WO2019146944A1 - Wireless charging coil module and wireless charging device - Google Patents

Wireless charging coil module and wireless charging device Download PDF

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Publication number
WO2019146944A1
WO2019146944A1 PCT/KR2019/000525 KR2019000525W WO2019146944A1 WO 2019146944 A1 WO2019146944 A1 WO 2019146944A1 KR 2019000525 W KR2019000525 W KR 2019000525W WO 2019146944 A1 WO2019146944 A1 WO 2019146944A1
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WO
WIPO (PCT)
Prior art keywords
connection
disposed
conductive line
coil
film
Prior art date
Application number
PCT/KR2019/000525
Other languages
French (fr)
Korean (ko)
Inventor
이기민
Original Assignee
엘지이노텍 주식회사
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Publication of WO2019146944A1 publication Critical patent/WO2019146944A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/30Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306Fastening or mounting coils or windings on core, casing or other support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/34Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36Electric or magnetic shields or screens
    • H01F27/366Electric or magnetic shields or screens made of ferromagnetic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/288Shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/30Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14Inductive couplings
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields

Definitions

  • Embodiments relate to a wireless charging coil module and a wireless charging device.
  • Portable terminals such as mobile phones and laptops, include a battery for storing power and a circuit for charging and discharging the battery. In order for the battery of such a terminal to be charged, power must be supplied from an external charger.
  • a charging system (hereinafter referred to as a "wireless charging system") and a control method using a method of transmitting power wirelessly are proposed.
  • the wireless charging system since the wireless charging system has not been installed in some portable terminals in the past and the consumer has to purchase a separate wireless charging receiver accessory, the demand for the wireless charging system is low, but the wireless charging user is expected to increase rapidly.
  • Wireless charging function is expected to be equipped basically.
  • Such a wireless charging system is equipped with a wireless charging module.
  • FIG. 1 is an exploded perspective view showing a conventional wireless charging coil module.
  • the coil portion 2 is disposed on the insulating layer 1.
  • a connecting portion 3 which is connected to the inner pad of the coil portion 2 across the coil portion 2 is disposed below the insulating layer 1.
  • one side of the connection part 3 is connected to the inner pad of the coil part 2 through the insulating layer 1, and the other side of the connection part 3 is connected to the substrate 4.
  • the outer pad of the coil part 2 is also connected to the substrate 4. Wireless power is transmitted via the coil section 2 or wireless power is received and charged to the battery.
  • the thickness of the wireless charging coil module is increased because the connecting portion 3 is disposed under the insulating layer 1 in the conventional wireless charging coil module.
  • the thickness of the connection part 3 is reduced in order to reduce the thickness of the wireless charging coil module, the resistance of the wireless charging coil module increases.
  • connection between the connection part 3 and the inner pad of the coil part 2, between the outer pad of the coil part 2 and the substrate 4 and between the connection part 3 and the substrate 4 A reflow process is performed. In this case, there is a problem that the contact resistance is increased.
  • the embodiment provides a wireless charging coil module and a wireless charging device of a new structure.
  • Embodiments provide a wireless charging coil module and a wireless charging device that can minimize resistance.
  • Embodiments provide a wireless charging coil module and a wireless charging device capable of reducing thickness.
  • the embodiment provides a wireless charging coil module and a wireless charging device having excellent heat dissipation performance.
  • Embodiments provide a wireless charging coil module and a wireless charging device capable of mass production by process automation.
  • a wireless charging coil module includes: a first film; A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad; A shielding member disposed on the coil portion, the shielding member having a receiving portion; And a connection substrate at least partially disposed in the accommodating portion.
  • the receiving portion includes: a first receiving portion formed in a first direction from the inner pad toward the outer pad; And a second accommodating portion connected to the first accommodating portion and formed in a second direction different from the first direction.
  • the connection board includes: a first connection portion disposed in the first accommodation portion and connected to the inner pad; A second connection portion disposed in the second accommodation portion and connected to the outer pad; And a third connection part extending from the second connection part and including a bent part.
  • a wireless charging coil module includes: a first film; A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad; A shielding member disposed on the coil portion, the shielding member having a receiving portion; And a connecting substrate at least partially disposed in the receiving portion.
  • the connection substrate includes a first protective layer; An insulating layer disposed on the first passivation layer; A second protective layer disposed on the insulating layer; A first conductive line disposed between the first passivation layer and the insulating layer; And a second conductive line disposed between the insulating layer and the second passivation layer.
  • a wireless charging coil module includes: a first film; A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad; A shielding member disposed on the coil portion, the shielding member having a receiving portion; And a connection substrate at least partially disposed in the accommodating portion.
  • the connection board includes: a first connecting member connected to the outer pad; a second connecting member connected to the inner pad; A first contact portion connected to the first connection member; And a second contact portion connected to the second connection member. Wherein the first connection member and the second connection member are exposed to a first surface of the connection substrate and the first contact portion and the second contact portion are exposed to a second surface different from the first surface of the connection substrate have.
  • the thickness of the coil portion is increased to reduce resistance and heat generation, it is not necessary to provide a separate heat radiating member.
  • the EMB shielding material is used in a thin thickness, the shielding effect is excellent and the thickness is reduced.
  • the thickness of the EMB shielding material is thinner than the thickness of the coil part, the thickness of the wireless charging coil module as a whole can be reduced.
  • a single substrate that is, a connecting substrate, has a first connecting line function for extending an electrical connection from the inside of the nose portion to the outside of the nose portion and a second connecting line function for extending the electrical connection from the nose portion to the main substrate.
  • Function and a fastening function for fastening with the main board can be achieved at the same time, so that the structure can be simplified and the cost can be reduced.
  • the first connection line function is realized by a second conductive line embedded in the first connection portion of the connection board and the second connection line function is realized by the first and second conductive lines embedded in the second connection portion and the second connection portion of the main board
  • the fastening function can be realized by a connector disposed at one end of the third connection part of the connection board.
  • the first connection portion and the third connection portion of the connection board are disposed toward the inside of the coil portion, thereby enabling mass production by automation of the process.
  • connection board is embodied as a flexible board and is rotated with respect to the second connection portion to the third connection portion of the connection board, the connection between the first connector and the second connector for fastening to the second connector of the main board There is no need for additional connection lines.
  • first and second conductive lines arranged in the third connection part of the connection board to be rotated to be connected to the second connector of the main board are arranged so as to be spaced apart from each other in the horizontal direction, Can be promoted.
  • the receiving portion is formed in the shielding member and / or the heat radiating member disposed on the coil portion, and the connecting board is inserted into the receiving portion, so that the electrical connection between the connecting board and the coil portion can be facilitated.
  • FIG. 1 is an exploded perspective view showing a conventional wireless charging coil module.
  • FIG. 2 is a block diagram illustrating a wireless charging system in accordance with an embodiment.
  • FIG. 3 is a block diagram illustrating the structure of a wireless power transmitter according to an embodiment.
  • FIG. 4 is a block diagram illustrating the structure of a wireless power receiver interlocked with the wireless power transmitter of FIG.
  • 5 shows a wireless power receiver according to an embodiment.
  • FIG. 6 is a perspective view showing a wireless charging coil module according to the first embodiment.
  • FIG. 7 shows a view from the coil part of the wireless charging coil module according to the first embodiment.
  • FIG. 8 is a perspective view showing a shielding member disposed on the coil part in the wireless charging coil module according to the first embodiment.
  • Fig. 9 shows a forming position of a receiving portion of the shielding member disposed on the coil portion in the wireless charging coil module according to the first embodiment.
  • FIG. 10 is a perspective view illustrating a connection board of the wireless charging coil module according to the first embodiment.
  • FIG. 11 is a plan view schematically illustrating the inside of a connection board of a wireless charging coil module according to the first embodiment.
  • 12A to 12E are cross-sectional views of the connection board of the wireless charging coil module of Fig.
  • FIG. 13 is a perspective view showing the wireless charging coil module according to the second embodiment.
  • FIG. 14 is a perspective view showing a heat dissipating member disposed on a shielding member in the wireless charging coil module according to the second embodiment.
  • the terms used in the embodiments of the present invention are intended to illustrate the embodiments and are not intended to limit the present invention.
  • a singular form may include plural forms unless specifically stated in the wording, and may be a combination of A, B, and C when it is described as " at least one (or more than one) Or < / RTI > all possible combinations.
  • terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms are not limited to the nature, order or order of the constituent elements.
  • upper or lower is not limited to the case where two components are in direct contact with each other, But also includes the case where another component is formed or disposed between two components. Also, in the case of "upper (upper) or lower (lower)", it may include not only an upward direction but also a downward direction based on one component.
  • an apparatus for transmitting wireless power on a wireless power charging system includes a wireless power transmitter, a wireless power transmitter, a wireless power transmitter, a transmitter, a transmitter, a transmitter, a transmitter, , A wireless power transmitter, and a wireless charging device.
  • a wireless power receiving device, a wireless power receiving device, a wireless power receiving device, a wireless power receiving device, a receiving terminal, a receiving side, a receiving device, a receiver Terminals and the like can be used in combination.
  • the wireless charging device may be configured as a pad type, a cradle type, an access point (AP) type, a small base type, a stand type, a ceiling embedded type, a wall type, Power may be transmitted to the device.
  • AP access point
  • a wireless power transmitter can be used not only on a desk or on a table, but also developed for automobiles and used in a vehicle.
  • a wireless power transmitter installed in a vehicle can be provided in a form of a stand that can be easily and stably fixed and mounted.
  • a wireless power receiver according to another embodiment may also be mounted on a vehicle, an unmanned aerial vehicle, an air drone or the like.
  • a wireless power receiver may include at least one wireless power transmission scheme and may receive wireless power from two or more wireless power transmitters at the same time.
  • the wireless power transmission scheme may include at least one of the electromagnetic induction scheme, the electromagnetic resonance scheme, and the RF wireless power transmission scheme.
  • a wireless power transmitter and a wireless power receiver that constitute a wireless power system can exchange control signals or information through in-band communication or Bluetooth low energy (BLE) communication.
  • the in-band communication and the BLE communication can be performed by a pulse width modulation method, a frequency modulation method, a phase modulation method, an amplitude modulation method, an amplitude and phase modulation method, and the like.
  • the wireless power receiver can transmit various control signals and information to the wireless power transmitter by generating a feedback signal by switching on / off the current induced through the reception coil in a predetermined pattern.
  • the information transmitted by the wireless power receiver may include various status information including received power intensity information.
  • the wireless power transmitter can calculate the charging efficiency or the power transmission efficiency based on the received power intensity information.
  • FIG. 2 is a block diagram illustrating a wireless charging system according to an embodiment.
  • the wireless charging system includes a wireless power transmitter 10 for transmitting power wirelessly, a wireless power receiver 20 for receiving the transmitted power, and an electronic device 30 Lt; / RTI >
  • the wireless power transmitting terminal 10 and the wireless power receiving terminal 20 can perform in-band communication in which information is exchanged using the same frequency band as that used for wireless power transmission.
  • the wireless power transmitting terminal 10 and the wireless power receiving terminal 20 perform out-of-band communication in which information is exchanged using a different frequency band different from the operating frequency used for wireless power transmission .
  • information exchanged between the wireless power transmitting terminal 10 and the wireless power receiving terminal 20 may include control information as well as status information of each other.
  • the status information and the control information exchanged between the transmitting and receiving end will become more apparent through the description of the embodiments to be described later.
  • the in-band communication and the out-of-band communication may provide bidirectional communication, but the present invention is not limited thereto. In another embodiment, the in-band communication and the out-of-band communication may be provided.
  • the unidirectional communication may be that the wireless power receiving terminal 20 transmits information only to the wireless power transmitting terminal 10, but the present invention is not limited thereto, and the wireless power transmitting terminal 10 may transmit information Lt; / RTI >
  • bidirectional communication is possible between the wireless power receiving terminal 20 and the wireless power transmitting terminal 10, but information can be transmitted only by any one device at any time.
  • the wireless power receiving terminal 20 may acquire various status information of the electronic device 30.
  • the status information of the electronic device 30 may include current power usage information, information for identifying a running application, CPU usage information, battery charge status information, battery output voltage / current information, And is information obtainable from the electronic device 30 and available for wireless power control.
  • FIG. 3 is a block diagram illustrating a structure of a wireless power transmitter according to an embodiment.
  • the wireless power transmitter 200 may include a power conversion unit 210, a power transmission unit 220, a communication unit 230, a control unit 240, and a sensing unit 250 . It should be noted that the configuration of the wireless power transmitter 200 described above is not necessarily an essential configuration, and may be configured to include more or less components.
  • the power conversion unit 210 can convert the power to a predetermined intensity.
  • the power conversion unit 210 may convert the power supplied from the power supply unit 260 into the power for wireless transmission.
  • the power transmission unit 220 may be configured to include a multiplexer 221 (or a multiplexer) and a transmission coil 222. [ In addition, the power transmitting unit 220 may include a carrier generator (not shown) for generating a specific operating frequency for power transmission.
  • the power transmission unit 220 includes a multiplexer 221 and a plurality of transmission coils 222 for controlling the output power of the power conversion unit 210 to be transmitted to the transmission coil, that is, And first through n-th transmission coils.
  • the controller 240 may transmit power through time division multiplexing for each transmission coil when a plurality of wireless power receivers are connected. For example, if the wireless power transmitter 200 has three wireless power receivers-i. E., The first through third wireless power receivers, respectively, identified through three different transmit coils, i. E. First through third transmit coils , The control unit 240 controls the multiplexer 221 so that power can be transmitted through a specific transmission coil in a specific time slot. At this time, the amount of power transmitted to the corresponding wireless power receiver can be controlled according to the length of the time slot allocated for each transmission coil, but this is only one embodiment. The amplification rate of the amplifier 212 of the wireless power receiver may be controlled to control the transmission power of each wireless power receiver.
  • the control unit 240 may control the multiplexer 221 so that the detection signals may be sequentially transmitted through the first through n'th transmit coils 222 during the first differential sense signal transmission procedure.
  • control unit 240 transmits a predetermined transmission coil identifier for identifying a signal strength indicator (Signal Strength Indicator) through a transmission coil from the demodulation unit 232 during the first detection signal transmission procedure, Lt; / RTI > received signal strength indicator.
  • the controller 240 controls the multiplexer 221 so that the signal strength indicator can be transmitted only through the transmitting coil (s) You may.
  • the control unit 240 transmits the transmit coil, which receives the signal strength indicator having the largest value,
  • the detection signal may be determined as a transmission coil to be transmitted first, and the multiplexer 221 may be controlled according to the determination result.
  • the modulator 231 may modulate the control signal generated by the controller 240 and transmit the modulated control signal to the multiplexer 221.
  • the modulation scheme for modulating the control signal includes a frequency shift keying (FSK) modulation scheme, a Manchester coding modulation scheme, a phase shift keying (PSK) modulation scheme, a pulse width modulation scheme, A differential bi-phase modulation method, and the like.
  • the demodulator 232 can demodulate the detected signal and transmit the demodulated signal to the controller 240 when a signal received through the transmission coil is detected.
  • the demodulated signal may include a signal strength indicator, an error correction (EC) indicator for power control during wireless power transmission, an end of charge indicator (EOC), an overvoltage / overcurrent / overheat indicator, but is not limited to, various status information for identifying the status of the wireless power receiver.
  • the demodulating unit 232 may identify which of the transmitting coils the demodulated signal is received and may provide the controlling unit 240 with a predetermined transmitting coil identifier corresponding to the identified transmitting coil.
  • the wireless power transmitter 200 may obtain the signal strength indicator through in-band communication that uses the same frequency used for wireless power transmission to communicate with the wireless power receiver.
  • the wireless power transmitter 200 can transmit wireless power using the transmit coil 222, as well as exchange various information with the wireless power receiver through the transmit coil 222.
  • the wireless power transmitter 200 may further include a separate coil corresponding to each of the transmit coil 222 (i.e., first to n < th > transmit coils) It should be noted that it may also perform in-band communication with the receiver.
  • the wireless power transmitter 200 and the wireless power receiver perform in-band communication.
  • the wireless power transmitter 200 and the wireless power receiver use only the frequency band Directional communication through different frequency bands.
  • the near-end bi-directional communication may be any one of low-power Bluetooth communication, RFID communication, UWB communication, and Zigbee communication.
  • FIG. 4 is a block diagram illustrating a structure of a wireless power receiver interworking with the wireless power transmitter of FIG.
  • the wireless power receiver 300 includes a receiving coil 310, a rectifier 320, a DC / DC converter 330, a load 340, a communication unit 360, 370).
  • the communication unit 360 may include at least one of a demodulation unit 361 and a modulation unit 362.
  • the wireless power receiver 300 shown in the example of FIG. 4 is shown as being capable of exchanging information with a wireless power transmitter through in-band communication, this is only one embodiment, and in another embodiment
  • the communication unit 360 may provide short-range bidirectional communication through a frequency band different from the frequency band used for wireless power signal transmission.
  • the AC power received through the receiving coil 310 may be transmitted to the rectifying unit 320.
  • the rectifier 320 may convert the AC power to DC power and transmit it to the DC / DC converter 330.
  • the DC / DC converter 330 may convert the intensity of the rectifier output DC power to a specific intensity required by the load 340 and then deliver it to the load 340.
  • the receiving coil 310 may include a plurality of receiving coils (not shown), that is, first through n-th receiving coils.
  • the frequency of the AC power transmitted to each of the reception coils (not shown) may be different from each other, and another embodiment may include a predetermined frequency controller having a function of adjusting LC resonance characteristics for different reception coils
  • the resonance frequencies of the respective reception coils can be set differently.
  • the sensing unit 350 may measure the intensity of the DC power output from the rectifier 320 and may provide the measured DC power to the main control unit 370. Alternatively, the sensing unit 350 may measure the intensity of the current applied to the reception coil 310 according to the wireless power reception, and may transmit the measurement result to the main control unit 370.
  • the sensing unit 350 may measure the internal temperature of the wireless power receiver 300 and provide the measured temperature value to the main control unit 370.
  • the main controller 370 may compare the measured rectifier output DC power with a predetermined reference value to determine whether an overvoltage is generated. As a result of the determination, if an overvoltage occurs, a predetermined packet indicating that an overvoltage has occurred can be generated and transmitted to the modulator 362.
  • the signal modulated by the modulating unit 362 may be transmitted to the wireless power transmitter through the receiving coil 310 or a separate coil (not shown).
  • the main control unit 370 may determine that the sensing signal is received when the intensity of the rectifier output DC power is equal to or greater than a predetermined reference value. When receiving the sensing signal, the signal intensity indicator corresponding to the sensing signal is received by the modulating unit 362 To be transmitted to the wireless power transmitter.
  • the demodulation unit 361 demodulates the AC power signal between the reception coil 310 and the rectifier 320 or the DC power signal output from the rectifier 320 to identify whether or not the detection signal is received, (370). At this time, the main control unit 370 can control the signal strength indicator corresponding to the detection signal to be transmitted through the modulator 362.
  • 5 shows a wireless power receiver according to an embodiment.
  • the wireless power receiver may be the wireless power receiver 20 shown in FIG. 2 or the wireless power receiver 300 shown in FIG.
  • the wireless power receiver according to the embodiment may be a mobile phone, a smart phone, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player) , An electric toothbrush, an electronic tag, a lighting device, a remote control, a small electronic device such as a fishing rod, but is not limited thereto.
  • the wireless power receiver according to the embodiment can be mounted and used in any device capable of charging the battery.
  • the wireless power receiver according to the embodiment may be mounted on a vehicle, an unmanned aerial vehicle, an air drone or the like.
  • a wireless power receiver may include a main board 501 and a wireless charging coil module 400 disposed on the main board 501. 6) according to the first embodiment, but the wireless charging coil module 400A (FIG. 13) according to the second embodiment also corresponds to the wireless power Receiver.
  • the main board 501 may be a circuit board provided inside a mobile phone.
  • the wireless charging coil module 400 may include a connection board 430.
  • a first connector 437 may be provided on one side of the connection board 430.
  • the connection board 430 may connect the coil part 403 of the wireless charging coil module 400 to the main board 501.
  • the connecting substrate 430 is referred to as a first substrate
  • the main substrate 501 is referred to as a second substrate
  • the order may be reversed.
  • the connection substrate 430 of the wireless charging coil module 400 may be referred to as a main substrate
  • the main substrate 501 may be referred to as a connection substrate.
  • the first connector 503 of the connection board 430 may be referred to as a second connector
  • the second connector 503 of the main board 501 may be referred to as a first connector.
  • connection board 430 and the main boards 430 and 501 may be boards having circuit patterns built therein.
  • the connection substrate 430 is a flexible substrate
  • the main substrate 501 may be a rigid substrate, but the present invention is not limited thereto.
  • the rigid substrate may be a conventional printed circuit board as a substrate having little flexibility. Flexibility means performance that can be easily bent and restored to its original state.
  • the flexible substrate is a substrate which is more flexible than the rigid substrate.
  • the flexible substrate may be a substrate made of polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene terephthalate (PEN), polyarylate Glass Fiber Reinforced Plastic).
  • the first connector 437 of the wireless charging coil module 400 can be fastened to the second connector 503 of the main board 501. By fastening the first connector 437 and the second connector 503 The wireless charging coil module 400 may be electrically connected to the main board 501.
  • the main board 501 has a rectangular shape and the wireless charging coil module 400 has a round shape, the main board 501 and the wireless charging coil module 400 can have various shapes.
  • the size of the main board 501 may be different from the size of the wireless charging coil module 400 at least.
  • Various circuit elements such as a rectifier 320 and a DC / DC converter 330 as shown in FIG. 3 may be provided in a region where the wireless charging coil module 400 is not disposed in the main board 501.
  • Wireless power After the radio power received by the wireless charging coil module 400 via the second connector 503 and the first connector 437 is rectified by the rectifier 320 (Fig. 4) of the main board 501, DC converter 330 (FIG. 4), and then charged into the battery.
  • An unexplained reference numeral 409 denotes a film (hereinafter referred to as a second film), and constituent elements such as a coil portion 403 (FIG. 6), shield portions 407, 6) can be protected.
  • the shielding members 405, 407, 409 (FIG. 8) including the second film 409 may have receiving portions 412, 414 (FIG. 8) formed on one side thereof.
  • the receiving portions 412 and 414 may be openings that penetrate the top and bottom surfaces of the shielding members 405, 407, and 409.
  • the accommodating portions 412 and 414 may be grooves with one side of the shielding members 405, 407 and 409 entering inward.
  • the connecting board 430 is inserted into the receiving portions 412 and 414 of the shielding members 405 and 407 and 409 so that one side of the connecting board 430 is connected to the inner pad 403b May be connected to the outer pad 403c (FIG. 7).
  • connection board 430 may be connected to the second connector 503 of the main board 501.
  • each of the layers constituting the shielding members 405, 407, 409 may also be formed with the receiving portions 412, 414.
  • the receiving portions 412 and 414 formed in the respective layers may correspond to each other.
  • the sizes of the receiving portions 412 and 414 formed in the respective layers may be different, but the present invention is not limited thereto.
  • the connecting board 430 is disposed outside the coil part 403 through the receiving parts 412 and 414 of the shielding members 405, 407 and 409 under the second film 409 as well as the second film 409 . At this time, part or all of the connection board 430 may overlap with the coil part 403.
  • the connection substrate 430 is inserted into the second adhesive member 413 or the like on the components disposed under the coil part 403, for example, the first film 401, the third film 411, The receiving portions 412 and 414 may not be formed.
  • the connection board 430 includes a first connection portion 431 that traverses the coil portion 403 along the first direction, a second connection portion 431 that extends from the first connection portion 431 along a second direction different from the first direction, And a third connection part 435 extending from the second connection part 433 in the first direction and disposed in parallel with the first connection part 431.
  • the second direction may be a direction perpendicular to the first direction, but is not limited thereto.
  • the second connection portion 433 may extend along a direction away from the first connection portion 431.
  • the third connection portion 435 may be disposed to be spaced apart from the first connection portion 431.
  • the first to third connection portions 431, 433, and 435 may be integrally formed.
  • first connection part 431 may be integrally formed with the second connection part 433, and the third connection part 435 may be formed integrally with the second connection part 433.
  • the first to third connection portions 431, 433, and 435 may be positioned on the same plane.
  • the first and second connection portions 431 and 432 of the first to third connection portions 431 and 433 and 435 are connected to the inner pad 403b and the outer pad 403c of the coil portion 403, . Since the third connection portion 435 is not fixed until it is fastened to the main board 501, it can be bent in any direction.
  • the third connection portion 435 may include a bent portion 434.
  • the bent portion 434 may extend in the horizontal direction toward the inner pad 403b of the coil portion 403, which extends vertically from one side of the second connection portion 433.
  • the horizontal direction may be opposite to the first direction.
  • the bent portion 434 may be defined as a region including a point where the vertical and horizontal meet at the third connecting portion 435 and the periphery thereof.
  • the third connection part 435 is extended toward the inside of the coil part 403 through the bent part 434 so that the wireless charging coil module 400 and the wireless charging device capable of mass- have. Specifically, an automated cutting process can be made possible.
  • the first connection portion 431 and the second connection portion 433 of the connection board 430 can be inserted into the receiving portions 412 and 414 of the shielding members 405, 407, and 409.
  • One end of the third connection part 435 is connected to the second connection part 433 and the other end of the third connection part 435 is connected to the first connector 503 for electrical connection with the second connector 503 of the main board 501. [ (437) may be provided.
  • connection portion provided with the first connector 437 may be referred to as a fourth connection portion.
  • the fourth connection portion may be provided at an end point extending in the horizontal direction from the third connection portion 435.
  • One side of the third connection part may be bent at the third connection part 435 and extended, for example, along the second direction.
  • the fourth connector may include a first connector 437.
  • the first connector 437 may be disposed at an end point of the third connection part 435 and an area extending from the end point of the third connection part 435 along the second direction.
  • the fourth connection part may extend from the third connection part 435 in a direction away from the first connection part 431, that is, along the second direction.
  • connection board 430 is divided into the first to third connection portions 431, 433 and 435 or the first to fourth connection portions, A bridge function for enabling electrical connection to the outside of the part 403 and a flexible function for electrically connecting the coil part 403 and the main board 501 can be realized at the same time.
  • the first connection part 431 and the third connection part 435 of the connection substrate 430 are extended from the second connection part 433 toward the inside of the coil part 403, A wireless charging coil module and a wireless charging device can be provided. Specifically, an automated cutting process can be made possible. That is, the coil portion 403 and the shielding members 405, 407 and 409 are disposed on the first film 401 and the connecting substrate 430 is fixed to the receiving portions 412, When the first film 401 and the shielding members 405, 407 and 409 are cut so as to have a predetermined shape, for example, a circular shape, the connecting substrate 430, The first connection portion 431 and the third connection portion 435 of the second connection portion 433 extend from the second connection portion 433 toward the inside of the coil portion 403.
  • connection substrate 430 If the first or third connection portions 431 and 435 of the connection substrate 430 are disposed outside the cutting perforations, the first or third connection portions 431 and 435 of the connection substrate 430 are cut by the cutting process, .
  • This form is a limiting factor that makes automated production processes impossible, and has been an impediment to improving productivity and reducing process costs.
  • the first connection part 431 may be formed long along the direction crossing the coil part 403.
  • the first connection portion 431 may be disposed long along the direction perpendicular to the coiled coils of the coil portion 403.
  • the length of the first connection portion 431 may be greater than the length between the inner pad 403b and the outer pad 403c of the coil portion 403.
  • the third connection portion 435 may be spaced apart from the first connection portion 431 and disposed in parallel with the first connection portion 431.
  • the second connection portion 433 can connect the end of the first connection portion 431 and the end of the third connection portion 435.
  • first connection part 431 is connected to the inner pad 403b of the coil part 403.
  • second connection part 433 is connected to the outer pad 403c of the coil part 403.
  • the inner pad 403b of the coil portion 403 may be vertically overlapped with one side region of the first connection portion 41.
  • the outer pad 403c of the coil portion 403 may be vertically overlapped with one side region of the second connection portion 433.
  • the first and second connection portions 431 and 433 are connected to the inner pad 403b and the outer pad 403c of the coil portion 403 to connect the first and second connection portions 431 and 433 of the connection substrate 430, Can be fixed to the coil portion 403.
  • the third connector 435 may be bent so that the first connector 437 is connected to the second connector 503 of the main board 501. That is, since the second connection portion 433 of the connection substrate 430 is fixed, the third connection portion 435 can be rotated with respect to the second connection portion 433.
  • the third connection portion 435 of the connection board 430 can be rotated from the inside of the coil portion 403 toward the outside of the coil portion 403. [ For example, the third connection portion 435 of the connection board 430 may be rotated 180 ° with respect to the second connection portion 433.
  • the first connector 437 may be disposed on the upper surface of the third connection portion 435.
  • the first connector 437 When the third connector 435 is rotated with respect to the second connector 433, the first connector 437 is located on the lower surface of the third connector 435 and is disposed on the upper surface of the main board 501
  • the first connector 437 of the connection board 430 may be connected to the second connector 503 of the main board 501 after being faced to face the second connector 503.
  • the third connection portion 435 may be rotated about the axis of the second connection portion 433 in the longitudinal direction, that is, the second direction.
  • An end point of the third connection portion 435 is located on the same plane as the first connection portion 431 and is located on the outer side of the coil portion 403 when rotated about the axis of the second connection portion 433 in the second direction Lt; / RTI >
  • the second connector 503 of the main board 501 is disposed outside the coil part 403 so that the end point of the rotated third connection part 435, that is, the first connector 437, The second connector 503 of the second connector 503 can be fastened.
  • the first connector 437 of the connection board 430 may be detached from the second connector 503 of the main board 501.
  • the first connector 437 of the connection board 430 is a recessed female connector
  • the second connector 503 of the main board 501 may be a male connector protruding to the outside, but the present invention is not limited thereto.
  • the male connector 503 of the main board 501 can be inserted into the female connector 437 of the connecting board 430.
  • a fixing pin may be provided around the male connector 503 of the main board 501 so that the male connector 503 of the main board 501 is not arbitrarily detached from the female connector 437 of the connecting board 430.
  • the first connection portion 431 and the third connection portion 435 may have different lengths from each other.
  • the length of the first connection part 431 may be longer than the length of the third connection part 435.
  • the third connection part 431 is connected to the first connection part 435 of the third connection part 435 and the third connection part 435 is connected to the second connection part 435 of the third connection part 435.
  • the first connection part 431 depends on the length between the inner pad 403b and the outer pad 403c of the coil part 403, And the distance between the first connector 437 and the second connector 503 of the main board 501.
  • the length of the first connection part 431 can be reduced as the length between the inner pad 403b and the outer pad 403c of the coil part 403 is reduced.
  • the length of the third connection part 435 can be reduced as the distance between the first connector 437 of the third connection part 435 and the second connector 503 of the main board 501 is reduced.
  • the first connection portion 431 and the second connection portion 433 may have different thicknesses from each other.
  • the thickness of the first connection portion 431 may be smaller than the thickness of the second connection portion 433.
  • the thickness of the first connection portion 431 and the thickness of the third connection portion 435 may be substantially the same.
  • the thickness of the first connection portion 431 and the thickness of the edge of the third connection portion 435 may be the same.
  • the thickness of the first connection portion 431 may be different from the thickness of the central region of the third connection portion 435.
  • the thickness of the first connection portion 431 may be smaller than the thickness of the central region of the third connection portion 435.
  • the first connection portion 431 and the second connection portion 433 may have different widths from each other.
  • the width of the first connection portion 431 may be smaller than the width of the second connection portion 433.
  • the first connection portion 431 and the third connection portion 435 may have different widths from each other.
  • the width of the first connection portion 431 may be smaller than the width of the third connection portion 435.
  • reference numerals 505a and 505b denote first and second connection terminals.
  • first connector 437 of the connection board 430 When the first connector 437 of the connection board 430 is connected to the second connector 503 of the main board 501, And may be connected to the first and second contact portions 439a and 439b of the first connector 437 of the substrate 430.
  • FIG. 6 the wireless charging coil module 400 according to the first embodiment will be described in detail with reference to FIGS. 6 to 10.
  • FIG. 6 the wireless charging coil module 400 according to the first embodiment will be described in detail with reference to FIGS. 6 to 10.
  • FIG. 6 is a perspective view illustrating a wireless charging coil module according to the first embodiment
  • FIG. 7 is a bottom view of the wireless charging coil module according to the first embodiment
  • FIG. And FIG. 5 is a perspective view illustrating a shielding member disposed on the coil part in the wireless charging coil module according to the first embodiment of the present invention.
  • FIG. 9 is a view showing a forming position of a receiving portion of a shielding member disposed on the coil portion in the wireless charging coil module according to the first embodiment
  • FIG. 10 is a view showing a connecting substrate of the wireless charging coil module according to the first embodiment It is a perspective view.
  • a first film 401 may be provided.
  • the first film 401 can be used to protect or support the coil part 403.
  • the first film 401 may be a protective film or a supporting film.
  • the first film 401 may be a protective substrate or a supporting substrate.
  • the first film 401 may include, but is not limited to, a transparent polyimide (PI) resin.
  • the coil portion 403 can be provided.
  • the coil portion 403 may be disposed on the upper surface of the first film 401.
  • the coil part 403 may be formed of a metal sticker antenna (MSA) manufactured by the rolling process.
  • MSA copper (Cu) For example, MSA copper (Cu).
  • the coil portion 403 may be a single layer or a multi-layered structure.
  • an etching process is performed on the metal layer to form a plurality of wound coils 403a, first pads 403b, A coil portion 403 composed of a pad 403c may be formed.
  • the thickness of the coil portion 403 may be 127 mu m or less.
  • the first pad 403b is called an inner pad because it is located inside the coil part 403 and the second pad 403c is located outside the coil part 403 and may be referred to as an outer pad.
  • the plurality of coils 403a are formed in a spiral shape, and a hollow portion 403d in which the coil 403a is not formed may be located at the center thereof.
  • the hollow portion 403d may be an empty space.
  • the width of the first and second pads 403b and 403c may be at least greater than the width of the coil 403a. That is, since the first and second pads 403b and 403c are formed to be large in size, connection of the first and second connection members 446 and 447 of the connection substrate 430 can be facilitated later. In addition, since the first and second pads 403b and 403c are formed to have a large size, the contact resistance between the first and second pads 403b and 403c can be reduced to reduce the electrical loss.
  • the coil part 403 is formed by such a processing method, a separate bonding member for attaching the coil part 403 to the first film 401 is not required, so that the manufacturing cost can be reduced and the manufacturing process can be simplified .
  • shielding members 405, 407 and 409 can be provided.
  • Shielding members 405, 407, and 409 may be disposed on the coil section 403.
  • the shielding members 405, 407 and 409 may include a first adhesive member 405, a shielding member 407 and a second film 409.
  • the shielding member may be two or less layers or four or more layers. Specifically, when the first adhesive member 405 is disposed on the first film 401, the shielding member 407 is disposed on the first adhesive member 405, the second film 409 is placed on the shielding member 407, Lt; / RTI >
  • the coil portion 403 may be disposed between the first film 401 and the first adhesive member 405.
  • the size of the first film 401 and / or the size of the first adhesive member 405 may be larger than the size of the coil part 403.
  • the shielding member 407 and the first film 401 can be attached by the first adhesive member 405.
  • the first film 401 and the shielding material 407 can be attached to each other by the first adhesive member 405 outside the coil part 403.
  • the coil part 403 is surrounded by the first film 401 and the shielding material 407 and is not exposed to the outside.
  • the first adhesive member 405 allows the shielding material 407 to be attached to the first film 401 and / or the coil part 403.
  • the shielding member 407 can prevent the electromagnetic field generated, formed or induced by the coil 403a from affecting the electronic component.
  • An EMB (Electro-Magnetic Booster) shielding material may be used as the shielding material 407, but the present invention is not limited thereto.
  • EMB shielding materials can be made of amorphous and nanocrystalline ribbon materials.
  • the thickness of the shielding material 407 may be at least 73 ⁇ .
  • the thickness of the shielding material 407 may be 73 ⁇ . As described above, since the shielding performance is increased as the EMB shielding material is used, the thickness of the shielding material 407 can be reduced.
  • the second film 409 may serve to protect the shield member 407 and the coil part 403.
  • the second film 409 may be made of black polyethylene terephthalate (PET) resin, but the present invention is not limited thereto.
  • the first adhesive member 405, the shielding member 407 and the second film 409 may include the receiving portions 412 and 414.
  • the receiving portions 412 and 414 may be passages through which the connection substrate 430 is inserted.
  • the first adhesive member 405, the shielding member 407 and the second film 409 may include a first accommodating portion 412 and a second accommodating portion 414.
  • the first and second receiving portions 412 and 414 may have a shape corresponding to the first and second connecting portions 431 and 433 of the connecting board 430.
  • the first accommodating portion 412 is located between the inner pad 403b and the outer pad 403c of the coil portion 403 including the inner pad 403b and the outer pad 403c of the coil portion 403,
  • the second accommodating portion 414 can communicate with the first accommodating portion 412 from the outside of the coil portion 403. Therefore, the shielding members 405, 407, 409 are arranged such that a portion of the coil 403a of the coil portion 403 disposed below the shielding members 405, 407, 409 through the first accommodating portion 412 as viewed from above is exposed .
  • the first accommodating portion 412 is formed along the first direction from the inner pad 403b of the coil portion 403 toward the outer pad 403c and the second accommodating portion 414 is formed along the second direction As shown in FIG.
  • the first receiving portion 412 has a shape corresponding to the shape of the first connecting portion 431 of the connecting substrate 430 and the second receiving portion 414 has a shape corresponding to the shape of the second connecting portion 433 And the like. That is, the first and second receiving portions 412 and 414 may have shapes corresponding to the shapes of the first and second connecting portions 431 and 433 of the connecting substrate 430.
  • the size of the first receiving portion 412 may be larger than the size of the first connecting portion 431 of the connecting substrate 430, but the present invention is not limited thereto.
  • the size of the second accommodating portion 414 may be larger than the size of the second connecting portion 433 of the connecting substrate 430, but the present invention is not limited thereto.
  • the first connection part 431 of the connection board 430 is connected to the inner pad 403b of the coil part 403 and the second connection part 433 of the connection board 430 is connected to the outer pad of the coil part 403
  • the first accommodating portion 412 can be defined as an area from the inner pad 403b of the coil portion 403 to the outer side of the coil 403. [ The inner pad 403b and the coil 403 of the coil portion 403 are exposed by the first accommodating portion 412 and the outer pad 403c of the coil portion 403 is exposed in the second accommodating portion 414. [ ) Can be exposed.
  • the coil 403a may be located in the first accommodating portion 412 and not in the second accommodating portion 414.
  • the coil 403a can be vertically overlapped with the first accommodating portion 412.
  • the coil 403a may not overlap the second accommodating portion 414.
  • the outer pad 403c may be vertically overlapped with the first accommodating portion 412.
  • the receiving portions corresponding to the third connecting portions 435 of the connecting board 430 may not be formed in the shielding members 405, Accordingly, when the connecting substrate 430 is inserted into the receiving portions 412 and 414, the third connecting portion 435 of the connecting substrate 430 is disposed on the shielding members 405, 407 and 409, It may be possible. In this case, the third connection portion 435 of the connection substrate 430 is not in contact with the coil portion 403. [ When the connecting substrate 430 is fastened to the main substrate 501, the third connecting portion 435 of the connecting substrate 430 is no longer present on the shielding members 405, 407 and 409.
  • connection board 430 when the connection board 430 is fastened to the main board 501, the third connection part 435 of the connection board 430 is rotated about the second connection part 433, The first connector 437 provided in the connection part 435 may be electrically connected to the second connector 503 of the main board 501. [ Therefore, when the connection board 430 is fastened to the main board 501, the second connector 435 may be disposed on the second connector 503 of the main board 501.
  • the sizes of the receiving portions 412 and 414 of the first adhesive member 405, the shielding member 407 and the second film 409 may be different.
  • the width D1 of the first receiving portion 412 of the shielding member 407 may be larger than the width D1 of the first receiving portion 412 of the first adhesive member 405 or the second film 409 have.
  • the width D2 of the second accommodating portion 414 of the shielding material 407 may be larger than the width D2 of the first accommodating portion 414 of the first adhesive material 405 or the second film 409 have. Therefore, the shielding member 407 can be protected by the first adhesive member 405 and the second film 409 without being exposed to the outside due to the receptacles 412 and 414.
  • connection board 430 can be provided.
  • the connection board 430 can be inserted into the receiving portions 412 and 414 of the shielding members 405, 407 and 409. [
  • the connecting board 430 may be electrically connected to the coil portion 403 in the receiving portions 412 and 414 of the shielding members 405, 407 and 409 and electrically connected to the main board 501.
  • connection board 430 includes a second connection portion 433 formed along the second direction, a first connection portion 431 bent from one end of the second connection portion 433 and extending along the first direction, And a third connection part 435 bent from the other end of the second connection part 433 and extending along the first direction.
  • the first and second connection portions 431 and 433 may have shapes corresponding to the shapes of the receiving portions 412 and 414 of the shielding members 405 and 407 409.
  • the width of the first connection portion 431 and the width of the third connection portion 435 may be the same, but the invention is not limited thereto.
  • the first and second connection portions 431 and 433 may be arranged in parallel or parallel to each other, but the present invention is not limited thereto.
  • the first connection portion 431 of the connection substrate 430 is inserted into the first accommodation portion 412 of the shielding members 405, 407 and 409 and the second connection portion 433 of the connection substrate 430 is inserted into the shielding member 405, 407, and 409.
  • the second receiving portion 414 of the second receiving portion 414 may be inserted into the second receiving portion 414 of the second receiving portion 405, A part of the lower surface of the first connecting portion 431 of the connecting board 430 inserted into the first receiving portion 412 of the shielding members 405, 407 and 409 may be connected to the inner pad 403b of the coil portion 403. [ have.
  • a part of the lower surface of the second connection portion 433 of the connection board 430 inserted into the second accommodation portion 414 of the shielding members 405, 407 and 409 may be connected to the outer pad 403c of the coil portion 403. [ have.
  • the first connector 437 provided on the third connection part 435 of the connection board 430 is connected to the third connection part 435 of the connection board 430 to be connected to the second connector 503 of the main board 501,
  • the third connecting portion 435 of the connecting board 430 does not need to be inserted into the receiving portions 412 and 414 of the shielding members 405, 407, and 409 since the second connecting portion 433 is rotated with respect to the second connecting portion 433.
  • FIG. 11 is a plan view schematically illustrating the inside of a connection board of the wireless charging coil module according to the first embodiment
  • FIGS. 12a to 12e are sectional views of the connection board of the wireless charging coil module of FIG.
  • the width L1 of the portion of the third connection portion 435 of the connection substrate 430 where the first connector 437 is located may be larger than the width L2 of the other region.
  • the portion where the first connector 437 is located on the connection board 431 may be bent from the end of the third connection portion 435 and extend in a direction away from the first connection portion 431 or in a second direction.
  • the portion where the first connector 437 is located and the extended region may be referred to as a fourth connecting portion by being separated from the third connecting portion 435.
  • the first and second contact portions 439a and 439b of the first connector 437 may be disposed on a portion of the upper surface of the third connection portion 435.
  • the first and second contacts 439a and 439b of the first connector 437 may be connected to the first and second conductive lines 442 and 444, respectively.
  • the first and second contact portions 439a and 439b and the first and second conductive lines 442 and 444 may be embedded in the connection substrate 430.
  • One side of the first and second conductive lines 442 and 444 is connected to the first and second contact portions 439a and 439b and the other side of the first and second conductive lines 442 and 444 is connected to the side of the coil portion 403 And may be connected to the inner pad 403b and the outer pad 403c.
  • the first and second conductive lines 442 and 444 and the first and second contact portions 439a and 439b may be integrally formed and formed of the same metal material.
  • the first and second conductive lines 442 and 444 and the first and second contact portions 439a and 439b may be formed of copper (Cu), but the present invention is not limited thereto.
  • the first and second conductive lines 442 and 444 can be connected to the inner pad 403b and the outer pad 403c of the coil portion 403 via the first and second connecting members 446 and 447 .
  • the first and second connecting members 446 and 447 may be a soldering paste comprising tin (Sn), nickel (Ni), gold (Au), and / or a mixture thereof.
  • the first conductive line 442 may be disposed in the first connection portion 431, the second connection portion 433, and the third connection portion 435.
  • the second conductive line 444 may be disposed in the second connection part 433 and the third connection part 435. In other words, the second conductive line 444 is not disposed in the first connection portion 431. [ Accordingly, only the first conductive line 442 may be disposed in the first connection portion 431, and both the first and second conductive lines 442 and 444 may be disposed in the second and third connection portions 433 and 435.
  • the first and second conductive lines 442 and 444 may be disposed in different layers from each other.
  • a first conductive line 442 may be disposed on the first passivation layer 441 and an insulating layer 443 may be disposed on the first conductive line 442.
  • the second conductive line 444 may be disposed on the insulating layer 443 and the second protective layer 445 may be disposed on the second conductive line 444.
  • Other components may be added, or some of these components may be omitted.
  • the first and second conductive lines 442 and 444 may be formed on both sides of the insulating layer 443 or on the first and second protective layers 441 and 445 using an electroplating method.
  • the first conductive line 442 may be surrounded by the first passivation layer 441 and the insulating layer 443.
  • the second conductive line 444 may be surrounded by an insulating layer 443 and a second passivation layer 445.
  • the first and second conductive lines 442 and 444 may be copper (Cu) plated copper layers.
  • the first and second conductive lines 442 and 444 may be composed of two layers, each having a Cu layer of 0.035 mm and a Cu plating of 0.01 mm.
  • the first conductive line 442 may have a copper layer formed on the insulating layer 443, and a copper plating layer formed on the copper layer.
  • the second conductive line 444 may have a copper layer formed under the insulating layer 443 in a direction opposite to the first conductive line 442 and a copper plating layer formed under the copper layer.
  • the first protective layer 441, the insulating layer 443, and the second protective layer 445 may be formed of a material having excellent bending properties.
  • the first protective layer 441, the insulating layer 443, and the second protective layer 445 may be formed of a material having excellent insulation and strength.
  • the first protective layer 441, the insulating layer 443, and / or the second protective layer 445 may be formed of the same material.
  • the first protective layer 441, the insulating layer 443, and / or the second protective layer 445 may include a polyimide resin.
  • the first protective layer 441, the insulating layer 443, and / or the second protective layer 445 may be formed of materials different from each other.
  • the insulating layer 443 may be formed of a material excellent in insulation line, and the first and / or second protective layers 441 and 445 may be formed of a material having excellent strength.
  • connection board 430 The thickness of each component of the connection board 430 is shown in Table 1.
  • connection substrate 430 Thickness [mm]
  • the second conductive line 444, 0.035 The second protective layer 445, 0.0125
  • first conductive line 442 may be disposed in the first connection portion 431 of the connection substrate 430.
  • the first and second conductive lines 442 and 444 may be disposed on the second and third connection portions 433 and 435 of the connection substrate 430. Since the first and second conductive lines 442 and 444 are disposed on different layers from each other, the first and second conductive lines 442 and 444 may overlap each other or may be spaced from each other along the horizontal direction, ), In particular, the width of the third connecting portion 435 can be reduced, and more excellent warping characteristics can be ensured.
  • the insulating layer 443 allows the first and second conductive lines 442 and 444 to be spaced apart from each other.
  • the first and second conductive lines 442 and 444 are overlapped with each other in the second connection portion 433, the thickness becomes thick and the formation of the bent portion is difficult. Accordingly, the first and second conductive lines 442 and 444 are not overlapped with each other as in the third connecting portion 435, and the bending portion 434 can be formed with a reduced thickness. As the thickness is reduced and the bending portion 434 is formed as described above, the bending characteristic of the third connecting portion 435 can be increased. Therefore, the second receiving portion 414 may be formed to extend in the second direction in the first receiving portion 412 formed in the first direction. The bending portion 434 can be formed in the third connection portion 435 through the second accommodating portion 414, thereby simplifying the process and reducing the material cost.
  • connection substrate 430 The arrangement relationship of the first and second conductive lines 442 and 444 in the first to third connection portions 431, 433 and 435 of the connection substrate 430 will be described in detail below.
  • the second conductive line 444 may be electrically connected to the inner terminal of the coil part 403 through the end of the first connection part 431 of the connection board 430 as shown in FIG.
  • the second conductive line 444 disposed on the first connection portion 431 of the connection substrate 430 may be electrically connected to the inner terminal of the coil portion 403 using the second connection member 446.
  • the second connection member 446 may be a soldering paste comprising tin (Sn), nickel (Ni), gold (Au) and / or a mixture thereof.
  • the first conductive line 442 is not disposed in the first connection portion 431 of the connection substrate 430 because the first conductive line 442 is connected to the outer terminal of the coil portion 403. [ The first conductive line 442 is not disposed below the second conductive line 444 disposed between the insulating layer 443 and the second passivation layer 445. [ In this case, a via 453 (hereinafter referred to as a second via) in which the first protective layer 441 and the insulating layer 443 are partially removed is formed at the end of the first connection portion 431 of the connection substrate 430 So that a part of the lower surface of the second conductive line 444 can be exposed to the outside.
  • a via 453 hereinafter referred to as a second via
  • the solder paste is filled in the exposed second vias 453, the solder paste is cured by the laser soldering process so that the second conductive line 444 is electrically connected to the inner side of the coil portion 403 Terminals and may be physically fixed.
  • a portion of the second connection member 446 is disposed at least in the second via 453 and the other portion of the second connection member 446 protrudes from the second via 453 to the inner terminal of the coil portion 403 Can be connected.
  • only the second conductive line 444 may be disposed in the first connection portion 431 of the connection substrate 430.
  • a second conductive line 444 is disposed between the insulating layer 443 and the second protective layer 445 and the second conductive line 444 is electrically connected to the first connection portion 431 of the connection substrate 430 in the longitudinal direction As shown in FIG. Since the second conductive line 444 is surrounded by the insulating layer 443 and the second protective layer 445, the second conductive line 444 is not exposed to the outside.
  • the first conductive line 442 may be electrically connected to the outer terminal of the coil portion 403 through one side of the second connection portion 433 of the connection board 430 as shown in FIG.
  • the first conductive line 442 disposed in the second connection portion 433 of the connection substrate 430 may be electrically connected to the outer terminal of the coil portion 403 using the first connection member 447.
  • the first connecting member 447 may be a soldering paste including tin (Sn), nickel (Ni), gold (Au), and / or a mixture thereof.
  • a first conductive line 442 is disposed between the first protective layer 441 and the insulating layer 443 and a second conductive line 444 is disposed between the insulating layer 443 and the second protective layer 445 .
  • the first conductive line 442 and the second conductive line 444 may be vertically overlapped.
  • a portion of the lower surface of the first conductive line 442 may be exposed to the outside by forming a via 451 in which the first protective layer 441 is partially removed.
  • the first connection line 447 in which the soldering paste is hardened by the laser soldering process, is electrically connected to the outside of the coil portion 403 Terminals and may be physically fixed.
  • a portion of the first connection member 447 is disposed at least in the first via 451 and the other portion of the first connection member 447 protrudes from the first via 451 to the inner terminal of the coil portion 403 Can be connected.
  • the first conductive line 442 and the second conductive line 444 may be disposed on the third connection portion 435 of the connection substrate 430.
  • the first conductive line 442 and the second conductive line 444 may be spaced apart from each other in the horizontal direction.
  • the first conductive line 442 and the second conductive line 444 may be overlapped in the horizontal direction. Since the first conductive line 442 and the second conductive line 444 are formed of a metal material, the metal material may be rigid and poor in characteristics.
  • the third connection part 435 of the connection board 430 is rotated about the second connection part 433 and is then fastened to the second connector 503 of the main board 501 so that the bending property should be excellent . That is, the third connection portion 435 of the connection substrate 430 should have excellent flexibility.
  • the first conductive line 442 and the second conductive line 444 are arranged to be spaced apart from each other along the horizontal direction in the third connection portion 435 of the connection substrate 430, The line 442 and the second conductive line 444 are prevented from vertically overlapping each other, whereby excellent flexibility can be secured.
  • the upper surface of the first protective layer 441 may be defined as a first protective layer region, a second protective layer region, and a third protective layer region between the first and second protective layer regions.
  • the first conductive line 442 may be disposed on the first protective layer region of the first protective layer 441.
  • An insulating layer 443 may be disposed on the first passivation layer 441 and the first conductive line 442.
  • the second conductive line 444 may be disposed on the insulating layer 443 corresponding to the second protective layer region of the first protective layer 441.
  • the first conductive line 442 and the second conductive line 444 may be spaced apart from each other along the horizontal direction by a width of the third protective layer region of the first protective layer 441.
  • the flexibility of the third connection part 435 of the connection substrate 430 can be changed according to the distance between the first conductive line 442 and the second conductive line 444.
  • the first conductive line 442 and the second conductive line 444 may be formed so as to secure flexibility of the third connection portion 435 of the connection substrate 430 and to prevent the width of the third connection portion 435 of the connection substrate 430 from increasing. ) Can be optimized.
  • the separation distance between the first conductive line 442 and the second conductive line 444 may be between 0.1 mm and 2.5 mm. More specifically, the separation distance between the first conductive line 442 and the second conductive line 444 may be between 0.1 mm and 1.2 mm.
  • the second passivation layer 445 may be disposed on the insulating layer 443 and the second conductive line 444.
  • the first connector 437 may be provided at the end of the third connection part 435 of the connection board 430, that is, the fourth connection part, as shown in FIG. 12E.
  • the first connector 437 may include a first contact portion 439a and a second contact portion 439b.
  • the first and second contact portions 439a and 439b are formed on the first and second conductive lines 442 and 444 to maximize the contact area when the main board 501 is connected to the second connector 503, Lt; / RTI >
  • the first contact portion 439a and the second contact portion 439b may be disposed so as to be spaced apart from each other to prevent electrical shorting.
  • the first and second contact portions 439a and 439b may be formed of the same metal material as the first and second conductive lines 442 and 444.
  • the first and second conductive lines 442 and 444 and the first and second contact portions 439a and 439b may be formed of copper (Cu).
  • the first contact portion 439a may extend from the first conductive line 442 and the second contact portion 439b may extend from the second conductive line 444.
  • the first and second contact portions 439a and 439b may be exposed to the outside in order to be electrically connected to the second connector 503 of the main board 501.
  • a part of the upper surface of the first contact portion 439a may be exposed to the outside by the third via 455 in which the second protective layer 445 and the insulating layer 443 are partially removed.
  • a portion of the upper surface of the second contact portion 439b may be exposed to the outside by the fourth via 457 from which the second protective layer 445 is partially removed.
  • the first contact 439a of the first connector 437 of the connection board 430 Is electrically connected to the first connection terminal 505a of the second connector 503 of the main board 501 and the second contact portion 439b of the first connector 437 of the connection board 430, May be electrically connected to the second connection terminal 505b (FIG. 5) of the second connector 503 of the main board 501.
  • the first via 451 and the third via 455 are electrically connected to each other through a first connection member 447 and a first contact portion 439a in which a copper wire is formed all over the insulating layer 443 in the connection substrate 430, As shown in FIG.
  • the second vias 453 and the fourth vias 457 are electrically connected to the second connection members 446 and the second contacts 439a through which the copper wires are formed in the connection substrate 430 with the insulating layer 443 therebetween, As shown in FIG.
  • the first and second contact portions 439a and 439b and the first and second connection members 447 and 446 may be exposed on different surfaces of the connection substrate 430.
  • the first and second connection members 447 and 446 may be exposed on the lower surface of the connection substrate 430
  • the first and second contact portions 439a and 439b may be exposed on the connection substrate 430.
  • the first conductive line 442 is disposed between the first protective layer 441 and the insulating layer 443 and the second conductive line 444 is disposed between the insulating layer 443 and the second protective layer 445, The first conductive line 442 and the second conductive line 444 may be interchanged with each other.
  • the second conductive line 444 is disposed between the first protective layer 441 and the insulating layer 443 and the first conductive line 442 is disposed between the insulating layer 443 and the second protective layer 445 As shown in FIG.
  • the width of the first connection portion 431 of the connection substrate 430 and the width of the third connection portion 435 of the connection substrate 430 may be the same as each other. Do not.
  • the first and second conductive lines 442 and 444 are disposed on different layers from each other in the third connection portion 435 of the connection substrate 430 but the third connection portion 435 of the connection substrate 430
  • the first and second conductive lines 442 and 444 may be arranged to be spaced apart from each other along the horizontal direction in order to secure flexibility. In contrast, only the second conductive line 444 may be disposed on the first connection part 431 of the connection substrate 430.
  • the first and second conductive lines 442 and 444 must be disposed in the third connection portion 435 of the connection board 430 so as to be spaced apart from each other along the horizontal direction. Therefore, the first and second conductive lines 442 and 444 ) Is relatively narrow.
  • the width of the second conductive line 444 is substantially equal to the width of the first connection part 431 of the connection substrate 430 because only the second conductive line 444 is disposed in the first connection part 431 of the connection substrate 430, Of the width of the opening.
  • the width of the second conductive line 444 of the first connection portion 431 of the connection board 430 and the width of the second conductive line 444 of the second and third connection portions 433 and 435 are different.
  • the width P1 of the second conductive line 444 of the first connection portion 431 of the connection substrate 430 is set to be greater than the width P1 of the second conductive line 444 of the second and third connection portions 433 and 435 P2).
  • the width P1 of the second conductive line 444 of the first connection portion 431 of the connection substrate 430 is larger than the width P2 of the second conductive line 444 of the third connection portion 435 of the connection substrate 430 ,
  • the sectional area of the second conductive line 444 is increased and the line resistance can be drastically reduced.
  • the width P3 of the first conductive line 442 disposed on the third connection portion 435 of the connection substrate 430 is greater than the width P3 of the second conductive line 432 disposed on the third connection portion 435 of the connection substrate 430 444, but it is not limited thereto.
  • the width P3 of the first conductive line 442 disposed at the third connection portion 435 of the connection substrate 430 is greater than the width P3 of the second conductive line 444 disposed at the first connection portion 431 of the connection substrate 430,
  • the width P1 may be smaller than the width P1.
  • the width P3 of the first conductive line 442 disposed on the third connection portion 435 of the connection substrate 430 is greater than the width P3 of the first conductive line 442 disposed on the second connection portion 433 of the connection substrate 430. [ But it is not limited thereto.
  • the width P2 of the second conductive line 444 disposed on the third connection portion 435 of the connection substrate 430 is greater than the width of the second conductive line 444 disposed on the second connection portion 433 of the connection substrate 430. [ But it is not limited thereto.
  • the width P1 of the first conductive line 442 of the first connection portion 431 according to the first embodiment is larger than the width of the first conductive line 442 and the second conductive line 444 of the third connection portion 435 (P2, P3).
  • the width P1 of the first conductive line 442 of the first connection part 431 according to the first embodiment may be 2 mm.
  • the widths P2 and P3 of the first conductive line 442 and the second conductive line 444 of the third connection part 435 according to the embodiment may be 1 mm.
  • a third film 411 may be provided.
  • the third film 411 may be formed of a polyimide resin.
  • the third film 411 may be attached to the first film 401 using the second adhesive member 413. [ That is, the second adhesive member 413 allows the third film 411 to adhere to the first film 401.
  • the third film 411 can serve to protect the second adhesive member 413 from maintaining adhesiveness.
  • the third film 411 can be removed so that it can be fixed by the second adhesive member 413 when the wireless charging coil module 400 is placed on a terminal or the like.
  • the third film 411 and the second adhesive member 413 may optionally be omitted.
  • the thickness of the coil portion 403 is relatively thick, the resistance or heat generation is reduced, so that it is not necessary to provide a separate heat radiation member.
  • the EMB shielding material is used in a relatively thin thickness, the shielding effect is excellent and the thickness is reduced.
  • FIG. 13 is a perspective view illustrating a wireless charging coil module according to a second embodiment
  • FIG. 14 is a perspective view illustrating a heat dissipating member disposed on a shielding member in the wireless charging coil module according to the second embodiment.
  • the second embodiment is the same as the first embodiment except that the heat radiating members 415, 417 and 419 are added.
  • constituent elements having the same function or shape as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the heat radiation members 415, 417 and 419 can be provided.
  • the coil portion 403 is disposed on the first film 401, and the shielding members 405, 407, and 409 can be disposed on the coil portion 403.
  • the shielding members 405, 407 and 409 include a first adhesive member 405 disposed on the coil portion 403, a shielding member 407 disposed on the first adhesive member 405, And a second film 409 disposed thereon.
  • the second film 409 may be attached via the second adhesive member 413 under the first film 401.
  • the heat radiation members 415, 417, and 419 may be disposed on the shield members 405, 407, and 409.
  • the heat dissipating members 415, 417 and 419 are disposed on the shielding members 405, 407 and 409, specifically a third adhesive member (not shown) disposed on the second film 409, A second heat dissipation unit 417 disposed on the first heat dissipation unit 415 and a fourth film 419 disposed on the second heat dissipation unit 417.
  • the first heat dissipation unit 415 may include a heat dissipation unit 415,
  • the second film 409 and the second heat-radiating portion 417 or the fourth film 419 can be attached by the third adhesive member.
  • the second adhesive member 413 may be referred to as a third adhesive member, and the third adhesive member may be referred to as a second adhesive member.
  • the third film 411 may be referred to as a fourth film 419 and the fourth film 419 may be referred to as a third film 411.
  • the first heat-radiating portion 415 may be a heat-radiating sheet including copper (Cu) as a member for inducing heat generated in the coil portion 403 in the vertical direction.
  • the second heat-radiating portion 417 is a member for guiding the heat generated in the coil portion 403 in the horizontal direction, and may be a heat-radiating sheet including graphite. At least one portion of at least one of the first heat-radiating portion 415 and / or the second heat-radiating portion 417 may be connected to a discharge member such as a case.
  • the arrangement order of the first heat-radiating portion 415 and the second heat-radiating portion 417 may be changed. That is, the second heat dissipating unit 417 may be disposed on the third adhesive member, and the first heat dissipating unit 415 may be disposed on the second heat dissipating unit 417.
  • the heat generated in the coil part 403 is rapidly guided in the vertical direction by the first heat radiation part 415, and the heat of the coil part 403 guided to the first heat radiation part 415 is guided to the second heat radiation part
  • the heat radiation performance is drastically increased and the power transmission efficiency can be prevented from being lowered due to the heat of the coil part 403.
  • the sizes of the receiving portions 416 and 418 of the third adhesive member (not shown), the first heat radiating portion 415, the second heat radiating portion 417 and / or the fourth film 419 may be different.
  • the width of the third accommodating portion 416 of the second heat dissipating portion 417 may be equal to the width of the third accommodating portion 416 of the third adhesive member, the first heat dissipating portion 415, and / Width.
  • the width of the fourth accommodating portion 418 of the second heat releasing portion 417 is equal to the width of the fourth accommodating portion 418 of the third adhesive member, the first heat radiating portion 415, and / Width.
  • the shape of the third accommodating portion 416 corresponds to the shape of the first accommodating portion 412 of the shielding members 405, 407 and 409 and the shape of the fourth accommodating portion corresponds to the shape of the shielding member 405, 407, 2 accommodating portion 414 of the first embodiment.
  • the fourth film 419 is a member for protecting the first and second heat radiation parts 415 and 417, and may be formed of, for example, polyimide resin.
  • the fourth film 419 may have black color, but is not limited thereto.
  • the first heat radiating part 415 for guiding heat in the vertical direction and the second heat radiating part 417 for guiding heat in the horizontal direction are provided, So that the discharge performance can be improved.
  • the wireless charging coil modules 400 and 400A configured as described above can be mass-produced by the process automation. All components included in the wireless charging coil module 400, 400A may be supplied in a roll-to-roll fashion. The components described below may have a large size in which a plurality of wireless charging coil modules 400, 400A may be produced collectively.
  • a cutting process for forming the receiving portions 412 and 414 may be performed after the first adhesive member 405 is supplied in a roll-to-roll manner.
  • the cutting process for forming the receiving portions 412 and 414 may be performed after the shielding material 407 is supplied in a roll-to-roll manner.
  • the first adhesive member 405 can be attached to the lower surface of the shielding member 407.
  • a cutting process for forming the receiving portions 412 and 414 may be performed after the second film 409 is supplied in a roll-to-roll manner.
  • the second film 409 may be attached on the shielding material 407.
  • the first film 401 including the coil part 403 can be supplied.
  • the shielding material 407 and the second film 409 may be attached to the upper surface of the first film 401 including the coil portion 403 via the first adhesive member 405.
  • the second adhesive member 413 may be supplied in a roll-to-roll fashion and the third film 411 may be supplied in a roll-to-roll fashion.
  • the second adhesive member 413 can be attached on the third film 411. [ Then, the third film 411 can be attached to the lower surface of the first film 401 via the second adhesive member 413.
  • a cutting process for forming the receiving portions 416 and 418 can be performed.
  • the first heat-radiating portion 415 is supplied in a roll-to-roll fashion
  • a cutting process for forming the receiving portions 416 and 418 may be performed.
  • the third adhesive member can be attached to the lower surface of the first heat-radiating portion 415.
  • a cutting process for forming the receiving portions 416 and 418 may be performed.
  • the second heat-radiating portion 417 may be attached to the upper surface of the first heat-radiating portion 415.
  • the fourth film 419 is supplied in a roll-to-roll fashion, a cutting process for forming the receiving portions 416 and 418 can be performed.
  • the fourth film 419 may be attached to the upper surface of the second heat-radiating portion 417.
  • the first heat radiating portion 415, the second heat radiating portion 417 and the fourth film 419 may be attached to the upper surface of the third film 411 through the third adhesive member.
  • the shielding members 405, 407, 409 and the heat radiation members 415, 417, 419 are disposed on the first film 401 including the coil portion 403, and under the first film 401,
  • the third film 411 may be disposed.
  • the receiving portion is not formed in the first film 401 or the third film 411.
  • the accommodating portions 412 and 414 may be formed in the shielding members 405 and 407 and the accommodating portions 416 and 418 may be formed in the radiating members 415 and 417 and 419.
  • the connecting board 430 is inserted into the receiving portions 412 and 414 of the shielding members 405 and 407 and the receiving portions 418 and 418 of the heat radiating members 415 and 417 and 419,
  • the inner pad 403b of the coil portion 403 and the outer pad 403c may be electrically connected to the connection board 430.
  • the wireless charging coil modules 400 and 400A can be mass-produced all at once by the process automation.
  • the present invention can be used in the field of wireless power transmission and reception.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)

Abstract

A wireless charging coil module comprises: a first film; a coil part disposed on the first film and including an inner pad and an outer pad; a shielding member disposed on the coil part and having a receiving portion; and a connection substrate at least partly disposed in the receiving portion. The receiving portion may comprise: a first receiving portion formed in a first direction from the inner pad toward the outer pad; and a second receiving portion connected to the first receiving portion and formed in a second direction different from the first direction. The connection substrate may comprise: a first connection portion disposed in the first receiving portion and connected to the inner pad; a second connection portion disposed in the second receiving portion and connected to the outer pad; and a third connection portion extending from the second connection portion and including a bent portion.

Description

무선충전코일모듈 및 무선충전장치Wireless charging coil module and wireless charging device
실시예는 무선충전코일모듈 및 무선충전장치에 관한 것이다.Embodiments relate to a wireless charging coil module and a wireless charging device.
휴대폰, 노트북과 같은 휴대용 단말은 전력을 저장하는 배터리와 배터리의 충전 및 방전을 위한 회로를 포함한다. 이러한 단말의 배터리가 충전되려면, 외부의 충전기로부터 전력을 공급받아야 한다. Portable terminals, such as mobile phones and laptops, include a battery for storing power and a circuit for charging and discharging the battery. In order for the battery of such a terminal to be charged, power must be supplied from an external charger.
일반적으로 배터리에 전력을 충전시키기 위한 충전장치와 배터리 간의 전기적 연결방식의 일 예로, 상용전원을 공급받아 배터리에 대응하는 전압 및 전류로 변환하여 해당 배터리의 단자를 통해 배터리로 전기에너지를 공급하는 단자공급방식을 들 수 있다. 이러한 단자공급방식은 물리적인 케이블(cable) 또는 전선의 사용이 동반된다. 따라서 단자공급방식의 장비들을 많이 취급하는 경우, 많은 케이블들이 상당한 작업 공간을 차지하고 정리가 곤란하며 외관상으로도 좋지 않다. 또한 단자공급방식은 단자들간의 서로 다른 전위차로 인한 순간방전현상, 이물질에 의한 소손 및 화재 발생, 자연방전, 배터리의 수명 및 성능 저하 등의 문제점을 야기할 수 있다.2. Description of the Related Art [0002] Generally, as an example of an electrical connection between a charging device and a battery for charging electric power of a battery, a commercial electric power is supplied to a terminal for converting electric power into voltage and current corresponding to the battery, Supply method. This type of terminal supply is accompanied by the use of physical cables or wires. Therefore, when handling a lot of terminal-supplied equipment, many cables occupy considerable work space, are difficult to organize, and are not well apparent. Also, the terminal supply method may cause problems such as instantaneous discharge due to different potential difference between terminals, burnout due to foreign substances, fire, natural discharge, battery life and deterioration of performance.
최근 이와 같은 문제점을 해결하기 위하여, 무선으로 전력을 전송하는 방식을 이용한 충전시스템(이하 “무선충전시스템”이라 칭함.)과 제어방법들이 제시되고 있다. 또한, 무선충전시스템이 과거에는 일부 휴대용 단말에 기본 장착되지 않고 소비자가 별도 무선충전 수신기 액세서리를 별도로 구매해야 했기에 무선충전시스템에 대한 수요가 낮았으나 무선충전 사용자가 급격히 늘어날 것으로 예상되며 향후 단말 제조사에서도 무선충전 기능을 기본 탑재할 것으로 예상된다. In order to solve such a problem, a charging system (hereinafter referred to as a "wireless charging system") and a control method using a method of transmitting power wirelessly are proposed. In addition, since the wireless charging system has not been installed in some portable terminals in the past and the consumer has to purchase a separate wireless charging receiver accessory, the demand for the wireless charging system is low, but the wireless charging user is expected to increase rapidly. Wireless charging function is expected to be equipped basically.
이러한 무선충전시스템에는 무선충전모듈이 구비된다.Such a wireless charging system is equipped with a wireless charging module.
도 1은 종래의 무선충전코일모듈을 도시한 분해사시도이다.1 is an exploded perspective view showing a conventional wireless charging coil module.
도 1에 도시한 바와 같이, 절연층(1) 상에 코일부(2)가 배치된다. 코일부(2)를 가로질러 코일부(2)의 내측패드에 연결되는 연결부(3)가 절연층(1)의 하부에 배치된다. 즉, 연결부(3)의 일측이 절연층(1)을 관통하여 코일부(2)의 내측패드와 연결되고 연결부(3)의 타측이 기판(4)에 연결된다. 아울러, 코일부(2)의 외측패드 또한 기판(4)에 연결된다. 코일부(2)를 통해 무선전력이 전송되거나 무선전력이 수신되어 배터리에 충전된다. As shown in Fig. 1, the coil portion 2 is disposed on the insulating layer 1. [ A connecting portion 3 which is connected to the inner pad of the coil portion 2 across the coil portion 2 is disposed below the insulating layer 1. [ That is, one side of the connection part 3 is connected to the inner pad of the coil part 2 through the insulating layer 1, and the other side of the connection part 3 is connected to the substrate 4. In addition, the outer pad of the coil part 2 is also connected to the substrate 4. Wireless power is transmitted via the coil section 2 or wireless power is received and charged to the battery.
종래의 무선충전코일모듈에서 연결부(3)가 절연층(1)의 하부에 배치되어 무선충전코일모듈의 두께가 두꺼워지는 문제가 있다. 무선충전코일모듈의 두께를 줄이기 위해 연결부(3)의 두께가 얇아지는 경우, 무선충전코일모듈의 저항이 증가되는 문제가 있다. 또한, 종래의 무선충전코일모듈에서 연결부(3)의 배치를 위하여 단말기 등 무선충전코일모듈이 부착되는 부분에 별도의 시트를 붙여, 연결부(3)의 두께로 인한 편차를 보완하기 위한 구성이 더 필요하였다.There is a problem that the thickness of the wireless charging coil module is increased because the connecting portion 3 is disposed under the insulating layer 1 in the conventional wireless charging coil module. When the thickness of the connection part 3 is reduced in order to reduce the thickness of the wireless charging coil module, the resistance of the wireless charging coil module increases. Further, in order to arrange the connection part 3 in the conventional wireless charging coil module, there is a configuration for supplementing a deviation due to the thickness of the connection part 3 by attaching a separate sheet to a part where the wireless charging coil module such as a terminal is attached .
종래의 무선충전코일모듈에서 연결부(3)와 코일부(2)의 내측패드 사이, 코일부(2)의 외측패드와 기판(4) 사이 그리고 연결부(3)와 기판(4) 사이의 연결을 위해 리플로우(flow) 공정이 수행되는데, 이러한 경우 접촉 저항이 증가되는 문제가 있다. In the conventional wireless charging coil module, the connection between the connection part 3 and the inner pad of the coil part 2, between the outer pad of the coil part 2 and the substrate 4 and between the connection part 3 and the substrate 4 A reflow process is performed. In this case, there is a problem that the contact resistance is increased.
종래의 무선충전코일모듈에서는 공정 자동화가 이루어지지 않아, 공정 시간이 증가되고 대량 생산이 불가능한 문제가 있다. In the conventional wireless charging coil module, there is a problem that the process automation is not performed, the process time is increased, and mass production is impossible.
실시예는 새로운 구조의 무선충전코일모듈 및 무선충전장치를 제공한다.The embodiment provides a wireless charging coil module and a wireless charging device of a new structure.
실시예는 저항을 최소화할 수 있는 무선충전코일모듈 및 무선충전장치를 제공한다.Embodiments provide a wireless charging coil module and a wireless charging device that can minimize resistance.
실시예는 두께를 줄일 수 있는 무선충전코일모듈 및 무선충전장치를 제공한다.Embodiments provide a wireless charging coil module and a wireless charging device capable of reducing thickness.
실시예는 방열 성능이 뛰어난 무선충전코일모듈 및 무선충전장치를 제공한다.The embodiment provides a wireless charging coil module and a wireless charging device having excellent heat dissipation performance.
실시예는 공정 자동화에 의한 대량 생산이 가능한 무선충전코일모듈 및 무선충전장치를 제공한다.Embodiments provide a wireless charging coil module and a wireless charging device capable of mass production by process automation.
실시예에 따른 무선충전코일모듈은, 제1 필름; 상기 제1 필름 상에 배치되고, 내측패드와 외측패드를 포함하는 코일부; 상기 코일부 상에 배치되고, 수용부를 갖는 차폐부재; 및 상기 수용부 내에 적어도 일부가 배치되는 연결 기판;을 포함한다. 상기 수용부는, 상기 내측패드에서 상기 외측패드를 향하는 제1 방향으로 형성되는 제1 수용부; 및 상기 제1 수용부와 연결되고, 상기 제1 방향과 다른 제2 방향으로 형성되는 제2 수용부를 포함할 수 있다. 상기 연결 기판은, 상기 제1 수용부에 배치되고, 상기 내측패드와 연결되는 제1 연결부; 상기 제2 수용부에 배치되고, 상기 외측패드와 연결되는 제2 연결부; 및 상기 제2 연결부에서 연장되고 절곡부를 포함하는 제3 연결부;를 포함할 수 있다.A wireless charging coil module according to an embodiment includes: a first film; A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad; A shielding member disposed on the coil portion, the shielding member having a receiving portion; And a connection substrate at least partially disposed in the accommodating portion. Wherein the receiving portion includes: a first receiving portion formed in a first direction from the inner pad toward the outer pad; And a second accommodating portion connected to the first accommodating portion and formed in a second direction different from the first direction. The connection board includes: a first connection portion disposed in the first accommodation portion and connected to the inner pad; A second connection portion disposed in the second accommodation portion and connected to the outer pad; And a third connection part extending from the second connection part and including a bent part.
실시예에 따른 무선충전코일모듈은, 제1 필름; 상기 제1 필름 상에 배치되고, 내측패드와 외측패드를 포함하는 코일부; 상기 코일부 상에 배치되고, 수용부를 갖는 차폐부재; 및 상기 수용부 내에 적어도 일부가 배치되는 연결 기판을 포함할 수 있다. 상기 연결 기판은, 제1 보호층; 상기 제1 보호층 상에 배치되는 절연층; 상기 절연층 상에 배치되는 제2 보호층; 상기 제1 보호층과 상기 절연층 사이에 배치되는 제1 도전 라인; 및 상기 절연층과 상기 제2 보호층 사이에 배치되는 제2 도전 라인을 포함할 수 있다. 상기 제2 도전 라인이 배치되는 제1 연결부; 상기 제1 도전 라인과 상기 제2 도전 라인이 수직 방향으로 중첩되는 제2 연결부; 및 상기 제1 도전 라인과 상기 제2 도전 라인이 수직 방향으로 중첩되지 않고 수평 방향으로 중첩되는 제3 연결부;을 포함할 수 있다.A wireless charging coil module according to an embodiment includes: a first film; A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad; A shielding member disposed on the coil portion, the shielding member having a receiving portion; And a connecting substrate at least partially disposed in the receiving portion. The connection substrate includes a first protective layer; An insulating layer disposed on the first passivation layer; A second protective layer disposed on the insulating layer; A first conductive line disposed between the first passivation layer and the insulating layer; And a second conductive line disposed between the insulating layer and the second passivation layer. A first connection part in which the second conductive line is disposed; A second connection part in which the first conductive line and the second conductive line are overlapped in a vertical direction; And a third connection part in which the first conductive line and the second conductive line are overlapped in a horizontal direction without overlapping in a vertical direction.
실시예에 따른 무선충전코일모듈은, 제1 필름; 상기 제1 필름 상에 배치되고, 내측패드와 외측패드를 포함하는 코일부; 상기 코일부 상에 배치되고, 수용부를 갖는 차폐부재; 및 상기 수용부 내에 적어도 일부가 배치되는 연결 기판;을 포함할 수 있다. 상기 연결 기판은, 상기 외측패드와 연결되는 제1 연결부재 상기 내측패드와 연결되는 제2 연결부재; 상기 제1 연결부재와 연결되는 제1 접촉부; 상기 제2 연결부재와 연결되는 제2 접촉부를 포함할 수 있다. 상기 제1 연결부재와 상기 제2 연결부재는 상기 연결 기판의 제1 면으로 노출되고, 상기 제1 접촉부와 상기 제2 접촉부는 상기 연결 기판의 상기 제1면과 다른 제2 면으로 노출될 수 있다.A wireless charging coil module according to an embodiment includes: a first film; A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad; A shielding member disposed on the coil portion, the shielding member having a receiving portion; And a connection substrate at least partially disposed in the accommodating portion. The connection board includes: a first connecting member connected to the outer pad; a second connecting member connected to the inner pad; A first contact portion connected to the first connection member; And a second contact portion connected to the second connection member. Wherein the first connection member and the second connection member are exposed to a first surface of the connection substrate and the first contact portion and the second contact portion are exposed to a second surface different from the first surface of the connection substrate have.
실시예에 따르면, 코일부의 두께를 두껍게 하여 저항이나 발열이 감소되므로, 별도의 방열부재가 구비될 필요가 없다.According to the embodiment, since the thickness of the coil portion is increased to reduce resistance and heat generation, it is not necessary to provide a separate heat radiating member.
실시예에 따르면, EMB 차폐재가 얇은 두께로 사용되므로, 차폐 효과는 뛰어나면서 두께는 감소되는 효과가 있다. 아울러, 코일부가 두꺼워지는 두께폭보다 EMB 차폐재가 얇아지는 두께폭이 더 크므로, 전체적으로 무선충전코일모듈의 두께가 줄어들 수 있다. According to the embodiment, since the EMB shielding material is used in a thin thickness, the shielding effect is excellent and the thickness is reduced. In addition, since the thickness of the EMB shielding material is thinner than the thickness of the coil part, the thickness of the wireless charging coil module as a whole can be reduced.
실시예에 따르면, 하나의 기판, 즉 연결 기판으로 코일부의 내측으로부터 코일부의 외측으로 전기적인 연결을 연장시키는 제1 연결선 기능과 코일부로부터 메인 기판으로 전기적인 연결을 연장시키기 위한 제2 연결선 기능 그리고 메인 기판과의 체결을 위한 체결기능을 동시에 달성할 수 있어, 구조가 단순해지고 비용이 절감될 수 있다. 제1 연결선 기능은 연결 기판의 제1 연결부에 내장된 제2 도전라인에 의해 구현되고, 제2 연결선 기능은 메인 기판의 제2 연결부 및 제2 연결부에 내장된 제1 및 제2 도전라인에 의해 구현되며, 체결 기능은 연결 기판의 제3 연결부의 일측 끝단에 배치된 커넥터에 의해 구현될 수 있다. According to an embodiment, a single substrate, that is, a connecting substrate, has a first connecting line function for extending an electrical connection from the inside of the nose portion to the outside of the nose portion and a second connecting line function for extending the electrical connection from the nose portion to the main substrate. Function and a fastening function for fastening with the main board can be achieved at the same time, so that the structure can be simplified and the cost can be reduced. The first connection line function is realized by a second conductive line embedded in the first connection portion of the connection board and the second connection line function is realized by the first and second conductive lines embedded in the second connection portion and the second connection portion of the main board And the fastening function can be realized by a connector disposed at one end of the third connection part of the connection board.
실시예에 따르면, 연결 기판의 제1 연결부와 제3 연결부가 코일부의 내측을 향해 배치되도록 함으로써, 공정 자동화에 의한 대량 생산이 가능하도록 한다.According to the embodiment, the first connection portion and the third connection portion of the connection board are disposed toward the inside of the coil portion, thereby enabling mass production by automation of the process.
실시예에 따르면, 연결 기판이 플렉서블 기판으로 구현되어 연결 기판의 제3 연결부로 제2 연결부를 기준으로 회전되므로, 메인 기판의 제2 커넥터에 체결하기 위해 제1 커넥터와 제2 커넥터 사이를 연결하기 위한 추가적인 연결라인이 필요없다. According to an embodiment of the present invention, since the connection board is embodied as a flexible board and is rotated with respect to the second connection portion to the third connection portion of the connection board, the connection between the first connector and the second connector for fastening to the second connector of the main board There is no need for additional connection lines.
실시예에 따르면, 메인 기판의 제2 커넥터에 연결되기 위해 회전되어야 하는 연결 기판의 제3 연결부에 배치되는 제1 및 제2 도전라인이 수평 방향으로 서로 이격되도록 배치됨으로써, 연결 기판의 가요성이 증진될 수 있다. According to the embodiment, since the first and second conductive lines arranged in the third connection part of the connection board to be rotated to be connected to the second connector of the main board are arranged so as to be spaced apart from each other in the horizontal direction, Can be promoted.
실시예에 따르면, 코일부 상에 배치되는 차폐부재 및/또는 방열부재에 수용부가 형성되어 이 수용부에 연결 기판이 삽입됨으로써, 연결 기판과 코일부와의 전기적인 연결이 보다 수월할 수 있다. According to the embodiment, the receiving portion is formed in the shielding member and / or the heat radiating member disposed on the coil portion, and the connecting board is inserted into the receiving portion, so that the electrical connection between the connecting board and the coil portion can be facilitated.
도 1은 종래의 무선충전코일모듈을 도시한 분해사시도이다.1 is an exploded perspective view showing a conventional wireless charging coil module.
도 2은 실시예에 따른 무선충전시스템을 도시한 블록도이다.2 is a block diagram illustrating a wireless charging system in accordance with an embodiment.
도 3는 실시예에 따른 무선전력송신기의 구조를 도시한 블록도이다.3 is a block diagram illustrating the structure of a wireless power transmitter according to an embodiment.
도 4은 도 3의 무선전력송신기와 연동되는 무선전력수신기의 구조를 도시한 블록도이다.4 is a block diagram illustrating the structure of a wireless power receiver interlocked with the wireless power transmitter of FIG.
도 5는 실시예에 따른 무선전력수신기를 도시한다. 5 shows a wireless power receiver according to an embodiment.
도 6은 제1 실시예에 따른 무선충전코일모듈을 도시한 사시도이다.6 is a perspective view showing a wireless charging coil module according to the first embodiment.
도 7은 제1 실시예에 따른 무선충전코일모듈에서 코일부에서 내려다본 모습을 보여준다.FIG. 7 shows a view from the coil part of the wireless charging coil module according to the first embodiment.
도 8은 제1 실시예에 따른 무선충전코일모듈에서 코일부 상에 배치된 차폐부재를 도시한 사시도이다.8 is a perspective view showing a shielding member disposed on the coil part in the wireless charging coil module according to the first embodiment.
도 9는 제1 실시예에 따른 무선충전코일모듈에서 코일부 상에 배치된 차폐부재의 수용부의 형성위치를 도시한다.Fig. 9 shows a forming position of a receiving portion of the shielding member disposed on the coil portion in the wireless charging coil module according to the first embodiment.
도 10는 제1 실시예에 따른 무선충전코일모듈의 연결 기판을 도시한 사시도이다.10 is a perspective view illustrating a connection board of the wireless charging coil module according to the first embodiment.
도 11은 제1 실시예에 따른 무선충전코일모듈의 연결 기판의 내부를 개략적으로 도시한 평면도이다.11 is a plan view schematically illustrating the inside of a connection board of a wireless charging coil module according to the first embodiment.
도 12a 내지 도 12e는 도 11의 무선충전코일모듈의 연결 기판을 절단한 단면도이다.12A to 12E are cross-sectional views of the connection board of the wireless charging coil module of Fig.
도 13는 제2 실시예에 따른 무선충전코일모듈을 도시한 사시도이다.13 is a perspective view showing the wireless charging coil module according to the second embodiment.
도 14은 제2 실시예에 따른 무선충전코일모듈에서 차폐부재 상에 배치된 방열부재를 도시한 사시도이다.14 is a perspective view showing a heat dissipating member disposed on a shielding member in the wireless charging coil module according to the second embodiment.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명한다. 다만, 본 발명의 기술 사상은 설명되는 일부 실시 예에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있고, 본 발명의 기술 사상 범위 내에서라면, 실시 예들간 그 구성 요소들 중 하나 이상을 선택적으로 결합, 치환하여 사용할 수 있다. 또한, 본 발명의 실시예에서 사용되는 용어(기술 및 과학적 용어를 포함)는, 명백하게 특별히 정의되어 기술되지 않는 한, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 일반적으로 이해될 수 있는 의미로 해석될 수 있으며, 사전에 정의된 용어와 같이 일반적으로 사용되는 용어들은 관련 기술의 문맥상의 의미를 고려하여 그 의미를 해석할 수 있을 것이다. 또한, 본 발명의 실시예에서 사용된 용어는 실시예들을 설명하기 위한 것이며 본 발명을 제한하고자 하는 것은 아니다. 본 명세서에서, 단수형은 문구에서 특별히 언급하지 않는 한 복수형도 포함할 수 있고, “A, B 및(와) C 중 적어도 하나(또는 한 개 이상)”로 기재되는 경우 A, B, C로 조합할 수 있는 모든 조합 중 하나 이상을 포함할 수 있다. 또한, 본 발명의 실시 예의 구성 요소를 설명하는 데 있어서, 제1, 제2, A, B, (a), (b) 등의 용어를 사용할 수 있다. 이러한 용어는 그 구성 요소를 다른 구성 요소와 구별하기 위한 것일 뿐, 그 용어에 의해 해당 구성 요소의 본질이나 차례 또는 순서 등으로 한정되지 않는다. 그리고, 어떤 구성 요소가 다른 구성요소에 '연결', '결합' 또는 '접속'된다고 기재된 경우, 그 구성 요소는 그 다른 구성요소에 직접적으로 연결, 결합 또는 접속되는 경우 뿐만아니라, 그 구성 요소와 그 다른 구성요소 사이에 있는 또 다른 구성 요소로 인해 '연결', '결합' 또는 '접속'되는 경우도 포함할 수 있다. 또한, 각 구성 요소의 " 상(위) 또는 하(아래)"에 형성 또는 배치되는 것으로 기재되는 경우, 상(위) 또는 하(아래)는 두개의 구성 요소들이 서로 직접 접촉되는 경우 뿐만아니라 하나 이상의 또 다른 구성 요소가 두 개의 구성 요소들 사이에 형성 또는 배치되는 경우도 포함한다. 또한 “상(위) 또는 하(아래)”으로 표현되는 경우 하나의 구성 요소를 기준으로 위쪽 방향뿐만 아니라 아래쪽 방향의 의미도 포함할 수 있다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it is to be understood that the technical spirit of the present invention may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. It is to be understood that within the scope of the appended claims, May be used. It is also to be understood that the terms (including technical and scientific terms) used in the embodiments of the present invention, unless otherwise explicitly specified and described, are to be understood as generally understood by one of ordinary skill in the art to which the present invention pertains. And terms that are commonly used, such as predefined terms, may be interpreted in light of the contextual meaning of the related art. Moreover, the terms used in the embodiments of the present invention are intended to illustrate the embodiments and are not intended to limit the present invention. In the present specification, a singular form may include plural forms unless specifically stated in the wording, and may be a combination of A, B, and C when it is described as " at least one (or more than one) Or < / RTI > all possible combinations. In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms are not limited to the nature, order or order of the constituent elements. In addition, when an element is described as being 'connected', 'coupled' or 'connected' to another element, the element is not only directly connected to, coupled to, or connected to the other element, Or " connected " due to another component between the other components. In addition, when described as being formed or disposed on "upper or lower" of each component, upper or lower (lower) is not limited to the case where two components are in direct contact with each other, But also includes the case where another component is formed or disposed between two components. Also, in the case of "upper (upper) or lower (lower)", it may include not only an upward direction but also a downward direction based on one component.
실시예의 설명에 있어서, 무선 전력 충전 시스템상에서 무선 전력을 송신하는 장치는 설명의 편의를 위해 무선 전력 송신기, 무선 전력 송신 장치, 무선 전력 송신기, 송신단, 송신기, 송신 장치, 송신측, 무선 전력 전송 장치, 무선 전력 전송기, 무선충전장치 등을 혼용하여 사용하기로 한다. 또한, 무선 전력 송신 장치로부터 무선 전력을 수신하는 장치에 대한 표현으로 설명의 편의를 위해 무선 전력 수신 장치, 무선 전력 수신기, 무선 전력 수신 장치, 무선 전력 수신기, 수신 단말기, 수신측, 수신 장치, 수신기 단말 등이 혼용되어 사용될 수 있다.In the description of the embodiments, an apparatus for transmitting wireless power on a wireless power charging system includes a wireless power transmitter, a wireless power transmitter, a wireless power transmitter, a transmitter, a transmitter, a transmitter, a transmitter, , A wireless power transmitter, and a wireless charging device. For the sake of convenience, a wireless power receiving device, a wireless power receiving device, a wireless power receiving device, a wireless power receiving device, a receiving terminal, a receiving side, a receiving device, a receiver Terminals and the like can be used in combination.
실시예에 따른 무선충전장치는 패드 형태, 거치대 형태, AP(Access Point) 형태, 소형 기지국 형태, 스텐드 형태, 천장 매립 형태, 벽걸이 형태 등으로 구성될 수 있으며, 하나의 송신기는 복수의 무선 전력 수신 장치에 전력을 전송할 수도 있다. The wireless charging device according to the embodiment may be configured as a pad type, a cradle type, an access point (AP) type, a small base type, a stand type, a ceiling embedded type, a wall type, Power may be transmitted to the device.
일 예로, 무선 전력 송신기는 통상적으로 책상이나 탁자 위 등에서 놓여서 사용될 수 있을 뿐만 아니라, 자동차용으로도 개발되어 적용되어 차량 내에서 사용될 수 있다. 차량에 설치되는 무선 전력 송신기는 간편하고 안정적으로 고정 및 거치할 수 있는 거치대 형태로 제공될 수 있다. As an example, a wireless power transmitter can be used not only on a desk or on a table, but also developed for automobiles and used in a vehicle. A wireless power transmitter installed in a vehicle can be provided in a form of a stand that can be easily and stably fixed and mounted.
실시예에 따른 단말은 휴대폰(mobile phone), 스마트폰(smart phone), 노트북 컴퓨터(laptop computer), 디지털방송용 단말기, PDA(Personal Digital Assistants), PMP(Portable Multimedia Player), 네비게이션, MP3 player, 전동 칫솔, 전자 태그, 조명 장치, 리모콘, 낚시찌 등의 소형 전자 기기 등에 사용될 수 있으나, 이에 국한되지는 아니하며 실시예에 따른 무선 전력 수신 수단이 장착되어 배터리 충전이 가능한 모바일 디바이스 기기(이하, "디바이스"라 칭함.)라면 족하고, 단말 또는 디바이스라는 용어는 혼용하여 사용될 수 있다. 다른 일 실시예에 따른 무선 전력 수신기는 차량, 무인 항공기, 에어 드론 등에도 탑재될 수 있다. A mobile phone, a smart phone, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player), a navigation device, an MP3 player, (Hereinafter referred to as a " device ") capable of charging a battery by mounting a wireless power receiving means according to an embodiment, but not limited thereto, may be used for a small electronic device such as a toothbrush, an electronic tag, a lighting device, Quot;), and the term terminal or device may be used in combination. A wireless power receiver according to another embodiment may also be mounted on a vehicle, an unmanned aerial vehicle, an air drone or the like.
실시예에 따른 무선 전력 수신기는 적어도 하나의 무선 전력 전송 방식이 구비될 수 있으며, 2개 이상의 무선 전력 송신기로부터 동시에 무선 전력을 수신할 수도 있다. 여기서, 무선 전력 전송 방식은 상기 전자기 유도 방식, 전자기 공진 방식, RF 무선 전력 전송 방식 중 적어도 하나를 포함할 수 있다. 일반적으로, 무선 전력 시스템을 구성하는 무선 전력 송신기와 무선 전력 수신기는 인밴드 통신 또는 BLE(Bluetooth Low Energy) 통신을 통해 제어 신호 또는 정보를 교환할 수 있다. 여기서, 인밴드 통신, BLE 통신은 펄스 폭 변조(Pulse Width Modulation) 방식, 주파수 변조 방식, 위상 변조 방식, 진폭 변조 방식, 진폭 및 위상 변조 방식 등으로 수행될 수 있다. 일 예로, 무선 전력 수신기는 수신 코일을 통해 유도된 전류를 소정 패턴으로 ON/OFF 스위칭하여 궤환 신호(feedback signal)를 생성함으로써 무선 전력 송신기에 각종 제어 신호 및 정보를 전송할 수 있다. 무선 전력 수신기에 의해 전송되는 정보는 수신 전력 세기 정보를 포함하는 다양한 상태 정보를 포함할 수 있다. 이때, 무선 전력 송신기는 수신 전력 세기 정보에 기반하여 충전 효율 또는 전력 전송 효율을 산출할 수 있다.A wireless power receiver according to an embodiment may include at least one wireless power transmission scheme and may receive wireless power from two or more wireless power transmitters at the same time. Here, the wireless power transmission scheme may include at least one of the electromagnetic induction scheme, the electromagnetic resonance scheme, and the RF wireless power transmission scheme. Generally, a wireless power transmitter and a wireless power receiver that constitute a wireless power system can exchange control signals or information through in-band communication or Bluetooth low energy (BLE) communication. Here, the in-band communication and the BLE communication can be performed by a pulse width modulation method, a frequency modulation method, a phase modulation method, an amplitude modulation method, an amplitude and phase modulation method, and the like. For example, the wireless power receiver can transmit various control signals and information to the wireless power transmitter by generating a feedback signal by switching on / off the current induced through the reception coil in a predetermined pattern. The information transmitted by the wireless power receiver may include various status information including received power intensity information. At this time, the wireless power transmitter can calculate the charging efficiency or the power transmission efficiency based on the received power intensity information.
도 2은 실시예에 따른 무선 충전 시스템을 설명하기 위한 블록도이다.2 is a block diagram illustrating a wireless charging system according to an embodiment.
도 2을 참조하면, 무선 충전 시스템은 크게 무선으로 전력을 송출하는 무선 전력 송신단(10), 상기 송출된 전력을 수신하는 무선 전력 수신단(20) 및 수신된 전력을 공급 받는 전자기기(30)로 구성될 수 있다.Referring to FIG. 2, the wireless charging system includes a wireless power transmitter 10 for transmitting power wirelessly, a wireless power receiver 20 for receiving the transmitted power, and an electronic device 30 Lt; / RTI >
일 예로, 무선 전력 송신단(10)과 무선 전력 수신단(20)은 무선 전력 전송에 사용되는 동작 주파수와 동일한 주파수 대역을 이용하여 정보를 교환하는 인밴드(In-band) 통신을 수행할 수 있다. 다른 일예로, 무선 전력 송신단(10)과 무선 전력 수신단(20)은 무선 전력 전송에 사용되는 동작 주파수와 상이한 별도의 주파수 대역을 이용하여 정보를 교환하는 대역외(Out-of-band) 통신을 수행할 수도 있다.For example, the wireless power transmitting terminal 10 and the wireless power receiving terminal 20 can perform in-band communication in which information is exchanged using the same frequency band as that used for wireless power transmission. In another example, the wireless power transmitting terminal 10 and the wireless power receiving terminal 20 perform out-of-band communication in which information is exchanged using a different frequency band different from the operating frequency used for wireless power transmission .
일 예로, 무선 전력 송신단(10)과 무선 전력 수신단(20) 사이에 교환되는 정보는 서로의 상태 정보뿐만 아니라 제어 정보도 포함될 수 있다. 여기서, 송수신단 사이에 교환되는 상태 정보 및 제어 정보는 후술할 실시예들의 설명을 통해 보다 명확해질 것이다.For example, information exchanged between the wireless power transmitting terminal 10 and the wireless power receiving terminal 20 may include control information as well as status information of each other. Here, the status information and the control information exchanged between the transmitting and receiving end will become more apparent through the description of the embodiments to be described later.
상기 인밴드 통신 및 대역외 통신은 양방향 통신을 제공할 수 있으나, 이에 한정되지않으며, 다른 실시예에 있어서는 단방향 통신 또는 반이중 방식의 통신을 제공할 수도 있다.The in-band communication and the out-of-band communication may provide bidirectional communication, but the present invention is not limited thereto. In another embodiment, the in-band communication and the out-of-band communication may be provided.
일 예로, 단방향 통신은 무선 전력 수신단(20)이 무선 전력 송신단(10)으로만 정보를 전송하는 것일 수 있으나, 이에 한정되지는 않으며, 무선 전력 송신단(10)이 무선 전력 수신단(20)으로 정보를 전송하는 것일 수도 있다.For example, the unidirectional communication may be that the wireless power receiving terminal 20 transmits information only to the wireless power transmitting terminal 10, but the present invention is not limited thereto, and the wireless power transmitting terminal 10 may transmit information Lt; / RTI >
반이중 통신 방식은 무선 전력 수신단(20)과 무선 전력 송신단(10) 사이의 양방향 통신은 가능하나, 어느 한 시점에 어느 하나의 장치에 의해서만 정보 전송이 가능한 특징이 있다. In the half duplex communication mode, bidirectional communication is possible between the wireless power receiving terminal 20 and the wireless power transmitting terminal 10, but information can be transmitted only by any one device at any time.
실시예에 따른 무선 전력 수신단(20)은 전자 기기(30)의 각종 상태 정보를 획득할 수도 있다. 일 예로, 전자 기기(30)의 상태 정보는 현재 전력 사용량 정보, 실행중인 응용을 식별하기 위한 정보, CPU 사용량 정보, 배터리 충전 상태 정보, 배터리 출력 전압/전류 정보 등을 포함할 수 있으나, 이에 한정되지는 않으며, 전자 기기(30)로부터 획득 가능하고, 무선 전력 제어에 활용 가능한 정보이면 족하다. The wireless power receiving terminal 20 according to the embodiment may acquire various status information of the electronic device 30. [ For example, the status information of the electronic device 30 may include current power usage information, information for identifying a running application, CPU usage information, battery charge status information, battery output voltage / current information, And is information obtainable from the electronic device 30 and available for wireless power control.
도 3는 실시예에 따른 무선 전력 송신기의 구조를 설명하기 위한 블록도이다.3 is a block diagram illustrating a structure of a wireless power transmitter according to an embodiment.
도 3를 참조하면 무선 전력 송신기(200)는 크게, 전력 변환부(210), 전력 전송부(220), 통신부(230), 제어부(240), 센싱부(250)를 포함하여 구성될 수 있다. 상기한 무선 전력 송신기(200)의 구성은 반드시 필수적인 구성은 아니어서, 그보다 많거나 적은 구성 요소를 포함하여 구성될 수도 있음을 주의해야 한다.3, the wireless power transmitter 200 may include a power conversion unit 210, a power transmission unit 220, a communication unit 230, a control unit 240, and a sensing unit 250 . It should be noted that the configuration of the wireless power transmitter 200 described above is not necessarily an essential configuration, and may be configured to include more or less components.
도 3에 도시된 바와 같이, 전력 변환부(210)는 전원부(260)로부터 전원이 공급되면, 이를 소정 세기의 전력으로 변환하는 기능을 수행할 수 있다.As shown in FIG. 3, when power is supplied from the power supply unit 260, the power conversion unit 210 can convert the power to a predetermined intensity.
이를 위해, 전력 변환부(210)는 전원부(260)로부터 공급된 전력을 무선 송신용 전력으로 변환할 수 있다. To this end, the power conversion unit 210 may convert the power supplied from the power supply unit 260 into the power for wireless transmission.
전력 전송부(220)는 다중화기(221)(또는 멀티플렉서), 송신 코일(222)을 포함하여 구성될 수 있다. 또한, 전력 전송부(220)는 전력 전송을 위한 특정 동작 주파수를 생성하기 위한 반송파 생성기(미도시)를 포함할 수도 있다.The power transmission unit 220 may be configured to include a multiplexer 221 (or a multiplexer) and a transmission coil 222. [ In addition, the power transmitting unit 220 may include a carrier generator (not shown) for generating a specific operating frequency for power transmission.
도 3에 도시된 바와 같이, 전력 전송부(220)는 전력변환부(210)의 출력 전력이 송신 코일에 전달되는 것을 제어하기 위한 다중화기(221)와 복수의 송신 코일(222)-즉, 제1 내지 제n 송신 코일-을 포함하여 구성될 수 있다.3, the power transmission unit 220 includes a multiplexer 221 and a plurality of transmission coils 222 for controlling the output power of the power conversion unit 210 to be transmitted to the transmission coil, that is, And first through n-th transmission coils.
실시예에 따른 제어부(240)는 복수의 무선 전력 수신기가 연결된 경우, 송신 코일 별 시분할 다중화를 통해 전력을 전송할 수도 있다. 예를 들어, 무선 전력 송신기(200)에 3개의 무선 전력 수신기-즉, 제1 내지 3 무선 전력 수신기-가 각각 3개의 서로 다른 송신 코일-즉, 제1 내지 3 송신 코일-을 통해 식별된 경우, 제어부(240)는 다중화기(221)를 제어하여, 특정 타임 슬롯에 특정 송신 코일을 통해 전력이 송출될 수 있도록 제어할 수 있다. 이때, 송신 코일 별 할당된 타임 슬롯의 길이에 따라 해당 무선 전력 수신기로 전송되는 전력의 양이 제어될 수 있으나, 이는 하나의 실시예에 불과하며, 다른 일 예는 송신 코일 별 할당된 타임 슬롯 동안의 증폭기(212) 증폭률을 제어하여 무선 전력 수신기 별 송출 전력을 제어할 수도 있다.The controller 240 according to the embodiment may transmit power through time division multiplexing for each transmission coil when a plurality of wireless power receivers are connected. For example, if the wireless power transmitter 200 has three wireless power receivers-i. E., The first through third wireless power receivers, respectively, identified through three different transmit coils, i. E. First through third transmit coils , The control unit 240 controls the multiplexer 221 so that power can be transmitted through a specific transmission coil in a specific time slot. At this time, the amount of power transmitted to the corresponding wireless power receiver can be controlled according to the length of the time slot allocated for each transmission coil, but this is only one embodiment. The amplification rate of the amplifier 212 of the wireless power receiver may be controlled to control the transmission power of each wireless power receiver.
제어부(240)는 제1차 감지 신호 송출 절차 동안 제1 내지 제n 송신 코일(222)을 통해 감지 신호가 순차적으로 송출될 수 있도록 다중화기(221)를 제어할 수 있다. The control unit 240 may control the multiplexer 221 so that the detection signals may be sequentially transmitted through the first through n'th transmit coils 222 during the first differential sense signal transmission procedure.
또한, 제어부(240)는 제1차 감지 신호 송출 절차 동안 복조부(232)로부터 어느 송신 코일을 통해 신호 세기 지시자(Signal Strength Indicator)가 수신되었는지를 식별하기 위한 소정 송신 코일 식별자 및 해당 송신 코일을 통해 수신된 신호 세기 지시자를 수신할 수 있다. 연이어, 제2차 감지 신호 송출 절차에서 제어부(240)는 제1차 감지 신호 송출 절차 동안 신호 세기 지시자가 수신된 송신 코일(들)을 통해서만 감지 신호가 송출될 수 있도록 다중화기(221)를 제어할 수도 있다. 다른 일 예로, 제어부(240)는 제1차 감지 신호 송출 절차 동안 신호 세기 지시자가 수신된 송신 코일이 복수개인 경우, 가장 큰 값을 갖는 신호 세기 지시자가 수신된 송신 코일을 제2차 감지 신호 송출 절차에서 감지 신호를 가장 먼저 송출할 송신 코일로 결정하고, 결정 결과에 따라 다중화기(221)를 제어할 수도 있다. In addition, the control unit 240 transmits a predetermined transmission coil identifier for identifying a signal strength indicator (Signal Strength Indicator) through a transmission coil from the demodulation unit 232 during the first detection signal transmission procedure, Lt; / RTI > received signal strength indicator. In the second sensing signal sending process, the controller 240 controls the multiplexer 221 so that the signal strength indicator can be transmitted only through the transmitting coil (s) You may. In another example, when there are a plurality of transmit coils in which the signal strength indicator is received during the first differential sense signal transmission procedure, the control unit 240 transmits the transmit coil, which receives the signal strength indicator having the largest value, In the procedure, the detection signal may be determined as a transmission coil to be transmitted first, and the multiplexer 221 may be controlled according to the determination result.
변조부(231)는 제어부(240)에 의해 생성된 제어 신호를 변조하여 다중화기(221)에 전달할 수 있다. 여기서, 제어 신호를 변조하기 위한 변조 방식은 FSK(Frequency Shift Keying) 변조 방식, 맨체스터 코딩(Manchester Coding) 변조 방식, PSK(Phase Shift Keying) 변조 방식, 펄스 폭 변조(Pulse Width Modulation) 방식, 차등 2단계(Differential bi-phase) 변조 방식 등을 포함할 수 있으나, 이에 한정되지는 않는다.The modulator 231 may modulate the control signal generated by the controller 240 and transmit the modulated control signal to the multiplexer 221. Here, the modulation scheme for modulating the control signal includes a frequency shift keying (FSK) modulation scheme, a Manchester coding modulation scheme, a phase shift keying (PSK) modulation scheme, a pulse width modulation scheme, A differential bi-phase modulation method, and the like.
복조부(232)는 송신 코일을 통해 수신되는 신호가 감지되면, 감지된 신호를 복조하여 제어부(240)에 전송할 수 있다. 여기서, 복조된 신호에는 신호 세기 지시자, 무선 전력 전송 중 전력 제어를 위한 오류 정정(EC: Error Correction) 지시자, 충전 완료(EOC: End Of Charge) 지시자, 과전압/과전류/과열 지시자 등이 포함될 수 있으나, 이에 한정되지는 않으며, 무선 전력 수신기의 상태를 식별하기 위한 각종 상태 정보가 포함될 수 있다.The demodulator 232 can demodulate the detected signal and transmit the demodulated signal to the controller 240 when a signal received through the transmission coil is detected. Here, the demodulated signal may include a signal strength indicator, an error correction (EC) indicator for power control during wireless power transmission, an end of charge indicator (EOC), an overvoltage / overcurrent / overheat indicator, But is not limited to, various status information for identifying the status of the wireless power receiver.
또한, 복조부(232)는 복조된 신호가 어느 송신 코일로부터 수신된 신호인지를 식별할 수 있으며, 식별된 송신 코일에 상응하는 소정 송신 코일 식별자를 제어부(240)에 제공할 수도 있다. The demodulating unit 232 may identify which of the transmitting coils the demodulated signal is received and may provide the controlling unit 240 with a predetermined transmitting coil identifier corresponding to the identified transmitting coil.
일 예로, 무선 전력 송신기(200)는 무선 전력 전송에 사용되는 동일한 주파수를 이용하여 무선 전력 수신기와 통신을 수행하는 인밴드(In-Band) 통신을 통해 상기 신호 세기 지시자를 획득할 수 있다.In one example, the wireless power transmitter 200 may obtain the signal strength indicator through in-band communication that uses the same frequency used for wireless power transmission to communicate with the wireless power receiver.
또한, 무선 전력 송신기(200)는 송신 코일(222)을 이용하여 무선 전력을 송출할 수 있을 뿐만 아니라 송신 코일(222)을 통해 무선 전력 수신기와 각종 정보를 교환할 수도 있다. 다른 일 예로, 무선 전력 송신기(200)는 송신 코일(222)-즉, 제1 내지 제n 송신 코일)에 각각 대응되는 별도의 코일을 추가로 구비하고, 구비된 별도의 코일을 이용하여 무선 전력 수신기와 인밴드 통신을 수행할 수도 있음을 주의해야 한다.In addition, the wireless power transmitter 200 can transmit wireless power using the transmit coil 222, as well as exchange various information with the wireless power receiver through the transmit coil 222. [ In another example, the wireless power transmitter 200 may further include a separate coil corresponding to each of the transmit coil 222 (i.e., first to n < th > transmit coils) It should be noted that it may also perform in-band communication with the receiver.
이상이 도 3의 설명에서는 무선 전력 송신기(200)와 무선 전력 수신기가 인밴드 통신을 수행하는 것을 예를 들어 설명하고 있으나, 이는 하나의 실시예에 불과하며, 무선 전력 신호 전송에 사용되는 주파수 대역과 상이한 주파수 대역을 통해 근거리 양방향 통신을 수행할 수 있다. 일 예로, 근거리 양방향 통신은 저전력 블루투스 통신, RFID 통신, UWB 통신, 지그비 통신 중 어느 하나일 수 있다.In the description of FIG. 3, the wireless power transmitter 200 and the wireless power receiver perform in-band communication. However, the wireless power transmitter 200 and the wireless power receiver use only the frequency band Directional communication through different frequency bands. For example, the near-end bi-directional communication may be any one of low-power Bluetooth communication, RFID communication, UWB communication, and Zigbee communication.
도 4은 상기 도 3에 따른 무선 전력 송신기와 연동되는 무선 전력 수신기의 구조를 설명하기 위한 블록도이다.4 is a block diagram illustrating a structure of a wireless power receiver interworking with the wireless power transmitter of FIG.
도 4을 참조하면, 무선 전력 수신기(300)는 수신 코일(310), 정류기(320), 직류/직류 변환기(DC/DC Converter, 330), 부하(340), 통신부(360), 주제어부(370)를 포함하여 구성될 수 있다. 여기서, 통신부(360)는 복조부(361) 및 변조부(362) 중 적어도 하나를 포함하여 구성될 수 있다. 4, the wireless power receiver 300 includes a receiving coil 310, a rectifier 320, a DC / DC converter 330, a load 340, a communication unit 360, 370). Here, the communication unit 360 may include at least one of a demodulation unit 361 and a modulation unit 362.
상기한 도 4의 예에 도시된 무선 전력 수신기(300)는 인밴드 통신을 통해 무선 전력 송신기와 정보를 교환할 수 있는 것으로 도시되어 있으나, 이는 하나의 실시예에 불과하며, 다른 일 실시예에 따른 통신부(360)는 무선 전력 신호 전송에 사용되는 주파수 대역과는 상이한 주파수 대역을 통해 근거리 양방향 통신을 제공할 수도 있다. Although the wireless power receiver 300 shown in the example of FIG. 4 is shown as being capable of exchanging information with a wireless power transmitter through in-band communication, this is only one embodiment, and in another embodiment The communication unit 360 may provide short-range bidirectional communication through a frequency band different from the frequency band used for wireless power signal transmission.
수신 코일(310)을 통해 수신되는 AC 전력은 정류부(320)에 전달할 수 있다. 정류기(320)는 AC 전력을 DC 전력으로 변환하여 직류/직류 변환기(330)에 전송할 수 있다. 직류/직류 변환기(330)는 정류기 출력 DC 전력의 세기를 부하(340)에 의해 요구되는 특정 세기로 변환한 후 부하(340)에 전달할 수 있다. 또한 수신 코일(310)은 복수의 수신 코일(미도시)-즉, 제1 내지 제n 수신 코일-을 포함하여 구성될 수 있다. 일 실시예에 따른 각각의 수신 코일(미도시)에 전달되는 AC 전력의 주파수가 서로 상이할 수도 있고, 다른 일 실시예는 LC 공진 특성을 수신 코일마다 상이하게 조절하는 기능이 구비된 소정 주파수 제어기를 이용하여 각각의 수신 코일 별 공진주파수를 상이하게 설정할 수도 있다.AC power received through the receiving coil 310 may be transmitted to the rectifying unit 320. The rectifier 320 may convert the AC power to DC power and transmit it to the DC / DC converter 330. The DC / DC converter 330 may convert the intensity of the rectifier output DC power to a specific intensity required by the load 340 and then deliver it to the load 340. Also, the receiving coil 310 may include a plurality of receiving coils (not shown), that is, first through n-th receiving coils. The frequency of the AC power transmitted to each of the reception coils (not shown) according to an embodiment may be different from each other, and another embodiment may include a predetermined frequency controller having a function of adjusting LC resonance characteristics for different reception coils The resonance frequencies of the respective reception coils can be set differently.
센싱부(350)는 정류기(320) 출력 DC 전력의 세기를 측정하고, 이를 주제어부(370)에 제공할 수 있다. 또는, 센싱부(350)는 무선 전력 수신에 따라 수신 코일(310)에 인가되는 전류의 세기를 측정하고, 측정 결과를 주제어부(370)에 전송할 수도 있다. The sensing unit 350 may measure the intensity of the DC power output from the rectifier 320 and may provide the measured DC power to the main control unit 370. Alternatively, the sensing unit 350 may measure the intensity of the current applied to the reception coil 310 according to the wireless power reception, and may transmit the measurement result to the main control unit 370.
일 예로, 센싱부(350)는 무선 전력 수신기(300)의 내부 온도를 측정하고, 측정된 온도 값을 주제어부(370)에 제공할 수도 있다. For example, the sensing unit 350 may measure the internal temperature of the wireless power receiver 300 and provide the measured temperature value to the main control unit 370.
일 예로, 주제어부(370)는 측정된 정류기 출력 DC 전력의 세기가 소정 기준치와 비교하여 과전압 발생 여부를 판단할 수 있다. 판단 결과, 과전압이 발생된 경우, 과전압이 발생되었음을 알리는 소정 패킷을 생성하여 변조부(362)에 전송할 수 있다. 여기서, 변조부(362)에 의해 변조된 신호는 수신 코일(310) 또는 별도의 코일(미도시)을 통해 무선 전력 송신기에 전송될 수 있다. 또한, 주제어부(370)는 정류기 출력 DC 전력의 세기가 소정 기준치 이상인 경우, 감지 신호가 수신된 것으로 판단할 수 있으며, 감지 신호 수신 시, 해당 감지 신호에 대응되는 신호 세기 지시자가 변조부(362)를 통해 무선 전력 송신기에 전송될 수 있도록 제어할 수 있다. 다른 일 예로, 복조부(361)는 수신 코일(310)과 정류기(320) 사이의 AC 전력 신호 또는 정류기(320) 출력 DC 전력 신호를 복조하여 감지 신호의 수신 여부를 식별한 후 식별 결과를 주제어부(370)에 제공할 수 있다. 이때, 주제어부(370)는 감지 신호에 대응되는 신호 세기 지시자가 변조부(362)를 통해 전송될 수 있도록 제어할 수 있다.For example, the main controller 370 may compare the measured rectifier output DC power with a predetermined reference value to determine whether an overvoltage is generated. As a result of the determination, if an overvoltage occurs, a predetermined packet indicating that an overvoltage has occurred can be generated and transmitted to the modulator 362. Here, the signal modulated by the modulating unit 362 may be transmitted to the wireless power transmitter through the receiving coil 310 or a separate coil (not shown). The main control unit 370 may determine that the sensing signal is received when the intensity of the rectifier output DC power is equal to or greater than a predetermined reference value. When receiving the sensing signal, the signal intensity indicator corresponding to the sensing signal is received by the modulating unit 362 To be transmitted to the wireless power transmitter. The demodulation unit 361 demodulates the AC power signal between the reception coil 310 and the rectifier 320 or the DC power signal output from the rectifier 320 to identify whether or not the detection signal is received, (370). At this time, the main control unit 370 can control the signal strength indicator corresponding to the detection signal to be transmitted through the modulator 362. [
도 5는 실시예에 따른 무선전력수신기를 도시한다. 5 shows a wireless power receiver according to an embodiment.
이하의 도 5의 설명에서 도 6 내지 도 14에 도시된 구성 요소가 설명되는 경우, 해당 도면에 도시된 구성 요소의 도면부호가 명기된다. In the following description of FIG. 5, when the components shown in FIGS. 6 to 14 are described, reference numerals of the components shown in the drawings are specified.
실시예에 따른 무선전력수신기는 도 2에 도시된 무선전력수신기(20)이거나 도 4에 도시된 무선전력수신기(300)일 수 있다. The wireless power receiver according to an embodiment may be the wireless power receiver 20 shown in FIG. 2 or the wireless power receiver 300 shown in FIG.
실시예에 따른 무선전력수신기는 휴대폰(mobile phone), 스마트폰(smart phone), 노트북 컴퓨터(laptop computer), 디지털방송용 단말기, PDA(Personal Digital Assistants), PMP(Portable Multimedia Player), 네비게이션, MP3 player, 전동 칫솔, 전자 태그, 조명 장치, 리모콘, 낚시찌 등의 소형 전자 기기 등에 사용될 수 있으나, 이에 한정하지 않는다. 실시예에 따른 무선전력수신기가 장착되어 배터리 충전이 가능한 어떠한 기기에도 사용 가능하다. 예컨대, 실시예에 따른 무선전력수신기는 차량, 무인 항공기, 에어 드론 등에도 탑재될 수 있다. The wireless power receiver according to the embodiment may be a mobile phone, a smart phone, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player) , An electric toothbrush, an electronic tag, a lighting device, a remote control, a small electronic device such as a fishing rod, but is not limited thereto. The wireless power receiver according to the embodiment can be mounted and used in any device capable of charging the battery. For example, the wireless power receiver according to the embodiment may be mounted on a vehicle, an unmanned aerial vehicle, an air drone or the like.
도 5를 참조하면, 실시예에 따른 무선전력수신기는 메인 기판(501)과 메인 기판(501) 상에 배치되는 무선충전코일모듈(400)을 포함하여 구성될 수 있다. 여기서 무선충전코일모듈(400)은 제1 실시예에 따른 무선충전코일모듈(도 6)을 의미하지만, 제2 실시예에 따른 무선충전코일모듈(400A, 도 13) 또한 실시예에 따른 무선전력수신기에 채택될 수 있다. 5, a wireless power receiver according to an embodiment of the present invention may include a main board 501 and a wireless charging coil module 400 disposed on the main board 501. 6) according to the first embodiment, but the wireless charging coil module 400A (FIG. 13) according to the second embodiment also corresponds to the wireless power Receiver.
예를 들어, 메인 기판(501)은 휴대폰(mobile phone)의 내부에 구비된 회로 기판일 수 있다.For example, the main board 501 may be a circuit board provided inside a mobile phone.
메인 기판(501)의 일측에 제2 커넥터(503)가 구비될 수 있다. 무선충전코일모듈(400)은 연결 기판(430)을 포함할 수 있다. 연결 기판(430)의 일측에 제1 커넥터(437)가 구비될 수 있다. 연결 기판(430)은 무선충전코일모듈(400)의 코일부(403)을 메인 기판(501)에 연결시켜줄 수 있다. And a second connector 503 may be provided on one side of the main board 501. The wireless charging coil module 400 may include a connection board 430. A first connector 437 may be provided on one side of the connection board 430. The connection board 430 may connect the coil part 403 of the wireless charging coil module 400 to the main board 501.
연결 기판(430)은 제1 기판으로 지칭되고, 메인 기판(501)은 제2 기판으로 지칭되고, 이 순서가 뒤바뀔 수도 있다. 예컨대, 무선충전코일모듈(400)의 연결 기판(430)은 메인 기판으로 지칭되고, 메인 기판(501)은 연결 기판으로 지칭될 수 있다. 예컨대, 연결 기판(430)의 제1 커넥터(503)은 제2 커넥터로 지칭되고, 메인 기판(501)의 제2 커넥터(503)은 제1 커넥터로 지칭될 수 있다. The connecting substrate 430 is referred to as a first substrate, the main substrate 501 is referred to as a second substrate, and the order may be reversed. For example, the connection substrate 430 of the wireless charging coil module 400 may be referred to as a main substrate, and the main substrate 501 may be referred to as a connection substrate. For example, the first connector 503 of the connection board 430 may be referred to as a second connector, and the second connector 503 of the main board 501 may be referred to as a first connector.
연결 기판(430) 및 메인 기판(430, 501)은 회로 패턴이 내장된 기판일 수 있다. 구체적으로, 연결 기판(430)은 플렉서블(flexible) 기판이고, 메인 기판(501)은 리지드(rigid) 기판일 수 있지만, 이에 대해서는 한정하지 않는다. 리지드 기판은 가요성이 거의 없는 기판으로서 통상적인 인쇄회로기판일 수 있다. 가요성이란 쉽게 휘고 원래대로 복원될 수 있는 성능을 의미한다. 플렉서블 기판은 리지드 기판보다 가요성이 뛰어난 기판으로서, 예컨대, PI(Polyimide), PC(Polycarbonate), PES(Polyethersulfone), PET(Polyethyleneterephthalate), PEN(Polyethylenenaphthalate), PAR(Polyarylate)이나 복합재료로서 GFRP(Glass Fiber Reinforced Plastic)가 포함된 필름 형태의 기판일 수 있다. The connection board 430 and the main boards 430 and 501 may be boards having circuit patterns built therein. Specifically, the connection substrate 430 is a flexible substrate, and the main substrate 501 may be a rigid substrate, but the present invention is not limited thereto. The rigid substrate may be a conventional printed circuit board as a substrate having little flexibility. Flexibility means performance that can be easily bent and restored to its original state. The flexible substrate is a substrate which is more flexible than the rigid substrate. For example, the flexible substrate may be a substrate made of polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene terephthalate (PEN), polyarylate Glass Fiber Reinforced Plastic).
무선충전코일모듈(400)의 제1 커넥터(437)가 메인 기판(501)의 제2 커넥터(503)에 체결될 수 있다, 제1 커넥터(437)와 제2 커넥터(503)의 체결에 의해 무선충전코일모듈(400)은 메인 기판(501)과 전기적으로 연결될 수 있다. The first connector 437 of the wireless charging coil module 400 can be fastened to the second connector 503 of the main board 501. By fastening the first connector 437 and the second connector 503 The wireless charging coil module 400 may be electrically connected to the main board 501.
메인 기판(501)은 사각 형상을 가지고, 무선충전코일모듈(400)은 라운드 형상을 가지는 것으로 도시되고 있지만, 메인 기판(501)과 무선충전코일모듈(400)은 다양한 형상이 가능하다. Although the main board 501 has a rectangular shape and the wireless charging coil module 400 has a round shape, the main board 501 and the wireless charging coil module 400 can have various shapes.
메인 기판(501)의 사이즈는 적어도 무선충전코일모듈(400)의 사이즈와 다를 수 있다. 메인 기판(501) 중에서 무선충전코일모듈(400)이 배치되지 않는 영역에 도 3에 도시한 바와 같은 정류기(320, 직류/직류 변환기(330) 등과 같은 다양한 회로소자가 구비될 수 있다. 무선 전력이 제2 커넥터(503)와 제1 커넥터(437)를 경유하여 무선충전코일모듈(400)에 의해 수신된 무선 전력이 메인 기판(501)의 정류기(320, 도 4)에 의해 정류된 후, 직류/직류 변환기(330, 도 4)에 의해 직류전력으로 변환된 후 배터리에 충전될 수 있다. The size of the main board 501 may be different from the size of the wireless charging coil module 400 at least. Various circuit elements such as a rectifier 320 and a DC / DC converter 330 as shown in FIG. 3 may be provided in a region where the wireless charging coil module 400 is not disposed in the main board 501. Wireless power After the radio power received by the wireless charging coil module 400 via the second connector 503 and the first connector 437 is rectified by the rectifier 320 (Fig. 4) of the main board 501, DC converter 330 (FIG. 4), and then charged into the battery.
설명되지 않은 도면부호인 409는 필름(이하, 제2 필름이라 함)으로서, 무선충전코일모듈(400)의 내부에 배치되는 구성 요소, 예컨대 코일부(403, 도 6), 차폐부(407, 도 6) 등을 보호할 수 있다. An unexplained reference numeral 409 denotes a film (hereinafter referred to as a second film), and constituent elements such as a coil portion 403 (FIG. 6), shield portions 407, 6) can be protected.
제2 필름(409)를 포함한 차폐부재(405, 407, 409, 도 8)는 일측에 수용부(412, 414, 도 8)가 형성될 수 있다. 수용부(412, 414)는 차폐부재(405, 407, 409)의 상면과 하면이 관통된 개구일 수 있다. 수용부(412, 414)는 차폐부재(405, 407, 409)의 일측면이 내측 방향으로 들어간 홈 일 수 있다. 연결 기판(430)은 차폐부재(405, 407, 409)의 수용부(412, 414)로 삽입되어, 연결 기판(430)의 일측은 코일부(403)의 내측패드(403b, 도 7)와 외측패드(403c, 도 7)에 연결될 수 있다. 연결 기판(430)의 타측, 즉 제1 커넥터(437)이 메인 기판(501)의 제2 커넥터(503)에 연결될 수 있다. 도시되지 않았지만, 차폐부재(405, 407, 409)를 구성하는 각 레이어 또한 수용부(412, 414)가 형성될 수 있다. 각 레이어에 형성된 수용부(412, 414)는 서로 대응될 수 있다. 각 레이어에 형성된 수용부(412, 414)의 사이즈는 상이할 수 있지만, 이에 대해서는 한정하지 않는다. 연결 기판(430)이 제2 필름(409)뿐만 아니라 제2 필름(409) 아래의 차폐부재(405, 407, 409)의 수용부(412, 414)를 통해 코일부(403)의 외측에 배치될 수 있다. 이때 연결 기판(430)의 일부 또는 전체가 코일부(403)와 중첩될 수 있다. 한편, 코일부(403)의 하부에 배치되는 구성 요소, 예를 들어 후술하는 제1 필름(401), 제3 필름(411)은 제2 접착부재(413) 등에는 연결 기판(430)이 삽입될 필요가 없기 때문에 수용부(412, 414)가 형성되지 않을 수 있다. The shielding members 405, 407, 409 (FIG. 8) including the second film 409 may have receiving portions 412, 414 (FIG. 8) formed on one side thereof. The receiving portions 412 and 414 may be openings that penetrate the top and bottom surfaces of the shielding members 405, 407, and 409. The accommodating portions 412 and 414 may be grooves with one side of the shielding members 405, 407 and 409 entering inward. The connecting board 430 is inserted into the receiving portions 412 and 414 of the shielding members 405 and 407 and 409 so that one side of the connecting board 430 is connected to the inner pad 403b May be connected to the outer pad 403c (FIG. 7). The other side of the connection board 430, that is, the first connector 437, may be connected to the second connector 503 of the main board 501. Although not shown, each of the layers constituting the shielding members 405, 407, 409 may also be formed with the receiving portions 412, 414. The receiving portions 412 and 414 formed in the respective layers may correspond to each other. The sizes of the receiving portions 412 and 414 formed in the respective layers may be different, but the present invention is not limited thereto. The connecting board 430 is disposed outside the coil part 403 through the receiving parts 412 and 414 of the shielding members 405, 407 and 409 under the second film 409 as well as the second film 409 . At this time, part or all of the connection board 430 may overlap with the coil part 403. The connection substrate 430 is inserted into the second adhesive member 413 or the like on the components disposed under the coil part 403, for example, the first film 401, the third film 411, The receiving portions 412 and 414 may not be formed.
연결 기판(430)은 제1 방향에 따라 코일부(403)를 가로지르는 제1 연결부(431), 제1 연결부(431)으로부터 제1 방향과 상이한 제2 방향을 따라 연장 형성되는 제2 연결부(433) 및 제2 연결부(433)으로부터 제1 방향을 따라 연장 형성되고 제1 연결부(431)과 나란하게 배치되는 제3 연결부(435)을 포함할 수 있다. 제2 방향은 제1 방향에 수직인 방향일 수 있지만, 이에 대해서는 한정하지 않는다. 제2 연결부(433)은 제1 연결부(431)으로부터 멀어지는 방향을 따라 연장 형성될 수 있다. 제3 연결부(435)은 제1 연결부(431)으로부터 이격되도록 배치될 수 있다. 제1 내지 제3 연결부(431, 433, 435)는 일체로 형성될 수 있다. 즉, 제1 연결부(431)은 제2 연결부(433)와 일체로 형성되고, 제3 연결부(435)는 제2 연결부(433)와 일체로 형성될 수 있다. 제1 내지 제3 연결부(431, 433, 435)은 동일 평면 상에 위치될 수 있다. 제1 내지 제3 연결부(431, 433, 435) 중 제1 및 제2 연결부(431, 432)은 코일부(403)의 내측패드(403b)와 외측패드(403c)에 연결되므로 고정이 가능한데 반해. 제3 연결부(435)은 메인 기판(501)에 체결되기 전까지는 어떠한 고정도 없으므로 어느 방향으로든지 휨이 가능하다. The connection board 430 includes a first connection portion 431 that traverses the coil portion 403 along the first direction, a second connection portion 431 that extends from the first connection portion 431 along a second direction different from the first direction, And a third connection part 435 extending from the second connection part 433 in the first direction and disposed in parallel with the first connection part 431. [ The second direction may be a direction perpendicular to the first direction, but is not limited thereto. The second connection portion 433 may extend along a direction away from the first connection portion 431. [ The third connection portion 435 may be disposed to be spaced apart from the first connection portion 431. The first to third connection portions 431, 433, and 435 may be integrally formed. That is, the first connection part 431 may be integrally formed with the second connection part 433, and the third connection part 435 may be formed integrally with the second connection part 433. [ The first to third connection portions 431, 433, and 435 may be positioned on the same plane. The first and second connection portions 431 and 432 of the first to third connection portions 431 and 433 and 435 are connected to the inner pad 403b and the outer pad 403c of the coil portion 403, . Since the third connection portion 435 is not fixed until it is fastened to the main board 501, it can be bent in any direction.
제3 연결부(435)는 절곡부(434)를 포함할 수 있다. 예컨대, 절곡부(434)는 제2 연결부(433)의 일측으로부터 수직으로 연장된 후 코일부(403)의 내측패드(403b)를 향하는 수평방향으로 연장될 수 있다. 예를 들어, 수평방향은 제1 방향과 반대 방향일 수 있다. 이러한 경우, 절곡부(434)는 제3 연결부(435)에서 수직과 수평이 만나는 지점과 그 주변을 포함하는 영역으로 정의될 수 있다. 절곡부(434)를 통하여 제3 연결부(435)가 코일부(403)의 내측을 향해 연장 배치됨으로써, 공정 자동화에 의한 대량 생산이 가능한 무선충전코일모듈(400) 및 무선충전장치를 제공할 수 있다. 구체적으로 자동화된 커팅 공정이 가능하게 할 수 있다.The third connection portion 435 may include a bent portion 434. For example, the bent portion 434 may extend in the horizontal direction toward the inner pad 403b of the coil portion 403, which extends vertically from one side of the second connection portion 433. For example, the horizontal direction may be opposite to the first direction. In this case, the bent portion 434 may be defined as a region including a point where the vertical and horizontal meet at the third connecting portion 435 and the periphery thereof. The third connection part 435 is extended toward the inside of the coil part 403 through the bent part 434 so that the wireless charging coil module 400 and the wireless charging device capable of mass- have. Specifically, an automated cutting process can be made possible.
연결 기판(430)의 제1 연결부(431)과 제2 연결부(433)이 차폐부재(405, 407, 409)의 수용부(412, 414)에 삽입될 수 있다. 제3 연결부(435)의 일측은 제2 연결부(433)과 연결되고, 제3 연결부(435)의 타측에는 메인 기판(501)의 제2 커넥터(503)과의 전기적인 연결을 위한 제1 커넥터(437)가 구비될 수 있다. The first connection portion 431 and the second connection portion 433 of the connection board 430 can be inserted into the receiving portions 412 and 414 of the shielding members 405, 407, and 409. One end of the third connection part 435 is connected to the second connection part 433 and the other end of the third connection part 435 is connected to the first connector 503 for electrical connection with the second connector 503 of the main board 501. [ (437) may be provided.
이와 달리, 제1 커넥터(437)가 구비되는 연결부가 제4 연결부로 지칭될 수도 있다. 이러한 경우, 제4 연결부는 제3 연결부(435)로부터 수평방향으로 연장되는 끝 지점에 구비될 수 있다. 제3 연결부의 일측은 제3 연결부(435)에서 절곡되어 예컨대, 제2 방향을 따라 연장 형성될 수 있다. 제4 연결부는 제1 커넥터(437)를 포함할 수 있다. 제1 커넥터(437)은 제3 연결부(435)의 끝 지점과 이로부터 제2 방향을 따라 연장 형성된 영역에 배치될 수 있다. 제 4 연결부는 제1 연결부(431)으로부터 멀어지는 방향, 즉 제2 방향을 따라 제3 연결부(435)으로부터 연장 형성될 수 있다. Alternatively, the connection portion provided with the first connector 437 may be referred to as a fourth connection portion. In this case, the fourth connection portion may be provided at an end point extending in the horizontal direction from the third connection portion 435. One side of the third connection part may be bent at the third connection part 435 and extended, for example, along the second direction. The fourth connector may include a first connector 437. The first connector 437 may be disposed at an end point of the third connection part 435 and an area extending from the end point of the third connection part 435 along the second direction. The fourth connection part may extend from the third connection part 435 in a direction away from the first connection part 431, that is, along the second direction.
연결 기판(430)이 제1 내지 제3 연결부(431, 433, 435) 또는 제1 내지 제4 연결부로 구분됨으로써, 하나의 연결 기판(430)을 이용하여 코일부(403)의 내측단자로부터 코일부(403)의 외측으로 전기적인 연결이 가능하도록 하는 브릿지(bridge) 기능과 코일부(403)와 메인 기판(501)을 전기적으로 연결시키기 위한 플렉서블 기능을 동시에 구현될 수 있다. The connection board 430 is divided into the first to third connection portions 431, 433 and 435 or the first to fourth connection portions, A bridge function for enabling electrical connection to the outside of the part 403 and a flexible function for electrically connecting the coil part 403 and the main board 501 can be realized at the same time.
아울러, 연결 기판(430)의 제1 연결부(431)와 제3 연결부(435)이 제2 연결부(433)으로부터 코일부(403)의 내측을 향해 연장 배치됨으로써, 공정 자동화에 의한 대량 생산이 가능한 무선충전코일모듈 및 무선충전장치를 제공할 수 있다. 구체적으로 자동화된 커팅 공정이 가능하게 할 수 있다. 즉, 제1 필름(401) 상에 코일부(403) 및 차폐부재(405, 407, 409)가 배치되고, 연결 기판(430)이 차폐부재(405, 407, 409)의 수용부(412, 414)를 통해 코일부(403)에 인접하여 배치된 후, 제1 필름(401) 및 차폐부재(405, 407, 409)이 소정 모양, 예컨대 원형 형상이 되도록 커팅될 때, 연결 기판(430)의 제1 연결부(431)과 제3 연결부(435)이 제2 연결부(433)으로부터 코일부(403)의 내측을 향해 연장 배치됨으로써 이러한 커팅 공정에 방해되지 않게 된다. 만일 연결 기판(430)의 제1 또는 제3 연결부(431, 435)이 커팅 절취선 외측으로 배치되는 경우, 커팅 공정에 의해 연결 기판(430)의 제1 또는 제3 연결부(431, 435)이 커팅될 수 있다. 이런 형태는 자동화된 생산 공정이 불가능하게 하는 제한 요소로서, 생산성 향상 및 공정비 절감에 저해 요소가 되어 왔다. The first connection part 431 and the third connection part 435 of the connection substrate 430 are extended from the second connection part 433 toward the inside of the coil part 403, A wireless charging coil module and a wireless charging device can be provided. Specifically, an automated cutting process can be made possible. That is, the coil portion 403 and the shielding members 405, 407 and 409 are disposed on the first film 401 and the connecting substrate 430 is fixed to the receiving portions 412, When the first film 401 and the shielding members 405, 407 and 409 are cut so as to have a predetermined shape, for example, a circular shape, the connecting substrate 430, The first connection portion 431 and the third connection portion 435 of the second connection portion 433 extend from the second connection portion 433 toward the inside of the coil portion 403. If the first or third connection portions 431 and 435 of the connection substrate 430 are disposed outside the cutting perforations, the first or third connection portions 431 and 435 of the connection substrate 430 are cut by the cutting process, . This form is a limiting factor that makes automated production processes impossible, and has been an impediment to improving productivity and reducing process costs.
제1 연결부(431)은 코일부(403)를 가로지르는 방향을 따라 길게 형성될 수 있다. 예를 들어, 제1 연결부(431)은 코일부(403)의 권선된 코일들과 수직하는 방향을 따라 길게 배치될 수 있다. 제1 연결부(431)의 길이는 적어도 코일부(403)의 내측패드(403b)와 외측패드(403c) 사이의 길이보다 클 수 있다. The first connection part 431 may be formed long along the direction crossing the coil part 403. For example, the first connection portion 431 may be disposed long along the direction perpendicular to the coiled coils of the coil portion 403. The length of the first connection portion 431 may be greater than the length between the inner pad 403b and the outer pad 403c of the coil portion 403. [
제3 연결부(435)는 제1 연결부(431)으로부터 이격되어 제1 연결부(431)과 평행하게 배치될 수 있다. 이러한 경우, 제2 연결부(433)는 제1 연결부(431)의 끝단과 제3 연결부(435)의 끝단을 연결시켜 줄 수 있다. The third connection portion 435 may be spaced apart from the first connection portion 431 and disposed in parallel with the first connection portion 431. In this case, the second connection portion 433 can connect the end of the first connection portion 431 and the end of the third connection portion 435.
예컨대, 제1 연결부(431)의 일측의 하면은 코일부(403)의 내측패드(403b)에 연결되고, 제2 연결부(433)의 일측의 하면은 코일부(403)의 외측패드(403c)에 연결될 수 있지만, 이에 대해서는 한정하지 않는다. 코일부(403)의 내측패드(403b)는 제1 연결부(41)의 일측 영역과 수직으로 중첩될 수 있다. 코일부(403)의 외측패드(403c)는 제2 연결부(433)의 일측 영역과 수직으로 중첩될 수 있다. 제1 및 제2 연결부(431, 433)은 코일부(403)의 내측패드(403b)와 외측패드(403c)에 연결되어, 연결 기판(430)의 제1 및 제2 연결부(431, 433)이 코일부(403)에 고정될 수 있다. One side of the first connection part 431 is connected to the inner pad 403b of the coil part 403. One side of the second connection part 433 is connected to the outer pad 403c of the coil part 403. [ But it is not limited thereto. The inner pad 403b of the coil portion 403 may be vertically overlapped with one side region of the first connection portion 41. [ The outer pad 403c of the coil portion 403 may be vertically overlapped with one side region of the second connection portion 433. [ The first and second connection portions 431 and 433 are connected to the inner pad 403b and the outer pad 403c of the coil portion 403 to connect the first and second connection portions 431 and 433 of the connection substrate 430, Can be fixed to the coil portion 403.
제3 연결부(435)은 제1 커넥터(437)가 메인 기판(501)의 제2 커넥터(503)에 연결되기 위해 휘어질 수 있다. 즉, 연결 기판(430)의 제2 연결부(433)이 고정되므로, 제3 연결부(435)은 제2 연결부(433)을 기준으로 회전될 수 있다. 연결 기판(430)의 제3 연결부(435)은 코일부(403)의 내측으로부터 코일부(403)의 외측을 향해 회전될 수 있다. 예컨대, 연결 기판(430)의 제3 연결부(435)은 제2 연결부(433)을 기준으로 180° 회전될 수 있다. 제1 커넥터(437)는 제3 연결부(435)의 상면에 배치될 수 있다. The third connector 435 may be bent so that the first connector 437 is connected to the second connector 503 of the main board 501. That is, since the second connection portion 433 of the connection substrate 430 is fixed, the third connection portion 435 can be rotated with respect to the second connection portion 433. The third connection portion 435 of the connection board 430 can be rotated from the inside of the coil portion 403 toward the outside of the coil portion 403. [ For example, the third connection portion 435 of the connection board 430 may be rotated 180 ° with respect to the second connection portion 433. The first connector 437 may be disposed on the upper surface of the third connection portion 435.
따라서, 제3 연결부(435)이 제2 연결부(433)을 기준으로 회전되는 경우, 제1 커넥터(437)가 제3 연결부(435)의 하면에 위치되어 메인 기판(501)의 상면에 배치된 제2 커넥터(503)에 마주보도록 대향된 후, 연결 기판(430)의 제1 커넥터(437)가 메인 기판(501)의 제2 커넥터(503)에 연결될 수 있다. 구체적으로, 제3 연결부(435)는 제2 연결부(433)의 길이 방향, 즉 제2 방향에 따른 축을 기준으로 회전될 수 있다. 제3 연결부(435)의 끝 지점은 제1 연결부(431)과 동일 면 상에 위치되고, 제2 연결부(433)의 제2 방향에 따른 축을 기준으로 회전되는 경우 코일부(403)의 외측에 위치될 수 있다. 메인 기판(501)의 제2 커넥터(503)이 코일부(403)의 외측에 배치되므로, 상기 회전된 제3 연결부(435)의 끝 지점, 즉 제1 커넥터(437)은 메인 기판(501)의 제2 커넥터(503)에 체결될 수 있다.When the third connector 435 is rotated with respect to the second connector 433, the first connector 437 is located on the lower surface of the third connector 435 and is disposed on the upper surface of the main board 501 The first connector 437 of the connection board 430 may be connected to the second connector 503 of the main board 501 after being faced to face the second connector 503. Specifically, the third connection portion 435 may be rotated about the axis of the second connection portion 433 in the longitudinal direction, that is, the second direction. An end point of the third connection portion 435 is located on the same plane as the first connection portion 431 and is located on the outer side of the coil portion 403 when rotated about the axis of the second connection portion 433 in the second direction Lt; / RTI > The second connector 503 of the main board 501 is disposed outside the coil part 403 so that the end point of the rotated third connection part 435, that is, the first connector 437, The second connector 503 of the second connector 503 can be fastened.
도시되지 않았지만, 연결 기판(430)의 제1 커넥터(437)는 메인 기판(501)의 제2 커넥터(503)로부터 탈착될 수도 있다. 예컨대, 연결 기판(430)의 제1 커넥터(437)는 움푹 들어간 암 커넥터이고, 메인 기판(501)의 제2 커넥터(503)는 외부로 돌출되는 수 커넥터일 수 있지만, 이에 대해서는 한정하지 않는다. 메인 기판(501)의 수 커넥터(503)가 연결 기판(430)의 암 커넥터(437)에 삽입될 수 있다. 메인 기판(501)의 수 커넥터(503)가 연결 기판(430)의 암 커넥터(437)로부터 임의로 탈착되지 않도록 고정용 핀이 메인 기판(501)의 수 커넥터(503) 주변에 구비될 수도 있다. Although not shown, the first connector 437 of the connection board 430 may be detached from the second connector 503 of the main board 501. For example, the first connector 437 of the connection board 430 is a recessed female connector, and the second connector 503 of the main board 501 may be a male connector protruding to the outside, but the present invention is not limited thereto. The male connector 503 of the main board 501 can be inserted into the female connector 437 of the connecting board 430. [ A fixing pin may be provided around the male connector 503 of the main board 501 so that the male connector 503 of the main board 501 is not arbitrarily detached from the female connector 437 of the connecting board 430. [
제1 연결부(431)와 제3 연결부(435)는 서로 상이한 길이를 가질 수 있다. 예를 들어, 제1 연결부(431)의 길이는 제3 연결부(435)의 길이보다 길 수 있다. 제1 연결부(431)는 코일부(403)의 내측패드(403 b)와 외측패드(403c) 사이의 길이에 의존하는데 반해, 제3 연결부(435)는 제3 연결부(435)의 제1 커넥터(437)와 메인 기판(501)의 제2 커넥터(503)의 이격거리에 의존할 수 있다. 코일부(403)의 내측패드(403 b)와 외측패드(403c) 사이의 길이가 줄어들수록 제1 연결부(431)의 길이 또한 줄어들 수 있다. 제3 연결부(435)의 제1 커넥터(437)와 메인 기판(501)의 제2 커넥터(503)의 이격거리가 줄어들수록 제3 연결부(435)의 길이 또한 줄어들 수 있다. The first connection portion 431 and the third connection portion 435 may have different lengths from each other. For example, the length of the first connection part 431 may be longer than the length of the third connection part 435. The third connection part 431 is connected to the first connection part 435 of the third connection part 435 and the third connection part 435 is connected to the second connection part 435 of the third connection part 435. The first connection part 431 depends on the length between the inner pad 403b and the outer pad 403c of the coil part 403, And the distance between the first connector 437 and the second connector 503 of the main board 501. [ The length of the first connection part 431 can be reduced as the length between the inner pad 403b and the outer pad 403c of the coil part 403 is reduced. The length of the third connection part 435 can be reduced as the distance between the first connector 437 of the third connection part 435 and the second connector 503 of the main board 501 is reduced.
실시예에 따라, 제1 연결부(431)와 제2 연결부(433)는 서로 상이한 두께를 가질 수 있다. According to the embodiment, the first connection portion 431 and the second connection portion 433 may have different thicknesses from each other.
실시예에 따라, 제1 연결부(431)의 두께는 제2 연결부(433)의 두께보다 작을 수 있다. The thickness of the first connection portion 431 may be smaller than the thickness of the second connection portion 433. [
실시예에 따라, 제1 연결부(431)의 두께와 제3 연결부(435)의 두께는 실질적으로 동일 할 수 있다. According to the embodiment, the thickness of the first connection portion 431 and the thickness of the third connection portion 435 may be substantially the same.
실시예에 따라, 제1 연결부(431)의 두께와 제3 연결부(435)의 가장자리의 두께는 동일 할 수 있다.The thickness of the first connection portion 431 and the thickness of the edge of the third connection portion 435 may be the same.
실시예에 따라, 제1 연결부(431)의 두께와 제3 연결부(435)의 중앙영역의 두께는 상이할 수 있다.According to the embodiment, the thickness of the first connection portion 431 may be different from the thickness of the central region of the third connection portion 435.
실시예에 따라, 제1 연결부(431)의 두께는 제3 연결부(435)의 중앙영역의 두께보다 작을 수 있다. The thickness of the first connection portion 431 may be smaller than the thickness of the central region of the third connection portion 435. [
실시예에 따라, 제1 연결부(431)와 제2 연결부(433)는 서로 상이한 폭을 가질 수 있다. According to the embodiment, the first connection portion 431 and the second connection portion 433 may have different widths from each other.
실시예에 따라, 제1 연결부(431)의 폭은 제2 연결부(433)의 폭보다 작을 수 있다. According to an embodiment, the width of the first connection portion 431 may be smaller than the width of the second connection portion 433.
실시예에 따라, 제1 연결부(431)와 제3 연결부(435)는 서로 상이한 폭을 가질 수 있다. According to the embodiment, the first connection portion 431 and the third connection portion 435 may have different widths from each other.
실시예에 따라, 제1 연결부(431)의 폭은 제3 연결부(435)는 폭보다 작을 수 있다.According to an embodiment, the width of the first connection portion 431 may be smaller than the width of the third connection portion 435.
도 5에서 미설명부호 505a, 505b는 제1 및 제2 연결단자를 나타내는 것으로서, 연결 기판(430)의 제1 커넥터(437)와 메인 기판(501)의 제2 커넥터(503)의 체결시 연결 기판(430)의 제1 커넥터(437)의 제1 및 제2 접촉부(439a, 439b)에 연결될 수 있다. 5, reference numerals 505a and 505b denote first and second connection terminals. When the first connector 437 of the connection board 430 is connected to the second connector 503 of the main board 501, And may be connected to the first and second contact portions 439a and 439b of the first connector 437 of the substrate 430. [
이하에서 제1 실시예에 따른 무선충전코일모듈(400)을 도 6내지 도 10를 참조하여 상세히 설명한다. Hereinafter, the wireless charging coil module 400 according to the first embodiment will be described in detail with reference to FIGS. 6 to 10. FIG.
도 6은 제1 실시예에 따른 무선충전코일모듈을 도시한 사시도이고, 도 7은 제1 실시예에 따른 무선충전코일모듈에서 코일부에서 내려다본 모습을 보여주고, 도 8은 제1 실시예에 따른 무선충전코일모듈에서 코일부 상에 배치된 차폐부재를 도시한 사시도일 수 있다. 도 9는 제1 실시예에 따른 무선충전코일모듈에서 코일부 상에 배치된 차폐부재의 수용부의 형성위치를 도시하며, 도 10는 제1 실시예에 따른 무선충전코일모듈의 연결 기판을 도시한 사시도이다.FIG. 6 is a perspective view illustrating a wireless charging coil module according to the first embodiment, FIG. 7 is a bottom view of the wireless charging coil module according to the first embodiment, and FIG. And FIG. 5 is a perspective view illustrating a shielding member disposed on the coil part in the wireless charging coil module according to the first embodiment of the present invention. FIG. 9 is a view showing a forming position of a receiving portion of a shielding member disposed on the coil portion in the wireless charging coil module according to the first embodiment, and FIG. 10 is a view showing a connecting substrate of the wireless charging coil module according to the first embodiment It is a perspective view.
도 5 내지 도 10를 참조하면, 제1 실시예에 따른 무선충전코일모듈(400)에 따르면, 제1 필름(401)이 제공될 수 있다. 제1 필름(401)은 코일부(403)를 보호하거나 지지하는데 사용될 수 있다. 예를 들어, 제1 필름(401)은 보호필름 또는 지지필름 일 수 있다. 또는 제1 필름(401)은 보호기판 또는 지지기판 일 수 있다. 제1 필름(401)은 투명한 폴리이미드(PI: polyimide) 수지를 포함할 수 있지만, 이에 대해서는 한정하지 않는다. Referring to FIGS. 5 to 10, according to the wireless charging coil module 400 according to the first embodiment, a first film 401 may be provided. The first film 401 can be used to protect or support the coil part 403. [ For example, the first film 401 may be a protective film or a supporting film. Or the first film 401 may be a protective substrate or a supporting substrate. The first film 401 may include, but is not limited to, a transparent polyimide (PI) resin.
제1 실시예에 따른 무선충전코일모듈(400)에 따르면, 코일부(403)가 제공될 수 있다. 코일부(403)는 제1 필름(401)의 상면에 배치될 수 있다. 코일부(403)는 압연 공정으로 제작된 안테나(Metal Sticker Antenna, MSA)로 형성될 수 있다. 예를 들어 MSA 구리(Cu)으로 이루어질 수 있다. 코일부(403)는 단층이거나 다층으로 구성될 수 있다. According to the wireless charging coil module 400 according to the first embodiment, the coil portion 403 can be provided. The coil portion 403 may be disposed on the upper surface of the first film 401. The coil part 403 may be formed of a metal sticker antenna (MSA) manufactured by the rolling process. For example, MSA copper (Cu). The coil portion 403 may be a single layer or a multi-layered structure.
구체적으로, 압연 공정에 의해 형성된 금속층이 제1 필름(401) 상에 코팅된 후, 금속층을 대상으로 식각 공정이 수행되어, 다수로 권선된 코일(403a), 제1 패드(403b) 및 제2 패드(403c)로 이루어진 코일부(403)가 형성될 수 있다. 코일부(403)의 두께는 127㎛이하일 수 있다. 제1 패드(403b)은 코일부(403)의 내측에 위치되므로 내측패드로 지칭되고, 제2 패드(403c)은 코일부(403)의 외측에 위치되므로 외측패드로 지칭될 수 있다.Specifically, after the metal layer formed by the rolling process is coated on the first film 401, an etching process is performed on the metal layer to form a plurality of wound coils 403a, first pads 403b, A coil portion 403 composed of a pad 403c may be formed. The thickness of the coil portion 403 may be 127 mu m or less. The first pad 403b is called an inner pad because it is located inside the coil part 403 and the second pad 403c is located outside the coil part 403 and may be referred to as an outer pad.
다수의 코일(403a)은 나선 형상으로 형성되고, 그 중심에는 코일(403a)이 형성되지 않는 중공부(403d)가 위치될 수 있다. 중공부(403d)는 빈 공간일 수 있다. 제1 및 제2 패드(403b, 403c)의 폭은 적어도 코일(403a)의 폭보다 클 수 있다. 즉, 제1 및 제2 패드(403b, 403c)의 사이즈가 크게 형성되므로, 나중에 연결 기판(430)의 제1 및 제2 연결부재(446, 447)의 연결이 용이해질 수 있다. 또한 제1 및 제2 패드(403b, 403c)의 사이즈가 크게 형성됨에 따라, 제1 및 제2 패드(403b, 403c)의 접촉저항을 줄여 전기적 손실을 줄일 수 있다. The plurality of coils 403a are formed in a spiral shape, and a hollow portion 403d in which the coil 403a is not formed may be located at the center thereof. The hollow portion 403d may be an empty space. The width of the first and second pads 403b and 403c may be at least greater than the width of the coil 403a. That is, since the first and second pads 403b and 403c are formed to be large in size, connection of the first and second connection members 446 and 447 of the connection substrate 430 can be facilitated later. In addition, since the first and second pads 403b and 403c are formed to have a large size, the contact resistance between the first and second pads 403b and 403c can be reduced to reduce the electrical loss.
이와 같은 공정 방법으로 코일부(403)가 형성되므로, 코일부(403)를 제1 필름(401)에 부착하기 위한 별도의 접착 부재가 필요 없어 제조 비용이 절감되고, 제조 공정이 단순해질 수 있다. Since the coil part 403 is formed by such a processing method, a separate bonding member for attaching the coil part 403 to the first film 401 is not required, so that the manufacturing cost can be reduced and the manufacturing process can be simplified .
제1 실시예에 따른 무선충전코일모듈(400)에 따르면, 차폐부재(405, 407, 409)가 제공될 수 있다. 차폐부재(405, 407, 409)가 코일부(403) 상에 배치될 수 있다. 차폐부재(405, 407, 409)는 제1 접착부재(405), 차폐재(407) 및 제2 필름(409)를 포함할 수 있다. 차폐부재는 2개층 이하일 수도 있고, 4개층 이상일 수도 있다. 구체적으로, 제1 접착부재(405)가 제1 필름(401) 상에 배치되고, 차폐재(407)가 제1 접착부재(405) 상에 배치되며, 제2 필름(409)이 차폐재(407) 상에 배치될 수 있다. 코일부(403)는 제1 필름(401)과 제1 접착부재(405) 사이에 배치될 수 있다. 제1 필름(401)의 사이즈 및/또는 제1 접착부재(405)의 사이즈는 코일부(403)의 사이즈보다 클 수 있다. 제1 접착부재(405)에 의해 차폐재(407)와 제1 필름(401)이 부착될 수 있다. 코일부(403)의 외측에서 제1 접착부재(405)에 의해 제1 필름(401)과 차폐재(407)이 서로 부착될 수 있다. 이에 따라, 코일부(403)는 제1 필름(401)과 차폐재(407)에 의해 둘러싸여 외부에 노출되지 않는다. According to the wireless charging coil module 400 according to the first embodiment, shielding members 405, 407 and 409 can be provided. Shielding members 405, 407, and 409 may be disposed on the coil section 403. [ The shielding members 405, 407 and 409 may include a first adhesive member 405, a shielding member 407 and a second film 409. The shielding member may be two or less layers or four or more layers. Specifically, when the first adhesive member 405 is disposed on the first film 401, the shielding member 407 is disposed on the first adhesive member 405, the second film 409 is placed on the shielding member 407, Lt; / RTI > The coil portion 403 may be disposed between the first film 401 and the first adhesive member 405. [ The size of the first film 401 and / or the size of the first adhesive member 405 may be larger than the size of the coil part 403. [ The shielding member 407 and the first film 401 can be attached by the first adhesive member 405. [ The first film 401 and the shielding material 407 can be attached to each other by the first adhesive member 405 outside the coil part 403. [ Thus, the coil part 403 is surrounded by the first film 401 and the shielding material 407 and is not exposed to the outside.
제1 접착부재(405)는 차폐재(407)를 제1 필름(401) 및/또는 코일부(403)와 부착되도록 한다. 차폐재(407)는 코일(403a)에 의해 발생, 형성 또는 유도되는 전자기장이 전자부품에 영향을 주는 것을 차단시킬 수 있다. 차폐재(407)로는 EMB(Electro-Magnetic BoosterTM) 차폐재가 사용될 수 있지만, 이에 대해서는 한정하지 않는다. EMB 차폐재는 비정질 및 나노 결정 리본(Ribbon) 물질로 이루어질 수 있다. 차폐재(407)의 두께는 적어도 73㎛이하일 수 있다. 예컨대, 차폐재(407)의 두께는 73㎛일 수 있다. 이와 같이, EMB 차폐재가 사용됨에 따라 차폐 성능이 증가되므로 차폐재(407)의 두께가 줄어들 수 있다. The first adhesive member 405 allows the shielding material 407 to be attached to the first film 401 and / or the coil part 403. [ The shielding member 407 can prevent the electromagnetic field generated, formed or induced by the coil 403a from affecting the electronic component. An EMB (Electro-Magnetic Booster) shielding material may be used as the shielding material 407, but the present invention is not limited thereto. EMB shielding materials can be made of amorphous and nanocrystalline ribbon materials. The thickness of the shielding material 407 may be at least 73 탆. For example, the thickness of the shielding material 407 may be 73 탆. As described above, since the shielding performance is increased as the EMB shielding material is used, the thickness of the shielding material 407 can be reduced.
제2 필름(409)은 차폐재(407)와 코일부(403)를 보호하는 역할을 할 수 있다. 제2 필름(409)은 블랙 PET(Polyethylene Terephtalate) 수지로 이루어질 수 있지만, 이에 대해서는 한정하지 않는다. The second film 409 may serve to protect the shield member 407 and the coil part 403. [ The second film 409 may be made of black polyethylene terephthalate (PET) resin, but the present invention is not limited thereto.
제1 접착부재(405), 차폐재(407) 및 제2 필름(409)은 수용부(412, 414)를 포함할 수 있다. 수용부(412, 414)는 연결 기판(430)이 삽입되기 위한 통로일 수 있다. 제1 접착부재(405), 차폐재(407) 및 제2 필름(409)은 제1 수용부(412)와 제2 수용부(414)를 포함할 수 있다. 제1 및 제2 수용부(412, 414)는 연결 기판(430)의 제1 및 제2 연결부(431, 433)에 대응되는 형상을 가질 수 있다. The first adhesive member 405, the shielding member 407 and the second film 409 may include the receiving portions 412 and 414. [ The receiving portions 412 and 414 may be passages through which the connection substrate 430 is inserted. The first adhesive member 405, the shielding member 407 and the second film 409 may include a first accommodating portion 412 and a second accommodating portion 414. The first and second receiving portions 412 and 414 may have a shape corresponding to the first and second connecting portions 431 and 433 of the connecting board 430.
제1 수용부(412)는 코일부(403)의 내측패드(403b)와 외측패드(403c)를 포함하여 코일부(403)의 내측패드(403b)와 외측패드(403c) 사이에 위치되고, 제2 수용부(414)는 코일부(403)의 외측에서 제1 수용부(412)와 연통될 수 있다. 따라서, 차폐부재(405, 407, 409)는 위에서 보았을 때 제1 수용부(412)를 통해 차폐부재(405, 407, 409) 아래에 배치된 코일부(403)의 코일(403a) 일부가 노출될 수 있다. The first accommodating portion 412 is located between the inner pad 403b and the outer pad 403c of the coil portion 403 including the inner pad 403b and the outer pad 403c of the coil portion 403, The second accommodating portion 414 can communicate with the first accommodating portion 412 from the outside of the coil portion 403. Therefore, the shielding members 405, 407, 409 are arranged such that a portion of the coil 403a of the coil portion 403 disposed below the shielding members 405, 407, 409 through the first accommodating portion 412 as viewed from above is exposed .
제1 수용부(412)는 코일부(403)의 내측패드(403b)에서 외측패드(403c)를 향하는 제1 방향을 따라 형성되고, 제2 수용부(414)는 제1 방향과 상이한 제2 방향을 따라 형성될 수 있다. 예컨대, 제1 수용부(412)는 연결 기판(430)의 제1 연결부(431)의 형상에 대응되는 형상을 가지며, 제2 수용부(414)는 연결 기판(430)의 제2 연결부(433)의 형상에 대응되는 형상을 가질 수 있다. 즉, 제1 및 제2 수용부(412, 414)는 연결 기판(430)의 제1 및 제2 연결부(431, 433)의 형상에 대응되는 형상을 가질 수 있다. 제1 수용부(412)의 사이즈는 연결기판(430)의 제1 연결부(431)의 사이즈보다 클 수 있지만, 이에 대해서는 한정하지 않는다. 제2 수용부(414)의 사이즈는 연결기판(430)의 제2 연결부(433)의 사이즈보다 클 수 있지만, 이에 대해서는 한정하지 않는다. 연결 기판(430)의 제1 연결부(431)가 코일부(403)의 내측패드(403b)와 연결되고, 연결 기판(430)의 제2 연결부(433)가 코일부(403)의 외측패드(403c)와 연결되므로, 제1 수용부(412)는 코일부(403)의 내측패드(403b)로부터 코일(403)의 외측까지의 영역으로 정의될 수 있다. 이에 따라, 제1 수용부(412)에 의해 코일부(403)의 내측패드(403b) 및 코일(403)이 노출되고, 제2 수용부(414)에 코일부(403)의 외측패드(403c)가 노출될 수 있다. 즉, 코일(403a)은 제1 수용부(412)에 위치되고 제2 수용부(414)에 위치되지 않을 수 있다. 제1 실시예에 따라, 코일(403a)은 제1 수용부(412)와 수직으로 중첩될 수 있다. 제1 실시예에 따라, 코일(403a)는 제2 수용부(414)와 중첩되지 않을 수 있다. 제1 실시예에 따라, 외측패드(403c)는 제1 수용부(412)와 수직으로 중첩될 수 있다.The first accommodating portion 412 is formed along the first direction from the inner pad 403b of the coil portion 403 toward the outer pad 403c and the second accommodating portion 414 is formed along the second direction As shown in FIG. The first receiving portion 412 has a shape corresponding to the shape of the first connecting portion 431 of the connecting substrate 430 and the second receiving portion 414 has a shape corresponding to the shape of the second connecting portion 433 And the like. That is, the first and second receiving portions 412 and 414 may have shapes corresponding to the shapes of the first and second connecting portions 431 and 433 of the connecting substrate 430. The size of the first receiving portion 412 may be larger than the size of the first connecting portion 431 of the connecting substrate 430, but the present invention is not limited thereto. The size of the second accommodating portion 414 may be larger than the size of the second connecting portion 433 of the connecting substrate 430, but the present invention is not limited thereto. The first connection part 431 of the connection board 430 is connected to the inner pad 403b of the coil part 403 and the second connection part 433 of the connection board 430 is connected to the outer pad of the coil part 403 The first accommodating portion 412 can be defined as an area from the inner pad 403b of the coil portion 403 to the outer side of the coil 403. [ The inner pad 403b and the coil 403 of the coil portion 403 are exposed by the first accommodating portion 412 and the outer pad 403c of the coil portion 403 is exposed in the second accommodating portion 414. [ ) Can be exposed. That is, the coil 403a may be located in the first accommodating portion 412 and not in the second accommodating portion 414. [ According to the first embodiment, the coil 403a can be vertically overlapped with the first accommodating portion 412. [ According to the first embodiment, the coil 403a may not overlap the second accommodating portion 414. According to the first embodiment, the outer pad 403c may be vertically overlapped with the first accommodating portion 412. [
차폐부재(405, 407, 409)에 연결 기판(430)의 제3 연결부(435)에 대응되는 수용부는 형성되지 않을 수 있다. 따라서, 연결 기판(430)이 수용부(412, 414)에 삽입되는 경우, 연결 기판(430)의 제3 연결부(435)는 차폐부재(405, 407, 409) 상에 배치되어, 자유로운 휨이 가능한 상태일 수 있다. 이러한 경우, 연결 기판(430)의 제3 연결부(435)은 코일부(403)과 접촉되지 않게 된다. 연결 기판(430)이 메인 기판(501)에 체결되는 경우, 연결 기판(430)의 제3 연결부(435)는 더 이상 차폐부재(405, 407, 409) 상에 존재하지 않는다. 즉, 연결 기판(430)이 메인 기판(501)에 체결되는 경우, 연결 기판(430)의 제3 연결부(435)는 제2 연결부(433)를 기준으로 회전되어 연결 기판(430)의 제3 연결부(435)에 구비된 제1 커넥터(437)가 메인 기판(501)의 제2 커넥터(503)에 전기적으로 연결될 수 있다. 따라서, 연결 기판(430)이 메인 기판(501)에 체결되는 경우, 제2 연결부(435)는 메인 기판(501)의 제2 커넥터(503) 상에 배치될 수 있다. The receiving portions corresponding to the third connecting portions 435 of the connecting board 430 may not be formed in the shielding members 405, Accordingly, when the connecting substrate 430 is inserted into the receiving portions 412 and 414, the third connecting portion 435 of the connecting substrate 430 is disposed on the shielding members 405, 407 and 409, It may be possible. In this case, the third connection portion 435 of the connection substrate 430 is not in contact with the coil portion 403. [ When the connecting substrate 430 is fastened to the main substrate 501, the third connecting portion 435 of the connecting substrate 430 is no longer present on the shielding members 405, 407 and 409. That is, when the connection board 430 is fastened to the main board 501, the third connection part 435 of the connection board 430 is rotated about the second connection part 433, The first connector 437 provided in the connection part 435 may be electrically connected to the second connector 503 of the main board 501. [ Therefore, when the connection board 430 is fastened to the main board 501, the second connector 435 may be disposed on the second connector 503 of the main board 501.
제1 접착부재(405), 차폐재(407) 및 제2 필름(409)의 수용부(412, 414)의 크기가 상이할 수 있다. 예컨대, 차폐재(407)의 제1 수용부(412)의 폭(D1)은 제1 접착부재(405) 또는 제2 필름(409)의 제1 수용부(412)의 폭(D1)보다 클 수 있다. 예컨대, 차폐재(407)의 제2 수용부(414)의 폭(D2)은 제1 접착부재(405) 또는 제2 필름(409)의 제2 수용부(414)의 폭(D2)보다 클 수 있다. 따라서, 차폐재(407)가 수용부412, 414)로 인하여 외부로 노출되지 않고, 제1 접착부재(405) 및 제2 필름(409)에 의하여 보호될 수 있다.The sizes of the receiving portions 412 and 414 of the first adhesive member 405, the shielding member 407 and the second film 409 may be different. The width D1 of the first receiving portion 412 of the shielding member 407 may be larger than the width D1 of the first receiving portion 412 of the first adhesive member 405 or the second film 409 have. The width D2 of the second accommodating portion 414 of the shielding material 407 may be larger than the width D2 of the first accommodating portion 414 of the first adhesive material 405 or the second film 409 have. Therefore, the shielding member 407 can be protected by the first adhesive member 405 and the second film 409 without being exposed to the outside due to the receptacles 412 and 414.
제1 실시예에 따른 무선충전코일모듈(400)에 따르면, 연결 기판(430)이 제공될 수 있다. 연결 기판(430)은 차폐부재(405, 407, 409)의 수용부(412, 414)에 삽입될 수 있다. 연결 기판(430)은 차폐부재(405, 407, 409)의 수용부(412, 414)에서 코일부(403)에 전기적으로 연결되고 메인 기판(501)에 전기적으로 연결되기 위해 체결될 수 있다. According to the wireless charging coil module 400 according to the first embodiment, a connection board 430 can be provided. The connection board 430 can be inserted into the receiving portions 412 and 414 of the shielding members 405, 407 and 409. [ The connecting board 430 may be electrically connected to the coil portion 403 in the receiving portions 412 and 414 of the shielding members 405, 407 and 409 and electrically connected to the main board 501.
구체적으로, 연결 기판(430)은 제2 방향을 따라 길게 형성된 제2 연결부(433), 제2 연결부(433)의 일측단으로부터 절곡되어 제1 방향을 따라 연장 형성되는 제1 연결부(431) 및 제2 연결부(433)의 타측단으로부터 절곡되어 제1 방향을 따라 연장 형성되는 제3 연결부(435)을 포함할 수 있다. 제1 및 제2 연결부(431, 433)는 차폐부재(405, 407 409)의 수용부(412, 414)의 형상에 대응되는 형상을 가질 수 있다. 제1 연결부(431)의 폭과 제3 연결부(435)의 폭은 동일할 수 있지만, 이에 대해서는 한정하지 않는다. Specifically, the connection board 430 includes a second connection portion 433 formed along the second direction, a first connection portion 431 bent from one end of the second connection portion 433 and extending along the first direction, And a third connection part 435 bent from the other end of the second connection part 433 and extending along the first direction. The first and second connection portions 431 and 433 may have shapes corresponding to the shapes of the receiving portions 412 and 414 of the shielding members 405 and 407 409. The width of the first connection portion 431 and the width of the third connection portion 435 may be the same, but the invention is not limited thereto.
제1 및 제2 연결부(431, 433)은 서로 이격되어 평행하게 또는 나란하게 배치될 수 있지만, 이에 대해서는 한정하지 않는다. 연결 기판(430)의 제1 연결부(431)는 차폐부재(405, 407, 409)의 제1 수용부(412)로 삽입되고, 연결 기판(430)의 제2 연결부(433)는 차폐부재(405, 407, 409)의 제2 수용부(414)로 삽입될 수 있다. 차폐부재(405, 407, 409)의 제1 수용부(412)에 삽입된 연결 기판(430)의 제1 연결부(431)의 하면 일부분이 코일부(403)의 내측패드(403b)에 연결될 수 있다. 차폐부재(405, 407, 409)의 제2 수용부(414)에 삽입된 연결 기판(430)의 제2 연결부(433)의 하면 일부분이 코일부(403)의 외측패드(403c)에 연결될 수 있다. 연결 기판(430)의 제3 연결부(435)에 구비된 제1 커넥터(437)가 메인 기판(501)의 제2 커넥터(503)에 연결되기 위해 연결 기판(430)의 제3 연결부(435)은 제2 연결부(433)을 기준으로 회전되므로, 연결 기판(430)의 제3 연결부(435)은 차폐부재(405, 407, 409)의 수용부(412, 414)에 삽입될 필요가 없다. The first and second connection portions 431 and 433 may be arranged in parallel or parallel to each other, but the present invention is not limited thereto. The first connection portion 431 of the connection substrate 430 is inserted into the first accommodation portion 412 of the shielding members 405, 407 and 409 and the second connection portion 433 of the connection substrate 430 is inserted into the shielding member 405, 407, and 409. The second receiving portion 414 of the second receiving portion 414 may be inserted into the second receiving portion 414 of the second receiving portion 405, A part of the lower surface of the first connecting portion 431 of the connecting board 430 inserted into the first receiving portion 412 of the shielding members 405, 407 and 409 may be connected to the inner pad 403b of the coil portion 403. [ have. A part of the lower surface of the second connection portion 433 of the connection board 430 inserted into the second accommodation portion 414 of the shielding members 405, 407 and 409 may be connected to the outer pad 403c of the coil portion 403. [ have. The first connector 437 provided on the third connection part 435 of the connection board 430 is connected to the third connection part 435 of the connection board 430 to be connected to the second connector 503 of the main board 501, The third connecting portion 435 of the connecting board 430 does not need to be inserted into the receiving portions 412 and 414 of the shielding members 405, 407, and 409 since the second connecting portion 433 is rotated with respect to the second connecting portion 433.
도 11은 제1 실시예에 따른 무선충전코일모듈의 연결 기판의 내부를 개략적으로 도시한 평면도이고, 도 12a 내지 도 12e는 도 11의 무선충전코일모듈의 연결 기판을 절단한 단면도이다.FIG. 11 is a plan view schematically illustrating the inside of a connection board of the wireless charging coil module according to the first embodiment, and FIGS. 12a to 12e are sectional views of the connection board of the wireless charging coil module of FIG.
도 5 내지 도 12에 도시한 바와 같이, 제1 커넥터(437)를 구성하기 위한 제1 및 제2 접촉부(439a, 439b)의 사이즈가 클수록 접촉 저항이 작으므로 제1 및 제2 접촉부(439a, 439b) 간의 전기적인 쇼트를 방지하기 위해 제1 및 제2 접촉부(439a, 439b)는 서로 이격되어야 한다. 이에 따라, 연결 기판(430)의 제3 연결부(435)의 일부분, 즉 제1 커넥터(437)가 위치된 부분의 폭(L1)은 다른 영역의 폭(L2)보다 클 수 있다. 연결 기판(431)에서 제1 커넥터(437)가 위치된 부분은 제3 연결부(435)의 끝단으로부터 절곡되어 제1 연결부(431)로부터 멀어지는 방향, 즉 제2 방향을 따라 연장 형성될 수 있다. 이와 같이 제1 커넥터(437)가 위치된 부분과 상기 연장된 영역은 제3 연결부(435)와 구분하여 제4 연결부로 지칭될 수도 있다. 5 to 12, the larger the size of the first and second contact portions 439a and 439b for forming the first connector 437, the smaller the contact resistance. Therefore, the first and second contact portions 439a, The first and second contact portions 439a and 439b should be spaced from each other to prevent electrical shorting between the first and second contact portions 439a and 439b. The width L1 of the portion of the third connection portion 435 of the connection substrate 430 where the first connector 437 is located may be larger than the width L2 of the other region. The portion where the first connector 437 is located on the connection board 431 may be bent from the end of the third connection portion 435 and extend in a direction away from the first connection portion 431 or in a second direction. The portion where the first connector 437 is located and the extended region may be referred to as a fourth connecting portion by being separated from the third connecting portion 435.
제1 커넥터(437)의 제1 및 제2 접촉부(439a, 439b)는 제3 연결부(435)의 상면 일부분에 배치될 수 있다. 제1 커넥터(437)의 제1 및 제2 접촉부(439a, 439b)는 제1 및 제2 도전라인(442, 444)에 연결될 수 있다. 제1 및 제2 접촉부(439a, 439b)와 제1 및 제2 도전라인(442, 444)은 연결 기판(430) 내에 내장될 수 있다. 제1 및 제2 도전라인(442, 444)의 일측은 제1 및 제2 접촉부(439a, 439b)에 연결되고 제1 및 제2 도전라인(442, 444)의 타측은 코일부(403)의 내측패드(403b)와 외측패드(403c)에 연결될 수 있다. 제1 및 제2 도전라인(442, 444)과 제1 및 제2 접촉부(439a, 439b)는 일체형으로 형성되고 동일한 금속 물질로 형성될 수 있다. 예컨대, 제1 및 제2 도전라인(442, 444)과 제1 및 제2 접촉부(439a, 439b)는 구리(Cu)로 형성될 수 있지만, 이에 대해서는 한정하지 않는다.The first and second contact portions 439a and 439b of the first connector 437 may be disposed on a portion of the upper surface of the third connection portion 435. [ The first and second contacts 439a and 439b of the first connector 437 may be connected to the first and second conductive lines 442 and 444, respectively. The first and second contact portions 439a and 439b and the first and second conductive lines 442 and 444 may be embedded in the connection substrate 430. One side of the first and second conductive lines 442 and 444 is connected to the first and second contact portions 439a and 439b and the other side of the first and second conductive lines 442 and 444 is connected to the side of the coil portion 403 And may be connected to the inner pad 403b and the outer pad 403c. The first and second conductive lines 442 and 444 and the first and second contact portions 439a and 439b may be integrally formed and formed of the same metal material. For example, the first and second conductive lines 442 and 444 and the first and second contact portions 439a and 439b may be formed of copper (Cu), but the present invention is not limited thereto.
제1 및 제2 도전라인(442, 444)은 제1 및 제2 연결부재(446, 447)를 매개로 하여 코일부(403)의 내측패드(403b)와 외측패드(403c)에 연결될 수 있다. 제1 및 제2 연결부재(446, 447)는 주석(Sn), 니켈(Ni), 금(Au) 및/또는 이들의 혼합을 포함하는 솔더링 페이스트일 수 있다. The first and second conductive lines 442 and 444 can be connected to the inner pad 403b and the outer pad 403c of the coil portion 403 via the first and second connecting members 446 and 447 . The first and second connecting members 446 and 447 may be a soldering paste comprising tin (Sn), nickel (Ni), gold (Au), and / or a mixture thereof.
제1 도전라인(442)은 제1 연결부(431), 제2 연결부(433) 및 제3 연결부(435)에 배치될 수 있다. 제2 도전라인(444)은 제2 연결부(433)과 제3 연결부(435)에 배치될 수 있다. 다시 말해, 제2 도전라인(444)은 제1 연결부(431)에 배치되지 않는다. 따라서, 제1 연결부(431)에는 제1 도전라인(442)만 배치되고, 제2 및 제3 연결부(433, 435)에는 제1 및 제2 도전라인(442, 444) 모두 배치될 수 있다. The first conductive line 442 may be disposed in the first connection portion 431, the second connection portion 433, and the third connection portion 435. The second conductive line 444 may be disposed in the second connection part 433 and the third connection part 435. In other words, the second conductive line 444 is not disposed in the first connection portion 431. [ Accordingly, only the first conductive line 442 may be disposed in the first connection portion 431, and both the first and second conductive lines 442 and 444 may be disposed in the second and third connection portions 433 and 435.
제1 및 제2 도전라인(442, 444)은 서로 상이한 층에 배치될 수 있다. 제1 보호층(441) 상에 제1 도전라인(442)이 배치되고, 제1 도전라인(442) 상에 절연층(443)이 배치될 수 있다. 절연층(443) 상에 제2 도전라인(444)이 배치되고, 제2 도전라인(444) 상에 제2 보호층(445)가 배치될 수 있다. 이 이외에 다른 구성 요소가 추가되거나 또는 이들 구성 요소 중 일부 구성 요소가 생략될 수도 있다. The first and second conductive lines 442 and 444 may be disposed in different layers from each other. A first conductive line 442 may be disposed on the first passivation layer 441 and an insulating layer 443 may be disposed on the first conductive line 442. The second conductive line 444 may be disposed on the insulating layer 443 and the second protective layer 445 may be disposed on the second conductive line 444. [ Other components may be added, or some of these components may be omitted.
제1 및 제2 도전라인(442, 444)은 전기 도금 방식을 이용하여 절연층(443)의 양면 또는 제1 및 제2 보호층(441, 445)에 형성될 수 있다. 제1 도전라인(442)은 제1 보호층(441)과 절연층(443)에 의해 둘러싸일 수 있다. 제2 도전라인(444)은 절연층(443)과 제2 보호층(445)에 의해 둘러싸일 수 있다. The first and second conductive lines 442 and 444 may be formed on both sides of the insulating layer 443 or on the first and second protective layers 441 and 445 using an electroplating method. The first conductive line 442 may be surrounded by the first passivation layer 441 and the insulating layer 443. The second conductive line 444 may be surrounded by an insulating layer 443 and a second passivation layer 445.
제1 및 제2 도전라인(442, 444)은 구리(Cu) 도금된 구리층일 수 있다. 예를 들어, 제1 및 제2 도전라인(442, 444)은 0.035mm의 구리층에 구리 도금층(Cu plating)이 0.01mm 형성되어 2개의 층으로 구성될 수 있다. The first and second conductive lines 442 and 444 may be copper (Cu) plated copper layers. For example, the first and second conductive lines 442 and 444 may be composed of two layers, each having a Cu layer of 0.035 mm and a Cu plating of 0.01 mm.
실시예에 따라, 제1 도전라인(442)은 절연층(443)에 구리층이 형성되고, 구리층 상에 구리 도금층이 형성될 수 있다. 제2 도전라인(444)는 제1 도전라인(442)과 반대방향으로 절연층(443) 아래에 구리층이 형성되고, 구리층 아래에 구리 도금층이 형성될 수 있다.According to the embodiment, the first conductive line 442 may have a copper layer formed on the insulating layer 443, and a copper plating layer formed on the copper layer. The second conductive line 444 may have a copper layer formed under the insulating layer 443 in a direction opposite to the first conductive line 442 and a copper plating layer formed under the copper layer.
제1 보호층(441), 절연층(443) 및 제2 보호층(445) 모두 휨 특성이 우수한 재질로 형성될 수 있다. 제1 보호층(441), 절연층(443) 및 제2 보호층(445)은 절연성과 강도가 우수한 재질로 형성될 수 있다. The first protective layer 441, the insulating layer 443, and the second protective layer 445 may be formed of a material having excellent bending properties. The first protective layer 441, the insulating layer 443, and the second protective layer 445 may be formed of a material having excellent insulation and strength.
제1 보호층(441), 절연층(443) 및/또는 제2 보호층(445)은 동일한 재질로 형성될 수 있다. 예컨대, 제1 보호층(441), 절연층(443) 및/또는 제2 보호층(445)은 폴리이미드(polyimide) 수지를 포함할 수 있다. 다른 예로서, 제1 보호층(441), 절연층(443) 및/또는 제2 보호층(445)은 서로 상이한 재질로 형성될 수 있다. 예컨대, 절연층(443)은 절연선이 우수한 재질로 형성되고, 제1 및/또는 제2 보호층(441, 445)은 강도가 우수한 재질로 형성될 수 있다. The first protective layer 441, the insulating layer 443, and / or the second protective layer 445 may be formed of the same material. For example, the first protective layer 441, the insulating layer 443, and / or the second protective layer 445 may include a polyimide resin. As another example, the first protective layer 441, the insulating layer 443, and / or the second protective layer 445 may be formed of materials different from each other. For example, the insulating layer 443 may be formed of a material excellent in insulation line, and the first and / or second protective layers 441 and 445 may be formed of a material having excellent strength.
연결 기판(430)의 각 구성 요소의 두께는 표 1과 같다.The thickness of each component of the connection board 430 is shown in Table 1.
연결 기판(430)의 구성 요소The components of the connection substrate 430 두께[mm]Thickness [mm]
제1 보호층(441)The first protective layer 441, 0.01250.0125
제1 도전라인(442)The first conductive line 442, 0.0350.035
절연층(443)In the insulating layer 443, 0.01250.0125
제2 도전라인(444)The second conductive line 444, 0.0350.035
제2 보호층(445)The second protective layer 445, 0.01250.0125
도 10 및 도 11에 도시한 바와 같이, 연결 기판(430)의 제1 연결부(431)에는 제1 도전라인(442)만 배치될 수 있다. 연결 기판(430)의 제2 및 제3 연결부(433, 435)에는 제1 및 제2 도전라인(442, 444)이 배치될 수 있다. 제1 및 제2 도전라인(442, 444)이 서로 상이한 층에 배치되므로, 제1 및 제2 도전라인(442, 444)은 서로 중첩되거나 수평 방향을 따라 서로 이격되어도 무방하므로, 연결기판(430), 특히 제3 연결부(435)의 폭을 줄일 수 있어, 더욱 더 우수한 휨 특성을 확보할 수 있다. 절연층(443)에 의해 제1 및 제2 도전라인(442, 444)은 서로 이격될 수 있다. As shown in FIGS. 10 and 11, only the first conductive line 442 may be disposed in the first connection portion 431 of the connection substrate 430. The first and second conductive lines 442 and 444 may be disposed on the second and third connection portions 433 and 435 of the connection substrate 430. Since the first and second conductive lines 442 and 444 are disposed on different layers from each other, the first and second conductive lines 442 and 444 may overlap each other or may be spaced from each other along the horizontal direction, ), In particular, the width of the third connecting portion 435 can be reduced, and more excellent warping characteristics can be ensured. The insulating layer 443 allows the first and second conductive lines 442 and 444 to be spaced apart from each other.
제2 연결부(433)에서 제1 및 제2 도전라인(442, 444)가 중첩되므로 두께가 두꺼워지고 절곡부의 형성이 어려운 문제가 있다. 이에 따라, 제3 연결부(435)에서와 같이 제1 및 제2 도전라인(442, 444)가 서로 중첩되지 않도록 하여, 두께를 얇게 하고 절곡부(434)를 형성할 수 있다. 이와 같이 두께가 얇아지고 절곡부(434)가 형성됨에 따라, 제3 연결부(435)의 휨 특성이 증가될 수 있다. 따라서, 제1 방향으로 연장되어 형성된 제1 수용부(412)에서 제2 방향으로 연장되어 형성된 제2 수용부(414)를 가질 수 있다. 제2 수용부(414)를 통하여 제3 연결부(435)에 절곡부(434)가 형성될 수 있어, 공정 단순화 및 재료비 절감 효과가 구현될 수 있다.Since the first and second conductive lines 442 and 444 are overlapped with each other in the second connection portion 433, the thickness becomes thick and the formation of the bent portion is difficult. Accordingly, the first and second conductive lines 442 and 444 are not overlapped with each other as in the third connecting portion 435, and the bending portion 434 can be formed with a reduced thickness. As the thickness is reduced and the bending portion 434 is formed as described above, the bending characteristic of the third connecting portion 435 can be increased. Therefore, the second receiving portion 414 may be formed to extend in the second direction in the first receiving portion 412 formed in the first direction. The bending portion 434 can be formed in the third connection portion 435 through the second accommodating portion 414, thereby simplifying the process and reducing the material cost.
이하에서 연결 기판(430)의 제1 내지 제3 연결부(431, 433, 435)에서의 제1 및 제2 도전라인(442, 444)의 배치관계를 상세히 설명한다.The arrangement relationship of the first and second conductive lines 442 and 444 in the first to third connection portions 431, 433 and 435 of the connection substrate 430 will be described in detail below.
도 12a에 도시한 바와 같이, 연결 기판(430)의 제1 연결부(431)의 끝단을 통해 제2 도전라인(444)이 코일부(403)의 내측단자에 전기적으로 연결될 수 있다. 즉, 제2 연결부재(446)를 이용하여 연결 기판(430)의 제1 연결부(431)에 배치되는 제2 도전라인(444)이 코일부(403)의 내측단자에 전기적으로 연결될 수 있다. 제2 연결부재(446)는 주석(Sn), 니켈(Ni), 금(Au) 및/또는 이들의 혼합을 포함하는 솔더링 페이스트일 수 있다. The second conductive line 444 may be electrically connected to the inner terminal of the coil part 403 through the end of the first connection part 431 of the connection board 430 as shown in FIG. The second conductive line 444 disposed on the first connection portion 431 of the connection substrate 430 may be electrically connected to the inner terminal of the coil portion 403 using the second connection member 446. [ The second connection member 446 may be a soldering paste comprising tin (Sn), nickel (Ni), gold (Au) and / or a mixture thereof.
제1 도전라인(442)은 코일부(403)의 외측단자에 연결되므로, 연결 기판(430)의 제1 연결부(431)에는 제1 도전라인(442)이 배치되지 않는다. 이에 따라, 절연층(443)과 제2 보호층(445) 사이에 배치되는 제2 도전라인(444) 아래에 제1 도전라인(442)이 배치되지 않는다. 이러한 경우, 연결 기판(430)의 제1 연결부(431)의 끝단에서 제1 보호층(441)과 절연층(443)이 부분적으로 제거된 비아(453, 이하, 제2 비아라 함)가 형성되어 제2 도전라인(444)의 하면의 일부 영역이 외부에 노출될 수 있다. 이와 같이 노출된 제2 비아(453)에 솔더링 페이스트가 채워진 후 레이저 솔더링 공정에 의해 솔더링 페이스트가 경화된 제2 연결부재(446)에 의해 제2 도전라인(444)이 코일부(403)의 내측단자에 전기적으로 연결되고 물리적으로 고정될 수 있다. 제2 연결부재(446)의 일부는 적어도 제2 비아(453)에 배치되고, 제2 연결부재(446)의 다른 일부는 제2 비아(453)로부터 돌출되어 코일부(403)의 내측단자에 연결될 수 있다. The first conductive line 442 is not disposed in the first connection portion 431 of the connection substrate 430 because the first conductive line 442 is connected to the outer terminal of the coil portion 403. [ The first conductive line 442 is not disposed below the second conductive line 444 disposed between the insulating layer 443 and the second passivation layer 445. [ In this case, a via 453 (hereinafter referred to as a second via) in which the first protective layer 441 and the insulating layer 443 are partially removed is formed at the end of the first connection portion 431 of the connection substrate 430 So that a part of the lower surface of the second conductive line 444 can be exposed to the outside. After the solder paste is filled in the exposed second vias 453, the solder paste is cured by the laser soldering process so that the second conductive line 444 is electrically connected to the inner side of the coil portion 403 Terminals and may be physically fixed. A portion of the second connection member 446 is disposed at least in the second via 453 and the other portion of the second connection member 446 protrudes from the second via 453 to the inner terminal of the coil portion 403 Can be connected.
도 12b에 도시한 바와 같이, 연결 기판(430)의 제1 연결부(431)에는 제2 도전라인(444)만 배치될 수 있다. 절연층(443)과 제2 보호층(445) 사이에 제2 도전라인(444)이 배치되고, 이러한 제2 도전라인(444)은 연결 기판(430)의 제1 연결부(431)의 길이 방향을 따라 배치될 수 있다. 제2 도전라인(444)은 절연층(443)과 제2 보호층(445)에 의해 둘러싸이므로, 외부에 노출되지 않는다. 12B, only the second conductive line 444 may be disposed in the first connection portion 431 of the connection substrate 430. [ A second conductive line 444 is disposed between the insulating layer 443 and the second protective layer 445 and the second conductive line 444 is electrically connected to the first connection portion 431 of the connection substrate 430 in the longitudinal direction As shown in FIG. Since the second conductive line 444 is surrounded by the insulating layer 443 and the second protective layer 445, the second conductive line 444 is not exposed to the outside.
도 12c에 도시한 바와 같이, 연결 기판(430)의 제2 연결부(433)의 일측을 통해 제1 도전라인(442)이 코일부(403)의 외측단자에 전기적으로 연결될 수 있다. 즉, 제1 연결부재(447)를 이용하여 연결 기판(430)의 제2 연결부(433)에 배치되는 제1 도전라인(442)이 코일부(403)의 외측단자에 전기적으로 연결될 수 있다. 제1 연결부재(447)는 주석(Sn), 니켈(Ni), 금(Au) 및/또는 이들의 혼합을 포함하는 솔더링 페이스트일 수 있다. The first conductive line 442 may be electrically connected to the outer terminal of the coil portion 403 through one side of the second connection portion 433 of the connection board 430 as shown in FIG. The first conductive line 442 disposed in the second connection portion 433 of the connection substrate 430 may be electrically connected to the outer terminal of the coil portion 403 using the first connection member 447. [ The first connecting member 447 may be a soldering paste including tin (Sn), nickel (Ni), gold (Au), and / or a mixture thereof.
제1 보호층(441)과 절연층(443) 사이에 제1 도전라인(442)이 배치되고, 절연층(443)과 제2 보호층(445) 사이에 제2 도전라인(444)이 배치될 수 있다. 제1 도전라인(442)과 제2 도전라인(444)이 수직으로 중첩되도록 배치될 수 있다. 제1 보호층(441)이 부분적으로 제거된 비아(451, 이하, 제1 비아라 함)가 형성되어 제1 도전라인(442)의 하면의 일부 영역이 외부에 노출될 수 있다. 이와 같이 노출된 제1 비아(451)에 솔더링 페이스트가 채워진 후 레이저 솔더링 공정에 의해 솔더링 페이스트가 경화된 제1 연결부재(447)에 의해 제1 도전라인(442)이 코일부(403)의 외측단자에 전기적으로 연결되고 물리적으로 고정될 수 있다. 제1 연결부재(447)의 일부는 적어도 제1 비아(451)에 배치되고, 제1 연결부재(447)의 다른 일부는 제1 비아(451)로부터 돌출되어 코일부(403)의 내측단자에 연결될 수 있다.A first conductive line 442 is disposed between the first protective layer 441 and the insulating layer 443 and a second conductive line 444 is disposed between the insulating layer 443 and the second protective layer 445 . The first conductive line 442 and the second conductive line 444 may be vertically overlapped. A portion of the lower surface of the first conductive line 442 may be exposed to the outside by forming a via 451 in which the first protective layer 441 is partially removed. After the solder paste is filled in the exposed first vias 451, the first connection line 447, in which the soldering paste is hardened by the laser soldering process, is electrically connected to the outside of the coil portion 403 Terminals and may be physically fixed. A portion of the first connection member 447 is disposed at least in the first via 451 and the other portion of the first connection member 447 protrudes from the first via 451 to the inner terminal of the coil portion 403 Can be connected.
도 12d에 도시한 바와 같이, 연결 기판(430)의 제3 연결부(435)에는 제1 도전라인(442)과 제2 도전라인(444)이 배치될 수 있다. 제1 도전라인(442)과 제2 도전라인(444)은 수평 방향으로 서로 이격되도록 배치될 수 있다. 제1 도전라인(442)과 제2 도전라인(444)은 수평 방향으로 중첩될 수 있다. 제1 도전라인(442)과 제2 도전라인(444)은 금속 물질로 형성되는 바, 금속 물질은 경직성을 가져 ◎ 특성에 취약할 수 있다. 이에 반해, 연결 기판(430)의 제3 연결부(435)은 제2 연결부(433)을 기준으로 회전된 후 메인 기판(501)의 제2 커넥터(503)에 체결되므로, 휨 특성이 우수해야 한다. 즉, 연결 기판(430)의 제3 연결부(435)은 우수한 가요성을 가져야 한다. 따라서, 제1 실시예에서는 연결 기판(430)의 제3 연결부(435)에서 제1 도전라인(442)과 제2 도전라인(444)이 수평 방향을 따라 서로 이격되도록 배치하여, 즉 제1 도전라인(442)과 제2 도전라인(444)이 수직으로 중첩되지 않도록 하여, 우수한 가요성을 확보할 수 있다. The first conductive line 442 and the second conductive line 444 may be disposed on the third connection portion 435 of the connection substrate 430. [ The first conductive line 442 and the second conductive line 444 may be spaced apart from each other in the horizontal direction. The first conductive line 442 and the second conductive line 444 may be overlapped in the horizontal direction. Since the first conductive line 442 and the second conductive line 444 are formed of a metal material, the metal material may be rigid and poor in characteristics. The third connection part 435 of the connection board 430 is rotated about the second connection part 433 and is then fastened to the second connector 503 of the main board 501 so that the bending property should be excellent . That is, the third connection portion 435 of the connection substrate 430 should have excellent flexibility. Therefore, in the first embodiment, the first conductive line 442 and the second conductive line 444 are arranged to be spaced apart from each other along the horizontal direction in the third connection portion 435 of the connection substrate 430, The line 442 and the second conductive line 444 are prevented from vertically overlapping each other, whereby excellent flexibility can be secured.
제1 보호층(441)의 상면은 제1 보호층 영역, 제2 보호층 영역 그리고 제1 및 제2 보호층 영역 사이에 제3 보호층 영역으로 정의될 수 있다. 이러한 경우, 제1 도전라인(442)이 제1 보호층(441)의 제1 보호층 영역 상에 배치될 수 있다. 제1 보호층(441)과 제1 도전라인(442) 상에 절연층(443)이 배치될 수 있다. 제2 도전라인(444)이 제1 보호층(441)의 제2 보호층 영역에 대응하는 절연층(443) 상에 배치될 수 있다. 이러한 경우, 제1 도전라인(442)과 제2 도전라인(444)은 제1 보호층(441)의 제3 보호층 영역의 폭만큼 수평 방향을 따라 서로 이격될 수 있다. 제1 도전라인(442)과 제2 도전라인(444) 간의 이격거리에 따라 연결 기판(430)의 제3 연결부(435)의 가요성이 달라질 수 있다. 예컨대, 제1 도전라인(442)과 제2 도전라인(444) 간의 이격거리가 멀어질수록 가요성은 좋아지지만 연결 기판(430)의 제3 연결부(435)의 폭 또한 증가될 수 있다. 따라서, 연결 기판(430)의 제3 연결부(435)의 가요성도 확보하고 연결 기판(430)의 제3 연결부(435)의 폭도 증가되지 않도록 제1 도전라인(442)과 제2 도전라인(444) 간의 이격거리가 최적화될 수 있다. 예컨대, 제1 도전라인(442)과 제2 도전라인(444) 간의 이격거리는 0.1mm 내지 2.5mm일 수 있다. 좀 더 구체적으로, 제1 도전라인(442)과 제2 도전라인(444) 간의 이격거리는 0.1mm 내지 1.2mm일 수 있다. The upper surface of the first protective layer 441 may be defined as a first protective layer region, a second protective layer region, and a third protective layer region between the first and second protective layer regions. In this case, the first conductive line 442 may be disposed on the first protective layer region of the first protective layer 441. An insulating layer 443 may be disposed on the first passivation layer 441 and the first conductive line 442. The second conductive line 444 may be disposed on the insulating layer 443 corresponding to the second protective layer region of the first protective layer 441. [ In this case, the first conductive line 442 and the second conductive line 444 may be spaced apart from each other along the horizontal direction by a width of the third protective layer region of the first protective layer 441. The flexibility of the third connection part 435 of the connection substrate 430 can be changed according to the distance between the first conductive line 442 and the second conductive line 444. For example, the greater the distance between the first conductive line 442 and the second conductive line 444, the better the flexibility, but the width of the third connection part 435 of the connection board 430 can also be increased. The first conductive line 442 and the second conductive line 444 may be formed so as to secure flexibility of the third connection portion 435 of the connection substrate 430 and to prevent the width of the third connection portion 435 of the connection substrate 430 from increasing. ) Can be optimized. For example, the separation distance between the first conductive line 442 and the second conductive line 444 may be between 0.1 mm and 2.5 mm. More specifically, the separation distance between the first conductive line 442 and the second conductive line 444 may be between 0.1 mm and 1.2 mm.
절연층(443)과 제2 도전라인(444) 상에 제2 보호층(445)이 배치될 수 있다. The second passivation layer 445 may be disposed on the insulating layer 443 and the second conductive line 444. [
도 12e에 도시한 바와 같이, 연결 기판(430)의 제3 연결부(435)의 끝단, 즉 제4 연결부에 제1 커넥터(437)가 구비될 수 있다. 제1 커넥터(437)는 제1 접촉부(439a)와 제2 접촉부(439b)를 포함할 수 있다. 제1 및 제2 접촉부(439a, 439b)는 메인 기판(501)의 제2 커넥터(503)와의 연결시 접촉 면적을 극대화하여 접촉 저항을 최소화하기 위해 제1 및 제2 도전라인(442, 444)의 폭보다 클 수 있다. 제1 접촉부(439a)와 제2 접촉부(439b)는 전기적인 쇼트를 방지하기 위해 서로 간에 이격되도록 배치될 수 있다. The first connector 437 may be provided at the end of the third connection part 435 of the connection board 430, that is, the fourth connection part, as shown in FIG. 12E. The first connector 437 may include a first contact portion 439a and a second contact portion 439b. The first and second contact portions 439a and 439b are formed on the first and second conductive lines 442 and 444 to maximize the contact area when the main board 501 is connected to the second connector 503, Lt; / RTI > The first contact portion 439a and the second contact portion 439b may be disposed so as to be spaced apart from each other to prevent electrical shorting.
제1 및 제2 접촉부(439a, 439b)는 제1 및 제2 도전라인(442, 444)과 동일한 금속 물질로 형성될 수 있다. 예컨대, 제1 및 제2 도전라인(442, 444)과 제1 및 제2 접촉부(439a, 439b)는 구리(Cu)로 형성될 수 있다. 제1 접촉부(439a)는 제1 도전라인(442)으로부터 연장 형성되고, 제2 접촉부(439b)는 제2 도전라인(444)으로부터 연장 형성될 수 있다. The first and second contact portions 439a and 439b may be formed of the same metal material as the first and second conductive lines 442 and 444. For example, the first and second conductive lines 442 and 444 and the first and second contact portions 439a and 439b may be formed of copper (Cu). The first contact portion 439a may extend from the first conductive line 442 and the second contact portion 439b may extend from the second conductive line 444. [
제1 및 제2 접촉부(439a, 439b)는 메인 기판(501)의 제2 커넥터(503)와 전기적으로 연결되기 위해 외부에 노출될 수 있다. 예컨대, 제2 보호층(445) 및 절연층(443)이 부분적으로 제거된 제3 비아(455)에 의해 제1 접촉부(439a)의 상면의 일부 영역이 외부에 노출될 수 있다. 예컨대, 제2 보호층(445)이 부분적으로 제거된 제4 비아(457)에 의해 제2 접촉부(439b)의 상면의 일부 영역이 외부에 노출될 수 있다. The first and second contact portions 439a and 439b may be exposed to the outside in order to be electrically connected to the second connector 503 of the main board 501. [ A part of the upper surface of the first contact portion 439a may be exposed to the outside by the third via 455 in which the second protective layer 445 and the insulating layer 443 are partially removed. For example, a portion of the upper surface of the second contact portion 439b may be exposed to the outside by the fourth via 457 from which the second protective layer 445 is partially removed.
따라서, 연결 기판(430)의 제1 커넥터(437)와 메인 기판(501)의 제2 커넥터(503)가 체결되는 경우, 연결 기판(430)의 제1 커넥터(437)의 제1 접촉부(439a)는 메인 기판(501)의 제2 커넥터(503)의 제1 연결단자(505a, 도 5)에 전기적으로 연결되고, 연결 기판(430)의 제1 커넥터(437)의 제2 접촉부(439b)는 메인 기판(501)의 제2 커넥터(503)의 제2 연결단자(505b, 도 5)에 전기적으로 연결될 수 있다.When the first connector 437 of the connection board 430 and the second connector 503 of the main board 501 are fastened together, the first contact 439a of the first connector 437 of the connection board 430 Is electrically connected to the first connection terminal 505a of the second connector 503 of the main board 501 and the second contact portion 439b of the first connector 437 of the connection board 430, May be electrically connected to the second connection terminal 505b (FIG. 5) of the second connector 503 of the main board 501.
제1 비아(451) 및 제3 비아(455)는 연결 기판(430) 내에서 절연층(443)을 사이에 두고 모두 구리 도선이 형성되는 제1 연결부재(447) 및 제1 접촉부(439a)에 형성될 수 있다.The first via 451 and the third via 455 are electrically connected to each other through a first connection member 447 and a first contact portion 439a in which a copper wire is formed all over the insulating layer 443 in the connection substrate 430, As shown in FIG.
제2 비아(453) 및 제4 비아(457)는 연결 기판(430) 내에서 절연층(443)을 사이에 두고 모두 구리 도선이 형성되는 제2 연결부재(446) 및 제2 접촉부(439a)에 형성될 수 있다. The second vias 453 and the fourth vias 457 are electrically connected to the second connection members 446 and the second contacts 439a through which the copper wires are formed in the connection substrate 430 with the insulating layer 443 therebetween, As shown in FIG.
제1 및 제2 접촉부(439a, 439b)와 제1 및 제2 연결부재(447,446)이 연결 기판(430)의 서로 상이한 면에 노출될 수 있다. 예컨대, 제1 및 제2 연결부재(447,446)은 연결 기판(430)의 하면에 노출되고, 제1 및 제2 접촉부(439a, 439b)은 연결 기판(430)의 상면에 노출될 수 있다. The first and second contact portions 439a and 439b and the first and second connection members 447 and 446 may be exposed on different surfaces of the connection substrate 430. [ For example, the first and second connection members 447 and 446 may be exposed on the lower surface of the connection substrate 430, and the first and second contact portions 439a and 439b may be exposed on the connection substrate 430.
이상에서, 제1 도전라인(442)이 제1 보호층(441)과 절연층(443) 사이에 배치되고, 제2 도전라인(444)이 절연층(443)과 제2 보호층(445) 사이에 배치되는 것으로 설명되었지만, 제1 도전라인(442)과 제2 도전라인(444)이 서로 바뀌어도 무방하다. 즉, 제2 도전라인(444)이 제1 보호층(441)과 절연층(443) 사이에 배치되고, 제1 도전라인(442)이 절연층(443)과 제2 보호층(445) 사이에 배치될 수 있다. The first conductive line 442 is disposed between the first protective layer 441 and the insulating layer 443 and the second conductive line 444 is disposed between the insulating layer 443 and the second protective layer 445, The first conductive line 442 and the second conductive line 444 may be interchanged with each other. The second conductive line 444 is disposed between the first protective layer 441 and the insulating layer 443 and the first conductive line 442 is disposed between the insulating layer 443 and the second protective layer 445 As shown in FIG.
도 12b 및 도 12d에 도시한 바와 같이, 연결 기판(430)의 제1 연결부(431)의 폭과 연결 기판(430)의 제3 연결부(435)의 폭은 동일할 수 있지만, 이에 대해서는 한정하지 않는다. 상술한 바와 같이, 연결 기판(430)의 제3 연결부(435)에서 제1 및 제2 도전라인(442, 444)이 서로 상이한 층에 배치되지만 연결 기판(430)의 제3 연결부(435)의 가요성을 확보하기 위해 제1 및 제2 도전라인(442, 444)이 수평 방향을 따라 서로 이격되도록 배치될 수 있다. 이에 반해, 연결 기판(430)의 제1 연결부(431)은 제2 도전라인(444)만 배치될 수 있다. 따라서, 연결 기판(430)의 제3 연결부(435)에서는 제1 및 제2 도전라인(442, 444)이 수평 방향을 따라 서로 이격되도록 배치되어야 하므로, 제1 및 제2 도전라인(442, 444)의 폭이 비교적 좁다. 이에 반해, 연결 기판(430)의 제1 연결부(431)에서는 오로지 제2 도전라인(444)만 배치되므로, 제2 도전라인(444)의 폭은 거의 연결 기판(430)의 제1 연결부(431)의 폭에 근접할 정도로 넓을 수 있다. 12B and 12D, the width of the first connection portion 431 of the connection substrate 430 and the width of the third connection portion 435 of the connection substrate 430 may be the same as each other. Do not. The first and second conductive lines 442 and 444 are disposed on different layers from each other in the third connection portion 435 of the connection substrate 430 but the third connection portion 435 of the connection substrate 430 The first and second conductive lines 442 and 444 may be arranged to be spaced apart from each other along the horizontal direction in order to secure flexibility. In contrast, only the second conductive line 444 may be disposed on the first connection part 431 of the connection substrate 430. Therefore, the first and second conductive lines 442 and 444 must be disposed in the third connection portion 435 of the connection board 430 so as to be spaced apart from each other along the horizontal direction. Therefore, the first and second conductive lines 442 and 444 ) Is relatively narrow. The width of the second conductive line 444 is substantially equal to the width of the first connection part 431 of the connection substrate 430 because only the second conductive line 444 is disposed in the first connection part 431 of the connection substrate 430, Of the width of the opening.
연결 기판(430)의 제1 연결부(431)의 제2 도전라인(444)의 폭과 제2 및 제3 연결부(433, 435)의 제2 도전라인(444)의 폭이 상이하다. 예컨대, 연결 기판(430)의 제1 연결부(431)의 제2 도전라인(444)의 폭(P1)은 제2 및 제3 연결부(433, 435)의 제2 도전라인(444)의 폭(P2)보다 클 수 있다. 연결 기판(430)의 제1 연결부(431)의 제2 도전라인(444)의 폭(P1)은 연결 기판(430)의 제3 연결부(435)의 제2 도전라인(444)의 폭(P2)보다 크므로, 제2 도전라인(444)의 단면적이 증가되어 선저항(line resistance)이 획기적으로 감소될 수 있다. 한편, 연결 기판(430)의 제3 연결부(435)에 배치된 제1 도전라인(442)의 폭(P3)은 연결 기판(430)의 제3 연결부(435)에 배치된 제2 도전라인(444)의 폭(P2)와 동일할 수 있지만, 이에 대해서는 한정하지 않는다. 연결 기판(430)의 제3 연결부(435)에 배치된 제1 도전라인(442)의 폭(P3)은 연결 기판(430)의 제1 연결부(431)에 배치된 제2 도전라인(444)의 폭(P1)보다 작을 수 있다. 연결 기판(430)의 제3 연결부(435)에 배치된 제1 도전라인(442)의 폭(P3)은 연결 기판(430)의 제2 연결부(433)에 배치된 제1 도전라인(442)의 폭과 동일할 수 있지만, 이에 대해서는 한정하지 않는다. 연결 기판(430)의 제3 연결부(435)에 배치된 제2 도전라인(444)의 폭(P2)은 연결 기판(430)의 제2 연결부(433)에 배치된 제2 도전라인(444)의 폭과 동일할 수 있지만, 이에 대해서는 한정하지 않는다. The width of the second conductive line 444 of the first connection portion 431 of the connection board 430 and the width of the second conductive line 444 of the second and third connection portions 433 and 435 are different. The width P1 of the second conductive line 444 of the first connection portion 431 of the connection substrate 430 is set to be greater than the width P1 of the second conductive line 444 of the second and third connection portions 433 and 435 P2). The width P1 of the second conductive line 444 of the first connection portion 431 of the connection substrate 430 is larger than the width P2 of the second conductive line 444 of the third connection portion 435 of the connection substrate 430 , The sectional area of the second conductive line 444 is increased and the line resistance can be drastically reduced. The width P3 of the first conductive line 442 disposed on the third connection portion 435 of the connection substrate 430 is greater than the width P3 of the second conductive line 432 disposed on the third connection portion 435 of the connection substrate 430 444, but it is not limited thereto. The width P3 of the first conductive line 442 disposed at the third connection portion 435 of the connection substrate 430 is greater than the width P3 of the second conductive line 444 disposed at the first connection portion 431 of the connection substrate 430, The width P1 may be smaller than the width P1. The width P3 of the first conductive line 442 disposed on the third connection portion 435 of the connection substrate 430 is greater than the width P3 of the first conductive line 442 disposed on the second connection portion 433 of the connection substrate 430. [ But it is not limited thereto. The width P2 of the second conductive line 444 disposed on the third connection portion 435 of the connection substrate 430 is greater than the width of the second conductive line 444 disposed on the second connection portion 433 of the connection substrate 430. [ But it is not limited thereto.
제1 실시예에 따른 제1 연결부(431)의 제1 도전라인(442)의 폭(P1)은 제3 연결부(435)의 제1 도전라인(442) 및 제2 도전라인(444)의 폭(P2, P3)보다 2배 이상 클 수 있다.The width P1 of the first conductive line 442 of the first connection portion 431 according to the first embodiment is larger than the width of the first conductive line 442 and the second conductive line 444 of the third connection portion 435 (P2, P3).
제1 실시예에 따른 제1연결부(431)의 제1 도전라인(442)의 폭(P1)은 2mm 일 수 있다. 실시예에 따른 제3 연결부(435)의 제1 도전라인(442) 및 제2 도전라인(444)의 폭(P2, P3)는 1mm 일 수 있다. The width P1 of the first conductive line 442 of the first connection part 431 according to the first embodiment may be 2 mm. The widths P2 and P3 of the first conductive line 442 and the second conductive line 444 of the third connection part 435 according to the embodiment may be 1 mm.
다시 도 1을 참조하면, 제1 실시예에 따른 무선충전코일모듈(400)에 따르면, 제3 필름(411)이 제공될 수 있다. 제3 필름(411)은 폴리이미드 수지로 형성될 수 있다. 제3 필름(411)은 제2 접착부재(413)를 이용하여 제1 필름(401)에 부착될 수 있다. 즉, 제2 접착부재(413)은 제3 필름(411)을 제1 필름(401)에 부착되도록 한다.Referring again to FIG. 1, according to the wireless charging coil module 400 according to the first embodiment, a third film 411 may be provided. The third film 411 may be formed of a polyimide resin. The third film 411 may be attached to the first film 401 using the second adhesive member 413. [ That is, the second adhesive member 413 allows the third film 411 to adhere to the first film 401.
제3 필름(411)은 제2 접착부재(413)가 접착성을 유지하도록 보호하는 역할을 할 수 있다. The third film 411 can serve to protect the second adhesive member 413 from maintaining adhesiveness.
제3 필름(411)은 무선충전코일모듈(400)이 단말 등에 배치될 때, 제2 접착부재(413)에 의하여 고정될 수 있도록 제거될 수 있다.The third film 411 can be removed so that it can be fixed by the second adhesive member 413 when the wireless charging coil module 400 is placed on a terminal or the like.
제3 필름(411)과 제2 접착부재(413)는 선택 사항으로서 생략될 수도 있다. The third film 411 and the second adhesive member 413 may optionally be omitted.
제1 실시예에 따르면, 코일부(403)의 두께가 비교적 두껍기는 하지만 저항이나 발열이 감소되므로, 별도의 방열부재가 구비될 필요가 없다.According to the first embodiment, although the thickness of the coil portion 403 is relatively thick, the resistance or heat generation is reduced, so that it is not necessary to provide a separate heat radiation member.
제1 실시예에 따르면, EMB 차폐재가 비교적 얇은 두께로 사용되므로, 차폐 효과는 뛰어나면서 두께는 감소되는 효과가 있다. According to the first embodiment, since the EMB shielding material is used in a relatively thin thickness, the shielding effect is excellent and the thickness is reduced.
도 13는 제2 실시예에 따른 무선충전코일모듈을 도시한 사시도이고, 도 14은 제2 실시예에 따른 무선충전코일모듈에서 차폐부재 상에 배치된 방열부재를 도시한 사시도이다.FIG. 13 is a perspective view illustrating a wireless charging coil module according to a second embodiment, and FIG. 14 is a perspective view illustrating a heat dissipating member disposed on a shielding member in the wireless charging coil module according to the second embodiment.
제2 실시예는 방열부재(415, 417, 419)가 추가되는 것을 제외하고는 제1 실시예와 동일하다. 제2 실시예에서 제1 실시예와 동일한 기능이나 형상을 갖는 구성 요소에 대해서는 동일한 도면 부호를 부여하고 상세한 설명은 생략한다.The second embodiment is the same as the first embodiment except that the heat radiating members 415, 417 and 419 are added. In the second embodiment, constituent elements having the same function or shape as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
도 13 및 도 14을 참조하면, 제2 실시예에 따른 무선충전코일모듈(400A)에 따르면, 방열부재(415, 417, 419)가 제공될 수 있다. 13 and 14, according to the wireless charging coil module 400A according to the second embodiment, the heat radiation members 415, 417 and 419 can be provided.
구체적으로, 코일부(403)가 제1 필름(401) 상에 배치되고, 차폐부재(405, 407, 409)가 코일부(403) 상에 배치될 수 있다. 차폐부재(405, 407, 409)는 코일부(403) 상에 배치되는 제1 접착부재(405), 제1 접착부재(405) 상에 배치되는 차폐재(407) 및 상기 차폐재(407) 상에 배치되는 제2 필름(409)을 포함할 수 있다. Specifically, the coil portion 403 is disposed on the first film 401, and the shielding members 405, 407, and 409 can be disposed on the coil portion 403. [ The shielding members 405, 407 and 409 include a first adhesive member 405 disposed on the coil portion 403, a shielding member 407 disposed on the first adhesive member 405, And a second film 409 disposed thereon.
제1 필름(401) 아래에 제2 접착부재(413)를 매개로 하여 제2 필름(409)이 부착될 수 있다. The second film 409 may be attached via the second adhesive member 413 under the first film 401. [
방열부재(415, 417, 419)가 차폐부재(405, 407, 409) 상에 배치될 수 있다. 방열부재(415, 417, 419)는 차폐부재(405, 407, 409), 구체적으로 제2 필름(409) 상에 배치되는 제3 접착부재(미도시), 제3 접착부재 상에 배치되는 제1 방열부(415), 제1 방열부(415) 상에 배치되는 제2 방열부(417) 및 제2 방열부(417) 상에 배치되는 제4 필름(419)를 포함할 수 있다. 제3 접착부재에 의해 제2 필름(409)와 제2 방열부(417) 또는 제4 필름(419)가 부착될 수 있다.The heat radiation members 415, 417, and 419 may be disposed on the shield members 405, 407, and 409. [ The heat dissipating members 415, 417 and 419 are disposed on the shielding members 405, 407 and 409, specifically a third adhesive member (not shown) disposed on the second film 409, A second heat dissipation unit 417 disposed on the first heat dissipation unit 415 and a fourth film 419 disposed on the second heat dissipation unit 417. The first heat dissipation unit 415 may include a heat dissipation unit 415, The second film 409 and the second heat-radiating portion 417 or the fourth film 419 can be attached by the third adhesive member.
설명의 편의에 따라, 제2 접착부재(413)는 제3 접착부재로 지칭되고 제3 접착부재는 제2 접착부재로 지칭될 수도 있다. 제3 필름(411)은 제4 필름(419)으로 지칭되고 제4 필름(419)은 제3 필름(411)으로 지칭될 수도 있다. According to convenience of description, the second adhesive member 413 may be referred to as a third adhesive member, and the third adhesive member may be referred to as a second adhesive member. The third film 411 may be referred to as a fourth film 419 and the fourth film 419 may be referred to as a third film 411. [
제1 방열부(415)는 코일부(403)에서 발생된 열을 수직 방향으로 유도되도록 하는 부재로서, 구리(Cu)를 포함하는 방열 시트일 수 있다. 제2 방열부(417)는 코일부(403)에서 발생된 열을 수평 방향으로 유도되도록 하는 부재로서, 그라파이트(graphite) 재질을 포함하는 방열시트일 수 있다. 제1 방열부(415) 및/또는 제2 방열부(417)의 적어도 하나의 일부 영역이 케이스와 같은 방출부재에 연결될 수 있다. 제1 방열부(415)와 제2 방열부(417)의 배치 순서는 변경 가능할 수 있다. 즉, 제3 접착부재 상에 제2 방열부(417)가 배치되고, 제2 방열부(417) 상에 제1 방열부(415)가 배치될 수 있다.The first heat-radiating portion 415 may be a heat-radiating sheet including copper (Cu) as a member for inducing heat generated in the coil portion 403 in the vertical direction. The second heat-radiating portion 417 is a member for guiding the heat generated in the coil portion 403 in the horizontal direction, and may be a heat-radiating sheet including graphite. At least one portion of at least one of the first heat-radiating portion 415 and / or the second heat-radiating portion 417 may be connected to a discharge member such as a case. The arrangement order of the first heat-radiating portion 415 and the second heat-radiating portion 417 may be changed. That is, the second heat dissipating unit 417 may be disposed on the third adhesive member, and the first heat dissipating unit 415 may be disposed on the second heat dissipating unit 417.
따라서, 코일부(403)에서 발생된 열은 제1 방열부(415)에 의해 신속히 수직 방향으로 유도되고, 제1 방열부(415)로 유도된 코일부(403)의 열은 제2 방열부(417)에 의해 신속히 수평 방향으로 유도되어 케이스와 같은 방출부재를 통해 외부로 방출되므로, 열 방출 성능이 획기적으로 증가되어 코일부(403)의 열로 인한 전력전송효율 저하를 방지할 수 있다. Accordingly, the heat generated in the coil part 403 is rapidly guided in the vertical direction by the first heat radiation part 415, and the heat of the coil part 403 guided to the first heat radiation part 415 is guided to the second heat radiation part The heat radiation performance is drastically increased and the power transmission efficiency can be prevented from being lowered due to the heat of the coil part 403. In addition,
제3 접착부재(미도시), 제1 방열부(415), 제2 방열부(417) 및/또는 제4 필름(419)의 수용부(416, 418)의 사이즈가 상이할 수 있다. 예컨대, 제2 방열부(417)의 제3 수용부(416)의 폭은 제3 접착부재, 제1 방열부(415) 및/또는 제4 필름(419)의 제3 수용부(416)의 폭보다 클 수 있다. 예컨대, 제2 방열부(417)의 제4 수용부(418)의 폭은 제3 접착부재, 제1 방열부(415) 및/또는 제4 필름(419)의 제4 수용부(418)의 폭보다 클 수 있다. 제3 수용부(416)의 형상은 차폐부재(405, 407, 409)의 제1 수용부(412)의 형상에 대응되고, 제 4수용부의 형상은 차폐부재(405, 407, 409)의 제2 수용부(414)의 형상에 대응될 수 있다. 제4 필름(419)은 제1 및 제2 방열부(415, 417)를 보호하는 부재로서, 예컨대 폴리이미드 수지로 형성될 수 있다. 제4 필름(419)은 블랙 컬러를 가질 수 있지만, 이에 대해서는 한정하지 않는다. The sizes of the receiving portions 416 and 418 of the third adhesive member (not shown), the first heat radiating portion 415, the second heat radiating portion 417 and / or the fourth film 419 may be different. For example, the width of the third accommodating portion 416 of the second heat dissipating portion 417 may be equal to the width of the third accommodating portion 416 of the third adhesive member, the first heat dissipating portion 415, and / Width. For example, the width of the fourth accommodating portion 418 of the second heat releasing portion 417 is equal to the width of the fourth accommodating portion 418 of the third adhesive member, the first heat radiating portion 415, and / Width. The shape of the third accommodating portion 416 corresponds to the shape of the first accommodating portion 412 of the shielding members 405, 407 and 409 and the shape of the fourth accommodating portion corresponds to the shape of the shielding member 405, 407, 2 accommodating portion 414 of the first embodiment. The fourth film 419 is a member for protecting the first and second heat radiation parts 415 and 417, and may be formed of, for example, polyimide resin. The fourth film 419 may have black color, but is not limited thereto.
제2 실시예에 따르면, 수직 방향으로 열을 유도하는 제1 방열부(415)와 수평 방향으로 열을 유도하는 제2 방열부(417)가 구비됨으로써, 코일부(403)의 열이 신속히 외부로 방출되어 방출 성능이 향상될 수 있다. According to the second embodiment, the first heat radiating part 415 for guiding heat in the vertical direction and the second heat radiating part 417 for guiding heat in the horizontal direction are provided, So that the discharge performance can be improved.
이상과 같이 구성되는 무선충전코일모듈(400, 400A)은 공정 자동화에 의해 대량 생산이 가능하다. 무선충전코일모듈(400, 400A)에 포함되는 모든 구성 요소는 롤투롤(roll-to-roll) 방식으로 공급될 수 있다. 이하에서 설명되는 구성요소들은 다수의 무선충전코일모듈(400, 400A)이 일괄적으로 생산될 수 있는 대량의 사이즈를 가질 수 있다. The wireless charging coil modules 400 and 400A configured as described above can be mass-produced by the process automation. All components included in the wireless charging coil module 400, 400A may be supplied in a roll-to-roll fashion. The components described below may have a large size in which a plurality of wireless charging coil modules 400, 400A may be produced collectively.
예컨대, 제1 접착부재(405)가 롤투롤 방식으로 공급된 후 수용부(412, 414) 형성을 위한 커팅 공정이 수행될 수 있다. 차폐재(407)가 롤투롤 방식으로 공급된 후 수용부(412, 414) 형성을 위한 커팅 공정이 수행될 수 있다. 제1 접착부재(405)가 차폐재(407)의 하면에 부착될 수 있다. 제2 필름(409)이 롤투롤 방식으로 공급된 후 수용부(412, 414) 형성을 위한 커팅 공정이 수행될 수 있다. 제2 필름(409)이 차폐재(407) 상에 부착될 수 있다. For example, a cutting process for forming the receiving portions 412 and 414 may be performed after the first adhesive member 405 is supplied in a roll-to-roll manner. The cutting process for forming the receiving portions 412 and 414 may be performed after the shielding material 407 is supplied in a roll-to-roll manner. The first adhesive member 405 can be attached to the lower surface of the shielding member 407. [ A cutting process for forming the receiving portions 412 and 414 may be performed after the second film 409 is supplied in a roll-to-roll manner. The second film 409 may be attached on the shielding material 407. [
코일부(403)를 포함하는 제1 필름(401)이 공급될 수 있다. 제1 접착부재(405)를 매개로 하여 차폐재(407) 및 제2 필름(409)이 코일부(403)를 포함하는 제1 필름(401)의 상면에 부착될 수 있다. The first film 401 including the coil part 403 can be supplied. The shielding material 407 and the second film 409 may be attached to the upper surface of the first film 401 including the coil portion 403 via the first adhesive member 405. [
제2 접착부재(413)가 롤투롤 방식으로 공급되고 제3 필름(411)이 롤투롤 방식으로 공급될 수 있다. 제2 접착부재(413)가 제3 필름(411) 상에 부착될 수 있다. 이어서, 제2 접착부재(413)를 매개로 하여 제3 필름(411)이 제1 필름(401)의 하면에 부착될 수 있다. The second adhesive member 413 may be supplied in a roll-to-roll fashion and the third film 411 may be supplied in a roll-to-roll fashion. The second adhesive member 413 can be attached on the third film 411. [ Then, the third film 411 can be attached to the lower surface of the first film 401 via the second adhesive member 413.
제3 접착부재(미도시)가 롤투롤 방식으로 공급된 후, 수용부(416, 418) 형성을 위한 커팅 공정이 수행될 수 있다. 제1 방열부(415)가 롤투롤 방식으로 공급된 후, 수용부(416, 418) 형성을 위한 커팅 공정이 수행될 수 있다. 제3 접착부재가 제1 방열부(415)재의 하면에 부착될 수 있다. 제2 방열부(417)가 롤투롤 방식으로 공급된 후, 수용부(416, 418) 형성을 위한 커팅 공정이 수행될 수 있다. 제2 방열부(417)가 제1 방열부(415)재의 상면에 부착될 수 있다. 제4 필름(419)이 롤투롤 방식으로 공급된 후, 수용부(416, 418) 형성을 위한 커팅 공정이 수행될 수 있다. 제4 필름(419)이 제2 방열부(417)의 상면에 부착될 수 있다. After the third adhesive member (not shown) is supplied in a roll-to-roll manner, a cutting process for forming the receiving portions 416 and 418 can be performed. After the first heat-radiating portion 415 is supplied in a roll-to-roll fashion, a cutting process for forming the receiving portions 416 and 418 may be performed. The third adhesive member can be attached to the lower surface of the first heat-radiating portion 415. [ After the second heat-radiating portion 417 is supplied in a roll-to-roll fashion, a cutting process for forming the receiving portions 416 and 418 may be performed. The second heat-radiating portion 417 may be attached to the upper surface of the first heat-radiating portion 415. After the fourth film 419 is supplied in a roll-to-roll fashion, a cutting process for forming the receiving portions 416 and 418 can be performed. The fourth film 419 may be attached to the upper surface of the second heat-radiating portion 417.
제3 접착부재를 매개로 하여 제1 방열부(415), 제2 방열부(417) 및 제4 필름(419)이 제3 필름(411)의 상면에 부착될 수 있다. The first heat radiating portion 415, the second heat radiating portion 417 and the fourth film 419 may be attached to the upper surface of the third film 411 through the third adhesive member.
이에 따라, 코일부(403)를 포함하는 제1 필름(401) 상에 차폐부재(405, 407, 409)와 방열부재(415, 417, 419)가 배치되고, 제1 필름(401) 아래에 제3 필름(411)이 배치될 수 있다. 제1 필름(401)이나 제3 필름(411)은 수용부가 형성되지 않는다. 차폐부재(405, 407, 409)에 수용부(412, 414)가 형성되고 방열부재(415, 417, 419)에 수용부(416, 418)이 형성될 수 있다. Accordingly, the shielding members 405, 407, 409 and the heat radiation members 415, 417, 419 are disposed on the first film 401 including the coil portion 403, and under the first film 401, The third film 411 may be disposed. The receiving portion is not formed in the first film 401 or the third film 411. The accommodating portions 412 and 414 may be formed in the shielding members 405 and 407 and the accommodating portions 416 and 418 may be formed in the radiating members 415 and 417 and 419. [
연결 기판(430)이 차폐부재(405, 407, 409)의 수용부(412, 414)와 방열부재(415, 417, 419)의 수용부(416, 418)에 삽입된 후, 솔더 페이스트 공정에 의해 연결 기판(430)에 코일부(403)의 내측패드(403b)와 외측패드(403c)가 전기적으로 연결될 수 있다. The connecting board 430 is inserted into the receiving portions 412 and 414 of the shielding members 405 and 407 and the receiving portions 418 and 418 of the heat radiating members 415 and 417 and 419, The inner pad 403b of the coil portion 403 and the outer pad 403c may be electrically connected to the connection board 430. [
이후 커팅 공정에 의해, 다수의 무선충전코일모듈(400, 400A)이 대량 생산될 수 있다. Thereafter, a plurality of wireless charging coil modules 400 and 400A can be mass-produced by the cutting process.
이와 같은 공정에 의해 무선충전코일모듈(400, 400A)이 공정 자동화에 의해 일괄적으로 대량 생산이 가능하다.By such a process, the wireless charging coil modules 400 and 400A can be mass-produced all at once by the process automation.
이상에서 설명된 공정 순서는 사용자의 사용 방법에 의해 얼마든지 변경 가능하다. The process sequence described above can be changed as much as desired by the user.
상기의 상세한 설명은 모든 면에서 제한적으로 해석되어서는 아니되고 예시적인 것으로 고려되어야 한다. 실시예의 범위는 첨부된 청구항의 합리적 해석에 의해 결정되어야 하고, 실시예의 등가적 범위 내에서의 모든 변경은 실시예의 범위에 포함된다.The foregoing detailed description should not be construed in all aspects as limiting and should be considered illustrative. The scope of the embodiments should be determined by rational interpretation of the appended claims, and all changes within the equivalents of the embodiments are included in the scope of the embodiments.
본 발명은 무선 전력 송수신 분야에 이용될 수 있다.The present invention can be used in the field of wireless power transmission and reception.

Claims (15)

  1. 제1 필름;A first film;
    상기 제1 필름 상에 배치되고, 내측패드와 외측패드를 포함하는 코일부;A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad;
    상기 코일부 상에 배치되고, 수용부를 갖는 차폐부재; 및A shielding member disposed on the coil portion, the shielding member having a receiving portion; And
    상기 수용부 내에 적어도 일부가 배치되는 연결 기판;을 포함하고,And a connecting substrate at least partially disposed in the accommodating portion,
    상기 수용부는,The receiving portion includes:
    상기 내측패드에서 상기 외측패드를 향하는 제1 방향으로 형성되는 제1 수용부; 및 A first receiving portion formed in a first direction from the inner pad toward the outer pad; And
    상기 제1 수용부와 연결되고, 상기 제1 방향과 다른 제2 방향으로 형성되는 제2 수용부를 포함하고,And a second accommodating portion connected to the first accommodating portion and formed in a second direction different from the first direction,
    상기 연결 기판은,Wherein:
    상기 제1 수용부에 배치되고, 상기 내측패드와 연결되는 제1 연결부;A first connection portion disposed in the first accommodation portion and connected to the inner pad;
    상기 제2 수용부에 배치되고, 상기 외측패드와 연결되는 제2 연결부; 및 A second connection portion disposed in the second accommodation portion and connected to the outer pad; And
    상기 제2 연결부에서 연장되고 절곡부를 포함하는 제3 연결부를 포함하는 무선충전코일모듈.And a third connection portion extending from the second connection portion and including a bent portion.
  2. 제1항에 있어서, The method according to claim 1,
    상기 연결 기판은,Wherein:
    상기 외측패드와 연결되는 제1 연결부재;A first connection member connected to the outer pad;
    상기 내측패드와 연결되는 제2 연결부재;A second connection member connected to the inner pad;
    상기 제1 연결부재와 연결되는 제1 접촉부;A first contact portion connected to the first connection member;
    상기 제2 연결부재와 연결되는 제2 접촉부를 포함하는 무선충전코일모듈.And a second contact portion connected to the second connection member.
  3. 제2항에 있어서,3. The method of claim 2,
    상기 연결 기판은,Wherein:
    제1 보호층;A first protective layer;
    상기 제1 보호층 상에 배치되는 절연층;An insulating layer disposed on the first passivation layer;
    상기 절연층 상에 배치되는 제2 보호층;A second protective layer disposed on the insulating layer;
    상기 제1 보호층과 상기 절연층 사이에 배치되고, 상기 제1 연결부재와 상기 제1 접촉부를 연결시키는 제1 도전 라인; 및A first conductive line disposed between the first protective layer and the insulating layer, the first conductive line connecting the first connecting member and the first contact; And
    상기 절연층과 상기 제2 보호층 사이에 배치되고, 상기 제2 연결부재와 상기 제2 접촉부를 연결시키는 제2 도전 라인을 포함하는 무선충전코일모듈.And a second conductive line disposed between the insulating layer and the second protective layer, the second conductive line connecting the second connection member and the second contact.
  4. 제1항에 있어서, The method according to claim 1,
    상기 제2 수용부의 폭은 상기 제1 수용부의 폭보다 크고, The width of the second accommodating portion is larger than the width of the first accommodating portion,
    상기 제1 및 제2 수용부는 상기 연결 기판의 상기 제1 및 제2 연결부에 대응되는 형상을 갖는 무선충전코일모듈.Wherein the first and second receiving portions have a shape corresponding to the first and second connecting portions of the connecting board.
  5. 제1항에 있어서, The method according to claim 1,
    상기 연결 기판의 상기 제1 연결부에는 상기 제2 도전라인만 배치되고,Wherein only the second conductive line is disposed in the first connection portion of the connection board,
    제1 비아를 통해 상기 제2 도전라인의 일부분이 상기 코일부의 상기 내측패드에 연결되고, A portion of the second conductive line through a first via is connected to the inner pad of the coil portion,
    상기 연결 기판의 상기 제2 연결부에는 상기 제1 도전라인과 상기 제2 도전라인이 수직으로 중첩되어 배치되고,The first conductive line and the second conductive line are vertically stacked on the second connection portion of the connection substrate,
    제2 바이를 통해 상기 제1 도전라인의 일부분이 상기 코일부의 상기 외측패드에 연결되는 무선충전코일모듈.And a portion of the first conductive line is connected to the outer pad of the coil portion via a second via.
  6. 제1 필름;A first film;
    상기 제1 필름 상에 배치되고, 내측패드와 외측패드를 포함하는 코일부;A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad;
    상기 코일부 상에 배치되고, 수용부를 갖는 차폐부재; 및A shielding member disposed on the coil portion, the shielding member having a receiving portion; And
    상기 수용부 내에 적어도 일부가 배치되는 연결 기판;을 포함하고,And a connecting substrate at least partially disposed in the accommodating portion,
    상기 연결 기판은,Wherein:
    제1 보호층;A first protective layer;
    상기 제1 보호층 상에 배치되는 절연층;An insulating layer disposed on the first passivation layer;
    상기 절연층 상에 배치되는 제2 보호층;A second protective layer disposed on the insulating layer;
    상기 제1 보호층과 상기 절연층 사이에 배치되는 제1 도전 라인; 및A first conductive line disposed between the first passivation layer and the insulating layer; And
    상기 절연층과 상기 제2 보호층 사이에 배치되는 제2 도전 라인을 포함하고, And a second conductive line disposed between the insulating layer and the second passivation layer,
    상기 제2 도전 라인이 배치되는 제1 연결부; A first connection part in which the second conductive line is disposed;
    상기 제1 도전 라인과 상기 제2 도전 라인이 수직 방향으로 중첩되는 제2 연결부; 및A second connection part in which the first conductive line and the second conductive line are overlapped in a vertical direction; And
    상기 제1 도전 라인과 상기 제2 도전 라인이 수직 방향으로 중첩되지 않고 수평 방향으로 중첩되는 제3 연결부을 포함하는 무선충전코일모듈.And a third connection portion in which the first conductive line and the second conductive line are overlapped in a horizontal direction without overlapping in a vertical direction.
  7. 제6항에 있어서,The method according to claim 6,
    상기 제1 연결부에 배치되는 제1 연결부재;A first connection member disposed at the first connection portion;
    상기 제2 연결부에 배치되는 제2 연결부재; 및A second connecting member disposed at the second connecting portion; And
    상기 제3 연결부에 배치되는 제1 및 제2 접촉부를 포함하고, And first and second contact portions disposed on the third connection portion,
    상기 제1 도전라인은 상기 제1 연결부재와 상기 제1 접촉부를 연결시키고,The first conductive line connects the first connection member and the first contact,
    상기 제2 도전라인은 상기 제2 연결부재와 상기 제2 접촉부를 연결시키는 무선충전코일모듈.And the second conductive line connects the second connection member and the second contact.
  8. 제6항에 있어서, The method according to claim 6,
    상기 연결 기판의 상기 제1 연결부에는 상기 제2 도전라인만 배치되고,Wherein only the second conductive line is disposed in the first connection portion of the connection board,
    제1 비아를 통해 상기 제2 도전라인의 일부분이 상기 코일부의 상기 내측패드에 연결되고,A portion of the second conductive line through a first via is connected to the inner pad of the coil portion,
    상기 연결 기판의 상기 제2 연결부에는 상기 제1 도전라인과 상기 제2 도전라인이 수직으로 중첩되어 배치되고,The first conductive line and the second conductive line are vertically stacked on the second connection portion of the connection substrate,
    제2 바이를 통해 상기 제1 도전라인의 일부분이 상기 코일부의 상기 외측패드에 연결되는 무선충전코일모듈.And a portion of the first conductive line is connected to the outer pad of the coil portion via a second via.
  9. 제1 필름;A first film;
    상기 제1 필름 상에 배치되고, 내측패드와 외측패드를 포함하는 코일부;A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad;
    상기 코일부 상에 배치되고, 수용부를 갖는 차폐부재; 및A shielding member disposed on the coil portion, the shielding member having a receiving portion; And
    상기 수용부 내에 적어도 일부가 배치되는 연결 기판;을 포함하고,And a connecting substrate at least partially disposed in the accommodating portion,
    상기 연결 기판은,Wherein:
    상기 외측패드와 연결되는 제1 연결부재;A first connection member connected to the outer pad;
    상기 내측패드와 연결되는 제2 연결부재;A second connection member connected to the inner pad;
    상기 제1 연결부재와 연결되는 제1 접촉부;A first contact portion connected to the first connection member;
    상기 제2 연결부재와 연결되는 제2 접촉부를 포함하고,And a second contact portion connected to the second connection member,
    상기 제1 연결부재와 상기 제2 연결부재는 상기 연결 기판의 제1 면으로 노출되고, The first connection member and the second connection member are exposed to the first surface of the connection substrate,
    상기 제1 접촉부와 상기 제2 접촉부는 상기 연결 기판의 상기 제1면과 다른 제2 면으로 노출되는 무선충전코일모듈.Wherein the first contact portion and the second contact portion are exposed to a second surface different from the first surface of the connection substrate.
  10. 제9항에 있어서, 10. The method of claim 9,
    상기 연결 기판은,Wherein:
    상기 내측패드에서 상기 외측패드를 향하는 제1 방향으로 형성되는 제1 연결부;A first connection portion formed in a first direction from the inner pad toward the outer pad;
    상기 제1 방향과 다른 제2 방향으로 형성되는 제2 연결부; 및A second connection part formed in a second direction different from the first direction; And
    상기 제2 연결부에서 제3 방향으로 연장되고 상기 제2 방향과 다른 제4 방향으로 연장되는 제3 연결부;를 포함하고,And a third connection part extending in a third direction at the second connection part and extending in a fourth direction different from the second direction,
    상기 제3 연결부는 수직으로 연장된 후 수평으로 연장되는 절곡부를 포함하는 무선충전코일모듈.And the third connection portion includes a bent portion extending vertically and then extending horizontally.
  11. 제9에 있어서, In the ninth aspect,
    상기 차폐부재는,The shielding member
    상기 제1 필름 및 상기 코일부에 부착되는 제1 접착부재;A first adhesive member attached to the first film and the coil part;
    상기 제1 접착부재 상에 배치되는 차폐재; 및A shielding material disposed on the first adhesive member; And
    상기 차폐재 상에 배치되는 제2 필름을 포함하는 무선충전코일모듈.And a second film disposed on the shielding material.
  12. 제11항에 있어서,12. The method of claim 11,
    상기 차폐재는 EMB 차폐재이고, 적어도 73㎛이하의 두께를 가지며, Wherein the shielding material is an EMB shielding material and has a thickness of at least 73 mu m,
    상기 차폐재의 제1 및 제2 수용부의 폭은 상기 제2 필름의 제1 및 제2 수용부의 폭보다 큰 무선충전코일모듈.Wherein a width of the first and second receiving portions of the shielding material is larger than a width of the first and second receiving portions of the second film.
  13. 커넥터를 갖는 메인 기판;A main board having a connector;
    상기 메인 기판 상에 배치되는 무선충전코일모듈을 포함하고,And a wireless charging coil module disposed on the main board,
    상기 무선충전코일모듈은,The wireless charging coil module includes:
    제1 필름;A first film;
    상기 제1 필름 상에 배치되고, 내측패드와 외측패드를 포함하는 코일부;A coil portion disposed on the first film, the coil portion including an inner pad and an outer pad;
    상기 코일부 상에 배치되고, 수용부를 갖는 차폐부재; 및A shielding member disposed on the coil portion, the shielding member having a receiving portion; And
    상기 수용부 내에 적어도 일부가 배치되는 연결 기판;을 포함하고,And a connecting substrate at least partially disposed in the accommodating portion,
    상기 수용부는,The receiving portion includes:
    상기 내측패드에서 상기 외측패드를 향하는 제1 방향으로 형성되는 제1 수용부; 및 A first receiving portion formed in a first direction from the inner pad toward the outer pad; And
    상기 제1 수용부와 연결되고, 상기 제1 방향과 다른 제2 방향으로 형성되는 제2 수용부를 포함하고,And a second accommodating portion connected to the first accommodating portion and formed in a second direction different from the first direction,
    상기 연결 기판은,Wherein:
    상기 제1 수용부에 배치되고, 상기 내측패드와 연결되는 제1 연결부;A first connection portion disposed in the first accommodation portion and connected to the inner pad;
    상기 제2 수용부에 배치되고, 상기 외측패드와 연결되는 제2 연결부; 및 A second connection portion disposed in the second accommodation portion and connected to the outer pad; And
    상기 제2 연결부에서 연장되고 절곡부를 포함하는 제3 연결부를 포함하는 무선충전장치.And a third connection portion extending from the second connection portion and including a bent portion.
  14. 제13항에 있어서,14. The method of claim 13,
    상기 연결 기판이 상기 메인 기판의 상기 커넥터에 체결되기 위해 상기 연결 기판의 일부분이 회전되는 무선충전장치.And a part of the connection board is rotated so that the connection board is fastened to the connector of the main board.
  15. 제14항에 있어서,15. The method of claim 14,
    상기 연결 기판의 일부분은 상기 코일부의 내측으로부터 상기 코일부의 외측을 향해 회전되는 무선충전장치.And a part of the connecting board is rotated from the inside of the coil part toward the outside of the coil part.
PCT/KR2019/000525 2018-01-23 2019-01-14 Wireless charging coil module and wireless charging device WO2019146944A1 (en)

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EP4280238A4 (en) * 2021-02-03 2024-06-26 Huawei Technologies Co., Ltd. Coil module, coil encapsulation structure, and wireless charging device

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CN113921246A (en) * 2020-07-10 2022-01-11 株式会社Mst科技 Coil module and method for manufacturing the same
EP4280238A4 (en) * 2021-02-03 2024-06-26 Huawei Technologies Co., Ltd. Coil module, coil encapsulation structure, and wireless charging device

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