WO2019107027A1

WO2019107027A1 - Musical instrument board material and musical instrument

Info

Publication number: WO2019107027A1
Application number: PCT/JP2018/039665
Authority: WO
Inventors: 亜寿美松田; 智矢宮田; 和幸小林; 中村　康敬
Original assignee: ヤマハ株式会社
Priority date: 2017-12-01
Filing date: 2018-10-25
Publication date: 2019-06-06
Also published as: JP7176184B2; JP2019101231A; JP2022162089A; JP7392782B2

Abstract

The purpose of the present invention is to provide a musical instrument board material and a musical instrument that are capable of exhibiting vibration characteristics close to those of wood while ensuring enhanced strength and weather fastness. The musical instrument board material (1) according to one embodiment of the present invention is provided with a first fibrous layer (2) and a first base material layer (3) laminated on at least one surface of the first fibrous layer (2), wherein the first fibrous layer (2) includes a fiber and a binder; the fiber is a poly(para-phenylene benzobisoxazole) fiber, a liquid crystalline polyester fiber, an aramid fiber, a polyarylate fiber, a ultrahigh molecular weight polyethylene fiber, a polyethylene naphthalate fiber, or a glass fiber; and the first base material layer (3) is either a wooden layer or a porous layer including a synthetic resin as a main component.

Description

Instrument plate and instrument

The present invention relates to a musical instrument plate and a musical instrument.

In musical instruments such as string instruments, plate materials are used as diaphragms for propagating vibrations. This board is made of, for example, wood. However, a plate made of this wood is easily deformed due to a change in humidity, and this deformation may lower the acoustic characteristics.

In view of such problems, “stringed instrument top members” (see Japanese Patent Laid-Open No. 2001-356759) have been proposed today. The top member described in this publication comprises a wood layer and a pair of composite material layers laminated on both sides of the wood layer, and the pair of composite material layers contain woven carbon fibers. It is said that the strength and the weather resistance of the top member can be enhanced by the carbon fibers contained in the pair of composite material layers, whereby the deformation of the top member can be suppressed.

JP 2001-356759 A

However, when wood is reinforced with a composite material layer containing carbon fibers as in the top member described in the above-mentioned publication, the strength and the weather resistance of the top member can be enhanced to a certain extent, while the vibration characteristics are different from wood. May be Therefore, according to the top member, the acoustic characteristics may be deteriorated, and it may be difficult for the player to emit a desired tone.

The present invention has been made based on such circumstances, and an object of the present invention is to provide an instrument plate and instrument capable of exhibiting vibration characteristics close to that of wood while enhancing strength and weatherability. To provide.

One aspect of the present invention made to solve the above problems comprises a first fiber layer, and a first base material layer laminated on at least one surface side of the first fiber layer, and the first fiber The layer has a fiber and a binder, and the fiber is polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber, The board material for musical instruments is a wood layer or a porous layer containing a synthetic resin as a main component.

Moreover, another aspect of this invention made in order to solve the said subject is an instrument provided with the board | plate material for said instruments as a sound board.

It is a typical sectional view showing a board for musical instruments concerning one embodiment of the present invention. It is a schematic perspective view which shows a stringed musical instrument provided with the board | plate material for musical instruments of FIG. It is a schematic cross section which shows the board material for musical instruments which concerns on embodiment different from the board material for musical instruments of FIG. It is a schematic cross section which shows the board material for musical instruments which concerns on embodiment different from the board material for musical instruments of FIG.1 and FIG.3. FIG. 5 is a schematic cross-sectional view showing an instrument plate according to an embodiment different from the instrument plate of FIGS. 1, 3 and 4. FIG. 6 is a schematic cross-sectional view showing a musical instrument plate according to an embodiment different from the musical instrument plate of FIGS. 1 and 3 to 5; FIG. 7 is a schematic cross-sectional view showing a musical instrument plate according to an embodiment different from the musical instrument plate of FIGS. 1 and 3 to 6; FIG. 10 is a schematic cross-sectional view showing a musical instrument plate according to an embodiment different from the musical instrument plate of FIGS. 1 and 3 to 7; FIG. 10 is a schematic cross-sectional view showing an instrument plate according to an embodiment different from the instrument plate of FIGS. 1 and 3 to 8;

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

One aspect of the present invention comprises a first fiber layer, and a first base material layer laminated on at least one surface of the first fiber layer, and the first fiber layer has fibers and a binder. The fiber is polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber, and the first substrate layer is wood It is a board for musical instruments which is a porous layer having a layer or a synthetic resin as a main component.

The instrument board preferably includes a pair of first base layers stacked on both sides of the first fiber layer.

The musical instrument board includes a pair of second fiber layers laminated on the outer surface side of the pair of first base layers, the pair of second fiber layers having a fiber and a binder, and the fiber Polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber. In addition, the "outside side" in the said board | plate material for musical instruments means the outer side of the thickness direction on the basis of a 1st fiber layer.

The musical instrument plate includes a pair of second base layers laminated on the outer surface side of the pair of second fiber layers, and the pair of second base layers is a porous layer mainly composed of a wood layer or a synthetic resin. It should be a quality layer.

Another aspect of the present invention is a musical instrument including the musical instrument plate as a sound board.

In the present invention, the "main component" refers to a component having the largest content in terms of mass, and for example, a component having a content of 50 mass% or more.

In the board for musical instrument according to one aspect of the present invention, the first fiber layer has a fiber and a binder, and the fiber is polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultrahigh molecular weight Since it is polyethylene fiber, polyethylene naphthalate fiber or glass fiber, strength can be enhanced by the first fiber layer. Moreover, since the said 1st fiber layer has the above-mentioned structure, the said board | substrate material for musical instruments is excellent in impermeability in this 1st fiber layer. Therefore, the said board | plate material for said musical instruments can prevent moisture from reaching the 1st base material layer by the said 1st fiber layer, and can improve a weather resistance by this. Furthermore, according to the findings of the present inventors, the first fiber layer has fibers and a binder, and the fibers are fibers of the type, so that the vibration damping rate of the first fiber layer is the vibration of wood. It can be close to the attenuation rate. Therefore, the board for musical instruments can exhibit vibration characteristics close to the vibration characteristics of wood.

Moreover, since the musical instrument according to another aspect of the present invention includes the musical instrument plate as a sound board, it is possible to suppress the deterioration of the acoustic characteristics while enhancing the strength and the weather resistance of the sound board.

First Embodiment
<Mass plate>
The instrument board 1 of FIG. 1 includes a first fiber layer 2 and a first base layer 3 laminated on one side of the first fiber layer 2. The first fiber layer 2 and the first base layer 3 are directly laminated. The instrument board 1 is a two-layer structure of a first fiber layer 2 and a first base layer 3. The first fiber layer 2 has fibers and a binder, and the fibers are polyparaphenylene benzobisoxazole fibers, liquid crystal polyester fibers, aramid fibers, polyarylate fibers, ultra high molecular weight polyethylene fibers, polyethylene naphthalate fibers or glass fibers It is. The first base layer 3 is a wood layer mainly composed of wood. Since the first base material layer 3 is a wood layer, the musical instrument plate 1 can more easily bring the vibration characteristics of the musical instrument plate 1 closer to the vibration characteristics of wood. Moreover, since the said 1st base material layer 3 is a wood layer, the board | substrate 1 for said instruments is easy to hold down the whole cost.

In the instrument board 1, the first fiber layer 2 comprises polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultrahigh molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber, and a binder thereof The elastic modulus of the first fiber layer 2 is higher than the elastic modulus of the first base layer 3. Therefore, the musical instrument board 1 has sufficient strength even if the overall thickness is reduced as compared to a musical instrument board made of wood. Therefore, weight reduction can be achieved by making the thickness of the musical instrument board 1 smaller than that of a conventional wood board.

As a minimum of average thickness of the board material 1 for musical instruments concerned, 1.0 mm is preferred and 1.5 mm is more preferred. If the average thickness of the instrument plate 1 is smaller than the lower limit, the strength of the instrument plate 1 may be insufficient. In addition, "average thickness" means the average value of the thickness in arbitrary 10 points | pieces.

(First fiber layer)
The first fiber layer 2 is formed in a plate shape having a substantially uniform thickness. The first fiber layer 2 is impermeable to water. The first fiber layer 2 is stacked on the first base material layer 3 to increase the strength of the first base material layer 3 on the side of the first fiber layer 2 on which the first fiber layer 2 is laminated. Further, the first fiber layer 2 suppresses the arrival of water to the first base material layer 3, thereby suppressing the absorption of water by the first base material layer 3.

The average thickness of the first fiber layer 2 is smaller than the average thickness of the first base layer 3. The lower limit of the average thickness of the first fiber layer 2 is preferably 50 μm, more preferably 70 μm. If the average thickness is smaller than the lower limit, the strength improvement effect by the first fiber layer 2 may not be sufficiently obtained.

As described above, the first fiber layer 2 comprises polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultrahigh molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber, and the binder thereof. . The first fiber layer 2 may contain two or more of the fibers described above, but in order to make the vibration characteristics of the entire first fiber layer 2 uniform, only one of the fibers is used. Is preferred. In the first fiber layer 2, the fibers are preferably oriented along one direction substantially perpendicular to the thickness direction. The musical instrument plate 1 can easily increase the strength in one direction by, for example, matching the grain direction of the first base layer 3 with the orientation direction of the fibers in the first fiber layer 2. On the other hand, it is possible to control the anisotropy by intersecting the orientation direction of the fibers in the first fiber layer 2 with the orientation direction of the first base layer 3, for example, with the musical plate material 1. As a result, the strength in a desired direction along the fiber orientation can be effectively enhanced, and the vibration characteristics can be easily adjusted.

Examples of the aramid fibers include polyparaphenylene terephthalamide fibers, copolyparaphenylene-3,4'-oxydiphenylene terephthalamide fibers, and polymetaphenylene terephthalamide fibers. Examples of polyarylate fibers include "Vectran" (registered trademark) of Kuraray Co., Ltd., and the like. Examples of the ultra-high molecular weight polyethylene fiber include, for example, “Dyneema” (registered trademark) of Toyobo Co., Ltd. Examples of polyethylene naphthalate fibers include "Teonex" (registered trademark) of Teijin Limited. Further, examples of the glass fiber include E-glass fiber, T-glass fiber, D-glass fiber and the like.

As said binder, thermosetting resins, such as a melamine resin, an alkyd resin, an epoxy resin, a silicone resin, a polyurethane, are mentioned, These can be used individually or in mixture of 2 or more types. Among them, an epoxy resin is preferable as the binder. When the binder is an epoxy resin, the first fiber layer 2 and the first base material can be cured by impregnating the epoxy resin on the side of the first base layer 3 on which the first fiber layer 2 is to be laminated. While being able to adhere | attach layer 3 firmly, it is easy to suppress permeation | transmission of the water | moisture content to the 1st base material layer 3. As shown in FIG.

The first fiber layer 2 is formed by impregnating polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber in a thermosetting resin. It is preferable that the sheet-like prepreg is obtained by semi-curing the thermosetting resin. Thus, by forming the first fiber layer 2 from the prepreg, the strength of the first fiber layer 2 and the adhesive strength between the first fiber layer 2 and the first base layer 3 can be easily and surely enhanced. Can. In addition, when the 1st fiber layer 2 is formed from a sheet-like prepreg, the 1st fiber layer 2 may be formed from the prepreg of 1 sheet, and may be formed from the laminated body of a prepreg of several sheets.

The lower limit of the Young's modulus in the orientation direction of the fibers of the first fiber layer 2 is preferably 50 GPa, more preferably 100 GPa. On the other hand, 600 GPa is preferable as the upper limit of the Young's modulus in the orientation direction of the fibers of the first fiber layer 2. If the Young's modulus is less than the lower limit, the rigidity of the first fiber layer 2 may be insufficient, and the strength improvement effect of the first fiber layer 2 may not be sufficiently obtained. On the other hand, when the Young's modulus exceeds the upper limit, the first fiber layer 2 may become too hard, and the musical instrument plate 1 may become difficult to vibrate.

The upper limit of the specific gravity of the first fiber layer 2 is preferably 2.2. When the specific gravity of the first fiber layer 2 exceeds the upper limit, there is a possibility that the weight reduction of the musical instrument plate 1 can not be sufficiently promoted.

The first fiber layer 2 may contain other components other than the fibers and the binder. Examples of other components contained in the first fiber layer 2 include plasticizers, crosslinking agents, curing catalysts, foaming agents, foam stabilizers, antioxidants, ultraviolet light absorbers, and the like.

(First base layer)
The first base layer 3 is formed in a plate shape having a substantially uniform thickness. The first base material layer 3 is laminated on substantially the entire surface on one side of the first fiber layer 2. Examples of wood forming the first base material layer 3 include softwoods such as spruce, and hardwoods such as rosewood, maple, and sidefish. The first base material layer 3 may be a veneer mainly composed of the wood, or may be plywood using spruce, rosewood, maple, sided or the like as a veneer.

As a minimum of average thickness of the 1st substrate layer 3, 0.8 mm is preferred and 1 mm is more preferred. If the average thickness is smaller than the lower limit, the strength may be insufficient.

It is preferable that the binder of the first fiber layer 2 be impregnated on the side of the first base layer 3 on which the first fiber layer 2 is laminated. Thus, the adhesive strength of the first base layer 3 and the first fiber layer 2 can be enhanced by impregnating the binder on the side of the first fiber layer 2 on which the first fiber layer 2 is laminated. While being able to be carried out, the water absorbency of the 1st base material layer 3 can be suppressed lower by sealing the space by the side of the lamination side of the 1st fiber layer 2 of the 1st base material layer 3 with the above-mentioned binder.

The lower limit of the average impregnation depth of the binder based on the laminated surface of the first fiber layer 2 of the first base material layer 3 is preferably 0.01 mm, and more preferably 0.05 mm. If the average impregnation depth is less than the lower limit, the fine voids of the first base material layer 3 may not be sufficiently sealed. In addition, "the average impregnation depth of a binder" means the average value of the impregnation depth of the binder in arbitrary ten points extracted in the arbitrary cross sections cut | disconnected in the thickness direction.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 1, a step of preparing the first base layer 3 (a base layer preparing step), and a step of laminating the first fiber layer 2 on the first base layer 3 (stacking step) Have.

(Lamination process)
The laminating step is a step of overlapping the forming material of the first fiber layer 2 on the first base layer 3 (overlapping step), and the forming material of the first fiber layer 2 after overlapping is the first base layer 3 And bonding (adhesion step).

<Superposition process>
In the superposing step, semi-cured poly-phenylene-benzo-bisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber impregnated in thermosetting resin The sheet-like prepreg in the state is superposed on the surface of the first base layer 3.

Bonding process
In the bonding step, the first base material layer 3 stacked in the stacking step is heat pressed on the prepreg side. Thus, the thermosetting resin can be cured while being impregnated into the first base layer 3, and the first fiber layer 2 and the first base layer 3 can be firmly bonded, and the thermosetting resin can be used. By sealing the voids of the first base material layer 3, the water absorbency of the first base material layer 3 can be suppressed to a lower level.

<Stringed instrument>
The stringed instrument 11 of FIG. 2 includes a hollow body 13 having a soundboard 12, a bridge 15 provided on the outer surface side of the soundboard 12 for supporting a plurality of strings 14, and a saddle 16 provided on the outer surface of the bridge 15. It mainly comprises a neck 17 connected to the body 13 and extending from one end of the soundboard 12 and a head 18 provided on one end of the neck 17. The plurality of strings 14 are wound around one end on a plurality of pegs 19 provided on the head 18 and locked, and the other end is supported by the bridge 15 via the saddle 16 and locked on a plurality of pins 20 It is done. Also, the soundboard 12 has a sound hole 21 between the other end of the neck 17 and the bridge 15. The stringed instrument 11 includes the instrument plate 1 of FIG. 1 as a soundboard 12. In the instrument board 1, the first base layer 3 constitutes the outer surface side of the soundboard 12. The stringed instrument 11 is configured as an acoustic guitar that resonates the vibration of the string 14 with the body 13 to obtain a predetermined volume.

<Advantage>
In the instrument board 1, the first fiber layer 2 has a fiber and a binder, and the fiber is polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene Since it is a naphthalate fiber or glass fiber, the first fiber layer 2 can increase the strength. Moreover, since the said 1st fiber layer 2 has the above-mentioned structure, the said board | plate material 1 for musical instruments has this 1st fiber layer 2 excellent in impermeable property. Therefore, the board material 1 for musical instruments can prevent moisture from reaching the first base material layer 3 by the first fiber layer 2, and thereby the weather resistance can be improved. In particular, the musical instrument board 1 may be used by laminating another layer such as a cosmetic coating layer on the outer surface side of the first base layer 3. In this case, the instrument board 1 can prevent the arrival of moisture to the first base layer 3 on both sides of the first base layer 3, so the weather resistance can be more appropriately enhanced. Furthermore, according to the findings of the present inventors, the first fiber layer 2 has fibers and a binder, and the fibers are fibers of the type, so that the vibration damping rate of the first fiber layer 2 is made of wood. Can be close to the vibration damping rate of Therefore, the board member 1 for musical instruments can exhibit vibration characteristics close to the vibration characteristics of wood.

Further, since the first base material layer 3 is laminated on one surface side of the first fiber layer 2, the musical instrument board 1 is incorporated in the musical instrument so that the first base material layer 3 constitutes the outer surface side. This makes it possible to make the appearance of this instrument woody.

The manufacturing method of the board for musical instruments can manufacture the board for musical instruments 1 easily and reliably. Moreover, the manufacturing method of the said board | plate material for musical instruments raises the adhesive strength of the 1st base material layer 3 and the 1st fiber layer 2 by using the above-mentioned prepreg as a formation material of the 1st fiber layer 2, The water absorbency of 1 base material layer 3 can be suppressed more appropriately.

Since the stringed instrument 11 includes the musical instrument plate 1 as the sounding board 12, it is possible to suppress the deterioration of acoustic characteristics while enhancing the strength and the weather resistance of the sounding board 12.

Second Embodiment
<Mass plate>
The musical instrument board 31 of FIG. 3 includes a first fiber layer 2 and a pair of first base layers 3 stacked on both sides of the first fiber layer 2. The specific configuration of the first fiber layer 2 and the pair of first base layers 3 can be the same as that of the musical instrument plate 1 of FIG. 1.

The pair of first base layers 3 is directly laminated to the first fiber layer 2. The instrument plate 31 is a three-layer structure of the first fiber layer 2 and the pair of first base layers 3.

The pair of first base layers 3 constitute the outermost layers on both sides of the musical instrument plate 31. The materials for forming the pair of first base layers 3 (the woods forming the pair of first base layers 3) may be different, but are preferably the same. By forming the pair of first base layers 3 with the same material, it is possible to emphasize the vibration characteristics of a specific wood. Moreover, the manufacturing cost of the board | plate material 31 for said musical instruments can be held down because the formation material of a pair of 1st base material layers 3 is the same. Further, from the viewpoint of suppressing the warpage of the musical instrument plate 31, it is preferable to make the material and thickness of each layer on both sides in the thickness direction symmetrical with respect to the first fiber layer 2. Therefore, also from this point of view, it is preferable that the materials for forming the pair of first base layers 3 be the same, and that the thicknesses of the pair of first base layers 3 be preferably equal.

The grains of the pair of first base layers 3 may be oriented in the same direction, or may be oriented in different directions. However, it is preferable that the orientation direction of the grain of the pair of first base layers 3 be the same in terms of enhancing the anisotropy of rigidity. Moreover, in this case, it is preferable that the orientation direction of the grain of the pair of first base layers 3 and the orientation direction of the fibers of the first fiber layer 2 are all the same. On the other hand, it is preferable that the orientation direction of the grain of the pair of first base layers 3 is different from the orientation direction of the fibers of the first fiber layer 2 from the viewpoint of weakening the rigid anisotropy.

The lower limit of the average thickness of the instrument plate 31 can be the same as that of the instrument plate 1 of FIG. 1. The lower limit of the average thickness of the musical instrument plate 31 is preferably 1.0 mm, more preferably 1.5 mm.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 1, the step of preparing the pair of first base layers 3 (the step of preparing the base layer) and the pair of first base layers 3 on both sides of the first fiber layer 2 are laminated. And a step of stacking (stacking step).

(Lamination process)
The laminating step is a step of overlapping the pair of first base layers 3 on both surface sides of the forming material of the first fiber layer 2 (overlapping step), and a pair of forming materials of the first fiber layer 2 after overlapping. Bonding with the first base material layer 3 of FIG.

<Superposition process>
In the superposing step, semi-cured poly-phenylene-benzo-bisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber impregnated in thermosetting resin The pair of first base layers 3 is superimposed on both sides of the sheet-like prepreg in the state.

Bonding process
In the bonding step, the pair of first base layers 3 stacked in the stacking step is heat pressed on both sides of the prepreg. Thus, the thermosetting resin can be impregnated and cured on the inner surface side of the pair of first base layers 3, and the pair of first base layers 3 and the first fiber layer 2 can be firmly bonded. By sealing the voids of the first base layer 3 with this thermosetting resin, the water absorbency of the pair of first base layers 3 can be suppressed to a lower level.

<Advantage>
The musical instrument plate 31 has the first fiber layer 2 disposed at the center in the thickness direction with less influence on the vibration characteristics, thereby maintaining the vibration characteristics of the wood forming the pair of first base layers 3. It is easy to improve strength and weather resistance. Moreover, since the said board member 31 for musical instruments is provided with the pair of first base layers 3 as the outermost layer, it can have a wood-like appearance. Furthermore, since the musical instrument plate 31 includes the pair of first base layers 3 as the outermost layer, it can be easily incorporated into a stringed instrument or the like in the same manner as a conventional wooden plate.

The manufacturing method of the board for musical instruments can manufacture the board for musical instruments 31 easily and reliably.

Third Embodiment
<Mass plate>
The instrument board 41 of FIG. 4 includes the first fiber layer 2, a pair of first base layers 3 stacked on both sides of the first fiber layer 2, and an outer surface side of the pair of first base layers 3. And a pair of second fiber layers 42 to be stacked. The specific configuration of the first fiber layer 2 and the pair of first base layers 3 can be similar to that of the musical instrument plate 31 of FIG. 3.

The pair of first base layers 3 is directly laminated to the first fiber layer 2. Further, the pair of second fiber layers 42 is directly laminated on the pair of first base layers 3. That is, in the instrument board 41, the pair of second fiber layers 42 is stacked on the outer surface of the instrument board 31 of FIG. 3. The instrument board 41 is a five-layer structure of the first fiber layer 2, the pair of first base layers 3, and the pair of second fiber layers 42.

(2nd fiber layer)
The pair of second fiber layers 42 constitute the outermost layer of the instrument board 41. The pair of second fiber layers 42 includes fibers and a binder. The fibers are polyparaphenylene benzobisoxazole fibers, liquid crystal polyester fibers, aramid fibers, polyarylate fibers, ultra high molecular weight polyethylene fibers, polyethylene naphthalate fibers or glass fibers. Moreover, as said binder, thermosetting resins, such as the above-mentioned melamine resin, an alkyd resin, an epoxy resin, a silicone resin, and a polyurethane, can be used. That is, the pair of second fiber layers 42 can be configured to include the same fibers and binder as the first fiber layer 2. The pair of second fiber layers 42 may include other components similar to the first fiber layer 2. The pair of second fiber layers 42 can be formed of the same prepreg as the first fiber layer 2. The binder of the pair of second fiber layers 42 is preferably impregnated on the outer surface side of the pair of first base layers 3. The average impregnation depth of the binder based on the lamination surface of the second fiber layer 42 of the first base material layer 3 can be the same as that of the musical instrument plate 1 of FIG. 1.

The second fiber layer 42 is formed in a plate shape having a substantially uniform thickness. The second fiber layer 42 is impermeable to water. The second fiber layer 42 is laminated on substantially the entire outer surface of the first base layer 3. The second fiber layer 42 is laminated on the outer surface of the first base material layer 3 to increase the strength of the outer surface side of the first base material layer 3. In addition, the second fiber layer 42 suppresses the arrival of water to the first base material layer 3 and thereby suppresses the absorption of water by the first base material layer 3.

The average thickness of the second fiber layer 42 is smaller than the average thickness of the first base layer 3. The average thickness of the pair of second fiber layers 42 and the Young's modulus and specific gravity in the direction of orientation of the fibers can be the same as those of the first fiber layer 2 of the instrument plate 1 of FIG.

It is preferable that the main component of the fibers contained in the pair of second fiber layers 42 and the main component of the binder be the same. By making the main component of the fiber and the main component of the binder contained in the pair of second fiber layers 42 the same, the manufacturing cost of the musical instrument plate 41 can be suppressed. Further, from the viewpoint of suppressing the warp of the musical instrument plate 41, it is preferable to make the material and thickness of each layer on both sides in the thickness direction symmetrical with respect to the first fiber layer 2. Therefore, it is preferable that the main component of the fiber contained in a pair of 2nd fiber layer 42 and the main component of a binder are the same also from this viewpoint. Further, from the above viewpoint, the thickness of the pair of second fiber layers 42 is preferably equal, and the forming material and thickness of the pair of first base layers 3 are preferably the same.

The lower limit of the average thickness of the instrument plate 41 can be the same as that of the instrument plate 1 of FIG. 1. The lower limit of the average thickness of the musical instrument plate 41 is preferably 1.0 mm, more preferably 1.5 mm.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 41, the step of preparing the pair of first base layers 3 (the step of preparing the base layer) and the pair of first base layers 3 on both sides of the first fiber layer 2 are laminated. And a step of laminating the pair of second fiber layers 42 on the outer surface side of the pair of first base layers 3 (a second laminating step).

The substrate layer preparing step and the first laminating step in the method of manufacturing the musical instrument plate can be performed in the same procedure as the musical instrument plate 31 of FIG. 3. In the second laminating step, the pair of second fiber layers 42 may be directly laminated on the outer surfaces of the pair of first base layers 3, and an adhesive is used on the outer surfaces of the pair of first base layers 3. The second fiber layer 42 may be laminated. As a method of directly laminating the pair of second fiber layers 42 on the outer surface of the pair of first base layers 3, for example, a prepreg forming the pair of second fiber layers 42 is formed on the outer surface of the pair of first base layers 3 Superimposition (superposition process), a method of heat-pressing the pair of second fiber layers 42 on the side of the pair of first base layers 3 in this superimposed state (adhesion process) may be mentioned. The manufacturing method of the board material for musical instruments may perform the first lamination process before the second lamination process, or may perform the first lamination process after the second lamination process, and the first lamination process and the second lamination process. You may go at the same time.

<Advantage>
Since the musical instrument board 41 includes the pair of second fiber layers 42 on the outer surface side of the pair of first base layers 3, the overall thickness can be easily adjusted by the pair of second fiber layers 42. Since the first fiber layer 2 and the second fiber layer 42 are laminated on both sides of the pair of first base layers 3, the musical instrument plate 41 is configured to be the first fiber layer 2. And by sandwiching with the 2nd fiber layer 42, intensity on both sides of a pair of 1st substrate layers 3 can be raised. In addition, since the first fiber layer 2 and the second fiber layer 42 are laminated on both sides of the pair of first base layers 3, the instrument board 41 is configured to have the first fiber layer 2 and the pair of second fiber layers. 42 can prevent the moisture from reaching the pair of first base layers 3 easily and reliably, and thereby the weather resistance can be enhanced. Furthermore, since the pair of second fiber layers 42 has fibers and a binder, and the fibers are fibers of the type described above, the instrument board 41 has a vibration damping ratio of the pair of second fiber layers 42 of wood. It can be close to the vibration damping rate. Therefore, the board 41 for musical instruments can exhibit vibration characteristics close to the vibration characteristics of wood.

The manufacturing method of the board for musical instruments can manufacture the board for musical instruments 41 easily and reliably.

Fourth Embodiment
<Mass plate>
The instrument plate 51 of FIG. 5 includes a first fiber layer 2, a pair of first base layers 3 stacked on both sides of the first fiber layer 2, and an outer surface side of the pair of first base layers 3. A pair of second fiber layers 42 to be stacked and a pair of second base layers 53 to be stacked on the outer surface side of the pair of second fiber layers 42 are provided. The specific configuration of the first fiber layer 2, the pair of first base layers 3, and the pair of second fiber layers 42 can be the same as that of the instrument plate 41 of FIG. 4.

The pair of first base layers 3 is directly laminated to the first fiber layer 2. The pair of second fiber layers 42 is directly laminated on the pair of first base layers 3. Further, the pair of second base layers 53 is directly laminated on the pair of second fiber layers 42. That is, in the instrument plate 51, the pair of second base layers 53 is stacked on the outer surface of the instrument plate 41 of FIG. The instrument plate 51 is a seven-layer structure of a first fiber layer 2, a pair of first base layers 3, a pair of second fiber layers 42, and a pair of second base layers 53.

(2nd substrate layer)
The pair of second base layers 53 constitutes the outermost layer of the musical instrument plate 51. The pair of second base layers 53 is a wood layer mainly composed of wood. As a forming material of a pair of 2nd base material layers 53, it can be made to be the same as that of the 1st base material layer 3 of board material 1 for musical instruments of FIG. The pair of second base layers 53 may be a single board or plywood, as in the case of the first base layer 3 of the musical instrument plate 1 of FIG. 1.

The second base layer 53 is formed in a plate shape having a substantially uniform thickness. The average thickness of the second base layer 53 is larger than the average thickness of each of the first fiber layer 2 and the second fiber layer 42. The second base layer 53 is laminated on substantially the entire outer surface of the second fiber layer 42. The average thickness of the second base layer 53 can be the same as that of the first base layer 3 of the musical instrument plate 1 shown in FIG. It is preferable that the binder of the second fiber layer 42 be impregnated on the side of the second base layer 53 on which the second fiber layer 42 is laminated. The average impregnation depth of the binder based on the laminated surface of the second fiber layer 42 of the second base material layer 53 can be the same as that of the musical instrument plate 1 of FIG. 1.

The materials for forming the pair of second base layers 53 may be different, but are preferably the same. When the forming materials of the pair of second base layers 53 are the same, the forming materials are more preferably the same as the forming materials of the pair of first base layers 3. By making the materials of the pair of second base layers 53 the same, it is possible to emphasize specific vibration characteristics of wood. Moreover, the manufacturing cost of the board | plate material 51 for said musical instruments can be held down because the formation material of a pair of 2nd base material layers 53 is the same. Further, from the viewpoint of suppressing the warpage of the musical instrument plate 51, it is preferable to make the material and thickness of each layer on both sides in the thickness direction symmetrical with respect to the first fiber layer 2. Therefore, also from this point of view, it is preferable that the materials for forming the pair of second base layers 53 be the same, and it is preferable that the thicknesses of the pair of second base layers 53 be equal.

The grains of the pair of second base layers 53 may be oriented in the same direction, or may be oriented in different directions. However, it is preferable that the orientation directions of the pair of second base layers 53 be the same in order to increase the rigidity anisotropy. In this case, the orientation direction of the pair of second base layers 53 is preferably the same as the orientation direction of the pair of first base layers 3, and the first fiber layer 2 and the pair of It is more preferable that the orientation direction of the fibers of the 2 fiber layer 42 be the same. On the other hand, from the point of weakening the rigid anisotropy, the orientation direction of the pair of second base layer 53 is the orientation direction of the pair of first base layer 3 and the orientation direction of the first fiber layer 2. It is preferable to be different from the orientation direction of the fibers and the orientation direction of the fibers of the pair of second fiber layers 42.

The lower limit of the average thickness of the instrument plate 51 can be the same as that of the instrument plate 1 of FIG. 1. The lower limit of the average thickness of the instrument plate 51 is preferably 1.0 mm, and more preferably 1.5 mm.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 51, the step of preparing the pair of first base layers 3 and the pair of second base layers 53 (the step of preparing the base layer), and the pair on both sides of the first fiber layer 2 A step of laminating the first base material layer 3 (first lamination step), a step of laminating the pair of second fiber layers 42 on the outer surface side of the pair of first base layers 3 (second lamination step), And laminating the pair of second base layers 53 on the outer surface side of the pair of second fiber layers 42 (third laminating step).

The base material layer preparing step, the first laminating step, and the second laminating step in the method of manufacturing the musical instrument plate can be performed in the same procedure as the method of manufacturing the musical plate 41 in FIG. 4. In the third laminating step, the pair of second base layers 53 may be directly laminated on the outer surfaces of the pair of second fiber layers 42, and the outer surfaces of the pair of second fiber layers 42 are bonded using an adhesive. The second base layer 53 may be stacked. As a method of directly laminating the pair of second base layers 53 on the outer surface of the pair of second fiber layers 42, for example, the pair of second base layers 53 is formed on the outer surface of the prepreg forming the pair of second fiber layers 42. Superimposition (superposition process), a method of heat-pressing the pair of second base layers 53 on the side of the pair of second fiber layers 42 in a superimposed state (adhesion process) may be mentioned. In the manufacturing method of the said board material for musical instruments, the order which performs a 1st lamination process, a 2nd lamination process, and a 3rd lamination process is not specifically limited. Moreover, the manufacturing method of the said board | plate material for musical instruments can also perform a 1st lamination process, a 2nd lamination process, and a 3rd lamination process simultaneously.

<Advantage>
Since the musical instrument board 51 includes the pair of second base layers 53 on the outer surface side of the pair of second fiber layers 42, the overall thickness can be easily adjusted by the pair of second base layers 53. The musical instrument plate 51 has strength and weather resistance while maintaining the vibration characteristics of wood by arranging the first fiber layer 2 and the pair of second fiber layers 42 on the center side in the thickness direction with less influence on the vibration characteristics. Can be enhanced. Moreover, since the said board member 51 for musical instruments is provided with the pair of second base layers 53 as the outermost layer, it can have a wood-like appearance. Furthermore, since the musical instrument board 51 includes the pair of second base layers 53 as the outermost layer, it can be easily incorporated into a stringed instrument or the like in the same manner as a conventional wood board.

The manufacturing method of the board for musical instruments can manufacture the board for musical instruments 51 easily and reliably.

Fifth Embodiment
<Mass plate>
The instrument plate 61 of FIG. 6 includes the first fiber layer 2 and a first base layer 63 laminated on one surface side of the first fiber layer 2. The first fiber layer 2 and the first base layer 63 are directly laminated. The musical instrument plate 61 is a two-layer structure of the first fiber layer 2 and the first base layer 63. The first fiber layer 2 has fibers and a binder, and the fibers are polyparaphenylene benzobisoxazole fibers, liquid crystal polyester fibers, aramid fibers, polyarylate fibers, ultra high molecular weight polyethylene fibers, polyethylene naphthalate fibers or glass fibers It is. The first base layer 63 is a porous layer containing a synthetic resin as a main component. The first fiber layer 2 in the musical instrument plate 61 can be the same as the musical instrument plate 1 shown in FIG.

(First base layer)
The first base layer 63 is formed in a plate shape having a substantially uniform thickness. The first base layer 63 is laminated on substantially the entire surface on one side of the first fiber layer 2. It is preferable that the binder of the first fiber layer 2 be impregnated on the side of the first base layer 63 on which the first fiber layer 2 is laminated. The average impregnation depth of the binder based on the laminated surface of the first fiber layer 2 of the first base material layer 63 can be the same as that of the instrument plate 1 of FIG. 1.

The first base layer 63 may have a honeycomb structure (multi-tubular structure, multi-chamber structure). When the first base layer 63 has a honeycomb structure, weight reduction may be promoted in some cases.

The average thickness of the first base layer 63 is larger than the average thickness of the first fiber layer 2. As a minimum of average thickness of the 1st substrate layer 63, 100 micrometers is preferred, 0.8 mm is more preferred, and 1 mm is still more preferred. If the average thickness is less than the lower limit, the thickness of the musical instrument plate 61 becomes too small, which may make it difficult to use as a sound board or the like of a stringed instrument.

The first base layer 63 is made of, for example, a synthetic resin foam. Examples of the synthetic resin include polymethacrylimide, polyethylene, polypropylene, polyurethane, polystyrene, phenol resin, urea resin, polyvinyl chloride, silicone resin, polyimide, melamine resin and the like. Among them, as the synthetic resin, polymethacrylimide which is excellent in heat resistance and relatively high in strength, and which can easily achieve weight reduction by increasing the cell ratio is preferable.

When the first base layer 63 is formed of a synthetic resin foam, the plurality of cells contained in the first base layer 63 is preferably a closed cell. When the cells of the first base layer 63 are connected cells in which a plurality of independent cells are connected, for example, when the first fiber layer 2 is formed by laminating the above-described prepreg on the first base layer 63, The penetration of the thermosetting resin of the prepreg into the connected air bubbles tends to make the vibration characteristics of the first base layer 63 uneven. On the other hand, when the air bubbles of the first base material layer 63 are closed air cells, the thermosetting resin can be impregnated into the first base material layer 63 substantially uniformly, so the vibration of the first base material layer 63 It is easy to make the characteristics uniform.

The lower limit of the Young's modulus of the first base layer 63 is preferably 50 MPa. On the other hand, as a maximum of Young's modulus of the 1st substrate layer 63, 200MPa is preferred. If the Young's modulus is less than the lower limit, the rigidity of the first base layer 63 may be insufficient, and the rigidity of the musical instrument plate 61 may not be sufficiently improved. On the other hand, when the Young's modulus exceeds the upper limit, the first base material layer 63 becomes too hard, which may make it difficult for the musical instrument plate 61 to vibrate.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 61, a step of preparing the first base material layer 63 (base material layer preparing step), and a step of laminating the first fiber layer 2 on the first base material layer 63 (lamination step) Have. About the base material layer preparation process and lamination process in the manufacturing method of the board material for musical instruments concerned, it can carry out in the same procedure as the manufacturing method of board material 1 for musical instruments of FIG.

<Advantage>
The strength of the instrument plate 61 can be enhanced by the first fiber layer 2. Moreover, the said board member 61 for musical instruments can prevent moisture from reaching the first base layer 63 by the first fiber layer 2, and thereby the weather resistance can be improved. In particular, the musical instrument plate 61 may be used by laminating another layer such as a cosmetic coating layer on the outer surface side of the first base layer 63. In this case, the instrument board 61 can prevent the water from reaching the first base layer 63 on both sides of the first base layer 63, so that the weather resistance can be more appropriately improved. Furthermore, the said board material 61 for musical instruments has a fiber and a binder in the said 1st fiber layer 2, and the said fiber is a fiber of the said kind, The vibration attenuation factor of this 1st fiber layer 2 is a vibration of a wood It can be close to the attenuation rate. Therefore, the board 61 for musical instruments can exhibit vibration characteristics close to the vibration characteristics of wood.

Since the first base material layer 63 is a porous layer containing a synthetic resin as a main component, the instrument board 61 can suppress variation in vibration characteristics and promote uniformization of quality. Further, since the first base material layer 63 is a porous layer containing synthetic resin as a main component, the musical instrument plate 61 is, for example, adjusted in vibration characteristics by adjusting the type of synthetic resin, the cell diameter, the cell ratio and the like. It can be adjusted widely. Furthermore, the said board material 61 for musical instruments can promote weight reduction by the 1st base material layer 63 being a porous layer which has a synthetic resin as a main component.

The manufacturing method of the board for musical instruments can manufacture the board 61 for musical instruments easily and reliably.

Sixth Embodiment
<Mass plate>
The instrument plate 71 of FIG. 7 includes a first fiber layer 2 and a pair of first base layers 63 stacked on both sides of the first fiber layer 2. The specific configuration of the first fiber layer 2 and the pair of first base layers 63 can be the same as that of the musical instrument plate 61 of FIG. 6.

The pair of first base layers 63 is directly laminated to the first fiber layer 2. The instrument board 71 is a three-layer structure of the first fiber layer 2 and the pair of first base layers 63.

The pair of first base layers 63 constitute the outermost layers on both sides of the musical instrument plate 71. The main components of the pair of first base layers 63 may be different, but are preferably the same. When the main components of the pair of first base layers 63 are the same, specific vibration characteristics can be emphasized. In addition, since the main components of the pair of first base layers 63 are the same, the manufacturing cost of the musical instrument plate 71 can be suppressed. Further, from the viewpoint of suppressing the warpage of the musical instrument plate 71, it is preferable to make the materials and thicknesses of the layers on both sides in the thickness direction symmetrical with respect to the first fiber layer 2. Therefore, also from this viewpoint, the main components of the pair of first base layers 63 are preferably the same, and the thicknesses of the pair of first base layers 63 are preferably equal.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 71, the step of preparing the pair of first base layers 63 (the step of preparing the base layer) and the pair of first base layers 63 are laminated on both sides of the first fiber layer 2. And a step of stacking (stacking step). The base layer preparation step and the lamination step in the method of manufacturing the musical instrument plate can be performed in the same procedure as the method of manufacturing the musical plate 31 in FIG. 3.

<Advantage>
The musical instrument plate 71 has strength and weather resistance while maintaining the vibration characteristics of the pair of first base layers 63 by arranging the first fiber layer 2 at the central portion in the thickness direction where the influence on the vibration characteristics is small. Can be enhanced. Moreover, the said board material 71 for musical instruments is a porous layer which a pair of 1st base material layers 63 have a synthetic resin as a main component, The thickness of the board material 71 for said musical instruments is made large, promoting weight reduction. can do.

The manufacturing method of the board for musical instruments can manufacture the board for musical instruments 71 easily and reliably.

Seventh Embodiment
<Mass plate>
The instrument plate 81 of FIG. 8 includes the first fiber layer 2, a pair of first base layers 63 stacked on both sides of the first fiber layer 2, and an outer surface side of the pair of first base layers 63. And a pair of second fiber layers 82 to be laminated. The specific configuration of the first fiber layer 2 and the pair of first base layers 63 can be similar to that of the musical instrument plate 71 of FIG. 7.

The pair of first base layers 63 is directly laminated to the first fiber layer 2. Also, the pair of second fiber layers 82 is directly laminated on the pair of first base layers 63. That is, in the instrument board 81, the pair of second fiber layers 82 is stacked on the outer surface of the instrument board 71 of FIG. The musical instrument board 81 is a five-layer structure of the first fiber layer 2, the pair of first base layers 63, and the pair of second fiber layers 82.

(2nd fiber layer)
The pair of second fiber layers 82 constitute the outermost layer of the musical instrument plate 81. The pair of second fiber layers 82 includes fibers and a binder. The fibers are polyparaphenylene benzobisoxazole fibers, liquid crystal polyester fibers, aramid fibers, polyarylate fibers, ultra high molecular weight polyethylene fibers, polyethylene naphthalate fibers or glass fibers. Moreover, as said binder, thermosetting resins, such as the above-mentioned melamine resin, an alkyd resin, an epoxy resin, a silicone resin, and a polyurethane, are mentioned. That is, the pair of second fiber layers 82 can be configured to include the same fibers and binders as the first fiber layer 2. The pair of second fiber layers 82 may include other components similar to the first fiber layer 2. The pair of second fiber layers 82 can be formed of the same prepreg as the first fiber layer 2. The binder of the pair of second fiber layers 82 is preferably impregnated on the outer surface side of the pair of first base layers 63. The average impregnation depth of the binder based on the laminated surface of the second fiber layer 82 of the first base material layer 63 can be the same as that of the instrument plate 1 of FIG. 1.

The second fiber layer 82 is formed in a plate shape having a substantially uniform thickness. The second fiber layer 82 is impermeable to water. The second fiber layer 82 is laminated on substantially the entire outer surface of the first base layer 63. The second fiber layer 82 is laminated on the outer surface of the first base layer 63 to enhance the strength on the outer surface side of the first base layer 63. In addition, the second fiber layer 82 prevents the water from reaching the first base layer 63, thereby suppressing the absorption of the water by the first base layer 63.

The average thickness of the second fiber layer 82 is smaller than the average thickness of the first base layer 63. The average thickness of the pair of second fiber layers 82 and the Young's modulus and specific gravity in the orientation direction of the fibers can be the same as those of the first fiber layer 2 of the musical instrument board 1 shown in FIG.

It is preferable that the main component of the fibers contained in the pair of second fiber layers 82 and the main component of the binder be the same. By making the main component of the fiber and the main component of the binder contained in the pair of second fiber layers 82 the same, the manufacturing cost of the musical instrument plate 81 can be suppressed. Further, from the viewpoint of suppressing the warp of the musical instrument plate 81, it is preferable to make the material and thickness of each layer on both sides in the thickness direction symmetrical with respect to the first fiber layer 2. Therefore, it is preferable that the main component of the fiber contained in a pair of 2nd fiber layer 82 and the main component of a binder are the same also from this viewpoint. Further, from the above viewpoint, the thickness of the pair of second fiber layers 82 is preferably equal, and the forming material and thickness of the pair of first base layers 63 are also preferably the same.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 81, the step of preparing the pair of first base layers 63 (the step of preparing the base layer) and the pair of first base layers 63 are laminated on both sides of the first fiber layer 2. And a step of laminating the pair of second fiber layers 82 on the outer surface side of the pair of first base layers 63 (a second laminating step). The base material layer preparing step, the first laminating step, and the second laminating step in the method of manufacturing the musical instrument plate can be performed in the same procedure as the method of manufacturing the musical plate 41 in FIG. 4.

<Advantage>
Since the musical instrument plate 81 includes the pair of second fiber layers 82 on the outer surface side of the pair of first base layers 63, the overall thickness can be easily adjusted by the pair of second fiber layers 82. The musical instrument plate 81 includes the pair of second fiber layers 82 on the outer surface side of the pair of first base layers 63, so that the vibration characteristics close to wood are maintained, and the entire thickness is adjusted. It is easy to reduce the weight of In particular, since the musical instrument board 81 includes the pair of second fiber layers 82 on the outside of the pair of first base layers 63, the strength on both sides can be enhanced and vibration characteristics closer to wood can be exhibited. . In the musical instrument board 81, the pair of second fiber layers 82 is disposed on the outer surface side of the pair of first base layers 63, and the first fiber layer 2 is formed on both sides of the first base layer 63. Since the second fiber layer 82 is laminated, the first fiber layer 2 and the pair of second fiber layers 82 can easily and reliably prevent moisture from reaching the pair of first base layers 63. This can improve the weather resistance.

The manufacturing method of the board for musical instruments can manufacture the board for musical instruments 81 easily and reliably.

Eighth Embodiment
<Mass plate>
The musical instrument plate 91 of FIG. 9 includes the first fiber layer 2, a pair of first base layers 63 stacked on both sides of the first fiber layer 2, and an outer surface side of the pair of first base layers 63. A pair of second fiber layers 82 to be stacked and a pair of second base layers 93 to be stacked on the outer surface side of the pair of second fiber layers 82 are provided. The specific configuration of the first fiber layer 2, the pair of first base layers 63, and the pair of second fiber layers 82 can be the same as that of the musical instrument plate 81 of FIG.

The pair of first base layers 63 is directly laminated to the first fiber layer 2. The pair of second fiber layers 82 is directly laminated on the pair of first base layers 63. Also, the pair of second base layers 93 is directly laminated on the pair of second fiber layers 82. That is, in the instrument board 91, the pair of second base layers 93 is stacked on the outer surface of the instrument board 81 of FIG. The musical instrument plate 91 is a seven-layer structure of a first fiber layer 2, a pair of first base layers 63, a pair of second fiber layers 82, and a pair of second base layers 93.

(2nd substrate layer)
The pair of second base layers 93 constitutes the outermost layer of the musical instrument plate 91. The pair of second base layers 93 is a porous layer containing a synthetic resin as a main component. The pair of second base layers 93 may be formed of a synthetic resin foam, or may have a honeycomb structure (multi-tubular structure, multi-chamber structure). The main components of the pair of second base layers 93 can be the same as the first base layer 63 of the instrument plate 61 of FIG. When the pair of second base layers 93 is formed of a synthetic resin foam, the plurality of cells contained in the pair of second base layers 93 are preferably closed cells. The average thickness of the second base layer 93 is larger than the average thickness of each of the first fiber layer 2 and the second fiber layer 82. The Young's modulus and the average thickness of the pair of second base layers 93 can be similar to that of the pair of first base layers 63.

The second base material layer 93 is formed in a plate shape having a substantially uniform thickness. The second base layer 93 is laminated on substantially the entire outer surface of the second fiber layer 82.

The main components of the pair of second base layers 93 may be different, but are preferably the same. When the main components of the pair of second base layers 93 are the same, specific vibration characteristics can be emphasized. Moreover, the manufacturing cost of the said board member 91 for musical instruments can be held down because the main component of a pair of 2nd base material layers 93 is the same. Further, from the viewpoint of suppressing the warpage of the musical instrument plate 91, it is preferable to make the material and thickness of each layer on both sides in the thickness direction symmetrical about the first fiber layer 2. Therefore, also from this viewpoint, the main components of the pair of second base layers 93 are preferably the same, and the thicknesses of the pair of second base layers 93 are preferably equal.

<Manufacturing method>
In the method of manufacturing the musical instrument plate 91, a step of preparing a pair of first base layers 63 and a pair of second base layers 93 (a base layer preparing step), and a pair of layers on both sides of the first fiber layer 2. A step of laminating the first base material layer 63 (first laminating step), a step of laminating the pair of second fiber layers 82 on the outer surface side of the pair of first base layers 63 (second laminating step), And laminating the pair of second base layers 93 on the outer surface side of the pair of second fiber layers 82 (third laminating step).

The base material layer preparing step, the first laminating step, the second laminating step, and the third laminating step in the method of manufacturing the musical instrument plate can be performed in the same procedure as the method of manufacturing the musical plate 51 shown in FIG. .

<Advantage>
Since the musical instrument plate 91 includes the pair of second base layers 93 on the outer surface side of the pair of second fiber layers 82, the overall thickness can be easily adjusted by the pair of second base layers 93. When the main component of the pair of second base layers 93 is the same as the main component of the pair of first base layers 63, the musical instrument plate 91 has a pair of first base layers 63 and a pair of first base layers 63. It is easy to maintain specific vibration characteristics corresponding to the main component of the two base material layers 93. Further, the musical instrument plate 91 has the main component of the pair of second base layers 93 the same as the main component of the pair of first base layers 63, more specifically, the pair of second base layers 93. By employing the same configuration as the pair of first base layers 63, the manufacturing cost can be reduced.

The method of manufacturing the musical instrument plate can manufacture the musical instrument plate 91 easily and reliably.

Other Embodiments
The musical instrument plate and the musical instrument according to the present invention can be implemented in various modifications and alterations in addition to the aforementioned embodiments. For example, the musical instrument use plate may be provided between the first fiber layer and the first base layer, between the first base layer and the second fiber layer, between the second fiber layer and the second base layer, 2) Other layers such as a resin layer and a wood layer may be provided on the outer surface or the like of the base material layer.

The said board material for musical instruments is, as the other layer, polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or fibers other than glass fiber and binders thereof And may have a fiber layer.

The instrument board may have a cosmetic coating layer on the outer surface side of the base layer (the first base layer and the second base layer). The musical instrument sheet can prevent the water from reaching the base layer from both sides by sandwiching the base layer between the fiber layer (the first fiber layer or the second fiber layer) and the coating layer. Therefore, the weather resistance can be more properly improved.

When the pair of first base layers is laminated on both sides of the first fiber layer, the first base layer is a wood layer, and the other first base layer is a synthetic resin. It may be a porous layer containing as a main component. In addition, when the pair of second base layers is laminated on the outer surface side of the pair of second fiber layers, the musical instrument use plate is one in which the second base layer is a wood layer and the other second base layer is May be a porous layer mainly composed of a synthetic resin.

The musical instrument board has a pair of first base layers, a pair of second fiber layers, a pair of second base layers, etc. on one or more pairs of fiber layers and / or bases on both sides of the first fiber layer. When the layers are laminated, the components of the paired base layer and / or fiber layer may be different. More specifically, in the case where all of the paired base layers are wood layers, the types of wood forming these wood layers may be different, and all of the paired base layers are porous layers. In the case, the synthetic resin contained in these porous layers may be different. Also, the fiber types and / or binder components of the paired fiber layers may be different. Furthermore, the musical instrument board has a pair of first base layers, a pair of second fiber layers, a pair of second base layers, etc. on one or more pairs of fiber layers and / or on both sides of the first fiber layer. When the substrate layer is laminated, the thickness of the paired substrate layer and / or fiber layer may be different.

The musical instrument board may be configured as a laminate of eight or more layers by alternately providing a base material layer and a fiber layer on the outer surface side of the first fiber layer. Thereby, the said board material for musical instruments tends to realize desired thickness and vibration characteristics. Moreover, when the said board material for musical instruments equips the outer surface side of a 1st fiber layer with a base material layer and a fiber layer alternately, the number of layers of a substrate layer and a fiber layer laminated on both sides of the 1st fiber layer is equal. Is preferred. Furthermore, it is preferable that the main component and thickness of each layer arrange | positioned symmetrically with respect to the said 1st fiber layer are the same as the said board | plate material for musical instruments. Thereby, the said board | plate material for musical instruments can prevent curvature, and can improve quality.

When the first base material layer and the second base material layer are porous layers containing synthetic resin as a main component, the bubbles of the first base material layer and the second base material layer are, for example, microballoons, etc. It may be formed by bubble-forming particles.

The first fiber layer and the second fiber layer may be polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber in a thermoplastic resin You may form from the impregnated prepreg. Further, the first fiber layer and the second fiber layer do not necessarily have to be formed from a prepreg, and are formed, for example, by applying and heating a coating liquid in which the fibers are dispersed in a resin composition containing a binder resin and an organic solvent. It may be done. The first fiber layer and the second fiber layer may be formed by adhering the fibers to the base layer using an adhesive.

Poly paraphenylene benzo bis oxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra-high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber contained in the first fiber layer and the second fiber layer increase the rigidity, And in order to make the vibration attenuation factor of the first fiber layer and the second fiber layer close to the vibration attenuation factor of wood, it is preferable to be oriented along one direction substantially perpendicular to the thickness direction. However, the fibers contained in the first fiber layer and the second fiber layer do not necessarily have to be oriented in one direction when strong rigidity anisotropy is not required.

As fibers contained in the first fiber layer and the second fiber layer, silicon carbide (SiC) fibers, boron fibers and the like can also be used. A sufficient reinforcing effect can be obtained also by these fibers.

The stringed instrument may be provided with the

musical instrument plate

31, 41, 51, 61, 71, 81, 91 of FIGS. 3 to 9 as a soundboard, instead of the musical instrument plate 1 of FIG. Further, when the stringed musical instrument includes the musical instrument plate 1 of FIG. 1 or the musical instrument plate 61 of FIG. 6 as a soundboard, the first base layers 3 and 63 do not necessarily have to be disposed on the outer surface side. The layer 2 may be disposed on the outer surface side, and the first fiber layer 2 may be used as a design layer.

The stringed instrument is not limited to the acoustic guitar described above, and may be, for example, an electric acoustic guitar, a violin, a cello, a mandolin or the like. Moreover, the said board material for musical instruments may be used as a sound board arrange | positioned by the back surface side of a body.

Moreover, the said board | plate material for musical instruments may be used for musical instruments other than the stringed instrument provided with a sound board other than the above-mentioned stringed instrument. For example, the instrument board may be used as a keyboard instrument, a percussion instrument, or the like.

As described above, the musical instrument plate according to the present invention can exhibit vibration characteristics close to the vibration characteristics of wood while enhancing the strength and weather resistance, and thus is suitable as a musical instrument plate having excellent acoustic characteristics. . Further, the musical instrument according to the present invention is suitably used as a musical instrument having excellent acoustic characteristics.

1, 31, 41, 51, 61, 71, 81, 91 Board material for musical instruments 2

First fiber layer

3, 63 First base material layer 11 Stringed instrument 12 Sound board 13 Body 14 String 15 Bridge 16 Saddle 17 Neck 18 Head 19 Peg 20 pin 21

sound hole

42, 82

second fiber layer

53, 93 second base layer

Claims

A first fiber layer,
A first base layer laminated on at least one surface side of the first fiber layer;
The first fiber layer comprises fibers and a binder,
The fiber is polyparaphenylene benzobisoxazole fiber, liquid crystal polyester fiber, aramid fiber, polyarylate fiber, ultra-high molecular weight polyethylene fiber, polyethylene naphthalate fiber or glass fiber,
A board for musical instruments, wherein the first base material layer is a wood layer or a porous layer containing a synthetic resin as a main component.
The musical instrument board according to claim 1, further comprising a pair of the first base layers stacked on both sides of the first fiber layer.
A pair of second fiber layers laminated on the outer surface side of the pair of first base layers;
The pair of second fiber layers comprises fibers and a binder,
The musical instrument sheet according to claim 2, wherein the fiber is a polyparaphenylene benzobisoxazole fiber, a liquid crystal polyester fiber, an aramid fiber, a polyarylate fiber, an ultrahigh molecular weight polyethylene fiber, a polyethylene naphthalate fiber or a glass fiber.
A pair of second base layers laminated on the outer surface side of the pair of second fiber layers;
The musical instrument plate according to claim 3, wherein the pair of second base layers is a wood layer or a porous layer containing a synthetic resin as a main component.
An instrument comprising the musical instrument plate according to any one of claims 1 to 4 as a soundboard.