WO2019226294A1 - Ground path systems for providing a shorter and symmetrical ground path - Google Patents

Ground path systems for providing a shorter and symmetrical ground path Download PDF

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Publication number
WO2019226294A1
WO2019226294A1 PCT/US2019/030733 US2019030733W WO2019226294A1 WO 2019226294 A1 WO2019226294 A1 WO 2019226294A1 US 2019030733 W US2019030733 W US 2019030733W WO 2019226294 A1 WO2019226294 A1 WO 2019226294A1
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WO
WIPO (PCT)
Prior art keywords
bowl
ground
coupled
pedestal
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2019/030733
Other languages
French (fr)
Inventor
Tuan Anh Nguyen
Jason M. Schaller
Iv Edward P. Hammond
David Blahnik
Tejas ULAVI
Amit Kumar BANSAL
Sanjeev Baluja
Jun Ma
Juan Carlos Rocha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to SG11202009022RA priority Critical patent/SG11202009022RA/en
Priority to KR1020247035876A priority patent/KR102892472B1/en
Priority to KR1020207035734A priority patent/KR102725261B1/en
Priority to JP2020565777A priority patent/JP7362669B2/en
Priority to CN202411193850.8A priority patent/CN119082711A/en
Priority to CN201980030846.0A priority patent/CN112088426B/en
Publication of WO2019226294A1 publication Critical patent/WO2019226294A1/en
Anticipated expiration legal-status Critical
Priority to JP2023116487A priority patent/JP7542117B2/en
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
    • C23C16/45536—Use of plasma, radiation or electromagnetic fields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32587—Triode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput

Definitions

  • Embodiments of the present disclosure generally relate to process chambers, such as chemical vapor deposition chambers. More particularly, embodiments of the present disclosure relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground.
  • RF radio frequency
  • CVD Chemical vapor deposition
  • a substrate such as a semiconductor wafer or transparent substrate used for flat panel displays.
  • CVD is generally accomplished by introducing process gasses into a vacuum chamber that contains a substrate.
  • the precursor gas or gas mixture is typically directed downwardly through a gas distribution assembly situated near the top of the chamber.
  • the gas distribution assembly is placed above a substrate that is positioned on a heated pedestal at a small distance such that the gas distribution assembly and the process gasses are heated by the radiated heat from the pedestal.
  • the process gasses in the chamber may be energized (e.g., excited) into a plasma by applying radio frequency (RF) power to the chamber from one or more RF sources coupled to the chamber, referred to as plasma-enhanced CVD (PECVD).
  • RF radio frequency
  • PECVD plasma-enhanced CVD
  • a RF source coupled to the pedestal through a RF matching circuit and a faceplate of the gas distribution assembly grounded to the chamber body facilitate formation of a capacitive plasma coupling.
  • the RF source provides RF energy to the pedestal to facilitate generation of the capacitive coupled plasma, also known as a main plasma, between the pedestal and the faceplate of the gas distribution assembly.
  • a parasitic plasma also known as a secondary plasma
  • the parasitic plasma reduces the concentration of the capacitive coupled plasma, and thus reduces the density of the capacitive coupled plasma which reduces the deposition rate of the film.
  • variation of the concentration and density of the parasitic plasma between chambers reduces the uniformity between films formed in separate chambers.
  • a ground path system in one embodiment, includes a ground bowl and a bottom bowl configured to be disposed in a chamber.
  • the chamber includes a processing volume, and a pedestal disposed in the processing volume by a stem coupled to a lift system configured to move the pedestal between an elevated processing position and a lowered position.
  • the ground bowl is coupled to the stem and the pedestal by a thermal barrier.
  • a bottom bowl carrier is coupled to a track. The bottom bowl carrier configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position.
  • the bottom bowl is coupled to the ground bowl by a ground bowl conductor, and the bottom bowl is coupled to the chamber by a bottom bowl conductor.
  • a ground path system in another embodiment, includes a ground bowl configured to be disposed in a chamber.
  • the chamber includes a processing volume, and a pedestal disposed in the processing volume by a stem coupled to a cooling hub connected to a lift system configured to move the pedestal between an elevated processing position and a lowered position.
  • the ground bowl is coupled to the cooling hub.
  • a ground bowl conductor is coupled to the ground bowl. The ground bowl conductor is in a compressed state when the pedestal and the ground bowl are in the elevated processing position and in an expanded state when the pedestal and ground bowl are in the lowered position.
  • a chamber in yet another embodiment, includes a chamber body having a processing volume, and a pedestal disposed in the processing volume by a stem coupled to a cooling hub connected to move the pedestal between an elevated processing position and a lowered position.
  • a ground path system is disposed in the chamber body.
  • the ground path system includes a ground bowl coupled to the stem and the pedestal by a thermal barrier and coupled to the cooling hub.
  • a bottom bowl is coupled to the ground bowl by a ground bowl conductor and coupled to the chamber by a bottom bowl conductor.
  • a bottom bowl carrier is coupled to a track. The bottom bowl carrier is configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position.
  • Figure 1A is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
  • Figure 1 B is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
  • Figure 1C is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
  • Figure 1 D is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
  • Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity.
  • the ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates the processing region from the outer volume of the processing volume providing a reduced surface area for RF energy to propagate and eliminates any non-symmetries of the chamber body. Therefore, the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased.
  • Figure 1A and Figure 1 B are schematic cross-sectional views of a chemical vapor deposition (CVD) chamber 100 having a ground path system 200 disposed therein.
  • the chamber 100 is a PRECISIONTM chamber manufactured by Applied Materials, Inc., located in Santa Clara, Calif.
  • the chamber 100 has a chamber body 102 and a chamber lid 104.
  • the chamber body includes processing volume 106 and a pumping path 108.
  • the processing volume 106 is the space defined by the chamber body and the chamber lid 104
  • the pumping path 108 is a path formed in the chamber body 102 coupled to a pumping volume 112 formed in a pumping plate 114.
  • the chamber 100 includes a gas distribution assembly 116 disposed through the chamber lid 104 to deliver a flow of one or more gases into a processing region 110 described in detail herein.
  • the gas distribution assembly 116 includes a gas manifold 118 coupled to a gas inlet passage 120 formed in the chamber lid 104.
  • the gas manifold 118 receives the flow of gases from one or more gas sources 122.
  • the flow of gases distributes across a gas box 124, flows through a plurality of holes (not shown) of a backing plate 126, and further distributes across a plenum 128 defined by the backing plate 126 and a faceplate 130.
  • the flow of gases then flows into a processing region 110 of the processing volume 106 through a plurality of holes 132 of the faceplate 130.
  • a pump 133 is connected to the pumping path 108 by a conduit 134 to control the pressure within the processing region 110 and to the exhaust gases and byproducts from the processing region 110 through the pumping volume 112 and pumping path 108.
  • the processing volume 106 includes a pedestal 138 for supporting a substrate 136 within the chamber 100.
  • the pedestal 138 includes a heating element (not shown) and an electrode 140 disposed within.
  • the electrode 140 includes a conductive mesh, such as a tungsten-, copper-, or molybdenum-containing conductive mesh.
  • the pedestal 138 is movably disposed in the processing volume 106 by a stem 142 coupled to a heater clamp 144.
  • the heater clamp 144 is coupled to a cooling hub 146.
  • the cooling hub 146 is connected to a lift system 162 that moves the pedestal 138 between an elevated processing position (shown in Figure 1A) and a lowered position (shown in Figure 1 B).
  • Movement of the pedestal 138 facilitates transfer of the substrate 136 to and from the processing volume 106 through a slit valve 148 formed though the chamber body 102.
  • the elevated processing position corresponds to the processing region 110 defined by the pedestal 138 and faceplate 130 of the gas distribution assembly 116.
  • the pedestal 138 has holes disposed therethrough, through which a plurality of lift pins 150 are movably disposed. In the lowered position, the plurality of lift pins 150 are projected from the pedestal 138 by contacting a lift plate 152 coupled to a bottom 154 of the chamber body. Projection of the lift pins 150 places the substrate 136 in a spaced- apart relation from the pedestal to facilitate the transfer of the substrate 136.
  • a RF source 156 is coupled to the electrode 140 disposed within pedestal 138 through a RF matching circuit 158.
  • the RF matching circuit 158 is electrically coupled to the electrode 140 by a conductive rod 160 disposed through the cooling hub 146 and stem 142.
  • the faceplate 130 which is grounded via the ground path system 200, and the electrode 140 facilitate formation of a capacitive plasma coupling.
  • the RF source 156 provides RF energy to the pedestal 138 to facilitate generation of a capacitive coupled plasma, also known as a main plasma, between the pedestal 138 and the faceplate 130 of the gas distribution assembly 116.
  • the ground path system 200 provides a short and symmetrical path for RF energy to propagate from the faceplate 130 to the RF matching circuit 158 to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity.
  • the ground path system 200 includes a ground bowl 202, and a bottom bowl 204.
  • the ground bowl 202 is coupled to the stem 142 and the pedestal 138 by a thermal barrier 228.
  • the thermal barrier 228 provides a barrier to the pedestal 138 that may be heated up to a temperature greater than about 700 °C.
  • the thermal barrier 228 includes materials having a low thermal conductivity.
  • the thermal barrier 228 includes one or more of inconel, quartz, aluminum oxide, aluminum nitride, and stainless steel containing materials to provide a barrier to the temperature.
  • the ground bowl 202 is also coupled to the cooling hub 146 that is connected to the lift system 162.
  • the lift system 162 moves the ground bowl 202 between the elevated processing position (shown in Figure 1A) and the lowered position (shown in Figure 1 B), facilitating transfer of the substrate 136.
  • the ground bowl 202 includes conductive materials capable of withstanding a temperature in the processing volume 106 greater than about 700 °C and process environment in the processing volume 106. In one embodiment, which can be combined with other embodiments described herein, the ground bowl 202 includes one or more of inconel, aluminum, and stainless steel containing materials.
  • the bottom bowl 204 is coupled to a bottom bowl carrier 206.
  • the bottom bowl carrier 206 is coupled to a track 208.
  • the bottom bowl carrier 206 is actuated to move linearly along the track 208 to move the bottom bowl 204 between a ground position (shown in Figure 1A) and a transfer position (shown in Figure 1 B).
  • the track 208 may also be a rail or cable.
  • the bottom bowl carrier 206 includes conductive materials capable of withstanding the temperature and process environment in the processing volume 106.
  • the bottom bowl 204 includes one or more of inconel, aluminum, and stainless steel containing materials.
  • the ground bowl 202 is coupled to the bottom bowl 204 via the ground bowl conductor 210.
  • the ground bowl conductor is in an expanded state when the pedestal 138 and ground bowl 202 are in the elevated processing position and a compressed state when the pedestal 138 and ground bowl 202 are in the lowered position.
  • the ground bowl conductor 210 in the expanded state provides a path for RF energy to propagate.
  • the ground bowl conductor 210 includes conductive materials capable of withstanding the temperature and process environment in the processing volume 106.
  • the ground bowl conductor 210 includes one or more of nickel-base alloy (e.g., HAYNES ® 230 ® alloy), inconel, and stainless steel containing materials.
  • the ground bowl conductor 210 includes a plurality of bellows 212 that expand in the expanded state and compress in the compressed state.
  • the bottom bowl 204 is coupled to the bottom 154 of the chamber body 102 via the bottom bowl conductor 214.
  • the bottom bowl 204 is in the expanded state when the bottom bowl 204 is in the ground position and the compressed state when the bottom bowl 204 is in the transfer position.
  • the bottom bowl conductor 214 in the expanded state provides a path for RF energy to propagate.
  • the bottom bowl conductor 214 includes conductive materials capable of withstanding the temperature and process environment in the processing volume 106.
  • the ground bowl conductor 210 includes one or more of nickel-base alloy (e.g., HAYNES ® 230 ® alloy), inconel, and stainless steel containing materials.
  • the bottom bowl conductor 214 includes a plurality of bellows 216 that expand in the expanded state and compress in the compressed state.
  • the cooling hub 146 is coupled to the bottom bowl carrier 206 by a plurality of bellows 222 to maintain the pressure within processing volume 106.
  • the ground bowl 202 in the lowered position and the bottom bowl 204 in the transfer position (shown in Figure 1 B) facilitate transfer of the substrate 136 to and from the processing volume 106 through a slit valve 148 formed though the chamber body 102.
  • the ground bowl 202 in the elevated processing position and the bottom bowl 204 in the ground position bifurcates the processing volume 106 to form an inner volume 218 of the processing volume 106 that isolates the processing region 110 from the outer volume 220 of the processing volume 106. Isolating the inner volume 218 from the outer volume 220 of the processing volume 106 provides a reduced surface area for RF energy to propagate and eliminates non-symmetries of the chamber body 102, such as those caused by the presence of the slit valve 148, that may cause the formation of a parasitic plasma.
  • the bottom bowl 204 in the ground position contacts the pumping plate 114 to complete a primary RF cage 224 for RF energy to propagate from the faceplate 130 to the RF matching circuit 158.
  • RF energy propagates along the primary RF cage 224 from the faceplate 130 to the pumping plate 114, from the bottom bowl 204 to the ground bowl conductor 210, from the ground bowl conductor 210 to the ground bowl 202, and from the ground bowl 202 to the conductive rod 160.
  • the primary RF cage 224 formed by the bottom bowl 204 in the ground position contacting the pumping plate 114, utilizes the reduced surface area to enable a shorter and more controlled ground path so that parasitic plasma is not generated underneath the pedestal 138 in the inner volume 218. Therefore, the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased, which increases the deposition rate of the film. Furthermore, the primary RF cage 224 is substantially symmetrical to improve the uniformity of the capacitive coupled plasma to improve the uniformity of the deposited film.
  • the bottom bowl 204 in the ground position forms a secondary RF cage 226 in the outer volume 220 if the bottom bowl 204 in the ground position does not contact the pumping plate 114.
  • the secondary RF cage provides containment of RF energy.
  • RF energy propagates along the secondary RF cage 226 from the chamber body 102 to the bottom bowl conductor 214, from the bottom bowl conductor 214 to the bottom bowl 204, and from the bottom bowl 204 to the primary RF cage 224.
  • FIG. 1C and Figure 1 D are schematic cross-sectional views of a CVD chamber 100 having a ground path system 300 disposed therein.
  • the faceplate 130 grounded via the ground path system 300 and the electrode 140, facilitate formation of a capacitive plasma coupling.
  • the ground path system 300 provides a short and symmetrical path for radio frequency (RF) energy to propagate from the faceplate 130 to the RF matching circuit 158 to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity.
  • RF radio frequency
  • the ground path system 300 includes a ground bowl 302.
  • the ground bowl 302 is coupled to the cooling hub 146.
  • the cooling hub 146 is connected to the lift system 162 that moves the ground bowl 302 between the elevated processing position (shown in Figure 1C) and the lowered position (shown in Figure 1 D) that facilitates transfer of the substrate 136.
  • the ground bowl 302 is separated from the pedestal 138.
  • the ground bowl 302 includes conductive materials capable of withstanding a temperature in the processing volume 106 greater than about 700 °C and capable of withstanding a process environment in the process volume 106.
  • the ground bowl 302 one or more of includes inconel, aluminum, and stainless steel containing materials.
  • the ground bowl 302 is coupled to a ground bowl conductor 304.
  • the ground bowl conductor 304 is in a compressed state when the pedestal 138 and ground bowl 302 are in the elevated processing position and an expanded state when the pedestal 138 and ground bowl 302 are in the lowered position.
  • the ground bowl conductor 304 in the compressed state provides a path for RF energy to propagate.
  • the ground bowl conductor 304 includes conductive materials capable of withstanding the temperature in the processing volume 106.
  • the ground bowl conductor 304 includes one or more of nickel-base alloy (e.g., HAYNES ® 230 ® alloy), inconel, and stainless steel containing materials.
  • the ground bowl conductor 304 includes a plurality of bellows 306 that expand in the expanded state and compress in the compressed state.
  • the ground bowl 304 in the lowered position (shown in Figure 1 D) facilitates transfer of the substrate 136 to and from the processing volume 106 through a slit valve 148 formed though the chamber body 102.
  • the ground bowl 304 in the elevated processing position (shown in Figure 1C) bifurcates the processing volume 106 to form an inner volume 308 of the processing volume 106 that isolates the processing region 110 from the outer volume 310 of the processing volume 106.
  • Isolating the inner volume 308 from the outer volume 310 of the processing volume 106 provides a reduced surface area for RF energy to propagate and eliminates non-symmetries of the chamber body 102, such as those caused by presence of the slit valve 148. Non-symmetries of the chamber body 102may cause the formation of a parasitic plasma.
  • the ground bowl conductor 304 in a compressed state contacts the pumping plate 114 to complete a primary RF cage 312 for RF energy to propagate from the faceplate 130 to the RF matching circuit 158.
  • RF energy propagates along the primary RF cage 312 from the faceplate 130 to the ground bowl conductor 304, from the ground bowl conductor 304 to the ground bowl 302, and from the ground bowl 302 to the conductive rod 160.
  • the primary RF cage 312 formed by the ground bowl 302 in the elevated processing position contacting the pumping plate 114, utilizes the reduced surface area to enable a shorter and more controlled ground path so that parasitic plasma is not generated underneath the pedestal 138 in the inner volume 308. Therefore, the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased which increases the deposition rate of the film. Furthermore, the primary RF cage 312 is substantially symmetrical to improve the uniformity of the capacitive coupled plasma to improve the uniformity of the deposited film.
  • the ground bowl 302 in the elevated processing position forms a secondary RF cage 314 in the outer volume 310 if the ground bowl 302 (in the elevated processing position) does not contact the pumping plate 114.
  • the secondary RF cage provides containment of RF energy.
  • RF energy propagates along the secondary RF cage 314 from the chamber body 102 to the ground bowl 302, and from the ground bowl 302 to the primary RF cage 312.
  • ground path systems are describe herein provide a shorter and symmetrical path for (RF energy to propagate to ground to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity.
  • Bifurcating the processing volume of the CVD chamber to form an inner volume that isolates the processing region from the outer volume of the processing volume provides a reduced surface area for RF energy to propagate and eliminates non symmetries of the chamber body.
  • forming a primary RF cage utilizing the reduced surface area enables a shorter and more controlled ground path so that parasitic plasma is not generated underneath the pedestal in the inner volume.
  • the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased which increases the deposition rate of the film.
  • the primary RF cage is substantially symmetrical to improve the uniformity of the capacitive coupled plasma to improve the uniformity of the deposited film.
  • plasma process chambers may benefits from aspects described herein, including plasma process chambers such as physical vapor deposition (PVD) chambers, etch chambers, atomic layer deposition (ALD) chambers, such as plasma-enhanced ALD chambers, and the like.
  • PVD physical vapor deposition
  • ALD atomic layer deposition

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Abstract

Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates an outer volume of the processing volume.

Description

GROUND PATH SYSTEMS FOR PROVIDING A SHORTER AND SYMMETRICAL
GROUND PATH
BACKGROUND
Field
[0001] Embodiments of the present disclosure generally relate to process chambers, such as chemical vapor deposition chambers. More particularly, embodiments of the present disclosure relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground.
Description of the Related Art
[0002] Chemical vapor deposition (CVD) is generally employed to deposit a film on a substrate, such as a semiconductor wafer or transparent substrate used for flat panel displays. CVD is generally accomplished by introducing process gasses into a vacuum chamber that contains a substrate. The precursor gas or gas mixture is typically directed downwardly through a gas distribution assembly situated near the top of the chamber. The gas distribution assembly is placed above a substrate that is positioned on a heated pedestal at a small distance such that the gas distribution assembly and the process gasses are heated by the radiated heat from the pedestal.
[0003] During CVD the process gasses in the chamber may be energized (e.g., excited) into a plasma by applying radio frequency (RF) power to the chamber from one or more RF sources coupled to the chamber, referred to as plasma-enhanced CVD (PECVD). A RF source coupled to the pedestal through a RF matching circuit and a faceplate of the gas distribution assembly grounded to the chamber body facilitate formation of a capacitive plasma coupling. The RF source provides RF energy to the pedestal to facilitate generation of the capacitive coupled plasma, also known as a main plasma, between the pedestal and the faceplate of the gas distribution assembly. However, a parasitic plasma, also known as a secondary plasma, may be generated underneath the pedestal in a lower volume of the vacuum chamber as a byproduct of generating the capacitive coupled plasma and ground path of the faceplate. The parasitic plasma reduces the concentration of the capacitive coupled plasma, and thus reduces the density of the capacitive coupled plasma which reduces the deposition rate of the film. Furthermore, variation of the concentration and density of the parasitic plasma between chambers reduces the uniformity between films formed in separate chambers.
[0004] Accordingly, what are needed in the art are ground path systems for reducing the generation of the parasitic plasma.
SUMMARY
[0005] In one embodiment, a ground path system is provided. The ground path system includes a ground bowl and a bottom bowl configured to be disposed in a chamber. The chamber includes a processing volume, and a pedestal disposed in the processing volume by a stem coupled to a lift system configured to move the pedestal between an elevated processing position and a lowered position. The ground bowl is coupled to the stem and the pedestal by a thermal barrier. A bottom bowl carrier is coupled to a track. The bottom bowl carrier configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position. The bottom bowl is coupled to the ground bowl by a ground bowl conductor, and the bottom bowl is coupled to the chamber by a bottom bowl conductor.
[0006] In another embodiment, a ground path system is provided. The ground path system includes a ground bowl configured to be disposed in a chamber. The chamber includes a processing volume, and a pedestal disposed in the processing volume by a stem coupled to a cooling hub connected to a lift system configured to move the pedestal between an elevated processing position and a lowered position. The ground bowl is coupled to the cooling hub. A ground bowl conductor is coupled to the ground bowl. The ground bowl conductor is in a compressed state when the pedestal and the ground bowl are in the elevated processing position and in an expanded state when the pedestal and ground bowl are in the lowered position.
[0007] In yet another embodiment, a chamber is provided. The chamber includes a chamber body having a processing volume, and a pedestal disposed in the processing volume by a stem coupled to a cooling hub connected to move the pedestal between an elevated processing position and a lowered position. A ground path system is disposed in the chamber body. The ground path system includes a ground bowl coupled to the stem and the pedestal by a thermal barrier and coupled to the cooling hub. A bottom bowl is coupled to the ground bowl by a ground bowl conductor and coupled to the chamber by a bottom bowl conductor. A bottom bowl carrier is coupled to a track. The bottom bowl carrier is configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of scope, as the disclosure may admit to other equally effective embodiments.
[0009] Figure 1A is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
[0010] Figure 1 B is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
[0011] Figure 1C is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
[0012] Figure 1 D is a schematic cross-sectional view of a chemical vapor deposition chamber having a ground path system disposed therein according to an embodiment.
[0013] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
DETAILED DESCRIPTION
[0014] Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates the processing region from the outer volume of the processing volume providing a reduced surface area for RF energy to propagate and eliminates any non-symmetries of the chamber body. Therefore, the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased.
[0015] Figure 1A and Figure 1 B are schematic cross-sectional views of a chemical vapor deposition (CVD) chamber 100 having a ground path system 200 disposed therein. One example of the chamber 100 is a PRECISION™ chamber manufactured by Applied Materials, Inc., located in Santa Clara, Calif. The chamber 100 has a chamber body 102 and a chamber lid 104. The chamber body includes processing volume 106 and a pumping path 108. The processing volume 106 is the space defined by the chamber body and the chamber lid 104, and the pumping path 108 is a path formed in the chamber body 102 coupled to a pumping volume 112 formed in a pumping plate 114.
[0016] The chamber 100 includes a gas distribution assembly 116 disposed through the chamber lid 104 to deliver a flow of one or more gases into a processing region 110 described in detail herein. The gas distribution assembly 116 includes a gas manifold 118 coupled to a gas inlet passage 120 formed in the chamber lid 104. The gas manifold 118 receives the flow of gases from one or more gas sources 122. The flow of gases distributes across a gas box 124, flows through a plurality of holes (not shown) of a backing plate 126, and further distributes across a plenum 128 defined by the backing plate 126 and a faceplate 130. The flow of gases then flows into a processing region 110 of the processing volume 106 through a plurality of holes 132 of the faceplate 130. A pump 133 is connected to the pumping path 108 by a conduit 134 to control the pressure within the processing region 110 and to the exhaust gases and byproducts from the processing region 110 through the pumping volume 112 and pumping path 108.
[0017] The processing volume 106 includes a pedestal 138 for supporting a substrate 136 within the chamber 100. The pedestal 138 includes a heating element (not shown) and an electrode 140 disposed within. In one embodiment, which can be combined with other embodiments described herein, the electrode 140 includes a conductive mesh, such as a tungsten-, copper-, or molybdenum-containing conductive mesh. The pedestal 138 is movably disposed in the processing volume 106 by a stem 142 coupled to a heater clamp 144. The heater clamp 144 is coupled to a cooling hub 146. The cooling hub 146 is connected to a lift system 162 that moves the pedestal 138 between an elevated processing position (shown in Figure 1A) and a lowered position (shown in Figure 1 B). Movement of the pedestal 138 facilitates transfer of the substrate 136 to and from the processing volume 106 through a slit valve 148 formed though the chamber body 102. The elevated processing position corresponds to the processing region 110 defined by the pedestal 138 and faceplate 130 of the gas distribution assembly 116. The pedestal 138 has holes disposed therethrough, through which a plurality of lift pins 150 are movably disposed. In the lowered position, the plurality of lift pins 150 are projected from the pedestal 138 by contacting a lift plate 152 coupled to a bottom 154 of the chamber body. Projection of the lift pins 150 places the substrate 136 in a spaced- apart relation from the pedestal to facilitate the transfer of the substrate 136.
[0018] A RF source 156 is coupled to the electrode 140 disposed within pedestal 138 through a RF matching circuit 158. The RF matching circuit 158 is electrically coupled to the electrode 140 by a conductive rod 160 disposed through the cooling hub 146 and stem 142. The faceplate 130, which is grounded via the ground path system 200, and the electrode 140 facilitate formation of a capacitive plasma coupling. The RF source 156 provides RF energy to the pedestal 138 to facilitate generation of a capacitive coupled plasma, also known as a main plasma, between the pedestal 138 and the faceplate 130 of the gas distribution assembly 116. When RF power is supplied to the electrode 140, an electric filed is generated between the faceplate 130 and pedestal 138 such that atoms of gases present in the processing region 110 between the pedestal 138 and the faceplate 130 are ionized and release electrons. The ionized atoms accelerated to the pedestal 138 to facilitate film formation on the substrate 136.
[0019] The ground path system 200 provides a short and symmetrical path for RF energy to propagate from the faceplate 130 to the RF matching circuit 158 to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity. The ground path system 200 includes a ground bowl 202, and a bottom bowl 204. The ground bowl 202 is coupled to the stem 142 and the pedestal 138 by a thermal barrier 228. The thermal barrier 228 provides a barrier to the pedestal 138 that may be heated up to a temperature greater than about 700 °C. The thermal barrier 228 includes materials having a low thermal conductivity. In one embodiment, which can be combined with other embodiments described herein, the thermal barrier 228 includes one or more of inconel, quartz, aluminum oxide, aluminum nitride, and stainless steel containing materials to provide a barrier to the temperature.
[0020] The ground bowl 202 is also coupled to the cooling hub 146 that is connected to the lift system 162. The lift system 162 moves the ground bowl 202 between the elevated processing position (shown in Figure 1A) and the lowered position (shown in Figure 1 B), facilitating transfer of the substrate 136. The ground bowl 202 includes conductive materials capable of withstanding a temperature in the processing volume 106 greater than about 700 °C and process environment in the processing volume 106. In one embodiment, which can be combined with other embodiments described herein, the ground bowl 202 includes one or more of inconel, aluminum, and stainless steel containing materials. The bottom bowl 204 is coupled to a bottom bowl carrier 206. The bottom bowl carrier 206 is coupled to a track 208. The bottom bowl carrier 206 is actuated to move linearly along the track 208 to move the bottom bowl 204 between a ground position (shown in Figure 1A) and a transfer position (shown in Figure 1 B). The track 208 may also be a rail or cable. The bottom bowl carrier 206 includes conductive materials capable of withstanding the temperature and process environment in the processing volume 106. In one embodiment, which can be combined with other embodiments described herein, the bottom bowl 204 includes one or more of inconel, aluminum, and stainless steel containing materials.
[0021] The ground bowl 202 is coupled to the bottom bowl 204 via the ground bowl conductor 210. The ground bowl conductor is in an expanded state when the pedestal 138 and ground bowl 202 are in the elevated processing position and a compressed state when the pedestal 138 and ground bowl 202 are in the lowered position. The ground bowl conductor 210 in the expanded state provides a path for RF energy to propagate. The ground bowl conductor 210 includes conductive materials capable of withstanding the temperature and process environment in the processing volume 106. In one embodiment, which can be combined with other embodiments described herein, the ground bowl conductor 210 includes one or more of nickel-base alloy (e.g., HAYNES® 230® alloy), inconel, and stainless steel containing materials. In another embodiment, which can be combined with other embodiments described herein, the ground bowl conductor 210 includes a plurality of bellows 212 that expand in the expanded state and compress in the compressed state.
[0022] The bottom bowl 204 is coupled to the bottom 154 of the chamber body 102 via the bottom bowl conductor 214. The bottom bowl 204 is in the expanded state when the bottom bowl 204 is in the ground position and the compressed state when the bottom bowl 204 is in the transfer position. The bottom bowl conductor 214 in the expanded state provides a path for RF energy to propagate. The bottom bowl conductor 214 includes conductive materials capable of withstanding the temperature and process environment in the processing volume 106. In one embodiment, which can be combined with other embodiments described herein, the ground bowl conductor 210 includes one or more of nickel-base alloy (e.g., HAYNES® 230® alloy), inconel, and stainless steel containing materials. In another embodiment, which can be combined with other embodiments described herein, the bottom bowl conductor 214 includes a plurality of bellows 216 that expand in the expanded state and compress in the compressed state. The cooling hub 146 is coupled to the bottom bowl carrier 206 by a plurality of bellows 222 to maintain the pressure within processing volume 106. [0023] The ground bowl 202 in the lowered position and the bottom bowl 204 in the transfer position (shown in Figure 1 B) facilitate transfer of the substrate 136 to and from the processing volume 106 through a slit valve 148 formed though the chamber body 102. The ground bowl 202 in the elevated processing position and the bottom bowl 204 in the ground position (shown in Figure 1A) bifurcates the processing volume 106 to form an inner volume 218 of the processing volume 106 that isolates the processing region 110 from the outer volume 220 of the processing volume 106. Isolating the inner volume 218 from the outer volume 220 of the processing volume 106 provides a reduced surface area for RF energy to propagate and eliminates non-symmetries of the chamber body 102, such as those caused by the presence of the slit valve 148, that may cause the formation of a parasitic plasma.
[0024] Furthermore, the bottom bowl 204 in the ground position contacts the pumping plate 114 to complete a primary RF cage 224 for RF energy to propagate from the faceplate 130 to the RF matching circuit 158. In the inner volume 218, RF energy propagates along the primary RF cage 224 from the faceplate 130 to the pumping plate 114, from the bottom bowl 204 to the ground bowl conductor 210, from the ground bowl conductor 210 to the ground bowl 202, and from the ground bowl 202 to the conductive rod 160. The primary RF cage 224, formed by the bottom bowl 204 in the ground position contacting the pumping plate 114, utilizes the reduced surface area to enable a shorter and more controlled ground path so that parasitic plasma is not generated underneath the pedestal 138 in the inner volume 218. Therefore, the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased, which increases the deposition rate of the film. Furthermore, the primary RF cage 224 is substantially symmetrical to improve the uniformity of the capacitive coupled plasma to improve the uniformity of the deposited film.
[0025] Additionally, the bottom bowl 204 in the ground position forms a secondary RF cage 226 in the outer volume 220 if the bottom bowl 204 in the ground position does not contact the pumping plate 114. The secondary RF cage provides containment of RF energy. In the outer volume 220, RF energy propagates along the secondary RF cage 226 from the chamber body 102 to the bottom bowl conductor 214, from the bottom bowl conductor 214 to the bottom bowl 204, and from the bottom bowl 204 to the primary RF cage 224.
[0026] Figure 1C and Figure 1 D are schematic cross-sectional views of a CVD chamber 100 having a ground path system 300 disposed therein. The faceplate 130, grounded via the ground path system 300 and the electrode 140, facilitate formation of a capacitive plasma coupling. The ground path system 300 provides a short and symmetrical path for radio frequency (RF) energy to propagate from the faceplate 130 to the RF matching circuit 158 to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity.
[0027] The ground path system 300 includes a ground bowl 302. The ground bowl 302 is coupled to the cooling hub 146. The cooling hub 146 is connected to the lift system 162 that moves the ground bowl 302 between the elevated processing position (shown in Figure 1C) and the lowered position (shown in Figure 1 D) that facilitates transfer of the substrate 136. The ground bowl 302 is separated from the pedestal 138. The ground bowl 302 includes conductive materials capable of withstanding a temperature in the processing volume 106 greater than about 700 °C and capable of withstanding a process environment in the process volume 106. In one embodiment, which can be combined with other embodiments described herein, the ground bowl 302 one or more of includes inconel, aluminum, and stainless steel containing materials.
[0028] The ground bowl 302 is coupled to a ground bowl conductor 304. The ground bowl conductor 304 is in a compressed state when the pedestal 138 and ground bowl 302 are in the elevated processing position and an expanded state when the pedestal 138 and ground bowl 302 are in the lowered position. The ground bowl conductor 304 in the compressed state provides a path for RF energy to propagate. The ground bowl conductor 304 includes conductive materials capable of withstanding the temperature in the processing volume 106. In one embodiment, the ground bowl conductor 304 includes one or more of nickel-base alloy (e.g., HAYNES® 230® alloy), inconel, and stainless steel containing materials. In another embodiment, which can be combined with other embodiments described herein, the ground bowl conductor 304 includes a plurality of bellows 306 that expand in the expanded state and compress in the compressed state. [0029] The ground bowl 304 in the lowered position (shown in Figure 1 D) facilitates transfer of the substrate 136 to and from the processing volume 106 through a slit valve 148 formed though the chamber body 102. The ground bowl 304 in the elevated processing position (shown in Figure 1C) bifurcates the processing volume 106 to form an inner volume 308 of the processing volume 106 that isolates the processing region 110 from the outer volume 310 of the processing volume 106. Isolating the inner volume 308 from the outer volume 310 of the processing volume 106 provides a reduced surface area for RF energy to propagate and eliminates non-symmetries of the chamber body 102, such as those caused by presence of the slit valve 148. Non-symmetries of the chamber body 102may cause the formation of a parasitic plasma.
[0030] Furthermore, when the pedestal 138 and the ground bowl 302 are in the elevated processing position, the ground bowl conductor 304 in a compressed state contacts the pumping plate 114 to complete a primary RF cage 312 for RF energy to propagate from the faceplate 130 to the RF matching circuit 158. In the inner volume 308, RF energy propagates along the primary RF cage 312 from the faceplate 130 to the ground bowl conductor 304, from the ground bowl conductor 304 to the ground bowl 302, and from the ground bowl 302 to the conductive rod 160. The primary RF cage 312, formed by the ground bowl 302 in the elevated processing position contacting the pumping plate 114, utilizes the reduced surface area to enable a shorter and more controlled ground path so that parasitic plasma is not generated underneath the pedestal 138 in the inner volume 308. Therefore, the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased which increases the deposition rate of the film. Furthermore, the primary RF cage 312 is substantially symmetrical to improve the uniformity of the capacitive coupled plasma to improve the uniformity of the deposited film.
[0031] Additionally, the ground bowl 302 in the elevated processing position forms a secondary RF cage 314 in the outer volume 310 if the ground bowl 302 (in the elevated processing position) does not contact the pumping plate 114. The secondary RF cage provides containment of RF energy. In the outer volume 310, RF energy propagates along the secondary RF cage 314 from the chamber body 102 to the ground bowl 302, and from the ground bowl 302 to the primary RF cage 312.
[0032] In summation, ground path systems are describe herein provide a shorter and symmetrical path for (RF energy to propagate to ground to reduce generation of the parasitic plasma, and thus increase deposition rate and improve film uniformity. Bifurcating the processing volume of the CVD chamber to form an inner volume that isolates the processing region from the outer volume of the processing volume provides a reduced surface area for RF energy to propagate and eliminates non symmetries of the chamber body. Furthermore, forming a primary RF cage utilizing the reduced surface area enables a shorter and more controlled ground path so that parasitic plasma is not generated underneath the pedestal in the inner volume. Therefore, the concentration of the capacitive coupled plasma is increased, and thus the density of the capacitive coupled plasma is increased which increases the deposition rate of the film. Furthermore, the primary RF cage is substantially symmetrical to improve the uniformity of the capacitive coupled plasma to improve the uniformity of the deposited film.
[0033] While aspects herein are described with respect to CVD chambers, and plasma-enhanced configurations thereof, it is contemplated that other process chambers may benefit from aspects of the disclosure. For example, plasma process chambers may benefits from aspects described herein, including plasma process chambers such as physical vapor deposition (PVD) chambers, etch chambers, atomic layer deposition (ALD) chambers, such as plasma-enhanced ALD chambers, and the like.
[0034] While the foregoing is directed to examples of the present disclosure, other and further examples of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

What is claimed is:
1. A ground path system, comprising:
a chamber having a processing volume;
a ground bowl and a bottom bowl disposed in the chamber; and
a pedestal disposed in the processing volume by a stem coupled to a lift system configured to move the pedestal between an elevated processing position and a lowered position;
a thermal barrier coupling the ground bowl to the pedestal; and
a bottom bowl carrier coupled to a track, the bottom bowl carrier configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position, the bottom bowl coupled to the ground bowl by a ground bowl conductor, and the bottom bowl coupled to the chamber by a bottom bowl conductor.
2. The system of claim 1 , wherein the stem coupled to a heater clamp that is coupled to a cooling hub, the cooling hub connected to the lift system.
3. The system of claim 2, wherein the ground bowl in the elevated processing position and the bottom bowl in the ground position bifurcates the processing volume to form an inner volume of the processing volume isolated from an outer volume of the processing volume.
4. The system of claims 1 or 3, further comprising a radio frequency (RF) source coupled to an electrode disposed within the pedestal through a RF matching circuit electrically coupled to the electrode by a conductive rod disposed through the cooling hub and the stem.
5. The system of claims 1 , 2, 3, or 4, further comprising a faceplate disposed vertically above the pedestal.
6. The system of claim 5, wherein the bottom bowl in the ground position contacts a pumping plate of the chamber to a form a primary RF cage for RF energy to propagate from the faceplate to the RF matching circuit.
7. The system of claims 1 , 2, 3, 4, 5, or 6, wherein the ground bowl in the lowered position and the bottom bowl in the transfer position facilitate transfer of a substrate to and from the processing volume through a slit valve formed though the the chamber.
8. A ground path system, comprising:
a ground bowl configured to be disposed in a chamber, the chamber having: a processing volume; and
a pedestal disposed in the processing volume by a stem coupled to a cooling hub connected to a lift system configured to move the pedestal between an elevated processing position and a lowered position;
the ground bowl coupled to the cooling hub; and
a ground bowl conductor coupled to the ground bowl, the ground bowl conductor in a compressed state when the pedestal and the ground bowl are in the elevated processing position and in an expanded state when the pedestal and ground bowl are in the lowered position.
9. The system of claim 8, wherein the ground bowl in the elevated processing position bifurcates the processing volume to form an inner volume of the processing volume isolated from an outer volume of the processing volume.
10. The system of claims 8 or 9, further comprising a radio frequency (RF) source coupled to an electrode disposed within the pedestal through a RF matching circuit electrically coupled to the electrode by a conductive rod disposed through the cooling hub and the stem.
11. The system of claims 8, 9, or 10, further comprising a faceplate disposed vertically above the pedestal.
12. The system of claim 11 , wherein the ground bowl conductor is in a compressed state when the pedestal and the ground bowl in the elevated processing position contacts a pumping plate of the chamber to form a primary RF cage for RF energy to propagate from the faceplate to the RF matching circuit.
13. The system of claims 8, 9, 10, 11 , or 12, wherein the ground bowl in the lowered position facilitates transfer of a substrate to and from the processing volume through a slit valve formed though the chamber.
14. The system of claims 8, 9, 10, 11 , 12, or 13, wherein a heater clamp is coupled to the cooling hub.
15. A chemical vapor deposition (CVD) chamber, comprising:
a chamber body having a processing volume; and
a pedestal disposed in the processing volume by a stem coupled to a cooling hub connected to move the pedestal between an elevated processing position and a lowered position; and
a ground path system disposed in the chamber body, the ground path system comprising:
a ground bowl coupled to the stem and the pedestal by a thermal barrier and coupled to the cooling hub;
a bottom bowl coupled to the ground bowl by a ground bowl conductor and coupled to the chamber by a bottom bowl conductor; and
a bottom bowl carrier coupled to a track, the bottom bowl carrier configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position.
PCT/US2019/030733 2018-05-25 2019-05-03 Ground path systems for providing a shorter and symmetrical ground path Ceased WO2019226294A1 (en)

Priority Applications (7)

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SG11202009022RA SG11202009022RA (en) 2018-05-25 2019-05-03 Ground path systems for providing a shorter and symmetrical ground path
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