WO2019237600A1 - Acrylic pressure sensitive adhesive and preparation method thereof, composite film structure, diaphragm, and sound producing device - Google Patents

Abstract

Provided are an acrylic pressure sensitive adhesive and preparation method thereof, a composite film structure using the acrylic pressure sensitive adhesive, a diaphragm using the composite film structure and a sound producing device using the diaphragm. Raw materials for producing the acrylic pressure sensitive adhesive by weight comprise: 30 to 45 parts of soft monomer, 5 to 20 parts of hard monomer, 1 to 10 parts of functional monomer, 0.01 to 1 part of initiator, 0.01 to 1 part of crosslinking agent, 30 to 45 parts of organic solvent, and 5 to 10 parts of damping modifier. The diaphragm using the acrylic pressure sensitive adhesive still has better damping performance without increasing the thickness of the pressure sensitive adhesive, so as to solve the low frequency distortion problem of the sound producing device.

Description

Acrylic pressure-sensitive adhesive and preparation method thereof, composite membrane structure, diaphragm, and sound generating device Technical field

The present invention relates to the technical field of sound generating devices, and in particular, to an acrylic pressure-sensitive adhesive, a method for preparing the acrylic pressure-sensitive adhesive, a composite film structure using the acrylic pressure-sensitive adhesive, a diaphragm using the composite film structure, and A sound generating device using the diaphragm.

Background technique

In the field of sound generators, there have been technical problems with high low-frequency distortion. In order to improve the low-frequency performance of the sound generating device, it is generally implemented by increasing the thickness of the pressure-sensitive adhesive in the diaphragm. However, an increase in the thickness of the pressure-sensitive adhesive will lead to an increase in the weight of the diaphragm, thereby increasing the load on the sound generating device.

Summary of the Invention

In view of the above problems, the present invention provides an acrylic pressure-sensitive adhesive, which aims to make the diaphragm applied with the acrylic pressure-sensitive adhesive have better damping performance without increasing the thickness of the pressure-sensitive adhesive to solve the problem. Low-frequency distortion of the sound generator.

In order to solve the above technical problems, according to parts by weight, the raw materials for making the acrylic pressure-sensitive adhesive include:

30 ~ 45 parts of soft monomer;

5-20 parts of hard monomer;

1-10 parts of functional monomer;

0.01 ～ 1 part of initiator;

Crosslinking agent 0.01 ～ 1 part;

5-10 parts of damping modifier; and

30 to 45 parts of organic solvent.

Further, the soft monomer is n-butyl acrylate and / or 2-ethylhexyl acrylate; and / or,

The hard monomer is at least one of methyl methacrylate, styrene, and acrylic acid; and / or,

The functional monomer is at least one of methacrylic acid, acrylamide, and acrylic acid; and / or,

The initiator is benzoyl peroxide and / or azobisisobutyronitrile; and / or,

The cross-linking agent is ethyl isocyanate methacrylate and / or aluminum acetate; and / or,

The damping modifier is at least one of nitrile rubber, neoprene, chlorinated polyethylene rubber, and butyl rubber; and / or,

The organic solvent is at least one of benzene, toluene, ethyl acetate, xylene, N-methylpyrrolidone and methyl ethyl ketone.

The invention also provides a method for preparing an acrylic pressure-sensitive adhesive, including the following steps:

5 to 10 parts of a damping modifier and 30 to 45 parts of an organic solvent are provided by weight part, and the damping modifier is added to the organic solvent to obtain a mixture;

Provide 30 to 45 parts of soft monomers, 5 to 20 parts of hard monomers, 1 to 10 parts of functional monomers, and 0.01 to 1 part of initiators, and add soft monomers, hard monomers, and functional monomers to the mixture And initiator, and heat treatment to obtain colloid;

Provide 0.01 to 1 part of a cross-linking agent, and add the cross-linking agent to the colloid; and

The colloid added with a crosslinking agent is dried to obtain a pressure-sensitive adhesive.

Further, the step of drying the colloid added with a cross-linking agent includes sequentially performing a first drying treatment and a second drying treatment on the colloid added with a cross-linking agent, and the first drying The drying temperature of the treatment is 70 to 100 ° C, the drying time is 2 to 3 minutes, the drying temperature of the second drying treatment is 130 to 150 ° C, and the drying time is 2 to 3 minutes; and / or,

The heating temperature of the heat treatment is 75 to 85 ° C, and the heating time is 6 to 8 hours.

The present invention also provides a composite film structure, which includes two first substrate layers and at least one first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer is sandwiched between the two first substrates. Between the material layers, at least one of the two first substrate layers is a plastic substrate layer, and the material of the first pressure-sensitive adhesive layer is the acrylic pressure-sensitive adhesive described in the above embodiment.

Further, the material of the plastic substrate layer is polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, polyethylene naphthalate, and polyterephthalic acid. At least one of glycol esters; and / or,

The thickness of the first substrate layer ranges from 2 to 40 μm; and / or,

The thickness of the first pressure-sensitive adhesive layer ranges from 2 to 40 μm.

Further, the composite film structure includes a second pressure-sensitive adhesive layer and a second substrate layer. The second substrate layer includes a first surface and a second surface opposite to each other. The first pressure-sensitive adhesive layer is sandwiched between the first pressure-sensitive adhesive layer and the second surface. Between the first surface of the two substrate layers and a first substrate layer, the second pressure-sensitive adhesive layer is sandwiched between the second surface of the second substrate layer and another first substrate layer, and the second The material of the pressure-sensitive adhesive layer is the same as that of the first pressure-sensitive adhesive layer, or the material of the second pressure-sensitive adhesive layer is a silicone-based pressure-sensitive adhesive.

Further, the second substrate layer is a thermoplastic elastomer layer or an engineering plastic layer, and the thermoplastic elastomer layer is selected from a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer At least one of the engineering plastic layer is selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, polyethylene naphthalate, polyterephthalate At least one of ethylene glycol formate and polybutylene terephthalate; and / or,

The thickness of the second pressure-sensitive adhesive layer ranges from 2 to 40 μm; and / or,

The thickness of the second substrate layer ranges from 1 to 30 μm.

The present invention also provides a composite film structure, which includes two first substrate layers and at least one first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer is sandwiched between the two first substrates. Between the material layers, at least one of the two first substrate layers is a thermoplastic elastomer layer, and the material of the first pressure-sensitive adhesive layer is the acrylic pressure-sensitive adhesive described in the above embodiment.

Further, the material of the thermoplastic elastomer layer includes at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer; and / or,

The thickness of the first substrate layer ranges from 5 to 40 μm; and / or,

The thickness of the first pressure-sensitive adhesive layer ranges from 2 to 40 μm.

Further, the two substrate layers are both thermoplastic elastomer layers, and the composite film structure includes a first thermoplastic elastomer layer, the first pressure-sensitive adhesive layer, and a second thermoplastic elastomer layer that are sequentially stacked.

Further, the materials of the first thermoplastic elastomer layer and the second thermoplastic elastomer layer are the same.

Further, the composite film structure includes a second pressure-sensitive adhesive layer and a second substrate layer. The second substrate layer includes a first surface and a second surface opposite to each other. The first pressure-sensitive adhesive layer is sandwiched between the first pressure-sensitive adhesive layer and the second surface. Between the first surface of the two substrate layers and a first substrate layer, the second pressure-sensitive adhesive layer is sandwiched between the second surface of the second substrate layer and another first substrate layer, and the second The material of the pressure-sensitive adhesive layer is the same as that of the first pressure-sensitive adhesive layer, or the material of the second pressure-sensitive adhesive layer is a silicone-based pressure-sensitive adhesive.

Further, the material of the second substrate layer is a thermoplastic elastomer or an engineering plastic, and the thermoplastic elastomer is selected from the group consisting of thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, thermoplastic polyamide elastomer, and silicone elastomer. At least one, the engineering plastic is selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, polyethylene naphthalate, and polyethylene terephthalate At least one of a glycol ester and polybutylene terephthalate; and / or,

The thickness of the second pressure-sensitive adhesive layer ranges from 2 to 40 μm; and / or,

The thickness of the second substrate layer ranges from 1 to 30 μm.

The invention also provides a diaphragm, which has the composite film structure described in the above embodiment.

The invention also provides a sound generating device, which comprises the diaphragm described in the above embodiment.

According to parts by weight, the raw materials for making the acrylic pressure-sensitive adhesive according to the technical solution of the present invention include: 30 to 45 parts of soft monomers, 5 to 20 parts of hard monomers, 1 to 10 parts of functional monomers, 0.01 to 1 part of initiator, 0.01 to 1 part of cross-linking agent, 30 to 45 parts of organic solvent and 5 to 10 parts of damping modifier. The soft monomer, hard monomer and functional monomer will undergo polymerization reaction under the action of the initiator, and cross-link A cross-linking reaction further occurs under the action of a cross-linking agent, thereby generating an acrylic pressure-sensitive adhesive having a three-dimensional network structure. The three-dimensional network structure can make the acrylic pressure-sensitive adhesive have a dense structure to make the acrylic pressure-sensitive adhesive. It has better damping performance, and the addition of a damping modifier can further improve the damping performance of the acrylic pressure-sensitive adhesive. When the acrylic pressure-sensitive adhesive is applied to the diaphragm, the diaphragm can ensure better damping performance without increasing the thickness of the acrylic pressure-sensitive adhesive, thereby solving the problem of low-frequency distortion of the sound device.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structure shown in the drawings without paying creative labor.

FIG. 1 is a cross-sectional view of a first embodiment of a composite membrane structure of the present invention.

FIG. 2 is a cross-sectional view of a second embodiment of the composite membrane structure of the present invention.

3 is a cross-sectional view of an embodiment of a diaphragm according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

Label	name	Label		name
100	Composite membrane structure	51	First surface
10	First substrate layer	53	Second surface
30	First pressure-sensitive adhesive layer	200	Diaphragm
30 ’	Second pressure-sensitive adhesive layer	twenty one	Folding ring
50	Second substrate layer	twenty three	Ball top

The realization of the purpose, functional characteristics and advantages of the present invention will be further described with reference to the embodiments and the drawings.

detailed description

In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between components in a specific posture (as shown in the drawings). The relative positional relationship, movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.

It should also be noted that when an element is referred to as being "fixed to" or "disposed to" another element, it may be directly on the other element or a centered element may be present at the same time. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present concurrently.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on those that can be realized by a person of ordinary skill in the art. When the combination of technical solutions conflicts or cannot be achieved, such a combination of technical solutions should be considered non-existent. , Is not within the scope of protection claimed by the present invention.

The invention provides an acrylic pressure-sensitive adhesive.

By weight parts, the raw materials for making acrylic pressure-sensitive adhesives include:

30 ~ 45 parts of soft monomer;

5-20 parts of hard monomer;

1-10 parts of functional monomer;

0.01 ～ 1 part of initiator;

Crosslinking agent 0.01 ～ 1 part;

5-10 parts of damping modifier; and

30 to 45 parts of organic solvent.

According to parts by weight, the raw materials for making the acrylic pressure-sensitive adhesive according to the technical solution of the present invention include: 30 to 45 parts of soft monomers, 5 to 20 parts of hard monomers, 1 to 10 parts of functional monomers, 0.01 to 1 part of initiator, 0.01 to 1 part of cross-linking agent, 30 to 45 parts of organic solvent and 5 to 10 parts of damping modifier. The soft monomer, hard monomer and functional monomer will undergo polymerization reaction under the action of the initiator, and cross-link A cross-linking reaction further occurs under the action of a cross-linking agent, thereby generating an acrylic pressure-sensitive adhesive having a three-dimensional network structure. The three-dimensional network structure can make the acrylic pressure-sensitive adhesive have a dense structure to make the acrylic pressure-sensitive adhesive. It has better damping performance, and the addition of damping modifier can further improve the damping performance of acrylic pressure-sensitive adhesive. When the acrylic pressure-sensitive adhesive is applied to the diaphragm, the diaphragm can still ensure better damping performance without increasing the thickness of the acrylic pressure-sensitive adhesive, thereby solving the problem of low-frequency distortion of the sound device.

The soft monomer is n-butyl acrylate and / or 2-ethylhexyl acrylate.

Soft monomers provide initial tack and peel strength for acrylic pressure-sensitive adhesives. If the amount of soft monomer is too small, the wettability and initial tack of acrylic pressure-sensitive adhesive are too poor; if too much is used, the acrylic pressure-sensitive adhesive's holding power is too poor.

The hard monomer is at least one of methyl methacrylate, styrene, and acrylic acid. If the amount of the hard monomer is too small, the cohesive force of the acrylic pressure-sensitive adhesive is insufficient; if it is too large, the initial viscosity of the acrylic pressure-sensitive adhesive is poor.

The functional monomer is at least one of methacrylic acid, acrylamide, and acrylic acid.

Functional monomers can be used to adjust the adhesion of acrylic pressure-sensitive adhesives to substrates.

The initiator is benzoyl peroxide and / or azobisisobutyronitrile.

The role of the initiator is to provide free radicals for the polymerization of acrylic monomers. If the amount is too small, the conversion rate of the acrylic pressure-sensitive adhesive will be reduced, and the polymerization reaction will not be complete. As a result, the cohesive force of the acrylic pressure-sensitive adhesive is reduced.

The cross-linking agent is ethyl isocyanate methacrylate and / or aluminum acetate.

The role of the cross-linking monomer causes a cross-linking reaction between the soft monomer, the hard monomer and the functional monomer, and increases the cohesive force of the acrylic pressure-sensitive adhesive. If the amount is too small, the degree of crosslinking of the acrylic pressure-sensitive adhesive is insufficient, which will lead to degumming; if the amount is too large, the crosslinking will be excessive, which will cause the initial viscosity of the acrylic pressure-sensitive adhesive to be seriously reduced.

The damping modifier is at least one of a nitrile rubber, a neoprene rubber, a chlorinated polyethylene rubber, and a butyl rubber.

The damping modifier has better damping characteristics. After adding it to the acrylic pressure-sensitive adhesive, the damping characteristics of the acrylic pressure-sensitive adhesive can be greatly improved.

The organic solvent is at least one of benzene, toluene, ethyl acetate, xylene, N-methylpyrrolidone and methyl ethyl ketone.

The soft monomer, the hard monomer, the functional monomer, the initiator, the cross-linking agent, and the damping modifier are soluble in the organic solvent.

It should be noted that, for the above soft monomers, hard monomers, functional monomers, initiators, cross-linking agents, organic solvents, and damping modifiers, other materials may also be used, and the present invention does not limit this.

The invention also provides a method for preparing an acrylic pressure-sensitive adhesive, including the following steps:

5 to 10 parts of damping modifier and 30 to 45 parts of organic solvent are provided by weight part, and the damping modifier is added to the organic solvent to obtain a mixture;

Provide 30 to 45 parts of soft monomers, 5 to 20 parts of hard monomers, 1 to 10 parts of functional monomers, and 0.01 to 1 part of initiators. Add soft monomers, hard monomers, functional monomers and initiators to the mixture. Agent and heat treatment to obtain colloid;

Provide 0.01 to 1 part of the cross-linking agent. After the colloid is cooled, add the cross-linking agent to the colloid; and

The colloid containing the crosslinking agent is dried to obtain an acrylic pressure-sensitive adhesive.

Understandably, the damping modifier can be plasticized on an open mill for 10 to 15 minutes before being put into an organic solvent.

The organic solvent is at least one of benzene, toluene, ethyl acetate, xylene, N-methylpyrrolidone and methyl ethyl ketone.

In an embodiment of the present invention, when the colloid added with a crosslinking agent is dried to obtain an acrylic pressure-sensitive adhesive, the colloid may be coated on a substrate, and then the colloid is dried.

The material of the substrate may be a thermoplastic elastomer layer, a release film or an engineering plastic layer. The thermoplastic elastomer layer is selected from at least a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer. One, the engineering plastic layer is selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, polyethylene naphthalate, polyethylene terephthalate Ester and at least one of polybutylene terephthalate.

The soft monomer, the hard monomer and the functional monomer of the technical solution of the present invention undergo a polymerization reaction under the action of an initiator, and further undergo a cross-linking reaction under the action of a cross-linking agent, thereby generating acrylic acid having a three-dimensional network structure. Pressure-sensitive adhesive, the three-dimensional network structure can make the acrylic pressure-sensitive adhesive have a dense structure, so that the acrylic pressure-sensitive adhesive has better damping performance, and the addition of a damping modifier can further improve the pressure-sensitive adhesive Damping performance of pressure-sensitive adhesive. When the acrylic pressure-sensitive adhesive is applied to the diaphragm, the diaphragm can ensure better damping performance without increasing the thickness of the acrylic pressure-sensitive adhesive, thereby solving the problem of low-frequency distortion of the sound device.

The step of drying the colloid added with the crosslinking agent includes sequentially performing the first drying treatment and the second drying treatment on the colloid added with the crosslinking agent, and the drying temperature of the first drying treatment is 70 to 100. ℃, drying time is 2 ~ 3min, drying temperature of the second drying treatment is 130 ~ 150 ° C, drying time is 2 ~ 3min.

The first drying process removes organic solvents from the colloid.

The second drying treatment can further cause a crosslinking reaction between the soft monomer, the hard monomer and the functional monomer, so as to cure the colloid to obtain an acrylic pressure-sensitive adhesive.

In the above steps, 30 to 45 parts of soft monomers, 5 to 20 parts of hard monomers, 1 to 10 parts of functional monomers, and 0.01 to 1 part of initiator are provided, and soft monomers, hard monomers, and functional monomers are added to the mixture. Body and initiator, and heat treatment to obtain colloid, the heating temperature of the heat treatment is 75-85 ° C, and the heating time is 6-8h.

During the heat treatment, the polymerization of the soft monomers, hard monomers, and functional monomers occurs under the action of the initiator.

Referring to FIG. 1, the present invention also provides a composite film structure 100. The composite film structure 100 includes two first substrate layers 10 and at least one first pressure-sensitive adhesive layer 30 sandwiched therebetween. Between the two first substrate layers 10, at least one of the two first substrate layers 10 is a plastic substrate layer, and the material of the first pressure-sensitive adhesive layer 10 is the acrylic pressure-sensitive adhesive described in the above embodiment. gum.

Since the composite membrane structure 100 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described in detail here.

The material of the plastic substrate layer includes polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, polyethylene naphthalate, polyethylene terephthalate At least one of. When another layer in the first substrate layer is not a plastic substrate layer, the material may include at least one of a polyester elastomer, a polyurethane elastomer, and a silicone elastomer. Of course, other materials may also be used. The invention does not limit this.

The thickness of the first base material layer 10 ranges from 2 to 40 μm. ,

Optionally, the thickness of the first substrate layer 10 is 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm , 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, or 40 μm.

It can be understood that the two first substrate layers 10 can be made of the same material or different materials.

At least one of the first substrate layers 10 in the technical solution of the present invention is a plastic substrate layer, and the material of the plastic substrate layer is selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, and polyimide At least one of polyphenylene sulfide, polyethylene naphthalate, and polyethylene terephthalate, so that the softening temperature of at least one of the first substrate layers 10 is greater than 80 ° C, It has good high temperature resistance, and the thickness of the first substrate layer 10 is 5 to 40 μm, so that the composite film structure 100 not only has better strength and resilience, but also has excellent structural stability and high resistance. High temperature resistance.

The thickness of the first pressure-sensitive adhesive layer 30 ranges from 2 to 40 μm.

Optionally, the thickness of the pressure-sensitive adhesive layer 30 is 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, or 40 μm.

The thickness of the first pressure-sensitive adhesive layer 30 of the technical solution of the present invention ranges from 2 to 40 μm, so that the composite film structure 100 using the first pressure-sensitive adhesive layer 30 has better high temperature resistance characteristics, even when the input voltage increases, The rigidity and damping performance of the composite membrane structure 100 will not be significantly reduced.

Further, the two base material layers 10 are both plastic base material layers. At this time, the composite film structure 100 is a first plastic substrate layer, a first pressure-sensitive adhesive layer, and a second plastic substrate layer that are sequentially stacked. The materials of the first thermoplastic substrate layer and the second plastic substrate layer may be the same or different.

Optionally, the materials of the first plastic substrate layer and the second plastic substrate layer are the same, for example, both are polyetheretherketone. At this time, the composite film structure is a polyetheretherketone, an acrylic pressure-sensitive adhesive, and a polyetheretherketone structure which are sequentially stacked. Wherein, the acrylic pressure-sensitive adhesive is the acrylic pressure-sensitive adhesive modified by the damping modifier in the above embodiment.

Referring to FIG. 2, the composite film structure 100 further includes a second pressure-sensitive adhesive layer 30 ′ and a second substrate layer 50. The second substrate layer 50 includes a first surface 51 and a second surface 53 opposite to each other. The adhesive layer 30 is sandwiched between the first surface 51 of the second substrate layer 50 and a first substrate layer 10, and the second pressure-sensitive adhesive layer 30 ′ is sandwiched between the second surface 53 of the second substrate layer 50. Between the first pressure-sensitive adhesive layer 30 ′ and another first substrate layer 10, the material of the second pressure-sensitive adhesive layer 30 ′ is the same as that of the first pressure-sensitive adhesive layer 30, or the material of the second pressure-sensitive adhesive layer 30 ′ is silicone Class pressure-sensitive adhesive. Of course, the material of the second pressure-sensitive adhesive layer 30 'may also be an adhesive of other materials, which is not limited in the present invention.

The material of the second substrate layer 50 is a thermoplastic elastomer or an engineering plastic. The thermoplastic elastomer is selected from at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer. The engineering plastic Selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, polyethylene naphthalate, polyethylene terephthalate, and polyterephthalate At least one of butylene glycol formate.

The thickness of the second pressure-sensitive adhesive layer 30 'ranges from 2 to 40 m.

The thickness of the second base material layer 50 ranges from 1 to 30 μm.

Optionally, the thickness of the second pressure-sensitive adhesive layer 30 'is 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, or 40 μm.

Optionally, the thickness of the second substrate layer 50 is 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm , 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, or 30 μm.

The composite film structure 100 of the technical solution of the present invention includes two layers of a first substrate layer 10, a first pressure-sensitive adhesive layer 30, a second pressure-sensitive adhesive 30 ', and a second substrate layer 50, one of which is a pressure-sensitive adhesive layer 30 It is sandwiched between the first surface 51 of the second substrate layer 50 and a first substrate layer 10, and the second pressure-sensitive adhesive layer 30 'is sandwiched between the second surface 53 of the second substrate layer 50 and another Between the first substrate layers 10 to increase the stiffness and anti-polarization capability of the composite film structure 100.

The material of the second pressure-sensitive adhesive layer 30 'may be a silicone-based pressure-sensitive adhesive. The raw materials of the silicone pressure-sensitive adhesive include:

20 to 80 parts of silicone resin;

0.1 to 5 parts of catalyst;

5 to 55 parts of silicone rubber; and

30 to 90 parts of organic solvent.

The catalyst is an organic complex of platinum or an organic tin compound.

The main role of the catalyst is to speed up the reaction.

The concentration of the platinum organic complex is 1 to 100 ul / L. The organic complex of platinum may be at least one of a solution of chloroplatinic acid polysiloxane, a chloroplatinic acid isopropanol complex, and a chloroplatinic acid diethyl phthalate complex.

The organic tin-based compound is at least one selected from the group consisting of dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin diacetate, and stannous octoate.

The organic solvent is at least one of benzene, toluene, ethyl acetate, xylene, N-methylpyrrolidone and methyl ethyl ketone. The silicone resin and the silicone rubber can be dissolved in the organic solvent for uniform mixing.

The manufacturing materials of the second pressure-sensitive adhesive layer 30 'of the technical solution of the present invention include: 20 to 80 parts of silicone resin, 30 to 90 parts of organic solvent, 0.1 to 5 parts of catalyst, 5 to 55 parts of silicone rubber, and silicone rubber. A condensation reaction occurs with the silicone resin, a cross-linking reaction occurs between the silicone rubber, and the catalyst accelerates the reaction speed, thereby generating a three-dimensional network-structured silicone pressure-sensitive adhesive. The three-dimensional network structure can make the The silicone pressure-sensitive adhesive has a dense structure, so that the silicone pressure-sensitive adhesive has better high temperature resistance, and the silicone resin has the advantages of large molecular weight and high modulus. The silicone resin is set to 20 to 80 parts. In order to make the silicone-based pressure-sensitive adhesive also have better compactness and adhesion, the silicone rubber is set to 5 to 55 parts to improve the film-forming property, adhesiveness and return of the silicone-based pressure-sensitive adhesive. The elasticity makes the diaphragm using the silicone pressure-sensitive adhesive not to cause polarization phenomenon during the vibration process, so that the sound generating device using the diaphragm has better sound quality and listening stability.

The second pressure-sensitive adhesive layer 30 'of the present invention has high damping property, and its loss factor is ≥0.5.

The second pressure-sensitive adhesive layer 30 'of the present invention has better high temperature holding viscosity. In a test environment at 150 ° C, its falling time is more than 1 hour.

The silicone resin includes an M chain link and a Q chain link. The M chain link is

The Q chain link is

Here, R ₁ is a methyl group, a hydrogen group, or a vinyl group, and the range of m is 15-20.

The number ratio between the M chain links and the Q chain links is 1: 0.6 to 0.9.

The M chain link of the silicone resin can improve the compatibility with the silicone rubber and play a role of increasing the viscosity. The Q chain link has a reinforcing effect and can improve the cohesive strength of the second pressure-sensitive adhesive layer 30 'produced. When the number of M chain links and Q chain links is relatively small, the compatibility between the silicone resin and the silicone rubber is poor, and when the number of M chain links and Q chain links is relatively large, the second pressure-sensitive adhesive layer 30 is obtained. 'Cohesive strength is poor. The number ratio of the M chain link and the Q chain link in the technical solution of the present invention is set to 1: 0.6 to 0.9, which not only can make the silicone resin and the silicone rubber have better compatibility, so that the second pressure The sensitive adhesive layer 30 'has good comprehensive performance and high solid content, and can also make the second pressure-sensitive adhesive layer 30' prepared with better elasticity and cohesive strength.

R1 in the M chain link is a methyl group, a hydrogen group or a vinyl group, and the hydrogen group and the vinyl group can be used for a condensation reaction or an addition reaction with a silicone rubber.

It can be understood that m in the Q link may be 15, 16, 17, 18, 19, or 20.

The value of m in the Q chain link represents the content of hydroxyl groups. The content of hydroxyl groups will affect the degree of reaction between silicone resin and silicone rubber, and affect the properties of silicone pressure-sensitive adhesives, such as adhesion and bonding strength. The value of m in the Q chain link of the present invention ranges from 15 to 20, so that the prepared silicone pressure-sensitive adhesive has better adhesion and bonding strength.

The structural formula of silicone rubber is

Here, R ₂ is a methyl group, a vinyl group, or a phenyl group, and the range of n is 5000 to 10,000. Phenyl can increase the heat resistance of silicone pressure-sensitive adhesives, and vinyl can crosslink with other groups.

The silicone rubber of the present invention has a linear structure with a hydroxyl group as an end group, and the hydroxyl group can undergo a condensation reaction with the silicone resin.

The range of the silicone rubber n is 5000 to 10,000, so that the molecular weight of the silicone rubber is moderate, so that the prepared second pressure-sensitive adhesive layer 30 'has better flexibility, cohesive strength, low mobility, good viscosity, And solid content.

In one embodiment of the present invention, the silicone rubber is at least one of methyl hydroxy silicone rubber, vinyl silicone rubber, and phenyl silicone rubber.

The mass ratio of silicone resin and silicone rubber ranges from 1: 1 to 15: 1.

Understandably, the mass ratio of silicone resin and silicone rubber is: 1: 1, 2: 1, 3: 1, 4: 1, 5: 1, 6: 1, 7: 1, 8: 1, 9: 1, 10: 1, 11: 1, 12: 1, 13: 1, 14: 1, or 15: 1, etc.

The range of the mass ratio of the silicone resin and the silicone rubber according to the technical solution of the present invention is set to 1: 1 to 15: 1, so that the prepared second pressure-sensitive adhesive layer 30 'has better initial tack and stickiness.

The raw material of the second pressure-sensitive adhesive layer 30 'further includes 0 to 5 parts by weight of a crosslinking agent. The crosslinking agent is a hydrogen-containing silicone oil, an organic peroxide, or an alkoxysilane.

The role of the cross-linking agent is to cause the cross-linking reaction of the silicone rubber and increase the cohesive force of the silicone pressure-sensitive adhesive.

Hydrogen-containing silicone oil refers to a silicone oil containing an S-H bond. Understandably, the silicone rubber also undergoes a crosslinking reaction with the hydrogen-containing silicone oil.

Organic peroxides can be benzoyl peroxide, t-butyl hydroperoxide, dicumene peroxide, 2,4-dichlorobenzoyl, 2,5-dimethyl-2,5-di ( Tert-butylperoxy) hexane, di- (tert-butylisopropylperoxy) benzene, and the like.

The alkoxysilane may be epoxysilane, tetramethoxysilane, octyltrimethoxysilane, di-tert-butoxydiacetoxysilane, methoxysilane, 3- (2,3-glycidoxy) At least one of propyltrimethoxysilane, methyltriacetoxyoximylsilane, methyltrimethoxysilane, vinyltrimethoxysilane, ethoxysilane, propoxysilane, and butoxysilane Kind and so on.

The raw materials of the second pressure-sensitive adhesive layer 30 'further include 0 to 5 parts by weight of the reaction inhibitor.

The reaction inhibitor is at least one of an alkynol compound, a nitrogen-containing compound, and a vinyl compound.

The reaction inhibitor can slow down the reaction speed, so that the storage period of the pressure-sensitive adhesive is prolonged.

The alkynol compound may be ethynylcyclohexanol, 2-methyl-3-butyn-2-ol, 3-phenyl-1-butyn-3-ol, and 3-propyl-1-butyn- At least one of 3-alcohols.

The nitrogen-containing compound may be at least one of quinoline, methylhydrazine, and phenylhydrazine.

The vinyl compound may be perchloroethylene and / or tetravinyltetramethylcyclotetrasiloxane.

Referring to FIG. 1, the present invention also provides a composite film structure 100. The composite film structure 100 includes two first substrate layers 10 and at least one first pressure-sensitive adhesive layer 30 sandwiched therebetween. Between the two first substrate layers 10, at least one of the two first substrate layers 10 is a thermoplastic elastomer layer, and the material of the first pressure-sensitive adhesive layer 10 is the acrylic pressure-sensitive adhesive described in the above embodiment. gum.

Since the composite membrane structure 100 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described in detail here.

The material of the thermoplastic elastomer layer includes at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer.

The thickness of the first base material layer 10 ranges from 5 to 40 μm.

Optionally, the thickness of the first substrate layer 10 is 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm , 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, or 40 μm.

It can be understood that the two first substrate layers 10 can be made of the same material or different materials.

The material of the first substrate layer 10 of the technical solution of the present invention is selected from at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer, so that the first substrate layer 10 At least one of the layers has a softening temperature greater than 80 ° C, has good high temperature resistance, and the thickness of the first substrate layer 10 is 5 to 40 μm, so that the composite film structure 100 not only has better strength and resilience, but also has excellent Structural stability, and high temperature resistance.

The thickness of the pressure-sensitive adhesive layer 30 ranges from 2 to 40 μm.

Optionally, the thickness of the pressure-sensitive adhesive layer 30 is 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, or 40 μm.

The thickness of the pressure-sensitive adhesive layer 30 of the technical solution of the present invention ranges from 2 to 40 μm, so that the composite film structure 100 using the pressure-sensitive adhesive layer 30 has better high temperature resistance characteristics. Even when the input voltage increases, the composite film structure 100 The rigidity and damping performance will not be significantly reduced.

Further, the two base material layers 10 are both thermoplastic elastomer layers. At this time, the composite film structure 100 is a first thermoplastic elastomer layer, a first pressure-sensitive adhesive layer, and a second thermoplastic elastomer layer that are sequentially stacked. The material between the first thermoplastic elastomer layer and the second thermoplastic elastomer layer may be the same. It can be different.

Optionally, the material between the first thermoplastic elastomer layer and the second thermoplastic elastomer layer is the same. For example, the materials of the first thermoplastic elastomer layer and the second thermoplastic elastomer layer are both thermoplastic polyester elastomers. At this time, the composite film structure is a thermoplastic polyester elastomer layer, an acrylic pressure-sensitive adhesive, and a thermoplastic polyester elastomer layer. Structures stacked one after another. Wherein, the acrylic pressure-sensitive adhesive is the acrylic pressure-sensitive adhesive modified by the damping modifier in the above embodiment.

Referring to FIG. 2, the composite film structure 100 further includes a second pressure-sensitive adhesive layer 30 ′. The composite film structure 100 further includes a second substrate layer 50, and the second substrate layer 50 includes a first surface 51 disposed oppositely. And a second surface 50, wherein a pressure-sensitive adhesive layer 30 is sandwiched between the first surface 51 of the second substrate layer 50 and a first substrate layer 10, and the second pressure-sensitive adhesive layer 30 'is sandwiched between Between the second surface 53 of the two base material layers 50 and another first base material layer 10. The material of the second pressure-sensitive adhesive layer 30 'is the same as that of the first pressure-sensitive adhesive layer 30, or the material of the second pressure-sensitive adhesive layer 30' is a silicone-based pressure-sensitive adhesive. Of course, the material of the second pressure-sensitive adhesive layer 30 'may also be an adhesive of other materials, which is not limited in the present invention.

The material of the second substrate layer 50 is a thermoplastic elastomer or an engineering plastic. Among them, the thermoplastic elastomer is selected from at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer. Engineering plastics are selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, polyethylene naphthalate, polyethylene terephthalate, and polyparaphenylene terephthalate. At least one of butylene phthalate.

The thickness of the second pressure-sensitive adhesive layer 30 'ranges from 2 to 40 m.

The thickness of the second base material layer 50 ranges from 1 to 30 μm.

Optionally, the thickness of the second substrate layer 50 is 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm , 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, or 30 μm.

The composite film structure 100 of the technical solution of the present invention includes two first substrate layers 10, two laminated sensitive adhesive layers, and a second substrate layer 50, wherein a pressure sensitive adhesive layer 30 is sandwiched between the second substrate layers 50 Between the first surface 51 and a first substrate layer 10, the second pressure-sensitive adhesive layer 30 ′ is sandwiched between the second surface 53 of the second substrate layer 50 and another first substrate layer 10, In order to increase the stiffness and anti-polarization ability of the composite film structure 100.

It should be noted that the material of the second pressure-sensitive adhesive is the same as the material of the second pressure-sensitive adhesive when at least one of the first substrate layers is a plastic substrate layer. For reference, please refer to the foregoing embodiments. More details.

Referring to FIG. 3, the present invention further provides a diaphragm 200. The diaphragm 200 has this composite film structure.

In an embodiment of the present invention, the thickness of the diaphragm 200 may be 12 to 190 μm.

Since the diaphragm 200 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated one by one here.

In addition, the first substrate layer 10 provides a required rigidity for the vibration of the diaphragm 200 and obtains a high transient response. The pressure-sensitive adhesive layer 30 has a high adhesive force, so that the vibration of each layer of the diaphragm 200 can be kept consistent. In addition, the pressure-sensitive adhesive layer 30 has better damping characteristics, so that the diaphragm 200 has higher sound quality and listening stability, so that the sound generating device can be overcome.

The diaphragm 200 includes at least one folded ring portion 21, and the folded ring portion 21 has the composite film structure.

The diaphragm 200 further includes a dome portion 23, and the dome portion 23 is connected to the folding ring portion 21.

In an embodiment of the present invention, the diaphragm 200 includes two folded ring portions 21.

In one embodiment of the present invention, the ball top portion 23 and the folded ring portion 21 are integrally formed.

In one embodiment of the present invention, the ball top portion 23 and the folded ring portion 21 are made of different materials.

In an embodiment of the present invention, the ball top portion 23 is located at the center position of the diaphragm 200, the folded ring portion 21 is located on the peripheral side of the center position of the diaphragm 200, and surrounds the center position of the diaphragm 200.

The invention also provides a sound generating device (not shown). The sound generating device includes the diaphragm 200.

Since the sound generating device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated one by one here.

In an embodiment of the present invention, the sound generating device further includes a voice coil (not shown), and the diaphragm 200 and the voice coil are firmly adhered to improve the performance of the diaphragm 200.

The method for preparing the acrylic pressure-sensitive adhesive of the present invention includes the following examples:

Embodiment one:

5 parts by weight of nitrile rubber and 44.3 parts of toluene are provided in parts by weight. After the nitrile rubber is plasticized on an open mill for 10 min, it is dissolved in toluene to obtain a mixture;

Provide 35 parts of 2-ethylhexyl acrylate, 10 parts of methyl methacrylate, 5 parts of methacrylic acid, and 0.2 parts of benzoyl peroxide, and add 2-ethylhexyl acrylate and methyl to the mixture. Methyl acrylate, methacrylic acid, and benzoyl peroxide, and heat to obtain a colloid, wherein the temperature of the heat treatment is 75 ° C. and the time is 6 h;

After the colloid is cooled, 0.5 part of isocyanatoethyl methacrylate is provided. Add the isocyanatoethyl methacrylate to the colloid and stir well; and

The colloid is coated on a release film, the colloid is dried for the first time to remove toluene, and then the colloid is subjected to a second drying treatment to obtain the acrylic pressure-sensitive adhesive of Example 1, wherein the first drying The treatment temperature was 70 ° C and the time was 2 minutes. The temperature of the second drying treatment was 140 ° C and the time was 3 minutes.

Among them, benzoyl peroxide as an initiator can provide free radicals for the polymerization of acrylic monomers. As a cross-linking agent, ethyl isocyanate methacrylate can cause a cross-linking reaction between methacrylic acid, 2-ethylhexyl acrylate, and methyl methacrylate. Nitrile rubber can improve the damping performance of acrylic pressure-sensitive adhesives.

Embodiment two:

According to parts by weight, 6 parts of neoprene and 33.5 parts of ethyl acetate were provided. After the ethyl acetate was plasticized on an open kneader for 12 min, it was dissolved in ethyl acetate to obtain a mixture;

Provide 40 parts of n-butyl acrylate, 15 parts of acrylic acid, 8 parts of acrylamide, and 0.4 parts of azobisisobutyronitrile. Add n-butyl acrylate, acrylic acid, acrylamide, and azobisisobutyronitrile to the mixture, and Heating to obtain a colloid, wherein the temperature of the heat treatment is 80 ° C. and the time is 8 h;

After the colloid is cooled, provide 0.3 parts of aluminum acetate, add aluminum acetate to the colloid, and stir well; and

The colloid was coated on a polyphenylene sulfide substrate, the colloid was dried for the first time to remove ethyl acetate, and the colloid was subjected to the second drying treatment to obtain the acrylic pressure-sensitive adhesive of Example 2. The temperature of the first drying process was 80 ° C and the time was 3 minutes, and the temperature of the second drying process was 150 ° C and the time was 2 minutes.

Among them, azobisisobutyronitrile as an initiator can provide free radicals for the polymerization of acrylic monomers. Aluminum acetate as a crosslinking agent can cause a crosslinking reaction between n-butyl acrylate, acrylic acid and acrylamide. Neoprene can improve the damping performance of acrylic pressure-sensitive adhesives.

The loss factor of the acrylic pressure-sensitive adhesive prepared by the preparation methods of Example 1 and Example 2 was tested. The loss factor of the acrylic pressure-sensitive adhesive of Example 1 was 0.42, and the acrylic pressure-sensitive adhesive of Example 2 was The loss factor of the sensitive adhesive is 0.45. However, the loss factor of the acrylic pressure-sensitive adhesive in the prior art is usually 0.2. It is shown that the acrylic pressure-sensitive adhesive produced by the preparation method of the present invention has a loss factor greater than 0.4 and has good damping properties.

The above are only preferred embodiments of the present invention, and thus do not limit the patent scope of the present invention. Under the inventive concept of the present invention, equivalent structural transformations made using the description and drawings of the present invention, or directly or indirectly used in other Relevant technical fields are included in the patent protection scope of the present invention.

Claims (16)

1. An acrylic pressure-sensitive adhesive, characterized in that, according to parts by weight, the raw materials for making the acrylic pressure-sensitive adhesive include:

   30 ~ 45 parts of soft monomer;

   5-20 parts of hard monomer;

   1-10 parts of functional monomer;

   0.01 ～ 1 part of initiator;

   Crosslinking agent 0.01 ～ 1 part;

   5-10 parts of damping modifier; and

   30 to 45 parts of organic solvent.
2. The acrylic pressure-sensitive adhesive according to claim 1, wherein the soft monomer is n-butyl acrylate and / or 2-ethylhexyl acrylate; and / or,

   The hard monomer is at least one of methyl methacrylate, styrene, and acrylic acid; and / or,

   The functional monomer is at least one of methacrylic acid, acrylamide, and acrylic acid; and / or,

   The initiator is benzoyl peroxide and / or azobisisobutyronitrile; and / or,

   The cross-linking agent is ethyl isocyanate methacrylate and / or aluminum acetate; and / or,

   The damping modifier is at least one of nitrile rubber, neoprene, chlorinated polyethylene rubber, and butyl rubber; and / or,

   The organic solvent is at least one of benzene, toluene, ethyl acetate, xylene, N-methylpyrrolidone and methyl ethyl ketone.
3. A method for preparing an acrylic pressure-sensitive adhesive includes the following steps:

   5 to 10 parts of a damping modifier and 30 to 45 parts of an organic solvent are provided by weight part, and the damping modifier is added to the organic solvent to obtain a mixture;

   Provide 30 to 45 parts of soft monomers, 5 to 20 parts of hard monomers, 1 to 10 parts of functional monomers, and 0.01 to 1 part of initiators, and add soft monomers, hard monomers, and functional monomers to the mixture And initiator, and heat treatment to obtain colloid;

   Provide 0.01 to 1 part of a cross-linking agent, and add the cross-linking agent to the colloid; and

   The colloid added with a crosslinking agent is dried to obtain an acrylic pressure-sensitive adhesive.
4. The method for preparing an acrylic pressure-sensitive adhesive according to claim 3, wherein the step of drying the colloid added with a crosslinking agent comprises:

   The colloid to which the cross-linking agent is added is sequentially subjected to a first drying treatment and a second drying treatment. The drying temperature of the first drying treatment is 70 to 100 ° C, and the drying time is 2 to 3 minutes. The drying temperature of the second drying process is 100 to 140 ° C, and the drying time is 2 to 3 minutes; and / or,

   The heating temperature of the heat treatment is 75 to 85 ° C, and the heating time is 6 to 8 hours.
5. A composite film structure, characterized in that the composite film structure includes two first substrate layers and at least one first pressure-sensitive adhesive layer, and the first pressure-sensitive adhesive layer is sandwiched between the two first substrates. Between the material layers, at least one of the two first substrate layers is a plastic substrate layer, and the material of the first pressure-sensitive adhesive layer is the acrylic pressure-sensitive adhesive according to claim 1. .
6. The composite film structure according to claim 5, wherein the material of the plastic substrate layer comprises: polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, At least one of polyethylene naphthalate and polyethylene terephthalate; and / or,

   The thickness of the first substrate layer ranges from 2 to 40 μm; and / or,

   The thickness of the first pressure-sensitive adhesive layer ranges from 2 to 40 μm.
7. The composite film structure according to claim 5 or 6, wherein the composite film structure includes a second pressure-sensitive adhesive layer and a second substrate layer, and the second substrate layer includes a first surface and a first surface opposite to each other and The second surface, the first pressure-sensitive adhesive layer is sandwiched between the first surface of the second substrate layer and a first substrate layer, and the second pressure-sensitive adhesive layer is sandwiched between the second surface of the second substrate layer Between the second pressure-sensitive adhesive layer and another first substrate layer, the material of the second pressure-sensitive adhesive layer is the same as that of the first pressure-sensitive adhesive layer, or the material of the second pressure-sensitive adhesive layer is a silicone-based pressure-sensitive adhesive.
8. The composite film structure according to claim 7, wherein the material of the second substrate layer is a thermoplastic elastomer or an engineering plastic, and the thermoplastic elastomer is selected from a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, At least one of a thermoplastic polyamide elastomer and a silicone elastomer, the engineering plastic is selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, and polynaphthalene At least one of polyethylene formate, polyethylene terephthalate, and polybutylene terephthalate; and / or,

   The thickness of the second pressure-sensitive adhesive layer ranges from 2 to 40 μm; and / or,

   The thickness of the second substrate layer ranges from 1 to 30 μm.
9. A composite film structure, characterized in that the composite film structure includes two first substrate layers and at least one first pressure-sensitive adhesive layer, and the first pressure-sensitive adhesive layer is sandwiched between the two first substrates. Between the material layers, at least one of the two first substrate layers is a thermoplastic elastomer layer, and the material of the first pressure-sensitive adhesive layer is the acrylic pressure-sensitive adhesive according to claim 1. .
10. The composite film structure according to claim 9, wherein the material of the thermoplastic elastomer layer comprises at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyamide elastomer, and a silicone elastomer. Species; and / or,

    The thickness of the first substrate layer ranges from 5 to 40 μm; and / or,

    The thickness of the first pressure-sensitive adhesive layer ranges from 2 to 40 μm.
11. The composite film structure according to claim 9 or 10, wherein the two substrate layers are both thermoplastic elastomer layers, and the composite film structure comprises: a first thermoplastic elastomer layer stacked in sequence, the The first pressure-sensitive adhesive layer and the second thermoplastic elastomer layer.
12. The composite film structure according to claim 11, wherein the materials of the first thermoplastic elastomer layer and the second thermoplastic elastomer layer are the same.
13. The composite film structure according to claim 9 or 10, wherein the composite film structure comprises a second pressure-sensitive adhesive layer and a second substrate layer, and the second substrate layer includes a first surface and a first surface opposite to each other and The second surface, the first pressure-sensitive adhesive layer is sandwiched between the first surface of the second substrate layer and a first substrate layer, and the second pressure-sensitive adhesive layer is sandwiched between the second surface of the second substrate layer Between the second pressure-sensitive adhesive layer and another first substrate layer, the material of the second pressure-sensitive adhesive layer is the same as that of the first pressure-sensitive adhesive layer, or the material of the second pressure-sensitive adhesive layer is a silicone-based pressure-sensitive adhesive.
14. The composite film structure according to claim 13, wherein the material of the second substrate layer is a thermoplastic elastomer or an engineering plastic, and the thermoplastic elastomer is selected from the group consisting of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, At least one of a thermoplastic polyamide elastomer and a silicone elastomer, the engineering plastic is selected from the group consisting of polyetheretherketone, polyarylate, polyetherimide, polyimide, polyphenylene sulfide, and polynaphthalene At least one of polyethylene formate, polyethylene terephthalate, and polybutylene terephthalate; and / or,

    The thickness of the second pressure-sensitive adhesive layer ranges from 2 to 40 μm; and / or,

    The thickness of the second substrate layer ranges from 1 to 30 μm.
15. A vibrating membrane, wherein the vibrating membrane has a composite membrane structure according to any one of claims 5 to 8 or 9 to 14.
16. A sound generating device, characterized in that the sound generating device comprises the diaphragm according to claim 15.

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