WO2019140580A1

WO2019140580A1 - Encapsulation assembly and display module

Info

Publication number: WO2019140580A1
Application number: PCT/CN2018/073099
Authority: WO
Inventors: 李问杰
Original assignee: 深圳信炜生物识别科技有限公司
Priority date: 2018-01-17
Filing date: 2018-01-17
Publication date: 2019-07-25
Also published as: CN209486695U

Abstract

An encapsulation assembly (200) and a display module. The encapsulation assembly (200) comprises: an encapsulation cover plate (21) comprising a first side (210) and a second side (211), the first side (210) being used for encapsulating a display assembly (100); and a photosensitive layer (22) disposed on the second side (211) of the encapsulation cover plate (21) and used for sensing an optical signal coming from above and generating a corresponding electrical signal. The display module comprises the encapsulation assembly (200) and the display assembly (100), the encapsulation assembly (200) being used for encapsulating the display assembly (100).

Description

Package component and display module

Technical field

The present application relates to a package assembly and a display module for implementing sensing biometric information.

Background technique

At present, biometric information sensors, especially fingerprint recognition sensors, have gradually become the standard components of electronic products such as mobile terminals. Since the optical fingerprint recognition sensor has stronger penetration ability than the capacitive fingerprint recognition sensor, an optical fingerprint recognition module applied to the mobile terminal has been proposed. As shown in FIG. 1, the optical fingerprint recognition module includes an optical fingerprint sensor 400 and a light source 402. The optical fingerprint sensor 400 is disposed under the protective cover 401 of the mobile terminal. The light source 402 is disposed adjacent to one side of the optical fingerprint sensor 400. When the user's finger F contacts the protective cover 401, the light signal emitted by the light source 402 passes through the protective cover 401 and reaches the finger F, is reflected by the valleys and ridges of the finger F, and is received by the optical fingerprint sensor 400, and A fingerprint image of the finger F is formed.

However, the above optical fingerprint recognition module can only be limited to a predetermined area of the mobile terminal, such as a non-display area of the mobile terminal, and must contact the predetermined area to perform fingerprint recognition, and the use is still limited. Therefore, it is necessary to propose a structure that can be set in the display area and realize fingerprint recognition of any area in the display area.

Application content

The embodiments of the present application aim to at least solve one of the technical problems existing in the prior art. Therefore, the embodiment of the present application needs to provide a package component and a display module.

A package component of an embodiment of the present application includes:

a package cover comprising a first side and a second side, the first side being for encapsulating a display assembly;

The photosensitive layer is disposed on the second side of the package cover for sensing an optical signal from above and generating a corresponding electrical signal.

The embodiment of the present application forms a photosensitive layer on the package cover of the package display assembly, thereby eliminating the need for an additional substrate of the photosensitive layer, which not only saves cost, but also saves the thickness of the display module. In addition, in the display module, the display component and other components can be independently prepared, that is, after the photosensitive layer is formed on the transparent cover, the transparent cover is packaged to display the component, thereby speeding up the process of the display module.

In some embodiments, the package cover is a transparent cover.

In some embodiments, the package cover is a rigid substrate or a flexible film.

In some embodiments, the package assembly further includes a touch layer disposed on the photosensitive layer, the touch layer being configured to detect whether an object contacts or approaches the package assembly.

In some embodiments, the touch layer includes a plurality of transparent electrodes and conductive leads connecting the plurality of transparent electrodes.

In some embodiments, the package assembly further includes a collimating layer on the touch layer for passing light in a direction perpendicular to the package cover or near the vertical direction .

In certain embodiments, the collimating layer is integrally formed. In this way, the processing process of the alignment layer is made simpler. Moreover, the alignment layer can be independently processed and placed on the touch layer to speed up the process of the display module.

In some embodiments, the photosensitive layer includes a plurality of photosensitive pixels, and the plurality of photosensitive pixels are arranged in a two-dimensional array.

In some embodiments, the collimating layer includes a collimating member corresponding to the plurality of photosensitive pixels, and the adjacent collimating members are connected by a connecting portion. The alignment layer is integrated by the connecting portion, so that the independently formed alignment layer is disposed on the touch layer.

In some embodiments, the collimating member includes a plurality of light absorbing walls and light through holes surrounded by the plurality of light absorbing walls.

In some embodiments, the material of the connecting portion is the same as the material of the light absorbing wall.

In some embodiments, the photosensitive layer further includes scan lines and data lines electrically connected to the plurality of photosensitive pixels, the scan lines for transmitting a driving signal to drive the plurality of photosensitive pixels to perform Light sensing; the data line is used to output a sensing signal generated when the plurality of photosensitive pixels perform light sensing.

In some embodiments, the connection is located directly above the scan line and/or data line and is used to cover the scan line and/or data line. As such, the connection portion will have a corresponding light-shielding effect on the scan lines and the data lines, and it is not necessary to additionally provide a light-shielding structure for the scan lines and the data lines.

In some embodiments, the package assembly further includes a polarizing layer, the polarizing layer being on the collimating layer.

In some embodiments, the package assembly further includes a protective cover on the polarizing layer.

A display module according to an embodiment of the present invention includes a display component and a package component, the package component is used to package the display component, and the package component is the package component of any of the above embodiments. Therefore, it has all the beneficial effects of the above display module.

The additional aspects and advantages of the embodiments of the present application will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the embodiments of the present application will become apparent and readily understood from

1 is a schematic diagram of an optical sensing structure applied to an electronic device in the prior art;

2 is a schematic structural diagram of a display module according to an embodiment of the present application;

3 is a partially enlarged schematic structural view of a portion A of the display module shown in FIG. 2;

4 is a schematic structural view of a photosensitive layer in a display module according to an embodiment of the present application;

5 is a schematic circuit diagram of a photosensitive pixel in a photosensitive layer according to another embodiment of the present application;

6 is a schematic top plan view of a collimating layer according to an embodiment of the present application;

7 is a schematic view showing a preparation process of a collimating layer according to an embodiment of the present application;

8 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

9 is a schematic structural view of a cross section of the electronic device shown in FIG. 8 taken along line I-I.

Detailed ways

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.

In the description of the present application, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise. "Contact" or "touch" includes direct or indirect contact. For example, the photosensitive module and the display module disclosed in the following are disposed inside the electronic device, such as under the protective cover, and the user's finger indirectly contacts the photosensitive module and the display module through the protective cover.

In the description of the present application, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise specifically defined and defined. Connected, or integrally connected; may be mechanically connected, or may be electrically connected or may communicate with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. The specific meanings of the above terms in the present application can be understood by those skilled in the art on a case-by-case basis.

The following disclosure provides many different embodiments or examples for implementing the different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of the specific examples are described below. Of course, they are merely examples and are not intended to limit the application. In addition, the present application may repeat reference numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or settings discussed. Moreover, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Further, the described features, structures may be combined in one or more embodiments in any suitable manner. In the following description, numerous specific details are set forth However, those skilled in the art should appreciate that the technical solution of the present application can be practiced without one or more of the specific details, or other structures, components, and the like. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the application.

In some embodiments, please refer to FIG. 2, which illustrates the structure of a display module according to an embodiment of the present application. The display module 1 includes a display assembly 100 and a package assembly 200. When the display assembly 100 is in operation, a corresponding optical signal is emitted for display. The package assembly 200 is located above the display assembly 100 for encapsulating the display assembly 100 to prevent dust, moisture, and the like in the air from corroding the display assembly 100, thereby causing degradation of electrical performance of the display assembly 100, thereby affecting display. The life of the assembly 100.

Further, please refer to FIG. 2 and FIG. 3 again. FIG. 3 shows a partially enlarged structure of the A portion of the display module of FIG. The package assembly 200 includes a package cover 21 and a photosensitive layer 22 disposed on the package cover 21. The package cover 21 is a transparent cover plate including a first side 210 and a second side 211 disposed opposite to each other in a thickness direction thereof. The first side 210 faces the display assembly 100 for packaging the display assembly 100. The photosensitive layer 22 is formed on the second side 211 of the package cover 21, and includes a plurality of photosensitive pixels 220, and the plurality of photosensitive pixels 220 are arranged in a two-dimensional array for performing optical signals from above the photosensitive layer 22. Sensing and generating a corresponding electrical signal. In this way, the display module 1 can realize the sensing of the biometric information. Specifically, when the object is located above the package assembly 200, the light signal emitted by the display assembly 100 passes through the package assembly 200 and reaches the object, and reflection will occur, and the reflected light signal is sensed by the photosensitive layer 22. Since the surface of the object has a rough texture, there is a difference in the degree of reflection of the light signal, and thus the biometric information of the object can be obtained according to the signal sensed by the photosensitive layer 22. It should be noted that the optical paths of the two optical signals are only schematically shown in FIG. 2, and are not limited to the optical paths of other optical signals.

The embodiment of the present application forms the photosensitive layer 22 on the transparent cover 21 of the package display assembly 100, so that the substrate of the photosensitive layer 22 is not required to be additionally disposed, which not only saves cost, but also saves the overall thickness of the display module 1. . In addition, in the display module 1, the display component 100 and the other components can be independently prepared, that is, after the photosensitive layer 22 is formed on the transparent cover 21, the transparent cover 21 is then packaged to display the component 100, thereby accelerating the display module. 1 process.

Further, please refer to FIG. 4. FIG. 4 shows the structure of the photosensitive layer according to an embodiment of the present application. A plurality of photosensitive pixels 220 in the photosensitive layer are distributed in an array on the package cover 21, and a scan line group and a data line group electrically connected to the photosensitive pixels 220 are formed on the package cover 21, and the scan line group is used for The scan driving signal is transmitted to the photosensitive pixel 220 to activate the photosensitive pixel 220 to perform light sensing, and the data line group is used to output an electrical signal generated by the photosensitive pixel 220 performing light sensing.

Specifically, the photosensitive pixels 220 are distributed in an array, such as a matrix distribution. Of course, it can also be distributed in other rule manners or in an irregular manner. The scan line group includes a plurality of scan lines 201. The data line group includes a plurality of data lines 202. The plurality of scan lines 201 and the plurality of data lines 202 are disposed to cross each other and disposed between adjacent photosensitive pixels 220. For example, a plurality of scanning lines G1, G2, ..., Gm are arranged at intervals in the Y direction, and a plurality of data lines S1, S2, ..., Sn are arranged at intervals in the X direction. However, the plurality of scanning lines 201 and the plurality of data lines 202 are not limited to the vertical arrangement shown in FIG. 4, and may be disposed at an angle, for example, 30°, 60°, or the like. In addition, due to the conductivity of the scan lines 201 and the data lines 202, the scan lines 201 and the data lines 202 at the intersections are separated by an insulating material.

It should be noted that the distribution and the number of the scan lines 201 and the data lines 202 are not limited to the above-exemplified embodiments, and the corresponding scan line groups and data lines may be correspondingly set according to the structure of the photosensitive pixels 220. group.

Further, a plurality of scan lines 201 are connected to a photosensitive driving circuit 230, and a plurality of data lines 202 are connected to a signal processing circuit 250. The photosensitive driving circuit 230 is configured to provide a corresponding scan driving signal and transmit it to the corresponding photosensitive pixel 220 through the corresponding scanning line 201 to activate the photosensitive pixel 220 to perform light sensing. The photosensitive driving circuit 230 is formed on the package cover 21, and of course, it can also be electrically connected to the photosensitive pixel 220 through a connecting member (for example, a flexible circuit board), that is, a plurality of scanning lines 201 are connected. The signal processing circuit 250 receives an electrical signal generated by the corresponding photosensitive pixel 220 performing light sensing through the data line 202, and acquires biometric information of the target object based on the electrical signal.

In some embodiments, the signal processing circuit 250 and the photosensitive driving circuit 230 are further connected to a controller 27 for controlling the driving circuit to output a corresponding scanning driving signal, such as but not limited to activating the photosensitive pixels line by line. 220 performs light sensing. The controller 270 is further configured to control the signal processing circuit 250 to receive the electrical signal output by the photosensitive pixel 220, and after receiving the electrical signal output by all the photosensitive pixels 220 performing the light sensing, generate biometric information of the target object according to the electrical signal. .

Further, the signal processing circuit 250 and the controller 270 may be disposed on the package cover 21. Of course, in order to save space occupied by the package cover 21, the signal processing circuit 250 and the controller 270 may also be connected by, for example, a connector (for example, The flexible circuit board is electrically connected to the photosensitive pixel 220.

In some embodiments, please refer to FIG. 5. FIG. 5 illustrates a connection structure of the photosensitive pixel 220 of the embodiment with the scan line 201 and the data line 202. The photosensitive pixel 220 includes at least one photosensitive device Q1 and a switching device Q2. The switching device Q2 has a control terminal C and two signal terminals, for example, a first signal terminal Sn1 and a second signal terminal Sn2. The control terminal C of the switching device Q2 is connected to the scan line 202, the first signal terminal Sn1 of the switching device Q2 is connected to a reference signal L via the photosensitive device Q1, and the second signal terminal Sn2 of the switching device Q2 is connected to the data line 201. It should be noted that the photosensitive pixel 220 illustrated in FIG. 5 is for illustrative purposes only and is not limited to other constituent structures of the photosensitive pixel 220.

Specifically, the above-mentioned photosensitive device Q1 is, for example but not limited to, any one or several of a photodiode, a phototransistor, a photodiode, a photo resistor, and a thin film transistor. Taking the photodiode shown in FIG. 5 as an example, by applying a negative voltage to both ends of the photodiode, at this time, if the photodiode receives the optical signal, a photocurrent that is proportional to the optical signal is generated, and is received. The greater the intensity of the optical signal, the larger the photocurrent generated, and the faster the voltage drop across the negative pole of the photodiode. Therefore, by collecting the voltage signal on the negative electrode of the photodiode, the optical signal intensity reflected from different parts of the object is obtained. And then obtain biometric information of the object. It can be understood that a plurality of photosensitive devices Q1 are provided to increase the photosensitive effect.

Further, the switching device Q2 is, for example but not limited to, any one or several of a triode, a MOS transistor, and a thin film transistor. Of course, the switching device Q2 may also include other types of devices, and the number may also be two, three, and the like.

In some embodiments, the switching device Q2 may be disposed under the photosensitive device Q1, or the switching device Q2 may be partially overlapped with the photosensitive device Q1. The scan line 201 and the data line 202 may also be disposed under the switching device Q2. Thus, the arrangement of the photosensitive pixels 220, the scanning lines 201, and the data lines 202 can be made more compact, and in the case where the installation area is limited, the photosensitive area of the photosensitive device Q1 is increased, thereby enhancing the sensing effect of the photosensitive layer 22.

Specifically, in some embodiments, the semiconductor layer and the upper electrode of the photosensitive device Q1 may also extend over the switching device Q2 to increase the sensing area. Taking the photosensor Q1 as a photodiode as an example, the anode and the semiconductor layer of the photodiode extend above the switching device Q2, covering the switching device Q2, and the anode is further provided with a light shielding layer above the region of the switching device Q2 to prevent the light from illuminating the switching device Q2. . The cathode of the photodiode is connected to the switching device Q2. The cathode is a lower electrode, for example made of a non-transmissive conductive material, such as a metallic material.

In some embodiments, the package cover 21 can comprise a rigid transparent substrate (e.g., a glass substrate) or a flexible film. The rigid substrate can be used to enhance the package strength, and the flexible film can realize the function of the curved screen. In actual use, the material of the package cover 21 can be flexibly set according to needs.

In some embodiments, the package assembly 200 further includes a touch layer 23 disposed on the photosensitive layer 22 for detecting whether an object contacts or approaches the package assembly 200. Specifically, the touch layer 23 includes a plurality of transparent electrodes and conductive leads connecting the plurality of transparent electrodes to implement self-capacitive touch detection and/or mutual capacitance touch detection. It should be noted that the plurality of transparent electrodes may be formed in a single layer structure or a multi-layer structure, and the arrangement rules of the plurality of transparent electrodes may be flexibly set as needed, which is not limited herein.

Further, the conductive lead of the touch layer 23 is further connected with a touch detection circuit (not shown) for providing a control signal to the transparent electrode, and determining a touch position according to the detection signal of the transparent electrode. . It can be understood that the touch detection circuit can be integrated with the controller 270 and the signal processing circuit 250 of the photosensitive layer 22 on one chip, that is, the touch layer 23 and the photosensitive layer 22 share the same integrated circuit, thereby saving the control component. Cost, but also simplifies the control line. Of course, in order to better achieve touch control and photosensitive control, the corresponding control structure can also be set separately.

In some embodiments, the package assembly 200 further includes a collimating layer 24 on the touch layer 23 for passing light in a direction perpendicular to the package cover 21 or near the vertical direction. The collimating layer 24 allows the incident light rays at a large angle (the angle which is an angle between the incident light direction and the vertical direction) to pass through, thereby improving the photosensitive precision.

In some embodiments, please refer to FIG. 6, which shows a top view structure of the alignment layer. The alignment layer 24 is integrally formed. Specifically, the alignment layer 24 includes a collimating member 240 corresponding to the plurality of photosensitive pixels 220, and the adjacent collimating members 240 are connected by a connecting portion 241. Since the alignment layer 24 is integrally formed, the processing process of the alignment layer 24 is simpler, and the alignment layer 24 can be independently processed and placed on the touch layer 23, thereby accelerating the process of the package assembly 200.

In some embodiments, referring to FIG. 3 , the collimating member 240 includes a plurality of light absorbing walls 242 and light through holes 243 surrounded by the plurality of light absorbing walls 242 . Further, the material of the connecting portion 241 is the same as that of the light absorbing wall 242, so that not only the integral forming of the alignment layer 24 but also the processing of the alignment layer 24 is simplified.

Further, since the collimating member 240 in the collimating layer 24 is disposed corresponding to the photosensitive pixel 220, the connecting portion 241 between the collimating members 240 corresponds to the scanning line and the data line in the photosensitive layer 22, so if the connecting portion 241 is located Directly above the scan lines and the data lines, and covering the scan lines and the data lines, the connection portion 241 has a corresponding light-shielding effect on the scan lines and the data lines, so that it is not necessary to additionally provide a light-shielding structure for the scan lines and the data lines.

Further, please refer to FIG. 7. FIG. 7 illustrates a process of preparing a collimating layer according to an embodiment of the present application. When the alignment layer 24 is independently processed, the method may include: S1, first providing a molding die, the molding die is disposed according to the arrangement of the collimating member 240 and the specific structure of the collimating member 240, for example, a plurality of forming walls are formed. Filling groove of 242; S2, filling the light-absorbing material in the forming mold and solidifying it, in order to make the filling groove of the forming mold fully filled with the light-absorbing material, the filled light-absorbing material exceeds the forming mold; S3, removing the forming mold Obtaining a semi-finished product of the alignment layer; S4, removing excess light absorbing material to form a collimating layer 24.

In some embodiments, the package assembly 200 further includes a polarizing layer 25 on the alignment layer 24.

In some embodiments, the package assembly 200 further includes a protective cover 26 on the polarizing layer 25 to prevent direct contact between the object and the components in the display module 1 to implement the display module 1 protection of.

In some embodiments, the display component in the display module includes a plurality of display pixels, and the plurality of display pixels are used to emit an optical signal for display. The display component is, for example, an OLED display component, a liquid crystal display component, or other display component having a display function. The photosensitive layer includes a plurality of photosensitive pixels, and the photosensitive pixels are disposed corresponding to the display pixels. When an object is located above the display module, the optical signal emitted by the display pixel passes through the photosensitive layer and reaches the object, and the optical signal reflected by the object is sensed by the photosensitive layer, thereby obtaining biometric information of the object, such as fingerprint information. .

Referring to FIG. 2 and FIG. 3 together, the display assembly 100 shown in FIG. 2 is an OLED assembly. Specifically, the display component includes an array substrate 11 and a plurality of display pixels on the array substrate 11, and the display pixels are self-luminous pixels. Each display pixel includes at least one light-emitting element 12, and the area where the light-emitting element 12 is located is the display area L1, and the remaining area is the non-display area L2. The light-emitting element 12 is for emitting an optical signal of one or several colors of red, yellow, blue, green, white, and black. Part or all of the photosensitive pixel 220 is located above the non-display area L2. In one embodiment, the projections of the photosensitive pixels 220 on the array substrate 11 all fall within the non-display area L2. In another embodiment, the projection of the photosensitive pixels 220 on the array substrate 11 partially falls within the non-display area L2. The other part is located in the display area L1. Further, in order not to affect the normal display of the display area L1, the portion falling on the display area L1 will be set to a transparent structure.

Further, with continued reference to FIG. 2, the array substrate 11 includes a substrate 111 and a plurality of TFT thin film transistors 112 and a driving circuit (not shown) formed on the substrate 111. The light-emitting element 12 is an organic light-emitting diode device, and specifically includes a reflective anode 121, an organic light-emitting layer 122, and a translucent cathode 123. When the above-mentioned light-emitting element 12 operates, a corresponding driving signal is applied on the emitter anode 121 and the semi-transparent cathode 123, thereby exciting the rapid flow of electrons and holes in the organic light-emitting layer 122, and when the electrons fill the holes, the corresponding ones are released. The light energy, in turn, causes the organic light-emitting layer 122 to emit light. Most of the optical signal emitted by the organic light-emitting layer 122 is emitted through the translucent cathode 123, and the rest is repeatedly reflected between the translucent cathode 123 and the reflective anode 121, or is emitted from the translucent cathode 123, or the optical signal is gradually weakened. Until it disappears. It should be noted that only the basic structure of the light-emitting element 12 is shown in FIG. 2, and other structures for enhancing the display effect, such as a hole transport layer, an electron transport layer, an electron blocking layer, a hole blocking layer, etc., may be actually added. . The display component formed by the light-emitting element 12 is a top-emitting structure, and of course, it can be flexibly set to a bottom-emitting structure and a double-sided light-emitting structure according to different uses.

In the above display module 100, independent control of the light-emitting elements 12, that is, one or more of the light-emitting elements 12, can be achieved according to the control of the driving circuit and the TFT thin film transistor 112. In addition, the light-emitting element 12 is used to emit light signals of the same color, such as white or black; or light signals of different colors, such as red, blue, green, yellow, and the like.

Further, referring to FIG. 6 again, since the collimating member 240 of the collimating layer 24 is disposed above the photosensitive device Q1 of the photosensitive pixel 220, and the collimating member 240 is again a light absorbing structure, in order not to affect the normality of the display assembly 100. It is shown that the photosensitive device Q1 of the photosensitive pixel 220 must be disposed above the non-display area L2. In addition, since the area of the switching device Q2 is small, the switching device Q2 is disposed in the display region L1 without affecting the display effect of the display assembly 100. Of course, in order to achieve a better display effect, it is preferable to arrange the structure of the photosensitive pixel 220 above the non-display area L2. It can be understood that if the device in the photosensitive pixel 220 is a transparent structure, the device can also be disposed in the display region L1 of the display assembly 100, such as the photosensitive device Q1 of the transparent structure. It should be noted that the display pixels in FIG. 6 include three display pixels of R, G, and B, and are not limited to other display pixels. The display pixel herein may also refer to one or more of three display pixels including R, G, and B. Moreover, the arrangement structure of the display pixels is merely illustrative, and is not limited to other arrangement structures.

In some embodiments, in the process of the display module 1 described above, the package assembly 200 and the display assembly 100 may be separately formed according to the structure described above, and then the display assembly 100 may be packaged by the package assembly 200. Of course, the package of the display assembly 100 can also be performed after forming part of the structure of the package assembly 200. For example, after the photosensitive layer 22 and the touch layer 23 are sequentially formed on the package cover 21, the package cover 21 forming the photosensitive layer 22 and the touch layer 23 is used to package the display component 100, and then the touch after packaging. A alignment layer 24, a polarizing layer 25, and a protective cover 26 are sequentially disposed on the layer 23.

Further, referring to FIG. 8 and FIG. 9, FIG. 8 shows a structure of an electronic device according to an embodiment of the present application, and FIG. 9 shows a cross-sectional structure of the electronic device shown in FIG. 8 along line II, and FIG. 9 shows only Part of the structure of the electronic device. The electronic device is provided with the display module 1 of any one of the above embodiments, which is used for image display of an electronic device and for sensing biometric information of a target object contacting or approaching the electronic device.

Electronic devices such as, but not limited to, suitable types of electronic products such as consumer electronics, home electronics, vehicle-mounted electronic products, and financial terminal products. Among them, consumer electronic products such as mobile phones, tablets, notebook computers, desktop monitors, computer integrated machines. Home-based electronic products such as smart door locks, TVs, refrigerators, and wearable devices. Vehicle-mounted electronic products such as car navigation systems, car DVDs, etc. Financial terminal products such as ATM machines, terminals for self-service business, etc. The electronic device shown in FIG. 9 is exemplified by a mobile terminal of the mobile phone type. However, the display module is also applicable to other suitable electronic products, and is not limited to mobile terminals.

Specifically, the front side of the mobile terminal 3 is provided with a display area 101, and the screen area of the display area 101 is relatively high, for example, 80% or more. The screen ratio refers to the ratio of the display area 101 to the front area of the mobile terminal 3. The mobile terminal 3 includes the display component 100 and the package component 200 in the display module 1 . The area formed by the plurality of display pixels in the display component 100 is the display area 101 , and the plurality of photosensitive pixels of the photosensitive layer 22 in the package component 200 . The formed area is a photosensitive area, and the photosensitive area is greater than or equal to the display area 101, so that the display module 1 can realize biometric information sensing of an object at any position within the display screen.

Specifically, when the mobile terminal 3 is in a bright screen state and is in the biometric information sensing mode, the display component 100 emits an optical signal. When an object contacts or approaches the display area 101, the photosensitive layer 22 receives the optical signal reflected by the object, converts the received optical signal into a corresponding electrical signal, and then acquires the object based on the electrical signal. Biometric information, such as fingerprint image information, is predetermined. Of course, alternatively, the photosensitive area may be set smaller than the display area 101 based on considerations of other factors such as cost, so that the biometric information sensing of the object on the local area in the display screen can be realized.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. The specific features, structures, materials, or characteristics described in the embodiments or examples are included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless specifically defined otherwise.

While the embodiments of the present application have been shown and described above, it is understood that the foregoing embodiments are illustrative and are not to be construed as limiting the scope of the present application. The embodiments are subject to changes, modifications, substitutions and variations.

Claims

A package component comprising:

a package cover comprising a first side and a second side, the first side being for encapsulating a display assembly;

The photosensitive layer is disposed on the second side of the package cover for sensing an optical signal from above and generating a corresponding electrical signal.
The package assembly of claim 1 wherein said package cover is a transparent cover.
The package assembly of claim 2 wherein said package cover is a rigid substrate or a flexible film.
The package assembly of claim 1 , wherein the package assembly further comprises a touch layer disposed on the photosensitive layer, the touch layer being configured to detect whether an object contacts or approaches the package assembly .
The package assembly of claim 4 wherein said touch layer comprises a plurality of transparent electrodes and conductive leads connecting said plurality of transparent electrodes.
The package assembly of claim 4, wherein the package assembly further comprises a alignment layer, the alignment layer being located on the touch layer for providing a direction perpendicular to or close to the package cover The light in the vertical direction passes through.
The package assembly of claim 6 wherein said alignment layer is integrally formed.
The package assembly of claim 6 wherein said photosensitive layer comprises a plurality of photosensitive pixels and said plurality of photosensitive pixels are arranged in a two-dimensional array.
A package assembly according to claim 8 wherein said alignment layer comprises a collimating member corresponding to said plurality of photosensitive pixels, and said adjacent collimating members are connected by a connecting portion.
A package assembly according to claim 9, wherein said collimating member comprises a plurality of light absorbing walls and light through holes surrounded by said plurality of light absorbing walls.
The package assembly according to claim 10, wherein the material of the connecting portion is the same as the material of the light absorbing wall.
The package assembly of claim 9 wherein said photosensitive layer further comprises scan lines and data lines electrically coupled to said plurality of photosensitive pixels, said scan lines for transmitting a drive signal for driving The plurality of photosensitive pixels perform light sensing; the data lines are used to output a sensing signal generated when the plurality of photosensitive pixels perform light sensing.
The package assembly of claim 12 wherein said connection portion is located directly above said scan line and/or data line and is for covering said scan line and/or data line.
The package assembly of claim 6 wherein said package assembly further comprises a polarizing layer, said polarizing layer being located on said alignment layer.
The package assembly of claim 14 wherein said package assembly further comprises a protective cover over said polarizing layer.
A display module, comprising: a display component and a package component, the package component for packaging the display component, and the package component is the package component according to any one of claims 1-15.