WO2019136151A3 - Thermal interface material - Google Patents

Thermal interface material

Info

Publication number
WO2019136151A3
WO2019136151A3 PCT/US2019/012186 US2019012186W WO2019136151A3 WO 2019136151 A3 WO2019136151 A3 WO 2019136151A3 US 2019012186 W US2019012186 W US 2019012186W WO 2019136151 A3 WO2019136151 A3 WO 2019136151A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal interface
interface material
thermal
heat
kpa
Prior art date
Application number
PCT/US2019/012186
Other languages
French (fr)
Other versions
WO2019136151A2 (en
Inventor
Martin D. Smalc
Prashanth SUBRAMANIAN
Original Assignee
Neograf Solutions, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neograf Solutions, Llc filed Critical Neograf Solutions, Llc
Publication of WO2019136151A2 publication Critical patent/WO2019136151A2/en
Publication of WO2019136151A3 publication Critical patent/WO2019136151A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Abstract

A thermal interface material is disclosed. The thermal interface material comprises a flexible graphite sheet having mechanical alteration; and a heat transfer fluid incorporated in the flexible graphite sheet, where the heat transfer fluid has an operating temperature ranging from -40° C to 300° C and passes the UL94 V-0 flame test when used as a thermal interface material in a thermal interface for a heat source. The thermal interface material has a thermal impedance (Y) at least 10% lower than that defined by Y = 1.02(10-7)X2-2.8(10-4)X+0.26 when X is a contact pressure ranging from 400 kPa to 1400 kPa. Also disclosed are a thermal interface assembly comprising the thermal interface material, and a thermal management system comprising the thermal interface assembly for facilitating the management of the heat from a heat source.
PCT/US2019/012186 2018-01-05 2019-01-03 Thermal interface material WO2019136151A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862614138P 2018-01-05 2018-01-05
US62/614,138 2018-01-05

Publications (2)

Publication Number Publication Date
WO2019136151A2 WO2019136151A2 (en) 2019-07-11
WO2019136151A3 true WO2019136151A3 (en) 2020-04-09

Family

ID=67144252

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2019/012186 WO2019136151A2 (en) 2018-01-05 2019-01-03 Thermal interface material

Country Status (1)

Country Link
WO (1) WO2019136151A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115996839A (en) * 2020-02-28 2023-04-21 新格拉夫解决方案有限责任公司 Thermal management system
CN116018680A (en) * 2020-09-04 2023-04-25 新格拉夫解决方案有限责任公司 Electronic device with thermal management system including graphite element

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030118826A1 (en) * 2001-12-26 2003-06-26 Greinke Ronald A. Thermal interface material
US20040241417A1 (en) * 2003-05-30 2004-12-02 Fischer Patrick J. Thermally conducting foam interface materials
US20130265722A1 (en) * 2009-06-05 2013-10-10 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20140245760A1 (en) * 2006-01-13 2014-09-04 E I Du Pont De Nemours And Company Refrigerant additive compositions containing perfluoropolyethers
US20160280550A1 (en) * 2013-11-05 2016-09-29 Graftech International Holdings Inc. A graphite article
WO2017172703A1 (en) * 2016-03-30 2017-10-05 Parker-Hannifin Corporation Thermal interface material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030118826A1 (en) * 2001-12-26 2003-06-26 Greinke Ronald A. Thermal interface material
US20040241417A1 (en) * 2003-05-30 2004-12-02 Fischer Patrick J. Thermally conducting foam interface materials
US20140245760A1 (en) * 2006-01-13 2014-09-04 E I Du Pont De Nemours And Company Refrigerant additive compositions containing perfluoropolyethers
US20130265722A1 (en) * 2009-06-05 2013-10-10 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20160280550A1 (en) * 2013-11-05 2016-09-29 Graftech International Holdings Inc. A graphite article
WO2017172703A1 (en) * 2016-03-30 2017-10-05 Parker-Hannifin Corporation Thermal interface material

Also Published As

Publication number Publication date
WO2019136151A2 (en) 2019-07-11

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