WO2019230170A1 - Vehicle-mounted electronic device - Google Patents

Vehicle-mounted electronic device Download PDF

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Publication number
WO2019230170A1
WO2019230170A1 PCT/JP2019/013252 JP2019013252W WO2019230170A1 WO 2019230170 A1 WO2019230170 A1 WO 2019230170A1 JP 2019013252 W JP2019013252 W JP 2019013252W WO 2019230170 A1 WO2019230170 A1 WO 2019230170A1
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Prior art keywords
cover
circuit board
case
vehicle
electronic device
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PCT/JP2019/013252
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French (fr)
Japanese (ja)
Inventor
侯宏 松岡
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株式会社デンソー
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Publication of WO2019230170A1 publication Critical patent/WO2019230170A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0212Condensation eliminators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/03Covers

Definitions

  • the present disclosure relates to an in-vehicle electronic device mounted on a vehicle such as an automobile.
  • various electronic devices such as a display unit and an engine control ECU are mounted on a vehicle such as an automobile.
  • This type of electronic device is configured by housing a circuit board in a case, but in particular, there is a device that includes a cooling fan and takes outside air into the case to cool components.
  • a cooling fan takes outside air into the case to cool components.
  • condensation may occur on the surface of the circuit board, which may lead to corrosion. Therefore, conventionally, a moisture-proofing agent is generally applied to a portion on the circuit board where there is a risk of condensation.
  • Patent Document 1 in the optical disc apparatus, protection made of a thin stainless steel plate is considered. Providing a cover is disclosed.
  • Patent Document 2 discloses that, in a digital camera, the optical filter is covered with an elastomer such as a rubber material in order to prevent dust from entering the optical filter portion.
  • JP 2004-110973 A Japanese Patent No. 5901347
  • the present disclosure is intended to provide an in-vehicle electronic device that can effectively protect a circuit board from dew condensation, dust, and the like, but can simply complete the configuration for that purpose.
  • the in-vehicle electronic device is an electronic device mounted on a vehicle, and covers a case, a circuit board provided in the case, and at least a part of the circuit board.
  • a protective cover provided on the surface of the case.
  • the cover is made of a molded product of a plastic sheet, and integrally includes a front-side protrusion and a back-side protrusion, and the front-side protrusion is an inner part of the case. Abutting against the wall surface, the back side protrusion is provided in a state of abutting against the surface of the circuit board.
  • the circuit board is covered with the protective cover, it is possible to prevent condensation on the circuit board and prevent dust from adhering.
  • the protective cover is formed of a molded product of a plastic sheet, a three-dimensional shape following the surface shape of the circuit board can be easily formed. Therefore, the cover itself can be thinned and arranged with a small clearance. Moreover, it can be made inexpensively. Since the cover is made of an insulating material, it is a matter of course that, unlike a metal cover, even if the clearance between the circuit board and the circuit board is reduced, the problem of poor insulation does not occur.
  • FIG. 1 shows an embodiment and is an exploded perspective view of an in-vehicle electronic device.
  • FIG. 2 is a perspective view of the main part with the second case removed
  • FIG. 3 is a perspective view of a state in which a cover is disposed on the second circuit board
  • FIG. 4 is a cross-sectional view showing the surface side protrusion portion.
  • FIG. 5 is a cross-sectional view showing the rear surface side protruding portion.
  • a vehicle-mounted electronic device 1 (hereinafter simply referred to as “electronic device 1”) according to the present embodiment is composed of, for example, a display unit that constitutes a navigation system, and is mounted on a central portion of an instrument panel of an automobile.
  • the liquid crystal panel side that is disposed on the front side, that is, the front side in an actual vehicle-mounted state, that is, in a used state, is shown in a form in which the liquid crystal panel is placed downward.
  • FIG. 1 schematically shows the overall appearance of the electronic device 1.
  • the electronic device 1 is configured by housing circuit boards 3 and 4 formed by mounting various components on a printed wiring board in a case 2.
  • two circuit boards 3 and 4 are provided in the case 2, of which the front side in the figure, that is, the lower side circuit board in the use state, is the first circuit board 3, the back side,
  • the upper circuit board is referred to as a second circuit board 4 in use.
  • the case 2 has a substantially rectangular box shape that is thin in the vertical direction in the figure, that is, in the front-rear direction in the state of use, and the lower first case 5 in the figure and the upper second case 6 in the figure are abutted and joined. Configured.
  • the first case 5 is made of, for example, plastic and has a thin, substantially rectangular box shape with an upper surface opened in the figure.
  • a liquid crystal panel is provided on the lower surface side of the first case 5, that is, on the front surface side when the vehicle is mounted.
  • the second case 6 is made of, for example, a metal and has a rectangular lid shape whose bottom surface is opened in the figure, and is provided so as to close the opening part on the top surface in the figure of the first case 5.
  • a fan mounting portion 6a is provided at the center of the second case 6, and a cooling fan device (not shown) is mounted.
  • the second case 6 is provided with an opening 6b or the like in which a plurality of connectors 8 (only part of which are shown) for external connection are disposed.
  • the extension part 6c extended to the near side by the figure is integrally provided in the lower part of the front end.
  • an external airflow inlet 7 is provided between the first case 5 and the extended portion 6c of the second case 6 on the front surface, that is, in the use state in the drawing of the case 2, at the bottom surface.
  • the first circuit board 3 has a horizontally long shape, and a plurality of components 9 (only a part thereof) constituting an electric circuit are mounted on the upper surface thereof. ing.
  • the first circuit board 3 is disposed on the near side in the figure in the first case 5 of the case 2, and therefore the upper surface portion of the first circuit board 3 is located at a portion facing the external air flow inlet 7.
  • the second circuit board 4 has a substantially square shape larger in the front-rear direction than the first circuit board 3 in the figure, and the first circuit board 3 in the first case 5 of the case 2. It is arrange
  • the connector 8 is mounted on the second circuit board 4.
  • a protective cover 11 is provided so as to cover the upper surface of the first circuit board 3 among the circuit boards 3 and 4.
  • the cover 11 is a molded product of a plastic sheet.
  • the cover 11 has a shape that covers the entire upper surface of the first circuit board 3 including the electronic components 9 on the upper surface of the first circuit board 3 so as to cover almost the entire upper surface with a slight clearance. It is formed in a rectangular lid shape.
  • the plastic sheet constituting the cover 11 is made of, for example, polypropylene or PP sheet or film having a thickness of 0.5 mm, and the cover 11 is formed by so-called vacuum forming.
  • vacuum molding is a method in which a sheet is heated and softened, and the sheet is molded by being brought into close contact with the surface of a mold by vacuuming.
  • an opening 11 a is formed in the cover 11 for a part 9 having a large height.
  • the component 9 is disposed so as to protrude upward from the opening 11a.
  • the cover 11 is integrally formed with a front side protrusion 12 positioned on the front surface side, and is integrally formed with a back surface protrusion 13 positioned on the back surface side.
  • one surface-side protruding portion 12 is provided at a position along the center line C of the front side portion of the cover 11, for example, in a form that bulges in a circle with a diameter of about 4 mm. ing.
  • the projecting dimension in the thickness direction (upward in the drawing) of the front side protruding portion 12 is, for example, about 0.6 mm.
  • the front end of the surface side protrusion 12 abuts on the case 2, that is, the inner wall surface of the extension 6 c of the second case 6.
  • each of the two rear surface protruding portions 13 is provided side by side in the horizontal direction at a position symmetrical to the left and right with respect to the center line C in the front end portion of the cover 11. It has been.
  • These back side protrusions 13 are formed so that the tip is rounded and protrudes to the back side, and the protruding dimension in the thickness direction (downward in the figure) is, for example, about 0.6 mm.
  • These back side protrusions 13 are in contact with the surface of the first circuit board 3 at their tips.
  • the cover 11 is sandwiched and held between the second case 6 and the first circuit board 3.
  • the amount of interference in the height direction in the drawing of the front surface side protruding portion 12 and the back surface side protruding portion 13 is, for example, about 0.3 mm.
  • screw insertion holes are formed in the first circuit board 3 at the corners on both sides and on the other corners.
  • the screw boss portion (not shown) formed on the inner wall portion of the first case 5 is fixed by screws 14 such as screws.
  • the cover 11 is also formed with screw insertion holes 11 b at four corners or the like at positions overlapping the screw insertion holes of the first circuit board 3. .
  • the cover 11 is fixed to the first case 5 together with the first circuit board 3 by so-called co-tightening with the screws 14.
  • the operation and effect of the electronic device 1 configured as described above will be described.
  • the first circuit board 3 is covered with the protective cover 11, thereby preventing condensation on the first circuit board 3 and preventing dust from adhering.
  • the cover 11 is formed of a molded product of a plastic sheet, a three-dimensional shape following the surface shape of the first circuit board 3 can be easily formed.
  • the cover 11 can be disposed with a small clearance and a small clearance.
  • the cover 11 can be made inexpensively. Since the cover 11 is made of an insulating material, it is a matter of course that the problem of insulation failure does not occur even if the clearance between the cover 11 and the first circuit board 3 is reduced, unlike a metal cover.
  • the plastic cover 11 when the plastic cover 11 is provided in the case 2, there is a concern about the generation of vibration sound of the cover 11 due to vehicle vibration.
  • the front side protrusion 12 provided on the front side of the cover 11 contacts the inner wall surface of the extension 6c of the second case 6, and the back side protrusion 13 provided on the back side of the cover 11 is the first. It contacts the surface of the circuit board 3.
  • the cover 11 is sandwiched and held between the case 2 and the first circuit board 3, and the vibration of the cover 11 can be regulated to prevent the generation of abnormal noise. Therefore, according to the present embodiment, while the circuit board 3 can be effectively protected from dew condensation, dust, and the like, it is possible to obtain an excellent effect that the configuration for that can be easily completed.
  • a fan device is provided, and the outside air is taken in from the outside air flow inlet 7 provided in the case 2.
  • the cover 11 is provided so as to cover the upper surface of the first circuit board 3, which is a portion facing the external air flow inlet 7.
  • the surface portion of the first circuit board 3, which is the portion where condensation is most likely to occur in the case 2 can be covered with the cover 11. Therefore, even if dew condensation occurs, it is on the surface side of the cover 11, so that dew condensation on the first circuit board 3 and problems associated therewith can be prevented in advance.
  • one front side protruding portion 12 is provided at a position along the center line C in the cover 11, and a plurality of back side protruding portions 13 are arranged on the left and right sides of the center line C of the cover 11. It was arranged at a symmetrical position. As a result, the cover 11 is stably held between the case 2 and the first circuit board 3.
  • polypropylene is adopted as the plastic sheet constituting the cover 11.
  • Polypropylene as a material is inexpensive and lightweight, has excellent insulating properties, and can obtain a certain strength, that is, high rigidity even with a thin sheet. Good formability such as vacuum forming. Advantages such as being stronger and more stable against heat and temperature change than rubber or the like, and having a smaller heat capacity than metal can be obtained.
  • the cover 11 when the cover 11 is attached, the first case 5 of the case 2 is screwed together with the first circuit board 3, so-called joint fastening.
  • the cover 11 was made from PP, you may comprise from a polyethylene terephthalate, ie, PET, and can obtain the effect
  • the present invention can be applied to various electronic devices for vehicles of various uses and types such as an engine ECU.
  • various changes can be made to the shape of the case and the arrangement of the external airflow inlet.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

This vehicle-mounted electronic device (1), which is an electronic device mounted on a vehicle, is provided with: a case (2); a circuit board (3) provided inside the case; and a protective cover (11) provided so as to cover at least a portion of the circuit board, wherein the cover comprises a molded article made of a plastic sheet and has an integrated front surface-side protrusion section (12) and rear surface-side protrusion section (13). The front surface-side protrusion section abuts the inner wall surface of the case, and the rear surface-side protrusion section abuts the front surface of the circuit board.

Description

車載用電子装置Automotive electronic devices 関連出願の相互参照Cross-reference of related applications
 本出願は、2018年5月30日に出願された日本出願番号2018-103502号に基づくもので、ここにその記載内容を援用する。 This application is based on Japanese Application No. 2018-103502 filed on May 30, 2018, the contents of which are incorporated herein by reference.
 本開示は、例えば自動車等の車両に搭載される車載用電子装置に関する。 The present disclosure relates to an in-vehicle electronic device mounted on a vehicle such as an automobile.
 例えば、自動車等の車両には、例えばディスプレイユニットやエンジン制御用ECU等の各種の電子装置が搭載される。この種の電子装置は、ケース内に回路基板を収容して構成されるが、特に冷却ファンを備え、外気をケース内に取込んで部品の冷却を図るようにしたものがある。このものでは、低温の状態で、高湿度の空気がケース内に浸入すると、回路基板の表面等における結露が発生し、ひいては腐食等につながる虞がある。そこで、従来では、回路基板上の結露の虞のある部分に、防湿剤を塗布することが一般に行われている。 For example, various electronic devices such as a display unit and an engine control ECU are mounted on a vehicle such as an automobile. This type of electronic device is configured by housing a circuit board in a case, but in particular, there is a device that includes a cooling fan and takes outside air into the case to cool components. In this case, if high-humidity air enters the case at a low temperature, condensation may occur on the surface of the circuit board, which may lead to corrosion. Therefore, conventionally, a moisture-proofing agent is generally applied to a portion on the circuit board where there is a risk of condensation.
 また、電子装置における回路基板の表面部に対する塵埃などの侵入を防止するために、例えば次のような構成も考えられている、即ち、特許文献1では、光ディスク装置において、ステンレスの薄板からなる保護カバーを設けることが開示されている。或いは、特許文献2においては、デジタルカメラにおいて、光学フィルタ部分への塵埃の侵入を防止するために、光学フィルタをゴム材等のエラストマでカバーすることが開示されている。 Further, in order to prevent intrusion of dust and the like into the surface portion of the circuit board in the electronic device, for example, the following configuration is also considered. That is, in Patent Document 1, in the optical disc apparatus, protection made of a thin stainless steel plate is considered. Providing a cover is disclosed. Alternatively, Patent Document 2 discloses that, in a digital camera, the optical filter is covered with an elastomer such as a rubber material in order to prevent dust from entering the optical filter portion.
特開2004-110973号公報JP 2004-110973 A 特許第5901347号公報Japanese Patent No. 5901347
 しかしながら、上記のように、回路基板に防湿剤を塗布する構成では、塗布作業や管理に工数がかかり、製造コストがアップしてしまう事情がある。また、コネクタ等に防湿剤が付着してしまうと、機能不良を招いてしまう虞もある。金属製の保護カバーを設ける構成では、保護カバー自体が高価となると共に、回路基板との間のクリアランスを小さく確保することが難しく、絶縁不良等の問題があった。或いは、エラストマでカバーする構成では、車両という高温、高湿の環境下での使用において、ゴム材料の変形や劣化の問題があった。 However, as described above, in the configuration in which the moisture-proofing agent is applied to the circuit board, there are circumstances in which the man-hours for the application work and management are increased, and the manufacturing cost is increased. Moreover, if a moisture-proofing agent adheres to a connector etc., there exists a possibility of causing a malfunction. In the configuration in which the metal protective cover is provided, the protective cover itself is expensive and it is difficult to ensure a small clearance from the circuit board, which causes problems such as poor insulation. Or in the structure covered with an elastomer, there existed a problem of a deformation | transformation and deterioration of a rubber material in the use in the high temperature and high humidity environment of a vehicle.
 本開示は、結露や塵埃等からの回路基板の保護を効果的に行うことができながら、そのための構成を簡単に済ませることができる車載用電子装置を提供することを目的とする。 The present disclosure is intended to provide an in-vehicle electronic device that can effectively protect a circuit board from dew condensation, dust, and the like, but can simply complete the configuration for that purpose.
 本開示の第一の態様において、車載用電子装置は、車両に搭載される電子装置であって、ケースと、前記ケース内に設けられた回路基板と、前記回路基板の少なくとも一部を覆うように設けられる保護用のカバーとを備え、前記カバーは、プラスチック製シートの成形品からなると共に、表面側突起部及び裏面側突起部を一体に有し、前記表面側突起部が前記ケースの内壁面に当接し、前記裏面側突起部が前記回路基板の表面に当接した状態で設けられている。 In the first aspect of the present disclosure, the in-vehicle electronic device is an electronic device mounted on a vehicle, and covers a case, a circuit board provided in the case, and at least a part of the circuit board. A protective cover provided on the surface of the case. The cover is made of a molded product of a plastic sheet, and integrally includes a front-side protrusion and a back-side protrusion, and the front-side protrusion is an inner part of the case. Abutting against the wall surface, the back side protrusion is provided in a state of abutting against the surface of the circuit board.
 これによれば、回路基板が保護用のカバーによって覆われることにより、回路基板に対する結露の防止や、塵埃の付着の防止を図ることができる。このとき、保護用のカバーは、プラスチック製シートの成形品から構成されるので、回路基板の表面形状に倣った立体形状を容易に形成できる。よって、カバーの厚み自体を薄くして小さなクリアランスでも配置することが可能となる。また安価に済ませることができる。カバーは、絶縁材製なので、金属製のカバーと異なり、回路基板との間のクリアランスを小さくしても、絶縁不良の問題が生ずることはないことは勿論である。 According to this, since the circuit board is covered with the protective cover, it is possible to prevent condensation on the circuit board and prevent dust from adhering. At this time, since the protective cover is formed of a molded product of a plastic sheet, a three-dimensional shape following the surface shape of the circuit board can be easily formed. Therefore, the cover itself can be thinned and arranged with a small clearance. Moreover, it can be made inexpensively. Since the cover is made of an insulating material, it is a matter of course that, unlike a metal cover, even if the clearance between the circuit board and the circuit board is reduced, the problem of poor insulation does not occur.
 ここで、ケース内にプラスチック製のカバーを設ける場合、車両振動に伴うカバーの振動音の発生が懸念される。ところが、カバーの表面側に設けられた表面側突起部がケースの内壁面に当接し、カバーの裏面側に設けられた裏面側突起部が回路基板の表面に当接するので、カバーがケースと回路基板との間に挟まれて保持される形態となる。これにより、カバーの振動を規制して異音の発生を防止することができる。従って、結露や塵埃等からの回路基板の保護を効果的に行うことができながら、そのための構成を簡単に済ませることができるという優れた効果を得ることができる。 Here, when a plastic cover is provided in the case, there is a concern about generation of vibration sound of the cover due to vehicle vibration. However, the front side projection provided on the front side of the cover contacts the inner wall surface of the case, and the rear side projection provided on the back side of the cover contacts the surface of the circuit board. It becomes the form which is pinched | interposed and hold | maintained between board | substrates. Thereby, the vibration of the cover can be regulated to prevent the generation of abnormal noise. Therefore, it is possible to effectively protect the circuit board from dew condensation, dust, and the like, while obtaining an excellent effect that the configuration for the circuit board can be easily completed.
 本開示についての上記目的およびその他の目的、特徴や利点は、添付の図面を参照しながら下記の詳細な記述により、より明確になる。その図面は、
図1は、一実施形態を示すもので、車載用電子装置の分解斜視図であり、 図2は、第2ケースを取外した状態の要部の斜視図であり、 図3は、第2回路基板上にカバーを配置した状態の斜視図であり、 図4は、表面側突起部部分を示す断面図であり、 図5は、裏面側突起部部分を示す断面図である。
The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings. The drawing
FIG. 1 shows an embodiment and is an exploded perspective view of an in-vehicle electronic device. FIG. 2 is a perspective view of the main part with the second case removed, FIG. 3 is a perspective view of a state in which a cover is disposed on the second circuit board, FIG. 4 is a cross-sectional view showing the surface side protrusion portion. FIG. 5 is a cross-sectional view showing the rear surface side protruding portion.
 以下、車載用電子装置として例えば車両用のディスプレイユニットに適用した一実施形態について、図面を参照しながら説明する。本実施形態に係る車載用電子装置1(以下、単に「電子装置1」という)は、例えばナビゲーションシステムを構成するディスプレイユニットからなり、自動車のインストルメントパネルの中央部分に搭載される。尚、図面においては、実際の車載時、つまり使用状態では前面即ち正面側に配置される液晶パネル側を、下向きに置いた形態で示している。 Hereinafter, an embodiment in which the vehicle-mounted electronic device is applied to, for example, a vehicle display unit will be described with reference to the drawings. A vehicle-mounted electronic device 1 (hereinafter simply referred to as “electronic device 1”) according to the present embodiment is composed of, for example, a display unit that constitutes a navigation system, and is mounted on a central portion of an instrument panel of an automobile. In the drawings, the liquid crystal panel side that is disposed on the front side, that is, the front side in an actual vehicle-mounted state, that is, in a used state, is shown in a form in which the liquid crystal panel is placed downward.
 図1は、電子装置1の全体の外観を概略的に示している。この電子装置1は、ケース2内に、プリント配線板に各種部品を実装してなる回路基板3、4を収容して構成される。このとき、本実施形態では、2枚の回路基板3、4がケース2内に設けられ、そのうち図で手前側、即ち使用状態では下側の回路基板を第1の回路基板3、奥側、即ち使用状態では上側の回路基板を第2の回路基板4と称する。 FIG. 1 schematically shows the overall appearance of the electronic device 1. The electronic device 1 is configured by housing circuit boards 3 and 4 formed by mounting various components on a printed wiring board in a case 2. At this time, in the present embodiment, two circuit boards 3 and 4 are provided in the case 2, of which the front side in the figure, that is, the lower side circuit board in the use state, is the first circuit board 3, the back side, In other words, the upper circuit board is referred to as a second circuit board 4 in use.
 前記ケース2は、図で上下方向即ち使用状態では前後方向に薄型のほぼ矩形箱状をなし、図で下側の第1ケース5と、図で上側の第2ケース6とを突き合わせて接合して構成される。そのうち第1ケース5は、図2にも一部示すように、例えばプラスチックから、図で上面が開口した薄型ほぼ矩形箱状に構成されている。図示はしないが、この第1ケース5の下面側即ち車載時には前面側には、液晶パネルが設けられている。 The case 2 has a substantially rectangular box shape that is thin in the vertical direction in the figure, that is, in the front-rear direction in the state of use, and the lower first case 5 in the figure and the upper second case 6 in the figure are abutted and joined. Configured. Of these, as shown in part in FIG. 2, the first case 5 is made of, for example, plastic and has a thin, substantially rectangular box shape with an upper surface opened in the figure. Although not shown, a liquid crystal panel is provided on the lower surface side of the first case 5, that is, on the front surface side when the vehicle is mounted.
 前記第2ケース6は、例えば金属から、図で下面が開口した矩形蓋状に構成され、前記第1ケース5の図で上面の開口部を塞ぐように設けられる。この第2ケース6の中央部には、ファン取付部6aが設けられており、冷却用のファン装置(図示せず)が装着される。さらに、第2ケース6には、外部接続用の複数個のコネクタ8(一部のみ図示)が配置される開口6b等が設けられている。尚、第2ケース6の図で前端下辺部には、図で手前側に延びる延出部6cが一体に設けられている。 The second case 6 is made of, for example, a metal and has a rectangular lid shape whose bottom surface is opened in the figure, and is provided so as to close the opening part on the top surface in the figure of the first case 5. A fan mounting portion 6a is provided at the center of the second case 6, and a cooling fan device (not shown) is mounted. Further, the second case 6 is provided with an opening 6b or the like in which a plurality of connectors 8 (only part of which are shown) for external connection are disposed. In addition, in the figure of the 2nd case 6, the extension part 6c extended to the near side by the figure is integrally provided in the lower part of the front end.
 このとき、ケース2の図で前面部即ち使用状態では底面部には、第1ケース5と第2ケース6の延出部6cとの間に位置して外気流入口7が設けられている。これにて、前記ファン装置が駆動されると、図1に矢印Aで示すように、外気流入口7からケース2内に外気が吸い込まれる。吸い込まれた空気は、内部の電子部品等の冷却に寄与した後、図で上面側即ち使用状態では背面側に排出される。 At this time, an external airflow inlet 7 is provided between the first case 5 and the extended portion 6c of the second case 6 on the front surface, that is, in the use state in the drawing of the case 2, at the bottom surface. When the fan device is driven, the outside air is sucked into the case 2 from the outside air flow inlet 7 as indicated by an arrow A in FIG. The sucked air contributes to the cooling of the internal electronic components and the like, and is then discharged to the upper surface side, that is, the rear surface side in the use state.
 前記第1の回路基板3は、図2、図3にも示すように、横長な形状をなし、その上面には、電気回路を構成する複数個の部品9(一部のみ図示)が実装されている。この場合、第1の回路基板3は、ケース2の第1ケース5内の図で手前側に配置され、従って、第1の回路基板3の上面部は、前記外気流入口7に臨む部位に配置されている。図1に示すように、第2の回路基板4は、第1の回路基板3より図で前後方向に大型なほぼ正方形状をなし、ケース2の第1ケース5内の第1の回路基板3の奥側に位置して配設されている。前記コネクタ8は、第2の回路基板4上に実装されている。 As shown in FIGS. 2 and 3, the first circuit board 3 has a horizontally long shape, and a plurality of components 9 (only a part thereof) constituting an electric circuit are mounted on the upper surface thereof. ing. In this case, the first circuit board 3 is disposed on the near side in the figure in the first case 5 of the case 2, and therefore the upper surface portion of the first circuit board 3 is located at a portion facing the external air flow inlet 7. Has been placed. As shown in FIG. 1, the second circuit board 4 has a substantially square shape larger in the front-rear direction than the first circuit board 3 in the figure, and the first circuit board 3 in the first case 5 of the case 2. It is arrange | positioned and located in the back | inner side. The connector 8 is mounted on the second circuit board 4.
 さて、本実施形態では、前記回路基板3、4のうち、第1の回路基板3の上面を覆うように、保護用のカバー11が設けられる。図1~図3に示すように、このカバー11は、プラスチック製シートの成型品からなる。このカバー11は、全体として、第1の回路基板3の上面の電子部品9を含めた凹凸形状に沿うようにして、僅かなクリアランスを確保した状態で上面ほぼ全体を覆うような形状、つまり薄型の矩形蓋形状に形成されている。より具体的には、このカバー11を構成するプラスチック製シートは、例えばポリプロピレン、即ちPPの、厚み寸法が0.5mmのシート又はフィルムからなり、いわゆる真空成型によりカバー11が成形されている。 In the present embodiment, a protective cover 11 is provided so as to cover the upper surface of the first circuit board 3 among the circuit boards 3 and 4. As shown in FIGS. 1 to 3, the cover 11 is a molded product of a plastic sheet. The cover 11 has a shape that covers the entire upper surface of the first circuit board 3 including the electronic components 9 on the upper surface of the first circuit board 3 so as to cover almost the entire upper surface with a slight clearance. It is formed in a rectangular lid shape. More specifically, the plastic sheet constituting the cover 11 is made of, for example, polypropylene or PP sheet or film having a thickness of 0.5 mm, and the cover 11 is formed by so-called vacuum forming.
 周知のように、真空成型とは、シートを加熱して軟化させた状態で、真空引きにより成形型の表面に密着させて成形する方法である。尚、図2、図3に示すように、第1の回路基板3の上面に実装されている部品9のうち、高さ寸法の大きい一部の部品9に関しては、カバー11に開口11aが形成され、部品9がその開口11aから上方に突出するように配置される。 As is well known, vacuum molding is a method in which a sheet is heated and softened, and the sheet is molded by being brought into close contact with the surface of a mold by vacuuming. As shown in FIGS. 2 and 3, among the components 9 mounted on the upper surface of the first circuit board 3, an opening 11 a is formed in the cover 11 for a part 9 having a large height. The component 9 is disposed so as to protrude upward from the opening 11a.
 そして、カバー11には、その表面側に位置して表面側突起部12が一体に形成され、裏面側に位置して裏面側突起部13が一体に形成されている。そのうち表面側突起部12は、図3、図4に示すように、カバー11の図で前側寄り部位の中心線Cに沿う位置に、例えば直径4mm程度で丸く膨らんだ形態に1個が設けられている。また、表面側突起部12の厚み方向(図で上方)への突出寸法は、例えば0.6mm程度とされている。この表面側突起部12は、先端が前記ケース2、つまり第2ケース6の延出部6cの内壁面に当接する。 Further, the cover 11 is integrally formed with a front side protrusion 12 positioned on the front surface side, and is integrally formed with a back surface protrusion 13 positioned on the back surface side. Of these, as shown in FIGS. 3 and 4, one surface-side protruding portion 12 is provided at a position along the center line C of the front side portion of the cover 11, for example, in a form that bulges in a circle with a diameter of about 4 mm. ing. In addition, the projecting dimension in the thickness direction (upward in the drawing) of the front side protruding portion 12 is, for example, about 0.6 mm. The front end of the surface side protrusion 12 abuts on the case 2, that is, the inner wall surface of the extension 6 c of the second case 6.
 前記裏面側突起部13は、図5にも示すように、カバー11の図で前端部位の、中心線Cに対して左右に対称的な位置に、各2個ずつが横方向に並んで設けられている。これら裏面側突起部13は、先端が丸みを帯びた円筒状をなして裏面側に突出するように形成されており、厚み方向(図で下方)への突出寸法は、例えば0.6mm程度とされている。これら裏面側突起部13は、先端が第1の回路基板3の表面に当接する。これにて、カバー11は、第2ケース6と第1の回路基板3との間に挟まれて保持される形態となる。この場合、表面側突起部12及び裏面側突起部13の図で高さ方向の干渉量は、例えば0.3mm程度となる。 As shown in FIG. 5, each of the two rear surface protruding portions 13 is provided side by side in the horizontal direction at a position symmetrical to the left and right with respect to the center line C in the front end portion of the cover 11. It has been. These back side protrusions 13 are formed so that the tip is rounded and protrudes to the back side, and the protruding dimension in the thickness direction (downward in the figure) is, for example, about 0.6 mm. Has been. These back side protrusions 13 are in contact with the surface of the first circuit board 3 at their tips. Thus, the cover 11 is sandwiched and held between the second case 6 and the first circuit board 3. In this case, the amount of interference in the height direction in the drawing of the front surface side protruding portion 12 and the back surface side protruding portion 13 is, for example, about 0.3 mm.
 このとき、前記第1の回路基板3には、両側前後の各コーナー部分や、それ以外の要所に位置して、ねじ挿通穴が形成されている。これにて、図2等に示すように、第1ケース5の内壁部に形成されたねじボス部(図示せず)に対して、ビス等のねじ14による取付け固定がなされる。本実施形態では、図3に示すように、カバー11にも、4つのコーナー部などに、第1の回路基板3のねじ挿通穴に重なる位置に、ねじ挿通用の穴11bが形成されている。前記ねじ14によるいわゆる共締めにより、カバー11は第1の回路基板3と併せて第1ケース5に固定されている。 At this time, screw insertion holes are formed in the first circuit board 3 at the corners on both sides and on the other corners. Thus, as shown in FIG. 2 and the like, the screw boss portion (not shown) formed on the inner wall portion of the first case 5 is fixed by screws 14 such as screws. In the present embodiment, as shown in FIG. 3, the cover 11 is also formed with screw insertion holes 11 b at four corners or the like at positions overlapping the screw insertion holes of the first circuit board 3. . The cover 11 is fixed to the first case 5 together with the first circuit board 3 by so-called co-tightening with the screws 14.
 次に、上記のように構成された電子装置1の作用・効果について述べる。上記構成の電子装置1においては、第1の回路基板3が保護用のカバー11によって覆われることにより、第1の回路基板3に対する結露の防止や、塵埃の付着の防止を図ることができる。このとき、カバー11は、プラスチック製シートの成形品から構成されるので、第1の回路基板3の表面形状に倣った立体形状を容易に形成できる。これにて、カバー11の厚み自体を薄くして小さなクリアランスでも配置することが可能となる。また、カバー11を安価に済ませることができる。カバー11は、絶縁材製なので、金属製のカバーと異なり、第1の回路基板3との間のクリアランスを小さくしても、絶縁不良の問題が生ずることがないことは勿論である。 Next, the operation and effect of the electronic device 1 configured as described above will be described. In the electronic device 1 having the above-described configuration, the first circuit board 3 is covered with the protective cover 11, thereby preventing condensation on the first circuit board 3 and preventing dust from adhering. At this time, since the cover 11 is formed of a molded product of a plastic sheet, a three-dimensional shape following the surface shape of the first circuit board 3 can be easily formed. Thus, the cover 11 can be disposed with a small clearance and a small clearance. Further, the cover 11 can be made inexpensively. Since the cover 11 is made of an insulating material, it is a matter of course that the problem of insulation failure does not occur even if the clearance between the cover 11 and the first circuit board 3 is reduced, unlike a metal cover.
 ここで、ケース2内にプラスチック製のカバー11を設ける場合、車両振動に伴うカバー11の振動音の発生が懸念される。ところが、カバー11の表面側に設けられた表面側突起部12が第2ケース6の延出部6cの内壁面に当接し、カバー11の裏面側に設けられた裏面側突起部13が第1の回路基板3の表面に当接する。これにより、カバー11がケース2と第1の回路基板3との間に挟まれて保持される形態となり、カバー11の振動を規制して異音の発生を防止することができる。従って、本実施形態によれば、結露や塵埃等からの回路基板3の保護を効果的に行うことができながら、そのための構成を簡単に済ませることができるという優れた効果を得ることができる。 Here, when the plastic cover 11 is provided in the case 2, there is a concern about the generation of vibration sound of the cover 11 due to vehicle vibration. However, the front side protrusion 12 provided on the front side of the cover 11 contacts the inner wall surface of the extension 6c of the second case 6, and the back side protrusion 13 provided on the back side of the cover 11 is the first. It contacts the surface of the circuit board 3. As a result, the cover 11 is sandwiched and held between the case 2 and the first circuit board 3, and the vibration of the cover 11 can be regulated to prevent the generation of abnormal noise. Therefore, according to the present embodiment, while the circuit board 3 can be effectively protected from dew condensation, dust, and the like, it is possible to obtain an excellent effect that the configuration for that can be easily completed.
 特に本実施形態では、ファン装置を備え、ケース2に設けられた外気流入口7から外気を取入れる構成とされている。カバー11は、外気流入口7に臨む部分である第1の回路基板3の図で上面を覆うように設けられている。これにより、ケース2内において最も結露が生じやすい部分である第1の回路基板3の表面部を、カバー11により覆うことができる。従って、結露が生じたとしてもカバー11の表面側になるので、第1の回路基板3上の結露やそれに伴う不具合を未然に防止することができる。 Particularly in the present embodiment, a fan device is provided, and the outside air is taken in from the outside air flow inlet 7 provided in the case 2. The cover 11 is provided so as to cover the upper surface of the first circuit board 3, which is a portion facing the external air flow inlet 7. As a result, the surface portion of the first circuit board 3, which is the portion where condensation is most likely to occur in the case 2, can be covered with the cover 11. Therefore, even if dew condensation occurs, it is on the surface side of the cover 11, so that dew condensation on the first circuit board 3 and problems associated therewith can be prevented in advance.
 また、本実施形態では、1個の表面側突起部12をカバー11のうち中心線Cに沿う位置に設け、複数個の裏面側突起部13を、カバー11のうち中心線Cに対して左右対称的な位置に設けるようにした。これにより、カバー11が、ケース2と第1の回路基板3との間に安定して保持されるようになる。 Further, in the present embodiment, one front side protruding portion 12 is provided at a position along the center line C in the cover 11, and a plurality of back side protruding portions 13 are arranged on the left and right sides of the center line C of the cover 11. It was arranged at a symmetrical position. As a result, the cover 11 is stably held between the case 2 and the first circuit board 3.
 本実施形態では、カバー11を構成するプラスチック製シートとして、ポリプロピレンを採用した。材料としてのポリプロピレンは、安価、軽量であり、絶縁性に優れ、薄いシートでも一定の強度即ち高い剛性が得られる。真空成型などの成形性も良い。ゴム等と比べて熱や温度変化に強く熱的に安定している、金属に比べて熱容量も小さい等のメリットを得ることができる。 In this embodiment, polypropylene is adopted as the plastic sheet constituting the cover 11. Polypropylene as a material is inexpensive and lightweight, has excellent insulating properties, and can obtain a certain strength, that is, high rigidity even with a thin sheet. Good formability such as vacuum forming. Advantages such as being stronger and more stable against heat and temperature change than rubber or the like, and having a smaller heat capacity than metal can be obtained.
 尚、上記実施形態では、カバー11の取付けにあたっては、ケース2の第1ケース5に対して、第1の回路基板3と共にねじ止め、いわゆる共締めする構成とした。これに対し、そのような固定手段を特に設けることなく、ケースと回路基板との間に挟持して保持する構成とすることも可能である。また、上記実施形態では、カバー11を、PP製としたが、ポリエチレンテレフタレート、即ちPETから構成しても良く、PP製の場合と同様の作用・効果を得ることができる。ファン装置を備えないものであっても、同様にカバー11を設けることにより、結露や塵埃等からの回路基板を保護することができる。 In the above embodiment, when the cover 11 is attached, the first case 5 of the case 2 is screwed together with the first circuit board 3, so-called joint fastening. On the other hand, it is also possible to adopt a configuration in which such a fixing means is not particularly provided and held between the case and the circuit board. Moreover, in the said embodiment, although the cover 11 was made from PP, you may comprise from a polyethylene terephthalate, ie, PET, and can obtain the effect | action and effect similar to the case made from PP. Even if the fan device is not provided, the circuit board can be protected from dew condensation, dust and the like by providing the cover 11 in the same manner.
 その他、上記実施形態では、ディスプレイユニットに適用したが、エンジンECU等様々な用途、種類の車両用電子装置全般に適用することが可能である。ケースの形状や、外気流入口の配置などについても様々な変更が可能であることは勿論である。本開示は、実施例に準拠して記述されたが、本開示は当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。 In addition, although applied to the display unit in the above embodiment, the present invention can be applied to various electronic devices for vehicles of various uses and types such as an engine ECU. Of course, various changes can be made to the shape of the case and the arrangement of the external airflow inlet. Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments and structures. The present disclosure includes various modifications and modifications within the equivalent range. In addition, various combinations and forms, as well as other combinations and forms including only one element, more or less, are within the scope and spirit of the present disclosure.

Claims (4)

  1.  車両に搭載される電子装置(1)であって、
     ケース(2)と、
     前記ケース内に設けられた回路基板(3)と、
     前記回路基板の少なくとも一部を覆うように設けられる保護用のカバー(11)とを備え、
     前記カバーは、プラスチック製シートの成形品からなると共に、表面側突起部(12)及び裏面側突起部(13)を一体に有し、
     前記表面側突起部が前記ケースの内壁面に当接し、前記裏面側突起部が前記回路基板の表面に当接した状態で設けられている車載用電子装置。
    An electronic device (1) mounted on a vehicle,
    Case (2),
    A circuit board (3) provided in the case;
    A protective cover (11) provided to cover at least a part of the circuit board,
    The cover is made of a molded product of a plastic sheet, and integrally has a front side protrusion (12) and a back side protrusion (13),
    The vehicle-mounted electronic device provided in the state which the said surface side protrusion part contact | abutted to the inner wall surface of the said case, and the said back surface side protrusion part contact | abutted to the surface of the said circuit board.
  2.  前記ケースには、外気を導入するための外気流入口が設けられており、前記カバーは、前記回路基板のうち少なくとも前記外気流入口に臨む部分を覆うように設けられる請求項1記載の車載用電子装置。 The in-vehicle use according to claim 1, wherein the case is provided with an external air flow inlet for introducing external air, and the cover is provided so as to cover at least a portion of the circuit board facing the external air flow inlet. Electronic equipment.
  3.  前記表面側突起部及び裏面側突起部のうち両方またはいずれか一方は、前記カバーのうち中心線に対して対称的な位置に設けられている請求項1又は2記載の車載用電子装置。 3. The vehicle-mounted electronic device according to claim 1, wherein one or both of the front-side protrusion and the rear-side protrusion are provided at positions symmetrical with respect to a center line in the cover.
  4.  前記カバーを構成するプラスチック製シートは、ポリプロピレン又はポリエチレンテレフタレートからなる請求項1から3のいずれか一項に記載の車載用電子装置。 4. The on-vehicle electronic device according to claim 1, wherein the plastic sheet constituting the cover is made of polypropylene or polyethylene terephthalate.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023023700A1 (en) * 2021-08-25 2023-03-02 Redarc Technologies Pty Ltd Electronics housing assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023047976A (en) * 2021-09-27 2023-04-06 株式会社デンソー Control device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087554A (en) * 2007-09-27 2009-04-23 Hitachi Maxell Ltd Battery pack
JP2012132432A (en) * 2010-11-30 2012-07-12 Panasonic Corp Inverter device integrated electric compressor
JP2017130335A (en) * 2016-01-20 2017-07-27 アルプス電気株式会社 Electronic device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013105965A (en) * 2011-11-16 2013-05-30 Daikin Ind Ltd Seal structure of electrical part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087554A (en) * 2007-09-27 2009-04-23 Hitachi Maxell Ltd Battery pack
JP2012132432A (en) * 2010-11-30 2012-07-12 Panasonic Corp Inverter device integrated electric compressor
JP2017130335A (en) * 2016-01-20 2017-07-27 アルプス電気株式会社 Electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023023700A1 (en) * 2021-08-25 2023-03-02 Redarc Technologies Pty Ltd Electronics housing assembly

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