WO2019187567A1

WO2019187567A1 - Electro-optic device and method for manufacturing same

Info

Publication number: WO2019187567A1
Application number: PCT/JP2019/002356
Authority: WO
Inventors: 洋祐兵頭; 真一郎岡
Original assignee: 株式会社ジャパンディスプレイ
Priority date: 2018-03-30
Filing date: 2019-01-24
Publication date: 2019-10-03
Also published as: JP2019179102A

Abstract

This electro-optic device is provided with: a first substrate; a second substrate facing the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate. The second substrate is provided with: a second flexible base having flexibility; an inorganic film formed on the second flexible base; and an overcoat layer. The overcoat layer is formed between the second flexible base and the inorganic film.

Description

Electro-optical device and manufacturing method thereof

Embodiments described herein relate generally to an electro-optical device and a method for manufacturing the same.

2. Description of the Related Art An electro-optical device such as a liquid crystal display device that is formed of a flexible substrate and can be bent is known (see, for example, Patent Document 1 and Patent Document 2). The liquid crystal display device includes a pair of substrates bonded with an annular sealing material and a liquid crystal layer sealed between the substrates. The area superimposed on the sealing material is a non-display area where no image is displayed. In the case of a foldable liquid crystal display device, for example, a non-display region can be folded back to form a liquid crystal display device with a narrow frame region.

JP 2012-185457 A JP 2013-228439 A

A narrow frame LCD device can be obtained as the radius of curvature of the bent portion is reduced. On the other hand, if the radius of curvature is too small, the wiring may break at the bent portion. When the wiring breaks, first, a crack is generated in the inorganic film that is less flexible than the organic film, and the cracks in the inorganic film affect the surrounding wiring in a chained manner. Examples of the inorganic film include a barrier layer that is formed for the purpose of blocking the intrusion of oxygen and moisture and relaxing the stress of the flexible substrate. An object of the present disclosure is to provide a flexible electro-optical device having excellent connection reliability by preventing damage to wiring.

An electro-optical device according to an embodiment includes a first substrate, a second substrate facing the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The second substrate includes a flexible second flexible substrate, an inorganic film formed on the second flexible substrate, and an overcoat layer. The overcoat layer is formed between the second flexible substrate and the inorganic film.

FIG. 1 is a plan view showing a schematic configuration of the liquid crystal display device of the present embodiment. FIG. 2 is a cross-sectional view showing the structure of the display area shown in FIG. FIG. 3 is a cross-sectional view showing the structure of the non-display area shown in FIG. FIG. 4 is an enlarged cross-sectional view of the bent portion shown in FIG. FIG. 5 is a cross-sectional view showing a comparative example with the present embodiment. FIG. 6 is a flowchart showing an example of a manufacturing method of the liquid crystal display device of the present embodiment.

Several embodiments will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those that can be easily conceived by a person skilled in the art while keeping the gist of the invention, as appropriate, are included in the scope of the present invention. In addition, the drawings may be schematically represented in comparison with actual modes in order to clarify the description, but are merely examples, and do not limit the interpretation of the present invention. In each figure, reference numerals may be omitted for the same or similar elements arranged in succession. In addition, in the present specification and each drawing, components that perform the same or similar functions as those already described are denoted by the same reference numerals, and redundant detailed description may be omitted.

In the following description, a liquid crystal display device DSP is disclosed as an example of a display device. However, this embodiment does not prevent the application of the individual technical ideas disclosed in this embodiment to other types of display devices. The main configuration disclosed in this embodiment is an application of a self-luminous display device such as an organic electroluminescence (EL) display device, an electronic paper display device having an electrophoretic element, or the like, Micro Electro Mechanical System (MEMS). The present invention can be applied to various electro-optical devices such as a display device or a display device using electrochromism. A display apparatus can be used for various apparatuses, such as a smart phone, a tablet terminal, a mobile telephone terminal, a personal computer, a television receiver, a vehicle-mounted apparatus, a game device, and a wearable terminal, for example.

FIG. 1 is a plan view showing a schematic configuration of the liquid crystal display device DSP of the present embodiment. The liquid crystal display device DSP includes a display panel (liquid crystal cell) PNL that displays an image on a display surface, and a drive circuit board FPC mounted on the display panel PNL. In the following description, viewing from the display surface of the display panel PNL toward the back surface is defined as planar view.

The display panel PNL may be a transmission type that displays an image by selectively transmitting light from the back surface, or a reflection type that displays an image by selectively reflecting light incident on the display surface. It may be. In the case of the transmission type, the liquid crystal display device DSP further includes an illumination device BL that irradiates light to the back surface of the display panel PNL. The drive circuit board FPC controls operations of the display panel PNL and the illumination device BL.

The display panel PNL includes a first substrate (array substrate) SUB1, a second substrate (counter substrate) SUB2, a sealing material (adhesive) SE, and a liquid crystal layer LQ. The first substrate SUB1 is formed in a substantially rectangular shape having first to fourth sides E1, E2, E3, E4. For example, the first and third sides E1 and E3 are short sides, and the second and fourth sides E2 and E4 are long sides.

The second substrate SUB2 faces the first substrate SUB1 in the thickness direction Z of the display panel PNL. The first substrate SUB1 is formed larger than the second substrate SUB2 in the long side direction of the display panel PNL, for example, and has a mounting region NDat exposed from the second substrate SUB2. A drive circuit board FPC is mounted in the mounting area NDat.

The drive circuit board FPC sequentially receives image data for one frame for displaying on the display panel PNL from, for example, a main board of an electronic device on which the liquid crystal display device DSP is mounted. This image data includes information such as the display color of each pixel PX, for example. The drive circuit board FPC is provided with a control module CTR and the like. The control module CTR controls the operation of the display panel PNL and the illumination device BL. Note that the drive circuit board FPC and the control module CTR may be separately provided in the mounting area NDAt.

The seal material SE is formed of an organic material such as acrylic resin or epoxy resin. The seal material SE corresponds to a portion indicated by a diagonal line rising to the right in FIG. 1, and bonds the first substrate SUB1 and the second substrate SUB2. The liquid crystal layer LQ is disposed between the first substrate SUB1 and the second substrate SUB2 inside the sealing material SE. The liquid crystal layer LQ is an example of an electro-optical layer that is driven by electricity and selectively transmits light. The electro-optical layer may be the above-described electrophoretic element, MEMS shutter, or the like.

The display surface of the display panel PNL has a display area DA for displaying an image and a non-display area (peripheral area) NDA surrounding the display area DA. In the display area DA, a plurality of subpixels SPX are arranged in a matrix. For example, a pixel PX capable of color display can be configured by combining three subpixels SPX respectively corresponding to red (R), green (G), and blue (B). Note that the pixel PX may include a subpixel SPX of another color such as white, or may include a plurality of subpixels SPX of the same color.

In the non-display area NDA, a light shielding layer 21 to be described later is formed. The non-display area NDA includes first to fourth non-display areas NDA1, NDA2, NDA3, and NDA4. The first non-display area NDA1 is partitioned between the display area DA and the first side E1. The first non-display area NDA1 includes the mounting area NDAt described above.

Similarly, the second non-display area NDA2 is partitioned between the display area DA and the second side E2. The third non-display area NDA3 is partitioned between the display area DA and the third side E3. The fourth non-display area NDA4 is partitioned between the display area DA and the fourth side E4.

In the display area DA surrounded by the non-display area NDA, the first substrate SUB1 includes a plurality of scanning signal lines GL and a plurality of video signal lines SL intersecting the scanning signal lines GL. The aforementioned subpixel SPX corresponds to a region defined by two adjacent scanning signal lines GL and two adjacent video signal lines SL.

The direction in which each scanning signal line GL extends is defined as a first direction X, and the direction in which each video signal line SL extends is defined as a second direction Y. In the example shown in FIG. 1, the video signal line SL is indicated by a straight line parallel to the second direction Y, but the video signal line SL may extend in the second direction Y while being bent zigzag.

In the example shown in FIG. 1, the first direction X coincides with the short side direction of the display panel PNL, and the second direction Y coincides with the long side direction of the display panel PNL. The first and second directions X and Y are not limited to the example shown in FIG. The first direction X may coincide with the long side direction of the display panel PNL, and the second direction Y may coincide with the short side direction of the display panel PNL, or other directions. The first and second directions X and Y are orthogonal to the thickness direction Z of the display panel PNL.

The first substrate SUB1 includes a scanning driver GD connected to each scanning signal line GL and a video driver SD connected to each video signal line SL. The scanning driver GD is provided in each of the second and fourth non-display areas NDA2 and NDA4. The video driver SD is provided between the mounting area NDAt and the display area DA in the first non-display area NDA1.

Note that the scanning driver GD and the video driver SD may be provided in the drive circuit board FPC or in the control module CTR. The scanning driver GD and the video driver SD are an example of a driving circuit for displaying an image, and can be formed in the same process as a switching element SW of a sub-pixel SPX described later, for example.

The first substrate SUB1 includes a switching element SW and a pixel electrode PE in each subpixel SPX. The switching element SW is constituted by, for example, a thin film transistor (TFT), and is electrically connected to the scanning signal line GL, the video signal line SL, and the pixel electrode PE. A common electrode CE extends to face the plurality of subpixels SPX. The common electrode CE may be provided on the first substrate SUB1 or may be provided on the second substrate SUB2.

The control module CTR controls the scanning driver GD and the video driver SD based on the received image data. The scanning driver GD supplies a scanning signal to each scanning signal line GL, and the video driver SD supplies a video signal to each video signal line SL. When the scanning signal is supplied to the scanning signal line GL corresponding to the switching element SW, the video signal line SL corresponding to the switching element SW and the pixel electrode PE are electrically connected, and the video signal of the video signal line SL is changed. Supplied to the pixel electrode PE. The pixel electrode PE forms an electric field with the common electrode CE to change the alignment of the liquid crystal molecules in the liquid crystal layer LQ. The storage capacitor CS is formed between the common electrode CE and the pixel electrode PE, for example.

FIG. 2 is a cross-sectional view showing the structure of the display panel PNL in the display area DA shown in FIG. As shown in FIG. 2, the display panel PNL further includes a first polarizing plate PL1 and a second polarizing plate PL2. The first polarizing plate PL1 is disposed between the illumination device BL and the display panel PNL on the back side of the display panel PNL. The illumination device BL faces the first substrate SUB1 and irradiates the first substrate SUB1 with light. The second polarizing plate PL2 is disposed on the display surface side of the display panel PNL.

In addition, when using the illuminating device BL which irradiates polarized light, you may abbreviate | omit 1st polarizing plate PL1. When a MEMS shutter is used instead of the liquid crystal layer LQ, the first and second polarizing plates PL1 and PL2 may be omitted. In the example shown in FIG. 2, the display panel PNL has a configuration corresponding to a display mode that mainly uses a lateral electric field substantially parallel to the XY plane. The display panel PNL has a configuration corresponding to a vertical electric field perpendicular to the XY plane, an electric field oblique to the XY plane, or a display mode using a combination thereof. Also good.

As described above, the first substrate SUB1 includes the scanning signal line GL, the video signal line SL, the switching element SW, the pixel electrode PE, and the common electrode CE. In addition to these, the first substrate SUB1 includes the first flexible substrate 10, the first insulating layer 11, the second insulating layer 12, the third insulating layer 13, the fourth insulating layer 14, and the fifth. An insulating layer 15 and a first alignment film AL1 are further provided. The switching element SW includes a semiconductor layer SC and a relay electrode SLr.

As shown in FIG. 2, the first insulating layer 11 covers the first flexible substrate 10. The semiconductor layer SC is formed on the first insulating layer 11. The second insulating layer 12 covers the semiconductor layer SC and the first insulating layer 11. The scanning signal line GL is formed on the second insulating layer 12. The third insulating layer 13 covers the scanning signal lines GL and the second insulating layer 12.

The video signal line SL and the relay electrode (source electrode or drain electrode) SLr are formed on the third insulating layer 13 and are in contact with the semiconductor layer SC through the contact holes CH1 and CH2, respectively. The video signal line SL and the relay electrode SLr can be formed in the same process. The fourth insulating layer 14 covers the video signal line SL, the relay electrode SLr, and the third insulating layer 13. The common electrode CE is formed on the fourth insulating layer 14. The fifth insulating layer 15 covers the common electrode CE and the fourth insulating layer 14.

The pixel electrode PE is formed on the fifth insulating layer 15 and is in contact with the relay electrode SLr through the contact hole CH3. Note that the pixel electrode PE may be formed under the fifth insulating layer 15, and the common electrode CE may be formed over the fifth insulating layer 15. The first alignment film AL1 covers the pixel electrode PE and the fifth insulating layer 15, and is in contact with the liquid crystal layer LQ. The first alignment film AL1 aligns the liquid crystal molecules of the liquid crystal layer LQ in a state where no voltage is applied to the pixel electrode PE.

The first flexible substrate 10 is made of, for example, a polyimide resin. The common electrode CE and the pixel electrode PE are made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The scanning signal line GL, the video signal line SL, and the relay electrode SLr are, for example, metal lines having a single layer structure or a stacked structure.

The first to third and fifth insulating

layers

11, 12, 13, and 15 are inorganic films such as silicon oxide, silicon nitride, or alumina. The fourth insulating layer 14 is an organic film formed from a photosensitive resin such as an acrylic resin, and extends to the end of the first substrate SUB1. The fourth insulating layer 14 has a function of flattening the unevenness of the switching element SW, and is formed thicker than the first to third and fifth insulating

layers

11, 12, 13, 15 and the first alignment film AL1. Yes. The first alignment film AL1 can be formed, for example, by applying polyimide resin or the like by inkjet printing or flexographic printing.

The second substrate SUB2 includes a second flexible substrate 20, a light shielding layer (black matrix) 21, a color filter layer 22, an overcoat layer 23, a barrier layer 24, and a second alignment film AL2. I have. The second flexible substrate 20 can be formed from the same material as the first flexible substrate 10. The second alignment film AL2 can be formed of the same material as the first alignment film AL1.

As shown in FIG. 2, the light shielding layer 21 is formed on the lower surface of the second flexible substrate 20. The color filter layer 22 covers the light shielding layer 21 and the second flexible substrate 20. The light shielding layer 21 is formed in the non-display area NDA in plan view. Further, the light shielding layer 21 is formed immediately above the metal lines such as the scanning signal line GL, the video signal line SL, and the relay electrode SLr in the display area DA, and partitions the subpixel SPX.

The color filter layer 22 faces the pixel electrode PE, and a part thereof overlaps the light shielding layer 21. The color filter layer 22 may be formed on the first substrate SUB1 instead of the second substrate SUB2. The color filter layer 22 includes a red color filter layer, a green color filter layer, a blue color filter layer, and the like arranged corresponding to the sub-pixel SPX. The overcoat layer 23 covers the color filter layer 22. The barrier layer 24 covers the overcoat layer 23. The second alignment film AL2 covers the barrier layer 24 and is in contact with the liquid crystal layer LQ. The light shielding layer 21, the color filter layer 22, and the overcoat layer 23 can all be formed of an organic material. That is, the light shielding layer 21, the color filter layer 22, and the overcoat layer 23 are examples of organic layers.

The barrier layer 24 is an inorganic film such as silicon oxide, silicon nitride, or alumina, and has a function of blocking oxygen and moisture that have entered the second flexible substrate 20. In the present embodiment, for example, a single layer film made of silicon nitride is used for the barrier layer 24 in consideration of optical characteristics. The barrier layer 24 is formed for the purpose of relaxing the stress of the second flexible substrate 20. In the manufacture of the liquid crystal display device DSP, when the second glass substrate described later is peeled from the second flexible substrate 20, the second flexible substrate 20 may be warped by stress. The barrier layer 24 imparts stress in a direction that cancels the stress and suppresses the warp of the second flexible substrate 20.

FIG. 3 is a cross-sectional view showing the structure of the fourth non-display area NDA4. The structures of the first to third non-display areas NDA1, NDA2, and NDA3 have substantially the same shape and function as the structure of the fourth non-display area NDA4. For this reason, the fourth non-display area NDA4 will be described in detail as a representative, and overlapping description of the first to third non-display areas NDA3 will be omitted.

In the example shown in FIG. 3, the fourth non-display portion NDA4 is folded back to the back side of the display panel PNL, and the respective end portions of the first and second substrates SUB1 and SUB2 are located on the back side of the illumination device BL. Yes. With such a configuration, the fourth non-display area NDA4 cannot be seen from the display surface side of the display panel PNL, and thus a liquid crystal display device DSP having a narrow frame width W can be configured. When the non-display area NDA is folded back to the back side, compressive stress is generated on the first substrate SUB1 side of the display panel PNL. A tensile stress is generated on the second substrate SUB2 side. On the neutral plane N located at the approximate center of the display panel PNL, the tensile stress and the compressive stress are balanced.

FIG. 4 is an enlarged cross-sectional view showing a part of the display panel PNL bent in FIG. One feature of the liquid crystal display device DSP of the present embodiment is that the light shielding layer 21 and the overcoat layer 23 are formed between the second flexible substrate 20 and the barrier layer 24. FIG. 5 is a cross-sectional view showing a comparative example with the present embodiment. If there is a barrier layer 24 between the second flexible substrate 20 and the light shielding layer 21 as in the comparative example shown in FIG. 5, the distance from the neutral plane N to the barrier layer 24 is large. Become.

On the other hand, according to the present embodiment, since the barrier layer 24 is provided above the light shielding layer 21 and the overcoat layer 23 (on the liquid crystal layer LQ side), as shown in FIG. A barrier layer 24 can be disposed. In addition, plate | board thickness T1, T2 of the 1st and 2nd

flexible base materials

10 and 20 may mutually differ. By adjusting the plate thicknesses T1 and T2, the distance between the neutral plane N and the barrier layer 24 can be further reduced.

In the manufacturing process of the liquid crystal display device DSP, the barrier layer 24 is generally formed by CVD (Chemical Vapor Deposition). If the CVD is performed in the presence of the light shielding layer 21 in order to dispose the barrier layer 24 on the light shielding layer 21, the light shielding layer 21 volatilizes and the vacuum chamber of the CVD apparatus is contaminated.

FIG. 6 is a flowchart showing an example of a manufacturing method of the liquid crystal display device DSP according to the present embodiment. The manufacturing method according to the present embodiment is characterized in that the barrier layer 24 is formed without using CVD. In the example shown in FIG. 6, the manufacturing method includes assembling the liquid crystal display device DSP by preparing the first substrate SUB1, preparing the second substrate SUB2, and bonding the first substrate SUB1 and the second substrate SUB2. And a process.

The steps ST1 to ST3 for preparing the first substrate SUB1 will be described. First, the material of the 1st flexible base material 10 is apply | coated to the upper surface of a 1st glass substrate, the applied material is hardened, and the 1st flexible base material 10 is formed (1st flexible base material formation) ST1). As an example, the first flexible substrate 10 of polyimide film can be formed by applying a composition containing polyamic acid on a first glass substrate and imidizing it by heat treatment at 300 to 500 ° C.

On the first flexible substrate 10, the scanning signal line GL, the video signal line SL, the semiconductor layer SC, the common electrode CE, the pixel electrode PE, the first to fifth insulating

layers

11, 12, 13, 14, A circuit layer in which 15 and the like are stacked is formed (circuit layer formation ST2). The material of the first alignment film AL1 is applied on the circuit layer, and the applied material is cured to form the first alignment film AL1 (first alignment film formation ST3). Through steps ST1 to ST3, a mother substrate including a plurality of first substrates SUB1 is obtained.

Next, steps ST4 to ST7 for preparing the second substrate SUB2 will be described. In the same manner as in ST1, the second flexible substrate 20 is formed on the second glass substrate (second flexible substrate formation ST4). The light shielding layer 21, the color filter layer 22 (colored layer), the overcoat layer 23, and the like are formed on the second flexible substrate 20 (colored layer formation ST5).

After the step ST5, the barrier layer 24 is formed on the overcoat layer 23 by sputtering an inorganic material such as silicon oxide, silicon nitride, or alumina. The barrier layer 24 is formed so as to cover the second flexible substrate 20 through the light shielding layer 21, the color filter layer 22, and the overcoat layer 23. In the same manner as in ST3, a second alignment film AL2 is further formed on the barrier layer 24 (second alignment film formation ST7), and a mother substrate including a plurality of second substrates SUB2 is obtained.

Next, steps ST8 to ST15 for assembling the liquid crystal display device DSP by bonding the first and second substrates SUB1 and SUB2 will be described. The material of the sealing material SE is applied to one of the mother substrates, and the liquid crystal material of the liquid crystal layer LQ is dropped on the inner side surrounded by the sealing material SE (liquid crystal dropping ST8). Two mother substrates are bonded together, and the sealing material SE is cured (substrate adhesion ST9). The method of injecting the liquid crystal layer LQ is not limited to the steps ST8 and ST9 (one drop fill method). A vacuum injection method may be used in which the first and second substrates SUB1 and SUB2 are bonded first and the liquid crystal layer LQ is sealed later.

The second glass substrate is peeled from the second flexible substrate 20. Specifically, the second flexible substrate 20 is irradiated with laser light through a translucent second glass substrate. Thereby, the 2nd flexible base material 20 absorbs a laser beam, and decomposes | disassembles slightly. A space is generated at the interface between the second flexible substrate 20 and the second glass substrate, and the second glass substrate is peeled from the second flexible substrate 20 (second glass substrate peeling ST10). At this time, the barrier layer 24 suppresses the warp of the second flexible base material 20 that is not fixed to the second glass substrate.

The mother substrate including the first and second substrates SUB1 and SUB2 together with the first glass substrate is cut and separated into a plurality of panels (cell cut ST11). A part of the second substrate SUB2 is cut out by the laser beam to expose the terminal of the first substrate SUB1 (mounting region formation ST12). Thereby, the mounting area NDat is formed. Note that the steps ST10 and ST11 may be combined into one step.

The drive circuit board FPC is mounted on the exposed terminals (drive circuit board mounting ST13). Specifically, an anisotropic conductive film is disposed on the terminal. An anisotropic conductive film is a film-like adhesive containing uniformly dispersed conductive particles. Next, the drive circuit board FPC and the first substrate SUB1 are pressurized from the top and bottom and heated at the same time. Thereby, a part of the anisotropic conductive film is melted, and the drive circuit board FPC and the first board SUB1 are electrically and mechanically connected.

In the same manner as ST10 for peeling the second glass substrate, the first glass substrate is peeled from the first flexible base material 10 (first glass substrate peeling ST14). The first and second polarizing plates PL1 and PL2 are attached to the obtained display panel PNL, and the lighting device BL is assembled.

When the non-display area NDA and the drive circuit board FPC of the display panel PNL are bent toward the back side of the display panel PNL, the liquid crystal display device DSP is completed (turning ST15). When the non-display area NDA is bent to the back side, tensile stress is generated in the second substrate SUB2. Since the inorganic film is weaker in tensile stress than compressive stress, the inorganic film tends to break in the second substrate SUB2 more easily than in the first substrate SUB1.

In the liquid crystal display device DSP of the present embodiment configured as described above, the distance between the barrier layer 24 that suppresses the warp of the second flexible base material 20 and the neutral surface N is the comparison shown in FIG. It becomes smaller than the liquid crystal display device DSP of the example. Thereby, since the stress which acts on the barrier layer 24 when the 2nd flexible base material 20 is bent can be minimized, the fracture | rupture of the barrier layer 24 can be prevented.

The manufacturing method according to this embodiment uses sputtering instead of CVD. Since sputtering can be formed even under conditions where an organic film is present, it is not limited to the position immediately above the second flexible substrate 20 and is more neutral than the light shielding layer 21, the color filter layer 22, and the overcoat layer 23. The barrier layer 24 can be formed near the surface N. In addition, various suitable effects can be obtained from this embodiment and its modifications.

Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof. The configurations disclosed in the embodiments can be combined as appropriate.

DESCRIPTION OF SYMBOLS 10 ... 1st flexible base material, 20 ... 2nd flexible base material, 21 ... Light-shielding layer, 23 ... Overcoat layer, 24 ... Barrier layer (an example of inorganic film), DSP ... Liquid crystal display device (display device) LQ ... liquid crystal layer, SUB1 ... first substrate, SUB2 ... second substrate, T1 ... plate thickness of the first flexible substrate, T2 ... plate thickness of the second flexible substrate.

Claims

A first substrate;
A second substrate facing the first substrate;
A liquid crystal layer disposed between the first substrate and the second substrate,
The second substrate includes a flexible second flexible substrate, an inorganic film formed on the second flexible substrate, and an overcoat layer,
The overcoat layer is an electro-optical device formed between the second flexible substrate and the inorganic film.
The first substrate and the second substrate have a display region and a peripheral region in plan view,
The electro-optical device according to claim 1, wherein the inorganic film is formed so as to cover the second flexible base material in the display region and the peripheral region.
The first substrate includes a first flexible base material having flexibility,
The electro-optical device according to claim 1, wherein a thickness of the second flexible substrate is different from a thickness of the first flexible substrate.
2. The electro-optical device according to claim 1, wherein the inorganic film is formed between the overcoat layer and the liquid crystal layer.
2. The electro-optical device according to claim 1, wherein the second substrate further includes a color filter layer formed between the second flexible base material and the inorganic film.
The electro-optical device according to claim 1, wherein the second substrate further includes a light shielding layer formed between the second flexible base material and the overcoat layer.
A display area for displaying an image, and a peripheral area around the display area,
The electro-optical device according to claim 1, wherein the peripheral region is bent.
The bent peripheral region has a neutral surface where tensile stress and compressive stress are balanced,
The electro-optical device according to claim 7, wherein the inorganic film is closer to the neutral surface than the overcoat layer.
An illuminating device facing the first substrate and irradiating the first substrate with light;
The electro-optical device according to claim 7, wherein the peripheral region is bent so that an end portion of the first substrate is located on a back side of the illumination device.
Preparing a second flexible substrate having flexibility in a state in which an organic layer made of an organic material is formed;
A method of manufacturing an electro-optical device, wherein a barrier layer made of an inorganic film is formed by sputtering on a surface of the organic layer opposite to the second flexible substrate.
Preparing a flexible first flexible substrate on which a circuit layer having a semiconductor and metal wiring is formed;
The method of manufacturing an electro-optical device according to claim 10, wherein the first flexible substrate and the second flexible substrate are bonded together via a liquid crystal layer.
The method of manufacturing an electro-optical device according to claim 11, wherein the organic layer includes a colored layer and an overcoat layer formed between the colored layer and the barrier layer.
The method of manufacturing an electro-optical device according to claim 11, further comprising bending the bonded first flexible substrate and second flexible substrate.