WO2019129162A1 - Lampe à del - Google Patents

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Publication number
WO2019129162A1
WO2019129162A1 PCT/CN2018/124483 CN2018124483W WO2019129162A1 WO 2019129162 A1 WO2019129162 A1 WO 2019129162A1 CN 2018124483 W CN2018124483 W CN 2018124483W WO 2019129162 A1 WO2019129162 A1 WO 2019129162A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
led
led assembly
substrate
column member
Prior art date
Application number
PCT/CN2018/124483
Other languages
English (en)
Inventor
Guozhong Zhang
Lu DENG
Jinxiang Shen
Original Assignee
Zhejiang Shenghui Lighting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Shenghui Lighting Co., Ltd. filed Critical Zhejiang Shenghui Lighting Co., Ltd.
Publication of WO2019129162A1 publication Critical patent/WO2019129162A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present disclosure generally relates to the field of lighting technology and, more particularly, relates to an LED lamp having a bulb shape.
  • a Light Emitting Diode is a semiconductor solid-state light emitting device.
  • the LED uses a solid semiconductor chip as the light emitting material.
  • the carrier is recombined to release excess energy to cause photon emission, thereby achieving the light emission.
  • An LED bulb lamp is an energy-saving lighting tool, which uses an LED chip as the internal light source, and uses the bulb shape that people are used to as the appearance.
  • LED bulb lamps using LEDs as light sources on the market mostly use plastic bulbs, and a heat sink structure is disposed outside the plastic bulbs.
  • This arrangement of the heat sink allows large heat dissipation area but at the same time causes a great reduction to the light transmission area of the bulb.
  • the heat dissipation area of the heat sink is reduced, the overall heat dissipation effect of the LED bulb is difficult to meet the requirements.
  • the heat dissipation of existing LED bulb lamps mainly relies on the heat sink disposed outside the bulb to achieve the heat dissipation effect. While ensuring the overall heat dissipation effect, it is bound to lead to a reduction of the light emitting area of the bulb.
  • the present disclosure provides an LED bulb lamp to solve the technical problem of a reduction of the light emitting area of an existing bulb caused by a heat sink disposed outside the existing bulb.
  • the LED lamp includes a glass bulb shell, an LED assembly, a heat sink and a lamp head.
  • the LED assembly is configured to sleeve a first end of the heat sink, and the lamp head is configured to sleeve a second end of the heat sink.
  • the glass bulb shell covers the heat sink.
  • the LED assembly is located in a space formed in between the glass bulb shell and the heat sink. Heat generated by the LED assembly is transferred to the lamp head and the glass bulb shell through the heat sink when the LED assembly emits light.
  • the heat sink includes a heat sink member, and a connection member connected to the heat sink member.
  • the LED assembly is attached to an outer surface of the heat sink member.
  • a first end of the connection member is connected to the glass bulb shell, and a second end of the connection member is connected to the lamp head.
  • the heat sink member includes a column member, and a cylindrical member connected to the column member.
  • the cylindrical member is disposed between the connection member and the column member, and contacts the connection member and the column member respectively.
  • the LED assembly includes a substrate and an LED light source disposed on the substrate. The substrate is in contact with an outer surface of the column member, and heat generated by the LED light source is transferred to the column member through the substrate when the LED light source emits light.
  • the column member has a regular quadrangular prism structure, and an end surface of the column member away from the cylindrical member is square.
  • the substrate includes a first substrate having a plurality of edges, and a plurality of second substrates respectively perpendicularly connected to the plurality of edges of the first substrate.
  • the first substrate is attached to an end surface of the column member at the first end of the heat sink.
  • Each of the plurality of second substrates is attached to one side surface of the column member.
  • the first substrate is provided with M LED light sources, which are uniformly distributed along a center of the first substrate.
  • M is an integer greater than or equal to 1.
  • each of the second substrates is provided with N LED light sources, which are uniformly distributed along a length direction and a width direction of the second substrates.
  • N is an integer greater than or equal to 2.
  • the LED lamp further includes a driving circuit electrically connected to the LED assembly and configured to convert external alternating current into direct current, and to drive the LED assembly to emit light using the direct current.
  • a driving circuit electrically connected to the LED assembly and configured to convert external alternating current into direct current, and to drive the LED assembly to emit light using the direct current.
  • the second end of the heat sink includes a groove, and the driving circuit is disposed in the groove.
  • the heat sink is provided with a first electrical contact, which is electrically connected to an output terminal of the driving circuit.
  • a second electrical contact in contact with the first electrical contact is disposed on the LED assembly to transmit the direct current outputted by the driving circuit to the LED assembly.
  • the LED assembly is a color light emitting device configured to emit lights with different color temperatures when a voltage of the direct current outputted by the driving circuit is different.
  • a current input terminal of the LED assembly is electrically insulated from the heat sink.
  • the heat sink is made of metal.
  • the LED assembly and the lamp head are sleeved onto two ends of the heat sink respectively.
  • the glass bulb shell is sleeved on the outer side of the heat sink and the LED assembly, so that both the heat sink and the LED assembly are located inside the glass bulb shell.
  • the LED bulb lamp can achieve a qualified heat dissipation effect through the heat sink structure disposed inside, there is no need to provide an additional heat sink on the outer side of the bulb for heat dissipation, so that the entire glass bulb shell can emit light, which increases the light emitting area.
  • the light emitted by the LED assembly can achieve better illumination and texture effect after being refracted and scattered by the glass bulb shell.
  • FIG. 1 illustrates a structural diagram of an LED consistent with the disclosed embodiments
  • FIG. 2 illustrates an exploded view of the structure of the LED lamp shown in FIG. 1.
  • a process, a method, a system, a product, or a that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to such process, method, product, or device.
  • FIG. 1 is a structural diagram of an LED lamp having a bulb shape in one embodiment
  • FIG. 2 is an exploded view of the LED lamp shown in FIG. 1.
  • an LED lamp having a bulb shape may be referred as an LED bulb lamp.
  • an exemplary LED bulb lamp includes a glass bulb shell 1, an LED assembly 4, a heat sink 3 and a lamp head 2.
  • the LED assembly 4 is configured to sleeve a first end of the heat sink 3, and the lamp head 2 is configured to sleeve a second end of the heat sink 3.
  • the lamp head 2 and the heat sink 3 are in direct contact with each other, and the heat on the heat sink 3 can be transferred to the lamp head 2 by heat conduction.
  • the glass bulb shell 1 is wrapped around and covers the heat sink 3.
  • the LED assembly 4 is located in a space formed in between the glass bulb shell 1 and the heat sink 3. When the LED assembly 4 emits light, the light is refracted and scattered by the glass bulb shell 1 disposed outside the LED assembly 4, so that the LED bulb lamp emits light out uniformly.
  • the glass bulb shell 1 is in direct contact with the heat sink 3, and the heat on the heat sink 3 can be transferred to the glass bulb shell 1 by heat conduction.
  • the LED assembly 4 emits light
  • the LED assembly 4 generates heat due to the light emission, and heat can be transferred to the lamp head 2 and the glass bulb shell 1 through the heat sink 3.
  • the lamp head 2 is also in direct contact with the glass bulb shell 1, so the heat on the glass bulb shell 1 can be further transferred to the lamp head 2, thereby achieving a more effective heat dissipation effect.
  • the LED assembly and the lamp head are respectively sleeved on two ends of the heat sink, and the integral glass bulb shell is sleeved on the outer side of the heat sink, so that the heat sink and the LED assembly are located inside the glass bulb shell.
  • the LED assembly emits light
  • the generated heat is transferred to the lamp head and the glass bulb shell through the heat sink, which greatly increases the heat dissipation area to achieve good heat dissipation effect.
  • the disclosed LED bulb lamp can achieve a qualified heat dissipation effect through the heat sink structure disposed inside, there is no need to provide an additional heat sink on the outer side of the lamp for heat dissipation.
  • the heat dissipation structure is not visible from the appearance, so that the light can be emitted out from the whole glass bulb shell, thereby increasing the light emitting area.
  • the bulb shell is made of glass, the light emitted by the LED assembly can achieve better illumination and texture effect after being refracted and scattered by the glass bulb shell.
  • the heat sink 3 may include a heat sink member and a connection member 31 connected to and in contact with the heat sink member.
  • the heat sink member and the connection member 31 may be connected after being manufactured separately, or may be directly formed by integral molding.
  • the shape and the formation process of the heat sink member and the connection member 31 are not specifically limited.
  • the heat sink member is configured to ensure that the heat dissipation effect meets the requirements, so that the LED bulb lamp can achieve effective heat dissipation.
  • connection member 31 is configured to ensure a reliable connection between the lamp head 2 and the heat sink 3, and a reliable connection between the heat sink 3 and the glass bulb shell 1 (e.g., with a structure compatible with the edge portion of the lamp head 2 and/or the edge portion of the glass bulb shell 1) .
  • a cross-section area of the connection member 31 is slightly greater than a cross-section area of the heat sink member so that the glass bulb shell can cover the heat sink member and contact and connect to the connection member 31.
  • LED bulb lamps of different powers have great differences in heat generation when the LED bulb lamps emit light. Therefore, when selecting the material of the heat sink 3, it is also necessary to consider the heat dissipation requirements of the specific LED bulb lamps.
  • materials with higher thermal conductivity can be selected as the material of the heat sink 3.
  • materials with lower thermal conductivity can be selected as the material of heat sinks for cost saving.
  • the material of the heat sink 3 may be metal, such as copper, aluminum, silver, or the like.
  • the heat sink may be integrally formed or welded by splicing. It should be noted that, the material and the specific molding method of the heat sink 3 are not specifically limited herein, but only need to ensure different heat dissipation requirements of different LED bulb lamps.
  • the LED assembly 4 is disposed on the part or all of the outer surface of the heat sink member.
  • the LED assembly 4 contacts (e.g., is attached to) the outer surface of the heat sink member, so that the heat generated by the LED assembly 4 can be effectively transferred to the heat sink member when the LED assembly 4 is emitting light.
  • connection member 31 includes two ends. A first end of the connection member 31 near the LED assembly 4 is connected to the glass bulb shell 1 (e.g., at the edge) , and a second end of the connection member 31 away from the LED assembly 4 is connected to the lamp head 2 (e.g., at the edge) .
  • first end of the connection member 31 may be detachably connected with the edge of the glass bulb shell 1, such as by screw connection or snap connection.
  • second end of the connection member may be detachably connected with the edge of the lamp head 2, such as by screw connection or snap connection.
  • the LED assembly 4 is usually fabricated into a planar structure, that is, the LED assembly 4 includes a substrate and an LED light source disposed on the substrate.
  • the heat sink member may be designed to include a column member 33 and a cylindrical member 32 connected to the column member 33.
  • the cylindrical member 32 is disposed between the connection member and the column member 33.
  • the column member 33 and the cylindrical member 32 may be connected after being manufactured separately, or may be directly formed by integral molding.
  • the process of forming the column member 33 and the cylindrical member 32 is not specially limited.
  • the LED assembly 4 may be fabricated in other shapes, such as a cylindrical shape if the process conditions permit.
  • the heat sink member may be designed in a cylindrical shape that matches the shape of the LED assembly 4. It should be noted that, the shapes of the LED assembly and the heat sink member are not specifically limited except only that the LED assembly and the heat sink member are ensured to be compatible with each other.
  • the side surfaces and the end surface of the column member 33 are all flat, they can be closely adhered to the substrate of the LED assembly 4. According to the specific heat dissipation requirements, an appropriate amount of thermal conductive glue can be added between the LED assembly 4 and the column member 33. Since the side surfaces and the end surface of the column member 33 closely fit with the substrate of the LED assembly 4, the generated heat from the LED assembly 4 can be more efficiently transferred to the column member 33 through the substrate during light emission.
  • the column member 33 is a rectangular column.
  • the substrates of LED assembly 4 can be disposed on and attached to four side surfaces and one end surface (e.g., the end surface facing toward the glass bulb shell 1 at the first end of the heat sink 3) of the column member 33.
  • the column member 33 is a hexagonal column, and the substrates of LED assembly 4 can be disposed on and attached to six side surfaces and one end surface of the column member 33.
  • the area (or length and width) of an LED substrate attached to the end surface of the column member 33 is substantially the same or a little smaller than the area (or length and width) of the end surface of the column member 33.
  • the area (or length and width) of an LED substrate attached to a side surface of the column member 33 is substantially the same or a little smaller than the area (or length and width) of the corresponding side surface of the column member 33.
  • the manufacture of the abnormally shaped heat sink can be avoided under the premise of ensuring the overall heat dissipation effect.
  • both the side surfaces and the end surface of the column member 33 are planar structures, the flat type LED substrates can be directly used, and the manufacturing and patching cost of the flat type LED substrates is low.
  • the connection between the column member 33 and the LED substrate are closer, and the configuration of the cylindrical member 32 can maximize the heat dissipation surface area of the heat sink member to enhance the heat dissipation effect.
  • the LED assembly 4 is only disposed on the column member 33 but not the cylindrical member 32.
  • One end of the column member 33 can be the first end of the entire heat sink 3 and may be disposed with LED light assembly 4.
  • the other end of the column member 33 contacts the cylindrical member 32, and the column member 33 and the cylindrical member 32 together forms the heat sink member of the heat sink 3.
  • the column member 33 described above may be designed as a structure of a regular polygon column, such as a quadrangular prism.
  • the end surface of the column member 33 away from the cylindrical member 32 may have a regular polygon shape, such as a square, an equilateral triangle, a regular pentagon, etc.
  • the number of edges of the end surface of the column member 33 is the same as the number of side surfaces of the column member 33. Each side surface is perpendicular to the end surface.
  • each side surfaces of the column member 33 have the same shape and area, the light intensity emitted from the side surfaces of the column member 33 can be the same if same number of LED light sources configured with same brightness are disposed on each side surface of the column member 33 in a same or similar manner.
  • the light emitted from the glass bulb shell 1 becomes more uniform, so that the illumination brightness of the space in which the LED bulb is located is more uniform.
  • the substrate on the LED assembly 4 can be designed to include a first substrate and second substrates.
  • Each second substrates is respectively perpendicularly connected to each edge of the first substrate.
  • the first substrate is in contact with the end surface of the column member 33, the end surface facing away from the cylindrical member 32 (e.g., at the first end of the heat sink 3) , and the multiple second substrates are respectively in contact with the multiple side surfaces of the column member 33.
  • the LED light source e.g., LED chips
  • the LED light sources on the first substrate and the second substrate may be arranged according to the following rules.
  • the corresponding LED assembly 4 may correspondingly include a first substrate having a similar size as the end surface of the column member 33 and four second substrates each having a similar size as each side surface of the column member 33.
  • the first substrate is in contact with the end surface of the column member 33 away from the cylindrical member 32. That is, the surface of the first substrate on which the LED light source can be disposed is square.
  • the M LED light sources are uniformly distributed along the center of such square (e.g., with even spacings, that is, the distance between each LED light source and the center of the square is the same) .
  • M is an integer greater than or equal to 1.
  • the LED light source may be directly disposed at the center of the square. If two LED light sources are disposed on the first substrate, the two LED light sources may be respectively disposed at positions with equal distances from the center of the square. For the convenience of manufacturing and aesthetics, in practical implementations, the two LED light sources can be symmetrically disposed along the center of the square and perpendicular to the symmetrical axis of one side of the squares on either side of the center of the square. If three LED light sources are disposed on the first substrate, the three LED light sources may be respectively disposed at positions with equal distances from the center of the square. The angle formed by any of two LED light sources and the centerline of the square is 120 degrees.
  • the four second substrates are respectively attached to the four side surfaces of the column member 33.
  • N is an integer greater than or equal to 2
  • the N LED light sources are uniformly distributed along the length direction and the width direction of the second substrate.
  • two neighboring LED light sources are disposed either on a same row or a same column.
  • the spacing between each row is the same, and the spacing between each column is the same.
  • the LED light sources may be arranged in two rows and two rows equidistantly, and if six LED light sources are disposed on the second substrate, the LED light sources are arranged equidistant in two rows and three columns or three rows and two columns.
  • the rule for arranging the LED light sources is not specifically limited, and only the light emitted from each surface of the LED assembly 4 is ensured to be uniform.
  • the second end of the heat sink 3 may further include a groove or an opening.
  • a driving circuit 5 is disposed in the groove or can be inserted into an inner hollow space of the heat sink 3 through the opening.
  • the driving circuit 5 is electrically connected to the LED assembly 4.
  • the driving circuit 5 converts external alternating current into direct current, and drives the LED assembly to emit light by direct current.
  • the driving circuit 5 may include a rectifying module, which may be any circuit structure capable of realizing alternating current rectification in the field.
  • the rectifying module may be a rectifier bridge composed of diodes.
  • the output side of the rectifier module can be connected in parallel with a first capacitor for voltage regulation, and the input side of the rectifier module can also be connected in parallel with a second capacitor for voltage regulation.
  • the driving circuit 5 may include a DC driving module, which may be any circuit structure capable of realizing DC driving in the field. While the circuit is being driven, the voltage of the input LED assembly 4 can be further regulated, and the voltage value and/or the current value can be adjusted accordingly, so that the LED assembly 4 satisfies the corresponding lighting requirements.
  • the DC drive module can be a linear regulator circuit or a switching regulator circuit. If the regulated driving circuit is a switching regulator circuit, the regulated driving circuit may include one of the following: a buck converter circuit, a switching DC boost circuit, and a flyback conversion circuit. If the buck converter circuit is used, the output voltage is lower than the input voltage, and the output current is continuous.
  • a first electrical contact may be disposed on the heat sink 3, and the first electrical contact is electrically connected to the output terminal of the driving circuit 5.
  • a second electrical contact is disposed on the LED assembly 4. The first electrical contact is in contact with the second electrical contact to form a current loop, so that the driving circuit 5 transmit the current output to the LED assembly 4 to make the LED assembly 4 to emit light.
  • the current input terminal of the LED assembly 4 can be electrically insulated from the heat sink 3 to further improve the safety of the driving circuit.
  • the LED bulb lamp may use a white light source.
  • a color LED light source can be selected as the light emitting source of the LED assembly 4.
  • the LED assembly 4 emits lights with different color temperatures.
  • the color LED light source adopts LED lamp bead chips of four basic colors including white (e.g., various white lights such as cool white and warm white) , red, green, blue (R, G, B) . These lamp bead chips are packaged in various forms.
  • Each set of colors can be used independently, and be separately connected to the driving circuit 5 and/or a single chip microcomputer (e.g., disposed on a same substrate/board as the driving circuit 5 and configured to send control signals to the driving circuit 5 to adjust the brightness and color of the lighting sources according to predetermined program or user instruction) .
  • a user can adjust the brightness of the four-color lamp bead chips of white, red, green and blue (R, G, B) through the remote control (e.g., using antenna configured in the LED bulb lamp and connected to the single chip microcomputer) or the wired connection button on the lamp.
  • LED lamp bead chips of red, green and blue can also be controlled to adjust the light color to almost any visible color that human eyes can perceive according to the principle of optical three primary colors. It should be noted that the color of the light source of the LED bulb lamp and the manner of color change are not specifically limited in the embodiment.
  • the LED assembly and the lamp head are sleeved on two ends of the heat sink respectively.
  • the glass bulb shell is sleeved on the outer side of the heat sink, so that both the heat sink and the LED assembly are located in the glass bulb shell.
  • the LED bulb lamp can achieve a qualified heat dissipation effect through the heat sink structure disposed inside, there is no need to provide an additional heat sink on the outer side of the bulb for heat dissipation, so that the entire glass bulb shell can emit light, which increases the light emitting area.
  • the glass bulb shell is used in the embodiment, the light emitted by the LED assembly can achieve better illumination and texture effect after being refracted and scattered by the glass bulb shell.
  • connection may be a fixed connection, a detachable connection, or an integral connection.
  • the connection can also be a mechanical connection, an electrical connection or a communication with each other.
  • the connection can be a direct connection or an indirect connection through an intermediate medium.
  • the connection can make the internal connection of two components or the interaction of two components.
  • the first feature "on” or “under” the second feature may means the direct contact of the first and second features, and may also means that the first and second features are not in direct contact, but are contacted by additional features between them.
  • the first feature "above” the second feature may mean that the first feature directly above and obliquely above the second feature, or merely means that the first feature level is higher than the second feature.
  • the first feature “below” , “below” and “below” the second feature may mean the first feature directly below and obliquely below the second feature, or merely means that the first feature level is less than the second feature.

Abstract

Une lampe à DEL ayant une forme d'ampoule comprend une enveloppe en verre (1), un ensemble DEL (4), un dissipateur thermique (3) et une tête de lampe (2). L'ensemble DEL (4) est conçu pour s'emmancher sur une première extrémité du dissipateur thermique (3), et la tête de lampe (2) est conçue pour s'emmancher sur une seconde extrémité du dissipateur thermique (3). L'enveloppe en verre d'ampoule (1) recouvre le dissipateur thermique (3). L'ensemble DEL (4) est situé dans un espace formé entre l'enveloppe en verre d'ampoule (1) et le dissipateur thermique (3). La chaleur générée par l'ensemble DEL (4) est transférée à la tête de lampe (2) et à l'enveloppe en verre d'ampoule (1) par le dissipateur thermique (3) lorsque l'ensemble DEL (4) émet de la lumière.
PCT/CN2018/124483 2017-12-29 2018-12-27 Lampe à del WO2019129162A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711486531.6 2017-12-29
CN201711486531.6A CN108119787A (zh) 2017-12-29 2017-12-29 Led球泡灯

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WO2019129162A1 true WO2019129162A1 (fr) 2019-07-04

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Publication number Priority date Publication date Assignee Title
CN108119787A (zh) * 2017-12-29 2018-06-05 浙江生辉照明有限公司 Led球泡灯

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EP2937624A1 (fr) * 2012-11-01 2015-10-28 Iwasaki Electric Co., Ltd Lampe à del
CN108119787A (zh) * 2017-12-29 2018-06-05 浙江生辉照明有限公司 Led球泡灯
CN207880494U (zh) * 2017-12-29 2018-09-18 浙江生辉照明有限公司 Led球泡灯

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