WO2019160711A1

WO2019160711A1 - Apparatus and methods for processing a substrate

Info

Publication number: WO2019160711A1
Application number: PCT/US2019/016682
Authority: WO
Inventors: Jeffrey Allen KNOWLES; Richard Sean Priestley; Hak Chuah Sim
Original assignee: Corning Incorporated
Priority date: 2018-02-13
Filing date: 2019-02-05
Publication date: 2019-08-22
Also published as: TW201935311A

Abstract

An apparatus includes a light source and an image capture device. The light source is oriented to transmit light along a path extending from a first portion of an outer edge of a substrate, through the substrate, to a second portion of the outer edge of the substrate. The image capture device is oriented to capture an image of the second portion of the outer edge. A method of processing the substrate includes transmitting light along the path and capturing an image of the second portion of the outer edge.

Description

APPARATUS AND METHODS FOR PROCESSING A SUBSTRATE

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of priority under 35 U. S.C. § 119 of U. S. Provisional Application Serial No. 62/629846 filed on February 13, 2018, the content of which is relied upon and incorporated herein by reference in its entirety.

FIELD

[0002] The present disclosure relates generally to an apparatus and methods for processing a substrate and, more particularly, to methods and apparatus for transmitting light and capturing an image of a portion of an outer edge of a substrate.

BACKGROUND

[0003] It is known to capture an image of a portion of a substrate. For example, it is known to illuminate a portion of a substrate and capture an image of the portion of the substrate.

SUMMARY

[0004] The following presents a simplified summary of the disclosure in order to provide a basic understanding of some exemplary embodiments described in the detailed description.

[0005] In some embodiments, an apparatus can include a light source oriented to transmit light along a path extending from a first portion of an outer edge of a substrate, through the substrate, to a second portion of the outer edge of the substrate. The apparatus can include an image capture device oriented to capture an image of the second portion of the outer edge.

[0006] In some embodiments, the apparatus can include a controller to operate the image capture device.

[0007] In some embodiments, the path can be linear.

[0008] In some embodiments, the light source can include a light emitting region from which the light can be transmitted, and the image capture device can include an image capture region on which the image can be captured.

[0009] In some embodiments, the light emitting region can face the first portion of the outer edge. [0010] In some embodiments, the image capture region can face the second portion of the outer edge.

[0011] In some embodiments, the light emitting region can face the image capture region.

[0012] In some embodiments, the light emitting region can define a first end of the path, and the image capture region can define a second end of the path.

[0013] In some embodiments, a method of processing a substrate can include the step of transmitting light along a path extending from a first portion of an outer edge of the substrate, through the substrate, to a second portion of the outer edge of the substrate. The method can include the step of capturing an image of the second portion of the outer edge.

[0014] In some embodiments, the substrate can include at least one material selected from the group consisting of glass, glass-ceramic, ceramic, and silicon.

[0015] In some embodiments, the method can further include traversing the substrate relative to the path while performing the transmitting and the capturing.

[0016] In some embodiments, the method can further include traversing the path relative to the substrate while performing the transmitting and the capturing.

[0017] In some embodiments, the first portion of the outer edge can be opposite the second portion of the outer edge.

[0018] In some embodiments, the path can be linear.

[0019] In some embodiments, the method can include determining a feature of the substrate based on the captured image.

[0020] In some embodiments, the feature can define one or more of a first dimension of a first chamfered surface extending from a first major surface of the substrate, a second dimension of a second chamfered surface extending from a second major surface of the substrate, and a third dimension of a third surface extending from the first chamfered surface to the second chamfered surface.

[0021] In some embodiments, the third surface can include a planar portion perpendicular to at least one of the first major surface and the second major surface.

[0022] In some embodiments, the outer edge of the substrate can extend across a thickness of the substrate defined between the first major surface and the second major surface. The first dimension can define a first distance parallel to the thickness of the substrate extending from a first intersection of the first major surface and the first chamfered surface to a second intersection of the first chamfered surface and the third surface. The second dimension can define a second distance parallel to the thickness of the substrate extending from a third intersection of the second major surface and the second chamfered surface to a fourth intersection of the second chamfered surface and the third surface. The third dimension can define a third distance parallel to the thickness of the substrate extending from the second intersection to the fourth intersection.

[0023] In some embodiments, the path can be substantially parallel to at least one of the first major surface and the second major surface.

[0024] In some embodiments, the outer edge can laterally circumscribe the first major surface and the second major surface.

[0025] The above embodiments are exemplary and can be provided alone or in any combination with any one or more embodiments provided herein without departing from the scope of the disclosure. Moreover, it is to be understood that both the foregoing general description and the following detailed description present embodiments of the present disclosure, and are intended to provide an overview or framework for understanding the nature and character of the embodiments as they are described and claimed. The accompanying drawings are included to provide a further understanding of the embodiments, and are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure, and together with the description, serve to explain the principles and operations thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] These and other features, embodiments, and advantages of the present disclosure can be further understood when read with reference to the accompanying drawings, in which:

[0027] FIG. 1 illustrates a plan view of an exemplary apparatus and method including a light source and an image capture device in accordance with embodiments of the disclosure;

[0028] FIG. 2 shows a partial cross-sectional view of the exemplary apparatus and method along line 2-2 of FIG. 1 in accordance with embodiments of the disclosure; [0029] FIG. 3 shows an exemplary view from the perspective of an image capture region of the image capture device of FIG. 2 in accordance with embodiments of the disclosure;

[0030] FIG. 4 shows an exemplary embodiment of a captured image from the perspective of an image capture region of the image capture device of FIG. 3 in accordance with embodiments of the disclosure;

[0031] FIG. 5 illustrates a plan view of an exemplary electronic display including a display panel in accordance with embodiments of the disclosure; and

[0032] FIG. 6 shows a partial cross-sectional view of the exemplary electronic display taken along line 6-6 of FIG. 5 including a back light unit in accordance with embodiments of the disclosure;

[0033] FIG. 7 shows an enlarged view of the back light unit taken at view 7 of FIG. 6 in accordance with embodiments of the disclosure; and

[0034] FIG. 8 shows an exemplary embodiment of the exemplary electronic display of FIG. 5, with the display panel removed for clarity, in accordance with embodiments of the disclosure.

DETAILED DESCRIPTION

[0035] Methods and apparatus will now be described more fully hereinafter with reference to the accompanying drawings in which exemplary embodiments of the disclosure are shown. Whenever possible, the same reference numerals are used throughout the drawings to refer to the same or like parts. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0036] Glass sheets are commonly fabricated by flowing molten material to a forming body whereby a glass ribbon can be formed by a variety of ribbon forming processes including, float, slot draw, down-draw (including fusion down-draw), up- draw, press roll or other forming processes. The glass ribbon from any of these processes can then be subsequently divided to provide one or more glass sheets. In some embodiments, processing of the glass sheet can include transporting the glass sheet from one location to another location. Additionally, in some embodiments, the one or more glass sheets can be suitable for further processing into a desired application, including but not limited to, a display application, a lighting application, a photovoltaic application or any other application benefiting from the use of high quality glass sheets. For example, the one or more glass sheets can be used in a variety of display applications, including liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), or the like. In some embodiments, the glass sheets can include a variety of compositions including but not limited to glass (e.g., soda-lime glass, borosilicate glass, alumino-borosilicate glass, an alkali-containing glass, or an alkali-free glass), ceramic, glass-ceramic, or any combination thereof.

[0037] As shown in FIG. 1, in some embodiments, an apparatus 100 can include a substrate 110. Unless otherwise noted, one or more features of a glass sheet may be provided, alone or in combination, with respect to features of the substrate 110 without departing from the scope of the disclosure. For example, in some embodiments, the substrate 110 can include at least one material selected from the group consisting of glass, glass-ceramic, ceramic, and silicon. In some embodiments, the substrate 110 can include a first major surface 111 and a second major surface 112. Additionally, FIG. 2 shows a partial cross-sectional view of the apparatus 100 along line 2-2 of FIG. 1. In some embodiments, an outer edge 120 of the substrate 110 can extend across a thickness“T” of the substrate 110 defined between the first major surface 111 and the second major surface 112. In some embodiments, the thickness“T’ of the substrate 110 can be less than or equal to about 2 millimeters (mm), less than or equal to about 1 millimeter, less than or equal to about 0.5 millimeters, for example, less than or equal to about 300 micrometers, less than or equal to about 200 micrometers, or less than or equal to about 100 micrometers, although other thicknesses may be provided in further embodiments.

[0038] In some embodiments, the outer edge 120 of the substrate 110 can include a planar surface extending across at least a portion of the thickness“T” between the first major surface 111 and the second major surface 112. Moreover, in some embodiments, the outer edge 120 can include a non-planar surface including at least one of a convex profile and a concave profile extending across at least a portion of the thickness“T” between the first major surface 111 and the second major surface 112. In some embodiments, the outer edge 120 can include two or more planar surfaces, two or more non-planar surfaces, or a combination of one or more planar surfaces and one or more non-planar surfaces extending across at least a portion of the thickness“T” between the first major surface 111 and the second major surface 112. In some embodiments, the outer edge 120 can be one or more of ground, polished, buffed, and machined to provide the edge surface of the outer edge 120 with one or more profiles, shapes, and surface characteristics.

[0039] For example, in some embodiments, the outer edge 120 can include a first chamfered surface 123 extending from the first major surface 111 of the substrate 110, a second chamfered surface 124 extending from the second major surface 112 of the substrate 110, and a third surface 125 extending from the first chamfered surface 123 to the second chamfered surface 124. For example, in some embodiments, the first chamfered surface 123 and the second chamfered surface 124 can be provided (e.g., machined, etched) to reduce or eliminate stress concentrations that may otherwise be defined at a sharp comer of the outer edge 120. For example, in some embodiments surface discontinuities present on the outer edge 120, based at least in part on, for example, a separation (e.g., cutting scoring) process to provide the substrate 110, can be smoothed or removed by providing the outer edge 120 of the substrate 110 with one or more of the first chamfered surface 123, the second chamfered surface 124, and the third surface 125. Accordingly, as compared to a substrate including an outer edge including surface continuities, in some embodiments, the substrate 110 of the present disclosure including one or more of the first chamfered surface 123, the second chamfered surface 124, and the third surface 125 can be structurally stronger and less likely to break or fail when employed in a display application in accordance with embodiments of the disclosure.

[0040] Moreover, as discussed more fully below, in some embodiments, the substrate 110 of the present disclosure including one or more of the first chamfered surface 123, the second chamfered surface 124, and the third surface 125 can provide desirable optical properties when employed, for example, in a back light unit 600 of an electronic display 500 (See FIGS. 5-8) in accordance with embodiments of the disclosure. For example, in some embodiments, the outer edge 120 including one or more of the first chamfered surface 123, the second chamfered surface 124, and the third surface 125 can be finished (e.g., polished) to define an optical quality surface substantially free of surface discontinuities (e.g., scratches). In some embodiments, surface discontinuities can optically interfere with light transmitted into, through, and out of the surface. Accordingly, in some embodiments, one or more of the first chamfered surface 123, the second chamfered surface 124, and the third surface 125 can be substantially free of surface discontinuities and can provide the substrate 110 with an outer edge 120 including an optical surface quality into, through, and out of which light can be transmitted.

[0041] In some embodiments, the third surface 125 can include a planar portion perpendicular to at least one of the first major surface 111 and the second major surface 112. Additionally, in some embodiments, the outer edge 120 of the substrate 110 can laterally circumscribe the first major surface 111 and the second major surface 112. For purposes of the disclosure, a first feature that“laterally circumscribes” a second feature is intended to mean that, in a top or bottom view in a direction perpendicular to a major feature (e.g., first major surface 111, second major surface 112) of the substrate 110, for example, an outer periphery defined by the first feature surrounds an outer periphery defined by the second feature. Thus, for example, as shown in the view of FIG. 1, an outer periphery (defined by the outer edge 120) of the substrate 110 surrounds an outer periphery (defined by the first major surface 111 and the second major surface 112) of the substrate 110. In some embodiments, one or more features of the outer edge 120 (e.g., first chamfered surface 123, second chamfered surface 124, third surface 125) can laterally circumscribe at least a portion of the first major surface 111 and at least a portion of the second major surface 112. Likewise, in some embodiments, one or more features of the outer edge 120 (e.g., first chamfered surface 123, second chamfered surface 124, third surface 125) can laterally circumscribe the entire first major surface 111 and the entire second major surface 112.

[0042] In some embodiments, the apparatus 100 can include a light source 130 oriented to transmit light 140 along a path 145 extending from a first portion 121 of the outer edge 120 of the substrate 110, through the substrate 110, to a second portion 122 of the outer edge 120 of the substrate 110. In some embodiments, the first portion 121 can be opposite the second portion 122. In some embodiments, the light source 130 can include a light emitting region 135 facing the first portion 121 of the outer edge 120. In some embodiments, light 140 can be transmitted from the light emitting region 135 of the light source 130. In some embodiments, the light source 130 can include a light emitting diode (LED), a light bulb, a laser, and/or one or more optical fibers oriented to provide a high intensity beam of light 140 with low divergence along the path 145. In some embodiments, the path 145 can be linear. In some embodiments, the path 145 can be substantially parallel to at least one of the first major surface 111 and the second major surface 112.

[0043] Additionally, in some embodiments, the apparatus 100 can include an image capture device 150 oriented to capture an image 300 (See FIG. 3 and FIG. 4) of the second portion 122 of the outer edge 120. In some embodiments, the image capture device 150 can include an image capture region 155 facing the second portion 122 of the outer edge 120. In some embodiments, the image 300 can be captured on the image capture region 155 of the image capture device 150. In some embodiments, the light emitting region 135 of the light source 130 can face the image capture region 155 of the image capture device 150. In some embodiments, the light emitting region 135 can define a first end of the path 145, and the image capture region 155 can define a second end of the path 145. In some embodiments, the first end of the path 145 can be opposite the second end of the path 145.

[0044] Moreover, in some embodiments, the apparatus 100 can include a controller 160 to operate the image capture device 150. For example, in some embodiments, the controller 160 can operate the image capture device 150 to capture the image 300. Unless otherwise noted, in some embodiments, the apparatus 100 can include the substrate 110; however, in some embodiments, the apparatus 100 can be considered complete without the substrate 110, without departing from the scope of the disclosure. For example, in some embodiments, the apparatus 100 including at least one of the light source 130 and the image capture device 150 can be considered complete and oriented to process the substrate 110 (without including the substrate 110) in accordance with embodiments of the disclosure.

[0045] FIG. 3 provides an exemplary view of what the image capture region 155 of the image capture device 150 may see, in some embodiments. Moreover, in some embodiments, the image capture device 150 can include imaging technology (e.g., camera, sensor, light, laser, lens, adapter, zoom lens, filter, etc.) to provide image-based automatic inspection and analysis of one or more features of the substrate 110. For example, in some embodiments, the image capture device 150 can obtain and acquire (e.g., capture) an image 300 (See FIG. 4) including one or more features of the substrate 110.

[0046] Additionally, in some embodiments, the image capture device 150 can be connected to the controller 160 (e.g., computer, CPU, programmable logic controller) via a wired or wireless connection. In some embodiments, the controller 160 can oriented to, programmed to, encoded to, designed to, and/or made to operate the image capture device 150 and can process information (e.g., digital images) obtained by the image capture device 150. In some embodiments, the controller 160 can further include hardware and software to provide image processing capabilities of the image 300 acquired by the image capture device 150. For example, in some embodiments, the controller 160 can process the image 300 using filters, image extraction and decoding techniques, to obtain data from the image 300, image comparison techniques, edge detection capabilities, image stitching and registration, pixel counting and manipulation, segmentation, pattern recognition, color analysis, optical analysis, gauging and metrology, and other image capture image processing methods. Based at least in part on the image processing capabilities, the controller 160 can provide an output (e.g., control signal) to one or more components to identify, characterize, or otherwise define one or more features of the substrate 110 based on the output.

[0047] Accordingly, for purposes of the disclosure, the image capture device 150, alone or in combination with the controller 160, is to be understood to be technically distinguished from, for example, a human eye that utilizes the visual system of the central nervous system of a human to process visual detail, alone or in combination with a human brain to interpret the visual detail obtained with the human visual system. Thus, in some embodiments, the image capture device 150, alone or in combination with the controller 160, can provide automatic image capture and image processing of features of the substrate 110 without human interaction, thereby providing a scalable, consistent, and repeatable automatic method for processing the substrate 110. Moreover, although a single image capture device 150 is illustrated in the drawing figures, it is to be understood that one or more image capture devices can be employed, in some embodiments, in accordance with methods of the disclosure without departing from the scope of the disclosure.

[0048] Methods of processing the substrate 110 will now be described with reference to FIGS. 1-4, with the understanding that one or more steps of the methods can be provided alone or in combination with one or more features of the apparatus 100 in accordance with embodiments of the disclosure. Referring back to FIG. 1 and FIG. 2, in some embodiments, a method of processing the substrate 110 can include transmitting light 140 from the light source 130 along the path 145 extending from the first portion 121 of the outer edge 120 through the substrate 110 to the second portion 122 of the outer edge 120.

[0049] As schematically illustrated in FIG. 3 and FIG. 4, in some embodiments, the method can include capturing an image 300 of the second portion 122 of the outer edge 120 with the image capture device 150. Although depicted as a stationary process, in some embodiments, the method can include traversing the substrate 110 relative to the path 145 while performing the transmitting of the light 140 and the capturing of the image 300. For example, in some embodiments, the method can include traversing the substrate 110 relative to at least one of the light source 130 and the image capture device 150 while performing the transmitting of the light 140 and the capturing of the image 300. In addition or alternatively, in some embodiments, the method can include traversing the path 145 relative to the substrate 110 while performing the transmitting of the light 140 and the capturing of the image 300. For example, in some embodiments, the method can include traversing at least one of the light source 130 and the image capture device 150 relative to the substrate 110 while performing the transmitting of the light 140 and the capturing of the image 300.

[0050] With reference to FIGS. 2-4, in some embodiments, the method can include determining a feature of the substrate 110 based on the captured image 300. For example, in some embodiments, the method can include determining a feature of the second portion 122 of the outer edge 120 of the substrate 110 based on the captured image 300. In some embodiments, the feature can include one or more of a first dimension“tl” of the first chamfered surface 123 extending from the first major surface 111 of the substrate 110, a second dimension“t2” of the second chamfered surface 124 extending from the second major surface 112 of the substrate 110, and a third dimension“t3” of the third surface 125 extending from the first chamfered surface 123 to the second chamfered surface 124 as well as the thickness“T” of the substrate 110. In addition or alternatively, in some embodiments, the thickness“T” of the substrate 110 can be determined (e.g., measured) by one or more techniques, not based on the image 300, without departing from the scope of the disclosure. In some embodiments, the first dimension“tl” can define a first distance parallel to the thickness“T” of the substrate 110 extending from a first intersection 126 of the first major surface 111 and the first chamfered surface 123 to a second intersection 128 of the first chamfered surface 123 and the third surface 125. The second dimension“t2” can define a second distance parallel to the thickness “T” of the substrate 110 extending from a third intersection 127 of the second major surface 112 and the second chamfered surface 124 to a fourth intersection 129 of the second chamfered surface 124 and the third surface 125. The third dimension“t3” can define a third distance parallel to the thickness“T” of the substrate 110 extending from the second intersection 128 to the fourth intersection 129.

[0051] In some embodiments, by determining, based on the image 300, the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, the summation of“tl” +“t2” +“t3” can define the thickness“T” of the substrate 110. In some embodiments, by determining, based on the image 300, the first dimension“tl” and the second dimension“t2”, the third dimension“t3”, can be defined as the thickness“T” of the substrate 110 minus“tl” and“t2”. In some embodiments, by determining, based on the image 300, the first dimension“tl” and the third dimension “t3”, the second dimension“t2”, can be defined as the thickness“T” of the substrate 110 minus“tl” and“t3”. In some embodiments, by determining, based on the image 300, the second dimension“t2” and the third dimension“t3”, the first dimension“tl”, can be defined as the thickness“T” of the substrate 110 minus“t2” and“t3”. In some embodiments, determining one or more of the first dimension “tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, based on the image 300, can enable inspection and quantification of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110. In some embodiments, the substrate 110 can be selected and employed in a variety of display applications in accordance with embodiments of the disclosure based, at least in part, on the inspection and quantification of the one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110.

[0052] For example, FIG. 5 illustrates an exemplary electronic display 500 in accordance with embodiments of the disclosure. Additionally, FIG. 6 shows a cross- sectional view of the electronic display 500 along line 6-6 of FIG. 5. In some embodiments, the electronic display 500 can include a back light unit 600 oriented to face a major surface of a display panel 510. For example, the display panel 510 can include a first major surface 511 opposite a second major surface 512, and the back light unit 600 can be oriented to face the second major surface 512 of the display panel 510. In some embodiments, the first major surface 511 of the display panel 510 can face outward away from the back light unit 600, and the back light unit 600 can illuminate the display panel 510 by providing light from the back light unit 600 to the second major surface 512 of the display panel 510. In some embodiments, the electronic display 500 can be employed as a computer monitor, television monitor, portable display for a cellular phone, tablet, etc., and any other display where the display panel 510 can provide an electronic image (e.g., text, picture, video, etc.) and where the back light unit 600 can illuminate the display panel 510 and the electronic image. In some embodiments, the display panel 510 can include an LCD panel oriented to produce the electronic image which, when illuminated from behind by the back light unit 600, can then be viewed by a user facing the first major surface 511 of the display panel 510.

[0053] For example, in some embodiments, the electronic display 500 can be positioned within a housing (not shown) to, for example, protect the electronic display 500 and provide a structure by which the electronic display 500 can be mounted, held, and otherwise touched by a user or environment in which the electronic display 500 may be employed. In some embodiments, the electronic display 500 can include one or more optical components (e.g., reflectors, filters, etc.) and one or more additional electronic components (e.g., transducers, circuits, receivers, transmitters, power supplies, batteries, etc.) integrated with and electrically connected to the electronic display 500 to, for example, enable a user to interact with and control one or more features of the electronic display 500. Accordingly, it is to be understood that, unless otherwise noted, the features of the electronic display 500 disclosed herein can be employed in a variety of applications including, but not limited to, the particular applications provided herein as exemplary embodiments as well as other applications not explicitly disclosed. In some embodiments, the back light unit 600 can include a light guide plate and/or a plurality of waveguides. For example, in some embodiments, one or more features of the substrate 110 can be provided as one or more features of a light guide plate and/or one or more features of one of more waveguides of a plurality of waveguides defining at least in part the back light unit 600 of the electronic display 500 in accordance with embodiments of the disclosure. [0054] Turning back to FIG. 4, in some embodiments, the image capture device 150, alone or in combination with the controller 160, can automatically define at least one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110. For example, in some embodiments, the image capture device 150 can capture the image 300 of the second portion 122 of the outer edge 120 of the substrate 110 and can process the image 300 using one or more image processing techniques to identify and determine at least one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, of one or more respective features of the first chamfered surface

123, the second chamfered surface 124, the third surface 125, and the substrate 110.

[0055] For example, based on the transmission of light 140 through the substrate 110, the second portion 122 of the outer edge 120 of the substrate 110 can be illuminated based on optical light transmission. In some embodiments, as observed from the perspective of the image capture device 150, the third surface 125 can define a higher intensity (e.g., brighter) transmission of light relative to the amount of light transmitted through the first chamfered surface 123 and the second chamfered surface 124. That is, in some embodiments, based on the orientation of the first chamfered surface 123, the second chamfered surface 124, and the third surface 125 relative to orientation of the light emitting region 135 of the light source 130 and the orientation of the image capture region 155 of the image capture device 150, a distinction between the first chamfered surface 123, the second chamfered surface

124, and the third surface 125 can be identified based on respective illuminated properties discernible in the captured image 300.

[0056] For example, in some embodiments, the image capture device 150 and/or the controller 160 can employ one or more image processing techniques to determine (e.g., estimate), based on the captured image 300, one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110. As schematically illustrated in the exemplary captured image 300 of FIG. 4, in some embodiments, a plurality of pixels 401, 402 corresponding to a plurality of pixels from which the captured image 300 is composed can be processed in accordance with embodiments of the disclosure. For clarity, not all pixels from which the captured image 300 is composed are shown, and those pixels from which the captured image 300 is composed that are shown are schematically represented for purposes of description with the understanding that more or less pixels can be provided in other embodiments without departing from the scope of the disclosure. In some embodiments, pixel resolution with micron or sub-micron precision can be employed to estimate one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T” with micron or sub-micron accuracy.

[0057] For example, in some embodiments, the number of pixels may be defined based on one or more of the resolution of the image capture device 150, the relative thickness“T” of the substrate 110 and the features of the outer edge 120 (e.g., first chamfered surface 123, second chamfered surface 124, third surface 125), and the capabilities of the controller 160 including the image processing techniques employed to process the captured image 300. Additionally, in some embodiments, the number of pixels 401, 402 can be increased to, for example, increase spatial resolution and accuracy of the estimated dimensions one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110, or decreased, to for example, increase computation speed. As represented with respect to the plurality of pixels 401, 402 (respectively representing different resolutions), in some embodiments, one or more pixels may correspond to, for example, a physical feature and/or a spatial location of a physical feature of the outer edge 120. For example, based on the transmission of light 140 along the path 145 (See FIG. 1 and FIG. 2), the plurality of pixels 401, 402 from which the captured image 300 is composed can be processed. In some embodiments, transmitted light incident on the first chamfered surface 123 and the second chamfered surface 124 can be scattered and/or refracted based on the orientation of the surfaces 123, 124 relative to the beam of light. Likewise, in some embodiments, transmitted light incident on the third surface 125 can be transmitted out of the surface 125 without significant scattering and/or refraction. Thus, in some embodiments, the first chamfered surface 123 and the second chamfered surface 124 can include a silhouette (e.g., shadow) relative to the third surface 125 such that features of each of the surfaces 123, 124, 125 of the outer edge 120 can be discernible based on an illumination contrast difference captured in the image 300.

[0058] As schematically represented, with respect to the plurality of pixels 401, shown in FIG. 4, in some embodiments, pixel 401a can correspond to a physical feature and/or a spatial location of a physical feature of the first chamfered surface 123, pixel 401b can correspond to a physical feature and/or a spatial location of a physical feature of the third surface 125, and pixel 401c can correspond to a physical feature and/or a spatial location of a physical feature of the second intersection 128 between the first chamfered surface 123 and the third surface 125. That is, based on the transmission of light 140 along the path 145 (See FIG. 1 and FIG. 2) and because of the physical features of the outer edge 120, in some embodiments, based on the captured image 300, pixel 401a can define a lower illumination intensity relative to the illumination intensity of pixel 401b. In some embodiments, pixel 401c can define an illumination intensity characteristic of an intersection between two surfaces.

[0059] Accordingly, in some embodiments, an analysis of the respective optical transmission-based illumination intensities of pixels 401a, 401b, 401c can be performed and a correlation indicative of one or more physical features and/or one or more spatial locations of one or more physical features of the outer edge 120, based on the optical transmission-based illumination intensities, can be determined. Likewise, as schematically represented, with respect to the plurality of pixels 401, in some embodiments, pixel 401d can correspond to a physical feature and/or a spatial location of a physical feature of the third surface 125, pixel 401e can correspond to a physical feature and/or a spatial location of a physical feature of the second chamfered surface 124, and pixel 401f can correspond to a physical feature and/or a spatial location of a physical feature of the fourth intersection 129 between the second chamfered surface 124 and the third surface 125.

[0060] In some embodiments, a same or similar approach of processing the captured image 300 and analyzing the respective optical transmission-based illumination intensities of pixels can be employed with respect to one or more pixels corresponding to a physical feature and/or a spatial location of a physical feature of the first intersection 126 of the first major surface 111 and the first chamfered surface 123 as well as the third intersection 127 of the second major surface 112 and the second chamfered surface 124. For example, as schematically represented, with respect to the plurality of pixels 401, in some embodiments, pixel 401g can correspond to a physical feature and/or a spatial location of a physical feature (including blank space) outside the profile of the outer edge 120, pixel 401h can correspond to a physical feature and/or a spatial location of a physical feature of the first chamfered surface 123, and pixel 401i can correspond to a physical feature and/or a spatial location of a physical feature of the first intersection 126 between the first chamfered surface 123 and the first major surface 111. Thus, based on the transmission of light 140 along the path 145 (See FIG. 1 and FIG. 2) and because of the physical features of the outer edge 120, in some embodiments, based on the captured image 300, pixel 40 lg can define a lower illumination intensity relative to the illumination intensity of pixel 401h. In some embodiments, pixel 401i can define an illumination intensity characteristic of an intersection between two surfaces.

[0061] Additionally, in some embodiments, an analysis of the respective optical transmission-based illumination intensities of pixels 401g, 401h, 401i can be performed and a correlation indicative of one or more physical features and/or one or more spatial locations of one or more physical features of the outer edge 120, based on the optical transmission-based illumination intensities, can be determined. Likewise, as schematically represented, with respect to the plurality of pixels 401, in some embodiments, pixel 401j can correspond to a physical feature and/or a spatial location of a physical feature of the second chamfered surface 124, pixel 401k can correspond to a physical feature and/or a spatial location of a physical feature (including blank space) outside the profile of the outer edge 120, and pixel 4011 can correspond to a physical feature and/or a spatial location of a physical feature of the third intersection 127 between the second chamfered surface 124 and the second major surface 112.

[0062] Accordingly, in some embodiments, a calculation of the relative spatial distance between pixels 401a-4011 of the plurality of pixels 401 can be performed to estimate one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110, in accordance with embodiments of the disclosure. In some embodiments, the processing of the plurality of pixels 401 can be performed directly based on the spatial coordinates of the pixels 401a-4011. In addition or alternatively, in some embodiments, one or more interpolation (e.g., sub-pixel interpolation) techniques, including linear, non-linear, and other numerical techniques can be employed with respect to the spatial coordinates of the pixels 401a-4011 to process the plurality of pixels 401.

[0063] As schematically represented, with respect to the plurality of pixels 402, shown in FIG. 4, in some embodiments, pixel 402a can correspond to a physical feature and/or a spatial location of a physical feature of the first chamfered surface 123, and pixel 402b can correspond to a physical feature and/or a spatial location of a physical feature of the third surface 125. That is, based on the transmission of light 140 along the path 145 (See FIG. 1 and FIG. 2) and because of the physical features of the outer edge 120, in some embodiments, based on the captured image 300, pixel 402a can define a lower illumination intensity relative to the illumination intensity of pixel 402b.

[0064] Accordingly, in some embodiments, an analysis of the respective optical transmission-based illumination intensities of pixels 402a, 402b can be performed and a correlation indicative of one or more physical features and/or one or more spatial locations of one or more physical features of the outer edge 120, based on the optical transmission-based illumination intensities, can be determined. Likewise, as schematically represented, with respect to the plurality of pixels 402, in some embodiments, pixel 402c can correspond to a physical feature and/or a spatial location of a physical feature of the third surface 125, and pixel 402d can correspond to a physical feature and/or a spatial location of a physical feature of the second chamfered surface 124.

[0065] In some embodiments, a same or similar approach of processing the captured image 300 and analyzing the respective optical transmission-based illumination intensities of pixels can be employed with respect to one or more pixels corresponding to a physical feature and/or a spatial location of a physical feature of the first intersection 126 of the first major surface 111 and the first chamfered surface 123 as well as the third intersection 127 of the second major surface 112 and the second chamfered surface 124. For example, as schematically represented, with respect to the plurality of pixels 402, in some embodiments, pixel 402e can correspond to a physical feature and/or a spatial location of a physical feature (including blank space) outside the profile of the outer edge 120, and pixel 402f can correspond to a physical feature and/or a spatial location of a physical feature of the first chamfered surface 123. Thus, based on the transmission of light 140 along the path 145 (See FIG. 1 and FIG. 2) and because of the physical features of the outer edge 120, in some embodiments, based on the captured image 300, pixel 402e can define a lower illumination intensity relative to the illumination intensity of pixel 402f.

[0066] Additionally, in some embodiments, an analysis of the respective optical transmission-based illumination intensities of pixels 402e, 402f can be performed and a correlation indicative of one or more physical features and/or one or more spatial locations of one or more physical features of the outer edge 120, based on the optical transmission-based illumination intensities, can be determined. Likewise, as schematically represented, with respect to the plurality of pixels 402, in some embodiments, pixel 402g can correspond to a physical feature and/or a spatial location of a physical feature of the second chamfered surface 124, and pixel 402h can correspond to a physical feature and/or a spatial location of a physical feature (including blank space) outside the profile of the outer edge 120,

[0067] Accordingly, in some embodiments, a calculation of the relative spatial distance between pixels 402a-402f of the plurality of pixels 402 can be performed to estimate one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110, in accordance with embodiments of the disclosure. In some embodiments, the processing of the plurality of pixels 402 can be performed directly based on the spatial coordinates of the pixels 402a-402f. In addition or alternatively, in some embodiments, one or more interpolation (e.g., sub-pixel interpolation) techniques, including linear, non-linear, and other numerical techniques can be employed with respect to the spatial coordinates of the pixels 402a-402f to process the plurality of pixels 402.

[0068] Moreover, in some embodiments, as compared to, for example, an outer edge that is illuminated based on irradiated light (e.g., reflection geometry), methods and apparatus 100 of the present disclosure employing transmission-based illumination can provide better (e.g., more accurate) data with respect to the captured image 300 and the respective processing and analysis employed to determine one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension “t3”, as well as the thickness“T”, of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110. That is, without intending to be bound by theory, it is believed that transmission-based illumination of the outer edge 120 of the substrate 110 in accordance with embodiments of the disclosure can provide more accurate estimates of one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, than, for example, illuminating the outer edge 120 (e.g., second portion 122) with a light source (not shown) facing the outer edge 120 (e.g., second portion 122) and capturing an image based on reflection of the light off of the surfaces of the outer edge 120.

[0069] Accordingly, in some embodiments, obtaining more accurate estimates of one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, higher quality substrates 110 can be produced, processed, and provided to be employed in a variety of display applications in accordance with embodiments of the disclosure. For example, in some embodiments, a substrate 110 may be provided, where for a particular display application, it is determined that the third dimension“t3” of the third surface 125 is about 80% to about 90% of the total thickness“T” of the substrate 110. That is, in some embodiments, to achieve, for example desirable light coupling efficiency with respect to the outer edge 120 of the substrate 110 when employed in a back light unit 600 of an electronic display 500 (See FIG. 5), it can be determined that each of the first dimension“tl” of the first chamfered surface 123 and the second dimension“t2” of the second chamfered surface 124 is about 5% to about 10% of the total thickness “T” of the substrate 110. Based on the methods and the apparatus 100 to process the substrate 110 of the present disclosure, in some embodiments, substrates conforming to one or more predetermined criteria can be identified and selected to be employed in a variety of display applications with the understanding that, because the substrate 110 was processed in accordance with embodiments of the disclosure, the substrate 110 includes desirable optical properties and physical characteristics meeting or exceeding the predetermined criteria that, therefore, provide advantages with respect to the application in which the substrate 110 can be employed.

[0070] Referring to FIG. 6, in some embodiments, the back light unit 600 can be oriented with the first major surface 111 of the substrate 110 facing the second major surface 512 of the display panel 510. Additionally, in some embodiments (not shown), the back light unit 600 can be oriented with the second major surface 112 of the substrate 110 facing the second major surface 512 of the display panel 510. In some embodiments, the first major surface 111 of the substrate 110 can be parallel to the second major surface 112 of the substrate 110; however, in some embodiments, the first major surface 111 can be oriented at a non-zero angle relative to the second major surface 112.

[0071] Similarly, in some embodiments, the first major surface 511 of the display panel 510 can be parallel to the second major surface 512 of the display panel 510; however, in some embodiments, the first major surface 511 can be oriented at a non-zero angle relative to the second major surface 512. In some embodiments, any one or more of the first major surface 111 and the second major surface 112 of the substrate 110, and the first major surface 511 and the second major surface 512 of the display panel 510 can be parallel to each other; however, in some embodiments, any one or more of the first major surface 111 and the second major surface 112 of the substrate 110, and the first major surface 511 and the second major surface 512 of the display panel 510 can be oriented at a non-zero angle relative to each other. Additionally, in some embodiments, any one or more of the first major surface 111 and the second major surface 112 of the substrate 110, and the first major surface 511 and the second major surface 512 of the display panel 510 can be planar; however, in some embodiments, any one or more of the first major surface 111 and the second major surface 112 of the substrate 110, and the first major surface 511 and the second major surface 512 of the display panel 510 can be non-planar (e.g., curved).

[0072] In some embodiments, the back light unit 600 can include one or more light sources 625, 627 facing the outer edge 120 of the substrate 110. In some embodiments, the light source 625 can include a light emitting diode (LED), a light bulb, and/or one or more optical fibers. In some embodiments, the light source 625 can be oriented to provide light from the light source 625, 627 to the outer edge 120 of the substrate 110. Moreover, in some embodiments, the light source 625, 627 can include an on/off control where the light source 625, 627 provides light (e.g., illuminates) when an electrical signal is provided to the light source 625, 627 and where the light source 625, 627 does not provide light (e.g., does not illuminate) when the electrical signal is not provided to the light source 625, 627. In some embodiments, an illumination intensity of the light source 625, 627 can be controlled by, for example, varying an electrical signal provided to the light source 625, 627.

[0073] As show in FIG. 7 which shows an enlarged view taken at view 7 of FIG. 6, in some embodiments, light 635 from a light emitting region 630 of the light source 625 can travel along a path 645 that is perpendicular to a face (e.g., third surface 125) of the outer edge 120 of the substrate 110. Although described with respect to light source 625, unless otherwise noted, it is to be understood that one or more features of the light source 625 can be employed, alone or in combination in a same or similar manner, with respect to light source 627 as well as other light sources in accordance with embodiments of the disclosure without departing from the scope of the disclosure. In some embodiments, the light emitting region 630 of the light source 625 can correspond to a region of the light source 625 from which light 635 is provided. For example, in some embodiments, the light source 625 can include a casing (not shown) that can house electrical components of the light source 625. In some embodiments, the light emitting region 630 of the light source 625 can exclude the features and dimensions of the casing and electrical components and instead can correspond to the region of the light source 625 from which light 635 is provided. Therefore, unless otherwise noted, features of the light emitting region 630 of the light source 625, are intended to refer to a region of the light source 625 from which light 635 is provided and not to other non-light emitting features of the light source 625

[0074] In some embodiments, the light emitting region 630 of the light source 625 can be optically coupled to the outer edge 120 (e.g., third surface 125) of the substrate 110. For example, in some embodiments, the light emitting region 630 of the light source 625 can be optically coupled to the outer edge 120 of the substrate 110 by being positioned in physical contact with the third surface 125 of the outer edge 120. In some embodiments, the light emitting region 630 of the light source 625 can be spaced a distance from the outer edge 120. Additionally, in some embodiments, an optical medium (e.g., transparent adhesive, optical filter, optical coupler, etc.) can be positioned between the light emitting region 630 of the light source 625 and the outer edge 120 of the substrate 110 to optically couple the light emitting region 630 of the light source 625 to, for example, the third surface 125 of the outer edge 120 of the substrate 110.

[0075] In some embodiments, if provided, the optical medium can be transparent to visible light. For purposes of this disclosure, visible light is considered light with wavelengths from 400 nanometers to 700 nanometers, and an element or medium is considered“transparent” if greater than or equal to 85% of visible light can pass through the element or medium. In some embodiments, an optical medium that is transparent to visible light can allow light from the light emitting region 630 of the light source 625 to propagate from the light emitting region 630 through the optical medium to the outer edge 120 of the substrate 110. In comparison, if the optical medium was opaque to visible light, in some embodiments, the optical medium may at least one of reduce and block light from the light emitting region 630 of the light source 625 from propagating from the light emitting region 630 to the substrate 110. Accordingly, in some embodiments, the optical medium can bond the light emitting region 630 of the light source 625 and the outer edge 120 of the substrate 110 together without affecting the transmission of visible light between the light emitting region 630 and the outer edge 120 and without degrading the optical characteristics of the back light unit 600.

[0076] In some embodiments, optically coupling the light emitting region 630 of the light source 625 to the third surface 125 of the outer edge 120 of the substrate 110 can illuminate the substrate 110 based on the light from the light source 625 provided to the third surface 125 of the outer edge 120 of the substrate 110. In some embodiments, illuminating an object (e.g., the substrate 110) based on light provided (e.g., from the light emitting region 630 of the light source 625) to an edge of the object (e.g., the third surface 125 of the outer edge 120 of the substrate 110) can be known as “edge-lighting.” Referring back to FIG. 4, in some embodiments, determining one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T”, can enable inspection and quantification of one or more respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110. For example, in some embodiments, the inspection and quantification can allow selective determination as to whether the substrate 110 is suitable to be employed in one or more intended“edge-lighting” applications.

[0077] Additionally, as shown in FIG. 8, which provides an exemplary embodiment of the plan view of the electronic display 500 of FIG. 5 with the display panel 510 removed for clarity, in some embodiments, based on“edge-lighting,” light provided from the light emitting region 630 of the light source 625 to the outer edge 120 of the substrate 110 can propagate along the substrate 110 in a direction away from a first edge 801 of the substrate 110 to travel through the substrate 110 between a second edge 802 and a fourth edge 804 toward a third edge 803 of the substrate 110 opposite the first edge 801. The second edge 802 and the fourth edge 804 of the substrate 110 can extend between the first edge 801 and the third edge 803, and the light can travel from the first edge 801 toward the third edge 803 while traveling between the second edge 802 and the fourth edge 804.

[0078] In some embodiments, a distance between the first edge 801 and the third edge 803 along at least one of the second edge 802 and the fourth edge 804 can define a length“L” of the substrate 110. In some embodiments, light provided from the light emitting region 630 of the light source 625 to the first edge 801 of the substrate 110 can propagate along the length“L” of the substrate 110 from the first edge 801 to the third edge 803 illuminating the substrate 110 within the boundary of the first edge 801, the second edge 802, the third edge 803, and the fourth edge 804. Likewise, in some embodiments, light provided from a light emitting region 632 of the light source 627 to the third edge 803 of the substrate 110 can propagate along the length“L” of the substrate 110 from the third edge 803 to the first edge 801 illuminating the substrate 110 within the boundary of the first edge 801, the second edge 802, the third edge 803, and the fourth edge 804. Although illustrated as including two light sources 625, 627 respectively coupled to the first edge 801 and the third edge 803, in some embodiments, any number of light sources can be provided and coupled to one or more of the first edge 801, the second edge 802, the third edge 803, and the fourth edge 804 without departing from the scope of the disclosure.

[0079] In some embodiments,“edge-lighting” of the substrate 110 can provide a back light unit 600 having smaller dimensions (e.g., a thinner profile) and a back light unit 600 of less weight than, for example, a back light unit 600 that is illuminated with light sources positioned behind the unit (not shown). For example, light sources positioned behind (e.g., facing the second major surface 112 of the substrate 110) can illuminate the back light unit 600. However, in some embodiments, lighting the back light unit 600 with light sources positioned behind the back light unit 600 can include more light sources to provide a same or similar illumination of the back light unit 600 as compared to the number of light sources provided when the back light unit 600 is illuminated by“edge-lighting” of the substrate 110. Similarly, in some embodiments, lighting the back light unit 600 with light sources positioned behind the back light unit 600 can provide a comparatively thicker back light unit 600 relative to a thickness of a back light unit 600 illuminated by“edge-lighting” of the substrate 110. Accordingly, in some embodiments, as trends toward smaller, lighter, and thinner electronic displays 500 may be pursued, the “edge-lit” back light unit 600 of the present disclosure can provide several advantages over back light units illuminated, for example, by light sources positioned behind the back light unit 600.

[0080] Moreover, in some embodiments, one or more features of the methods and apparatus 100 disclosed herein can provide better coupling efficiency between the light emitting region 630 of the light source 625 and the outer edge 120 (e.g., third surface 125) of the substrate 110 as compared to, for example, coupling efficiency between the light emitting region 630 of the light source 625 and the outer edge of substrates where such substrates do not include one or more features of the methods and apparatus 100 in accordance with embodiments of the present disclosure. For example, in some embodiments, based at least in part on the image 300 and the inspection and quantification of one or more of the first dimension“tl”, the second dimension“t2”, and the third dimension“t3”, as well as the thickness“T” of the respective features of the first chamfered surface 123, the second chamfered surface 124, the third surface 125, and the substrate 110, the substrate 110 can be selectively defined based on optical coupling efficiency and employed in a variety of display applications in accordance with embodiments of the disclosure.

[0081] Accordingly, in some embodiments, based on the apparatus 100 and the methods of the disclosure, defining the substrate 110 based on optical coupling efficiency between the light emitting region 630 of the light source 625 and the third surface 125 of the outer edge 120 of the substrate 110 can provide a substrate 110 with improved illumination characteristics of the back light unit 600, reduce at least one of the relative power, size, and intensity of the light source 625, and provide additional optical advantages to the back light unit 600 and the electronic display 500 that cannot be achieved by substrates not including features based on the apparatus and methods of the disclosure.

[0082] It will be appreciated that the various disclosed embodiments may involve particular features, elements or steps that are described in connection with that particular embodiment. It will also be appreciated that a particular feature, element or step, although described in relation to one particular embodiment, may be interchanged or combined with alternate embodiments in various non-illustrated combinations or permutations.

[0083] Embodiments and the functional operations described herein may be implemented in digital electronic circuitry, or in computer software, firmware, or hardware, including the structures disclosed in this specification and their structural equivalents, or in combinations of one or more of them. Embodiments described herein may be implemented as one or more computer program products, i.e., one or more modules of computer program instructions encoded on a tangible program carrier for execution by, or to control the operation of, data processing apparatus. The tangible program carrier may be a computer readable medium. The computer readable medium may be a machine-readable storage device, a machine-readable storage substrate, a memory device, or a combination of one or more of them.

[0084] The term“processor” or“controller” may encompass all apparatus, devices, and machines for processing data, including by way of example a programmable processor, a computer, or multiple processors or computers. The processor may include, in addition to hardware, code that creates an execution environment for the computer program in question, e.g., code that constitutes processor firmware, a protocol stack, a database management system, an operating system, or a combination of one or more of them.

[0085] A computer program (also known as a program, software, software application, script, or code) may be written in any form of programming language, including compiled or interpreted languages, or declarative or procedural languages, and it may be deployed in any form, including as a standalone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. A computer program does not necessarily correspond to a file in a file system. A program may be stored in a portion of a file that holds other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files that store one or more modules, sub programs, or portions of code). A computer program may be deployed to be executed on one computer or on multiple computers that are located at one site or distributed across multiple sites and interconnected by a communication network.

[0086] The processes described herein may be performed by one or more programmable processors executing one or more computer programs to perform functions by operating on input data and generating output. The processes and logic flows may also be performed by, and apparatus may also be implemented as, special purpose logic circuitry, e.g., an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit) to name a few.

[0087] Processors suitable for the execution of a computer program include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Generally, a processor will receive instructions and data from a read only memory or a random-access memory or both. The essential elements of a computer are a processor for performing instructions and one or more data memory devices for storing instructions and data. Generally, a computer will also include, or be operatively coupled to receive data from or transfer data to, or both, one or more mass storage devices for storing data, e.g., magnetic, magneto optical disks, or optical disks. However, a computer need not have such devices. Moreover, a computer may be embedded in another device, e.g., a mobile telephone, a personal digital assistant (PDA), to name just a few.

[0088] Computer readable media suitable for storing computer program instructions and data include all forms data memory including nonvolatile memory, media and memory devices, including by way of example semiconductor memory devices, e.g., EPROM, EEPROM, and flash memory devices; magnetic disks, e.g., internal hard disks or removable disks; magneto optical disks; and CD ROM and DVD-ROM disks. The processor and the memory may be supplemented by, or incorporated in, special purpose logic circuitry.

[0089] To provide for interaction with a user, embodiments described herein may be implemented on a computer having a display device, e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor, and the like for displaying information to the user and a keyboard and a pointing device, e.g., a mouse or a trackball, or a touch screen by which the user may provide input to the computer. Other kinds of devices may be used to provide for interaction with a user as well; for example, input from the user may be received in any form, including acoustic, speech, or tactile input.

[0090] Embodiments described herein may be implemented in a computing system that includes a back end component, e.g., as a data server, or that includes a middleware component, e.g., an application server, or that includes a front end component, e.g., a client computer having a graphical user interface or a Web browser through which a user may interact with implementations of the subject matter described herein, or any combination of one or more such back end, middleware, or front end components. The components of the system may be interconnected by any form or medium of digital data communication, e.g., a communication network. Examples of communication networks include a local area network (“LAN”) and a wide area network (“WAN”), e.g., the Internet.

[0091] The computing system may include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.

[0092] Directional terms as used herein— for example up, down, right, left, front, back, top, bottom— are made only with reference to the figures as drawn and are not intended to imply absolute orientation.

[0093] As used herein the terms "the," "a," or "an," mean "at least one," and should not be limited to "only one" unless explicitly indicated to the contrary. Thus, for example, reference to "a component" includes embodiments having two or more such components unless the context clearly indicates otherwise.

[0094] As used herein, the term “about” means that amounts, sizes, formulations, parameters, and other quantities and characteristics are not and need not be exact, but may be approximate and/or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art. When the term“about” is used in describing a value or an end-point of a range, the disclosure should be understood to include the specific value or end-point referred to. Whether or not a numerical value or end-point of a range in the specification recites“about,” the numerical value or end-point of a range is intended to include two embodiments: one modified by “about,” and one not modified by“about.” It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

[0095] The terms“substantial,”“substantially,” and variations thereof as used herein are intended to note that a described feature is equal or approximately equal to a value or description. For example, a“substantially planar” surface is intended to denote a surface that is planar or approximately planar. Moreover, as defined above, “substantially similar” is intended to denote that two values are equal or approximately equal. In some embodiments, “substantially similar” may denote values within about 10% of each other, such as within about 5% of each other, or within about 2% of each other.

[0096] The above embodiments, and the features of those embodiments, are exemplary and may be provided alone or in any combination with any one or more features of other embodiments provided herein without departing from the scope of the disclosure.

[0097] It will be apparent to those skilled in the art that various modifications and variations may be made to the present disclosure without departing from the spirit and scope of the disclosure. Thus, it is intended that the present disclosure cover the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.

Claims

CLAIMS What is claimed is:

1. An apparatus comprising:

a light source oriented to transmit light along a path extending from a first portion of an outer edge of a substrate, through the substrate, to a second portion of the outer edge of the substrate; and

an image capture device oriented to capture an image of the second portion of the outer edge.

2. The apparatus of claim 1, further comprising a controller to operate the image capture device.

3. The apparatus of claim 1, wherein the path is linear.

4. The apparatus of claim 1, wherein the light source comprises a light emitting region from which the light is transmitted, and wherein the image capture device comprises an image capture region on which the image is captured.

5. The apparatus of claim 4, wherein the light emitting region faces the first portion of the outer edge.

6. The apparatus of claim 4, wherein the image capture region faces the second portion of the outer edge.

7. The apparatus of claim 4, wherein the light emitting region faces the image capture region.

8. The apparatus of claim 4, wherein the light emitting region defines a first end of the path, and wherein the image capture region defines a second end of the path.

9. A method of processing a substrate comprising the steps of: transmitting light along a path extending from a first portion of an outer edge of the substrate, through the substrate, to a second portion of the outer edge of the substrate; and

capturing an image of the second portion of the outer edge.

10. The method of claim 9, wherein the substrate comprises at least one material selected from the group consisting of glass, glass-ceramic, ceramic, and silicon.

11. The method of claim 9, further comprising the step of traversing the substrate relative to the path while performing the transmitting and the capturing.

12. The method of claim 9, further comprising the step of traversing the path relative to the substrate while performing the transmitting and the capturing.

13. The method of claim 9, wherein the first portion of the outer edge is opposite the second portion of the outer edge.

14. The method of claim 9, wherein the path is linear.

15. The method of claim 9, further comprising the step of determining a feature of the substrate based on the captured image.

16. The method of claim 15, wherein the feature defines one or more of a first dimension of a first chamfered surface extending from a first major surface of the substrate, a second dimension of a second chamfered surface extending from a second major surface of the substrate, and a third dimension of a third surface extending from the first chamfered surface to the second chamfered surface.

17. The method of claim 16, wherein the third surface comprises a planar portion perpendicular to at least one of the first major surface and the second major surface.

18. The method of claim 16, wherein the outer edge of the substrate extends across a thickness of the substrate defined between the first major surface and the second major surface, wherein the first dimension defines a first distance parallel to the thickness of the substrate extending from a first intersection of the first major surface and the first chamfered surface to a second intersection of the first chamfered surface and the third surface, wherein the second dimension defines a second distance parallel to the thickness of the substrate extending from a third intersection of the second major surface and the second chamfered surface to a fourth intersection of the second chamfered surface and the third surface, and wherein the third dimension defines a third distance parallel to the thickness of the substrate extending from the second intersection to the fourth intersection.

19. The method of claim 16, wherein the path is substantially parallel to at least one of the first major surface and the second major surface.

20. The method of claim 16, wherein the outer edge laterally circumscribes the first major surface and the second major surface.