WO2019174381A1 - 激光发生器、结构光投射器、图像获取结构和电子装置 - Google Patents

激光发生器、结构光投射器、图像获取结构和电子装置 Download PDF

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Publication number
WO2019174381A1
WO2019174381A1 PCT/CN2019/070682 CN2019070682W WO2019174381A1 WO 2019174381 A1 WO2019174381 A1 WO 2019174381A1 CN 2019070682 W CN2019070682 W CN 2019070682W WO 2019174381 A1 WO2019174381 A1 WO 2019174381A1
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WO
WIPO (PCT)
Prior art keywords
array
lens barrel
sub
arrays
additional
Prior art date
Application number
PCT/CN2019/070682
Other languages
English (en)
French (fr)
Inventor
张学勇
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP19767946.7A priority Critical patent/EP3742564B1/en
Publication of WO2019174381A1 publication Critical patent/WO2019174381A1/zh
Priority to US16/993,377 priority patent/US11402199B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18305—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2513—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • G02B19/0057—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/106—Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1086—Beam splitting or combining systems operating by diffraction only
    • G02B27/1093—Beam splitting or combining systems operating by diffraction only for use with monochromatic radiation only, e.g. devices for splitting a single laser source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4205—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • G02B27/425—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application in illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2033—LED or laser light sources
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/147—Details of sensors, e.g. sensor lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/271—Image signal generators wherein the generated image signals comprise depth maps or disparity maps

Definitions

  • the present application relates to the field of optical and electronic technologies, and more particularly to a laser generator, a structured light projector, an image acquisition structure, and an electronic device.
  • the collector can acquire the speckle pattern emitted by the structured light projector and further processed by the processor for imaging.
  • the speckle pattern emitted by the laser projector is required to be higher. Local irrelevance.
  • Embodiments of the present application provide a laser generator, a structured light projector, an image acquisition structure, and an electronic device.
  • a laser generator of an embodiment of the present application includes a substrate and an array of light emitting elements disposed on the substrate, the array of light emitting elements including a base array and an additional array, the base array forming a base region, the additional array forming an additional a region, the base array includes at least three basic sub-arrays, each of the basic sub-arrays forming a basic sub-region, the basic region including a common region, the common region being located at least on the three basic sub-regions, and The common area is located within the additional area.
  • a structured light projector of an embodiment of the present application includes a substrate assembly and a laser generator disposed on the substrate assembly; the laser generator includes a substrate and an array of light emitting elements disposed on the substrate
  • the array of light-emitting elements includes a base array forming a base region, the additional array forming an additional region, the base array including at least three basic sub-arrays, each of the base sub-arrays forming a base a sub-area, the base area including a common area, the common area being located at least on the three base sub-areas, and the common area being located in the additional area.
  • the image acquisition structure of the embodiment of the present application includes a structured light projector, an image collector, and a processor respectively connected to the structured light projector and the image collector; the structured light projector is configured to emit a laser pattern outward; The image collector is configured to acquire the laser pattern; the processor is configured to process the laser pattern to obtain a depth image; the structured light projector comprises a substrate assembly and a laser generator, wherein the laser generator is disposed in the a substrate assembly; the laser generator comprising a substrate and an array of light emitting elements disposed on the substrate, the array of light emitting elements comprising a base array and an additional array, the base array forming a base region, the additional array forming An additional area, the basic array includes at least three basic sub-arrays, each of the basic sub-arrays forming a basic sub-area, the basic area including a common area, the common area being located at least on the three basic sub-areas, And the common area is located in the additional area.
  • An electronic device of an embodiment of the present application includes a housing and an image acquisition structure disposed in the housing and exposed from the housing to acquire a depth image;
  • the image acquisition structure includes a structured light projector, an image a collector and a processor respectively coupled to the structured light projector and the image collector;
  • the structured light projector for emitting a laser pattern outward;
  • the image collector for acquiring the laser pattern;
  • the processing The device is configured to process the laser pattern to obtain a depth image;
  • the structured light projector includes a substrate assembly and a laser generator, the laser generator is disposed on the substrate assembly;
  • the laser generator includes a substrate and is disposed at An array of light-emitting elements on the substrate, the array of light-emitting elements comprising a base array forming a base region, the additional array forming an additional region, the base array comprising at least three basic sub-arrays,
  • Each of the basic sub-arrays forms a basic sub-area, the basic area including a common area, the common area
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an image acquisition structure according to an embodiment of the present application.
  • FIG. 3 is a perspective view of a structured light projector according to an embodiment of the present application.
  • FIG. 4 is a schematic plan view of a structured light projector according to an embodiment of the present application.
  • FIG. 5 is a perspective exploded view of a structured light projector according to an embodiment of the present application.
  • Figure 6 is a cross-sectional view of the structured light projector of Figure 4 taken along line VI-VI;
  • Figure 7 is a schematic cross-sectional view of the structured light projector of Figure 4 taken along line VII-VII;
  • Figure 8 is an enlarged schematic view showing a portion XIII of the structured light projector of Figure 7;
  • Figure 9 is an enlarged schematic view showing a portion IX of the structured light projector shown in Figure 5;
  • FIG. 10 is a perspective view of a protective cover of a structured light projector according to an embodiment of the present application.
  • 11 to 14 are schematic views showing the structure of a laser generator of a structured light projector according to an embodiment of the present application.
  • the first feature "on” or “below” the second feature may be the direct contact of the first and second features, or the first and second features are indirectly through the intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
  • the laser generator 13 of the embodiment of the present application includes a substrate 131 and an array of light-emitting elements 132 disposed on the substrate 131, the array of light-emitting elements 132 including a base array 133 and an additional array 134, the base array 133 forming a basis Region A, the additional array 134 forms an additional region C, the base array 133 includes at least three basic sub-arrays 1331, each of the basic sub-arrays 1331 forming a basic sub-region a, the basic region A including a common region B
  • the common area B is located at least on the three basic sub-areas a, and the common area B is located in the additional area C.
  • At least three of the basic sub-arrays 1331 are identical, and the additional array 134 is identical to the basic sub-array 1331.
  • At least three of the basic sub-arrays 1331 are identical, and the additional array 134 is generated by the basic sub-array 1331 by means of transformation, the manner of transformation including rotation, mirroring, and scaling. A combination of one or more.
  • At least three of the basic sub-array 1331 and the additional array 134 may be generated by any one of the basic sub-arrays 1331 in a manner of rotation, mirroring, and scaling. One or more combinations.
  • the light-emitting elements 132 of the basic sub-array 1331 are regularly or irregularly distributed.
  • the additional array 134 and each of the base sub-arrays 1331 can be individually driven to emit light.
  • the structured light projector 10 of the embodiment of the present application includes a substrate assembly 11 and a laser generator 13 according to any of the above embodiments, and the laser generator 13 is disposed on the substrate assembly 11.
  • the structured light projector 10 further includes a lens barrel 12, a collimating element 14, and a diffractive optical element 15;
  • the lens barrel 12 includes a barrel side wall 122, the barrel side wall 122
  • a receiving cavity 121 is formed on the substrate assembly 11 and formed together with the substrate assembly 11;
  • the collimating component 14 is received in the receiving cavity 121;
  • the diffractive optical component 15 is received in the receiving cavity 121
  • the laser generator 13 is for emitting laser light into the receiving cavity 121, and the collimating element 14 and the diffractive optical element 15 are sequentially disposed on the optical path of the laser generator 13.
  • the lens barrel 12 includes a limiting protrusion 123 protruding from the barrel side wall 122 into the receiving cavity 121, and the diffractive optical element 15 is mounted on the limiting protrusion.
  • the laser generator 13 further includes a protective cover 16 that is coupled to the lens barrel 12, the protective cover 16 includes a protective top wall 161, and the diffractive optical element 15 is located at the limit The position protrusion 123 is between the protective top wall 161.
  • the protective cover 16 further includes a protective sidewall 162 extending from the protective top wall 161.
  • the protective cover 16 is disposed on the lens barrel 12, and the protective sidewall 162 is
  • the lens tube side wall 122 is fixedly connected to the outer wall of the lens barrel side wall 122.
  • the protective side wall 162 defines a plastic hole 163 at a position corresponding to the glue receiving groove 126. The glue is allowed to enter the glue tank 126 through the dispensing hole 163.
  • the image acquisition structure 100 of the embodiment of the present application includes the structured light projector 10, the image collector 20, and the processor 30 respectively connected to the structured light projector 10 and the image collector 20 according to any of the above embodiments.
  • the structured light projector 10 is configured to emit a laser pattern outward; the image collector 20 is configured to acquire the laser pattern; and the processor 30 is configured to process the laser pattern to obtain a depth image.
  • the electronic device 1000 of the embodiment of the present application includes a housing 200 and the image acquisition structure 100 described in the above embodiments, and the image acquisition structure 100 is disposed in the housing 200 and exposed from the housing 200 to acquire a depth image. .
  • an electronic device 1000 of an embodiment of the present application includes a housing 200 and an image acquisition structure 100 .
  • the electronic device 1000 can be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc.
  • the embodiment of the present application is described by taking the electronic device 1000 as a mobile phone as an example. It can be understood that the specific form of the electronic device 1000 It can be other and is not limited here.
  • the image acquisition structure 100 is disposed in the housing 200 and exposed from the housing 200 to obtain a depth image, and the housing 200 can provide protection for the image acquisition structure 100 from dust, water, drop, etc., and the housing 200 is provided with an image. Holes corresponding to the structure 100 are taken to allow light to pass through or penetrate the housing 200.
  • the image acquisition structure 100 includes a structured light projector 10, an image collector 20, and a processor 30.
  • a projection window 40 corresponding to the structured light projector 10 and an acquisition window 50 corresponding to the image collector 20 may be formed on the image acquisition structure 100.
  • the structured light projector 10 is configured to project a laser pattern to the target space through the projection window 40
  • the image collector 20 is configured to collect the laser pattern modulated by the target object through the acquisition window 50.
  • the laser light projected by the structured light projector 10 is infrared light
  • the image capture device 20 is an infrared camera.
  • the processor 30 is coupled to both the structured light projector 10 and the image capture unit 20 for processing the laser pattern to obtain a depth image.
  • the processor 30 calculates an offset value of each pixel point in the laser pattern and a corresponding pixel point in the reference pattern by using an image matching algorithm, and further obtains a depth image of the laser pattern according to the offset value.
  • the image matching algorithm may be a Digital Image Correlation (DIC) algorithm.
  • DIC Digital Image Correlation
  • other image matching algorithms can be used instead of the DIC algorithm.
  • the structure of the structured light projector 10 will be further described below.
  • the structured light projector 10 includes a substrate assembly 11, a lens barrel 12, a laser generator 13, a diffusing optical element (DOE) 14, a diffractive optical element 15, and a protective cover 16.
  • the laser generator 13, the collimating element 14, and the diffractive optical element 15 are sequentially disposed on the optical path of the laser generator 13, and specifically, the light emitted from the laser generator 13 sequentially passes through the collimating element 14 and the diffractive optical element 15.
  • the substrate assembly 11 includes a substrate 111 and a circuit board 112 carried on the substrate 111 .
  • the substrate 111 is used to carry the lens barrel 12, the laser generator 13, and the circuit board 112.
  • the material of the substrate 111 may be plastic, such as Polyethylene Glycol Terephthalate (PET), Polymethyl Methacrylate (PMMA), Polycarbonate (PC), Polyacyl. At least one of imine (Polyimide, PI). That is, the substrate 111 can be made of a single plastic material of any of PET, PMMA, PC or PI. As such, the substrate 111 is lighter in weight and has sufficient support strength.
  • the circuit board 112 may be any one of a printed circuit board, a flexible circuit board, and a soft and hard board.
  • a via 113 may be formed in the circuit board 112. The via 113 may be used to accommodate the laser generator 13. A portion of the circuit board 112 is covered by the lens barrel 12, and another portion is extended and connected to the connector 17. The connector 17 is connected.
  • the structured light projector 10 can be connected to the main board of the electronic device 1000.
  • the lens barrel 12 is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel 12 can be connected to the circuit board 112 of the substrate assembly 11, and the lens barrel 12 and the circuit board 112 can be bonded by adhesive to improve the airtightness of the receiving cavity 121.
  • the specific connection manner of the lens barrel 12 and the substrate assembly 11 may be other, for example, by a snap connection.
  • the receiving cavity 121 can be used to accommodate components such as the collimating element 14, the diffractive optical element 15, and the receiving cavity 121 simultaneously forms a part of the optical path of the structured light projector 10.
  • the lens barrel 12 has a hollow cylindrical shape, and the lens barrel 12 includes a barrel side wall 122 and a limiting protrusion 123.
  • the barrel side wall 122 surrounds the receiving cavity 121, and the outer wall of the barrel side wall 122 may be formed with a positioning and mounting structure to facilitate fixing the position of the structured light projector 10 when the structured light projector 10 is mounted in the electronic device 1000.
  • the lens barrel 12 includes a first surface 124 and a second surface 125 opposite to each other, wherein one opening of the receiving cavity 121 is opened on the second surface 125 and the other opening is opened on the first surface 124.
  • the second side 125 is bonded to the circuit board 112, such as glued, and the first side 124 can serve as a bonding surface of the lens barrel 12 and the protective cover 16 and the like.
  • the outer wall of the side wall 122 of the lens barrel is provided with a glue receiving groove 126 .
  • the plastic groove 126 can be opened from the first surface 124 and extend toward the second surface 125 .
  • the limiting protrusions 123 protrude inward from the side wall 122 of the lens barrel. Specifically, the limiting protrusions 123 protrude from the side wall 122 of the lens barrel into the receiving cavity 121 .
  • the limiting protrusions 123 may have a continuous annular shape, or the limiting protrusions 123 may include a plurality of, and the plurality of limiting protrusions 123 are spaced apart.
  • the limiting protrusion 123 encloses the light-passing hole 1231.
  • the light-passing hole 1231 can serve as a part of the receiving cavity 121. The laser light passes through the light-passing hole 1231 and penetrates into the diffractive optical element 15.
  • the limiting protrusion 123 is located between the first surface 124 and the second surface 125.
  • the receiving cavity 121 between the limiting protrusion 123 and the second surface 125 can be used for receiving the collimating element 14, the limiting protrusion 123 and the The receiving cavity 121 between the one side 124 can be used to receive the diffractive optical element 15.
  • the diffractive optical element 15 abuts against the limiting protrusion 123, it can be considered that the diffractive optical element 15 is mounted in position, and when the collimating element 14 is in contact with the limiting protrusion 123, it can be considered as collimating Element 14 is mounted in place.
  • the limiting protrusion 123 includes a limiting surface 1232 that is coupled to the diffractive optical element 15 when the diffractive optical element 15 is mounted on the limiting protrusion 123.
  • the laser generator 13 is disposed on the substrate assembly 11. Specifically, the laser generator 13 may be disposed on the circuit board 112 and electrically connected to the circuit board 112. The laser generator 13 may also be disposed on the substrate 111. Corresponding to the via 113. At this time, the laser generator 13 can be electrically connected to the circuit board 112 by arranging wires. The laser generator 13 is used to emit laser light, which may be visible or invisible, such as infrared or ultraviolet light. Referring to Figure 11, the laser generator 13 includes a substrate 131 and an array of light emitting elements 132.
  • the substrate 131 may be a semiconductor substrate such as a wafer, and the substrate 131 is mounted on the substrate assembly 11, for example, by bonding the substrate 131 to the substrate assembly 11 by gluing.
  • the array of light-emitting elements 132 includes a plurality of light-emitting elements 132 disposed on the substrate 131 for emitting laser light outward.
  • the light-emitting element 132 may be a Vertical Cavity Surface Emitting Laser (VCSEL). ) and other light sources.
  • the array of light emitting elements 132 includes a base array 133 and an additional array 134.
  • the base array 133 and the additional array 134 each include a plurality of light emitting elements 132, the base array 133 forms a base area A, the additional array 134 forms an additional area C, and there may be multiple additional arrays 134, each of which forms an additional area C Wherein, the base area A and the additional area C may have overlapping areas.
  • the base array 133 includes at least three basic sub-arrays 1331, each of which forms a base sub-area a, and different base sub-areas a may have mutually overlapping areas, and the base sub-area a is located on the base area A.
  • the base area A further includes a common area B, and the common area B is located at least on the three basic sub-areas a, or the common area B is formed by overlapping at least three basic sub-areas a.
  • the common area B may have a light-emitting element 132 or no light-emitting element 132, and the common area B may be a point, a line or a face. In one example, as shown in FIG.
  • the common area B is a point, The dots are simultaneously located on the four basic sub-regions a; in another example, as shown in Fig. 12, the common region B is a rectangular region which is simultaneously located on the four basic sub-regions a.
  • the public area B is also located in the additional area C, or the boundary of the additional area C surrounds the public area B. It can be understood that the public area B is located on at least three basic sub-areas a and the additional area C, that is, An overlapping portion is formed between each additional region C and at least three basic sub-regions a.
  • each additional array 134 overlaps with at least three basic sub-arrays 1331, thereby improving the locality of the array of light-emitting elements 132.
  • the additional area C overlaps with the four basic sub-areas a, that is, the additional array 134 overlaps with the four basic sub-arrays 1331, and the additional array 134 and the different basic sub-arrays 1331
  • the arrays formed by the overlapping portions are different from each other, and therefore, the local irrelevant performance of the array of light-emitting elements 132 is significantly improved.
  • each circle indicates the position where the light-emitting element 132 is located, and is not used to indicate the actual shape and size of the light-emitting element 132
  • the solid-line square represents the outline of the substrate 131.
  • the dotted line is used to assist in indicating the boundary of each area, and does not necessarily exist in the laser generator 13.
  • the specific arrangement of the light-emitting elements 132 in the basic sub-array 1331 in the drawing, the combination of the plurality of basic sub-areas a, the specific shapes of the basic sub-area a and the additional area C are for illustrative purposes only, and cannot be understood as Application restrictions. Referring to FIG.
  • the basic array 133 when the laser generator 13 is fabricated, the basic array 133 may be fabricated on the substrate 131. Specifically, the basic sub-array 1331 may be fabricated on the substrate 131 one by one, when all the basic sub-arrays 1331 are completed. After that, the public area B is generated. An additional array 134 is then created and the additional area C is created and the common area B is located within the additional area C.
  • the collimating element 14 may be an optical lens, the collimating element 14 is used to collimate the laser light emitted by the laser generator 13, the collimating element 14 is received in the receiving cavity 121, and the collimating element 14 may be along the second side. 125 is assembled into the receiving cavity 121 in the direction of the first face 124.
  • the collimating element 14 includes an optical portion 141 and a mounting portion 142 for engaging with the lens barrel sidewall 122 and fixing the collimating element 14.
  • the optical portion 141 includes the collimating element 14 opposite to each other. Two surfaces on each side.
  • the diffractive optical element 15 is mounted on the limiting protrusion 123. Specifically, the diffractive optical element 15 is combined with the limiting surface 1232 to be mounted on the limiting protrusion 123.
  • the outer surface of the diffractive optical element 15 includes a top surface 151, a bottom surface 152, and a side surface 153.
  • the top surface 151 and the bottom surface 152 are opposite each other, and the side surface 153 is connected to the top surface 151 and the bottom surface 152.
  • the bottom surface 152 is combined with the limiting surface 1232.
  • the bottom surface 152 is formed with a diffractive structure, and the top surface 151 may be a smooth plane.
  • the diffractive optical element 15 may project the laser light collimated by the collimating element 14 to project a laser pattern corresponding to the diffractive structure.
  • the diffractive optical element 15 can be made of glass or can be said to be made of a composite plastic such as PET.
  • the protective cover 16 is coupled to the lens barrel 12, and the protective cover 16 is used to limit the position of the diffractive optical element 15. Specifically, the protective cover 16 serves to prevent the combination of the diffractive optical element 15 and the lens barrel 12 from failing. After that, it is taken out from the lens barrel 12.
  • the protective cover 16 includes a protective top wall 161 and a protective sidewall 162.
  • the protective top wall 161 and the limiting protrusion 123 are respectively located on opposite sides of the diffractive optical element 15, or the diffractive optical element 15 is located between the limiting protrusion 123 and the protective top wall 161, so that even the diffractive optical element The combination of the 15 and the limit projections 123 is disabled, and the diffractive optical element 15 does not come out due to the restriction of the protective top wall 161.
  • the protective top wall 161 is provided with a light-passing hole 1611. The position of the light-passing hole 1611 corresponds to the diffractive optical element 15. The laser light passes through the light-passing hole 1231, the diffractive optical element 15 and the light-passing hole 1611, and then passes through the structured light projector 10. Shoot out.
  • the overall shape of the protection top wall 161 is rounded square, and the light-passing hole 1611 may have a shape of a circle, a rectangle, an ellipse, a trapezoid or the like.
  • the protective sidewall 162 extends from the periphery of the protective top wall 161.
  • the protective cover 16 is disposed on the lens barrel 12, and the protective sidewall 162 is fixedly coupled to the lens barrel sidewall 122.
  • the protective sidewall 162 includes a plurality of protective sub-walls 1621 that are sequentially connected end to end. Each of the protective sub-sides 1621 and the lens can sidewall 122 are fixedly connected, and each of the protective sub-walls 1621 has a small rubber hole 163. .
  • the position of the dispensing hole 163 corresponds to the position of the adhesive tank 126. When the protective cover 16 is placed on the lens barrel 12, the glue can be dispensed from the dispensing hole 163 into the glue receiving groove 126.
  • each of the protective sub-walls 1621 is provided with a single dispensing hole 163.
  • each of the protective sub-sides 1621 is provided with a plurality of dispensing holes 163, such as two or three.
  • each of the protection sub-sides 1621 is provided with two dispensing holes 163, and the two dispensing holes 163 respectively correspond to the two inner sidewalls 1261 of the adhesive tank 126, which is convenient. The user simultaneously dispenses glue to both sides of the glue tank 126 to increase the dispensing speed.
  • the inner side wall 1261 of the plastic tank 126 is obliquely connected to the inner bottom wall 1262 of the plastic tank 126 and the outer wall of the lens barrel side wall 122.
  • the oblique connection refers to the inner side wall 1261 and the inner bottom wall 1262, and the inner side wall 1261 and the mirror
  • the outer wall of the side wall 122 of the cylinder is not perpendicular.
  • the prior art structured light projector generally uses a Vertical Cavity Surface Emitting Laser (VCSEL) as a light source, and the local irrelevance of the arrangement of the light-emitting elements on the VCSEL needs to be further improved.
  • the common area B is located at least on the three basic sub-areas a, and the common area B is located in the additional area C, so that the additional area C intersects with at least three basic sub-areas a, that is, attached
  • the array 134 overlaps with at least three of the basic sub-arrays 1331 to form an arrangement of a wider variety of light-emitting elements 132, increasing the local irrelevance of the array of light-emitting elements 132.
  • the protective cover 16 is combined with the lens barrel 12, the protective top wall 161 of the protective cover 16 and the limiting protrusion 123 together limit the position of the diffractive optical element 15, and the diffractive optical element 15 does not fall off in the light-emitting direction, thereby preventing the laser from passing through.
  • the diffractive optical element 15 is emitted to protect the user and improve safety.
  • the additional array 134 and each of the basic sub-arrays 1331 can be individually driven to emit light.
  • the plurality of additional arrays 134 may be uniformly driven, or each additional array 134 may be separately driven.
  • the laser light emitted from the different basic sub-arrays 1334 does not affect each other, and the laser generator 13 can be made different by controlling different arrays to emit laser light. Laser pattern.
  • the light-emitting elements 132 of the basic sub-array 1331 are regularly distributed. In other embodiments, the light-emitting elements 132 of the base sub-array 1331 are irregularly distributed. In still other embodiments, in the plurality of basic sub-arrays 1331, the basic sub-array 1331 in which the light-emitting elements 132 are regularly distributed, and the basic sub-array 1331 in which the light-emitting elements 132 are irregularly distributed are simultaneously present.
  • the regular distribution may be an array in which a plurality of light-emitting elements 132 are arranged in a row and a column, and the rows and columns are at a fixed angle; or a plurality of light-emitting elements 132 may be arranged in a radial array around a certain point; It is also possible to arbitrarily have a regular distribution of a plurality of light-emitting elements 132 equally spaced along a predetermined direction, and is not limited herein. It can be understood that manufacturing a plurality of light-emitting elements 132 regularly distributed on the substrate 131 can greatly improve manufacturing efficiency, and therefore, when the light-emitting elements of the basic sub-array 1331 are regularly distributed, the manufacturing efficiency of the basic sub-array 1331 is high. Of course, when the light-emitting elements 132 of the basic sub-array 1331 are irregularly distributed, the local irrelevance of the light-emitting elements 132 of the basic sub-array 1331 is high.
  • the additional array 134 is the same as the basic sub-array 1331. That is to say, the basic sub-array 1331 is the same as the additional array 134.
  • the array of the light-emitting elements 132 it is only necessary to design the arrangement pattern of the light-emitting elements 132 in one of the basic sub-arrays 1331, and the remaining basic sub-array 1331 and the additional array 134 are both It can be manufactured in the same arrangement pattern, saving design cost and improving manufacturing efficiency.
  • At least three basic sub-arrays 1331 are identical, and additional arrays 134, 1341, 1342, 1343 are generated by the basic sub-array 1331 by transformation, including rotation, mirroring, and A combination of one or more of the zooms.
  • the additional array 1341 can be generated by the basic sub-array 1331 by rotating
  • the additional array 1342 can be generated by the basic sub-array 1331 by mirroring
  • the additional array 1343 can be generated by the basic sub-array 1331 by scaling.
  • the additional arrays 134, 1341, 1342, 1343 obtained by different transformations overlap with the basic sub-array 1331 to produce an array of different light-emitting elements 132, which can improve the local irrelevance of the array of light-emitting elements 132.
  • the rotation angle in the rotation transformation, the symmetry axis in the mirror transformation and the scaling factor in the scaling transformation can all be selected according to the actual needs of the production.
  • an additional array 134 can also be generated by the combination of multiple transformation modes of the basic sub-array 1331.
  • the basic sub-array 1331 can be mirrored and then rotated to generate an additional array 134; after the basic sub-array 1331 can be scaled, Rotation is performed, and finally an image is generated to generate an additional array 134 and the like, which are not limited herein.
  • the additional arrays 134, 1341, 1342, 1343 can be generated by the basic sub-array 1331 by conversion, without redesigning the additional arrays 134, 1341, 1342, 1343, saving a certain design cost, and enabling the light-emitting elements.
  • the 132 array has a high local irrelevance.
  • At least three basic sub-arrays 1331 and additional arrays 134 may be generated by any one of the basic sub-arrays 1331 in a transforming manner, including one of rotation, mirroring, and scaling. Or a combination of multiples.
  • any two basic sub-arrays 1331, any two additional arrays 134, any one of the basic sub-arrays 1331, and any one of the additional arrays 134 may be mutually transformed by one or more of the above-described transformation methods. For example, in the example shown in FIG.
  • the basic sub-array 1332 and the basic sub-array 1333 can be obtained by mirroring the basic sub-array 1331, and the basic sub-array 1334 can be obtained by rotating the basic sub-array 1331 by adding the array 134. It can be obtained by the basic sub-array 1331 by scaling. Since the plurality of basic sub-arrays 1331 are obtained by transformation, the arrangement of the light-emitting elements 132 in the base array 133 has a high local irrelevance, and then overlaps with the basic sub-array 1331 through the additional array 134, further The local irrelevance of the array of light emitting elements 132 is increased.
  • the pattern of the basic sub-array 1331 can be designed firstly, and the patterns of the remaining basic sub-array 1331 and the additional array 134 can be obtained by one or more of the above-mentioned transformation methods, which is less difficult to design and cost-effective.
  • the protective cover 16 further includes a resilient first hook 164 protruding inwardly from the protective sidewall 162 , the lens barrel 12 further including from the barrel sidewall 122 When the protective cover 16 is placed on the lens barrel 12, the first hook 164 and the second hook 127 are engaged to restrict the protective cover 16 from coming off the lens barrel 12.
  • the second hook 127 can protrude outward from the inner bottom wall 1262 of the self-adhesive tank 126.
  • the first hook 164 corresponds to the position of the second hook 127, and the protective cover 16 is covered in the lens barrel 12
  • the first hook 164 and the second hook 127 are opposite to each other and elastically deformed.
  • the protective cover 16 is installed in position, the first hook 164 and the second hook 127 are engaged with each other, and the tactile feedback is accompanied. The "click" sound that snaps into place.
  • the protective cover 16 is more reliably combined with the lens barrel 12, and before the protective cover 16 and the lens barrel 12 are bonded with the glue, the first hook 164 and the second hook 127 can be engaged with each other, and can be effectively fixed.
  • the relative position of the protective cover 16 and the lens barrel 12 facilitates dispensing.
  • a first hook 164 is formed on each of the protector sidewalls 1621.
  • a plurality of second hooks 127 are also disposed in the plurality of adhesive tanks 126.
  • the second hooks 127 correspond to the positions of the first hooks 164, and the plurality of first hooks 164 and the corresponding second hooks 127 At the same time, the combination of the protective cover 16 and the lens barrel 12 is more reliable.
  • the first hook 164 may correspond to an intermediate position of the protection sub-side wall 1621
  • the second hook 127 may correspond to an intermediate position of the adhesive tank 126.
  • the first hook 164 is located between the at least two dispensing holes 163, and more specifically, at least two of each of the protective sub-walls 1621.
  • the dispensing holes 163 are symmetrically distributed with respect to the first hook 164. In this way, the glue is allowed to flow on both sides of the first hook 164 and the second hook 127 respectively, and the amount of glue on both sides is equivalent, and the bonding force is relatively uniform.
  • the protective sidewall 162 is provided with a relief hole 165 at a position corresponding to the first hook 164 .
  • the escape hole 165 provides the elastic deformation of the first hook 164.
  • the deformation space that is, the first hook 164 is elastically deformed and protrudes into the escape hole 165.
  • the first hook 164 and the second hook 127 are opposite to each other, the first hook 164 is elastically deformed outward, and the first hook 164 extends into the escape hole 165 to avoid motion interference with the protective sidewall 162. It is also convenient for the user to observe the cooperation of the first hook 164 and the second hook 127 through the avoidance hole 165, for example, to determine whether all the first hooks 164 are engaged with the corresponding second hook 127.
  • the second hook 127 is formed with a guiding slope 1271 along the direction in which the protective cover 16 is sleeved into the lens barrel 12 , and the guiding inclined surface 1271 is away from the inner bottom wall 1262 to protect During the process of the cover 16 being disposed in the lens barrel 12, the first hook 164 is opposed to the guide slope 1271. Because the guiding slope 1271 is inclined with respect to the inner bottom wall 1262, during the cooperation of the first hook 164 and the second hook 127, the resisting force of the second hook 127 received by the first hook 164 is slowly and continuously increased. Large, the shape variable of the first hook 164 is also continuously increased, and the first hook 164 and the second hook 127 are easily engaged.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, for example two, three, unless specifically defined otherwise.

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Abstract

一种激光发生器(13)。激光发生器(13)包括衬底(131)和发光元件(132)阵列。发光元件(132)阵列设置在衬底(131)上。发光元件(132)阵列包括基础阵列(133)和附加阵列(134)。基础阵列(133)形成基础区域(A)，附加阵列(134)形成附加区域(C)。基础阵列(133)包括至少三个基础子阵列(1331)，每个基础子阵列(1331)形成基础子区域(a)。基础区域(A)包括公共区域(B)，公共区域(B)至少位于三个基础子区域(a)上，公共区域(B)位于附加区域(C)内。

Description

激光发生器、结构光投射器、图像获取结构和电子装置
优先权信息
本申请请求2018年03月12日向中国国家知识产权局提交的、专利申请号为201810200490.8的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及光学及电子技术领域，更具体而言，涉及一种激光发生器、结构光投射器、图像获取结构和电子装置。
背景技术
在3D成像中，采集器可以采集结构光投射器发射的散斑图案，并由处理器进一步处理以进行成像，为了提高成像的精度和准确率，激光投射器发射的散斑图案要求具有较高的局部不相关性。
发明内容
本申请实施方式提供一种激光发生器、结构光投射器、图像获取结构和电子装置。
本申请实施方式的激光发生器包括衬底和设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列，所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
本申请实施方式的结构光投射器包括基板组件和激光发生器，所述激光发生器设置在所述基板组件上；所述激光发生器包括衬底和设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列，所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
本申请实施方式的图像获取结构包括结构光投射器、图像采集器及分别与所述结构光投射器和所述图像采集器连接的处理器；所述结构光投射器用于向外发射激光图案；所述图像采集器用于采集所述激光图案；所述处理器用于处理所述激光图案以获得深度图像；所述结构光投射器包括基板组件和激光发生器，所述激光发生器设置在所述基板组件上； 所述激光发生器包括衬底和设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列，所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
本申请实施方式的电子装置包括壳体和图像获取结构，所述图像获取结构设置在所述壳体内并从所述壳体暴露以获取深度图像；所述图像获取结构包括结构光投射器、图像采集器及分别与所述结构光投射器和所述图像采集器连接的处理器；所述结构光投射器用于向外发射激光图案；所述图像采集器用于采集所述激光图案；所述处理器用于处理所述激光图案以获得深度图像；所述结构光投射器包括基板组件和激光发生器，所述激光发生器设置在所述基板组件上；所述激光发生器包括衬底和设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列，所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的电子装置的结构示意图；
图2是本申请实施方式的图像获取结构的结构示意图；
图3是本申请实施方式的结构光投射器的立体示意图；
图4是本申请实施方式的结构光投射器的平面示意图；
图5是本申请实施方式的结构光投射器的立体分解示意图；
图6是图4所示的结构光投射器沿VI-VI线的截面示意图；
图7是图4所示的结构光投射器沿VII-VII线的截面示意图；
图8是图7中的结构光投射器的XIII部分的放大示意图；
图9是图5所示的结构光投射器的IX部分的放大示意图；
图10是本申请实施方式的结构光投射器的保护盖的立体示意图；
图11至图14是本申请实施方式的结构光投射器的激光发生器的结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
本申请实施方式的激光发生器13包括衬底131和设置在所述衬底131上的发光元件132阵列，所述发光元件132阵列包括基础阵列133和附加阵列134，所述基础阵列133形成基础区域A，所述附加阵列134形成附加区域C，所述基础阵列133包括至少三个基础子阵列1331，每个所述基础子阵列1331形成基础子区域a，所述基础区域A包括公共区域B，所述公共区域B至少位于三个所述基础子区域a上，且所述公共区域B位于所述附加区域C内。
在某些实施方式中，至少三个所述基础子阵列1331均相同，所述附加阵列134与所述基础子阵列1331相同。
在某些实施方式中，至少三个所述基础子阵列1331均相同，所述附加阵列134由所述基础子阵列1331通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
在某些实施方式中，至少三个所述基础子阵列1331和所述附加阵列134可以由任意一个所述基础子阵列1331通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
在某些实施方式中，所述基础子阵列1331的发光元件132规则分布或不规则分布。
在某些实施方式中，所述附加阵列134和每个所述基础子阵列1331可被单独驱动以发射光线。
本申请实施方式的结构光投射器10包括基板组件11和上述任一实施方式所述的激光发生器13，所述激光发生器13设置在所述基板组件11上。
在某些实施方式中，所述结构光投射器10还包括镜筒12、准直元件14、及衍射光学元件15；所述镜筒12包括镜筒侧壁122，所述镜筒侧壁122设置在所述基板组件11上并与所述基板组件11共同形成收容腔121；所述准直元件14收容在所述收容腔121内；所 述衍射光学元件15收容在所述收容腔121内，所述激光发生器13用于向所述收容腔121内发射激光，所述准直元件14和所述衍射光学元件15依次设置在所述激光发生器13的光路上。
在某些实施方式中，所述镜筒12包括自所述镜筒侧壁122向所述收容腔121内凸出的限位凸起123，所述衍射光学元件15安装在所述限位凸起123上，所述激光发生器13还包括保护盖16，所述保护盖16与所述镜筒12结合，所述保护盖16包括保护顶壁161，所述衍射光学元件15位于所述限位凸起123与所述保护顶壁161之间。
在某些实施方式中，所述保护盖16还包括自所述保护顶壁161延伸的保护侧壁162，所述保护盖16罩设在所述镜筒12上，所述保护侧壁162与所述镜筒侧壁122固定连接，所述镜筒侧壁122的外壁开设有容胶槽126，所述保护侧壁162与所述容胶槽126对应的位置开设有点胶孔163，以允许胶水通过所述点胶孔163进入所述容胶槽126。
本申请实施方式的图像获取结构100包括上述任一实施方式所述的结构光投射器10、图像采集器20及分别与所述结构光投射器10和所述图像采集器20连接的处理器30；所述结构光投射器10用于向外发射激光图案；所述图像采集器20用于采集所述激光图案；所述处理器30用于处理所述激光图案以获得深度图像。
本申请实施方式的电子装置1000包括壳体200和上述实施方式所述的图像获取结构100，所述图像获取结构100设置在所述壳体200内并从所述壳体200暴露以获取深度图像。
请参阅图1，本申请实施方式的电子装置1000包括壳体200和图像获取结构100。电子装置1000可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁系统、柜员机等，本申请实施例以电子装置1000是手机为例进行说明，可以理解，电子装置1000的具体形式可以是其他，在此不作限制。图像获取结构100设置在壳体200内并从壳体200暴露以获取深度图像，壳体200可以给图像获取结构100提供防尘、防水、防摔等的保护，壳体200上开设有与图像获取结构100对应的孔，以使光线从孔中穿出或穿入壳体200。
请参阅图2，图像获取结构100包括结构光投射器10、图像采集器20和处理器30。图像获取结构100上可以形成有与结构光投射器10对应的投射窗口40，和与图像采集器20对应的采集窗口50。结构光投射器10用于通过投射窗口40向目标空间投射激光图案，图像采集器20用于通过采集窗口50采集被标的物调制后的激光图案。在一个例子中，结构光投射器10投射的激光为红外光，图像采集器20为红外摄像头。处理器30与结构光投射器10及图像采集器20均连接，处理器30用于处理激光图案以获得深度图像。具体地，处理器30采用图像匹配算法计算出该激光图案中各像素点与参考图案中的对应各个像素点的偏离值，再根据该偏离值进一步获得该激光图案的深度图像。其中，图像匹配算法可为数字图像相关(Digital Image Correlation，DIC)算法。当然，也可以采用其它图像匹配 算法代替DIC算法。下面将对结构光投射器10的结构作进一步介绍。
请参阅图3至图5，结构光投射器10包括基板组件11、镜筒12、激光发生器13、准直元件(diffractive optical elements,DOE)14、衍射光学元件15和保护盖16。激光发生器13、准直元件14和衍射光学元件15依次设置在激光发生器13的光路上，具体地，激光发生器13发出的光依次穿过准直元件14和衍射光学元件15。
请参阅图5至图7，基板组件11包括基板111及承载在基板111上的电路板112。基板111用于承载镜筒12、激光发生器13和电路板112。基板111的材料可以是塑料，比如聚对苯二甲酸乙二醇酯(Polyethylene Glycol Terephthalate，PET)、聚甲基丙烯酸甲酯(Polymethyl Methacrylate，PMMA)、聚碳酸酯(Polycarbonate，PC)、聚酰亚胺(Polyimide，PI)中的至少一种。也就是说，基板111可以采用PET、PMMA、PC或PI中任意一种的单一塑料材质制成。如此，基板111质量较轻且具有足够的支撑强度。
电路板112可以是印刷电路板、柔性电路板、软硬结合板中的任意一种。电路板112上可以开设有过孔113，过孔113内可以用于容纳激光发生器13，电路板112一部分被镜筒12罩住，另一部分延伸出来并可以与连接器17连接，连接器17可以将结构光投射器10连接到电子装置1000的主板上。
请参阅图6和图7，镜筒12设置在基板组件11上并与基板组件11共同形成收容腔121。具体地，镜筒12可以与基板组件11的电路板112连接，镜筒12与电路板112可以通过粘胶粘接，以提高收容腔121的气密性。当然，镜筒12与基板组件11的具体连接方式可以有其他，例如通过卡合连接。收容腔121可以用于容纳准直元件14、衍射光学元件15等元器件，收容腔121同时形成结构光投射器10的光路的一部分。在本申请实施例中，镜筒12呈中空的筒状，镜筒12包括镜筒侧壁122和限位凸起123。
镜筒侧壁122包围收容腔121，镜筒侧壁122的外壁可以形成有定位和安装结构，以便于在将结构光投射器10安装在电子装置1000内时固定结构光投射器10的位置。镜筒12包括相背的第一面124和第二面125，其中收容腔121的一个开口开设在第二面125上，另一个开口开设在第一面124上。第二面125与电路板112结合，例如胶合，第一面124可以作为镜筒12与保护盖16等的结合面。请结合图8和图9，镜筒侧壁122的外壁开设有容胶槽126，容胶槽126可以自第一面124开设并向第二面125的方向延伸。
请参阅图6和图7，限位凸起123自镜筒侧壁122向内凸出，具体地，限位凸起123自镜筒侧壁122向收容腔121内突出。限位凸起123可以呈连续的环状，或者限位凸起123包括多个，多个限位凸起123间隔分布。限位凸起123围成过光孔1231，过光孔1231可以作为收容腔121的一部分，激光穿过过光孔1231后穿入衍射光学元件15。限位凸起123位于第一面124与第二面125之间，限位凸起123与第二面125之间的收容腔121可以用 于收容准直元件14，限位凸起123与第一面124之间的收容腔121可以用于收容衍射光学元件15。同时，在组装结构光投射器10时，当衍射光学元件15与限位凸起123相抵，可以认为衍射光学元件15安装到位，当准直元件14与限位凸起123相抵，可以认为准直元件14安装到位。限位凸起123包括限位面1232，当衍射光学元件15安装在限位凸起123上时，限位面1232与衍射光学元件15结合。
请参阅图7，激光发生器13设置在基板组件11上，具体地，激光发生器13可以设置在电路板112上并与电路板112电连接，激光发生器13也可以设置在基板111上并与过孔113对应。此时，可以通过布置导线将激光发生器13与电路板112电连接。激光发生器13用于发射激光，激光可以是可见光或不可见光，例如红外光或紫外光。请结合图11，激光发生器13包括衬底131和发光元件132阵列。
衬底131可以是半导体衬底，比如是晶圆，衬底131安装在基板组件11上，例如通过胶合的方式将衬底131与基板组件11结合。
请参阅图11，发光元件132阵列包括多个发光元件132，发光元件132设置在衬底131上并用于向外发射激光，发光元件132可以是垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)等光源。发光元件132阵列包括基础阵列133和附加阵列134。基础阵列133与附加阵列134均包括多个发光元件132，基础阵列133形成基础区域A，附加阵列134形成附加区域C，附加阵列134可以有多个，每个附加阵列134均形成一个附加区域C，其中，基础区域A与附加区域C可以有重叠的区域。
基础阵列133包括至少三个基础子阵列1331，每个基础子阵列1331形成基础子区域a，不同的基础子区域a可以有相互重叠的区域，基础子区域a位于基础区域A上。基础区域A还包括公共区域B，公共区域B至少位于三个基础子区域a上，或者说，公共区域B由至少三个基础子区域a重叠形成。公共区域B内可以有发光元件132，也可以没有发光元件132，公共区域B可以是一个点、一条线或一个面，在一个例子中，如图11所示，公共区域B为一个点，该点同时位于四个基础子区域a上；在另一个例子中，如图12所示，公共区域B为一个矩形区域，该矩形区域同时位于四个基础子区域a上。同时，公共区域B还位于附加区域C内，或者说，附加区域C的边界包围了公共区域B，可以理解，公共区域B同时位于至少三个基础子区域a上和附加区域C内，也就是每个附加区域C与至少三个基础子区域a之间形成有重叠部分，对应的，每个附加阵列134均与至少三个基础子阵列1331有交叠，提高了发光元件132阵列的局部不相关性。例如如图11所示，附加区域C与四个基础子区域a均有重叠部分，也就是附加阵列134与四个基础子阵列1331均有交叠，且附加阵列134与不同的基础子阵列1331交叠部分形成的阵列是互不相同的，因此，发光元件132阵列的局部不相关性能得到显著提高。
需要说明的是，在本申请实施方式的附图中，各圆圈表示发光元件132所在的位置，并不用来表示发光元件132的实际形状及大小，实线方框代表的是衬底131的轮廓，虚线用于辅助表示各区域的边界，并不一定真实存在于激光发生器13中。且附图中的基础子阵列1331中发光元件132的具体排布方式、多个基础子区域a的组合方式、基础子区域a和附加区域C的具体形状仅用于举例说明，不能理解为对本申请的限制。请参阅图11，在制作激光发生器13时，可以先在衬底131上制作基础阵列133，具体地，可以逐一地在衬底131上制作基础子阵列1331，当所有基础子阵列1331制作完成后，公共区域B随之产生。接着再制作附加阵列134，附加区域C随之产生，并使得公共区域B位于附加区域C内。
请参阅图7，准直元件14可以是光学透镜，准直元件14用于准直激光发生器13发射的激光，准直元件14收容在收容腔121内，准直元件14可以沿第二面125指向第一面124的方向组装到收容腔121内。准直元件14包括光学部141和安装部142，安装部142用于与镜筒侧壁122结合并固定准直元件14，在本申请实施例中，光学部141包括位于准直元件14相背两侧的两个曲面。
请参阅图7和图8，衍射光学元件15安装在限位凸起123上，具体地，衍射光学元件15与限位面1232结合以安装在限位凸起123上。衍射光学元件15的外表面包括顶面151、底面152和侧面153。顶面151和底面152相背，侧面153连接顶面151和底面152，当衍射光学元件15安装在限位凸起123上时，底面152与限位面1232结合。本申请实施例中，底面152上形成有衍射结构，顶面151可以是光滑的平面，衍射光学元件15可以将经准直元件14准直后的激光投射出与衍射结构对应的激光图案。衍射光学元件15可以由玻璃制成，也可以说由复合塑料(如PET)制成。
请参阅图7和图8，保护盖16与镜筒12结合，保护盖16用于限制衍射光学元件15的位置，具体地，保护盖16用于防止衍射光学元件15与镜筒12的结合失效后从镜筒12中脱出。请结合图10，保护盖16包括保护顶壁161和保护侧壁162。
保护顶壁161与限位凸起123分别位于衍射光学元件15的相背的两侧，或者说，衍射光学元件15位于限位凸起123与保护顶壁161之间，如此，即使衍射光学元件15与限位凸起123的结合失效了，由于保护顶壁161的限制作用，衍射光学元件15也不会脱出。保护顶壁161开设有通光孔1611，通光孔1611的位置与衍射光学元件15对应，激光先后穿过过光孔1231、衍射光学元件15和通光孔1611后从结构光投射器10中射出。在本申请实施例中，保护顶壁161的整体形状呈圆角方形，通光孔1611可以呈圆形、矩形、椭圆形、梯形等形状。
请参阅图8至图10，保护侧壁162自保护顶壁161的周缘延伸，保护盖16罩设在镜筒12上，保护侧壁162与镜筒侧壁122固定连接。保护侧壁162包括多个首尾依次相接的 保护子侧壁1621，每个保护子侧壁1621与镜筒侧壁122均固定连接，每个保护子侧壁1621上均形成有点胶孔163。点胶孔163的位置与容胶槽126的位置对应，当保护盖16罩设在镜筒12上后，可以从点胶孔163向容胶槽126内点胶，胶水固化后，保护侧壁162与镜筒侧壁122固定连接。在一个例子中，每个保护子侧壁1621上开设有单个点胶孔163，在另一个例子中，每个保护子侧壁1621上开设有多个点胶孔163，例如两个、三个、四个等，在本申请实施例中，每个保护子侧壁1621上开设有两个点胶孔163，两个点胶孔163分别与容胶槽126的两个内侧壁1261对应，便于用户向容胶槽126的两侧同时点胶，提高点胶速度。进一步地，容胶槽126的内侧壁1261倾斜连接容胶槽126的内底壁1262与镜筒侧壁122的外壁，倾斜连接指的是内侧壁1261与内底壁1262，内侧壁1261与镜筒侧壁122的外壁均不垂直，当胶水被注入到内侧壁1261上时，在内侧壁1261的导引作用下，胶水容易向容胶槽126的中间位置流动，加快胶水填充容胶槽126的速度。
现有技术中的结构光投射器一般采用垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser，VCSEL)作为光源，而VCSEL上的发光元件的排列方式的局部不相关性有待进一步提高。本申请实施方式的电子装置1000中，公共区域B至少位于三个基础子区域a上，且公共区域B位于附加区域C内，使得附加区域C与至少三个基础子区域a相交，也就是附加阵列134与至少三个基础子阵列1331交叠，以形成更多种类的发光元件132的排列方式，提高了发光元件132阵列的局部不相关性。
另外，由于保护盖16与镜筒12结合，保护盖16的保护顶壁161与限位凸起123一起限制衍射光学元件15的位置，衍射光学元件15不会沿出光方向脱落，避免激光未经过衍射光学元件15后发射出去，保护用户，提高安全性。
请参阅图11，在某些实施方式中，附加阵列134和每个基础子阵列1331可被单独驱动以发射光线。当附加阵列134的数量为多个时，多个附加阵列134可以是被统一驱动，也可以是每个附加阵列134均可被单独驱动。同时，附加阵列134与基础子阵列1334之间，不同的基础子阵列1334之间发射激光或不发射激光均不会互相影响，通过控制不同的阵列组合发射激光，可使得激光发生器13发出不同的激光图案。
请参阅图11，在某些实施方式中，基础子阵列1331的发光元件132规则分布。在另一些实施方式中，基础子阵列1331的发光元件132不规则分布。在又一些实施方式中，多个基础子阵列1331中，同时存在发光元件132规则分布的基础子阵列1331，和发光元件132不规则分布的基础子阵列1331。
其中，规则分布可以是多个发光元件132排列成行列纵横交错，且行列呈固定的夹角的阵列；也可以是多个发光元件132排列成以某个点为中心向四周呈放射状的阵列；也可以是多个发光元件132沿着预定方向等间距分布等任意具有一定规律的分布，在此不作限 制。可以理解，在衬底131上制造规则分布的多个发光元件132可以大幅提高制造效率，因此，当基础子阵列1331的发光元件规则分布时，该基础子阵列1331的制造效率较高。当然，当基础子阵列1331的发光元件132不规则分布时，该基础子阵列1331的发光元件132的局部不相关性较高。
请参阅图11，在某些实施方式中，至少三个基础子阵列1331均相同，附加阵列134与基础子阵列1331相同。也就是说，基础子阵列1331与附加阵列134相同，在制造发光元件132阵列时，只需要对一个基础子阵列1331内发光元件132的排列图案进行设计，其余基础子阵列1331和附加阵列134均可以采用相同的排列图案进行制造，节约设计的成本，提高制造效率。
请参阅图13，在某些实施方式中，至少三个基础子阵列1331均相同，附加阵列134、1341、1342、1343由基础子阵列1331通过变换的方式产生，变换的方式包括旋转、镜像和缩放中的一种或多种的组合。具体地，请参阅图13，附加阵列1341可由基础子阵列1331通过旋转的方式产生，附加阵列1342可由基础子阵列1331通过镜像的方式产生，附加阵列1343可由基础子阵列1331通过缩放的方式产生，由不同的变换方式获得的附加阵列134、1341、1342、1343与基础子阵列1331交叠后，均能产生不同的发光元件132的阵列，可提高发光元件132阵列的局部不相关性。其中，旋转变换中的旋转角度，镜像变换中的对称轴和缩放变换中的缩放倍数均可以依据生产的实际需求进行选择。当然，一个附加阵列134也可以由基础子阵列1331通过多种变换方式的组合变换后产生，例如可以将基础子阵列1331镜像后再旋转产生一个附加阵列134；可以将基础子阵列1331缩放后，再进行旋转，最后再进行镜像后产生一个附加阵列134等，在此不作限制。如此，附加阵列134、1341、1342、1343可由基础子阵列1331通过变换的方式产生，不需要再对附加阵列134、1341、1342、1343重新设计，节约了一定的设计成本，且能够使得发光元件132阵列具有较高的局部不相关性。
请参阅图14，在某些实施方式中，至少三个基础子阵列1331和附加阵列134可以由任意一个基础子阵列1331通过变换的方式产生，变换的方式包括旋转、镜像和缩放中的一种或多种的组合。此时，任意两个基础子阵列1331、任意两个附加阵列134、任意一个基础子阵列1331和任意一个附加阵列134均可以通过上述一种或多种变换方式互相变换得到。例如在图14所示的例子中，基础子阵列1332和基础子阵列1333可以由基础子阵列1331通过镜像的方式得到，基础子阵列1334可以由基础子阵列1331通过旋转的方式得到，附加阵列134可以由基础子阵列1331通过缩放的方式得到。由于多个基础子阵列1331之间是通过变换的方式得到，因此基础阵列133中发光元件132的排列已经具有较高的局部不相关性，再通过附加阵列134与基础子阵列1331交叠，进一步提高发光元件132阵列的 局部不相关性。另外，可以先设计一个基础子阵列1331的图案，再通过上述一种或多种变换方式得到其余基础子阵列1331和附加阵列134的图案，设计难度较小，节约成本。
请参阅图8至图10，在某些实施方式中，保护盖16还包括自保护侧壁162向内凸出的弹性的第一卡勾164，镜筒12还包括自镜筒侧壁122向外凸出的第二卡勾127，保护盖16罩设在镜筒12上时，第一卡勾164与第二卡勾127咬合以限制保护盖16脱离镜筒12。
具体地，第二卡勾127可以自容胶槽126的内底壁1262向外凸出，第一卡勾164与第二卡勾127的位置对应，在将保护盖16罩设在镜筒12上的过程中，第一卡勾164与第二卡勾127相抵并发生弹性形变，当保护盖16安装到位后，第一卡勾164与第二卡勾127互相咬合，且会伴随触感反馈和咬合到位的“嗒”声。如此，保护盖16与镜筒12结合更可靠，且在用胶水将保护盖16与镜筒12粘结前，可以先将第一卡勾164与第二卡勾127互相咬合，能有效地固定保护盖16与镜筒12的相对位置，利于点胶的进行。
请参阅图8至图10，在某些实施方式中，每个保护子侧壁1621上均形成有第一卡勾164。对应的，多个容胶槽126内也均设置有第二卡勾127，第二卡勾127与第一卡勾164的位置对应，多个第一卡勾164与对应的第二卡勾127同时咬合，保护盖16与镜筒12的结合更可靠。具体地，第一卡勾164可以与保护子侧壁1621的中间位置对应，第二卡勾127可以与容胶槽126的中间位置对应。当每个保护子侧壁1621形成有至少两个点胶孔163时，第一卡勾164位于至少两个点胶孔163之间，更具体地，每个保护子侧壁1621上的至少两个点胶孔163相对于第一卡勾164对称分布。如此，便于胶水在第一卡勾164和第二卡勾127的两侧分别流动，且两侧的胶水量相当，粘结力较均匀。
请参阅图8和图10，在某些实施方式中，保护侧壁162在与第一卡勾164对应的位置开设有避让孔165。在保护盖16罩设在镜筒12的过程中，第一卡勾164与第二卡勾127相抵且第一卡勾164发生弹性形变时，避让孔165为第一卡勾164的弹性形变提供形变空间，即，第一卡勾164发生弹性形变且伸入避让孔165。具体地，第一卡勾164与第二卡勾127相抵时，第一卡勾164向外发生弹性形变，第一卡勾164伸入避让孔165以避免与保护侧壁162发生运动干涉，另外，也便于用户通过避让孔165观察第一卡勾164与第二卡勾127的配合情况，例如判断是不是所有的第一卡勾164均与对应的第二卡勾127咬合好了。
请参阅图8和图9，在某些实施方式中，第二卡勾127形成有导引斜面1271，沿保护盖16套入镜筒12的方向，导引斜面1271远离内底壁1262，保护盖16罩设在镜筒12的过程中，第一卡勾164与导引斜面1271相抵。由于导引斜面1271的相对于内底壁1262倾斜，第一卡勾164与第二卡勾127配合的过程中，第一卡勾164受到的第二卡勾127的抵持力缓慢连续地增大，第一卡勾164的形变量也连续地变大，第一卡勾164与第二卡勾127 容易卡合。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (33)

  1. 一种激光发生器，其特征在于，包括：
    衬底；和
    设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列，所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
  2. 根据权利要求1所述的激光发生器，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列与所述基础子阵列相同。
  3. 根据权利要求1所述的激光发生器，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列由所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  4. 根据权利要求1所述的激光发生器，其特征在于，至少三个所述基础子阵列和所述附加阵列可以由任意一个所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  5. 根据权利要求1所述的激光发生器，其特征在于，所述基础子阵列的发光元件规则分布或不规则分布。
  6. 根据权利要求1所述的激光发生器，其特征在于，所述附加阵列和每个所述基础子阵列可被单独驱动以发射光线。
  7. 一种结构光投射器，其特征在于，包括基板组件和激光发生器，所述激光发生器，所述激光发生器设置在所述基板组件上，所述激光发生器包括：
    衬底；和
    设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列，所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
  8. 根据权利要求7所述的结构光投射器，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列与所述基础子阵列相同。
  9. 根据权利要求7所述的结构光投射器，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列由所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  10. 根据权利要求7所述的结构光投射器，其特征在于，至少三个所述基础子阵列和所述附加阵列可以由任意一个所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  11. 根据权利要求7所述的结构光投射器，其特征在于，所述基础子阵列的发光元件规则分布或不规则分布。
  12. 根据权利要求7所述的结构光投射器，其特征在于，所述附加阵列和每个所述基础子阵列可被单独驱动以发射光线。
  13. 根据权利要求7至12任意一项所述的结构光投射器，其特征在于，所述结构光投射器还包括：
    镜筒，所述镜筒包括镜筒侧壁，所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔；
    准直元件，所述准直元件收容在所述收容腔内；和
    衍射光学元件，所述衍射光学元件收容在所述收容腔内，所述激光发生器用于向所述收容腔内发射激光，所述准直元件和所述衍射光学元件依次设置在所述激光发生器的光路上。
  14. 根据权利要求13所述的结构光投射器，其特征在于，所述镜筒包括自所述镜筒侧壁向所述收容腔内凸出的限位凸起，所述衍射光学元件安装在所述限位凸起上，所述结构光投射器还包括保护盖，所述保护盖与所述镜筒结合，所述保护盖包括保护顶壁，所述衍射光学元件位于所述限位凸起与所述保护顶壁之间。
  15. 根据权利要求14所述的结构光投射器，其特征在于，所述保护盖还包括自所述保护顶壁延伸的保护侧壁，所述保护盖罩设在所述镜筒上，所述保护侧壁与所述镜筒侧壁固定连接，所述镜筒侧壁的外壁开设有容胶槽，所述保护侧壁与所述容胶槽对应的位置开设有点胶孔，以允许胶水通过所述点胶孔进入所述容胶槽。
  16. 一种图像获取结构，其特征在于，包括：
    结构光投射器，所述结构光投射器用于向外发射激光图案；
    图像采集器，所述图像采集器用于采集所述激光图案；和
    分别与所述结构光投射器和所述图像采集器连接的处理器，所述处理器用于处理所述激光图案以获得深度图像；
    所述结构光投射器包括基板组件和激光发生器，所述激光发生器，所述激光发生器设置在所述基板组件上，所述激光发生器包括：
    衬底；和
    设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列， 所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
  17. 根据权利要求16所述的图像获取结构，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列与所述基础子阵列相同。
  18. 根据权利要求16所述的图像获取结构，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列由所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  19. 根据权利要求16所述的图像获取结构，其特征在于，至少三个所述基础子阵列和所述附加阵列可以由任意一个所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  20. 根据权利要求16所述的图像获取结构，其特征在于，所述基础子阵列的发光元件规则分布或不规则分布。
  21. 根据权利要求16所述的图像获取结构，其特征在于，所述附加阵列和每个所述基础子阵列可被单独驱动以发射光线。
  22. 根据权利要求16至21任意一项所述的图像获取结构，其特征在于，所述结构光投射器还包括：
    镜筒，所述镜筒包括镜筒侧壁，所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔；
    准直元件，所述准直元件收容在所述收容腔内；和
    衍射光学元件，所述衍射光学元件收容在所述收容腔内，所述激光发生器用于向所述收容腔内发射激光，所述准直元件和所述衍射光学元件依次设置在所述激光发生器的光路上。
  23. 根据权利要求22所述的图像获取结构，其特征在于，所述镜筒包括自所述镜筒侧壁向所述收容腔内凸出的限位凸起，所述衍射光学元件安装在所述限位凸起上，所述结构光投射器还包括保护盖，所述保护盖与所述镜筒结合，所述保护盖包括保护顶壁，所述衍射光学元件位于所述限位凸起与所述保护顶壁之间。
  24. 根据权利要求23所述的图像获取结构，其特征在于，所述保护盖还包括自所述保护顶壁延伸的保护侧壁，所述保护盖罩设在所述镜筒上，所述保护侧壁与所述镜筒侧壁固定连接，所述镜筒侧壁的外壁开设有容胶槽，所述保护侧壁与所述容胶槽对应的位置开设有点胶孔，以允许胶水通过所述点胶孔进入所述容胶槽。
  25. 一种电子装置，其特征在于，包括壳体和图像获取结构，所述图像获取结构设置 在所述壳体内并从所述壳体暴露以获取深度图像，所述图像获取结构包括：
    结构光投射器，所述结构光投射器用于向外发射激光图案；
    图像采集器，所述图像采集器用于采集所述激光图案；和
    分别与所述结构光投射器和所述图像采集器连接的处理器，所述处理器用于处理所述激光图案以获得深度图像；
    所述结构光投射器包括基板组件和激光发生器，所述激光发生器，所述激光发生器设置在所述基板组件上，所述激光发生器包括：
    衬底；和
    设置在所述衬底上的发光元件阵列，所述发光元件阵列包括基础阵列和附加阵列，所述基础阵列形成基础区域，所述附加阵列形成附加区域，所述基础阵列包括至少三个基础子阵列，每个所述基础子阵列形成基础子区域，所述基础区域包括公共区域，所述公共区域至少位于三个所述基础子区域上，且所述公共区域位于所述附加区域内。
  26. 根据权利要求25所述的电子装置，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列与所述基础子阵列相同。
  27. 根据权利要求25所述的电子装置，其特征在于，至少三个所述基础子阵列均相同，所述附加阵列由所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  28. 根据权利要求25所述的电子装置，其特征在于，至少三个所述基础子阵列和所述附加阵列可以由任意一个所述基础子阵列通过变换的方式产生，所述变换的方式包括旋转、镜像和缩放中的一种或多种的组合。
  29. 根据权利要求25所述的电子装置，其特征在于，所述基础子阵列的发光元件规则分布或不规则分布。
  30. 根据权利要求25所述的电子装置，其特征在于，所述附加阵列和每个所述基础子阵列可被单独驱动以发射光线。
  31. 根据权利要求25至30任意一项所述的电子装置，其特征在于，所述结构光投射器还包括：
    镜筒，所述镜筒包括镜筒侧壁，所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔；
    准直元件，所述准直元件收容在所述收容腔内；和
    衍射光学元件，所述衍射光学元件收容在所述收容腔内，所述激光发生器用于向所述收容腔内发射激光，所述准直元件和所述衍射光学元件依次设置在所述激光发生器的光路上。
  32. 根据权利要求31所述的电子装置，其特征在于，所述镜筒包括自所述镜筒侧壁向所述收容腔内凸出的限位凸起，所述衍射光学元件安装在所述限位凸起上，所述结构光投射器还包括保护盖，所述保护盖与所述镜筒结合，所述保护盖包括保护顶壁，所述衍射光学元件位于所述限位凸起与所述保护顶壁之间。
  33. 根据权利要求32所述的电子装置，其特征在于，所述保护盖还包括自所述保护顶壁延伸的保护侧壁，所述保护盖罩设在所述镜筒上，所述保护侧壁与所述镜筒侧壁固定连接，所述镜筒侧壁的外壁开设有容胶槽，所述保护侧壁与所述容胶槽对应的位置开设有点胶孔，以允许胶水通过所述点胶孔进入所述容胶槽。
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