WO2019232032A1 - Réseau de détection de matrice multimodale éclairée - Google Patents

Réseau de détection de matrice multimodale éclairée Download PDF

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Publication number
WO2019232032A1
WO2019232032A1 PCT/US2019/034374 US2019034374W WO2019232032A1 WO 2019232032 A1 WO2019232032 A1 WO 2019232032A1 US 2019034374 W US2019034374 W US 2019034374W WO 2019232032 A1 WO2019232032 A1 WO 2019232032A1
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WO
WIPO (PCT)
Prior art keywords
sensing
force
region
illuminated
light emitting
Prior art date
Application number
PCT/US2019/034374
Other languages
English (en)
Inventor
Cheng Seong Lee
Wai Jye CHAN
Chee Wai Lu
Original Assignee
Interlink Electronics, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interlink Electronics, Inc. filed Critical Interlink Electronics, Inc.
Publication of WO2019232032A1 publication Critical patent/WO2019232032A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position

Definitions

  • Typical user interface devices such as touch panels, keypads or keyboards, comprise of discrete touch sensing nodes or discrete mechanical switches arranged in some form of matrix sensing array configuration. Illumination of the touch panel, keypad or keyboard is typically provided using a uniform backlighting source, such as LED.
  • Fig. 1 illustrates an example sensing and illumination system including a sensing layer and an illumination unit.
  • Fig. 2 shows a combination of physical stack-up of input sensing and output illumination, which is configured as an illuminated input sensing device.
  • Figs. 3A, 3B, 3C, 3D, 4A, and 4B show an embodiment of a physical topology defined as a matrix sensing topology I as top view and cross-sectional view, respectively.
  • Figs. 5A, 5B, 5C, 5D, 6A and 6B show an alternative embodiment physical topology defined as matrix sensing topology II as top view and cross-sectional view, respectively.
  • Figs. 7A, 7B, 7C. 7D, 8A and 8B show an alternative embodiment physical topology defined as matrix sensing topology III as top view and cross-sectional view, respectively.
  • Figs. 9A and 9B illustrate an example of output sensing characteristics for a typical force sensing element known as a force sensing resistor (FSR) and a novel force sensing device defined as force sensing device (FSD), respectively;
  • FSR force sensing resistor
  • FSD force sensing device
  • Figs. 10A and 10B illustrate differences in the electrode topology between an FSR (Fig. lOa) and an FSD (Fig. lOb).
  • Typical user interface devices such as touch panels, keypads or keyboards, comprise of discrete touch sensing nodes or discrete mechanical switches arranged in some form of matrix sensing array configuration. Illumination of the touch panel, keypad or keyboard is typically provided using a uniform backlighting source, such as LED.
  • This invention proposes a unique approach of combining a matrix sensing array of force/pressure sensing elements and a matrix array of LEDs simultaneously. The former and latter devices are functioning as input and output, respectively as a multi-modal device or system.
  • Various embodiments disclosed herein relate to designs and implementations of a multi-modal sensing array with matrix illumination (e.g., for human-machine interface (HMI) applications). For example, some embodiments may relate to a unique approach of combining a sensing array of force/pressure sensing elements and an array of light emitting diodes (LEDs) (e.g., substantially simultaneously).
  • An input modality of a sensing and illumination system may include, but is not limited to, multi-touch sensing, discrete force/pressure node and/or gestures.
  • an output modality of a sensing and illumination system may include, but is not limited to, multi-node illumination, illumination intensity, illumination modulation, and/or illumination color.
  • sensing and illumination system 100 may be implemented within a human interface device (HID) (e.g., a touchpad, a touchscreen, a keyboard, a keypad, and the like), which may be part of an electronic device (e.g., a computing device, a tool, a measurement device, etc.).
  • HID human interface device
  • Sensing and illumination system 100 which may also be referred to herein as a “sensing system” or a“sensing architecture,” includes a sensing surface 102, a sensing layer 104, and an illumination unit 106.
  • Sensing and illumination system 100 also includes a controller 108 (e.g., a multi-modal controller), a controller 110 (e.g., an AndroidTM, iOSTM, or WindowsTM controller) including an interface 111 (e.g., BLE and/or USB interface), and a graphics user interface (GUI) 112.
  • a controller 108 e.g., a multi-modal controller
  • a controller 110 e.g., an AndroidTM, iOSTM, or WindowsTM controller
  • an interface 111 e.g., BLE and/or USB interface
  • GUI graphics user interface
  • sensing surface 102 which may include an exterior surface of, for example, a display device (e.g., a touch screen), may be configured to receive user input.
  • sensing surface 102 which may also be referred to herein as an“illuminated force sensing surface” may include one or more light diffuser elements and a force actuator.
  • the force actuator may be selected to achieve an appropriate Young’s modulus property (e.g., to achieve one or more desired force sensing characteristics).
  • Sensing layer 104 may be positioned near (e.g., adjacent) sensing surface 102 and may be configured to sense force, pressure, and/or gestures applied to and/or made proximate to sensing surface 102 (e.g., in response to the user input).
  • sensing layer 104 may include one or more sensing nodes.
  • the one or more sensing nodes may include, for example, one or more force sensing elements, one or more strain sensing elements, and/or one or more environmental sensing elements.
  • an input modality may include, for example, multi-touch sensing, discrete force/pressure sensing, and/or gesture (e.g., hand gesture) sensing.
  • Sensing layer 104 which may be flexible (e.g., including a flexible printed circuit) or rigid (e.g., including a printed circuit board), may include any number of sensing nodes arranged in any configuration.
  • sensing nodes may be printed on a PCB or a flexible circuit board.
  • sensing layer 104 may include an array of sensing nodes, arranged in columns and rows. More specifically, for example, sensing layer 104 may include a matrix array of 400 sensing nodes, arranged in 20 columns and 20 rows.
  • the sensing nodes may be arranged in accordance with a layout of a keyboard. For example, some or all of the sensing nodes may correspond to a particular key on the keyboard.
  • Each of the sensing nodes that corresponds to a particular key may be arranged to substantially align with the respective key. In at least one embodiment, some sensing nodes may not correspond to a key on the keyboard. Such sensing nodes may be referred to as interstitial sensing elements. The interstitial sensing elements may be configured to receive user input that is not intended to activate a particular key of the keyboard.
  • Illumination unit 106 which may also be referred to herein as a“light emitting diode (LED) array,” may include a plurality of LEDs.
  • the LEDs may include red, blue and green (RGB) LEDs, single color LEDs, or any combination thereof.
  • RGB red, blue and green
  • an output modality may include, for example, multi-node illumination, illumination intensity, illumination modulation, and/or illumination color.
  • one or more LEDs of illumination unit 106 may be position adjacent (e.g., around) each sensing node of sensing layer 104. In other embodiments, each LED of illumination unit 106 may be located directly within a sensing node of sensing layer 104. In yet other embodiments, a plurality of LEDs of illumination unit 106 may be positioned around a sensing node of sensing layer 104 (e.g., to form illumination onto a light guide ring and the light diffuser). In at least these embodiments, when an input modality is applied at a specific region, a surrounding LED may be illuminated onto the light guide ring and the light diffuser as the output modality. In some embodiments, the sensing nodes may include electrically responsive force sensing elements with a defined cut-out (e.g., to allow illumination onto the light diffuser region where external force is applied).
  • a PCB e.g., of sensing layer 104
  • a PCB may include cut-outs and/or openings and LEDs (e.g., of illumination unit 106) may be reverse mounted to enable LED illumination onto a light diffuser layer (e.g., of sensing layer 104).
  • LEDs e.g., of illumination unit 106
  • FPC flexible printed circuit
  • a force actuator layer (e.g., of sensing layer 104) may include a protrusion or dome configured as a force concentrator (e.g., such that an external applied force may be sensed via an associated sensing node).
  • Controller 108 which may be communicatively coupled to each of sensing layer 104 and illumination unit 106, may be configured to receive data (e.g., sensor data) and/or transmit one or more control signals from/to sensing layer 104 and/or illumination unit 106.
  • controller 108 which may include a multi -model HMI controller, may perform various analyses based on data received from one or more sensing nodes (e.g., of sensing layer 104).
  • controller 108 may be configured to translate and determine a translation of one or more input modalities into one or more output modalities.
  • controller 108 may include a processor configured to execute computational processing of dynamic force detection and measurement data from force sensing elements. Further, the processor may use the dynamic force detection and measurement data to, for example, determine a force/pressure map across some or all of a surface (e.g., surface 102). The processor may also be configured to execute computational processing of dynamic strain detection and measurement data from strain sensing elements. Moreover, the processor may be configured to execute computational processing of dynamic environmental sensing data received from one or more environmental sensing elements. The processor may also use the environmental sensing data to achieve dynamic environmental compensation of force sensing elements and the strain sensing elements. The processor may further be configured to execute computational processing of dynamic motion sensing data received from one or more motion sensing elements. Furthermore, the processor may use the motion sensing data to achieve dynamic motion compensation of force sensing elements, the strain sensing elements and/or the environmental sensing elements.
  • the processor may use the motion sensing data to achieve dynamic motion compensation of force sensing elements, the strain sensing elements and/or the environmental sensing elements.
  • controller 108 may also include an embedded host controller.
  • the host controller may include circuitry configured to receive data from one or more sensing nodes.
  • the host controller may include a memory to store the data and a processor to execute operations.
  • the embedded host controller may be electronically connected to a client device via a communication link.
  • the sensor may be coupled to the client device via a communication link.
  • the communication link may provide any form of wired or wireless communication capability between a device (e.g., controller 108) and any other device.
  • the communication link may include a radio frequency (RF) antenna.
  • RF radio frequency
  • the communication link may be configured to provide, via wireless mechanisms, LAN connectivity, Bluetooth connectivity, Bluetooth Low Energy (BLE), Wi-Fi connectivity, NFC connectivity, M2M connectivity, D2D connectivity, GSM connectivity, 3G connectivity, 4G connectivity, LTE connectivity, any other suitable communication capability, or any suitable combination thereof.
  • Sensing and illumination system 100 may include any number of communication links.
  • the communication link may provide various functionality, such as an Android® controller and display module, game engine visualization, various modes (e.g., walking and running modes), a BLE interface, USB interface, etc.
  • Sensing and illumination system 100 may also include a haptic feedback unit 116 that may drive haptic feedback to sensing and illumination system 100.
  • a controller e.g., controller 108 and/or an embedded controller
  • the embedded controller may generate and send instructions to the haptic feedback unit 116 to produce a haptic response via the system (e.g., as a haptic feedback that a user may feel).
  • Example haptic feedback may include, but are not limited to, a press, a pulse, a shock, a release, all of which may be short, long, or repeated.
  • the haptic feedback may be used to indicate various input and/or output operations.
  • Fig. 2 shows a combination of physical stack-up of input sensing and output illumination, which is configured as an illuminated input sensing device 100.
  • Fig. 2 shows an embodiment of the physical configuration of the input sensing device 100 for implementing the illuminated force sensing surface layer 102, translucent matrix force sensing layer 104, and matrix LED illumination layer 106.
  • the illuminated force sensing surface layer 102 includes light diffuser elements 410, 610, 810 and a force actuator 420, 620, 820 ( Figures 4A, 4B, 6A, 6B, 8A, and 8B).
  • each force actuator 420, 620, 820 can be selected to achieve the appropriate Young’s modulus property to achieve the desired force sensing characteristics.
  • the translucent matrix force sensing layer 104 includes at least one sensing node 430, 630, 830 ( Figures 4A, 4B, 6A, 6B, 8A, and 8B).
  • each sensing node 430, 630, 830 can include a sensor that detects contact or pressure or heat or proximity, or other indication of a force being applied to the illuminated force sensing surface layer 102 above the sensing node 430, 630, 830.
  • the matrix LED illumination layer 106 includes a substrate 440, 442, 640, 642, 840, 842 (e.g., printed circuit board“PCB” 440, 640, 840 or flexible printed circuit“FPC” 442, 642, 842).
  • the matrix LED illumination layer 106 also includes a LED 450, 452, 650, 652, 850, 852 (e.g., reverse mounted 450, 650, 850 or forward mounted 452, 652, 852), which is mounted or coupled with the substrate 440, 442, 640, 642, 840, 842.
  • a LED 450, 452, 650, 652, 850, 852 e.g., reverse mounted 450, 650, 850 or forward mounted 452, 652, 852, which is mounted or coupled with the substrate 440, 442, 640, 642, 840, 842.
  • the illuminated force sensing surface has been omitted for clarity.
  • multiple LEDs are located around the sensing node. Cut-outs or openings are created in the PCB configuration where LEDs are reverse mounted to enable LED illumination onto the light diffuser layer. In the FPC configuration, LEDs are mounted without any cut-outs or openings.
  • the force actuator layer comprises of a 3-dimensional protrusion or dome, acting as a force concentrator, to ensure that external applied force is transmitted onto the sensing node.
  • the input modality consists of, but is not limited to, multi-touch sensing, discrete force/pressure and gestures applied on the illuminated force sensing surface.
  • the output modality consists of, but is not limited to, multi-node illumination, illumination intensity and illumination color. When input modality is applied at a specific region, one or more adjacent LEDs will be illuminated as the output modality.
  • Fig. 3A illustrates the illuminated input sensing device 400 of one of the embodiments, comprising a topology 300 having at least one light emitting region 302 and at least one sensing region 304 separated from each other by a boundary region 306.
  • Fig. 3B illustrates the illuminated input sensing device 400 of one of the embodiments, wherein the topology 300 includes the illuminated force sensing surface layer 102 having: the light emitting region 302 configured as an aperture 308 having a diffuser element 410 within the aperture 308; and the sensing region 304 configured as a force actuator 420, wherein the light emitting region 302 and sensing region 304 are separated from each other by a surface layer body 406.
  • Fig. 3C illustrates the illuminated input sensing device 400 of one of the embodiments, wherein the topology 300 includes the translucent matrix force sensing layer 104 having: the light emitting region 302 configured as an aperture 412 and optionally having a light guide 435 within the aperture 412; and the sensing region 304 configured as a sensing node 430, wherein the light emitting region 302 and sensing region 304 are separated from each other by a sensing layer body 408.
  • Fig. 3D illustrates the illuminated input sensing device 400 of one of the embodiments, wherein the topology 300 includes the matrix LED illumination layer 106 having: the light emitting region 302 configured as an LED 450, 452; and the sensing region 304 configured as a substrate 440, 442, wherein the light emitting region 302 and sensing region 304 are separated from each other by the substrate 440a, 442a.
  • the matrix LED illumination layer 106 having: the light emitting region 302 configured as an LED 450, 452; and the sensing region 304 configured as a substrate 440, 442, wherein the light emitting region 302 and sensing region 304 are separated from each other by the substrate 440a, 442a.
  • Fig. 4A illustrates the illuminated input sensing device 400 of one of embodiments, comprising a configuration 400a having at least one light emitting region 302 and at least one sensing region 304 separated from each other by a boundary region 306.
  • Fig. 4B illustrates the illuminated input sensing device 400 of one of the embodiments, having a configuration 400b that includes the matrix LED illumination layer 106 having: the light emitting region 302 configured as a forward LED 452; and the sensing region 304 configured as a substrate 442 in a form of a flexible printed circuit (FPC), wherein the light emitting region 302 and sensing region 304 are separated from each other by the substrate 442a.
  • the matrix LED illumination layer 106 having: the light emitting region 302 configured as a forward LED 452; and the sensing region 304 configured as a substrate 442 in a form of a flexible printed circuit (FPC), wherein the light emitting region 302 and sensing region 304 are separated from each other by the substrate 442a.
  • FPC flexible printed circuit
  • Figs. 5A, 5B, 5C, 5D, 6A, and 6B show an alternative embodiment physical topology defined as matrix sensing topology II as top view and cross-sectional view, respectively.
  • each LED is located directly within the sensing node.
  • the sensing node comprises of electrically responsive force sensing elements with a defined cut-out to allow illumination onto the light diffuser region where external force is applied. Cut-outs or openings are created in the PCB configuration where LEDs are reverse mounted to enable LED illumination onto the light diffuser layer. In the FPC configuration, LEDs are mounted without any cut-outs or openings.
  • the force actuator layer comprises of a 3-dimensional protrusion or dome, acting as a force concentrator, to ensure that external applied force is transmitted onto the sensing node.
  • the input modality consists of, but is not limited to, multi-touch sensing, discrete force/pressure and gestures applied on the illuminated force sensing surface.
  • the output modality consists of, but is not limited to, multi-node illumination, illumination intensity and illumination color. When input modality is applied at a specific region, the corresponding LED will be illuminated as the output modality.
  • Fig. 7A, 7B, 7C, 7D, 8 A and 8B show an alternative embodiment physical topology defined as matrix sensing topology III as top view and cross-sectional view, respectively.
  • multiple LEDs are located around the sensing node to form illumination onto the light guide ring and the light diffuser.
  • the sensing node comprises of electrically responsive force sensing elements with a defined cut-out to allow illumination onto the light diffuser region where external force is applied. Cut-outs or openings are created in the PCB configuration where LEDs are reverse mounted to enable LED illumination onto the light diffuser layer. In the FPC configuration, LEDs are mounted without any cut-outs or openings.
  • the force actuator layer comprises of a 3- dimensional protrusion or dome, acting as a force concentrator, to ensure that external applied force is transmitted onto the sensing node.
  • the input modality consists of, but is not limited to, multi -touch sensing, discrete force/pressure and gestures applied on the illuminated force sensing surface.
  • the output modality consists of, but is not limited to, multi-node illumination, illumination intensity and illumination color. When input modality is applied at a specific region, the surrounding LED will be illuminated onto the light guide ring and the light diffuser as the output modality.
  • Figs. 9A and 9B illustrate an example of output sensing characteristics for a typical force sensing element known as a force sensing resistor (FSR) and a novel force sensing device defined as force sensing device (FSD), examples of which are illustrated and described with reference to Figs. 10A and 10B.
  • Figs. 9a and 9b illustrate the distinction in linearity between the typical FSR compared to an example FSD in accordance with the present disclosure.
  • a typical analog circuit implementation of the FSR may include the use of a voltage divider circuit where a fixed resistor is connected to ground and in series with the force sensing element which is also connected to a voltage supply.
  • An inherent limitation of the FSR is highly non-linear characteristic for the voltage divider circuit output when the external force is applied on the FSR.
  • Figs. 9A and 9B illustrates a linear regression curve fitting for the range of force from 1 to 10 N in the case of the FSR.
  • the solid line represents raw data of observed voltages for force values.
  • the dashed line represents a linear regression curve fitting.
  • the coefficient of determination (R 2 ) for the curve illustrated in Fig. 9a is a value of 0.8515.
  • Fig. 9b illustrates a linear regression curve fitting for the range of force from 0.5 to 10.5 N in the case of the FSD in accordance with the present disclosure.
  • the solid line represents raw data of observed voltages for force values
  • the dashed line represents a linear regression curve fitting.
  • use of the FSD shows a significantly improved linear regression curve fitting.
  • the value of R2 for the curve illustrated in Fig. 9b is a value of 0.98.
  • Figs. lOa and lOb provide an example of each of an FSR and FSD, respectively.
  • Figs. lOa and lOb illustrate differences in the electrode topology between an FSR lOOOa (Fig. lOa) and an FSD lOOOb (Fig. lOb).
  • the topology of an FSR lOOOa may include first and second electrodes l020a and l030a arranged in a horizontal distribution for a generally circular force sensing region lOlOa.
  • a series of horizontally overlapping arms (e.g., the arms l022a of the first electrode l020a and the arms l032a of the second electrode l030a) that are discrete between the first and second electrodes l020a and l030a may be utilized.
  • the first electrode l020a may have a first arm l022a that extends through the majority of the region between the first electrode l020a and the second electrode l030a.
  • Directly above but not in contact with the first arm l022a of the first electrode l020a may be a first arm l032a of the second electrode l030a.
  • the arms l022a and l032a may alternate through the entire circular force sensing region lOlOa. Additionally, the entire region between the two electrodes may include arms l022a and l032a filling the space. The spacing between the arms l022a and l032a may be generally uniform across the length of the arms.
  • the topology of the example FSD lOOOb in accordance with the present disclosure may include a first electrode l020b and a second electrode l030b to implement a generally circular force sensing region 1010b.
  • the two electrodes l020b and l030b may be arranged in a semi-circular and radial configuration, rather than a horizontal configuration as illustrated in Fig. lOa.
  • arms l022b of the first electrode l020b and arms l032b of the second electrode l030b may project from an outer region of the circular force sensing region 1010b radially inwards towards the center of the circular force sensing region lOlOb.
  • the arms l022b of the first electrode l020b and the arms l032b of the second electrode l030b may stop short of the middle of the circular force sensing region lOlOb, leaving a gap in a central region 1040 without any conductive material.
  • the central region 1040 may be between approximately 0% and 50% of the circular force sensing region lOlOb, and may also fall in the range of 5% and 40%, or between 5% and 25%, etc.
  • the arms l022b of the first electrode l020b and the arms l032b of the second electrode l030b may be shaped to taper as they progress radially in towards the central region 1040 due to the radially projecting shape of the arms l022b and l032b.
  • Such a shape may result in a variation in distance between successive arms at the edges of the circular force sensing region lOlOb compared to the center of the circular force sensing region lOlOb.
  • the distance between successive arms may be greater proximate the edges of the circular force sensing region lOlOb and smaller when closer to the center of the circular force sensing region lOlOb.
  • a gap may be placed between the first electrode l020b and the second electrode l030b. As illustrated in Figure lOb, the gap may be located at approximately the top and bottom of the circular force sensing region lOlOb.
  • sizes of the FSD lOOOb may be as explained herein, although any size or dimension of the FSD lOOOb may be included.
  • the width of the arms l022b and/or l032b may be between approximately 0.05 and 3.0 mm.
  • the diameter of the force sensing region lOlOb may be between approximately 3 and 30 mm.
  • the gap between the first electrode l020b and the second electrode 1030b may be between approximately 0.05 and 0.5 mm.
  • the central region 1040 may be between approximately 0.5 and 2.0 mm.
  • the use of the FSD lOOOb illustrated in Fig. lOb may facilitate a decrease in manufacturing costs and waste in material when compared to the FSR lOOOa as illustrated in Fig. lOa.
  • the first and second electrodes l020b and l030b of the FSD lOOOb may be symmetrical about a vertical axis such that two copies of a single electrode may be used, and flipped over to create the FSD lOOOb.
  • two unique electrodes are created when forming the FSR lOOOa.
  • the various features described for the topology of the FSD lOOOb may contribute to a more linear relationship between voltage change and force application when compared to the FSR lOOOa.
  • the value of R 2 for the curve illustrated in Fig. 9a associated with the FSR is a value of 0.8515
  • the value of R 2 for the curve illustrated in Fig. 9b associated with the FSD is a value of 0.98.
  • An illuminated input sensing device 100 can include: an illuminated force sensing surface layer 102; a translucent matrix force sensing layer 104; and a matrix LED illumination layer 106.
  • a substrate 440, 442, 640, 642, 840, 842 e.g., printed circuit board“PCB” 440, 640, 840 or flexible printed circuit “FPC” 442, 642, 842
  • LED 450, 452, 650, 652, 850, 852 e.g., reverse mounted 450, 650, 850 or forward mounted 452, 652, 852).
  • the illuminated input sensing device 400 of one of the embodiments includes the illuminated force sensing surface layer 102 having: the light emitting region 302 configured as an aperture 308 having a diffuser element 410 within the aperture 308; and the sensing region 304 configured as a force actuator 420, wherein the light emitting region 302 and sensing region 304 are separated from each other by a surface layer body 406, wherein the force actuator 420 is a separate material from the surface layer body 406.
  • the illuminated input sensing device 400 of one of the embodiments includes the illuminated force sensing surface layer 102 having: the light emitting region 302 configured as an aperture 308 having a diffuser element 410 within the aperture 308; and the sensing region 304 configured as a force actuator 420, wherein the light emitting region 302 and sensing region 304 are separated from each other by a surface layer body 406, wherein the force actuator 420 is a uniform material with the surface layer body 406.
  • each light emitting region 302 has a diameter Dl; and each sensing region 304 has a diameter D2, wherein Dl is smaller, the same as, or larger than D2.
  • each pair of sensing regions 304 has center to center distance of Xmm in an X plane; and each pair of sensing regions 304 has center to center distance of Ymm in an Y plane.
  • each pair of light emitting regions 302 has center to center distance of Xmm in an X plane; and each pair of light emitting regions 302 has center to center distance of Ymm in a Y plane.
  • the illuminated input sensing device 400 of one of the embodiments, wherein the sensing layer body 408 at the sensing region 304 and the body region 306 therearound is air or a malleable or flexibly resilient or elastomeric material that allows for the force actuator 420 to apply a force to the sensing node 430.
  • PCB printed circuit board
  • PCBA printed circuit board assembly
  • PCBA printed circuit board assembly
  • the illuminated input sensing device 600 of one of the embodiments comprising a topology 500 having a light emitting region 502 within an annular sensing region 504.
  • the illuminated input sensing device 600 of one of the embodiments comprising a topology 500 having a light emitting region 502 within an annular sensing region 504, which are separated from other light emitting regions 502 within annular sensing regions 504 by a boundary region 506.
  • the topology 500 includes the translucent matrix force sensing layer 104 having: the light emitting region 502 configured as an aperture 512 and optionally having a light guide 635 within the aperture 512; and the sensing region 504 configured as an annular sensing node 630, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by a sensing layer body 608.
  • the illuminated input sensing device 600 of one of the embodiments having a configuration 600a that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a reverse mounted LED 650; and the sensing region 504 configured as a substrate 640 as a printed circuit board (PCB) having the reverse mounted LED 650, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.
  • PCB printed circuit board
  • the illuminated input sensing device 600 of one of the embodiments having a configuration 600a that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a reverse mounted LED 650; and the sensing region 504 configured as a substrate 640 as a printed circuit board (PCB) having the reverse mounted LED 650, wherein the reverse mounted LED 650 is below the annular sensing node 630, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.
  • PCB printed circuit board
  • the illuminated input sensing device 600 of one of the embodiments having a configuration 600b that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a forward mounted LED 652; and the sensing region 504 configured as a substrate 642 as a flexible printed circuit (FPC) having the forward mounted LED 650 thereon, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.
  • FPC flexible printed circuit
  • the illuminated input sensing device 600 of one of the embodiments having a configuration 600b which includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a forward mounted LED 652; and the sensing region 504 configured as a substrate 642 as a flexible printed circuit (FPC) having the forward mounted LED 650 in an aperture of the annular sensing node 630, wherein the light emitting region 502 and sensing region 504 are separated from other light emitting regions 502 and sensing regions 504 by separating substrate portions 640a, 642a.
  • FPC flexible printed circuit
  • each light emitting region 502 has a diameter Dl; and each sensing region 504 has a diameter D2, wherein Dl is smaller than D2.
  • each pair of sensing regions 504 has center to center distance of Xmm in an X plane; and each pair of sensing regions 504 has center to center distance of Ymm in an Y plane.
  • each pair of light emitting regions 502 has center to center distance of Xmm in an X plane; and each pair of light emitting regions 502 has center to center distance of Ymm in an Y plane.
  • the illuminated input sensing device 600 of one of the embodiments, wherein the sensing layer body 608 at the sensing region 504 and the body region 606 therearound is air or a malleable or flexibly resilient or elastomeric material that allows for the force actuator 620 to apply a force to the sensing node 630.
  • PCB printed circuit board
  • PCBA printed circuit board assembly
  • PCBA printed circuit board assembly
  • the illuminated input sensing device 600 of one of the embodiments having a configuration 600b that includes the matrix LED illumination layer 106 having: the light emitting region 502 configured as a forward LED 652; and the sensing region 504 configured as a substrate 642 in a form of a flexible printed circuit (FPC), wherein the light emitting region 502 and sensing region 504 are separated from each other by the substrate 642a.
  • the matrix LED illumination layer 106 having: the light emitting region 502 configured as a forward LED 652; and the sensing region 504 configured as a substrate 642 in a form of a flexible printed circuit (FPC), wherein the light emitting region 502 and sensing region 504 are separated from each other by the substrate 642a.
  • FPC flexible printed circuit
  • the illuminated input sensing device 800 of one of the embodiments comprising a topology 700 having an annular light emitting region 702 surrounding a sensing region 704.
  • the illuminated input sensing device 800 of one of the embodiments comprising a topology 700 having an annular light emitting region 702 surrounding a sensing region 704, which are separated from other annular light emitting regions 702 surrounding sensing regions 704 by a boundary region 706.
  • the illuminated input sensing device 800 of one of the embodiments comprising a configuration 800a that includes the matrix LED illumination layer 106 having: the light emitting region 702 configured as a reverse mounted LED 850; and the sensing region 704 configured as a substrate 840 as a printed circuit board 840, wherein the light emitting region 702 and sensing region 704 are separated from other light emitting regions 702 and sensing regions 704 by separating substrate portions 840a.
  • the illuminated input sensing device 800 of one of the embodiments comprising a configuration 800b that includes the matrix LED illumination layer 106 having: the light emitting region 702 configured as a forward mounted LED 852; and the sensing region 704 configured as a substrate 842, wherein the light emitting region 702 and sensing region 704 are separated from other light emitting regions 702 and sensing regions 704 by separating substrate portions 842a.
  • each light emitting region 702 has a diameter Dl; and each sensing region 704 has a diameter D2, wherein D2 is smaller than Dl.
  • each pair of sensing regions 704 has center to center distance of Xmm in an X plane; and each pair of sensing regions 704 has center to center distance of Ymm in an Y plane.
  • each pair of light emitting regions 702 has center to center distance of Xmm in an X plane; and each pair of light emitting regions 702 has center to center distance of Ymm in an Y plane.
  • the illuminated input sensing device 800 of one of the embodiments, wherein the sensing layer body 808 is a different material from the light guide 835 and/or sensing node 830.
  • the illuminated input sensing device 800 of one of the embodiments, wherein the sensing layer body 808 at the sensing region 704 and the body region 806 therearound is air or a malleable or flexibly resilient or elastomeric material that allows for the force actuator 820 to apply a force to the sensing node 830.
  • PCB printed circuit board
  • PCBA printed circuit board assembly
  • PCBA printed circuit board assembly
  • the illuminated input sensing device 800 of one of the embodiments having a configuration 800b that includes the matrix LED illumination layer 106 having: the light emitting region 702 configured as a forward LED 852; and the sensing region 704 configured as a substrate 842 in a form of a flexible printed circuit (FPC), wherein the light emitting region 702 and sensing region 704 are separated from each other by the substrate 842a.
  • the matrix LED illumination layer 106 having: the light emitting region 702 configured as a forward LED 852; and the sensing region 704 configured as a substrate 842 in a form of a flexible printed circuit (FPC), wherein the light emitting region 702 and sensing region 704 are separated from each other by the substrate 842a.
  • FPC flexible printed circuit
  • a range includes each individual member.
  • a group having 1-3 cells refers to groups having 1, 2, or 3 cells.
  • a group having 1-5 cells refers to groups having 1, 2, 3, 4, or 5 cells, and so forth.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

Un dispositif de détection d'entrée éclairée comprend une couche de surface de détection de force éclairée, une couche de détection de force de matrice translucide et une couche d'éclairage à DEL matricielle.
PCT/US2019/034374 2018-05-29 2019-05-29 Réseau de détection de matrice multimodale éclairée WO2019232032A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862677567P 2018-05-29 2018-05-29
US62/677,567 2018-05-29

Publications (1)

Publication Number Publication Date
WO2019232032A1 true WO2019232032A1 (fr) 2019-12-05

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Country Link
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Cited By (1)

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US20220146737A1 (en) * 2020-11-06 2022-05-12 Sony Interactive Entertainment Inc. Input device

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US20070152977A1 (en) * 2005-12-30 2007-07-05 Apple Computer, Inc. Illuminated touchpad
US20110069020A1 (en) * 2009-09-24 2011-03-24 Lg Display Co., Ltd. Touch sensing liquid crystal display device
US20140022177A1 (en) * 2012-06-13 2014-01-23 Microsoft Corporation Input Device Configuration having Capacitive and Pressure Sensors
WO2014147505A1 (fr) * 2013-03-19 2014-09-25 Koninklijke Philips N.V. Dispositif d'éclairage avec dispositif de mise en forme de faisceau réglable
US8847935B2 (en) * 2008-11-07 2014-09-30 Sony Corporation Display device and electronic product having light sensors in plural pixel regions
US9229597B2 (en) * 2013-02-22 2016-01-05 Nthdegree Technologies Worldwide, Inc. Integrated capacitive touch screen and LED layer

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Publication number Priority date Publication date Assignee Title
US20070152977A1 (en) * 2005-12-30 2007-07-05 Apple Computer, Inc. Illuminated touchpad
US8847935B2 (en) * 2008-11-07 2014-09-30 Sony Corporation Display device and electronic product having light sensors in plural pixel regions
US20110069020A1 (en) * 2009-09-24 2011-03-24 Lg Display Co., Ltd. Touch sensing liquid crystal display device
US20140022177A1 (en) * 2012-06-13 2014-01-23 Microsoft Corporation Input Device Configuration having Capacitive and Pressure Sensors
US9229597B2 (en) * 2013-02-22 2016-01-05 Nthdegree Technologies Worldwide, Inc. Integrated capacitive touch screen and LED layer
WO2014147505A1 (fr) * 2013-03-19 2014-09-25 Koninklijke Philips N.V. Dispositif d'éclairage avec dispositif de mise en forme de faisceau réglable

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US20220146737A1 (en) * 2020-11-06 2022-05-12 Sony Interactive Entertainment Inc. Input device

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