WO2019222919A1 - Dispositif électronique souple et procédé de détermination de sa position de flexion - Google Patents

Dispositif électronique souple et procédé de détermination de sa position de flexion Download PDF

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Publication number
WO2019222919A1
WO2019222919A1 PCT/CN2018/087865 CN2018087865W WO2019222919A1 WO 2019222919 A1 WO2019222919 A1 WO 2019222919A1 CN 2018087865 W CN2018087865 W CN 2018087865W WO 2019222919 A1 WO2019222919 A1 WO 2019222919A1
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Prior art keywords
layer
electronic device
flexible
bending position
flexible electronic
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PCT/CN2018/087865
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English (en)
Chinese (zh)
Inventor
林源城
苏伟盛
施文杰
Original Assignee
深圳市柔宇科技有限公司
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201880093888.4A priority Critical patent/CN112449692A/zh
Priority to PCT/CN2018/087865 priority patent/WO2019222919A1/fr
Publication of WO2019222919A1 publication Critical patent/WO2019222919A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present application relates to the field of flexible display technology, and in particular, to a flexible electronic device and a method for determining a bending position thereof.
  • the embodiment of the present application discloses a flexible electronic device and a method for determining a bending position thereof, so as to solve the foregoing problems.
  • An embodiment of the present application discloses a flexible electronic device including a flexible substrate, a flexible display component, a piezoelectric sensing component, and a processor.
  • the flexible display component is stacked on the flexible substrate. Two adjacent side walls are provided with a recessed portion along the peripheral direction of the flexible display component.
  • the piezoelectric sensing component includes at least two piezoelectric sensing units, and the at least two piezoelectric sensing units are disposed at Inside the recessed portion, and each of the side walls corresponds to at least one of the piezoelectric sensing units, and when the flexible electronic device is bent, the piezoelectric sensing unit corresponding to a bending position of the flexible electronic device is generated
  • the corresponding bending position identification signal the processor determines a bending position according to the bending position identification signal, and adjusts the content display of the flexible display component according to the bending position.
  • the embodiment of the present application discloses a method for determining a bending position, and the method for determining a bending position is applied to the flexible electronic device.
  • the bending position determining method includes the steps of: when the flexible electronic device is bent, the piezoelectric sensing unit corresponding to the bending position of the flexible electronic device generates a corresponding bending position identification signal; according to the bending The folding position identification signal determines a folding position; and adjusts the content display of the flexible electronic device according to the folding position.
  • the flexible electronic device and the bending position determining method of the present application can determine the bending position of the flexible electronic device at an arbitrary position through the piezoelectric sensing component, so that the flexible electronic device can adjust the display according to the bending position. Content with a better user experience.
  • FIG. 1 is a schematic cross-sectional structure diagram of a flexible electronic device in a first embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a flexible electronic device according to an embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional structure diagram of a flexible electronic device in a second embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional structure diagram of a flexible electronic device in a third embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional structure diagram of a flexible electronic device in a fourth embodiment of the present application.
  • 6a and 6b are equivalent circuit diagrams of a piezoelectric induction unit in an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of the flexible electronic device 1 after removing all the laminated structures on the anode layer in an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a bending position of a flexible display component according to an embodiment of the present application.
  • FIG. 9 is a schematic cross-sectional structure of a solder joint in an embodiment of the present application.
  • FIG. 10 is a schematic flowchart of a method for determining a bending position of a flexible electronic device according to an embodiment of the present application.
  • Flexible electronic device 1 Flexible substrate 10 Flexible display components 30 Piezo Inductive Components 50
  • processor 70 Side wall 301 Recess 302 Piezo Induction Unit 51 Display area X1 Non-display area F1 Anode layer 31 Luminescent layer 32 Cathode layer 33 Hole transport layer 34 Electron transport layer 35 Flexible display components 30a, 30b, 30c Thin film transistor array 36 First inorganic layer 37 Organic layer 38 Second inorganic layer 39 Anode unit 311 Pad area 80 Solder joint 81 Bend position H1, H2, H3, V1, V2, V3 Insulation 811 Metal conductive layer 812 The protective layer 813 Protective layer opening 8131 Flattening layer 814 Planar opening 8141 Overlap layer 815
  • FIG. 1 is a schematic cross-sectional structure diagram of a flexible electronic device 1 according to a first embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a flexible electronic device according to an embodiment of the present application.
  • the flexible electronic device 1 includes a flexible substrate 10, a flexible display component 30, a piezoelectric sensing component 50, and a processor 70.
  • the flexible display component 30 is stacked on the flexible substrate 10.
  • the flexible substrate 10 is used to provide support for the flexible display assembly 30.
  • the flexible display component 30 is used to provide content display.
  • a recessed portion 302 is defined in at least two adjacent sidewalls 301 of the flexible display component 30 along a circumferential direction of the flexible display component 30.
  • the piezoelectric sensing component 50 includes at least two piezoelectric sensing units 51.
  • the at least two piezoelectric sensing units 51 are disposed in the recessed portion 302, and each of the side walls 301 is correspondingly provided with at least one of the piezoelectric sensing units 51.
  • the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 generates a corresponding bending position identification signal.
  • the processor 70 determines a bending position according to the bending position identification signal, and adjusts the content display of the flexible display component 30 according to the bending position.
  • the processor 70 can determine the bending position on the flexible electronic device 1 through the bending position identification signal generated by the piezoelectric sensing component 50, and can adjust the flexible display component according to the bending position. 30 content shows that has a better user experience.
  • the flexible substrate 10 may be, but is not limited to, a polymer plastic substrate, a metal foil substrate, an ultra-thin glass substrate, a paper substrate, and the like.
  • the polymer plastic substrate may be made of, but not limited to, polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), and polysulfone ether ( PES), polyethylene terephthalate (PEN), polyimide (PI) and other materials.
  • PE polyethylene
  • PP polypropylene
  • PS polystyrene
  • PET polyethylene terephthalate
  • PES polysulfone ether
  • PEN polyethylene terephthalate
  • PI polyimide
  • the flexible display component 30 has a display area X1 and a non-display area F1 provided around a periphery of the display area X1.
  • the display area X1 is used to provide content display.
  • the recessed portion 302 is located in the non-display area F1. Therefore, the arrangement of the at least two piezoelectric sensing units 51 does not affect the content display of the display area X1 of the flexible display component 30.
  • the extending direction of the recessed portion 302 may be parallel to the surface of the flexible display component 30, or may be in a non-parallel wave shape.
  • the flexible display component 30 includes an anode layer 31, a light emitting layer 32, and a cathode layer 33.
  • the anode layer 31 is stacked on the flexible substrate 10.
  • the light emitting layer 32 is stacked on the anode layer 31.
  • the cathode layer 33 is stacked on the light emitting layer 32.
  • the anode layer 31 is generally made of a conductive material having a high work function and good light transmittance.
  • the anode layer 31 is a metal conductive film made of indium tin oxide (ITO).
  • ITO indium tin oxide
  • the light emitting layer 32 is generally prepared by using a fluorescent dopant doped in a fluorescent host material.
  • the cathode layer 33 is generally made of an organic metal with a low work function.
  • the cathode layer 33 is an organic thin film metal electrode prepared by an evaporation method.
  • a positive DC voltage of 2 to 10 V is applied to the anode layer 31 and the cathode layer 33 is grounded, the holes generated by the anode layer 31 and the electrons generated by the cathode layer 33 move to each other, and The light emitting layers 32 meet.
  • energy excitons are generated, thereby exciting light-emitting molecules to finally generate visible light.
  • the recessed portion 302 may be provided in a stack formed by any one of the anode layer 31, the light-emitting layer 32, and the cathode layer 33, any two adjacent layers, or three adjacent layers. A structure corresponding to the non-display area F1. Referring to FIG. 1, in this embodiment, the recessed portion 302 is disposed in a region of the anode layer 31 corresponding to the non-display region F1.
  • the at least two piezoelectric sensing units 51 are sequentially disposed in the recessed portion 302. Therefore, when the flexible electronic device 1 is bent, the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 can sense the bending behavior of the flexible electronic device 1 and generate a corresponding response. Identification signal of the bending position.
  • the processor 70 can determine a bending position according to the bending position identification signal.
  • FIG. 3 is a schematic cross-sectional structure diagram of the flexible electronic device 1 in the second embodiment of the present application.
  • the flexible display component 30 a shown in FIG. 3 is similar to the flexible display component 30 shown in FIG. 1, except that the flexible display component 30 a further includes a hole transport layer 34 and an electron transport layer 35.
  • the hole transport layer 34 is disposed between the anode layer 31 and the light emitting layer 32.
  • the electron transport layer 35 is disposed between the light emitting layer 32 and the cathode layer 33.
  • the hole-transporting layer 34 is generally made of a class of aromatic amine compounds, which has good thermal stability and can help the holes generated by the anode layer 31 move to the light-emitting layer 32.
  • the electron transport layer 35 is generally made of a fluorescent dye compound, which has good thermal stability and surface stability, and can help the electrons released by the cathode layer 33 to be smoothly transferred to the light emitting layer 32. Therefore, the light emitting efficiency of the flexible display component 30a can be improved, and the holes and electrons in the light emitting layer 32 caused by the mobility of holes in the anode layer 31 and the mobility of electrons in the cathode layer 33 can be avoided. The imbalance of the implantation further reduces the luminous efficiency.
  • the recessed portion 302 may be provided in any one of the anode layer 31, the hole transport layer 34, the light emitting layer 32, the electron transport layer 35, and the cathode layer 33.
  • the recessed portion 302 is disposed in a region of the anode layer 31 corresponding to the non-display region F1.
  • the at least two piezoelectric sensing units 51 are sequentially disposed in the recessed portion 302.
  • the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 can sense the bending behavior of the flexible electronic device 1 and generate a corresponding response. Identification signal of the bending position.
  • the processor 70 can determine a bending position according to the bending position identification signal.
  • FIG. 4 is a schematic cross-sectional structure diagram of the flexible electronic device 1 in the third embodiment of the present application.
  • the flexible display component 30b shown in FIG. 4 is similar to the flexible display component 30a shown in FIG. 3, except that in this embodiment, the flexible display component 30 adopts an active driving method, that is, the flexible display component 30b further includes a thin film transistor array 36, which is disposed between the flexible substrate 10 and the anode layer 31.
  • Each thin film transistor in the thin film transistor array 36 corresponds to one of the light emitting layers 32.
  • the thin-film transistor corresponding to the pixel in the thin-film transistor array 36 is turned on to drive the pixel and cause it to emit light continuously.
  • the above active driving method does not require scanning, the power supply current is constant, high peak current is not required, and power consumption is lower.
  • the recessed portion 302 may be provided in any one of the thin film transistor array 36, the anode layer 31, the hole transport layer 34, the light emitting layer 32, the electron transport layer 35, and the cathode layer 33, and any two adjacent layers , An area corresponding to the non-display area F1 in a layered structure formed by any three adjacent layers, any four adjacent layers, any five adjacent layers, or six adjacent layers. Please refer to FIG. 4 again.
  • the recessed portion 302 is disposed in a region of the anode layer 31 corresponding to the non-display region F1.
  • the at least two piezoelectric sensing units 51 are sequentially disposed in the recessed portion 302.
  • the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 can sense the bending behavior of the flexible electronic device 1 and generate a corresponding response. Identification signal of the bending position.
  • the processor 70 can thereby determine a bending position according to the bending position identification signal.
  • FIG. 5 is a schematic cross-sectional structure diagram of the flexible electronic device 1 in the fourth embodiment of the present application.
  • the flexible display component 30c shown in FIG. 5 is similar to the flexible display component 30b shown in FIG. 4, except that in this embodiment, the flexible display component 30c further includes a first inorganic layer 37, an organic layer 38, and a second Inorganic layer 39.
  • the first inorganic layer 37 is stacked on a side of the cathode layer 33 facing away from the anode layer 31.
  • the organic layer 38 is stacked on a side of the first inorganic layer 37 facing away from the anode layer 31.
  • the second inorganic layer 39 is disposed on a side of the organic layer 38 facing away from the anode layer 31.
  • the first inorganic layer 37, the organic layer 38, and the second inorganic layer 39 collectively constitute an encapsulation layer.
  • the first inorganic layer 37, the organic layer 38, and the second inorganic layer 39 provide protection for the flexible display component 30c
  • the recessed portion 302 is disposed on the thin film transistor array 36, the anode layer 31, the hole transport layer 34, the light emitting layer 32, the electron transport layer 35, the cathode layer 33, the first inorganic layer 37, the organic layer 38, and the first layer. Any one of the two inorganic layers 39, any two adjacent layers, any three adjacent layers, any four adjacent layers, any five adjacent layers, any six adjacent layers, and any seven adjacent layers In an area corresponding to the non-display area F1 in a layered structure formed by any adjacent eight or nine layers. In this embodiment, the recessed portion 302 is disposed in a region of the anode layer 31 corresponding to the non-display region F1.
  • the at least two piezoelectric sensing units 51 are sequentially disposed in the recessed portion 302, so that when the flexible electronic device 1 is bent, the pressure corresponding to the bending position of the flexible electronic device 1 is
  • the electrical sensing unit 51 can sense the bending behavior of the flexible electronic device 1 and generate a corresponding bending position identification signal.
  • the processor 70 can thereby determine a bending position according to the bending position identification signal.
  • the recessed portion 302 may also be disposed in a region corresponding to the non-display region F1 among other layers included in the flexible display component 30, for example, a hole injection layer, an electron Injection layer, etc.
  • FIG. 6 a and FIG. 6 b are equivalent circuit diagrams of the piezoelectric induction unit 51.
  • the piezoelectric sensing unit 51 is a piezoelectric sensor. When the piezoelectric sensing unit 51 is compressed / stretched, the piezoelectric material generates a piezoelectric effect. The two polar surfaces of the piezoelectric sensing unit 51 have opposite polarities but the same amount of electricity. Charge.
  • ⁇ a piezoelectric constant
  • S a force area
  • d a distance between two electrode plates of the piezoelectric induction unit 51.
  • the piezoelectric sensing unit 51 generates a voltage when it is bent, and therefore, the voltage of the flexible display assembly 30 can be determined according to whether the piezoelectric sensing unit 51 at a corresponding position of the flexible display assembly 30 generates a voltage. Whether the position is bent. Specifically, the piezoelectric induction unit 51 generates a voltage when it is bent, and the processor 70 determines the flexible display assembly 30 when a voltage is generated by the piezoelectric induction unit 51 at a position corresponding to the flexible display assembly 30.
  • This position is bent; the piezoelectric sensing unit 51 does not generate a voltage when there is no bending, and the processor 70 generates no voltage when the piezoelectric sensing unit 51 at a corresponding position of the flexible display component 30 does not generate a voltage. It is determined that the position of the flexible display assembly 30 is not bent.
  • each piezoelectric sensing unit 51 is set corresponding to a bending position, and the bending position is stored, and specifically stored in the form of a correspondence table between the piezoelectric sensing unit and the bending position.
  • the processor 70 determines that the bending position corresponding to the piezoelectric sensing unit 51 is bent according to a correspondence table between the piezoelectric sensing unit and the bending position.
  • FIG. 7 is a schematic structural diagram of the flexible electronic device 1 after removing all the laminated structures on the anode layer 31 in an embodiment of the present application.
  • the anode layer 31 includes at least two anode units 311 and is arranged in an array.
  • the recessed portion 302 is disposed only at two adjacent sides of the flexible display component 30 corresponding to the non-display area F1. It can be understood that, in other embodiments, the recessed portion 302 may also be disposed at positions of four sides of the flexible display component 30 corresponding to the non-display area F1.
  • the piezoelectric display units 51 are correspondingly provided on all edges of the flexible display component 30, when any two piezoelectric display units 51 of the flexible display component 30 generate a voltage, the flexibility can be determined.
  • the bending position of the display unit 30 is a bending line.
  • the processor 70 adjusts the content display of the flexible display component 30 according to the bend line, for example, adjusts the flexible display component 30 to display the screen in accordance with the bend line according to the bend line.
  • the piezoelectric sensing unit 51 is in a strip shape, and the at least two piezoelectric sensing units 51 are spaced apart from each other and sequentially housed in the recessed portion 302, and are respectively separated from the recessed portion 302.
  • the structure of the corresponding position is adapted. It can be understood that, in other embodiments, the voltage sensing unit 51 may be arranged in other shapes, and any two adjacent piezoelectric sensing units 51 of the at least two piezoelectric sensing units 51 may be arranged next to each other.
  • the flexible electronic device 1 includes a pad region 80.
  • the pad region 80 is provided with at least two solder joints 81, the at least two solder joints 81 are respectively electrically connected to the processor 70, and the at least two piezoelectric sensing units 51 are connected to the at least two solder joints 81.
  • Points 81 correspond one-to-one.
  • a metal lead 511 is provided on the front and back of each piezoelectric sensing unit 51, and the metal lead 511 electrically connects the piezoelectric sensing unit 51 and the corresponding solder joint 81.
  • each solder joint 81 is electrically connected to the processor 70, so that the processor 70 can determine the bending of the flexible display component 30 according to the bending position identification signal generated by the piezoelectric sensing unit 51. Folded position.
  • the number of the at least one piezoelectric sensing unit 51 is six, three of which correspond to the lateral bending positions H1, H2, H3, and the other three correspond to Vertical bending positions V1, V2 and V3.
  • the number of the metal leads 511 is also six.
  • the number of the solder joints 81 is also six. Each metal lead 511 electrically connects a corresponding piezoelectric sensing unit 51 and a corresponding solder joint 81.
  • the voltages of the piezoelectric induction units 51 corresponding to the three bending positions H1, H2, and H3 are equal.
  • the voltage of the piezoelectric induction unit 51 corresponding to the bending position H2 is greater than the voltage corresponding to the other two bending positions H1 and H3.
  • the voltage of the electric induction unit 51 Therefore, it can be determined whether the corresponding bending position of the flexible electronic device 1 is bent according to whether the piezoelectric sensing unit 51 generates a voltage.
  • the number, length, and interval length of the adjacent piezoelectric sensing units 51 may be determined according to the bending radius and sensitivity requirements of the flexible electronic device 1.
  • FIG. 9 is a schematic cross-sectional structure diagram of a solder joint 81 in an embodiment of the present application.
  • the solder joint 81 includes an insulating layer 811, a metal conductive layer 812, a protective layer 813, a planarization layer 814, and an overlap layer 815, which are disposed on top of each other.
  • the protective layer 813 is disposed on the metal conductive layer 812 and surrounds the metal conductive layer 812.
  • the protective layer 813 is provided with a protective layer opening 8131, and the metal conductive 812 layer is exposed from the protective layer opening 8131.
  • the planarizing layer 814 is disposed on the protective layer 813 and surrounds the protective layer 813.
  • the planarizing layer 814 is provided with a planarizing layer opening 8141 at a position corresponding to the protective layer opening 8131.
  • a bonding layer 815 overlaps one of the planarization layer 814, the planarization layer opening 8141, and the protective layer opening 8131, and the metal lead 511 of the piezoelectric sensing unit 51 overlaps the bonding layer.
  • the metal conductive layer 812 is electrically connected to the processor 70.
  • FIG. 10 is a schematic flowchart of a method for determining a bending position according to an embodiment of the present application.
  • the bending position determination method is applied to the aforementioned flexible electronic device 1, and the execution order is not limited to the order shown in FIG. 10.
  • the method includes steps:
  • step 101 when the flexible electronic device 1 is bent, the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 generates a corresponding bending position identification signal.
  • the piezoelectric sensing unit 51 is a piezoelectric sensor.
  • the piezoelectric sensing unit 51 When the piezoelectric sensing unit 51 is compressed / stretched, the piezoelectric material generates a piezoelectric effect, and charges with opposite polarities but equal electric charges appear on two polar surfaces. That is, the piezoelectric induction unit 51 generates a voltage when it is bent.
  • Step 102 Determine a bending position according to the bending position identification signal.
  • the processor 70 determines a bending position according to the bending position identification signal.
  • the processor 70 determines whether the position of the flexible display component 30 is bent according to whether the piezoelectric sensing unit 51 at the corresponding position of the flexible display component 30 generates a voltage.
  • the piezoelectric induction unit 51 generates a voltage when it is bent, and the processor 70 determines the flexible display assembly 30 when a voltage is generated by the piezoelectric induction unit 51 at a position corresponding to the flexible display assembly 30. This position is bent; the piezoelectric sensing unit 51 does not generate a voltage when there is no bending, and the processor 70 generates no voltage when the piezoelectric sensing unit 51 at a corresponding position of the flexible display component 30 does not generate a voltage. It is determined that the position of the flexible display assembly 30 is not bent.
  • each piezoelectric sensing unit 51 is set corresponding to a bending position, and the bending position is stored, and specifically stored in the form of a correspondence table between the piezoelectric sensing unit and the bending position.
  • the processor 70 determines that the bending position corresponding to the piezoelectric sensing unit 51 is bent according to a correspondence table between the piezoelectric sensing unit and the bending position.
  • Step 103 Adjust the content display of the flexible display component 30 according to the bending position.
  • the processor 70 adjusts the content display of the flexible electronic device 1 according to the bending position, for example, adjusts the split screen and the like according to the bending position.
  • the flexible electronic device and the bending position determining method of the present application can determine the bending position at any position of the flexible electronic device in real time through a piezoelectric sensing component, so that the flexible electronic device can adjust the display according to the bending surrounding. Content with a better user experience.
  • the processor 70 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), and application-specific integrated circuits (ASICs). ), Ready-made programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.
  • the general-purpose processor may be a microprocessor, or the processor may be any conventional processor, etc.
  • the processor is a control center of the flexible electronic device 1 and uses various interfaces and lines to connect the entire flexible electronic device. Various parts of the device 1.
  • the flexible electronic device 1 further includes a memory (not shown), and various data of the flexible electronic device 1 can be stored in the memory.
  • the memory may be specifically used to store the computer program and / or module, and the processor 70 runs or executes the computer program and / or module stored in the memory and calls data stored in the memory. Realize various functions of the flexible electronic device 1.
  • the memory may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, application programs required for multiple functions (such as a sound playback function, an image playback function, etc.), etc .; the storage data area may store Data (such as audio data, phone book, etc.) created based on the use of the mobile phone.
  • the memory may include a high-speed random access memory, and may also include a non-volatile memory, such as a hard disk, an internal memory, a plug-in hard disk, a Smart Media Card (SMC), and a Secure Digital (SD). ) Card, flash memory card (Flash card), multiple disk storage devices, flash memory devices, or other volatile solid-state storage devices.
  • a non-volatile memory such as a hard disk, an internal memory, a plug-in hard disk, a Smart Media Card (SMC), and a Secure Digital (SD).
  • SSD Secure Digital

Abstract

La présente invention concerne un dispositif électronique souple, comprenant un substrat souple, un composant d'affichage souple, un composant de détection piézoélectrique et un processeur. Le composant d'affichage souple est empilé sur le substrat souple ; des parties d'évidement sont formées sur au moins deux parois latérales adjacentes du composant d'affichage souple le long d'une direction périphérique du composant d'affichage souple ; le composant de détection piézoélectrique comprend au moins deux unités de détection piézoélectriques, qui sont disposées dans les parties d'évidement, et chaque paroi latérale correspond à au moins une unité de détection piézoélectrique ; lorsque le dispositif électronique souple est fléchi, l'unité de détection piézoélectrique correspondante génère un signal d'identification de position de flexion correspondant, et le processeur détermine la position de flexion selon le signal d'identification de position de flexion, et règle l'affichage du contenu sur le composant d'affichage souple selon la position de flexion. La présente invention concerne également un procédé de détermination de position de flexion. Selon la présente invention, une position de flexion à une position quelconque du dispositif électronique souple peut être obtenue en temps réel au moyen du composant de détection piézoélectrique, et le processeur peut ainsi régler l'affichage du contenu sur le dispositif électronique souple en fonction de la position de flexion.
PCT/CN2018/087865 2018-05-22 2018-05-22 Dispositif électronique souple et procédé de détermination de sa position de flexion WO2019222919A1 (fr)

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CN201880093888.4A CN112449692A (zh) 2018-05-22 2018-05-22 柔性电子装置及其弯折位置确定方法
PCT/CN2018/087865 WO2019222919A1 (fr) 2018-05-22 2018-05-22 Dispositif électronique souple et procédé de détermination de sa position de flexion

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