WO2019135588A1 - Structure de bande interdite électromagnétique et dispositif électronique la comprenant - Google Patents

Structure de bande interdite électromagnétique et dispositif électronique la comprenant Download PDF

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Publication number
WO2019135588A1
WO2019135588A1 PCT/KR2019/000012 KR2019000012W WO2019135588A1 WO 2019135588 A1 WO2019135588 A1 WO 2019135588A1 KR 2019000012 W KR2019000012 W KR 2019000012W WO 2019135588 A1 WO2019135588 A1 WO 2019135588A1
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WIPO (PCT)
Prior art keywords
conductive
circuit board
antenna
electronic device
communication
Prior art date
Application number
PCT/KR2019/000012
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English (en)
Korean (ko)
Inventor
이준호
치코만치니 스코그나안토니오
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2019135588A1 publication Critical patent/WO2019135588A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • Various embodiments of the present invention are directed to an electronic device, for example, an electromagnetic bandgap structure and an electronic device including the same.
  • the electronic device can output the stored information as sound or image.
  • various functions can be mounted on one electronic device such as a mobile communication terminal. For example, not only communication functions but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallet are integrated into one electronic device have.
  • next generation communication system such as a next generation (e.g., fifth generation) communication system or a pre- Efforts are being made to develop next generation communication systems.
  • the next generation communication system is being implemented in a very high frequency band (several tens of GHz band, for example, 6 GHz or more, 300 GHz or less) such as millimeter wave (mm wave).
  • a very high frequency band severe tens of GHz band, for example, 6 GHz or more, 300 GHz or less
  • millimeter wave millimeter wave
  • a beamforming, a massive multi-input multi-output (MIMO) Full-dimensional MIMO (FD-MIMO), antenna array, analog beam-forming, and large scale antenna technologies are being developed.
  • the high-frequency characteristic may be influenced by the surrounding environment.
  • a next-generation communication antenna having the same structure may exhibit different performance depending on the actual installation environment.
  • antenna performance degradation may occur due to coupling or impedance degradation between a communication signal between a wireless transceiver (e.g., a legacy (diversity) antenna) and a millimeter wave communication communication circuit.
  • a wireless transceiver e.g., a legacy (diversity) antenna
  • an electronic device in which an electromagnetic band-gap structure is disposed in a vicinity of a communication circuit for millimeter wave communication.
  • an electromagnetic band-gap structure may be disposed in the interior space of the electronic device to provide communication for millimeter wave communication with a metal contained in a wireless transceiver (e.g., a legacy antenna or bezel) It is possible to reduce deterioration of the performance of the antenna signal due to a coupling or impedance drop occurring between the circuits.
  • a wireless transceiver e.g., a legacy antenna or bezel
  • An electronic device includes a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate,
  • the side member includes a housing including an elongated conductive portion;
  • An antenna structure disposed within the space spaced apart from the conductive portion, the antenna structure comprising a printed circuit board and an array of conductive plates formed on or in the printed circuit board;
  • a first wireless communication circuit electrically connected to the array of conductive plates and configured to transmit and / or receive a first signal having a first frequency in the range of 6 GHz to 300 GHz;
  • a second wireless communication circuit electrically connected to a first point of the conductive portion and configured to transmit and / or receive a second signal having a second frequency lower than the first frequency;
  • an electromagnetic band-gap structure located in the space, the electromagnetic band-gap structure being disposed between the first point and the antenna structure in a direction parallel to the conductive portion.
  • An electronic device includes: a housing including a conductive portion; A printed circuit board disposed within the housing; A first antenna device for transmitting and / or receiving a first signal having a first frequency in the range of 6 GHz to 300 GHz through the array of conductive plates, the first antenna device including an array of conductive plates formed on or within the printed circuit board, ; A second antenna device electrically connected to the conductive portion and transmitting and / or receiving a second signal having a second frequency lower than the first frequency through at least a portion of the conductive portion; An electromagnetic band-gap structure that is spaced apart from the first antenna device and the second antenna device and limits interference between the first signal of the first antenna and the second signal of the second antenna, . ≪ / RTI >
  • An electronic device includes: a conductive portion for forming a part of a side member of the electronic device; And an electromagnetic band-gap structure electrically connected to at least a portion of the conductive portion.
  • the electromagnetic bandgap structure includes conductive patches forming a periodic pattern; A plurality of conductive vias disposed in each of the conductive patches in a vertical direction; And an insulating layer disposed facing the layer formed by the conductive patches.
  • an electronic device in providing an electronic device with a communication signal, or a power and a control signal, to a communication device that transmits and receives radio waves (e.g., millimeter waves) in a frequency band of several tens GHz or more, It is possible to reduce the deterioration of the performance of the antenna signal caused by the coupling due to the peripheral structure or the lowering of the impedance by disposing an electromagnetic band-gap structure.
  • radio waves e.g., millimeter waves
  • an electronic device may be configured to have an electromagnetic band-gap structure at various locations on an internal space to maintain the performance of the wireless communication device, Can be improved.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, in accordance with various embodiments.
  • FIG. 2 is a diagram showing an example of an electronic device supporting 5G communication.
  • FIG. 3 is a block diagram of a communication device in accordance with one embodiment.
  • FIG. 4 is a block diagram illustrating an electronic device 101 in accordance with various embodiments of the present invention.
  • FIG. 5 is a front perspective view of an electronic device 101, in accordance with various embodiments of the present invention.
  • FIG. 6 is a rear perspective view of an electronic device 101, in accordance with various embodiments of the present invention.
  • Figure 7 is an exploded perspective view of an electronic device 101, in accordance with various embodiments of the present invention.
  • FIG. 8 is a schematic diagram illustrating a communication device 610 and an electromagnetic band-gap structure 440 of the electronic device 101, according to one of various embodiments of the present invention.
  • FIG. 9 is a perspective view illustrating the arrangement relationship of a communication device 610 and an electromagnetic band-gap structure 440 of an electronic device according to one of various embodiments of the present invention.
  • FIG. 10 is a block diagram illustrating a communication device 610 including a communication circuit 620 of an electronic device according to various embodiments of the present invention.
  • FIG 11 is a perspective view illustrating the arrangement relationship of the electromagnetic bandgap structure 640 disposed in the conductive portion 601 of the electronic device according to one of various embodiments of the present invention.
  • Figure 12 is an enlarged view of a top view and an electromagnetic bandgap structure 640 as viewed from above of the structure of Figure 9, in accordance with one of various embodiments of the present invention.
  • FIG. 13 is a perspective view of another embodiment of an electromagnetic bandgap structure 740 disposed in a conductive portion 501 of an electronic device, in accordance with one of various embodiments of the present invention.
  • FIG. 14 is a perspective view of another embodiment of an electromagnetic bandgap structure 840 disposed on a printed circuit board 811 of an electronic device, in accordance with one of various embodiments of the present invention.
  • FIG. 15A shows an electromagnetic bandgap structure 940 disposed on the electronic device first region S1 according to one embodiment.
  • FIG. 15B shows an electromagnetic bandgap structure 940 disposed on the electronic device internal second region S2, according to one embodiment.
  • FIG. 16 is a graph illustrating return loss for each frequency band of the first antenna apparatus according to various embodiments of the present invention. Referring to FIG.
  • 17 is a graph illustrating return loss of a second antenna device according to various embodiments of the present invention.
  • FIG. 18A is a graph of a directivity of a first antenna device excluding an electromagnetic bandgap structure according to various embodiments of the present invention
  • FIG. 18B is a graph of a directivity of a first antenna device having an electromagnetic bandgap structure disposed adjacent to the first antenna device.
  • FIG. 19 is a graph illustrating realized gains of a first antenna device with and without an electromagnetic bandgap structure according to various embodiments of the present invention.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, in accordance with various embodiments.
  • an electronic device 101 in a network environment 100 communicates with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) (E. G., A < / RTI > remote wireless communication network).
  • a first network 198 e.g., a short-range wireless communication network
  • the electronic device 101 is capable of communicating with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identity module 196, ).
  • at least one (e.g., display 160 or camera module 180) of these components may be omitted from the electronic device 101, or one or more other components may be added.
  • some of these components may be implemented as a single integrated circuit.
  • a sensor module 176 e.g., a fingerprint sensor, an iris sensor, or a light sensor
  • the display device 160 e.g., a display
  • Processor 120 executes at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120 by executing software (e.g., program 140) And can perform various data processing or arithmetic operations.
  • the processor 120 may provide instructions or data received from other components (e.g., sensor module 176 or communication module 190) Process the instructions or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134.
  • the processor 120 includes a main processor 121 (e.g., a central processing unit or application processor), and a secondary processor 123 (e.g., a graphics processing unit, an image signal processor , A sensor hub processor, or a communications processor). Additionally or alternatively, the coprocessor 123 may use less power than the main processor 121, or it may be set to be specific to the specified function. The coprocessor 123 may be implemented separately from, or as part of, the main processor 121.
  • a main processor 121 e.g., a central processing unit or application processor
  • a secondary processor 123 e.g., a graphics processing unit, an image signal processor , A sensor hub processor, or a communications processor.
  • the coprocessor 123 may use less power than the main processor 121, or it may be set to be specific to the specified function.
  • the coprocessor 123 may be implemented separately from, or as part of, the main processor 121.
  • a functionally related other component e.g., camera module 180 or communication module 190
  • Memory 130 may store various data used by at least one component (e.g., processor 120 or sensor module 176) of electronic device 101.
  • the data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144,
  • the input device 150 may receive commands or data to be used for components (e.g., processor 120) of the electronic device 101 from the outside (e.g., a user) of the electronic device 101.
  • the input device 150 may include, for example, a microphone, a mouse, or a keyboard.
  • the sound output device 155 can output the sound signal to the outside of the electronic device 101.
  • the sound output device 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes, such as multimedia playback or record playback, and receivers can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker, or as part thereof.
  • Display device 160 may visually provide information to an external (e.g., user) of electronic device 101.
  • Display device 160 may include, for example, a display, a hologram device, or a projector and control circuitry for controlling the device.
  • the display device 160 may comprise a touch circuitry configured to sense a touch, or a sensor circuit (e.g., a pressure sensor) configured to measure the force generated by the touch have.
  • the audio module 170 may convert the sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 is configured to acquire sound through the input device 150, or to output audio to the audio output device 155, or to an external electronic device (e.g., Electronic device 102) (e.g., a speaker or headphone)).
  • an external electronic device e.g., Electronic device 102
  • a speaker or headphone e.g., a speaker or headphone
  • the sensor module 176 senses the operating state (e.g., power or temperature) of the electronic device 101 or an external environmental condition (e.g., a user state) and generates an electrical signal or data value corresponding to the sensed condition can do.
  • the sensor module 176 may be, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, A temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used by the electronic device 101 to connect directly or wirelessly with an external electronic device (e.g., the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102).
  • connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (e.g., vibrations or movements) or electrical stimuli that the user may perceive through tactile or kinesthetic sensations.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture a still image and a moving image.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage the power supplied to the electronic device 101.
  • the power management module 388 may be implemented as at least a portion of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module 190 may be a direct (e.g., wired) communication channel between the electronic device 101 and an external electronic device (e.g., an electronic device 102, an electronic device 104, or a server 108) Establishment, and communication through the established communication channel.
  • Communication module 190 may include one or more communication processors that operate independently of processor 120 (e.g., an application processor) and that support direct (e.g., wired) or wireless communication.
  • the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 : A local area network (LAN) communication module, or a power line communication module).
  • a corresponding one of these communication modules may be a first network 198 (e.g., a short range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (e.g. a cellular network, (E.g., a telecommunications network, such as a computer network (e.g., a LAN or WAN)).
  • a wireless communication module 192 e.g., a cellular communication module, a short range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • a wired communication module 194 e.g., a local area network (LAN) communication module, or a power
  • the wireless communication module 192 may be configured to communicate with the subscriber identity module 196 in a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identity (IMSI)
  • subscriber information e.g., International Mobile Subscriber Identity (IMSI)
  • IMSI International Mobile Subscriber Identity
  • the antenna module 197 can transmit signals or power to the outside (e.g., an external electronic device) or receive it from the outside.
  • the antenna module 197 may include one or more antennas, from which at least one (e.g., one or more) antennas suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, May be selected, for example, by the communication module 190.
  • a signal or power may be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna.
  • At least some of the components are connected to each other via a communication method (e.g., bus, general purpose input and output, SPI, or mobile industry processor interface (MIPI) For example, commands or data).
  • a communication method e.g., bus, general purpose input and output, SPI, or mobile industry processor interface (MIPI)
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199.
  • Each of the electronic devices 102 and 104 may be the same or a different kind of device as the electronic device 101.
  • all or a portion of the operations performed on the electronic device 101 may be performed on one or more external devices of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may, instead of executing the function or service itself Or in addition, to one or more external electronic devices to perform the function or at least part of the service.
  • One or more external electronic devices that have received the request may execute at least a portion of the requested function or service, or an additional function or service associated with the request, and deliver the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or in addition to provide at least a portion of the response to the request.
  • cloud computing distributed computing, or client- Can be used.
  • the electronic device can be various types of devices.
  • An electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device e.g., a smart phone
  • a computer device e.g., a laptop, a desktop, a tablet, or a portable multimedia device
  • portable medical device e.g., a portable medical device
  • camera e.g., a camera
  • a wearable device e.g., a smart watch
  • a home appliance e.g., a smart bracelet
  • any (e.g., first) component may be referred to as being “coupled” or “connected” to another (eg, second) component, with or without the term “functionally”
  • any (e.g., first) component may be referred to as being “coupled” or “connected” to another (eg, second) component, with or without the term “functionally”
  • module may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic blocks, components, or circuits.
  • a module may be an integrally constructed component or a minimum unit of the component or part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • the various embodiments of the present document may include one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101) (E. G., Program 140). ≪ / RTI >
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by the compiler or code that may be executed by the interpreter.
  • a device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transient' means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), which means that data is permanently stored on the storage medium Do not distinguish between cases where they are temporarily stored.
  • a method according to various embodiments disclosed herein may be provided in a computer program product.
  • a computer program product can be traded between a seller and a buyer as a product.
  • the computer program product may be distributed in the form of a machine readable storage medium (e.g., compact disc read only memory (CD-ROM)), or via an application store (e.g. PlayStore TM ) For example, smartphones), directly or online (e.g., downloaded or uploaded).
  • an application store e.g. PlayStore TM
  • smartphones e.g., smartphones
  • online e.g., downloaded or uploaded.
  • at least a portion of the computer program product may be temporarily stored, or temporarily created, on a storage medium readable by a machine, such as a manufacturer's server, a server of an application store, or a memory of a relay server.
  • each component e.g., a module or program of the components described above may include one or more entities.
  • one or more of the above-described components or operations may be omitted, or one or more other components or operations may be added.
  • a plurality of components e.g., modules or programs
  • the integrated component may perform one or more functions of each component of each of the plurality of components in a manner similar or similar to that performed by the corresponding one of the plurality of components prior to the integration .
  • operations performed by a module, program, or other component may be performed sequentially, in parallel, repetitively, or heuristically, or one or more of the operations may be performed in a different order, Or one or more other operations may be added.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, with reference to the accompanying drawings, an electronic apparatus according to various embodiments will be described.
  • the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).
  • FIG. 2 is a diagram showing an example of an electronic device 100 supporting 5G communication.
  • the electronic device 101 includes a housing 210, a processor 240, a communication module 250 (e.g., communication module 190 of FIG. 1), a first communication device 221, The first conductive line 231, the second conductive line 232, the third conductive line 233, or the fourth conductive line 233, the third communication line 223, the fourth communication line 224, Line < / RTI >
  • a communication module 250 e.g., communication module 190 of FIG. 1
  • the housing 210 may protect the other components of the electronic device 101.
  • the housing 210 may include, for example, a front plate, a back plate facing away from the front plate, and a back plate attached to or integral with the back plate, And a side member (or metal frame) surrounding the space between the plate and the back plate.
  • the electronic device 101 may include at least one communication device.
  • the electronic device 101 may include at least one of a first communication device 221, a second communication device 222, a third communication device 223, or a fourth communication device 224 .
  • the first communication device 221, the second communication device 222, the third communication device 223, or the fourth communication device 224 may be located within the housing 210 .
  • the first communication device 221 may be located at the upper left of the electronic device 101 and the second communication device 222 may be located at the upper left of the electronic device 101.
  • the third communication device 223 may be disposed at the lower left end of the electronic device 101 and the fourth communication device 224 may be disposed at the lower right end of the electronic device 101 .
  • the processor 240 may be any of a central processing unit, an application processor, a graphics processing unit (GPU), a camera image signal processor, or a baseband processor (or a communication processor Or more.
  • the processor 240 may be implemented as a system on chip (SoC) or a system in package (SiP).
  • SoC system on chip
  • SiP system in package
  • the communication module 250 may be electrically connected to at least one communication device using at least one conductive line.
  • the communication module 250 may use the first conductive line 231, the second conductive line 232, the third conductive line 233, or the fourth conductive line 234, The first communication device 221, the second communication device 222, the third communication device 223, or the fourth communication device 224.
  • Communication module 250 may include, for example, a baseband processor, or at least one communication circuit (e.g., IFIC, or RFIC).
  • Communication module 250 may include, for example, a baseband processor separate from processor 240 (e.g., application processor (AP)).
  • the first conductive line 231, the second conductive line 232, the third conductive line 233 or the fourth conductive line 234 may comprise, for example, a coaxial cable, or an FPCB.
  • the communication module 250 may include a first baseband processor (BP) (not shown) or a second baseband processor (BP) (not shown).
  • the electronic device 101 may further include one or more interfaces for supporting chip-to-chip communication between the first BP (or second BP) and the processor 240.
  • the processor 240 and the first BP or the second BP may transmit and receive data using the inter-processor communication channel.
  • the first BP or the second BP may provide an interface for communicating with other entities.
  • the first BP may, for example, support wireless communication for a first network (not shown).
  • the second BP may support wireless communication, for example, to a second network (not shown).
  • the first BP or the second BP may form one module with the processor 240.
  • the first BP or the second BP may be integrally formed with the processor 240.
  • the first BP or the second BP may be disposed in one chip, or may be formed in an independent chip form.
  • the processor 240 and the at least one Baseband Processor e.g., the first BP
  • SoC chip SoC chip
  • a first network (not shown), or a second network (not shown) may correspond to the network 199 of FIG.
  • the first network (not shown) and a second network (not shown) each of which may comprise a 4G (4 th generation) networks, and 5G (5 th generation) networks.
  • the 4G network may support, for example, long term evolution (LTE) protocols defined in 3GPP.
  • the 5G network may support, for example, the NR (new radio) protocol defined in 3GPP.
  • FIG. 3 is a block diagram of a communication device in accordance with one embodiment.
  • the communication device 300 e.g., the first communication device 221, the second communication device 222, the third communication device 223, or the fourth communication device 224 of FIG. 2 (E.g., RFIC), a PCB 350, a first antenna array 340, or a second antenna array 345.
  • the PCB 350 may include a communications circuit 330, a first antenna array 340, or a second antenna array 345.
  • a first antenna array 340 or a second antenna array 345 is disposed on a first side of the PCB 350 and a communication circuit 330 is located on a second side of the PCB 350 .
  • the PCB 350 is electrically connected to another PCB (e.g., a PCB on which the communication module 250 of FIG. 2 is disposed) using a transmission line (e.g., the first conductive line 231, coaxial cable of FIG. 2) (E.g., a coaxial cable connector or a board to board (B-to-B)).
  • a transmission line e.g., the first conductive line 231, coaxial cable of FIG. 2
  • the PCB 350 may be coaxially connected to a PCB on which the communication module 250 is disposed, for example, using a coaxial cable connector, and the coaxial cable may be used for transmission and reception of IF signals or RF signals. have. As another example, power or other control signals may be communicated through the B-to-B connector.
  • the first antenna array 340, or the second antenna array 345 may comprise a plurality of antennas.
  • the antenna may include a patch antenna, a loop antenna, or a dipole antenna.
  • the plurality of antennas included in the first antenna array 340 may be a patch antenna to form a beam toward the back plate of the electronic device 200.
  • the plurality of antennas included in the second antenna array 345 may be a dipole antenna, or a loop antenna, to form a beam toward the side member of the electronic device 200.
  • the communication circuit 330 may support at least some of the 300 GHz band (e.g., from 24 GHz to 30 GHz or from 37 GHz to 40 GHz) at 6 GHz.
  • the communications circuit 330 may upconvert or downconvert the frequency.
  • the communication circuit 330 included in the communication device 300 e.g., the first communication device 221 of FIG. 2 may be connected to a conductive line (e.g., the communication module 250 of FIG. 2) (E.g., the first conductive line 231 of FIG. 2) to an RF signal.
  • the communication circuit 330 included in the communication device 300 e.g., the first communication device 221 of FIG.
  • An RF signal (e.g., a millimeter wave signal) can be down-converted to an IF signal and transmitted to the communication module using a conductive line.
  • FIG. 4 is a block diagram illustrating an electronic device 101 in accordance with various embodiments of the present invention.
  • the communication device 404 may be, for example, a millimeter wave communication device that performs wireless communication in a frequency band of 6 GHz to 300 GHz.
  • the electronic device 101 includes a processor 420, a power management module 488 (e.g., a PMIC), a wireless transceiver 490, and a processor 420 mounted on a circuit board (e.g., main circuit board 404a) .
  • the communication device 404 may include an auxiliary circuit board 404b disposed adjacent to the main circuit board 404a.
  • the communication module 190 or the wireless communication module 192 of FIG. 1 may be coupled to the processor 420 of the wireless transceiver 490, the circuit board (e.g., the main circuit board 404a) Management module 488 (e.g., a PMIC), and may be under the control of the processor 420.
  • the processor 420 may include at least a communication processor, or may be an integrated application processor and communication processor, and the wireless transceiver 490, The power management module 488, or the wireless communication circuit 492, or the like.
  • the power management module 488 (e.g., the power management module 188 of FIG. 1) is controlled by the processor 420, the radio transceiver 490, The power supplied to the wireless communication circuit 492 or other electronic components in the electronic device 400 can be managed.
  • the power management module 488 may provide a power signal to a TCXO / XO (temperature controlled crystal oscillator / crystal oscillator), and the TCXO / XO may generate a clock signal, (490), the processor (420), or the power management module (488).
  • the wireless transceiver 490 may communicate a Rx digital signal, a transmit analog I / Q signal, or a control signal with the processor 420. In some embodiments, the wireless transceiver 490 may generate and provide a communication signal to the wireless communication circuit 492.
  • the communication device 404 may include the radio communication circuit 492 and the radiating conductor 497 (s) mounted on the auxiliary circuit board 404b.
  • the communication device 404 may be a structure in which the radio communication circuit 492 and the radiating conductor 497 are disposed on one circuit board.
  • the wireless communication circuit 492 may receive a communication signal via the wireless transceiver 490 or may transmit the received communication signal to the wireless transceiver 490.
  • the wireless communication circuit 492 may perform wireless communication using the radiating conductor 497 (s) under the control of the processor 420.
  • the wireless communication circuit 492 receives a control signal and power from the processor 420 and the power management module 488 and processes a communication signal received from the outside or a communication signal to be externally transmitted can do.
  • the wireless communication circuit 492 may include a switch circuit for separating transmission / reception signals or various amplifiers and filter circuits for enhancing transmission / reception signal quality.
  • the wireless communication circuit 492 includes a phase shifter connected to each radiating conductor, so that the communication device 404 ), For example, the direction of the electronic device 101 can be controlled.
  • the wireless communication circuit 492 may provide a phase difference feed to each radiating conductor so that the communication device 404 or the electronic device (E. G., The electronic device 101). This phase difference feeding can be useful for securing an optimal communication environment or a good communication environment in a communication method having strong linearity, such as millimeter wave communication (for example, wireless communication using a frequency band of 6 GHz or more and 300 GHz or less).
  • the auxiliary circuit board 404b may be connected to the main circuit board 404a via a flexible printed circuit board 404c.
  • the flexible printed circuit board 404c may transmit a control signal, a power supply, or a communication signal from the main circuit board 404a to the auxiliary circuit board 404b.
  • signals received via the communication device 404 may be transmitted to the main circuit board 404a via the flexible printed circuit board 404c.
  • the flexible printed circuit board 404c may extend substantially as part of the auxiliary circuit board 404b.
  • the flexible printed circuit board 404c includes a first extending portion 441a extending from the auxiliary circuit board 404b, a second extending portion 441b extending from the first extending portion 441a, Or a third extension 441c.
  • the second extension 441b and the third extension 441c may extend at least partially parallel to each other and may include a first connector 443a or a second connector 443b at an end thereof. have.
  • the second extension part 441b may be connected to the main circuit board 404a through the first connector 443a, and the third extension part 441c may be connected to the second connector 443b And may be connected to the main circuit board 404a.
  • the first connector 443a may be connected to a connector provided on the main circuit board 404a to establish a line for transmitting a power or a control signal, It is possible to establish a line for transmitting a communication signal by connecting to another connector provided on the circuit board 404a.
  • the flexible printed circuit board 404c is not a branched structure consisting of the second extended portion 441b or the extensible third extension 441c, but rather a substantially printed circuit board form (e.g., The first extension portion 441a), and a line through which a line for transmitting power or a control signal transmits a communication signal may be disposed in one printed circuit board.
  • 5 is a front perspective view of an electronic device 101, in accordance with various embodiments of the present invention.
  • 6 is a rear perspective view of an electronic device 101, in accordance with various embodiments of the present invention.
  • an electronic device 101 includes a first surface (or a front surface) 510A, a second surface (or back surface) 510B, and a first surface 510A, And a side 510C surrounding the space between the first surface 510A and the second surface 510B.
  • the housing 510 may refer to a structure forming part of the first side 510A, second side 510B and side 510C of FIG.
  • the first surface 510A may be formed by a front plate 502 (e.g., a glass plate, or polymer plate comprising a variety of coating layers) that is at least partially substantially transparent.
  • the second surface 510B may be formed by a substantially opaque back plate 511.
  • the back plate 511 may be formed by a combination of at least two of these materials, for example, a coating or colored glass, a ceramic, a polymer, a metal (e.g. aluminum, stainless steel (STS), or magnesium) .
  • the side 510C may be formed by a side bezel structure (or "side member") 518 which is coupled to the front plate 502 and the rear plate 511 and includes a metal and / or polymer.
  • the rear plate 511 and the side bezel structure 518 may be integrally formed and include the same material (e.g., a metal material such as aluminum).
  • the front plate 502 includes a first region 510D that extends from the first surface 510A toward the rear plate and extends seamlessly, edge of the substrate. 6), the rear plate 511 includes a second region 510E that extends from the second surface 510B toward the front plate and extends seamlessly, can do.
  • the front plate or back plate may comprise only one of the first region or the second region.
  • the side bezel structure has a first thickness (or width) on the side where the first region or the second region is not included, Region or a second thickness that is thinner than the first thickness on the side including the second region.
  • the electronic device 101 includes a display 501, audio modules 503, 507, 514, sensor modules 504, 519, camera modules 505, 512, 513, 515, 516, 517, an indicator 506, and connector holes 508, In some embodiments, the electronic device 101 may omit or additionally include at least one of the components (e.g., keying device 515, 516, 517, or indicator 506) have.
  • the components e.g., keying device 515, 516, 517, or indicator 506 have.
  • the display 501 may be exposed through a substantial portion of the front plate 502. [ In some embodiments, at least a portion of the display 501 may be exposed through the faceplate 502 forming the first side 510A and the first side 510D of the side 510C.
  • the display 501 may be disposed in proximity to, or in combination with, a touch sensing circuit, a pressure sensor capable of measuring the strength of the touch (pressure), and / or a digitizer for sensing a stylus pen in a magnetic field.
  • At least a portion of the sensor module 504, 519, and / or at least a portion of the key input device 515, 516, 517 may be located within the first region 510D and / Gt; 510E < / RTI >
  • the audio modules 503, 507, 514 may include a microphone hole 503 and speaker holes 507, 514.
  • the microphone hole 503 may include a microphone for acquiring an external sound, and in some embodiments, a plurality of microphones may be disposed to sense the direction of sound.
  • the speaker holes 507 and 514 may include an external speaker hole 507 and a communication receiver hole 514.
  • the speaker holes 507 and 514 and the microphone hole 503 may be implemented as a single hole, or a speaker may be included without speaker holes 507 and 514 (e.g., piezo speaker).
  • the sensor modules 504 and 519 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101, or an external environmental condition.
  • the sensor modules 504 and 519 may include a first sensor module 504 (e.g., proximity sensor) and / or a second sensor module (not shown) disposed on the first side 510A of the housing 510 (E.g., a fingerprint sensor), and / or a third sensor module 519 (e.g., an HRM sensor) disposed on a second side 510B of the housing 510.
  • the fingerprint sensor may be disposed on the second surface 510B as well as the first surface 510A of the housing 510 (e.g., the home key button 515).
  • the electronic device 101 includes a sensor module such as a gesture sensor, a gyroscope, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared sensor, A humidity sensor, or an ambient light sensor 504, as shown in FIG.
  • a sensor module such as a gesture sensor, a gyroscope, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared sensor, A humidity sensor, or an ambient light sensor 504, as shown in FIG.
  • the camera modules 505, 512, 513 may include a first camera device 505 disposed on the first side 510A of the electronic device 101 and a second camera device 506 disposed on the second side 510B A second camera device 512 (e.g., camera module 180 of FIG. 1), and / or a flash 513.
  • the camera modules 505, 512 may include one or more lenses, an image sensor, and / or an image signal processor.
  • the flash 513 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101.
  • the key input devices 515, 516, and 517 include a home key button 515 disposed on the first surface 510A of the housing 510, a touch disposed around the home key button 515, Pad 516, and / or side key button 517 disposed on side 510C of housing 510.
  • the electronic device 101 may not include some or all of the above-mentioned key input devices 515, 516, 517, and the key input devices 515, 516, 517, Or may be implemented in other forms, such as soft keys,
  • the indicator 506 may be disposed on the first surface 510A of the housing 510, for example.
  • the indicator 506 may, for example, provide status information of the electronic device 101 in optical form and may include an LED.
  • connector holes 508 and 509 may include a first connector hole 508 that can receive a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, And / or a second connector hole (or earphone jack) 509 that can receive a connector for transmitting and receiving audio signals to and from an external electronic device.
  • a connector e.g., a USB connector
  • second connector hole or earphone jack
  • Figure 7 is an exploded perspective view of an electronic device 101, in accordance with various embodiments of the present invention.
  • the electronic device 101 (e.g., electronic device 101 of Figures 1 to 6) includes a side bezel structure 531, a first support member 532 (e.g., a bracket) (E.g., front plate 520), a display 530, a printed circuit board 540, a battery 550, at least one communication device 590, a second support member 560 (e.g., a rear case) Antenna 570, and a second plate (e.g., back plate 580).
  • electronic device 101 may further include other components, such as omitting at least one of the components (e.g., first support member 532, or second support member 560) . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 1 or 5, and redundant descriptions are omitted below.
  • the first support member 532 may be disposed inside the electronic device 101 and connected to the side bezel structure 531, or may be formed integrally with the side bezel structure 531.
  • the first support member 532 may be formed of, for example, a metal material and / or a non-metal (e.g., polymer) material.
  • the first support member 532 may have a display 530 coupled to one side and a printed circuit board 540 coupled to the other side.
  • the printed circuit board 540 may be equipped with a processor, memory, and / or interface.
  • a processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor.
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.
  • the battery 550 is an apparatus for supplying power to at least one component of the electronic device 101, such as a non-rechargeable primary battery, or a rechargeable secondary battery, Battery. At least a portion of the battery 550 may be disposed substantially coplanar with, for example, the printed circuit board 540. The battery 550 may be integrally disposed inside the electronic device 101 and detachably disposed with the electronic device 101. [
  • the antenna 570 may be disposed between the back plate 580 and the battery 550.
  • Antenna 570 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna.
  • the antenna 570 can perform, for example, short-range communication with an external device, or wirelessly transmit and receive power required for charging.
  • the antenna structure may be formed by the side bezel structure 531 and / or a portion of the first support member 532 or a combination thereof.
  • the electronic device may include a plurality of communication devices 590.
  • some of the plurality of communication devices 590 may be implemented to transmit and receive radio waves (referred to as propagation waves of A and B frequency bands) having different characteristics for MIMO implementation.
  • some of the plurality of communication apparatuses 590 may transmit and receive radio waves having the same characteristics (referred to as radio waves of A1 and A2 frequencies in the A frequency band) for diversity implementation, for example, . ≪ / RTI >
  • another part of the plurality of communication devices 590 may be configured to simultaneously transmit and receive radio waves having the same characteristics (called radio waves of B1 and B2 frequencies in the B frequency band) for the diversity implementation Can be set.
  • two communication devices may be included, but in another embodiment of the present invention, the electronic device 101 may include four communication devices to simultaneously implement MIMO and diversity . In yet another embodiment, the electronic device 101 may include only one communication device 590.
  • one communication device in consideration of the transmission / reception characteristics of radio waves, when one communication device is disposed at a first position inside the housing 510, And may be disposed at a second position separated from the first position.
  • one communication apparatus and another communication apparatus can be arranged taking into account the mutual separation distance according to the diversity characteristic.
  • At least one communication device 590 is a wireless communication circuit (e. G., A wireless communication circuit of FIG. 4 (see FIG. 4) for processing a radio wave transmitted and received in a very high frequency band 492).
  • the radiating conductor (e.g., radiating conductor 497) (s) of the at least one communication device 590 may comprise, for example, a patch-type radiating conductor or a radiation conductor of a dipole structure extending in one direction And a plurality of the radiation conductors may be arrayed to form an antenna array.
  • a chip for example, an integrated circuit chip in which a part of the wireless communication circuit is implemented may be disposed on one side of the region where the radiation conductor is disposed or on a surface facing the opposite direction to the side on which the radiation conductor is disposed, And may be electrically connected to the radiating conductor (s) through a wiring made of a printed circuit pattern.
  • FIG. 8 is a schematic diagram illustrating a communication device 610 and an electromagnetic band-gap structure 640 of the electronic device 101, according to one of various embodiments of the present invention.
  • 9 is a perspective view illustrating the arrangement relationship of a communication device 610 and an electromagnetic band-gap structure 640 of an electronic device according to one of various embodiments of the present invention.
  • the electronic device 101 includes a conductive portion 601 of the housing 510, a communication device 610, a first wireless communication circuit (e.g., the communication module 250 of FIG. 2) A second wireless communication circuit (e.g., communication module 250 of FIG. 2), and an electromagnetic band-gap structure 640.
  • a first wireless communication circuit e.g., the communication module 250 of FIG. 2
  • a second wireless communication circuit e.g., communication module 250 of FIG. 2
  • an electromagnetic band-gap structure 640 e.g., electromagnetic band-gap structure
  • the conductive portion 601, the communication device 610, and the first and second wireless communication circuits of Figs. 8 and 9 are connected to a portion of the side bezel structure 531 of Fig. 7, the communication device 590, Module 250 may be partly or wholly identical.
  • the communication device 610 may include a communication circuit (e.g., communication circuit 330 of FIG. 3) and an antenna structure (e.g., antenna structure 613 of FIG. 10).
  • 'X' in the three-axis orthogonal coordinate system corresponds to the longitudinal direction of the electronic device housing 510
  • 'Y' denotes the width direction of the electronic device housing 510
  • 'Z' denotes the electronic device housing 510, In the thickness direction.
  • 'Z' may mean a first direction (+ Z) and a second direction (-Z).
  • the housing 510 may include a first plate (e.g., the front plate 520 of FIG. 7) oriented in a first direction (+ Z), a first direction A second plate (e.g., the back plate 580 of FIG. 7) facing in the second direction -Z toward the opposite direction and a side member (not shown) surrounding the space 603 between the first plate and the second plate (E.g., side bezel structure 531 of FIG. 7).
  • the side member may include a conductive portion 601 formed of a metal material.
  • the conductive portion 601 may be an elongated conductive area at least partially exposed to the outside in a direction perpendicular to the first direction + Z and / or the second direction -Z. Lt; / RTI >
  • the conductive portion 601 may be utilized as an antenna radiator of the second wireless communication circuit.
  • the communication device 610 may include a communication circuit (e.g., communication circuit 620 of FIG. 10) and an antenna structure (e.g., antenna structure 613 of FIG. 10).
  • the antenna structure may be disposed on a space separated from the conductive portion 601 and may include an array of conductive plates 611 and an array of conductive plates 612.
  • the conductive plates 612 may include a metal material, and may be provided as a radiator of the antenna.
  • the communication device 610 may be formed in a region adjacent to a side member (e.g., the side bezel structure 531 of FIG. 7). However, the communication device 610 is disposed in the upper right area, but is not limited thereto. Depending on the structure of the electronic device 101, the upper left area, the lower right area, and / or the lower left area As shown in FIG. As another example, the communication device 610 may be disposed to face a side of the electronic device (e.g., the side bezel structure 531 of FIG. 7).
  • the printed circuit board 611 is implemented as a multi-layer circuit board
  • a part of the conductive layer (or wiring layer) may be used in the printed circuit board 611 to form patch- 612 may be formed.
  • the printed circuit board 611 of the multi-layer circuit board structure comprises via pads of each conductive layer and a combination of via holes formed in the insulating layer between the conductive layers And conductive plates 612 of a grid structure.
  • the conductive plates 612 having a grid structure can form another antenna array inside or adjacent to the side or side of the printed circuit board 611.
  • various types of radiation conductors or antenna arrays may be formed on one side, the other side, or the inside of the printed circuit board 611.
  • the printed circuit board 611 includes a main circuit board accommodated in the housing 510, and the main circuit board includes a region for disposing a battery (e.g., the battery 550 in FIG. 7) May be disposed in the remaining region except for the region.
  • the printed circuit board 611 may include at least one auxiliary circuit board electrically extended from the main circuit board.
  • the auxiliary circuit board (s) may be disposed on the edge region of the main circuit board, for example, on the upper side, the lower side, the one side or both sides, depending on the structure of the electronic device 101.
  • an array of conductive plates 612 of the communication device 610 may be formed on the main circuit board or may be formed on the auxiliary circuit board.
  • the present invention is not limited thereto.
  • an array (not shown) of the conductive plates 612 array of conductive plates may be formed on the printed circuit board 611.
  • the arrangement of the antenna array may vary depending on each electronic device such as a home TV, a sound device, or a mobile communication terminal.
  • the first wireless communication circuit (e.g., communication module 250 of FIG. 2) is electrically coupled to the array of conductive plates 612 and includes a processor (e.g., processor 240 of FIG. 2) The wireless communication using the array of the conductive plates 612 can be performed.
  • the first wireless communication circuit receives a control signal and power from the processor and the power management module (e.g., the power management module 188 of FIG. 1) The communication signal to be transmitted can be processed.
  • the first wireless communication circuit may include a switch circuit for separating transmission / reception signals, various amplifiers and filter circuits for improving transmission / reception signal quality, and the like.
  • the first wireless communication circuit may be configured to transmit and / or receive a first signal having a first frequency between 6 GHz and 300 GHz.
  • the second wireless communication circuit (e.g., communication module 250 of FIG. 2) is electrically connected to the first point 601a of the conductive portion 601, The processor 240 of the mobile communication terminal 100).
  • the second wireless communication circuit receives a control signal and power from the processor and the power management module, and can process a communication signal received from the outside or a communication signal to be externally transmitted.
  • the second wireless communication circuit may include a switch circuit for separating transmission / reception signals, various amplifiers and filter circuits for improving transmission / reception signal quality, and the like.
  • the second wireless communication circuit may be configured to transmit and / or receive a second signal having a second frequency lower than the first frequency of the first wireless communication circuit.
  • the second frequency band may have a range of 6 GHz or less.
  • an electromagnetic band-gap structure 640 is disposed in a direction parallel to the conductive portion 601, and is provided in the first wireless communication circuit and the second wireless communication circuit The deterioration caused by the coupling or the lowering of the impedance can be reduced.
  • the electromagnetic bandgap structure 640 is formed between the first point 610a of the conductive portion 601 and the communication device 610, It is possible to isolate the interference of signals generated between at least a part of the conductive part 601 operating as a radiator and the communication device 610 connected to the second wireless communication circuit.
  • the electromagnetic bandgap structure 640 may be spaced apart from the first point 610a of the conductive portion 601 and the communication device 610 to act as an antenna radiator connected to the first wireless communication circuit
  • the communication device (610) connected to the second wireless communication circuit can be separated from each other. Accordingly, it is possible to effectively manufacture an antenna device having a small antenna size and independent of the size of a frequency wave.
  • FIG. 10 is a block diagram illustrating a communication circuit 620 and an antenna structure 613 that form a communication device 610 of an electronic device according to various embodiments of the present invention.
  • an electronic device includes a communications device 610 to achieve a high data rate, wherein the communications device 610 is a very high frequency band (tens of GHz band, e.g., greater than or equal to 6 GHz, less than or equal to 300 GHz
  • a very high frequency band tens of GHz band, e.g., greater than or equal to 6 GHz, less than or equal to 300 GHz
  • An antenna structure 613 and a communication circuit 620 e.g., communication circuit 330 of FIG.
  • a circuit board e.g., circuit board 611 (e.g., PCB 350 of FIG. 3) included as part of a communication device according to various embodiments of the present invention has communication circuitry 620 disposed on one side,
  • the conductive plates 612 on the other side may form an antenna array (e.g., the first antenna array 340, or the second antenna array 345 of FIG. 3).
  • the circuit board 611 may further include another conductive plate (not shown) provided therein.
  • the conductive plates are electrically connected to the communication circuit 620 via a wiring path formed inside the circuit board 611 to transmit and receive radio waves.
  • the communication circuit 620 includes a phase shifter, each connected to the radiation conductor ,
  • the direction of the electronic device 101 can be controlled.
  • the communication circuit 620 may provide a phase difference feed to each of the conductive plates to cause the electronic device (e. G., The electronic device < (E.g., the antenna 101).
  • This phase difference feeding can be useful for securing an optimal communication environment or a good communication environment in a communication method having strong linearity, such as millimeter wave communication (for example, wireless communication using a frequency band of 6 GHz or more and 300 GHz or less).
  • the communication circuit 620 may be configured to have a first frequency between 6 GHz and 300 GHz
  • the communication circuit 620 electrically connected to the antenna array may be implemented in a communication device of a corresponding frequency band, provided that the electronic device supports a single band.
  • the communication circuit 620 may be implemented in a corresponding dual frequency band communication device if the electronic device supports a dual band (e.g., a 28 GHz frequency band and a 39 GHz frequency band).
  • a portion of communication circuitry 620 may be implemented as a communications device in a first frequency band (eg, a 28 GHz frequency band) and the remainder may be implemented as a communications device in a first-frequency band (eg, a 39 GHz frequency band) .
  • the communication circuit 620 may be mounted on a circuit board 611 in a ball grid array (BGA) or land grid array (LGA) .
  • a shielding member 622 may be mounted on one side of the circuit board 611.
  • the shielding member 622 may be attached to one surface of the circuit board 611 at least in a state of enclosing the communication circuit 620, thereby providing an electromagnetic shielding structure to other surrounding electronic components and the like.
  • lumped element (s) 621 such as resistive elements, inductive elements, or capacitive elements
  • the lumped element (s) And may be mounted on one surface of the main circuit board 611.
  • the lumped element (s) 621 may be received within the shielding member 622 together with a communication circuit 620.
  • FIG. 11 The structure and performance of the electromagnetic bandgap structure will be described with reference to FIGS. 11 to 17.
  • FIG. 11 The structure and performance of the electromagnetic bandgap structure will be described with reference to FIGS. 11 to 17.
  • FIG. 11 The structure and performance of the electromagnetic bandgap structure will be described with reference to FIGS. 11 to 17.
  • FIG. 11 The structure and performance of the electromagnetic bandgap structure will be described with reference to FIGS. 11 to 17.
  • FIG 11 is a perspective view illustrating the arrangement relationship of the electromagnetic bandgap structure 640 disposed in the conductive portion 601 of the electronic device according to one of various embodiments of the present invention.
  • Figure 12 is an enlarged view of a top view and an electromagnetic bandgap structure 640 as viewed from above of the structure of Figure 11, in accordance with one of various embodiments of the present invention.
  • the electronic device 101 includes a conductive portion 601, at least one feeding portion 601b, an antenna structure 613, and an electromagnetic band-gap structure ) ≪ / RTI >
  • the conductive portion 601, the antenna structure 613, and the electromagnetic band gap structure 640 of Figs. 11 and 12 are similar to the conductive portion 601, the antenna structure 613, and the electromagnetic bandgap structure 640 of Fig. Or all may be the same.
  • At least a portion of the conductive portion 601 may be provided as a radiator of the antenna through a second wireless communication circuit (e.g., the communication module 250 of FIG. 2).
  • a second wireless communication circuit e.g., the communication module 250 of FIG. 2.
  • at least one portion extending from the conductive portion 601 to the inside of the space may be provided as the feeding portion 601b.
  • another portion extending from the conductive portion 601 to the inside of the space may be provided as a ground 601c of the antenna.
  • the feeding part 601b and the ground 601c are formed of two spaced apart parts, but the present invention is not limited thereto.
  • the feeding part 601b and the ground part 601c may be formed of one or more than three pieces extending from the conductive part 601. [
  • a portion of the printed circuit board disposed in a space may include a conductive region, which may be utilized as a ground for the antenna have.
  • the radiator of the conductive portion 601 may be implemented in various forms such as a rod, a meanderline, a patch, or a microstrip.
  • the radiator may be electrically connected to the feeding unit 601b to transmit and receive high frequency signals in at least one frequency band.
  • the feeding unit 601b may be electrically connected to the radiator to supply a RF signal (radio frequency signal) by applying a signal current, or may receive another RF signal .
  • the electromagnetic band-gap structure 640 may be disposed on at least one side of the conductive portion 601.
  • the electromagnetic bandgap structure 640 may be integrally formed with the conductive portion 601, or may be manufactured as a separate structure from the conductive portion 601, and then bonded.
  • the electromagnetic bandgap structure 640 may be a mushroom type, a cross hair type, a swastika type ebg, or the like, when supporting a single band. , Or a hexagonal patch type (hexagonal patch type).
  • the electromagnetic band gap structure 640 when the electromagnetic band gap structure 640 supports a dual band, the electromagnetic band gap structure 640 may include a hexagonal patch with a double c type, a square patch with a a single disconnected loop type, or a fractal type.
  • Various shapes and transmission characteristics of the electromagnetic bandgap structure 640 can be found in the following references.
  • the electromagnetic bandgap structure 640 may include a periodic pattern of conductive patches 641 and a plurality of conductive vias 642. As another example, the electromagnetic bandgap structure 640 may further include an insulating layer 644 and a conductive film 645.
  • the mushroom type electromagnetic bandgap structure 640 may be a three-dimensional (3D) electromagnetic bandgap structure formed of a rigid patch provided with cylindrical vias (s).
  • the transfer reaction of the mushroom type electromagnetic bandgap structure 640 may vary depending on the size of the conductive patch (s), or the diameter of the via (s) and the spacing between the unit elements.
  • the transmission characteristics of the mushroom type electromagnetic bandgap structure may depend on the thickness of the substrate and substrate material provided.
  • the gap between unit elements can be made to be about 0.8 to 1.20 mm, the via diameter to about 0.15 to 0.25 mm, and the substrate thickness to about 0.8 to 1.20 mm.
  • the conductive patches 641 of the electromagnetic bandgap structure 640 may be disposed perpendicular to the first plate (e.g., the front plate 520 of FIG. 7).
  • the conductive patches 641 may be formed to face the space (for example, the space 603 in FIG. 9).
  • the conductive patches 641 may include a first signal of the first frequency band and a second signal of the second frequency, The interference of the second signal in the frequency band can be suppressed.
  • Each of the conductive vias 642 may be electrically connected between each of the conductive patches 641 and the conductive portion 601.
  • the conductive vias 642 may be grounded (formed with a conductive layer) through a conductive film.
  • the insulating layer 644 of the electromagnetic band gap structure 640 may be provided in a plurality of layers and may include a first insulating layer 644a and a second insulating layer 644b .
  • the first insulating layer 644a may be disposed between one of the conductive patches 641 and the conductive portion 601.
  • the first insulating layer 644a is formed in the space between the conductive patches 641 and the conductive portion 601 to support the conductive patches 641 and to form the conductive vias 642.
  • the second insulating layer 644b may be disposed on one surface of the conductive patches 641.
  • the second insulating layer 644b may physically block the conductive patches 641 from the outside.
  • the conductive film 645 of the electromagnetic bandgap structure 640 may be disposed between the first insulating layer 644a and the conductive portion 601 as an adhesive material.
  • the conductive film 645 may include an anisotropic conductive film.
  • the conductive film 645 may be used to couple an electromagnetic bandgap structure 640 formed of a separate structure to the conductive portion 601.
  • the conductive film 645 may couple the bandgap structure 640 to the conductive portion 601 and then provide heat to provide electrical ground and conductive vias 642.
  • the conductive film 645 provides electrical coupling between one side of the printed circuit board and the electromagnetic bandgap structure 640 .
  • FIG. 13 is a perspective view illustrating another embodiment of an electromagnetic bandgap structure 740 disposed in a conductive portion 701 of an electronic device, in accordance with one of various embodiments of the present invention.
  • an electronic device includes a conductive portion 701, at least one feeding portion 701b, an antenna structure 710, and an electromagnetic band-gap structure 740 can do.
  • the conductive portion 701, the antenna structure 710 and the electromagnetic bandgap structure 740 of FIG. 13 are similar to the conductive portion 601, the antenna structure 613, and the electromagnetic bandgap structure 640 of FIGS. 11 and 12, Or all may be the same. Hereinafter, differences from FIG. 11 and FIG. 12 will be described.
  • At least one portion extending from the conductive portion 701 into the space may include a feeding portion 701b (the other portion extending from the conductive portion serves as the ground) Available).
  • the feeding part 701b is formed of two spaced apart conductors, but is not limited thereto.
  • the feeding part 701b may be formed of one or more than three conductive parts extending from the conductive part 701.
  • the electromagnetic band-gap structure 740 may be disposed on at least one surface of the conductive portion 701 in a plurality.
  • the electromagnetic bandgap structure 740 may include a first electromagnetic bandgap structure 740a and a second electromagnetic bandgap structure 740b.
  • the first electromagnetic band gap structure 740a and the second electromagnetic band gap structure 740b may be spaced apart from each other and may be integrally formed with the conductive portion 701, And then bonded.
  • the first electromagnetic bandgap structure 740a includes a radiator (e.g., a portion of the conductive portion 701) of the second wireless communication circuit (e.g., wireless communication module 192 of Figure 1) As shown in FIG.
  • the second electromagnetic bandgap structure 740b may be disposed in parallel with the first electromagnetic bandgap structure 740a and may be disposed adjacent to the antenna structure 710.
  • the first electromagnetic bandgap structure 740a or the second electromagnetic bandgap structure 740b may be a mushroom type, a crosshair type a cross hair type, a swastika type ebg, or a hexagonal patch type.
  • a hexagonal patch including a double c type a patch with a double c type, a square patch with a single disconnected loop type, or a fractal type.
  • the electromagnetic bandgap structure 740 includes a periodic pattern of conductive patches and a plurality of conductive vias in the first conductive patch 741a, or the second conductive patch 741b .
  • the electromagnetic bandgap structure 740 may further include an insulating layer and a conductive film.
  • the conductive film may include an anisotropic conductive film.
  • FIG. 14 is a perspective view of another embodiment of an electromagnetic bandgap structure 840 disposed on a printed circuit board 811 of an electronic device, in accordance with one of various embodiments of the present invention.
  • an electronic device may include a printed circuit board 811, antenna structures 810, and an electromagnetic band-gap structure 840.
  • the antenna structure 810 and the electromagnetic bandgap structure 840 of Figure 14 may be partly or wholly identical to the antenna structure and electromagnetic bandgap structure 640 included in the communication device 610 of Figures 8-12 .
  • FIG. 11 and FIG. 12 differ from FIG. 11 and FIG. 12 will be described.
  • the electromagnetic band-gap structure 840 may be disposed on at least one side of the printed circuit board 811.
  • the electromagnetic bandgap structure 840 may be spaced apart from a conductive portion (e.g., the conductive portion 601 of FIG. 8) and may be formed integrally with the printed circuit board 811, And can be manufactured as a separate structure from the circuit board 811 and then combined.
  • the electromagnetic bandgap structure 840 includes a periodic pattern of conductive patches and a plurality of conductive vias in the first conductive patch 841a, or the second conductive patch 841b .
  • the electromagnetic bandgap structure 840 may further include an insulating layer and an anisotropic conductive film.
  • the electromagnetic bandgap structure 840 may be disposed adjacent to the antenna structure 810.
  • the electromagnetic bandgap structure 840 may be disposed in an upper region of the printed circuit board 811 (e.g., a bezel adjacent region of the electronic device).
  • the electromagnetic bandgap structure 840 can be freely designed to correspond to an electronic device internal structure.
  • the upper end portion 840a and the lower end portion 840b of the electromagnetic bandgap structure 840 may be formed in a different N * M arrangement ('N') than the first conductive patch 841a or the second conductive patch 841b, , And 'M' are natural numbers).
  • the upper end portion 840a may form an array of the first conductive patches 841a in the arrangement of 13x4 and the lower end portion 840b may form the array of the second conductive patches 841b in the 9x5 arrangement.
  • the antenna structure 810 may be disposed in multiple adjacent to the electromagnetic bandgap structure 840.
  • the antenna structure 810 may be disposed in the upper right area and the upper left area of the electronic device, with the electromagnetic bandgap structure 840 therebetween.
  • the present invention is not limited to this, and it may be arranged in the right lower region and / or the left lower region depending on the structure of the electronic device.
  • 15A and 15B are perspective views illustrating another embodiment of an electromagnetic bandgap structure 940 of an electronic device, in accordance with one of various embodiments of the present invention.
  • 15A shows an electromagnetic bandgap structure 940 disposed on a first area S1 of an interior structure 101 of an electronic device 101, according to one embodiment.
  • FIG. 15B shows an electromagnetic bandgap structure 940 disposed on the second internal structure S2 of the electronic device 101, according to one embodiment.
  • an electronic device e.g., electronic device 101 of FIG. 1 includes a first radiator 910 (e.g., conductive plates 612 of the communication device 610 of FIG. 8) 2 radiator 930 (a portion of the conductive portion 901), at least one feeding portion 901b, and an electromagnetic band-gap structure 940.
  • the first radiator 910, the second radiator 930, the conductive portion 901 and the electromagnetic band gap structure 940 shown in Figs. 15A and 15B are a part of the conductive portion 601 of Figs. 11 and 12, Some or all of the structure of the structure 613 and the electromagnetic bandgap structure 640 may be the same.
  • FIG. 11 and FIG. 12 will be described.
  • the electromagnetic band-gap structure 940 may be disposed in a region spaced apart from the conductive portion 901.
  • the electronic device further includes an inner structure 970 spaced apart from the conductive portion 901 and the first radiator 910, and the electromagnetic band gap structure 940 includes the inner structure 970, Lt; / RTI >
  • the internal structure 970 may include a bracket (e.g., a first support member 532 or a second support member 532 of FIG. 7) that includes a metal material formed on the space of the housing (e.g., the housing 510 of FIG. 8) (560).
  • the electromagnetic bandgap structure 940 may be disposed in a first region S1 (e.g., a top region) of the internal structure 970 of the electronic device.
  • the electromagnetic bandgap structure 940 disposed in the first region S1 suppresses the interference between the mutual antenna signals generated in the first radiator 910 disposed on one side and the second radiator 930 disposed on the other side .
  • the signal transmitted and / or received at the first radiator 910 may be a first signal having a first frequency between 6 GHz and 300 GHz, and the signal transmitted and / or received at the second radiator 930 may be And a second signal having a second frequency (e.g., 6 GHz or less) lower than the first frequency.
  • the electromagnetic bandgap structure 940 may be disposed in a second area S2 (e.g., a stop area) of the internal structure 970 of the electronic device.
  • the second region S2 may be a region closer to the center of the electronic device than the first region S1.
  • the electromagnetic bandgap structure 940 disposed in the second region S2 suppresses interference between the mutual antenna signals generated in the first radiator 910 disposed on one side and the second radiator 930 disposed on the other side .
  • the electromagnetic bandgap structure 940 can be disposed at various locations (e.g., at least a portion of the internal structure 970) on the interior space of the electronic device, so that the degree of freedom of design within the electronic device Can be improved.
  • the internal structure 970 may include a printed circuit board, and the electromagnetic band gap structure 940 may be electrically connected to the printed circuit board.
  • the electromagnetic bandgap structure 940 disposed on the internal structure 970 may be formed integrally with the internal structure 970 or may be manufactured and then bonded to a separate structure from the internal structure 970 .
  • the electromagnetic bandgap structure 940 may be a mushroom type, a cross hair type, a swastika type ebg, or the like, when supporting a single band. , Or a hexagonal patch type (hexagonal patch type).
  • the electromagnetic bandgap structure 940 may include a hexagonal patch with a double c type, a square patch with a double c type, a single disconnected loop type, or a fractal type.
  • the electromagnetic bandgap structure 940 may include a periodic pattern of conductive patches and a plurality of conductive vias.
  • the electromagnetic bandgap structure 940 may further include an insulating layer and an anisotropic conductive film.
  • the conductive vias and the insulating layer may be formed on the inside or on the surface when the printed circuit board is embodied as a multilayer circuit board.
  • Each of the conductive vias may be electrically connected between each of the conductive patches and the ground.
  • the conductive patches may be disposed parallel to the first plate (e.g., the front plate 520 of FIG. 7).
  • the conductive patches may be formed to face the first plate 520 or the second plate (e.g., the rear plate 580 of FIG. 7).
  • 16 is a graph illustrating return loss of a first antenna device according to various embodiments of the present invention.
  • 17 is a graph illustrating return loss of a second antenna device according to various embodiments of the present invention.
  • FIGS. 16 and 17 illustrate reflection losses depending on the frequency range for each antenna structure (for example, the first antenna device and the second antenna device).
  • the signal transmitted and / or received by the first antenna device may be a first signal having a first frequency between 6 GHz and 300 GHz, and a signal transmitted and / And a second signal having a lower second frequency.
  • the first antenna device may be a configuration including the first wireless communication circuit and the communication device of Figs. 1 to 10
  • the second antenna device may include a first wireless communication circuit and a second wireless communication circuit in Figs. And may include a radiator through a conductive portion.
  • the first antenna device may be designed to operate in the frequency band of approximately 26.5 to 29.5 GHz, which is approximately a pre-meter wave antenna.
  • Line A may refer to the degree of reduced coupling per frequency band of the first antenna device excluding the electromagnetic bandgap structure (e.g., electromagnetic bandgap structures 640, 740, 840, 940 of FIGS. 8 to 15B)
  • the bandgap structure may refer to a degree of reduced coupling for each frequency band of the first antenna device disposed adjacent to the first antenna device.
  • the first antenna device in which the electromagnetic bandgap structure is disposed adjacent thereto limits the coupling of the signal of the frequency band of the first antenna device to the signal band generated in the other structure due to the electromagnetic bandgap structure It is possible to prevent deterioration of antenna performance. For example, it can be seen that line B shows improved degraded coupling within a certain frequency range compared to line A.
  • the electromagnetic bandgap structure can produce a band stop in a frequency band of approximately 26.5 to 29.5 GHz, thereby stably designing an antenna structure targeting only a specific frequency range.
  • the electromagnetic bandgap structure can minimize the signal coupling occurring in the first antenna device and the second antenna device, while simultaneously improving the performance of the first antenna device itself (for example, gain and / Or directivity) in the range of 26.5-29.5 GHz.
  • the second antenna device is designed to operate in a frequency range of approximately 6 GHz or less.
  • Line C may refer to the return loss per frequency band of the second antenna device excluding the electromagnetic bandgap structure (e.g., the electromagnetic bandgap structures 640, 740, 840 and 940 of FIGS. 8 to 15B),
  • line D represents the electromagnetic bandgap structure May refer to the reflection loss by frequency band of the adjacent second antenna device.
  • the electromagnetic bandgap structure may not provide a negative effect on the second antenna device since it is electrically smaller than the shape of the antenna structures.
  • 18A and 18B are graphs showing the directivity of the first antenna device according to various embodiments of the present invention, with or without an electromagnetic bandgap structure.
  • 18A is a graph of the directivity of the first antenna device excluding the electromagnetic bandgap structure
  • FIG. 18B is a graph of the directivity of the first antenna device in which the electromagnetic bandgap structure is disposed adjacent to the first antenna device.
  • FIG. 19 is a graph illustrating realized gains of a first antenna device with and without an electromagnetic bandgap structure according to various embodiments of the present invention.
  • the signal transmitted and / or received in the first antenna device may be a first signal having a first frequency between 6 GHz and 300 GHz.
  • the directivity of the first antenna device in which the electromagnetic bandgap structure is disposed adjacent thereto is improved.
  • the first antenna except for the electromagnetic bandgap structure has a main lobe magnitude of about 13 dBi, but the first antenna with the electromagnetic bandgap structure disposed adjacent has a main lobe size of about 14.2 dBi.
  • the first antenna except for the electromagnetic bandgap structure has an angular width of about 33.5 deg
  • the first antenna with the electromagnetic bandgap structure disposed adjacent to the antenna has an angular width
  • the side lobe magnitude of the first antenna in which the electromagnetic bandgap structure is disposed is relatively smaller than that of the first antenna in which the electromagnetic bandgap structure is excluded.
  • Line E may mean the realization gain of the device of the first antenna except for the electromagnetic bandgap structure (e. G., Electromagnetic bandgap structures 640, 740, 840 and 940 of Figs. 8 to 15B), and line F may indicate that the electromagnetic bandgap structure is adjacent Which may mean the realization gain of the first antenna device disposed.
  • the electromagnetic bandgap structure e. G., Electromagnetic bandgap structures 640, 740, 840 and 940 of Figs. 8 to 15B
  • line F may exhibit a relatively high realization gain in most frequency bands versus line E.
  • the first antenna (line F) in which the magnetic bandgap structure is disposed adjacent to the first antenna (line F) has an electromagnetic band gap structure of about 1.5 to 2.0 dB Can be realized.
  • the electromagnetic bandgap structure can minimize the signal coupling occurring in the first antenna device and the second antenna device, while simultaneously improving the performance of the first antenna device itself (for example, gain and / Or < / RTI > directional) to provide a stop band in the range of 26.5 to 29.5 GHz.
  • An electronic device (e.g., electronic device 101 of FIG. 7) according to various embodiments of the present invention includes a first plate (e.g., front plate 520 of FIG. 7), a second (E.g., the back plate 580 of Fig. 7) and the side member (e.g., the side surface of Fig. 7) that surrounds the space (e.g., space 603 in Fig. 9) between the first plate and the second plate Bezel structure 531), the side member comprising a housing (e.g., housing 510 of FIG. 9) including an elongated conductive portion; A printed circuit board (e.g., the printed circuit board 611 of Fig.
  • the antenna structure comprising an array of conductive plates (e.g., conductive plates 612 of FIG. 9) formed within the printed circuit board or on the printed circuit board; A first wireless communication circuit electrically connected to the array of conductive plates and configured to transmit and / or receive a first signal having a first frequency in the range of 6 GHz to 300 GHz; To transmit and / or receive a second signal that is electrically coupled to a first point of the conductive portion (e.g., first point 601a in FIG.
  • a second wireless communication circuit e.g., wireless communication module 192 of FIG. 1
  • an electromagnetic band-gap structure e.g., electromagnetic band gap structure 640 of FIG. 8 located in the space, wherein a direction parallel to the conductive portion between the first point and the antenna structure
  • the electromagnetic bandgap structure may be formed of a metal.
  • the electromagnetic bandgap structure may be disposed on the conductive portion.
  • the electronic device further includes an inner structure (e.g., inner structure 970 of FIG. 15A) spaced from the conductive portion and the antenna structure, and the electromagnetic bandgap structure is disposed on the inner structure .
  • an inner structure e.g., inner structure 970 of FIG. 15A
  • the internal structure may include a main printed circuit board.
  • the second wireless communication circuit may be formed on the main printed circuit board.
  • the electromagnetic bandgap structure may include a periodic pattern of conductive patches (e.g., conductive patches 641 of FIG. 12); And a plurality of conductive vias (e.g., conductive vias 642 of FIG. 12), each of the plurality of conductive vias including a respective conductive patch and ground of the conductive patches Part 601).
  • the conductive patches may be arranged to be parallel or perpendicular to the first plate.
  • the electromagnetic bandgap structure further includes an insulating layer (e.g., insulating layer 644 of FIG. 12), and the vias may be formed through the insulating layer.
  • an insulating layer e.g., insulating layer 644 of FIG. 12
  • the electromagnetic bandgap structure may include an anisotropic conductive film (e.g., anisotropic conductive film 645 of FIG. 12) that forms the insulating layer and the vias.
  • anisotropic conductive film e.g., anisotropic conductive film 645 of FIG. 12
  • the display may further include a display exposed through at least a portion of the first plate.
  • An electronic device includes: a housing including a conductive portion; A printed circuit board disposed within the housing; A first antenna device for transmitting and / or receiving a first signal having a first frequency in the range of 6 GHz to 300 GHz through the array of conductive plates, the first antenna device including an array of conductive plates formed on or within the printed circuit board, ; A second antenna device electrically connected to the conductive portion and transmitting and / or receiving a second signal having a second frequency lower than the first frequency through at least a portion of the conductive portion; And an electromagnetic band-gap structure that is spaced apart from the first antenna device and the second antenna device and limits interference between the first signal of the first antenna and the second signal of the second antenna can do.
  • the electromagnetic bandgap structure may be disposed on at least one side of the conductive portion.
  • the electromagnetic bandgap structure being disposed on the internal structure.
  • the array of conductive plates may include a patch-type radiation conductor or a dipole-type radiation conductor.
  • the electromagnetic bandgap structure includes conductive patches that form a periodic pattern; And a plurality of conductive vias, each of the plurality of conductive vias being electrically connectable between a respective one of the conductive patches and the ground.
  • the electromagnetic bandgap structure further comprises an insulating layer, the insulating layer facing the first insulating layer and the first insulating layer with the conductive vias formed thereon, and the second insulating layer covering the conductive patches And an insulating layer.
  • the printed circuit board includes a main circuit board and an auxiliary circuit board connected to the main circuit board, and a processor (e.g., the processor 220 of FIG. 2) mounted on the main circuit board; A wireless transceiver (e.g., wireless transceiver 290 of FIG. 2) mounted on the main circuit board; And a wireless communication circuit mounted on the main circuit board or the auxiliary circuit board, wherein the wireless communication circuit receives at least a control signal from the processor and receives a communication signal from the wireless transceiver Can be provided.
  • a processor e.g., the processor 220 of FIG. 2
  • a wireless transceiver e.g., wireless transceiver 290 of FIG. 2
  • a wireless communication circuit mounted on the main circuit board or the auxiliary circuit board, wherein the wireless communication circuit receives at least a control signal from the processor and receives a communication signal from the wireless transceiver Can be provided.
  • An electronic device includes: a conductive portion for forming a part of a side member of the electronic device; And an electromagnetic band-gap structure electrically connected to at least a portion of the conductive portion.
  • the electromagnetic bandgap structure includes conductive patches forming a periodic pattern; A plurality of conductive vias disposed in each of the conductive patches in a vertical direction; And an insulating layer disposed facing the layer formed by the conductive patches.
  • the electromagnetic bandgap structure may further include an anisotropic conductive film disposed between the insulating layer and the conductive portion.
  • the electronic device comprises: a printed circuit board disposed within the housing; And an antenna device for transmitting and / or receiving a first signal having a frequency in the range of 6 GHz to 300 GHz through the array of conductive plates, the antenna device comprising an array of conductive plates formed within or on the surface of the printed circuit board can do.
  • the magnetic band gap structure may block a signal that is generated from the surrounding structure of the antenna device and causes interference of the first signal.

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  • Engineering & Computer Science (AREA)
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  • Computer Networks & Wireless Communication (AREA)
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  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente invention peut comprendre : un boîtier comprenant une première plaque, une seconde plaque orientée dans la direction opposée à la première plaque, et un élément latéral entourant l'espace entre la première plaque et la seconde plaque, l'élément latéral comprenant une partie conductrice allongée ; une structure d'antenne disposée dans l'espace tout en étant espacée de la partie conductrice, la structure d'antenne comprenant une carte de circuit imprimé et un réseau de plaques conductrices formées à l'intérieur de la carte de circuit imprimé ou sur la carte de circuit imprimé ; un premier circuit de communication sans fil électroconnecté au réseau de plaques conductrices et configuré pour émettre et/ou recevoir un premier signal ayant une première fréquence dans la plage de 6 GHz à 300 GHz ; un second circuit de communication sans fil connecté électriquement à un premier point de la partie conductrice et configuré pour émettre et/ou recevoir un second signal ayant une seconde fréquence qui est inférieure à la première fréquence ; et une structure de bande interdite électromagnétique positionnée dans l'espace, la structure de bande interdite électromagnétique étant agencée entre le premier point et la structure d'antenne dans une direction parallèle à la partie conductrice. D'autres modes de réalisation peuvent également être possibles.
PCT/KR2019/000012 2018-01-04 2019-01-02 Structure de bande interdite électromagnétique et dispositif électronique la comprenant WO2019135588A1 (fr)

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