WO2019138723A1

WO2019138723A1 - Display device and method for manufacturing display device

Info

Publication number: WO2019138723A1
Application number: PCT/JP2018/044125
Authority: WO
Inventors: 直久安藤
Original assignee: 株式会社ジャパンディスプレイ
Priority date: 2018-01-12
Filing date: 2018-11-30
Publication date: 2019-07-18
Also published as: JP2019124745A

Abstract

Provided is a method for manufacturing a display device in which a plurality of display devices each including a display region, a peripheral region, and a boundary region is created on a first substrate for singulation. The method for manufacturing a display device comprises: forming an identifier on the first substrate for singulation, the identifier including a first identification section disposed in the boundary region located at the boundary of the display device and a second identification section disposed in the peripheral region located between the display region and the boundary region; cutting a second substrate for singulation in the boundary region by positioning a laser with respect to the first substrate for singulation using a first identification section; and cutting the first substrate for singulation in the boundary region by positioning the laser with respect to the first substrate for singulation using a second identification section. The cutting of the second substrate for singulation includes carbonizing at least a portion of the first substrate for singulation.

Description

Display device and method of manufacturing display device

The present invention relates to a display device and a method of manufacturing the display device.

In the display device, a light emitting element is provided in each pixel, and an image is displayed by individually controlling light emission. For example, in an organic EL display using an organic EL element as a light emitting element, an organic EL element is provided in each pixel, and the organic EL element is a layer including an organic EL material between a pair of electrodes consisting of an anode electrode and a cathode electrode. It has a structure (hereinafter, referred to as "organic EL layer"). In the organic EL display device, an anode electrode is provided as an individual pixel electrode for each pixel, and a cathode electrode is provided as a common pixel electrode to which a common potential is applied across a plurality of pixels. The organic EL display device controls the light emission of the pixel by applying the potential of the pixel electrode to each pixel with respect to the potential of the common pixel electrode.

In a method of manufacturing a display device in which a plurality of display panels are simultaneously formed, it is necessary to cut a large panel for multiple chamfering into pieces. At this time, an alignment mark is provided on the display panel, and is used for alignment at the time of cutting the multi-chamfered large panel.

Patent Document 1 discloses a semiconductor wafer, in particular, an alignment mark used after a wiring process.

Japanese Patent Application Publication No. 08-264423

When cutting a large panel for multiple chamfering into pieces, for example, after temporarily cutting and individualizing the large panel for multiple chamfering around the adjacent display panel, the display panel is obtained by cutting the outer periphery of each display panel You may cut out. Alternatively, the display panels may be cut out one by one by directly cutting the outer periphery of each display panel. Alternatively, display panels arranged in a matrix may be cut out together. In any case, it is necessary to select a laser beam according to the characteristics of each material constituting the multi-faceted large panel. For this reason, the same location may need to be subjected to multiple laser irradiations. For example, in the case where a polarizing plate is attached to a large panel for multiple chamfering, it is necessary to overstrike a carbon dioxide gas laser and a UV laser. However, the first laser irradiation may cause damage in the vicinity of the cutting region and the alignment mark may disappear.

An object of the present invention is to suppress a decrease in position detection accuracy even when a part of an alignment mark can not be visually recognized when cutting a large panel for multiple chamfering into pieces.

According to one embodiment of the present invention, there is provided a method of manufacturing a display device in which a plurality of display devices including a display region, a peripheral region, and a boundary region are formed on a first substrate for multiple chamfers. A first identification unit forming a pixel and disposed in the boundary region located at the boundary of the display device; and a second identification unit disposed in the peripheral region located between the display region and the boundary region , And the second substrate for multiple chamfers is formed on the first substrate for multiple chamfers across the plurality of display devices; Aligning the position of the laser and the first substrate for multiple chamfering using the identification unit, cutting the second substrate for multiple chamfering in the boundary area, and using the second identification unit, the laser and the first multiple chamfering substrate Aligning the substrate, the chamfering at the boundary area Cutting the first substrate, and cutting the second substrate for multi-chamfering comprises carbonizing at least a portion of the first substrate for multi-chamfering. Ru.

According to an embodiment of the present invention, there is provided a display area in which a plurality of pixels are arranged, a boundary area located at a boundary of a display device, and a peripheral area located between the display area and the boundary area. An identifier including one substrate, a first identification unit disposed in the boundary region, and a second identification unit disposed in the peripheral region, the display region, the peripheral region, and the boundary region And a second substrate, wherein at least a part of the first substrate in the boundary area is carbonized.

It is a perspective view showing a schematic structure of a display concerning one embodiment of the present invention. It is a top view which shows schematic structure of the display apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows schematic structure of the display area of the display apparatus which concerns on one Embodiment of this invention. It is a top view which shows schematic structure of the panel for multiple chamfers which concerns on one Embodiment of this invention. It is sectional drawing which shows schematic structure of the panel for multiple chamfers which concerns on one Embodiment of this invention. It is an enlarged plan view which shows schematic structure of the panel for multiple chamfers which concerns on one Embodiment of this invention. It is an enlarged plan view showing the schematic structure of the display concerning one embodiment of the present invention. It is a top view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 1 of this invention. It is an enlarged plan view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 1 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 1 of this invention. It is an enlarged plan view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 2 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 2 of this invention. It is an enlarged plan view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 3 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 3 of this invention. It is a top view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 4 of this invention. It is an enlarged plan view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 4 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 4 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 4 of this invention. It is a top view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 5 of this invention. It is an enlarged plan view which shows schematic structure of the panel for multiple chamfers which concerns on the modification 5 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 5 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 5 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 5 of this invention. It is an enlarged plan view which shows schematic structure of the display apparatus which concerns on the modification 5 of this invention. It is sectional drawing which shows the manufacturing method which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method which concerns on one Embodiment of this invention.

Hereinafter, a display according to some embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention can be implemented in many different modes, and is not construed as being limited to the description of the embodiments exemplified below. In the embodiment of the present invention, in particular, an organic EL display device is exemplified as a preferable application example, but the present invention is not limited to this.

Although the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each portion in comparison with the actual embodiment in order to make the description clearer, this is merely an example, and the interpretation of the present invention is limited. It is not a thing. In addition, the dimensional ratio of the drawings may be different from the actual ratio or part of the configuration may be omitted from the drawings for convenience of explanation. In the specification and the drawings, the same elements as those described above with reference to the drawings are denoted with the same reference numerals, and the detailed description will be appropriately omitted.

In this specification, when a plurality of films are formed by performing etching or light irradiation on a certain film, the plurality of films may have different functions or roles. However, the plurality of films are derived from the film formed as the same layer in the same step, and have the same layer structure and the same material. Therefore, these multiple films are defined as existing in the same layer.

In this specification, when one member or area is "above (or below)" another member or area, this is directly above (or just below) the other member or area unless there is a particular limitation. Not only when it is in the region above but also when it is above (or below) other members or areas, that is, when another component is included above (or below) other members or areas Also includes.

In the present specification, the expression “a certain structure is exposed from another structure” means an aspect in which a part of a certain structure is not covered by another structure. The part which is not covered also includes the aspect covered by another structure.

First Embodiment
[Display device configuration]
The schematic configuration of the display device 100 according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view showing a schematic configuration of a display device 100 according to the present embodiment. FIG. 2 is a plan view showing a schematic configuration of the display device 100 according to the present embodiment. In the display device 100, a display area 106 is provided on the first substrate 102. The display area 106 is configured by arranging a plurality of pixels 108 in a matrix. A second substrate 104 is provided on the top surface of the display area 106 as a sealing material. The second substrate 104 entirely covers the display area 106 and covers the boundary area 130 located at the boundary of the display device 100 and the peripheral area 140 located between the display area 106 and the boundary area 130. The second substrate 104 is fixed by an adhesive layer 110 that bonds the first substrate 102 and the second substrate 104. The display area 106 formed in the first substrate 102 is sealed by the second substrate 104 which is a sealing material so as not to be exposed to the air. Deterioration of the light emitting element provided in the pixel is suppressed by such a sealing structure. Note that although the configuration using the adhesive layer 110 covering the display area 106 is described here for fixing the second substrate 104, the present invention is not limited to this configuration. For example, a sealing material disposed to surround the display area 106 It may be fixed by the like.

A terminal region 114 is provided at one end of the first substrate 102. The terminal area 114 is disposed in the peripheral area 140 outside the display area 106. Furthermore, the terminal region 114 is disposed outside the second substrate 104. The second substrate 104 is formed on substantially the entire surface of the first substrate 102 so as to cover the terminal region 114 as described later, and then the portion overlapping the terminal region 114 is removed. However, the present invention is not limited to this, and the second substrate 104 may be formed so as not to cover the terminal area 114. The terminal area 114 is constituted by a plurality of connection terminals 116. The connection terminal 116 forms a contact point with a wiring substrate which connects the display device 100 with a device that outputs a video signal, a power supply, or the like. Therefore, the connection terminal 116 is exposed to the outside.

The first substrate 102 is provided with a first drive circuit 111 and a second drive circuit 112 for outputting a video signal input from the terminal area 114 to the display area 106. The first drive circuit 111 and the second drive circuit 112 are disposed in the peripheral area 140 outside the display area 106. In the present embodiment, the first drive circuit 111 is disposed inside the second substrate 104, and the second drive circuit 112 is disposed outside the second substrate 104. The second substrate 104 is formed on substantially the entire surface of the first substrate 102 so as to cover the second drive circuit 112, and then the portion overlapping with the second drive circuit 112 is removed. However, the present invention is not limited to this, and the second substrate 104 may be formed so as not to cover the second drive circuit 112.

The display area 106 and the first drive circuit 111 and the second drive circuit 112 are connected by wiring. The display area 106 is provided with scanning signal lines and video signal lines in addition to the pixels 108. Each pixel 108 in the display area 106 is connected to the first drive circuit 111 and the second drive circuit 112 by these wires. For example, the first drive circuit 111 is a drive circuit that outputs a scan signal to the display area 106 via a scan signal line, and the second drive circuit 112 outputs a video signal to the display area 106 via a video signal line. It is a drive circuit.

As shown in FIGS. 1 and 2, in the display device 100 according to the present embodiment, the identifier 200 is provided on the first substrate 102. The identifier 200 is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). The identifier 200 is arranged in a boundary area 130 which is the outer periphery of the display device 100 and a peripheral area 140 located between the display area 106 and the boundary area 130. In the present embodiment, the identifier 200 is disposed at one of the corner portions formed by one side where the terminal area 114 is provided and the other side adjacent thereto. However, the present invention is not limited to this, and the identifier 200 may be disposed in the vicinity of an intersection point formed by two adjacent sides of the first substrate 102. The number of identifiers 200 is not particularly limited, and may be one or more. The arrangement and structure of the identifier 200 will be described in detail later.

In the display device 100 according to the present embodiment, at least a part of the outer peripheral side surface of the display device 100 is carbonized. That is, at least a part of the side surfaces of the first substrate 102 and the second substrate 104 that are the same as the outer periphery of the display device 100 is carbonized. Furthermore, in the display device 100, at least a part of the boundary region 130 connected to the outer peripheral side surface of the display device 100 is carbonized. That is, in the first substrate 102 and the second substrate 104, at least a part of the boundary region 130 connected to the side surface coinciding with the outer periphery of the display device 100 is carbonized. Here, carbonization of the first substrate 102 indicates a state in which more carbon atoms are contained than the first substrate 102, and carbonization of the second substrate 104 indicates a state in which more carbon atoms are contained than the second substrate 104. Further, carbonization of the surface (side and top surfaces) of the boundary region 130 may be in a state where carbide of any of the organic substances constituting the outer periphery of the display device 100 is scattered. The carbonized area is colored black and the transmittance is significantly reduced.

[Pixel structure]
Next, with reference to FIG. 3, a schematic structure of the display area 106 of the display device 100 according to the present embodiment will be described. FIG. 3 is a cross-sectional view showing a schematic structure of the display area 106 according to the present embodiment. FIG. 3 is an enlarged schematic cross-sectional view taken along a dashed-dotted line AA ′ in FIG. As shown in FIG. 3, the plurality of pixels 108 disposed in the display area 106 have circuit elements. In this embodiment, the circuit element layer includes the semiconductor film 162, the gate insulating film 164, the gate electrode 166, the source /

drain electrodes

168 and 170, the capacitance electrode 172, the interlayer film 174, the flattening film 176, the connection electrode 178, and the additional capacitance electrode. It has a multilayer structure including an additional capacitance insulating film 182, a partition wall 184, a pixel electrode 190, an EL layer 192, and a passivation film 196. Each of the plurality of pixels 108 in the display area 106 has a drive transistor DRT, a storage capacitance Cs, an additional capacitance Cad, and a light emitting element OLED. The driving transistor DRT controls light emission of the light emitting element OLED.

Circuit elements included in the plurality of pixels 108 in the display area 106 are provided on the first substrate 102 via the undercoat 160. The first substrate 102 can include an organic resin material. The first substrate 102 can also be provided with flexibility by using an organic resin material. As the organic resin material, polymers such as polyimide, polyamide, polyester, polycarbonate and the like can be mentioned, and among them, polyimide having high heat resistance is preferable.

The undercoat 160 may have a single layer structure as shown in FIG. 3 or may be composed of a plurality of films. In the case of using a plurality of films, a film containing silicon oxide, a film containing silicon nitride, and a film containing a film containing silicon oxide may be sequentially formed on the first substrate 102.

The driving transistor DRT includes a semiconductor film 162, a gate insulating film 164, a gate electrode 166, and source /

drain electrodes

168 and 170. The gate insulating film 164 is sandwiched between the gate electrode 166 and the semiconductor film 162. The gate electrode 166 is disposed to intersect at least a part of the semiconductor film 162 with the gate insulating film 164 interposed therebetween, and a channel region 162 a is formed in a region where the gate electrode 166 of the semiconductor film 162 overlaps. The semiconductor film 162 further includes a channel region 162a, a low concentration impurity region 162c doped with an impurity, and a source / drain region 162b doped with an impurity. The impurity concentration of the low concentration impurity region 162c is lower than that of the source / drain region 162b. In the example shown in FIG. 3, the drive transistor DRT is a top gate type transistor. However, the present invention is not limited to this, and the structure of the transistor included in the circuit element may be a bottom gate transistor. In addition, the upper / lower relationship between the source /

drain electrodes

168 and 170 and the semiconductor film 162 is not limited.

A capacitor electrode 172 present in the same layer as the gate electrode 166 is provided to overlap with one of the source / drain regions 162 b via the gate insulating film 164. An interlayer film 174 is provided on the gate electrode 166 and the capacitor electrode 172. An opening reaching the semiconductor film 162 is formed in the interlayer film 174 and the gate insulating film 164, and source /

drain electrodes

168 and 170 are disposed to cover the opening. A part of the source / drain electrode 170 overlaps with a part of the source / drain region 162 b and the capacitor electrode 172 through the interlayer film 174, and a part of the source / drain region 162 b, a part of the gate insulating film 164, a capacitor electrode A storage capacitance Cs is formed by the portion 172, the interlayer film 174, and a part of the source / drain electrode 170.

A planarization film 176 is further provided on the drive transistor DRT and the storage capacitor Cs. The planarization film 176 has an opening reaching the source / drain electrode 170, and a connection electrode 178 covering the opening and a part of the top surface of the planarization film 176 is provided in contact with the source / drain electrode 170. An additional capacitance electrode 180 is further provided on the planarization film 176. The connection electrode 178 and the additional capacitance electrode 180 may be formed at the same time, or may be formed in different steps so as to have different materials. When the connection electrode 178 and the additional capacitance electrode 180 are simultaneously formed, the connection electrode 178 and the additional capacitance electrode 180 exist in the same layer and have the same composition.

An additional capacitance insulating film 182 is formed to cover the connection electrode 178 and the additional capacitance electrode 180. The additional capacitance insulating film 182 does not cover a part of the connection electrode 178 at the opening of the planarization film 176, and exposes the upper surface of the connection electrode 178. Thereby, the electrical connection between the pixel electrode 190 and the source / drain electrode 170 provided thereon is enabled via the connection electrode 178. The additional capacitance insulating film 182 may be provided with an opening 186 for permitting contact between the partition 184 provided thereon and the planarizing film 176. The formation of the connection electrode 178 and the opening 186 is optional. By providing the connection electrode 178, corrosion of the surface of the source / drain electrode 168 can be prevented in a subsequent process, and an increase in contact resistance of the source / drain electrode 168 can be prevented. Impurities in the planarization film 176 can be removed through the opening 186, which can improve the reliability of the circuit element and the light emitting element OLED.

A pixel electrode 190 is provided on the additional capacitance insulating film 182 so as to cover the connection electrode 178 and the additional capacitance electrode 180. The storage capacitor insulating film 182 is sandwiched between the storage capacitor electrode 180 and the pixel electrode 190, and a storage capacitor Cad is formed by this structure. The pixel electrode 190 is shared by the additional capacitance Cad and the light emitting element OLED.

A partition 184 covering the end of the pixel electrode 190 is provided on the pixel electrode 190. By the partition wall 184, unevenness due to the pixel electrode 190 can be alleviated, and cutting of the electroluminescent layer (hereinafter, EL layer) 192 and the counter electrode 194 provided thereon can be prevented. An EL layer 192 and a counter electrode 194 covering the EL layer 192 are provided to cover the partition wall 184 and the pixel electrode 190. When light emitted from the light emitting element OLED is extracted through the pixel electrode 190, the pixel electrode 190 is configured to transmit visible light. In this case, as a specific material, a conductive oxide capable of transmitting visible light such as indium-tin oxide (ITO) or indium-zinc oxide (IZO) is used. On the other hand, when light emitted from the light emitting element OLED is taken out through the counter electrode 194, the pixel electrode 190 is configured to reflect visible light. In this case, the pixel electrode 190 contains a metal such as silver or aluminum having a high reflectance of visible light. Alternatively, the pixel electrode 190 may have a stacked structure of a film containing a conductive oxide and a film containing a metal with high reflectance. For example, a stacked structure of a first conductive film containing a conductive oxide, a second conductive film containing a metal such as silver or aluminum, and a third conductive film containing a conductive oxide can be employed.

The structure of the EL layer 192 is arbitrary, and functional layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, an electron blocking layer, a hole blocking layer, an exciton blocking layer, etc. It can be formed in combination. The structure of the EL layer 192 may be the same between all the pixels 108, and some structures may differ between the adjacent pixels 108. For example, the pixels 108 may be configured such that the structure or material of the light emitting layer is different between adjacent pixels 108, and the other layers have the same structure. In FIG. 3, a hole transport layer 192a, a light emitting layer 192b, and an electron transport layer 192c are shown as representative functional layers in consideration of easy viewing.

When light emitted from the light emitting element OLED is extracted through the pixel electrode 190, the counter electrode 194 is configured to reflect visible light. Specifically, it is formed using a metal with high reflectance such as aluminum, silver, magnesium or an alloy thereof (for example, an alloy of magnesium and silver). On the other hand, when light emitted from the light emitting element OLED is extracted through the counter electrode 194, the pixel electrode 190 is configured to include a conductive oxide capable of transmitting visible light. Alternatively, the above-described metal or alloy may be formed to a thickness that allows visible light to be transmitted. In this case, a conductive oxide film showing translucency to visible light may be further formed.

A passivation film 196 is disposed on the counter electrode 194 as an optional configuration. The structure of the passivation film 196 can be arbitrarily determined, and either a single layer structure or a laminated structure may be employed. In the case of having a stacked structure, for example, a structure in which a first layer 196a containing a silicon-containing inorganic compound, a second layer 196b containing a resin, and a first layer 196a containing a silicon-containing inorganic compound can be sequentially stacked can be employed. . Examples of the silicon-containing inorganic compound include silicon nitride and silicon oxide. Examples of the resin include epoxy resin, acrylic resin, polyester, polycarbonate and the like.

The second substrate 104 is disposed via the adhesive layer 110 so as to cover the display area 106 and the first drive circuit 111. The second substrate 104 can include an organic resin material such as polyvinyl alcohol or polyethylene terephthalate. The second substrate 104 includes an optical film such as a polarizing plate and a phase plate. The optical film covers the plurality of pixels 108 and is disposed on the outer surface of the second substrate 104. The optical film is disposed in order to suppress deterioration in visibility due to the external light incident on the display device 100 being reflected by the pixel electrode 190.

As an optional configuration, a first film may be disposed below the first substrate 102, and a second film may be disposed above the second substrate 104. The structure of the first film and the second film can be arbitrarily determined, and either a single layer structure or a laminated structure may be adopted. In the case of having a single-layer structure, for example, an organic resin material such as polyethylene terephthalate can be included.

[Configuration of panel for multiple chamfers]
The schematic configuration of the multiple panel 10 according to the present embodiment will be described with reference to FIGS. 4A, 4B and 5A, 5B. FIG. 4A and FIG. 4B are diagrams showing a schematic configuration of a multiple panel 10 according to an embodiment of the present invention. FIG. 4A is a plan view showing the multiple panel 10 according to one embodiment of the present invention. FIG. 4B is a cross-sectional view of the multi-chamfered panel 10 of FIG. FIG. 5A and FIG. 5B are enlarged plan views showing a schematic configuration of the multiple panel 10 and the display device 100 according to the embodiment of the present invention. 5A is an enlarged plan view of region B of FIG. 4A. 5B is an enlarged plan view of the display device 100 after the panel 10 for multiple chamfers of FIG. 5A is cut into pieces.

In the present embodiment, the circuit elements included in each pixel 108 of the plurality of display devices 100 are simultaneously formed in the plurality of display regions 106 on the first substrate 102 'for multiple chamfering. In FIG. 4A, four display areas 106 corresponding to four display devices 100 are disposed on the first substrate 102 'for multiple chamfers. In FIG. 4B, the second substrate for multiple chamfer 104 'is disposed on substantially the entire surface of the first substrate for multiple chamfer 102'. After forming each circuit element, substantially the entire surface of the first substrate for multiple chamfer 102 ′ is sealed by the second substrate for multiple chamfer 104 ′ as a sealing material so that the display region 106 is not exposed to the air. However, the present invention is not limited to this, and the second substrate for multiple chamfer 104 ′ may be formed so as not to cover the terminal area 114 of each display device 100. For example, in FIG. 4A, two multi-faceted second substrates 104 'may be disposed on one multi-facet first substrate 102' for each of the display regions 106 of the upper and lower two display devices 100. That is, in order to expose the terminal area 114 of each display device 100, the display devices 100 adjacent in the lateral direction may be sealed by the second substrate for multiple chamfers 104 '.

The cutting site 120 is disposed at the boundary of each display device 100. Each display device 100 can be obtained by cutting the multi-chamfered panel 10 at the cutting site 120 and further exposing the terminal area 114. In the present embodiment, an extra space is arranged around each display device 100. That is, two cutting portions 120 are disposed between the adjacent display devices 100. Here, the space between the two cutting portions 120 outside the display devices 100 is also referred to as a peripheral area 140. However, the present invention is not limited to this, and the display devices 100 may be arranged adjacent to each other. In this case, one cutting site 120 is disposed between the adjacent display devices 100.

Each cut portion 120 located at the boundary of the display device 100 and the vicinity thereof are defined as a boundary region 130. Therefore, the outer peripheral side surface of the display device 100 cut out from the multi-chamfered panel 10 is also set as the boundary region 130. Furthermore, the boundary region 130 in the display device 100 indicates not only the outer peripheral side surface of the display device 100 to be a cut surface but also the vicinity of the outer peripheral side surface that can be affected by cutting. For example, the above-described carbonization is caused by cutting of the second substrate for multiple bevel 104 ′ by the carbon dioxide gas laser described later, and the area connected to the outer peripheral side surface to which such thermal influence is applied is also used as the boundary area 130. .

The cutting order for cutting out each display device 100 from the multi-chamfered panel 10 is not particularly limited. For example, after temporarily cutting and dividing the multi-chamfered panel 10 in the peripheral region 140 between the adjacent display devices 100 The display device 100 may be cut out by cutting each cutting site 120. The display device 100 may be cut out one by one by cutting the cutting portion 120 corresponding to the outer periphery of each display device 100 sequentially for each side. In addition, two display devices 100 may be cut out together for each of the cut portions 120 arranged linearly in the vertical and horizontal directions.

In order to identify the cleavage site 120, an identifier 200 is provided at each intersection of the cleavage site 120. In the present embodiment, one identifier 200 is disposed at one intersection point. The identifier 200 is located at one of the corners formed by the intersection of the cutting sites 120. As shown in FIG. 4A and FIG. 4B, by arranging the identifiers 200 at the corners located in the same direction at each intersection point, each of the plurality of display devices 100 on the multi-chamfer panel 10 has one identifier 200 each. Is placed. However, the present invention is not limited to this, and the place where the identifier 200 is arranged at each intersection may be all within the display device 100 or may be all outside the display device 100. Further, the number of identifiers 200 at each intersection is not limited to this, and one or more per intersection may be sufficient.

[Identifier structure]
As shown in FIGS. 5A and 5B, the identifier 200 has a first identification unit 210 and a second identification unit 220. The first identification unit 210 is disposed in the boundary area 130. The second identification unit 220 is disposed in the peripheral area 140 located between the display area 106 and the boundary area 130. In the present embodiment, the first identification unit 210 and the second identification unit 220 are connected. Each of the first identification unit 210 and the second identification unit 220 has a corner. However, the present invention is not limited to this, and the first identification unit 210 and the second identification unit 220 may be separated as shown in FIGS. 9A and 9B, and may further be rounded (not shown). . In the present embodiment, the first identification unit 210 is not disposed on the cutting site 120. However, the present invention is not limited to this, and the first identification unit 210 may be disposed on the cutting site 120, and may be disposed across the cutting site 120 as shown in FIG. In the present embodiment, the first identification unit 210 and the second identification unit 220 are both disposed at one corner formed by the intersection of the cutting sites 120. However, the present invention is not limited to this, and the first identification unit 210 and the second identification unit 220 may be disposed at different corners formed by the intersection of the cutting portions 120 as illustrated in FIGS. 11A to 11C. . The first identification unit 210 may be disposed in the boundary area 130, and the second identification unit 220 may be disposed in the peripheral area 140, and may have a structure capable of independently determining the intersections formed by the two cutting portions 120.

As shown in FIG. 5B, in the display device 100 cut out from the multi-chamfered panel 10, at least a part of the boundary region 130 is carbonized. Therefore, at least a part of the first identification unit 210 disposed in the boundary area 130 can not be viewed due to carbonization of the boundary area 130. The identifier 200 is provided between the first substrate 102 and the second substrate 104. At least a part of the first identification unit 210 can not be viewed due to the carbonization of the second substrate 104 provided on the first identification unit 210. Here, after the display device 100 is cut into pieces, the second substrate 104 near the terminal region 114 may be peeled off in order to expose the terminal region 114, for example. At this time, even if the second substrate 104 provided on the first identification unit 210 is peeled off, at least a part of the first identification unit 210 can not be viewed visually due to the carbonization of the first substrate 102. On the other hand, the peripheral area 140 located between the display area 106 and the boundary area 130 is not carbonized. Therefore, the second identification unit 220 disposed in the peripheral region 140 is visible from the stacking direction (the direction orthogonal to the upper surface of the first substrate 102).

In the present embodiment, the display device 100 is rectangular. For this reason, one display device 100 can be cut out from the multi-faceted panel 10 by cutting at least four cutting sites 120. The identifier 200 is disposed near each of the four intersections formed by the four cutting sites 120. The at least four identifiers 200 can identify four cleavage sites 120 by determining four intersection points. However, the present invention is not limited to this, and the number of identifiers 200 can be appropriately selected according to the shape of the display device 100.

The identifier 200 is formed of one of the metal materials constituting the circuit element layer provided in the display area 106. That is, the identifier 200 is formed when forming circuit elements of a plurality of pixels. In the present embodiment, the identifier 200 is formed in the same layer as the gate electrode 166 constituting the transistor. However, the present invention is not limited to this, and the identifier 200 may be formed separately from the circuit element.

In the present embodiment, the boundary region 130 of the display device 100 includes the first substrate 102, the undercoat 160, the adhesive layer 110, and the second substrate 104. However, the present invention is not limited to this, and the boundary region 130 of the display device 100 may be an organic resin material or silicon nitride constituting a circuit element layer provided in the display region 106 between the first substrate 102 and the second substrate 104. Etc. may be included. With such a configuration, the step in the stacking direction between the display area 106 and the boundary area 130 may be planarized.

The display device according to the present embodiment having such an identifier 200 enables the second identification unit 220 even when a part of the first identification unit 210 can not be visually recognized when cutting from a multi-faceted panel into individual pieces. Can be used to suppress the decrease in position detection accuracy.

<Modification 1>
The schematic configurations of the panel for multiple chamfering and the display device according to the present modification will be described with reference to FIGS. 6 and 7A and 7B. FIG. 6 is a plan view showing a multiple panel 10a according to a modification of the present invention. FIGS. 7A and 7B are enlarged plan views showing schematic configurations of the multiple panel 10a and the display device 100a according to a modification of the present invention. FIG. 7A is an enlarged plan view of the region C of FIG. 7B is an enlarged plan view of the display device 100a after the panel 10a for multiple chamfers of FIG. 7A is cut into pieces. Here, the configurations of the panel for multiple chamfers 10a and the display device 100a according to the present modification are the same as the configurations of the panel for multiple chamfers 10 and the display device 100 according to the first embodiment except for the number and arrangement of the identifiers 200a. . For this reason, the same parts as those of the first embodiment will not be described in detail.

[Display device configuration]
As shown in FIGS. 6, 7A and 7B, in the display device 100a according to this modification, four identifiers 200a are provided on the first substrate 102. The identifier 200 a is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). The identifier 200 a is disposed in the boundary area 130 which is the outer periphery of the display device 100 a and the peripheral area 140 located between the display area 106 and the boundary area 130. In the present modification, the identifier 200a is disposed at each corner formed by one side of the outer periphery of the display device 100a and the other side adjacent to one side. The four identifiers 200a are disposed one by one at the corners of the display device 100a.

[Configuration of panel for multiple chamfers]
The cutting site 120 is disposed at the boundary of each display device 100a. Each display device 100 a can be obtained by cutting the multiple-chamfered panel 10 a at the cutting portion 120 and further exposing the terminal area 114. In order to specify the cleavage site 120, an identifier 200a is provided at each intersection of the cleavage site 120. In this modification, four identifiers 200a are arranged at one intersection point. The identifiers 200 a are respectively disposed at four corners formed by the intersection of the cutting sites 120. As shown in FIG. 6, four identifiers 200 a are arranged in each of the plurality of display devices 100 a on the multi-chamfer panel 10 a. However, the present invention is not limited to this, and the number of identifiers 200a at each intersection may be one or more per intersection.

[Identifier structure]
As shown in FIGS. 7A and 7B, the identifier 200a includes a first identification unit 210a and a second identification unit 220a. The first identification unit 210 a is disposed in the boundary area 130. The second identification unit 220 a is disposed in the peripheral area 140 located between the display area 106 and the boundary area 130. In the present modification, the first identification unit 210a and the second identification unit 220a are connected.

As shown to FIG. 7B, at least one part of the boundary area 130 is carbonized in the display apparatus 100a cut out from the panel 10a for multiple chamfers. For this reason, at least a part of the first identification unit 210 a disposed in the boundary area 130 can not be visually recognized due to carbonization of the boundary area 130. The peripheral area 140 located between the display area 106 and the boundary area 130 is not carbonized. Therefore, the second identification unit 220a disposed in the peripheral region 140 is visible from the stacking direction (the direction orthogonal to the upper surface of the first substrate 102).

The display device 100a according to the present modification has a plurality of identifiers 200a, so that the position detection accuracy can be improved when the multiple-chamfered panel 10a is cut into pieces, and a part of the first identification unit 210a Even if it can not be visually recognized, the second identification unit 220a can be used to suppress a decrease in position detection accuracy.

<Modification 2>
The schematic configuration of the panel for multiple chamfers and the display device according to the present modification will be described with reference to FIGS. 8A and 8B. FIG. 8A and FIG. 8B are enlarged plan views showing schematic configurations of the multiple panel 10b and the display device 100b according to a modification of the present invention. FIG. 8A is an enlarged plan view of the intersection of the cutting site 120. FIG. 8B is an enlarged plan view of the display device 100b after the panel 10b for multiple chamfers of FIG. 8A is cut into pieces. Here, the configurations of the panel for multiple chamfers 10b and the display device 100b according to the present modification are the same as the configurations of the panel for multiple chamfers 10 and the display device 100 according to the first embodiment except for the shape of the identifier 200b. For this reason, the same parts as those of the first embodiment will not be described in detail.

[Display device configuration]
As shown in FIGS. 8A and 8B, in the display device 100b according to the present modification, the identifier 200b is provided on the first substrate 102. The identifier 200 b is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). The identifier 200 b is arranged in a boundary area 130 which is the outer periphery of the display device 100 b and a peripheral area 140 located between the display area 106 and the boundary area 130. In the present modification, the identifier 200 b is disposed at one of the corner portions formed by one side where the terminal area 114 is provided and the other side adjacent thereto.

[Configuration of panel for multiple chamfers]
The cutting site 120 is disposed at the boundary of each display device 100b. Each display device 100 b can be obtained by cutting the multiple-chamfered panel 10 b at the cutting site 120 and further exposing the terminal area 114. In order to specify the cleavage site 120, an identifier 200b is provided at each intersection of the cleavage site 120. In the present modification, one identifier 200 b is disposed at one intersection point. The identifier 200 b is located at one of the corners formed by the intersection of the cutting sites 120. By arranging the identifiers 200b at the corners located in the same direction at each of the intersections, one identifier 200b is arranged in each of the plurality of display devices 100b on the panel for multiple chamfers 10b. However, the present invention is not limited to this, and the place where the identifier 200b is disposed at each intersection may be all within the display device 100b or all outside the display device 100b. Further, the number of identifiers 200b at each intersection is not limited to this, and one or more per intersection may be sufficient.

[Identifier structure]
As shown in FIGS. 8A and 8B, the identifier 200b includes a first identification unit 210b and a second identification unit 220b. The first identification unit 210 b is disposed in the boundary area 130. The second identification unit 220 b is disposed in the peripheral area 140 located between the display area 106 and the boundary area 130. In the present modification, the first identification unit 210b and the second identification unit 220b are partially connected. In other words, the identifier 200b has a space 230b between the first identification unit 210b and the second identification unit 220b, and the first identification unit 210b and the second identification unit 220b are partially separated. That is, the second identification unit 220 b is partially separated from the boundary region 130.

As shown to FIG. 8B, at least one part of the boundary area 130 is carbonized about the display apparatus 100b cut out from the panel 10b for multiple chamfers. For this reason, at least a part of the first identification unit 210 b disposed in the boundary area 130 can not be viewed due to carbonization of the boundary area 130. The peripheral area 140 located between the display area 106 and the boundary area 130 is not carbonized. Therefore, the second identification unit 220b disposed in the peripheral region 140 is visible from the stacking direction (the direction orthogonal to the upper surface of the first substrate 102). In the present modification, the second identification unit 220 b is partially separated from the boundary region 130. For this reason, even if the boundary region 130 is carbonized, the outer shape of the second identification unit 220b can be easily identified, and the position of the second identification unit 220b can be detected more accurately.

In the display device 100b according to the present modification, the first detection unit 210b and the second detection unit 220b of the identifier 200b are partially separated, so that position detection accuracy is obtained when the multiple-chamfering panel 10b is cut into pieces. Further, even if a part of the first identification unit 210b can not be visually recognized, the second identification unit 220b can be used to suppress a decrease in position detection accuracy.

<Modification 3>
The schematic configuration of the panel for multiple chamfers and the display device according to the present modification will be described with reference to FIGS. 9A and 9B. FIG. 9A and FIG. 9B are enlarged plan views showing schematic configurations of a multiple panel 10c and a display device 100c according to a modification of the present invention. FIG. 9A is an enlarged plan view of the intersection of the cutting site 120. FIG. FIG. 9B is an enlarged plan view of the display device 100c after the panel 10c for multiple chamfers of FIG. 9A is cut into pieces. Here, the configurations of the panel for multiple chamfers 10c and the display device 100c according to the present modification are the same as the configurations of the panel for multiple chamfers 10 and the display device 100 according to the first embodiment except for the shape of the identifier 200c. For this reason, the same parts as those of the first embodiment will not be described in detail.

[Display device configuration]
As shown in FIGS. 9A and 9B, in the display device 100c according to the present modification, the identifier 200c is provided on the first substrate 102. The identifier 200c is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). The identifier 200c is disposed in the boundary area 130 which is the outer periphery of the display device 100c, and in the peripheral area 140 located between the display area 106 and the boundary area 130. In the present variation, the identifier 200c is disposed at one of the corner portions formed by one side where the terminal area 114 is provided and the other side adjacent thereto.

[Configuration of panel for multiple chamfers]
The cutting site 120 is disposed at the boundary of each display device 100c. Each display device 100c can be obtained by cutting the multiple-chamfered panel 10c at the cutting portion 120 and further exposing the terminal area 114. In order to specify the cleavage site 120, an identifier 200c is provided at each intersection of the cleavage site 120. In this modification, one identifier 200c is disposed at one intersection point. The identifier 200 c is located at one of the corners formed by the intersection of the cutting sites 120. By arranging the identifiers 200c at the corners located in the same direction at each of the intersections, one identifier 200c is arranged in each of the plurality of display devices 100c on the panel for multiple chamfers 10c. However, the present invention is not limited to this, and the place where the identifier 200c is disposed at each intersection may be all within the display device 100c or may be entirely outside the display device 100c. Further, the number of identifiers 200c at each intersection is not limited to this, and one or more per intersection may be sufficient.

[Identifier structure]
As shown in FIGS. 9A and 9B, the identifier 200c has a first identification unit 210c and a second identification unit 220c. The first identification unit 210 c is disposed in the boundary area 130. The second identification unit 220 c is disposed in the peripheral area 140 located between the display area 106 and the boundary area 130. In the present modification, the first identification unit 210c and the second identification unit 220c are separated. That is, the identifier 200c has a space 230c between the first identification unit 210c and the second identification unit 220c, and the first identification unit 210c and the second identification unit 220c are separated.

As shown in FIG. 9B, in the display device 100c cut out from the multiple-chamfering panel 10c, at least a part of the boundary region 130 is carbonized. For this reason, at least a part of the first identification unit 210 c disposed in the boundary area 130 can not be viewed due to carbonization of the boundary area 130. The peripheral area 140 located between the display area 106 and the boundary area 130 is not carbonized. Therefore, the second identification unit 220c disposed in the peripheral region 140 is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). In the present modification, the second identification unit 220 c is separated from the boundary region 130. Therefore, even if the boundary region 130 is carbonized, the outer shape of the second identification unit 220c can be more easily identified, and the position of the second identification unit 220c can be detected more accurately.

In the display device 100c according to the present modification, the first identification unit 210c and the second identification unit 220c of the identifier 200c are separated, so that the position detection accuracy is further improved when the multiple panels 10c are cut into pieces. Even if a part of the first identification unit 210c can not be visually recognized, the second identification unit 220c can be used to suppress a decrease in position detection accuracy.

<Modification 4>
The schematic configuration of the panel for multiple chamfers and the display device according to the present modification will be described with reference to FIGS. 10 and 11A to 11C. FIG. 10 is a plan view showing a multiple panel 10d according to a modification of the present invention. FIG. 11A to FIG. 11C are enlarged plan views showing schematic configurations of the multiple panel 10d and the display device 100d according to a modification of the present invention. 11A is an enlarged plan view of the region D of FIG. 11B and 11C are enlarged plan views of the display device 100d after the panel 10d for multiple chamfers of FIG. 11A is cut into pieces. Here, the configurations of the panel 10d for multiple chamfering and the display device 100d according to the present modification are the same as the configurations of the panel 10 for multiple chamfering and the display device 100 according to the first embodiment except for the shape and arrangement of the identifier 200d. . For this reason, the same parts as those of the first embodiment will not be described in detail.

[Display device configuration]
As shown in FIGS. 10 and 11A to 11C, in the display device 100d according to the present modification, an identifier 200d is provided on the first substrate 102. The identifier 200 d is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). The identifier 200 d is disposed in the boundary area 130 which is the outer periphery of the display device 100 d and the peripheral area 140 located between the display area 106 and the boundary area 130. In the present variation, one identifier 200d is divided into two corner portions of the display device 100d.

[Configuration of panel for multiple chamfers]
The cutting site 120 is disposed at the boundary of each display device 100d. Each of the display devices 100 d can be obtained by cutting the multiple chamfered panel 10 d at the cutting portion 120 and further exposing the terminal area 114. In order to specify the cleavage site 120, an identifier 200d is provided at each intersection of the cleavage site 120. In this modification, one identifier 200d is disposed at one intersection point. The identifier 200 d is divided into two of the four corners formed by the intersection of the cutting sites 120. By arranging the identifiers 200d at the corners located in the same direction at each of the intersections, one identifier 200d is arranged in each of the plurality of display devices 100d on the panel for multiple chamfers 10d. However, the present invention is not limited to this, and the place where the identifier 200d is disposed at each intersection may be all within the display device 100d or may be entirely outside the display device 100b. Further, the number of the identifiers 200 d at each intersection is not limited to this, and it is sufficient that the number is one or more per intersection.

[Identifier structure]
As shown in FIGS. 11A and 11B, the identifier 200d includes a first identification unit 210d and a second identification unit 220d. The first identification unit 210 d is disposed in the boundary area 130. The second identification unit 220 d is disposed in the peripheral area 140 located between the display area 106 and the boundary area 130. In the present modification, the first identification unit 210d and the second identification unit 220d are separated. That is, in the identifier 200d, the first identification unit 210d and the second identification unit 220d are separated. Furthermore, the first identification unit 210d and the second identification unit 220d are separately arranged at different corner portions.

As shown in FIG. 11B, in the display device 100d cut out from the multiple-chamfering panel 10d, at least a part of the boundary region 130 is carbonized. For this reason, at least a part of the first identification unit 210d disposed in the boundary area 130 can not be viewed due to carbonization of the boundary area 130. The peripheral area 140 located between the display area 106 and the boundary area 130 is not carbonized. Therefore, the second identification unit 220d disposed in the peripheral region 140 is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). In the present modification, the second identification unit 220 d is separated from the boundary region 130. Therefore, even if the boundary region 130 is carbonized, the outer shape of the second identification unit 220d can be more easily identified, and the position of the second identification unit 220d can be detected more accurately.

In the display device 100d according to the present modification, when the first identification unit 210d and the second identification unit 220d of the identifier 200d are separated, the position detection accuracy is further increased when the multiple panels 10d are cut into pieces. This can be improved, and even if a part of the first identification unit 210d can not be visually recognized, the second identification unit 220d can be used to suppress a decrease in position detection accuracy.

<Modification 5>
The schematic configuration of the panel for multiple chamfering and the display device according to the present modification will be described with reference to FIGS. 12, 13 and 14A to 14D. FIG. 12 is a plan view showing a multiple panel 10e according to a modification of the present invention. FIG. 13 is an enlarged plan view showing a schematic configuration of a multiple panel 10e according to a modification of the present invention. FIG. 13 is an enlarged plan view of the area E of FIG. 14A to 14D are enlarged plan views of the display device 100e after the panel 10e for multiple chamfers of FIG. 12 is cut into pieces. Here, the configurations of the panel for multiple chamfers 10e and the display device 100e according to the present modification are the same as the configurations of the panel for multiple chamfers 10 and the display device 100 according to the first embodiment except for the shape and arrangement of the identifier 200e. . For this reason, the same parts as those of the first embodiment will not be described in detail.

[Display device configuration]
As shown in FIG. 12, FIG. 13, and FIG. 14A to FIG. 14D, in the display device 100e according to the present modification, the identifier 200e is provided on the first substrate 102. The identifier 200 e is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). The identifier 200 e is disposed in the boundary area 130 which is the outer periphery of the display device 100 e and the peripheral area 140 located between the display area 106 and the boundary area 130. In this modification, one identifier 200e is divided into four corner portions of the display device 100e.

[Configuration of panel for multiple chamfers]
The cutting site 120 is disposed at the boundary of each display device 100 e. Each display device 100 e can be obtained by cutting the multiple-chamfered panel 10 e at the cutting site 120 and further exposing the terminal area 114. In order to specify the cleavage site 120, an identifier 200e is provided at each intersection of the cleavage site 120. In this modification, one identifier 200e is disposed at one intersection point. The identifier 200 e is disposed across the four corners formed by the intersection of the cutting sites 120. By arranging the identifiers 200e in the same direction at each intersection point, one identifier 200e is arranged in each of the plurality of display devices 100e on the multiple panel 10e. However, the present invention is not limited to this, and the number of identifiers 200e may be one or more per intersection point.

[Identifier structure]
As shown in FIG. 13, the identifier 200 e has a first identification unit 210 e and a second identification unit 220 e. The first identification unit 210 e is disposed in the boundary area 130 so as to straddle two cutting sites 120 forming an intersection point. The second identification unit 220 e is disposed in the peripheral area 140. In the present modification, the first identification unit 210e and the second identification unit 220e are separated. That is, in the identifier 200e, the first identification unit 210e and the second identification unit 220e are separated. Furthermore, the first identification unit 210e is disposed across four different corners. For this reason, it is possible to save the space for arranging the identifier 200e.

As shown in FIGS. 14A to 14D, at least a part of the boundary region 130 of the display device 100e cut out from the multi-chamfered panel 10e is carbonized. Therefore, at least a part of the first identification unit 210 e disposed in the boundary area 130 can not be viewed due to carbonization of the boundary area 130. The peripheral area 140 located between the display area 106 and the boundary area 130 is not carbonized. For this reason, the second identification unit 220e disposed in the peripheral region 140 is visible from the stacking direction (direction orthogonal to the upper surface of the first substrate 102). In the present modification, the second identification unit 220 e is separated from the boundary region 130. Therefore, even if the boundary region 130 is carbonized, the outer shape of the second identification unit 220e can be more easily identified, and the position of the second identification unit 220e can be detected more accurately.

The display device 100e according to the present modification can save the space where the identifier 200e is disposed by arranging the first identification unit 210e of the identifier 200e across the cut portion 120. By separating the first identification unit 210e and the second identification unit 220e of the identifier 200e, it is possible to further improve the position detection accuracy when cutting the panel 10e for multi-chamfering into individual pieces, and the first identification unit Even if a part of 210 e can not be visually recognized, the second identification unit 220 e can be used to suppress a decrease in position detection accuracy.

Second Embodiment
[Method of manufacturing display device]
In the present embodiment, a method of manufacturing the display device 100 will be described with reference to FIGS. 15A to 15C. In addition, about the manufacturing method of the panel 10 for multiple chamfers, it does not specifically limit except forming the identifier 200 mentioned above, and the existing method can be used. Therefore, the description of the method of manufacturing the panel 10 for multiple chamfers is omitted, and in FIGS. 15A to 15C, a method for forming the display device 100 by cutting the panel 10 for multiple chamfers into pieces will be described.

15A to 15C are cross-sectional views showing a manufacturing method according to an embodiment of the present invention. In the present embodiment, the boundary region 130 of the multi-chamfering panel 10 includes the first substrate 102 'for multi-chamfering, the undercoat 160, the adhesive layer 110, and the second substrate 104' for multi-chamfering. As shown in FIG. 15A, an identifier 200 is disposed between the multiple bevel first substrate 102 'and the multiple bevel second substrate 104'. The first identification unit 210 of the identifier 200 is disposed in the boundary area 130 of the multi-chamfering panel 10. A second identification unit 220 of the identifier 200 is disposed in the peripheral area 140 of the multi-chamfered panel 10. The identifier 200 is visible from the stacking direction (the direction orthogonal to the upper surface of the first substrate for multiple beveling 102 ′).

As shown in FIG. 15B, in order to cut the multi-chamfering panel 10 into pieces at the cutting site 120, the multi-chamfering second substrate 104 'is cut using a laser. First, using the first identification unit 210 and the second identification unit 220 of the identifier 200, the position detection of the first substrate for multi-chamfering 102 'of the panel 10 for multi-chamfering is performed. The position of the multiple beveling first substrate 102 ′ of the beveling panel 10 and the laser is aligned, and the multiple bevel second substrate 104 ′ is cut at the cutting portion 120 of the boundary region 130. The multi-chamfering second substrate 104 'includes a polarizing plate. For this reason, it is preferable to use a carbon dioxide gas laser for cutting the second substrate for multiple bevel 104 '. In the present embodiment, the cutting of the second substrate for multiple bevel 104 ′ by the carbon dioxide gas laser cuts the second substrate for multiple bevel 104 ′, the adhesive layer 110, and the undercoat 160. However, the present invention is not limited to this, and an organic resin material or silicon nitride constituting a circuit element layer further provided in the display region 106 between the first substrate 102 'for multiple chamfers and the second substrate 104 for multiple chamfers. And the like, and these layers may also be cut by a carbon dioxide gas laser.

A carbon dioxide laser generates heat. For this reason, at least a part of the boundary region 130 of the first substrate 102 'for multiple chamfers and the second substrate 104' for multiple chamfers is carbonized under the thermal influence of the carbon dioxide gas laser. The range of influence of the carbon dioxide gas laser depends on the irradiation conditions (intensity and range) of the laser. For example, the panel 10 with multiple chamfers is thermally affected by a carbon dioxide gas laser in a range of 10 μm or more from the cutting

site

120 and 100 μm or less from the cutting site. Therefore, the boundary region 130 can be appropriately set in a range of 10 μm or more from the cutting

site

120 and 100 μm or less from the cutting site 120. Carbonization by a carbon dioxide gas laser can extend to all the organic substances constituting the boundary area 130. In addition, the cut surface may be in a state where carbide of any of the organic substances constituting the boundary area 130 is scattered.

By carbonization with a carbon dioxide gas laser, at least a part of the first identification portion 210 of the identifier 200 located in the boundary area 130 becomes invisible. The second identification portion 220 of the identifier 200 located in the peripheral region 140 is visible from the stacking direction (the direction orthogonal to the upper surface of the multiple bevel first substrate 102 ′).

As shown in FIG. 15C, in order to cut the multi-chamfering panel 10 into pieces at the cutting site 120, the multi-chamfering first substrate 102 'is cut using a laser. The position detection of the first substrate for multiple chamfer 102 ′ of the panel for multiple chamfers 10 is performed using the second identification unit 220 of the identifier 200. The position of the multiple chamfering first substrate 102 ′ of the multiple chamfering panel 10 and the laser is aligned, and the multiple chamfering first substrate 102 ′ is cut at the cutting portion 120 of the boundary region 130. In the present embodiment, the first substrate for multiple chamfer 102 ′ includes polyimide. For this reason, it is preferable to use a UV laser for cutting the first substrate 102 'for multiple chamfering.

As in the present embodiment, by having the identifier 200 including the first identification unit 210 and the second identification unit 220, a part of the first identification unit 210 is visually recognized when the multi-chamfered panel is cut into pieces. Even if it becomes impossible, the second identification unit 220 can be used to suppress the decrease in position detection accuracy.
<Modification 6>
[Method of manufacturing display device]
In this embodiment, a modification of the method of manufacturing the display device 100 will be described with reference to FIGS. 16A to 16C. Here, the method of manufacturing the display device 100 according to the present modification is the same as the method of manufacturing the display device 100 according to the second embodiment except that the first film 197 and the second film 198 are further cut. For this reason, the same parts as those of the second embodiment will not be described in detail.

16A to 16C are cross-sectional views showing a manufacturing method according to an embodiment of the present invention. In the present embodiment, the boundary region 130 of the multi-chamfered panel 10 includes the first film 197, the first multi-chamfered substrate 102 ', the undercoat 160, the adhesive layer 110, the second multi-chamfered substrate 104', and the second film. It consists of 198. As shown in FIG. 16A, an identifier 200 is disposed between the multiple bevel first substrate 102 'and the multiple bevel second substrate 104'. The first identification unit 210 of the identifier 200 is disposed in the boundary area 130 of the multi-chamfering panel 10. A second identification unit 220 of the identifier 200 is disposed in the peripheral area 140 of the multi-chamfered panel 10. The identifier 200 is visible from the stacking direction (the direction orthogonal to the upper surface of the first substrate for multiple beveling 102 ′).

As shown in FIG. 16B, in order to cut the multi-faceted panel 10 into pieces at the cutting site 120, the multiple-face second substrate 104 'is cut using a laser. First, using the first identification unit 210 and the second identification unit 220 of the identifier 200, the position detection of the first substrate for multi-chamfer 102 'of the panel 10 for multi-chamfering is performed. The position of the multiple beveling first substrate 102 ′ of the beveling panel 10 and the laser is aligned, and the multiple bevel second substrate 104 ′ is cut at the cutting portion 120 of the boundary region 130. The multi-chamfering second substrate 104 'includes a polarizing plate. For this reason, it is preferable to use a carbon dioxide gas laser for cutting the second substrate for multiple bevel 104 '. In the present embodiment, the cutting of the second substrate for multiple bevel 104 ′ by the carbon dioxide gas laser cuts the second film 198, the second substrate for multiple bevel 104 ′, the adhesive layer 110, and the undercoat 160. However, the present invention is not limited to this, and an organic resin material or silicon nitride constituting a circuit element layer further provided in the display region 106 between the first substrate 102 'for multiple chamfers and the second substrate 104 for multiple chamfers. And the like, and these layers may also be cut by a carbon dioxide gas laser.

As shown in FIG. 16C, in order to cut the multi-chamfering panel 10 into pieces at the cutting site 120, the multi-chamfering first substrate 102 'is cut using a laser. The position detection of the first substrate for multiple chamfer 102 ′ of the panel for multiple chamfers 10 is performed using the second identification unit 220 of the identifier 200. The position of the multiple chamfering first substrate 102 ′ of the multiple chamfering panel 10 and the laser is aligned, and the multiple chamfering first substrate 102 ′ is cut at the cutting portion 120 of the boundary region 130. In the present embodiment, the first substrate for multiple chamfer 102 ′ includes polyimide. For this reason, it is preferable to use a UV laser for cutting the first substrate 102 'for multiple chamfering. In the present embodiment, the cutting of the first substrate for multiple bevel 102 ′ by the UV laser cuts the first substrate for multiple bevel 102 ′ and the first film 197.

As in the present embodiment, by having the identifier 200 including the first identification unit 210 and the second identification unit 220, a part of the first identification unit 210 is visually recognized when the multi-chamfered panel is cut into pieces. Even if it becomes impossible, the second identification unit 220 can be used to suppress the decrease in position detection accuracy.

The display device according to the preferred embodiment of the present invention and the method of manufacturing the same have been described above. However, these are merely examples, and the technical scope of the present invention is not limited to them. Indeed, various modifications may be made by those skilled in the art without departing from the scope of the invention as claimed in the claims. Therefore, it is to be understood that those modifications are also within the technical scope of the present invention.

Panel for multiple bevel: 10, display device: 100, first substrate: 102, second substrate: 104, display region: 106, pixel: 108, adhesive material: 110, first drive circuit: 111, second drive circuit: 112, terminal area: 114, connection terminal: 116, cutting site: 120, boundary area: 130, peripheral area: 140, identifier: 200, first identification unit: 210, second identification unit: 220

Claims

In a method of manufacturing a display device, a plurality of display devices including a display region, a peripheral region, and a boundary region are formed on a first substrate for multiple chamfering,
Forming a plurality of pixels in the display area;
An identifier including a first identification unit disposed in the boundary region located at the boundary of the display device, and a second identification unit disposed in the peripheral region located between the display region and the boundary region. Formed on the first substrate for multiple chamfers;
Forming a second substrate for multiple chamfers on the first substrate for multiple chamfers across the plurality of display devices;
Aligning the position of the laser and the first substrate for multiple chamfering using the first identification unit, and cutting the second substrate for multiple chamfering at the boundary region,
Aligning the position of the laser and the first substrate for multiple chamfering using the second identification unit, and cutting the first substrate for multiple chamfering at the boundary region,
A method of manufacturing a display device, wherein cutting the second substrate for multiple chamfers comprises carbonizing at least a part of the first substrate for multiple substrates.
The manufacturing of the display device according to claim 1, wherein carbonizing at least a part of the first substrate for multiple chamfers in the boundary area includes making at least a part of the first identification portion invisible. Method.
The method of manufacturing a display device according to claim 1, wherein cutting the multiple bevel second substrate includes carbonizing at least a part of the multiple bevel second substrate in the boundary region.
The method for manufacturing a display device according to claim 1, wherein the second substrate for multiple beveling is cut using a carbon dioxide gas laser, and the first substrate for multiple beveling is cut using a UV laser.
The method for manufacturing a display device according to claim 1, wherein a plurality of the identifiers are formed.
The method according to claim 1, wherein the first identification unit and the second identification unit are formed discontinuously.
Forming the identifier is:
The method for manufacturing a display device according to claim 1, wherein the identifier is formed when forming the plurality of pixels.
The pixel comprises a transistor,
Forming the plurality of pixels is:
The method according to claim 1, further comprising forming a gate electrode that configures the transistor in the same layer as the identifier.
The method for manufacturing a display device according to claim 1, wherein the first substrate for multiple beveling is formed of an organic resin material.
The method for manufacturing a display device according to claim 1, wherein the second substrate for multiple chamfers includes a polarizing plate.
Forming a first film under the multiple beveling first substrate across the plurality of display devices;

Forming a second film on the second substrate for multi-chamfer over the plurality of display devices;
Cutting the second substrate for multi-chamfering includes cutting the second film,
The method of manufacturing a display device according to claim 1, wherein cutting the first substrate for multiple chamfers comprises cutting the first film.
A first substrate including a display area in which a plurality of pixels are arranged, a boundary area located at the boundary of the display device, and a peripheral area located between the display area and the boundary area;
An identifier including a first identification unit disposed in the boundary area and a second identification unit disposed in the peripheral area;
A second substrate disposed in the display area, the peripheral area, and the boundary area;
The display device in which at least a part of the first substrate in the boundary area is carbonized.
The display device according to claim 12, wherein at least a part of the first identification unit is not visible due to carbonization of the first substrate.
The display device according to claim 12, wherein at least a part of the second substrate in the boundary area is carbonized.
The display device according to claim 12, wherein a plurality of the identifiers are arranged.
The display device according to claim 12, wherein the first identification unit and the second identification unit are separated.
The display device according to claim 12, wherein the plurality of pixels include a transistor, and a gate electrode that configures the transistor in the same layer as the identifier.
The display device according to claim 12, wherein the first substrate comprises an organic resin material.
The display device of claim 12, wherein the second substrate comprises a polarizer.
A first film disposed below the first substrate;
The display device according to claim 12, further comprising: a second film disposed on the second substrate.