at a shorter distance.
 フッ化ビニリデン重合体は、アミンと反応することにより、フッ素の一部がアミノ基に置換し得ることが知られている。したがって、当接工程を経なくても一部の分子接合剤が成形体と結合する場合がある。しかしながら本実施形態においては、80℃以上の熱を加えることにより、多くの分子接合剤において成形体との共有結合が形成される。その結果、非常に強固に結合した接合体を得ることができる。 It is known that a vinylidene fluoride polymer can be partially substituted with an amino group by reacting with an amine. Therefore, some molecular bonding agents may bond to the molded body without going through the contacting step. However, in the present embodiment, by applying heat of 80 ° C. or more, a covalent bond with a molded body is formed in many molecular bonding agents. As a result, it is possible to obtain a bonded body that is very strongly bonded.
 <まとめ>
 以上から明らかなように、本発明は以下を包含する。
<Summary>
As apparent from the above, the present invention includes the following.
 フッ化ビニリデン由来の構成単位を主成分とするフッ化ビニリデン重合体から成形された成形体と、上記成形体に接合された被接合体と、を備え、上記成形体と上記被接合体との接合は、分子接合剤を介したものであり、上記分子接合剤は、-NX、およびアルコキシシリル基またはシラノール基を有する化合物であり、ここでXおよびXは、それぞれ独立に、水素原子または炭素数1~5のアルキル基であり、90°剥離試験による上記成形体と上記被接合体との剥離強度が0.6N/mmより大きい、接合体。 A molded article molded from a vinylidene fluoride polymer having a constitutional unit derived from vinylidene fluoride as a main component, and a joined body joined to the molded article, including the molded article and the joined article. The bonding is through a molecular bonding agent, and the molecular bonding agent is a compound having —NX 1 X 2 and an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently A joined body, which is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and has a peel strength of greater than 0.6 N / mm between the molded body and the joined body in a 90 ° peel test.
 また、上記被接合体は、樹脂または金属から成形されていることが好ましい。 In addition, it is preferable that the object to be joined is formed of resin or metal.
 また、上記Xは、水素原子であることが好ましい。 Further, X 1 is preferably a hydrogen atom.
 また、上記分子接合剤は、以下の一般式(I)で表される化合物であることが好ましい。
Figure JPOXMLDOC01-appb-C000007
式中、Rは、水素原子、炭素数1~5のアルキル基、炭素数1~5のアミノアルキル基または以下の一般式(II)で表され、Rは炭素数1~10のアルキレン基であり、R~Rは、それぞれ独立に、ヒドロキシ基、炭素数1~5のアルコキシ基または炭素数1~5のアルキル基であり、R~Rの少なくとも1つはヒドロキシ基または炭素数1~5のアルコキシ基であり、Rは、炭素数1~5のアルキレン基であり、Rは、-NH-R-NHまたは-NR10であり、Rは、炭素数1~5のアルキレン基であり、RおよびR10は、それぞれ独立に、炭素数1~5のアルキル基である。式(II)中、*印は、式(I)のRが結合している窒素原子との結合部位である。
Further, the molecular bonding agent is preferably a compound represented by the following general formula (I).
Figure JPOXMLDOC01-appb-C000007
In the formula, R 1 is represented by a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an aminoalkyl group having 1 to 5 carbon atoms or the following general formula (II), and R 2 is an alkylene having 1 to 10 carbon atoms. R 3 to R 5 are each independently a hydroxy group, an alkoxy group having 1 to 5 carbon atoms or an alkyl group having 1 to 5 carbon atoms, and at least one of R 3 to R 5 is a hydroxy group Or an alkoxy group having 1 to 5 carbon atoms, R 6 is an alkylene group having 1 to 5 carbon atoms, R 7 is —NH—R 8 —NH 2 or —NR 9 R 10 , and R 8 Is an alkylene group having 1 to 5 carbon atoms, and R 9 and R 10 are each independently an alkyl group having 1 to 5 carbon atoms. In the formula (II), an asterisk (*) indicates a bonding site to the nitrogen atom to which R 1 in the formula (I) is bonded.
Figure JPOXMLDOC01-appb-C000008
 また、上記Rは、上記一般式(II)で表されることが好ましい。
Figure JPOXMLDOC01-appb-C000008
Further, R 1 is preferably represented by the general formula (II).
 また、上記分子接合剤は、-N-N’-ビス(2-アミノエチル)-6-(3-トリエトキシシリルプロピル)アミノ-1,3,5-トリアジン-2,4-ジアミンであることが好ましい。 Further, the molecular bonding agent is —NN′-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine. Is preferred.
 あるいは、上記Rが水素原子であることが好ましい。 Alternatively, it is preferable that the R 1 is a hydrogen atom.
 また、上記成形体と上記被接合体との距離は0.1μm以下であることが好ましい。 距離 Further, it is preferable that the distance between the molded body and the object to be joined is 0.1 μm or less.
 フッ化ビニリデン由来の構成単位を主成分とするフッ化ビニリデン重合体から成形された成形体および上記成形体に接合させる被接合体の一方または両方を、分子接合剤溶液を用いて表面処理する表面処理工程、および上記表面処理工程後、上記成形体と上記被接合体とを80℃以上で当接させる当接工程を含み、上記分子接合剤は、-NX、およびアルコキシシリル基またはシラノール基を有する化合物であり、ここでXおよびXは、それぞれ独立に、水素原子または炭素数1~5のアルキル基である、接合体の製造方法。 A surface on which one or both of a molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component and an object to be joined to the molded article are subjected to surface treatment using a molecular bonding agent solution After the treatment step and the surface treatment step, the method includes a contact step of contacting the molded body and the article to be joined at 80 ° C. or higher, wherein the molecular joining agent comprises —NX 1 X 2 , and an alkoxysilyl group or A method for producing a conjugate, which is a compound having a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.
 また、上記表面処理工程では、上記成形体および上記被接合体の両方を表面処理することが好ましい。 In the surface treatment step, it is preferable to perform a surface treatment on both the molded body and the joined body.
 また、上記表面処理工程の前に、上記分子接合剤を被接合体に結合させるための処理を含むことが好ましい。 Preferably, the method further includes, before the surface treatment step, a treatment for binding the molecular bonding agent to the object.
 また、上記当接工程は、プレスする工程であることが好ましい。 In addition, the contacting step is preferably a pressing step.
 あるいは、上記当接工程は、射出成形する工程であることが好ましい。 Alternatively, it is preferable that the contacting step is a step of injection molding.
 また、上記溶液における上記分子接合剤の含有量は、1wt%以下であることが好ましい。 The content of the molecular bonding agent in the solution is preferably 1 wt% or less.
 以下に実施例を示し、本発明の実施の形態についてさらに詳しく説明する。もちろん、本発明は以下の実施例に限定されるものではなく、細部については様々な態様が可能であることはいうまでもない。さらに、本発明は上述した実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、それぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。また、本明細書中に記載された文献の全てが参考として援用される。 Examples are shown below, and the embodiments of the present invention will be described in more detail. Of course, the present invention is not limited to the following examples, and it goes without saying that various aspects are possible in detail. Furthermore, the present invention is not limited to the above-described embodiment, and various changes can be made within the scope shown in the claims. It is included in the technical scope of the invention. In addition, all of the documents described in this specification are incorporated by reference.
 〔PVDF接着体の製造〕
 (実施例1)
 幅25mm、長さ60mm、厚さ79μmのポリフッ化ビニリデン(PVDF)フィルム((株)クレハ社製、#1000)をエタノールで10分間超音波洗浄した。乾燥後、テーブル式表面処理装置(春日電機株式会社製)を用いて、出力電力150W、ギャップ長2mm、移動速度4m/min、移動回数4回の条件でコロナ処理を行った。その後、0.1wt%A-TES水溶液(株式会社いおう化学研究所製)に浸漬し、サンプルA-1を得た。
[Production of PVDF bonded body]
(Example 1)
A polyvinylidene fluoride (PVDF) film (# 1000, manufactured by Kureha Corporation) having a width of 25 mm, a length of 60 mm and a thickness of 79 μm was ultrasonically washed with ethanol for 10 minutes. After drying, a corona treatment was performed using a table type surface treatment device (manufactured by Kasuga Electric Co., Ltd.) under the conditions of an output power of 150 W, a gap length of 2 mm, a moving speed of 4 m / min, and a moving frequency of 4 times. Thereafter, the sample was immersed in a 0.1 wt% A-TES aqueous solution (manufactured by Io Chemical Laboratory Co., Ltd.) to obtain a sample A-1.
 幅25mm、長さ60mm、厚さ1mmのPVDFシート((株)クレハ製、#2300)をエタノールで10分間超音波洗浄しサンプルB-1を得た。 PV A 25 mm wide, 60 mm long, 1 mm thick PVDF sheet (# 2300, manufactured by Kureha Corporation) was ultrasonically washed with ethanol for 10 minutes to obtain a sample B-1.
 剥離試験時の持ち手部分を得るため、サンプルB-1の処理面の上端部にポリイミドテープを貼り、その上にサンプルA-1をA-TES処理面を内側にして乗せ、135℃、2MPa、5分間熱プレス成形することで、PVDFフィルムとPVDFシートとの接合体を得た。プレス成形には、AYSR-5(株式会社神藤金属工業所製)を用いた。 In order to obtain a handle portion at the time of the peeling test, a polyimide tape was attached to the upper end of the treated surface of sample B-1, and sample A-1 was placed thereon with the A-TES treated surface inside, and placed at 135 ° C., 2 MPa By performing hot press molding for 5 minutes, a joined body of the PVDF film and the PVDF sheet was obtained. AYSR-5 (manufactured by Shindo Metal Industry Co., Ltd.) was used for press molding.
 (実施例2)
 幅30mm、長さ50mm、厚さ3mmのPPS板(ポリプラスチックス社製、1130TX1)をアセトンで10分間超音波洗浄した。乾燥後、0.1wt%P-TESエタノール溶液(株式会社いおう化学研究所製)にディップし、乾燥させた。乾燥後、積算光量が200mJ/cmになる条件でUV照射した。UV照射後、エタノールで超音波洗浄し、再度P-TESエタノール溶液にディップ、UV照射、エタノール超音波洗浄しサンプルを乾燥させた。その後、0.1wt%のA-TES水溶液に浸漬し、サンプルA-2を得た。
(Example 2)
A PPS plate (1130TX1, manufactured by Polyplastics) having a width of 30 mm, a length of 50 mm, and a thickness of 3 mm was ultrasonically cleaned with acetone for 10 minutes. After drying, the resultant was dipped in a 0.1 wt% P-TES ethanol solution (manufactured by Io Chemical Laboratory Co., Ltd.) and dried. After drying, UV irradiation was performed under the condition that the integrated light amount was 200 mJ / cm 2 . After UV irradiation, the sample was ultrasonically washed with ethanol, dipped again in a P-TES ethanol solution, irradiated with UV, ethanol ultrasonically washed, and the sample was dried. Thereafter, the sample was immersed in a 0.1 wt% A-TES aqueous solution to obtain a sample A-2.
 幅30mm、長さ50mm、厚さ79μmのPVDFフィルム((株)クレハ社製、#1000)をエタノールで10分間超音波洗浄しサンプルB-2を得た。 PV A 30 mm wide, 50 mm long, 79 μm thick PVDF film (# 1000, manufactured by Kureha Corporation) was ultrasonically washed with ethanol for 10 minutes to obtain a sample B-2.
 剥離試験時の持ち手部分を得るため、サンプルA-2の処理面の上端部にポリイミドテープを貼り、その上にサンプルB-2を乗せ、温度を180℃とした以外は実施例1と同様に熱プレス成形し、PVDFフィルムとPPS板との接合体を得た。 Same as Example 1 except that a polyimide tape was stuck on the upper end of the treated surface of sample A-2, and sample B-2 was placed thereon, and the temperature was set to 180 ° C. in order to obtain a handle portion during the peeling test. To obtain a bonded body of a PVDF film and a PPS plate.
 (実施例3)
 PPS板をPEEK板(Victrex社製、450G)とした以外は実施例2と同様の処理を行い、サンプルA-2の代わりにサンプルA-3を得た。次いで、サンプルA-2をサンプルA-3とした以外は実施例2と同様の処理を行い、PVDFフィルムとPEEK板との接合体を得た。
(Example 3)
The same processing as in Example 2 was performed except that the PPS plate was changed to a PEEK plate (450 G, manufactured by Victrex), and a sample A-3 was obtained instead of the sample A-2. Next, the same process as in Example 2 was performed except that Sample A-2 was changed to Sample A-3, to obtain a joined body of the PVDF film and the PEEK plate.
 (実施例4)
 PPS板を9Tポリアミド板(株式会社クラレ社製、ジェネスタTA-112)とした以外は実施例2と同様の処理を行い、サンプルA-2の代わりにサンプルA-4を得た。次いで、サンプルA-2をサンプルA-4とした以外は実施例2と同様の処理を行い、PVDFフィルムと9Tポリアミド板との接合体を得た。
(Example 4)
A sample A-4 was obtained in place of the sample A-2, except that the PPS plate was changed to a 9T polyamide plate (Kuraray Co., Genestar TA-112). Next, the same process as in Example 2 was performed except that Sample A-2 was changed to Sample A-4, to obtain a joined body of a PVDF film and a 9T polyamide plate.
 (実施例5)
 幅25mm、長さ100mm、厚さ1.6mmの鋼板((株)テストピース社製、SPCC)をアセトンで10分間超音波洗浄した。乾燥後、0.1wt%A-TES水溶液に浸漬し、サンプルA-5を得た。
(Example 5)
A steel plate (SPCC, manufactured by Testpiece Co., Ltd.) having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm was ultrasonically cleaned with acetone for 10 minutes. After drying, it was immersed in a 0.1 wt% A-TES aqueous solution to obtain a sample A-5.
 幅25mm、長さ100mm、厚さ79μmのPVDFフィルム((株)クレハ社製、#1000)をエタノールで10分間超音波洗浄しサンプルB-3を得た。 PV A 25 mm wide, 100 mm long and 79 μm thick PVDF film (# 1000, manufactured by Kureha Corporation) was ultrasonically washed with ethanol for 10 minutes to obtain a sample B-3.
 剥離試験時の持ち手部分を得るため、サンプルA-5の処理面の上端部にポリイミドテープを貼り、その上にサンプルB-3を乗せ、温度を180℃とした以外は実施例1と同様に熱プレス成形し、PVDFフィルムと鋼板との接合体を得た。 Same as Example 1 except that a polyimide tape was attached to the upper end of the treated surface of sample A-5, and sample B-3 was placed thereon, and the temperature was set to 180 ° C. in order to obtain a handle portion during the peeling test. To obtain a bonded body of a PVDF film and a steel sheet.
 (実施例6)
 鋼板を厚さ1.0mmのセラミックス板((株)テストピース社製、アルミナセラミックス)とした以外は実施例5と同様の処理を行い、サンプルA-5の代わりにサンプルA-6を得た。次いで、サンプルA-5をサンプルA-6とした以外は実施例5と同様の処理を行い、PVDFフィルムとセラミックス板との接合体を得た。
(Example 6)
A sample A-6 was obtained in place of the sample A-5, except that the steel plate was a ceramic plate having a thickness of 1.0 mm (alumina ceramics manufactured by Testpiece Co., Ltd.). . Next, the same process as in Example 5 was performed except that Sample A-5 was changed to Sample A-6, to obtain a joined body of the PVDF film and the ceramics plate.
 (実施例7)
 幅25mm、長さ100mm、厚さ1.6mmのAl板((株)テストピース社製、A5052P)をアセトンで10分間超音波洗浄した。乾燥後、SK-144((株)JCU社製)の5wt%水溶液に70℃、1分間浸漬させ、その後、イオン交換水で3分間超音波洗浄した。乾燥後、0.1wt%のA-TES水溶液に浸漬し、サンプルA-7を得た。
(Example 7)
An aluminum plate (A5052P, manufactured by Testpiece Co., Ltd.) having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm was ultrasonically cleaned with acetone for 10 minutes. After drying, it was immersed in a 5 wt% aqueous solution of SK-144 (manufactured by JCU Corporation) at 70 ° C. for 1 minute, and then ultrasonically washed with ion-exchanged water for 3 minutes. After drying, the sample was immersed in a 0.1 wt% A-TES aqueous solution to obtain a sample A-7.
 実施例5と同様の処理を行い、サンプルB-3を得た。 (4) The same processing as in Example 5 was performed to obtain a sample B-3.
 剥離試験時の持ち手部分を得るため、サンプルA-7の処理面の上端部にポリイミドテープを貼り、その上にサンプルB-3を乗せ、温度を180℃とした以外は実施例1と同様に熱プレス成形し、PVDFフィルムとAl板との接合体を得た。 Same as Example 1 except that a polyimide tape was attached to the upper end of the treated surface of sample A-7, and sample B-3 was placed thereon, and the temperature was set to 180 ° C. in order to obtain a handle portion during the peeling test. To obtain a bonded body of a PVDF film and an Al plate.
 (実施例8)
 A-TES水溶液を3-アミノプロリルトリエトキシシラン(以下:APS、東京化成工業株式会社製)水溶液とした以外は実施例7と同様の処理を行い、サンプルA-7の代わりにサンプルA-8を得た。次いで、サンプルA-7をサンプルA-8とした以外は実施例7と同様の処理を行い、PVDFフィルムとAl板との接合体を得た。
(Example 8)
The same treatment as in Example 7 was performed, except that the A-TES aqueous solution was changed to an aqueous solution of 3-aminoprolyltriethoxysilane (hereinafter, APS, manufactured by Tokyo Chemical Industry Co., Ltd.). 8 was obtained. Next, the same process as in Example 7 was performed except that Sample A-7 was changed to Sample A-8, to obtain a joined body of the PVDF film and the Al plate.
 (実施例9)
 本実施例では、実施例8と異なり、Al板ではなくPVDFフィルムに対して、分子接合剤を用いた処理を行った。
(Example 9)
In this example, unlike Example 8, a treatment using a molecular bonding agent was performed on a PVDF film instead of an Al plate.
 幅25mm、長さ100mm、厚さ1.6mmのAl板((株)テストピース社製、A5052P)をアセトンで10分間超音波洗浄した。乾燥後、SK-144((株)JCU社製)の5wt%水溶液に70℃、1分間浸漬させ、その後、イオン交換水で3分間超音波洗浄し、サンプルA-9を得た。 (5) An Al plate (A5052P, manufactured by Testpiece Co., Ltd.) having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm was ultrasonically cleaned with acetone for 10 minutes. After drying, the sample was immersed in a 5 wt% aqueous solution of SK-144 (manufactured by JCU Corporation) at 70 ° C. for 1 minute, and then ultrasonically washed with ion-exchanged water for 3 minutes to obtain a sample A-9.
 幅25mm、長さ100mm、厚さ79μmのPVDFフィルム((株)クレハ社製、#1000)をエタノールで10分間超音波洗浄した。乾燥後、実施例1と同様の条件でコロナ処理を行った。その後、1.0wt%APS水溶液を塗布して、サンプルB-4を得た。 25 A 25 mm wide, 100 mm long, 79 μm thick PVDF film (# 1000, manufactured by Kureha Corporation) was ultrasonically cleaned with ethanol for 10 minutes. After drying, a corona treatment was performed under the same conditions as in Example 1. Thereafter, a 1.0 wt% APS aqueous solution was applied to obtain a sample B-4.
 剥離試験時の持ち手部分を得るため、サンプルA-9の処理面の上端部にポリイミドテープを貼り、その上にサンプルB-4を乗せ、実施例7と同様に熱プレス成型し、PVDFフィルムとAl板との接合体を得た。 In order to obtain a handle portion during the peeling test, a polyimide tape was attached to the upper end of the treated surface of sample A-9, sample B-4 was placed thereon, and hot press molding was performed as in Example 7, and a PVDF film was formed. And an Al plate were obtained.
 (比較例1)
 幅25mm、長さ100mm、厚さ1.6mmのAl板((株)テストピース社製、A5052P)をアセトンで10分間超音波洗浄した。その後、乾燥しサンプルA-10を得た。
(Comparative Example 1)
An aluminum plate (A5052P, manufactured by Testpiece Co., Ltd.) having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm was ultrasonically cleaned with acetone for 10 minutes. Thereafter, drying was performed to obtain a sample A-10.
 実施例5と同様の処理を行い、サンプルB-3を得た。 (4) The same processing as in Example 5 was performed to obtain a sample B-3.
 剥離試験時の持ち手部分を得るため、サンプルA-10の上端部にポリイミドテープを貼り、その上にサンプルB-3を乗せ、180℃、2MPa、5分間熱プレスしたが、冷却時にPVDFフィルムが剥離し、PVDFフィルムとAl板との接合体を得ることができなかった。 In order to obtain the handle portion during the peeling test, a polyimide tape was attached to the upper end of sample A-10, and sample B-3 was placed thereon, and hot pressed at 180 ° C., 2 MPa, and 5 minutes. Was peeled off, and a joined body of the PVDF film and the Al plate could not be obtained.
 〔剥離強度評価〕
 実施例1~7で得られた接合体について、それぞれ90°剥離強度試験を行い、評価した。90°剥離強度は、AUTOGRAPH AGS-1kNJ(株式会社島津製作所製)を用いて常温下で測定した。結果を表1に示す。
(Peeling strength evaluation)
Each of the joined bodies obtained in Examples 1 to 7 was evaluated by performing a 90 ° peel strength test. The 90 ° peel strength was measured at room temperature using AUTOGRAPH AGS-1kNJ (manufactured by Shimadzu Corporation). Table 1 shows the results.
Figure JPOXMLDOC01-appb-T000009
 表1に示す通り、得られた接合体ではいずれも高い剥離強度が確認された。
Figure JPOXMLDOC01-appb-T000009
As shown in Table 1, in each of the obtained joined bodies, high peel strength was confirmed.

Claims (14)

  1.  フッ化ビニリデン由来の構成単位を主成分とするフッ化ビニリデン重合体から成形された成形体と、
     上記成形体に接合された被接合体と、を備え、
     上記成形体と上記被接合体との接合は、分子接合剤を介したものであり、
     上記分子接合剤は、-NX、およびアルコキシシリル基またはシラノール基を有する化合物であり、ここでXおよびXは、それぞれ独立に、水素原子または炭素数1~5のアルキル基であり、
     90°剥離試験による上記成形体と上記被接合体との剥離強度が0.6N/mmより大きい、接合体。
    A molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component,
    A joined body joined to the molded body,
    Bonding of the molded body and the body to be bonded is through a molecular bonding agent,
    The molecular bonding agent is a compound having —NX 1 X 2 and an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. Yes,
    A joined body having a peel strength of greater than 0.6 N / mm between the molded body and the joined body in a 90 ° peel test.
  2.  上記被接合体が、樹脂または金属から成形されている、請求項1に記載の接合体。 接合 The joined body according to claim 1, wherein the joined body is formed of resin or metal.
  3.  上記Xが、水素原子である、請求項1または2に記載の接合体。 The conjugate according to claim 1, wherein X 1 is a hydrogen atom.
  4.  上記分子接合剤が、以下の一般式(I)で表される化合物である、請求項1~3のいずれか1項に記載の接合体。
    Figure JPOXMLDOC01-appb-C000001
     (式中、Rは、水素原子、炭素数1~5のアルキル基、炭素数1~5のアミノアルキル基または以下の一般式(II)で表され、Rは炭素数1~10のアルキレン基であり、R~Rは、それぞれ独立に、ヒドロキシ基、炭素数1~5のアルコキシ基または炭素数1~5のアルキル基であり、R~Rの少なくとも1つはヒドロキシ基または炭素数1~5のアルコキシ基であり、Rは、炭素数1~10のアルキレン基であり、Rは、-NH-R-NHまたは-NR10であり、Rは、炭素数1~10のアルキレン基であり、RおよびR10は、それぞれ独立に、炭素数1~5のアルキル基である。式(II)中、*印は、式(I)のRが結合している窒素原子との結合部位である。)
    Figure JPOXMLDOC01-appb-C000002
    The conjugate according to any one of claims 1 to 3, wherein the molecular bonding agent is a compound represented by the following general formula (I).
    Figure JPOXMLDOC01-appb-C000001
    (Wherein, R 1 is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an aminoalkyl group having 1 to 5 carbon atoms, or the following general formula (II), and R 2 is a group having 1 to 10 carbon atoms. R 3 to R 5 are each independently a hydroxy group, an alkoxy group having 1 to 5 carbon atoms or an alkyl group having 1 to 5 carbon atoms, and at least one of R 3 to R 5 is a hydroxy group; A group or an alkoxy group having 1 to 5 carbon atoms, R 6 is an alkylene group having 1 to 10 carbon atoms, R 7 is —NH—R 8 —NH 2 or —NR 9 R 10 ; 8 is an alkylene group having 1 to 10 carbon atoms, and R 9 and R 10 are each independently an alkyl group having 1 to 5 carbon atoms. Is the bonding site with the nitrogen atom to which R 1 is bonded.)
    Figure JPOXMLDOC01-appb-C000002
  5.  上記Rが、上記一般式(II)で表される、請求項4に記載の接合体。 The conjugate according to claim 4, wherein the R 1 is represented by the general formula (II).
  6.  上記分子接合剤が、N-N’-ビス(2-アミノエチル)-6-(3-トリエトキシシリルプロピル)アミノ-1,3,5-トリアジン-2,4-ジアミンである、請求項1~5のいずれか1項に記載の接合体。 The method according to claim 1, wherein the molecular bonding agent is NN'-bis (2-aminoethyl) -6- (3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-diamine. 6. The conjugate according to any one of items 5 to 5.
  7.  上記Rが水素原子である、請求項4に記載の接合体。 The conjugate according to claim 4, wherein said R 1 is a hydrogen atom.
  8.  上記成形体と上記被接合体との距離が0.1μm以下である、請求項1~7のいずれか1項に記載の接合体。 (8) The joined body according to any one of (1) to (7), wherein a distance between the molded body and the joined body is 0.1 μm or less.
  9.  フッ化ビニリデン由来の構成単位を主成分とするフッ化ビニリデン重合体から成形された成形体および上記成形体に接合させる被接合体の一方または両方を、分子接合剤を含む溶液を用いて表面処理する表面処理工程、および
     上記表面処理工程後、上記成形体と上記被接合体とを80℃以上で当接させる当接工程を含み、
     上記分子接合剤は、-NX、およびアルコキシシリル基またはシラノール基を有する化合物であり、ここでXおよびXは、それぞれ独立に、水素原子または炭素数1~5のアルキル基である、接合体の製造方法。
    Surface treatment of one or both of a molded article molded from a vinylidene fluoride polymer having a structural unit derived from vinylidene fluoride as a main component and an object to be joined to the molded article using a solution containing a molecular bonding agent Surface treatment step, and after the surface treatment step, including a contact step of contacting the molded body and the object to be bonded at 80 ° C. or more,
    The molecular bonding agent is a compound having —NX 1 X 2 and an alkoxysilyl group or a silanol group, wherein X 1 and X 2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. A method for manufacturing a joined body.
  10.  上記表面処理工程では、上記成形体および上記被接合体の両方を表面処理する、請求項9に記載の接合体の製造方法。 The method for manufacturing a joined body according to claim 9, wherein in the surface treatment step, both the molded body and the joined body are subjected to surface treatment.
  11.  上記表面処理工程の前に、上記分子接合剤を被接合体に結合させるための処理を含む、請求項9に記載の接合体の製造方法。 The method for producing a joined body according to claim 9, further comprising a treatment for binding the molecular joining agent to the joined body before the surface treatment step.
  12.  上記当接工程は、プレスする工程である、請求項9~11のいずれか1項に記載の接合体の製造方法。 The method for producing a joined body according to any one of claims 9 to 11, wherein the contacting step is a pressing step.
  13.  上記当接工程は、射出成形する工程である、請求項9~11のいずれか1項に記載の接合体の製造方法。 The method for producing a joined body according to any one of claims 9 to 11, wherein the contacting step is an injection molding step.
  14.  上記溶液における上記分子接合剤の含有量は、1wt%以下である、請求項9~13のいずれか1項に記載の接合体の製造方法。 The method for producing a joined body according to any one of claims 9 to 13, wherein the content of the molecular joining agent in the solution is 1 wt% or less.
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JPH10293492A (en) * 1997-03-26 1998-11-04 Xerox Corp Fuser member
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Publication number Priority date Publication date Assignee Title
JPH0796575A (en) * 1993-09-29 1995-04-11 Tokai Rubber Ind Ltd Laminate and its production
JPH10293492A (en) * 1997-03-26 1998-11-04 Xerox Corp Fuser member
JP2004536722A (en) * 2001-05-21 2004-12-09 スリーエム イノベイティブ プロパティズ カンパニー Adhesion of fluoropolymer
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JP2015096326A (en) * 2013-10-11 2015-05-21 住友電工プリントサーキット株式会社 Method for producing fluorine resin substrate and printed wiring board

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Publication number Priority date Publication date Assignee Title
CN115214256A (en) * 2022-07-14 2022-10-21 艾尔玛科技股份有限公司 In-mold injection molding decorative film with surface texture touch feeling
CN115214256B (en) * 2022-07-14 2023-06-16 艾尔玛科技股份有限公司 In-mold injection molding decorative film with surface texture touch feeling

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