WO2019113751A1 - Oled薄膜封装结构及显示模组 - Google Patents

Oled薄膜封装结构及显示模组 Download PDF

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Publication number
WO2019113751A1
WO2019113751A1 PCT/CN2017/115495 CN2017115495W WO2019113751A1 WO 2019113751 A1 WO2019113751 A1 WO 2019113751A1 CN 2017115495 W CN2017115495 W CN 2017115495W WO 2019113751 A1 WO2019113751 A1 WO 2019113751A1
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film layer
oled
inorganic
organic
package structure
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French (fr)
Inventor
陈秉宏
林盈妃
吴思宗
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to PCT/CN2017/115495 priority Critical patent/WO2019113751A1/zh
Priority to CN201780096981.6A priority patent/CN111357114B/zh
Publication of WO2019113751A1 publication Critical patent/WO2019113751A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present invention relates to a display device, and more particularly to an OLED film package structure and a display module.
  • OLED film (OLED, ie Organic) Light-Emitting Diode, also known as organic light-emitting diode (also known as organic electro-laser display, organic light-emitting semiconductor) is packaged in a traditional process, and is sandwiched between two layers of inorganic substances (Ink: ink). Ink is mainly to absorb the stress during the subsequent bending process.
  • the coating process of Ink is mostly processed by the inkjet method of IJP (IJP: Inkjet Printing Technology), but the Ink after inkjet needs to be planarized, and in the process of planarization, Ink may overflow to the periphery of the panel.
  • IJP Inkjet Printing Technology
  • Bank Blocking Structure
  • OCR Optical Clear Resin
  • OCA Optically Clear
  • the technical problem to be solved by the present invention is to provide a display module and an OLED film package structure which can avoid the outward overflow during the planarization process when the organic film layer is formed.
  • the technical solution adopted by the present invention to solve the technical problem thereof is to construct an OLED thin film encapsulation structure, which comprises an array film layer, an OLED film layer, a first inorganic film layer, an organic film layer, and a plurality of layers which are sequentially stacked. Two inorganic film layers;
  • the array film layer is provided with a concave isolation groove along the outer ring of the organic film layer on a side of the outer layer of the organic film layer and opposite to the first inorganic film layer to prevent formation
  • the ink of the organic film layer overflows to the outer circumference of the isolation groove.
  • a projection range of the OLED film layer to a plane of the array film layer is within a projection range of the first inorganic film layer, the array film layer to a plane of the array film layer, and the first inorganic film
  • the layer, the array film layer is in a region of the outer ring of the OLED film layer to coat the OLED film layer.
  • a projection range of the organic film layer to a plane of the array film layer is within a projection range of the plane of the first inorganic film layer and the second inorganic film layer to the array film layer, the first The inorganic film layer and the second inorganic film layer are coated in the region of the outer ring of the organic film layer.
  • the isolation trench comprises at least one trench disposed along a circumference of the organic film layer.
  • the isolation trench comprises a grid-like trench disposed along a circumference of the organic film layer.
  • a projection range of the organic film layer to a plane of the array film layer is within a projection range of the isolation trench to a plane of the array film layer.
  • the second inorganic film layer smoothly transitions from a region corresponding to the isolation trench to a region corresponding to the second inorganic film layer and the organic film layer.
  • the second inorganic film layer transitions from a region corresponding to the isolation trench to a curved surface or a slope between the second inorganic film layer and a region corresponding to the organic film layer.
  • the isolation trench is formed by etching.
  • the cross-sectional shape of the groove is a combination of one or more of a semicircular shape, a V shape, a U shape, and a zigzag shape.
  • the first inorganic film layer and the second inorganic film layer are formed by vapor deposition.
  • the material of the first inorganic film layer and the second inorganic film layer is a combination of one or more of silicon oxide, silicon nitride, and silicon oxynitride.
  • the array film layer comprises an organic photoresist.
  • the side of the array film layer opposite to the OLED is attached to the flexible substrate.
  • the side of the second inorganic film layer opposite to the organic film layer is provided with an optical glue.
  • the invention also constructs a display module comprising the OLED film package structure.
  • the display module and the OLED thin film encapsulation structure of the invention have the following beneficial effects: the OLED film encapsulation structure separates the organic film layer from the outer ring, and the ink after ink ejection needs to be planarized, and the process of planarization, if the ink When it overflows outward, it will flow into the isolation groove first to avoid flowing out of the isolation groove, and prevent the ink ejected from overflowing when the organic film layer is formed by inkjet.
  • FIG. 1 is a partial cross-sectional view showing an OLED film package structure in an embodiment of the present invention.
  • a display module 100 in a preferred embodiment of the present invention includes an OLED thin film package structure 10 for encapsulating an OLED film.
  • the OLED thin film package structure 10 includes an array film layer 1, an OLED film layer 2, a first inorganic film layer 3, an organic film layer 4, and a second inorganic film layer 5 which are laminated in this order from bottom to top.
  • the array film layer 1 usually includes a driving element, a TFT, an insulating layer, a metal line, an organic photoresist, an inorganic photoresist, and the like.
  • the arrangement is determined according to a corresponding design, and may not be limited herein.
  • the array film layer is regularly formed on the glass substrate 6 as a TFT device, a pixel or the like, and functions as a control signal to generate a corresponding current and voltage.
  • the OLED film layer 2 is attached to the array film layer 1, and the OLED film layer functions to emit light.
  • the material of the first inorganic film layer 3 and the second inorganic film layer 5 may be a combination of one or more of silicon oxide, silicon nitride, and silicon oxynitride, and is usually formed by vapor deposition.
  • the organic film layer 4 is an organic ink. After the first inorganic film layer 3 is formed, it is formed on the outside of the first inorganic film layer 3 by spraying, and the second inorganic film layer 5 is formed on the outside of the organic film layer 4. form.
  • the array film layer 1 is provided with a concave isolation groove 11 along the outer ring of the organic film layer 4 on the outer surface of the organic film layer 4 and opposite to the first inorganic film layer 3, and the first inorganic film layer 3 is formed. Thereafter, it is in contact with the exposed organic photoresist in the isolation trench 11 and the OLED film layer 2.
  • the isolation trench 11 can still isolate the organic film layer 4 from the outer ring to prevent the ink discharged to the outer periphery of the isolation trench 11 when the organic film layer 4 is formed by inkjet. overflow.
  • the ink after ink ejection needs to be flattened, and flattening is a process of keeping the surface of the ink flat and flat.
  • the flattening of the ink mainly uses the method of static advection to let the ink flow naturally. During the leveling process, the excess ink will flow to the outer ring of the organic film layer 4.
  • the ink first flows into the isolation trench 11 when it overflows outward, and does not flow outside the isolation trench 11.
  • the projection range of the plane of the OLED film layer 2 to the plane of the array film layer 1 is within the projection range of the plane of the first inorganic film layer 3, the array film layer 1 to the array film layer 1, first The inorganic film layer 3 and the array film layer 1 are covered in the outer ring of the OLED film layer 2 to coat the OLED film layer 2, so that the OLED film layer 2 is sealed by the array film layer 1 and the first inorganic film layer 3.
  • the OLED film layer 2 is located in the closed loop formed by the isolation trenches 11. In other embodiments, the OLED film layer 2 may also cover the loop formed by the isolation trenches 11.
  • the projection range of the plane from the organic film layer 4 to the array film layer 1 is within the projection range of the plane of the first inorganic film layer 3, the second inorganic film layer 5 to the array film layer 1, the first inorganic film layer 3, the second inorganic layer
  • the film layer 5 is placed in the outer ring of the organic film layer 4 to coat the organic film layer 4, and the organic film layer 4 is sealed by the first inorganic film layer 3 and the second inorganic film layer 5.
  • the projection range of the plane from the organic film layer 4 to the array film layer 1 is within the projection range of the plane of the isolation trench 11 to the array film layer 1, in which case the organic film layer 4 does not overflow to the isolation. Outside the circle of the slot 11.
  • a partial region may be disposed outside the loop formed by the isolation trench 11, or the circumference of the organic film layer 4 may be disposed outside the loop formed by the isolation trench 11.
  • the isolation trench 11 includes a trench disposed along the circumference of the organic film layer 4 to block ink spillage. In other embodiments, the isolation trench 11 includes two turns and two or more trenches disposed along the circumference of the organic film layer 4. When the ink overflows the innermost trench, the outer ring has other grooves to be used for the ink. Block.
  • the isolation trench 11 may also include a grid-like trench disposed along the circumference of the organic film layer 4, and the grid-like trench is formed by a plurality of trenches disposed on the circumference of the organic film layer 4 and crossing each other to increase ink overflow.
  • the space for accommodating the ink can be increased.
  • the overflowed ink can be accommodated in the isolation groove 11 as much as possible to prevent the ink from overflowing the isolation groove 11.
  • the depth and width of the groove can be unrestricted, and the effect of blocking the ink overflow can be achieved.
  • the cross-sectional shape can be semicircular, V-shaped, U-shaped, zigzag, etc., or a combination of various shapes, serrated
  • the grooved section of the groove can form a multilayer barrier to prevent ink from overflowing.
  • the isolation grooves 11 may be a combination of grooves of other outer shapes, and after being connected to each other, a closed isolation groove 11 is formed outside the organic film layer 4.
  • the isolation trench 11 is formed by etching in the embodiment, is easy to process, and is easy to control the shape and depth. In other embodiments, the isolation trench 11 can also be formed by pressing.
  • the first inorganic film layer 3 is formed by vapor deposition, and the position corresponding to the isolation trench 11 covers the isolation trench 11 and is in contact with the exposed organic photoresist in the isolation trench 11 but does not The isolation trench 11 is filled and can flow into the isolation trench 11 when the ink flattening level overflows.
  • the second inorganic film layer 5 is formed by vapor deposition, covering the organic film layer 4 and the first inorganic film layer 3 located on the outer ring of the organic film layer 4.
  • the position of the second inorganic film layer 5 corresponding to the isolation groove 11 covers the ink in the isolation groove 11 and the first inorganic film layer 3, and the overflowed ink is enclosed in the isolation groove 11.
  • the side of the array film layer 1 opposite to the OLED film layer 2 is attached to the flexible substrate 6, and the display module 100 can be bent.
  • the organic film layer 4 mainly absorbs the stress during the subsequent bending process.
  • the side of the second inorganic film layer 5 opposite to the organic film layer 4 is provided with an optical glue 7. Since the outer ring of the organic film layer 4 has no convex structure, the flow of the optical glue 7 is not affected, and the subsequent touch panel 8 is easily attached. Go to the optical glue 7.
  • the second inorganic film layer 5 smoothly transitions from the region corresponding to the isolation trench 11 to the region corresponding to the second inorganic film layer 5 and the organic film layer 4, so that the flow of the optical adhesive 7 is smoother, which facilitates the flow of the optical adhesive 7 level.
  • the second inorganic film layer 5 has a curved surface transition or a slope transition between the region corresponding to the isolation trench 11 and the region corresponding to the second inorganic film layer 5 and the organic film layer 4.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示模组（100）及OLED薄膜封装结构（10），OLED薄膜封装结构（10），包括依次层叠设置的阵列膜层（1）、OLED膜层（2）、第一无机膜层（3）、有机膜层（4）、以及第二无机膜层（5）。阵列膜层（1）在位于有机膜层（4）外圈区域、且与第一无机膜层（3）相对的一侧上沿有机膜层（4）外圈设有内凹的隔离槽（11），喷墨后的油墨需要进行平坦化，而平坦化的过程，若油墨在向外溢出时，会流到隔离槽（11）内，防止喷墨形成有机膜层（4）时，喷出的油墨向外溢出。

Description

OLED薄膜封装结构及显示模组 技术领域
本发明涉及显示装置，更具体地说，涉及一种OLED薄膜封装结构及显示模组。
 背景技术
OLED薄膜（OLED，即Organic Light-Emitting Diode, 称为有机发光二极管，又称为有机电激光显示、有机发光半导体）封装于传统工艺过程中，多由二层无机物中间夹一层有机物(Ink：油墨)，而当中的Ink主要在于吸收后续弯曲过程中的应力。
Ink的涂布工艺多采用IJP（IJP：喷墨打印技术）的喷墨方式加工，但是喷墨后的Ink需要进行平坦化，而平坦化的过程，Ink会发生向面板外围溢流的情况。
现有防止Ink溢流是在面板上设置Bank（Bank：阻挡结构），以防止Ink溢流至其他区域。
因为在面板周边增设了Bank（约2um高度），在后续TP（Touch Panel，触摸板）贴合时，将会影响OCR/OCA光学胶（OCR：Optical Clear Resin，光学透明树脂；OCA：Optically Clear Adhesive，固态透明光学胶）的流动。
 技术问题
本发明要解决的技术问题在于，提供一种可避免有机膜层形成时在平坦化过程中向外溢出的显示模组及OLED薄膜封装结构。
 技术解决方案
本发明解决其技术问题所采用的技术方案是：构造一种OLED薄膜封装结构，其特征在于，包括依次层叠设置的阵列膜层、OLED膜层、第一无机膜层、有机膜层、以及第二无机膜层；
所述阵列膜层在位于所述有机膜层外圈区域、且与所述第一无机膜层相对的一侧上沿所述有机膜层外圈设有内凹的隔离槽，以防止形成所述有机膜层的油墨向所述隔离槽外圈溢出。
优选地，所述OLED膜层到所述阵列膜层所在平面的投影范围在所述第一无机膜层、阵列膜层到所述阵列膜层所在平面的投影范围内，所述第一无机膜层、所述阵列膜层位于所述OLED膜层外圈的区域将所述OLED膜层包覆。
优选地，所述有机膜层到所述阵列膜层所在平面的投影范围在所述第一无机膜层、第二无机膜层到所述阵列膜层所在平面的投影范围内，所述第一无机膜层、第二无机膜层位于所述有机膜层外圈的区域将所述有机膜层包覆。
优选地，所述隔离槽包括沿所述有机膜层周圈设置的至少一圈沟槽。
优选地，所述隔离槽包括沿所述有机膜层周圈设置的网格状沟槽。
优选地，所述有机膜层到所述阵列膜层所在平面的投影范围在所述隔离槽到所述阵列膜层所在平面的投影范围内。
优选地，所述第二无机膜层与所述隔离槽对应的区域到所述第二无机膜层与所述有机膜层对应的区域之间平滑过渡。
优选地，所述第二无机膜层与所述隔离槽对应的区域到所述第二无机膜层与所述有机膜层对应的区域之间弧面或斜面过渡。
优选地，所述隔离槽采用蚀刻形成。
优选地，所述沟槽的断面形状为半圆形、V形、U形、锯齿状中的一种或多种的组合。
优选地，所述第一无机膜层、第二无机膜层采用气相沉积的方式形成。
优选地，所述第一无机膜层、第二无机膜层的材质为氧化硅、氮化硅、氮氧化硅中的一种或多种的组合。
优选地，所述阵列膜层包括有机光阻。
优选地，所述阵列膜层与所述OLED相背的一侧贴合在柔性基板上。
优选地，所述第二无机膜层与所述有机膜层相背的一侧设有光学胶。
本发明还构造一种显示模组，包括所述的OLED薄膜封装结构。
 有益效果
实施本发明的显示模组及OLED薄膜封装结构，具有以下有益效果：OLED薄膜封装结构将有机膜层与外圈隔离开，喷墨后的油墨需要进行平坦化，而平坦化的过程，若油墨在向外溢出时，会先流到隔离槽内，避免流到隔离槽外，防止喷墨形成有机膜层时，喷出的油墨向外溢出。
 附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是本发明实施例中的OLED薄膜封装结构的局部剖面示意图。
 本发明的最佳实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
如图1所示，本发明一个优选实施例中的显示模组100包括对OLED薄膜封装的OLED薄膜封装结构10。
在本实施例中，OLED薄膜封装结构10包括从下至上依次层叠设置的阵列膜层1、OLED膜层2、第一无机膜层3、有机膜层4、以及第二无机膜层5。
阵列膜层1通常包括驱动原件、TFT、绝缘层、金属线路、有机光阻、无机光阻等，排布方式根据对应的设计方案而定，这里可以不做限定。阵列膜层是在玻璃基板6上有规则地做成TFT器件、像素等图案，作用是控制信号，产生相对应的电流和电压。
OLED膜层2贴合在阵列膜层1上，OLED膜层的作用是发光。
第一无机膜层3、第二无机膜层5的材质可为氧化硅、氮化硅、氮氧化硅中的一种或多种的组合，通常采用气相沉积的方式形成。有机膜层4为有机油墨，在第一无机膜层3形成后，采用喷涂的方式在第一无机膜层3外侧形成，第二无机膜层5为在有机膜层4形成后再在其外侧形成。
阵列膜层1在位于有机膜层4外圈区域、且与第一无机膜层3相对的一侧上沿有机膜层4外圈设有内凹的隔离槽11，第一无机膜层3形成后，会与隔离槽11内外露的有机光阻以及与OLED膜层2接触。
第一无机膜层3覆盖到隔离槽11内后，隔离槽11仍可以将有机膜层4与外圈隔离开，防止喷墨形成有机膜层4时，喷出的油墨向隔离槽11外圈溢出。
喷墨后的油墨需要进行平坦化，平坦化就是在油墨的表面保持平整平坦的工艺。油墨的平坦化主要是采用静止平流的方式让油墨自然流平，在流平过程中，多出的油墨会向有机膜层4外圈流动溢出。
有了隔离槽11后，在有机膜层4平坦化的过程中，油墨在向外溢出时，会先流到隔离槽11内，避免流到隔离槽11外。
优选地，在本实施例中，OLED膜层2的到阵列膜层1所在平面的投影范围在第一无机膜层3、阵列膜层1到阵列膜层1所在平面的投影范围内，第一无机膜层3、阵列膜层1位于OLED膜层2外圈的区域将OLED膜层2包覆，使OLED膜层2被阵列膜层1和第一无机膜层3密封。本实施例中，OLED膜层2位于隔离槽11形成的封闭圈内，在其他实施例中，OLED膜层2也可覆盖到隔离槽11形成的圈外。
有机膜层4到阵列膜层1所在平面的投影范围在第一无机膜层3、第二无机膜层5到阵列膜层1所在平面的投影范围内，第一无机膜层3、第二无机膜层5位于有机膜层4外圈的区域将有机膜层4包覆，使有机膜层4被第一无机膜层3和第二无机膜层5密封。
优选地，本实施例中，有机膜层4到阵列膜层1所在平面的投影范围在隔离槽11到阵列膜层1所在平面的投影范围内，该情况下，有机膜层4没有溢出到隔离槽11的圈外。在其他实施例中，在有机膜层4形成时也可有局部区域设置到隔离槽11形成的圈外，或有机膜层4的周圈均有设置到隔离槽11形成的圈外。
在一些实施例中，隔离槽11包括沿有机膜层4周圈设置的一圈沟槽，以阻挡油墨溢出。在其他实施例中，隔离槽11包括沿有机膜层4周圈设置的两圈及两圈以上沟槽，当油墨溢出最内圈的沟槽后，外圈还有其他的沟槽能对油墨进行阻隔。
隔离槽11也可包括沿有机膜层4周圈设置的网格状沟槽，网格状沟槽由在有机膜层4周圈设置并相互交叉连通的多条沟槽形成，可以增加油墨溢出时需要流动的距离，还可以增加容置油墨的空间，在相同溢出量的情况下，可以让溢出的油墨尽量收容在隔离槽11内，避免油墨溢出隔离槽11。
沟槽的深度、宽度可以不做限定，能起到阻隔油墨溢出的作用即可，断面形状可为半圆形、V形、U形、锯齿状等，也可为多种形状的组合，锯齿状的沟槽断面可以形成多层阻隔，防止油墨溢出。
隔离槽11也可为其他外形的槽的组合，相互连通后，在有机膜层4外形成封闭的隔离槽11。
优选地，本实施例中隔离槽11采用蚀刻形成，易于加工，也易于控制外形和深度等，在其他实施例中，隔离槽11也可采用压合的方式形成。
进一步地，第一无机膜层3采用气相沉积的方式形成，与隔离槽11对应的位置会覆盖到隔离槽11内，会与隔离槽11内外露的有机光阻接触导通，但不会将隔离槽11填充，可在油墨平坦化流平向外溢时流到隔离槽11内。
在油墨平坦化流平形成有机膜层4后，第二无机膜层5再采用气相沉积的方式形成，覆盖到有机膜层4及位于有机膜层4外圈的第一无机膜层3上，第二无机膜层5与隔离槽11对应的位置会覆盖到隔离槽11内的油墨、第一无机膜层3上，将溢出的油墨封闭在隔离槽11内。
在一些实施例中，阵列膜层1与OLED膜层2相背的一侧贴合在柔性基板6上，可以使显示模组100弯曲，有机膜层4主要在于吸收后续弯曲过程中的应力。
第二无机膜层5与有机膜层4相背的一侧设有光学胶7，由于有机膜层4外圈没有凸起结构，不会影响光学胶7的流动，便于后续触摸板8贴合到光学胶7上。
优选地，第二无机膜层5与隔离槽11对应的区域到第二无机膜层5与有机膜层4对应的区域之间平滑过渡，使得光学胶7的流动更加顺畅，利于光学胶7流平。进一步地，在本实施例中，第二无机膜层5与隔离槽11对应的区域到第二无机膜层5与有机膜层4对应的区域之间弧面过渡或斜面过渡。
可以理解地，上述各技术特征可以任意组合使用而不受限制。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (16)

  1. 一种OLED薄膜封装结构，其特征在于，包括依次层叠设置的阵列膜层（1）、OLED膜层（2）、第一无机膜层（3）、有机膜层（4）、以及第二无机膜层（5）；
    所述阵列膜层（1）在位于所述有机膜层（4）外圈区域、且与所述第一无机膜层（3）相对的一侧上沿所述有机膜层（4）外圈设有内凹的隔离槽（11），以防止形成所述有机膜层（4）的油墨向所述隔离槽（11）外圈溢出。
  2. 根据权利要求1所述的OLED薄膜封装结构，其特征在于，所述OLED膜层（2）到所述阵列膜层（1）所在平面的投影范围在所述第一无机膜层（3）、阵列膜层（1）到所述阵列膜层（1）所在平面的投影范围内，所述第一无机膜层（3）、所述阵列膜层（1）位于所述OLED膜层（2）外圈的区域将所述OLED膜层（2）包覆。
  3. 根据权利要求1所述的OLED薄膜封装结构，其特征在于，所述有机膜层（4）到所述阵列膜层（1）所在平面的投影范围在所述第一无机膜层（3）、第二无机膜层（5）到所述阵列膜层（1）所在平面的投影范围内，所述第一无机膜层（3）、第二无机膜层（5）位于所述有机膜层（4）外圈的区域将所述有机膜层（4）包覆。
  4. 根据权利要求1所述的OLED薄膜封装结构，其特征在于，所述隔离槽（11）包括沿所述有机膜层（4）周圈设置的至少一圈沟槽。
  5. 根据权利要求1所述的OLED薄膜封装结构，其特征在于，所述隔离槽（11）包括沿所述有机膜层（4）周圈设置的网格状沟槽。
  6. 根据权利要求3至5任一项所述的OLED薄膜封装结构，其特征在于，，所述有机膜层（4）到所述阵列膜层（1）所在平面的投影范围在所述隔离槽（11）到所述阵列膜层（1）所在平面的投影范围内。
  7. 根据权利要求1至5任一项所述的OLED薄膜封装结构，其特征在于，所述第二无机膜层（5）与所述隔离槽（11）对应的区域到所述第二无机膜层（5）与所述有机膜层（4）对应的区域之间平滑过渡。
  8. 根据权利要求7所述的OLED薄膜封装结构，其特征在于，所述第二无机膜层（5）与所述隔离槽（11）对应的区域到所述第二无机膜层（5）与所述有机膜层（4）对应的区域之间弧面或斜面过渡。
  9. 根据权利要求1至5任一项所述的OLED薄膜封装结构，其特征在于，所述隔离槽（11）采用蚀刻形成。
  10. 根据权利要求1至5任一项所述的OLED薄膜封装结构，其特征在于，所述沟槽的断面形状为半圆形、V形、U形、锯齿状中的一种或多种的组合。
  11. 根据权利要求1至5任一项所述的OLED薄膜封装结构，其特征在于，所述第一无机膜层（3）、第二无机膜层（5）采用气相沉积的方式形成。
  12. 根据权利要求11所述的OLED薄膜封装结构，其特征在于，所述第一无机膜层（3）、第二无机膜层（5）的材质为氧化硅、氮化硅、氮氧化硅中的一种或多种的组合。
  13. 根据权利要求1至5任一项所述的OLED薄膜封装结构，其特征在于，所述阵列膜层（1）包括有机光阻。
  14. 根据权利要求1至5任一项所述的OLED薄膜封装结构，其特征在于，所述阵列膜层（1）与所述OLED相背的一侧贴合在柔性基板（6）上。
  15. 根据权利要求1至5任一项所述的OLED薄膜封装结构，其特征在于，所述第二无机膜层（5）与所述有机膜层（4）相背的一侧设有光学胶（7）。
  16. 一种显示模组，其特征在于，包括权利要求1至15任一项所述的OLED薄膜封装结构（10）。
PCT/CN2017/115495 2017-12-11 2017-12-11 Oled薄膜封装结构及显示模组 Ceased WO2019113751A1 (zh)

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