WO2019093778A1

WO2019093778A1 - Led manufacturing system and led manufacturing method

Info

Publication number: WO2019093778A1
Application number: PCT/KR2018/013513
Authority: WO
Inventors: 이왕기; 이규남; 김기완; 이원호; 박제현; 송후근; 김영환
Original assignee: 주식회사 대성엔지니어링
Priority date: 2017-11-08
Filing date: 2018-11-08
Publication date: 2019-05-16
Also published as: KR20190052645A; KR102546064B1

Abstract

The present invention relates to an LED manufacturing system and an LED manufacturing method for manufacturing an LED. Disclosed is an LED manufacturing system for curing a molding agent (40) of an LED element (10) on a base member (20), on which multiple LED elements (10) are mounted in the form of an N × M matrix (here, N and M are a natural number) and multiple reflectors (30) filled with the molding agent (40) are installed to correspond to the LED elements (10), respectively. The LED manufacturing system performs a curing process in which a beam spot is formed on the base member (20) by means of emission of beam generated at a light source unit (100) and reciprocates relative to the base member (20) a predetermined number of times over the multiple reflectors (30) so as to cure the molding agent (40) onto which the beam has been emitted.

Description

LED manufacturing system and LED manufacturing method

The present invention relates to an LED manufacturing system and an LED manufacturing method for manufacturing an LED.

A light emitting diode (LED) is a device that emits a predetermined light by making a small number of injected carriers (electrons or holes) using a pn junction structure of a semiconductor and recombining them. The LED has low power consumption, long life, It can be installed in a space, and has a characteristic against vibration.

A typical LED package includes a lead frame mounted on a substrate, an LED element mounted on the lead frame to emit light, a bonding wire electrically connecting the LED element and the lead frame, a reflector for reflecting the light emitted from the LED element, And a molding material (encapsulant) which is filled inside the reflector and sealed by sealing the LED element and the bonding wire.

In general, an LED package assembling process includes a wafer sawing process for separating a wafer on which integrated circuits are formed into LED devices, a die attaching process for mounting each LED device on a lead frame using a predetermined bonding means, a die attach process, a wire bonding process for connecting the leads of the lead frame to the electrode pads of the LED device by a metal wire, and a step for sealing the LED device with the molding resin A molding process, and a test process for verifying the reliability of the LED package having completed the molding process. In addition, various additional processes are additionally performed.

Particularly, during the LED package manufacturing process, a curing process is performed after the molding process. In the curing process, heat is applied to the LED package after the molding process for a predetermined time to stabilize the molding resin characteristics. This is a process for protecting the LED element and the metal thin wire inside.

After the molding process is completed, the lead frame strip is loaded into a storage container such as a magazine or a carrier. Then, the storage container is put into the LED package curing device to form a lead frame strip Curing the semi-finished LED package.

That is, in the conventional package curing system, the curing operation of the molded LED package is carried out for a long time (about 2 hours) manually in a curing apparatus (oven or chamber) while a plurality of lead frames are stacked on the magazine.

Accordingly, the conventional package curing system has a problem that the process efficiency is lowered because the process is performed in accordance with the step-by-step manual.

Further, since the sealing material is sequentially applied to the plurality of lead frames before being brought into the curing apparatus, a waiting time occurs until curing in the curing apparatus after the sealing material is applied.

That is, the curing process of the molding agent using the conventional oven requires a curing time of 2 hours or more, which causes the encapsulation material to precipitate and aggregate due to heat flow.

In addition, there is a problem that the LED package product made of the same material causes color coordinate deviation and luminance deviation between products because the fluorescent material content between the internal positions of the LED package is unevenly arranged due to the heat flow of the sealing material.

In addition, since the conventional curing method requires a long time to cure the molding agent in order to reduce the stress during the process, the process time becomes long.

SUMMARY OF THE INVENTION It is an object of the present invention to recognize the above problems and to provide a method for curing a molding material or an adhesive layer by irradiating a molding agent or an adhesive layer for forming an LED element directly or indirectly with infrared rays, And to improve the performance of the manufactured LED and to minimize the performance deviation between the LED packages.

SUMMARY OF THE INVENTION The present invention has been achieved in order to achieve the above-mentioned object of the present invention. The present invention is characterized in that a plurality of LED elements 10 are mounted in an NxM matrix (where N and M are natural numbers) There is provided an LED manufacturing method for curing a molding material 40 of an LED element 10 with respect to a base member 20 provided with a plurality of reflectors 30 corresponding to the elements 10, A beam spot formed on the base member 20 is irradiated onto the plurality of reflectors 30 by a predetermined number of times for the base member 20 by irradiating a beam generated from the light source unit 100, And performs a curing process for curing the beam-irradiated molding material (40) by relative reciprocating motion.

The diameter of the beam spot formed on the base member 20 is preferably larger than the plane size of the reflector 30.

The present invention is also characterized in that a plurality of LED elements 52 are arranged on an upper surface in the form of an NxM matrix where N and M are natural numbers and each of the LED elements 52 has an adhesive layer 53 formed on the upper surface thereof And an adhesive layer 53 formed on an upper surface of each LED element 52 with respect to a base member 20 to which a fluorescent substance 54 of a sheet structure is attached, The beam spot formed on the base member 20 is irradiated by a predetermined reciprocating movement relative to the base member 20 over a plurality of the reflectors 30, And a curing step of curing the molding agent (40) is performed.

The diameter of the beam spot formed on the base member 20 is preferably larger than the plane size of the phosphor 54.

The LED manufacturing system according to the present invention includes a linear movement device 600 for linearly moving the base member 20, and the light source unit 100 includes a linear movement device 600, The beam spot can be reciprocated on the member 20 in the direction perpendicular to the linear movement direction of the base member 20. [

The light source unit 100 can reciprocate the beam spot formed on the base member 20 in a direction perpendicular to the linear movement direction of the base member 20 using the scanner 110. [

The light source unit 100 has an intensity in a range of 100 W to 1 KW and the light source unit 100 can be configured to irradiate a laser beam having a wavelength of 800 nm to 2 μm.

The LED manufacturing system according to the present invention includes a base unit 20 and a stage unit 20 which is relatively moved with respect to the light source unit 100 for relative reciprocal movement between the light source unit 100 and the base member 20. [ 60).

The stage unit 60 may include a process stage unit 650 in which the base member 20 to be subjected to the curing process is inserted and the curing process is performed by irradiation of a laser beam.

The stage unit 60 is disposed in front of the process stage unit 650 and transfers the base member 20 to the process stage unit 650 after the base member 20 to be subjected to the curing process is inserted from the outside A loading stage 640; And an unloading stage unit 660 installed at the rear of the process stage unit 650 to transfer the base member 20 from the process stage unit 650 to the outside after the curing process is completed.

The light source unit 100 includes a light source for generating a laser beam; A scanner 110 for forming a beam spot by irradiating a laser beam generated from the light source on a base member 20 placed on the process stage portion 650 positioned in the beam irradiation region; And an optical system 120 for guiding the laser beam generated from the light source to the scanner 110.

The light source unit 100 can be reciprocated in a direction perpendicular to the linear movement direction of the base member 20 by using the scanner 110 on the beam spot formed on the base member 20. [

The present invention is also characterized in that a plurality of LED elements 10 are mounted in the form of N × M matrices (where N and M are natural numbers) and a molding agent 40 is filled in the interior corresponding to each LED element 10 A method of manufacturing an LED for curing a molding material (40) of an LED element (10) with respect to a base member (20) on which reflectors (30) of a light source unit (40) irradiated with the beam by a reciprocating movement relative to the base member (20) a predetermined number of times over a plurality of the reflectors (30) through a beam spot formed on the substrate (20) And a curing process is carried out.

The present invention is also characterized in that a plurality of LED elements 52 are arranged in the form of an NxM matrix (where N and M are natural numbers) on the upper surface and an adhesive layer 53 is formed on the upper surface of each LED element 52 A method of manufacturing an LED for curing an adhesive layer (53) formed on an upper surface of each LED element (52) with respect to a base member (20) to which a phosphor (54) A beam spot formed on the base member (20) is irradiated by a beam, and the beam spot is irradiated by a predetermined reciprocating movement relative to the base member (20) over a plurality of the reflectors (30) And a curing step of curing the molding agent (40) is carried out.

INDUSTRIAL APPLICABILITY The LED manufacturing system and the manufacturing method according to the present invention greatly reduce the time required for curing an LED package by irradiating infrared light directly or indirectly to a molding agent or an adhesive layer for forming an LED element to cure the molding agent or the adhesive layer It is possible to improve the performance (luminous efficiency, optical characteristic deviation, life span) of the manufactured LED and to minimize the performance deviation between LED packages.

Specifically, the LED manufacturing system and the manufacturing method according to the present invention are characterized in that a plurality of LED elements are mounted in a matrix of N × M, and a plurality of reflectors corresponding to the LED elements are filled in the molding material, In order to cure the molding agent of the LED element, a beam spot formed on the base member by irradiation of the beam is irradiated to the base member by a predetermined reciprocating movement over a plurality of reflectors, The gas barrier property of the molding agent can be improved and the time required for curing can be shortened to prevent the phosphor deposition of the molding agent and improve the production yield.

In addition, the LED manufacturing system and the LED manufacturing method according to the present invention can improve the reliability of the LED package by reducing the stress generated in the shrinking process of the molding agent by rapidly curing the molding agent.

In the LED manufacturing system and the LED manufacturing method according to the present invention, since the infrared rays are directly irradiated to the molding agent, infrared rays transmitted through the molding agent are reflected on the reflector plated surface (for example, Ag coated surface) So that the effect of irradiating the infrared rays in multiple can be obtained.

The LED manufacturing system and the LED manufacturing method according to the present invention can improve the LED package mass production efficiency by automating the LED package curing process.

A main feature of the present invention is that a conventional manufacturing method for intensively irradiating light to a molding agent in each LED package is carried out to move a beam spot formed by a laser beam across a plurality of LED packages, The present invention provides a method for thermally curing an adhesive for bonding a fluorescent substance to a fluorescent substance, thereby significantly shortening the time for performing the curing process, thereby greatly improving productivity.

Accordingly, the LED manufacturing system and the LED manufacturing method according to the present invention can be applied to an LED package in which an adhesive layer is disposed on the upper surface of an LED element of a thin plate shape to form a ceramic, a film, a sheet of glass such as PIG (Phosphor in Glass) In the production of the LED having the fluorescent layer of the structure, in attaching the phosphor to which the adhesive layer is interposed and attached on the upper surface of the thin plate-like LED element, the adhesive layer is directly or indirectly irradiated with infrared rays to cure the molding agent or the adhesive layer , It is possible to greatly reduce the time required for curing the LED package and improve the performance (luminous efficiency, optical characteristic deviation, lifetime) of the manufactured LED.

In particular, it is possible to uniformly cure the molding material, thereby minimizing the performance variation between the LED packages.

In addition, in the case of film curing, there is an advantage that the yield of the yarn can be greatly improved by preventing the flicker of the fluorescent layer of the sheet structure, and the productivity can be greatly improved by quick curing.

1 is a perspective view showing an LED manufacturing system according to an embodiment of the present invention.

Fig. 2 is a schematic view showing the configuration of the LED manufacturing system of Fig. 1; Fig.

Fig. 3 is a sectional view showing a part of the light irradiation part and the base member in the LED manufacturing system of Fig. 1; Fig.

FIG. 4 is a plan view showing a process of fabricating an LED package according to an embodiment of the present invention. Referring to FIG.

FIG. 5 is a partially enlarged view showing the light irradiation process by the light irradiation unit in FIG.

FIG. 6A is a photograph showing a phosphor part in a conventional LED device in which a phosphor is cured by using an oven, FIG. 6B is a photograph showing a phosphor part in the LED device manufactured by the manufacturing method and LED device according to the present invention It is a photograph showing.

7 is a side view showing a second embodiment of the LED package manufactured by the LED manufacturing system according to the present invention.

8 is a front view showing an LED manufacturing system according to another aspect of the present invention.

Fig. 9 is a plan view showing the light source portion of the LED manufacturing system of Fig. 8; Fig.

10A and 10B are plan views showing an example of a stage portion in the LED manufacturing system of Fig.

11 is a sectional view of the stage portion shown in Figs. 10A and 10B.

12 is a cross-sectional view showing the loading stage portion among the stage portions shown in Figs. 10A and 10B.

13 is a cross-sectional view showing the unloading stage portion of the stage portion shown in Figs. 10A and 10B.

Hereinafter, an LED manufacturing system and an LED manufacturing method according to the present invention will be described with reference to the accompanying drawings.

1 to 5, a plurality of LED elements 10 are mounted in an NxM matrix (where N and M are natural numbers), and each LED element 10 An LED manufacturing system for curing a molding material (40) of an LED element (10) with respect to a base member (20) provided with a plurality of reflectors (30) The beam spot formed on the base member 20 by the irradiation of the beam generated from the light source unit 100 is irradiated onto the reflector 30 by a predetermined reciprocating movement relative to the base member 20 a predetermined number of times, And a curing step of curing the irradiated molding agent (40) is performed.

Here, the predetermined number of reciprocating movements of the beam spot is determined according to the physical properties of the molding material 40 to be cured.

The base member 20 may be a lead frame in which a plurality of LED elements 10 are mounted in an N × M matrix (where N and M are natural numbers) inside a reflector 30 provided on an upper surface.

Here, the LED package is an LED package according to the first embodiment, and includes an LED element 10 connected to the lead of the base member 20 (wire-bonded) through a metal thin wire and mounted on the base member 20, And a reflector 30 provided in correspondence with the element 10.

The LED manufacturing system according to the present invention is characterized in that a plurality of LED elements 10 are mounted in the form of an NxM matrix where N and M are natural numbers and corresponding to each LED element 10, The present invention is a system for curing a molding agent 40 of an LED element 10 with respect to a base member 20 provided with a plurality of reflectors 30 to be filled in a molding material. Herein, the present invention is described as an example in which the molding agent is cured as the first embodiment, but it can be applied to any structure that requires curing through heating by irradiation of a beam of an adhesive or the like.

Meanwhile, in implementing the reciprocating movement of the beam spot relative to the base member 20, various configurations are possible according to the relative reciprocating movement of the base member 20 and the light source unit 100.

For example, the LED system includes a linear moving device 600 for linearly moving the base member 20, wherein the light source 100 includes a base member 20 linearly moved by the linear moving device 600, The beam spot can be reciprocated in a direction perpendicular to the linear movement direction of the base member 20. [

As a more specific example, the linear movement apparatus 600 has a structure in which the base member 20 filled with the molding material 40 inside the reflector 30 is linearly moved (for example, linearly moved in the X-axis direction) Various configurations are possible.

For example, the linear movement device 600 may be configured to have a variety of configurations with a configuration for forming a conveyance path for conveying the base member 20 in a state of being supported.

More specifically, the linear movement device 600 may be configured in various ways, such as a guide portion, a roller, a conveyor belt, etc., installed along the movement path of the base member 20.

The linear moving device 600 may be a conveyor belt installed below the LED manufacturing system between the base member loading unit 300 and the base member unloading unit 400. In this case, a plurality of base members 20 may be sequentially transferred from the base member loading portion 300 toward the base member unloading portion 400, and the molding agent 40 may be cured.

That is, the present invention has an advantage that the base member loading, the molding material hardening, and the base member unloading can be performed in an in-line manner.

On the other hand, the linear moving device 600 is preferably made of a material having high thermal conductivity, such as aluminum or an aluminum alloy, for precise linear movement.

In the heating process by beam irradiation of the light source unit 100, the linear motion device 600 directly supports the base member 20 or indirectly supports the base member 20 by the same structure as the stage unit 60, There may be a problem that heat leakage occurs through the device 600 and the heating process is not smooth.

In forming the linear motion device 600, it is preferable that a member having a low thermal conductivity such as Teflon is interposed or coated on a portion directly or indirectly in contact with the base member 20 in order to reduce thermal conductivity .

Further, it is preferable to use a material having a low thermal conductivity and a material of the stage portion 60 described later.

The light source unit 100 is configured to irradiate a beam spot formed on the base member 20 with a molding material irradiated with a beam by a reciprocating movement of a predetermined number of times relative to the base member 20 over a plurality of reflectors 30, Various configurations are possible as a configuration for generating a beam to be irradiated to the base member 20 for curing the base member 40. [

As an example, the light source may include a light source for generating a laser beam, as shown in Fig. 9; And an optical system 120 for forming an optical path for irradiating the molding material 40 with the laser beam emitted from the light source.

The light source may be a light source that generates a laser beam having a predetermined wavelength range or a short wavelength, and may have various configurations.

The light source may generate a laser beam having a wavelength range of from 800 nm in the near infrared region to 2 um in the infrared region. Preferably, the laser beam is in a wavelength range of 1,060 to 1,080 nm Infrared rays of a wavelength can be generated.

For example, the light source may be an IR CW laser (Continuous wave laser) outputting an infrared laser beam, but is not limited thereto.

Although the light source generates the laser beam, it may be a light source that outputs ultraviolet light, visible light, or near-infrared light, which is not an infrared light but a certain light intensity or more.

The optical system 120 is configured to form an optical path for irradiating the molding material 40 with infrared rays emitted from the light source. The optical system 120 may include a reflective member, a lens member, a diaphragm member, or the like.

Here, the optical system 120 may include an adapter unit 130 for connection with an optical cable 140 connected to a light source for generating a laser beam.

The adapter unit 130 is connected to an optical cable 140 that transmits a laser beam generated from a light source when the light source is installed apart from the optical system 120, and may have various configurations.

4 and 5, the laser beam generated from the light source is irradiated to a beam spot formed on the base member 20 using a galvanometer scanner 110 or the like, Thereby generating a beam reciprocally moved reciprocally in a direction perpendicular to the linear movement direction of the member 20.

The diameter of the beam spot formed on the base member 20 is preferably larger than that of the reflector 30 provided on the base member 20.

That is, it is preferable that the diameter of the beam spot is formed to be large enough to include at least one reflector 30 installed in the base member 20.

Particularly, the light source unit 100 reciprocates the beam spot formed on the base member 20 in the direction perpendicular to the linear movement direction of the base member 20 using the galvanometer scanner 110 or the like, The curing of the molding agent 40 can be achieved more quickly by applying sufficient heat to the curing of the molding agent 40 filled in the reflector 30 of the base member 20.

Meanwhile, the light source unit 100 has an intensity in the range of 100 W to 1 KW, and irradiates an infrared laser beam having a wavelength of 800 nm to 2 μm, for example, a wavelength of 1060 to 1080 nm, .

Meanwhile, in the present invention, the molding material 40 is a polymer compound 42 obtained by mixing a heat source portion 41 that generates heat by infrared rays.

In the heat source unit 41, heat generation can be induced by infrared rays of a certain wavelength.

The heat source unit 41 is made of at least one of a filler and a fluorescent material, and absorbs infrared rays irradiated through the non-light emitting transition to generate heat.

The polymer compound (42) is composed of any one of carbon fiber compound, graphite, graphite, carbon nanotube, silicone compound, nitrogen compound, boron compound, zircon compound, titanium compound, aluminum compound and zinc compound.

When the heat source part 41 is made of a phosphor, the phosphor is made of at least one of YAG, TAG, Silicate, Nitride, Halide and Quantum dot, and the mixing ratio of the heat source part 41 is And may be mixed with the polymer compound 42 at a ratio of 1 wt% to 50 wt%, depending on the viscosity of the polymer compound 42 and the color temperature target of the LED light source, and is usually 5 wt% 100 Wt% is preferable, and if a certain viscosity can be secured, it can be mixed without being limited by the mixing ratio.

The size of the mixed heat source 41 may range from a few nanometers (nm) to several tens of micrometers (占 퐉), but it is usually between 1 and 50 micrometers (占 퐉) .

In order to induce the heat generation of the heat source unit 41, the heat source unit 41 is provided with a wavelength of 100 W to 1 KW and a wavelength of 800 nm to 2 μm, for example, 1060 to 1080 nm, It is preferable that the laser beam is irradiated.

The heat source unit 41 is heated by absorbing infrared rays and the heat source unit 41 heated by the infrared rays transmits heat generated around the heat source unit 41 through heat generation, The polymer compound (42) can be shrunken by heat conduction.

Therefore, high-speed curing can be performed through the heat source unit 41 that induces the internal shrinkage of the polymer compound 42, and the adhesion between the polymer compound 42 and the heat source unit 41 is shaped to improve the gas barrier property .

The polymer compound 42 can be rapidly cured to reduce the stress generated in the shrinking process of the polymer compound 42 and to cause the stress to flow toward the heat source 41, So that uniform curing can be performed between the portions 41.

When the molding agent 40 is slowly cured, the phosphor is precipitated and the luminous efficiency is lowered. Therefore, the method of rapidly curing the molding agent 40 by infrared rays has advantages over the conventional curing method using the convection oven, .

That is, as shown in FIG. 6A, since the conventional convection oven curing method requires a long time, relatively more phosphors are precipitated downward. However, the infrared curing system according to the present invention performs quick curing before the phosphor is precipitated The characteristics of the LED light source can be improved.

In the infrared curing system according to the present invention, heat generated in the heat source unit 41 heated by infrared rays is transmitted to the heat source unit 41, The surrounding molding agent 40 is contracted so that the interface between the molding material 40 and the heat source unit 41 is more tightly adhered to thereby further improve the reliability in driving.

In addition, the conventional curing method using a convection oven has a problem that discoloration is seriously generated due to infiltrated sulfur gas because of low gas barrier property. On the other hand, the curing method according to the present invention, as shown in FIG. 6B, The heat generated in the heat source unit 41 by the heat source unit 41 shrinks the molding agent 40 around the heat source unit 41 so that the interface between the molding agent 40 and the heat source unit 41 is more firmly adhered, The discoloration and the gas barrier property can be remarkably improved.

The LED manufacturing system includes a base member loading unit 300 on which a plurality of base members 20 to be sequentially loaded by the dispenser unit 200 are loaded; And a base member unloading unit 400 for receiving the base member 20 from the LED manufacturing system and unloading the base member 20 to the unloading member 320.

The base member loading unit 300 is configured to load the base member 20 from the loading mount 30 on which the base member 20 having a plurality of LED elements 10 are mounted to the LED manufacturing system Configuration is possible.

The loading unit 310 may be a storage unit such as a magazine or a carrier for loading and storing the base member 20 in which the LED element 10 is mounted and the molding agent 40 is not applied, Container.

The base member loading unit 300 may be configured such that the loading unit 310 is horizontally moved or vertically moved such that the base member 20 loaded on the loading unit 310 is sequentially discharged from the loading position, And an elevator unit for the elevator.

The base member unloading unit 400 may be configured to receive the base member 20, which has been subjected to the hardening process, from the LED manufacturing system and unload the unloading member 320.

The unloading member 320 may include a storage container such as a magazine or a carrier on which the base member 20 on which the LED package curing is completed is loaded in the LED manufacturing system.

The base member unloading unit 400 may be configured to move the unloading member 320 horizontally or vertically so that the base member 20 is sequentially unloaded to the unloading member 320 at the unloading position, The elevator unit may further include an elevator unit for elevating the elevator unit in the direction of the elevator.

The LED manufacturing system receives the base member 20 from the base member loading unit 300 or transfers the base member 20 to the base member loading unit 400, And a linear moving device 600 for horizontally moving the member 20.

The LED manufacturing system is provided between the base member loading unit 300 and the LED manufacturing system and includes a molding member 40 (see FIG. 1) mounted inside the reflector 30 of the base member 20, which is loaded from the base member loading unit 300, The dispenser unit 200 may further include a dispenser unit 200 for filling the dispenser 200.

The dispenser unit 200 may be configured to fill the molding material 40 inside the reflector 30 installed in the base member 20 on which the plurality of LED elements 10 are mounted.

For example, the dispenser unit 200 may include a nozzle unit that is provided on the upper side of the movement path of the base member 20 and supplies the molding material 40 to the inside of the reflector 30 of the base member 20 .

The nozzle unit may be applied to various feeding systems and may be connected to an external molding material supplying apparatus.

2, the LED manufacturing system includes a first image acquiring unit 610 installed between the dispenser unit 200 and the LED manufacturing system to acquire a top surface image of the base member 20 .

The first image obtaining unit 610 may be configured to obtain a top surface image of the base member 20 after the molding step of the dispenser unit 200 and inspect the molding state of the LED package.

The first image obtaining unit 610 may be configured with an optical package such as a camera.

2, the LED manufacturing system includes a second image acquiring unit 620 installed between the LED manufacturing system and the base member unloading unit 400 to acquire a top surface image of the base member 20, As shown in FIG.

The second image obtaining unit 610 may be configured to obtain a top surface image of the base member 20 after the curing step in the LED manufacturing system to check the curing state of the LED package.

The second image acquiring unit 620 may be configured with an optical package such as a camera.

Meanwhile, the LED manufacturing system and the LED manufacturing method according to the present invention may have a structure as shown in FIG. 7, in addition to the structure shown in FIG. 3, in which the LED package to be subjected to the curing process is performed.

More specifically, as shown in FIG. 7, the LED package manufactured in the LED manufacturing system and the LED manufacturing method according to the present invention includes a plurality of LEDs in an N × M matrix (where N and M are natural numbers) The LED elements 52 may be manufactured from a base member 20 on which an adhesive layer 53 is formed on the upper surface and a phosphor 54 of a sheet structure is attached on the adhesive layer 53. [ Here, in the LED element according to the second embodiment of the present invention, the base member may have another configuration, but the same reference numerals are given for convenience of description.

The base member 20 may be a lead frame, a substrate or the like on which a plurality of LED elements 52 are arranged in the form of an N × M matrix (where N and M are natural numbers) on the upper surface as shown in FIG. 1 .

Here, the LED package may be composed of the LED element 10 mounted on the base member 20 by being connected (wire-bonded) to the lead of the base member 20 through the fine metal wire.

On the other hand, the LED element 10 is an LED element manufactured through a semiconductor process or the like, which is a thin plate-like element mounted on the base member 20 and emitting light by electric application.

The phosphor 54 is a sheet member attached to the upper surface of the LED element 52 and may have various configurations such as a phosphor having a ceramic, glass, or film structure depending on the material thereof.

Particularly, the phosphor 54 has a sheet structure to be attached to the upper surface of the LED element 52.

The adhesive layer 53 is formed on the upper surface of the LED element 52 and adheres to the fluorescent material 54 of the sheet structure. The adhesive layer 53 may have various physical properties depending on the kind of the fluorescent material.

On the other hand, in the LED package having the above-described structure, the sheet-shaped fluorescent material 54 is attached to the upper surface of the LED element 52 with the adhesive layer 53 interposed therebetween. Then, the LED package shown in FIGS. 1, 2, Can be manufactured by an LED element manufacturing system and an LED element manufacturing method as shown in Figs. 8 to 13.

The base member 20 to which the fluorescent substance 54 having the sheet structure is attached on the upper surface of the LED element 52 with the adhesive layer 53 interposed therebetween is mounted on the linear moving device 600 or the stage unit 60, Through a beam irradiation region irradiated with a laser beam by the light source unit 100 described later.

5, the generated light is irradiated to a beam spot formed on the base member 20 in a linear form of the base member 20 using a galvanometer scanner 110 or the like, And a laser beam reciprocating in a direction perpendicular to the moving direction is generated.

Particularly, the light source unit 100 reciprocates the beam spot formed on the base member 20 in the direction perpendicular to the linear movement direction of the base member 20 using the galvanometer scanner 110 or the like, The curing of the adhesive layer 53 can be achieved more quickly by applying sufficient heat to the curing of the adhesive layer 53 of the base member 20.

Meanwhile, the light source unit 100 is preferably configured to emit an infrared laser beam having a wavelength of 100 W to 1 KW and a wavelength of 800 nm to 2 μm, for example, a wavelength of 1,060 to 1,080 nm.

A key technical point of the present invention is to eliminate the conventional manufacturing method of intensively irradiating light to a molding material / fluorescent material in each LED package, and move a beam spot formed by the laser beam across a plurality of LED packages, And the adhesive for adhesive bonding of the molding material and the fluorescent material is thermally cured, thereby significantly shortening the execution time of the curing process, thereby greatly improving the productivity.

3 and 7, various embodiments are possible according to the basic configuration for manufacturing the LED package.

For example, the present invention provides a method of manufacturing an LED, wherein a plurality of LED elements 10 are mounted in the form of an NxM matrix (where N and M are natural numbers), corresponding to each LED element 10, A method of manufacturing an LED for curing a molding material (40) of an LED element (10) with respect to a base member (20) provided with a plurality of reflectors (30) A beam spot formed on the base member (20) is irradiated by a beam, and the beam spot is irradiated by a predetermined reciprocating movement relative to the base member (20) over a plurality of the reflectors (30) The curing process for curing the molding agent 40 can be performed.

The present invention also provides a method of manufacturing an LED, in which a plurality of LED elements 52 are arranged on an upper surface in the form of an N x M matrix (where N and M are natural numbers) A method of manufacturing an LED for curing an adhesive layer (53) formed on an upper surface of each LED element (52) with respect to a base member (20) on which a fluorescent material (54) The beam spot formed on the base member 20 is irradiated onto the plurality of reflectors 30 through a predetermined reciprocating movement relative to the base member 20 by a predetermined number of times A curing process may be performed to cure the molding material 40 irradiated with the beam.

Meanwhile, in the implementation of the core technical idea of the present invention, various embodiments of the LED manufacturing system are also possible.

For example, the LED manufacturing system according to another embodiment of the present invention includes a base member 20 for relative reciprocal movement between the light source 100 and the base member 20, as shown in Figs. 8 to 13 And a stage unit 60 that is positioned relative to the light source unit 100 and moves relative to the light source unit 100.

The stage unit 60 can be configured in various ways as a structure in which the base member 20 is seated and moved relative to the light source unit 100 for relative reciprocal movement between the light source unit 100 and the base member 20.

The stage unit 60 may include a process stage unit 650 in which a base member 20 to be subjected to a curing process is inserted and a curing process is performed by irradiation of a laser beam.

The process stage unit 650 may have a variety of configurations in which a base member 20 to be subjected to a curing process is inserted and a curing process is performed by irradiation of a laser beam.

For example, the process stage unit 650 includes a lower plate 653 on which the base member 20 is mounted, and an opening 654 formed by a through hole, a slot, or the like to enable beam irradiation in the beam irradiation region And may include an upper plate 652.

The upper plate 652 may be vertically movable with respect to the lower plate 653 for easy seating of the base member 20 with respect to the lower plate 653.

Thus, the upper plate 652 can be moved up and down with respect to the lower plate 653 by the lift member 655.

The stage unit 60 is installed in front of the process stage unit 650 for easy seating of the base member 20 with respect to the lower plate 653, A loading stage unit 640 inserted from the loading stage unit 650 and transferred to the process stage unit 650; And an unloading stage unit 660 installed at the rear of the process stage unit 650 for transferring the base member 20 from the process stage unit 650 and discharging the base member 20 to the outside.

The loading stage unit 640 is installed in front of the process stage unit 650 for easy seating of the base member 20 with respect to the lower plate 653 so that the base member 20, And then transferred to the process stage unit 650. [0154] FIG.

For example, the loading stage unit 640 includes a lower plate 643 that supports the bottom surface of the base member 20, and a lower plate 643 that is spaced apart from the lower plate 643 to guide movement of the base member 20 And an upper plate 644.

The upper plate 644 guides the movement of the push member 690 pushing the base member 20 seated on the lower plate 643 so as to transmit the base member 20 to the process stage unit 650 The cutout portion 641 may be formed.

The cutout portion 641 is formed to cut the upper plate 644 in the moving direction of the base member 20 for transferring the base member 20 from the loading stage portion 640 to the process stage portion 650 .

The push member 690 pushes the base member 20 seated on the lower plate 643 so as to be able to transmit the base member 20 to the process stage portion 650, And the base member 20 is pressed against the process stage portion 650 by means of the process stage portion 650.

Particularly, the push member 690 is installed so as to be movable up and down so as not to interfere with its movement when the base member 20 is moved from the outside to the loading stage portion 640.

The push member 690 preferably has an L shape so that the portion of the base member 20 that is in contact with the base member 20 is more protruded so that the base member 20 can be sufficiently moved to the loading stage portion 640 Do.

The unloading stage unit 660 has a structure in which the base member 20 installed at the rear of the process stage unit 650 and completed the hardening process is received from the process stage unit 650 and discharged to the outside, Do.

The unloading stage unit 660 includes a lower plate 663 for supporting the bottom of the base member 20 and a lower plate 663 for guiding the movement of the base member 20 The upper plate 664 may be formed of a metal plate.

The lower plate 663 includes a push member 680 for pushing the base member 20 seated on the lower plate 663 for transferring the base member 20 from the unloading stage portion 660 to the outside A cutout 661 for guiding the movement can be formed.

The cutout portion 661 may be formed to cut the lower plate 663 in the moving direction of the base member 20 for transferring the base member 20 from the unloading stage portion 660 to the outside.

The push member 680 is configured to push the base member 20 seated on the lower plate 663 so that the base member 20 can be transmitted from the process stage portion 650 to the outside, (Not shown) to press the base member 20 from the process stage portion 650 toward the outside.

Particularly, the push member 680 is installed so as to be movable up and down so as not to interfere with its movement when the base member 20 is moved from the outside to the unloading stage portion 660.

The push member 680 includes an inverted L-shaped member 630 which is inwardly protruded so that the base member 20 is further protruded so that the base member 20 can be sufficiently moved to the outside from the unloading stage unit 640 It is desirable to form the shape.

The push member 680 has a push member 640 for transferring the base member 20 from the process stage portion 650 to the unloading stage portion 640 in addition to external outflow from the unloading stage portion 640. [ Can be used together.

The lower plate 653 of the process stage unit 650 includes a base plate 653 mounted on the lower plate 653 to transmit the base member 20 from the process stage unit 650 to the unloading stage unit 640, A cutout portion 651 for guiding the movement of the push member 680 pushing the push member 20 may be formed.

The cutout portion 651 is formed to cut the lower plate 653 in the moving direction of the base member 20 for transferring the base member 20 from the process stage portion 650 to the unloading stage portion 640 .

The light source unit 100 includes a light source for generating a laser beam corresponding to the configuration of the stage unit 60 described above; A scanner 110 for irradiating a laser beam generated from a light source on a base member 20 mounted on a process stage portion 650 positioned in a beam irradiation region to form a beam spot; And an optical system 120 for guiding the laser beam generated from the light source to the scanner 110.

Here, the beam irradiation area is a region where a ray spot beam irradiated by the scanner 110 of the light source unit 100 is formed on the base member 20 by a linear movement of the stage unit 60 as a region where a beam spot sufficient for heating is formed The base member 20 can be moved.

When the process stage unit 650 is positioned in the beam irradiation area, a beam spot formed on the base member 20 is moved to the plurality of reflectors 30 by the relative movement of the stage unit 60 with respect to the scanner 110. [ The molding material 40 irradiated with the beam is cured by a reciprocating movement relative to the base member 20 a predetermined number of times over the base member 20.

To this end, the stage unit 60 including the process stage unit 650 is moved in a direction in which the base member 20 for performing the hardening process is loaded, as shown in FIG. 10A, , And can be moved over the beam irradiation area to perform a curing process.

4 and 5, the movement pattern of the beam spot on the base member 20 during the above-described curing process is not limited to the pattern that linearly reciprocates in the direction perpendicular to the moving direction of the base member 20 , A zigzag pattern is formed as shown in FIG. 10C, and various movement patterns can be obtained on the assumption of smooth curing conditions.

The predetermined number of reciprocating movements of the beam spot is determined according to the physical properties of the molding material 40 or the adhesive layer 53 to be cured.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

Claims

A plurality of LED elements 10 are mounted in the form of an N × M matrix where N and M are natural numbers and a plurality of reflectors 30 corresponding to the LED elements 10, (40) of the LED element (10) with respect to the base member (20) on which the LED element (10) is mounted,

A beam spot formed on the base member 20 is irradiated onto the plurality of reflectors 30 by a predetermined number of relative reciprocating movements of the base member 20 And a curing step of curing the molding agent (40) irradiated with the beam is performed.
The method according to claim 1,

Wherein a diameter of a beam spot formed on the base member (20) is larger than a plane size of the reflector (30).
A plurality of LED elements 52 are arranged on an upper surface in the form of an NxM matrix (where N and M are natural numbers), each LED element 52 has an adhesive layer 53 formed on its upper surface, The LED manufacturing system for curing the adhesive layer (53) formed on the upper surface of each LED element (52) with respect to the base member (20) to which the phosphor (54)

A beam spot formed on the base member 20 is irradiated onto the plurality of reflectors 30 by a predetermined number of relative reciprocating movements of the base member 20 And a curing step of curing the molding agent (40) irradiated with the beam is performed.
The method of claim 3,

Wherein a diameter of a beam spot formed on the base member (20) is larger than a plane size of the phosphor (54).
The method according to any one of claims 1 to 4,

And a linear movement device (600) for linearly moving the base member (20)

The light source unit 100 reciprocally moves the beam spot on the base member 20 linearly moved by the linear movement device 600 in a direction perpendicular to the linear movement direction of the base member 20 LED manufacturing system.
The method of claim 5,

The light source unit 100 reciprocally moves the beam spot formed on the base member 20 in a direction perpendicular to the linear movement direction of the base member 20 using the scanner 110 LED manufacturing system.
The method according to any one of claims 1 to 4,

The light source unit 100 has an intensity in a range of 100 W to 1 KW,

Wherein the light source unit (100) is configured to irradiate a laser beam having a wavelength of 800 nm to 2 占 퐉.
The method according to any one of claims 1 to 4,

And a stage part (60) on which the base member (20) is mounted for relative reciprocal movement between the light source part (100) and the base member (20) and moved relative to the light source part (100) LED manufacturing system.
The method of claim 8,

The stage unit 60 includes:

And a process stage part (650) in which the base member (20) to be subjected to the curing process is inserted and the curing process is performed by irradiation of a laser beam.
The method of claim 9,

A loading stage unit 640 installed in front of the process stage unit 650 to transfer the base member 20 from the outside to the process stage unit 650 after the curing process is to be performed;

And an unloading stage unit 660 installed at the rear of the process stage unit 650 for transferring the base member 20 from the process stage unit 650 to the outside after the curing process is completed LED manufacturing system.
The method of claim 9,

The light source unit (100)

A light source for generating a laser beam;

A scanner 110 for forming a beam spot by irradiating a laser beam generated from the light source on a base member 20 placed on the process stage portion 650 positioned in the beam irradiation region;

And an optical system (120) for guiding the laser beam generated from the light source to the scanner (110).
The method of claim 8,

The light source unit 100 is reciprocally moved in a direction perpendicular to the linear movement direction of the base member 20 by using the scanner 110 on the beam spot formed on the base member 20. [ LED manufacturing system.
The method of claim 8,

The light source unit 100 has an intensity in a range of 100 W to 1 KW,

Wherein the light source unit (100) is configured to irradiate a laser beam having a wavelength of 800 nm to 2 占 퐉.
A plurality of LED elements 10 are mounted in the form of an N × M matrix where N and M are natural numbers and a plurality of reflectors 30 corresponding to the LED elements 10, A method of manufacturing an LED for curing a molding material (40) of an LED element (10) with respect to a base member (20)

A beam spot formed on the base member 20 is irradiated onto the plurality of reflectors 30 by a predetermined number of relative reciprocating movements of the base member 20 And a curing step of curing the molding agent (40) irradiated with the beam is performed.
15. The method of claim 14,

Wherein a diameter of a beam spot formed on the base member (20) is larger than a plane size of the reflector (30).
A plurality of LED elements 52 are arranged on an upper surface in the form of an NxM matrix (where N and M are natural numbers), each LED element 52 has an adhesive layer 53 formed on its upper surface, (53) formed on an upper surface of each LED element (52) with respect to a base member (20) to which a phosphor (54)

A beam spot formed on the base member 20 is irradiated onto the plurality of reflectors 30 by a predetermined number of relative reciprocating movements of the base member 20 And a curing step of curing the molding agent (40) irradiated with the beam is performed.
18. The method of claim 16,

Wherein a diameter of a beam spot formed on the base member (20) is larger than a plane size of the phosphor (54).
The method according to any one of claims 14 to 17,

The light source unit 100 reciprocally moves the beam spot formed on the base member 20 in a direction perpendicular to the linear movement direction of the base member 20 using the scanner 110 LED manufacturing method.
The method according to any one of claims 14 to 17,

The light source unit 100 has an intensity in a range of 100 W to 1 KW,

Wherein the light source unit (100) is configured to emit a laser beam having a wavelength of 800 nm to 2 占 퐉.