WO2019147888A1

WO2019147888A1 - Edge conductors

Info

Publication number: WO2019147888A1
Application number: PCT/US2019/015077
Authority: WO
Inventors: Timothy James Orsley
Original assignee: Corning Incorporated
Priority date: 2018-01-26
Filing date: 2019-01-25
Publication date: 2019-08-01
Also published as: TW201943319A; JP2021511674A; CN111656871A; KR20200105527A

Abstract

An edge conductor includes a first portion configured to be electrically connected to a first conductor on a first surface of a substrate, a second portion configured to be electrically connected to a second conductor on a second surface of the substrate, and a third portion extending between the first portion and the second portion along an edge of the substrate, where the second surface of the substrate is opposite the first surface of the substrate, and the edge of the substrate extends between the first surface of the substrate and the second surface of the substrate.

Description

EDGE CONDUCTORS

This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 62/622,334 filed on January 26, 2018, the content of which is relied upon and incorporated herein by reference in its entirety.

Field

The present disclosure relates generally to electrical conductors. More particularly, the present disclosure relates to edge conductors to electrically couple conductors on opposite surfaces of a substrate, such as a glass substrate of a display tile.

Technical Background

Electronic displays may be used in numerous types of devices such as televisions, smart phones, tablet computers, automotive electronics, augmented reality devices, and the like. Tiled displays, in which pixels on adjacent tiles continue across a boundary between tiles at the same pitch as pixels within a tile, may be used to achieve a "zero bezel" display. Tiled displays may include control electronics on one surface of a glass substrate and emitters on an opposite surface of the glass substrate.

One approach to transfer electrical signals between one surface of a glass substrate and an opposite surface of the glass substrate may include metallized through-glass-vias (TGVs). Fabrication of metallized TGVs, however, may be expensive, as individual holes are often formed and metallized with a serial process, and may potentially damage emitters, which are often formed on the glass substrate before the TGVs. Use of TGVs may also pose challenges in fabrication of a thin film transistor array for controlling individual pixels. Another approach to transfer electrical signals between one surface of a glass substrate and an opposite surface of the glass substrate may include printing of conductive ink around an edge of the glass substrate. Conductive inks, however, may have difficulty in achieving sufficient electrical performance, such as current carrying capacity to drive emitters, and may also have difficulty in being used on a substrate with a sharp edge corner.

Accordingly, edge conductors to transfer electrical signals from one surface of a glass substrate to an opposite surface of the glass substrate are disclosed herein.

Summary

Some embodiments of the present disclosure relate to an edge conductor. The edge conductor includes a first portion configured to be electrically connected to a first conductor on a first surface of a substrate, a second portion configured to be electrically connected to a second conductor on a second surface of the substrate, and a third portion extending between the first portion and the second portion along an edge of the substrate. The edge conductor includes a first bend between the first portion and the third portion, and a second bend between the second portion and the third portion. The second surface of the substrate is opposite the first surface of the substrate, and the edge of the substrate extends between the first surface of the substrate and the second surface of the substrate.

Other embodiments of the present disclosure relate to a display tile. The display tile includes a substrate having a first surface, a second surface opposite the first surface, and an edge surface extending between the first surface and the second surface. The display tile includes a first conductor on the first surface of the substrate, a second conductor on the second surface of the substrate, and a third conductor bent to extend along each of the first surface, the second surface, and the edge surface. The third conductor is electrically coupled with both the first conductor and the second conductor. Other embodiments of the present disclosure relate to a method of making a display tile. The method includes placing an edge conductor along one of a first surface of a substrate, a second surface of the substrate opposite the first surface of the substrate, and an edge surface of the substrate extending between the first surface of the substrate and the second surface of the substrate. The method further includes bending the edge conductor to extend along the other of the first surface of the substrate, the second surface of the substrate, and the edge surface of the substrate. With the method, placing the edge conductor and bending the edge conductor includes electrically coupling the edge conductor with a first conductor on the first surface of the substrate and a second conductor on the second surface of the substrate.

Other embodiments of the present disclosure relate to a display tile. The display tile includes a substrate having a first surface, a second surface opposite the first surface, and an edge surface extending between the first surface and the second surface. The display tile includes a first conductor on the first surface of the substrate, a second conductor on the second surface of the substrate, and a third conductor extending along the edge surface of the substrate. The third conductor is proud of the first surface of the substrate and the second surface of the substrate, and is electrically coupled with both the first conductor and the second conductor.

Other embodiments of the present disclosure relate to a method of making a display tile. The method includes placing an edge conductor along an edge surface of a substrate, with the edge surface of the substrate extending between a first surface of the substrate and a second surface of the substrate opposite the first surface of the substrate, and the edge conductor extending beyond the first surface of the substrate and the second surface of the substrate. The method further includes electrically coupling the edge conductor with a first conductor on the first surface of the substrate and a second conductor on the second surface of the substrate.

The edge conductors and methods disclosed herein enable the transfer of electrical signals from one surface of a glass substrate to an opposite surface of the glass substrate while providing lower fabrication costs, as well as improved conductivity.

Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings.

It is to be understood that both the foregoing general description and the following detailed description describe various embodiments and are intended to provide an overview or framework for understanding the nature and character of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments, and are

incorporated into and constitute a part of this specification. The drawings illustrate various embodiments described herein, and together with the description serve to explain the principles and operations of the claimed subject matter.

Brief Description of the Drawings

Figs. 1 A, 1 B schematically depict front and back plan views, respectively, of an example of a display tile.

Fig. 2 schematically depicts a perspective view of an example of a substrate for a display tile.

Fig. 3 schematically depicts a plan view of an example of a plurality of edge conductors.

Figs. 4A, 4B, 4C schematically depict a side view of an example of securing an edge conductor of Fig. 3 to the substrate of Fig. 2.

Fig. 5 schematically depicts an exploded perspective view of an example of a display tile including the substrate of Fig. 2 and edge conductors of Fig. 3.

Fig. 6 schematically depicts a perspective view of an example of a substrate for a display tile. Fig. 7 schematically depicts a plan view of an example of a panel of edge conductors.

Fig. 8 schematically depicts a plan view of an example of the substrate of Fig. 6 positioned on the panel of edge conductors of Fig. 7.

Figs. 9A, 9B schematically depict front and back views, respectively, of an example of a portion of the substrate of Fig. 6 from the perspective of lines 9A-9A and 9B-9B, respectively, of Fig. 8.

Figs. 10A, 10B, 10C, 10D schematically depict a side view of an example of securing an edge conductor of Fig. 7 to the substrate of Fig. 6 from the perspective of line 10-10 of Fig. 8.

Fig. 11 schematically depicts an edge view of an example of a display tile including the substrate of Fig. 6 and edge conductors of Fig. 7.

Fig. 12 schematically depicts a perspective view of an example of a substrate for a display tile.

Fig. 13 schematically depicts a plan view of an example of a plurality of edge conductors.

Fig. 14 schematically depicts a plan view of an example of the plurality of edge conductors of Fig. 13 positioned on the substrate of Fig. 12.

Figs. 15A, 15B, 15C schematically depict a side view of an example of securing an edge conductor of Fig. 13 to the substrate of Fig. 12 from the perspective of line 15-15 of Fig. 14.

Fig. 16 schematically depicts a plan view of an example of the plurality of edge conductors of Fig. 13 secured to the substrate of Fig. 12.

Fig. 17 schematically depicts a side view of an example of a display tile including the substrate of Fig. 12 and an edge conductor of Fig. 14.

Fig. 18 schematically depicts a perspective view of an example of a substrate for a display tile.

Fig. 19 schematically depicts a plan view of an example of a plurality of edge conductors. Figs. 20A, 20B, 20C schematically depict a side view of an example of securing an edge conductor of Fig. 19 to the substrate of Fig. 18 from the perspective of line 20-20 of Fig. 19.

Fig. 21 schematically depicts a perspective view of an example of a substrate for a display tile.

Fig. 22A schematically depicts a plan view of an example of a plurality of edge conductors.

Fig. 22B schematically depicts a side view of an example of the plurality of edge conductors of Fig. 22A from the perspective of line 22B-22B of Fig. 22A.

Fig. 23 schematically depicts a plan view of an example of the plurality of edge conductors of Figs. 22A, 22B positioned on the substrate of Fig. 21.

Figs. 24A, 24B, 24C schematically depict a side view of an example of securing an edge conductor of Figs. 22A, 22B to the substrate of Fig. 21 from the perspective of line 24-24 of Fig. 23.

Fig. 25 schematically depicts a perspective view of an example of a substrate for a display tile.

Fig. 26A schematically depicts a plan view of an example of a plurality of edge conductors.

Fig. 26B schematically depicts a side view of an example of the plurality of edge conductors of Fig. 26A from the perspective of line 26B-26B of Fig. 26A.

Fig. 27A schematically depicts a plan view of an example of the substrate of Fig. 25 positioned on the plurality of edge conductors of Figs. 26A, 26B.

Fig. 27B schematically depicts a side view of an example of a portion of the substrate of Fig. 25 positioned on an edge conductor of Figs. 26A, 26B from the perspective of line 27B-27B of Fig. 27 A.

Figs. 28A, 28B, 28C, 28D schematically depict side views of an example of securing an edge conductor of Figs. 26A, 26B to the substrate of Fig. 25 from the perspective of line 27B-27B of Fig. 27 A.

Fig. 29 schematically depicts a side view of an example of a portion of a substrate for a display tile and an example of an edge conductor secured to the substrate. Fig. 30 schematically depicts a side view of an example of a portion of a substrate for a display tile and an example of an edge conductor secured to the substrate.

Detailed Description

Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Ranges can be expressed herein as from "about" one particular value, and/or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent "about," it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

Directional terms as used herein (for example, up, down, right, left, front, back, top, bottom, vertical, horizontal) are made only with reference to the figures as drawn and are not intended to imply absolute orientation.

Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order, nor that with any apparatus, specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred, in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of embodiments described in the specification.

As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a" component includes aspects having two or more such components, unless the context clearly indicates otherwise.

Referring to Figs. 1A, 1 B, an exemplary display tile 100 is schematically depicted. More specifically, Fig. 1 A schematically depicts a front plan view of an example of display tile 100, and Fig. 1 B schematically depicts a back plan view of an example of display tile 100. Display tile 100 includes a substrate 110, a plurality of light sources 180, and drive circuitry or control electronics 190.

In the depicted example, substrate 110 has a first surface 112 (Fig. 1A) and a second surface 114 (Fig. 1 B) opposite first surface 112, with light sources 180 provided on first surface 112 and control electronics 190 provided on second surface 114. In examples, first surface 112 represents a front or first side 102 of display tile 100, and second surface 114 represents a back or second side 104 of display tile 100.

Light sources 180 may be arranged, for example, in an array including any number of rows and columns. Each light source 180 is electrically coupled to drive circuitry, such as drive circuitry or control electronics 190, for driving or controlling operation of each light source 180. Each light source 180 may include, for example, a light emitting diode (LED), a microLED, an organic light emitting diode (OLED), or other suitable light source.

Fig. 2 schematically depicts a perspective view of an example of a substrate 210 for a display tile 200, as an example of substrate 110 for display tile 100. Substrate 210 has a first surface 212 and a second surface 214 opposite first surface 212, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 212 and drive circuitry or control electronics (not shown), such as drive circuitry or control electronics 190 (Fig. 1 B), provided on second surface 214. In addition, substrate 210 has a third surface 216 extended between first surface 212 and second surface 214, with third surface 216 representing an edge surface 218 of substrate 210.

In examples, first surface 212 and second surface 214 are substantially parallel with each other, and edge surface 218 is substantially orthogonal to first surface 212 and second surface 214. In examples, first surface 212 represents a front or first side 202 of display tile 200 and second surface 214 represents a back or second side 204 of display tile 200.

In the depicted example, substrate 210 has a substantially rectangular shape and includes additional edge (or side) surfaces extending between first surface 212 and second surface 214. In other examples, substrate 210 may have other suitable shapes, such as, for example, circular, triangular, or other polygonal shapes, with corresponding or associated surfaces.

In the depicted example, display tile 200 includes first conductors 220 on first surface 212 of substrate 210 and second conductors 222 on second surface 214 of substrate 210. In examples, first conductors 220 are electrically connected to light sources (not shown) provided on first surface 212 of substrate 210, such as light sources 180 (Fig. 1A), and second conductors 222 are electrically connected to drive circuitry or control electronics (not shown) provided on second surface 214 of substrate 210, such as drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources. In examples, first conductors 220 and second conductors 222 are spaced on respective first surface 212 and second surface 214, and positioned adjacent to and extending inward from edge surface 218.

In one example, an interconnect material 226 is provided adjacent an end of first conductors 220 and second conductors 222 adjacent to edge surface 218. In examples, interconnect material 226 is a conductive material and facilitates electrical connection with first conductors 220 and second conductors 222, as described below. In examples, interconnect material 226 may include a conductive metal, such as, for example, copper, a conductive paste, such as, for example, an anisotropic conductive paste (ACP), a

conductive film, such as, for example, an anisotropic conductive film (ACF), or a conductive adhesive, such as, for example, an anisotropic conductive adhesive (AC A).

Fig. 3 schematically depicts a plan view of an example of a plurality of edge conductors 230. Edge conductors 230 represent third conductors 224 of display tile 200, and provide electrical connection between first conductors 220 and second conductors 222, as described below. More specifically, edge conductors 230 are bent to extend around edge surface 218 of substrate 210 (Fig. 2) and provide electrical connection between respective and corresponding first conductors 220 on first surface 212 of substrate 210 and second

conductors 222 on second surface 214 of substrate 210 (Fig. 2). In examples, edge conductors 230 may be bent along fold lines 232, as described below, to extend around edge surface 218 of substrate 210 and provide electrical connection between first conductors 220 and second conductors 222.

In one example, as depicted in Fig. 3, edge conductors 230 may be formed as a series of spaced edge conductors 230 supported by one or more than one web or spine 234 and individual tethers 236 extended between spine 234 and respective and corresponding edge conductors 230. As such, spine 234 and tethers 236 hold or maintain a spacing and relative position of edge conductors 230 as edge conductors 230 are secured to substrate 210. In one example, as depicted in Fig. 3, spines 234 and respective and corresponding tethers 236 are provided at each end (i.e. , opposite ends) of edge conductors 230. In another example, a single spine 234 and respective and corresponding tethers 236 are provided at one end of edge conductors 230.

In one example, edge conductors 230, spine (or spines) 234, and tethers 236 may be unitarily, integrally formed of a flat metal foil. As such, the flat metal foil may be patterned or masked (for example, by photolithography) and chemical etched to define edge conductors 230, spine (or spines) 234, and tethers 236. In examples, as described below, spine (or spines) 234 and tethers 236 are separated from edge conductors 230 at tethers 236 after edge conductors 230 are secured to substrate 210. In examples, tethers 236 may include narrowed and/or reduced thickness regions that facilitate separation of spine (or spines) 234 and tethers 236 from edge conductors 230.

Figs. 4A, 4B, 4C schematically depict a side view of an example of securing an edge conductor 230 to substrate 210. In one example, a series of edge conductors 230 may be substantially simultaneously secured to substrate 210 corresponding to a position of respective first conductors 220, as provided on first surface 212 of substrate 210, and second conductors 222, as provided on second surface 214 of substrate 210.

As depicted in the example of Fig. 4A, edge conductor 230, with spines 234 and tethers 236 attached thereto, is positioned or placed along edge surface 218 of substrate 210 in a position corresponding to a respective first conductor 220 and second conductor 222.

As depicted in the example of Fig. 4B, edge conductor 230, with spines 234 and tethers 236 attached thereto, is bent, as represented by arrows 240 (Fig. 4A), to extend along first surface 212 and second surface 214 of substrate 210 such that edge conductor 230 establishes electrical connection with first conductor 220 and second conductor 222. In the depicted example, edge conductor 230 establishes electrical connection with first conductor 220 and second conductor 222 via interconnect material 226 (see also Fig. 4A).

As depicted in the example of Fig. 4B, after edge conductor 230 is secured to substrate 210 including, more specifically, electrically coupled with first conductor 220 on first surface 212 and second conductor 222 on second surface 214, spines 234 and tethers 236 are separated from edge conductor 230. For example, spines 234 and tethers 236 may be bent, as represented by arrows 242, to release spines 234 and tethers 236 from edge conductor 230.

As depicted in the example of Fig. 4C, edge conductor 230 includes a first portion 230a extended along first surface 212, a second portion 230b extended along second surface 214, and a third portion 230c extended along edge surface 218. In addition, edge conductor 230 includes a first bend 230d between first portion 230a and third portion 230c, and a second bend 230e between second portion 230b and third portion 230c. In one example, with edge conductor 230 bent to extend along first surface 212 and second surface 214, first portion 230a and second portion 230b are substantially parallel with each other. As such, first bend 230d and second bend 230e are each a substantially orthogonal bend. In one example, first portion 230a and second portion 230b are substantially the same length such that edge conductor 230 extends substantially the same distance along first surface 212 and second surface 214 of substrate 210.

In one example, edge conductor 230 may be pressure bonded to substrate 210. More specifically, first portion 230a may be pressure bonded to first conductor 220 on first surface 212 of substrate 210, and second portion 230b may be pressure bonded to second conductor 222 on second surface 214 of substrate 210. Other manners of securing edge conductor 230 to substrate 210 may also be implemented.

Fig. 5 schematically depicts an exploded perspective view of an example of display tile 200 including substrate 210 and edge conductors 230. As depicted in the example of Fig. 5, edge conductors 230 are aligned with corresponding first conductors 220 provided on first surface 212 of substrate 210 and corresponding second conductors 222 provided on second surface 214 of substrate 210. As such, edge conductors 230 extend between first surface 212 and second surface 214 along edge surface 218 to electrically couple respective first conductors 220 on first surface 212 of substrate 210 with respective second conductors 222 on second surface 214 of substrate 210.

Fig. 6 schematically depicts a perspective view of an example of a substrate 310 for a display tile 300, as an example of substrate 110 for display tile 100. Similar to substrate 210 (Fig. 2) of display tile 200, substrate 310 has a first surface 312 and a second surface 314 opposite first surface 312, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 312 and drive circuitry or control electronics (not shown), such as drive circuitry or control electronics 190 (Fig. 1 B), provided on second surface 314. In addition, substrate 310 has a third surface 316 extended between first surface 312 and second surface 314, with third surface 316 representing an edge surface 318 of substrate 310. In examples, first surface 312 represents a front or first side 302 of display tile 300 and second surface 314 represents a back or second side 304 of display tile 300.

In the depicted example, display tile 300 includes first conductors 320 on first surface 312 of substrate 310 and second conductors 322 on second surface 314 of substrate 310. In examples, first conductors 320 are electrically connected to light sources (not shown) provided on first surface 312 of substrate 310, such as light sources 180 (Fig. 1A), and second conductors 322 are electrically connected to drive circuitry or control electronics (not shown) provided on second surface 314 of substrate 310, such as drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources. In examples, first conductors 320 and second conductors 322 are spaced on respective first surface 312 and second surface 314, and positioned adjacent to and extending inward from edge surface 318.

In one example, an interconnect material 326 is provided adjacent an end of first conductors 320 and second conductors 322 adjacent to edge surface 318. In examples, interconnect material 326 is a conductive material and facilitates electrical connection with first conductors 320 and second conductors 322, as described below.

As depicted in the example of Fig. 6, interconnect material 326 extends a width of substrate 310 adjacent to edge surface 318. In examples, interconnect material 326 may include a conductive paste, such as, for example, an anisotropic conductive paste (ACP), a conductive film, such as, for example, an anisotropic conductive film (ACF), or a conductive adhesive, such as, for example, an anisotropic conductive adhesive (ACA). As an anisotropic conductive paste, anisotropic conductive film, or anisotropic conductive adhesive, interconnect material 326 is conductive only in the Z-axis (i.e. , thickness) and is non-conductive in the X- and Y-axis. Fig. 7 schematically depicts a plan view of an example of a panel of edge conductors 330. Similar to edge conductors 230 (Fig. 3) of display tile 200, edge conductors 330 represent third conductors 324 of display tile 300, and provide electrical connection between first conductors 320 and second conductors 322, as described below. More specifically, edge conductors 330 are bent to extend around edge surface 318 of substrate 310 (Fig. 6) and provide electrical connection between respective and corresponding first conductors 320 on first surface 312 of substrate 310 and second conductors 322 on second surface 314 of substrate 310 (Fig. 6). In examples, edge conductors 330 may be bent along fold lines 332, as described below, to extend around edge surface 318 of substrate 310 and provide electrical connection between first conductors 320 and second conductors 322.

In one example, as depicted in Fig. 7, edge conductors 330 may be formed as an array of edge conductors 330. For example, a flat metal foil may be patterned or masked (for example, by photolithography) and chemical etched to form a perforated panel 334 whereby openings or holes 336 in panel 334 become "spaces" between adjacent edge conductors 330. As such, panel 334 may be severed along cut lines 338, as described below, to singulate a series of parallel edge conductors 330. As depicted in the example of Fig. 7, panel 334 may be severed to provide multiple series of parallel edge conductors 330 (for example, four series of parallel edge conductors 330).

Fig. 8 schematically depicts a plan view of an example of substrate 310 positioned on panel 334, and Figs. 9A, 9B schematically depict front and back views, respectively, of an example of a portion of substrate 310 from the perspective of lines 9A-9A and 9B-9B, respectively, of Fig. 8.

In the example of Fig. 8, substrate 310, with first conductors 320 on first surface 312 and second conductors 322 on second surface 314, is positioned with edge surface 318 (Fig. 6) facing and in contact with panel 334. In one example, substrate 310 is aligned with fold lines 332 (Fig. 7).

As depicted in the example of Figs. 9A, 9B, interconnect material 326 is provided on first surface 312 and second surface 314 adjacent an end of first conductors 320 and second conductors 322 adjacent to edge surface 318. In one example, interconnect material 326 extends a width of substrate 310 adjacent to edge surface 318.

Figs. 10A, 10B, 10C, 10D schematically depict a side view of an example of securing an edge conductor 330 to substrate 310. In one example, a series of edge conductors 330 may be substantially simultaneously secured to substrate 310 corresponding to a position of respective first conductors 320, as provided on first surface 312 of substrate 310, and second conductors 322, as provided on second surface 314 of substrate 310.

As depicted in the example of Fig. 10A, substrate 310 is positioned on panel 334 with edge surface 318 facing and in contact with panel 334. More specifically, substrate 310 is positioned on panel 334 with edge surface 318 facing and in contact with edge conductor 330 of panel 334. In examples, substrate 310 and edge conductor 330 are aligned such that a position of edge conductor 330 corresponds to a position of first conductor 320 and second conductor 322.

In one example, as depicted in Fig. 10A, panel 334, with the array of edge conductors 330 (Fig. 7), is supported by a fixture 350 and captured between substrate 310 and fixture 350.

As depicted in the example of Fig. 10B, panel 334 is severed along cut lines 338 (Fig. 7) to singulate edge conductor 330. In one example, panel 334 is severed by blades 352. In one example, a series of edge conductors 330 may be substantially simultaneously singulated by blades 352.

As depicted in the example of Fig. 10C, edge conductor 330 is bent to extend along first surface 312 and second surface 314 of substrate 310 such that edge conductor 330 establishes electrical connection with first conductor 320 and second conductor 322. In the depicted example, edge conductor 330 establishes electrical connection with first conductor 320 and second conductor 322 via interconnect material 326 (see also Fig. 10A).

In one example, as depicted in Fig. 10C, edge conductor 330 may be bent by portions of fixture 350. For example, portions of fixture 350 may be advanced or moved relative to substrate 310, as represented by arrows 354, to bend edge conductor 330.

As such, as depicted in the example of Fig. 10D, after edge conductor 330 is bent, portions of fixture 350 may be retracted or moved relative to substrate 310, as represented by arrows 356.

As depicted in the example of Fig. 10D, edge conductor 330 includes a first portion 330a extended along first surface 312, a second portion 330b extended along second surface 314, and a third portion 330c extended along edge surface 318. In addition, edge conductor 330 includes a first bend 330d between first portion 330a and third portion 330c, and a second bend 330e between second portion 330b and third portion 330c. In one example, with edge conductor 330 bent to extend along first surface 312 and second surface 314, first portion 330a and second portion 330b are substantially parallel with each other. As such, first bend 330d and second bend 330e are each a substantially orthogonal bend. In one example, first portion 330a and second portion 330b are substantially the same length such that edge conductor 330 extends substantially the same distance along first surface 312 and second surface 314 of substrate 310.

In one example, edge conductor 330 may be pressure bonded to substrate 310. More specifically, first portion 330a may be pressure bonded to first conductor 320 on first surface 312 of substrate 310, and second portion 330b may be pressure bonded to second conductor 322 on second surface 314 of substrate 310. Other manners of securing edge conductor 330 to substrate 310 may also be implemented.

Fig. 11 schematically depicts an edge view of an example of display tile 300 including substrate 310 and edge conductors 330. As depicted in the example of Fig. 11 , edge conductors 330 extend along and contact edge surface 318 of substrate 310 between first side 302 and second side 304 of display tile 300. Similar to edge conductors 230 of display tile 200 (Fig. 5), edge conductors 330 are aligned with corresponding first conductors 320 provided on first surface 312 of substrate 310 and corresponding second conductors 322 provided on second surface 314 of substrate 310 (Fig. 6). As such, edge conductors 330 extend between first surface 312 and second surface 314 along edge surface 318 to electrically couple respective first conductors 320 on first surface 312 of substrate 310 with respective second conductors 322 on second surface 314 of substrate 310. In the depicted example, edge conductors 330 establish electrical connection with first conductor 320 and second conductor 322 via interconnect material 326.

Fig. 12 schematically depicts a perspective view of an example of a substrate 410 for a display tile 400, as an example of substrate 110 for display tile 100. Similar to substrate 210 (Fig. 2) for display tile 200, substrate 410 has a first surface 412 and a second surface 414 opposite first surface 412, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 412 and drive circuitry or control electronics (not shown), such as drive circuitry or control electronics 190 (Fig. 1 B), provided on second surface 414. In addition, substrate 410 has a third surface 416 extended between first surface 412 and second surface 414, with third surface 416 representing an edge surface 418 of substrate 410. In examples, first surface 412 represents a front or first side 402 of display tile 400 and second surface 414 represents a back or second side 404 of display tile 400.

In the depicted example, display tile 400 includes first conductors 420 on first surface 412 of substrate 410 and second conductors 422 on second surface 414 of substrate 410. In examples, first conductors 420 are electrically connected to light sources (not shown) provided on first surface 412 of substrate 410, such as light sources 180 (Fig. 1A), and second conductors 422 are electrically connected to drive circuitry or control electronics (not shown) provided on second surface 414 of substrate 410, such as drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources. In examples, first conductors 420 and second conductors 422 are spaced on respective first surface 412 and second surface 414, and positioned adjacent to and extending inward from edge surface 418. In one example, an interconnect material 426 is provided adjacent an end of first conductors 420 and second conductors 422 adjacent to edge surface 418. In examples, interconnect material 426 is a conductive material and facilitates electrical connection with first conductors 420 and second conductors 422, as described below.

As depicted in the example of Fig. 12, interconnect material 426 extends a width of substrate 410 adjacent to edge surface 418. In examples,

interconnect material 426 may include a conductive paste, such as, for example, an anisotropic conductive paste (ACP), a conductive film, such as, for example, an anisotropic conductive film (ACF), or a conductive adhesive, such as, for example, an anisotropic conductive adhesive (ACA).

Fig. 13 schematically depicts a plan view of an example of a plurality of edge conductors 430. Similar to edge conductors 230 (Fig. 3) of display tile 200, edge conductors 430 represent third conductors 424 of display tile 400, and provide electrical connection between first conductors 420 and second conductors 422, as described below. More specifically, edge conductors 430 are bent to extend around edge surface 418 of substrate 410 (Fig. 12) and provide electrical connection between respective and corresponding first conductors 420 on first surface 412 of substrate 410 and second conductors 422 on second surface 414 of substrate 410 (Fig. 12). In examples, edge conductors 430 may be bent along fold lines 432, as described below, to extend around edge surface 418 of substrate 410 and provide electrical connection between first conductors 420 and second conductors 422.

In one example, as depicted in Fig. 13, edge conductors 430 may be formed as a series of spaced edge conductors 430 supported by a web or a spine 434. For example, a flat metal foil may be patterned or masked (for example, by photolithography) and chemical etched to form edge conductors 430 and spine 434. As such, spine 434 may be severed along a cut line 438, as described below, to singulate a series of parallel edge conductors 430.

Fig. 14 schematically depicts a plan view of an example of the series of edge conductors 430 positioned on substrate 410. More specifically, a first portion 430a of respective edge conductors 430 is aligned with corresponding first conductors 420 and secured to substrate 410 on first surface 412, as described below. Similar to interconnect material 326 of substrate 300 (Figs.

9A, 9B), interconnect material 426 is provided on first surface 412 and second surface 414 (Fig. 16) adjacent an end of first conductors 420 and second conductors 422 (Fig. 16) adjacent to edge surface 418. In one example, interconnect material 426 extends a width of substrate 410 adjacent to edge surface 418.

Figs. 15A, 15B, 15C schematically depict a side view of an example of securing edge conductors 430 to substrate 410. In one example, a series of edge conductors 430 may be substantially simultaneously secured to substrate 410 corresponding to a position of respective first conductors 420, as provided on first surface 412 of substrate 410, and second conductors 422, as provided on second surface 414 of substrate 410.

As depicted in the example of Fig. 15A, edge conductor 430 is positioned or placed along first surface 412 of substrate 410 in a position corresponding to first conductor 420 such that edge conductor 430 is secured to substrate 410 to establish electrical connection with first conductor 420. More specifically, first portion 430a of edge conductor 430 is secured to substrate 410 to establish electrical connection with first conductor 420. In the depicted example, edge conductor 430 establishes electrical connection with first conductor 420 via interconnect material 426.

As depicted in the example of Fig. 15A, spine 434 is severed from edge conductor 430 along cut line 438 (Fig. 13) to singulate edge conductor 430. In one example, spine 434 is severed by blade 452. In one example, a series of edge conductors 430 may be substantially simultaneously singulated by blade 452.

As depicted in the examples of Figs. 15B and 15C, edge conductor 430 is bent to extend along edge surface 418 of substrate 410, as represented by arrow 440, and bent to extend along second surface 414 of substrate 410, as represented by arrow 442, respectively, such that edge conductor 430 establishes electrical connection with second conductor 422. More specifically, a second portion 430b of edge conductor 430 establishes electrical connection with second conductor 422. In the depicted example, edge conductor 430 establishes electrical connection with second conductor 422 via interconnect material 426.

Fig. 16 schematically depicts a plan view of an example of the series of edge conductors 430 secured to substrate 410. More specifically, as

schematically depicted in Fig. 16, second portion 430b of respective edge conductors 430 is secured to substrate 410 on second surface 414 in a position corresponding to respective second conductors 422 such that edge conductors 430 establish electrical connection with respective second conductors 422 around edge surface 418. In the depicted example, edge conductors 430 establish electrical connection with second conductors 422 via interconnect material 426.

Fig. 17 schematically depicts a side view of an example of display tile 400 including substrate 410 and edge conductor 430. As depicted in the example of Fig. 17, edge conductor 430 includes a first portion 430a extended along first surface 412, a second portion 430b extended along second surface 414, and a third portion 430c extended along edge surface 418. In addition, edge conductor 430 includes a first bend 430d between first portion 430a and third portion 430c, and a second bend 430e between second portion 430b and third portion 430c. In one example, with edge conductor 430 bent to extend along first surface 412 and second surface 414, first portion 430a and second portion 430b are substantially parallel with each other. As such, first bend 430d and second bend 430e are each a substantially orthogonal bend. In one example, first portion 430a and second portion 430b are substantially the same length such that edge conductor 430 extends substantially the same distance along first surface 412 and second surface 414 of substrate 410.

In one example, edge conductor 430 may be pressure bonded to substrate 410. More specifically, first portion 430a may be pressure bonded to first conductor 420 on first surface 412 of substrate 410, and second portion 430b may be pressure bonded to second conductor 422 on second surface 414 of substrate 410. Other manners of securing edge conductor 430 to substrate 410 may also be implemented.

Fig. 18 schematically depicts a perspective view of an example of a substrate 510 for a display tile 500, as an example of substrate 110 for display tile 100. Similar to substrate 210 (Fig. 2) of display tile 200, substrate 510 has a first surface 512 and a second surface 514 opposite first surface 512, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 512 and drive circuitry or control electronics (not shown), such as drive circuitry or control electronics 190 (Fig. 1 B), provided on second surface 514. In addition, substrate 510 has a third surface 516 extended between first surface 512 and second surface 514, with third surface 516 representing an edge surface 518 of substrate 510. In examples, first surface 512 represents a front or first side 502 of display tile 500 and second surface 514 represents a back or second side 504 of display tile 500.

In the depicted example, display tile 500 includes first conductors 520 on first surface 512 of substrate 510 and second conductors 522 on second surface 514 of substrate 510. In examples, first conductors 520 are electrically connected to light sources (not shown) provided on first surface 512 of substrate 510, such as light sources 180 (Fig. 1A), and second conductors 522 are electrically connected to drive circuitry or control electronics (not shown) provided on second surface 514 of substrate 510, such as drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources. In examples, first conductors 520 and second conductors 522 are spaced on respective first surface 512 and second surface 514, and positioned adjacent to and extending inward from edge surface 518.

Fig. 19 schematically depicts a plan view of an example of a plurality of edge conductors 530. Similar to edge conductors 230 (Fig. 3) of display tile 200, edge conductors 530 represent third conductors 524 of display tile 500, and provide electrical connection between first conductors 520 and second conductors 522, as described below. More specifically, edge conductors 530 are bent to extend around edge surface 518 of substrate 510 (Fig. 18) and provide electrical connection between respective and corresponding first conductors 520 on first surface 512 of substrate 510 and second conductors 522 on second surface 514 of substrate 510 (Fig. 18). In examples, edge conductors 530 may be bent along fold lines 532, as described below, to extend around edge surface 518 of substrate 510 and provide electrical connection between first conductors 520 and second conductors 522.

In one example, as depicted in Fig. 19, edge conductors 530 may be formed as a series of spaced edge conductors 530 supported by a spine or strip 534. For example, a flat metal foil may be secured (for example, bonded) to a supporting substrate, such as polyimide, pattern or masked (for example, by photolithography), and etched to form edge conductors 530. In one example, a mask layer 560 (Fig. 20A) may be provided on a surface of edge conductors 530 to protect and insulate edge conductors 530. In one example, a portion of the supporting substrate may be selectively removed such that strip 534 of the supporting substrate remains. As such, edge conductors 530 may be exposed or remain as a series of edge conductors 530 supported by and extended from strip 534. As depicted in the example of Fig. 19, strip 534 may be severed from edge conductors 530 along a cut line 538, as described below, to singulate a series of parallel edge conductors 530.

In one example, as depicted in Fig. 19, an interconnect material 526 is provided at or adjacent to opposite ends of respective edge conductors 530. In examples, interconnect material 526 is a conductive material and facilitates electrical connection with first conductors 520 and second conductors 522 (Fig. 18), as described below. In one example, interconnect material 526 may comprise deposits of solder. As such, interconnect material 526 may include solder "bumps" which may be reflowed, as described below.

Figs. 20A, 20B, 20C schematically depict a side view of an example of securing edge conductor 530 to substrate 510. In one example, a series of edge conductors 530 may be substantially simultaneously secured to substrate 510 corresponding to a position of respective first conductors 520, as provided on first surface 512 of substrate 510, and second conductors 522, as provided on second surface 514 of substrate 510.

As depicted in the example of Fig. 20A, substrate 510 is positioned on edge conductor 530 with edge surface 518 facing edge conductor 530. In examples, substrate 510 and edge conductor 530 are aligned such that a position of edge conductor 530 corresponds to a position of first conductor 520 and second conductor 522. In one example, edge conductor 530 is secured to substrate 510 at edge surface 518. For example, edge conductor 530 may be bonded to substrate 510 by an adhesive tape 570 (for example, a double-sided adhesive tape) provided on edge surface 518.

With edge conductor 530 secured to substrate 510, strip 534 may be severed from edge conductor 530 along cut line 538 (Fig. 19) to singulate edge conductor 530. In one example, strip 534 is severed by a blade 552. In one example, a series of edge conductors 530 may be substantially simultaneously singulated by blade 552.

As depicted in the example of Fig. 20B, with substrate 510 secured to edge conductor 530 and strip 534 severed from edge conductor 530, edge conductor 530 is bent, as represented by arrows 540, to extend along first surface 512 and second surface 514 of substrate 510 such that edge conductor 530 establishes electrical connection with first conductor 520 and second conductor 522. In one example, edge conductor 530 may be supported by and bent by, for example, a fixture, such as fixture 350 (Fig. 10C).

As depicted in the example of Fig. 20C, edge conductor 530 establishes electrical connection with first conductor 520 and second conductor 522 via interconnect material 526 (see also Fig. 20A). More specifically, in an example where interconnect material 526 comprises deposits of solder (i.e. , solder "bumps"), interconnect material 526 may be reflowed with heat to bond or secure edge conductor 530 to first conductor 520 on first surface 512 of substrate 510 and second conductor 522 on second surface 514 of substrate 510. Other manners of securing edge conductor 530 to substrate 510 may also be implemented. As depicted in the example of Fig. 20C, edge conductor 530 includes a first portion 530a extended along first surface 512, a second portion 530b extended along second surface 514, and a third portion 530c extended along edge surface 518. In addition, edge conductor 530 includes a first bend 530d between first portion 530a and third portion 530c, and a second bend 530e between second portion 530b and third portion 530c. In one example, with edge conductor 530 bent to extend along first surface 512 and second surface 514, first portion 530a and second portion 530b are substantially parallel with each other. As such, first bend 530d and second bend 530e are each a substantially orthogonal bend. In one example, first portion 530a and second portion 530b are substantially the same length such that edge conductor 530 extends substantially the same distance along first surface 512 and second surface 514 of substrate 510.

Fig. 21 schematically depicts a perspective view of an example of a substrate 610 for a display tile 600, as an example of substrate 110 for display tile 100. Similar to substrate 210 (Fig. 2) for display tile 200, substrate 610 has a first surface 612 and a second surface 614 opposite first surface 612, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 612 and drive circuitry or control electronics (not shown), such as drive circuitry or control electronics 190 (Fig. 1 B), provided on second surface 614. In addition, substrate 610 has a third surface 616 extended between first surface 612 and second surface 614, with third surface 616 representing an edge surface 618 of substrate 610. In examples, first surface 612 represents a front or first side 602 of display tile 600 and second surface 614 represents a back or second side 604 of display tile 600.

In the depicted example, display tile 600 includes first conductors 620 on first surface 612 of substrate 610 and second conductors 622 on second surface 614 of substrate 610. In examples, first conductors 620 are electrically connected to light sources (not shown) provided on first surface 612 of substrate 610, such as light sources 180 (Fig. 1A), and second conductors 622 are electrically connected to drive circuitry or control electronics (not shown) provided on second surface 614 of substrate 610, such as drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources. In examples, first conductors 620 and second conductors 622 are spaced on respective first surface 612 and second surface 614, and positioned adjacent to and extending inward from edge surface 618.

In one example, an interconnect material 626 is provided adjacent an end of first conductors 620 and second conductors 622 adjacent to edge surface 618. In examples, interconnect material 626 is a conductive material and facilitates electrical connection with first conductors 620 and second conductors 622, as described below.

As depicted in the example of Fig. 21 , interconnect material 626 extends a width of substrate 610 adjacent to edge surface 618. In examples,

interconnect material 626 may include a conductive paste, such as, for example, an anisotropic conductive paste (ACP), a conductive film, such as, for example, an anisotropic conductive film (ACF), or a conductive adhesive, such as, for example, an anisotropic conductive adhesive (ACA).

Fig. 22A schematically depicts a plan view of an example of a plurality of edge conductors 630, and Fig. 22B schematically depicts a side view of an example of edge conductors 630 from the perspective of line 22B-22B of Fig. 22A. Similar to edge conductors 230 (Fig. 3) of display tile 200, edge

conductors 630 represent third conductors 624 of display tile 600, and provide electrical connection between first conductors 620 and second conductors 622, as described below. More specifically, edge conductors 630 are bent to extend around edge surface 618 of substrate 610 (Fig. 21 ) and provide electrical connection between respective and corresponding first conductors 620 on first surface 612 of substrate 610 and second conductors 622 on second surface 614 of substrate 610 (Fig. 21 ). In examples, edge conductors 630 may be bent along fold lines 632, as described below, to extend around edge surface 618 of substrate 610 and provide electrical connection between first conductors 620 and second conductors 622. In one example, as depicted in Figs. 22A, 22B, edge conductors 630 may be formed as a series of spaced edge conductors 630 supported by a polymer film 640. For example, a flat metal foil may be secured (for example, bonded) to polymer film 640, patterned or masked (for example, by photolithography), and chemical etched to form edge conductors 630 on polymer film 640.

In examples, polymer film 640 is formed of a stretchable resin film, and the flat metal foil is formed of a copper foil such that the stretchable resin film is covered or clad with the copper foil. As such, the copper-clad stretchable film may be patterned or masked and chemical etched to form parallel traces of copper foil on the stretchable resin film whereby the parallel traces of copper foil form a series of parallel edge conductors 630 on the stretchable resin film.

Fig. 23 schematically depicts a plan view of an example of the series of edge conductors 630, as supported by polymer film 640, positioned on substrate 610. More specifically, a first portion 630a of respective edge conductors 630 is aligned with corresponding first conductors 620 and secured to substrate 610 on first surface 612, as described below. Similar to

interconnect material 326 of substrate 300 (Figs. 9A, 9B), interconnect material 626 is provided on first surface 612 and second surface 614 (Fig. 24A) adjacent an end of first conductors 620 and second conductors 622 (Fig. 24A) adjacent to edge surface 618. In one example, interconnect material 626 extends a width of substrate 610 adjacent to edge surface 618.

Figs. 24A, 24B, 24C schematically depict a side view of an example of securing edge conductors 630, as supported by polymer film 640, to substrate 610. In one example, a series of edge conductors 630 may be substantially simultaneously secured to substrate 610 corresponding to a position of respective first conductors 620, as provided on first surface 612 of substrate 610, and second conductors 622, as provided on second surface 614 of substrate 610.

As depicted in the example of Fig. 24A, edge conductor 630, as supported by polymer film 640, is positioned or placed along first surface 612 of substrate 610 in a position corresponding to first conductor 620 such that edge conductor 630 is secured to substrate 610 to establish electrical connection with first conductor 620. More specifically, first portion 630a of edge conductor 630 is secured to substrate 610 to establish electrical connection with first conductor 620. In the depicted example, edge conductor 630 establishes electrical connection with first conductor 620 via interconnect material 626.

As depicted in the examples of Figs. 24B and 24C, edge conductor 630, as supported by polymer film 640, is bent to extend along edge surface 618 of substrate 610, as represented by arrow 650, and bent to extend along second surface 614 of substrate 610, as represented by arrow 652, respectively, such that edge conductor 630 establishes electrical connection with second conductor 622. More specifically, a second portion 630b of edge conductor 630 establishes electrical connection with second conductor 622. In the depicted example, edge conductor 630 establishes electrical connection with second conductor 622 via interconnect material 626.

In one example, edge conductor 630, as supported by polymer film 640, may be pressure bonded to substrate 610. More specifically, first portion 630a may be pressure bonded to first conductor 620 on first surface 612 of substrate 610, and second portion 630b may be pressure bonded to second conductor 622 on second surface 614 of substrate 610. In specific examples, edge conductor 630 may be pressure bonded to substrate 610 by thermo- compression bonding. Other manners of securing edge conductor 630 to substrate 610 may also be implemented.

In one example, interconnect material 626 may comprise deposits of solder. As such, interconnect material 626 may include solder "bumps" which may be reflowed with heat to bond or secure edge conductor 630 to first conductor 620 on first surface 612 of substrate 610 and second conductor 622 on second surface 614 of substrate 610.

In examples, as described above, polymer film 640 is formed of a stretchable resin film. As such, polymer film 640 adapts and conforms to a shape or contour of substrate 610 as edge conductor 630, as supported by polymer film 640, is bent to extend along edge surface 618 of substrate 610 (Fig. 24B) and bent to extend along second surface 614 of substrate 610 (Fig. 24C).

In examples, with edge conductor 630 supported by polymer film 640 and secured to substrate 610, polymer film 640 provides mechanical protection to edge conductor 630 and electrical insulation of edge conductor 630. For example, polymer film 640 may act as an insulator to help prevent edge conductor 630 from becoming shorted with an edge conductor of an adjacent display tile.

In one example, after edge conductor 630, as supported by polymer film 640, is secured to substrate 610, polymer film 640 may be removed. For example, polymer film 640 may be removed with an etchant that may selectively remove polymer film 640 without damage to edge conductor 630 or substrate 610, including without damage to first conductor 620 and second conductor 622.

In examples, with edge conductor 630 supported by polymer film 640 and secured to substrate 610, a thickness of metal foil forming edge conductor 630 may be thinner than that of a non-supported edge conductor. As such, with removal of polymer film 640, as described above, a final thickness of edge conductor 630 along edge surface 618 of substrate 610 may be reduced.

Fig. 25 schematically depicts a perspective view of an example of a substrate 710 for a display tile 700, as an example of substrate 110 for display tile 100. Similar to substrate 210 (Fig. 2) for display tile 200, substrate 710 has a first surface 712 and a second surface 714 opposite first surface 712, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 712 and drive circuitry or control electronics (not shown), such as drive circuitry or control electronics 190 (Fig. 1 B), provided on second surface 714. In addition, substrate 710 has a third surface 716 extended between first surface 712 and second surface 714, with third surface 716 representing an edge surface 718 of substrate 710. In examples, first surface 712 represents a front or first side 702 of display tile 700 and second surface 714 represents a back or second side 704 of display tile 700. In the depicted example, display tile 700 includes first conductors 720 on first surface 712 of substrate 710 and second conductors 722 on second surface 714 of substrate 710. In examples, first conductors 720 are electrically connected to light sources (not shown) provided on first surface 712 of substrate 710, such as light sources 180 (Fig. 1A), and second conductors 722 are electrically connected to drive circuitry or control electronics (not shown) provided on second surface 714 of substrate 710, such as drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources. In examples, first conductors 720 and second conductors 722 are spaced on respective first surface 712 and second surface 714, and positioned adjacent to and extending inward from edge surface 718. In examples, first conductors 720 and second connectors 722 are spaced from edge surface 718.

Fig. 26A schematically depicts a plan view of an example of a plurality of edge conductors 730, and Fig. 26B schematically depicts a side view of an example of edge conductors 730 from the perspective of line 26B-26B of Fig. 26A. Edge conductors 730 represent third conductors 724 of display tile 700, and provide electrical connection between first conductors 720 and second conductors 722, as described below. In examples, edge conductors 730 may be positioned, as described below, to extend along edge surface 718 of substrate 710 and provide electrical connection between first conductors 720 and second conductors 722. More specifically, edge conductors 730 extend along edge surface 718 of substrate 710 (Fig. 25) and are electrically coupled with first conductors 720 and second conductors 722 to provide electrical connection between respective and corresponding first conductors 720 on first surface 712 of substrate 710 and second conductors 722 on second surface 714 of substrate 710 (Fig. 25).

In one example, as depicted in Figs. 26A, 26B, edge conductors 730 may be formed as a series of spaced edge conductors 730 supported by a substrate 740. For example, a flat metal foil may be secured (for example, bonded) to substrate 740, patterned or masked (for example, by photolithography), and chemical etched to form edge conductors 730 on substrate 740. In examples, substrate 740 is a polymer substrate and formed of polyimide material, and the flat metal foil is formed of a copper foil such that the polyimide material is covered with the copper foil. As such, the copper-covered polyimide substrate may be patterned or masked and chemical etched to form parallel traces of copper foil on the polyimide substrate whereby the parallel traces of copper foil form a series of parallel edge conductors 730 on the polyimide substrate.

Fig. 27A schematically depicts a plan view of an example of substrate 710 positioned on edge conductors 730, and Fig. 27B schematically depicts a side view of substrate 710 positioned on an edge conductor 730 from the perspective of line 27B-27B of Fig. 27A. In the example of Figs. 27A, 27B, substrate 710, with first conductors 720 on first surface 712 and second conductors 722 on second surface 714, is positioned with edge surface 718 facing and in contact with edge conductors 730, as supported by substrate 740. In examples, substrate 710 is positioned on edge conductors 730 such that edge conductors 730 protrude from, extend beyond, or are proud of first surface 712 and second surface 714. As such, an inside corner 706 is formed between edge conductor 730 and first surface 712 of substrate 710 and an inside corner 708 is formed between edge conductor 730 and second surface 714 of substrate 710.

Figs. 28A, 28B, 28C, 28D schematically depict side views of an example of securing edge conductor 730 to substrate 710. In one example, as depicted in Fig. 28A, substrate 740, with edge conductors 730 (Fig. 26A), and substrate 710, with edge surface 718 facing and in contact with edge conductors 730 (Fig. 27), are supported by a fixture 750 such that substrate 740, with edge

conductors 730, is positioned between substrate 710 and fixture 750. In one example, as depicted in Figs. 28A, 28B, fixture 750 is tilted or oriented at an angle such that substrate 740, with edge conductor 730, and substrate 710, with first conductor 720 and second conductor 722, are also tilted or oriented at the same angle. As depicted in the example of Fig. 28A, fixture 750 is tilted or oriented at a first acute angle A1 relative to horizontal. As such, a "trough" is formed at inside corner 706 (Fig. 27B) provided between edge conductor 730 and substrate 710 including, more specifically, between edge conductor 730 and first surface 712 of substrate 710, and between edge conductor 730 and first conductor 720.

As depicted in the example of Fig. 28A, edge conductor 730 is electrically coupled with first conductor 720 via solder 760. In examples, molten solder 760 is deposited (for example, dropped or jetted) into the "trough" or inside corner 706 formed between edge conductor 730 and substrate 710 in an area of first conductor 720. As such, solder 760 forms a solder joint in inside corner 706 between edge conductor 730 and substrate 710, and establishes electrical connection between edge conductor 730 and first conductor 720.

As depicted in the example of Fig. 28B, fixture 750 is tilted or oriented at a second acute angle A2 relative to horizontal. As such, a "trough" is formed at inside corner 708 (Fig. 27B) provided between edge conductor 730 and substrate 710 including, more specifically, between edge conductor 730 and second surface 714 of substrate 710, and between edge conductor 730 and second conductor 722.

As depicted in the example of Fig. 28B, edge conductor 730 is electrically coupled with second conductor 722 via solder 762. In examples, molten solder 762 is deposited (for example, dropped or jetted) into the "trough" or inside corner 708 formed between edge conductor 730 and substrate 710 in an area of second conductor 722. As such, solder 762 forms a solder joint in inside corner 708 between edge conductor 730 and substrate 710, and establishes electrical connection between edge conductor 730 and second conductor 722.

In one example, as depicted in Figs. 28C, 28D, after edge conductor 730 is electrically coupled with first conductor 720 and second conductor 722, substrate 740, with edge conductor 730, is severed along cutline 752. As such, a remaining portion of substrate 740, with edge conductors 730, may be used to establish electrical connection with another substrate 710. In examples, with edge conductor 730 supported by substrate 740 and secured to substrate 710, substrate 740 provides mechanical protection to edge conductor 730 and electrical insulation of edge conductor 730. For example, substrate 740 may act as an insulator to help prevent edge conductor 730 from becoming shorted with an edge conductor of an adjacent display tile.

In one example, as depicted in Figs. 28C, 28D, a bead of adhesive 764 may be provided over solder 760 and/or solder 762, and along inside corner 706 (Fig. 27B) and/or inside corner 708 (Fig. 27B) formed between substrate 740 and substrate 710, including between substrate 740 and first surface 712 of substrate 710, and/or between substrate 740 and second surface 714 of substrate 710 (including in a space between adjacent first conductors 720, adjacent second conductors 722, and adjacent edge conductors 730). As such, adhesive 764 may protect solder 760 and/or solder 762 and may provide additional structural support to the joint formed by solder 760 and/or solder 762 between substrate 740 and substrate 710. Adhesive 764 may be provided before or after the remaining portion of substrate 740, with edge conductors 730, is severed. In examples, adhesive 764 may be black in color to help hide solder 760 and/or solder 762 from view, especially on an emitter side of a display tile, as solder 760 and/or solder 762 may typically be silver in color.

Fig. 29 schematically depicts a side view of an example of a portion of a substrate 810 for a display tile 800 and an example of an edge conductor 830, as supported by a substrate 840, secured to substrate 810. Substrate 810 has a first surface 812 and a second surface 814 opposite first surface 812, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 812. In addition, substrate 810 has a third surface 816 extended between first surface 812 and second surface 814, with third surface 816 representing an edge surface 818 of substrate 810. In examples, first surface 812 represents a front or first side 802 of display tile 800 and second surface 814 represents a back or second side 804 of display tile 800. In one example, substrate 840 includes drive circuitry or control electronics 890, as an example of drive circuitry or control electronics 190 (Fig. 1 B). In the depicted example, display tile 800 includes first conductors 820 on first surface 812 of substrate 810 (similar to first conductors 720 on first surface 712 of substrate 710) and substrate 840 includes edge conductors 830 (similar to edge conductors 730 on substrate 740). In examples, first conductors 820 are electrically connected to light sources (not shown) provided on first surface 812 of substrate 810, such as light sources 180 (Fig. 1A), and edge conductors 830 are electrically connected to drive circuitry or control electronics 890 supported by substrate 840, as an example of drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources.

As depicted in the example of Fig. 29, edge conductor 830 is electrically coupled with first conductor 820 via solder 860. In examples, solder 860 is deposited (for example, dropped or jetted, as described above) into a "trough" or inside corner formed between edge conductor 830 and substrate 810 in an area of first conductor 820. As such, solder 860 forms a solder joint in the inside corner formed between edge conductor 830 and substrate 810, and establishes electrical connection between edge conductor 830 and first conductor 820.

In one example, as depicted in Fig. 29, to protect solder 860 and/or provide additional structural support, a bead of adhesive 864 may be provided over solder 860, and along the inside corner formed between substrate 840 and substrate 810, including between substrate 840 and first surface 812 of substrate 810. In one example, to provide additional structural support, a bead of adhesive 864 may be provided along the inside corner formed between substrate 840 and second surface 814 of substrate 810.

Fig. 30 schematically depicts a side view of an example of a portion of a substrate 910 for a display tile 900 and an example of an edge conductor 930, as supported by a substrate 940, secured to substrate 910. Substrate 910 has a first surface 912 and a second surface 914 opposite first surface 912, with light sources (not shown), such as light sources 180 (Fig. 1A), provided on first surface 912. In addition, substrate 910 has a third surface 916 extended between first surface 912 and second surface 914, with third surface 916 representing an edge surface 918 of substrate 910. In examples, first surface 912 represents a front or first side 902 of display tile 900 and second surface 914 represents a back or second side 904 of display tile 900. In one example, substrate 940 includes drive circuitry or control electronics 990, as an example of drive circuitry or control electronics 190 (Fig. 1 B).

In the depicted example, display tile 900 includes first conductors 920 on first surface 912 of substrate 910 (similar to first conductors 620 on first surface 612 of substrate 610) and substrate 940 includes edge conductors 930 (similar to edge conductors 630 on polymer film 640). In examples, first conductors 920 are electrically connected to light sources (not shown) provided on first surface 912 of substrate 910, such as light sources 180 (Fig. 1A), and edge conductors 930 are electrically connected to drive circuitry or control electronics 990 supported by substrate 940, as an example of drive circuitry or control electronics 190 (Fig. 1 B), for controlling the light sources.

In examples, substrate 940 may be formed of a polymer film (similar to polymer film 640), and edge conductor 930, as supported by substrate 940, may be secured to first conductor 920 by thermo-compression bonding using an interconnect material 926 (similar to interconnect material 626) such that edge conductor 930 is electrically coupled with first conductor 920 (see, e.g., Figs. 24A, 24B). Other manners of establishing electrical connection between edge conductor 930 and first conductor 920 may also be implemented. In one example, to provide additional structural support, a bead of adhesive 964 may be provided along the inside corner formed between substrate 940 and second surface 914 of substrate 910.

Although specific examples have been illustrated and described herein, a variety of alternate and/or equivalent implementations may be substituted for the specific examples shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific examples discussed herein.

Claims

CLAIMS What is claimed is:

1. An edge conductor, comprising:

a first portion configured to be electrically connected to a first conductor on a first surface of a substrate;

a second portion configured to be electrically connected to a second conductor on a second surface of the substrate, the second surface of the substrate opposite the first surface of the substrate;

a third portion extending between the first portion and the second portion, the third portion configured to extend along an edge of the substrate, the edge of the substrate extending between the first surface of the substrate and the second surface of the substrate;

a first bend between the first portion and the third portion; and

a second bend between the second portion and the third portion.

2. The edge conductor of claim 1 , wherein the first portion and the second portion are substantially parallel with each other.

3. The edge conductor of claim 1 , wherein the first portion and the second portion are substantially a same length.

4. The edge conductor of claim 1 , wherein the first portion and the second portion are configured to be pressure bonded to the substrate.

5. The edge conductor of claim 1 , wherein the first bend and the second bend are each a substantially orthogonal bend.

6. The edge conductor of claim 1 , wherein the edge conductor comprises bent metal foil.

7. The edge conductor of claim 6, wherein the bent metal foil is supported by a polymer film.

8. The edge conductor of claim 7, wherein the polymer film is a stretchable resin film.

9. A display tile, comprising:

a substrate having a first surface, a second surface opposite the first surface, and an edge surface extending between the first surface and the second surface;

a first conductor on the first surface of the substrate;

a second conductor on the second surface of the substrate; and a third conductor bent to extend along each of the first surface, the second surface, and the edge surface,

wherein the third conductor is electrically coupled with both the first conductor and the second conductor.

10. The display tile of claim 9, wherein the third conductor is secured to the substrate by pressure bonding.

11. The display tile of claim 9, wherein the third conductor comprises bent metal foil.

12. The display tile of claim 11 , wherein the bent metal foil is supported by a polymer film.

13. The display tile of claim 12, wherein the polymer film is a stretchable resin film.

14. The display tile of claim 9, further comprising: an interconnect material between the first conductor and the third conductor, and between the second conductor and the third conductor.

15. The display tile of claim 14, wherein the interconnect material extends a width of the substrate adjacent the edge surface of the substrate.

16. The display tile of claim 9, further comprising:

a plurality of light sources on the first surface of the substrate; and control electronics on the second surface of the substrate.

17. A method of making a display tile, comprising:

placing an edge conductor along one of a first surface of a substrate, a second surface of the substrate opposite the first surface of the substrate, and an edge surface of the substrate extending between the first surface of the substrate and the second surface of the substrate; and

bending the edge conductor to extend along the other of the first surface of the substrate, the second surface of the substrate, and the edge surface of the substrate,

wherein placing the edge conductor and bending the edge conductor comprises electrically coupling the edge conductor with a first conductor on the first surface of the substrate and a second conductor on the second surface of the substrate.

18. The method of claim 17, wherein placing the edge conductor comprises placing the edge conductor along the edge surface of the substrate, and

wherein bending the edge conductor comprises substantially

simultaneously bending the edge conductor to extend along both the first surface of the substrate and the second surface of the substrate.

19. The method of claim 17, wherein placing the edge conductor comprises placing the edge conductor along one of the first surface of the substrate and the second surface of the substrate, and wherein bending the edge conductor comprises bending the edge conductor to extend along the edge surface of the substrate and then bending the edge conductor to extend along the other of the first surface of the substrate and the second surface of the substrate.

20. The method of claim 17, wherein placing the edge conductor and bending the edge conductor comprises securing the edge conductor to the substrate by pressure bonding.

21. The method of claim 17, wherein the edge conductor comprises a metal foil including a plurality of spaced edge conductors each tethered to a spine.

22. The method of claim 21 , wherein the method further comprises:

after placing the edge conductor and before bending the edge conductor, severing the spine from the plurality of spaced edge conductors.

23. The method of claim 21 , wherein the method further comprises:

after bending the edge conductor, severing the spine from the plurality of space edge conductors.

24. The method of claim 17, wherein the edge conductor comprises a metal foil including a plurality of spaced edge conductors supported by a polymer film.

25. The method of claim 24, wherein the polymer film comprises a

stretchable resin film.

26. The method of claim 17, wherein the method further comprises:

before placing the edge conductor, applying an interconnect material to one of (a) the edge conductor and (b) each of the first conductor and the second conductor.

27. The method of claim 26, wherein applying the interconnect material comprises applying the interconnect material along a width of the substrate adjacent the edge surface of the substrate.

28. The method of claim 17, wherein the display tile comprises:

29. A display tile, comprising:

a first conductor on the first surface of the substrate;

a second conductor on the second surface of the substrate; and a third conductor extending along the edge surface of the substrate, wherein the third conductor is proud of the first surface of the substrate and the second surface of the substrate, and is electrically coupled with both the first conductor and the second conductor.

30. The display tile of claim 29, wherein the edge surface of the substrate is substantially orthogonal to the first surface of the substrate and the second surface of the substrate.

31. The display tile of claim 29, wherein the third conductor is electrically coupled with the first conductor via a first solder joint and is electrically coupled with the second conductor via a second solder joint.

32. The display tile of claim 31 , wherein the first solder joint and the second solder joint are each a jetted-solder joint.

33. The display tile of claim 31 , wherein the third conductor and the first surface of the substrate form a first inside corner, and the third conductor and the second surface of the substrate form a second inside corner, wherein the first solder joint is provided in the first inside corner, and the second solder joint is provided in the second inside corner.

34. The display tile of claim 29, wherein the third conductor comprises a metal foil supported by a polymer substrate.

35. The display tile of claim 29, further comprising:

36. A method of making a display tile, comprising:

placing an edge conductor along an edge surface of a substrate, the edge surface of the substrate extending between a first surface of the substrate and a second surface of the substrate opposite the first surface of the substrate, and the edge conductor extending beyond the first surface of the substrate and the second surface of the substrate; and

electrically coupling the edge conductor with a first conductor on the first surface of the substrate and a second conductor on the second surface of the substrate.

37. The method of claim 36, wherein electrically coupling the edge conductor comprises electrically coupling the edge conductor with the first conductor via a first solder joint and electrically coupling the edge conductor with the second conductor via a second solder joint.

38. The method of claim 37, wherein placing the edge conductor comprises forming a first inside corner between the edge conductor and the first surface of the substrate, and forming a second inside corner between the edge conductor and the second surface of the substrate, and wherein electrically coupling the edge conductor comprises forming the first solder joint in the first inside corner and forming the second solder joint in the second inside corner.

39. The method of claim 38, wherein forming the first solder joint comprises orienting the edge conductor and the substrate at a first acute angle relative to horizontal and jetting molten solder into the first inside corner, and forming the second solder joint comprises orienting the edge conductor and the substrate at a second acute angle relative to horizontal and jetting molten solder into the second inside corner.

40. The method of claim 36, wherein the display tile comprises: