WO2019138903A1

WO2019138903A1 - Packaging body and individual packaging box

Info

Publication number: WO2019138903A1
Application number: PCT/JP2018/048113
Authority: WO
Inventors: 和幸稲垣
Original assignee: 株式会社Ｊｖｃケンウッド
Priority date: 2018-01-10
Filing date: 2018-12-27
Publication date: 2019-07-18
Also published as: JP2019119509A

Abstract

According to the present invention, a packaging body (1), which accommodates a terminal part (55) in a recessed section (33) and packages a speaker unit (5) by covering the outer periphery of the speaker unit (5), is provided with a surface of the packaging body (1) and through-holes (31A, 31B) with openings passing through at terminal (55)-facing positions on a surface of the packaging body (1), said surface facing the speaker unit (5) in a state in which the speaker unit (5) is packaged.

Description

Packaging and individual packaging

TECHNICAL FIELD The present disclosure relates to a product package, and more particularly to a package suitable for packaging an electronic component provided with a terminal.

The speaker unit which does not have a housing | casing has the unevenness | corrugation resulting from a shape, and is provided with the exposed electrode. Furthermore, when the speaker unit is of the electrodynamic type, it includes a heavy magnetic circuit. As the package of the speaker unit, a foam fixing material that fits the shape of the speaker unit and can support weight is used. The speaker unit is packaged in a package and then stored in an individual packaging box made of paper or the like.

As a package of electronic parts such as light bulbs, those described in Patent Documents 1 to 3 are known. The lamp storage container of Patent Document 1 protects the glass portion of the light bulb with a paper board. In the package for a lamp of Patent Document 2, a flexible material is formed according to the shape of the lamp to be stored, and the entire lamp is covered. The luminaire broadcast device of Patent Document 3 protects a luminaire by bending a cardboard.

Unexamined-Japanese-Patent No. 2004-175411 JP 2004-359349 A JP, 2009-190774, A

The package of the speaker unit has a structure that covers the entire outer periphery of the speaker unit because it is necessary to firmly hold the magnetic circuit and to protect the diaphragm, the frame, and the terminals.

If it is necessary to check the operation and characteristics of the speaker unit just before product shipment, place a tester rod on the terminal of the speaker unit to measure the conduction and resistance between the terminals or measure the resistance between the terminals and the speaker frame It is necessary to measure. For this reason, it was necessary to take out the speaker unit from the package.

An embodiment is made in view of the above, and it aims at providing a package which can protect electronic parts certainly and can perform operation and a check of characteristics in the state where it was packed. .

The package according to the embodiment is a package for packaging an electronic component, and in a state in which the electronic component is packaged, a position at which the surface of the package facing the electronic component faces a terminal provided in the electronic component. And a through hole having an opening on the package surface.

The individual packaging box according to the embodiment is an individual packaging box for storing the packaging body, and is provided with holes or perforations at positions on the surface of the packaging body corresponding to the through hole openings.

According to the embodiment, it is possible to provide a package capable of reliably protecting an electronic component and capable of performing operation and characteristic confirmation in a packaged state.

FIG. 1 is a perspective view showing a configuration of a speaker unit packaged by the package of the present embodiment. FIG. 2 is a perspective view showing the configuration of the package of the present embodiment. FIG. 3 is a perspective view showing the configuration of the upper part of the package. FIG. 4 is a perspective view showing the configuration of the lower part of the package. FIG. 5 is a perspective view showing the speaker unit inserted in the lower part of the package. FIG. 6 is a bottom view of a package in which the speaker unit is packaged. FIG. 7 is a view showing the shape of the through hole provided in the package. FIG. 8 is a view showing another shape of the through hole provided in the package. FIG. 9 is a view showing still another shape of the through hole provided in the package. FIG. 10 is a figure which shows another shape of the through-hole with which a package body is provided.

Hereinafter, embodiments of the present invention will be described using the drawings.

With reference to FIG. 1, a speaker unit 5 will be described as an example as an electronic component packaged by the package of the present embodiment. The electrodynamic speaker unit 5 shown in FIG. 1 has a diaphragm 51 having a circular outer shape, an edge 52 connected to the outer periphery of the diaphragm 51, and an external magnetic circuit 53 having a bottom yoke, a top plate and a magnet. A voice coil bobbin (not shown) in which a voice coil disposed inside the magnetic circuit 53 is wound around one end and the other end is connected to the diaphragm 51, a frame holding the outer circumference of the magnetic circuit 53 and the edge 52 54 and a terminal 55 to which a lead wire from a voice coil is connected. The terminal portion 55 includes a positive terminal 55A and a negative terminal 55B electrically connected to the voice coil, and a terminal plate 55C for fixing the positive terminal 55A and the negative terminal 55B.

The speaker unit 5 vibrates the diaphragm 51 according to the voltage signal applied to the plus terminal 55A and the minus terminal 55B, and outputs a sound. When measuring the electrical characteristics of the speaker unit 5, the tester rod is brought into contact with the plus terminal 55A and the minus terminal 55B.

The package of the present embodiment for packaging the speaker unit 5 will be described with reference to FIGS. Hereinafter, the upper surface of the package 1 shown in FIG. 2 will be referred to as the upper surface, the lower surface as the lower surface, the front surface as the front, and the rear surface as the back.

The package 1 shown in FIG. 2 is a combination of the upper part 2 of the package shown in FIG. 3 and the lower part 3 of the package shown in FIG. The outer shape of the package 1 in which the package upper portion 2 and the package lower portion 3 are combined is a substantially rectangular parallelepiped. One speaker unit 5 is accommodated in each of the two

spaces

1A and 1B formed when the package upper portion 2 and the package lower portion 3 are combined. The package 1 accommodates the two speaker units 5 and is accommodated in the individual packaging box in a state where the upper part 2 of the package and the lower part 3 of the package are combined. The package 1 is a foam fixing material, and is a molded article using foamable polystyrene. The material of the package 1 is not limited to expandable polystyrene, and other foam materials may be used. The individual packaging box is a rectangular parallelepiped made of paper into which the package 1 can be inserted, and has a size in which the package 1 can be perfectly fit. The material of the individual box is not limited to paper.

The upper part 2 of the package and the lower part 3 of the package are mirror symmetric. In addition, the package 1 is two-fold symmetric about an axis connecting the center of the upper surface and the center of the lower surface of the package 1. Here, the upper part 2 and the lower part 3 of the package are referred to, and the two members constituting the package 1 are divided into the upper part and the lower part, but the upper part 2 and the lower part 3 of the package are mirror symmetric. It doesn't matter which way down. Since the package 1 is symmetrical twice, either side may be front or back. Moreover, although the package 1 shall be a combination of the package upper part 2 and the package lower part 3 for convenience of explanation, it does not get caught by this. The package 1 may be integrally molded, or may be configured by three or more members. Each of the upper package 2 and the lower package 3 may be defined as a package.

Each of the package upper part 2 and the package lower part 3 has the unevenness forming the

spaces

1A and 1B along the envelope shape of the outer periphery of the speaker unit 5 so that the directions of the two speaker units 5 are alternated and held. Have. More specifically, as shown in FIG. 4, on the right side of the lower part 3 of the package, a groove 34A along the shape of the outer periphery of the frame 54, a slope 34B matched to the shape of the back of the frame 54 in order from the front side A ridge 34C fitted to the top plate portion of the magnetic circuit 53, a groove 34D along the shape of the outer periphery of the magnet portion of the magnetic circuit 53, and a ridge 34E holding the back surface of the bottom yoke of the magnetic circuit 53 are provided. A groove 34A, a slope 34B, a mountain 34C, a groove 34D, and a mountain 34E are provided on the left side of the lower part 3 of the package in order from the back surface side. Similarly to the lower part 3 of the package, the upper part 2 of the package has irregularities along the envelope of the outer periphery of the speaker unit 5. The package 1 covers the outer periphery of the speaker unit 5 and packages the speaker unit 5 by these structures. The speaker unit 5 can be firmly fixed by firmly holding the magnetic circuit 53 whose weight is concentrated by the mountain 34C fitting to the top plate portion and the mountain 34C and the mountain 34E. Further, the packaging body 1 alternately holds the directions of the two speaker units 5 so that the weight is not biased to either the front or the back.

As a space for housing the terminal portion 55, a part of the slope 34B, the mountain 34C, and the groove 34D in a portion close to the lower surface of the package 1 is cut away to form a recess 33. Openings are formed on the lower surface of the package 1 at positions facing the plus terminal 55A and the minus terminal 55B. Through

holes

31A and 31B penetrating from the bottom surface of the recess 33 to the opening in the lower surface of the package 1 are formed. In other words, the through

holes

31A and 31B penetrate the plus terminal 55A and the minus terminal 55B from the lower surface of the package 1 in a visible manner. The through

holes

31A and 31B are isolated by the beam 32.

Since the package upper portion 2 and the package lower portion 3 are mirror symmetric, the package upper portion 2 has the same recess as the package lower portion 3 and the through holes 21A penetrating from the upper surface of the recess to the upper surface of the package 1 21 B is provided. The through

holes

21A and 21B are isolated by the beam 22. Since both the package upper portion 2 and the package lower portion 3 have the recesses, the terminal portions 55 may be accommodated on either side of the package upper portion 2 or the package lower portion 3.

The lower package body 3 is provided with a through hole 31 </ b> C penetrating the lower surface of the package 1 on the bottom surface of the groove 34 </ b> A that holds the outer periphery of the frame 54. Since the mountain 34C is cut and the recess 33 is formed, the bottom of each of the

spaces

1A and 1B of the lower part 3 of the package extends from the mountain 34E to the groove 34A, and the distance to the lower surface becomes shorter. Furthermore, since the groove 34A is provided with the through hole 31C, there is no place where water is collected in the

spaces

1A and 1B. By this structure, the condition of cooling water used immediately after the molding of the lower part 3 of the package is improved. The upper part 2 of the package also has a similar structure provided with a through hole 21C. The through

holes

21C and 31C have openings at positions facing the frame 54, and are arranged to communicate with the openings in the surface of the package 1, and the frame 54 can be viewed from the surface of the package 1 is there.

FIG. 5 shows how the speaker unit 5 is inserted into the lower part 3 of the package. When the upper part 2 of the package is covered with the lower part 3 of the package in which the speaker unit 5 is inserted, the speaker unit 5 is wrapped by the package 1. In FIG. 5, the terminal 55 is accommodated in the recess 33 of the lower part 3 of the package. The package 1 covers the outer periphery of the speaker unit 5 including the terminal portion 55, and covers the speaker unit 5 by exposing the sound emitting surface of the speaker unit 5 and a part of the back surface of the bottom yoke. The package 1 may package the speaker unit 5 without exposing the sound emitting surface of the speaker unit 5 and the back surface of the bottom yoke.

As shown in the bottom view of FIG. 6, in a state where the speaker unit 5 is packaged in the package 1, the plus terminal 55A and the minus terminal 55B can be visually recognized from the through

holes

31A and 31B. The frame 54 can be visually recognized from the through holes 31C. The electrical characteristics can be measured while the speaker unit 5 is packaged by inserting the tester rod from each of the through

holes

31A and 31B and contacting the plus terminal 55A and the minus terminal 55B. Since the through

holes

31A and 31B are isolated by the beam 32, measurement can be performed reliably without shorting the tester bars when measuring the electrical characteristics. Further, the insulation resistance between the terminal and the frame can be confirmed by inserting the tester rod from each of the through

holes

31B and 31C and bringing the tester into contact with the negative terminal 55B and the frame 54 to measure the resistance value.

The individual box for housing the package 1 is provided with a hole at each position corresponding to the opening in the surface of the package possessed by the through holes 21A to 21C, 31A to 31C, whereby the package 1 can be individually boxed. The terminal of the speaker unit 5 and the outer surface of the individual box communicate with each other in the state of being housed in the connector, and the electrical characteristics can be measured by inserting the tester rod. Perforation may be performed as needed by placing perforations at positions corresponding to the openings on the surface of the package provided by the through holes 21A to 21C and 31A to 31C of the individual box.

A variation of the shape of the through hole will be described with reference to FIGS.

FIGS. 7 to 10 are cross-sectional views showing the vicinity of the through

holes

31A and 31B of the packaging body 1 in a state in which the speaker unit 5 is housed and housed in the individual box 4.

Holes

41A and 41B are opened in the individual packaging box 4 at positions corresponding to the openings of the through

holes

31A and 31B. The through

holes

31A and 31B and the

holes

41A and 41B of the individual packaging box 4 in each embodiment are sized to allow insertion of a tester rod.

The through

holes

31A and 31B in FIG. 7 are formed straight from the position facing the plus terminal 55A and the minus terminal 55B toward the lower surface. A beam 32 is formed between the through

holes

31A and 31B from the lower surface of the package 1 to the recess 33. In spite of having the through

holes

31A and 31B which reduce the strength around the terminal portion 55 to be protected by the beam 32, the package 1, particularly the package 1 due to the vibration during transportation or the collision of sharp objects It is possible to give the strength that the periphery of the terminal 55 of the body 1 is not broken. Also, the through

holes

31A, 31B are arranged such that each distance between the plus terminal 55A and the minus terminal 55B and a line on the extension of one surface of the inner wall of the through

holes

31A, 31B is within a predetermined distance, for example 5 mm. Thus, when the tester rod is inserted along the inner wall of the beam 32, the tester rod can be easily pressed against the plus terminal 55A or the minus terminal 55B, and the operation and the characteristic can be easily confirmed by the tester rod.

The beam 32 may be extended to the vicinity of the plus terminal 55A and the minus terminal 55B. When the beam 32 is formed between the plus terminal 55A and the minus terminal 55B, the plus terminal 55A and the minus terminal 55B are separately stored in the through

holes

31A and 31B, respectively.

In the through

holes

31A and 31B of FIG. 8, the size of the hole on the side of the packaging box 4 is made smaller, and the size of the hole on the side of the terminal portion 55 is made larger. In the example of FIG. 8, the inner wall on the beam 32 side of the through

holes

31A and 31B is not tapered, and the other surface is tapered so that the through

holes

31A and 31B from the surface of the package 1 toward the terminal portion 55 Spread in a tapered shape. The through

holes

31A and 31B may extend in a step-like manner from the individual packaging box 4 side to the terminal portion 55 side. In addition, the inner wall on the beam 32 side may be tapered.

The plus terminal 55A and the minus terminal 55B in FIG. 8 are disposed with the terminal faces directed outward. Even with the configuration of such terminals, by widening the terminal 55 side of the through

holes

31A and 31B, the tester rod 6 is moved in a state inserted into the through

holes

31A and 31B, and the tester is viewed from the side of the terminals The rod 6 can be easily brought into contact. Further, by narrowing the individual box 4 side of the through

holes

31A and 31B, it is possible to prevent the intrusion of dust into the interior of the package 1, and the thickness of the beam 32 is partially increased to further increase the through holes. The strength around 31A and 31B can also be secured.

The through

holes

31A and 31B in FIG. 9 are wider at the individual packaging box 4 side and narrower at the terminal portion 55 side, contrary to FIG. Since the through

holes

31A and 31B in FIG. 9 are wide on the side of the individual packaging box 4, insertion of the tester rod is easy.

In the through

holes

31A and 31B of FIG. 10, the distance between the openings of the through

holes

31A and 31B on the packaging box 4 side is longer than the distance between the openings of the through

holes

31A and 31B on the terminal 55 side. . That is, the through

holes

31A and 31B are inclined away from each other from the terminal 55 side to the packaging box 4 side. With this structure, the strength of the package can be secured compared to the case where the openings on the individual box 4 side of the through

holes

31A and 31B are close to each other, and furthermore, the through

holes

31A and 31B are inclined. Invasion can be suppressed.

In the through

holes

31A and 31B of FIGS. 7 to 10, by making the shapes of the openings of the through holes 31A and the through holes 31B different from each other, the polarity of the terminals connected from the through

holes

31A and 31B can be easily determined. It becomes easy to identify the terminal necessary for confirmation, and erroneous insertion of the tester rod can be prevented. Also in the through hole 31C of FIG. 6, the structure may be different from that of the through

holes

31A and 31B.

In the through

holes

31A and 31B of FIGS. 7 to 10, the hole diameter between the opening on the surface side of the package 1 of the through hole 31A and the through hole 31B and the opening on the terminal side of the package 1 is narrowed. It may be. By making the portion with the smallest hole diameter close to the thickness of the tester rod, the opening on the surface side of the package 1 is more than in the case where the diameter is smaller than the opening on the terminal side of the package 1 By supporting the tester rod at a position close to the terminal portion, the tester tip can be more easily pressed against the terminal. In other words, this configuration makes it possible to support the tester rod at the constricted portion, which makes it easier to press the tester rod against the terminal.

As described above, according to the present embodiment, it is the package 1 which accommodates the speaker unit 5 by housing the terminal portion 55 in the recess 33 and covering the outer periphery of the speaker unit 5, and the speaker unit 5 is packaged. In the closed state, the speaker 1 is provided with through

holes

31A, 31B having a position facing the terminal 55 on the surface facing the speaker unit 5 of the package 1, the surface of the package 1, and an opening. Electrical characteristics can be measured in a state in which the unit 5 is packaged by the package 1.

According to the present embodiment, individual packaging box 4 for storing packaging body 1 is provided with

holes

41A and 41B at positions corresponding to through

holes

31A and 31B, whereby packaging body 1 is stored in the individual packaging box. The electrical characteristics of the speaker unit 5 can be measured by

Although a speaker unit having a terminal portion in which two terminals of a plus terminal and a minus terminal are present is shown in the embodiment, the present invention is not limited to the speaker unit, and the gist of the present invention is also applied to electronic components such as light bulbs and batteries. It is possible to carry out without departing from the scope, and it becomes possible to confirm the conduction related to the failure and the battery voltage. In addition, in the terminal portion provided with three or more terminals, the effects of the present invention can be obtained also in an embodiment having a beam so as to separate the respective terminals.

The present disclosure is related to the subject matter described in Japanese Patent Application No. 2018-001629 filed on Jan. 10, 2018, the entire disclosure content of which is incorporated herein by reference.

Claims

A package for packaging electronic components,
In a state where the electronic component is packaged, a through hole having an opening and passing through a position on the surface of the package facing the electronic component that faces the terminal provided on the electronic component and the surface of the package A package comprising:
The through hole has an opening at a position opposite to each of the two or more terminals in a surface opposite to two or more terminals of the electronic component of the package, and the surface of the package. 2. The package according to claim 1, wherein two or more packages are disposed in the package, and between at least a pair of through holes, the package faces from the opening facing the terminal to the opening in the surface of the package and penetrates away from each other. body.
The package according to claim 1, wherein the through hole has a shape in which a hole diameter is expanded from an opening on a surface of the package to an opening facing the terminal.
The through hole has an opening facing the terminal such that the terminal is within a predetermined distance from an extension of one surface of the inner wall of the through hole in a state where the electronic component is packaged. The package body in any one of 3. thru | or 3.
It is an individual packaging box for accommodating the package body in any one of Claim 1 to 4, Comprising:
The individual box is provided with a hole or a perforation at a position corresponding to the through hole opening on the surface of the package.