WO2019138702A1 - Vacuum device - Google Patents

Vacuum device Download PDF

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Publication number
WO2019138702A1
WO2019138702A1 PCT/JP2018/043350 JP2018043350W WO2019138702A1 WO 2019138702 A1 WO2019138702 A1 WO 2019138702A1 JP 2018043350 W JP2018043350 W JP 2018043350W WO 2019138702 A1 WO2019138702 A1 WO 2019138702A1
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WO
WIPO (PCT)
Prior art keywords
hole
stage
vacuum
disposed
substrate
Prior art date
Application number
PCT/JP2018/043350
Other languages
French (fr)
Japanese (ja)
Inventor
傑之 鈴木
和博 武者
淳介 松崎
慎太郎 田宮
展史 南
裕利 中尾
Original Assignee
株式会社アルバック
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アルバック filed Critical 株式会社アルバック
Priority to CN201880015142.1A priority Critical patent/CN110366774B/en
Priority to JP2019506749A priority patent/JP6515254B1/en
Publication of WO2019138702A1 publication Critical patent/WO2019138702A1/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a vacuum apparatus using a vacuum atmosphere, and more particularly to a vacuum apparatus that can be changed from a vacuum atmosphere to an atmospheric pressure atmosphere in a short time without cracking or dropping of a substrate.
  • a substrate loading and unloading chamber is used to move a substrate between the atmosphere and a vacuum atmosphere, the substrate is disposed in the substrate loading and unloading chamber in the air atmosphere, and the substrate loading and unloading chamber is evacuated to evacuate the periphery of the substrate.
  • a vacuum processing chamber in a vacuum atmosphere is connected to a substrate transfer chamber in which a substrate is placed.
  • the substrate is placed in a substrate loading and unloading chamber placed in a vacuum atmosphere, nitrogen gas and air are introduced into the vacuum atmosphere to make the substrate loading and unloading chamber at atmospheric pressure, and the substrate loading and unloading chamber and the air atmosphere are connected. Is taken out to the atmosphere.
  • FIG. 8 shows a substrate loading / unloading chamber 102 according to the prior art, which has a stage 115 constituting the bottom surface of the substrate loading / unloading chamber, and a container-like lid member 116 covered on the stage 115.
  • the stage 115 is provided with a support member 128 formed of a protrusion or a protrusion, and the carrier plate 112 is detachably mounted on the support member 128.
  • a gap 105 is formed between the stage 115 and the carrier plate 112.
  • One or more substrates 107 are disposed on the transport plate 112.
  • the lid member 116 is provided with an air supply and exhaust port 109.
  • An evacuation device 124 and a gas supply device 125 are connected to the air supply and exhaust port 109.
  • a rectifying plate 106 is provided between the air supply and exhaust port 109 and the substrate 107 on the carrier plate 112.
  • the gas supply device 125 is operated to supply a pressurizing gas such as air to the internal space 118 from the air supply / discharge port 109.
  • the pressurizing gas supplied to the internal space 118 collides with the current plate 106 and flows laterally, passes between the current plate 106 and the wall surface of the lid member 116 to reach the surface of the substrate 107, and then enters the internal space 118 is boosted. At this time, although the introduced pressurizing gas does not collide with the substrate 107, the flow rate of the pressurizing gas around the substrate 107 may be too high, and the substrate 107 may be damaged if it is thin.
  • the introduced pressurizing gas passes through the gap 105 around the carrier plate 112 and flows into the space on the back surface side of the substrate 107, so that a strong swirl of the pressurizing gas is formed under the substrate 107. 107 lifts up. When the substrate 107 falls onto the frame of the transfer plate 112 or the like, it may be damaged.
  • the substrate 107 may be broken up and broken by the flow of the air filling the internal space 118. Therefore, in order to prevent the damage of the substrate 107, it is conceivable to reduce the supply rate of the pressure-boosting gas and the evacuation rate.
  • the present invention was created to solve the above-mentioned disadvantages of the prior art, and its object is to provide a technique capable of changing from a vacuum atmosphere to an atmospheric pressure atmosphere in a short time.
  • the present invention relates to a vacuum chamber, an insertion hole provided on a ceiling of the vacuum chamber, a closing position for closing the insertion hole, and replacement of the inside of the vacuum chamber below the closing position.
  • a stage on which the object to be conveyed is disposed with a gap in an upwardly directed surface, and a container-shaped configuration facing downward with respect to said stage, said container-shaped being movable between positions
  • a lid member which is hermetically sealed between an edge portion of the opening of the shape and the ceiling outside the insertion hole, and an air supply / exhaust through hole formed in the lid member;
  • a transport plate disposed on the stage, and a substrate disposed on the transport plate, wherein the insertion hole is closed by the stage and carried out between the lid member and the stage.
  • the space is airtight between the lid member and the ceiling When it is removed, it is separated from the atmosphere, and the carry-in / out space is evacuated from the air supply / discharge port which is an opening provided in the carry-in / out space of the air supply / discharge through hole.
  • a vacuum apparatus to which a pressure-boosting gas is supplied wherein a rectangular or square first flow straightening plate is disposed between the stage and the air supply and discharge port, and the object to be transferred is the first flow straightening plate
  • the lid member has four wall surfaces arranged in a square cylindrical shape, and the first straightening vane contacts two wall surfaces parallel to one another among the four wall surfaces, A second straightening plate spaced apart from the other parallel two wall surfaces and being rectangular or square in the portion of the first straightening plate spaced apart from the two wall surfaces, the second straightening plate is spaced apart And the second current plate is disposed in front of the second current plate.
  • the surface facing the wall surface a vacuum device through hole through which the boost gas passes through is provided between the rear surface.
  • the present invention is a vacuum device in which a recess is formed on the surface of the transfer plate facing the first straightening vane.
  • an upper through hole disposed at a height between the surface of the substrate disposed on the transfer plate and a surface facing downward of the first rectifying plate
  • the vacuum device may include a lower through hole disposed at a height between the height of the back surface of the object to be transferred disposed on the stage and the height of the surface of the stage.
  • a surface side gap is formed between the substrate and the first current plate, and a back surface side gap is formed between the back surface of the transfer plate and the surface of the stage, It is a vacuum device in which the value of the product of the volume of the gap and the area of the upper through hole and the value of the product of the volume of the back surface side gap and the area of the lower through hole are equal.
  • the distance between the second straightening vane and the wall facing the second straightening vane is greater than the width in the vertical direction of the upper through hole, and the lower through hole Is a vacuum device that is larger than the vertical width of the
  • the through hole in the through hole, an upper through hole disposed at a height between the surface of the substrate disposed on the transfer plate and a surface facing downward of the first rectifying plate, and A through hole on the stage, which is a gap provided between the stage and the lower end of the second current plate, is included, and the through hole on the stage is closer to the rear surface of the carrier plate disposed on the stage It is a vacuum device placed at a low height.
  • a surface side gap is formed between the substrate and the first current plate, and a back surface side gap is formed between the back surface of the transfer plate and the surface of the stage, It is a vacuum device in which the value of the product of the volume of the gap and the area of the upper through hole, and the value of the product of the volume of the back surface side gap and the area of the on-stage through hole are equal.
  • the present invention is a vacuum device provided with a lifting device that raises and lowers the first flow straightening plate and the second flow straightening plate with respect to the lid member.
  • the distance between the second straightening vane and the wall surface facing the second straightening vane is greater than the width in the vertical direction of the upper through hole, and the penetration on the stage is achieved. It is a vacuum device that is larger than the vertical width of the hole.
  • the present invention is a vacuum apparatus provided with a plurality of the air supply and exhaust ports.
  • the present invention is the vacuum device in which a mesh-like flow straightening member is provided at the air supply and discharge port.
  • the present invention is a vacuum apparatus in which the substrate is vacuum processed inside the vacuum chamber.
  • a view seen from the direction showing the cross section of the second straightening vane of the vacuum device in which the second straightening vane is provided on the short side of the first straightening vane The view from the direction perpendicular to FIG. 1 with the first straightening vane of the vacuum device in contact with the wall surface (the second straightening vane is omitted)
  • Diagram for explaining the state when the stage of the vacuum device is stopped at the exchange position (a): A front view of the second straightening vane provided with a seal member at its lower end (b) A cross-sectional view in the direction perpendicular to the front view (c): A second on the lower end with a through hole on the stage Front view of current plate (d) Cross-sectional view in the direction perpendicular to the front view An exploded view showing the relative positions of the first and second baffles, the object to be transported, and the stage The figure which shows the state which the 1st straightening vane of the vacuum apparatus with which the 2nd straightening vane was provided
  • FIGS. 1 to 3 show a vacuum apparatus 3a according to a first example of the present invention in which a second rectifying plate 6 is provided on the short side of a rectangular first rectifying plate 5 described later, and FIGS. It is the vacuum apparatus 3b of the 2nd example of this invention by which the 2nd flow straightening plate 6 was provided in the long side of the flow straightening plate 5 of 1 one.
  • 1 and 2 are cross-sectional views when the vacuum device 3a of the first example is cut in different directions, and similarly, in FIGS. 6 and 7, the vacuum device 3b of the second example is cut in different directions.
  • the vacuum apparatuses 3 a and 3 b of the first and second examples respectively have a substrate loading and unloading chamber 2 and a vacuum processing chamber 4.
  • the vacuum processing chamber 4 has a vacuum chamber 14 and a stage 15 disposed inside the vacuum chamber 14, and a ceiling of the vacuum chamber 14 is provided with an insertion hole formed of a through hole.
  • FIG. 3 shows a state in which the stage 15 is stopped at the exchange position inside the vacuum chamber 14 as described later, and the reference numeral 11 in the same figure is an insertion hole.
  • the substrate loading / unloading chamber 2 has a lid member 16.
  • the lid member 16 is in the shape of a container facing downward, and the lid member 16 is provided on the insertion hole 11 with the edge portion 18 of the container opening 39 in contact with the vacuum chamber 14. ing.
  • the stage 15 Assuming that the position of the stage 15 when the insertion hole 11 is closed by the stage 15 is referred to as a closed position, the stage 15 is stopped at the closed position in FIGS.
  • the hole 11 is closed by the stage 15 to separate the internal space of the vacuum chamber 14 from the transfer space 8 and maintain the internal space of the vacuum chamber 14 in a vacuum atmosphere even if the transfer space 8 is in the air atmosphere. It can be done.
  • a plurality of support members 28 composed of protrusions or protrusions are provided, and the object 10 to be conveyed is placed on the support member 28 so as to be separated from the support member 28.
  • the object to be transported 10 has a transport plate 12 and one or more substrates 7 disposed on the transport plate 12.
  • the back surface of the transfer plate 12 and the surface of the stage 15 are separated, and a back surface side gap 26 which is a space between the back surface of the transfer plate 12 and the surface of the stage 15 is formed on the back surface side of the transfer plate 12 ing.
  • the wall of the lid member 16 is provided with an air supply and exhaust through hole 21 which is a through hole.
  • the air supply / exhaust through hole 21 is connected to a pipe 22 disposed outside the vacuum chamber 14, and the vacuum evacuation device 24 and the gas supply device 25 disposed outside the vacuum chamber 14 are carried out by the pipe 22 respectively. It is connected to the space 8.
  • An air supply and exhaust port 9 which is one end of the air supply and exhaust through hole 21 is provided on the surface of the lid member 16 exposed to the carry in and out space 8, and gas supply and exhaust are performed from the air supply and exhaust port 9.
  • the vacuum devices 3a and 3b are provided with a control device 19, and the vacuum evacuation device 24, the gas supply device 25, and a lift device 37 described later are connected to the control device 19 and controlled by the control device 19. There is.
  • the evacuation unit 24, the gas supply unit 25, and the lifting unit 37 operate as described below according to the operation of the control unit 19.
  • pressurized gas such as air or nitrogen gas is supplied from the gas supply device 25 to the air supply / discharge through hole 21.
  • the supplied pressurized gas passes through the air supply / discharge through hole 21 and is blown out from the air supply / discharge port 9 to the carry-in / out space 8, and the carry-in / out space 8 is pressurized. At this time, the evacuation of the transfer space 8 by the evacuation device 24 is stopped.
  • the vacuum exhaust device 24 evacuates the gas such as air filled in the transfer space 8 from the air supply and discharge port 9. At this time, the pressure supply gas is not supplied from the gas supply device 25.
  • the air supply and exhaust port 9 is directed in the direction in which the stage 15 is positioned, the first current plate 5 is disposed between the air supply and exhaust port 9 and the transport plate 12, and the substrate 7 disposed on the transport plate 12 is
  • the first current plate 5 is arranged to face the first current plate 5 at a distance.
  • the first flow control plate 5 is suspended from the cover member 16 by a suspension member 33 whose one end is fixed to the cover member 16 and the other end is fixed to the first flow control plate 5.
  • the pressurizing gas When the pressurizing gas is introduced from the air supply and exhaust port 9, the pressurizing gas is blown to the first straightening vane 5. A through hole is not formed in the first straightening vane 5, and the pressurizing gas does not penetrate the first straightening vane 5.
  • the first straightening vane 5 and the conveyance plate 12 are square or rectangular quadrilateral thin plates, and the conveyance plate 12 is smaller than the first straightening vane 5 and disposed inside the four sides of the first straightening vane 5 It is done.
  • the first straightening vane 5 and the conveyance plate 12 are disposed horizontally, and among the six faces of the first straightening vane 5, four faces other than the front and back faces are formed in a linear elongated shape.
  • the lid member 16 has four flat wall surfaces, and the wall surfaces are vertically disposed to form a square cylinder.
  • the first straightening vane 5 has two sets of parallel planes, where two planes parallel to one another among the elongated four faces of the first straightening vane 5 are one set of parallel planes.
  • one set of parallel surfaces is disposed parallel to the wall surface of lid member 16 and is in contact with the wall surface, and the other set of parallel surfaces is elongated at the first end
  • the two parallel surfaces are in contact with the two wall surfaces in contact with each other, and the other two wall surfaces are disposed facing in parallel, spaced apart from each other.
  • a slidable rubber member is provided on any one of a pair of parallel surfaces in contact with the wall surface of the lid member 16 or a wall surface of the lid member 16 in contact with the pair of parallel surfaces;
  • the parallel surfaces of the set and the wall surface of the lid member 16 may be in contact via the rubber member.
  • FIG. 5 is a drawing showing the relative positions between the first straightening vane 5 of the vacuum device 3a of FIGS. 1 and 2, the object 10 to be conveyed, and the stage 15.
  • the parallel surface of the set having the long side is in surface contact with the wall surface of the lid member 16 and the parallel surface of the set having the short side is disposed facing away from the other wall surface.
  • the baffles 6 are attached respectively.
  • the parallel surfaces of the set having the short sides are in surface contact with the wall surface of the lid member 16, and the parallel surfaces of the set having the long sides are spaced apart in parallel to the two wall surfaces. Then, the second straightening vane 6 can be attached.
  • the second straightening vane 6 is a square or rectangular quadrilateral thin plate, and among the six faces of the second straightening vane 6, the area of the two faces is large and the other four faces are formed in a linear elongated shape .
  • the second straightening plate 6 has two wide side faces vertically and is formed on two side faces respectively facing the wall surface of the lid member 16 so as to face each other. It is arranged to be spaced apart from 12.
  • the two sides are vertical and are in contact with the same wall together with the two sides of the first straightening vane 5, and the other elongated two sides are horizontal
  • One of the surfaces is mounted in contact with the first current plate 5, and the other surface faces the stage 15 at a distance.
  • a thin plate mounting plate is vertically fixed to the second straightening vane 6 at the upper end of the thin plate second straightening vane 6, and the mounting plate is placed on the second straightening vane 6, The second current plate 6 is prevented from falling from the first current plate 5.
  • one side surface is disposed to be separated from one wall surface of the lid member 16 and the other side surface is disposed to be separated from the transport object 10
  • the two ends of the two side surfaces are in contact with the wall surface of the lid member 16, and a buffer space 17 is formed between the second current plate 6 and the wall surface of the lid member 16 facing the second current plate 6.
  • the upper end of the second straightening vane 6 is in close contact with the first straightening vane 5 so that no gap is formed between the first straightening vane 5 and the second straightening vane 6.
  • a lifting device 20 is provided on the lid member 16, and the upper end of the hanging member 33 is airtightly drawn out of the lid member 16 and attached to the lifting device 20.
  • the suspension member 33 moves upward or downward, and the first current plate 5 and the second current plate 6 move together with the first current plate 5 as the suspension member 33 moves.
  • a set of parallel surfaces move up and down while in contact with the wall surface of the wall member 16.
  • FIG. 4 (a) shows the side face of the second straightening vane 6 facing away from and facing the wall surface of the lid member 16, and FIG. 4 (b) is a vertical cross-sectional view of the side face FIG. 2 is a cross-sectional view of one straightening vane 5, a processing target 10, and a stage 15.
  • the second straightening vane 6 is provided with an upper through hole 13 and a lower through hole 23 penetrating the second straightening vane 6 in the thickness direction, respectively.
  • the opening of the upper through hole 13 and the opening of the lower through hole 23 are respectively provided on the side facing the transport plate 12 and the side facing the lid member 16 It is formed.
  • the upper through holes 13 are provided at a position higher than the higher side of the surface of the substrate 7 or the edge portion of the transfer plate 12 disposed in the transfer plate 12 and lower than the back surface of the first current plate 5. Also, the lower through hole 23 is provided at a position lower than the back surface of the carrier plate 12 and higher than the surface of the stage 15.
  • a seal member 29 is disposed between the lower end of the second current plate 6 and the surface of the stage 15.
  • the sealing member 29 is in contact with both the lower end of the second straightening vane 6 and the surface of the stage 15 and is pressed by the lower end of the second straightening vane 6 to lower the lower end of the second straightening vane 6 and the surface of the stage 15 Of the second straightening vane 6 and the surface of the stage 15 so as not to pass gas.
  • the seal member 29 can use a rubber-like deformation member such as an O-ring, for example.
  • a space formed between the substrate 7 disposed on the transport plate 12 and the first current plate 5 is referred to as a front side gap 27, the buffer space 17 and the front side gap 27 are connected by the upper through holes 13.
  • the buffer space 17 and the back side gap 26 described above are connected by the lower through hole 23.
  • the sealing member 29 can be disposed on the bottom of the groove 30 formed on the surface of the stage 15 so as not to move. In this case, if the width of the opening of the groove 30 is made about the width of the sealing member 29 and the width of the bottom of the groove 30 is made larger than the width of the opening of the groove 30, the sealing member 29 is outside the groove 30. There is no risk of popping into
  • FIGS. 4C and 4D show an example in which the sealing member 29 is not provided.
  • the lower end of the second straightening vane 6 is separated from the surface of the stage 15, and the second straightening
  • the on-stage through hole 31 is formed between the plate 6 and the stage 15, and the lower through hole 23 is not formed. Therefore, the buffer space 17 and the above-mentioned back surface side gap 26 are connected by the on-stage through hole 31.
  • the on-stage through hole 31 is the same as the lower through hole 23 in that it is formed at a position lower than the back surface of the transfer plate 12 and higher than the surface of the stage 15.
  • the transfer in / out space 8 When the transfer in / out space 8 is changed from the vacuum atmosphere to the atmospheric pressure atmosphere, the evacuation of the transfer in / out space 8 is stopped, and then the pressure raising gas is blown out from the supply / discharge port 9 to the transfer in / out space 8.
  • the blown-up pressure-boosting gas is blown to the first current plate 5. That is, the pressurizing gas collides with the first straightening vane 5, and the colliding boosting gas is bent in the traveling direction, advances along the first straightening vane 5, collides with the wall surface of the lid member 16 and advances The direction is bent and flows into the buffer space 17.
  • the pressurizing gas flowing into the buffer space 17 travels along the second current plate 6 in the direction in which the surface of the stage 15 is located.
  • the pressurizing gas passes through the upper through hole 13 and flows from the buffer space 17 into the surface side gap 27, and the lower through hole 23 or the upper stage through hole 31 It passes through and flows from the buffer space 17 into the back surface side gap 26.
  • the transport plate 12 is provided with a plate opening 38 (FIG. 5) and the substrate 7 is arranged above the plate opening 38. Accordingly, the back surface of the substrate 7 is exposed to the back surface side gap 26 at the bottom surface of the plate opening 38, and the pressurizing gas flowing into the back surface side gap 26 collides with the back surface of the substrate 7 through the plate opening 38.
  • the first flow straightening plate 5 prevents collision between the substrate 7 and the pressure-boosting gas, thereby preventing breakage or floating of the substrate 7. If the flow rate of the pressurizing gas that collides with the back surface of the substrate 7 is not high and the swirling pressure gas is formed in the back surface side gap 26, the substrate 7 floats up from the transport plate 12 and drops. In some cases, the substrate 7 may be damaged.
  • the boosting speed of the front-side gap 27 and the boosting speed of the back-side gap 26 are made to coincide with each other.
  • the product of the volume value of the front side gap 27 and the area value of the upper through hole 13, the volume value of the back side gap 26, the area value of the lower through hole 23, or the on-stage through hole 31 It is preferable to make the product value with the area value equal.
  • the lid member 16 When the loading / unloading space 8 changes from a vacuum atmosphere to an atmospheric pressure atmosphere, the lid member 16 is opened, and the object 10 to be transported moves on the support member 28 and is carried out of the lid member 16.
  • the evacuation device 24 evacuates the loading and unloading space 8 for the atmosphere and the loading and unloading space 8 is changed to the vacuum atmosphere.
  • the air filling the front side gap 27 passes through the upper through hole 13 and moves to the buffer space 17 to be evacuated and the air filling the back side gap 26 passes the lower through hole 23 or the stage It passes through the upper through hole 31 and moves to the buffer space 17 and is evacuated.
  • the stage 15 is connected to the lifting device 37 by a lifting rod 36.
  • the lifting rod 36 is lowered by the lifting device 37, the stage 15 is lowered together with the lifting rod 36, and the stage 15 is inserted into the insertion hole 11 It separates from the circumference and closure of the insertion hole 11 is released.
  • the internal space of the lid member 16 and the internal space of the vacuum chamber 14 are connected by the insertion hole 11 in the state where the closure is released. However, since the edge portion 18 of the container opening 39 of the lid member 16 is in contact with the vacuum chamber 14 to be airtight, the inside of the vacuum chamber 14 maintains a vacuum atmosphere.
  • the stage 15 of FIG. 3 is stationary at a replacement position, which is a predetermined position inside the vacuum chamber 14, and the transport object 10 on the stage 15 stationary at the replacement position is vacuumed from above the stage 15 by the transport device.
  • the inside of the vacuum chamber 14 is moved by the inside of the vacuum chamber 14 by the vacuum processing device provided in the vacuum chamber 14.
  • the vacuum processing apparatus is a sputtering target
  • thin film formation by sputtering is vacuum processing, but vacuum processing is not limited to thin film formation, and includes, for example, processing such as etching, ashing, or ion implantation.
  • the second straightening vane 6 is provided on either the short side or the long side of the first straightening vane 5, but both the short side and the long side of the same first straightening vane 5 are provided.
  • the buffer space 17 When the buffer space 17 is enlarged, the time for boosting and de-pressurizing the space surrounded by the first and second rectifying plates 5 and 6 is increased. The flow of the inflowing pressurizing gas becomes uniform, and wafer breakage and the like are prevented.
  • the number of the air supply and exhaust port 9 was one, but a plurality of air supply and exhaust ports 9 are provided in one air supply and exhaust through hole 21, and the pressure boosting gas is transferred from the plurality of air supply and exhaust ports 9. It was confirmed that the introduction of V.8 reduced the occurrence of wafer breakage without increasing the volume of the buffer space 17. It is considered that this is because the flow of the pressurizing gas in the loading and unloading space 8 has become uniform.
  • the width of the on-stage through hole 31 and the width of the upper through hole 13 and the width of the lower through hole 23 (where the width of the through hole is the distance of the holes in the height direction) make the size smaller than the distance between the 16 walls. For example, when the distance between the second current plate 6 and the wall surface of the lid member 16 is 5 mm, the width of the on-stage through hole 31, the width of the upper through hole 13, and the width of the lower through hole 23 are respectively Make the size 0.5 mm or more and less than 5 mm. And it is preferable to set the magnitude
  • the front side gap 27 is formed between the substrate 7 disposed on the transport plate 12 and the first current plate 5, and the back surface between the back surface of the transport plate 12 and the front surface of the stage 15.
  • the side gap 26 is formed, and the volume of the front side gap 27 and the area of the upper through hole 13 (the upper through hole 13 are set to make the pressure change rate on the front side and the back side of the object 10 to be the same.
  • the product of the sum of the areas of the upper through holes 13, the volume of the back surface side gap 26, and the area of the lower through holes 23 (a plurality of lower through holes 23 are provided) If it is equal to the product of the area of each lower through hole 23 and the product of the area of through hole 31 on the stage, the surface side gap 27 when introducing the pressure gas is equalized.
  • the pressure change rate of the back surface side gap 26 becomes equal, and the surface at the time of vacuum exhaustion
  • the pressure change rates of the side gap 27 and the back surface side gap 26 become equal, and the substrate 7 is prevented from floating and the like.
  • the width in the vertical direction of the on-stage through hole 31 is increased, and decreased when it is lowered.
  • the first and second rectifying plates 5 and 6 are lowered to be a stage
  • the pressure raising speed of the front side gap 27 is made larger than that of the back side gap 26.

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Abstract

Provided is a vacuum device capable of changing a vacuum atmosphere to an atmospheric-pressure atmosphere in a short time without breaking a substrate. A first straightening plate 5 is disposed between a subject 10 to be processed, and a supply/exhaust port 9 so that a pressure increasing gas blowing from the supply/exhaust port 9 does not collide with the subject 10. A second straightening plate 6 is provided between the subject 10 and a wall surface of a cover member 16, and the pressure increasing gas is introduced between the first straightening plate 5, and a substrate 7 in the subject 10, and between the substrate 7 and a stage 15 from an upper through hole 13 at a position higher than the substrate 7, and a lower through hole 23 at a position lower than the substrate 7 so that the substrate 7 is prevented from floating.

Description

真空装置Vacuum device
 本発明は、真空雰囲気を用いる真空装置に関し、特に、基板の割れや脱落が発生せずに真空雰囲気から大気圧雰囲気に短時間で変化させることができる真空装置に関する。 The present invention relates to a vacuum apparatus using a vacuum atmosphere, and more particularly to a vacuum apparatus that can be changed from a vacuum atmosphere to an atmospheric pressure atmosphere in a short time without cracking or dropping of a substrate.
 大気中と真空雰囲気中の間で基板を移動させるために基板搬出入室が用いられており、基板を大気雰囲気の基板搬出入室に配置し、基板搬出入室を真空排気して基板の周囲を真空雰囲気にし、真空雰囲気にされた真空処理室と基板が配置された基板搬出入室を接続する。また、基板を真空雰囲気に置かれた基板搬出入室に配置し、真空雰囲気中に窒素ガスや大気を導入して基板搬出入室を大気圧にして、基板搬出入室と大気雰囲気とを接続して基板を大気雰囲気に取り出すことが行われている。 A substrate loading and unloading chamber is used to move a substrate between the atmosphere and a vacuum atmosphere, the substrate is disposed in the substrate loading and unloading chamber in the air atmosphere, and the substrate loading and unloading chamber is evacuated to evacuate the periphery of the substrate. A vacuum processing chamber in a vacuum atmosphere is connected to a substrate transfer chamber in which a substrate is placed. In addition, the substrate is placed in a substrate loading and unloading chamber placed in a vacuum atmosphere, nitrogen gas and air are introduced into the vacuum atmosphere to make the substrate loading and unloading chamber at atmospheric pressure, and the substrate loading and unloading chamber and the air atmosphere are connected. Is taken out to the atmosphere.
 図8は従来技術の基板搬出入室102であり、基板搬出入室の102底面を構成するステージ115と、ステージ115にかぶせられた容器状の蓋部材116とを有している。 FIG. 8 shows a substrate loading / unloading chamber 102 according to the prior art, which has a stage 115 constituting the bottom surface of the substrate loading / unloading chamber, and a container-like lid member 116 covered on the stage 115.
 ステージ115には、突条又は突起から成る支持部材128が設けられており、支持部材128上には搬送プレート112が分離可能に乗せられている。ステージ115と搬送プレート112の間には隙間105が形成されている。 The stage 115 is provided with a support member 128 formed of a protrusion or a protrusion, and the carrier plate 112 is detachably mounted on the support member 128. A gap 105 is formed between the stage 115 and the carrier plate 112.
 搬送プレート112には、一枚又は複数枚の基板107が配置されている。
 蓋部材116には給排気口109が設けられている。給排気口109には、真空排気装置124とガス供給装置125とが接続されている。
 給排気口109と搬送プレート112上の基板107の間には、整流板106が設けられている。
One or more substrates 107 are disposed on the transport plate 112.
The lid member 116 is provided with an air supply and exhaust port 109. An evacuation device 124 and a gas supply device 125 are connected to the air supply and exhaust port 109.
A rectifying plate 106 is provided between the air supply and exhaust port 109 and the substrate 107 on the carrier plate 112.
 真空雰囲気にされた基板搬出入室102の内部空間118を大気圧雰囲気に変更する場合にはガス供給装置125を動作させ、給排気口109から内部空間118に空気等の昇圧用ガスを供給する。 In order to change the internal space 118 of the substrate transfer in / out chamber 102 that has been vacuum atmosphere to the atmospheric pressure atmosphere, the gas supply device 125 is operated to supply a pressurizing gas such as air to the internal space 118 from the air supply / discharge port 109.
 内部空間118に供給された昇圧用ガスは、整流板106に衝突して横方向に流れ、整流板106と蓋部材116の壁面との間を通過して基板107の表面に到達し、内部空間118が昇圧する。
 このとき、導入した昇圧用ガスは基板107に衝突しないのに、基板107周辺の昇圧用ガスの流速が大きすぎ、かつ基板107が薄いと破損する場合がある。
The pressurizing gas supplied to the internal space 118 collides with the current plate 106 and flows laterally, passes between the current plate 106 and the wall surface of the lid member 116 to reach the surface of the substrate 107, and then enters the internal space 118 is boosted.
At this time, although the introduced pressurizing gas does not collide with the substrate 107, the flow rate of the pressurizing gas around the substrate 107 may be too high, and the substrate 107 may be damaged if it is thin.
 また、導入した昇圧用ガスは搬送プレート112の周囲の隙間105を通過して、基板107の裏面側の空間に流入するから、基板107の下で昇圧用ガスの強い渦巻が形成されると基板107が浮き上がる。そして基板107が搬送プレート112の枠上などに落下すると破損する場合がある。 Further, the introduced pressurizing gas passes through the gap 105 around the carrier plate 112 and flows into the space on the back surface side of the substrate 107, so that a strong swirl of the pressurizing gas is formed under the substrate 107. 107 lifts up. When the substrate 107 falls onto the frame of the transfer plate 112 or the like, it may be damaged.
 大気雰囲気になっている内部空間118を真空排気するときも、内部空間118に充満する大気の流れによって基板107が舞い上がって破損する場合がある。
 従って、基板107の破損を防止するためには、昇圧用ガスの供給速度や真空排気速度を低下させることが考えられる。
Even when evacuating the internal space 118 in the atmosphere, the substrate 107 may be broken up and broken by the flow of the air filling the internal space 118.
Therefore, in order to prevent the damage of the substrate 107, it is conceivable to reduce the supply rate of the pressure-boosting gas and the evacuation rate.
 しかしながら、基板搬出入に要する時間の短縮化がますます求められているのに対し、昇圧用ガスの供給速度や真空排気速度を低下させると処理時間が長くなる。そこで、基板搬出入に要する時間を長くせずに基板の破損を防止できる技術が求められている。 However, while it is increasingly required to shorten the time taken to carry out the substrate, the processing time becomes longer when the supply speed of the pressure-boosting gas and the evacuation speed are reduced. Therefore, there is a need for a technology that can prevent damage to a substrate without increasing the time required to carry the substrate in and out.
WO2017/146204WO 2017/146204
 本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、真空雰囲気から大気圧雰囲気に短時間で変更できる技術を提供することにある。 The present invention was created to solve the above-mentioned disadvantages of the prior art, and its object is to provide a technique capable of changing from a vacuum atmosphere to an atmospheric pressure atmosphere in a short time.
 上記課題を解決するために本発明は、真空槽と、前記真空槽の天井に設けられた挿入孔と、前記挿入孔を閉塞させる閉塞位置と前記閉塞位置よりも下方の前記真空槽内の交換位置との間で移動可能にされ、上方に向けられた面に搬送対象物が隙間を開けて配置されるステージと、前記ステージに対して伏せられた向きの容器形形状にされ、前記容器形形状の開口の縁部分と前記挿入孔の外側の前記天井との間が気密にされる蓋部材と、前記蓋部材に形成された給排気用貫通孔と、を有し、前記搬送対象物は、前記ステージ上に配置された搬送プレートと、前記搬送プレート上に配置された基板とを含み、前記挿入孔が前記ステージで閉塞されて形成される前記蓋部材と前記ステージとの間の搬出入空間は、前記蓋部材と前記天井との間が気密にされると大気から分離され、前記搬出入空間は前記給排気用貫通孔の前記搬出入空間に設けられた開口である給排気口から真空排気され、前記搬出入空間には前記給排気口から昇圧用気体が供給される真空装置であって、前記ステージと前記給排気口との間には長方形又は正方形である第一の整流板が配置され、前記搬送対象物は前記第一の整流板と前記ステージとの間に配置され、前記蓋部材は四角筒形形状に配置された四壁面を有し、前記第一の整流板は、前記四壁面のうち互いに平行な二壁面と接触し、他の平行な二壁面と離間して配置されており、前記二壁面と離間した前記第一の整流板の部分に長方形又は正方形である第二の整流板が、前記第二の整流板が離間された前記二壁面と対面して配置され、前記第二の整流板には、前記壁面と対面する面と、その裏面との間で貫通して前記昇圧用気体が通過する貫通孔が設けられた真空装置である。
 本発明は、前記搬送プレートの前記第一の整流板に面した表面には、窪みが形成された真空装置である。
 本発明は、前記貫通孔には、前記搬送プレート上に配置された前記基板の表面と前記第一の整流板の下方に向く面との間の高さに配置された上側貫通孔と、前記ステージ上に配置された前記搬送対象物の裏面の高さと前記ステージの表面の高さとの間の高さに配置された下側貫通孔とが含まれる真空装置である。
 本発明は、前記基板と前記第一の整流板との間には表面側隙間が形成され、前記搬送プレートの裏面と前記ステージの表面との間には裏面側隙間が形成され、前記表面側隙間の体積と前記上側貫通孔の面積との積の値と、前記裏面側隙間の体積と前記下側貫通孔の面積との積の値とが等しくされた真空装置である。
 本発明は、前記第二の整流板と前記第二の整流板と対面する前記壁面との間の距離は、前記上側貫通孔の鉛直方向の幅よりも大きくされ、且つ、前記下側貫通孔の鉛直方向の幅よりも大きくされた真空装置である。
 本発明は、前記貫通孔には、前記搬送プレート上に配置された前記基板の表面と前記第一の整流板の下方に向く面との間の高さに配置された上側貫通孔と、前記ステージと前記第二の整流板の下端との間に設けられた隙間であるステージ上貫通孔とが含まれ、前記ステージ上貫通孔は、前記ステージ上に配置された前記搬送プレートの裏面よりも低い高さに配置された真空装置である。
 本発明は、前記基板と前記第一の整流板との間には表面側隙間が形成され、前記搬送プレートの裏面と前記ステージの表面との間には裏面側隙間が形成され、前記表面側隙間の体積と前記上側貫通孔の面積との積の値と、前記裏面側隙間の体積と前記ステージ上貫通孔の面積との積の値とが等しくされた真空装置である。
 本発明は、前記第一の整流板と前記第二の整流板とを前記蓋部材に対して上昇と下降とをさせる昇降装置が設けられた真空装置である。
 本発明は、前記第二の整流板と、前記第二の整流板と対面する前記壁面との間の距離は、前記上側貫通孔の鉛直方向の幅よりも大きくされ、且つ、前記ステージ上貫通孔の鉛直方向の幅よりも大きくされた真空装置である。
 本発明は、複数の前記給排気口が設けられた真空装置である。
 本発明は、前記給排気口には、メッシュ状の整流部材が設けられた真空装置である。
 本発明は、前記基板は前記真空槽の内部で真空処理される真空装置である。
In order to solve the above problems, the present invention relates to a vacuum chamber, an insertion hole provided on a ceiling of the vacuum chamber, a closing position for closing the insertion hole, and replacement of the inside of the vacuum chamber below the closing position. A stage on which the object to be conveyed is disposed with a gap in an upwardly directed surface, and a container-shaped configuration facing downward with respect to said stage, said container-shaped being movable between positions A lid member which is hermetically sealed between an edge portion of the opening of the shape and the ceiling outside the insertion hole, and an air supply / exhaust through hole formed in the lid member; A transport plate disposed on the stage, and a substrate disposed on the transport plate, wherein the insertion hole is closed by the stage and carried out between the lid member and the stage. The space is airtight between the lid member and the ceiling When it is removed, it is separated from the atmosphere, and the carry-in / out space is evacuated from the air supply / discharge port which is an opening provided in the carry-in / out space of the air supply / discharge through hole. A vacuum apparatus to which a pressure-boosting gas is supplied, wherein a rectangular or square first flow straightening plate is disposed between the stage and the air supply and discharge port, and the object to be transferred is the first flow straightening plate And the stage, the lid member has four wall surfaces arranged in a square cylindrical shape, and the first straightening vane contacts two wall surfaces parallel to one another among the four wall surfaces, A second straightening plate spaced apart from the other parallel two wall surfaces and being rectangular or square in the portion of the first straightening plate spaced apart from the two wall surfaces, the second straightening plate is spaced apart And the second current plate is disposed in front of the second current plate. The surface facing the wall surface, a vacuum device through hole through which the boost gas passes through is provided between the rear surface.
The present invention is a vacuum device in which a recess is formed on the surface of the transfer plate facing the first straightening vane.
In the present invention, in the through hole, an upper through hole disposed at a height between the surface of the substrate disposed on the transfer plate and a surface facing downward of the first rectifying plate, and The vacuum device may include a lower through hole disposed at a height between the height of the back surface of the object to be transferred disposed on the stage and the height of the surface of the stage.
In the present invention, a surface side gap is formed between the substrate and the first current plate, and a back surface side gap is formed between the back surface of the transfer plate and the surface of the stage, It is a vacuum device in which the value of the product of the volume of the gap and the area of the upper through hole and the value of the product of the volume of the back surface side gap and the area of the lower through hole are equal.
In the present invention, the distance between the second straightening vane and the wall facing the second straightening vane is greater than the width in the vertical direction of the upper through hole, and the lower through hole Is a vacuum device that is larger than the vertical width of the
In the present invention, in the through hole, an upper through hole disposed at a height between the surface of the substrate disposed on the transfer plate and a surface facing downward of the first rectifying plate, and A through hole on the stage, which is a gap provided between the stage and the lower end of the second current plate, is included, and the through hole on the stage is closer to the rear surface of the carrier plate disposed on the stage It is a vacuum device placed at a low height.
In the present invention, a surface side gap is formed between the substrate and the first current plate, and a back surface side gap is formed between the back surface of the transfer plate and the surface of the stage, It is a vacuum device in which the value of the product of the volume of the gap and the area of the upper through hole, and the value of the product of the volume of the back surface side gap and the area of the on-stage through hole are equal.
The present invention is a vacuum device provided with a lifting device that raises and lowers the first flow straightening plate and the second flow straightening plate with respect to the lid member.
In the present invention, the distance between the second straightening vane and the wall surface facing the second straightening vane is greater than the width in the vertical direction of the upper through hole, and the penetration on the stage is achieved. It is a vacuum device that is larger than the vertical width of the hole.
The present invention is a vacuum apparatus provided with a plurality of the air supply and exhaust ports.
The present invention is the vacuum device in which a mesh-like flow straightening member is provided at the air supply and discharge port.
The present invention is a vacuum apparatus in which the substrate is vacuum processed inside the vacuum chamber.
 短時間で真空雰囲気から大気圧雰囲気に変更しても、基板が破壊されたり浮き上がったりすることがない。 Even if the vacuum atmosphere is changed to the atmospheric pressure atmosphere in a short time, the substrate is not broken or lifted up.
第一の整流板の短辺に第二の整流板が設けられた真空装置の第二の整流板の断面を示す方向から見た図A view seen from the direction showing the cross section of the second straightening vane of the vacuum device in which the second straightening vane is provided on the short side of the first straightening vane その真空装置の第一の整流板が壁面に接触した状態で図1とは垂直な方向から見た図(第二の整流板は省略)The view from the direction perpendicular to FIG. 1 with the first straightening vane of the vacuum device in contact with the wall surface (the second straightening vane is omitted) その真空装置のステージが交換位置で静止したときの状態を説明するための図Diagram for explaining the state when the stage of the vacuum device is stopped at the exchange position (a):下端にシール部材が設けられた第二の整流板の正面図  (b)その正面図と垂直な方向の断面図  (c):下端にステージ上貫通孔が設けられた第二の整流板の正面図  (d)その正面図と垂直な方向の断面図(a): A front view of the second straightening vane provided with a seal member at its lower end (b) A cross-sectional view in the direction perpendicular to the front view (c): A second on the lower end with a through hole on the stage Front view of current plate (d) Cross-sectional view in the direction perpendicular to the front view 第一、第二の整流板と、搬送対象物と、ステージとの相対位置を示す分解組立図An exploded view showing the relative positions of the first and second baffles, the object to be transported, and the stage 第一の整流板の長辺に第二の整流板が設けられた真空装置の第一の整流板が壁面に接触した状態を示す図(第二の整流板は省略)The figure which shows the state which the 1st straightening vane of the vacuum apparatus with which the 2nd straightening vane was provided in the long side of the 1st straightening vane contacted the wall surface (the 2nd straightening vane is omitted) その真空装置の第二の整流板の断面を示す方向から見た図A view from the direction showing the cross section of the second straightening vane of the vacuum device 従来技術の基板搬出入室Prior art substrate loading and unloading chamber
 図1~図3は後述する長方形の第一の整流板5の短辺に第二の整流板6が設けられた本発明の第一例の真空装置3aであり、図6、7は、第一の整流板5の長辺に第二の整流板6が設けられた本発明の第二例の真空装置3bである。図1と図2は、第一例の真空装置3aを異なる方向で切断したときの断面図であり、同様に、図6と図7も、第二例の真空装置3bを異なる方向で切断したときの断面図である。第一例の真空装置3aと第二例の真空装置3bの説明では、同じ目的と機能を有する部材には、同じ名称、同じ符号を付して説明する。 1 to 3 show a vacuum apparatus 3a according to a first example of the present invention in which a second rectifying plate 6 is provided on the short side of a rectangular first rectifying plate 5 described later, and FIGS. It is the vacuum apparatus 3b of the 2nd example of this invention by which the 2nd flow straightening plate 6 was provided in the long side of the flow straightening plate 5 of 1 one. 1 and 2 are cross-sectional views when the vacuum device 3a of the first example is cut in different directions, and similarly, in FIGS. 6 and 7, the vacuum device 3b of the second example is cut in different directions. FIG. In description of the vacuum apparatus 3a of a 1st example, and the vacuum apparatus 3b of a 2nd example, the same name and the same code | symbol are attached | subjected and demonstrated to the member which has the same objective and function.
 第一、第二例の真空装置3a、3bは、基板搬出入室2と真空処理室4とをそれぞれ有している。 
 真空処理室4は、真空槽14と、真空槽14の内部に配置されたステージ15とを有しており、真空槽14の天井には貫通孔から成る挿入孔が設けられている。
 図3は後述するように、ステージ15を真空槽14の内部の交換位置で静止させた状態を示しており、同図の符号11は挿入孔である。
The vacuum apparatuses 3 a and 3 b of the first and second examples respectively have a substrate loading and unloading chamber 2 and a vacuum processing chamber 4.
The vacuum processing chamber 4 has a vacuum chamber 14 and a stage 15 disposed inside the vacuum chamber 14, and a ceiling of the vacuum chamber 14 is provided with an insertion hole formed of a through hole.
FIG. 3 shows a state in which the stage 15 is stopped at the exchange position inside the vacuum chamber 14 as described later, and the reference numeral 11 in the same figure is an insertion hole.
 基板搬出入室2は蓋部材16を有している。蓋部材16は伏せられた向きの容器形形状にされており、蓋部材16は、容器形形状の容器開口39の縁部分18が真空槽14に接触されて、挿入孔11の上に設けられている。 The substrate loading / unloading chamber 2 has a lid member 16. The lid member 16 is in the shape of a container facing downward, and the lid member 16 is provided on the insertion hole 11 with the edge portion 18 of the container opening 39 in contact with the vacuum chamber 14. ing.
 図1~図3、図6、図7の状態では蓋部材16の縁部分18と真空槽14の天井との間は気密にされており、蓋部材16とステージ15との間に形成された搬出入空間8には大気が侵入しないようにされている。 In the state of FIGS. 1 to 3, 6 and 7, the space between the edge portion 18 of the lid member 16 and the ceiling of the vacuum chamber 14 is airtight and is formed between the lid member 16 and the stage 15 Air is prevented from entering the transfer space 8.
 挿入孔11がステージ15によって閉塞されているときのステージ15の位置を閉塞位置と言うものとすると、図1、図2、図6、図7ではステージ15は閉塞位置に静止されており、挿入孔11は、ステージ15によって閉塞され、真空槽14の内部空間と、搬出入空間8とが分離され、搬出入空間8が大気雰囲気にされても、真空槽14の内部空間を真空雰囲気に維持できるようになっている。 Assuming that the position of the stage 15 when the insertion hole 11 is closed by the stage 15 is referred to as a closed position, the stage 15 is stopped at the closed position in FIGS. The hole 11 is closed by the stage 15 to separate the internal space of the vacuum chamber 14 from the transfer space 8 and maintain the internal space of the vacuum chamber 14 in a vacuum atmosphere even if the transfer space 8 is in the air atmosphere. It can be done.
 ステージ15上には、突条又は突起から成る複数の支持部材28が設けられており、支持部材28上には搬送対象物10が支持部材28と分離できるように乗せられている。 On the stage 15, a plurality of support members 28 composed of protrusions or protrusions are provided, and the object 10 to be conveyed is placed on the support member 28 so as to be separated from the support member 28.
 搬送対象物10は、搬送プレート12と、搬送プレート12に配置された一枚乃至複数枚の基板7とを有している。搬送プレート12の裏面とステージ15の表面とは離間しており、搬送プレート12の裏面側には、搬送プレート12の裏面とステージ15の表面との間の空間である裏面側隙間26が形成されている。 The object to be transported 10 has a transport plate 12 and one or more substrates 7 disposed on the transport plate 12. The back surface of the transfer plate 12 and the surface of the stage 15 are separated, and a back surface side gap 26 which is a space between the back surface of the transfer plate 12 and the surface of the stage 15 is formed on the back surface side of the transfer plate 12 ing.
 蓋部材16の壁には貫通孔である給排気用貫通孔21が設けられている。この給排気用貫通孔21は、真空槽14の外部に配置された配管22に接続され、真空槽14の外部に配置された真空排気装置24とガス供給装置25とは配管22によってそれぞれ搬出入空間8に接続されている。 The wall of the lid member 16 is provided with an air supply and exhaust through hole 21 which is a through hole. The air supply / exhaust through hole 21 is connected to a pipe 22 disposed outside the vacuum chamber 14, and the vacuum evacuation device 24 and the gas supply device 25 disposed outside the vacuum chamber 14 are carried out by the pipe 22 respectively. It is connected to the space 8.
 蓋部材16の搬出入空間8に露出する面には、給排気用貫通孔21の一端である給排気口9が設けられており、給排気口9から気体の給排気が行われる。 An air supply and exhaust port 9 which is one end of the air supply and exhaust through hole 21 is provided on the surface of the lid member 16 exposed to the carry in and out space 8, and gas supply and exhaust are performed from the air supply and exhaust port 9.
 真空装置3a、3bには制御装置19が設けられており、真空排気装置24と、ガス供給装置25と、後述する昇降装置37とは、制御装置19に接続され、制御装置19によって制御されている。真空排気装置24と、ガス供給装置25と、昇降装置37とは、制御装置19の動作によって以下に説明するように動作する。 The vacuum devices 3a and 3b are provided with a control device 19, and the vacuum evacuation device 24, the gas supply device 25, and a lift device 37 described later are connected to the control device 19 and controlled by the control device 19. There is. The evacuation unit 24, the gas supply unit 25, and the lifting unit 37 operate as described below according to the operation of the control unit 19.
 真空雰囲気にされた基板搬出入室2の搬出入空間8を大気圧雰囲気に変更する場合は、ガス供給装置25から給排気用貫通孔21に空気や窒素ガス等の昇圧ガスが供給される。 When the transfer space 8 of the substrate transfer in / out chamber 2 which has been made into a vacuum atmosphere is changed to the atmospheric pressure atmosphere, pressurized gas such as air or nitrogen gas is supplied from the gas supply device 25 to the air supply / discharge through hole 21.
 供給された昇圧ガスは、給排気用貫通孔21を通過して給排気口9から搬出入空間8に吹き出され、搬出入空間8が昇圧される。このとき、真空排気装置24による搬出入空間8の真空排気は停止されている。 The supplied pressurized gas passes through the air supply / discharge through hole 21 and is blown out from the air supply / discharge port 9 to the carry-in / out space 8, and the carry-in / out space 8 is pressurized. At this time, the evacuation of the transfer space 8 by the evacuation device 24 is stopped.
 他方、搬出入空間8を大気圧雰囲気から真空雰囲気に変更する場合は、真空排気装置24によって搬出入空間8に充満する空気などの気体を給排気口9から真空排気する。このとき、ガス供給装置25からは昇圧用ガスを供給しない。 On the other hand, when the transfer space 8 is changed from the atmospheric pressure atmosphere to the vacuum atmosphere, the vacuum exhaust device 24 evacuates the gas such as air filled in the transfer space 8 from the air supply and discharge port 9. At this time, the pressure supply gas is not supplied from the gas supply device 25.
 給排気口9はステージ15が位置する方向に向けられており、給排気口9と搬送プレート12との間には第一の整流板5が配置され、搬送プレート12に配置された基板7は第一の整流板5と離間して対面するようにされている。この例では、一端が蓋部材16に固定され、他端が第一の整流板5に固定された吊下部材33によって第一の整流板5が蓋部材16から吊り下げられている。 The air supply and exhaust port 9 is directed in the direction in which the stage 15 is positioned, the first current plate 5 is disposed between the air supply and exhaust port 9 and the transport plate 12, and the substrate 7 disposed on the transport plate 12 is The first current plate 5 is arranged to face the first current plate 5 at a distance. In this example, the first flow control plate 5 is suspended from the cover member 16 by a suspension member 33 whose one end is fixed to the cover member 16 and the other end is fixed to the first flow control plate 5.
 給排気口9から昇圧用ガスを導入すると、昇圧用ガスは第一の整流板5に吹き付けられる。第一の整流板5には貫通孔は形成されておらず、昇圧用ガスは第一の整流板5を貫通しない。 When the pressurizing gas is introduced from the air supply and exhaust port 9, the pressurizing gas is blown to the first straightening vane 5. A through hole is not formed in the first straightening vane 5, and the pressurizing gas does not penetrate the first straightening vane 5.
 第一の整流板5と搬送プレート12とは正方形又は長方形の四辺形状の薄板であり、搬送プレート12は第一の整流板5よりも小さく、第一の整流板5の四辺よりも内側に配置されている。ここでは第一の整流板5と搬送プレート12とは水平に配置されており、第一の整流板5の六面のうち、表面と裏面以外の四面は線状の細長に形成されている。 The first straightening vane 5 and the conveyance plate 12 are square or rectangular quadrilateral thin plates, and the conveyance plate 12 is smaller than the first straightening vane 5 and disposed inside the four sides of the first straightening vane 5 It is done. Here, the first straightening vane 5 and the conveyance plate 12 are disposed horizontally, and among the six faces of the first straightening vane 5, four faces other than the front and back faces are formed in a linear elongated shape.
 蓋部材16は平面状の壁面を四面有しており、各壁面は鉛直に配置されて四角筒が形成されている。第一の整流板5の細長の四面のうち、互いに平行な二平面を一組の平行面とすると、第一の整流板5は、二組の平行面を有している。 The lid member 16 has four flat wall surfaces, and the wall surfaces are vertically disposed to form a square cylinder. The first straightening vane 5 has two sets of parallel planes, where two planes parallel to one another among the elongated four faces of the first straightening vane 5 are one set of parallel planes.
 その二組の平行面のうち、一組の平行面は蓋部材16の壁面と平行に配置され、それぞれ壁面と接触されており、他の一組の平行面は細長の両端が第一の組の平行面が接触した二壁面と接触し、他の二壁面とは平行に離間して対面配置されている。 Of the two sets of parallel surfaces, one set of parallel surfaces is disposed parallel to the wall surface of lid member 16 and is in contact with the wall surface, and the other set of parallel surfaces is elongated at the first end The two parallel surfaces are in contact with the two wall surfaces in contact with each other, and the other two wall surfaces are disposed facing in parallel, spaced apart from each other.
 蓋部材16の壁面と接触する一組の平行面、又は一組の平行面と接触する蓋部材16の壁面のいずれか一方に摺動可能なゴム部材を設け、第一の整流板5の一組の平行面と、蓋部材16の壁面とが、そのゴム部材を介して接触するようにしてもよい。 A slidable rubber member is provided on any one of a pair of parallel surfaces in contact with the wall surface of the lid member 16 or a wall surface of the lid member 16 in contact with the pair of parallel surfaces; The parallel surfaces of the set and the wall surface of the lid member 16 may be in contact via the rubber member.
 図5は、図1,2の真空装置3aの第一の整流板5と、搬送対象物10と、ステージ15との間の相対的な位置を示す図面であり、第一の整流板5の二組の平行面のうち、長辺を有する組の平行面が蓋部材16の壁面と面接触し、短辺を有する組の平行面が他の壁面と離間して対面配置され、第二の整流板6がそれぞれ取り付けられている。第二例の真空装置3bのように、短辺を有する組の平行面が蓋部材16の壁面とそれぞれ面接触し、長辺を有する組の平行面が二壁面と平行に離間して対面配置されて、第二の整流板6が取り付けられることもできる。 FIG. 5 is a drawing showing the relative positions between the first straightening vane 5 of the vacuum device 3a of FIGS. 1 and 2, the object 10 to be conveyed, and the stage 15. Of the two sets of parallel surfaces, the parallel surface of the set having the long side is in surface contact with the wall surface of the lid member 16 and the parallel surface of the set having the short side is disposed facing away from the other wall surface. The baffles 6 are attached respectively. Like the vacuum device 3b of the second example, the parallel surfaces of the set having the short sides are in surface contact with the wall surface of the lid member 16, and the parallel surfaces of the set having the long sides are spaced apart in parallel to the two wall surfaces. Then, the second straightening vane 6 can be attached.
 第二の整流板6は正方形又は長方形の四辺形状の薄板であり、第二の整流板6の六面のうち、二面の面積が広く、他の四面は線状の細長に形成されている。第二の整流板6は面積の広い二面が鉛直にされ、蓋部材16の一壁面とそれぞれ離間して対面する二側面にされており、二側面は搬送プレート12の側方にそれぞれ搬送プレート12から離間して位置するように配置されている。 The second straightening vane 6 is a square or rectangular quadrilateral thin plate, and among the six faces of the second straightening vane 6, the area of the two faces is large and the other four faces are formed in a linear elongated shape . The second straightening plate 6 has two wide side faces vertically and is formed on two side faces respectively facing the wall surface of the lid member 16 so as to face each other. It is arranged to be spaced apart from 12.
 第二の整流板6の細長の四面のうち、二面は鉛直であって第一の整流板5の二面と一緒にそれぞれ同じ壁面に接触され、他の細長の二面は水平であってその一方の面は第一の整流板5と接触して取りつけられ、他の面はステージ15と離間して対面されている。 Of the elongated four sides of the second straightening vane 6, the two sides are vertical and are in contact with the same wall together with the two sides of the first straightening vane 5, and the other elongated two sides are horizontal One of the surfaces is mounted in contact with the first current plate 5, and the other surface faces the stage 15 at a distance.
 ここでは、薄板の第二の整流板6の上端には、薄板の取付板が第二の整流板6に垂直に固定され、取付板が第二の整流板6の上に乗せられて、第二の整流板6が第一の整流板5から落下しないようにされている。 In this case, a thin plate mounting plate is vertically fixed to the second straightening vane 6 at the upper end of the thin plate second straightening vane 6, and the mounting plate is placed on the second straightening vane 6, The second current plate 6 is prevented from falling from the first current plate 5.
 一枚の第二の整流板6の面積の広い二側面のうち、一側面は蓋部材16の一壁面と離間して配置され、他の側面は搬送対象物10と離間して配置されており、二側面の両端は蓋部材16の壁面に接触され、第二の整流板6とその第二の整流板6が対面する蓋部材16の壁面との間でバッファ空間17が形成されている。
 第二の整流板6の上端は第一の整流板5に密着されており、第一の整流板5と第二の整流板6との間には隙間は形成されないようにされている。
Of the two wide side surfaces of the second straightening vane 6 of one sheet, one side surface is disposed to be separated from one wall surface of the lid member 16 and the other side surface is disposed to be separated from the transport object 10 The two ends of the two side surfaces are in contact with the wall surface of the lid member 16, and a buffer space 17 is formed between the second current plate 6 and the wall surface of the lid member 16 facing the second current plate 6.
The upper end of the second straightening vane 6 is in close contact with the first straightening vane 5 so that no gap is formed between the first straightening vane 5 and the second straightening vane 6.
 蓋部材16には昇降装置20が設けられており、吊下部材33の上端は蓋部材16の外部に気密に導出され、昇降装置20に取り付けられている。昇降装置20が動作すると、吊下部材33が上方又は下方に移動し、吊下部材33の移動に伴って第一の整流板5と第二の整流板6とが、第一の整流板5の一組の平行面が壁部材16の壁面と接触しながら上下に移動する。 A lifting device 20 is provided on the lid member 16, and the upper end of the hanging member 33 is airtightly drawn out of the lid member 16 and attached to the lifting device 20. When the lifting device 20 operates, the suspension member 33 moves upward or downward, and the first current plate 5 and the second current plate 6 move together with the first current plate 5 as the suspension member 33 moves. A set of parallel surfaces move up and down while in contact with the wall surface of the wall member 16.
 図4(a)は第二の整流板6の、蓋部材16の壁面と離間して対面する側面を示しており、同図(b)は、その側面と垂直な鉛直方向で切断した、第一の整流板5と処理対象物10とステージ15との断面図である。 FIG. 4 (a) shows the side face of the second straightening vane 6 facing away from and facing the wall surface of the lid member 16, and FIG. 4 (b) is a vertical cross-sectional view of the side face FIG. 2 is a cross-sectional view of one straightening vane 5, a processing target 10, and a stage 15.
 同図(a)を参照し、第二の整流板6には、第二の整流板6を厚み方向に貫通する上側貫通孔13と下側貫通孔23とがそれぞれ一個又は複数個ずつ設けられており、第二の整流板6の側面のうち、搬送プレート12と対面する側面と蓋部材16と対面する側面とには、上側貫通孔13の開口と下側貫通孔23の開口とがそれぞれ形成されている。 Referring to FIG. 6A, the second straightening vane 6 is provided with an upper through hole 13 and a lower through hole 23 penetrating the second straightening vane 6 in the thickness direction, respectively. Of the side surfaces of the second straightening vane 6, the opening of the upper through hole 13 and the opening of the lower through hole 23 are respectively provided on the side facing the transport plate 12 and the side facing the lid member 16 It is formed.
 上側貫通孔13は、搬送プレート12に配置された基板7の表面又は搬送プレート12の縁部分の高い方よりも高く、且つ、第一の整流板5の裏面よりも低い位置に設けられており、また、下側貫通孔23は、搬送プレート12の裏面よりも低く、ステージ15の表面よりも高い位置に設けられている。 The upper through holes 13 are provided at a position higher than the higher side of the surface of the substrate 7 or the edge portion of the transfer plate 12 disposed in the transfer plate 12 and lower than the back surface of the first current plate 5. Also, the lower through hole 23 is provided at a position lower than the back surface of the carrier plate 12 and higher than the surface of the stage 15.
 搬送対象物10と第一の整流板5とは離間され、従って、基板7の表面と、基板7の周囲で露出された搬送プレート12の表面とは第一の整流板5から離間されている。
 第二の整流板6の下端とステージ15の表面との間には、シール部材29が配置されている。
The object to be transported 10 and the first current plate 5 are separated, and thus the surface of the substrate 7 and the surface of the transfer plate 12 exposed around the substrate 7 are separated from the first current plate 5 .
A seal member 29 is disposed between the lower end of the second current plate 6 and the surface of the stage 15.
 シール部材29は、第二の整流板6の下端とステージ15の表面の両方に接触し、第二の整流板6の下端によって押圧されて、第二の整流板6の下端とステージ15の表面の両方に密着し、第二の整流板6の下端とステージ15の表面との間に気体を通さないようにされている。シール部材29は例えばOリングのようなゴム状変形部材を用いることができる。 The sealing member 29 is in contact with both the lower end of the second straightening vane 6 and the surface of the stage 15 and is pressed by the lower end of the second straightening vane 6 to lower the lower end of the second straightening vane 6 and the surface of the stage 15 Of the second straightening vane 6 and the surface of the stage 15 so as not to pass gas. The seal member 29 can use a rubber-like deformation member such as an O-ring, for example.
 搬送プレート12上に配置された基板7と第一の整流板5との間に形成された空間を表面側隙間27と呼ぶと、バッファ空間17と表面側隙間27とは上側貫通孔13によって接続されており、バッファ空間17と上述の裏面側隙間26とは下側貫通孔23によって接続されている。 Assuming that a space formed between the substrate 7 disposed on the transport plate 12 and the first current plate 5 is referred to as a front side gap 27, the buffer space 17 and the front side gap 27 are connected by the upper through holes 13. The buffer space 17 and the back side gap 26 described above are connected by the lower through hole 23.
 シール部材29は、移動しないように、ステージ15の表面に形成した溝30の底面上に配置することができる。この場合、溝30の開口の幅をシール部材29の幅程度の大きさにし、溝30の底面の幅を溝30の開口の幅よりも大きくしておくと、シール部材29が溝30の外部に飛び出してしまうことがなくなる。 The sealing member 29 can be disposed on the bottom of the groove 30 formed on the surface of the stage 15 so as not to move. In this case, if the width of the opening of the groove 30 is made about the width of the sealing member 29 and the width of the bottom of the groove 30 is made larger than the width of the opening of the groove 30, the sealing member 29 is outside the groove 30. There is no risk of popping into
 図4(c)、(d)は、シール部材29が設けられていない例であり、この例では、第二の整流板6の下端はステージ15の表面から離間しており、第二の整流板6とステージ15との間に、ステージ上貫通孔31が形成されており、下側貫通孔23は形成されていない。従って、バッファ空間17と上述の裏面側隙間26とはステージ上貫通孔31によって接続されている。ステージ上貫通孔31は、搬送プレート12の裏面よりも低く、ステージ15の表面よりも高い位置に形成される点で、下側貫通孔23と同じである。 FIGS. 4C and 4D show an example in which the sealing member 29 is not provided. In this example, the lower end of the second straightening vane 6 is separated from the surface of the stage 15, and the second straightening The on-stage through hole 31 is formed between the plate 6 and the stage 15, and the lower through hole 23 is not formed. Therefore, the buffer space 17 and the above-mentioned back surface side gap 26 are connected by the on-stage through hole 31. The on-stage through hole 31 is the same as the lower through hole 23 in that it is formed at a position lower than the back surface of the transfer plate 12 and higher than the surface of the stage 15.
 次に、気体の流れについて説明する。
 搬出入空間8が真空雰囲気から大気圧雰囲気に変更される場合には、搬出入空間8の真空排気が停止された後、搬出入空間8へ給排気口9から昇圧用ガスが吹き出される。吹き出された昇圧用ガスは第一の整流板5に吹き付けられる。つまり、昇圧用ガスは第一の整流板5に衝突し、衝突した昇圧用ガスは進行方向が曲げられ、第一の整流板5に沿って進行し、蓋部材16の壁面に衝突して進行方向が曲げられ、バッファ空間17の中に流入する。バッファ空間17の中に流入した昇圧用ガスは、ステージ15の表面が位置する方向に向けて第二の整流板6に沿って進行する。
Next, the flow of gas will be described.
When the transfer in / out space 8 is changed from the vacuum atmosphere to the atmospheric pressure atmosphere, the evacuation of the transfer in / out space 8 is stopped, and then the pressure raising gas is blown out from the supply / discharge port 9 to the transfer in / out space 8. The blown-up pressure-boosting gas is blown to the first current plate 5. That is, the pressurizing gas collides with the first straightening vane 5, and the colliding boosting gas is bent in the traveling direction, advances along the first straightening vane 5, collides with the wall surface of the lid member 16 and advances The direction is bent and flows into the buffer space 17. The pressurizing gas flowing into the buffer space 17 travels along the second current plate 6 in the direction in which the surface of the stage 15 is located.
 第二の整流板6に沿って進行する際に、昇圧用ガスは上側貫通孔13を通過してバッファ空間17から表面側隙間27に流入し、下側貫通孔23又はステージ上貫通孔31を通過してバッファ空間17から裏面側隙間26に流入する。 When traveling along the second flow straightening plate 6, the pressurizing gas passes through the upper through hole 13 and flows from the buffer space 17 into the surface side gap 27, and the lower through hole 23 or the upper stage through hole 31 It passes through and flows from the buffer space 17 into the back surface side gap 26.
 搬送プレート12には、プレート開口38が設けられており(図5)、基板7はプレート開口38の上に配置されている。従って、基板7の裏面はプレート開口38の底面で裏面側隙間26に露出されており、裏面側隙間26に流入した昇圧用ガスはプレート開口38を通って基板7の裏面に衝突する。 The transport plate 12 is provided with a plate opening 38 (FIG. 5) and the substrate 7 is arranged above the plate opening 38. Accordingly, the back surface of the substrate 7 is exposed to the back surface side gap 26 at the bottom surface of the plate opening 38, and the pressurizing gas flowing into the back surface side gap 26 collides with the back surface of the substrate 7 through the plate opening 38.
 第一の整流板5によって、基板7と昇圧用ガスとの間に衝突が発生しないようにされているため、基板7の破損や浮き上がりが防止されているが、基板7は搬送プレート12には止められておらず、基板7の裏面に衝突する昇圧用ガスの流速が強すぎたり、裏面側隙間26に昇圧用ガスの渦巻が形成されたりすると、基板7が搬送プレート12から浮き上がり、落下する際に基板7が破損する場合がある。 The first flow straightening plate 5 prevents collision between the substrate 7 and the pressure-boosting gas, thereby preventing breakage or floating of the substrate 7. If the flow rate of the pressurizing gas that collides with the back surface of the substrate 7 is not high and the swirling pressure gas is formed in the back surface side gap 26, the substrate 7 floats up from the transport plate 12 and drops. In some cases, the substrate 7 may be damaged.
 基板7の浮き上がりを防止するために、搬出入空間8に昇圧用ガスを導入する際には、表面側隙間27の昇圧速度と裏面側隙間26の昇圧速度とを一致させ、且つ、搬出入空間8を真空排気する際には、表面側隙間27の減圧速度と裏面側隙間26の減圧速度とを一致させることが好ましい。 In order to prevent the floating of the substrate 7, when introducing the pressurizing gas into the loading and unloading space 8, the boosting speed of the front-side gap 27 and the boosting speed of the back-side gap 26 are made to coincide with each other. When evacuating 8, it is preferable to match the pressure reduction speed of the front surface side gap 27 with the pressure reduction speed of the back surface side gap 26.
 その場合には、表面側隙間27の体積値と上側貫通孔13の面積値との積の値と、裏面側隙間26の体積値と下側貫通孔23の面積値又はステージ上貫通孔31の面積値との積の値とが等しくなるようにすることが好ましい。 In that case, the product of the volume value of the front side gap 27 and the area value of the upper through hole 13, the volume value of the back side gap 26, the area value of the lower through hole 23, or the on-stage through hole 31 It is preferable to make the product value with the area value equal.
 搬出入空間8が真空雰囲気から大気圧雰囲気に変化すると蓋部材16が開けられ、搬送対象物10は支持部材28上を移動して蓋部材16の外部に搬出される。 When the loading / unloading space 8 changes from a vacuum atmosphere to an atmospheric pressure atmosphere, the lid member 16 is opened, and the object 10 to be transported moves on the support member 28 and is carried out of the lid member 16.
 以上は、搬出入空間8を真空雰囲気から大気雰囲気に変化させる場合であったが、真空排気装置24によって大気雰囲気の搬出入空間8を真空排気し、搬出入空間8を真空雰囲気に変化させる場合も、表面側隙間27に充満する空気は上側貫通孔13を通過してバッファ空間17に移動し、真空排気され、裏面側隙間26に充満する空気は下側貫通孔23を通過し、又はステージ上貫通孔31を通過してバッファ空間17に移動し、真空排気される。 The above is the case where the loading and unloading space 8 is changed from the vacuum atmosphere to the atmosphere, but the evacuation device 24 evacuates the loading and unloading space 8 for the atmosphere and the loading and unloading space 8 is changed to the vacuum atmosphere. Also, the air filling the front side gap 27 passes through the upper through hole 13 and moves to the buffer space 17 to be evacuated and the air filling the back side gap 26 passes the lower through hole 23 or the stage It passes through the upper through hole 31 and moves to the buffer space 17 and is evacuated.
 ステージ15には、昇降ロッド36によって昇降装置37に接続されており、昇降装置37によって昇降ロッド36が降下されると、ステージ15は昇降ロッド36と一緒に降下し、ステージ15は挿入孔11の周囲から離間し、挿入孔11の閉塞は解除される。 The stage 15 is connected to the lifting device 37 by a lifting rod 36. When the lifting rod 36 is lowered by the lifting device 37, the stage 15 is lowered together with the lifting rod 36, and the stage 15 is inserted into the insertion hole 11 It separates from the circumference and closure of the insertion hole 11 is released.
 閉塞が解除された状態では蓋部材16の内部空間と真空槽14の内部空間とは、挿入孔11によって接続されている。但し、蓋部材16の容器開口39の縁部分18が真空槽14に接触されて気密にされているので、真空槽14の内部は真空雰囲気が維持される。 The internal space of the lid member 16 and the internal space of the vacuum chamber 14 are connected by the insertion hole 11 in the state where the closure is released. However, since the edge portion 18 of the container opening 39 of the lid member 16 is in contact with the vacuum chamber 14 to be airtight, the inside of the vacuum chamber 14 maintains a vacuum atmosphere.
 図3のステージ15は、真空槽14内部の所定の位置である交換位置で静止されており、交換位置で静止されたステージ15上の搬送対象物10は、搬送装置により、ステージ15上から真空槽14の内部を移動され、真空槽14に設けられた真空処理装置によって真空槽14の内部で真空処理がされる。真空処理装置がスパッタリングターゲットである場合は、スパッタリングによる薄膜形成が真空処理となるが、真空処理は薄膜形成に限定されず、例えば、エッチング処理、アッシング処理、又はイオン注入等の処理が含まれる。 The stage 15 of FIG. 3 is stationary at a replacement position, which is a predetermined position inside the vacuum chamber 14, and the transport object 10 on the stage 15 stationary at the replacement position is vacuumed from above the stage 15 by the transport device. The inside of the vacuum chamber 14 is moved by the inside of the vacuum chamber 14 by the vacuum processing device provided in the vacuum chamber 14. When the vacuum processing apparatus is a sputtering target, thin film formation by sputtering is vacuum processing, but vacuum processing is not limited to thin film formation, and includes, for example, processing such as etching, ashing, or ion implantation.
 上記例では、第二の整流板6は第一の整流板5の短辺又は長辺のいずれか一方に設けられていたが、同一の第一の整流板5の短辺と長辺の両方に合計四枚の第二の整流板6を設けることができる。その場合、各第二の整流板6と蓋部材16の壁面との間にバッファ空間17がそれぞれ形成される。 In the above example, the second straightening vane 6 is provided on either the short side or the long side of the first straightening vane 5, but both the short side and the long side of the same first straightening vane 5 are provided. There can be provided a total of four second baffles 6. In that case, buffer spaces 17 are respectively formed between the second straightening vanes 6 and the wall surface of the lid member 16.
 なお、バッファ空間17を大きくすると、第一、第二の整流板5,6で囲われた空間を昇圧させる時間と減圧させる時間とが増加するが、表面側隙間27と裏面側隙間26とに流入する昇圧用ガスの流れが均一になり、ウェハ割れ等が防止される。 When the buffer space 17 is enlarged, the time for boosting and de-pressurizing the space surrounded by the first and second rectifying plates 5 and 6 is increased. The flow of the inflowing pressurizing gas becomes uniform, and wafer breakage and the like are prevented.
 また、上記例では給排気口9は1個であったが、1個の給排気用貫通孔21に複数の給排気口9を設け、複数の給排気口9から昇圧用ガスが搬出入空間8に導入されるようにしたところ、バッファ空間17の体積を増加させなくてもウェハ割れの発生が減少することが確認されている。これは、搬出入空間8の昇圧用ガスの流れが均一になったことが理由であると考えられる。 In the above example, the number of the air supply and exhaust port 9 was one, but a plurality of air supply and exhaust ports 9 are provided in one air supply and exhaust through hole 21, and the pressure boosting gas is transferred from the plurality of air supply and exhaust ports 9. It was confirmed that the introduction of V.8 reduced the occurrence of wafer breakage without increasing the volume of the buffer space 17. It is considered that this is because the flow of the pressurizing gas in the loading and unloading space 8 has become uniform.
 また、給排気口9と第一の整流板5との間に、メッシュ状の整流部材を配置するとバッファ空間17の体積を増加させなくてもウェハ割れの発生が減少することが確認されており、これも、昇圧用ガスの流れが均一になったことが理由であると考えられる。 In addition, it has been confirmed that the occurrence of wafer breakage is reduced even if the volume of the buffer space 17 is not increased if the mesh-like flow straightening member is disposed between the air supply and exhaust port 9 and the first flow straightening plate 5. This is also considered to be because the flow of the pressurizing gas is uniform.
 ステージ上貫通孔31の幅と上側貫通孔13の幅と下側貫通孔23の幅(貫通孔の幅は高さ方向の孔の距離とする)とは、第二の整流板6と蓋部材16の壁面との間の距離よりも短い大きさにする。例えば、第二の整流板6と蓋部材16の壁面との間の距離が5mmの場合は、ステージ上貫通孔31の幅と上側貫通孔13の幅と下側貫通孔23の幅とをそれぞれ0.5mm以上5mm未満の大きさにする。そして幅の大きさは、第一、第二の整流板5,6で囲われた空間の体積値に応じて設定するのが好ましい。 The width of the on-stage through hole 31 and the width of the upper through hole 13 and the width of the lower through hole 23 (where the width of the through hole is the distance of the holes in the height direction) Make the size smaller than the distance between the 16 walls. For example, when the distance between the second current plate 6 and the wall surface of the lid member 16 is 5 mm, the width of the on-stage through hole 31, the width of the upper through hole 13, and the width of the lower through hole 23 are respectively Make the size 0.5 mm or more and less than 5 mm. And it is preferable to set the magnitude | size of width according to the volume value of the space enclosed by the 1st, 2nd flow regulating plates 5 and 6. FIG.
 第二の整流板6に下側貫通孔23を形成する場合よりも第二の整流板6の下端とステージ15の表面との間の隙間をステージ上貫通孔31として用いる方が、寸法の管理が容易である。 Rather than forming the lower through hole 23 in the second straightening plate 6, using the gap between the lower end of the second straightening plate 6 and the surface of the stage 15 as the on-stage through hole 31 is more dimensional control Is easy.
 上記例では、搬送プレート12上に配置された基板7と第一の整流板5との間には表面側隙間27が形成され、搬送プレート12の裏面とステージ15の表面との間には裏面側隙間26が形成されており、搬送対象物10の表面側と裏面側の圧力の変化速度を同じにするために、表面側隙間27の体積と上側貫通孔13の面積(上側貫通孔13が複数個設けられている場合は各上側貫通孔13の面積の合計値)との積の値と、裏面側隙間26の体積と下側貫通孔23の面積(下側貫通孔23が複数個設けられている場合は、各下側貫通孔23の面積の合計値)との積又はステージ上貫通孔31の面積との積の値とを等しくすると、圧力ガスの導入の際の表面側隙間27と裏面側隙間26との圧力変化速度が等しくなり、また、真空排気の際の表面側隙間27と裏面側隙間26との圧力変化速度が等しくなり、基板7の浮き上がり等が防止される。 In the above example, the front side gap 27 is formed between the substrate 7 disposed on the transport plate 12 and the first current plate 5, and the back surface between the back surface of the transport plate 12 and the front surface of the stage 15. The side gap 26 is formed, and the volume of the front side gap 27 and the area of the upper through hole 13 (the upper through hole 13 are set to make the pressure change rate on the front side and the back side of the object 10 to be the same. When a plurality of holes are provided, the product of the sum of the areas of the upper through holes 13, the volume of the back surface side gap 26, and the area of the lower through holes 23 (a plurality of lower through holes 23 are provided) If it is equal to the product of the area of each lower through hole 23 and the product of the area of through hole 31 on the stage, the surface side gap 27 when introducing the pressure gas is equalized. The pressure change rate of the back surface side gap 26 becomes equal, and the surface at the time of vacuum exhaustion The pressure change rates of the side gap 27 and the back surface side gap 26 become equal, and the substrate 7 is prevented from floating and the like.
 また、昇降装置20によって第一、第二の整流板5,6を上昇させるとステージ上貫通孔31の上下方向の幅が増大し、下降させると減少する。 In addition, when the first and second current plates 5 and 6 are raised by the lifting device 20, the width in the vertical direction of the on-stage through hole 31 is increased, and decreased when it is lowered.
 表面側隙間27の体積値と上側貫通孔13の面積値との積の値と、裏面側隙間26の体積値とステージ上貫通孔31の面積値との積の値とが等しくなる高さに第一、第二の整流板5,6が配置されている状態から、搬出入空間8に昇圧用ガスを導入する際には、第一、第二の整流板5,6を下降させてステージ上貫通孔31の上下方向の幅を狭くしてステージ上貫通孔31の面積を減少させることで裏面側隙間26よりも表面側隙間27の昇圧速度を大きくし、搬送プレート12上の基板7の浮きを防止し、また、搬出入空間8を真空排気する際には、第一、第二の整流板5,6を上昇させてステージ上貫通孔31の上下方向の幅を広くしてステージ上貫通孔31の面積を増大させることで表面側隙間27よりも裏面側隙間26の減圧速度を大きくして搬送プレート12上の基板7の浮きを防止するとよい。 At a height such that the product value of the volume value of the front side gap 27 and the area value of the upper through hole 13 and the product value of the volume value of the back side gap 26 and the area value of the on-stage through hole 31 are equal. When introducing the pressure raising gas into the loading / unloading space 8 from the state where the first and second rectifying plates 5 and 6 are arranged, the first and second rectifying plates 5 and 6 are lowered to be a stage By reducing the width of the upper through holes 31 in the vertical direction to reduce the area of the through holes 31 on the stage, the pressure raising speed of the front side gap 27 is made larger than that of the back side gap 26. In order to prevent floating and to evacuate the loading / unloading space 8, raise the first and second straightening vanes 5 and 6 to widen the width in the vertical direction of the on-stage through hole 31 and on the stage By increasing the area of the through hole 31, the pressure reduction speed of the back surface side gap 26 rather than the front surface side gap 27 It may prevent floating of the substrate 7 on the carrier plate 12 by increasing.
 なお、搬送対象物10の表面に露出する搬送プレート12の表面の部分に窪みが形成されているとその表面上で淀みとなるような渦が発生し、基板7に対する割れ発生の防止又は減少に寄与することが確認されている。 If a depression is formed in the surface portion of the transfer plate 12 exposed to the surface of the transfer object 10, an eddy that becomes stagnant on the surface is generated to prevent or reduce the occurrence of a crack on the substrate 7 It is confirmed that it contributes.
 3a、3b……真空装置
 5……第一の整流板
 6……第二の整流板
 7……基板
 8……搬出入空間
 9……給排気口
10……搬送対象物
11……挿入孔
12……搬送プレート
13……上側貫通孔
14……真空槽
15……ステージ
16……蓋部材
20……昇降装置
23……下側貫通孔
31……ステージ上貫通孔 
3a, 3b ··· Vacuum device 5 ··· First rectifying plate 6 ··· Second rectifying plate 7 · · · Substrate 8 ··· Loading and unloading space 9 ··· Air supply and exhaust port 10 ··· Transport object 11 ··· Insertion hole 12: Transport plate 13: Upper through hole 14: Vacuum tank 15: Stage 16: Lid member 20: Lifting device 23: Lower through hole 31: Upper stage through hole

Claims (12)

  1.  真空槽と、
     前記真空槽の天井に設けられた挿入孔と、
     前記挿入孔を閉塞させる閉塞位置と前記閉塞位置よりも下方の前記真空槽内の交換位置との間で移動可能にされ、上方に向けられた面に搬送対象物が隙間を開けて配置されるステージと、
     前記ステージに対して伏せられた向きの容器形形状にされ、前記容器形形状の開口の縁部分と前記挿入孔の外側の前記天井との間が気密にされる蓋部材と、
     前記蓋部材に形成された給排気用貫通孔と、
     を有し、
     前記搬送対象物は、前記ステージ上に配置された搬送プレートと、前記搬送プレート上に配置された基板とを含み、
     前記挿入孔が前記ステージで閉塞されて形成される前記蓋部材と前記ステージとの間の搬出入空間は、前記蓋部材と前記天井との間が気密にされると大気から分離され、
     前記搬出入空間は前記給排気用貫通孔の前記搬出入空間に設けられた開口である給排気口から真空排気され、前記搬出入空間には前記給排気口から昇圧用気体が供給される真空装置であって、
     前記ステージと前記給排気口との間には長方形又は正方形である第一の整流板が配置され、
     前記搬送対象物は前記第一の整流板と前記ステージとの間に配置され、
     前記蓋部材は四角筒形形状に配置された四壁面を有し、
     前記第一の整流板は、前記四壁面のうち互いに平行な二壁面と接触し、他の平行な二壁面と離間して配置されており、
     前記二壁面と離間した前記第一の整流板の部分に長方形又は正方形である第二の整流板が、前記第二の整流板が離間された前記二壁面と対面して配置され、
     前記第二の整流板には、前記壁面と対面する面と、その裏面との間で貫通して前記昇圧用気体が通過する貫通孔が設けられた真空装置。
    With a vacuum chamber,
    An insertion hole provided on a ceiling of the vacuum chamber;
    It is made movable between a closed position where the insertion hole is closed and a replacement position in the vacuum chamber below the closed position, and the object to be conveyed is disposed with a gap on the surface directed upward. Stage,
    A lid member in the shape of a container facing downward with respect to the stage, the space between the edge portion of the opening of the container shape and the ceiling outside the insertion hole being airtight;
    An air supply and exhaust through hole formed in the lid member;
    Have
    The transfer target includes a transfer plate disposed on the stage, and a substrate disposed on the transfer plate,
    A loading / unloading space between the lid member and the stage, which is formed by closing the insertion hole with the stage, is separated from the atmosphere when the space between the lid member and the ceiling is airtight.
    The transfer space is evacuated from an air supply / discharge port which is an opening provided in the transfer space of the air supply / discharge through hole, and a vacuum is supplied to the transfer space from the air supply / discharge port. A device,
    A rectangular or square first flow straightener is disposed between the stage and the inlet and outlet,
    The transport object is disposed between the first current plate and the stage,
    The lid member has four wall surfaces arranged in a square cylindrical shape,
    The first straightening vane is in contact with two parallel wall surfaces among the four wall surfaces, and is disposed apart from the other parallel two wall surfaces,
    A second straightening plate, which is rectangular or square, is disposed in a portion of the first straightening vane spaced apart from the two wall faces, facing the two wall faces where the second straightening vanes are spaced apart,
    The second straightening vane is provided with a through hole which passes between the surface facing the wall surface and the back surface thereof and through which the pressurizing gas passes.
  2.  前記搬送プレートの前記第一の整流板に面した表面には、窪みが形成された請求項1記載の真空装置。 The vacuum apparatus according to claim 1, wherein a recess is formed on a surface of the transfer plate facing the first straightening vane.
  3.  前記貫通孔には、前記搬送プレート上に配置された前記基板の表面と前記第一の整流板の下方に向く面との間の高さに配置された上側貫通孔と、前記ステージ上に配置された前記搬送対象物の裏面の高さと前記ステージの表面の高さとの間の高さに配置された下側貫通孔とが含まれる請求項1又は請求項2のいずれか1項記載の真空装置。 An upper through hole disposed at a height between the surface of the substrate disposed on the transfer plate and a surface facing downward of the first straightening vane, in the through hole, and disposed on the stage The vacuum according to any one of claims 1 or 2, further comprising a lower through hole disposed at a height between the height of the back surface of the transported object and the height of the surface of the stage. apparatus.
  4.  前記基板と前記第一の整流板との間には表面側隙間が形成され、前記搬送プレートの裏面と前記ステージの表面との間には裏面側隙間が形成され、
     前記表面側隙間の体積と前記上側貫通孔の面積との積の値と、前記裏面側隙間の体積と前記下側貫通孔の面積との積の値とが等しくされた請求項3記載の真空装置。
    A surface side gap is formed between the substrate and the first current plate, and a back surface side gap is formed between the back surface of the transfer plate and the surface of the stage,
    The vacuum according to claim 3, wherein the value of the product of the volume of the surface side gap and the area of the upper through hole, and the value of the product of the volume of the back side gap and the area of the lower through hole are equal. apparatus.
  5.  前記第二の整流板と前記第二の整流板と対面する前記壁面との間の距離は、前記上側貫通孔の鉛直方向の幅よりも大きくされ、且つ、前記下側貫通孔の鉛直方向の幅よりも大きくされた請求項3記載の真空装置。 The distance between the second straightening vane and the wall surface facing the second straightening vane is made greater than the width in the vertical direction of the upper through hole, and in the vertical direction of the lower through hole 4. The vacuum apparatus of claim 3, wherein the vacuum is greater than the width.
  6.  前記貫通孔には、前記搬送プレート上に配置された前記基板の表面と前記第一の整流板の下方に向く面との間の高さに配置された上側貫通孔と、前記ステージと前記第二の整流板の下端との間に設けられた隙間であるステージ上貫通孔とが含まれ、
     前記ステージ上貫通孔は、前記ステージ上に配置された前記搬送プレートの裏面よりも低い高さに配置された請求項1又は請求項2のいずれか1項記載の真空装置。
    An upper through hole disposed at a height between a surface of the substrate disposed on the transfer plate and a surface facing downward of the first straightening vane, the through hole, the stage, and the first through hole And a through hole on the stage, which is a gap provided between the lower end of the second current plate and
    The vacuum apparatus according to any one of claims 1 and 2, wherein the through hole on the stage is disposed at a height lower than a back surface of the transfer plate disposed on the stage.
  7.  前記基板と前記第一の整流板との間には表面側隙間が形成され、前記搬送プレートの裏面と前記ステージの表面との間には裏面側隙間が形成され、
     前記表面側隙間の体積と前記上側貫通孔の面積との積の値と、前記裏面側隙間の体積と前記ステージ上貫通孔の面積との積の値とが等しくされた請求項6記載の真空装置。
    A surface side gap is formed between the substrate and the first current plate, and a back surface side gap is formed between the back surface of the transfer plate and the surface of the stage,
    The vacuum according to claim 6, wherein the value of the product of the volume of the surface side gap and the area of the upper through hole, and the value of the product of the volume of the back side gap and the area of the on-stage through hole are equal. apparatus.
  8.  前記第一の整流板と前記第二の整流板とを前記蓋部材に対して上昇と下降とをさせる昇降装置が設けられた請求項7記載の真空装置。 8. The vacuum apparatus according to claim 7, further comprising an elevating device for raising and lowering the first straightening vane and the second straightening vane relative to the lid member.
  9.  前記第二の整流板と、前記第二の整流板と対面する前記壁面との間の距離は、前記上側貫通孔の鉛直方向の幅よりも大きくされ、且つ、前記ステージ上貫通孔の鉛直方向の幅よりも大きくされた請求項6記載の真空装置。 The distance between the second straightening vane and the wall surface facing the second straightening vane is made greater than the width in the vertical direction of the upper through hole, and the vertical direction of the through hole on the stage The vacuum apparatus according to claim 6, wherein the width is larger than the width of.
  10.  複数の前記給排気口が設けられた請求項1記載の真空装置。 The vacuum apparatus according to claim 1, wherein a plurality of the air supply and exhaust ports are provided.
  11.  前記給排気口には、メッシュ状の整流部材が設けられた請求項1記載の真空装置。 The vacuum device according to claim 1, wherein a mesh-like flow straightening member is provided at the air supply and discharge port.
  12.  前記基板は前記真空槽の内部で真空処理される請求項1記載の真空装置。
     
    The vacuum apparatus according to claim 1, wherein the substrate is vacuum processed inside the vacuum chamber.
PCT/JP2018/043350 2018-01-12 2018-11-26 Vacuum device WO2019138702A1 (en)

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Publication number Priority date Publication date Assignee Title
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10151029A (en) * 1996-11-25 1998-06-09 Sony Corp Substrate case storage rack
JP2000126581A (en) * 1998-10-29 2000-05-09 Kokusai Electric Co Ltd Load lock apparatus
WO2012036043A1 (en) * 2010-09-17 2012-03-22 株式会社アルバック Vacuum processing device
WO2017146204A1 (en) * 2016-02-25 2017-08-31 株式会社アルバック Vacuum device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288992A (en) * 1998-04-06 1999-10-19 Nissin Electric Co Ltd Processed object transfer chamber
JP3884570B2 (en) * 1998-05-29 2007-02-21 大日本スクリーン製造株式会社 Substrate processing equipment
JP4244176B2 (en) * 2002-10-25 2009-03-25 大日本スクリーン製造株式会社 Substrate processing equipment
JP2006128559A (en) * 2004-11-01 2006-05-18 Tokyo Electron Ltd Substrate processing system
US7579276B2 (en) * 2004-10-15 2009-08-25 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method of manufacturing semiconductor device
JP5698059B2 (en) * 2011-04-08 2015-04-08 株式会社日立国際電気 Substrate processing apparatus and solar cell manufacturing method
JP5853291B2 (en) * 2011-12-01 2016-02-09 東海高熱工業株式会社 Substrate processing apparatus and transfer apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10151029A (en) * 1996-11-25 1998-06-09 Sony Corp Substrate case storage rack
JP2000126581A (en) * 1998-10-29 2000-05-09 Kokusai Electric Co Ltd Load lock apparatus
WO2012036043A1 (en) * 2010-09-17 2012-03-22 株式会社アルバック Vacuum processing device
WO2017146204A1 (en) * 2016-02-25 2017-08-31 株式会社アルバック Vacuum device

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