WO2019215977A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2019215977A1
WO2019215977A1 PCT/JP2019/005216 JP2019005216W WO2019215977A1 WO 2019215977 A1 WO2019215977 A1 WO 2019215977A1 JP 2019005216 W JP2019005216 W JP 2019005216W WO 2019215977 A1 WO2019215977 A1 WO 2019215977A1
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WO
WIPO (PCT)
Prior art keywords
housing
heat sink
control device
electronic control
opening
Prior art date
Application number
PCT/JP2019/005216
Other languages
French (fr)
Japanese (ja)
Inventor
宙 南部
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Priority to JP2020518142A priority Critical patent/JP7112486B2/en
Publication of WO2019215977A1 publication Critical patent/WO2019215977A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to an electronic control device.
  • Patent Document 1 discloses a structure of a casing of an electronic device that exposes a heat dissipation component to the outside of the casing.
  • This housing accommodates a plurality of printed circuit boards on which electronic components are mounted.
  • the housing includes a wall surface board, a housing-side connector, a board-side connector, a heat sink, and a radiator.
  • the wall board constitutes one wall surface of the housing and has a slit penetrating outside the housing.
  • the housing-side connector includes a slit that is fixed to the inside of the wall surface board and communicates with the slit.
  • the board-side connector is fitted to a housing-side connector disposed on one end side of the printed board.
  • the heat sink is in contact with electronic components on the printed circuit board.
  • the radiator is inserted from the outside of the casing through the slit, and one end side is in surface contact with the heat sink, and the other end side protrudes outside the casing.
  • Patent Document 1 dissipates heat generated by electronic components from the radiator to the outside of the housing.
  • a heat sink and a radiator are required.
  • the present invention has been made in view of the above problems, and an object thereof is to provide an electronic control device capable of improving heat dissipation with a simple structure.
  • an electronic control device includes a bottomed cylindrical casing having an opening at one end, and a control board inserted into the casing from the opening.
  • the housing includes a slit that is inserted into a part of the heat sink attached to the control board accommodated in the casing and exposes a part of the heat sink to the outside of the casing. Formed.
  • heat dissipation can be improved with a simple structure.
  • FIG. 1 is an external perspective view of an electronic control device according to a first embodiment.
  • FIG. 1 is an external perspective view of the electronic control device according to the first embodiment.
  • the electronic control device of this embodiment includes a resin casing 10 and a printed circuit board 20 (see FIG. 3) as an example of a “control board” accommodated in the casing 10.
  • the housing 10 is formed in a bottomed cylindrical shape having one end serving as an opening 11 (see FIG. 2).
  • a cover 12 is attached to the opening 11.
  • a window 13 for exposing the terminal of the connector 21 is provided in the center of the cover 12.
  • a plate-like fin 23 of the heat sink 22 to be described later is exposed at the center of the upper surface of the housing 10.
  • FIG. 2 is a perspective view of the housing according to the first embodiment.
  • a pair of rails 14 are provided on the left and right inner surfaces of the housing 10 in the vertical direction.
  • the pair of rails 14 are slid while sandwiching both end portions of the printed board 20 up and down to guide insertion / removal of the printed board 20 with respect to the housing 10.
  • a plurality of slits 15 extending in the front-rear direction are formed at equal intervals in the left-right direction at the center of the upper surface of the housing 10.
  • Each slit 15 exposes each fin 23 included in the heat sink 22 accommodated in the housing 10 to the outside of the housing 10.
  • a first convex portion 16, a slit 15, and a second convex portion 17 are formed in this order from the opening 11 side.
  • the first convex portion 16 is formed on the opening 11 side of the upper surface of the housing 10.
  • the slit 15 is formed between the first convex portion 16 and the second convex portion 17.
  • the second convex part 17 is formed on the side opposite to the opening part 11 with the slit 15 on the upper surface of the housing 10 interposed therebetween.
  • the first convex portion 16 and the second convex portion 17 protrude outside the housing 10 from the heat sink 22. Thereby, the 1st convex part 16 and the 2nd convex part 17 can protect the front and back of the heat sink 22 from the impact by fall etc.
  • the first convex portion 16 and the second convex portion 17 may be flush with the heat sink 22.
  • the slit 15 is formed from the inclined wall on the second convex portion 17 side of the first convex portion 16 to the front side of the second convex portion 17.
  • FIG. 2 only a part of the slit 14 formed in the first convex portion 16 is shown (about half are omitted).
  • FIG. 3 is a perspective view of the control board according to the first embodiment.
  • a connector 21 and a CPU 24 as an example of an electronic component are mounted on the surface of the printed circuit board 20.
  • the connector 21 is disposed at one end of the printed circuit board 20 (the end on the opening 11 side).
  • the connector 21 is connected to other connectors.
  • the CPU 24 is disposed at the center of the printed circuit board 20.
  • a heat sink 22 is attached to the surface of the printed circuit board 20.
  • the heat sink 22 is attached to the printed circuit board 20 by adhesion, screws, or the like in contact with the opposite side of the CPU 24 to the printed circuit board 20.
  • the heat sink 22 is made of a metal material such as aluminum.
  • the heat sink 22 includes a base and a plurality of fins 22 for heat dissipation.
  • the fin 22 is formed in a plate shape.
  • the fins 22 are erected at the same interval as the interval of the slits 14 from the base.
  • the fins 22 are exposed to the outside of the housing 10 when inserted into the slits 14.
  • the heat sink 22 conducts the heat of the CPU 24 from the base to the fins 22 and discharges it to the outside of the housing 10.
  • FIG. 4 is a cross-sectional view of the electronic control device according to the first embodiment.
  • FIG. 4 shows a state before the cover 12 is attached to the housing 10.
  • the fins 23 of the heat sink 22 are inserted from the opening 11 side of the slit 15, and the fins 23 protruding from the slit 15 are exposed to the outside of the housing 10.
  • a cover 12 is attached to the opening 11 of the housing 10. Thereby, the terminal of the connector 21 is exposed to the outside of the housing 10 through the window 13 provided in the cover 12 (see FIG. 1).
  • the housing 10 is inserted into the fins 23 of the heat sink 22 attached to the printed circuit board 20 accommodated in the housing 10 to expose the fins 23 to the outside of the housing 10. 15 was formed.
  • the fin 13 of the heat sink 22 is exposed to the outside of the housing 10 by a simple structure of the housing 10, and the heat dissipation can be improved. Therefore, no additional components for heat dissipation are required.
  • the possibility that the heat sink 102 is directly impacted by dropping or the like can be reduced.
  • the second embodiment will be described with reference to FIG. In the following embodiments including the present embodiment, differences from the first embodiment will be mainly described.
  • FIG. 5 is a cross-sectional view of the electronic control device according to the second embodiment.
  • the slits 15 may be blocked by the fins 26 of the heat sink 25 by arranging the CPU 27 and the heat sink 25 to the opening 11 side.
  • FIG. 6 is a cross-sectional view of the electronic control device according to the third embodiment.
  • the slit 15 and the first convex portion 16 may be formed on the upper surface of the housing 30 without forming the second convex portion 16. That is, the first convex portion 16 is formed on the opening 11 side of the upper surface of the housing 30, and the side opposite to the opening 11 across the slit 15 on the upper surface of the housing 30 is lower than the heat sink 22. It may be formed.
  • the first protrusion 16 can protect the opening 11 side of the fin 23 of the heat sink 22 from impact due to dropping or the like, and the thickness on the opposite side of the opening 11 across the slit 15 in the housing 30. As a result, the housing 30 can be reduced in size.
  • the CPUs 24 and 27 may be semiconductor elements with a large amount of heat generation other than the CPUs 24 and 27.
  • SYMBOLS 10 Housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Provided is an electronic control device with which it is possible to improve heat dissipation performance with a simple structure. An electronic control device comprising a bottomed cylindrical casing 10 in which one end is an opening 11, and a printed substrate 20 inserted into the casing 10 via the opening 11, wherein the casing 10 has formed therein a slit 15 through which is inserted part of a heat sink 22 mounted on the printed substrate 20 housed in the casing 10, and via which part of the heat sink 22 is exposed to the exterior of the casing 10.

Description

電子制御装置Electronic control device
　本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
　例えば、特許文献１には、放熱部品を筐体の外部に露出させる電子装置の筐体の構造が開示されている。この筐体は、電子部品を実装したプリント基板を複数収容する。筐体は、壁面ボードと、筐体側コネクタと、基板側コネクタと、ヒートシンクと、ラジェータと、を具備する。 For example, Patent Document 1 discloses a structure of a casing of an electronic device that exposes a heat dissipation component to the outside of the casing. This housing accommodates a plurality of printed circuit boards on which electronic components are mounted. The housing includes a wall surface board, a housing-side connector, a board-side connector, a heat sink, and a radiator.
　壁面ボードは、筐体の一壁面を構成し、筐体外部に貫通したスリットを有する。筐体側コネクタは、壁面ボードの内側に固定され、スリットと連通して貫通するスリットを備える。基板側コネクタは、プリント基板の一端側に配設された筐体側コネクタに嵌合する。ヒートシンクは、プリント基板上の電子部品と接触する。ラジェータは、筐体の外部からスリットを貫通して挿入され、一端側がヒートシンクと面接触するとともに、他端側が筐体の外部に突出する。 The wall board constitutes one wall surface of the housing and has a slit penetrating outside the housing. The housing-side connector includes a slit that is fixed to the inside of the wall surface board and communicates with the slit. The board-side connector is fitted to a housing-side connector disposed on one end side of the printed board. The heat sink is in contact with electronic components on the printed circuit board. The radiator is inserted from the outside of the casing through the slit, and one end side is in surface contact with the heat sink, and the other end side protrudes outside the casing.
特開平８－２５５９９０号公報JP-A-8-255990
　特許文献１の筐体は、電子部品の発する熱をラジェータから筐体外部へ放熱する。この従来の構造では、ヒートシンクと、ラジエータという少なくとも２種の部品が必要となる。 The housing of Patent Document 1 dissipates heat generated by electronic components from the radiator to the outside of the housing. In this conventional structure, at least two kinds of parts, that is, a heat sink and a radiator are required.
　本発明は、上記課題に鑑みてなされたもので、その目的は、簡単な構造で放熱性を向上させることができる電子制御装置を提供することにある。 The present invention has been made in view of the above problems, and an object thereof is to provide an electronic control device capable of improving heat dissipation with a simple structure.
　上記課題を解決すべく、本発明に従う電子制御装置は、一端が開口部となる有底筒状の筐体と、前記開口部から前記筐体内に挿入される制御基板とを備えた電子制御装置であって、前記筐体には、当該筐体内に収容される前記制御基板に取り付けられた前記ヒートシンクの一部に挿入されて、当該ヒートシンクの一部を当該筐体の外側に露出させるスリットを形成した。 In order to solve the above problems, an electronic control device according to the present invention includes a bottomed cylindrical casing having an opening at one end, and a control board inserted into the casing from the opening. The housing includes a slit that is inserted into a part of the heat sink attached to the control board accommodated in the casing and exposes a part of the heat sink to the outside of the casing. Formed.
　本発明によれば、簡単な構造で放熱性を向上させることができる According to the present invention, heat dissipation can be improved with a simple structure.
第１実施例に係る電子制御装置の外観斜視図。1 is an external perspective view of an electronic control device according to a first embodiment. 第１実施例に係る筐体の斜視図。The perspective view of the housing | casing which concerns on 1st Example. 第１実施例に係るプリント基板の斜視図。The perspective view of the printed circuit board concerning a 1st example. 第１実施例に係る電子制御装置の断面図。Sectional drawing of the electronic control apparatus which concerns on 1st Example. 第２実施例に係る電子制御装置の断面図。Sectional drawing of the electronic control apparatus which concerns on 2nd Example. 第３実施例に係る電子制御装置の断面図。Sectional drawing of the electronic control apparatus which concerns on 3rd Example.
　幾つかの実施例について、図面を用いて詳細に説明する。尚、以下に説明する実施例は特許請求の範囲に係る発明を限定するものではなく、また実施例の中で説明されている諸要素及びその組み合わせの全てが発明の解決手段に必須であるとは限らない。 Several embodiments will be described in detail with reference to the drawings. It should be noted that the embodiments described below do not limit the invention according to the claims, and that all the elements and combinations described in the embodiments are essential for the solution of the invention. Is not limited.
　図１は、第１実施例に係る電子制御装置の外観斜視図である。 FIG. 1 is an external perspective view of the electronic control device according to the first embodiment.
　本実施例の電子制御装置は、樹脂製の筐体１０と、筐体１０に収容される「制御基板」の一例としてのプリント基板２０（図３参照）と、を備えている。筐体１０は、一端が開口部１１（図２参照）となる有底筒状に形成されている。開口部１１には、カバー１２が取り付けられる。カバー１２の中央には、コネクタ２１の端子を露出させる窓１３が設けられている。筐体１０の上面中央には、後述するヒートシンク２２の板状のフィン２３が露出する。 The electronic control device of this embodiment includes a resin casing 10 and a printed circuit board 20 (see FIG. 3) as an example of a “control board” accommodated in the casing 10. The housing 10 is formed in a bottomed cylindrical shape having one end serving as an opening 11 (see FIG. 2). A cover 12 is attached to the opening 11. In the center of the cover 12, a window 13 for exposing the terminal of the connector 21 is provided. A plate-like fin 23 of the heat sink 22 to be described later is exposed at the center of the upper surface of the housing 10.
　図２は、第１実施例に係る筐体の斜視図である。 FIG. 2 is a perspective view of the housing according to the first embodiment.
　筐体１０の左右の内側面には、上下に一対のレール１４がそれぞれ設けられている。一対のレール１４は、プリント基板２０の両側端部を上下に挟みながらスライドさせて、筐体１０に対するプリント基板２０の挿脱を案内する。 A pair of rails 14 are provided on the left and right inner surfaces of the housing 10 in the vertical direction. The pair of rails 14 are slid while sandwiching both end portions of the printed board 20 up and down to guide insertion / removal of the printed board 20 with respect to the housing 10.
　筐体１０の上面中央には、前後方向に延びる複数のスリット１５が左右方向に等間隔に形成されている。各スリット１５は、筐体１０内に収容されたヒートシンク２２が備える各フィン２３を筐体１０の外側に露出させる。 A plurality of slits 15 extending in the front-rear direction are formed at equal intervals in the left-right direction at the center of the upper surface of the housing 10. Each slit 15 exposes each fin 23 included in the heat sink 22 accommodated in the housing 10 to the outside of the housing 10.
　さらに、筐体１０の上面には、開口部１１側から順に、第一凸部１６と、スリット１５と、第二凸部１７とが、形成されている。第一凸部１６は、筐体１０の上面の開口部１１側に形成されている。スリット１５は、第一凸部１６と、第二凸部１７との間に形成されている。第二凸部１７は、筐体１０の上面のスリット１５を挟んで開口部１１とは反対側に形成されている。第一凸部１６及び第二凸部１７は、ヒートシンク２２よりも筐体１０の外側に突出する。これにより、第一凸部１６及び第二凸部１７は、落下等による衝撃からヒートシンク２２の前後を保護することができる。第一凸部１６及び第二凸部１７は、ヒートシンク２２と面一でもよい。 Furthermore, on the upper surface of the housing 10, a first convex portion 16, a slit 15, and a second convex portion 17 are formed in this order from the opening 11 side. The first convex portion 16 is formed on the opening 11 side of the upper surface of the housing 10. The slit 15 is formed between the first convex portion 16 and the second convex portion 17. The second convex part 17 is formed on the side opposite to the opening part 11 with the slit 15 on the upper surface of the housing 10 interposed therebetween. The first convex portion 16 and the second convex portion 17 protrude outside the housing 10 from the heat sink 22. Thereby, the 1st convex part 16 and the 2nd convex part 17 can protect the front and back of the heat sink 22 from the impact by fall etc. The first convex portion 16 and the second convex portion 17 may be flush with the heat sink 22.
　スリット１５は、第一凸部１６の第二凸部１７側の傾斜壁から第二凸部１７の手前に亘って形成される。尚、図２中、第一凸部１６に形成されたスリット１４は、一部のみを図示（約半分を省略）している。 The slit 15 is formed from the inclined wall on the second convex portion 17 side of the first convex portion 16 to the front side of the second convex portion 17. In FIG. 2, only a part of the slit 14 formed in the first convex portion 16 is shown (about half are omitted).
　図３は、第１実施例に係る制御基板の斜視図である。 FIG. 3 is a perspective view of the control board according to the first embodiment.
　プリント基板２０の表面には、コネクタ２１と、電子部品の一例としてのＣＰＵ２４と、が実装される。コネクタ２１は、プリント基板２０の一端（開口部１１側の端）に配置される。コネクタ２１は、他のコネクタと接続される。ＣＰＵ２４は、プリント基板２０の中央に配置される。 A connector 21 and a CPU 24 as an example of an electronic component are mounted on the surface of the printed circuit board 20. The connector 21 is disposed at one end of the printed circuit board 20 (the end on the opening 11 side). The connector 21 is connected to other connectors. The CPU 24 is disposed at the center of the printed circuit board 20.
　プリント基板２０の表面には、ヒートシンク２２が取り付けられる。ヒートシンク２２は、ＣＰＵ２４のプリント基板２０とは反対側に接触する状態で接着またはネジ等によってプリント基板２０に取り付けられる。ヒートシンク２２は、アルミニウムなどの金属材料で構成されている。ヒートシンク２２は、基部と、放熱用の複数のフィン２２とを備える。フィン２２は、板状に形成されている。フィン２２は、基部からスリット１４の間隔と同じ等間隔に立設している。フィン２２は、スリット１４に挿入されたときに、筐体１０の外側に露出する。ヒートシンク２２は、ＣＰＵ２４の熱を基部からフィン２２に伝導させて、筐体１０の外側に排出する。 A heat sink 22 is attached to the surface of the printed circuit board 20. The heat sink 22 is attached to the printed circuit board 20 by adhesion, screws, or the like in contact with the opposite side of the CPU 24 to the printed circuit board 20. The heat sink 22 is made of a metal material such as aluminum. The heat sink 22 includes a base and a plurality of fins 22 for heat dissipation. The fin 22 is formed in a plate shape. The fins 22 are erected at the same interval as the interval of the slits 14 from the base. The fins 22 are exposed to the outside of the housing 10 when inserted into the slits 14. The heat sink 22 conducts the heat of the CPU 24 from the base to the fins 22 and discharges it to the outside of the housing 10.
　図４は、第１実施例に係る電子制御装置の断面図である。尚、図４は、カバー１２を筐体１０に取り付ける前の状態を示している。 FIG. 4 is a cross-sectional view of the electronic control device according to the first embodiment. FIG. 4 shows a state before the cover 12 is attached to the housing 10.
　次に、筐体１０内にプリント基板２０を収容する手順について説明する。作業員は、予めコネクタ２１及び放熱が必要なＣＰＵ２４を実装すると共にヒートシンク２２を取り付けたプリント基板２０を、筐体１０の開口部１１から筐体１０内部へ挿入させる。筐体１０内にプリント基板２０を挿入する際、プリント基板２０は、両側端を上下のレール１４間に挟まれながらスライドさせることによって、筐体１０内への挿入が案内される。 Next, a procedure for housing the printed circuit board 20 in the housing 10 will be described. An operator inserts the printed circuit board 20 on which the connector 21 and the CPU 24 that needs heat radiation are mounted in advance and the heat sink 22 is attached into the housing 10 through the opening 11 of the housing 10. When inserting the printed circuit board 20 into the housing 10, the printed circuit board 20 is guided to be inserted into the housing 10 by sliding both side ends while being sandwiched between the upper and lower rails 14.
　さらにプリント基板２０を筐体１０内に挿入すると、ヒートシンク２２のフィン２３は、スリット１５の開口部１１側から挿入され、スリット１５から突出したフィン２３が筐体１０の外側に露出する。筐体１０内にプリント基板２０を挿入した後、筐体１０の開口部１１には、カバー１２を取り付けられる。これにより、コネクタ２１の端子は、カバー１２に設けられた窓１３を介して筐体１０の外側に露出する（図１参照）。 Further, when the printed circuit board 20 is inserted into the housing 10, the fins 23 of the heat sink 22 are inserted from the opening 11 side of the slit 15, and the fins 23 protruding from the slit 15 are exposed to the outside of the housing 10. After inserting the printed circuit board 20 into the housing 10, a cover 12 is attached to the opening 11 of the housing 10. Thereby, the terminal of the connector 21 is exposed to the outside of the housing 10 through the window 13 provided in the cover 12 (see FIG. 1).
　本実施例によれば、筐体１０には、筐体１０内に収容されたプリント基板２０に取り付けられたヒートシンク２２のフィン２３に挿入されて、フィン２３を筐体１０の外側に露出させるスリット１５を形成した。これにより、筐体１０の簡単な構造によって、ヒートシンク２２のフィン１３が筐体１０の外側に露出させて、放熱性を向上させることが可能となる。したがって、放熱のための追加構成部品が不要となる。 According to the present embodiment, the housing 10 is inserted into the fins 23 of the heat sink 22 attached to the printed circuit board 20 accommodated in the housing 10 to expose the fins 23 to the outside of the housing 10. 15 was formed. Thereby, the fin 13 of the heat sink 22 is exposed to the outside of the housing 10 by a simple structure of the housing 10, and the heat dissipation can be improved. Therefore, no additional components for heat dissipation are required.
　さらに、第一凸部１６及び第二凸部１７が、ヒートシンク２２よりも突出しているので、落下等によりヒートシンク１０２が直接衝撃を受ける可能性を減らすことができる。 Furthermore, since the first convex portion 16 and the second convex portion 17 protrude from the heat sink 22, the possibility that the heat sink 102 is directly impacted by dropping or the like can be reduced.
　図５を用いて第２実施例を説明する。本実施例を含む以下の各実施例では、第１実施例との相違を中心に説明する。 The second embodiment will be described with reference to FIG. In the following embodiments including the present embodiment, differences from the first embodiment will be mainly described.
　図５は、第２実施例に係る電子制御装置の断面図である。 FIG. 5 is a cross-sectional view of the electronic control device according to the second embodiment.
　図５に示すように、ＣＰＵ２７及びヒートシンク２５を開口部１１側まで配置させることによって、スリット１５がヒートシンク２５のフィン２６に塞がれてもよい。 As shown in FIG. 5, the slits 15 may be blocked by the fins 26 of the heat sink 25 by arranging the CPU 27 and the heat sink 25 to the opening 11 side.
　この構成によれば、スリット１５を介して筐体１０の外側から内側に水、砂、埃などが侵入することを抑制することができる。 According to this configuration, it is possible to prevent water, sand, dust, and the like from entering from the outside to the inside of the housing 10 through the slit 15.
　図６を用いて第３実施例を説明する。 A third embodiment will be described with reference to FIG.
　図６は、第３実施例に係る電子制御装置の断面図である。 FIG. 6 is a cross-sectional view of the electronic control device according to the third embodiment.
　図６に示すように、筐体３０の上面には、第二凸部１６を形成せずに、スリット１５と、第一凸部１６とを形成してもよい。即ち、筐体３０の上面の開口部１１側には、第一凸部１６を形成すると共に、筐体３０の上面のスリット１５を挟んで開口部１１とは反対側は、ヒートシンク２２よりも低く形成してもよい。 As shown in FIG. 6, the slit 15 and the first convex portion 16 may be formed on the upper surface of the housing 30 without forming the second convex portion 16. That is, the first convex portion 16 is formed on the opening 11 side of the upper surface of the housing 30, and the side opposite to the opening 11 across the slit 15 on the upper surface of the housing 30 is lower than the heat sink 22. It may be formed.
　この構成によれば、第一凸部１６によってヒートシンク２２のフィン２３の開口部１１側を落下等による衝撃から保護でき、また筐体３０におけるスリット１５を挟んで開口部１１とは反対側の厚みが薄くなり、筐体３０を小型化することができる。 According to this configuration, the first protrusion 16 can protect the opening 11 side of the fin 23 of the heat sink 22 from impact due to dropping or the like, and the thickness on the opposite side of the opening 11 across the slit 15 in the housing 30. As a result, the housing 30 can be reduced in size.
　なお、本発明は上記した実施例に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施例は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。 In addition, this invention is not limited to the above-mentioned Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.
　例えば、上記実施例では、ＣＰＵ２４，２７は、ＣＰＵ２４，２７以外の発熱量の多い半導体素子であってもよい。 For example, in the above embodiment, the CPUs 24 and 27 may be semiconductor elements with a large amount of heat generation other than the CPUs 24 and 27.
　１０…筐体、１１…開口部、１４…レール、１５…スリット、１６…第一凸部、１７…第二凸部、２０…プリント基板、２１…コネクタ、２２…ヒートシンク、２３…フィン、２４…ＣＰＵ、２５…ヒートシンク、２６…フィン、２７…ＣＰＵ、３０…筐体 DESCRIPTION OF SYMBOLS 10 ... Housing | casing, 11 ... Opening part, 14 ... Rail, 15 ... Slit, 16 ... 1st convex part, 17 ... 2nd convex part, 20 ... Printed circuit board, 21 ... Connector, 22 ... Heat sink, 23 ... Fin, 24 ... CPU, 25 ... heat sink, 26 ... fin, 27 ... CPU, 30 ... housing

Claims (8)

  1. 　一端が開口部となる有底筒状の筐体と、前記開口部から前記筐体に挿入される制御基板とを備えた電子制御装置であって、
    　前記筐体には、当該筐体内に収容される前記制御基板に取り付けられた前記ヒートシンクの一部に挿入されて、当該ヒートシンクの一部を当該筐体の外側に露出させるスリットを形成した、電子制御装置。     An electronic control device comprising a bottomed cylindrical casing having one end as an opening, and a control board inserted into the casing from the opening,
    The case is formed with a slit that is inserted into a part of the heat sink attached to the control board accommodated in the case and exposes a part of the heat sink to the outside of the case. Control device.
  2. 　前記筐体の前記開口部側には、前記ヒートシンクよりも前記筐体の外側に突出する第一凸部を形成し、
    　前記第一凸部の傾斜面には、前記スリットを形成した、請求項１に記載の電子制御装置。     On the opening side of the housing, a first convex portion that protrudes outside the housing from the heat sink is formed,
    The electronic control device according to claim 1, wherein the slit is formed on the inclined surface of the first convex portion.
  3. 　前記筐体の前記スリットを挟んで前記開口部側とは反対側には、前記ヒートシンクよりも前記筐体の外側に突出する第二凸部を形成した、請求項２に記載の電子制御装置。 The electronic control device according to claim 2, wherein a second convex portion that protrudes to the outside of the housing from the heat sink is formed on a side opposite to the opening portion across the slit of the housing.
  4. 　前記制御基板には、電子部品が実装され、
    　前記ヒートシンクは、前記電子部品に接触する状態で前記制御基板に取り付けられた、請求項１に記載の電子制御装置。     Electronic components are mounted on the control board,
    The electronic control device according to claim 1, wherein the heat sink is attached to the control board in contact with the electronic component.
  5. 　前記制御基板には、コネクタが実装され、
    　前記コネクタの端子は、前記開口部から露出される、請求項１に記載の電子制御装置。     A connector is mounted on the control board,
    The electronic control device according to claim 1, wherein a terminal of the connector is exposed from the opening.
  6. 　前記ヒートシンクは、複数のフィンを備える、請求項１に記載の電子制御装置。 The electronic control device according to claim 1, wherein the heat sink includes a plurality of fins.
  7. 　前記スリットは、前記筐体内に前記制御基板が挿入されたときに、前記ヒートシンクに塞がれる、請求項１に記載の電子制御装置。 The electronic control device according to claim 1, wherein the slit is closed by the heat sink when the control board is inserted into the housing.
  8. 　前記筐体には、当該筐体内に対する前記制御基板の挿脱を案内するレールを設けた、請求項１に記載の電子制御装置。
          The electronic control device according to claim 1, wherein a rail for guiding insertion / removal of the control board into / from the housing is provided in the housing.
PCT/JP2019/005216 2018-05-09 2019-02-14 Electronic control device WO2019215977A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388390U (en) * 1989-12-26 1991-09-10
JPH0617294U (en) * 1992-08-04 1994-03-04 富士通株式会社 Cooling structure for heat generating parts
JP2002299873A (en) * 2001-04-04 2002-10-11 Denso Corp Electronic control apparatus
US20090103268A1 (en) * 2007-10-23 2009-04-23 Tyco Electronics Corporation Module assembly having heat transfer plate
WO2014069340A1 (en) * 2012-11-02 2014-05-08 日立オートモティブシステムズ株式会社 Electronic control device
JP2017147914A (en) * 2016-02-19 2017-08-24 矢崎総業株式会社 Electric connection box and wiring harness

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388390U (en) * 1989-12-26 1991-09-10
JPH0617294U (en) * 1992-08-04 1994-03-04 富士通株式会社 Cooling structure for heat generating parts
JP2002299873A (en) * 2001-04-04 2002-10-11 Denso Corp Electronic control apparatus
US20090103268A1 (en) * 2007-10-23 2009-04-23 Tyco Electronics Corporation Module assembly having heat transfer plate
WO2014069340A1 (en) * 2012-11-02 2014-05-08 日立オートモティブシステムズ株式会社 Electronic control device
JP2017147914A (en) * 2016-02-19 2017-08-24 矢崎総業株式会社 Electric connection box and wiring harness

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