WO2019198860A1

WO2019198860A1 - Mobile terminal

Info

Publication number: WO2019198860A1
Application number: PCT/KR2018/004984
Authority: WO
Inventors: 이재웅; 김항석; 이병화
Original assignee: 엘지전자 주식회사
Priority date: 2018-04-09
Filing date: 2018-04-30
Publication date: 2019-10-17

Abstract

In order to solve a heating problem of a mobile terminal due to heating of a chipset, particularly, in order to prevent excessive concentration of heat in one area of a mobile terminal, the present invention provides a mobile terminal comprising: a display unit disposed on the front surface thereof; a support frame disposed on the rear surface of the display unit to support the display unit; a substrate unit including a first printed circuit board and a second printed circuit board sequentially laminated and disposed on the rear surface of the support frame; a cover frame disposed on the rear surface of the substrate unit to form a rear outer appearance thereof; a chipset disposed on one surface of one among the first printed circuit board or the second circuit printed board; and a heat transfer member, one side of which is in contact with the other surface of the printed circuit board on which the chipset is disposed, and the other side of which is in contact with one among the support frame opposite to the other surface, the cover frame, or the printed circuit board on which the chipset is not disposed.

Description

Mobile terminal

The present invention relates to a mobile terminal that implements a heat dissipation structure.

In a mobile terminal, some mounted components generate heat when driven. The heat generation of the components adversely affects the mobile terminal. For example, overheating of a mobile terminal may cause a cold soldering phenomenon in which soldering of a substrate and a chipset falls, and may cause a burn or a fire problem.

This heat generation problem is aggravated as components mounted in the mobile terminal increase, the volume of the mobile terminal decreases, and the size of the chipset or the like decreases.

In order to solve the heat problem, the mobile terminal may include a throttling algorithm. If the temperature is above a certain temperature, the operation of the chipset is controlled to slow the operation. In another method, a physical heat dissipation structure is implemented. The chipset may be in contact with other members to maximize the heat generation area. Recently, in addition to this method, a heat pipe may be provided to effectively help heat generation using a phase change.

Nevertheless, the heat dissipation of chipsets is increasing, and there is a continuing demand for effective heat removal.

In particular, in the case of a chipset supporting 5G, a large amount of heat is generated, and sufficient heat dissipation cannot be realized using a conventional heat dissipation structure.

An object of the present invention is to solve the problem caused by the heat generation of the mobile terminal described above.

According to an aspect of the present invention to achieve the above object, a display unit provided on the front, a support frame provided on the back of the display unit for supporting the display unit, the first printing provided sequentially laminated on the back of the support frame A substrate part including a circuit board and a second printed circuit board, a cover frame provided on a rear surface of the substrate part to form a rear surface, and provided on one surface of the first printed circuit board or the second printed circuit board And a heat transfer contacting one of the chipset and one side of the printed circuit board having the chipset and the other side of the support frame, the cover frame, or the printed circuit board not provided with the chipset, the other side of which is opposite to the other surface. It provides a mobile terminal comprising a member.

In addition, according to another aspect of the present invention, the heat transfer member provides a mobile terminal including a thermoelectric element of which the temperature of one side is lowered and the temperature of the other side is increased.

According to another aspect of the present invention, the heat transfer member includes a thermal interface material (TIM) provided on at least one side of one side or the other side of the thermoelectric element, and the thermal interface material includes a heat radiation pad ( It provides a mobile terminal, characterized in that any one of a pad, a heat radiation gel (Gel), grease (Grease).

In addition, according to another aspect of the present invention, the thermoelectric device provides a mobile terminal, characterized in that the conductive wire is connected to the printed circuit board equipped with the chipset.

In addition, according to another aspect of the present invention, in a printed circuit board provided with the chipset, a region in which the chipset is provided and a region in which the heat transfer member is provided provide at least one region overlapping the mobile terminal.

According to another aspect of the present invention, the chipset provides a mobile terminal, characterized in that it comprises a 5G RF chipset.

In addition, according to another aspect of the present invention, the chipset provides a mobile terminal, characterized in that provided on the same printed circuit board as the 5G RF antenna.

In addition, according to another aspect of the invention, the chipset is provided on the back of the first printed circuit board or the second printed circuit board, the heat transfer member is the front of the printed circuit board with the chipset and the support frame It provides a mobile terminal, characterized in that in contact with.

In addition, according to another aspect of the present invention, there is provided a mobile terminal further comprising a heat pipe provided between the heat transfer member and the support frame.

Further, according to another aspect of the invention, the chipset is provided on the back of the second printed circuit board, the heat transfer member is in contact with the front of the second printed circuit board and the back of the first printed circuit board. It provides a mobile terminal characterized by.

Further, according to another aspect of the invention, the chipset is provided on the front of the first printed circuit board, the heat transfer member is in contact with the back of the first printed circuit board and the front of the second printed circuit board. It provides a mobile terminal characterized by.

According to another aspect of the present invention, the display unit may include a display panel, a metal plate covering the rear surface of the display panel, and a window covering the front surface of the display panel, wherein the metal plate overlaps the chipset. It provides a mobile terminal characterized in that it is not provided for.

Referring to the effect of the optical device according to the invention as follows.

According to at least one of the embodiments of the present invention, there is an advantage in that the heat generation of the mobile terminal can be solved.

In addition, according to at least one of the embodiments of the present invention, there is an advantage that the space utilization can be maximized by effectively using the existing structure of the mobile terminal.

Further scope of the applicability of the present invention will become apparent from the following detailed description. However, various changes and modifications within the spirit and scope of the present invention can be clearly understood by those skilled in the art, and therefore, specific embodiments, such as the detailed description and the preferred embodiments of the present invention, are given by way of example only. Should be.

1A is a block diagram illustrating a mobile terminal related to the present invention.

1B and 1C are conceptual views of one example of a mobile terminal, viewed from different directions.

2 is an exploded rear perspective view illustrating a part of main components of a mobile terminal according to the present invention.

3 is a partial cross-sectional conceptual view of a mobile terminal related to the present invention.

4 is a side view showing a package for mounting a chipset for 5G according to the present invention.

5 to 7 illustrate an embodiment of a mobile terminal in which a chipset is mounted on a rear surface of a second printed circuit board.

8 illustrates an embodiment of a mobile terminal in which a chipset is mounted on a rear surface of a first printed circuit board.

9 illustrates an embodiment of a mobile terminal in which a chipset is mounted on a rear surface of a first printed circuit board.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and the same or similar components are denoted by the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted. The suffixes "module" and "unit" for components used in the following description are given or used in consideration of ease of specification, and do not have distinct meanings or roles from each other. In addition, in describing the embodiments disclosed herein, when it is determined that the detailed description of the related known technology may obscure the gist of the embodiments disclosed herein, the detailed description thereof will be omitted. In addition, the accompanying drawings are intended to facilitate understanding of the embodiments disclosed herein, but are not limited to the technical spirit disclosed herein by the accompanying drawings, all changes included in the spirit and scope of the present invention. It should be understood to include equivalents and substitutes.

Optical devices described herein include mobile phones, smart phones, laptop computers, digital broadcasting terminals, personal digital assistants, portable multimedia players, navigation, slate PCs. , Tablet PCs, ultrabooks, wearable devices, such as smartwatches, glass glasses, head mounted displays, and the like. have.

However, the configuration according to the embodiments described herein may be applied to fixed terminals such as digital TVs, desktop computers, digital signages, and the like, except that it is applicable only to optical devices. It's easy for a technician to know.

1A to 1C, FIG. 1A is a block diagram illustrating a mobile terminal according to the present invention, and FIGS. 1B and 1C are conceptual views of one example of the mobile terminal, viewed from different directions.

The mobile terminal 100 includes a wireless communication unit 110, an input unit 120, a sensing unit 140, an output unit 150, an interface unit 160, a memory 170, a controller 180, and a power supply unit 190. ) May be included. The components shown in FIG. 1A are not essential to implementing the mobile terminal 100, so the mobile terminal 100 described herein may have more or fewer components than those listed above. have.

More specifically, the wireless communication unit 110 of the components, between the mobile terminal 100 and the wireless communication system, between the mobile terminal 100 and another mobile terminal 100, or the mobile terminal 100 and the external server It may include one or more modules that enable wireless communication therebetween. In addition, the wireless communication unit 110 may include one or more modules for connecting the mobile terminal 100 to one or more networks.

The wireless communication unit 110 may include at least one of the broadcast receiving module 111, the mobile communication module 112, the wireless internet module 113, the short range communication module 114, and the location information module 115. .

The input unit 120 may include a camera 121 or an image input unit for inputting an image signal, a microphone 122 for inputting an audio signal, an audio input unit, or a user input unit 123 for receiving information from a user. , Touch keys, mechanical keys, and the like. The voice data or the image data collected by the input unit 120 may be analyzed and processed as a control command of the user.

The sensing unit 140 may include one or more sensors for sensing at least one of information in the mobile terminal 100, surrounding environment information surrounding the mobile terminal 100, and user information. For example, the sensing unit 140 may include a proximity sensor 141, an illumination sensor 142, an illumination sensor, a touch sensor, an acceleration sensor, a magnetic sensor, and gravity. G-sensor, Gyroscope Sensor, Motion Sensor, RGB Sensor, Infrared Sensor, Infrared Sensor, Fingerprint Sensor, Ultrasonic Sensor Optical sensors (e.g. cameras 121), microphones (see 122), battery gauges, environmental sensors (e.g. barometers, hygrometers, thermometers, radiation detection sensors, Thermal sensors, gas sensors, etc.), chemical sensors (eg, electronic noses, healthcare sensors, biometric sensors, etc.). Meanwhile, the mobile terminal 100 disclosed in the present specification may combine and use information sensed by at least two or more of these sensors.

The output unit 150 is used to generate an output related to sight, hearing, or tactile sense, and includes at least one of a display unit 151, an audio output unit 152, a haptic module 153, and an optical output unit 154. can do. The display unit 151 forms a layer structure with or is integrally formed with the touch sensor, thereby implementing a touch screen. The touch screen may function as a user input unit 123 that provides an input interface between the mobile terminal 100 and the user, and may also provide an output interface between the mobile terminal 100 and the user.

The interface unit 160 serves as a path to various types of external devices connected to the mobile terminal 100. The interface unit 160 connects a device equipped with a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, and an identification module. It may include at least one of a port, an audio input / output (I / O) port, a video input / output (I / O) port, and an earphone port. In the mobile terminal 100, in response to an external device being connected to the interface unit 160, appropriate control associated with the connected external device may be performed.

In addition, the memory 170 stores data supporting various functions of the mobile terminal 100. The memory 170 may store a plurality of application programs or applications driven in the mobile terminal 100, data for operating the mobile terminal 100, and instructions. At least some of these applications may be downloaded from an external server via wireless communication. In addition, at least some of these application programs may exist on the mobile terminal 100 from the time of shipment for basic functions of the mobile terminal 100 (for example, a call forwarding, a calling function, a message receiving, and a calling function). The application program may be stored in the memory 170 and installed on the mobile terminal 100 to be driven by the controller 180 to perform an operation (or function) of the mobile terminal 100.

In addition to the operation related to the application program, the controller 180 typically controls the overall operation of the mobile terminal 100. The controller 180 may provide or process information or a function appropriate to a user by processing signals, data, information, and the like, which are input or output through the above-described components, or by driving an application program stored in the memory 170.

In addition, the controller 180 may control at least some of the components described with reference to FIG. 1A in order to drive an application program stored in the memory 170. Furthermore, the controller 180 may operate by combining at least two or more of the components included in the mobile terminal 100 to drive the application program.

The power supply unit 190 receives power from an external power source and an internal power source under the control of the controller 180 to supply power to each component included in the mobile terminal 100. The power supply unit 190 includes a battery, which may be a built-in battery or a replaceable battery.

At least some of the components may operate in cooperation with each other in order to implement an operation, control, or control method of the mobile terminal 100 according to various embodiments described below. In addition, the operation, control, or control method of the mobile terminal 100 may be implemented on the mobile terminal 100 by driving at least one application program stored in the memory 170.

1B and 1C, the disclosed mobile terminal 100 includes a terminal body in a bar shape. However, the present invention is not limited thereto, and the present invention can be applied to various structures such as a watch type, a clip type, a glass type, or a folder type, a flip type, a slide type, a swing type, a swivel type, and two or more bodies which are coupled to be movable relative. . Although related to a particular type of mobile terminal, a description of a particular type of mobile terminal may generally apply to other types of mobile terminals.

Herein, the terminal body may be understood as a concept that refers to the mobile terminal 100 as at least one aggregate.

The mobile terminal 100 includes a case (eg, a frame, a housing, a cover, etc.) forming an external appearance. As shown, the mobile terminal 100 may include a front case 101 and a rear case 102. Various electronic components are disposed in the internal space formed by the combination of the front case 101 and the rear case 102. At least one middle case may be additionally disposed between the front case 101 and the rear case 102.

The display unit 151 may be disposed in front of the terminal body to output information. As shown, the window 151a of the display unit 151 may be mounted to the front case 101 to form a front surface of the terminal body together with the front case 101. Or it may be provided in combination with the middle case as needed.

In some cases, an electronic component may be mounted on the rear case 102. Electronic components attachable to the rear case 102 include a removable battery, an identification module, a memory card, and the like. In this case, the rear cover 103 may be detachably coupled to the rear case 102 to cover the mounted electronic components. Therefore, when the rear cover 103 is separated from the rear case 102, the electronic components mounted on the rear case 102 are exposed to the outside.

As illustrated, when the rear cover 103 is coupled to the rear case 102, a portion of the side surface of the rear case 102 may be exposed. In some cases, the rear case 102 may be completely covered by the rear cover 103 during the coupling. On the other hand, the rear cover 103 may be provided with an opening for exposing the camera 121b or the sound output unit 152b to the outside.

The

cases

101, 102, and 103 may be formed by injecting a synthetic resin, or may be formed of a metal, for example, stainless steel (STS), aluminum (Al), titanium (Ti), or the like.

The mobile terminal 100 may be configured such that one case may provide the internal space, unlike the above example in which a plurality of cases provide an internal space for accommodating various electronic components. In this case, the mobile terminal 100 of the unibody that the synthetic resin or metal from the side to the rear may be implemented.

On the other hand, the mobile terminal 100 may be provided with a waterproof portion (not shown) to prevent water from seeping into the terminal body. For example, the waterproof portion is provided between the window 151a and the front case 101, between the front case 101 and the rear case 102 or between the rear case 102 and the rear cover 103, and a combination thereof. It may include a waterproof member for sealing the inner space.

The mobile terminal 100 includes a display unit 151, first and second

sound output units

152a and 152b, a proximity sensor 141, an illuminance sensor 142, an optical output unit 154, and first and second units. The cameras 121a and 121b, the first and

second manipulation units

123a and 123b, the microphone 122, the interface unit 160, and the like may be provided.

Hereinafter, as illustrated in FIGS. 1B and 1C, the display unit 151, the first sound output unit 152a, the proximity sensor 141, the illuminance sensor 142, and the light output unit may be disposed on the front surface of the terminal body. 154, the first camera 121a and the first operation unit 123a are disposed, and the second operation unit 123b, the microphone 122, and the interface unit 160 are disposed on the side of the terminal body. The mobile terminal 100 in which the second sound output unit 152b and the second camera 121b are disposed on the rear surface of the mobile terminal 100 will be described as an example.

However, these configurations are not limited to this arrangement. These configurations may be excluded or replaced as needed or disposed on other sides. For example, the first manipulation unit 123a may not be provided on the front surface of the terminal body, and the second sound output unit 152b may be provided on the side of the terminal body instead of the rear surface of the terminal body.

The display unit 151 displays (outputs) information processed by the mobile terminal 100. For example, the display unit 151 may display execution screen information of an application program driven in the mobile terminal 100 or user interface (UI) and graphical user interface (GUI) information according to the execution screen information. .

The display unit 151 may include a liquid crystal display (LCD), a thin film transistor-liquid crystal display (TFT LCD), an organic light-emitting diode (OLED), and a flexible display (flexible display). display, a 3D display, or an e-ink display.

In addition, two or more display units 151 may exist according to an implementation form of the mobile terminal 100. In this case, the plurality of display units may be spaced apart or integrally disposed on one surface of the mobile terminal 100, or may be disposed on different surfaces.

The display unit 151 may include a touch sensor that senses a touch on the display unit 151 so as to receive a control command by a touch method. By using this, when a touch is made to the display unit 151, the touch sensor may sense the touch, and the controller 180 may generate a control command corresponding to the touch based on the touch sensor. The content input by the touch method may be letters or numbers or menu items that can be indicated or designated in various modes.

Meanwhile, the touch sensor is formed of a film having a touch pattern and disposed between the window 151a and the display (not shown) on the rear surface of the window 151a or directly patterned on the rear surface of the window 151a. It can also be Alternatively, the touch sensor may be integrally formed with the display. For example, the touch sensor may be disposed on a substrate of the display or provided in the display.

As such, the display unit 151 may form a touch screen together with the touch sensor. In this case, the touch screen may function as the user input unit 123 (see FIG. 1A). In some cases, the touch screen may replace at least some functions of the first manipulation unit 123a.

The first sound output unit 152a may be implemented as a receiver for transmitting a call sound to the user's ear, and the second sound output unit 152b may be a loud speaker for outputting various alarm sounds or multimedia reproduction sounds. It can be implemented in the form of).

A sound hole for emitting sound generated from the first sound output unit 152a may be formed in the window 151a of the display unit 151. However, the present invention is not limited thereto, and the sound may be configured to be emitted along an assembly gap between the structures (for example, a gap between the window 151a and the front case 101). In this case, an externally formed hole may be invisible or hidden for sound output, thereby simplifying the appearance of the mobile terminal 100.

The light output unit 154 is configured to output light for notifying when an event occurs. Examples of the event may include message reception, call signal reception, missed call, alarm, schedule notification, email reception, information reception through an application, and the like. When the user's event confirmation is detected, the controller 180 may control the light output unit 154 to end the light output.

The first camera 121a processes an image frame of a still image or a moving image obtained by the image sensor in a shooting mode or a video call mode. The processed image frame may be displayed on the display unit 151 and stored in the memory 170.

The first and

second manipulation units

123a and 123b may be collectively referred to as a manipulating portion as an example of the user input unit 123 operated to receive a command for controlling the operation of the mobile terminal 100. have. The first and

second manipulation units

123a and 123b may be adopted in any manner as long as the user is tactile manner such as touch, push, scroll, and the like while the user is tactile. In addition, the first and

second manipulation units

123a and 123b may be employed in such a manner that the first and

second manipulation units

123a and 123b are operated without a tactile feeling by the user through proximity touch, hovering touch, or the like.

In the drawing, the first operation unit 123a is illustrated as being a touch key, but the present invention is not limited thereto. For example, the first manipulation unit 123a may be a mechanical key or a combination of a touch key and a push key.

The contents input by the first and

second manipulation units

123a and 123b may be variously set. For example, the first operation unit 123a receives a command such as a menu, a home key, a cancellation, a search, etc., and the second operation unit 123b is output from the first or second

sound output units

152a and 152b. The user may receive a command such as adjusting the volume of the sound and switching to the touch recognition mode of the display unit 151.

Meanwhile, as another example of the user input unit 123, a rear input unit (not shown) may be provided on the rear surface of the terminal body. The rear input unit is manipulated to receive a command for controlling the operation of the mobile terminal 100, and the input contents may be variously set. For example, commands such as power on / off, start, end, scroll, etc., control of the volume of sound output from the first and second

sound output units

152a and 152b, and the touch recognition mode of the display unit 151. Commands such as switching can be received. The rear input unit may be implemented in a form capable of input by touch input, push input, or a combination thereof.

The rear input unit may be disposed to overlap the front display unit 151 in the thickness direction of the terminal body. For example, the rear input unit may be disposed at the rear upper end of the terminal body so that the user can easily manipulate the index body when the user grips the terminal body with one hand. However, the present invention is not necessarily limited thereto, and the position of the rear input unit may be changed.

As such, when the rear input unit is provided at the rear of the terminal body, a new type user interface using the same may be implemented. In addition, when the touch screen or the rear input unit described above replaces at least some functions of the first operation unit 123a provided in the front of the terminal body, the first operation unit 123a is not disposed on the front of the terminal body. The display unit 151 may be configured with a larger screen.

Meanwhile, the mobile terminal 100 may be provided with a fingerprint recognition sensor for recognizing a user's fingerprint, and the controller 180 may use fingerprint information detected through the fingerprint recognition sensor as an authentication means. The fingerprint recognition sensor may be embedded in the display unit 151 or the user input unit 123.

The microphone 122 is configured to receive a user's voice, other sounds, and the like. The microphone 122 may be provided at a plurality of locations and configured to receive stereo sound.

The interface unit 160 serves as a path for connecting the mobile terminal 100 to an external device. For example, the interface unit 160 may be connected to another device (eg, an earphone or an external speaker), a port for short-range communication (for example, an infrared port (IrDA Port), or a Bluetooth port (Bluetooth). Port), a wireless LAN port, or the like, or a power supply terminal for supplying power to the mobile terminal 100. The interface unit 160 may be implemented in the form of a socket for receiving an external card such as a subscriber identification module (SIM) or a user identity module (UIM), a memory card for storing information.

The second camera 121b may be disposed on the rear surface of the terminal body. In this case, the second camera 121b has a photographing direction substantially opposite to that of the first camera 121a.

The second camera 121b may include a plurality of lenses arranged along at least one line. The plurality of lenses may be arranged in a matrix format. Such a camera may be referred to as an 'array camera'. When the second camera 121b is configured as an array camera, images may be photographed in various ways using a plurality of lenses, and images of better quality may be obtained.

The flash 124 may be disposed adjacent to the second camera 121b. The flash 124 shines light toward the subject when the subject is photographed by the second camera 121b.

The second sound output unit 152b may be additionally disposed on the terminal body. The second sound output unit 152b may implement a stereo function together with the first sound output unit 152a and may be used to implement a speakerphone mode during a call.

The terminal body may be provided with at least one antenna for wireless communication. The antenna may be built in the terminal body or formed in the case. For example, an antenna that forms part of the broadcast receiving module 111 (refer to FIG. 1A) may be configured to be pulled out from the terminal body. Alternatively, the antenna may be formed in a film type and attached to the inner side of the rear cover 103, or may be configured such that a case including a conductive material functions as an antenna.

The terminal body is provided with a power supply unit for supplying power to the mobile terminal 100. The power supply unit may include a battery 191 embedded in the terminal body or detachably configured from the outside of the terminal body.

The battery 191 may be configured to receive power through a power cable connected to the interface unit 160. In addition, the battery 191 may be configured to enable wireless charging through a wireless charger. The wireless charging may be implemented by a magnetic induction method or a resonance method (magnetic resonance method).

Meanwhile, in the drawing, the rear cover 103 is coupled to the rear case 102 to cover the battery 191 to limit the detachment of the battery 191 and to protect the battery 191 from external shock and foreign matter. To illustrate. When the battery 191 is detachably configured to the terminal body, the rear cover 103 may be detachably coupled to the rear case 102.

2 is an exploded rear perspective view of a part of a main component of the mobile terminal 100 according to the present invention.

The display unit 151 is provided on the front of the mobile terminal 100. The display unit 151 may include a display panel 151b that performs image output and a window 151a that protects the display panel 151b from the outside.

The display unit 151 may have a different structure according to an output method such as an LCD or an OLED. For example, in the former case, the display panel 151b may have a liquid crystal panel and a backlight unit. On the other hand, the OLED display panel 151b has a TFT layer, a C / F layer, etc., and thus the backlight unit may be omitted.

The display unit 151 may be mounted on the support frame 210 positioned on the rear surface. The support frame 210 may mean the front case 101 (see FIG. 1) or the middle case described above.

The back of the support frame 210 may be mounted on the substrate unit 220 to be described later. That is, the support frame 210 provides a counterpart having a display unit 151 at the front and a substrate unit 220 at the rear.

Therefore, the support frame 210 may be provided in the form of a panel having a size larger than that of the display unit 151 or the substrate unit 220. In some cases, the mobile terminal 100 may be exposed as a part of the exterior of the mobile terminal 100.

The support frame 210 may be formed of a plastic or metal having rigidity. In particular, when the metal is provided with a high thermal conductivity, it is easy to spread quickly by receiving heat such as the display unit 151 or the substrate unit 220.

The support frame 210 together with the cover frame 230 provided on the rear surface may form an electric component for driving an electronic configuration of the mobile terminal 100. The electrical component may be formed between the support frame and the cover frame 230.

The substrate unit 220 may be provided on the rear surface of the support frame 210 which is an electric component. The board unit 220 includes a printed circuit board (PCB) 221. The board unit 220 mounts electronic components necessary for driving the mobile terminal 100 and configures a circuit for sending and receiving signals.

The substrate unit 220 may be composed of a single printed circuit board 221 or may be composed of a plurality of layers of the printed circuit board 221. Recently, as the number of components mounted on the printed circuit board 221 increases and at the same time the mounting space of the mobile terminal 100 is narrowed, it is often implemented in the form of a plurality of layers of the printed circuit board 221.

In the case of a single printed circuit board 221, this is defined as a first printed circuit board 221a. As the printed circuit board 221a, the far printed circuit board is defined as the second printed circuit board 221b. The first printed circuit board 221a and the second printed circuit board 221b are sequentially stacked on the rear surface of the support frame 210.

Typically, the first printed circuit board 221a is a main printed circuit board (Main-PCB) on which most components are mounted, and the second printed circuit board (221b) is a multilayer printed circuit board on which relatively few components are mounted. (Stacked-PCB) In the present invention, the size and use of the printed circuit board are not separately distinguished.

The first printed circuit board 221a and the second printed circuit board 221b may be connected by an interposer printed circuit board 222 to exchange electronic signals with each other.

The cover frame 230 is provided on the rear portion of the substrate 220 to protect the substrate 220 or the battery 191. The cover frame 230 may form a rear appearance of the mobile terminal 100 in some cases.

The cover frame 230 may be provided with the rear case 102 described above, or may be implemented as a dual structure of the rear case 102 and the rear cover 103. Typically, only the rear case 102 is provided in the case of the battery 191 integrated mobile terminal 100, and the rear case 102 and the rear cover 103 are provided together in the case of the battery 191 replaceable mobile terminal 100. do.

In the case of the mobile terminal 100 integrated with the battery 191, in the former case, the cover frame 230 is the rear case 102, and in the latter case, the cover frame 230 is the rear case 102 and the rear cover 103. do.

Alternatively, as shown in FIG. 2, the rear case 102 may be provided by a combination of two members. The cover frame 230 in the form of the rear case 102 may be provided by combining the wireless charging module and the bracket 232 for mounting the wireless charging module and the glass cover 231 provided at the rear.

The chipset 241 is mounted on one surface of the substrate unit 220. One surface of the substrate unit 220 may mean any one of the front or rear surface of the first printed circuit board 221a when provided as a single printed circuit board, and is provided as a double printed circuit board. In this case, it means any one of the front or rear surface of the first printed circuit board 221a and the front or rear surface of the second printed circuit board 221b.

3 is a partial cross-sectional conceptual view of a mobile terminal 100 according to the present invention.

The heat transfer member 250 serves to transfer heat near the chipset 241 to a distant place. To this end, one side of the heat transfer member 250 may be in contact with a printed circuit board provided with the chipset 241, and the other side of the heat transfer member 250 may be in contact with a specific member 320 serving as a heat sink. The specific member serving as a heat sink may be any one of a support frame, a cover frame, or a printed circuit board without a corresponding chipset.

When the surface on which the chipset 241 is provided on one surface and the other surface on the other surface of the substrate 220 is the other surface, the heat transfer member 250 is provided on the other surface 2202 of the substrate 220. .

Unlike the structure in which the heat transfer member 250 is provided on the surface of the chip set 241, the heat dissipation is performed on the opposite side of the surface of the chip set 241. This is because when the heat dissipation to the side of the chip set 241 alone does not provide sufficient heat dissipation efficiency, or the member 310 to which the chipset 241 and the outer side of the chipset 241 face is located close to the opposite surface 3101. This is appropriate when there is a fear of heat concentration.

Therefore, the feature of the present invention can be applied to a chipset for 5G, in which heat generation of the chipset is high and heat may be concentrated. The chipset for 5G means a communication chipset using the 3.5 GHz band of Sub-6 and the 28-40 GHz band of mmWave. Especially in the case of mmWave band, because of the large transmission loss due to the frequency characteristics, a relatively large amount of power is required and heat generation is also higher. The chipset for 5G may include a radio frequency (IC) integrated circuit (IC), a radio frequency (RF), or a power amplifier.

Alternatively, the present invention can be applied to an application processor chipset used in a mobile terminal. Although it may be applied to other chipsets mounted in other mobile terminals, it is preferable to apply to the chipsets having a relatively high heat generation.

The heat transfer member 250 may be provided in an area corresponding to the area of the chipset 241 of the other surface 2202 of the substrate unit 220. The term "corresponding to" means that the region A provided with the chipset 241 and the region B provided with the heat transfer member 250 overlap at least partially with respect to the vertical direction of the surface of the substrate 220.

Preferably, the region B provided with the heat transfer member 250 is the same as the region B provided with the chipset 241 or included in the region B provided with the chipset 241.

One side of the heat transfer member 250 is in contact with the other surface (2202) of the substrate portion 220, the other side is in contact with the opposite surface (3201) of the member 320 facing the other side of the heat transfer member 250 chipset ( The heat of 241 is spread to other configurations.

The heat transfer member 250 may particularly include a thermoelectric element 251. The thermoelectric element 251 uses the Peltier effect. The thermoelectric element 251 to which the current is applied has a low temperature on one side and a high temperature on the other side. Heat is transferred from the heat radiation target by bringing the thermoelectric element 251 on the side at which the temperature is lowered into contact with the heat radiation target.

That is, the thermoelectric element 251 actively transmits heat to transfer heat generated from the chipset 241 to another area. When the thermoelectric element 251 is driven, the amount of heat generated may be increased in view of the entire mobile terminal 100, but there is a synergistic effect in preventing heat from being concentrated in one region.

The thermoelectric element 251 may be connected to the printed circuit board having the chipset 241 through the conductive line 253.

The thermoelectric element 251 may be made of ceramic. Due to the material characteristics of the thermoelectric element 251, the contact reliability between the thermoelectric element 251 and the other surface 2202 of the substrate 220 or the heat transfer member 250 is not sufficiently guaranteed. The air gap of the contact surface may occur. To solve this problem, the heat transfer member 250 may include a thermal interface material (TIM) 252 on at least one side of one side and the other side of the thermoelectric element 251.

The thermal interface material 252 may include at least one of a heat dissipation pad, a heat dissipation gel, and a grease. The thermal interface material 252 performs sufficient heat transfer and eliminates gaps that may occur between the thermoelectric element 251 and other members.

Alternatively, the thermal interface material 252 is not an essential component of the heat transfer member 250, and a bonding member or a tape may be substituted. Therefore, in the embodiments described below, the thermal interface material 252 may be omitted even if shown, or may be provided on at least one side of both sides of the thermoelectric element 251 even if not shown.

4 is a side view showing a package 240 mounting the chipset 241 for 5G according to the present invention.

4 (a) shows that the antenna 243 is provided in the package 240, and FIG. 4 (b) shows that the antenna 243 is a 5G chipset (eg, a package) of the package 240 through the flexible PCB 247. 241).

The 5G chipset 241 has a large loss in the atmosphere radiated from the antenna 243 and a loss in the substrate line reaching the antenna 243 due to the frequency characteristic.

In order to compensate for such a loss, it is generally provided in the form of a package 240 as shown in FIG.

In order to minimize the loss in the air may be provided with an array antenna 243. The array antenna 243 means that the plurality of antennas 243 having the same direction are provided in an array form.

In order to minimize the loss caused by the line, the chipset 241 and the antenna 243 are provided adjacent to each other. As shown in FIG. 4A, the chipset 241 and the antenna 243 are mounted together in the package 240 or adjacent to each other through the flexible PC 247 even though the package 240 is outside the package 240 as shown in FIG. 4B. You can.

Therefore, the chipset 241 and the antenna 243 are preferably provided on the same substrate or printed circuit board. Furthermore, it is preferable to be provided on the surface of the same printed circuit board. For example, when the chipset 241 is provided on the rear surface of the second printed circuit board, the antenna 243 may also be provided on the rear surface of the second printed circuit board.

The 5G chipset to be described later may be separately provided with the 5G chipset package of FIG. 4, or may be mounted on the board unit, or the board unit may serve as a chipset PC ratio. Therefore, it is assumed that the two are not distinguished for convenience of explanation.

5 to 7 illustrate an embodiment of a mobile terminal 100 in which a chipset is mounted on a rear surface of a second printed circuit board 221b.

The chipset 241 for 5G should satisfy the condition of the package 240 described above and be provided at a place where the radiation performance is sufficiently guaranteed in the mobile terminal 100. Accordingly, the 5G chipset package 240 may be mounted on the rear surface of the second printed circuit board 221b provided adjacent to the outside of the mobile terminal 100.

The outer side of the chipset 241 may face the cover frame 230. When the chipset 241 generates a large amount of heat, one region of the cover frame 230 corresponding to the chipset 241 may be overheated. In particular, if the cover frame 230 forms the outermost rear surface of the mobile terminal 100, the user may cause an image.

The heat transfer member 250 is provided on the front surface of the second printed circuit board 221b to perform heat radiation.

Referring to FIG. 5, when the chipset 241 is provided in one region of the second printed circuit board 221b that does not overlap with the first printed circuit board 221a, the other side of the heat transfer member 250 may have a support frame 210. ). That is, in this case, the opposing surface 3201 described above becomes the rear surface of the supporting frame 210.

Since the support frame 210 is provided in a wide plate shape parallel to the front or rear surface of the mobile terminal 100, the support frame 210 serves as a heat sink of a large area. Thus, heat is not concentrated and spreads relatively broadly to prevent sudden temperature rises at specific points.

Referring to FIG. 6, even when the chipset 241 is provided in one region of the second printed circuit board 221b that does not overlap with the first printed circuit board 221a, the heat transfer member 250 may be used. The other side of the heat pipe 261 may be indirectly connected to the support frame 210. In this case, the heat pipe 261 may be provided to contact the support frame 210.

Since the heat pipe 261 connects the support frame 210 and the heat transfer member 250 indirectly, heat transfer can be performed far away from the heat generation point as compared with the case where the heat pipe 261 is not provided. Compared to the case of FIG. 5, the heat radiation efficiency may be increased.

The heat pipe 261 of the present embodiment may perform heat dissipation of not only the chipset 241 provided on the rear surface of the second printed circuit board 221b but also other chipsets 242. As shown in FIG. 6, heat dissipation of the application processor chipset 242 may be performed together.

Referring to FIG. 7, a chipset 241 may be provided in an area of the second printed circuit board 221b overlapping the first printed circuit board 221a. In this case, the other side of the heat transfer member 250 may be provided to contact the first printed circuit board 221a. That is, the first printed circuit board 221a may serve as a heat sink that receives heat transfer from the chipset 241 and radiates heat.

Furthermore, the at least one other chipset 242 mounted on the first printed circuit board 221a may have the support frame 210 through the thermal interface material 252 or the heat pipe 261 as shown in FIG. 7. And secondarily heat transfer can be performed.

8 illustrates an embodiment of a mobile terminal 100 in which a chipset 241 is mounted on a rear surface of a first printed circuit board 221a, and FIG. 9 shows a chipset 241 on a rear surface of a first printed circuit board 221a. It relates to an embodiment of the mounted mobile terminal 100.

Unlike the embodiment of FIGS. 5 to 7, the chipset 241 may be provided on the first printed circuit board 221a as shown in FIGS. 8 and 9.

FIG. 8 illustrates an embodiment in which the chipset 241 is provided in an area of the rear surface of the first printed circuit board 221a that does not overlap the second printed circuit board 221b.

The heat transfer member 241 is provided on the front surface of the first printed circuit board 221a so that one side of the heat transfer member 241 is in contact with the area where the chipset 241 is mounted, and the other side is provided on the support frame 210 or the support frame 210. The heat pipe 261 or the like can be in contact with the configuration. Other heat transfer member 241 features are as described above.

When the chipset 241 is provided on the rear surface of the first printed circuit board 221a, the distance to the cover frame 230 is relatively longer than that provided on the rear surface of the second printed circuit board 221b. Heat can be prevented from being concentrated in the 230, and a short distance to an opposite surface such as the support frame 210 or the heat pipe 261 enables short heat transfer.

9 illustrates an embodiment in which the chipset 241 is provided in a region of the front surface of the first printed circuit board 221a that does not overlap the second printed circuit board 221b.

When the chipset 241 is provided as the 5G chipset 241, the 5G chipset 241 is directional in frequency characteristics. The chipset 241 for 5G can exhibit radiation performance on the outer 180 ° region.

Based on the above-described features, when the 5G chipset 241 is provided on the front surface of the first printed circuit board 221a as shown in FIG. 9, radio waves may be radiated to the front of the mobile terminal 100.

The heat transfer member 250 is provided on the rear surface of the first printed circuit board 221a in the region where the chipset 241 is provided. One side of the heat transfer member 250 contacts the front surface of the first printed circuit board 221a and the other side contacts the front surface of the second printed circuit board 221b to transfer heat from the chipset 241 to the second printed circuit board 221b. Can be.

If necessary, the heat transfer member 250 may be additionally provided on the rear surface of the second printed circuit board 221b (not shown). Heat of the second printed circuit board 221b may be transferred to the cover frame 230 so that heat may be dispersed. However, it is preferable that the heat transfer member 250 does not directly contact the back surface of the first printed circuit board 221a and the cover frame 230. This is because heat of the chipset 241 is transferred directly to the cover frame 230 due to the heat transfer member 250 so that heat may be concentrated in one region of the cover frame 230.

When the display panel 151b is provided in an LCD form, the display panel 151b is generally surrounded by a metal plate. As a result, in order to prevent the interference of the 5G chipset 241, the display panel 151b of the display unit 151 and the metal plate covering the same may be provided to avoid an area corresponding to the 5G chipset 241. Can be.

It is apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit and essential features of the present invention.

The above detailed description should not be construed as limiting in all respects but should be considered as illustrative. The scope of the invention should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the invention are included in the scope of the invention.

The above-described features can be applied in part or in whole to all mobile terminals.

Claims

A display unit provided at the front side;

A support frame provided on a rear surface of the display unit to support the display unit;

A substrate unit including a first printed circuit board and a second printed circuit board sequentially stacked on a rear surface of the support frame;

A cover frame provided on a rear surface of the substrate to form a rear exterior;

A chipset provided on one surface of either the first printed circuit board or the second printed circuit board; And

One side is in contact with the other surface of the printed circuit board provided with the chipset, the other side includes a heat transfer member in contact with any one of the support frame, the cover frame or the printed circuit board is not provided with the other surface Mobile terminal.
According to claim 1,

The heat transfer member includes a thermoelectric element having a lower temperature at one side and a higher temperature at the other side.
The method of claim 2,

The heat transfer member,

A thermal interface material (TIM) provided on at least one side of one side or the other side of the thermoelectric element,

The thermal interface material is any one of a heat dissipation pad (Pad), heat dissipation gel (Gel), grease (Grease).
The method of claim 2,

The thermoelectric element,

A mobile terminal, characterized in that the conducting wire is connected to the printed circuit board equipped with the chipset.
According to claim 1,

In a printed circuit board provided with the chipset, the area in which the chipset is provided and the area in which the heat transfer member is provided overlap at least one area.
According to claim 1,

The chipset comprises a 5G RF chipset.
The method of claim 6,

The chipset is provided on the same printed circuit board as the 5G RF antenna.
According to claim 1,

The chipset is provided on the rear surface of the first printed circuit board or the second printed circuit board,

The heat transfer member is a mobile terminal, characterized in that contact with the front and the support frame of the printed circuit board equipped with the chipset.
The method of claim 8,

The mobile terminal further comprises a heat pipe provided between the heat transfer member and the support frame.
According to claim 1,

The chipset is provided on the back of the second printed circuit board,

And the heat transfer member contacts the front surface of the second printed circuit board and the rear surface of the first printed circuit board.
According to claim 1,

The chipset is provided on the front surface of the first printed circuit board,

The heat transfer member is in contact with the rear surface of the first printed circuit board and the front surface of the second printed circuit board.
The method of claim 11, wherein

The display unit,

Display panel;

A metal plate covering a rear surface of the display panel; And

A window covering a front surface of the display panel;

The metal plate is not provided for the area overlapping with the chipset.