WO2019195622A1 - Coupleur directionnel indépendant de la polarisation - Google Patents

Coupleur directionnel indépendant de la polarisation Download PDF

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Publication number
WO2019195622A1
WO2019195622A1 PCT/US2019/025897 US2019025897W WO2019195622A1 WO 2019195622 A1 WO2019195622 A1 WO 2019195622A1 US 2019025897 W US2019025897 W US 2019025897W WO 2019195622 A1 WO2019195622 A1 WO 2019195622A1
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WO
WIPO (PCT)
Prior art keywords
optical
optical signal
signal
directional coupler
waveguides
Prior art date
Application number
PCT/US2019/025897
Other languages
English (en)
Inventor
Faraz MONIFI
Bryan Park
Original Assignee
Finisar Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/157,946 external-priority patent/US10797801B2/en
Application filed by Finisar Corporation filed Critical Finisar Corporation
Publication of WO2019195622A1 publication Critical patent/WO2019195622A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/12147—Coupler

Definitions

  • the embodiments discussed herein relate to a polarization independent directional coupler.
  • Fiber optics and optoelectronics are important aspects of modem optical networks because they allow for efficient and accurate transmission of optical data between various components in a network system.
  • An optical transceiver module (“transceiver”), which may include an optical receiver, is an example of a modular component that is used in optical networks.
  • Signals in optical communication systems often need to be conditioned prior to being processed by a receiver. Some conditioning may include splitting or attenuating the optical signal prior to the receiver.
  • Optical signals received from a fiber optic transmission line typically include optical signals exhibiting both TE polarization and TM polarization. Conditioning of these signals often results in disparate extinction ratios for TE and TM polarized signals.
  • Some embodiments discussed herein are related to polarization independent directional couplers.
  • a directional coupler may include a first waveguide and a second waveguide.
  • the first waveguide may include an optical input port to receive an optical signal and a first output port.
  • the second waveguide may include a terminated port and a second output port.
  • the first and second waveguides may be spaced apart in a first region.
  • the first and second waveguides may be decreasingly spaced apart with respective slopes of the first and second waveguides in a second region.
  • the first and second waveguides may be substantially parallel for a distance L and spaced apart by an optical coupling gap G in a third region.
  • the first and second waveguides may be increasingly spaced apart with respective slopes of the first and second waveguides in a fourth region.
  • the first and second waveguides may be spaced apart in a fifth region.
  • a directional coupler may include a first waveguide and a second waveguide.
  • the first waveguide may include an optical input port to receive an optical signal and a first output port.
  • the second waveguide may include a terminated port and a second output port.
  • the first and second optical waveguides may be configured to split the optical signal such that a first portion of the optical signal is directed to the first output port and a second portion of the optical signal is directed to the second output port.
  • the first portion of the optical signal may include first substantially equal portions of a transverse magnetic (TM) polarization mode and a transverse electric (TE) polarization mode of the optical signal.
  • the second portion of the optical signal may include second substantially equal portions of the TM polarization mode and the TE polarization mode of the optical signal.
  • a system may include an optical receiver and a directional coupler.
  • the optical receiver may be formed on a silicon substrate.
  • the directional coupler may be formed on the silicon substrate and may include a first waveguide and a second waveguide.
  • the first waveguide may be formed on the silicon substrate with the optical receiver and may include an optical input port to receive an optical signal and a first output port.
  • the second waveguide may be formed on the silicon substrate with the optical receiver and may include a terminated port and a second output port.
  • the first and second waveguides may be spaced apart to inhibit optical coupling in a first region.
  • the first and second waveguides may be decreasingly spaced apart in a second region in a direction from the first region to a third region.
  • the first and second waveguides may be substantially parallel for a distance L and spaced apart by an optical coupling gap G in the third region to facilitate optical coupling in the third region.
  • the first and second waveguides may be increasingly spaced apart in a fourth region in a direction from the third region to a fifth region.
  • the first and second waveguides may be spaced apart to inhibit optical coupling in the fifth region.
  • Figure 2A depicts an example optical receiver system
  • Figure 2B depicts another example optical receiver system
  • Figure 3 illustrates another example optical receiver system
  • Figure 4 depicts an example system including a plurality of optical front-ends
  • Figure 5 illustrates an example optoelectronic module including at least one optical receiver
  • Figure 6 illustrates an example implementation of a directional coupler of the optical receiver systems of Figures 2A-3;
  • Figure 7 depicts plots of simulated results of the directional coupler of Figure 6;
  • Figure 8 is an overhead view of an example SiN-Si multimode adiabatic coupler; and Figure 9 illustrates an example optical system in which the SiN-Si multimode adiabatic coupler of Figure 8 may be implemented,
  • polarization independent directional couplers which may be implemented in and/or with, e g., optical receivers.
  • optical receivers may include multiple signal paths, which may each carry signals of comparable polarizations or polarization ratios.
  • Optical transceivers may include a receiver optical subassembly (“ROSA”) and a transmitter optical subassembly (“TOSA”).
  • the ROSA may include a photodiode or other optical detector for detecting optical signals and sensing circuitry for converting the optical signals to electrical signals compatible with other network components.
  • the TOSA may include a laser or other suitable light source for transmitting optical signals and may further include control circuitry for modulating the laser according to an input digital data signal and a photodetector to monitor laser power.
  • TIA photodetector/transimpedance amplifier
  • a transimpedance circuit may include shunt elements at an input of the TIA, a reduced input stage gain, and/or signal clamping circuits that may complicate the design and compromise the sensitivity and linearity of a TIA input stage.
  • some embodiments described herein may include an optical receiver with a large dynamic range and linearity without the complicated design, compromised sensitivity, and compromised linearity of conventional optical receivers.
  • Silicon photonics or other integrated photonic technologies may enable use of multiple integrated photodetectors and the ability to split an incoming signal into multiple signal paths.
  • Directional couplers may offer extremely low optical insertion loss and controlled splitting ratios, which, when combined with the integrated photodetectors, enable new circuit topologies that may circumvent the limitations found in conventional optical receivers.
  • FIG. 1 illustrates an example optical receiver system 100 (hereinafter“system 100”), arranged in accordance with at least one embodiment described herein.
  • the system 100 which may include, for example, an optical receiver, includes an optical fiber 102, a fiber coupler or spot size converter 104, and a photonic integrated circuit (PIC) 106.
  • the optical fiber 102 may include any type of optical fiber, such as a multi-mode fiber or single-mode fiber, configured to transmit an optical signal.
  • an optical signal may be transmitted to the photonic IC 106 via the optical fiber 102 and the spot size converter 104.
  • Figure 2A depicts an example optical receiver system 200A (hereinafter system 200A), arranged in accordance with at least one embodiment described herein.
  • the system 200A may include, correspond to, or be included in the system 100 of Figure 1.
  • the system 200A which includes an optical receiver, includes the optical fiber 102 and the spot size converter 104 of Figure 1.
  • the system 200A further includes a directional coupler 206 and multiple signal paths.
  • the system 200A includes signal paths 207A and 207B, collectively hereinafter“signal paths 207”.
  • the signal path 207A includes a photodetector 208A, a TIA 210A, and an interpolator 212.
  • the signal path 207B includes a photodetector 208B, a TIA 210B, and an interpolator 212.
  • the TIAs 210A, 210B may be collectively referred to hereinafter as“TIAs 210”.
  • the path 207B further includes a waveguide terminator 209.
  • Each of photodetectors 208A and 208B may be configured to generate a current in response to an incident optical signal.
  • the optical power of the incident optical signal may determine the current that flows in the corresponding one of the photodetectors 208.
  • the optical signal may generate a current in the photodetectors 208 that corresponds to a digital data carried via the optical fiber 102.
  • the TIA 210A and TIA 210B maybe similar, or identical, circuits, and may be configured for optimal input referred noise performance.
  • the system 200A may be configured to enable one signal path (e.g., either the signal path 207A or 207B) and to disable the other signal path based on an output power level within the system 200A (e g., within one of the signal paths 207).
  • the interpolator (also referred to herein as“adder”) 212 is coupled to an output of each of the TIA 210A and the TIA 210B.
  • the system 200A includes an amplifier 214 coupled to an output of the interpolator 212, and an optical power sensing circuit 216, which may be coupled to the TIA 210A, the TIA 210B, the interpolator 212, and/or the amplifier 214.
  • the optical power sensing circuit 216 may be configured to detect an optical power level within the system 200A. More specifically, the optical power sensing circuit 216 may detect the optical power level within, for example, the TIA 210A, the TIA 210B, at an output of the interpolator 212, and/or at an output of the amplifier 214. Further, as described more fully below, based on the detected optical power level, the system 200A may transition between the signal paths 207 (e.g., from the signal path 207A to the signal path 207B, or vice versa). The optical power sensing circuit 216 may also be referred to as and/or may include an optical power sensor.
  • the photonic IC 106 may include and/or may have coupled thereto the directional coupler 206, the photodetectors 208, the TIA 210A, the TIA 210B, the interpolator 212, the amplifier 214, and/or the optical power sensing circuit 216 of Figure 2A.
  • an optical signal may be received at the directional coupler 206, and the directional coupler 206 may split the received optical signal into two portions, each directed to a different one of the signals paths 207.
  • one signal path such as the signal path 207A
  • another signal path such as the signal path 207B
  • another portion e.g., another percentage, such as a lesser percentage
  • the signal path 207A may be configured to convey X% of the optical signal while the signal path 207B may be configured to convey 100-C% of the signal.
  • X may be a value between substantially 75 and substantially 100.
  • the signal path 207A may convey 75% of the optical signal and the signal path 207B may convey 25% of the optical signal.
  • the signal path 207A may convey 80% of the optical signal and the signal path 207B may convey 20% of the optical signal. In yet another example, the signal path 207A may convey 90% of the optical signal and the signal path 207B may convey 10% of the optical signal.
  • system 200A is illustrated in Figure 2A as including two signal paths 207, the present disclosure is not so limited. More generally, the system 200A may include multiple signal paths (e.g., two signal paths, three signal paths, four signal paths, five signal paths, etc.)
  • each of the photodetectors 208 may generate an associated electrical signal, such as a current signal, which may be conveyed to an associated one of the TIAs 210. More specifically, the photodetector 208A may convey a current signal to the TIA 210A and the photodetector 208B may convey a current signal to the TIA 210B.
  • one of the TIA 210A and the TIA 210B may be enabled and the other of the TIA 210A and the TLA 210 may be disabled. More specifically, in some embodiments, the signal path 207A, and more specifically the TIA 210A, may be configured to be enabled (e.g., in an active mode) at low optical power, and the signal path 207B, and more specifically the TIA 210B, may be configured to be disabled (e.g., in a non-active mode) (e.g., at the same low optical power).
  • an output signal out of the TIA 210A may be distorted while an output signal out of the TIA 210B, which may be a fraction of the output signal of the TIA 210A (e.g., ((100-C)/C)), may be linear.
  • the signal path 207A may be configured to be disabled (e.g., non-active) at high optical power
  • the TIA 210B may be configured to be enabled (e.g., active) at high optical power since the TIA 210B receives only a fraction of the optical power and thus generates a non-distorted signal at its output even when the optical power of the optical signal received by the system 200A is a high optical power.
  • the optical power sensing circuit 216 may be configured to detect the optical power level in the system 200A based on, e.g., the output of the TIA 210A, the output of the TIA 210B, the output of the interpolator/adder 212, and/or the output of the amplifier 214. Alternatively or additionally, the optical power sensing circuit 216 may control switchovers between the TIA 210A and the TIA 210B depending on the detected optical power. For example, if the detected optical power increases from low optical power to high optical power, e.g., if the detected optical power increases above a threshold optical power, the optical power sensing circuit 216 may disable the TIA 210A and enable the TIA 21 OB.
  • the optical power sensing circuit 216 may enable the TIA 210A and disable the TIA 21 OB.
  • there may be a transitional input optical power range (described below) defined between a first threshold optical power and a second threshold optical power; if the detected optical power increases from below or above the transitional input optical power range into the transitional input optical power range, the optical power sensing circuit 216 may enable both of the TIAs 210 until the detected optical power is outside the transitional input optical power range.
  • transitioning from one signal path to another signal path may be substantially instantaneous (e.g., only one TIA conveying a signal at any one time).
  • a transition period may exist wherein more than one path may be active, and one path may ramp-up and another path may ramp-down during the transition period (e.g., a time period).
  • a transitional input optical power range to activate one signal and deactivate another signal path may exist.
  • the interpolator 212 may select the output of one or both of the TIAs 210 to output to the amplifier 214, e.g., based on a control signal from the optical power sensing circuit. Alternatively or additionally, the interpolator 212 may combine, e.g., add, the output of the TIA 210A and the output of the TIA 21 OB to output to the amplifier 214. For example, if both TIAs 210 are enabled, e g., during a transition period where the detected optical power is in the transitional input optical power range, a control signal from the optical power sensing circuit 216 may cause the interpolator 212 to add the outputs of the TIAs 210 to output the combined output to the amplifier 214.
  • the amplifier 214 may be configured to amplify the output of the interpolator 212 to be at or near a target output level and/or within a target output level range of the system 200A.
  • the amplifier 214 may include an amplifier or an attenuator with a fixed or variable gain, such as a variable gain amplifier (VGA), with or without automatic gain control.
  • VGA variable gain amplifier
  • the output of the interpolator 212 may have a signal amplitude proportional to the signal at the output of the TIA 210A until it reaches a crossover region (or transitional input optical power range of the system 200 A), at which point the amplitude at the output of the interpolator 212 may remain constant until the first signal path 207A is no longer active.
  • the output of the interpolator 212 may have a signal amplitude proportional to the signal at the output of the second TIA 21 OB.
  • the amplifier 214 may include internal automatic gain control (see, e.g., Figure 4) to provide linearity.
  • the directional coupler 206 may include a polarization dependent directional coupler 206. In other embodiments, the directional coupler 206 may include a polarization independent directional coupler 206. An example polarization independent directional coupler is described in more detail elsewhere herein.
  • Figure 2B depicts another example optical receiver system 200B (hereinafter“system 200B”), arranged in accordance with at least one embodiment described herein.
  • the system 200B may include, correspond to, or be included in the system 100 of Figure 1.
  • the system 200B of Figure 2B may include the same or similar components as the system 200A of Figure 2 A, including the directional coupler 206, the signal paths 207, the photodetectors 208, the TIAs 210, the interpolator 212, the amplifier 214, and the optical power sensing circuit 216. Accordingly, the system 200B may generally function in the same or similar manner as the system 200A, and a description of the foregoing components and the operation of the system 200B will not be repeated.
  • the system 200B of Figure 2B includes two silicon nitride (SiN)-silicon (Si) couplers 204A, 204B (collectively hereinafter“SiN-Si couplers 204”), including one in each of the signal paths 207.
  • the SiN-Si coupler 204A may be included in the signal path 207A to couple one output of the directional coupler 206 to the photodetector 208A of the signal path 207A
  • the SiN-Si coupler 204B may be included in the signal path 207B to couple another output of the directional coupler 206 to the photodetector 208B of the signal path 207B.
  • An example implementation of the SiN-Si couplers 204 is described elsewhere.
  • Figure 3 depicts another example optical receiver system 300 (hereinafter“system 300”), arranged in accordance with at least one embodiment described herein.
  • the system 300 may include, correspond to, or be included in the system 100 of Figure 1.
  • the system 300 may be implemented with silicon photonics technology devices.
  • the system 300 which may include an optical receiver, includes the optical fiber 102 and an interface 303, which may include, for example, a grating coupler, a spot size converter, and/or a polarization splitter.
  • the system 300 further includes directional couplers 306A and 306B (collectively “directional couplers 306”). Further, in this embodiment, the system 300 includes multiple signal paths 307A and 307B (collectively “signal paths 307”).
  • the signal path 307A includes a photodetector 308A, the TIA 210A and the interpolator 212.
  • the signal path 307B includes a photodetector 308B, the TIA 210B, and the interpolator 212.
  • the photodetectors 308A, 308B may be collectively referred to as“photodetectors 308”)
  • the interface 303 includes a polarization splitter
  • transverse electric (TE) waves of the received optical signal may be transmitted to one of the directional couplers 306 and transverse magnetic (TM) waves of the received optical signal may be transmitted to the other one of the directional couplers 306.
  • the interpolator 212, the amplifier 214, and/or the optical power sensing circuit 216 may operate within the system 300 in a similar or identical manner as in the system 200A and as already described above.
  • Each of photodetectors 308 may be configured to generate a current in response to an incident optical signal.
  • the optical power of the incident optical signal may determine the current that flows in each of the photodetectors 308.
  • the optical signal may generate a current in the photodetectors 308 that corresponds to a digital data carried via the optical fiber 102.
  • the system 300 further includes the interpolator 212 coupled to an output of each of the TIA 210A and TIA 210B, the amplifier 214 coupled to an output of the interpolator 212, and the optical power sensing circuit 216, which may be coupled to the TIAs 210, the interpolator 212, and/or the amplifier 214.
  • the photonic IC 106 may include and/or may have coupled thereto the directional couplers 306, the photodetectors 308, the TIAs 210, the interpolator 212, the amplifier 214, and/or the optical power sensing circuit 216 of Figure 3.
  • an optical signal propagating on the optical fiber 102 is received at the interface 303 and may be divided into a first component with a first polarization (e.g., TE polarization) and a second component with a second polarization (e.g., TM polarization).
  • a first polarization e.g., TE polarization
  • a second component with a second polarization e.g., TM polarization
  • One of the polarization components may be directed to the directional coupler 306A and the other of the polarization components may be directed to the other directional coupler 306B.
  • the directional coupler 306A may split a received optical signal, such as one of the polarization components received from the interface 303, into two portions, each directed to a different one of the signal paths 307.
  • the directional coupler 306B may split a received optical signal, such as the other one of the polarization components received from the interface 303, into two portions, each directed to a different one of the signal paths 307.
  • one path, such as path 307 A may be configured to convey a certain portion (e.g., a percentage) of a received optical signal and another signal path, such as the signal path 307B, may be configured to convey another portion (e.g., another percentage, such as a lesser percentage) of the received optical signal.
  • the signal path 307A may be configured to convey X% of the received optical signal (whether from either or both of the directional couplers 306) while the signal path 307B may be configured to convey 100-X% of the received optical signal (whether from either or both of the directional couplers 306).
  • X may be a value between substantially 75 and substantially 100.
  • the signal path 307A may convey 75% of the received optical signal and the signal path 307B may convey 25% of the signal.
  • the signal path 307A may convey 80% of the received optical signal and the signal path 307B may convey 20% of the received optical signal In yet another example, the signal path 307A may convey 90% of the received optical signal and the signal path 307B may convey 10% of the received optical signal.
  • the system 300 is illustrated in Figure 3 as including two signal paths 307, the present disclosure is not so limited. More generally, the system 300 may include multiple signal paths (e g., two signal paths, three signal paths, four signal paths, five signal paths, etc.)
  • each of photodetectors 308 may generate an associated electrical signal, such as current signal, which may be conveyed to an associated one of the TIAs 210. More specifically, the photodetector 308A may convey a current signal to the TIA 210A and the photodetector 308B may convey a current signal to the TIA 210B.
  • one of the TIA 210A and the 210B may be enabled and the other of the TIA 210A and the TIA 210 may be disabled in the system 300. More specifically, in some embodiments, the signal path 307A, and more specifically the TIA 210A, may be configured to be in an active mode at low optical power, and the signal path 307B, and more specifically the TIA 210B, may be configured to be disabled at low optical power. Alternatively or additionally, both of the TIAs 210 may be enabled during a transition period in which the detected optical power is within a transitional input optical power range.
  • an output signal out of the TIA 210A may be distorted while an output signal out of the TIA 210B, which may be a fraction of the output signal of the TIA 210A, may be linear. Accordingly, in some embodiments, the signal path 307A, and more specifically the TIA 210A, may be configured to be disabled at high optical power, and the TIA 210B may be configured to be active at high optical power. Accordingly, the dynamic range of the system 300 may be improved.
  • transitioning from one signal path to another signal path may be substantially instantaneous (e.g., only one TIA conveying a signal at any one time).
  • more than one signal path may be active for a transition period, e.g., one signal path may ramp-up and the other signal path may ramp-down during the transition period (e.g , a time period).
  • FIG 4 is a block diagram depicting an example system 400, arranged in accordance with at least one embodiment described herein.
  • the system 400 includes photodetectors 451 A, 45 IB (collectively“photodetectors 451”), receiver front-ends 452A, 452B (collectively “receiver front-ends 452”), the interpolator 212, a control 454, a first VGA 456, a second VGA 458, a buffer 460, and an automatic gain control (AGC) 462.
  • Each of the receiver front-ends 452 may include at least a portion of the system 200A (see Figure 2A) or at least a portion of the system 300 (see Figure 3).
  • the receiver front-end 452A and/or the receiver front-end 452B may include the TIA 210A and/or the TIA 210B (see Figures 2A-3).
  • the photodetectors 451 may include or correspond to the photodetectors 208, 308 (see Figures 2A-3), while the control 454 may include, may be included in, and/or may correspond to the optical power sensing circuit 216 of Figures 2A-3.
  • the system 400 may be operated in the same or a similar manner to one or more of the systems 200 A, 200B, 300.
  • the control 454 may sense average optical power, e.g., at one or both of the photodetector 451, and may activate one or both of the receiver front ends 452 and/or may deactivate one of the receiver front ends 452 depending on the detected optical power.
  • the interpolator 212 interpolates output(s) of the receiver front end(s) 452.
  • the output of the interpolator 212 may need to be further amplified or attenuated to reach a target output level
  • the amplification or attenuation may be provided by one or both VGAs 456, 458, and the amount of amplification or attenuation may be controlled through an AGC loop that includes the AGC 462.
  • the buffer 460 may provide a drive capability to deliver a final output of the system 400.
  • FIG. 5 illustrates an example optoelectronic module 500 (hereinafter“module 500”), arranged in accordance with at least one embodiment described herein.
  • the module 500 may be configured for use in transmitting and receiving optical signals in connection with a host device (not shown). Alternatively or additionally, the module 500 may include a portion or all of one or more of the systems 100, 200A, 300, 400 described herein.
  • the module 500 may include a bottom housing 502, a receive port 504, and a transmit port 506.
  • the module 500 further includes a PCB 508 positioned within the bottom housing 502.
  • the PCB 508 may include one or more integrated circuits (e.g., a first integrated circuit 520 and a second integrated circuit 522) positioned thereon.
  • the module 500 includes a ROSA 510 and a TOSA 512 also positioned within bottom housing 502.
  • An edge connector 514 may be located on an end of the PCB 508 to enable the module 500 to electrically interface with a host device.
  • the PCB 508 may facilitate electrical communication between the host device and the ROSA 510 and between the host device and the TOSA 512.
  • the module 500 may additionally include a top housing that cooperates with the bottom housing 502 to at least partially enclose one or more of the other components of the module 500.
  • the module 500 may be configured for optical signal transmission and reception at a variety of data rates, such as 1 Gb/s, 10 Gb/s, 20 Gb/s, 40 Gb/s, 100 Gb/s, or higher, or other data rates.
  • the module 500 may be configured for optical signal transmission and reception at various distinct wavelengths using wavelength division multiplexing (WDM) using one of various WDM schemes, such as Coarse WDM, Dense WDM, or Light WDM.
  • WDM wavelength division multiplexing
  • the module 500 may be configured to support various communication protocols, such as Fibre Channel and High Speed Ethernet.
  • the module 500 may be configured in any of a variety of different form factors, such the Small Form-factor Pluggable (SFP), the enhanced Small Form-factor Pluggable (SFP+), the 10 Gigabit Small Form Factor Pluggable (XFP), the C Form-factor Pluggable (CFP) and the Quad Small Form-factor Pluggable (QSFP) multi -source agreements (MS As).
  • SFP Small Form-factor Pluggable
  • SFP+ enhanced Small Form-factor Pluggable
  • XFP 10 Gigabit Small Form Factor Pluggable
  • CFP C Form-factor Pluggable
  • QSFP Quad Small Form-factor Pluggable multi -source agreements
  • the ROSA 510 may house one or more optical receivers (e.g., system 200A of Figure 2A, system 200B of Figure 2B, and/or system 300 of Figure 3) that are electrically coupled to an electrical interface 516.
  • the one or more optical receivers may be configured to convert optical signals received through the receive port 504 into corresponding current electrical signals that are relayed to an integrated circuit (e.g., within the ROSA 510) (not shown in Figure 5; see e.g., integrated circuit 106 of Figure 1) through an electrical interface 516 and the PCB 508.
  • the TOSA 512 may house one or more optical transmitters, such as lasers, that are electrically coupled to another electrical interface 518.
  • the one or more optical transmitters may be configured to convert electrical signals received from a host device by way of the PCB 508 and the electrical interface 518 into corresponding optical signals that are transmitted through the transmit port 506.
  • an integrated circuit (not shown in Figure 5), which may be similar to and/or correspond to the integrated circuit 106 of Figure 1 or other integrated circuit, may be integrated within the ROSA 510 and may be configured to convert the current electrical signals to voltage electrical signals and to equalize the voltage electrical signals.
  • the integrated circuit may drive the equalized voltage electrical signals to a second integrated circuit (e.g., within the ROSA 510 and/or on the PCB 508), which, in some embodiments, may be a CDR circuit.
  • a second integrated circuit e.g., within the ROSA 510 and/or on the PCB 508
  • an integrated circuit such as the integrated circuit 106 of Figure 1
  • module 500 may be made to without departing from the scope of the present disclosure.
  • the module 500 illustrated in Figure 5 is one architecture in which embodiments of the present disclosure may be employed. This specific architecture is only one of countless architectures in which embodiments may be employed. The scope of the present disclosure is not intended to be limited to any particular architecture or environment.
  • Figure 6 illustrates an example implementation of the directional coupler 206 of Figures 2A-3, arranged in accordance with at least one embodiment described herein.
  • the directional coupler 206 of Figures 2A-3 may have different implementations than illustrated in Figure 6, which is provided as one example implementation only.
  • the directional coupler 206 of Figure 6 may be an 80/20 polarization independent directional coupler implemented in SiN in some embodiments.
  • the directional coupler 206 may be configured as paths or branches formed of SiN waveguides, e.g., SiN cores surrounded on one or more sides by a cladding.
  • Figure 6 illustrates the waveguide cores.
  • the directional coupler 206 may be formed with two SiN waveguides 607A and 607B (hereinafter collectively“waveguides 607”, or individually“first waveguide 607A” and “second waveguide 607B”) along or at least coupled to the signal paths 207A and 207B.
  • the waveguides 607 are formed generally to run parallel with each other and then formed with a reduced separation distance of a gap G of at least a distance 602 to facilitate optical coupling of the optical signal.
  • Each branch formed by the first waveguide 607A and the second waveguide 607B includes an enlarged gap input section 604, a decreasing gap input section 606 with a slope of approximately dy/dx, a minimum gap section 608 (also designated as having a length L where the gap G is at a minimum), an increasing gap section 610 with a slope of approximately dy/dx, and an enlarged gap output section 612.
  • first and second waveguides 607A and 607B are formed to have a waveguide width W illustrated as width 614 and a waveguide thickness T (e.g., in and out of the page in Figure 6).
  • the width W, thickness T, and/or other dimensions and parameters may refer to dimensions and parameters of the cores of the waveguides 207 unless otherwise noted.
  • the width W 614 may refer to the width of the waveguide core of each of the waveguides 607.
  • the SiN material may be formed from a silicon nitride (S13N4) material or other suitable material, e.g., with a high refractive index of about 1.9 used to determine a coupling length for the TE and TM polarization modes.
  • the first waveguide 607A may include an input port 616 and a first output port 618 with the first waveguide 607A being configured with a consistent width W and thickness T along all or part of its total length.
  • the second waveguide 607B may include a terminated port 620 and a second output port 622 with the second waveguide 607B also being configured with a consistent width W and thickness T along all or part of its total length.
  • the input port 616 of the first waveguide 607A may be optically coupled to, e.g., the optical fiber 102 of Figure 2B through the spot size converter 104.
  • the first output port 618 of the first waveguide 607A may be optically coupled to, e.g., the first photodetector 208A, either directly (Figure 2A) or through the SiN-Si coupler 204A ( Figure 2B).
  • the terminated port 620 of the second waveguide 607B may be optically coupled to, e.g., the waveguide terminator 209 of Figure 2A or 2B.
  • the second output port 622 of the second waveguide 607B may be optically coupled to, e.g., the second photodetector 208B, either directly (Figure 2A) or through the SiN-Si coupler 204B ( Figure 2B).
  • Figure 6 further illustrates a table identifying example values for various dimensions of the directional coupler 206.
  • the identified dimensions are merely illustrative for an example manufacturing process.
  • the example dimensions in the table for the directional coupler 206 may result in an approximately 80%-20% split of the input signal and may provide approximately equal distribution of the TE and TM polarization of the signals in each of the first and second waveguides 607A and 607B.
  • the directional coupler 206 may provide signals to a receiver that enables the receiver to be configured as a less sophisticated receiver (e.g., as discussed with respect to Figures 2A and 2B) and allows for higher dynamic range and a linear response.
  • the directional coupler 206 may be polarization independent with nominal insertion loss with a split ratio tolerance of 80% +/-5% and 20% +1-5% operating at a frequency with a wavelength, for example, of 1310 nanometers (nm) +/-6.5 nm.
  • the directional coupler 206 may be formed using SiN waveguide cores with silicon dioxide (SiCk) cladding on one or more sides of each of the SiN waveguide cores.
  • the waveguide parameters may be as shown in the table of Figure 6 resulting in a refractive index, for example, of approximately 1.9.
  • the waveguide parameters in the table of Figure 6 may be modified.
  • the length L may more generally be in a range from 2.0 micrometers to 7.0 micrometers.
  • the gap G may be in a range 450 nm +/-50 nm.
  • the width W may be in a range 740 nm +/-100 nm.
  • the thickness T may be in a range 600 nm +/-100 nm.
  • the slope dy/dx may be in a range 3/20 +/-(l/20).
  • the input port 616 is configured to receive an optical signal including both TE and TM polarization over an operation band of frequencies having wavelengths between, for example, 1.3 pm and 1.32 pm.
  • the optical signal then passes through the first waveguide 607A and cross-couples to the second waveguide 607B in the minimum gap section 608 (also designated as to have a length L). Because of the dimensions and parameters identified herein for the structures forming the directional coupler 206, the TE polarization mode and the TM polarization mode of the input optical signal may be distributed substantially equally in both the first waveguide 607A and the second waveguide 607B.
  • Figure 7 illustrates simulation plots of results for the directional coupler 206 of Figure 6, arranged in accordance with at least one embodiment described herein.
  • (A) simulates optical signal transmission from the first input port 616 to the first output port 618 (e.g., a ratio of an optical signal present at the first output port 618 with respect to the optical signal present at the first input port 616) as a function of optical signal wavelength over a frequency band having wavelengths between about 1.3 pm to about 1.32 pm.
  • plot (B) simulates optical signal transmission from the first input port 616 to the second output port 622 (e g., a ratio of the optical signal present at the second output port 622 with respect to the optical signal present at the first input port 616) as a function of optical signal wavelength over the frequency band having wavelengths between about 1.3 pm to about 1.32 pm.
  • plot (A) the simulated optical signal transmission of the TE mode of the optical signal from the first input port 616 to the first output port 618 is plotted as curve 702 while the simulated optical signal transmission of the TM mode of the optical signal from the first input port 616 to the first output port 618 is plotted as curve 704.
  • plot (B) the simulated optical signal transmission of the TE mode of the optical signal from the first input port 616 to the second output port 622 is plotted as curve 706 while the simulated optical signal transmission of the TM mode of the optical signal from the first input port 616 to the second output port 622 is plotted as curve 708.
  • (B) illustrate a splitting of the input optical signal to about a constant transmission portion of about 0.80 (e.g., 80%) to the first output port 618 and about 0.20 (e.g., 20%) to the second output port 622 for the frequency band having wavelengths between about 1.3 pm to about 1.32 pm.
  • curves 702, 704, 706, and 708 illustrate approximately equal (less than 0.2%) distributions of TE and TM modes across the band of interest.
  • a plot (C) illustrates a power plot of the directional coupler 206 of Figure 6.
  • the plot (C) includes a vertical axis on the left side corresponding to vertical spacing of the directional coupler 206, with the directional coupler 206 in Figure 7 oriented upside down compared to the directional coupler 206 illustrated in Figure 6.
  • the horizontal axis in plot (C) is distance from the first input port 616, corresponding to a distance of 0 microns, and the first and second output ports 618, 622, corresponding to a distance of 41 microns.
  • a vertical legend of optical power intensity is also illustrated on the right side of the plot (C).
  • the second output port 622 (illustrated as the upper right-hand branch) exhibits an optical power intensity of about 20% when compared to the optical power intensity legend, while the first output port 618 exhibits an optical power intensity of about 80% when compared to the optical power intensity legend.
  • Embodiments described herein may alternately or additionally include a SiN-Si multimode adiabatic coupler, which may relax Si tip width fabrication tolerance.
  • Figure 8 is an overhead view of an example SiN-Si multimode adiabatic coupler 800 (hereinafter“coupler 800”), arranged in accordance with at least one embodiment described herein. Either or both of the SiN-Si couplers 204 of Figure 2B may be implemented similar or identical to the coupler 800 of Figure 8.
  • the coupler 800 may be included in any of the systems described herein, such as in the systems 200A, 200B of Figures 2A, 2B as the SiN-Si coupler 204A and/or as the SiN-Si coupler 204B of Figure 2B.
  • the coupler 800 includes a Si waveguide 802 and a SiN waveguide 804.
  • Each of the Si waveguide 802 and the SiN waveguide 804 includes a core, e.g., a core of Si for the Si waveguide 802 or a core of SiN for the SiN waveguide 804, and a cladding.
  • Figure 8 illustrates the cores of the Si and SiN waveguides 802, 804; the cores of the Si and SiN waveguides 802, 804 and the cladding are illustrated in Fig. 9 according to an example implementation.
  • the cladding may include SiCb or other suitable cladding.
  • the SiN waveguide 804 is vertically displaced above the Si waveguide 802 and is illustrated as semi-transparent to show the Si waveguide 802 therebeneath. In other embodiments, the SiN waveguide 804 may be vertically displaced below the Si waveguide 802.
  • Each of the Si waveguide 802 and the SiN waveguide 804 includes a tapered section at an end thereof.
  • the Si waveguide 802 includes a Si taper 806 and the SiN waveguide 804 includes a SiN taper 808.
  • An end of the Si waveguide 802 opposite the Si taper 806 may be optically coupled to an optical receiver, such as a germanium (Ge) detector.
  • the photodetector 208A of Figure 2B may include a Ge detector to which the end of the Si waveguide 802 opposite the Si taper 806 may be coupled.
  • the coupler 800 may be configured to adiabatically couple light from the SiN waveguide 804 through the SiN taper 808 and the Si taper 806 into the Si waveguide 802, which light may then be coupled out to the Ge detector or other optical receiver. Additional details regarding adiabatic coupling are disclosed in U S Patent No. 9,405,066, issued on August 2, 2016 (hereinafter the‘066 patent) and U.S. App. No. 15/596,958 (hereinafter the‘958 application), fded May 16, 2017. The‘066 patent and the‘958 application are incorporated herein by reference in their entireties.
  • the Si taper 806 may gradually change from a relatively narrow tip to a multimodal waveguide with a width wsi suitable for multimode optical signals.
  • the width of the relatively narrow tip of the Si taper 806 may be in a range from 100-120 nm and the width wsi may be about 1 micrometer (pm).
  • a length of the Si taper 806 is denoted in Figure 8 as Lsi taper.
  • the SiN waveguide 804 may have a constant width and/or height, e.g., the portion of the SiN waveguide 804 above the Si taper 806 does not taper.
  • the SiN taper 808 may taper down from a width wsi N suitable for multimode optical signals to a relatively narrow tip.
  • the width W3 ⁇ 4N may be about 1 pm and the width of the relatively narrow tip of the SiN taper 808 may be around 250 nm.
  • the widths wsi and wsus are equivalent in this example, in other embodiments they may be different.
  • a length of the SiN taper 808 is denoted in Figure 8 as LSIN taper, and may be about 0.01 mm in some embodiments.
  • the Si waveguide 802 may have a constant width and/or height, e.g., the portion of the Si waveguide 802 below the SiN taper 808 does not taper.
  • An end of the SiN waveguide 804 opposite the SiN taper 808 may be coupled to, e.g., an output of the directional coupler 206 of Figure 2B, such as the first output port 618 or the second output port 622 of the directional coupler 206 of Figure 6.
  • FIG 9 illustrates an example optical system 900 in which the coupler 800 of Figure 8 may be implemented, arranged in accordance with at least one embodiment described herein.
  • the optical system 900 may include a Si substrate 902, a buried oxide (BOX) layer 904 formed on the Si substrate 902, a Si waveguide layer 906 formed on the BOX layer 904 and that includes one or more Si waveguides such as the Si waveguide 802 of Figure 8, a SiN slab 910A formed on the Si waveguide layer 906, a SiN waveguide layer 912 formed on the SiN slab 910A and that includes one or more SiN waveguides such as the SiN waveguide 804 of Figure 8, and one or more dielectric layers 918 formed on the SiN waveguide layer 912.
  • BOX buried oxide
  • a second SiN slab 910B may be formed between the SiN waveguide layer 912 and the dielectric layers 918.
  • Each of the Si waveguide layer 906 and the SiN waveguide layer 912 may additionally include dielectric material, such as S1O2 and/or other material(s) that serves as a cladding for the Si waveguide(s) and SiN waveguide(s) in each respective Si or SiN waveguide layer 906, 912.
  • The‘066 patent and the‘958 application disclose various example details of the elements included in the optical system 900 as well as various alternative arrangements (e.g., different order of layers) and/or other embodiments.
  • the principles disclosed herein may be implemented in combination with none or one or more of the details, alternative arrangements, and/or other embodiments of the‘066 patent and/or the‘958 application.
  • the Si waveguide 802 may include a height hsi and the width wsr
  • the SiN waveguide 804 may include a height hs and the width WS I N.
  • Figure 9 is a cross- sectional view of the optical system 900 taken at the location at which the width wsi of the Si waveguide 802 equals the width wsm of the SiN waveguide 804. Stated another way, and with combined reference to Figures 8 and 9, the cross-sectional view of the optical system 900 may be taken at a location aligned to both the rightmost end in Figure 8 of the Si taper 806 and to the leftmost end in Figure 8 of the SiN taper 808.
  • the height hs of the Si waveguide 802 may be about 300 nm or some other value in an example implementation.
  • the width wsi of the Si waveguide 802 may be about 100 nm to 1,000 nm (or 0.1 pm to 1 pm) depending on which part of the Si waveguide 802 is being measured.
  • the tip of the core of the Si waveguide 802 may be about 100 nm up to 120 nm which then tapers gradually up to 1 pm.
  • the height hsi N of the SiN waveguide 804 may be about 600 nm or some other value in an example implementation.
  • the width ws of the SiN waveguide 804 may be about 250 nm to 1 pm depending on which part of the SiN waveguide 804 is being measured.
  • the tip of the core of the SiN waveguide 804 may be about 250 nm which then tapers gradually up to 1 pm.
  • the width and/or height wsi, wsm, hsi, and/or hsi N of the Si and SiN waveguides 802 and 804 may be different than the foregoing values.
  • coupler 800 Additional details regarding the coupler 800 and/or variations thereof are disclosed in the ‘958 application.
  • any disjunctive word or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms.
  • the phrase“A or B” should be understood to include the possibilities of“A” or“B” or“A and B.”

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

La présente invention concerne un coupleur directionnel qui comprend un premier guide d'ondes et un deuxième guide d'ondes. Le premier guide d'ondes peut comprendre un port d'entrée optique servant à recevoir un signal optique et un premier port de sortie. Le deuxième guide d'ondes peut comprendre un port terminé et un deuxième port de sortie. Les premier et deuxième guides d'ondes optiques peuvent être configurés pour diviser le signal optique de telle sorte qu'une première partie du signal optique est dirigée vers le premier port de sortie et qu'une deuxième partie du signal optique est dirigée vers le deuxième port de sortie. La première partie du signal optique peut comprendre des premières parties sensiblement égales d'un mode de polarisation magnétique transversal (TM) et d'un mode de polarisation électrique transversal (TE) du signal optique. La deuxième partie du signal optique peut comprendre des deuxièmes parties sensiblement égales du mode de polarisation TM et du mode de polarisation TE du signal optique.
PCT/US2019/025897 2018-04-04 2019-04-04 Coupleur directionnel indépendant de la polarisation WO2019195622A1 (fr)

Applications Claiming Priority (4)

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US201862652633P 2018-04-04 2018-04-04
US62/652,633 2018-04-04
US16/157,946 2018-10-11
US16/157,946 US10797801B2 (en) 2017-10-11 2018-10-11 Split optical front end receivers

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CN113917621A (zh) * 2020-07-07 2022-01-11 华为技术有限公司 一种pic芯片、光模块和光网络设备

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US6002823A (en) * 1998-08-05 1999-12-14 Lucent Techolonogies Inc. Tunable directional optical waveguide couplers
US6636669B1 (en) * 1999-05-21 2003-10-21 Northwestern University Nanophotonic directional coupler device
US20040136646A1 (en) * 2002-08-22 2004-07-15 Arle Shahar All optical decoding systems for decoding optical encoded data symbols across multiple decoding layers
US9366818B1 (en) * 2015-11-06 2016-06-14 Inphi Corporation Broadband silicon nitride polarization beam splitter
US9405066B2 (en) 2014-11-11 2016-08-02 Finisar Corporation Two-stage adiabatically coupled photonic systems

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Publication number Priority date Publication date Assignee Title
US6002823A (en) * 1998-08-05 1999-12-14 Lucent Techolonogies Inc. Tunable directional optical waveguide couplers
US6636669B1 (en) * 1999-05-21 2003-10-21 Northwestern University Nanophotonic directional coupler device
US20040136646A1 (en) * 2002-08-22 2004-07-15 Arle Shahar All optical decoding systems for decoding optical encoded data symbols across multiple decoding layers
US9405066B2 (en) 2014-11-11 2016-08-02 Finisar Corporation Two-stage adiabatically coupled photonic systems
US9366818B1 (en) * 2015-11-06 2016-06-14 Inphi Corporation Broadband silicon nitride polarization beam splitter

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113917621A (zh) * 2020-07-07 2022-01-11 华为技术有限公司 一种pic芯片、光模块和光网络设备
CN113917621B (zh) * 2020-07-07 2023-04-18 华为技术有限公司 一种pic芯片、光模块和光网络设备

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