WO2019235731A1

WO2019235731A1 - Connection member including housing that faces plurality of printed circuit boards and conductor that electrically connects plurality of printed circuit boards, and electronic device including same

Info

Publication number: WO2019235731A1
Application number: PCT/KR2019/004479
Authority: WO
Inventors: 김태우; 민봉규; 박진용; 윤혜림; 이형주; 임재한
Original assignee: 삼성전자 주식회사
Priority date: 2018-06-08
Filing date: 2019-04-15
Publication date: 2019-12-12
Also published as: KR102543696B1; KR20190139597A

Abstract

According to one embodiment of the present invention, an electronic device comprises: a first printed circuit board including one or more antennas and one or more first terminals electrically connected to the one or more antennas; a second printed circuit board including a processor configured to communicate with an external electronic device by using the one or more antennas, and one or more second terminals electrically connected to the processor; and an interposer for connecting the first printed circuit board to the second printed circuit board, wherein the interposer includes: a housing including a first surface, a second surface facing the first surface, and one or more third surfaces encompassing the space between the first surface and the second surface; and a conductor for electrically connecting the first surface and a designated surface from among the one or more third surfaces, and the conductor allows the first surface to be electrically connected to the one or more first terminals while facing the first printed circuit board and allows the designated surface to be electrically connected to the one or more second terminals while facing the second printed circuit board. Additional various embodiments are possible.

Description

A connecting member comprising a housing facing the plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, and an electronic device comprising the same

Various embodiments of the present disclosure relate to a connection member including a housing facing a plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, and an electronic device including the same.

BACKGROUND With the development of digital technology, electronic devices have been provided in various forms such as smart phones, tablet personal computers (PDAs), personal digital assistants (PDAs), and the like. Electronic devices are also being developed in a form that can be worn on a user to improve portability and accessibility of the user. The electronic device may include a printed circuit board connecting the electronic components, and the printed circuit board may support data input / output exchange of the electronic components.

The electronic device may include, for example, a plurality of electrically printed circuit boards. In the situation where electronic devices having a portable nature are preferred and electronic components for various functions are being added to the electronic devices, it is becoming more difficult to mount a plurality of printed circuit boards in a limited space of the electronic device.

Various embodiments of the present disclosure electrically connect a plurality of printed circuit boards and a housing facing the plurality of printed circuit boards for easy placement in a limited space of an electronic device while electrically connecting the plurality of printed circuit boards. A connection member including a conductor, and an electronic device including the same can be provided.

According to an embodiment of the present disclosure, an electronic device may include a first printed circuit board including one or more antennas and one or more first terminals electrically connected to the one or more antennas, and the one or more antennas. A second printed circuit board comprising a processor configured to communicate with an external electronic device, one or more second terminals electrically connected to the processor, and an interposer connecting the first printed circuit board to the second printed circuit board. a housing comprising an interposer, the interposer including a first face, a second face facing the first face, and one or more third faces surrounding between the first face and the second face, And a conductor electrically connecting between the first face and a designated one of the one or more third faces, wherein the conductor comprises: A first side is electrically connected with the one or more first terminals facing the first printed circuit board, and the designated side is electrically connected with the one or more second terminals facing the second printed circuit board. Can be connected.

Various embodiments may easily arrange a plurality of printed circuit boards in a limited space of an electronic device while electrically connecting the printed circuit boards using an interposer. In addition, when an interposer according to an embodiment is utilized to electrically connect a first printed circuit board on which a directional antenna is mounted and a second printed circuit board on which a processor configured to wirelessly communicate using the antenna is electrically connected, Setting the installation position or the orientation angle with respect to the printed circuit board may be more free.

In addition, the effects that can be obtained or predicted by various embodiments of the present invention will be disclosed directly or implicitly in the detailed description of the embodiments of the present invention. For example, various effects predicted in accordance with various embodiments of the present invention will be disclosed in the following detailed description.

1 is a perspective view of a front surface of an electronic device including an interposer including a housing facing a plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, according to an exemplary embodiment.

2 is a perspective view of a rear side of the electronic device of FIG. 1 according to an embodiment.

3 is an exploded perspective view of the electronic device of FIG. 1 according to an exemplary embodiment.

4A is a perspective view of the front side of a schematic interposer according to one embodiment.

4B is a perspective view of the back side of the interposer of FIG. 4A, according to one embodiment.

5 illustrates an interposer including a housing facing a plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, and an electronic device including the same, according to an exemplary embodiment.

6A, 6B, 6C, and 6D are cross-sectional views of interposers according to various embodiments.

7 illustrates an interposer including a housing facing a plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, and an electronic device including the same, according to an exemplary embodiment.

8A is a perspective view of a front side of an interposer according to an embodiment.

8B is a perspective view of the rear side of the interposer of FIG. 8A, according to one embodiment.

9A and 9B illustrate a state in which printed circuit boards are connected through an interposer according to an embodiment.

10 illustrates a state in which printed circuit boards are connected through an interposer according to various embodiments of the present disclosure.

11 is a cross-sectional view illustrating a state in which printed circuit boards are connected through an interposer according to various embodiments of the present disclosure.

12A is a perspective view of an interposer according to an embodiment.

12B is a cross-sectional view of the interposer corresponding to A-A in FIG. 12A.

12C is a cross-sectional view of the interposer corresponding to B-B in FIG. 12A.

FIG. 12D is a cross-sectional view of the interposer corresponding to C-C in FIG. 12A.

13 is a cross-sectional view of printed circuit boards connected via an interposer according to an embodiment.

14 is a cross-sectional view of a coupled state of an interposer and a printed circuit board according to an exemplary embodiment.

15 is a block of an electronic device in a network environment, including an interposer including a housing facing a plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, according to various embodiments. It is also.

16 is a block diagram of an electronic device according to an embodiment of the present disclosure.

17 is a block diagram of a communication device according to an exemplary embodiment.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. Various embodiments of the present disclosure and terms used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, and it should be understood to include various changes, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the items, unless the context clearly indicates otherwise. In this document, expressions such as "having", "may have", "includes" or "can include" refer to the presence of a corresponding feature (e.g., numerical, functional, operational, or component such as a component). It does not exclude the presence of additional features. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C", "at least one of A, B and C" and "A, Phrases such as "at least one of B, or C" may include all possible combinations of items listed together in the corresponding one of the phrases. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish a component from other corresponding components, and to separate the components from other aspects (e.g. Order). Some (eg, first) component may be referred to as "coupled" or "connected" to another (eg, second) component, with or without the term "functionally" or "communicatively". When mentioned, it means that any component can be connected directly to the other component (eg, by wire), wirelessly, or via a third component.

Electronic devices according to various embodiments of the present disclosure may be various types of devices. The electronic device may include, for example, a portable communication device (eg, a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. An electronic device according to an embodiment of the present disclosure is not limited to the above-described devices. In this document, the term user may refer to a person who uses an electronic device or a device (eg, an artificial intelligence electronic device) that uses an electronic device.

1 is a perspective view of a front surface of an electronic device including an interposer including a housing facing a plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, according to an exemplary embodiment. 2 is a perspective view of a rear side of the electronic device of FIG. 1 according to an embodiment. 3 is an exploded perspective view of the electronic device of FIG. 1 according to an exemplary embodiment. 4A is a perspective view of the front side of a schematic interposer according to one embodiment. 4B is a perspective view of the back side of the interposer of FIG. 4A, according to one embodiment.

1 and 2, an electronic device 100 according to an embodiment may include a first surface (or front surface) 110A, a second surface (or rear surface) 110B, a first surface 110A, and It may include a housing 110 including a side (110C) surrounding the space between the second surface (110B). In another embodiment (not shown), the housing may refer to a structure forming some of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1. According to one embodiment, the first face 110A may be formed by a front plate 102 (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least partially substantially transparent. The second surface 110B may be formed by the substantially opaque back plate 111. The back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side 110C may be formed by a side bezel structure (or “side member”) 118 that engages the front plate 102 and the back plate 111 and includes metal and / or polymer. In some embodiments, back plate 111 and side bezel structure 118 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 102 includes two first regions 110D extending seamlessly from the first surface 110A toward the rear plate 111 and extending seamlessly. It may be included at both ends of the long edge (102). In the illustrated embodiment (see FIG. 2), the back plate 111 has a long edge between two second regions 110E extending seamlessly from the second face 110B toward the front plate 102. It can be included at both ends. In some embodiments, the front plate 102 (or the back plate 111) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included. In the above embodiments, when viewed from the side of the electronic device 100, the side bezel structure 118 may be formed on the side where the first regions 110D or the second regions 110E are not included. It may have a first thickness (or width) and may have a second thickness thinner than the first thickness on the side surface including the first regions 110D or the second regions 110E.

According to an embodiment, the electronic device 100 may include a display 101,

audio modules

103, 107, 114,

sensor modules

104, 119,

camera modules

105, 112, 113, and a key. It may include at least one or more of the

input devices

115, 116, 117, the indicator 106, or the connector holes 108, 109. In some embodiments, the electronic device 100 may omit at least one of the components (eg, the

key input devices

115, 116, 117, or the indicator 106) or may further include other components. Can be.

The display 101 may be exposed through, for example, a substantial portion of the front plate 102. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first surface 110A and the first regions 110D of the side surface 110C. The display 101 may be combined with or adjacent to the touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field stylus pen. In some embodiments, at least a portion of the

sensor modules

104, 119, and / or at least a portion of the

key input devices

115, 116, 117 may have the first regions 110D, and / or the It may be disposed in the second regions 110E.

According to an embodiment, the

audio modules

103, 107, and 114 may include a microphone hole 103 and speaker holes 107 and 114. The microphone hole 103 may include a microphone for acquiring an external sound, and in some embodiments, a plurality of microphones may be disposed to detect a direction of the sound. The speaker holes 107 and 114 may include an external speaker hole 107 and a receiver receiver hole 114 for a call. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as one hole, or a speaker may be included without the speaker holes 107 and 114 (eg, a piezo speaker).

According to an embodiment of the present disclosure, the

sensor modules

104 and 119 may generate an electric signal or data value corresponding to an operating state inside the electronic device 100 or an external environment state. The

sensor modules

104, 119 may comprise, for example, a first sensor module 104 (eg, proximity sensor) and / or a second sensor module (not shown) disposed on the first face 110A of the housing 110. (Eg, a fingerprint sensor), and / or a third sensor module 119 (eg, an HRM sensor) disposed on the second surface 110B of the housing 110. The fingerprint sensor may be disposed on the second surface 110B as well as the first surface 110A (eg, the home key button 115) of the housing 110. The electronic device 100 may include a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor, or an illumination sensor 104.

According to an embodiment of the present disclosure, the

camera modules

105, 112, and 113 are disposed on the first camera device 105 disposed on the first surface 110A of the electronic device 100, and the second surface 110B. Second camera device 112, and / or flash 113. The

camera devices

105, 112 may include one or a plurality of lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100.

According to an embodiment of the present disclosure, the

key input devices

115, 116, and 117 may be disposed around the home key button 115 and the home key button 115 disposed on the first surface 110A of the housing 110. The touch pad 116 and / or the side key button 117 disposed on the side surface 110C of the housing 110 may be included. In another embodiment, the electronic device 100 may not include some or all of the above-mentioned

key input devices

115, 116, 117, and the non-included

key input devices

115, 116, 117 may not be included. The display 101 may be implemented in other forms such as soft keys.

Indicator 106 may be disposed, for example, on first surface 110A of housing 110. The indicator 106 may provide, for example, state information of the electronic device 100 in the form of light, and may include an LED.

According to an embodiment, the connector holes 108 and 109 may include a first connector hole 108 that may receive a connector (eg, a USB connector) for transmitting and receiving power and / or data with an external electronic device; And / or a second connector hole (eg, an earphone jack) 109 that can accommodate a connector for transmitting and receiving an audio signal with an external electronic device.

Referring to FIG. 3, the electronic device 300 may include a side bezel structure 310, a first support member 311 (eg, a bracket), a front plate 320, a display 330, and a printed circuit board (PCB). printed circuit board) 340, a battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a back plate 380. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360) or further include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2, and overlapping descriptions thereof will be omitted.

According to an embodiment of the present disclosure, the first support member 311 may be disposed inside the electronic device 300 to be connected to the side bezel structure 310 or may be integrally formed with the side bezel structure 310. The first support member 311 may be formed of, for example, a metal material and / or a nonmetal (eg, polymer) material. In the first support member 311, the display 330 may be coupled to one surface thereof, and the printed circuit board 340 may be coupled to the other surface thereof. The printed circuit board 340 may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially coplanar with, for example, the printed circuit board 340. The battery 350 may be integrally disposed in the electronic device 300, or may be detachably attached to the electronic device 300.

The second support member 360 may be coupled to the first support member 311, for example, and disposed between the printed circuit board 340 and the back plate 380. The second support member 360 may be coupled to the first support member 311 using bolt fastening together with the printed circuit board 340, and may cover and protect the printed circuit board 340.

According to an embodiment, the antenna 370 may be disposed between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure 310 and / or the first support member 311.

According to an embodiment, the printed circuit board 340 may include a first printed circuit board 341 and a second printed circuit board 342 electrically connected to each other via an interposer 390. . The interposer disclosed in this document may be defined as a connection member or a connector that is electrically connected to a different surface from the printed circuit boards. The interposer disclosed in this document may be replaced with the term 'connecting member' or 'connector'. According to one embodiment, the first printed circuit board 341 is electrically connected to the interposer 390 to face one surface 401 of the interposer 390, and the second printed circuit board 342 is interposer The other surface 403 of 390 may be electrically connected to the interposer 390. The interposer 390 not only electrically connects the first and second printed

circuit boards

341, 342, but also secures the first printed circuit board 341 to a set position with respect to the second printed circuit board 342. Can be. There may be a structure in which the first printed circuit board is inserted into the socket connector mounted on the rear surface 342a or the rear surface 342a facing the front side 342a of the second printed circuit board 342, but the interposer 390 Compared to the case of utilizing the structure, the structure may not be free to design the position or orientation of the first printed circuit board with respect to the second printed circuit board. There may be a structure in which the first printed circuit board and the second printed circuit board are connected by using a flexible printed circuit board (FPCB) or a coaxial cable. However, this structure may be compared with the case where the interposer 390 is used. A separate element may be needed to fix the first printed circuit board to the position or direction set relative to the second printed circuit board.

4A and 4B, an interposer 390 according to an embodiment may include a first face 401, a second face 402 facing the first face 401, and a first face 401 and It may include a housing 410 that includes one or more

third surfaces

403, 404, 405, 406 that surround between the second surfaces 402. The interposer 390 connects at least one conductor 42-n that electrically connects between the first face 401 and a designated face 403 of one or more

third faces

403, 404, 405, 406. It may include. According to one embodiment, the conductor 42-n may include a third terminal 43-n disposed to be exposed to the first surface 401, and one or more of the one or more

third surfaces

403, 404, 405, and 406. And a fourth terminal 44-n disposed to be exposed to the designated surface 403. The conductor 42-n includes a portion (not shown) that electrically connects the third terminal 43-n and the fourth terminal 44-n, which portion is to be disposed inside the housing 410. Can be. According to an embodiment, the conductor 42-n may be formed of an integral metal member extending from the third terminal 43-n to the fourth terminal 44-n. The plurality of conductors 42-1, 42-2,..., 42-n may be disposed in the housing 410 of the insulating material and may be physically separated from each other. According to one embodiment, as shown, the housing 810 may be generally rectangular parallelepiped, but may vary in shape, and accordingly, the number or position of the surfaces of the housing, or the third or fourth terminals The location can also vary.

According to an embodiment, the interposer 390 arranges a plurality of conductors 42-1, 42-2,..., 42-n in a mold and then injects a resin such as an insulating polymer (eg, insert injection). (insert injection) or injection joint (injection joint).

3, 4A and 4B, the first printed circuit board 341 includes one or more first terminals (not shown), and the second printed circuit board 342 includes one or more second terminals (not shown). May include). One or more first terminals of the first printed circuit board 341 may be one or more third terminals 43-1, 43-2,..., 43-n disposed on the first surface 401 of the interposer 390. ) Can be electrically connected. One or more second terminals of the second printed circuit board 342 are one or more fourth terminals disposed on the designated side 403 of one or more

third sides

403, 404, 405, 406 of the interposer 390. (44-1, 44-2, ..., 44-n) may be electrically connected.

According to one embodiment, when combining the first printed circuit board 341, the second printed circuit board 342, and the interposer 390, the first terminals and the interposer of the first printed circuit board 341. Between the third terminals 43-1, 43-2,..., 43-n of 390, and / or the second terminals of the second printed circuit board 342 and the fourth of the interposer 390. Solder may be disposed between the terminals 44-1, 44-2,..., 44-n. According to various embodiments, various other conductive materials (eg, conductive adhesive materials) may be utilized to replace the solder.

According to an embodiment, when the first printed circuit board 341 and the second printed circuit board 342 are coupled through the interposer 390, the first printed circuit board 341 may be a second printed circuit board ( 342 may be disposed perpendicularly with respect. In various embodiments, referring to FIG. 4A, one or more third terminals 43-1, 43-2,..., 43-n electrically connected to the first printed circuit board 341 are disposed on the other side. When the interposer 390 is modified such that the first printed circuit board 341 may be in a different placement relationship with respect to the second printed circuit board 342. For example, if the interposer 390 is designed such that one or more third terminals 43-1, 43-2,..., 43-n are disposed on a face 404 opposite to the designated face 403. The first printed circuit board 341 may be disposed in parallel with the second printed circuit board 432.

According to one embodiment, the second printed circuit board 342 includes a front face 342a facing the first support member 311 and a back face (not shown) facing the second support member 360, as shown in FIG. As such, the interposer 390 may be mounted on the backside of the second printed circuit board 342. According to various embodiments, the interposer 390 may be mounted on the front surface 342a of the second printed circuit board 342 and electrically connected to the second printed circuit board 341.

According to various embodiments of the present disclosure, in FIG. 3, an example in which one first printed circuit board 341 is connected to the second printed circuit board 342 via the interposer 390 is provided. An example is also possible in which the substrates are electrically connected to the second printed circuit board 342 via at least one interposer.

According to an embodiment, the first printed circuit board 341 may include one or more antennas (not shown), and one or more antennas may be electrically connected to one or more first terminals. According to one embodiment, the second printed circuit board 342 includes a processor (not shown) configured to communicate with an external electronic device using one or more antennas included in the first printed circuit board 341. It may be electrically connected to one or more second terminals.

According to various embodiments, the interposer 390 further includes at least one metal member (not shown) coupled with the housing 410, and the metal member may include the conductors 42-1, 42-2,. 42-n). For example, the metal member may include a metal plate disposed on at least a portion of an outer surface of the housing 410. When the first printed circuit board 391 and the second printed circuit board 392 transmit and receive signals through the interposer 390, the metal member can reduce the influence of electromagnetic noise on the transmission and reception of these signals. have.

For example, there may be a structure in which the first printed circuit board and the second printed circuit board are connected by using an FPCB or a coaxial cable, but compared to the case where the interposer 390 is used, the electrical of the FPCB or the coaxial cable may be reduced. The length may be longer than the electrical length of the conductor (eg, 42-n of FIG. 4A) included in the interposer 390. According to an embodiment, the structure of electrically connecting the first printed circuit board and the second printed circuit board by using the interposer 390 is compared with the case of using a FPCB or coaxial cable having a relatively long electrical length. Thus, the influence of electromagnetic noise on the transmission and reception of signals can be reduced.

For example, in a structure in which the first printed circuit board and the second printed circuit board are electrically connected via a coaxial cable or an FPCB, the coaxial cable or the FPCB and the printed circuit board (for example, the first printed circuit board or the second printed circuit) Socket connectors and plug connectors may be utilized for the connections between the circuit boards). According to an embodiment, the structure of electrically connecting the first printed circuit board and the second printed circuit board by using the interposer 390 may be compared to a case of utilizing a coaxial cable or an FPCB, and a socket connector and a plug connector. Since it is not necessary to secure the mounting space may be advantageous. Transmission and reception signals between the first printed circuit board and the second printed circuit board may be lost by the coaxial cable or the connection between the FPCB and the printed circuit board, or by the coaxial cable or FPCB. According to an embodiment, the structure of electrically connecting the first printed circuit board and the second printed circuit board by using the interposer 390 may be a loss of such a transmission / reception signal as compared with the case of using a coaxial cable or an FPCB. Can be reduced.

Referring to FIG. 5, in one embodiment, the electronic device 500 (eg, 100 of FIG. 1 or 2, or 300 of FIG. 3) may include a first printed circuit board 510 (eg, 341 of FIG. 3), An interposer 530 (eg, FIG. 3) that electrically connects the second printed circuit board 520 (eg, 342 of FIG. 3), the first printed circuit board 510, and the second printed circuit board 520. 390).

According to one embodiment, the interposer 530 may include a first face 531, a second face 532 facing the first face 532, and a first face 531 and a second face 532. It may include a housing 534 having one or more third surfaces (not shown) surrounding the. In cross section, the interposer 530 electrically connects between a first face 531 (eg 401 of FIG. 4A) and a designated one of the one or more third faces 533 (eg 403 of FIG. 4B). And a conductor 535 (eg, 42-n of FIG. 4A or 4B). According to an embodiment, the conductor 535 may be exposed to the third terminal 503 (eg, 43-n of FIG. 4A) disposed to be exposed to the first surface 531 and the designated surface 533. It may include a fourth terminal 504 disposed (eg, 44-n of FIG. 4B). The conductor 535 includes a portion (not shown) for electrically connecting the third terminal 503 and the fourth terminal 504, which may be disposed inside the housing 534.

According to an embodiment, the second printed circuit board 520 may include a fifth surface 521 and a sixth surface 522 (eg, the front surface 342a of FIG. 3) disposed opposite to each other. The second printed circuit board 520 includes a second terminal 502 disposed on the fifth side 521, the second terminal 502 being formed of the interposer 530 via a conductive material such as solder. It may be electrically connected to the four terminals 504.

According to an embodiment, the first printed circuit board 510 may include a seventh surface 511 and an eighth surface 512 disposed opposite to each other. The first printed circuit board 510 includes a first terminal 501 disposed on the seventh surface 511, and the first terminal 501 is formed of the interposer 530 through a conductive material such as solder. It may be electrically connected to the three terminals 503.

According to an embodiment, the interposer 530 may include a metal member 536 disposed on at least a portion of an outer surface of the housing 534. According to an embodiment, the metal member 536 may include a metal plate disposed on the second side 532 of the housing 534, and the metal plate may be physically separated from the conductor 535. . When the first printed circuit board 510 and the second printed circuit board 520 transmit and receive signals through the interposer 530, the metal member 536 flows in from the outside of the electronic device 500 or the electronic device ( Electromagnetic noise (eg, electromagnetic noise) generated inside the 500 (eg, the first printed circuit board 510, the second printed circuit board 520, or the interposer 530) may affect the transmission and reception of a signal. It can reduce madness. For example, electronic elements included in the first printed circuit board 510 and the second printed circuit board 520 may utilize the conductor 535 included in the interposer 530 as a signal line. A signal or data can be transmitted or received. Due to the flow of electric current, an electric field is formed in the conductor 535, and the electric field imparts noise to a signal passing through another signal line in the vicinity or an electric element in the vicinity, thereby interfering with the normal operation of the electric element (EMI). interference)). In order to improve electromagnetic interference, the conductors included in interposer 530 (e.g., 42-1, 42-2,..., 42-n in FIGS. 4A or 4B) are to be as far apart as possible or the volume is further increased. Although designed to increase, there may be a burden that the size of the interposer 530 needs to be expanded. The metal member 536 may be disposed in the housing 510 to be physically separated from the conductor 535 to reduce the electromagnetic interference (for example, noise). According to various embodiments of the present disclosure, the metal member for reducing electromagnetic interference may not be limited to the position or number shown in FIG. 5. For example, the metal member may be disposed in or extend to an outer surface area of the housing 534 where the third terminal 503 and the fourth terminal 504 are not disposed.

According to some embodiments, at least a part of the metal member for reducing electromagnetic interference may be disposed spaced apart from the conductor 535 in the housing 534.

According to an embodiment, the metal member 536 may be electrically connected to the first printed circuit board 510 or the second printed circuit board 520. For example, although not shown, the metal member 536 includes a terminal disposed on one surface of the housing 534 or extending out of the housing 534, which terminal utilizes a conductive material such as solder to form a first printed circuit. The substrate 510 may be electrically connected to the ground (not shown) of the substrate 510 or the ground (not shown) of the second printed circuit board 520. According to some embodiments, the metal member 536 may be in an electrically floating state.

According to an embodiment, the angle 581 between the first printed circuit board 510 and the second printed circuit board 520 coupled through the interposer 530 may be about 90 °. For example, the designated surface 533 of the interposer 530 facing the first printed circuit board 520 and the first surface 531 of the interposer 530 facing the first printed circuit board 510. The angle 582 between may be about 90 °. According to some embodiments, an interposer such that the angle 582 between the first face 531 on which the third terminal 503 is disposed and the designated face 533 on which the fourth terminal 504 is disposed forms an acute or obtuse angle. When 530 is deformed, the angle 581 between the first printed circuit board 510 and the second printed circuit board 520 may be an acute or obtuse angle.

According to various embodiments, the first terminal 501 of the first printed circuit board 510, the second terminal 502 of the second printed circuit board 502, and the third terminal 503 of the interposer 530 may be provided. Alternatively, by changing the position of at least one of the fourth terminals 504, the arrangement of the first printed circuit board 501 with respect to the second printed circuit board 502 may be variously formed. For example, the first printed circuit board 510 may include a first end 513 protruding at a first height H1 with respect to the fifth surface 521 of the second printed circuit board 520, and the second printed circuit board 510. It may include a second end 514 protruding at a second height H2 with respect to the sixth surface 522 of the printed circuit board 520. As shown, the first height H1 may be greater than the second height H2, but in some embodiments, the first height H1 and the second height H2 are substantially the same or the first printing. The second end 514 of the circuit board 510 may be formed so as not to protrude with respect to the sixth side 522 of the second printed circuit board 520.

According to various embodiments, the first printed circuit board 510 or the second printed circuit board 520 may be an inner layer in which a circuit is formed using copper clad laminates (CCLs) (or discs). (Or an inner layer substrate) and a multilayer printed circuit board formed by stacking a plurality of inner layers, according to an embodiment of the present disclosure. The printed circuit board 510 or the second printed circuit board 520 may be a single-side printed circuit board with a circuit formed only on one side or a double-sided circuit with a circuit formed on both sides. printed circuit board).

According to an embodiment, the first printed circuit board 510 may include one or more antennas 510a disposed on the eighth surface 512. According to some embodiments, one or more antennas may be implemented as a circuit included in an inner layer of the first printed circuit board 510. The eighth side 512 of the first printed circuit board 510 may substantially face the side member 591 (eg, 310 of FIG. 3). One or more antennas may include a first antenna for forming a beam or beam pattern directed to the side member 591. According to an embodiment, the first antenna may include at least one of a dipole antenna or a loop antenna.

According to various embodiments of the present disclosure, one or more antennas included in the first printed circuit board 510 may include a second antenna for forming a beam with the back plate 592 (eg, 380 of FIG. 3). According to an embodiment, the second antenna may include a patch antenna.

According to an embodiment, the first printed circuit board 510 may include a communication circuit (eg, a radio frequency integrated circuit (RFIC)) electrically connected to the plurality of antennas, and the communication circuit may include the seventh surface 511. Can be placed in. According to some embodiments, the communication circuit may be arranged with one or more antennas on the eighth face 512.

According to one embodiment, the communication circuit of the first printed circuit board 510 may up-convert or down-convert the frequency. For example, the communication circuit may receive an intermediate frequency (IF) signal from a communication module (not shown) of the second printed circuit board 520, and up-convert the received IF signal to an RF signal. For example, the communication circuit may down convert the RF signal received through the plurality of antennas into an IF signal, and the IF signal may be provided to the processor 520a or the communication module of the second printed circuit board 520.

Referring to FIG. 6A, the interposer 610 (eg, 390 of FIG. 4A) is coupled with a conductor 616 (eg, 42-n of FIG. 4A) and a metal member 617 (eg, 536 of FIG. 5). It may include a housing 615 to be coupled (for example, 410 of FIG. 4A). In cross-section, the housing 615 is a front side 611 (at which the third terminal 616a of the conductor 616 (e.g. 43-n in FIG. 4A or 503 in FIG. 5) is disposed). Example: first side 401 of FIG. 4A), back side 612 facing front 611, and fourth terminal 616b of conductor 616 (eg 44-n of FIG. 4B). Or a lower side 613 (eg 403 of FIG. 4B) on which the 504 of FIG. 5 is disposed, and a top side 614 (eg 404 of FIG. 4A) facing the bottom 613. It may include.

According to an embodiment, the

intermediate portions

616c and 616d connecting the third terminal 616a and the fourth terminal 616b of the conductor 616 may be disposed in the housing 615. For example, the

middle portions

616c and 616d may include a first middle portion 616c extending from the third terminal 616a in a direction from the front surface 611 to the rear surface 612, and the bottom surface at the top surface 614. It may include a second intermediate portion 616d extending in the direction toward 613 to connect the fourth terminal 616b and the first intermediate portion 616c. According to one embodiment, the first intermediate portion 616c and the second intermediate portion 616d may be orthogonal to each other. According to various embodiments, the

intermediate portions

616c and 616d may be formed in various other forms, thereby, for example, providing a conductive path connecting between the third terminal 616a and the fourth terminal 616b. The length can be shorter.

According to one embodiment, the metal member 617 is disposed on the back side 612 (eg, the second side 402 of FIG. 4B) of the housing 615 and faces from the back side 612 to the front side 611. It may include a bent end (617a). According to an embodiment, as shown, the end 617a may be disposed to be exposed to the lower surface 613. According to some embodiments, the end 617a may extend into the housing 611 and not be exposed to the outside.

According to one embodiment, the end 617a is coupled via a conductive material (eg solder) with the corresponding terminal of a second printed circuit board (eg 342 in FIG. 3 or 520 in FIG. 5), whereby metal The member 617 may be electrically connected to the ground of the second printed circuit board. According to some embodiments, although not shown, the end 617a may be bent in a direction from the front surface 611 to the rear surface 612.

According to various embodiments of the present disclosure, the end 617a may be used as an element for increasing the bonding force between the metal member 627 and the housing 615, and for example, a hook that is elastically coupled to the housing 615. ) May be included.

According to various embodiments of the present disclosure, at least a part of the metal member may be disposed in the housing 615.

Referring to FIG. 6B, in cross-section, interposer 620 (eg, 390 of FIG. 4A) may include conductor 626 (eg, 42-n of FIG. 4A) and metal member 627 (eg, FIG. And a housing 625 (eg, 410 of FIG. 4A) coupled with 536 of 5. Like the housing 615 of FIG. 6A, the housing 625 may include a front surface 621, a back surface 622, a bottom surface 623, and a top surface 624. Like the conductor 616 of FIG. 6A, the conductor 626 includes a third terminal 626a (for example, 43-n of FIG. 4A or 503 of FIG. 5) disposed on the front surface 621, and a bottom surface ( And a fourth terminal 626b (eg, 44-n of FIG. 4B or 504 of FIG. 5) disposed in 623. According to one embodiment, the metal member 627 may not only have at least a portion of the back side 622 of the housing 625 (eg, 402 of FIG. 4B) but also at least a portion of the top surface 624 (eg, 404 of FIG. 4A). It may be formed to cover.

According to various embodiments, although not shown, one end 627a of the metal member 627 may be bent in a direction from the bottom surface 623 to the top surface 624, or from the top surface 624 to the bottom surface 624. It may be formed in a depressed form. According to various embodiments, the bent end is coupled via a corresponding material of a first printed circuit board (eg, 341 in FIG. 3 or 510 in FIG. 5) and a conductive material (eg, solder), thereby forming a metal member. 627 may be electrically connected to the ground of the first printed circuit board.

According to various embodiments, although not shown, the other end portion 627b of the metal member 627 may be bent in a direction from the front surface 621 to the rear surface 622 or from the rear surface 622 toward the front surface 621. It may be formed in a depressed form. According to various embodiments, the bent end is coupled via a corresponding material of a second printed circuit board (eg 342 in FIG. 3 or 520 in FIG. 5) and a conductive material (eg solder) by means of a metal member. 627 may be electrically connected to the ground of the second printed circuit board.

Referring to FIG. 6C, in cross-section, interposer 630 (eg, 390 of FIG. 4A) may include conductor 636 (eg, 42-n of FIG. 4A) and metal member 637 (eg, FIG. And a housing 635 (eg, 410 of FIG. 4A) coupled with 536 of 5. Like the housing 615 of FIG. 6A, the housing 635 may include a front surface 631, a back surface 632, a bottom surface 633, and a top surface 634. Like the conductor 616 of FIG. 6A, the conductor 636 includes a third terminal 636a (for example, 43-n of FIG. 4A or 503 of FIG. 5) disposed on the front surface 621, and a bottom surface ( And a fourth terminal 636b (eg, 44-n of FIG. 4B or 504 of FIG. 5) disposed in 633. According to one embodiment, the metal member 637 is disposed on the back side 622 of the housing 635 (eg, 402 of FIG. 4B) and may include an extension 637a extending into the housing 635. This extension 637a may increase the coupling force between the metal member 637 and the housing 635. Such a structure that extends a portion of the metal member 637 into the interior of the housing 635 may be useful when it is difficult to extend the metal member to the outer surface of the housing 635. In FIG. 6C, only one extension 637a extending into the housing 635 is illustrated, but a plurality of extensions extending into the housing 635 may be formed.

Referring to FIG. 6D, in cross section, the interposer 640 (eg, 390 of FIG. 4A) is a housing coupled with the first conductor 646, the second conductor 656, and the metal member 647. 645 (eg, 410 of FIG. 4A). Like the housing 615 of FIG. 6A, the housing 645 may include a front surface 641, a back surface 642, a bottom surface 643, and a top surface 644.

According to one embodiment, the first conductor 646 is coupled to the housing 645 so that a part thereof is disposed inside the housing 645, the third terminal 646a disposed on the front surface 641, and the bottom surface of the first conductor 646. It may include a fourth terminal 646b disposed at 643.

According to an embodiment, the second conductor 656 may be physically separated from the first conductor 646, and may be coupled to the housing 645 such that a part of the second conductor 656 is disposed inside the housing 645. The second conductor 656 may include a fifth terminal 656a disposed on the front surface 641 and a sixth terminal 656b disposed on the lower surface 643.

According to one embodiment, the third terminal 646a and the fifth terminal 656a are electrically connected to the first printed circuit board (eg, 341 of FIG. 3) through a conductive material (eg, solder). The fourth terminal 646b and the sixth terminal 656b may be electrically connected to the second printed circuit board (eg, 342 of FIG. 3) through a conductive material (eg, solder). According to various embodiments of the present disclosure, an additional conductor further disposed in the housing 645 similar to the first conductor 646 or the second conductor 656 may further include a first printed circuit board and a second printed circuit board. It can be used to make electrical connections.

According to an embodiment, the metal member 647 may be disposed on the rear surface 612 of the housing 615 (eg, the second surface 402 of FIG. 4B). According to various embodiments, the metal member 647 may be replaced with one of the metal member 617 of FIG. 6A, the metal member 627 of FIG. 6B, or the metal member 637 of FIG. 6C, or a combination of some of them. It can be formed as.

Referring to FIG. 7, in one embodiment, the electronic device 700 (eg, 100 of FIG. 1 or 2, or 300 of FIG. 3) may include a plurality of first printed

circuit boards

711, 712, 713, and 714. (Eg, 341 in FIG. 3), the second printed circuit board 720 (eg, 342 in FIG. 3), the plurality of first printed

circuit boards

711, 712, and 713 and the second printed circuit board 720.

Interposers

731, 732, 733, and 734 (eg, 390 of FIG. 3) for electrically connecting the interconnectors.

According to an embodiment, the second printed circuit board 720 may be integrally formed with the outer structure 750 of the electronic device 700 (eg, the side member 310 of FIG. 3) or may be formed with the outer structure 750. It may be coupled to the connected support member 760 (eg, the first support member 311 of FIG. 3). The outer structure 750 can include a first side member 751, a second side member 752, a third side member 753, and a fourth side member 754. The first side member 751 may be disposed in parallel with the second side member 752 and arranged in the y axis direction at a separation distance. The third side member 753 may be disposed side by side in the x-axis direction with a separation distance in parallel with the fourth side member 754. According to one embodiment, the connection between the first side member 751 and the third side member 753, the connection between the first side member 751 and the fourth side member 754, the second side member 752 ) And the connection between the third side member 753, or the connection between the second side member 752 and the fourth side member 754 may provide a smooth curved side. According to one embodiment, the support member 760 is a mid-plate or bracket pointing to the inner portion surrounded by the

side members

751, 752, 753, 754 of the outer structure 750. Can be defined.

According to one embodiment, the support member 760 is an inner structure 770 formed of the same or different metal material than the outer structure 750, and an inner structure disposed between the outer structure 750 and the inner structure 770. 780 may be included. The outer structure 750 surrounds the space between the front plate (eg 320 in FIG. 3) and the back plate (eg 380 in FIG. 3), and the inner structure 770 extends or extends from the outer structure 750. It may be combined with the structure 750 and disposed in the space. The inner structure 780 is disposed in the space between the front plate (eg 320 in FIG. 3) and the back plate (eg 380 in FIG. 3) and is coupled to the outer structure 750 and the inner structure 770. It may include. According to an embodiment, the internal structure 780 may include a portion 751a of the first side member 751 and a portion 752a of the second side member 751 with the remaining

portions

751b, 751c, 752b, and 752c. , 753, 754 may be maintained in a physically or electrically separated state. The first side member 751 has a gap (not shown) formed at the first distance d1 from the third side member 753, and a gap (not shown) formed at the second distance d2 from the fourth side member 754. May include). The second side member 752 includes a gap (not shown) formed at the third distance d3 from the third side surface 753, and a gap (not shown) formed at the fourth distance d4 from the fourth side member 754. ) May be included.

Portions

781, 782, 783, 784 of the inner structure 780 may be disposed in these gaps to form a side (eg, 110C in FIG. 1) with the outer structure 750. According to an embodiment, the first distance d1, the second distance d2, the third distance d3, and the fourth distance d4 may be the same. According to some embodiments, at least some of the first distance d1, the second distance d2, the third distance d3, or the fourth distance d4 may be different from each other.

According to one embodiment, the portion 751a of the first side member 751 or the portion 752a of the second side member 752 may be in an electrically floating state. According to some embodiments, the portion 751a of the first side member 751 or the portion 752a of the second side member 752 may be electrically connected to the second printed circuit board 720 to form part of the communication circuit ( Eg antenna radiator or ground).

According to an embodiment, the second printed circuit board 720 may include a first region 721 and a first region disposed between the first side member 751 and the battery 940 (eg, 350 of FIG. 3). It may include a second region 722 extending from 721 and disposed between the fourth side member 754 and the battery 740. According to an embodiment, the first area 721 may include an opening 724 that supports the placement of a camera module (eg, the second camera device 112 of FIG. 2). The camera module is an integral part that includes a lens, an image sensor and / or an image signal processor, etc., and is arranged in such a manner as to be inserted into the opening 724 and electrically connected to the second printed circuit board 720. circuit).

According to an embodiment, the plurality of first printed

circuit boards

711, 712, 713, and 714 may include a printed circuit board 711 disposed between the first side member 751 and the first region 721. A printed circuit board 712 disposed between the third side member 753 and the first region 721, a printed circuit board 713 disposed between the fourth side member 754 and the first region 721, or And a printed circuit board 714 disposed between the fourth side member 754 and the second region 722. The first printed

circuit boards

711, 712, 713, 714 are electrically connected to the second printed circuit board 720 via the

interposers

731, 732, 733, 734, and the outer structure 750. It may be disposed adjacent to. For example, the gap between the first printed

circuit boards

711, 712, 713, 715 and the outer structure 750 may be about 5 mm or less.

According to one embodiment, one first printed circuit board 711 disposed adjacent to the first side member 751 may have a fifth distance d5 and a fourth side member 754 from the third side member 753. ) May be disposed at a sixth distance d6. According to an embodiment, the fifth distance d5 and the sixth distance d6 may be the same. According to some embodiments, the fifth distance d5 and the sixth distance d6 may be different. The first printed circuit board 711 is substantially parallel to the portion 751a of the first side member 751 extending straight, and one surface 711a of the first printed circuit board 711 is the first side member 751. May be directed to a portion 751a.

According to one embodiment, one first printed circuit board 711 disposed adjacent to the first side member 751 may at least overlap the internal structure 780.

According to an embodiment, another first printed circuit board 712 disposed adjacent to the third side member 753 may be disposed at a seventh distance d7 from the first side member 751. The first printed circuit board 712 may be substantially parallel to the straightly extending third side member 753, and one surface 712a of the first printed circuit board 712 may face the third side member 753. .

According to one embodiment, another first printed circuit board 713 disposed adjacent to the fourth side member 754 may be disposed at a seventh distance d7 or a different distance from the first side member 751. Can be. The first printed circuit board 713 may be substantially parallel to the fourth side member 754 extending straight, and one surface 713a of the first printed circuit board 713 may face the fourth side member 754. .

According to one embodiment, another first printed circuit board 714 disposed adjacent to the fourth side member 754 is substantially parallel to the fourth side member 754 extending straight, and the first printed circuit board One surface 714a of 714 may face the fourth side member 754.

According to various embodiments, the inner structure 780 extends such that the remaining first printed

circuit boards

712, 713, or 714 at least overlap the inner structure 780, such as one first printed circuit board 711. It may be designed.

According to various embodiments, the second printed circuit board 720 may include a third area 723 extending from the second area 722 and disposed between the second side member 752 and the battery 740. have. According to some embodiments, the third region 723 is separated from the second region 722 and may be electrically connected to the first region 721 or the second region 722 through an FPCB or a coaxial cable. . According to various embodiments of the present disclosure, although not shown, the electronic device 700 further includes at least one printed circuit board electrically connected to the third region 723 and disposed adjacent to the outer structure 750 through an interposer. It may also include. According to various embodiments of the present disclosure, some of the plurality of first printed

circuit boards

711, 712, 713, and 714 may be omitted.

According to one embodiment, the plurality of first printed

circuit boards

711, 712, 713, 714 may be defined as a communication device that includes one or more antennas and a communication circuit (eg, an RFIC), such a communication device. May form a beam or beam pattern directed to the outer structure 750. According to one embodiment, one or more antennas are disposed on one

surface

711a, 712a, 713a, 714b of the first printed

circuit boards

711, 712, 713, 714, the communication circuit is the same side (711a, 712a, 713a, 714a, or on the opposite side (not shown).

According to one embodiment, the portion 751a of the first side member 751 or the portion 752a of the second side member 752 may be physically or electrically separated by the internal structure 780. The structure can reduce degradation of antenna performance of communication devices implemented with a plurality of first printed

circuit boards

711, 712, 713, 714.

8A is a perspective view of a front side of an interposer according to an embodiment. 8B is a perspective view of the rear side of the interposer of FIG. 8A, according to one embodiment.

8A and 8B, the interposer 800 (eg, 390 of FIG. 3 or 4A) is generally rectangular in shape, such as the first face 801 (eg, 401 of FIG. 4A), A second face 802 facing the first face 801 (e.g., 402 of FIG. 4B), and one or more third faces 803 surrounding between the first face 801 and the

second face

802, 804, 805, 806 (eg, 403, 404, 405, 406 of FIGS. 4A and 4B) and a housing 810 (eg, 410 of FIG. 4A or 4B).

According to one embodiment, the interposer 800 includes a plurality of conductors electrically connecting between the first face 801 and a designated face 803 of one or more

third faces

803, 804, 805, and 806. (821, 822, 823, 824, 825, 826) (eg, 42-1, 42-2,..., 42-n of FIG. 4A or 4B). Each of the plurality of

conductors

821, 822, 823, 824, 825, and 826 is coupled to the housing 810 such that a portion thereof is disposed inside the housing 810, and the plurality of

conductors

821, 822, 823, 824, 825, 826 may remain physically separated. According to one embodiment, the plurality of

conductors

821, 822, 823, 824, 825, 826 are formed in substantially the same shape, and in a direction 809 between the

third surfaces

805 and 806 facing each other. Can be arranged. According to one embodiment, the intervals in which the plurality of

conductors

821, 822, 823, 824, 825, and 826 are arranged may be constant. According to some embodiments, the intervals in which the plurality of

conductors

821, 822, 823, 824, 825, and 826 are arranged may not be constant.

According to one embodiment, the plurality of

conductors

821, 822, 823, 824, 825, 826 are

third terminals

831, 832, 833, 834, 835 disposed to be exposed to the first surface 801. 836 (e.g., 43-1, 43-2,..., 43-n of FIG. 4A) and one or more

third surfaces

803, 804, 805, and 806,

Fourth terminals

841, 842, 843, 844, 845, and 846 (eg, 44-1, 44-2,..., 44-n of FIG. 4B) may be included.

According to an embodiment, the interposer 800 may include a metal plate 830 (eg, the metal member 536 of FIG. 5) disposed on the second surface 802 of the housing 810. When a signal is transmitted and received through the plurality of

conductors

821, 822, 823, 824, 825, and 826, the metal plate 830 may reduce the influence of electromagnetic noise on the transmission and reception of such a signal.

According to various embodiments of the present disclosure, a second surface 802 of the housing 810 may include a recess (not shown) for fitting the metal plate 830. According to various embodiments, when the metal plate 830 is fitted into the recess, a snap-fit that binds the metal plate 830 by a hook formed in the housing 534 may be applied. Can be. According to various embodiments, an adhesive material such as a polymer may be disposed between the metal plate 830 and the housing 810.

9A illustrates a first printed circuit for structural understanding of the coupling between the interposer 930 (eg 800 of FIG. 8A or 8B) and the printed circuit boards 910, 920 (

eg

341, 342 of FIG. 3). The substrate 910 is represented transparently. 9A and 9B, in one embodiment, the first printed circuit board 910 (eg, 341 in FIG. 3) may include a seventh surface 911 (eg, 511 in FIG. 5) disposed opposite to each other; An eighth surface 912 (eg, 512 of FIG. 5) may be included, and first terminals (eg, 501 of FIG. 5) may be disposed on the seventh surface 911. The first terminals disposed on the seventh surface 911 may include the

third terminals

931, 932, disposed on the first surface 901 of the interposer 930 (eg, the first surface 801 of FIG. 8A). 933, 934, 935, and 936 (eg, 831, 832, 833, 834, 835, and 836 of FIG. 8A) and a conductive material (eg, solder) may be electrically connected to each other. The second printed circuit board 920 (e.g., 342 in Fig. 3) has a fifth side 921 (e.g. 521 in Fig. 5) and a sixth side 922 (e.g. 522 in Fig. 5) disposed opposite each other. ), And second terminals (eg, 502 of FIG. 5) may be disposed on the fifth surface 921. The second terminals disposed on the fifth surface 921 are fourth terminals disposed on the designated third surface 903 (eg, 803 of FIG. 8B) of the interposer 930 (eg, 841 and 842 of FIG. 8A). , 843, 844, 845, and 846 may be electrically connected to each other through a conductive material (eg, solder).

According to an embodiment, the gap between the seventh surface 911 of the first printed circuit board 910 and the side surface 933 of the second printed circuit board 920 may vary depending on the mounting position of the interposer 930. can do. For example, as shown, the gap between the seventh side 911 of the first printed circuit board 910 and the side surface 923 of the second printed circuit board 920 may be substantially close to zero. For another example, when the first side 901 of the interposer 930 protrudes with respect to the side surface 923 of the second printed circuit board 920, the seventh side of the first printed circuit board 910 ( 911 may be spaced apart from side surface 923 of second printed circuit board 920.

According to an embodiment, after the first printed circuit board 910 and the interposer 930 are electrically connected, the second printed circuit board 920 and the interposer 930 may be electrically connected. According to some embodiments, the first printed circuit board 910 and the interposer 930 may be electrically connected after the second printed circuit board 920 and the interposer 930 are electrically connected.

According to an embodiment, the first printed circuit board 910 may include a communication circuit 919, a first antenna array 914, or a second antenna array 915. According to one embodiment, the communication circuit 919 or various electrical elements 917 is mounted on a seventh side (911 of FIG. 9B), and the seventh side 911 and the second side of the first printed circuit board 910. It may be disposed in a space 941 defined by the sixth surface 922 of the printed circuit board 920. The first antenna array 914 or the second antenna array 915 may be disposed on the eighth side (912 of FIG. 9B). According to some embodiments, the first antenna array 914 or the second antenna array 915 may be implemented as a circuit included in an inner layer of the first printed circuit board 910. The first antenna array 914 or the second antenna array 915 may be electrically connected to the communication circuit 919 through at least one inner layer circuit (or wiring) included in the first printed circuit board 910. .

According to an embodiment, the antenna array may be defined as a structure in which a plurality of antenna elements having substantially the same shape are arranged or a structure in which a plurality of antenna elements are arranged at regular intervals. The first antenna array 914 or the second antenna array 915 to which such an antenna array is applied overcomes high free space loss due to frequency characteristics in, for example, wireless communication utilizing a millimeter wave of about 20 GHz or more. And increase the antenna gain. The number of antenna elements is not limited to the illustrated example, and may vary depending on the size or antenna gain of the first printed circuit board 910.

According to various embodiments of the present disclosure, in order to reduce degradation of antenna gain due to mutual interference between antenna elements, various feeding structures (eg, multiple feedings) for the first antenna array 914 or the second antenna array 915 may be provided. Can be prepared.

According to an embodiment, the

antenna elements

914a, 914b, and 914c included in the first antenna array 914 include a patch antenna, and the

antenna elements

915a and 915b included in the second antenna array 915. 915c and 915d may include a dipole antenna or a loop antenna. According to one embodiment, the first antenna array 914 forms a beam toward the back plate of the electronic device (eg, 380 of FIG. 3), and the second antenna array 915 is a side bezel structure of the electronic device (eg The beam may be formed toward 310 in FIG. 3.

According to an embodiment, the first printed circuit board 910 may include inner layers in which circuits are formed using a copper clad laminate (CCL), first outer layers and second outer layers in which circuits are formed on both inner layers, and between layers. And a structure including prepregs for adhering and insulating the circuits, and the circuits between the layers may be electrically connected through vias formed in the first printed circuit board 910. According to an embodiment, the circuit included in the first outer layer includes the first antenna array 914 or the second antenna array 915, and the circuit included in the second outer layer uses solder as the communication circuit 919. And pads (or terminals) for mounting.

According to some embodiments, the first antenna array 914 or the second antenna array 915 is a conductive plate applied separately to the first printed circuit board 910 or a metal plate separately attached to the first printed circuit board 910. It may also contain paint.

According to an embodiment of the present disclosure, the communication circuit 919 may support wireless communication utilizing at least some bands (eg, about 24 GHZ to 30 GHZ, or about 37 GHz to 40 GHz) of about 3 GHz to 100 GHz band. The communication circuit 919 may up-convert or down-convert the frequency. For example, the IF signal output from the communication module included in the second printed circuit board 920 is provided to the communication circuit 919 of the first printed circuit board 910 through the interposer 930 and the communication circuit. 919 may up-convert the IF signal to an RF signal. For example, the communication circuit 919 down converts an RF signal (eg, a millimeter wave signal) received through the first antenna array 914 or the second antenna array 915 into an IF signal, and the IF signal is interleaved. It may be provided to the communication module of the first printed circuit board 910 through the poser 930.

According to various embodiments of the present disclosure, one of the first antenna array 914 and the second antenna array 915 may be omitted.

According to various embodiments, the first printed circuit board 910 may include an antenna matching circuit. Radiation characteristics and impedance of the first antenna array 914 or the second antenna array 915 are related to antenna performance, and may vary depending on the shape and size of the antenna element and the material of the antenna element. The radiation characteristics of the antenna element are the antenna radiation pattern (or antenna pattern), which is a directional function representing the relative distribution of power radiated from the antenna element, and the polarization state of the radio waves radiated from the antenna element ( Alternatively, the antenna may include antenna polarization. The impedance of the antenna element may be related to power transfer from the transmitter to the antenna element or power transfer from the antenna element to the receiver. To minimize reflections at the connection between the transmission line and the antenna element, the impedance of the antenna element is designed to match the impedance of the transmission line, thereby allowing maximum power transfer (or minimal power loss) or efficient signal transmission through the antenna element. This may be possible. Impedance matching can lead to efficient signal flow at a particular frequency (or resonant frequency). Impedance mismatch can reduce power loss or transmit and receive signals, resulting in poor communication performance. According to one embodiment, at least one electrical element 917 mounted on the first printed circuit board 910 may be used as a frequency adjustment circuit to eliminate such impedance mismatch. According to an embodiment of the present disclosure, the frequency adjusting circuit may move the resonance frequency to the designated frequency, or move the resonance frequency by the designated frequency.

According to various embodiments of the present disclosure, signals related to wireless communication, power, or various other functions may be transmitted through the interposer 930, and at least one electrical element 917 mounted on the first printed circuit board 910. ) May include passive elements or active elements associated with such signal transmission and reception.

According to an embodiment, although not shown, when the first printed circuit board 910 and the second printed circuit board 920 transmit and receive a signal through the interposer 930, the interposer 930 may transmit or receive the signal. A metal member (eg, 536 of FIG. 5, 617 of FIG. 6A, 627 of FIG. 6B, 637 of FIG. 6C, or 830 of FIG. 8B) may be included to reduce the affecting electromagnetic noise.

Referring to FIG. 10, in one embodiment, the first printed circuit board 1010 (eg, 341 in FIG. 3) has a seventh surface 1011 (eg, 911 in FIG. 9B) and an eighth side disposed opposite each other. A surface 1012 (eg, 912 of FIG. 9B) may be included, and a first terminal 1114 (eg, 501 of FIG. 5) may be disposed on the seventh surface 1011. The second printed circuit board 1020 (e.g., 342 in Fig. 3) has a fifth side 1021 (e.g. 521 in Fig. 5) and a sixth side 1022 (e.g. 522 in Fig. 5) disposed opposite each other. ), And a second terminal 1024 (eg, 502 of FIG. 5) may be disposed on the sixth surface 1022. The first printed circuit board 1010 and the second printed circuit board 1020, with the side surface 1013 of the first printed circuit board 1010 facing the sixth surface 1022 of the second printed circuit board 1020. May be electrically connected via the interposer 1030. The interposer 1030 includes a first terminal 1114 disposed on the seventh side 1011 of the first printed circuit board 1010 and a sixth side 1022 disposed on the second printed circuit board 1020. It may include at least one conductor 1031 (eg, 42-n of FIG. 4A or 4B) connected to the two terminals 1024 through a conductive material such as solder.

According to an embodiment, the eighth surface 1012 of the first printed circuit board 1010 may not protrude from the side surface 1023 of the second printed circuit board 1020. According to some embodiments, although not shown, the eighth surface 1012 of the first printed circuit board 1010 may protrude from the side surface 1023 of the second printed circuit board 1020.

According to an embodiment, the first printed circuit board 1010 may be a communication circuit 1019 disposed on the seventh surface 1011 (similar to or the same as the first printed circuit board 910 of FIG. 9A or 9B). Example: 919 of FIG. 9A, and one or more antennas (eg, antenna arrays 914 or 915 of FIG. 9A) disposed on the eighth face 1012.

According to an embodiment, the second printed circuit board 1020 may be a communication module or processor (eg, 520a of FIG. 5) configured to communicate with an external electronic device using one or more antennas included in the first printed circuit board 1010. ) May be included.

According to various embodiments, although not shown, a third printed circuit board electrically connected to the second printed circuit board 1020 may be further added. The second printed circuit board 1020 and the third printed circuit board may be interposers (eg, as shown in FIG. 4A) so that the side of the third printed circuit board faces the fifth side 1021 of the second printed circuit board 1020. 390 of 4b or 530 of FIG. 5 may be electrically connected to each other. The third printed circuit board may include communication circuitry and an antenna array, at least similarly to the first printed circuit board 910 of FIG. 9A or 9B. A communication module or processor (eg, 520a in FIG. 5) of the second printed circuit board 1020 utilizes one or more antennas included in at least one of the first printed circuit board 1010 or the third printed circuit board 1030. To communicate with an external electronic device.

Referring to FIG. 11, in one embodiment, when viewed in cross section, the seventh surface 1111 of the first printed circuit board 1110 faces the side surface 1123 of the second printed circuit board 1120. The first printed circuit board 1110 and the second printed circuit board 1120 may be electrically connected to each other via the first interposer 1131 and the second interposer 1132. The first interposer 1131 is a terminal 1101 disposed on the seventh side 1111 of the first printed circuit board 1110 and a terminal disposed on the fifth side 1121 of the second printed circuit board 1120. 1103 and at least one first conductor 1131a (eg, 42-n of FIG. 4A or 4B) connected through a conductive material (eg, solder). The second interposer 1132 is a terminal 1102 disposed on the seventh side 1111 of the first printed circuit board 1110 and a terminal disposed on the sixth side 1122 of the second printed circuit board 1120. 1104 and at least one second conductor 1132a (eg, 42-n of FIG. 4A or 4B) connected through solder.

According to an embodiment, the first printed circuit board 1110 may include one or more antennas. According to various embodiments, the first printed circuit board 1110 may include a communication circuit and an antenna array, at least similarly to the first printed circuit board 910 of FIG. 9A or 9B. For example, the first printed circuit board 1110 may include a communication circuit (eg, 919 of FIG. 9A) disposed on one surface 1111 and at least one antenna array (eg, FIG. 9A) disposed on the other surface 1112. 914 or 915).

According to an embodiment, the second printed circuit board 1120 may be a communication module or processor (eg, 520a of FIG. 5) configured to communicate with an external electronic device using one or more antennas included in the first printed circuit board 1110. ) May be included.

12A is a perspective view of an interposer according to an embodiment. 12B is a cross-sectional view of the interposer corresponding to A-A in FIG. 12A. 12C is a cross-sectional view of the interposer corresponding to B-B in FIG. 12A. FIG. 12D is a cross-sectional view of the interposer corresponding to C-C in FIG. 15A.

Referring to FIG. 12A, an interposer 1200 according to an embodiment may include a housing 1210, one or more first conductors 1221 and one or more second conductors 1222 coupled to the housing 1210. ) Or a metal member 1230.

According to an embodiment, the housing 1210 may have a front surface 1201 and a rear surface (not shown) facing each other, an upper surface 1203 and a lower surface (not shown) facing each other, and a left side surface (not shown) facing each other. And a rectangular parallelepiped including right side 1205.

12A and 12B, in one embodiment, the one or more first conductors 1221 are coupled with the housing 1210 so that a portion thereof is disposed inside the housing 1210, and the front side of the housing 1210. It may include a terminal 1221a disposed at 1201 and a terminal 1221b disposed on an upper surface 1203 of the housing 1210. When a printed circuit board facing the front surface 1201 of the housing 1210 is coupled with the interposer 1200, the terminals 1221a disposed on the front surface 1201 of the housing 1210 may conduct a conductive material such as solder. The electrical circuit can be electrically connected to the corresponding terminals of the printed circuit board. When a printed circuit board facing the top surface 1203 of the housing 1210 is coupled with the interposer 1200, the terminals 1221b disposed on the top surface 1203 of the housing 1210 may conduct a conductive material such as solder. The electrical circuit can be electrically connected to the corresponding terminals of the printed circuit board.

12A and 12C, in one embodiment, the one or more second conductors 1222 are coupled with the housing 1210 such that a portion thereof is disposed inside the housing 1210 and the bottom surface of the housing 1210. It may include a terminal 1222a disposed at 1204 and a terminal 1222b disposed on an upper surface 1203 of the housing 1210. When the printed circuit board facing the lower surface 1204 of the housing 1210 is coupled with the interposer 1200, the terminals 1222a disposed on the lower surface 1204 of the housing 1210 may be mediated by a conductive material such as solder. The electrical circuit can be electrically connected to the corresponding terminals of the printed circuit board. When the printed circuit board facing the top surface 1203 of the housing 1210 is coupled with the interposer 1200, the terminals 1222b disposed on the top surface 1203 of the housing 1210 may conduct a conductive material such as solder. The electrical circuit can be electrically connected to the corresponding terminals of the printed circuit board.

12A, in one embodiment, one or more first conductors 1221 and one or more second conductors 1222 are formed on the right side 1205 of the left side (not shown) of housing 1210. May be arranged in a direction 1209 facing each other, and may be physically separated from each other. For example, as shown, two first conductors 1221 may be disposed between two second conductors 1222. According to various embodiments of the present disclosure, the number of the first conductors or the second conductors shown in FIG. 12A may not be limited to or the arrangement thereof. For example, the first conductors and the second conductors may be alternately designed. May be

12A, 12B and 12C, a metal member 1230 according to an embodiment is disposed on the rear surface 1202 of the housing 1210 and includes one or more first conductors 1221 and one or more second conductives. It may be physically separated from the sieves 1222. According to various embodiments of the present disclosure, the metal member 1230 may be further extended to another side of the housing 1210 (eg, the left side or the right side 1205). According to various embodiments, the metal member 1230 may be replaced with one of the metal member 617 of FIG. 6A, the metal member 627 of FIG. 6B, or the metal member 637 of FIG. 6C, or a combination of some of them. It may be formed as. According to one embodiment, when a plurality of printed circuit boards coupled to the interposer 1200 transmits and receives a signal through the interposer 1200, the metal member 1230 is affected by electromagnetic noise affecting the transmission and reception of these signals. It can reduce madness.

12A, in one embodiment, the interposer 1200 is a first pin 1241 and a second pin coupled to the housing 1210 such that the interposer 1200 protrudes with respect to the top surface 1203 of the housing 1210. 1242 may be included. When the printed circuit board facing the top surface 1203 of the housing 1210 is coupled with the interposer 1200, the first pin 1241 and the second pin 1242 may be inserted into holes formed in the printed circuit board. have. For example, when electrically connecting the

terminals

1221b and 1222b disposed on the top surface 1203 of the housing 1210 and corresponding terminals of the printed circuit board, the first pin 1241 and the second pin 1242 are connected to each other. Inserted into the holes of the printed circuit board, the interposer 1200 may be positioned in the printed circuit board without shaking. According to an embodiment, the

terminals

1221b and 1222b disposed on the top surface 1203 of the housing 1210 may be disposed between the first pin 1241 and the second pin 1242. According to various embodiments of the present disclosure, the pins may not be limited to the position or number shown in FIG. 12A, and may be disposed between terminals, for example.

According to an embodiment, the interposer 1200 may include a third pin 1243 and a fourth pin 1244 coupled to the housing 1210 to protrude with respect to the bottom surface of the housing 1210. When the printed circuit board facing the bottom surface of the housing 1210 is coupled with the interposer 1200, the third pin 1243 and the fourth pin 1244 may be inserted into holes formed in the printed circuit board. For example, when electrically connecting terminals disposed on the bottom surface of the housing 1210 (eg, 1222a in FIG. 12C) and corresponding terminals of the printed circuit board, the third pin 1243 and the fourth pin 1244 may be connected to each other. Inserted into the holes of the printed circuit board, the interposer 1200 may be positioned in the printed circuit board without shaking. Terminals disposed on the bottom surface of the housing 1210 may be disposed between the third pin 1243 and the fourth pin 1244. According to various embodiments of the present disclosure, the pin may not be limited to the position or the number shown in FIG. 12A.

According to an embodiment, the first pin 1241 and the third pin 1243 may be electrically connected, and the second pin 1242 and the fourth pin 1244 may be electrically connected. For example, referring to FIG. 12D, there is an integral conductive member 1240 coupled with the housing 1210 such that a portion thereof is disposed inside the housing 1210, and a portion of the conductive member 1240 is a housing ( Protruding with respect to the upper surface 1203 of the 1210 is utilized as the first pin (1241), the other portion of the conductive member 1240 is protruded with respect to the lower surface 1204 of the housing 1210 and the third pin (1243) It can be used as. The second fin 1242 and the fourth fin 1242 of FIG. 12A may also be formed from an integral conductive member coupled to the housing 1210.

According to various embodiments of the present disclosure, the first pin 1241, the second pin 1242, the third pin 1243, or the fourth pin 1244 may be inserted into a hole of the printed circuit board to be coupled with the printed circuit board. have.

According to various embodiments, when the printed circuit board facing the top surface 1203 of the housing 1210 is coupled with the interposer 1200, the first pin 1241 and the second pin 1242 may be connected to the printed circuit board. Can be electrically connected. When the printed circuit board facing the lower surface 1204 of the housing 1210 is coupled with the interposer 1200, the third pin 1243 and the fourth pin 1244 may be electrically connected to the printed circuit board.

According to an embodiment, the first fin 1241, the second fin 1242, the third fin 1243, and the fourth fin 1244 may face the top surface 1203 of the housing 1210. And a printed circuit board facing the lower surface 1204 of the housing 1210. For example, through a first pin 1241, a second pin 1242, a third pin 1243, and a fourth pin 1244, the printed circuit board facing the top surface 1203 of the housing 1210. The ground and the ground of the printed circuit board facing the lower surface 1204 of the housing 1210 may be electrically connected.

According to various embodiments of the present disclosure, as illustrated in FIG. 12A, the first fin 1241 and the second fin 1242 disposed on one side, and the third fin 1243 and the fourth fin 1244 disposed on the other side are provided. Interposer 1200 including a, may be said to include a dual in-line package (DIP). According to various embodiments, when an interposer is designed to have pins (eg, first and

second pins

1241 and 1242, or third and fourth pins 1243 and 1244) disposed on only one side, such an interposer Can be said to include a single in-line package (SIP).

According to various embodiments of the present disclosure, an interposer that does not include pins (eg, 1241, 1242, 1243, and 1244) may be designed, and the interposer may be defined as a surface mount device (SMD).

Referring to FIG. 13, in one embodiment, when viewed in cross section, the interposer 1300 may have a front face 1301 (eg, 1201 in FIG. 12A) and a back face 1302 (eg, FIGS. 12B and 12C) facing each other. 1202) and a housing 1305 (e.g., 1210 of FIG. 12a) that includes an upper surface 1303 (e.g., 1203 of FIG. 12a) and a lower surface 1304 (e.g., 1204 of FIGS. 12b and 12c) facing each other. It may include.

According to one embodiment, when the second printed circuit board 1320 facing the front surface 1301 of the housing 1305 is coupled with the interposer 1300, at least disposed on the front surface 1301 of the housing 1305. One eleventh terminal 1351 (eg, 1221a of FIG. 12A or 12B) may be electrically connected to the second terminal 1321 of the second printed circuit board 1320 using a conductive material such as solder.

According to one embodiment, when the third printed circuit board 1330 facing the top surface 1303 of the housing 1305 is coupled with the interposer 1300, at least disposed on the top surface 1303 of the housing 1305. One twelfth terminal 1352 (eg, 1221b of FIG. 12B) and at least one thirteenth terminal 1353 (eg, 1222b of FIG. 12C) may be formed of a third printed circuit board 1330 using a conductive material such as solder. ) May be electrically connected to the third terminal 1333. The interposer 1300 includes a first conductor 1350a (eg, the first conductor 1221 of FIG. 12A or 12B) that includes an eleventh terminal 1351 and a twelfth terminal 1352. The second printed circuit board 1320 and the third printed circuit board 1320 may be electrically connected to each other through the first conductor 1350a.

According to one embodiment, when the first printed circuit board 1310 facing the bottom surface 1304 of the housing 1305 is coupled with the interposer 1300, at least disposed on the bottom surface 1304 of the housing 1305. One fourteenth terminal 1354 (eg, 1222a of FIG. 12C) may be electrically connected to the first terminal 1311 of the first printed circuit board 1310 using a conductive material such as solder. The interposer 1300 includes a second conductor 1350b (eg, the second conductor 1222 of FIG. 12A or 12C) including the thirteenth terminal 1353 and the fourteenth terminal 1354. The first printed circuit board 1310 and the third printed circuit board 1330 may be electrically connected through the second conductor 1350b.

According to various embodiments of the present disclosure, although not shown, the interposer 1300 may include at least one pin (for example, the first pin 1241 or the second pin 1 of FIG. 12A) protruding from the top surface 1303 of the housing 1305. 1242), wherein at least one pin may be inserted into a recess or hole formed in the third printed circuit board 1330. According to various embodiments of the present disclosure, at least one pin is inserted into a through-hole formed in the third printed circuit board 1330, and an end portion of the third printed circuit board 1630 is formed by using a conductive material such as solder. Protrude in the opposite direction and engage with the land around the through hole.

According to various embodiments of the present disclosure, although not shown, the interposer 1300 may include at least one pin (for example, the third pin 1243 or the fourth pin of FIG. 12A) protruding from the bottom surface 1304 of the housing 1305. 1244), and at least one pin may be inserted into a recess or hole formed in the first printed circuit board 1310. According to various embodiments of the present disclosure, at least one pin is inserted into a through hole formed in the first printed circuit board 1310, and an end thereof protrudes to the opposite side of the first printed circuit board 1310 by using a conductive material such as solder. Can be coupled to land around the through hole.

According to an embodiment, the first printed circuit board 1310 or the second printed circuit board 1320 may include one or more antennas. According to various embodiments, the first printed circuit board 1310 or the second printed circuit board 1320 includes a communication circuit and an antenna array, at least similarly to the first printed circuit board 910 of FIG. 9A or 9B. can do.

According to an embodiment, the third printed circuit board 1330 may be configured to communicate with an external electronic device using one or more antennas included in the first printed circuit board 1310 or the second printed circuit board 1320. Or a processor (eg, 520a of FIG. 5).

Referring to FIG. 14, interposer 1430 (eg, 1500 of FIG. 12A) may include at least one pin 1433 (eg, protruding from one surface 1432 of housing 1431 (eg, 1210 of FIG. 12A). 1241, 1242, 1243, or 1244 of FIG. 12A). When the printed circuit board 1410 (eg, 1310, 1320, or 1330 of FIG. 13) facing the one surface 1432 of the housing 1431 is coupled with the interposer 1430 (eg, 1300 of FIG. 13), At least one pin 1433 may be inserted into the through hole 1413 formed in the printed circuit board 1410 such that the interposer 1430 may be positioned on the printed circuit board 1410 without shaking.

According to one embodiment, the printed circuit board 1410 may include a land 1414 disposed around the through hole 1413, and the end 1434 of the at least one pin 1433 may be a conductive material such as solder. May be coupled to the land 1414. According to one embodiment, at least one pin 1433 may be electrically connected to the printed circuit board 1410. For example, the land 1414 may be electrically connected to a ground formed on an outer layer or an inner layer of the printed circuit board 1410, and the at least one pin 1433 may be electrically connected to the ground of the printed circuit board 1410. have.

According to some embodiments, at least one pin 1433 may be utilized only as an element for mechanical coupling between the interposer 1430 and the printed circuit board 1410. For example, the land 1414 of the printed circuit board 1410 serves as an element for securing at least one pin 1433 using solder and is not electrically connected to the ground of the printed circuit board 1410. You may not. According to some embodiments, the land 1414 of the printed circuit board 1410 may be omitted. According to various embodiments, at least one pin 1433 may be coupled to the printed circuit board 1410 through various nonconductive adhesive materials. According to various embodiments of the present disclosure, an adhesive material may be disposed between the at least one pin 1433 and the inner side surface (not shown) of the through hole 1413. According to various embodiments of the present disclosure, the at least one pin 1433 inserted into the through hole 1413 may have a length that does not protrude or protrude from the printed circuit board 1410.

According to various embodiments, when viewed in a direction 1401 from the housing 1431 to the printed circuit board 1410, the at least one pin 1433 may have various cross-sectional shapes such as a circle and a polygon. When viewed in the direction 1401, the through hole 1413 may be formed in a cross-sectional shape corresponding to the cross-sectional shape of the at least one pin 1433.

FIG. 15 illustrates an interposer including a housing facing a plurality of printed circuit boards and a conductor electrically connecting the plurality of printed circuit boards, and an electronic in a network environment 1500, including the same, according to various embodiments. A block diagram of an apparatus 1501 (eg, 100 of FIG. 1 or 2, or 300 of FIG. 3). Referring to FIG. 15, in a network environment 1500, the electronic device 1501 communicates with the electronic device 1502 through a first network 1598 (eg, a short range wireless communication network), or the second network 1599. The electronic device 1504 or the server 1508 may be communicated through a remote wireless communication network. According to an embodiment of the present disclosure, the electronic device 1501 may communicate with the electronic device 1504 through the server 1508. According to an embodiment, the electronic device 1501 may include a processor 1520, a memory 1530, an input device 1550, an audio output device 1555, a display device 1560 (eg, the display 101 of FIG. 1). Or display 330 of FIG. 3), audio module 1570 (eg 103, 107 or 114 of FIG. 1 or 2), sensor module 1576 (eg 104 of FIG. 1 or 119 of FIG. 2), interface 1577, haptic module 1579, camera module 1580 (eg, first camera device 105, second camera device 112, and / or flash 113 of FIG. 1 or 2), power management The module 1588, the battery 1589 (eg, 350 of FIG. 3), the communication module 1590, the subscriber identification module 1596, or the antenna module 1597 may be included. In some embodiments, at least one of the components (eg, the display device 1560 or the camera module 1580) may be omitted or one or more other components may be added to the electronic device 1501. In some embodiments, some of these components may be implemented in one integrated circuit. For example, the sensor module 1576 (eg, fingerprint sensor, iris sensor, or illuminance sensor) may be implemented embedded in the display device 1560 (eg, display).

The processor 1520 may, for example, execute software (eg, a program 1540) to execute at least one other component (eg, hardware or software component) of the electronic device 1501 connected to the processor 1520. It can control and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operation, the processor 1520 (eg, 520a in FIG. 5) may receive instructions received from another component (eg, sensor module 1576 or communication module 1590). Alternatively, data may be loaded into the volatile memory 1532, the instructions or data stored in the volatile memory 1532 may be processed, and the result data may be stored in the nonvolatile memory 1534. According to an embodiment, the processor 1520 may include a main processor 1521 (eg, a central processing unit or an application processor), and a coprocessor 1523 (eg, a graphics processing unit, an image signal processor) that may operate independently or together. , Sensor hub processor, or communication processor). Additionally or alternatively, the coprocessor 1523 may be configured to use lower power than the main processor 1521 or to be specific to a designated function. The coprocessor 1523 may be implemented separately from or as part of the main processor 1521.

The coprocessor 1523 may, for example, replace the main processor 1521 while the main processor 1521 is in an inactive (eg, sleep) state, or the main processor 1521 may be active (eg, execute an application). Together with the main processor 1521, at least one of the components of the electronic device 1501 (eg, display device 1560, sensor module 1576, or communication module 1590). Control at least some of the functions or states associated with the. According to one embodiment, the coprocessor 1523 (eg, an image signal processor or communication processor) may be implemented as part of another functionally related component (eg, camera module 1580 or communication module 1590). have.

The memory 1530 may store various data used by at least one component of the electronic device 1501 (for example, the processor 1520 or the sensor module 1576). The data may include, for example, software (eg, program 1540) and input data or output data for instructions associated with it. The memory 1530 may include a volatile memory 1532 or a nonvolatile memory 1534.

The program 1540 may be stored as software in the memory 1530 and may include, for example, an operating system 1542, middleware 1544, or an application 1546.

The input device 1550 may receive a command or data to be used for a component (for example, the processor 1520) of the electronic device 1501 from the outside (for example, a user) of the electronic device 1501. The input device 1550 may include, for example, a microphone, a mouse, or a keyboard.

The sound output device 1555 may output a sound signal to the outside of the electronic device 1501. The sound output device 1555 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of a speaker.

The display device 1560 may visually provide information to the outside (eg, a user) of the electronic device 1501. The display device 1560 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment of the present disclosure, the display device 1560 may include a touch circuitry configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the strength of a force generated by the touch. have.

The audio module 1570 may convert sound into an electrical signal or vice versa. According to an embodiment of the present disclosure, the audio module 1570 acquires sound through the input device 1550, or an external electronic device (eg, connected to the sound output device 1555 or the electronic device 1501 directly or wirelessly). Sound may be output through the electronic device 1502 (eg, a speaker or a headphone).

The sensor module 1576 detects an operating state (eg, power or temperature) or an external environmental state (eg, a user state) of the electronic device 1501 and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 1576 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 1577 may support one or more designated protocols that may be used for the electronic device 1501 to be directly or wirelessly connected to an external electronic device (eg, the electronic device 1502). According to an embodiment of the present disclosure, the interface 1577 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1578 may include a connector through which the electronic device 1501 may be physically connected to an external electronic device (eg, the electronic device 1502). According to an embodiment of the present disclosure, the connection terminal 1578 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

According to an embodiment, the connection terminal 1578 may include an interposer (eg, 390 of FIG. 3, 4A or 4B, and 530 of FIG. 5) electrically connected to a plurality of printed circuit boards facing different surfaces. 6a 610, 6b 620, 6c 630,

6d

640, 7 731, 732, 733, 734, 8a or 8b 800,

9a

930, 1010 1030, 11 1131, 1132, 1200 of FIG. 12A, or 1300 of FIG. 13). In one embodiment, referring again to FIG. 3, the first printed circuit board 341 is electrically connected to the interposer facing one surface 401 of the interposer 390, and the second printed circuit board 342 May be electrically connected to the interposer 390 to face the other surface 403 of the interposer 390. The interposer 390 not only electrically connects the first and second printed

circuit boards

341, 342, but also secures the first printed circuit board 341 to a set position with respect to the second printed circuit board 342. Can be.

The haptic module 1579 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinetic senses. According to one embodiment, the haptic module 1579 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1580 may capture still images and videos. According to an embodiment, the camera module 1580 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1588 may manage power supplied to the electronic device 1501. According to an embodiment of the present disclosure, the power management module 1588 may be implemented as at least part of a power management integrated circuit (PMIC).

The battery 1589 may supply power to at least one component of the electronic device 1501. According to an embodiment, the battery 1589 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 1590 may be a direct (eg wired) communication channel or wireless communication channel between the electronic device 1501 and an external electronic device (eg, the electronic device 1502, the electronic device 1504, or the server 1508). Establish and perform communication over established communication channels. The communication module 1590 may operate independently of the processor 1520 (eg, an application processor) and include one or more communication processors that support direct (eg, wired) or wireless communication. According to an embodiment, the communication module 1590 may be a wireless communication module 1592 (eg, a cellular communication module, a near field communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1594 (eg, It may include a local area network (LAN) communication module, or a power line communication module. The corresponding communication module of these communication modules may be a first network 1598 (e.g. a short range communication network such as Bluetooth, WiFi direct or an infrared data association (IrDA)) or a second network 1599 (e.g. a cellular network, the Internet, or Communicate with external electronic devices via a telecommunications network, such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented by a plurality of components (eg, a plurality of chips) separate from each other. The wireless communication module 1592 uses subscriber information (e.g., international mobile subscriber identifier (IMSI)) stored in the subscriber identification module 1596 within a communication network such as the first network 1598 or the second network 1599. The electronic device 1501 may be checked and authenticated.

The antenna module 1597 may transmit or receive a signal or power to an external (eg, an external electronic device) or from an external source. According to an embodiment, the antenna module 1597 may include one or more antennas, from which at least one suitable for a communication scheme used in a communication network, such as the first network 1598 or the second network 1599. May be selected by, for example, the communication module 1590. The signal or power may be transmitted or received between the communication module 1590 and the external electronic device through the selected at least one antenna.

At least some of the components are connected to each other and connected to each other through a communication method (eg, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)). For example, commands or data).

According to an embodiment of the present disclosure, the command or data may be transmitted or received between the electronic device 1501 and the external electronic device 1504 through the server 1508 connected to the second network 1599. Each of the

electronic devices

1502 and 1504 may be a device that is the same as or different from the electronic device 1501. According to an embodiment of the present disclosure, all or part of operations executed in the electronic device 1501 may be executed in one or more external devices of the external

electronic devices

1502, 1504, or 1508. For example, when the electronic device 1501 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 1501 may not execute the function or service itself. In addition to or in addition, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1501. The electronic device 1501 may process the result as it is, or additionally, and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology. This can be used.

According to an embodiment of the present disclosure, the electronic device 1501 may include a first printed circuit board including one or more antennas and one or more first terminals electrically connected to the one or more antennas. The processor 1520 may be configured to communicate with an external

electronic device

1504, 1502, or 1508 using the one or more antennas. The electronic device 1501 may include a second printed circuit board including one or more second terminals electrically connected to the processor 1522. The electronic device 1501 may include an interposer (eg, 390 of FIG. 3) connecting the first printed circuit board to the second printed circuit board. The interposer may include a housing including a first face, a second face facing the first face, and a space between the first face and the second face, the housing comprising one or more third faces; It may include a conductor that electrically connects between the designated one of the one or more third surfaces. Wherein the conductor is electrically connected with the one or more first terminals facing the first printed circuit board, and wherein the designated face faces the second printed circuit board; Can be electrically connected to the terminals.

As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. The module may be an integral part or a minimum unit or part of the component, which performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present disclosure may include one or more instructions stored in a storage medium (eg, internal memory 1536 or external memory 1538) that can be read by a machine (eg, electronic device 1501). It may be implemented as software (eg, program 1540) including the. For example, a processor (eg, the processor 1520) of the device (eg, the electronic device 1501) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the device to be operated to perform at least one function in accordance with the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' means only that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and the term is used when the data is stored semi-permanently on the storage medium. It does not distinguish cases where it is temporarily stored.

According to an embodiment of the present disclosure, a method according to various embodiments of the present disclosure may be included in a computer program product. The computer program product may be traded between the seller and the buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or two user devices ( Example: smartphones) can be distributed (eg downloaded or uploaded) directly or online. In the case of online distribution, at least a portion of the computer program product may be stored at least temporarily or temporarily created on a device-readable storage medium such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments of the present disclosure, each component (eg, a module or a program) of the above-described components may include a singular or plural objects. According to various embodiments of the present disclosure, one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of the component of each of the plurality of components the same as or similar to that performed by the corresponding component of the plurality of components before the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, or may be omitted. Or one or more other operations may be added.

Referring to FIG. 16, an electronic device 1600 (eg, 100 of FIG. 1 or 2, 300 of FIG. 3, or 1501 of FIG. 15) may include a communication device 1611, a processor 1621 (eg, 1520 of FIG. 15). ), A communication module 1622 (eg, the communication module 1590 of FIG. 15), or an interposer 1630.

According to an embodiment, the communication device 1611 may be disposed on the first printed circuit board 1610. The first printed circuit board 1610 may include a first printed circuit board 341 of FIG. 3, a first printed circuit board 510 of FIG. 5, and a plurality of first printed

circuit boards

711, 712 of FIG. 7. 713, 714, the first printed circuit board 910 of FIG. 9A, the first printed circuit board 1010 of FIG. 10, the first printed circuit board 1110 of FIG. 11, and the first printed circuit board of FIG. 13 ( 1310 or the second printed circuit board 1320.

According to one embodiment, the processor 1621 and / or the communication module 1622 may include a second printed circuit board 1620 (eg, 341 of FIG. 3, 520 of FIG. 5, 720 of FIG. 7, 920 of FIG. 9A, 1020 of FIG. 10, 1120 of FIG. 11, or 1330 of FIG. 13).

According to one embodiment, the first printed circuit board 1610 may include an interposer 1630 (e.g., 390 of Figures 3, 4A or 4B, 530 of Figure 5, 610 of Figure 6A, 610 of Figure 6B, 620 of Figure 6C). 630, 640 of FIG. 6D, 731, 732, 733, 734 of FIG. 7, 800 of FIG. 8A or 8B, 930 of FIG. 9A, 1030 of FIG. 10, 1131, 1132 of FIG. 11, 1200 of FIG. 12A, or 13 1300 may be electrically connected to the second printed circuit board 1620.

According to an embodiment, the processor 1621 may be one of a central processing unit, an application processor, a graphics processing unit (GPU), an image signal processor of a camera, or a baseband processor (or a communication processor (CP)). Or more. According to an embodiment of the present disclosure, the processor 1621 may be implemented as a system on chip (SoC) or a system in package (SIP).

According to an embodiment of the present disclosure, the communication module 1622 may be electrically connected to the communication device 1610 using the interposer 1630. The communication module 1622 may include, for example, a baseband processor or at least one communication circuit (eg, IFIC or RFIC). The communication module 1622 may include, for example, a baseband processor separate from the processor 1621 (eg, an application processor (AP)).

According to an embodiment, the communication module 1622 may include a first baseband processor (BP) (not shown), or a second baseband processor (BP) (not shown). The electronic device 1600 may further include one or more interfaces for supporting chip-to-chip communication between the first BP (or the second BP) and the processor 1621. The processor 1621 and the first BP or the second BP may transmit and receive data using the inter processor communication channel.

According to an embodiment, the first BP or the second BP may provide an interface for communicating with other entities. The first BP may, for example, support wireless communication for a first network (not shown). The second BP may, for example, support wireless communication for a second network (not shown).

According to an embodiment of the present disclosure, the first BP or the second BP may form a module with the processor 1621. For example, the first BP or the second BP may be integrally formed with the processor 1621. As another example, the first BP or the second BP may be disposed in one chip or may be formed in an independent chip form. According to an embodiment, the processor 1621 and at least one baseband processor (eg, the first BP) are integrally formed in one chip (SoC chip), and the other baseband processor (eg, the second BP) is an independent chip. It may be formed in the form.

According to an embodiment of the present disclosure, the first network (not shown) or the second network (not shown) may include the network 1599 of FIG. 15. According to an embodiment, each of the first network and the second network may include a 4th generation (4G) network and a 5th generation (5G) network. The 4G network may support, for example, the long term evolution (LTE) protocol defined in 3GPP. 5G networks may support, for example, the new radio (NR) protocol as defined in 3GPP.

Referring to FIG. 17, the communication device 1700 (eg, the communication device 1611 or the first printed circuit board 1610 of FIG. 16) may be connected to the communication circuit 1710 (eg, RFIC) (eg, 919 of FIG. 9A). ), A first antenna array 1720 (eg, 914 of FIG. 9A), or a second antenna array 1730 (eg, 915 of FIG. 9A).

According to an embodiment, the communication circuit 1710, the first antenna array 1720, or the second antenna array 1720 may be a single printed circuit board (eg, the first printed circuit board 910 or FIG. 9A of FIG. 9A). 16 may be mounted on the first printed circuit board 1610. According to an embodiment, the communication circuit 1710 may be disposed on one surface of the printed circuit board, and the first antenna array 1720 or the second antenna array 1720 may be disposed on the other surface of the printed circuit board. According to some embodiments, the first antenna array 1720 or the second antenna array 1720 may be included in an inner layer of the printed circuit board.

According to an embodiment, the first antenna array 1720 or the second antenna array 1730 may include a plurality of antenna elements. The antenna elements may comprise a patch antenna, a loop antenna or a dipole antenna. For example, the antenna element included in the first antenna array 1710 may be a patch antenna to form a beam toward the back plate 380 of the electronic device (eg, 300 of FIG. 3). As another example, the antenna element included in the second antenna array 1730 may be a dipole antenna or a loop antenna to form a beam toward the side member 310 of the electronic device (eg, the electronic device 300 of FIG. 3). Can be.

According to an embodiment, the communication circuit 1710 may support at least some bands (eg, about 24 GHZ to 30 GHZ, or about 37 GHz to 40 GHz) of about 3 GHZ to 100 GHZ band. According to an embodiment, the communication circuit 1710 may up-convert or down-convert the frequency. For example, communication circuitry 1710 may be an interposer (eg, 390 of FIGS. 3, 4A or 4B, 530 of FIG. 5, 610 of FIG. 6A) from a communication module (eg, communication module 1590 of FIG. 15). 6b 620, 6c 630,

6d

640, 7 731, 732, 733, 734, 8a or 8b 800,

9a

930, 1010 1030, 1131, 1132, FIG. The IF signal received through 1200 of 12a or 1300 of FIG. 13 may be up-converted into an RF signal. For example, the communication circuit 1710 may down-convert an RF signal (for example, a millimeter wave signal) received through the first antenna array 1720 or the second antenna array 1730 into an IF signal to use an interposer. It can be transmitted to the communication module.

According to an embodiment of the present disclosure, an electronic device (eg, 100 of FIG. 1 or 2, or 300 of FIG. 3) may include one or more antennas (eg, 914 or 915 of FIG. 9A), and the one or more antennas. And a first printed circuit board (eg, 510 of FIG. 5) that includes one or more first terminals (eg, 501 of FIG. 5) electrically connected to the first and second terminals. The electronic device may include a processor (eg, 1520 of FIG. 15 or 1621 of FIG. 16) configured to communicate with an external electronic device using the one or more antennas, and one or more second terminals electrically connected to the processor (eg, And a second printed circuit board (eg, 520 of FIG. 5) including 502 of FIG. 5. The electronic device may include an interposer (eg, 530 of FIG. 5) connecting the first printed circuit board 510 to the second printed circuit board 520. The interposer 530 may include a first surface 531, a second surface 532 facing the first surface 531, and a gap between the first surface 531 and the second surface 532. And a housing (eg, 534 of FIG. 5) that includes one or more surrounding third surfaces (eg, 403, 404, 405, 406 of FIGS. 4A and 4B). The interposer (eg, 530 of FIG. 5) may include a conductor that electrically connects the first surface (eg, 531 of FIG. 5) between a designated one of the one or more third surfaces (eg, 533 of FIG. 5). (Eg, 535 of FIG. 5). The conductor (eg, 535 of FIG. 5) has the first side (eg, 531 of FIG. 5) facing the first printed circuit board (eg, 510 of FIG. 5) so that the one or more first terminals ( 501, and the designated surface 503 may be electrically connected to the one or more second terminals 502 facing the second printed circuit board 520.

According to an embodiment of the present invention, the conductor (eg, 535 of FIG. 5) may be electrically connected to the one or more first terminals (eg, 501 of FIG. 5) and a conductive material (eg, solder). One or more third terminals (eg, 503 of FIG. 5) disposed on the first surface (eg, 531 of FIG. 5) and conductive with the one or more second terminals (eg, 502 of FIG. 5) to be connected. It may include one or more fourth terminals (eg, 504 of FIG. 5) disposed on the designated surface (eg, 533 of FIG. 5) to be electrically connected through a material (eg, solder).

According to an embodiment of the present disclosure, a portion of the conductor (eg, 535 of FIG. 5) may include the one or more third terminals (eg, 503 of FIG. 5) and the one or more fourth terminals (eg, of FIG. 5). It may be electrically connected to 504 of FIG. 5 and disposed inside the housing (eg, 534 of FIG. 5).

According to an embodiment of the present disclosure, the interposer (eg, 530 of FIG. 5) may include the second side (eg, 4020 of FIG. 4B or 502 of FIG. 5) or the one or more third sides (eg, FIG. 4a, 404, 405, and 403 and 406 of FIG. 4b are disposed on at least one of the other faces 404, 405 or 406 except for the designated face (e.g., 403 of FIG. 4b), and the conductor (e.g., 5 may further include a metal plate (eg, 536 of FIG. 5) that is physically separated from 535 of FIG. 5.

According to an embodiment of the present invention, the metal plate (eg, 536 of FIG. 5) may be a ground of the first printed circuit board (eg, 510 of FIG. 5) or the second printed circuit board (eg, of FIG. 5). : May be electrically connected to at least one of the grounds of 520 of FIG. 5.

According to an embodiment of the present disclosure, the metal plate (eg, 637 of FIG. 6C) may further include a portion (eg, 637a of FIG. 6C) extending into the housing (eg, 635 of FIG. 6C). have.

According to an embodiment of the present disclosure, the interposer 1200 (eg, 1200 of FIG. 12A) may include one or more pins (eg, first pin of FIG. 12A) protruding with respect to the designated surface (eg, 1203 of FIG. 12A). 1241, or a second pin 1242, wherein the one or

more pins

1241 and 1242 may be inserted into holes formed in the second printed circuit board (eg, 1320 of FIG. 13).

According to an embodiment of the present disclosure, the one or more pins (eg, the first pin 1241 of FIG. 12A) may be formed by using a conductive material such as solder to form the second printed circuit board (eg, 1320 of FIG. 13). It can be electrically connected to ground.

According to an embodiment of the present invention, the first printed circuit board (eg, 510 of FIG. 5) and the second printed circuit board (eg, FIG. 5) connected through the interposer (eg, 530 of FIG. 5). 520 may be orthogonal to each other.

According to an embodiment of the present disclosure, the electronic device (eg, 300 of FIG. 3) may include a front plate (eg, 320 of FIG. 3) and a back plate (eg, 380 of FIG. 3), and the front plate. A side member (eg, 320 of FIG. 3 or 750 of FIG. 7) surrounding the space between the 320 and the rear plate 380 may be further included. The first printed circuit board (eg, 711, 712, 713 or 714 of FIG. 7), the second printed circuit board (eg, 720 of FIG. 7) and the interposer (eg, 731, 732, 733 of FIG. 7). Or 734 is disposed in the space and one surface of the first printed circuit board (eg, 711, 712, 713 or 714 of FIG. 7) on which the one or more antennas are disposed (eg, 711a, 712a, 713a of FIG. 7). Or 714a may face the side member (eg, 750 of FIG. 7).

According to an embodiment of the present disclosure, the one or more antennas (eg, 914 or 915 of FIG. 9A) may transmit and receive a signal having a frequency ranging from 3 GHz to 100 GHz.

According to an embodiment of the present disclosure, the one or more antennas (eg, 914 or 915 of FIG. 9A) may include at least one of a loop antenna, a dipole antenna, or a patch antenna.

According to an embodiment of the present disclosure, the first printed circuit board (eg, 910 of FIG. 9A) may include a communication circuit (eg, up-converting or down-converting a signal of a predetermined frequency transmitted or received through the one or more antennas). 919 of FIG. 9A may be further included.

According to an embodiment of the present disclosure, the one or more antennas (eg, 914 or 915 of FIG. 9A) and the communication circuit (eg, 919 of FIG. 9A) may include the first printed circuit board (eg, FIG. 9A of FIG. 9A). 910 may be disposed on both sides (eg, 911 and 912 of FIG. 9B).

According to an embodiment of the present disclosure, an electronic device (eg, 100 of FIG. 1 or 2, or 300 of FIG. 3) may include one or more first antennas and one or more first electrical components electrically connected to the one or more first antennas. It may include a first printed circuit board (eg, 1310 of 13) including one terminal (eg, 1311 of FIG. 13). The electronic device may include a second printed circuit board (eg, FIG. 13) including one or more second antennas and one or more second terminals (eg, 1321 of FIG. 13) electrically connected to the one or more second antennas. 1320). The electronic device may be configured to communicate with an external electronic device using the one or more first antennas and / or the one or more second antennas (eg, 1520 of FIG. 15 or 1621 of FIG. 16) and the processor. A third printed circuit board (eg, 1330 of FIG. 13) including one or more third terminals (eg, 1333 of FIG. 13) and one or more fourth terminals (eg, 1334 of FIG. 13) connected to each other. Can be. The electronic device may include the first printed circuit board (eg, 1310 of FIG. 13) and the second printed circuit board (eg, 1320 of FIG. 13) with respect to the third printed circuit board (eg, 1330 of FIG. 13). It may include an interposer (for example, 1200 of FIG. 12A or 1300 of FIG. 13) for connecting. The interposer (eg, 1300 of FIG. 13) may include a first surface (eg, top surface 1303 of FIG. 13) and a second surface (eg, bottom surface 1304 of FIG. 13) facing in a first direction; A housing including a third face (eg, front surface 1301 of FIG. 13) and a fourth face (eg, back surface 1302 of FIG. 13) facing in a second direction opposite to the first direction (eg, 1305 of FIG. 13). The interposer (eg, 1300 of FIG. 13) may electrically connect the first surface (eg, top surface 1303 of FIG. 13) and the third surface (eg, front surface 1301 of FIG. 13). It may include a first conductor (eg, 1350a of FIG. 13). The first conductor (eg, 1350a of FIG. 13) may be formed such that the first surface (eg, top surface 1303 of FIG. 13) faces the third printed circuit board (eg, 1330 of FIG. 13). It may be electrically connected to one or more third terminals (eg, 1333 of FIG. 13). The first conductor (eg, 1350a of FIG. 13) may be formed such that the third surface (eg, front surface 1301 of FIG. 13) faces the second printed circuit board (eg, 1320 of FIG. 13). It may be electrically connected to one or more second terminals (eg, 1321 of FIG. 13). The interposer (eg, 1300 of FIG. 13) may electrically connect the first surface (eg, top surface 1303 of FIG. 13) and the second surface (eg, bottom surface 1304 of FIG. 13). It may include a second conductor (eg, 1350b of FIG. 13). The second conductor (eg, 1350b of FIG. 13) may be formed such that the first surface (eg, top surface 1303 of FIG. 13) faces the third printed circuit board (eg, 1330 of FIG. 13). It may be electrically connected to one or more third terminals (eg, 1331 of FIG. 13). The second conductor (eg, 1350b of FIG. 13) may be formed such that the second surface (eg, bottom 1304 of FIG. 13) faces the first printed circuit board (eg, 1310 of FIG. 13). It may be electrically connected to one or more first terminals (eg, 1311 of FIG. 13).

According to an embodiment of the present disclosure, the first conductor (eg, 1350a of FIG. 13) may be connected to the one or more third terminals (eg, 1333 of FIG. 13) and a conductive material (eg, solder). One or more fifth terminals (eg, 1352 of FIG. 13) may be disposed on the first surface (eg, top surface 1303 of FIG. 13) to be electrically connected. The first conductor (eg, 1350a of FIG. 13) may be connected to the third surface such that the one or more second terminals (eg, 1321 of FIG. 13) are electrically connected to each other via a conductive material (eg, solder). For example, one or more sixth terminals (eg, 1351 of FIG. 13) disposed on the front surface 1301 of FIG. 13 may be included.

According to an embodiment of the present disclosure, the second conductor (eg, 1350b of FIG. 13) may be connected to the one or more fourth terminals (eg, 1334 of FIG. 13) and a conductive material (eg, solder). One or more seventh terminals (eg, 1353 of FIG. 13) may be disposed on the first surface (eg, top surface 1303 of FIG. 13) to be electrically connected. The second conductor (eg, 1350b of FIG. 13) may be connected to the second surface such that the one or more first terminals (eg, 1311 of FIG. 13) are electrically connected to each other via a conductive material (eg, solder). For example, one or more eighth terminals (eg, 1354 of FIG. 13) disposed on the bottom surface 1304 of FIG. 13 may be included.

According to an embodiment of the present disclosure, the housing (eg, 410 of FIGS. 4A and 4B) may include a fifth surface facing the third direction opposite to the first direction and orthogonal to the second direction (eg, 405 of FIG. 4A and a sixth surface (eg, 406 of FIG. 4B or 1205 of FIG. 12A). The interposer 390 of FIGS. 4A and 4B may include the fourth side (eg, back surface 1302 of FIG. 13), the fifth side (eg, 405 of FIG. 4A), or the sixth side (eg, FIG. Metal plate (eg, 1230 of FIG. 12A) disposed on at least one of 406 of FIG. 4B or 1205 of FIG. 12A. The metal plate (eg, 1230 of FIG. 125A) may be physically separated from the first conductor (eg, 1221 of FIG. 12A) and the second conductor (eg, 1222 of FIG. 12A).

According to an embodiment of the present disclosure, the interposer 1200 (eg, 1200 of FIG. 12A) may include one or more first pins (eg, FIG. 12) protruding with respect to the first surface (eg, top surface 1203 of FIG. 12A). One or more second pins (eg, the third pin of FIG. 12A) protruding relative to the first pin 1241 or second pin 1242 of 12a or the second side (eg, bottom surface 1204 of FIG. 12B). 1243 or fourth pin 1244). The one or more first pins may be inserted into holes formed in the third printed circuit board, and the one or more second pins may be inserted into holes formed in the first printed circuit board.

According to an embodiment of the present disclosure, an electronic device (eg, 100 of FIG. 1 or 2, or 300 of FIG. 3) may include a first printed circuit including one or more first terminals (eg, 501 of FIG. 5). It may include a substrate (eg, 510 of FIG. 5). The electronic device may include a second printed circuit board (eg, 520 of FIG. 5) including one or more second terminals (eg, 502 of FIG. 5). The electronic device may include a connector (eg, interposer 530 of FIG. 5) that connects the first printed circuit board (eg, 510 of FIG. 5) to the second printed circuit board (eg, 520 of FIG. 5). ) May be included. The connector 530 surrounds a first surface 531, a second surface 532 facing the first surface 531, and between the first surface 531 and the second surface 532. May include a housing (eg, 534 of FIG. 5) that includes one or more third sides (eg, 403, 404, 405, 406 of FIGS. 4A and 4B). The interposer (eg, 530 of FIG. 5) may include a conductor that electrically connects the first surface (eg, 531 of FIG. 5) between a designated one of the one or more third surfaces (eg, 533 of FIG. 5). (Eg, 535 of FIG. 5). The conductor (eg, 535 of FIG. 5) has the first side (eg, 531 of FIG. 5) facing the first printed circuit board (eg, 510 of FIG. 5) so that the one or more first terminals ( 501, and the designated surface 503 may be electrically connected to the one or more second terminals 502 facing the second printed circuit board 520.

So far I looked at the center of the preferred embodiment of the present invention. Those skilled in the art will appreciate that the present invention can be implemented in a modified form without departing from the essential features of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the scope will be construed as being included in the present invention.

Claims

In an electronic device,

A first printed circuit board comprising one or more antennas and one or more first terminals electrically connected with the one or more antennas;

A second printed circuit board comprising a processor configured to communicate with an external electronic device using the one or more antennas, and one or more second terminals electrically connected to the processor; And

An interposer connecting said first printed circuit board to said second printed circuit board, wherein said interposer comprises:

A housing comprising a first face, a second face facing the first face, and one or more third faces surrounding between the first face and the second face; And

A conductor electrically connecting between the first face and a designated one of the one or more third faces,

Wherein the conductor is electrically connected with the one or more first terminals facing the first printed circuit board, and wherein the designated face faces the second printed circuit board. Electronic device electrically connected with two terminals.
The method of claim 1,

The conductor,

One or more third terminals disposed on the first surface to be electrically connected to the one or more first terminals via solder;

And one or more fourth terminals disposed on the designated face to be electrically connected to the one or more second terminals via solder.
The method of claim 2,

Some of the conductors,

An electronic device electrically connected to the one or more third terminals and the one or more fourth terminals and disposed inside the housing.
The method of claim 1,

The interposer,

And a metal plate disposed on at least one of the second or one of the one or more third surfaces other than the designated one, the metal plate being physically separated from the conductor.
The method of claim 4, wherein

The metal plate,

And an electronic device electrically connected to at least one of the ground of the first printed circuit board and the ground of the second printed circuit board.
The method of claim 4, wherein

The metal plate,

And a portion extending into the housing.
The method of claim 1,

The interposer includes one or more pins protruding with respect to the designated face,

The one or more pins are inserted into holes formed in the second printed circuit board.
The method of claim 7, wherein

The one or more pins,

The electronic device is electrically connected to the ground of the second printed circuit board using solder.
The method of claim 1,

And the first printed circuit board and the second printed circuit board connected through the interposer are perpendicular to each other.
The method of claim 1,

Further comprising a front plate and a back plate, and side members surrounding a space between the front plate and the back plate,

The first printed circuit board, the second printed circuit board, and the interposer are disposed in the space, and

An electronic device facing one side of the first printed circuit board on which the one or more antennas are disposed.
The method of claim 1,

The one or more antennas,

An electronic device that transmits and receives a signal having a frequency in the range of 3 GHz to 100 GHz.
The method of claim 1,

The one or more antennas,

An electronic device comprising at least one of a loop antenna, a dipole antenna, or a patch antenna.
The method of claim 1,

The first printed circuit board,

And communication circuitry for up-converting or down-converting a signal of a specified frequency transmitted or received via the one or more antennas.
The method of claim 13,

The one or more antennas and the communication circuit,

And electronic devices on both sides of the first printed circuit board.
The method of claim 13,

The communication circuit,

An electronic device that is a radio frequency integrated circuit (RFIC).